Wafer Inspection
Dragonfly™ G2 System
Dragonfly G2
Advanced Macro Inspection and Metrology System
Bright field / Dark field / HARL / Clearfind Illumination
Algorithms for Litho, Sort/Test, OQA, AP
Inline CD / Overlay / Die Position Metrology
TrueBump High-speed 3D Metrology
3D Metrology for Films and Profilometry
Real Time Binning & Die Disposition with Discover
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Recipe Sharing
• Recipes are saved into an SQL
database
• Shared components can be
leveraged on multiple tools and
across multiple recipes
• Changes can be managed by any
tool and are instantly available for
sharing with all tools
• No “master-slave” tools
• Recipes can be modified while the
system is inspecting
Recipe Server
• User permissions are configurable
• Waferless Recipe Creation and
subsequent layer recipe creation
possible without wafers
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Automatic Site Alignment
•The system automatically
determines the best site (die)
alignment feature(s)
•Backup alignment points
improve inspection reliability
Multiple ROI (rectangular, circular, polygon)
•Regions of Interest (ROI) are
not limited to squares.
•Auto ROI allows a single ROI
created around a feature to be
duplicated to all similar
features in the die.
•Segmental ROI
Color Shift
•Manual or Auto sensitivity
thresholds
•Advanced: Scaled & Radial
based thresholds
•Filters
Real Time: Defect Binning
•Create numerous binning
scenarios based
• Area
• Aspect Ratio
• Grey scale value
• Size
•Binning Paretos are
updated real time during
inspection
•Binning can drive image
capture
Dragonfly G2
Key Features
1.
Proprietary 2D Scanning and Imaging Algorithms
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2.
Die Size Management
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3.
Improved image and color quality
Clearfind Capable
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5.
Improves DSE efficiency from ~50% to 80%.
Whole wafer only
Next Gen Color Review Camera
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4.
Up to 150% increase in throughput
Defect sensitivity to 1 µm BF
Defect sensitivity to 0.3 µm DF
Eliminate nuisance defects
Nonvisual defect detection on bumps, RDL, Via, UBM
2D and 3D metrology
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XCD
TrueBump
VTSS
WTS + IR Camera
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Dragonfly G2
Competitive Differentiation
IR
Imaging
VTSS
True
Bump
- LED Bright and Dark Field
- LED High Angle Ring Light
(HARL)
- White Light or RGB
spectrum
selection and mixing
- Lifecycle: >5 years
HARL
Darkfield
- Wide Field Optics: 50%
Increase in FOV vs. Area
Scan
- 2x scan rate increase over
Dragonfly
- Improved Review quality
- Gen 2 real time focus
tracking
Scalability
TDI Optics
Optics
Illumination
RGB Control
- TrueBump High-speed 3D
- VTSS Interferometric
profiler
- WTS Si Thickness Sensor
- IR Inspection, Metrology,
and
Review
- Clearfind (Optional)
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Dragonfly G2
Illumination
RGB Control
• LED illumination source for BF, DF and HARL
• White Light mode
• Selectable R, G, B or mixed illumination
• Laser illumination source for Clearfind
Spectral Response
Bright field
Dark field
HARL
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Clearfind
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Dragonfly G2
Optics
• Improved sensitivity, throughput, repeatability and tool matching with
line scan technology over area scan methods
+∞
Line scan FOV
Area
Scan
FOV
Dragonfly
+50%
Area Scan
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Dragonfly G2
Review
Inspection
Productivity Enhancement
Mag
Inspection
Pixel Size
(µm)
Review Pixel
Size (µm)
BF
Sensitivity
DF
Sensitivity
10X
1.0
0.4
1.0
0.3
7.5X
1.25
0.5
1.25
0.4
5X
2.0
0.75
2.0
0.75
3X
3.03
1.20
3.03
1.0
2X
5.0
1.8
5.0
1.75
1X
10.0
3.7
10.0
3.0
20X
0.5
0.18
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50X
0.2
0.075
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• Up to 6 inspection objectives from 10X down to 1X
• Review and Metrology applications with 50X and 20X objectives
• Review magnification down to 0.07 µm when equipped with 50X
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Dragonfly G2
Scalability
• Capable of scaling to meet applications today and in the future, the
Dragonfly platform supports field upgradability for key applications
- 3 Mag Turret
- 3X
- 5X
- 7.5X
- 10X
- Range 1 µm – 450 µm
- Transparent film thickness
metrology for thick and
thin films
- Profilometry for RDL,
µBump, Trench, TSV and
Thin Si
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IR + WTS
- >70M Bump capable
VTSS
TrueBump
Wafer
- InGaAs IR camera for
Wafer alignment,
metrology and sampling
inspection
- Combined WTS for TSV
Depth, Si and Glass
thickness
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Reduce Nuisance Rate
Fine RDL defect inspection
CHALLENGE
HIGH NUISANCE RATE
DUE TO METAL
GRAININESS
BF Image
BF Image
Clearfind Image
Clearfind Image
RDL 2
Seed 2
PI 2
PI
RDL 1
Seed 1
PI 1
PI
Metal Interconnect
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CHALLENGE
NON-VISUAL
KILLER DEFECTS
Under develop Detection by CF
PI Residue
PI
Metal Interconnect
PR
PI
X
PR Residue
Seed Metal
Metal Interconnect
X
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Residue on Cu Pillar/Bump by CF
BF Image
DF Image
CHALLENGE
DIFFICULT TO DETECT
RESIDUE ON CU
PILLAR AND BUMPS
Clearfind Image
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3D TrueBump Technology Dragonfly LT100
Operating principles:
1. Laser line illuminated imaging
2. Triangulated image through turret and receiver
3. Custom high-speed CCD imager
Feature
Benefit
Microscope objectives
Can be optimized to specific application needs
Standard Objectives
3X, 5X, 7.5X
3 Position Turret
5-250+um bumps support in a single scan
7 position specular blocker
Automated control of stray light for improved accuracy
Imaging technology
Improve repeatability. Unaffected by stray light and
rough\shinny bumps
Custom camera
Improved throughput
Blue wavelength (nm) source
Improved resolution for smaller features
Large working distance
~11mm of clearance for film frame apps.
Data Rate
300%improvement over current LT sensor
Fast Accurate 3D Bump Inspection & Metrology
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Wafer – level
metrology
Localized metrology
• Via depth
• Thickness of:
3D
Metrologies
Application
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Transparent material
Photo-Resist
Polyimide
SiN / SiO2
• Bump Height
• Nail Protrusion height
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Wafer Shape
Wafer Bow
TTV
Residual Si Thickness
Wafer thickness
Adhesive layer thickness
Localized and wafer
level metrology
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VTSS In-Line Measurements
Goal
Use NSX330 Automatic 3D measurement to replace Off-Line human manually operation on
Step-Height
Nanospec
Microscope
Advantage
Fully automatic measurement .
Non-Contact / Non-Damage wafer measurements.
Constancy result without human error.
In-Line Metrology can speed-Up WIP.
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General Plating Application
- Real wafer Cu height with film(P-CE5000) index value
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Handling Options
• Cluster-based configuration
300mm Handler
• Handler provides wafer flow, scheduling,
process program definitions, interface to
host.
Wafer Inverter Module
• Multiple handler types available
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Ultra Thin Wafer Handler
NSX with SWS handler
200/300mm whole wafer handler
50/50 whole wafer and film frame
Small Wafer Station (SWS)
Ultra Thin wafer handler (75um)
Summary
• The Dragonfly G2 System delivers superior throughput and sensitivity
and combines the industry differentiating Clearfind inspection
capability to deliver a total defect solution for all process areas
− Multi-mode illumination with simultaneous BF, DF, HARL or Clearfind
− TrueBump High-speed 3D sensor for 100% bump height measurements with the
fastest time to solution and most accurate die disposition capability
− VTSS, WTS and IR camera capabilities combine provide a complete picture of
the process in a single platform
− Improved CoO and CoC
• Dragonfly G2 and Clearfind Technology provide the following benefits
− 100% inspection for critical defects in AP applications such as RDL bridging,
break, and residue
− The only non-visual defect inspection system for organic residue
− Wide application space provides robust detection across the process from wafer
level to package with traceability
− Process Control and feedback in addition to traditional AOI only defect inspection
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Thank You!
info@rudolphtech.com
www.rudolphtech.com
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