Composite Structures 303 (2023) 116323 Contents lists available at ScienceDirect Composite Structures journal homepage: www.elsevier.com/locate/compstruct Numerical simulation and validation of MWCNT-CFRP hybrid composite structure in lightweight satellite design Shoaib Iqbal , Tariq Jamil *, Syed Murtuza Mehdi Department of Mechanical Engineering, NED University of Engineering & Technology, Karachi 75270, Pakistan A R T I C L E I N F O A B S T R A C T Keywords: Electronic housing Space avionics Finite element analysis Composite materials Structure analysis Aluminum alloy is generally used in electronic housings of satellites in space avionics due to its remarkable mechanical, thermal, electrical, and radio-frequency shielding properties. This paper proposes a design for a lightweight multi-functional electronic housing made from plastic containing multi-wall carbon nanotubes (MWCNT) composite material. The structural design of housings was validated against a set of boundary con­ ditions and requirements of launch and space environments as prescribed by European Cooperation for Space Standardization (ECSS) standards. The proposed concept for lightweight composite housing was designed with special emphasis on reducing machining operations. The composite housing offers a mass saving of ~25 % over a typical aluminum housing with similar mechanical performance in the three orthogonal directions. The modal frequency is greater than 100 Hz qualifying the design requirement for satellite electronic housings. Under si­ nusoidal vibration loads, the structure shows no noticeable excitation in acceleration response graph, indicating no resonance in low-range frequencies from 5 to 100 Hz. Maximum stresses obtained from Quasi-static and random vibration loads are within the tensile strength limit in the three orthogonal directions. In addition, maximum deflection observed in electronic printed circuit boards is within the 1 mm design requirement. 1. Introduction Satellite development is among the most diverse research areas of modern science, as it entails scientific research in materials, manufacturing processes, vibrations, and numerous other engineering aspects. Out of the many complex stages of satellite development, the launch stage has continued to be the most challenging, particularly in terms of cost overheads. Budgeting is among the most important factors when carrying out a feasibility study for a space mission in view of the high costs of launching a unit mass of payload into space. Presently, the cost of launching a satellite into lower earth orbit varies between US$ 4,600/kg and US$ 15,400/kg for medium-sized satellites, depending on the launch vehicle and orbit distance from Earth [1]. Several researchers have accomplished this by employing lightweight composite materials, such as Carbon Fiber Reinforced Plastic (CFRP), in structural compo­ nents of satellites for mass optimization [2,3]. Electronic housings with a focus on high thermal conductivity have also been developed using monolithic composite laminates through autoclave manufacturing [4]. CFRP has also been used to develop composite structures with embedded electronics to improve mass savings in satellites [5]. A combination of pitch-based K1100 carbon fibers and Aluminum alloy materials has been extensively used to design and test lightweight housings with high thermal conductivity using numerical and experi­ mental methods [6–8]. Considerable mass savings by completely replacing Aluminum alloy by CFRP in satellite housing enclosures have also been discussed [9]. In general, electronic housings are made of aluminum alloys, particularly AA-6061 and AA-7075, due to their low density, suitable mechanical and thermal properties, low cost, manufacturability, and availability. Although aluminum alloys have a high strength-to-weight ratio compared to other readily available metals, there is still consid­ erable room for improvement in the selection of materials for spacecraft structure applications, especially in housing enclosures for satellite electronics. Several lightweight materials can substitute aluminum al­ loys for making electronics housings of satellites and spacecraft sub­ systems, but the selection procedure is easier said than done. Since the housing enclosure carries a large portion of the weight of the entire electronic unit, appropriate material and mechanical design is required to optimize its mass without compromising structural requirements [10]. * Corresponding author. E-mail address: tariqjamil@neduet.edu.pk (T. Jamil). https://doi.org/10.1016/j.compstruct.2022.116323 Received 13 March 2022; Received in revised form 25 July 2022; Accepted 7 October 2022 Available online 17 October 2022 0263-8223/© 2022 Elsevier Ltd. All rights reserved. S. Iqbal et al. Composite Structures 303 (2023) 116323 For the scope of this research work, a lightweight composite material made of CFRP and MWCNT is used to replace aluminum in plates of the electronics housing. CFRP is expansively used in numerous structural components of satellites [11], particularly supporting structures for imaging devices, antennas, and solar arrays, primarily because of its exceptional mechanical properties and fatigue resistance [12], but pri­ marily a higher strength-to-weight ratio, which proposes potential mass savings of up to 20 % compared to the Aluminum-alloy design [2–4,6]. This advantage, however, comes with several obstacles, such as low thermal conductivity, machinability, and insufficient electromagnetic radiation shielding properties of CFRP-based composites. While carbon fibers possess high electrical and thermal conductivity due to their high carbon content [3,7,13], an insulating medium is created due to the presence of polymer-epoxy matrix that is used to hold the reinforcing fibers in place in the CFRP form. The addition of MWCNTs into the polymer-epoxy matrix addresses these issues to a sizable extent. Experiments have shown that the addition of 0.25 wt% MWCNTs increase the tensile strength of CFRP by 60 % [12]. MWCNTs added into the polymer-epoxy matrix significantly increase the electrical conduc­ tivity of the composite laminates, thereby improving the electromag­ netic interference (EMI) shielding in CFRP and epoxy laminar composites [2,14,29]. When used as matrix reinforcement, CNTs in­ crease the vibration damping characteristics of fiber-reinforced com­ posites [15,21]. The addition of MWCNTs into cured epoxy resin has also tested to increase EMI shielding effectiveness and tensile strength [16,20,25]. With the help of computational study, interconnected bun­ dles of nanotubes are shown to have a strong effect on the thermal conductivity of CNT-based materials [17,35]. When used as multifunc­ tional nano-fillers, highly conductive CNTs are shown to improve the thermal conductivity of polymer-resin based nanocomposites [18,19]. Although CFRP is acknowledged for high material stiffness, it lacks the appropriate damping capacity due to the viscoelastic nature of carbon fibers [22]. CNTs increase the interfacial adhesion between polymer resin and carbon fibers [15]. Additionally, the damping effect is also enhanced by the relative motion of MWCNTs against the surface of polymer-epoxy resin. Since the surface area of CNTs is very high, the extreme friction occurs when they come in contact with the epoxy sur­ face, resulting in large amounts of energy absorption that improves the damping capability [23,24]. The primary objective of the research work presented here was to design and validate a lightweight composite housing for satellite electronics with respect to constraints of mass, natural frequency, structural integrity, and thermal conductivity, using a hybrid composite of MWCNT and CFRP. 2. Design methodology 2.1. Requirements of electronic housing An electronics housing is designed to fulfil a set of basic re­ quirements, which include multiple interfaces for mounting of elec­ tronic printed circuit boards (PCBs) within the structure; support for delicate internal components against mechanical loads during launch and space phase, a suitable thermal pathway for channeling excessive heat towards the satellite structure away from sensitive electronic components; a minimum of 2 mm thick walls made of AA-6061 protect the internal electronics against harmful radiations and EMI. Table 1 summarizes the key requirements of an electronic housing. 2.2. Work approach The principal objective of this study is to propose a lightweight composite design of electronic housing for satellite electronic sub sys­ tems. Typical electronics housing is made of aluminum AA-6061 alloy, which provides the right mechanical, thermal, and electrical charac­ teristics required for satellite applications. A hybrid MWCNT-CFRP composite was chosen for the proposed lightweight housing design due to its multi-functional properties, particularly a high strength-toweight ratio. Two computer aided designs of electronics housing were developed for this study, one using aluminum AA-6061 alloy and another with MWCNT-CFRP laminates, using PTC Creo Parametric software. The respective CAD models of the two housings are shown in Fig. 1 and Fig. 3. The structure designs of both housings were validated against static and dynamic loads as prescribed by European Cooperation for Space Standardization (ECSS) testing standards for launch and space environments. Multiple FEA numerical simulations in MSC Patran soft­ ware with MSC Nastran solver were performed. The results of stresses Table 1 Requirements for a typical electronic housing for space applications. Item Requirements Physical Interface Accommodation of up to 4 PCBs and provision for electronic connectors >100 Hz >0 Natural Frequency Margin of Safety (MoS) Max Deflection Radiation shielding <1 mm ≥2 mm (Aluminum) Fig. 1. (a) Typical AA-6061 Housing. (b) Arrangement of PCBs and D-sub connectors. 2 S. Iqbal et al. Composite Structures 303 (2023) 116323 and deflections obtained from the structural analyses and potential mass saving between the two housings were compared. in Fig. 2. These composite laminates make up the top plate, left plate, right plate, front plate, and back plate of the structure of the lightweight housing. The PCB frames are made of a combination of AA-6061 and MWCNT-CFRP composite laminate for improving the stiffness as well as heat dissipation. Other places where aluminum alloy is used are the bottom plate, PCB guide rails and mounting lugs. Fig. 3(b) shows the housing components made of MWCNT-CFRP in grey texture and AA6061 components in white color. 2.3. Aluminum housing Fig. 1(a) shows the external view of a conventional electronics housing made of Aluminum. The housing case consists of 6 plates made of AA-6061 material which are held together with stainless steel fas­ teners. The top plate of the housing features cut-outs for electrical interfacing of conventional D-sub connectors (DB-15 in this case). On the right and left plates, a total of eight mounting lugs for the housing are provided which are used to mount the housing on the sat­ ellite structure panels. The housing provides easy installation of four PCBs of standard Eurocard 6U size (233.33 mm × 160 mm). With some external plates hidden, Fig. 1(b) shows the internal organization of PCBs and D-sub connectors. All PCB cards are fastened to metallic frames, which are designed to provide optimum stiffness to PCBs and prevent excessive elastic deformation under external loads acting on the housing during launch and space environment. The frame and PCB assemblies are held inside the housing with the help of wedge-lock retainers that slide along the guide rails provided on the inner side of Left and Right housing plates. In the scope of this research project, each PCB is designed to hold a mass of up to 500 g, which has been distributed over the entire surface using the nonstructural mass feature of MSC Patran software. The housing compo­ nents of the conventional housing, including plates and frames are made of aluminum alloy AA-6061, whereas the PCB cards are made of Flame Retardant FR-4 material. AA-6061 is an excellent material for space applications, since it is both lightweight and has good structural and thermal properties. FR-4 is a glass-reinforced epoxy laminate composite, which is used as a standard for manufacturing of electronic circuit boards. 2.4.1. Advantages of MWCNT-CFRP laminates While CFRP characterizes outstanding properties on its own, studies by multiple researchers have shown that adding MWCNTs into the polymer matrix improves the mechanical, thermal, and electrical properties of CFRP laminates by a large margin [13,27,30,34]. In one study, researchers showed that the addition of 0.25 wt% MWCNTs into the epoxy polymer matrix improved the tensile strength by 60 % [12]. While CFRP exhibits good stiffness, the poor viscoelastic nature of car­ bon fibers results in an overall low damping capacity. MWCNTs increase the interfacial linkage between carbon fibers and resin, increasing damping properties [15,20]. A damping coefficient of 1.5 % is used for the numerical analyses in this study. In another study, the electrical conductivity of neat CFRP and MWCNT-CFRP laminates were compared and the surface resistivity of MWCNT-CFRP laminate was found by experimentation to be signifi­ cantly lower than neat CFRP [2]. Low surface resistivity is equivalent to a higher electrical conductivity, which is essential for satellite applica­ tions in order to fulfill electromagnetic interference (EMI) and electro­ magnetic compatibility (EMC) requirements. Electronic housings are generally required to have appropriate shielding measures from outer space radiations [2,4]. Generally, shielding equivalent to 2 mm thick aluminum alloy is acceptable for satellite electronic housings. Due to the polymer-epoxy matrix between carbon-fiber fabric sheets, neat CFRP is ineffective for shielding, however, MWCNTs improve the shielding properties of carbon-based composite laminates [2,16,28,31]. 2.4. Lightweight composite housing 2.4.2. Heat transfer path In satellites and spacecraft, a large amount of heat is generated by electronic components mounted on the PCBs that is required to be dissipated through a conductive path, since there is no medium for heat convection in space. For this approach to work, the housing structure for satellite electronics is required to be thermally conductive [3,7]. One of the main advantages of introducing MWCNTs as nano-fillers into the polymer resin matrix of CFRP is improvement in thermal conductivity [2,16,28]. To ensure an uninterrupted heat transfer in the course of this research work, housing components that make the primary heat transfer path are designed with AA-6061, particularly the frames, PCB guide rails, bottom plate, and lugs. In addition to providing optimum stiffness to electronics, the four frames act as heat sinks to transfer excessive heat away from the sensitive electronic components towards the PCB guide rails and bottom plate, from where excessive heat will disperse into the main satellite structure. Red arrows in Fig. 4 represent the heat transfer path. The lightweight housing design must also satisfy the design re­ quirements of natural frequency, MoS, maximum deflection, and most importantly, the accommodation of four PCBs within the structure, as mentioned in Table 1. The composite-based electronic housing presents a similar interface for installation of four PCBs each of Eurocard 6U size inside the structure as shown in Fig. 3(b). CFRP is an excellent material for a range of applications thanks to its lightweight characteristics, high strength-to-weight ratio, corrosion resistance, and low coefficient of thermal expansion, which makes it an attractive choice for space applications [11,12,14]. Mechanical prop­ erties of the composite material have been acquired from the experi­ mental work of Shifa et al. [2] and Tariq et al. [12], in which carbonwoven fabric (weave type: 5 Harness Satin, areal density 270 ± 5 g/ m2 and 0.4 ± 0.005 mm thickness) was used as carbon-fiber ply. A combination of Bisphenol-A-based resin and Cycloaliphatic-amine hardener was used in ratio of 10:3.5 (by weight) as the epoxy matrix. The resin matrix was impregnated by 0.25 wt% MWCNTs with a diameter range of 10–20 nm and length range of 10–30 µm. A schematic of a typical MWCNT-CFRP composite laminate is shown Fig. 2. Schematic of a typical MWCNT-CFRP composite laminate. 3 S. Iqbal et al. Composite Structures 303 (2023) 116323 Fig. 3. Lightweight composite housing. (a) External CAD model view. (b) Exploded view. 4 S. Iqbal et al. Composite Structures 303 (2023) 116323 Table 2 Mechanical properties of AA-6061 and FR-4 material. Property AA-6061 FR-4 Elastic Modulus (GPa) Yield Strength (MPa) Poisson Ratio Density (g/cm3) 68.7 276 0.33 2.7 22.4 262 0.143 1.5 Table 3 Mechanical Properties of MWCNT-CFRP composite [2]. Property MWCNT-CFRP Elastic Modulus E11 (GPa) Elastic Modulus E22 (GPa) Shear Modulus G12 (GPa) Poisson Ratio Density (g/cm3) 65.1 65.1 5.0 0.1 1.6 Table 4 First ten natural frequency modes. Mode Fig. 4. Heat transfer path in composite housing (red). (For interpretation of the references to color in this figure legend, the reader is referred to the web version of this article.) 1st 2nd 3rd 4th 5th 6th 7th 8th 9th 10th 3. Results and discussion 3.1. Structure analysis Spacecraft are subject to extreme acoustic noise during the launch phase, which produce high-frequency vibrations in satellite structure and internal electronic components. Additionally, events like the igni­ tion of propulsion systems, disengaging of flight control systems, and transportation of satellite to the space launch facility have the tendency to induce low-frequency vibrations with potentially large deflections. The electronics housing are designed in such a way to prevent unwanted environments from severely damaging the onboard electronics. Housing is required to pass a series of structural analyses before its design is validated for manufacturing. These include Modal analysis, Sinusoidal vibration analysis, Quasi-static analysis, and Random vibration analysis [32,33]. The mechanical loads for the aforementioned analyses have been acquired from ECSS Testing Standard for Space Engineering (ECSSE-10-03A) [26]. Components of both housings were modeled using 2D shell (plate) elements of order 1 using a mesh size of 3 mm. The FE model of the aluminum housing design consisted of 54,520 elements and 184 RBE2 multi-point connections. For the lightweight composite housing, 56,735 elements and 205 multi-point connections were used. Mechanical properties of AA-6061 and FR4 materials are listed in Table 2. The material properties of MWCNT-CFRP composite laminates listed in Table 3 have been acquired from Shifa et al (2020) [2]. Aluminum Housing Composite Housing Frequency (Hz) Mode Location Frequency (Hz) Mode Location 278.83 288.60 295.66 303.33 354.68 358.87 361.18 364.28 480.29 499.81 PCB 2 PCB 1 PCB 2 PCB 4 PCB 1 PCB 2 PCB 3 PCB 4 Top Plate Front Plate 257.95 269.62 271.21 273.97 323.97 325.72 327.24 328.93 394.23 464.04 All PCBs PCB 1 PCB 4 PCB 1 PCB 2 PCB 1 All PCBs All PCBs Top Plate Top Plate 3.2. Modal analysis Modal or Natural Frequency analysis involves the determination of the fundamental frequency of satellite and its components. Launch vehicle puts a lower limit on the fundamental frequency of a satellite and all electronic housings must be designed above this limit to maintain their mechanical integrity. If the fundamental frequency of the housing is lower than the lower limit in any direction, the electronics can get damaged due to resonance. The natural frequency of individual housings of satellite payloads is required to be greater than 100 Hz to avoid resonance [36]. The frequency and location of the first 10 natural fre­ quency modes of the two housings are listed in Table 4. The first three mode shapes of the two housings in all three orthog­ onal axis directions are shown in Fig. 5 and Fig. 6. For the aluminum housing, the first, second and third modes appear on the PCBs, which appear to be bending. A similar pattern was shown in the results of composite housing, where the PCBs appear to be bending in the initial three modes. Fig. 5. Mode shapes of aluminum housing. (a) 1st Mode. (b) 2nd Mode. (c) 3rd Mode. 5 S. Iqbal et al. Composite Structures 303 (2023) 116323 Fig. 6. Mode Shapes of composite housing. (a) 1st Mode. (b) 2nd Mode. (c) 3rd Mode. 3.3. Sinusoidal vibration analysis Table 5 Load case of sinusoidal vibration. Satellite and all of its components experience a low frequency vi­ bration environment (from 0 Hz to 100 Hz) due to various reasons, the first and foremost of which is the excitation of Propulsion System of the launch vehicle. Additional source of the sinusoidal vibration environ­ ment is the transportation of the satellite towards the launch site. Since the mounting location of the housing is undecided, the same maximum load is considered in all directions. The sinusoidal vibration loads pre­ sented in Table 5 are applied in all three directions. Fig. 7 depicts the sinusoidal input profile and response accelerations Frequency (Hz) Sinusoidal Amplitude (5–20) Hz (21–60) Hz (61–100) Hz 11 mm (0–peak) 20 g (0–peak) 6 g (0–peak) of both the aluminum and composite housings in x, y, and z-directions. Fig. 7(a) shows the input acceleration profile of sinusoidal vibration loads along with responses of aluminum and Composite housing in xdirection. Since the fundamental frequency of both housing designs is Fig. 7. Sinusoidal Input and Response Acceleration. (a) x-direction. (b) y-direction. (c) z-direction. 6 S. Iqbal et al. Composite Structures 303 (2023) 116323 greater than 100 Hz, no excitation can be observed in the output response graphs. Furthermore, the input and output response curves virtually overlap each other throughout the entire frequency range, ensuring that the housing design will not resonate in low-frequency environments between 5 and 100 Hz. In Fig. 7(b), a slight excitation in output response of both housings in Y-direction is observed. The maximum acceleration transmissibility in the aluminum housing is calculated to be 1.185 at 100 Hz, whereas the value for the Composite housing is 1.26 at 100 Hz. Fig. 7(c) shows that the response behavior of the aluminum and Composite housing in Zdirection follows the input acceleration load profile closely without any noticeable excitation. The three graphs demonstrate that neither hous­ ing display substantial excitation in acceleration under sinusoidal loads, which qualifies the housing designs for low frequency vibration environment. Table 6 Load case for Quasi-static analysis. Direction Inertial Load All orthogonal directions (x, y, z) 13.5 g Table 7 Von Mises Stress and Deflection. Direction X-axis Y-axis Z-axis Von Mises Stress (MPa) Deflection (mm) Aluminum Housing Composite Housing Aluminum Housing Composite Housing 5.96 10.9 5.08 23.5 22.5 6.98 0.00542 0.0546 0.0228 0.0151 0.0735 0.0275 static analysis is presented in Table 6, and the resulting Von Mises stresses and deflections are listed in Table 7. The maximum Von Mises stress and deflections are shown in Fig. 8 and Fig. 9 respectively. The Von Mises stress generated in housings due to constant accel­ eration loads are significantly lower than the yield and tensile strength of raw materials used. Maximum stress has been observed in y-direction on the mounting lugs in both housings, which is due to the large number of housing components perpendicular to the y-direction. Similarly, the max deflection in PCBs caused by the static load is lower than 1 mm in all three directions, which was the design requirement. 3.4. Quasi-static analysis The Static loading occurs during the launch phase and it is caused by the constant acceleration of the engines of launch vehicle and aero­ dynamic forces during the various phases of the vehicle flight. Static analysis is performed to verify and validate the structure of satellite. The maximum stresses on the components must not be greater than the yield strength of the raw material to keep it in the elastic region. If the generated stresses are greater than the yield limit, the respective ma­ terials will undergo plastic deformation, a phenomenon which is highly unacceptable in space technology. In such a situation, appropriate modifications are required to be made in the structure of the housing to maintain maximum stress in the desired range. More precisely, maximum stress must remain within some factor of safety of the yield strength of the raw materials used. The housing is constrained at mounting lugs and the static loading is applied in the form of Inertial Load and. The load case for the Quasi- 3.5. Random vibration analysis During the launch phase, a typical satellite experiences high fre­ quency vibration environment primarily caused by the excitation of acoustic noise fluctuations generated by different engine operations of the launch vehicle. In addition, engines generate high frequency thrust Fig. 8. Von Mises Stress produced in the electronic housing. (a) Aluminum housing. (b) Composite housing. 7 S. Iqbal et al. Composite Structures 303 (2023) 116323 Fig. 9. Deflection produced in the electronic housing. (a) Aluminum housing. (b) Composite housing. vibration simulations are presented in Table 9. The random response GRMS of aluminum housing is used as static inertial load to estimate Von Mises stresses and deflections generated in the aluminum and lightweight composite housings under random vi­ bration loads in the three orthogonal directions, as shown in Table 9. The resulting Von Mises stresses and deflections are tabulated in Table 10. The maximum Von Mises stress and deflections in the two housings are shown in Fig. 11 and Fig. 12 respectively. Stress values of 242 MPa were observed around the mounting holes of lugs due to stress concentration. Disregarding the abnormally high values in these elements, the actual maximum stress obtained in the composite housing is close to 189 MPa. Maximum Von Mises stress obtained from equivalent random load in both housings is observed in ydirection. In aluminum housing, the stress is concentrated on mounting lugs and fastener locations of housing plates as shown in Fig. 11(a). In composite housing, the Von Mises stress is observed on the mounting lugs and PCB frames as displayed in Fig. 11(b). Max PCB deflection in either housing is obtained to be lower than 1 mm in all three directions as shown in Fig. 12, which was the structure design requirement. Table 8 Load case for random vibration analysis (M is mass of housing). Frequency Levels GRMS (20–100) Hz (100–300) Hz (300–2000) Hz +3 dB/octave PSD (M) = 0.12 g2/Hz × (M + 20)/(M + 1) − 5 dB/octave 16.85 g oscillations, which are translated into the body of the launch vehicle, from where these random vibrations are transferred to the outer panels of the satellite through the launch vehicle adapter. The adapter transfers these vibrations to the structure panels of the satellite, from where they are transferred to the housings of sub-system units located inside the satellite [26]. The load case for the Random vibration simulation is presented in Table 8. Since location of housing in the satellite is unknown, the maximum random vibration loads ac­ cording to the ECSS standard is applied in all directions. The GRMS of input random vibration load is calculated to be 16.85 g. The comparisons of random vibration input and output random re­ sponses of both aluminum and composite housings in ×, y, and z-di­ rections are depicted in Fig. 10. The response graph in x-direction shows that the aluminum housing excites at around 800 Hz, whereas the composite housing shows a peak acceleration response at around 500 Hz. In y-direction, the aluminum housing first excites at around 300 Hz, with subsequent excitations at 800 Hz and 1100 Hz, whereas the com­ posite housing shows an excitation slightly at slightly lower frequency of 250 Hz. In z-direction, the aluminum housing first excites at around 500 Hz with a higher peak at 700 Hz. For the composite housing, the first excitation appears at 600 Hz, with a higher peak at around 1100 Hz. The response GRMS values of the two housings obtained from random 4. Conclusion The aim of this research study was to design a lightweight electronics housing that satisfies the design requirements of electronic housings for satellite applications. A composite housing was successfully designed for satellite electronics using a combination of CFRP, MWCNTs and AA6061 materials with the following observations: 1. The lightweight composite housing offers a mass saving of 25 % compared to a typical electronics housing made entirely of AA-6061, 8 S. Iqbal et al. Composite Structures 303 (2023) 116323 Fig. 10. Random input and response acceleration. (a) x-direction (b) y-direction (c) z-direction. Table 9 Random response GRMS of electronic housings. Direction x-direction y-direction z-direction Random Response GRMS Aluminum Housing Composite Housing 70.72 g 83.6 g 160.7 g 84.51 g 145.1 g 256.6 g which was the primary objective. Table 11 shows the potential mass difference between the two housings. 2. Results of Modal analysis show that the fundamental natural fre­ quencies of the composite housing in all three directions is greater than the 100 Hz and, therefore, can easily evade resonance with the primary structure of satellite and launch vehicle. 3. Acceleration response of the composite housing under sinusoidal vibration loads in the three orthogonal directions does not indicate any unwarranted excitation, validating the earlier results of natural frequency analysis. 4. Results of stresses and deflections obtained from Quasi-static anal­ ysis validate the structure design of composite housing for constant acceleration loads in all three directions. 5. Response of random vibration loads and resulting stresses obtained from Random vibration analysis show that the lightweight composite housing can safely hold the PCBs in place inside the housing without any damage due to excessive vibrations during the launch phase. Additionally, deflections obtained from Random vibration loads are found to be under 1 mm in all directions, which was the design requirement. 9 S. Iqbal et al. Composite Structures 303 (2023) 116323 Table 10 Von Mises stress (MPa) and deflection (mm). Direction x-axis y-axis z-axis Table 11 Mass Saving in the electronic housing. Von Mises Stress (MPa) Deflection (mm) Aluminum Housing Composite Housing Aluminum Housing Composite Housing 31.0 67.7 60.5 147 189 132 0.0261 0.338 0.0314 0.0942 0.762 0.522 Housing Mass (kg) % Mass Saving Conventional MWCNT-CFRP Composite 2.95 2.23 ~25 % Fig. 11. Von Mises Stress generated in the electronic housing. (a) Aluminum housing. (b) Composite housing. Fig. 12. Deflection generated in the electronic housing. (a) Aluminum housing. (b) Composite housing. The above findings observations demonstrate that the composite housing offers similar mechanical functionality as that of the aluminum housing and satisfies all the structure design requirements for electronic housings in satellite applications mentioned in Table 1. and associated advantages. The thermal and electrical characteristics of the composite material and housing itself have been briefly discussed in Section 2.4.2, however, experimental tests can be performed to validate the findings of the research work using a manufactured prototype. This paper has opened several opportunities for researchers to explore and experiment the thermal, electrical, and RF shielding properties of MWCNT-CFRP composite laminates for demanding applications, particularly in satellites and spacecraft structures. 5. 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Adv Aircr Spacecr Sci 2018;5(6):633–52. https://doi.org/10.12989/aas.2018.5.6.633. [36] ECSS Spacecraft mechanical loads analysis handbook (ECSS-E-HB-32-26A). https://ecss.nl/hbstms/ecss-e-hb-32-26a-spacecraft-mechanical-loads-analysis-ha ndbook. Shoaib Iqbal: Conceptualization, Methodology, Writing – original draft, Data curation, Investigation, Software, Visualization. Tariq Jamil: Resources, Supervision, Project administration, Writing – review & editing, Validation. Syed Murtuza Mehdi: Formal analysis. Declaration of Competing Interest The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper. Data availability The raw/processed data required to reproduce these findings cannot be shared at this time as the data also forms part of an ongoing study. Acknowledgement The authors wish to express their gratitude to S. M. Shahab Hussain, Saeed-ur-Rehman, and M. 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