Example Fabrication Notes
SPECIFICATIONS:
1.1 Fabricate per IPC-RB-276, IPC-SM-840, Type 2, Class 2, latest revisions.
1.2. Inspect per IPC-A-600, Class 2 latest revision
1.3. This drawing is to be used in conjunction with the provided Gerber and drill data when
applicable.
MATERIAL:
2.1. Copper clad plastic sheet per IPC-4101 type GFN FR-4 (ROHS Compliance REQUIRED). U.L
Flammability 94V-0. Tg of 170 C or higher Td of 340 C or greater
2.2. Specific Material Shall be:
-GF21/A2 / S1130
-S1000/IT-588TC/KB-6160A/KB6160B/KB6160C
-S1141 / H140A / S1440 / S0440 / NY1140
-S1141KF/S0401KF/S1000/IT-150GTC/IT 158TC/NY2150
-S1170/KB-6168/S1000-2/IT-180TC/NY2170
-H140H / S6015 Halogen-free
-H1600 / S1600 / S3116 High CTI
2.3. Glass Transition Temperature (Tg) will be 170C or higher
2.4. Decomposition Temperature (Td) will be 340 C or greater
2.5. Overall PCB Laminate thickness to be .062 +/- .007
2.6. PCB is a Multi-Layer of 4 layers.
2.7. Finished Copper weight on all layers shall be 1 oz. Copper.
FINISH:
3.1. PCB Plating
-ROHS-Hot air solder leveling (HASL)
-Immersion Tin
-Immersion Silver
-Electroless nickel immersion gold (ENIG).
-Other:
3.2. PCB MARKING:
3.2.1. Supplier to place
3.2.2. Flammability rating marking of 94V-0 to be place in silkscreen on Component Side
3.2.3. All PCB Markings to be in Non-Conductive White Epoxy Ink
3.2.4. Text size may vary but must remain legible.
3.3. Finished boards shall not have nicks, scratches, voids, exposed copper, poor plating, or misdrilled
holes.
3.4. Outer layer trace width minimum is 0.0006”
3.5. No solder thief pads allowed.
CONTROLLED IMPEDANCE
4.1. Not applicable
REGISTRATION
5.1. All layers to be within 0.005 of true position unless otherwise specified.
HOLES
6.1. All holes are finished sizes.
Example Fabrication Notes
6.2. All holes to be within 0.003 of true position unless otherwise specified.
6.3. Plate holes thru with copper 0.00010 min to 0.002 max thicknesses.
6.4. An NC drill file has been supplied.
6.5. See hole schedule for additional requirements
FINGERS:
7.1. None
SOLDERMASK:
8.1. Soldermask over bare copper on both sides using Green photo-imagable Soldermask, 0.003 max
thickness.
SILKSCREEN:
9.1. Silkscreen on both sides using white non-conductive epoxy or equivalent
9.2. No silkscreen is allowed on Bare Copper
9.3. Registration to be within 0.0010 from actual position and must be a minimum of 3mm away
from fiducial marks
9.4. Silkscreen must pass the peel test.
ELECTRICAL TEST
10.1. Testing IS required. Test continuity on all bare fabs using bed of nail fixture or flying probe from
the farthest extent of each trace, using both sides if required.
10.2. Adjacent Traces must have a minimum surface resistance of 2.5M Ohms at 10V
10.3. Comparative Tracking Index (CTI) will be 100 CTI<175
10.4. Connectivity must match ODB++ or IPC-D-356A Netlist.
CLEANLINESS
11.1 Boards shall be free of fiberglass dust or any other foreign material.
PACKAGING:
12.1. Bag and tag with part number and revision on each lot.
12.2. There shall be a max of 25 units per package, individually wrapped and shipped in cardboard
cartons with sufficient surrounding material to prevent damage during shipping
QC INSPECTION:
13.1. Confirm part number and/or ordering number.
14. Dimensions are in mm/mil