PAS 5500
USER GUIDE
RELEASE 8.4.0
Applicable to:
PAS 5500/20, /22, /60, /80, /100, /200, /250,
/300, /400, /500, /550, /700, /900, /950, SAWS
and RMCS
Date:
14 June 2000
Issue:
1
Order code:
4022 502 42660
COPYRIGHT
© Copyright ASML BV, Veldhoven, The Netherlands, 2000
All rights reserved. No part of this publication may be disclosed to third parties or reproduced,
stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical,
photocopying, recording or otherwise, without prior written permission from ASML BV.
Every page of this document is printed with the statement "Illegal copy if not printed in red". You
can obtain a legal copy from your local ASML representative quoting the order number on the
title page and footer of this document.
Persons who do not observe this copyright statement will be liable for damages.
IMPORTANT NOTICE
ASML reserves the right to alter its products and to make changes in contents, specifications and
prices without previous notice.
DISCLAIMER
ASML BV hereby disclaims any liability for damages or injury caused by, or resulting from, any
other use of the PAS 5500 than that specified by ASML.
RECORD OF AMENDMENTS
Amendment
12NC
Amendment
number
Date
issued
Date
inserted
Signature
SAFETY
Safety related items are indicated in this manual by:
• A pictogram showing the type of danger
• A description that tells how serious the danger is and any actions necessary to prevent it.
The three levels in safety are:
1 Danger, shows a very dangerous situation that, if not prevented, could result in death or a
very serious injury.
2 Warning, shows a dangerous situation where there is a risk of serious injury.
3 Caution, shows that equipment or property could be damaged or there is a risk of minor
injury.
Before you install, operate or maintain the system, read the applicable safety manual. There is a
safety manual for each PAS 5500 model.
Definition of pictograms
The following pictograms are used to show the type of danger:
General hazard
Laser radiation
UV radiation
Electrical hazard
Toxic hazard
Chemical hazard
Hot surface(s)
Strong magnetic
field(s)
Trapping by moving
parts
Moving heavy object(s)
Sharp object(s)
>25 kg
Lifting heavy object(s)
Flammable substances Electrostatic damage
4022 502 42660
14 June 2000
RF radiation
iii
General warnings
WARNING:
All forms of operation, installation work, maintenance, repair, modification and all other
activities involving the PAS 5500 system must only be carried out by authorized, fully
qualified personnel.
WARNING:
Only personnel who have received ASML maintenance training are allowed to open PAS
5500 system covers.
WARNING:
All safety and other requirements described in ASML manuals, the applicable contracts
and the law must be observed at all times.
WARNING:
Use of controls or adjustments or performance of procedures other than those specified in
ASML manuals may result in hazardous radiation exposure.
WARNING:
The mains power switch can be locked off during maintenance. Lockout/tagout procedures
should be according to local fab standards. In the U.S.A. these procedures must conform
to OSHA standard 1910.147.
WARNING:
During maintenance, all machine operating control points must be tagged to prevent
accidental operation.
iv
4022 502 42660
14 June 2000
ASSOCIATED DOCUMENTS
The PAS 5500 documentation set is divided into two groups, USER and SERVICE
documentation. Refer to the service catalog to find the version of the manuals below that is
applicable to your system. Some service manuals are applicable only to a small number of
models.
USER documentation
• Safety manual
• User Guide
• Release Bulletin
• SECS Interface manual
• Periodic Maintenance manual
• Acceptance Test Procedures manual
• Reticle manuals.
SERVICE documentation
• Software Installation manual
• Installation Conditions manual
• Installation manual
• Service manual AL
Alignment - Steppers
• Service manual AL5
Alignment - Step & Scan
• Service manual ALA
Alignment - ATHENA
• Service manual AM
Airmounts
• Service manual AR
Advanced Reticle Management System - Steppers
• Service manual ARS
Advanced Reticle Management System - Step & Scan
• Service manual CS
Computer System
• Service manual CT
Contamination and Temperature Control - Steppers
• Service manual CT5
Contamination and Temperature Control - Step & Scan
• Service manual DUV
Deep UV /90
• Service manual EL
Electrical Layout - Steppers
• Service manual EL5
Electrical Layout - Step & Scan
• Service manual IL3
Illumination /300
• Service manual IL4
Illumination /400
• Service manual IL5
Illumination /500
• Service manual IL9
Illumination /700 and /900
• Service manual IP
Illumination and Projection
• Service manual IP2
Illumination and Projection /200
• Service manual IS
Image Sensor - Steppers
• Service manual IS5
Image Sensor - Step & Scan
• Service manual LS
Level Sensor - Steppers
• Service manual LS5
Level Sensor - Step & Scan
• Service manual ME5
Metrology and Image Calibration - /400 and /500
• Service manual ME9
Metrology and Image Calibration - /900
• Service manual MIC
Metrology and Image Calibration - Steppers
• Service manual PN
Pneumatics
• Service manual PR3
Projection /300
• Service manual PRS
Projection Step & Scan
• Service manual PR9
Projection /900
• Service manual RS
Reticle System
• Service manual SRS
Scanning Reticle Stage
• Service manual SWS
Scanning Wafer Stage
• Service manual TIS
Transmission Image Sensor
• Service manual WH
Wafer Handling
• Service manual WS
Wafer Stage
• Board Schematics manual
• Functions manual.
4022 502 42660
14 June 2000
v
FEEDBACK REGARDING DOCUMENTATION
The ASML Publications department delivers technical information that is clear, up-to-date, and
accurate. If you have any comments about the documentation, please let us know.
When you give feedback please include:
1 The order code (12NC).
2 The issue date.
3 The page number, section number or, when applicable to a procedure, the procedure
number (pnnnnnn.ext, see footer).
Feedback address
Send your feedback to:
E-mail
comments@asml.nl
Address
ASML
Publications comments
PO Box 324
5500 AH Veldhoven
The Netherlands
Fax
+31 40 268 3883
vi
4022 502 42660
14 June 2000
Contents
1
MAIN MENU OVERVIEW
1.1
1.2
Menu Items . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 - 1
Soft Buttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 - 3
2
USER INTERFACE CONCEPTS
2.1
2.2
2.3
2.4
2.5
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
Trackball Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 1
Pointer and Caret Appearance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 1
Special Keys . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 2
PAS 5500 Windows. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 3
Window Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 10
Menus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 10
Forms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 10
Soft Buttons. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 10
Explanatory Text . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 11
Footer Line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 - 11
3
START-UP AND SHUT-DOWN PROCEDURES
3.1
3.2
3.3
3.4
3.5
Switch on the system. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 - 1
Login . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 - 1
Start-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 - 1
Switch Off the System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 - 1
Overview of all Start-Up/Shut-Down Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 - 2
4
SYSTEM ADMINISTRATION
4.1
4.2
4.2.1
4.2.2
4.2.3
4.2.4
4.2.5
4.2.6
4.3
4.3.1
4.4
File Utilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 1
Backup and Restore . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 2
Backup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 2
Restore . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 3
View Backup ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 3
View Backup/Restore History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 3
Upgrade. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 3
Downgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 3
User Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 3
Authority Levels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 4
View Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 - 4
5
MATERIAL HANDLING
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
Port and Slot Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 - 2
Install Reticles in a Reticle Carrier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 - 3
Replace a 6-Inch Reticle Carrier in a Reticle Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 - 3
Replace a 5-Inch Reticle Carrier in a Reticle Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 - 3
Replace a Reticle in a 6-Inch Single-Reticle Reticle Box (Option) . . . . . . . . . . . . . . . . . . . . . 5 - 4
Replacing a Reticle Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 - 4
How to Inspect Reticles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 - 5
How to Replace a Wafer Cassette . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 - 5
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i
6
IRIS - INTEGRATED RETICLE INSPECTION SYSTEM OPTION
6.1
6.2
6.3
6.4
IRIS User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 - 1
IRIS Scan Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 - 3
IRIS Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 - 3
Using IRIS in Batch Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 - 5
7
BATCH CONTROL
7.1
7.1.1
7.1.2
7.1.3
7.2
7.3
7.4
7.4.1
7.4.2
Define a Batch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 1
The Machine/Wafer Status Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 1
Define a Batch Using a Simple User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 4
Define a Batch Using an Extensive User Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 9
Run a Defined Batch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 13
Define a Test Batch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 14
Information Flow During Production . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 15
Batch Reports. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 16
Batch Report Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 - 17
8
BATCH STREAMING OPTION
8.1
8.1.1
8.1.2
8.2
8.3
8.4
8.5
8.6
Batch Streaming User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 1
Batch Streaming Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 1
Batch Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 3
Defining and Editing a Batch Queue. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 3
Batch Queue Execution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 4
Batch Streaming Utilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 4
Batch Streaming System Alerts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 5
Batch Shifts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 - 5
9
ALERT MANAGEMENT
9.1
9.2
Reporting errors to higher level maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 - 1
Flexible Signal Tower Control (SignALL Option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 - 2
10
RMCS - REMOTE MONITORING AND CONTROL SYSTEM
10.1
10.2
10.2.1
10.3
10.4
10.5
10.6
10.7
10.8
Starting RMCS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 1
RMCS User Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 1
RMCS Window Buttons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 2
Configuring a System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 2
Selecting a System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 3
Deselecting a System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 3
Lamp Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 4
Stopping RMCS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 4
Critical Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 - 4
11
SAWS - STAND ALONE WORK STATION
11.1
11.2
11.3
11.3.1
11.3.2
11.3.3
Installing SAWS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 1
Changing Machine Type Simulated by SAWS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 1
Simulation Behavior of Specific Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 1
Illumination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 1
ARMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 1
IRIS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 2
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12
JOB DEFINITION
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.1.5
12.1.6
12.1.7
12.2
12.2.1
12.2.2
12.2.3
12.3
12.3.1
12.4
12.4.1
12.4.2
12.4.3
12.5
12.6
12.7
12.7.1
12.7.2
12.7.3
12.7.4
12.7.5
12.7.6
12.8
Basic Concepts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 1
Cells . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 1
Dies and Exposure Fields . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 2
Images and Image IDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 2
Layer Numbers and Layer IDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 2
Layer ID, Image ID and Reticle ID. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 3
Image Location and Masking Window. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 4
Alignment Marks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 6
Specify the General Properties of a Job . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 7
File Browser . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 8
Jobs for 4x and 5x Lens Reduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 8
Modify Job . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 10
Define the Wafer Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 11
Cell Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 12
Alignment Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 14
Compatibility Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 14
Optical and Global Alignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 15
Mark Clearout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 18
Image Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 19
Image Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 21
Defining the Layer Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 22
Layer Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 22
Marks Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 24
Process Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 28
Reticle Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 32
Exposure Offsets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 33
Reticle Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 36
Standard Jobs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 - 37
13
FACTORY CONSTANTS
13.1
13.2
13.3
13.4
13.5
13.6
13.7
Batch Control Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 - 1
Default Reticle ID. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 - 4
Job Definition Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 - 5
Quadrupole Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 - 7
Layer Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 - 8
User Interface Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 - 9
IRIS Batch Control Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 - 11
14
RETICLE CONSTANTS
14.1
14.2
14.3
14.4
14.5
14.5.1
14.5.2
14.5.3
14.5.4
14.5.5
Maintaining Reticle Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 2
Reticle Group. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 2
Reticle Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 4
Reticle Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 5
Miscellaneous Reticle Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 7
Import/Export Metrology Reticle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 7
Upgrade Parent File . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 8
View Database Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 8
View Reticle Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 8
Import/Export Production Reticle List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 - 8
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1
MAIN MENU OVERVIEW
The PAS 5500 system has a login procedure with a user name and password. Each user is
assigned an access level (operator, process engineer or service engineer). After successfully
logging in, the Main Menu is displayed (see Figure 1.1). This gives the user access to the
different PAS 5500 software applications. Use the Help button for navigation instructions.
Access is either by selecting a main menu item or by selecting a standard button from the tool
bar. Only options and functions related to the user authority level are enabled. After selection of
an application, other forms and menus are displayed in the Dialogue window.
Figure 1.1 PAS software Dialogue window - Main Menu
1.1
Menu Items
Start-Up and ShutDown
Allows the user to start-up (initialize) or shutdown (terminate) the PAS 5500 subsystem software
or do a complete system shutdown, including a UNIX operating system logout. The user can also
use this menu to start or stop the maintenance mode.
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1-1
Batch Control
Gives the user access to the lot operation application.
The lot operation application is used to expose reticles on batches of wafers (see Part 2, Chapter
7: BATCH CONTROL). In the batch set-up, the user can select a recipe layer and provide any
process parameters necessary, such as exposure energy or focus offset. The lot can then be
started.
During batch processing, the actual lot production and wafer exposure information is continually
monitored in the graphics window and batch monitor window. If any warnings, alarms or
important events occur during processing, the operator is visually or audibly alerted by the
system’s signal tower lights or (optional) buzzer. Warning information is shown in the warning
window, while alert messages together with local alarm recovery and assist functions, are
provided by the alert window.
At batch completion, the collected batch data can be viewed in the report window. The reports
provide key production data, and detailed alignment and levelling data for monitoring and
process control purposes.
Factory Constants and Reticle Constants
Gives the user access to the factory constants and reticle constants editor.
Factory constants determine the fab-specific operating conditions, for example typical lot size,
exposure energy and focus offset for exposure.
These constants are used as defaults in the job definition and batch control, but can be
overridden by the user. Factory constants also determine the customization of batch setup
screens and the setup of material handling and alert management during lot processing.
Reticle constants describe the reticle specific data i.e. reticle transmission for correcting lens
heating effects, and mask manufacturing errors for overlay error correction. These reticle
constants are automatically applied when the reticle is being used for exposure. For metrology
reticles, the alignment mark layout on the reticle, and the nominal and actual mark positions, are
also described. This data, together with information about which marks to select from the
exposure field, is automatically taken into account when overlay measurements are done. A
default set of standard ASML reticle constants is provided.
Job Definition
Gives the user access to the job recipe editor.
A recipe, process program or job contains all the wafer and reticle layout information and device
specific settings needed for the exposure of the wafers. The factory constants serve as default
settings for the initial job setup and can be overridden by the user during job editing sessions.
Exposure process parameters from the job, for example exposure energy, are used as defaults
in the batch set-up, but can be overridden by the user before actual wafer exposure. A default set
of standard ASML jobs is provided.
Miscellaneous
Gives the user access to the functions such as backup and restore of user data, the software
configuration overview, generic file-management utilities and user authorization management.
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Test Manager
Gives the user access to test functions of the PAS 5500 subsystems.
Test functions include performance verification, adjustment and calibration tests. The majority of
these test functions can only be used by a service engineer. The results of the tests are available
in the test reports. Any machine constant adjustment resulting from a test must be confirmed by
the user before the actual update.
Machine Constants
Gives the user access to the machine constants editor.
Machine constants determine the adjustment variations of each subsystem of the machine (such
as adjustment knobs and screws). Machine constants are typically measured and updated by the
applicable subsystem calibration test software, run from the test manager. This guarantees
equipment performance, and machine to machine compatibility is maintained. Typical subsystem
hardware and/or software configurations are also setup using machine constants.
SECS Manager
Gives the user access to functions to switch the communications and control mode to setup and
check the communication through the SECS interface. When enabled, the remote control mode
allows front-panel lot-processing control of the system by a host system.
1.2
Soft Buttons
Cmd Hdl (Command Handler)
Gives the user access to functions to directly command the subsystems of the PAS 5500.
These are typically used by service engineers and include:
• Initialize
• Terminate
• Get status
• Low level functional commands.
This capability can only be selected from the tool bar button [Cmd Hdl] when in Test
Manager or Batch Control.
Mat Hdl (Material Handler)
Gives the user access to reticle and wafer handling utilities.
These include (un)loading reticle pods, listing reticle pod contents and reticle particle inspections.
Similar wafer utilities are (un)loading wafer cassettes or removing wafers from the system. The
actual material information is continually monitored in the material monitor window. This
capability is available at any time using the tool bar button [Mat Hdl].
Misc (Miscellaneous)
Gives the user access to:
• SECS Manager Status
• SECS Message to Host
• Start Condition Monitor Trends
• Start Condition Monitor History
• Start Condition Monitor Limits
• Start Report Tool.
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1-3
With these functions it is possible to:
• Continually monitor:
– The actual SECS communications
– The control and equipment process state.
• Send text messages to the host
• Start the condition monitor tools
• Start the report tool.
This capability is available at any time using the tool bar button [Misc ∇].
1-4
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2
USER INTERFACE CONCEPTS
The user interface is built on Sun’s OpenWindows, an OPEN LOOKTM user interface, with a few
deviations to preserve consistency with the PAS 2500/5000 user interface.
A user can interact with the PAS 5500 using:
• The operator console, consisting of:
– A color video display
– A keyboard
– A trackball.
• The emergency off (EMO) buttons on the different units
• The wafer handling and reticle handling ports.
The system interacts with the user through:
• The status lamp. When the ASML defaults are used, the status lamp indicates:
- Red lamp ON:
Process or system error occurred during running of a
batch (irregular intervention)
- Yellow lamp ON:
Operator intervention required during running of a batch
(regular intervention)
- Green lamp ON:
Running a batch
- All lamps OFF:
Batch finished, system idle.
• The wafer-handling port usage indicators (input, output, and reject)
• Several indicators in the cabinets and inside the system
• The optional Advanced Reticle-Management System (ARMS) port status indicators
(Locked, free)
• The (pre-) alignment monitors in the operator console.
Note: If the flexible signal tower control (SignALL) option is installed, the meaning of the status
lamps and the optional buzzer can be user defined (see Part 2, Chapter 9.2: Flexible
Signal Tower Control (SignALL Option).
2.1
Trackball Usage
A trackball is a pointing device that can be compared to a mechanical ball mouse, turned upside
down. Instead of moving the mouse over a surface, and thus causing the ball inside to rotate, the
user directly rotates the ball inside the trackball. The result, moving the pointer over the screen,
is the same. The three buttons named SELECT, ADJUST, and MENU are also the same. They
are the left, middle, and right mouse buttons respectively, on a right-hand configured mouse
(default on the PAS 5500).
Note: As multiple operators use the system, it is not advisable to change the mouse
configuration from right-hand to left-hand.
The trackball can be used to navigate the pointer on the screen and to initiate actions using the
mouse buttons.
2.2
Pointer and Caret Appearance
The pointer indicates the active part of the screen, and can be displayed in three ways:
• An arrow indicates that the system is ready to receive input
• A clock indicates that the system is busy
• A clock-arrow indicates that while in a monitor form (see section 2.4 : ‘PAS 5500 Windows’),
the system is continuously updating the data in the form, but the system can still receive
input by clicking the buttons in the window.
Moving the pointer inside a window makes that window active (this is indicated by a solid
rectangle in the title bar of the window). Clicking SELECT on an input field in a window, positions
the insert point there, and colors that item red. The location of the insert point is indicated by a
small dark triangle (caret). Moving the pointer into another window, or into the workspace,
changes the dark triangle into a dimmed caret, indicating that the insert point in that window is
inactive.
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2-1
2.3
Special Keys
The alphanumeric keys are used to input item values. The keys on the left keypad (L1 to L10)
perform OpenWindows actions. Several other keys on the keyboard have special meanings. See
Table 2.1.
Key label
Key name
Use
Window Button
<F1>
Help
Display help window of current item
in a fill-in form, or close the help
window (toggle).
[Help]
<F2>
Material Handling
Display or close the Material
Handling window (toggle).
[Mat Hdl]
<F3>
SECS Manager Status
Displays the status of the SECS
Communication, Control and
Process (option).
[Misc ∇]
<F4>
Stop
Stop the current action in the
monitor window.
[Stop]
<F5>
Print
Print the dialogue window.
[Print ∇]
<F7>
Buzzer mute (option).
<F10>
Command Handler
Display or close the command
handler (toggle).
<F11>
Activate
Activate current item (select a
software button).
<F12>
Accept
Accept fill-in form, and move up one
level in the menu structure.
<Return> or <Enter>
Accept item
Accept current menu option in a
menu, or accept current item value
and go to next item in a fill-in form.
<Esc>
Cancel / Exit / Escape
Exit a menu, report or form. Cancel
a monitor form.
<Delete> or
<Del> or
<Backspace>
Delete
Clear the selected field or delete a
character in a fill-in form.
<
>
Cursor Up
Go to previous item without
changing current item, scroll report
or error information one line down or
go to previous menu option.
<
>
Cursor Down
Go to next item without changing
current item, scroll report or error
information one line up or go to next
menu option.
<Shift>+<
>
Select Up
Select previous item in a form list
(like in the file browser).
<Shift>+<
>
Select Down
Select next item in a form list.
<
>
Cursor Left
(see section 2.5.2 : ‘Forms’)
<
>
Cursor Right
(see section 2.5.2 : ‘Forms’)
<PrSc>
Print Screen
Print the whole screen on a
graphics printer.
[Cmd Hdl]
[Accept]
[Cancel]/
[Exit]
Table 2.1 Special keys
2-2
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Key label
Key name
Use
<PgUp>
Page Up
Display previous page of report,
error information, or form list.
<PgDn>
Page Down
Display next page of report, error
info, or form list.
<Home>
Home
Display first page of report or error
info, or first item in a form list.
<End>
End
Display last page of report or error
info, or last item in a form list.
Window Button
Table 2.1 Special keys (Continued)
2.4
PAS 5500 Windows
After login, the workspace is filled with a number of windows. Other windows may automatically
open when needed, and will also close automatically when they are no longer needed.
Note: It is good working practice to quit all windows not opened by the PAS application, rather
than closing them. This keeps the workspace unobstructed, and frees memory. Too many
applications in parallel with the PAS application decreases the system’s memory swap
space, to the point where a warning will eventually be issued. If the warning is not acted
upon, a system lock-up may occur.
Windows can be identified by the title in the window header. Use the pointing device to activate
any window, by pointing in it. See the following pages for the different window types.
In both the Dialogue and the Material Handling windows, the user is presented with
menus that have options to select from. Options can be submenus, fill-in forms, or actions. A
submenu provides the user with a new set of options. A fill-in form enables the user to set items
required for the chosen option.
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2-3
Figure 2.1 Dialogue window
The PAS5500 Dialogue window (Figure 2.1) is the most important input window.
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Figure 2.2 Material Monitor window
The Material Monitor window (Figure 2.2) is constantly updated with position information of the wafers
or the reticles. Click View to toggle between wafer and reticle modes. Click Report to display a report for the
currently displayed mode.
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Figure 2.3 Graphics window
The Graphics window (Figure 2.3) displays the layout of the wafer, or reticle. It is also used to display graphs.
Figure 2.4 Dialogue Help window
Click [Help], to open the Dialogue Help window (Figure 2.4), which gives a short explanation of the
currently active item in a form.
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Figure 2.5 Warnings window
The Warnings window (Figure 2.5) is generated by the system’s error handler as a result of a command or
action. Do not quit this window. It is automatically opened and put in front of all other windows when it is
updated.
Figure 2.6 Dialogue Notification window
The Dialogue Notification window (Figure 2.6) is an automatic pop-up window that prompts the user
to make a selection.
Figure 2.7 Dialogue Confirmation window
The Dialogue Confirmation window (Figure 2.7) is an automatic pop-up window that prompts the user
to confirm the selection with a Yes or No.
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2-7
Figure 2.8 Report window
The Report window (Figure 2.8) replaces the Dialogue window. It shows the results of a process that has
already finished. This information can be used for statistical or administrative purposes.
2-8
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Figure 2.9 Alert window
The Alert window (Figure 2.9) is displayed when an error arises, prompting the user with a menu containing
recovery options. If this happens during running a batch, the red or the yellow status lamp will also be lit.
Figure 2.10 List item window
The list item window (Figure 2.10) is an automatic pop-up window, displaying all possible values of an item in
a form.
Figure 2.11 cmdtool(CONSOLE) window
The CONSOLE is the OpenWindows window (Figure 2.11) for system messages. Do not quit this window.
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2-9
2.5
Window Contents
2.5.1
Menus
In a menu, a particular option can be selected by clicking SELECT. It can also be selected by
entering the number that precedes it, followed by an <Enter>. If the option appears dimmed, it is
not available. These options either:
• Require other options to be selected first
• Access non-configured functions
• Are not available for the current authority level (see section 4.3 : ‘User Access’).
2.5.2
Forms
In a fill-in form, a number of items are presented to the user. When an item value is known to the
system, it is already filled in. These default values are taken from other forms, from values
previously inserted, or from the defaults in the system at start-up. All fields are in replace mode.
This means that typed-in text will replace any text already there. To change to edit mode of a
field, type a right arrow. The system then assumes that you want to add text, rather than replace
the text already supplied.
Note: Always accept an item value by typing <Enter> after changing it (see Table 2.1).
2.5.3
Soft Buttons
In a number of windows, buttons are displayed that can be clicked with the pointing device to
perform the specified command, or to activate another form. Some buttons can also be activated
using a keyboard key (see Table 2.1). An overview is shown below of the soft buttons that are
displayed in most menus and forms. The first nine are located in the menu bar at the top of the
Dialogue window.
[Accept]
This button applies the data in the form, and then exits one level up.
[Cancel]
This button exits a form; all input is cancelled.
[Exit]
This button exits a report window or a menu.
[Help]
This button displays a help window, explaining the current item, or soft
button.
[Print ∇]
This button prints the current window or report. This menu displays the
options:
- Dialogue Window
- Clear Printer Queue.
[Cmd Hdl]
This toggle button activates the command handler.
[Mat Hdl]
This button activates the material handler.
[Stop]
This button stops the current action.
[Misc ∇]
This button displays the options:
- SECS Manager Status
- SECS Message to Host
- Start/Stop Condition Monitor Trends
- Start/Stop Condition Monitor History
- Start/Stop Condition Monitor Limits
- Start/Stop Report Tool.
[Apply]
This button applies the data in the form, and updates the graphics window
if applicable. The current form remains active.
[Draw]
This button updates the graphics window with all applied data.
[New]
This button creates a new object.
[Insert]
This button creates a new object, and places it before the current object.
[Append]
This button creates a new object, and places it at the end of all objects.
[Delete]
This button deletes the current object.
[Previous]
This button selects the previous object.
[Copy]
This button copies an existing object and creates a new object from the
copy.
[Next]
This button selects the next object.
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Some forms have specialized soft buttons, and these are described where they occur.
Note 1: Using [Apply], [Accept], [Exit] and [Cancel].
The PAS 5500 provides [Accept], [Exit] and [Cancel] as standard in the
Dialogue window. Clicking these buttons results in leaving the current form or menu.
[Accept] accepts all user specified data. [Exit] and [Cancel] ignore it. In some
forms, [Apply] is available. [Apply] does the same as [Accept], but it does not
leave the form, allowing multiple objects to be defined without having to leave and enter
the form. Therefore, if there is an [Apply] button, it is a good working practice to:
1. Fill in the data in a form
2. [Apply] the data in the form
3. Exit the form with [Cancel].
To avoid unwanted [Apply] actions, do not use [Accept] in those fill-in forms.
Note 2: Where [Apply] is applicable for the whole input form, [Accept] is dimmed to make
sure that undesired input values are not accepted.
2.5.4
Explanatory Text
For every item in a fill-in form, a maximum of three lines of explanatory text is displayed at the
bottom of the Dialogue window. It explains what to fill in at the current item, and the range of
values allowed. A more detailed source of information on the current item is in the help text
displayed by clicking [Help].
2.5.5
Footer Line
In the bottom of the Dialogue window, a footer line displays the current action by the system.
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2 - 11
2 - 12
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3
START-UP AND SHUT-DOWN PROCEDURES
3.1
Switch on the system
To switch on the system, do the POWER ON section of the procedure CsPowOof.REP (see the
Computer System service manual). As a result of that, the Dialogue window appears on your
screen. The Dialogue window is used to operate the system (see section 2.4 : ‘PAS 5500
Windows’).
3.2
Login
In the PAS 5500 Dialogue window:
1. Enter your user name, and press <Enter>.
2. Enter your password, and press <Enter>.
You are now in the PAS 5500 Main Menu. More detailed information on access levels and user
administration is described in Chapter 4.3: User Access.
3.3
Start-Up
1. From the main menu, select: Start-Up/Shut-Down.
2. From the Start-Up/Shut-Down menu, select: Start-Up (FAST).
3. Click [Start], to start the system. This opens a start-up monitor form where you can see
which subsystems are Started. When all subsystems are Ready, you are returned to the
Start-Up (FAST) window.
4. If the Start-Up Status is successful, return to the main menu, by clicking [Exit] twice.
Note: If the system has not been started when the batch control menu is selected, the system
does a FAST start-up.
3.4
Switch Off the System
To switch off the system, do the POWER OFF section of procedure CsPowOof.REP (see the
Computer System service manual).
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3-1
3.5
Overview of all Start-Up/Shut-Down Options
• A Start-Up (FAST) only initializes subsystems that have not been initialized.
This option can be used after periodic maintenance, or after one of the subsystems was
powered down.
• A Start-Up (FULL) initializes all subsystems.
This option must be used if the system is started up after installation, after a change in the
machine constants that requires a re-initialization of the subsystem, a system shut down, or
an emergency switch off.
– If a change in the machine constants has been made, this message is displayed in
the PAS 5500 Warning window if a full start-up is necessary:
• (Re)initialize ... to make machine constants active.
– If the CS machine constants have been modified, this message is displayed:
• Restart PAS5500 software to activate changed CS machine
constants.
• A Shut-Down (FULL) shuts down all subsystems.
This option leaves the software loaded, but un-initialized. A full start-up is necessary.
• A System Shut-Down Power-ON will do an operating system (UNIX) logout.
This option terminates the software completely, for instance when you want to restart the
software from scratch.
Note: The software is terminated before installing a patch.
• A System Shut-Down Power-OFF stops the UNIX operating system.
This option must be used when the whole PAS 5500 system needs to be powered down, or
if a new release must be installed. After the shutdown, the power can be switched off.
• Maintenance mode provides a means to configure the flexible signal tower so that a lamp
is lit when maintenance is being carried out. The SignALL option must be installed to make
use of this feature. Before starting maintenance mode, the ER machine constants should be
edited to configure which lamp should be lit when the maintenance mode is active.
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4
SYSTEM ADMINISTRATION
4.1
File Utilities
In the main menu select Miscellaneous / File Utilities.
The system hard disk is structured as a UNIX file system. This is a tree-like structure, consisting
of one top directory containing other directories. Those directories contain other directories or
files, and so on. To prevent the user from getting lost in the directory structure, file handling is
controlled by the File Utilities menu.
These file types are handled in this manner:
• Batch reports. In the main menu select: Batch Control / Batch Report
Utilities. The batch reports are stored in the directory ‘job path name’/’layer ID’ and they
are named after the batch ID
• Job files. In the main menu select: Job Definition / Job Utilities
• Test Queues. In the main menu select: Test Manager / Test Queue Utilities
• Error logs. In the main menu select: Miscellaneous / File Utilities. The error
logs are stored in the directory user_data/error_logs.
The file utilities limit access to directories other than those reserved for files of the indicated type.
For example, using Job Utilities, the user can only access the directory user_data/jobs.
In each of these menus, the user first selects an operation (List, View, Copy, Rename, or
Delete). The value of the Home item shows in which directory the user started. All directories
and files below this home directory are accessible. The Source and Destination item can be
filled in, or selected by clicking [Select]. The [Select] button opens the File Browser
form, enabling the user to browse through all directories below the home directory.
Test reports can be accessed from the Test Manager / View Test Reports. Using
the View Test Reports form, the user can select a subsystem, followed by a test. Once a test
is selected, all available test reports of that test are displayed in the lower half of the form.
Selecting a test report version (followed by accepting the form) displays a report window with the
test report.
Working with Floppy Disks
Floppy disks are handled by the system through the Device Utilities form. This form is
accessible from any of the File Utilities forms, by clicking [Device Utilities]. In this
form, the user can select:
• [Connect]. A DOS or UNIX formatted floppy disk, inserted in the floppy disk drive, cannot
be accessed immediately. The file system on the floppy disk must first be ‘connected’ to a
location in the directory tree. The floppy disk is then accessible as a directory, until it is
ejected.
• [Format]. New 3.5 inch floppy disks (both high and low density are supported) are usually
already formatted. Only in situations where a connect action fails could it be necessary to
format the floppy disk. Note that a format action can only be successful on a previously
unformatted or UNIX formatted floppy disk. DOS floppy disks should be formatted on DOS
systems.
• [Duplicate]. If the destination floppy disk is not yet formatted, it will be formatted.
• [Eject/Disconnect]. Before a floppy disk is ejected, the file system on the floppy disk
is disconnected from the directory tree.
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4.2
Backup and Restore
All files on the system hard disk can be split into four groups:
• Operating system, delivered with the installation tape
• The software that makes up the application, delivered with the installation tape
• Data files necessary to run the production, backed up with a Specific backup
• Special data files and test reports, only backed up with a Full backup. A Full backup also
includes all files backed up in a Specific backup.
Batch reports are not automatically removed from the system. This is done to make sure these
reports cannot be lost due to inattentive system administration. The removal of these reports is
the responsibility of the user. The user is the only one who can judge whether reports are no
longer needed. For test reports, a version mechanism limits the maximum amount of test reports
saved for a particular test.
Note: System administrators are advised to set up working procedures to make sure old reports
are removed regularly. This will prevent cluttering of the hard disk and decrease the risk of
system lock-ups due to limited disk space. Extra files will slow down full, and specific
backups.
It is good working practice to make regular backups. Two backup procedures that may be useful
in working practice, are:
• Do a full backup every week on one of two tape sets that are used in turn, and a specific
backup every day on two other tapes that are used in turn.
• Do a full backup on a new tape set every week. Save every tape set until all jobs, for which
reports are saved on that tape set, are fully processed.
4.2.1
Backup
Backup allows the user to store certain groups of files away from the system. These files can be
restored if the files on the system are lost. From the main menu, select Miscellaneous /
Backup/Restore / Backup. In the Backup form, enter a comment to identify this backup,
specify the Device, and the Backup Type. Three types of backup can be made:
• A Full backup saves all files that are not on the release CD-ROM
• A Specific backup only saves files necessary to run and use the system, such as:
– Machine/factory constants and history
– User access information
– Job files
– Batch reports
– Condition data
– Test reports
– Test queues
– Configuration data
– Reticle constants.
• When a Specific backup is done, it is possible, using the Backup Set item, to limit the
backup set to only one file type such as:
– Jobs
– Batch reports
– Machine/factory constants and history
– Reticle constants
– Test queues
– Condition monitoring data.
Note: Any files located in the directory user_data/jobs/asm and the directories below it will
not be backed up during a backup. It is, therefore, not advised to locate local jobs or
changed standard jobs in those directories.
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4.2.2
Restore
Restore allows the user to overwrite the current files on the system with the files that were
backed up. From the main menu, select Miscellaneous / Backup/Restore / Restore.
Specify the Device, and insert the medium in its drive. Click [Check Backup ID], to read the
comments with the backup. If the backup is the backup wanted to restore, click [Accept], or
replace the backup medium and repeat the actions until the correct backup is found.
In software release 6.1 and higher, the backup format on tape and floppy has been changed into
the gtar™ format. As a result of this format change, backups cannot be restored from previous
releases using the Miscellaneous / Restore option. A special command is available to
enable backups from previous releases to be restored. This command can be executed from a
command tool window.
4.2.3
View Backup ID
This is an overview of the backups present on the external medium (floppy disk, tape). Specify
the Device type, and insert the medium in its drive. Click [Check Backup ID], to read the
comments with the backup.
4.2.4
View Backup/Restore History
This is an overview report of when the backups were made and when the system was restored.
4.2.5
Upgrade
This upgrades the machine constants, factory constants and reticle constants from previous
releases to the current release.
4.2.6
Downgrade
This downgrades the machine constants, factory constants and reticle constants from the current
release to the previous release.
4.3
User Access
All users of the system are administered with Miscellaneous / User Access. There, every
user can change their own password (Change Own Password), and existing users can have
their privileges changed (Modify Access), or can be denied access completely (Delete
Access). List Accesses gives the user an overview of users that have access to the system,
and their privilege. Create Access gives new users access to the machine and authorizes
them.
Note: The operator name is displayed in all reports.
It is good working practice to have two people who manage all the other user accesses. They
should instruct their people to refer all access related issues to them only, creating well-managed
access responsibilities. Those two people are:
• One field service engineer from ASM Lithography, managing the accesses of all other ASM
Lithography field engineers
• The customer’s system administrator, managing the accesses of all the local employees.
Once a new access is created with service engineer priority, the default service engineer access
(asm) and password (litho) are deleted. This means that, if the newly created service engineer
forgets his or her password, the software needs to be reloaded. If all service engineer accesses
are deleted, the default will be valid again automatically.
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4-3
4.3.1
Authority Levels
Access to the PAS 5500 is possible at three levels. In increasing order of capabilities, they are
called: the Operator level, the Process Engineer level and the Service Engineer level. Each
higher level incorporates all the levels below it. Only someone at Service Engineer Level can
allocate users and passwords. The authorization is done by inhibiting parts of the main menu, or
menus below it, for process engineers and operators.
Function
Authorized users
Operator
Process Engineer
Service Engineer
Start-up / Shut-down
*
*
*
Batch Control
*
*
*
Factory Constants
-
*
*
Job Definition
-
*
*
-
†
*
-
†
*
Machine Constants
-
‡
*
SECS Manager
*
*
*
Command Handler ∇
-
†
*
Material Handler ∇
*
*
*
Misc ∇
*
*
*
Miscellaneous
Test Manager
- no access
* full access
† limited access
‡ view only
Table 4.1 Authorization
4.4
View Configuration
This menu item allows the user to check the current software configuration. The reports show
the:
• Product type
• Machine number
• Machine type
• Installed software
• Installed options
• Installed patches
• Installed patches and differences
• Non-PAS 5500 files and their location.
4-4
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5
MATERIAL HANDLING
Handling of wafers and reticles is done through the Material Handling menu. This menu can
be started by clicking [Mat Hdl] or with the F2 key.
Figure 5.1 Material Handling window
This menu can be used to exchange wafer carriers and reticle boxes, and to remove wafers or
reticles that were left in the machine after the previous batch.
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5-1
5.1
Port and Slot Numbering
Reticle handling ports on systems equipped with the Advanced Reticle Management System
(ARMS) option, are numbered 1 to 3 from right to left (see Figure 5.2). If the Integrated Reticle
Inspection System (IRIS) option is installed, library 3 is replaced by the IRIS hardware. The slots
in a 6-slot reticle carrier are numbered 1 to 6, from top to bottom.
Figure 5.2 Port and slot numbering
Wafer handling ports are numbered 1 to 4, from rear to front. The slots in a wafer cassette are
numbered 1 to 25 (or 1 to 26), from bottom to top. Carriers using 26 wafers must have the same
pitch as carriers using 25 wafers.
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5.2
Install Reticles in a Reticle Carrier
CAUTION:
Do not install reticles produced for use on PAS 5500 systems in PAS 2500/PAS 5000
system reticle carriers (colored blue).
CAUTION:
Follow your local reticle handling procedures to prevent contamination. Contamination on
a reticle can decrease image quality.
.
CAUTION:
Make sure all reticles have a barcode. If a reticle does not have a barcode, problems will
occur when running a batch.
When loading reticles in a reticle carrier, make sure:
• You do not damage the pellicle
• The chrome side of the reticle faces down
• The reticle prealignment marks protrude from the reticle carrier, facing the step and scan
system when they are loaded.
5.3
Replace a 6-Inch Reticle Carrier in a Reticle Box
Parts Needed
a. Conductive reticle carrier 6 x 6-inch, with metal pins and O-rings (colored red).
b. Conductive dark inner liner with holes.
c. Conductive reticle box bottom with holes.
Remove the 6-Inch Reticle Carrier
1. Use a cleanroom wipe and alcohol to clean all areas where reticle carriers or reticle boxes
will be placed.
2. Install the reticle box in the SMIF box loader/unloader, and open it.
3. Remove the two screws that secure the reticle carrier to the reticle box from the reticle box
bottom plate.
4. Remove the reticle carrier.
Install the 6-Inch Reticle Carrier
5. Make sure you have the correct parts (a, b, and c above).
6. Install the reticle carrier on the reticle box bottom plate (covered with the inner liner).
7. Install the two screws through the holes in the bottom of the reticle box bottom plate and into
the reticle carrier pins.
8. Tighten the screws to secure the reticle carrier to the reticle box bottom plate.
9. Use the SMIF box loader/unloader to Install the cover of the reticle box.
10. Clean the bottom of the reticle box.
5.4
Replace a 5-Inch Reticle Carrier in a Reticle Box
Parts Needed
a. Non-conductive reticle carrier 6 x 5-inch, with clamping pin (gold colored).
b. Non-conductive clear inner liner with blind holes.
c. Non-conductive reticle box bottom with blind holes.
Remove the 5-Inch Reticle Carrier
1. Use a cleanroom wipe and alcohol to clean all areas where reticle carriers or reticle boxes
will be placed.
2. Install the reticle box in the SMIF box loader/unloader, and open it.
3. Remove the reticle carrier.
Install the 5-Inch Reticle Carrier
4. Make sure you have the correct parts (a, b, and c above).
5. Install the reticle carrier on the reticle box bottom plate (covered with the inner liner).
6. Use the SMIF box loader/unloader to install the cover of the reticle box.
7. Clean the bottom of the reticle box.
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5-3
5.5
Replace a Reticle in a 6-Inch Single-Reticle Reticle Box (Option)
Parts Needed
a. Single-reticle clear inner liner.
b. 6-inch single-reticle, reticle box.
Remove the Reticle
1. Use a cleanroom wipe and alcohol to clean all areas where reticle carriers or reticle boxes
will be placed.
2. Install the single-reticle reticle box in the SMIF box loader/unloader, and open it.
3. Remove the reticle (see section 5.2 : ‘Install Reticles in a Reticle Carrier’).
Install the Reticle
4. Make sure you have the correct parts (a, and b above).
5. Install the reticle in the reticle box bottom plate (covered with the inner liner).
6. Use the SMIF box loader/unloader to install the cover of the single-reticle reticle box.
7. Clean the bottom of the reticle box.
5.6
Replacing a Reticle Box
This procedure describes how to replace a reticle box, both on standard systems and on systems
equipped with the ARMS option.
Remove the Reticle Box
CAUTION:
On ARMS systems, only remove a reticle box if the green ‘SMIF box free’ indication lamp
on the SMIF port is lit.
.
1. Use a cleanroom wipe and alcohol to clean all areas where reticle carriers or reticle boxes
will be placed.
2. Click [Mat Hdl] to open the material handling window.
3. In the Material Handling menu, select: Exchange Reticle Box.
4. Click [Unlock #] to unlock the reticle box.
5. On ARMS systems, wait for the green ‘SMIF box free’ indication lamp, on the SMIF port, to
be lit.
Figure 5.3 Reticle box removal and install (side view)
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6. Remove the reticle box (see Figure 5.3):
1. Lift the reticle box until the locking mechanism is free from the locking pins.
2. Lift the front of the reticle box until the front of the reticle box is at the same height as
the reticle box guiding plate (A).
3. Remove the reticle box at an angle of 45° towards the front of the machine.
7. Place the reticle box on a clean surface. Do not slide the reticle box over the surface.
Install the Reticle Box
CAUTION:
On ARMS systems, only install a reticle box if the green ‘SMIF box free’ indication lamp on
the SMIF port is lit.
.
8. Make sure the open side of the reticle carrier inside the reticle box faces the machine.
9. Install the reticle box (see Figure 5.3):
1. Align the reticle box with the SMIF box loader/unloader.
2. Lower the reticle box until it is resting on the SMIF box loader/unloader.
Note: On ARMS systems, the green ‘SMIF box free’ indication lamp on the SMIF port goes off.
10. Click [Read #] to read the ID’s of the reticle box you have installed.
11. If there are no ID’s on the reticle, or if it is necessary to change the ID’s read in, click
[Specify], change the reticle ID, and click [Apply].
12. Click [Accept] to leave the form.
5.7
How to Inspect Reticles
If the IRIS option is installed, a manual reticle scan can be done by the operator using the menu
in the material handler. This is an unconditional inspection (see section 6 : ‘IRIS - INTEGRATED
RETICLE INSPECTION SYSTEM OPTION’).
5.8
How to Replace a Wafer Cassette
Replace Wafer Cassette
1. Wait until the elevator is in the top position.
2. Open the carrier port.
WARNING:
Elevator movement may trap body parts and cause injury. Only install and remove wafer
cassettes while the elevator is in the top position.
.
3. If present, remove the wafer cassette from the carrier port.
4. Install the new wafer cassette on the carrier port. Make sure the wafer cassette is correctly
placed on the carrier port.
5. Close the carrier port.
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5-5
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6
IRIS - INTEGRATED RETICLE INSPECTION SYSTEM OPTION
The IRIS particle inspection system option provides the means to inspect a reticle at any given
time, both off-line and during batch processing. By early detection of contamination or defects on
the reticle as an integral part of batch streaming, the possible effect of reduced wafer yield and
throughput loss can be avoided.
The system replaces library three of ARMS, leaving two libraries available to the operator for
reticle streaming purposes.
IRIS consists of two major subsystems, the ARMS gripper system and the Pelliclized reticle
Particle Detector (PPD). The system is designed to detect particles of sizes from 10 µm to
100 µm, on the glass side or pellicles of 6 inch reticles. Detection on chrome surfaces is not
supported by IRIS. Pellicles are scanned on the outside only. Three operator-defined bins are
used to collect data from a scan, representing the number of particles found in a given range of
sizes. Based on these numbers, the decision to either reject the reticle or to continue can be
made automatically, or by operator intervention.
6.1
IRIS User Interface
IRIS can be used in manual and automatic mode, and distinguishes between conditional and
unconditional scans. In an unconditional scan, the reticle is always physically scanned in the
PPD. In a conditional scan, the reticle is only scanned if the lifetime of the previous scan results
has expired. If not, the results of the previous scan are used. This Result Lifetime is set as a
factory constant (Part 3, Chapter 13.7: IRIS Batch Control Data).
In manual mode, a scan can be initiated by the operator through the material handler. Here, an
extra option, Inspect Reticles, is available. This manual inspection is always unconditional.
Note that the reject limits are taken from the layer zero of the factory constants. If a rejection limit
other than the one defined in the factory constants is desired, Command Handler / Reticle
System / Reticle Inspection / Basic Commands / Reticle Inspection can be
used to inspect a reticle manually. Select Always in the Operator Intervention field to
view the inspection results after the reticle is inspected.
Automatic scans are started by the batch control or batch streaming software, and can either be
conditional or unconditional depending on the specific scan. Job definition uses the factory
constants as default values for the IRIS inspection constants. Batch control uses the defined job
as a default for the inspection constants. During the execution of each job, some of the
inspection constants can be overruled as detailed in Chapter 7.1.2: Define a Batch Using a
Simple User Interface. In Job definition/ Layer layout, the menu item Reticle
Inspection enables the user to set different inspection surfaces and reject limits for separate
layers. Modification for individual batches is possible in the batch control or batch streaming
window.
The defaults for each new job are taken from the IRIS factory constants (see section 6.2 : ‘IRIS
Scan Options’). When old jobs are used with the new IRIS software release, they will be
upgraded with these defaults. All standard ASML jobs have already been upgraded, with IRIS
detection disabled.
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6-1
Figure 6.1 Inspect Reticles window
6-2
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6.2
IRIS Scan Options
The IRIS parameters that set the type of scan that is done are found in the PAS software in the
factory constants. Defaults for separate layers are stored under layer data. Defaults for batch
processing are stored under IRIS batch control data.
The IRIS factory constants, and the options available are listed in the factory constants (see Part
3, Chapter 13: FACTORY CONSTANTS).
6.3
IRIS Output
After an inspection, the system displays the inspection result in a graphics window (see Figure
6.2) and in the Inspection Result window (see Figure 6.3).
Figure 6.2 IRIS graphics window
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6-3
Figure 6.3 IRIS Inspection Result window
This result window contains the reticle ID, the number of particles in each bin, and analysis
advice. If the number of particles in any of the three bins exceeds the maximum number, this
advice will be to reject the reticle. An asterisk (*) is displayed in the Limit field of the bin(s)
where the maximum number of particles has been exceeded. At this point, the operator can
choose to continue, retry the inspection, or view the IRIS inspection report.
When the Analysis Advice states Reject Reticle, the reticle can be cleaned with these
steps:
• Leave the Inspection Result window open
• Open Material Handling window
• Select Exchange Reticle Box
• Unlock the box that contains the rejected reticle
• Remove the reticle box and clean the reticle offline
• Replace the reticle box and select the Read ID button
• Close Material Handling window
• Select Retry Inspection in the Batch Control Inspection Result window
The reticle will physically be inspected again and a new Inspection Result window will be
displayed showing the new Analysis Advice and the Factory Constants.
The Allow Operator Overrule parameter in the factory constants specifies if the operator is
allowed to overrule the advice.
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In the inspection report, all the inspection settings are displayed, the particle distribution for each
bin on each surface is given and, most importantly, the position and size of each detected
particle is listed. The coordinates comply with the ASML standard for reticle coordinates (see
Figure 6.4).
Figure 6.4 Reticle image field layout
Based on this report, the operator can decide if the reticle must be rejected. The system only
uses the total particle distribution as a basis for the analysis advice. An operator may also take
the particle position and size into account. Knowing the reticle layout, the operator can determine
if the detected particles will influence the process, and whether rejection of the reticle is
necessary.
6.4
Using IRIS in Batch Processing
Based on theoretical analysis, a particle size of 40 µm is expected to cause printable defects. It is
difficult to determine what the bin settings and rejection limits should be, especially since these
will also depend on the process involved, and where the particle is with respect to key device
areas. It is therefore advisable to use very low rejection limits (even as low as zero), and inspect
reticles before a batch is started. In this way, the condition of a reticle will be monitored by the
operator as often as the reticle is used, and problems will be detected before they can cause a
machine to become idle.
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6-5
6-6
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7
BATCH CONTROL
7.1
Define a Batch
Note: In the PAS application, the word batch is used for the exposure of one single layer, from
one job, on a number of wafers.
The versatility of the PAS 5500 means that many different user types will work with it. To allow
users to tailor the user interface of the PAS 5500 to their typical application, variables can be set
in the factory constants (see Part 3, Chapter 13.6: User Interface Data).
7.1.1
The Machine/Wafer Status Windows
The material monitor window is located in the lower right corner of the user interface. When a
batch is not being processed, the display shows the normal material monitor. This view can be
switched between wafer locations (see Figure 7.1) and reticle locations (see Figure 7.2) using
the View menu. If the IRIS option is present, the reticle locations window includes a
representation of the particle sensor (see Figure 7.3). When a batch is started, the wafer
exposure window (see Figure 7.4) is displayed in the upper right corner of the screen. If a batch
is run in batch streaming mode, the wafer exposure window is displayed on top of the material
monitor window. The material monitor is a separate window and can be moved to another part of
the screen if desired.
Figure 7.1 Wafer locations
Numbers in brackets represent the batch number. This is only used during batch streaming.
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7-1
Figure 7.2 Reticle locations, without the particle sensor
Figure 7.3 Reticle locations with the particle sensor
7-2
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Figure 7.4 Wafer exposure
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7-3
7.1.2
Define a Batch Using a Simple User Interface
In this example, the PAS 5500 user interface is configured with a combined Define Batch/
Process Data form, and the Corrections form is disabled (see Part 3, Chapter 13.6: User
Interface Data).
In the main menu, select: Batch Control.
• If the system has not been started, batch control starts the system. Before the batch control
menu is displayed, the system performs a FAST start-up (see Part 1, Chapter 3.5: Overview
of all Start-Up/Shut-Down Options), which can take up to ten minutes. The time depends on
the number of subsystems that are already started. If no subsystems were running, a FAST
start-up will take the same time as a FULL start-up.
Figure 7.5 Combined Define Batch/Process Data form
Define Batch
In the Batch Control menu, select: Define Batch.
• In the Define Batch form (see Figure 7.5) specify the batch ID. The batch ID is used to
construct the path name to the batch report belonging to this batch, together with the job
path name, and the layer ID. If all batches that are done on a certain group of wafers are
given the same batch ID, all reports belonging to that group of wafers are stored below the
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directory user_data/batch_reports/<job path name>/<layer ID>, with file
name <batch ID>. If there is already a file by that name in that directory, the system asks
whether the new report should overwrite it, should be appended, or if a new batch ID is
required.
• Click Job Name [Select]. This displays the file browser fill-in form (see Part 3, Chapter
12.2.1: File Browser). Select the directory where the job is located. Select the job from the
list shown in the window. Accept the file browser form.
• Click on Layer ID, and select a layer ID from the list. When a layer with multiple
illumination settings in job definition is selected, an alert window will open indicating that this
layer can not be processed as requested. The operator has the choice to either use the
settings of the first image for all other images or to abort the selection and run the job via
the test manager.
• Specify Cassettes for Control Mode, and fill in the number of cassettes. Wafers
Control Mode should only be used if the batch contains a few wafers out of a carrier that
also contains wafers that should not be processed. Specifying more wafers than there are
actually present in the carrier will cause the system to wait for the remaining wafers.
• Specify the Batch Type as a P(roduction) batch. This is a normal batch where every
exposure of an image is done using the specified energy and focus. The other options are
F(ocus meander), E(nergy meander) and M(atrix) (see section 7.3 : ‘Define a Test
Batch’).
• Specify the reticle ID in the Reticle ID item. A reticle that is not yet present in the box(es)
may be specified here. A reticle may also be selected from the reticles currently loaded by
clicking Reticle ID [Select] and choosing from the list of matching reticle ID’s.
Default values of Energy, Focus Offset and Focus Tilt are generated from the job data.
Normally, these values are correct and do not need to be changed, however, they can be
changed if necessary.
For very critical layers, the methods of conserving optimal focus can be supplemented by
exposing a test batch (see section 7.3 : ‘Define a Test Batch’).
Normally, the Illumination Mode defined in the job will be correct. If required, select the
Illumination Mode:
• Default: the default illumination mode, as defined in the illumination machine constants
are displayed and used
• Manual: specify the numerical aperture as required (/100 only)
• Conventional: specify the numerical aperture and sigma outer
• Annular: specify the numerical aperture, sigma inner and sigma outer
• Quadrupole: select the quadrupole ID, numerical aperture, sigma inner and sigma outer.
The values defined in the factory constants Quadrupole Definition are used as default
settings for the selected quadrupole ID.
The quadrupole illumination mode is automatically set on systems with the QUASAR option
installed (available on PAS 5500 /500, /550, and /700 with software release 8.2.0). On systems
without QUASAR installed, the quadrupole aperture must be set manually.
The Wafer Alignment Method shows the alignment method that was set in the job definition.
If it was set to TTL, it cannot be changed in the Define Batch form. If it was set to OA, it can be
changed to TTL in the Define Batch form.
Click [Apply] to accept the currently defined energy and focus values, and continue with the
next section.
The Preset button can be used to copy all values for energy and focus to all images in the
batch.
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7-5
Under production circumstances, the batch data are already filled in correctly. Click on [Batch
Data], to check the default values in the Batch Data form (see Figure 7.6).
I-06338E.rs
Figure 7.6 Batch Data form
• Select a batch report type:
– S(hort) includes wafer status
– M(edium) includes wafer status, alignment and levelling statistics
– F(ull) includes wafer status, alignment and levelling statistics, alignment and
levelling results.
• If an operator is available to assist in process errors, Operator Intervention must be
set to Y(es). If a process error occurs:
– The green light of the status lamp will go out
– The red light of the status lamp comes on.
• If Operator Intervention is set to N(o), and a process error occurs:
– The wafer is rejected
– The green status light will remain on.
• If the number of focus errors, or dynamic performance errors, per wafer is more than the
Maximum Error Count, that wafer is rejected.
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• Set Machine Clearance Reticles to Y(es) if another reticle is normally used in the next
batch. Set it to N(o) if all batches on this machine use the same reticle. Set Machine
Clearance/Wafers to Y(es). Set it to N(o) for special test purposes only.
• The Track Interface Usage is used to set the input/output usage of the wafer track.
• The Elevator Usage is used to set the input and output usage of the elevator.
• The Cassette Integrity must be set to Cassette if production used wafer cassettes
that are not completely filled, and should not be mixed.
• Restrict Idle Time on Stage. When set to N(o), the wafer remains on the wafer table
until the next wafer is available. When set to Y(es), the maximum idle time can be specified.
If this time expires, the wafer is discharged from the wafer table even if the next wafer is not
available.
• When the Optimized level performance is set, the optimized route is calculated
during batch definition using machine dependent parameters. By using the machine
dependent parameters and default critical percentage, the number of edge dies is equal or
smaller, so the levelling performance is increased.
Note: Default values for the batch data form are taken from the factory constants data or job file.
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7-7
The Reticle Inspection form is only visible for systems with the IRIS option. For production,
the reticle inspection data is filled in but can be changed with this form. Click on [Reticle
Inspection], to check or change the default values in the Reticle Inspection form (see
Figure 7.7) (see Part 3, Chapter 13.7: IRIS Batch Control Data).
Figure 7.7 Reticle Inspection form
The Batch [Clear] button is used to clear the batch definition form. All items are set to their
default values. Items, which do not have default values, are cleared.
If the necessary reticles for the selected layer ID are not available in a loaded reticle box, replace
the current reticle box with a reticle box that carries the correct reticle (see section 5 : ‘MATERIAL
HANDLING’). If the reticle is loaded, but its reticle ID is not known to the system:
• Click [Specify]
• Type the reticle ID in the correct input field
• Click [Apply]
• Click [Accept].
The batch can be started by either:
• Clicking [Batch Run] in the Batch Definition form
• Accepting the Define Production Batch form.
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In the Batch Control menu, notice that the Batch [Run] button is now enabled. See
Chapter 7.2: Run a Defined Batch for information on how to run the batch.
7.1.3
Define a Batch Using an Extensive User Interface
In this example, the user interface is configured without a combined Define Batch/Process
Data form (see Figure 7.7), and with the Corrections form (with the default parameter order)
enabled (see Part 3, Chapter 13.1: Batch Control Data).
In the main menu, select: Batch Control.
Figure 7.8 Define Batch form
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7-9
The process data can be accessed using the [Process Data] button (see Figure 7.9). See
Chapter 7.1.2: Define a Batch Using a Simple User Interface for an explanation of the process
data items.
Figure 7.9 Process Data form
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Click [Corrections] and fill in the necessary items (see Figure 7.10).
Figure 7.10 Corrections form
• The Interfield Corrections create offsets to the values set by the alignment system.
• The Intrafield Corrections can be used to correct:
– Translation
– Rotation
– Magnification
– Asymmetric Rotation (scanner only)
– Asymmetric Magnification (scanner only).
• Prealignment Corrections can be done when wafers from unmatched systems are
processed.
• Wafer Rotation can be filled in if the wafers need to be rotated before placing them on
the exposure table. This can be done to make the PAS 5500 field size compatible with other
system brands.
• The Lens Heating Correction factor can be filled in to compensate for lens heating
process-dependency effects.
• The Critical Percentage factor is used to control how much of a level sensor spot must
be usable within the usable wafer diameter to be selected as valid for leveling. When the
critical percentage factor is increased, the number of edge dies can be larger, which will
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7 - 11
decrease the throughput.
• If the optimum position measured with the 8.8 µm alignment grating does not exactly match
the position from the 8.0 µm grating, a correction value can be entered in the 8.0 to 8.8
Shift Corrections [um]. If OA alignment will be used in the batch, the 8.0 to 8.8
Shift Corrections [um] will be labeled Red and Green instead of M1 and M2.
• Alignment Mark Criteria are not always available. If the selected layer does not have
wafer alignment marks, for example in the zero layer and combined zero/first layer, this field
is not shown.
– Minimum Mark Distance specifies the minimum size of the wafer region to be
spanned by the wafer marks used in the fine phase of global or wafer alignment.
– Maximum Delta 8.0-to-8.8 Shift specifies the acceptance/rejection criteria
for alignment scans. The scan is rejected if the delta 8.0 to 8.8µm shift exceeds this
value.
– Maximum Model Residue specifies the mark acceptance/rejection criteria after
modeling all marks (n out of m). If the difference between the measured mark position
and the computed mark position exceeds this value, the mark is rejected.
– SPM Mark Scan specifies the capture range for SPM marks. A Small or Full
capture range for SPM-marks can be selected per layer.
– Wafer Grid Correction specifies the wafer alignment model to be used. The
wafer alignment model determines how the alignment results will be used to find the
position, rotation and magnification of each exposure. The wafer expansion is
calculated and used for each layer. If Wafer Grid Correction is set to No
wafer Scaling, then the value is calculated but not used for that layer.
– 88 and 8um Error Detection specifies if the error detection will be used on this
layer. The default setting is M(achine dependent). This means that the machine
specific parameter from the CD machine constants will be used. E(nable) sets the
error detection to on, and D(isable) sets the error detection to off.
Click [Accept] to accept the updated values and leave the Corrections form.
Click [Cancel], to leave the Process Data form.
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7.2
Run a Defined Batch
Start the batch by choosing Run Batch from the Batch Control menu (or [Run] from the
Batch Definition form). A batch consistency check is done (see section 7.4 : ‘Information
Flow During Production’) to make sure the batch can be processed.
Figure 7.11 Run Batch form
The Run Batch monitor form (see Figure 7.11) displays:
• The estimated completion time
• The time to go for the current batch
• The wafer or cassette counts.
The estimated time to complete the batch is a rough estimate that becomes more exact after the
first wafer is processed, as it is updated every time a wafer has been exposed.
The graphics window shows:
• The current image fields exposed
• The current image fields not exposed
• The previous image fields that are exposed
• The next image fields to be exposed
• The wafer number.
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Images with non-zero exposure offsets will be colored differently based on the exposure offset
group they belong to.
Click on [Start Batch]. If a batch is to be left unattended, make sure the first wafer passes
prealignment.
While a batch is running, the operator can stop it with [Stop] (in the top row of buttons). The
current action is finished and an error window is displayed, with these options:
• Continue Batch
Continue the batch as if nothing has happened.
• Abort Batch after current wafer
Continue exposing the current wafer, and then remove all wafers from the machine
according to the value of Machine Clearance, Wafers.
• Abort Batch immediately
Abort the current wafer and then remove all wafers from the machine according to the value
of Machine Clearance, Wafers.
Click on [View Definition] to view the report of the batch set-up that is being processed or
which is ready to be processed.
If the system detects a misplaced carrier or cross-slotted wafer, an alert is displayed and the
operator can correct the error and continue the batch. If an empty carrier is placed on the input
port, the system generates a warning.
The batch finishes after the specified batch size has been processed. The green light in the
status lamp goes off (see section 9.2 : ‘Flexible Signal Tower Control (SignALL Option)’).
7.3
Define a Test Batch
Define Test Batch (that is, a batch with Batch Type other than P(roduction) in the
Process Data form) uses the same fill-in forms as described for Define Batch. Some extra
items are displayed, inherent to the different function offered by Define Test Batch.
In the Batch Data form, in addition to the items present during production batch definition, it is
possible to choose:
• Not to use reticles
• Not to prealign the reticle
• An alignment other than specified in the job.
Use Reticles can be used to do an open frame test, to find the uniformity in resist. Reticle
Prealignment can be used for various single layer tests with non-PAS 5500 reticles, for
example, lens testing. Alignment Type can be used to force:
• No alignment
• Alignment on the fiducial marks
• Alignment as specified in the job.
In the Process Data fill-in form, focus and energy can be specified with Batch Type as:
• Focus meander
The first cell is exposed with the Actual energy and focus. The rest of the cells have the
same energy. For each subsequent cell, focus increases with the Focus Step value.
• Energy meander
The first cell is exposed with the Actual energy and focus. The rest of the cells have the
same focus. For each subsequent cell, energy increases with the Energy Step value.
• Matrix or focus energy matrix (FEM)
The center cell is exposed with the Actual energy and focus. In every column, the energy
increases by the value for Stepsize. Cells in columns to the left of the centre column
each have an energy lower than that of the centre cell. Cells in columns to the right of the
centre column, each have an energy that is higher. In every row, the focus decreases by
the value for Stepsize. Cells in rows above the centre row each have a focus lower than
that of the centre cell. Cells in rows below the centre row each have a focus that is higher.
The test batch report contains a table of the energy and focus values per exposure.
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Meander is a term used in the lithographic industry that means, to follow a row of cells and when
that row ends, move one row up and follow that row in the reverse direction of the previous row
(see Figure 7.12).
Figure 7.12 Focus and energy values with meander and matrix test batch
7.4
Information Flow During Production
After the start of a batch, information is retrieved during processing of the batch information.
When the batch is finished other information is created. To understand all these different flows of
information, the process is split up into three phases, and after each phase, the information
actions are explained.
• Batch preparation
Job definition and factory constants are obtained. The values obtained are filled in as
default in the different Batch Control forms. If certain items need to be changed every
batch, it may be wise to change the value in the job, or change the factory constants.
When all values are read in, a consistency check is done. This makes sure that:
– The number of reticles used is not larger than 6 (18 for ARMS systems)
– The reticles to be used are present
– The wafer input/output ports are consistent
– The energy and focus offset limits are respected
– The light source status is OK
– The remaining light source life time is OK
– The light source type is correct.
• Batch execution
Work is scheduled to all the subsystems, and monitored. The software receives status
messages from the subsystems. This information is used to update the monitoring form, to
fill the batch summary report, and the normal batch report.
• Batch reporting
The wafer status information from the previous phase, is shown in the batch summary
report. Information from preparation and execution is shown in a normal batch report (see
section 7.4.1 : ‘Batch Reports’).
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7.4.1
Batch Reports
Report Types
During a batch, the software monitors the processing of wafers. At the end of a batch this is
shown in one or more reports.
• Batch summary report
Use this report to check if the processed batch needs any rework. This report is not stored
as a file, but only displayed after completion of a batch.
• Short Batch report
This report is saved in a file named by the user before the batch started. The contents can
be found in Table 7.1. Use this report for administrative purposes.
• Medium Batch report
This report is saved in a file named by the user before the batch started. The contents can
be found in Table 7.1. Use this report for administrative purposes.
• Full Batch report
This report is saved in a file named by the user before the batch started. The contents can
be found in Table 7.1. Use this report for administrative purposes.
Before the batch is started, the user can choose none, a short, a medium, or a full batch report.
After the batch is finished, the user always gets the batch summary report, if the batch was
started with Batch Control. For batches started from the Test Manager, a batch summary
report is not displayed. For batches started by the host via the SECS interface it is configurable
whether or not a batch summary report will be displayed (see Part 3,Chapter 13.6: User Interface
Data).
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7.4.2
Batch Report Contents
Figure 7.13 Example batch report - Process Data
Batch ID, Job Name, Layer ID, Control Mode:
The values entered in the define batch window are displayed here (see section 7.1.2 : ‘Define a Batch Using
a Simple User Interface’).
PROCESS DATA:
Lists the values filled in on the Process Data form. For test batches the energy and focus steps are shown.
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Figure 7.14 Example batch report - Exposure Data
Exposure Data
Lists the values of the image offsets plus the cell offsets as specified in the Exposure Offsets form of Job
Definition (Figure 12.27). The defined cell offsets are shown for every image ID.
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Figure 7.15 Example batch report - Test Exposure Data
Test Exposure Data
Details, for every image ID, the energy and focus used for every group of cells.
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I-11108A.rs
Figure 7.16 Example batch report - Batch Data
Batch Data
Lists the values filled in on the Batch Data form.
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Figure 7.17 Example batch report - Process Corrections and Batch Monitoring Data
Process Corrections
Lists the values filled in on the Process Corrections form. They include, the interfield, intrafield,
prealignment, wafer rotation and 8.0 to 8.8 shift corrections.
Batch Monitoring Data
Shows date and time of the batch, light source lifetime remaining and used at the beginning and at the end
of the batch. Also the number of wafers processed, accepted, and rejected is shown.
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Figure 7.18 Example batch report - Wafer Data, Errors and Reticle Data
Wafer Data
Details for each wafer processed, the status, exposure status, lens temperature, lens pressure, the time
the wafer arrived on the wafer stage, and the time of the last exposure.
Errors
Details for each wafer processed, the alignment, focus, dynamic and other errors that occurred (see Table
7.2)
Reticle Data
Details for each reticle used, the translation, rotation, magnification, transmission factor and energy offset
values.
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Figure 7.19 Example batch report - Alignment Results
Alignments Results I
Details for each wafer processed, the wafer translation, expansion, rotation, non-orthogonality and number
of failed marks.
Alignment Statistics I
Details for all wafers processed, minimum, maximum, average, and standard deviation values of the results
shown under Alignment Results I.
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Figure 7.20 Example batch report - Alignment Results
Alignment Results II
Details for each wafer processed, the reticle magnification, reticle rotation, worst mean value of wafer quality
of all the quadrants, and the correction applied to the wafer position to prevent 8.0 to 8.8 µm errors.
Alignment Statistics II
Details for all wafers processed, minimum, maximum, average, and standard deviation values of the results
shown under Alignment Results II.
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I-13252.rs
Figure 7.21 Example batch report - Alignment Results with OA alignment
Alignment Results II
Details for each wafer processed, the reticle magnification, reticle rotation, and the red XY and green XY
corrections applied to the wafer position to prevent 8.0 to 8.8 µm errors. This table is displayed when OA is used
to align a layer on the wafer.
Alignment Statistics II
Details for all wafers processed, minimum, maximum, average, and standard deviation values of the results
shown under Alignment Results II. This table is displayed when OA is used to align a layer on the wafer.
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Figure 7.22 Example batch report - Level Results
Level Results I
Details for each wafer levelled globally, the height difference, and the rotation around the X and Y axes.
Level Statistics I
Details for all wafers processed, minimum, maximum, average, and standard deviation values of the
results presented under Level Results I.
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Figure 7.23 Example batch report - Level Results
Level Results II
Details for each wafer levelled field-by-field, the minimum and maximum value of the height difference, and
the rotation around the X and Y axes.
Level Statistics II
Details for all wafers processed, minimum, maximum, average, and standard deviation values of the
results presented under Level Results II.
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Figure 7.24 Example batch report - Level Results
Level Results III
Details for each wafer levelled field-by-field, the mean value and standard deviation of the height
difference, and the rotation around the X and Y axes.
Level Statistics III
Details for all wafers processed, minimum, maximum, average, and standard deviation values of the
results presented under Level Results III.
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Figure 7.25 Example batch report - Alignment Results
Alignment Results III
Details for each wafer processed, the average system adjustments over exposures and images (both height
and tilt) of the level sensor, the position of the movable lens elements in the /300 lens, the average position
(height) of the reticle table and the wavelength shift of the illumination laser (DUV steppers only).
Failed Alignment Marks
Details for each wafer, the position of the failed alignment marks. If no marks fail, this table is omitted.
Alignment Results IV
Details for each wafer processed, the scan scaling and skew, and the reticle stage translation.
Alignment Statistics IV
Details for all wafers processed, the minimum, maximum, average and standard deviation for the wafers in
Alignment Results IV
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I-13253.rs
Figure 7.26 Example batch report - Alignment Results with OA alignment
Alignment Results V
Details for each wafer processed, the largest order deviation, the worst wafer quality, and the largest
mark.resolution. This table is displayed when OA is used to align a layer on the wafer.
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Figure 7.27 Example batch report - Level Results
Dynamic Performance Statistics
Details for all wafers processed, the minimum, maximum, average, and standard deviation for the Moving
Average Error and Moving Standard Deviation Error.
Level Results IV
Displays for each wafer processed, the intrafield tilt range in the X and Y directions.
Level Statistics IV
Displays for all wafers processed, the intrafield tilt range minimum, maximum, average, and standard deviation.
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Figure 7.28 Example batch report -Reticle Inspection
Reticle Inspection
Shows the results of the reticle inspection.
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Report type
BS
Heading
S M F
x
x
x
PROCESS DATA
x
x
x
EXPOSURE DATA
x
x
x
TEST EXPOSURE DATA
x
x
x
BATCH DATA
x
x
x
PROCESS CORRECTIONS
x
x
x
BATCH MONITORING DATA
x
x
x
x
WAFER DATA
x
x
x
x
ERRORS
x
x
x
RETICLE DATA
x
ALIGNMENT RESULTS I
x
ALIGNMENT STATISTICS I
x
ALIGNMENT RESULTS II
x
ALIGNMENT STATISTICS II
x
LEVEL RESULTS I
x
LEVEL STATISTICS I
x
LEVEL RESULTS II
x
LEVEL STATISTICS II
x
LEVEL RESULTS III
x
LEVEL STATISTICS III
x
ALIGNMENT RESULTS III
x
FAILED ALIGNMENT MARKS
x
ALIGNMENT RESULTS IV
x
x
ALIGNMENT STATISTICS IV
x
x
DYNAMIC PERFORMANCE STATISTICS
x
LEVEL RESULTS IV
x
LEVEL STATISTICS IV
x
RETICLE INSPECTION
x
x
x
x
x
x
x
Where:
BS
S
M
F
- Batch Summary
- Small
- Medium
- Full
Table 7.1 Batch report contents
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Errors
The errors that may appear in the batch reports are shown in Table 7.3.
Heading
PREALIGNMENT
Error
Explanation
EDGE
Edge of wafer could not be detected during edge
prealignment.
OPT
Failure during optical prealignment.
MARK
Alignment mark not detected during global
alignment.
MODEL
Coordinate transformation could not be computed
during global alignment.
FOCUS
#ERRS
Number of focus errors; also focus spots detected
by focus monitoring.
DYN
#ERRS
Dynamic performance monitoring errors.
OTHERS
JOB ABORTED
Processing aborted by operator.
WH
Fatal error reported by wafer handling.
RH
Fatal error reported by reticle handling.
IL
Fatal error reported by illumination.
WS
Fatal error reported by wafer stage.
LC
Fatal error reported by level control.
IQ
Fatal error reported by image quality.
GLOBAL
EC
Others
SOFTWARE
Fatal error reported by software.
LEVEL
Global level failed.
TRACK
Wafer rejected already by the wafer track.
PREVIOUS BATCH
An error on this wafer, numbered 1, must be
looked up in the batch report of the previous batch
behind the wafer with the last number.
Table 7.2 Errors in batch reports
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8
BATCH STREAMING OPTION
The batch streaming option allows the user to operate the system in a continuous flow mode.
This mode of operation effectively eliminates batch overhead time associated with system
set-up. It allows the user to define batches for processing, and to place them into an execution
queue while the system is still running. Sequential execution of queued batches occurs
automatically.
The next batch in the queue is started when the last wafer of the current batch is taken from the
input port. In systems that are not configured with this option, definition and execution of the next
batch is not possible until the current batch has completed.
The batch streaming option can be installed on standard PAS 5500 systems, PAS 5500 systems
equipped with ARMS, and systems interfaced to track units that support cascade processing.
The ideal configuration is for a system that is track interfaced and equipped with ARMS. This
configuration maximizes automation while sustaining high system throughput. A system
configuration missing either of these components (ARMS or interfaced track) requires the
operator to supply a continuous flow of the missing material (reticles or wafers) to the system.
8.1
Batch Streaming User Interface
The user interface of the batch streaming software is different from the normal batch production
software.
8.1.1
Batch Streaming Form
• The Batch Streaming form is on the left half of the screen (see Figure 8.1). This form
provides the user with a batch queue definition and editing interface and a queue status
monitor that shows the status and contents of the batch queue. This monitor is located in
the upper half of the screen, in the form of a batch queue viewing window. The batch that is
selected in the viewing window is shown on the Selection line.
• The Batch No reflects the order in which a batch was initially defined. The batch numbers
are not indicative of the order of batch execution.
• The Batch ID is defined in the Batch Definition screen.
• The Status describes the condition of every batch in the batch queue. The valid states and
their definitions are:
- Pause
Pauses the stream of batches in the queue.
- Waiting
Indicates that reticles or wafers have either not been defined or
not loaded. The batch will not start until these conditions have
been met.
- Ready to Run Batch is ready to be processed.
- Started
The batch has begun and wafers are being loaded into the
system but exposures have not started.
- Processing
The current batch that is being exposed by the system.
- Completed
The batch has finished.
- Aborted
The batch was terminated prior to the last wafer being fully
exposed and put into the output cassette.
- Skipped
The batch had been stopped before the first wafer is loaded in
the E-chuck.
- Unloading
After the last wafer of a batch has been swapped from the
E-chuck, the batch status is Unloading. It remains
Unloading until the last wafer has been removed from the
system (either to the output cassette or to the track).
• The Acc/Rej column shows the number of wafers that are accepted or rejected for each
batch in the queue.
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8-1
Figure 8.1 Batch Streaming form
The batch status is indication of the batch states Started, Started/Waiting, Processing,
Skipping and Unloading uses the symbol >>> to indicate wafer flow. The >>> on the left
indicates that wafers are being loaded for the batch. The >>> on the right indicates that wafers
are being discharged. (see Figure 8.2).
I-11120.xwd
Figure 8.2 Batch status indication
The lower half of the Batch Streaming form contains the batch queue definition and editing
controls. These are described in section 8.2: Defining and Editing a Batch Queue.
8-2
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8.1.2
Batch Monitor
In the top right corner of the screen, the batch monitor can be found (see Figure 8.3). This
window shows all of the status and process information about the batch with the status
Processing on the Batch Streaming form. This screen also contains the [Stop] button
that stops the wafers processing in the current lot.
Figure 8.3 Batch monitor form
8.2
Defining and Editing a Batch Queue
To define and execute a batch queue, the batch streaming user interface must be activated by
selecting Batch Streaming from the Batch Control screen (see Figure 8.1). The
[Append] button is used to define and add a new batch to the stream. Selecting it brings up the
Batch Definition form, which must be filled-in (see Figure 7.5). After the batch has been
defined and accepted, the user is returned to the Batch Streaming screen and the batch just
defined changes status to Waiting or Ready to Run.
At this point, the next batch to be processed can be defined by selecting [Append] again and
repeating these steps. The first batch can be started before the definition of the next batch is
done. This is done by selecting the Queue [Continue] button. This button starts batch
processing after a Pause or when it is Ready to Run.
Editing a queue may be done before, or during the wafer processing. During batch streaming:
• New batches can be defined and added to the queue
• The existing order of the queue can be changed
• Pending batches can be deleted from the queue.
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8-3
A batch can be selected by clicking on a queue entry. These queue edit functions become
available:
- [Append]
Starts the definition of a new batch to be processed.
The new batch is added to the end of the batch queue.
- [Append Pause] Adds a Pause to the queue sequence.
- [Move Up]
Moves the selected batch up in the queue. This function is used to
modify the batch execution order.
- [Move Down]
Moves the selected batch down in the queue. This function is used to
modify the batch execution order.
- [Copy]
Copies the selected batch to the bottom of the queue. Batch ID and
wafer count must be re-defined.
- [Delete]
Deletes the selected batch.
- [Modify]
Modifies the selected batch that has been defined. This can be used
to review the process parameters.
8.3
Batch Queue Execution
Once the [Continue] button has been selected and the required wafers and reticles are
available to the system, processing begins. Reticles and wafers must now be supplied to the
system in the order in which their respective batches are ordered in the queue.
When there are <n> wafers left to process in the current batch (<n> being defined in the factory
constants Batch Preparation Warning Period), warnings are given if material (wafers or
reticles) are missing for the next batch. A warning message is displayed and the green warning
lamp begins to flash.
When the last wafer of the Processing batch is taken from the input carrier (or interface
pedestal) the status of the next batch in the queue changes to Started. This means wafers are
loaded for the next batch but exposures have not yet started.
The current batch changes status to Unloading when the last wafer is swapped from the
E-chuck. The next batch changes status to Processing.
The current batch changes status to Completed when the last wafer is placed in the output
carrier or into the interfaced track.
For systems not interfaced to wafer tracks, wafer carriers can be exchanged on the input and
output loaders as soon as the carrier is empty/full and has returned to the raised position.
If the IRIS option is installed, reticle inspection can be done during the batch streaming.
8.4
Batch Streaming Utilities
The Batch Streaming form (see Figure 8.1) provides the user with access to additional
software functions. Under the View heading, there are two software buttons, [Report] and
[Material]. The [Report] button displays the batch report of any previously processed
batch which has been selected. The [Material] button will display the batch, reticle, and wafer
cassette criteria of the selected batch. Under the Queue heading, the [Clear] button clears the
queue of all existing, defined batches. The [Continue] button starts the first batch that is
Ready to Run or restarts the queue after a pause.
8-4
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8.5
Batch Streaming System Alerts
Status lamp
Reticles
Wafers
Batches
8.6
The status lamp on the system starts to flash green when the next batch
in the queue does not have sufficient data or materials to keep an
uninterrupted flow of wafers. This warning is user defined in the factory
constants, and is based on the number of wafers left in a batch. The
green lamp flashes if:
- The batch is not defined
- The reticles are not present in the SMIF pod
- The wafers are not loaded on the input cassette
- A Pause has been inserted.
If reticles are not available, a prompt is generated on the Batch
Streaming screen that the system will pause unless the correct reticle
is available.
If a reticle ID is not defined, a prompt is displayed, and the stream will
pause.
If both output cassettes are full of wafers, a prompt will be generated on
the Batch Streaming screen indicating that the cassettes are full.
If no wafers are loaded for the next batch in the queue while the previous
is finishing, a prompt is generated on the Batch Streaming screen
and the stream will pause.
If a wafer is rejected, and the Reject Wafer Alert factory constant
is set to Y(es), a prompt is generated, the status light starts to flash and
the stream will pause.
If different batches are defined in the queue with different port usage (the
interchanging of input and output ports), the status will always be
Waiting, even if wafers and reticles are present.
If a job has been modified by the operator, or a new job has been
downloaded from a host while it is waiting in the queue, the batch set-up
is deleted from the queue and a prompt is generated.
If a batch is not defined after the batch that is processing, a prompt is
generated on the Batch Streaming screen.
If the batch report already exists for a defined batch, a prompt is
generated warning the operator.
Batch Shifts
A batch shift is defined as, a shift of one or more wafers in a batch which results in a single lot
containing wafers of two different lots. For example, this can occur if an operator loads 24 wafers
into a cassette and defines the batch as 23 (or 25) wafers while in wafer mode. In theory, if this is
not prevented or caught at a later process step, all subsequent batches running in the queue
could contain a wafer from the previous (or next) lot. To prevent this, batches can be processed
in (C)assette mode rather than (W)afer mode. This will eliminate the wafer count issue. On
a system interfaced to a wafer track, (N)one mode must be used.
Solutions incorporated into batch streaming to minimize the possibility of this issue are:
• If a batch is aborted, an alert prompt is displayed and a pause is inserted
• If a wafer is rejected, a pause can be automatically inserted
• If a batch is deleted while it has wafers in the system, an alert will be generated and a pause
inserted
• If a batch is aborted while processing, an alert is generated and a pause is inserted
• If the track end-of-batch signal does is not the same as the batch size, an alert is generated
and a pause inserted. This is for interfaced systems only.
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8-6
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9
ALERT MANAGEMENT
If an error occurs during batch processing, the green status light goes off and the yellow or the
red status light comes on. On the screen, an alert window opens displaying the error and
possible recovery options. Click [Help] once and the logged entry for that error is shown
including links to low level sub systems. By clicking [Help] twice, the contents of the error
logging file are displayed.
The logging file has a capacity of 10,000 lines of error messages. All errors that occur are stored
in a file called error_log.cur, in the directory user_data/error_logs. When it is full
(larger than 1 Mbyte), the system automatically renames it to a file called error_log.old,
overwriting a previous file with that name, if present.
In addition to error messages, events are also logged in the log file. Examples of an event are:
– A test has been started
– A specific reticle has been loaded.
Every error that occurs is reported through each ascending level in the software until it reaches
the top level, where an alert window is presented to the user. Three error types can be identified.
They are:
• System errors:
System errors are caused by errors in the system’s hardware or software. The red status
light to comes on.
• Process errors:
Process errors also cause the red status light to come on. These errors are caused by the
environment of the system. Examples are: calibration needed, (pre)alignment error.
– Automatically recoverable errors
These errors in the process are logged in the batch report. They are:
• Wafer edge prealignment failure (error message in batch report: EDGE)
• Wafer fine prealignment failure (error message in batch report: OPT).
– Recoverable process errors
Recoverable process errors are errors in the process that may require operator
intervention. If Operator Intervention is set to No, one retry is usually
performed, and then the wafer is rejected. If Operator Intervention is set to
Yes, the operator gets an alert window. The operator can retry, reject, or clear the
error. These errors are:
• Global alignment failure
• Global levelling failure
• Number of focus errors per wafer exceeded
• Number of dynamic process errors per wafer exceeded.
The errors are logged in the batch report.
• Operator errors:
These errors happen because the system is waiting for the operator to do a certain action.
They light the yellow status light. The operator must clear the cause of the error, and choose
to continue. Examples are:
– Lamp life time expired
– An empty input carrier
– No reticles
– Other wafer input/output errors.
9.1
Reporting errors to higher level maintenance
If you cannot recover from an error, display the log file by clicking [Help] once in the error
window. In the error message, one line may be included detailing what caused this error. If so,
search back in the log file to find the original error. Then call in the next level of maintenance, and
report to them the sequence of errors, and the ten events before, and after the original error.
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9-1
9.2
Flexible Signal Tower Control (SignALL Option)
The flexible signal tower control is an option to visually and/or audibly draw the operators
attention to alarms, important events or states of the system. It supports a buzzer and four lamps
(red, green, yellow and blue).
The ER: Signal Tower Configuration form is used to set the alarm states.
Figure 9.1 Flexible signal tower configuration form
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The system states are prioritized, with the most important event, maintenance, at the top of the
table and the least important control state, on-line/remote, at the bottom. If two or more events
occur at the same, the highest priority event will be displayed (see Figure 9.1).
• In the Signal Tower Control field, select the operational state of the signal tower
– A(lways)
The signal tower will function continually
– P(rocessing)
Function only during the processing states (setup... pause)
– O(ff)
The signal tower is turned off.
• In the configuration table, define the relationship between the errors, warnings and events
and the available lamps and buzzer, by specifying the states of the lamps and buzzers for
each system state.
– S(teady)
The lamp or buzzer is on continuously
– I(nterval)
The lamp or buzzer pulses on and off
– O(ff)
The lamp or buzzer is off
– *
The lamp or buzzer stays in it’s current state.
The lamps and buzzer can also be directly controlled using the SECS interface. Direct control of
the lamps and buzzer is allowed when the on-line state is active. Lamp settings via SECS have a
higher priority than the local lamp settings. This means that local settings will be overruled by the
host.
If the option is not installed, the ASML defaults are used.
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9-4
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10
RMCS - REMOTE MONITORING AND CONTROL SYSTEM
WARNING:
During service or maintenance, the RMCS station must be tagged ‘Stepper ... being
serviced. Do not operate’. This is done to prevent accidental operation of the system.
.
The Remote Monitoring and Control System (RMCS) is a central operator control station from
which an operator can monitor and control a maximum of six remote PAS 5500 systems
connected via an Ethernet network. Basic alarm status and lot processing information from the
connected systems is continually monitored and displayed. The user interface of any of the
connected systems can be switched from the systems operating console unit (OCU) to the
RMCS terminal using the X Window System network capability. The RMCS can be used with
PAS 5500 systems with software release 6.2 and up which have an external Ethernet interface.
To use the buzzer functionality and the blue lamp, the SignALL tower option must be installed.
10.1
Starting RMCS
The RMCS application is automatically started after logging on to the RMCS station. An RMCS
window is displayed after several seconds (see Figure 10.1).
If the RMCS application has been stopped, it can be started by typing the RM_start command
in the console window on the RMCS station.
10.2
RMCS User Interface
When starting up the RMCS for the first time, no systems are displayed (See Figure 10.1).
Figure 10.1 RMCS window with no configured steppers
When systems have been configured, a visual indication is given to show which systems can be
reached. Each configured system is portrayed as three solid bars representing the three lamps,
with the name of the system on a button below (see Figure 10.2). Inactive lamps are displayed in
black, active lamps are displayed in the appropriate color (red, yellow or green). A system that
cannot be reached will have all lamps displayed in grey.
Figure 10.2 RMCS window with configured steppers
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10 - 1
An option exists to display a fourth, blue lamp. If the system is configured for a blue lamp (see
section 10.3 : ‘Configuring a System’), four solid bars will be displayed for that system.
10.2.1
RMCS Window Buttons
Three buttons are available in the RMCS window:
• [Local]
– The [Local] button is used to return the user interface of the selected system to that
system.
• [Buzzer Off]
– The [Buzzer Off] button is used to mute the buzzer of a selected system, both at
the system and at the RMCS station. If the buzzer is active, this can still be seen in
the RMCS window.
• [Misc]
– The [Misc ∇] button leads to these menu items:
• Size
Allows the operator to select the size and orientation of the RMCS window. The
options are Vertical, Horizontal and Full.
• View Configuration
Allows the user to view a summary of the machine number and the installed
software version (Configuration Overview) or of the installed patches
(List Installed Patches) on the RMCS work station.
• RMCS Setup
Allows the user to choose the systems to be monitored and to allocate the
names to be displayed in the user interface.
10.3
Configuring a System
Select Misc/RMCS Setup in the RMCS window. The configuration of the RMCS station (which
systems are monitored) can be changed by adding or deleting system names in this window
(see Figure 10.3).
Figure 10.3 RMCS Setup form
The system is identified by the hostname. The name which will be displayed on the button in the
RMCS window and the blue lamp status must be entered.
The RMCS application must be re-started before the new configuration can be used. This can be
done using the command RM_restart in the console window of the RMCS station.
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If a system is no longer required on the monitoring list, it can be removed from the RMCS Setup
form. If more than six systems are defined in the setup form, an error is displayed when the
[Accept] button is selected.
The blue lamp is an option. It requires the SignALL tower option to be installed on the monitored
system. If it is configured in the RMCS setup, it should be enabled in the ER machine constants
of the monitored system.
10.4
Selecting a System
A configured system can be selected by clicking the button displaying the system name. Only
one system can be selected at any one time. When selected, the user interface of that system
(together with all other active windows such as the console window and log book) are sent to and
displayed on the RMCS station. If contact cannot be made with the selected system, an error
message is displayed on the screen. A selected system, in this case system 2002, is marked as
shown in Figure 10.4.
Figure 10.4 RMCS window with system 2002 selected
When the user interface of a system is transferred to the RMCS station, a message is displayed
on the screen of the selected system as shown in Figure 10.5. A [Local] button is included with
the message. When this button is selected, the user interface of the system is returned. The
system is no longer selected at the RMCS station.
Figure 10.5 Window displayed at selected system
10.5
Deselecting a System
A selected system will become deselected in these situations:
• When clicking [Local]in the RMCS window to return the user interface to the selected
system. The system is no longer selected.
• When the button of another system is clicked in the RMCS window. The previous selection
is automatically cancelled.
• When the [Local] button on the selected system is selected.
• When open-windows on the RMCS workstation is finished (by selecting Exit in the
openwindows menu), the user interface of any selected system is automatically sent back
to that system.
• If a power failure continues for too long, the control of the selected system is automatically
returned to the system.
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10.6
Lamp Status
When the status of a signal lamp or buzzer on one of the configured systems changes, the
RMCS application window is automatically placed on top of the other windows. The color of the
lamp on the screen changes to represent the signal tower lamp. The buzzer is heard (unless
muted) and a flashing icon is displayed on the screen next to the system selection button (see
Figure 10.6).
Figure 10.6 Selected system 2002 with error status
10.7
Stopping RMCS
The RMCS application can be stopped by typing the RM_stop command at the RMCS station
console window. The user interface of any selected system is automatically sent back to that
system.
10.8
Critical Errors
The RMCS station has an Uninterruptable Power Supply (UPS). If a power failure continues for
too long, the control of the selected system is automatically returned to the system. The RMCS
system will shut down.
If the RMCS station is turned off (using the on/off switch) while a system is selected, the control
of the selected system is automatically returned to the system. The RMCS system shuts down.
If the network connection between the RMCS station and a selected system is broken, the
system will loose the user interface. The PAS 5500 application must be restarted at the selected
system.
If the UPS of the RMCS station is turned off (using the UPS on/off switch) while a system is
selected then the system loses the user interface and the PAS 5500 application must be
restarted.
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11
SAWS - STAND ALONE WORK STATION
The Stand Alone Work Station (SAWS) is a work station without a physical connection to a step
and scan system. A SAWS can be used for applications which do not require an on-line machine,
for example, machine simulation and job recipe editing.
11.1
Installing SAWS
The SAWS software is installed using the normal installation procedure with the SoftWare
Installation Tool (SWIT). In the installation phase, the user is asked which machine type must be
simulated on the SAWS. After installation, default machine constants must be loaded for all
subsystems (machine constants may already be available when upgrading). In addition, some
essential machine constants must be set to guarantee the correct behavior in simulation mode.
The following machine constants are essential:
• RH: Reticle Handling (ARMS) and PS: Reticle Particle Sensor:
All ARMS machine constants must be valid to be able to initialize the ARMS driver. To do
this, set all valid flags to Y(es) in all ARMS machine constants screens.
• IP: Projection:
The Lens Type in Projection / General Lens Constants must match the machine
type which is simulated. The help information, which is shown by pressing F1 if this item is
selected, gives an overview of which lens type is used for which machine type.
• IL: Illumination Control:
The Illuminator Type in Illumination Control /Configuration Data must
match the lens type selected in Projection. The help information, which is shown by
pressing F1 if this item is selected, gives an overview of which illuminator type is used for
which lens type.
11.2
Changing Machine Type Simulated by SAWS
To change the machine type to be simulated by SAWS, the command pas_type is used. The
command is:
• pas_type -m machinetype : where machinetype is the machine type to be simulated
(22, 60, 80, 90, 100, 200, 250, 300, 400, 500, 550, 700, 900)
• pas_type -h : to show help information.
After switching to another machine type, the PAS software must be restarted using a pas_stop/
pas_start command. The essential machine constants of projection and illumination must be
adapted to the new machine type, before a full startup of the system is done.
11.3
Simulation Behavior of Specific Drivers
11.3.1
Illumination
The new illumination simulation behavior gives better support for illumination mode settings, NA,
sigma inner and sigma outer. Maintenance monitoring is also simulated. A new laser fill will
sometimes need to be done to continue batch processing. This can be done in the illumination
command handler.
11.3.2
ARMS
The Material Monitoring window is better supported by the ARMS simulation. Locking and
unlocking of reticle pods and specifying reticle IDs in a reticle selection form is also shown in the
Material Monitoring window. ARMS in combination with IRIS is supported.
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11.3.3
IRIS
If the IRIS option is available, the reticle inspection system can be simulated. Reticles can be
inspected using the material handling interface, or before a batch. In simulation mode, the
particle sensor can ‘detect’ some particles on the reticle. The system will ‘detect’ five particles at
the upper and lower surface of the following sizes: 75µm, 55µm, 25µm,15µm and 10µm. By
changing the reject limits, a reticle rejection by IRIS can be simulated.
11 - 2
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12
JOB DEFINITION
This section details two types of information needed to write a job. In the first section 12.1: Basic
Concepts, detailed information is given on the functions of each fill-in form and the interactions
between different items in those forms.
Writing a job can be split into three parts (see Figure 12.1):
• Specify the general properties of a job (wafer size and type)
• Define the layout of the wafer
• Define the layer IDs, and specify the contents of every layer ID.
Modify Job
Job Contents
Wafer Layout
Layer Layout
Cell Structure
Layer Definition
Alignment Definition
Marks Selection
Image Definition
Process Data
Image Distribution
Reticle Data
Exposure
Offsets
Reticle
Inspection
Reticle Inspection
I-05072b.frm
Figure 12.1 Job definition overview with form and menu names
12.1
Basic Concepts
12.1.1
Cells
To allow scribing of the wafer after all exposures have been made, all devices must be
distributed over the wafer in rows and columns. For this reason, the wafer surface is split into a
matrix of cells in the Cell Structure form. This matrix of cells also determines the wafer
stage step size.
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12.1.2
Dies and Exposure Fields
A die is a rectangular area, detailing one physical device. For simplicity, one would expect that
the size of the die is the cell size. This is correct when only one die fits in the field size. If two or
more dies fit in the field size, they can be grouped together on the reticle, and exposed in one
exposure. This increases the throughput significantly. To allow this, the PAS 5500 does not
‘think’ in dies, it only ‘thinks’ images. An image can be one or more dies (see Figure 12.2).
FIELD SIZE
ONE DIE
ONE IMAGE (THREE DIES)
I-06354a.frm
Figure 12.2 Die and image versus field size
However, to optimize the cell selection for exposures on the wafer, the die information can be
used. The die layout within an image can be specified as the number of dies along the X and Y
axis. A cell is selected for exposure if the number of dies, located completely within the edge
clearance, is greater than or equal to the specified minimum value.
12.1.3
Images and Image IDs
An image is a rectangular area, equal to the dimensions of one or more devices, that can be
exposed in one exposure. Sometimes an image is equal to the dimensions of only a part of a
device (die stitching). The maximum size of an image is determined by the field size of the
stepper or step and scan system, and the reticle size used.
An image represents the reticle area used for one exposure. Every image is identified by its
image ID. Use the Wafer Layout part of Job Definition to distribute images over the wafer
surface.
A job can contain up to 50 images, in addition to the necessary mark images.
12.1.4
Layer Numbers and Layer IDs
Cells, dies, images, and image IDs all give information on the wafer map or wafer layout. Devices
consist of several layers. Each of these layers is identified by a separate layer number, ranging
from 1 to 30. To enable aligning of all consecutive layers, alignment marks must be exposed
before all device layers. The layer containing the alignment marks is called the zero layer,
because it precedes all device layers. It is possible to combine exposure of the zero and first
layers. If necessary, more marks can be exposed along with devices in subsequent layers.
It is only possible to define the combined zero/first layer for the layer ID belonging to layer one.
Marks specified in the zero layer (layer = 0) will be exposed along with the devices of layer one.
To allow one job file to be used for a family of devices that only differ in a few layers, layer ID’s
are used to identify the processing data the PAS 5500 needs for a layer. In the Layer
Definition form, layer numbers can be created. One layer ID is assigned to each layer
number. More layer ID’s can be added to the same layer number, if alternative layer ID’s are
needed (see Figure 12.3). The total number of defined layer ID’s may not exceed 1000.
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Job file
Layer ID
layer8all
layer7version3
layer7version2
layer7version1
layer6version3
layer6version2
layer6version1
layer5all
layer4all
layer3version2
layer3version1
layer2version2
layer2version1
layer1all
zerolayer
One job file holds a collection of layer
IDs
Every device can have only one layer ID
per layer
Layer IDs are unique
Layer IDs can be assigned to layers of
a device by assigning them to the
correct layer number
Item
Layer
no.
Device 1
Device 2
Device 3
layer
layer
layer
layer
layer
layer
layer
layer
layer
wafer
8
7
6
5
4
3
2
1
0
layer8all
layer7version1
layer6version1
layer5all
layer4all
layer3version1
layer2version1
layer1all
zerolayer
wafer surface
layer8all
layer7version2
layer6version2
layer5all
layer4all
layer3version2
layer2version2
layer1all
zerolayer
wafer surface
layer8all
layer7version3
layer6version3
layer5all
layer4all
layer3version1
layer2version1
layer1all
zerolayer
wafer surface
I-05629.FRM
Figure 12.3 Layer, layer number and layer ID
12.1.5
Layer ID, Image ID and Reticle ID
For each layer, the defined images which must be exposed in that layer must be specified. For
every layer ID and every specified image ID that should be exposed, reticle and masking
information needs to be specified with it (see Figure 12.4). The default reticle ID and masking
window is the same as the values supplied during definition of the image. The reticles are
physically identified by their reticle ID’s (barcode), which contain up to 12 characters from the
ALPHA39 set of characters (wildcards * and ? are allowed). The reticles that carry the images to
be exposed on to the wafers can be masked off by the reticle masking blades in such a manner
that any rectangular area on the reticle can be used as an image. Different images on the same
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12 - 3
reticle may overlap. This is possible, for example, when one image ID describes four devices
exposed in one exposure, and a second image ID describes two of those devices that can be
exposed in areas where the first image ID would not fit (edge of wafer, near a smaller image).
12.1.6
Image Location and Masking Window
The centre of the image location on the reticle determines where the wafer stage will position the
image on the wafer. The position of the image on the wafer is set in the Image Distribution
form in Job Definition. The reticle masking window determines what area of the reticle is
exposed. Normally, the center of the image location on the reticle and the center of the masking
window match. The reticle image is exposed in the centre of the wafer image in the cell.
If the centers of image location on the reticle and masking window do not match, the area
defined by the REMA blades is exposed. That exposure will not land in the image on the wafer,
but it will have a translated position.
12 - 4
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Job file
reticle ID
One job file holds a collection of reticle
IDs
reticle13
reticle12
reticle11
reticle10
reticle9
reticle8
reticle7
reticle6
reticle5
reticle4
reticle3
reticle2
reticle1
PMreticle
Item
Layer
no.
layer ID
8
layer ID
7
layer ID
6
layer ID
5
layer ID
4
layer ID
3
layer ID
2
layer ID
1
layer ID
0
wafer
An image in a layer ID is described by a
reticle ID and masking info
For every layer ID, an image ID is
matched with a combination of reticle
ID and masking information
PM image
ID
PMreticle +
mask info
wafer
surface
Image ID 1
Image ID 2
reticle8 +
mask info
reticle7 +
mask info
reticle6 +
mask info
reticle8 +
mask info
reticle4 +
mask info
reticle3 +
mask info
reticle1 +
mask info
reticle1 +
mask info
reticle5 +
mask info
reticle5 +
mask info
reticle11 +
mask info
reticle13 +
mask info
reticle12 +
mask info
reticle2 +
mask info
reticle2 +
mask info
reticle9 +
mask info
wafer surface
wafer surface
I-05630.FRM
Figure 12.4 Reticle ID and image ID
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12.1.7
Alignment Marks
Alignment marks are used to align consecutive layers to the previous layers. Alignment can be
done using between two and 200 alignment marks. Only two are used for optical prealignment.
Additional global alignment marks (PM or SPM or XPA) can be positioned in the Other Global
Alignment Marks region (see Figure 12.13). The third primary mark can be used to calculate
different scaling in X and Y. This requires the third mark to be positioned as far away from the
line connecting the first two primary marks as possible. This distance should be at least 80% of
the wafer radius for accurate overlay. The fourth and subsequent primary marks are used to gain
alignment precision.
Alignment marks are identified by their mark ID’s. PM and XPA mark can be used for both optical
prealignment and global alignment.
If a reticle align on wafer mark is selected, the X align limits are used (see Figure 12.13).
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12.2
Specify the General Properties of a Job
The general properties of a job include job name, wafer size, and wafer geometry (flat edge or
notch). Once specified, they cannot be changed.
From the main menu, select: Job Definition. In the job definition menu, select: Modify
Job. In the Modify Job form (see Figure 12.5), click [Select] to select an existing job using
the file browser (see Figure 12.6). To create a new job, type the desired path and job name and
press enter.
Figure 12.5 Modify Job form
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12.2.1
File Browser
The File Browser can be used to load jobs that have already been defined and saved. Click
[Select] in the Modify Job form to open the File Browser (see Figure 12.6).
Figure 12.6 File browser
Job files and directories must be located in the directory user_data/jobs or a subdirectory
below, to make sure they are backed up. Do not save files in, or below the standard directory
asm, because files in those directories are not backed up.
Use the Filter to limit the number of files displayed in the list box, or leave it as an * to see all
files. Select an existing file or directory with a single click in the list box.
12.2.2
Jobs for 4x and 5x Lens Reduction
Jobs can be written for machines with a 4x or 5x lens-reduction. This makes it possible to run
some process-layers on a system with 4x lens reduction and others on a system with 5x lens
reduction.
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In the Image Definition form, the image data can be entered in 4x or 5x reticle coordinates,
or in wafer level coordinates. When the data is entered in one of these fields, the software will
calculate and fill in the remaining two data fields.
In the Reticle Data form, the lens reduction factor can be entered for a specific layer. This
lens reduction must be equal to the reduction factor of the machine on which this layer will be
exposed.
Method
In Job Definition, these steps must be done to make a job suitable for stepper and step and
scan exposures.
• Modify Job form:
When creating a new job, it is recommended that the field Machine Type must be equal
to the machine type on which most layers will be exposed. The lens reduction factor for that
machine type can be seen on the same form.
• Wafer Layout / Image Definition form:
The image sizes and shifts are given in reticle sizes and wafer sizes. If any of the reticle or
wafer fields are filled in, the other fields will be automatically calculated and filled in. The
additional 4x and wafer level entries are automatically filled-in when upgrading the job.
• Layer Layout / Reticle Data form:
Specify the Lens Reduction factor for each layer. The default setting of the lens
reduction factor is the same as the one in the Modify Job form.
Example
A device has twenty layers, two of those are critical and will be exposed on a /300 machine. The
other layers will be exposed on a /100 machine. The selected Machine Type, in the job form is
/100. The lens reduction factor is 5x.
The two layers which are critical will be exposed on a /300 system are layers two and six. In the
Reticle Data form, use the [Next] and [Previous] buttons to display the data for each of
these layers in turn. Adjust the Lens Reduction factor to 4x and Apply, for each of the two
layers. All the defined images for these layers will be adjusted using the lens reduction factor.
Note 1: If the zero and first layer are combined, it is only possible to adjust the lens reduction
factor of the first layer.
Note 2: If the lens reduction factor of the zero and first layer are different and the combined-layer
option is chosen, the lens reduction factor of the first layer will be used.
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12.2.3
Modify Job
If this is a new job, specify the Machine Type of the machine on which the job will be used, the
Diameter of the wafers to be processed, and whether the wafers can have notches or flat
edges. This cannot be changed when modifying an existing job. The Type: SEMI
(Semiconductor Equipment and Materials International) or JEIDA (Japan Electronic Industry
Development Association) is displayed as set in factory constants (see section 13.3 : ‘Job
Definition Data’).
Figure 12.7 Modify Job form
The Comment item can be filled with comments regarding the type of job, or a more detailed
description of the job (see Figure 12.7).
When an existing job is modified, the software release in which it was written is displayed in the
Job Release field. If a job is upgraded, the current release will also be displayed in the New
Job Release field. Any parameters that are in the current release but not in the job release,
will be given default values in the upgraded job. Typically the default values are taken from the
factory constants.
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After completing and accepting the fill-in form, the job contents menu is displayed (see Figure
12.8). Select: Wafer Layout. When creating a job, most options are disabled to begin with, but
become available as the job definition proceeds.
Figure 12.8 Job Contents menu
12.3
Define the Wafer Layout
In wafer layout, sizes and locations of the different images to be exposed are defined, together
with alignment mark information. In new jobs, each submenu must be completed in sequence.
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12.3.1
Cell Structure
In the wafer layout menu, select: Cell Structure.
See Figure 12.9 for a graphical explanation of some of the items to be filled in for this form. Fill in
the Cell Size (see section 12.1.1 : ‘Cells’).
Figure 12.9 Cell structure parameters
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Fill in the Edge Clearance. This is used to set the area near the edge for placing good dies. If
a notched wafer is used, the Flat item is disabled (see Figure 12.10).
I-06344F.rs
Figure 12.10 Cell Structure form
Fill in the Edge Exclusion. This defines a warning zone where an image should not be placed.
If an image is placed within this zone, a notification will be given in image distribution. This avoids
images being placed at the stage limits, where they could be incorrectly exposed.
Specify Wafer Cover. This specifies whether cell placement may be extended into the borders
of the wafer. Inner wafer cover means that cells are only valid when they lie completely within the
round edge clearance and flat edge clearance of the wafer. Whole wafer cover allows cells to
extend into the round edge clearance (see Figure 12.11). It is recommended that Wafer cover
is set to Inner cover if only one die fits in a cell.
Specify the Number of Dies. When multiple dies are exposed in one cell, the X and Y number
gives the number of dies along that axis. The Minimum per cell specification will lead to
selection of those edge cells that contain at least the number of dies which are fully within the
edge clearance area. (See Figure 12.11)
Cells that are invalid cannot be selected in the image distribution fill-in form.
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Specify Placement Mode. Initially, the matrix center (center point of the center cell) is the same
as the wafer center. The matrix of cells can be shifted across the wafer to maximize the number
of cells, and after that the number of dies. If you specify C(omputer) placement mode, 26 x 51
matrix shifts are tried (see Figure 12.9). Optimization is based on the highest number of inner
cells, followed by the highest number of dies in W(hole) wafer cover mode. By specifying
O(perator) placement mode, you can specify your own matrix shift or fine-tune the calculated
matrix-shift.
[Preview Results] and [Preview Focus Mode] update the graphics window and the
placement result, but do not accept the data. The Focus Edge Clearance (FEC) defined in the
factory constants is used.
After a satisfactory matrix placement is found, click [Accept] to accept the placement result
and exit the screen.
Figure 12.11 Whole and inner wafer cover
12.4
Alignment Definition
12.4.1
Compatibility Mode
For jobs not involving PAS 2500/PAS 5000’s, leave the PAS 5000 Edge Prealignment set to
N(o). Only set the PAS 5000 Edge Prealignment to Y(es) if mix-and-match with PAS 2500
and PAS 5000 systems is required for this job. Read the help text with this item for detailed
requirements for PAS 5000 mode mark placement.
Specify any required wafer rotation offset value in the Wafer Rotation field. This will be the
angle of rotation of the wafer when it is placed on the wafer table. A positive value gives a
rotation in the counterclockwise direction, negative values in the clockwise direction. This option
may be useful for mix and match purposes. Accept the Compatibility Mode form.
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12.4.2
Optical and Global Alignment
In the Wafer Layout menu, select: Alignment Definition. In the Alignment
Definition menu, select: Optical and Global Alignment (see Figure 12.12).
Figure 12.12 Optical and Global Alignment form
Select a Mark Type. Selecting the SM, SPM, XPA-X(S) or XPA-Y(S) mark type automatically
sets the Large Edge Clearance and the Optical Prealignment to No.
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Specify if a Large Edge Clearance is needed. Optical prealignment requires a large edge
clearance, and global alignment only requires a small edge clearance. The large and small
primary mark edge-clearance are both defined in the factory constants under Job Definition
Data.
Figure 12.13 Region locations on a wafer for reticle align on wafer mark
In the Mark Specification field, choose between the C(ell) and W(afer) coordinate systems,
and define a mark position. It is also possible to click SELECT in a cell with the pointing device
(see section 2.1 : ‘Trackball Usage’), automatically filling the cell index items. (Positions of
alignment marks should comply with the minimum mark deviation value defined in the Layer
layout/Process data. The default value is 40% of the wafer diameter).
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If scribelane marks are used, put at least two pairs of SPM marks on opposite sides of the wafer
in the region greater than 80% of the wafer diameter. If the mark sensor is used, at least two
alignment marks must be PM or XPA images to allow detection by the prealignment system, and
they must be in the prealignment regions (see Figure 12.13).
Note: It is not recommended that any mark (prealignment, global, or secondary) is positioned
too close to the edge of the wafer or another mark. It is essential for good overlay that
marks are not degraded by potential damage at the wafer edge, and variations in resist
thickness, wafer diameter, and local surface tilts. It is strongly advised not to use the first 5
mm from the edge of a wafer to place any type of mark.
Click [Apply] to accept the defined mark ID. Click [New] to define another mark ID.
Click [Distribute] to show the Alignment Mark Distribution form (see Figure
12.14).
Figure 12.14 Alignment Mark Distribution form
In the Cell Index field, one cell can be selected by giving the x and y co-ordinates.
Alternatively, ranges can be given, for example type -3..3 in the X: field to select the range of
columns -3 to 3 or use * to select all columns. Click [View Marks] to get an overview report of
all marks defined.
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The Alignment Mark Distribution form can be used to easily distribute scribelane mark
types like SPM or XPA-x/y.
Make sure two marks are defined in opposite regions for optical prealignment. Define a minimum
of two marks for global alignment (the optical and global marks can be combined). If only
scribelane primary marks are used, at least two of the selected marks must be x scribelane
primary marks and at least two of the selected marks must be y scribelane primary marks. It is
possible to align to more than just two global alignment marks. Reasons for this can be extremely
strict overlay requirements, or the need to eliminate distortion of the larger wafer sizes. Up to 200
global alignment marks may be used. When a new mark is added to a job with different layers, a
notification window is displayed. The mark can be used for global alignment on all non-zero
layers. Click [Exit] to leave the screen and return to the alignment definition menu.
12.4.3
Mark Clearout
Mark clearance is used to flood-expose the alignment marks, so that certain films that degrade
alignment mark quality can be etched out from the alignment marks.
The COMBI reticle contains two images suitable for mark clearout of the PM and SM marks
(images PF and SF are defined, by default, in Job Definition). The PF image is used only on
PM, XPA and XPA-S marks. The SF image is used only on the SM mark. If other marks need to
be cleared, a suitable image is not available on the COMBI reticle to do this.
Click Exit to return to the wafer layout menu.
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12.5
Image Definition
In the Wafer Layout menu, select Image Definition (see Figure 12.15). and specify an
image ID that is unique within this job.
Figure 12.15 Image Definition form
The Use for alignment check box is used to add user defined mark images to the standard
marker set. If this option is set to Y(es), The Basic Mark Type can be set, and a Variant ID
can be defined. The Variant ID is a 15 character string used to distinguish between basic
mark types with different segmentation.
Specify the common part of the reticle IDs (a total of 12 characters out of the ALPHA39 set) that
includes the information to be exposed in this image ID. It is shown as default in the reticle data
form.
When the Reticle Image and Masking Window sizes are the same, set the Identical
Masking field to Y(es). If the sizes are different, set the Identical Masking field to N(o) so
that the Masking Window size can be entered manually.
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Enter the size and shift of the image on the reticle. This can be set at reticle or wafer level. The
reticle size can be entered for a 4x or a 5x reticle. When the image size for one reticle has been
entered, the value for the other reticle is filled in automatically (see section 12.2.2 : ‘Jobs for 4x
and 5x Lens Reduction’). If the combined image size and shift does not fit in the reticle
boundaries as defined in the factory constants, the image shift is automatically reset to (0, 0).
During batch execution, the system automatically positions the wafer stage so the exposed part
of the wafer cell is mapped on to the position of the image on the reticle.
Note: If an image is positioned at the extreme of the Y axis of the reticle, the wafer stage cannot
be positioned so the image is exposed in the cells on the opposite Y axis of 200 mm
wafers.
If Identical Masking is set to N(o), fill in the position and size of the masking window.
Note: The identical masking field is not stored in the job. The default value is Y(es) when the
image and masking data are identical.
Click [Apply] to accept every image ID. Define image ID’s for every different device, or number
of devices, that need to be exposed.
[Exit] the form to return to the wafer layout menu.
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12.6
Image Distribution
In the wafer layout menu, select Image Distribution (see Figure 12.16).
Figure 12.16 Image Distribution form
Image definitions necessary for the exposure of the mark images are automatically created if a
specific mark type is distributed in the optical and global alignment section.
The default properties are based on the COMBI reticle layout. Several versions of the COMBI
reticle are available.The newest versions contain images for the exposure of SPM and XPA
marks.
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Distribute the images into the cells. Cells can be selected in two modes:
• Text mode, using the Cell Index item. Select cells by typing coordinates, ranges
(-2..2), or wildcards (*).
• Graphic mode, using the pointing device (see Part 1, Chapter 2: USER INTERFACE
CONCEPTS). Click:
– SELECT in a cell, to select or deselect that cell (toggle function).
– ADJUST in a cell, to change every cell in the matrix between the current adjusted cell
and the previously selected or adjusted cell, to the selected status of the previously
selected or adjusted cell.
– SELECT outside the wafer, to deselect all cells on the wafer.
– ADJUST outside the wafer, to select all cells on the wafer.
If the center of the image must coincide with the center of the cell, specify an Image to Cell
Shift of (0.0, 0.0). More than one image ID can be placed in a cell. If distributed image ID’s
overlap, a warning is given in the status line to inform the user. Images can be shifted or deleted
if the overlap was not intended. It is not possible to distribute one image ID in a cell twice.
However, it is possible to define two separate image ID’s with the same contents and reticle, and
distribute those in the same cell.
If Optimized Scanner Route is set to Y(es), throughput is increased by approximately 10 to
15%. Overlay errors can occur if different routes or different scan directions are used in some
layers, and the C&T upgrade (C&T FCO Mech 55632) is not installed.
Click [View Distribution] to obtain a report of the defined wafer layout. Click [Exit] to
exit the image distribution form.
Use View Wafer Layout to get a report of the wafer layout. Select Exit to go to the job
contents menu.
12.7
Defining the Layer Layout
In the Job Contents menu, select Layer Layout, followed by Layer Definition (see
Figure 12.17).
12.7.1
Layer Definition
Fill in the Number of Device Layers. For every device layer, a matching layer number is
automatically created. Click [Apply]. The default layer ID for each layer number is set in the
Factory Constants / Layer data. The Layer ID will initially be the same as the layer
number.
It is possible to define more layer IDs within one layer number. This option allows definition of
multiple first layers, which can be exposed in combination with zero layers. This feature is
typically used in ASIC applications where the interconnection layer determines the final
functionality of the device.
Use the buttons next to Layer ID, and the buttons next to Layer Number to:
• Change the name of a layer ID. Go to the layer ID using [Previous], [Next] or the
Select item, change the value of the layer ID item, and click [Apply].
• Add a new layer on top of existing layers. Click [Append], fill in the layer ID, and click
[Apply].
• Insert a new layer between existing layers. Choose a layer number using [Previous],
[Next], or the Select item, and then click [Insert]. Fill in the layer ID, and click
[Apply].
• Define a new layer ID in a given layer number. Choose a layer number with the
[Previous], [Next], or the Select item. Then click [New], fill in the layer ID item,
followed by [Apply].
• Delete a layer ID. Choose a layer ID using [Previous], [Next], or the Select item, and
then click [Delete]. Confirm the delete action by clicking [Delete Layer].
• Delete a layer number. Delete all layer IDs in that layer number.
• Copy a layer.
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Click [View Layer Definition] to obtain a report with an overview of all layer numbers and
layer ID’s. Exit the fill-in form with [Exit].
Figure 12.17 Layer Definition form
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12.7.2
Marks Selection
In the Layer Layout menu, select Marks Selection to display the Marks Selection form
(see Figure 12.18). As a default, all defined marks are exposed in the zero layer, and used for
alignment in all subsequent layers. [Exit] the report.
Figure 12.18 Marks Selection form
The Combined Mark/Image Exposure field indicates that mark images are exposed together
with device images on a particular layer. By defining alignment marks as marks in Optical and
Global Alignment (rather than as images in Image Definition), exposure of mark images
allows correction for lens distortion, if the mark image is not located in the centre of the image
field.
Number of Marks To Align (m), or N out of M alignment, gives the possibility to define m
marks of which n must be successfully aligned. This has these advantages:
• Redundancy if critical processing is involved, which tends to damage marks
• Less critical layers could use a lower n while more critical layers could use a higher n.
Global alignment software will optimize the selection of the n marks out of the total m.
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If a layer will be aligned with OA alignment, click the [Exit] button in the Marks Selection
form. In Layer Layout click on [Process Data]. Select the layer that must be aligned with
OA alignment, and set the Wafer Alignment Method for the layer to OA (see Figure 12.19).
Click the [Apply] button to apply the changes.
All layers with the same layer number use the same mark selection.
Click the [Exit] button to return to the Layer Layout menu.
Figure 12.19 Process Data form
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Return to the Marks Selection form. Select the layer that has been set to OA alignment. An
alignment recipe can now be selected for this layer. Click on the [Select] button below
Recipe Name, and select a predefined alignment recipe (see Figure 12.20). After the recipe is
selected, it is displayed next to Recipe Name. In this example, the selected recipe is
asm/default_job_recipe.
Figure 12.20 Marks Selection form
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Clicking [Global Selection] shows the Global Marks Selection form (see Figure
12.21).
Figure 12.21 Global Marks Selection form
Multiple marks over multiple layers can be modified in this form. For example, to select a mark
for global alignment in the layers 4 to 5:
• Type: 4 in the Layer Selection Start field
• Type: 5 in the Layer Selection End field
• Select the desired mark using the Mark Previous/Next buttons or the Mark Select field
• Click [Apply] to implement the changes.
Alternatively, all available marks can be used by clicking [Preset all Marks] or all marks of
the same mark type and mark to cell shift as the selected mark, by selecting [Preset Same
Type and Shift].
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12.7.3
Process Data
Select Process Data (see Figure 12.22) where these parameters can be set:
Figure 12.22 Process Data form
Wafer Alignment Method can be used to set the default alignment method used for the job.
If it is set to TTL, it cannot be controlled from the batch definition form. If it is set to OA, it can be
changed in the batch definition form.
Prealignment Mode, Selection Mark must be used to specify which mark needs to be
used for prealignment.
Note: If optical prealignment marks are available in two opposite prealignment regions, these
marks are selected automatically for optical prealignment.
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These three items have an impact on how an alignment is done (see section 12.4 : ‘Alignment
Definition’). They increase throughput at the cost of overlay. The machine constant Realign
Time Interval (in Machine Constants / EC) makes sure, after the specified time, a full
global alignment is done, regardless of these values:
• Symmetrical alignment specifies that all wafer marks must be scanned with both
beams if it is set to Y(es), and with one beam per mark if it is set to N(o) (M1 alignment).
• If Wafer alignment is set to Y(es), the reticle parameters will not be re-determined if a
new wafer is loaded for the same reticle. This will increase throughput.
• If Reticle alignment is set to Y(es), the wafer parameters will not be re-determined if
a new reticle is loaded for the same wafer. This will increase throughput for multiple reticle
jobs.
Calibration sets the calibration allowed during processing of this layer ID. If set to Y(es), a
calibration is performed when it is required, according to the EC machine constants.
Layer Shift compensates for possible global shift effects in the marks. The shifts are defined
at wafer level.
Lens Heating Correction can be used to correct for any process dependency. This factor
adjusts, per layer, the focus and magnification lens heating model scaling parameters.
Critical Percentage can be used to override the default critical percentage used to
increase the number of edge dies and thus decrease the throughput.
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Click [Process Corrections] to access the Process Corrections form (see Figure
12.23). If OA alignment will be used in the batch, the 8.0 to 8.8 Shift Corrections
[um] will be labeled Red and Green instead of M1 and M2.
Figure 12.23 Process Corrections form
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Click [Alignment Data] to access the Alignment Data form where parameters shown in
Figure 12.24 can be set.
Figure 12.24 Alignment Data criteria form
When defining layer number one, the zero and first layer can be specified as being combined in
one machine pass. If that is done, one machine pass is saved. For optimal overlay accuracy,
combined layer offsets have to be set.
Minimum Mark Distance. Specifies the minimum size of the wafer region to be spanned by
the wafer marks used in the fine phase of global or wafer alignment. It is expressed as a
percentage of the wafer diameter. If a mark set cannot be found in the fine phase that spans this
region, the wafer is rejected.
Maximum Delta 8.0 to 8.8 Shift. Specifies the acceptance/rejection criteria for
alignment scans. The scan will be rejected if the delta 8.0 to 8.8 µm shift exceeds this value.
Maximum Model Residue. Specifies the mark acceptance/rejection criteria after modeling all
marks (n out of m). If the difference between the measured mark position and the computed
mark position exceeds this value, the mark will be rejected.
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SPM Mark Scan. Specifies the capture range for SPM marks. A Small or Full capture range
for SPM-marks can be selected per layer. This parameter is only displayed if one or more SPM
marks have been defined for the job.
Wafer Grid Correction. Specifies the wafer alignment model to be used. The wafer
alignment model determines how the alignment results will be used to determine the position,
rotation and magnification of each exposure. The wafer expansion is calculated and used per
layer. If Wafer Grid Correction is set to No wafer Scaling, then the value is calculated
but not used for that layer.
88 and 8 um Error Detection. Specifies whether the error detection will be used on the
layer. M(achine dependent) is the default.
12.7.4
Reticle Data
Select Reticle Data (see Figure 12.25). Select a layer. Then select the image ID from the list
box of defined image ID’s. Expose Image is set to Y(es) for all defined images. The reticle ID
should then be specified as the barcode on the reticle.
Figure 12.25 Reticle Data form
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The lens reduction factor for the selected layer can be specified in the Lens Reduction field
(see section 12.2.2 : ‘Jobs for 4x and 5x Lens Reduction’). Values for the image size and shift will
be adjusted according to the chosen lens reduction. The default value depends on the machine
type selected when creating a new job.
The default values for Image ID related issues are defined in Wafer Layout/Image
Definition. The default values for energy, focus and illumination mode are defined per layer in
Factory Constants/Layer Data.
Note: If multiple illumination settings are specified within a single layer, an alert window opens
indicating that the layer can not be run as a regular production batch.The operator has the
choice to either use the settings for the first image in the layer for all other images, or to
accept the fact that the layer can only be processed via the test manager.
After selecting a Layer and an Image ID, the PAS 5500 Graphics window displays the
levelling mode and the exposure routing of the selected image. A change in Reticle Image
Size or Shift might change the levelling mode of a particular cell. The levelling mode depends
on the value of the focus edge clearance and critical percentage in Factory Constants/Job
Definition Data. These values are not part of the job and should match values used during
exposure of the job. The active focus edge clearance can be found in Factory
Constants/Batch Control Data, the critical percentage is part of the LC machine
constants.
12.7.5
Exposure Offsets
Select Exposure Offsets (see Figure 12.26). The menu item is only enabled when the
extended exposure offsets option is installed. Select the cells in which to apply exposure offsets.
Cells can be selected in two modes:
• Text mode, using the Cell Index item. Select cells by typing coordinates, ranges
(-2..2), or wildcards (*).
• Graphic mode, using the pointing device (see Part 1, Chapter 2.1: Trackball Usage). Click:
– SELECT in a cell, to select or deselect that cell (toggle function).
– ADJUST in a cell, to change every cell in the matrix between the current adjusted cell
and the previously selected or adjusted cell, to the selected status of the previously
selected or adjusted cell.
– SELECT outside the wafer, to deselect all cells on the wafer.
– ADJUST outside the wafer, to select all cells on the wafer.
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Figure 12.26 Exposure Offsets form
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Select an image and layer. Specify the energy, focus and focus tilt for the selected cell(s). Click
[Apply] and [Next] to define the offsets for the next image or layer.
Note: The value given for focus is only used during the exposure of wafers and not for global
alignment or global levelling.
Figure 12.27 Wafer layout with cell offsets
Cells with exposure offsets will be marked with a letter from A thru G. Cells with the same
exposure offsets will use the same letter (see Figure 12.27).
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12.7.6
Reticle Inspection
Select Reticle Inspection (see Figure 12.28). Select a layer. Then select the surface(s) to
be inspected and the reject limits for the surfaces on that layer. Click [Apply] and [Next] to
define the surface(s) and reject limits for the next layer.
Figure 12.28 Reticle Inspection form
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12.8
Standard Jobs
The jobs to test the current configuration of the system are located in directory
user_data/jobs/asm. All other test jobs are located in the directory
user_data/jobs/asm/job_library. All test jobs have names that reflect their use, and
configuration. e.g. AA_bbM_cWd_Re, where:
AA:
mnemonic for the functional description
bb:
stepper or scanner model: 20,22,60,80,90,100,200, 250, 300, 400, 500, 550,
700, or 900
c:
wafer size in inches
d:
N(otch) or F(lat)
e:
reticle plate size in inches.
The functional descriptions (AA) can be:
AD:
Alignment schemes and Distortion. Used for the static skew and scaling
calibration in scanners
CU:
CD Uniformity. Used for CD Uniformity exposures in batch control before the
introductions of the CD Uniformity exposure test software in software release
7.1.0
DD:
Data Delay. Used for calibration and verification of data delay machine constants
on scanners
FO:
FOCAL. Used for exposure and measurement of FOCAL wafers (including best
energy determination)
FP:
Focal Plane Deviation. Expose FPD reticle in Focus meander (not for /300)
GR:
Grid Calibration. Expose and read fishbone (mirror calibration) and orthogonality
LF:
Lens Heating FOCAL. Used for exposure and measurement of lens heating fine
tune wafers with a FOCAL
LH:
Lens Heating. Calibration of lens heating machine constants using a DOT reticle
for focus determination (not for /300)
LM:
Lens Heating Magnification. Used for calibration and verification of lens heating
induced magnification errors
MT:
Matching. Used for calibration and verification of matching machine constants
using mirror map layout. Crossfield and/or normal fields
NZ:
Non-Zero. Used for calibration and verification of non-zero offset machine
constants
OS:
Overlay versus illumination setting. Used for calibration and verification of the
illumination setting dependency of distortion. Only available for /200, /300, /400,
/500, /700 and /900 models
OT:
Overlay versus Tilt. Used to determine waferstage parameters, Abbe arms and
beam angles. To be used in test program Overlay versus Tilt
OV:
Overlay. Used for exposure of zerolayer, combined first layer, global aligned layer,
stage accuracy. Needed for red blue calibration, stage accuracy and overlay
verification, calibration of combined layer offsets and field matching
RL:
Reliability. Used to test system reliability, using two images on different reticles
RM:
Reticle Masking. Six exposures with different blade settings to verify REMA
calibration, done twice with two different energy values
RV:
RICO Verification. Job to define special zero layer used for RICO verification and
lens distortion qualification
TH:
Throughput. Used for throughput and reticle exchange time measurements
according to ATP specs. On machines with the IRIS reticle inspection option, an
additional layer for measurement with reticle inspection is included
Note 1: 4 and 5 inch wafer jobs are not available for the /300, and scanners.
Note 2: 4 and 5 inch wafer jobs are not available for the OS and FO function on /200 machines.
Note 3: 5 inch reticles are only available for /60 machines.
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13
FACTORY CONSTANTS
The factory constants are a way to provide default values for production settings. Typically, they
serve as default settings for batch control and job definition.
Figure 13.1 Factory Constants window
13.1
Batch Control Data
In the main menu, select Factory Constants. From the Factory Constants menu, select
Modify Factory Constants, followed by Batch Control Data.
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With Batch Data, Report Type, specify the report type that should appear as a default
when starting up a batch.
Figure 13.2 Batch Control Data form
Choose:
• S(hort) - general information
• M(edium) - general information, alignment and levelling statistics for the wafer
• F(ull) - general information, alignment and levelling statistics, raw alignment and levelling
data per wafer
• N(one) - no batch report generated
The Control Mode should be set to N(one) if a wafer track is used. The Control Mode
should be set to C(assettes) for normal operation without a wafer track. If only a part of the
carrier contents will be processed, the Control Mode can be set to W(afers). The Size is the
number of cassettes or wafers (see control mode) that is presented as default when starting up a
batch.
With Error Handling, Operator Intervention, specify N(o) if the batches normally run
unattended. This causes wafers to be rejected if the maximum error count for focus is exceeded.
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Use the Error Handling / Operator Intervention on System / Focus Corr. to
control whether production will be interrupted by the System / Focus Correction error message.
Specify the Maximum Error Count Focus value.
Specify the Maximum Error Count Dynamic Performance value.
Set Machine Clearance, Reticles to Y(es) if another reticle is normally used in the next
batch. Only set it to No if all batches on this machine use the same reticle.
Set Machine Clearance, Wafers to Y(es). Only set it to N(o) for special test purposes.
For Wafer Track Interface Usage specify if a wafer track is used for input, or output. The
port which the wafer track interfaces to is specified in the machine constants after installation of
the necessary hardware.
Elevator Usage specify the normal usage of the ports. Ensure that wafer track ports are
defined correctly according to the layout of the wafer track.
• I(nput) for wafer input only
• O(utput) for wafer output only
• R(eject) for rejected wafers only
• N(one) elevator not used
Integrity Wafer Cassette should be set to C(assette) if production mainly consists of
not completely filled cassettes that must not be mixed. In this manner, all wafers stay together in
the same cassette(s), and do not get mixed. Selection of N(one) will allow each output cassette
to be filled completely, without regard to which input cassette the wafer came from.
For Calibration Reticle ID, fill in the reticle ID of the reticle that will be used to find the ID
reference state and to measure drift of the system. This item is only applicable if the image
sensor option is present.
Specify whether the Barcode on Reticles are used to identify the reticles. If most reticles
carry a barcode, enter Y(es), the barcode reader will retry reader operations that have failed and
report any errors, otherwise enter N(o). A form is displayed during the definition of the batch,
enabling the user to enter the reticle IDs.
If Enable Reticle Error Compensation is set to N(o), the intrafield corrections stored in
the reticle database are not taken into account by the system. Entering Y(es) enables Intrafield
corrections to be made with the menu option Reticle Constants, and the intrafield correction
data is used during batches. This item is only displayed if the option is present.
If Enable Reticle CD Control is set to N(o), the exposure energy offsets stored in the
reticle database are not taken into account by the system. Entering Y(es) enables the option.
Prealignment Recovery can be set to N, E or M. If N(o) is selected, no recovery is performed
and the wafer is rejected. If set to E(dge Sensor), the edge sensor will be used again to
prealign the wafer but this will decrease the prealigned accuracy. If set to M(anually), the
wafer can be manually prealigned using a keyboard controlled joystick. This item is only
displayed if the mark sensor option is present.
Batch Preparation Warning period is only displayed when the batch streaming option is
present. When the number of wafers remaining to be processed in the current batch reaches this
defined value, the batch streaming software performs a series of system status checks. The
green warning lamp starts flashing (signal) if the next batch in the queue is not Ready to Run,
or if a Pause command has been inserted.
Select the Restrict Idle Time on Stage. When set to N(o), the wafer remains on the
wafer table until the next wafer is available. When set to Y(es), the maximum idle time (in
minutes and seconds) can be specified. If this time expires, the wafer is discharged from the
wafer table even if the next wafer is not available, this restriction may be needed if fast-degrading
resist is being used.
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When the Optimized Level Performance is set, the optimized route is calculated during
batch definition using machine dependent parameters. By using the machine dependent
parameters and default critical percentage, the number of edge dies is equal or smaller, so the
levelling performance is increased.
Accept the fill-in form.
13.2
Default Reticle ID
The default reticle ID used in all marker image definitions can be defined in Factory
Constants / Job Definition Data item Combi Reticle ID.
Reticle IDs
Reticle Type
Lens
Type
Stepper
Family
Images on Reticle
4358667*
5 inch
73
/60
PM, SM, PF, SF
4358666*
6 inch
73
/60
PM, SM, PF, SF
4501226*
6 inch
75
/100
PM, SM, PF, SF
4501226*
6 inch
80
/200
PM, SM, PF, SF
4501226*
6 inch
81
/250
PM, SM, PF, SF
4357371*
6 inch
other
other
PM, SM, PF, SF
4502398*
5 inch
73
/60
PM, SM, PF, SF + XPA and SPM marks
4502399*
6 inch
73
/60
PM, SM, PF, SF + XPA and SPM marks
4502400*
6 inch
other
other
PM, SM, PF, SF + XPA and SPM marks
4544020*
6 inch
78
/300
PM, SM, PF, SF + XPA and SPM marks
4544020*
6 inch
40
/400
PM, SM, PF, SF + XPA and SPM marks
4544020*
6 inch
79
/500
PM, SM, PF, SF + XPA and SPM marks
4544020*
6 inch
79
/550
PM, SM, PF, SF + XPA and SPM marks
4544020*
6 inch
70
/700
PM, SM, PF, SF + XPA and SPM marks
4544020*
6 inch
90
/900
PM, SM, PF, SF + XPA and SPM marks
other = /80, /90, /20 and /22
Table 13.1 COMBI reticle IDs
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13.3
Job Definition Data
In the main menu, select Factory Constants. From the Factory Constants menu, select
Modify Factory Constants, followed by Job Definition Data.
Figure 13.3 Factory constants Job Definition Data form
Type the Wafer Type as S(EMI Standard) or J(EIDA Standard).
Enter the wafer diameter most often used, and whether it has a notch Y(es) or a flat edge N(o).
Wafers without notches have a flat edge. The value of the Primary Flat Edge Length is
taken from the SEMI or JEIDA standards.
Specify the Flat Edge Clearance, and Round Edge Clearance, that is shown as default
in job definition. These clearances are taken into account for placing good dies in the cell
structure.
Specify the length of the two optional flat edges according to the SEMI standards, in the
Secondary Flat Edge fields.
Specify the distance to the wafer edge which will guarantee that images are within the wafer
stage range. This is done in the Edge Exclusion field. If an image is placed closer to the edge
than the value specified here, a warning will be given.
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Mark Clearance is used to specify the area around the primary and secondary marks that will
not be used, in order not to disturb the alignment process by device structures being mistaken for
alignment marks. The Large Primary Mark is used with PM primary marks for optical
prealignment, the Small Primary Mark for all other PM primary marks. The Secondary
Mark is used for SM marks. For all other mark types specific clearances are used based on their
size.
Specify the Lens Type (and on PAS 5500/60 models, the Reticle Type) as:
• PAS 5500 /20 - 76-Lens
• PAS 5500 /22 - 77-Lens
• PAS 5500 /60 - 73-Lens
• PAS 5500 /80 - 74-Lens
• PAS 5500 /90 - 72-Lens
• PAS 5500 /100 - 75-Lens
• PAS 5500 /200 - 80-Lens
• PAS 5500 /250 - 81-Lens
• PAS 5500 /300 - 78-Lens
• PAS 5500 /400 - 40-Lens
• PAS 5500 /5x0 - 79-Lens
• PAS 5500 /700 - 70-Lens
• PAS 5500 /900 - 90 Lens.
The field size is determined by the lens type.
The Combi Reticle ID is the name for the default reticle identification string used within the
job definition as the default reticle ID for various image ID’s.
The reticle specified here is then used as the default reticle in job definition for all other mark
image definitions.
Critical Percentage must be set per layer and is used when the batch is optimized during
job definition. You can overrule the default critical percentage in the Process Data form of Job
Definition.
Alignment Method is used to set the default alignment method used when adding layers to
jobs. The initial default is TTL.
Alignment Recipe is used to set the default alignment recipe that will be used for Off Axis
(OA) alignment.
Accept the fill-in form.
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13.4
Quadrupole Definition
In the main menu, select Factory Constants. From the Factory Constants menu, select
Modify Factory Constants, followed by Quadrupole Definition.
Figure 13.4 Factory constants Quadrupole Definition form
Specify a unique Quadrupole ID. Specify the Numerical Aperture, Sigma Outer and
Sigma Inner values to be used when that quadrupole ID is selected. These are used in job
definition and batch control.
Click [Apply] and [Next] to define the next quadrupole. A specific quadrupole can be
selected by clicking on the quadrupole name in the Select field.
When all quadrupoles have been defined, exit the fill-in form.
Note: To check which values of sigma-inner and sigma -outer are supported, see the New
Illumination Mode Annular field of Cmd Hdl / Illumination and
Projection / Illumination / AERIAL Commands / Get/set Sigmas.
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13.5
Layer Data
This data is used to generate default layer data for job definition.
In the main menu, select Factory Constants. From the Factory Constants menu, select
Modify Factory Constants, followed by Layer Data.
Figure 13.5 Factory constants Layer Data form
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For every layer number, with each layer ID:
• Set the Layer Shift to 0, except if a certain layer in all jobs to be generated always has
a layer shift
• Set the Energy, to the value most used with the resist in that particular layer ID
• Set the Focus Offset to 0
• Set the Focus Tilt to 0
• Specify the Min. Mark Distance, (minimum distance between marks during global
alignment), as a percentage of the wafer diameter
• Specify the Max. Delta 8.0-to-8.8 Shift, above which the alignment scan is
rejected
• Specify the Maximum Model Residue, (difference between measured and computed
mark position), above which the mark will be rejected
• Specify whether to use a F(ull) or S(mall) range SPM Mark Scan. This option applies
only to the fine alignment phase
• Specify whether to use M(achine Dependent) 88 and 8 um Error Detection by
selecting E(nable), D(isable). This option applies only to the fine alignment phase
• Set the Illumination Mode
– Default: the default illumination mode as defined in the illumination machine
constants are displayed and used
– Conventional: specify the numerical aperture and sigma outer
– Annular: specify the numerical aperture, sigma inner and sigma outer
– Quadrupole: select the quadrupole ID, numerical aperture, sigma inner and sigma
outer. The values defined in the factory constants Quadrupole Definition are
used as default settings for the selected quadrupole ID.
• Specify the surfaces to be inspected in the Reticle Inspection - Inspection
Surfaces field. This item is only displayed if the IRIS option is present
• Specify the small, medium and large Reject Limits for both surfaces (upper and lower).
This defines the maximum number of particles allowed in each range (bin) before rejection
of a wafer is advisable. This item is only displayed if the IRIS option is present
• [Action - Apply] every layer ID before proceeding with the next layer, and leave the
fill-in form with [Cancel].
Note: The quadrupole illumination mode is automatically set on systems with the QUASAR
option installed. On systems without QUASAR installed, the quadrupole aperture must be
set manually.
13.6
User Interface Data
In the main menu, select Factory Constants. From the Factory Constants menu, select
Modify Factory Constants, followed by User Interface Data.
The corrections can be used for mix-and-match. If the possibility to change the interfield,
intrafield, and prealignment corrections etc. during batch control is not required, turn off the
Enable Corrections Screen item. If the corrections screen is enabled, the Parameter
Order can be selected.
If it is rarely necessary to change the process data items at the bottom of the Define Batch
form Energy, Focus etc., it is possible to remove the items from the Define Batch form, and
replace it with a button that accesses the Process Data form. In this way, the operator is not
bothered with items that have to be skipped all the time, while keeping the possibility to change
the items at a deeper level in the menu tree. To keep all fill-in items in one form, select Y(es) with
Combine Define Batch/Process Data.
It is possible to choose how the Illumination Mode, Energy, Focus and Focus Tilt
parameters are displayed in the batch definition form. If these items are rarely changed, they can
be set to Display or even Blanked. If these items are regularly changed, set them to Edit.
When the Disable Preset Button item is set to N (the default), the Preset button is
enabled, and when it is set to Y, the Preset button in the batch is disabled.
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If the batch streaming option is available, it can be selected with Enable Batch Streaming.
Set to Y(es), the batch streaming mode will be enabled, set to N(o) single lot processing will be
enabled.
To restore the previous batch setup, set the Save Batch Definition item to Y(es).
Figure 13.6 Factory constants User Interface Data form
It is possible to chose how the Illumination Mode parameters in the reticle data form of job
definition form are displayed. If these items are rarely changed, they can be set to Display or
even Blanked. If these items are regularly changed, set them to Edit.
The Calibration Parameters in the reticle data form of the reticle editor can also be defined
as Display, Blanked or Edit depending on how often the parameters need to be changed.
The Transmission Factor Zero Alert can be switched on or off in this form. If set to Y,
alerts are generated if a reticle is selected for which no reticle transmission factor is available,
and Lens Heating has been activated in the ID machine constants.
The Reject Wafer Alert item specifies whether an alert (operator notice) is generated if a
reject wafer occurs during batch processing. For batch streaming, the queue pauses after the
batch, containing the rejects, has finished
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If the SECS option is available, SECS Batch Summary Report specifies whether or not the
system displays a report when in remote control mode, and waits for operator confirmation.
13.7
IRIS Batch Control Data
In the main menu, select Factory Constants. From the Factory Constants menu, select
Modify Factory Constants, followed by IRIS Batch Control Data. These parameters
are only applicable for systems with the IRIS option.
i13023.rs
Figure 13.7 Factory constants IRIS Batch Control Data form
The Ignore Pellicle factory constant is used to enable or disable the pellicle frame
recognition firmware. Some reticles do not have a pellicle frame that can be recognized by IRIS.
This option is used to enable a scan on a reticle with a pellicle frame that cannot be recognized
by IRIS.
In the Allow Operator Overrule field, specify if the operator can overrule the advice given
after the inspection.
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The Inspection Moment fields allow the operator to specify if a conditional inspection should
be carried out before a batch is started. This is done in the Inspect Before Batch field. The
choice can also be made to carry out an unconditional inspection:
• Before the reticle is used for the first time
• Before first loading
• After last unloading
• Never.
This can be done in the Inspect During Batch field.
Specify how long the result of an inspection will remain valid in the Result Lifetime field. If a
conditional inspection is requested while the result lifetime of a previous scan has not expired,
the reticle will not be physically inspected.
In the Analysis Area, the operator can choose to analyze the whole inspection area or the
image area in the current layer only (as defined in the job).
Note: The inspection always covers the entire reticle. The analysis area only determines which
area is to be analyzed by the software.
The Image Edge Inclusion parameter defines the zone around the image that will be
included in the analysis. The Pellicle Edge Exclusion parameter defines the size of the
border inside the pellicle frame that will be ignored in the analysis.
Note: The presence of a pellicle frame and its dimensions are detected automatically. A small
pellicle edge exclusion border is necessary to distinguish particles from the pellicle frame.
The Default Inspection Area can be defined in terms of the Size and position (Shift).
The Upper Surface Particle Bin defines the intervals for small, medium and large
particles for the upper surface, in a continuous range from 10 µm to 99999 µm. The Lower
Surface Particle Bin defines similar intervals for the lower surface.
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14
RETICLE CONSTANTS
Within the PAS 5500 there are two types of reticles:
• Metrology reticles
• Production reticles.
Metrology reticles are those used for qualifying lens distortion and overlay, or to find the machine
to machine matching offset. The Reticle Constants menu item in the factory constants
allows access to a database in which properties of both reticle types can be stored (see Figure
14.1).
Figure 14.1 Reticle Constants window
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All reticles have these properties:
• Intrafield corrections:
This items is only available if the Reticle Error Compensation (REC) option is installed and
activated in the factory constants. It allows definition of translation, magnification and
rotation offsets to be used during reticle alignment. Registration errors caused by reticle
manufacturing errors can be corrected with these offsets
• Reticle Transmission Factor (RTF):
Used for correcting lens-heating induced offsets
• RIS marks:
For metrology reticles only
• Alignment marks:
A reticle might be suitable for use on multiple PAS 5500 types. To allow the same reticle to
be used on more than one system type, alignment marks must be present at appropriate
positions:
– /60 needs alignment marks at 111mm
– /20, /22, /80 and /90 need alignment marks at 126 mm
– /100, /200 and /250 need alignment marks at 139 mm
– /300, /400, /500, 550, /700. and /900 must have alignment marks at 131 mm.
For each of the alignment marks the actual and nominal position can be entered.
For metrology reticles, the difference between actual and nominal mark position is used to
correct the marker positions in the image field area for errors induced by this difference. The
mark type can also be specified.
14.1
Maintaining Reticle Data
To maintain data on the two reticle data types (metrology and production), different menus must
be used. These are:
• Metrology reticle data:
To maintain the metrology reticle data, use the Factory Constants / Reticle
Constants / Reticle Group menu. Define the group data and the reticle layouts. The
Modify Layouts button can be used as a short cut to jump to the Reticle Layout
menu. Using this method, certain group items are already filled in. See section 14.4: Reticle
Layout and section 14.3: Reticle Data, for more details on entering metrology reticle data.
• Production reticle data:
To define reticle data, use the Factory Constants / Reticle Constants /
Reticle Data menu. See section 14.3: Reticle Data, for more details on entering
production reticle data.
14.2
Reticle Group
In the main menu, select Factory Constants / Reticle Constants / Reticle Group
(see Figure 14.2). Position the cursor in the Group - Select field to select an existing reticle
group, or click [New] to create a new reticle group. Reticle groups are usually named after their
purpose and the field size of the stepper or step & scan system and have default nominal values.
For example: OVERLAY22 is the group name of all reticles and layouts used to measure the
overlay on a PAS 5500/100 wafer stepper which has a 22 x 22 mm field size. Click the Report
buttons to obtain reports for the [Marks], [Reticles] and [Layouts] available.
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Figure 14.2 Reticle Group form
The [Modify - Reticles] button displays the Reticle Data form (see section 12.7.4 :
‘Reticle Data’), and the [Modify - Layouts] button displays the Reticle Layout form (see
section 14.4 : ‘Reticle Layout’).
If you are creating a new reticle group, fill in a Group Name, and click [Apply] to accept and
display the group contents. Click modify [Marks], to define the nominal mark positions. To
define a matrix of marks, click on [Matrix], to go to the Mark Matrix form. Select the mark
type from the window that is present on all reticles to be included in this reticle group. Fill in the
position of the centre of the matrix and the number of marks in the X and Y direction. If the outer
dimensions of the matrix are known, select Field Size as the matrix specification. If only the
pitch between columns and the pitch between rows is known, select Mark Pitch. Fill in the field
size, or mark pitch, depending on what was filled in as the matrix specification. Click [Preview
Matrix], to display the definition in the graphics window. Apply the form to enter the matrix of
marks into the reticle group, and click [Exit]to return to the Nominal Mark Positions form.
Cancel that form, to return to the Reticle Group form. Note that group contents displays the
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number of marks, and that [View Marks] is enabled. This is a new reticle group and reticles or
layouts are not yet included in the group. Cancel the Reticle Group form to return to the
Reticle Constants menu.
14.3
Reticle Data
After a reticle has been manufactured, it can be measured on a reticle metrology machine. The
translation, rotation, magnification and delta energy can be entered into the reticle database, if
the Reticle Error Compensation (REC) and Reticle CD Correction (RCC) options are configured.
In the main menu, select Factory Constants / Reticle Constants / Reticle Data
(see Figure 14.3). Position the cursor in the Reticle Select field to select an existing reticle
ID, or click [New] to create a new reticle ID. Fill in the reticle ID, and whether it is a production
reticle or a metrology reticle.
I-13026.rs
Figure 14.3 Reticle Data form
If the reticle is a metrology reticle, select a group that it belongs too.
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Select the Calibration Type used for the reticle. There are three possible types, None, LMS
and HOLY. Use None when the reticle has no REC file. Use LMS when the reticle data was
provided by the reticle manufacturer, or if the reticle was measured on a reticle metrology
machine. If the reticle was matched to the ASML reference grid, for example the H002-1 grid, fill
in the name of this grid.
Calibration Type
Data Type
ID
Machine Type
None
None
not applicable
not applicable
LMS
LMS data (measured by not applicable
reticle manufacturer)
not applicable
HOLY
Reticle matched to
ASML reference grid
/500
H002-1
Fill in the Transmission Factor as the ratio of the light leaving the bottom of the reticle and
the light striking the top of the reticle. This value is used by the system during modeling the lens
temperature, allowing feed-forward preventive corrections for focus drift on the PAS 5500 i-line
models.
Apply the form, and then, for Metrology reticles, click [Actual Positions] to enter the
measured positions of the marks in the database record for this reticle. This can be done on a
mark-by-mark basis, or read in from a file. The file must contain Xnominal, Ynominal, Xactual, and
Yactual, delimited by spaces, and separated by returns, for every mark on the reticle. Load the file
on the system in the user_data directory. Click [Read File], and in the Read File form, click
File Name [Select]. Select the file with the measurement data, and click [Apply]. To
change the actual positions marks one-by-one, select a mark, using [Previous] and [Next],
or press SELECT on a mark in the graphics window. Change the Actual Position, and then
click [Apply].
Click [View Marks] to display a report with all marks, or click [Cancel] to leave the form.
14.4
Reticle Layout
The reticle layout specifies which marks are read during a test that measures mark positions, for
example overlay and red-blue tests.
From the Reticle Constants menu, select Reticle Layout (see Figure 14.4). Position the
cursor in the Layout Select item to get an overview of the existing reticle layouts. Reticle
layouts are usually named after the group they apply to, followed by the number of marks in the
layout, and optionally their form if that is not apparent from the number of marks.
(OVERLAY18_11X is a layout which uses reticle group OVERLAY18, and only reads out 11
marks in the X direction. OVERLAY18_121 is a layout which uses reticle group OVERLAY18,
and reads out 121 marks in a matrix).
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Figure 14.4 Reticle Layout form
To change an existing reticle layout, select it from the list box. To create a new reticle layout,
select a reticle layout that closely resembles what you want and change the name, or select
[New]. Click [Apply], followed by [Mark Selection]. In the Layout Marks form, you can
include or exclude single marks in the layout, by clicking SELECT on them in the graphics
window, and filling in the value of the Include Mark in Layout item. Or toggle this by
clicking ADJUST on a mark in the graphics window. Cancel this form, and the form above it, to
return to the Reticle Constants menu.
Note: The marks are read in the sequence they are defined. It is recommended that the layout
marks are defined in the sequence of a spiral or meander pattern, as this minimizes stage
travel between marks.
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14.5
Miscellaneous Reticle Features
From the Factory Constants menu, select Reticle Constants /Miscellaneous (see
Figure 14.5).
Figure 14.5 Miscellaneous menu in the factory constants
14.5.1
Import/Export Metrology Reticle
Data from a metrology reticle can be imported and exported using the Import Metrology
Reticle and Export Metrology Reticle features.
Only files that are in the proper format can be imported. Effectively, this means that only files
created with the export option can be imported to another machine. When a file is exported, it is
written to the user_data/reticle_database/export directory. In addition to exporting the reticle
data, the applicable group specifications and available layout definitions for that group are also
exported. The user can select Alignment Mark Positions, Transform Mark Data and
Alignment Mark Distance to be included in the file(s). These options can be used to
generate a release 5.0 compatible file.
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The correct combination for a release 5.0 compatible file is:
• N(o) in the Include Mark Positions field
• Y(es) in the Transformed Mark Data field
• Select only one mark pair.
14.5.2
Upgrade Parent File
There are two types of file that can be upgraded and inserted into the reticle data base:
• Reticle Data (an old reticle data file selected for upgrading)
• Reticle Layout (an old reticle layout file selected for upgrading)
14.5.3
View Database Summary
A report is generated that displays the Number of Groups, Number of Reticles and the
Number of Layouts.
14.5.4
View Reticle Data
The reticle ID’s and transmission factors of all the reticles stored in the database can be
examined by choosing
14.5.5
Import/Export Production Reticle List
Data from multiple production reticles can be imported and exported using the Import/Export
Production Reticle List options. Some manufacturers can supply a list of reticle IDs and
their theoretical transmission factors. This saves time because the measurement of the
transmission factor for each reticle is a time consuming process.
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