二零一四年台灣平坦化論壇
2014 CMP Forum Taiwan
0830~1200 AM, September 5, 2014
台北市南港區經貿二路1號世貿南港展覽館 402C會議室
Taipei World Trade Center Nangang Exhibition Hall Rm 402C
平坦化現在以及超越摩爾
定律後的角色
THE ROLE OF CMP NOW
AND BEYOND MOORE’S LAW
平坦化如何勝任在 1X 技術節點訴求？製程材料與周邊支援技術都須
到位，把握機會，聆聽專家對以上議題解決方案的重點，必有收益。
主辦單位
Organized by
協辦單位
Co-Organized by
執行單位
Executed by
收費 Price
By 8/21
8/22~9/1
9/5 walk-in
CMPUGTW board members
Free
Free
TWD 200
CMPUGTW members
TWD 600
TWD 900
TWD 1000
Non-member
TWD 900
USD 30
TWD 1000
USD 35
TWD 1200
USD 40
08:30–08:50
Registration, sign up
08:50-09:00
Opening Remarks: Professor Arthur Chen, National Taiwan University of Science
and Technology; Chairman of Board Directors of CMPUGTW.
09:00-10:00
Session 1. Moderator: Dr. Willie Pai/Vice Chairman, KINIK Company
09:00-09:30
Challenges in 1x Design Node
Semiconductor Device Cleaning
Professor Jingoo Park
Hanyang University
09:30-10:00
CMP Applications from Nanometer
Scale Features to Microscopic Levels
Dr. Yuchun Wang, Vice
President of R&D
Anji Microelectronics
(Shanghai) Co., Ltd.
10:00-10:20
Break
10:20-12:00
Session 2 Moderator. Professor PL Tso, Tsing Hua University
The Next Generation Filtration of CMP
Slurry with Nanofiber Technology
HJ Yang, Director of
Application
Development
Entegris
CMP Solutions for 1X Technology
Nodes
Dr. Marty DeGroot,
Asia Technology
Director
Dow Electronic
Materials
11:20-11:50
Novel Colloidal Slurry for Low Defect
Dielectrics CMP.
Dr. KC Wu, Global
Strategic Marketing
Director
Cabot
Microelectronics
11:50-12:00
Open discussion
10:20-10:50
10:50-11:20
12:00
VIP lunch (invited only)
Programs are subject to change without prior notice