n= diffraction order Electronegativity on periodic table: low → right Ionic Bonds: + and − ions Cation Bonds: non-metal bond ~ bond where atoms share a pair of electron % Ionic Character of Interatomic bonds: 2 % = (1 − π −0.25(βπΈπ) ) ∗ 100 Bonding Forces: FN = FA + FR ∞ Potential Energy between two atoms: EN = ∫r FN dr = ∞ ∞ ∫r FA dr + ∫r FR dr = EA + ER EN = EA + ER π=wavelength (nm) ddhk=interplanar spacing Bragg's Law: a Interplanar spacing: dhkl = 2 2 2 √h +k +l h,k,l = miller indices of the plane a = unit cell edge length Process for finding Miller Indices: 1. Take reciprocal 2. linearize Ratio (%) of element mass to total alloy mass π1 πΆ1 = ∗ 100 π1 + π2 Burger Vector ( b ): Perpendicular to edge dislocations. Parallel for screw dislocations Fraction of Vacancies: ππ£ = # of vacancies K = Boltzmann constant ππ£ ππ N = total # of atomic sties T = Temperature (Kelvin) = ππ₯π − π ππ ππ£ = energy required to form vacancy Celsius → Kelvin K = °πΆ + 273.15 (DIFFUSION) Hume-Rothery Conditions for Complete Solubility 1. 2. Atomic Packing Factor: APF = volume of ions volume of cell 4 Volume of Sphere: Vsphere = πr 3 3 Volume of cell: Vcell = a3 nA Density for unit cell: p = = V c NA n′ (Ac +AA ) Density of Ceramics: p = # of atoms cenetered on plane Planar Density: PD = π3 3. 4. V c NA Ac = sum of atomic weight of cations in unit AA = sum of atomic weights of aniona in unit Vc = volume of unit cell n' = # of formula units/unit cell NA = avogadro's # Linear Density: LD = 4 3 π∗ π(π 3 ) area of plane # of atoms cenetered on plane area of plane r Ionic Size Ratio: cation ranion Surface Energy: Density of Plane↑ = S.E. ↓ for FCC – most dense = (1 1 1 ) For BCC – most dense = ( 1 1 0 ) Atomic Size Factor: The atomic radii of the two elements must differ by no more than 15%. |π1 − π2 | ∗ 100% ≤ 15% π1 Crystal Structure: Both elements must have the same crystal structure (e.g., both FCC, both BCC). Valency: The elements should have the same or similar valency. A metal tends to dissolve a metal of higher valency more readily than the reverse. Electronegativity: The elements must have similar electronegativities. Large differences may lead to compound formation instead of solid solution. Interstitial Solution: contains small nonmetals (C, H, O, N, B) Interdiffusion: Diffusion of atoms of one material into another material Self-diffusion: Atomic migration in a pure metal BCC has faster diffusion than FCC πππ π ππ πππππ’π ππ π ππππππ π Diffusion Flux: π½ = = ππππ∗π‘πππ π΄π‘ Fick’s First Law: –steady-state diffusion: The rate of mass transfer is proportional to the first derivative of concentration with position (negative sign means high → low concentration) ππΆ πΆ −πΆ π½ = −π· = −π· π΄ π΅ J = diffusion flux, D = diffusion coefficient, ππ₯ ππΆ π₯π΄ −π₯π΅ = concentration gradient, c = concentration, x = diffusion position Fick’s Second Law: –non-steady-state diffusion: The rate of change of concentration over time is proportional to the second derivative of concentration with position ππ₯ ππΆ ππ‘ =π· π2 πΆ ππΆ Solution: πΆπ −πΆπ ENERGY π΄ Attractive Energy πΈπ΄ = − , π΄ = = rate of change of concentration w/ time ππ₯ 2 ππ‘ πΆπ₯ +πΆπ = 1 − erf ( π₯ 2√π·π‘ ) use table for erf( ) π ππΈ π2 π· = π·π ππ₯π(− π ) D = diffusion coefficient ( ), π π π π·π = pre-exponential, R = Gas Constant, Qd = activation energy Diffusion Distance Formula: π₯ = √π·π‘ MECHANICAL PROPERTIES βπΏ πΉ π Strain π = Stress π = (A = area) modulus of Elasticity πΈ = πΏπ Hooke’s Law π = πΈπ and π΄ πΉ π΄ π π π −ππ = π ππ πΈ πΈ πΈ πΈ2 πΈ2 Poisson’s Ratio π = − π₯ = − π₯ Shear Stress π = ππππ ∅πππ π Fracture Toughness πΎπΌπΆ = ππ√ππ a= crack length (when internal do ½ a) , Y = geometry factor, M = momentum πΉ π βπΏ Torsion: π = = Thermal Expansion: = πΌ(π2 − π1 ) π΄π π΄π π Bending Stress: π = πΏ 32π ππ3 = 16πΉ∗πΏ πππ3 Moment: π = πΉ∗πΏ π πΌ∗π π Ohm’s Law: π½ = π ∗ π E-Field: π = π Drift Velocity: π£π = ππ π Electrical Conductivity: π = π|π|π ∗ π POLYMERS (hydrogen + carbon atoms) » Stretching = energy ~~~ break stretch = energy release » Isotactic (same side R), syndiotactic (Opposite side R), Atactic (Random), Stereoisomerism (linked together in the same order), π‘ππ‘ππ ππππ¦πππ π€π‘ Molecular number ππ = = ∑π₯π ππ Weight Avg. ππ€ = ∑π€π ππ π‘ππ‘ππ # ππ ππππππ’πππ ππ = ππππππ ππ π ππ§π πππππ, π€π = π€πππβπ‘ πππππ‘πππ, m = molecular weight Degree of Polymerization π«π· = 4 Yield Strength = when plastic deformation begins | Ductility = amount of plastic deform. @ failure (Measured w/ %EL & %RA) Resilience = area under stress strain to yielding | Toughness = energy absorbed before fracture ~ Area under stress-strain curve Interstitial occurs more rapidly than substitutional (|π§1 | ∗ π)(|π§1 | ∗ π), πΉ = , πΈπ΄ + πΈπ = πΈπππ‘ ππ ELECTRIC RESISTIVITY 1 π π΄ ππ΄ Electrical Resistivity: π = = = , Influence of Temperature on Diffusion π 1 4πππ π΄π π Composites (uper) πΈπ (π’) = πΈπ ππ + πΈπ ππ (lowr) πΈπ (π) = π∗ π (πΈπ πΈπ) πΈπ ππ πΈπ ππ 1 =࡬ πΈπ ππ + 1 πΈπ ππ −1 ΰ΅° Fibers ππ = π , if fiber length, l <15 lc then is it discontinuous 2ππ ππ = shear stress to break away, ππ = volume fraction SEMICONDUCTORS Intrinsic: π = ππ |π|(ππ + ππ ) P-Type extrinsic: π β« π (πππ π π − ) ~~ π΅, π΄π, πΊπ (ππππππ‘πππ ) ~~ π = π|π|ππ Influences: Increase impurity → decrease mobility Increase Temp → decrease mobility π π΄ ππ΄ Ohm’s Law: π = πΌπ Resistivity: π = = Conductivity π = 1 π ππ2 π l −ππ ππ ∗ 100 ππππ’ππ‘πππ% = π΄π −π΄π π΄π ∗ 100 Fracture cuts: strong necking > jagged necking > flat break Mass fraction or weight % Dislocations Dislocation Density = πππππ π ππππππππππ ππππππ ππππ ππππππ Yield Strength of a single crystal = ππ = Electron Mobility ππ = π¨π π ππππππ = ππ + ππ π −π ππππππ ππππππππ π π 2 ππ ππ‘ (πππ) Stress concentrator: ππ‘ = π = 2 α α FAILURE πΎ = specific surface energy, If ππ > ππ ∴ πππππ ππππππππ‘ππ Maximum stress: ππ = 2ππ ΰΆ§ π ππ‘ 2πΈπΎ Critical Stress ππ = ΰΆ§ ππ π π∗π π΄ Transit Time π‘ = Carrier Concentration in semicond. ππ = 1 π¨ −π¨π % Cold work = π πΌ∗π πΏ E. Field πΈ = , π΄ = , π = π 4 ππ΄ A = cross-sect. area, I = current, π = length, Z = # free e- per atom, A = atomic weight ππ π Free Electron Density (ππ3) π = π΄ Drift Velocity π£π = ππΈ Ductility Elongation% = f π Density π½ = ππΈ π πΏ π£π π(ππ +πβ ) e = elementary charge, ππ =electron mobility, πβ =hole mobil Electrical Conductivity: π = π ∗ 1.602 ∗ 10−19 ∗ ππ , n = # free electrons Total Conductivity: π = π(πππ + ππβ ) ~~~~~~~ Determining Donor vs Acceptor, P-Type vs N-Type ~~~~~~~~~ Group 3A = P-Type & Acceptor Group 5A = N-Type & Donor | P-type semiconductors have an extra hole. N-type semiconductors have an extra electron. THERMAL Types of heat transfer: conduction: direct molecular interaction convection: bulk motion of fluid Radiation: Electromagnetic emission ππ ππ Heat Capacity: πΆ = Thermal Conductivity (fourier’s): π = −π ππ ππ₯ OPTICAL βπ π Planck’s Law: πΈ = βπ£ = Index of Refraction: π = π π£ Q = heat energy (J), T = Temp. (K) l = length, q = heat flux (J/m2s), E = energy of photon (J), h = planck’s constant k = thermal conductivity (W/m*k) -34 6.626*10 J, v = frequency, c = speed of light 3E8 dT/dx = temp. gradient (K/m) m/s, π = wavelength Snell’s Law (Refraction of Light): π πππ1 π πππ2 = π2 π1 , π1= incidence angle, π2= refracted angle Critical Angle for Total Internal Reflection (n2 < n1): π ππ(ππ ) = Reflectance and Absorption: πππππ πππ‘π‘ππ πππ‘πππ ππ‘π¦ = πΌπ π π½π π2 π1 Io = incident intensity π½= absorption coefficient l = sample thickness Average Energy = max+πππ 2 Interpolation formula: π = π1 + Polystrene = C8H8 Budadiene = C4H4CH2 = CH2 πΈ−πΈ1 πΈ2 −πΈ1 ∗ (π2 − π1)
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