Electronics Subsystem Breakdown – Potential Structure
March 2025
Subsystem Breakdown
Harness
es
LV
HV
EMS Assembly
HV
LV
Sensor
s
- Mechanical
components (molding
casting, machining, insert
molding etc. capabilities)
- EMS sub assemblies
- PCBA (SMT expertise, vacuum
reflow, IPC 610 knowledge)
Current Scope
Potential Scope
- HV Battery pack
- ADAS
- MCU / ECU
- Cameras
- Sensors
- Radars
- Passive entry
- Displays
- Switches
- EDS
- Zonals
- Antennas
- Audio – speakers,
mics
- Accessories
- ASIC (OSAT and packaging
knowledge)
2
SIT Breakdown
SIT
SIT Lead
TPM
SIT 1: Interior
Harold Meija Ruiz
Christian Moreno
SIT 2: Seats
Sandeep Khengare
Abhaya Kulkarni
SIT 3: Exterior
Zuguang Chen
Roger Olle
SIT 4: Thermal
Nicholas Mancini
SIT 5: Powertrain
Jacob Kononiuk
Summer Jimenez
SIT 6: Chassis
Andrew Reimer
Aaron Wilkinson
SIT 7: Closures
Nermin Mujcinovic
Kevin Erickson
SIT 8: Electrical
Anthony Sansone
George John
SIT 9: Body
Vladimir Bogachuck
Edward Righetti
https://www.eesewiki.ford.com/pages/viewpag
e.action?pageId=1299841942
DIE Responsibilities
• Concept Stage (Design enablers)
• Collaborate with Design Engineering / ODM (full service suppliers) on DfM and DfA to ensure
part designs launch with • Quality focus – ramp to 98% FPY before safe launch
• Quality focus – zero defect escapes to GA
• Cost focus – BOM cost and assembly cost reduction
• Sourcing Stage
• Approve process concepts and equipment with suppliers • Quality focus – machine design and controls to reduce risk
• Cost focus – expertise with automation vendors and line design in a Capex GSM capacity to reduce
should cost
• Decision maker and stakeholder for sourcing decision based on
• Supplier preliminary audits
• Determining global sourcing strategy for EMS assembly down to Tier-X in conjunction with GSM
• Line Qualification Stage
• Guide the supplier through FAT (Factory Acceptance Testing), SAT (Site Acceptance Testing) and OK2Ship
readiness
• Production Stage
• Ramp up to 98% FPY and hand off to STA for sustaining qualification and operational activities
R&R Matrix
Milestone / Requirement
DIE Deliverable
Design Concept Verification
Involvement in DFx and design
of V&V plan to reduce design
release L/T.
Defined development timeline
with industrialization
milestones
RFQ/RFI
Lead technical sourcing
activities:
- Design DFx
- Process concept / machine
design approval
- Equipment list approval
- Supplier technical
assessment
Launch (DCV / TT / PP)
Part qualification
Post Launch / Mass Production
STA Deliverable
None
Schedule A (currently)
Surveillance audits
Yield reviews
Production planning
SCARs
jiRA FIEDLS
Workflow
1. Design concept – DfM
2. Design freeze
3. RFQ
4. DfX and equipment list approval
5. Sourcing approval
6. Business award
7. Line commission
8. Line qualification
9. Ramp
10.Steady rate. OK2SafeLaunch