AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
Component Technical Committee
AEC - Q100-001 - REV-C
October 8, 1998
Auto 动机电子 C
组件技术委员会
理事会
ATTACHMENT 1
ATTACHMENT 1
AEC - Q100-001 REV-C
AEC‑Q100‑001 REV‑C
WIRE BOND SHEAR TEST
线键合剪切测试
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
组件技术委员会汽车电子委员会
Component Technical Committee
致谢
Acknowledgment
Any document involving a complex technology brings together experience and skills from many sources. The
Automotive Electronics Counsel would especially like to recognize the following significant contributors to the
development of this document:
James T. Peace
Robert V. Knoell
Gerald E. Servais
Mark A. Kelly
DaimlerChrysler
Visteon Corporation
Delphi Delco Electronics Systems - Retired
Delphi Delco Electronics Systems
任何涉及复杂技术的文档都汇集了来自多方面的经验和技能。汽车电子委员会特别要感谢以下对本文件开发做
出重大贡献的人士：
詹姆斯 ·T· 皮斯 戴姆勒克莱斯勒 罗伯特 ·V· 克诺尔 伟世通公司 杰拉
尔德 ·E· 塞尔维斯 德尔福德尔科电子系统 ‑ 已退休 马克 ·A· 凯利 德
尔福德尔科电子系统
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
汽车电子委员会
月8日
组件技术委员会
Component Technical Committee
Change Notification
Change Notification
以下摘要详述了 AEC‑Q100‑001 Rev‑C 版本中所纳入的变更：
The following summary details the changes incorporated into AEC-Q100-001 Rev-C:
•
第 1.3.4.4 节，类型 4 ‑ 模具表面接触：修正了措辞以反映剪切工具与模具表面接触时的键合
Section 1.3.4.4, Type 4 - Die Surface Contact: Corrected wording to reflect bond shear
type where the shear tool contacts the die surface, rather than the bonding surface as
stated in Rev - B.
•
•
Added new Section 1.3.5, Footprint: Added new definition for “footprint”; changed
numbers of subsequent sections to reflect the addition.
•
新增第 1.3.5 节 “ 足迹 ”：新增 “ 足迹 ” 定义；调整后续章节编号以反映此次新增内容。
•
Section 3.6 step b, Footprint Inspection of Aluminum Wedge/Stitch Bonds: Added
wording to clarify method used to remove wire for footprint inspection.
•
第 3.6 节步骤 b，铝楔 / 缝合键合的焊点检查：增加措辞以明确用于移除导线进行焊点检查的方法。
•
Figure 3, Wire Bond Shear Types: Updated figure to reflect wording correction made to
Type 4 - Die Surface Contact.
•
图 3，线键合剪切类型：更新图表以体现对类型 4‑ 芯片表面接触的措辞修正。
•
Minor wording changes were made to the following: Section 1.1, 1.3.1, 1.3.4.1, 1.3.4.5, 2.2,
2.5, 3.2, and 3.5.
•
对以下部分进行了细微的措辞修改：第 1.1 节、 1.3.1 节、 1.3.4.1 节、 1.3.4.5 节、 2.2 节、 2.5 节、 3.2 节和 3.5 节。
剪切类型，而非如 Rev ‑ B 中所述的键合表面。
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
汽车电子委员会
组件技术委员会
Component Technical Committee
方法 ‑ 001
METHOD - 001
WIRE BOND SHEAR TEST
WIRE BOND SHEAR TEST
自本文件上一版修订以来所做的文本改进和差异均以下划线区域标示。部分图表也
Text enhancements and differences made since the last revision of this
document are shown as underlined areas. Several figures have also been
revised, but changes to these areas have not been underlined.
已修订，但这些区域的更改未加下划线。
1.
SCOPE
1. 范围
1.1
Description
1.1 描述
This test establishes a procedure for determining the strength of the interface between a gold ball bond
and a package bonding surface, or an aluminum wedge/stitch bond and a package bonding surface, on
either pre-encapsulation or post-encapsulation devices. This strength measurement is extremely
important in determining two features:
1.2
1)
the integrity of the metallurgical bond which has been formed.
2)
the reliability of gold and aluminum wire bonds to die or package bonding surfaces.
1) 已形成的冶金结合的完整性。2) 金线和铝线键合到芯片或封装键合表面的可靠性。
该测试方法仅适用于以下情况：球键合的球高度和直径，或楔形 / 缝合键合的线高度（压缩键合区域
The wire bond shear test is destructive. It is appropriate for use in process development, process
monitoring, and/or quality assurance.
引线键合剪切测试是破坏性的。它适用于工艺开发、工艺监控和 / 或质量保证。
为 1.25 密耳及以上）足够大，且相邻干扰结构距离足够远，以便在进行线键合剪切测试时能够实现适
当的放置和间隙（例如，键合表面上方及相邻键合之间）。
1.2 参考文件
Reference Documents
不适用
1.3 术语和定义
Terms and Definitions
The terms and definitions shall be in accordance with the following sections.
1.3.1
间的界面强度，适用于封装前或封装后的器件。此项强度测量对于确定以下两个特性至关重要：
This test method can be used only when the ball height and diameter for ball bonds, or the wire height
(1.25 mils and larger at the compressed bond area) for wedge/stitch bonds, are large enough and
adjacent interfering structures are far enough away to allow suitable placement and clearance (e.g.,
above the bonding surface and between adjacent bonds) when performing the wire bond shear test.
Not Applicable
1.3
本测试旨在建立一种程序，用于测定金球键合与封装键合面之间，或铝楔形 / 缝合键合与封装键合面之
术语和定义应符合以下部分的规定。
1.3.1 球焊
Ball Bond
The welding of a thin wire, usually gold, to a die bonding surface, usually an aluminum alloy bond pad,
using a thermal compression or thermosonic wire bonding process. The ball bond includes the enlarged
spherical portion of the wire (sometimes referred to as the nail head and formed by the flame-off and first
bonding operation in thermal compression and thermosonic process), the underlying bonding surface,
and the intermetallic weld interface. For the purposes of this document, all references to ball bonds are
applicable to gold ball bonds on die bonding surfaces; other ball bond material combinations may
require a new set of failure criteria (see section 4.1).
Page 1 of 11
将细线（通常为金线）通过热压或热声焊线工艺焊接到芯片键合表面（通常为铝合金键合垫）上。球焊点
包括导线的扩大球形部分（有时称为钉头，由热压和热声工艺中的火焰切断和第一次键合操作形成）、下
方的键合表面以及金属间焊接界面。在本文件中，所有关于球焊点的描述均适用于芯片键合表面上的金球
焊点；其他材料的球焊点组合可能需要一套新的失效标准（见第 4.1 节）。
第 1 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
汽车电子委员会
组件技术委员会
Component Technical Committee
1.3.2
1.3.2 粘接表面
Bonding Surface
1) 芯片表面（如芯片焊盘）或 2) 封装键合表面（如镀银引线框架柱或指状端子、基岛或焊盘上的引线下键合等），其上通过球焊、楔焊或针脚键
Either 1) the die surface (e.g., die bond pad) or 2) the package bonding surface (e.g., plated leadframe
post or finger, downbond to the flag or paddle, etc.) to which the wire is ball, wedge, or stitch bonded.
1.3.3
合方式连接导线。
1.3.3 键合剪切
Bond Shear
一种工艺，其中仪器使用凿形工具剪切或推动球状或楔形 / 缝合键合脱离键合表面（见图 1 ）。导致这种
A process in which an instrument uses a chisel shaped tool to shear or push a ball or wedge/stitch
bond off the bonding surface (see Figure 1). The force required to cause this separation is recorded and
is referred to as the bond shear strength. The bond shear strength of a gold ball bond, when correlated
to the diameter of the ball bond, is an indicator of the quality of the metallurgical bond between the gold
ball bond and the die bonding surface metallization. The bond shear strength of an aluminum
wedge/stitch bond, when compared to the manufacturer’s bond wire tensile strength, is an indicator of
the integrity of the weld between the aluminum wire and the die or package bonding surface.
Bond Weld Area
Bonding
Surface
C
L
分离所需的力被记录并称为键合剪切强度。金球键合的剪切强度与球键直径相关联时，可作为金球键合
与芯片键合表面金属化之间冶金键合质量的指标。铝楔形 / 缝合键合的剪切强度与制造商提供的键合线抗
拉强度相比较时，可作为铝线与芯片或封装键合表面之间焊接完整性的指标。
Bond Weld Area
Shear
Tool
Bond
Bonding
Surface
h
Specimen Clamp
h
Specimen Clamp
图 1：粘接剪切装置设置
Figure 1: Bond Shear set-up
Definition of Bond Shear Types for Ball and Wedge/Stitch Bonds (see Figure 3)
Bond
Test Specimen
Test Specimen
1.3.4
C
L
Shear
Tool
1.3.4
Definition of Bond Shear Types for Ball and Wedge/Stitch Bonds (see Figure 3)
1.3.4.1 类型 1 ‑ 债券提升
1.3.4.1 Type 1 - Bond Lift
A separation of the entire wire bond from the bonding surface with only an imprint being left on the
bonding surface. There is very little evidence of intermetallic formation or welding to the bonding surface
metallization.
整个线键合从键合表面完全分离，仅在键合表面留下压痕。几乎没有证据显示与键合表面金属化层形成金
属间化合物或焊接。
1.3.4.2 类型 2 ‑ 键合剪切
1.3.4.2 Type 2 - Bond Shear
A separation of the wire bond where: 1) A thin layer of bonding surface metallization remains with the
wire bond and an impression is left in the bonding surface, or 2) Intermetallics remain on the bonding
surface and with the wire bond, or 3) A major portion of the wire bond remains on the bonding surface.
Page 2 of 11
导线键合分离的情况包括：1) 键合表面金属化薄层仍附着于导线键合处，并在键合表面留下压痕；或 2)
金属间化合物残留于键合表面及导线键合处；或 3) 导线键合的主要部分仍保留在键合表面上。
第 2 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
汽车电子委员会
组件技术委员会
Component Technical Committee
1.3.4.3 类型 3 ‑ 坑洞形成
1.3.4.3 Type 3 - Cratering
A condition under the bonding surface metallization in which the insulating layer (oxide or interlayer
dielectric) and the bulk material (silicon) separate or chip out. Separation interfaces which show pits or
depressions in the insulating layer (not extending into the bulk) are not considered craters. It should be
noted that cratering can be caused by several factors including the wire bonding operation, the postbonding processing, and even the act of wire bond shear testing itself. Cratering present prior to the
shear test operation is unacceptable.
The shear tool contacts the die surface and produces an invalid shear value. This condition may be due
to improper placement of the specimen, a die surface not parallel to the shearing plane, a low shear
height, or instrument malfunction. This bond shear type is not acceptable and shall be eliminated from
the shear data.
The shear tool removes only the topmost portion of the ball or wedge/stitch bond. This condition may be
due to improper placement of the specimen, a die surface not parallel to the shearing plane, a high shear
height, or instrument malfunction. This bond shear type is not acceptable and shall be eliminated from the
shear data.
已存在的弹坑缺陷是不可接受的。
剪切工具与模具表面接触并产生无效剪切值。此情况可能是由于试样放置不当、模具表面与剪切面不平
行、剪切高度过低或仪器故障所致。此类粘结剪切类型不可接受，应从剪切数据中剔除。
剪切工具仅移除了球状或楔形 / 缝合键合的最顶部部分。这种情况可能是由于样品放置不当、模具表面与剪
切平面不平行、剪切高度过高或仪器故障所致。此类键合剪切类型不可接受，应从剪切数据中剔除。
1.3.4.6 类型 6 ‑ 粘接表面提升
1.3.4.6 Type 6 - Bonding Surface Lift
A separation between the bonding surface metallization and the underlying substrate or bulk material.
There is evidence of bonding surface metallization remaining attached to the ball or wedge/stitch bond.
键合表面金属化层与下方基板或主体材料之间的分离。有证据显示键合表面金属化层仍附着在球键或楔形 / 针脚键合上。
1.3.5 足迹
Footprint
An impression of the compressed wedge/stitch bond area created in the bonding surface during the
ultrasonic wire bonding process. The bond footprint area is normally larger than the actual metallurgical
weld interface.
超声波线键合过程中在键合表面形成的压缩楔形 / 针脚键合区域的印痕。键合足迹区域通常大于实际的冶
金焊接界面。
1.3.6 剪切工具或臂
Shear Tool or Arm
A tungsten carbide, or equivalent, chisel with specific angles on the bottom and back of the tool to
insure a shearing action.
1.3.7
多种因素引发，包括引线键合操作、键合后处理工序，甚至引线键合剪切测试本身的操作。剪切测试前
1.3.4.5 类型 5 ‑ 剪切跳过
1.3.4.5 Type 5 - Shearing Skip
1.3.6
若分离界面仅显示绝缘层存在凹坑或凹陷（未延伸至基体），则不视为弹坑。需注意，弹坑现象可能由
1.3.4.4 类型 4 ‑ 模具表面接触
1.3.4.4 Type 4 - Die Surface Contact
1.3.5
键合表面金属化层下的一种状况，即绝缘层（氧化物或层间介质）与基体材料（硅）发生分离或剥落。
一种碳化钨或等效材料的凿子，其底部和背面具有特定角度，以确保剪切作用。
1.3.7 楔形 / 缝合键合
Wedge/Stitch Bond
The welding of a thin wire, usually aluminum, to a die or package bonding surface using an ultrasonic
wire bonding process. The wedge bond, sometimes referred to as a stitch bond, includes the
compressed (ultrasonically bonded) area of the bond wire and the underlying bonding surface. When
wedge/stitch bonding to an aluminum alloy bonding surface, no intermetallic exists because the two
materials are of the same composition; but rather the two materials are combined and recrystallized by
the ultrasonic energy of the welding process. For the purposes of this document, all references to
wedge/stitch bonds are applicable to aluminum wedge/stitch bonds only; gold wedge/stitch bonds are
not required to be wire bond shear tested.
Page 3 of 11
将细金属线（通常为铝线）通过超声波线焊接工艺焊接到芯片或封装基板的键合表面。楔形焊点（有时
称为缝合焊点）包括键合线的压缩（超声波焊接）区域及下方的键合表面。当在铝合金键合表面进行楔
形 / 缝合焊接时，由于两种材料成分相同，不会形成金属间化合物，而是通过焊接过程中的超声波能量
使两种材料融合并重结晶。本文档中所有关于楔形 / 缝合焊点的内容仅适用于铝楔形 / 缝合焊点；金楔
形 / 缝合焊点无需进行线焊剪切测试。
第 3 页，共 11 页
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
AEC - Q100-001 - REV-C
October 8, 1998
月8日
汽车电子委员会
组件技术委员会
Automotive Electronics Council
Component Technical Committee
2.
APPARATUS AND MATERIAL
2.
The apparatus and materials required for wire bond shear testing shall be as follows:
The apparatus and materials required for wire bond shear testing shall be as follows:
2.1
2.1 检测设备
Inspection Equipment
一种光学显微镜系统或扫描电子显微镜，提供至少 30 倍的放大倍率。
An optical microscope system or scanning electron microscope providing a minimum of 30X
magnification.
2.2
2.2 测量设备
Measurement Equipment
一种能够测量线键合直径至 ±0.1 密耳以内的光学显微镜或测量系统。
An optical microscope or measurement system capable of measuring the wire bond diameter to within ±
0.1 mil.
2.3
2.3 工件夹具
Workholder
用于固定被测装置的夹具，使其与剪切平面平行且与剪切工具垂直。该夹具还应在引线键合剪切测试过
Fixture used to hold the device being tested parallel to the shearing plane and perpendicular to the
shear tool. The fixture shall also eliminate device movement during wire bond shear testing. If using a
caliper controlled workholder, place the holder so that the shear motion is against the positive stop of
the caliper. This is to insure that the recoil movement of the caliper controlled workholder does not
influence the wire bond shear test.
2.4
程中消除装置移动。若使用卡尺控制的工作夹具，应将夹具放置使剪切运动朝向卡尺的正向止挡，以确
保卡尺控制的工作夹具的回弹运动不会影响引线键合剪切测试。
2.4
Wire Bond Shear Equipment
Wire Bond Shear Equipment
线键合剪切设备必须能够将剪切工具精确放置在键合面最高点上方约 0.1 密耳处。该距离 (h) 应确保剪切
The wire bond shear equipment must be capable of precision placement of the shear tool approximately
0.1 mil above the topmost part of the bonding surface. This distance (h) shall insure the shear tool does
not contact the die or package bonding surface and shall be less than the distance from the topmost
part of the bonding surface to the center line (CL) of the ball or wedge/stitch bond.
2.5
装置与材料
工具不会接触芯片或封装键合面，且必须小于从键合面最高点到球键或楔形 / 针脚键中心线 (CL) 的距离。
2.5 邦德剪切工具
Bond Shear Tool
所需的剪切工具参数包括但不限于：平整的剪切面、锋利的剪切边缘以及 1.5 至 2 倍（ 1.5X 至 2X ）键
Required shear tool parameters include but are not limited to: flat shear face, sharp shearing edge, and
shearing width of 1.5 to 2 times (1.5X to 2X) the bond diameter or bond length. The shear tool should be
designed to prevent plowing and drag during wire bond shear testing. The shear tool should be clean
and free of chips (or other defects) that may interfere with the wire bond shear test.
合直径或键合长度的剪切宽度。剪切工具的设计应防止在引线键合剪切测试过程中出现犁沟和拖拽现象。
剪切工具应保持清洁，无可能干扰引线键合剪切测试的碎屑（或其他缺陷）。
3.
PROCEDURE
3. 程序
3.1
Calibration
3.1 校准
Before performing the wire bond shear test, it must be determined that the equipment has been
calibrated in accordance with the manufacturer's specifications and is presently in calibration.
Recalibration is required if the equipment is moved to another location.
Page 4 of 11
在进行线键合剪切测试前，必须确认设备已根据制造商规格完成校准且当前处于校准有效期内。
若设备移至其他位置，则需重新校准。
第 4 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
汽车电子委员会
组件技术委员会
Component Technical Committee
3.2
3.2 开封后待进行剪切测试的焊线目视检查
Visual Examination of Wire Bonds to be Shear Tested After Decapsulation
Before performing wire bond shear testing on a device which has been opened using wet chemical
and/or dry etch techniques, the bonding surfaces shall be examined to insure there is no absence of
metallization on the bonding surface area due to chemical etching. Ball or wedge/stitch bonds on
bonding surfaces with evidence of degradation from chemical attack or absence of metallization shall
not be used for wire bond shear testing. Wire bonds on bonding surfaces without degradation from
chemical attack may not be attached to the bonding surface due to other causes (e.g., package
stress). These wire bonds are considered valid and shall be included in the shear data as a zero (0)
gram value. Wire bonds must also be examined to ensure adjacent interfering structures are far enough
away to allow suitable placement and clearance (above the bonding surface and between adjacent wire
bonds) when performing the wire bond shear test.
3.3
Measurement of the Ball Bond Diameter to Determine the Ball Bond Failure Criteria
Once the bonding surfaces have been examined and prior to performing wire bond shear testing, the
diameter of all ball bonds (from at least one representative sample to be tested) shall be measured and
recorded. For asymmetrical ball bonds, determine the average using both the largest (d large) and the
smallest diameter (d small) values (see Figure 2). These ball bond diameter measurements shall be
used to determine the mean, or average, diameter value. The resulting mean, or average, ball bond
diameter shall then be used to establish the failure criteria as defined in section 4.1. If process-monitor
data has established the nominal ball bond diameter, then that value may be used to determine the
failure criteria as defined in section 4.1.
SYMMETRICAL
ASYMMETRICAL
在进行湿法化学和 / 或干法蚀刻技术开封后的器件上执行线键合剪切测试前，应检查键合表面以确保化学
蚀刻未导致键合区域金属化层缺失。对于键合表面存在化学侵蚀退化迹象或金属化层缺失的球键或楔形 /
缝合键，不得用于线键合剪切测试。键合表面未受化学侵蚀退化的线键可能因其他原因（如封装应力）未
与键合表面牢固附着，此类线键视为有效并应以零（ 0 ）克值纳入剪切数据。执行线键剪切测试时，还
需检查线键以确保相邻干扰结构距离足够，从而在测试过程中为键合表面上方及相邻线键之间提供适当的
放置空间和间隙。
3.3 球键合直径测量以确定球键合失效标准
一旦检查完接合表面并在进行线键合剪切测试之前，应测量所有球键合点的直径（至少从一个待测试的代表性样品中）
记录。对于非对称球键合，使用最大（ d large) and the 和最小直径计算平均值。
最小直径（ d small) values (see Figure 2). These ball bond diameter measurements shall be 用于确定
平均直径值。得出的平均球焊直径随后应用于建立如第 4.1 节定义的失效标准。若过程监控数据已确定
标称球焊直径，则该值可用于确定如第 4.1 节定义的失效标准。
SYMMETRICAL
ASYMMETRICAL
dsmall
dlarge
d
Figure 2: Ball bond diameter measurement (symmetrical vs. asymmetrical)
Page 5 of 11
dsmall
dlarge
d
图 2：球键合直径测量（对称与非对称对比）
第 5 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
汽车电子委员会
组件技术委员会
Component Technical Committee
3.4
The wire bond shear testing procedure shall be performed as follows:
The wire bond shear testing procedure shall be performed as follows:
a.
a. 线焊剪切设备在进行线焊剪切测试前，必须通过所有自诊断检测。 b. 线焊剪切设备及测试区域应无过
b.
c.
d.
3.5
3.4 线键合剪切测试程序
Wire Bond Shear Test Procedure
The wire bond shear equipment shall pass all self diagnostic tests prior to performing the wire
bond shear test.
The wire bond shear equipment and test area shall be free of excessive vibration or movement.
Examine the shear tool to verify it is in good condition and is not bent or damaged. Check the
shear tool to verify it is in the up position.
Adjust the workholder to match the device being tested. Secure the device to the workholder.
Make sure the die or package bonding surface is parallel to the shearing plane of the shear tool.
It is important that the shear tool does not contact the bonding surface or adjacent structures
during the shearing operation as this will give incorrect high readings.
Position the device so that the wire bond to be tested is located adjacent to the shear tool.
Lower the shear tool (or raise the device depending upon wire bond shear equipment used) to
approximately the die or package bonding surface but not contacting the surface (approximately
the thickness of the wire bond above the die or package bonding surface).
e.
For ball bond shear testing, position the ball bond to be tested so that the shear motion will
travel perpendicular to the die edge. Wire bond shear testing is required for ball bonds located
at the die bonding surface interface only.
f.
For aluminum wedge/stitch bond shear testing, a wire height at the compressed bond area of
1.25 mils and larger is required. For wires too small for wire bond shear testing (less than 1.25
mils in height at the compressed bond area), only a footprint inspection is required (see section
3.6). Position the wedge/stitch bond to be tested so that the shear motion will travel toward the
long side of the wedge/stitch bond and is free of any interference (i.e. shear the outside
wedge/stitch bond first and then shear toward the previously sheared wedge/stitch bond). Wire
bond shear testing is required for aluminum wedge/stitch bonds located at die and package
bonding surfaces; gold wedge/stitch bonds are not required to be wire bond shear tested.
g.
Position the shear tool a distance of approximately one ball bond diameter (or one aluminum
wire diameter for wedge/stitch bonds) from the wire bond to be shear tested and shear the wire
bond.
Examination of Sheared Wire Bonds
度振动或移动。检查剪切工具，确认其状态良好，无弯曲或损坏。确保剪切工具处于上升位置。 c. 调整
工件夹具以适配待测器件，并将器件牢固固定于夹具上。确保芯片或封装焊接表面与剪切工具的剪切平面
平行。关键注意：剪切过程中剪切工具不得接触焊接表面或邻近结构，否则会导致错误的高读数。 d. 定
位器件，使待测线焊位于剪切工具邻近位置。降低剪切工具（或根据设备类型抬升器件）至接近芯片或封
装焊接表面但不接触（约保持线焊厚度的高度）。 e. 球焊点剪切测试时，定位待测球焊点使剪切方向垂
直于芯片边缘。仅对位于芯片焊接界面处的球焊点需进行线焊剪切测试。 f. 铝楔形 / 针脚焊点剪切测试
要求压缩焊点区域的线高 ≥1.25 密耳。对于线高不足 1.25 密耳的焊点（压缩区域），仅需进行焊痕检查
（见第 3.6 节）。定位待测楔形 / 针脚焊点时，应使剪切方向朝向焊点长边且无任何干涉（即先剪切外侧
焊点，再向已剪切焊点方向推进）。铝楔形 / 针脚焊点位于芯片或封装焊接表面时需进行剪切测试，金质
楔形 / 针脚焊点无需测试。 g. 将剪切工具定位在距待测线焊约一个球焊直径（楔形 / 针脚焊点为一个铝
线直径）的距离处，实施剪切。
3.5 剪切线键合检查
All wire bonds shall be sheared in a planned/defined sequence so that later visual examination can
determine which shear values should be eliminated due to an improper shear. The wire bonds shall be
examined using at least 30X magnification to determine if the shear tool skipped over the wire bond
(type 5) or the shear tool scraped or plowed into the die surface (type 4). See Figure 3 for bond shear
types and illustrations.
所有线键合应按预定 / 定义的顺序进行剪切，以便后续目视检查能确定哪些剪切值因剪切不当而应被剔
Readings in which either a bond shear type 4 or 5 defective shear condition occurred shall be eliminated
from the shear data. Bond shear type 1, 2, 3, and 6 shall be considered acceptable and included in the
shear data.
读数中若出现键合剪切类型 4 或 5 的缺陷剪切情况，应从剪切数据中剔除。键合剪切类型 1 、 2 、 3 和
Page 6 of 11
除。检查线键合时需使用至少 30 倍放大倍率，以判断剪切工具是否跳过线键合（类型 5 ）或剪切工具
刮擦或犁入芯片表面（类型 4 ）。有关键合剪切类型及图示，请参见图 3。
6 应视为合格并纳入剪切数据。
第 6 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
汽车电子委员会
组件技术委员会
Component Technical Committee
Sheared wire bonds in which a bond shear type 3 cratering condition has occurred shall be investigated
further to determine whether the cracking and/or cratering is due to the wire bonding process or the act
of wire bond shear testing. Cratering caused prior to the wire bond shear test operation is
unacceptable. Cratering resulting from the act of wire bond shear testing shall be considered
acceptable and included in the shear data.
3.6
Footprint Inspection of Aluminum Wedge/Stitch Bonds
a.
b.
c.
3.7
All aluminum wire bonding processes to both die and package bonding surfaces shall have a
bond footprint inspection performed.
For wires too small for wire bond shear testing (less than 1.25 mils in height at the compressed
bond area), the wires shall be removed at the wedge/stitch bond location using a small sharp
blade to peel or pluck the wire bond from the bonding surface. The removal of the aluminum
wire shall be sufficient such that the wire bond interface can be visually inspected and the
metallurgical wire bond area determined.
4.2
可接受并纳入剪切数据。
3.6 铝楔 / 缝合键合焊点形貌检查
a. 所有对芯片和封装键合面进行的铝线键合工艺均需实施键合印迹检查。 b. 对于因尺寸过小无法进行键
合剪切测试的线材（压缩键合区域高度小于 1.25 密耳），应使用锋利小刀在楔形 / 缝合键合位置移除线
材，通过剥离或⾋除方式使键合面暴露。铝线移除程度需确保可目视检查键合界面，并能判定金属键合
区域。 c. 对于较粗线材（压缩键合区域高度大于 1.25 密耳），应在键合剪切测试后检查线材，分析失
效模式并确定楔形 / 缝合键合的印迹覆盖情况。
3.7 键合剪切数据
Bond Shear Data
应记录每根焊线剪切的数据。数据需标明焊线信息（位置、球焊点和 / 或线径、线材、焊接方法及焊
接材料）、剪切强度以及焊线剪切类型（定义见 1.3.4 节和图 3 ）。
4. 失效准则
FAILURE CRITERIA
The following failure criteria are not valid for devices that have undergone environmental stress testing or
have been desoldered from circuit boards.
4.1
剪切测试行为所致。焊线剪切测试操作前产生的坑裂不可接受。由焊线剪切测试行为导致的坑裂应视为
For larger wires (greater than 1.25 mils in height at the compressed bond area), the wires shall
be inspected after wire bond shear testing to examine the failure mode and to determine the
wedge/stitch bond footprint coverage.
Data shall be maintained for each wire bond sheared. The data shall identify the wire bond (location,
ball bond and/or wire diameter, wire material, method of bonding, and material bonded to), the shear
strength, and the bond shear type (as defined in section 1.3.4 and Figure 3).
4.
已发生 3 型焊点剪切坑裂情况的剪断焊线需进一步调查，以确定裂纹和 / 或坑裂是由焊线工艺还是焊线
Failure Criteria for Gold Ball Bonds
以下失效标准不适用于经过环境应力测试或已从电路板上拆焊的设备。
4.1 金球键合失效标准
The gold ball bonds on a device shall be considered acceptable if the minimum individual and sample
average ball bond shear values are greater than or equal to the values specified in Figure 4 and Table 1.
This criteria is applicable for gold wire ball bonds on aluminum alloy bonding surfaces. Other material
combinations may require a new set of failure criteria.
如果单个最小值和样本平均金球键合剪切值大于或等于图 4 和表 1 中规定的值，则设备上的金球键合应视为可接受。
Alternate minimum ball bond shear values may be proposed by the supplier if supporting data justifies
the proposed minimum values.
供应商可提出替代的最小球键合剪切值，但需有支持数据证明所提议的最小值是合理的。
Failure Criteria for Aluminum Wedge/Stitch Bonds
该标准适用于铝合金键合面上的金线球键合。其他材料组合可能需要一套新的失效标准。
.
4.2 铝楔 / 缝合粘接失效准则
The aluminum wedge/stitch bonds on a device shall be considered acceptable if the minimum shear
values are greater than or equal to the manufacturer’s bond wire tensile strength.
如果最小剪切值大于或等于制造商键合线的抗拉强度，则器件上的铝楔 / 缝合键合应视为可接受。
In addition, the percent of the wedge/stitch bond footprint in which bonding occurs shall be greater than
or equal to 50%. If it is necessary to control the wire bonding process using SPC for percent coverage,
a Cpk value can be calculated to this limit.
此外，楔形 / 针脚键合区域中发生键合的比例应大于或等于 50%。若需通过统计过程控制（ SPC ）来监
Page 7 of 11
控键合覆盖率，可针对此限值计算 Cpk 数值。
第 7 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC - Q100-001 - REV-C
October 8, 1998
汽车电子委员会
组件技术委员会
Component Technical Committee
Major portion of wire bond
attached to wire.
Wire bond separated from bonding
surface. Little or NO intermetallic
on bonding surface.
Ball or Wedge bonding
weld area intact.
Ball or Wedge bonding
weld area intact.
Bonding surface
intact.
Bonding surface
intact.
TYPE 1: Bond Lift
Major portion of wire bond
attached to wire.
Wire bond separated from bonding
surface. Little or NO intermetallic
on bonding surface.
TYPE 2: Bond Shear - Gold/Aluminum
Residual bonding surface and
substrate (bulk) material
attached to wire bond.
类型 1：邦德提升
TYPE 2: 键合剪切 ‑ 金 / 铝
Residual bonding surface and
substrate (bulk) material
attached to wire bond.
Arm contacted die surface
instead of wire bond.
Bonding surface lifted taking
portion of substrate (bulk) material.
手臂接触了模具表面而非线焊点。
Bonding surface lifted taking
portion of substrate (bulk) material.
Bonding surface separated
from die surface.
Bonding surface separated
from die surface.
TYPE 4: Die Surface Contact
TYPE 3: Cratering
Minor portion of wire bond
attached to wire.
Minor portion of wire bond
attached to wire.
Bonding surface metallization
separated from die surface.
Wire bond sheared too
high. Only portion of
wire bond removed.
TYPE 6: Bonding Surface Lift
TYPE 5: Shearing Skip
Figure 3: Wire Bond Shear Types *
* (Shear types are illustrated using ball bonds; these types also apply to wedge/stitch bonds)
Page 8 of 11
类型 4：模具表面接触
类型 3： 坑洞形成
Bonding surface metallization
separated from die surface.
Wire bond sheared too
high. Only portion of
wire bond removed.
TYPE 6：粘接表面提升
TYPE 5: 剪切跳跃
Figure 3: Wire Bond Shear Types *
* （剪切类型以球焊为例进行说明；这些类型同样适用于楔形 / 针脚焊接）
第 8 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC - Q100-001 - REV-C
October 8, 1998
汽车电子委员会
组件技术委员会
Component Technical Committee
最小剪力值
MINIMUM SHEAR VALUES
100
90
110
SHEAR STRENGTH (grams)
SHEAR STRENGTH (grams)
110
Minimum Sample Average
Minimum Individual Shear Reading
80
70
60
50
40
30
20
10
0
1.75
100
90
Minimum Sample Average
Minimum Individual Shear Reading
80
70
60
50
40
30
20
10
2.0
2.25
2.5
2.75
3.0
3.25
3.5
3.75
4.0
4.25
4.5
4.75
5.0
5.25
BALL BOND DIAMETER (mils)
Figure 4: Minimum acceptable individual and sample average ball bond shear values *, see Table 1
for exact ball bond shear values *
* (Shear values are applicable for gold wire ball bonds on aluminum alloy bonding surfaces)
Page 9 of 11
0
1.75
2.0
2.25
2.5
2.75
3.0
3.25
3.5
3.75
4.0
4.25
4.5
4.75
5.0
5.25
BALL BOND DIAMETER (mils)
Figure 4: Minimum acceptable individual and sample average ball bond shear values *, see Table 1
for exact ball bond shear values *
* （剪切值适用于金线球焊在铝合金键合表面的情况）
第 9 页，共 11 页
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
汽车电子委员会
组件技术委员会
Component Technical Committee
Table 1: Minimum acceptable individual and sample average ball bond shear values *
* (Shear values are applicable for gold wire ball bonds on aluminum alloy bonding surfaces)
表 1：最小可接受的单个及样本平均球键剪切力值 *
* （剪切值适用于金线球焊在铝合金键合表面的情况）
最低
样本平均值
(克)
最低个人额度
剪切读数
(克)
Ball Bond Diameter
(mils)
Minimum
Sample Average
(grams)
Minimum Individual
Shear Reading
(grams)
2.0
12.6
5.7
2.0
12.6
5.7
2.1
14.0
6.8
2.1
14.0
6.8
2.2
15.5
8.1
2.2
15.5
8.1
2.3
17.1
9.5
2.3
17.1
9.5
2.4
18.8
10.9
2.4
18.8
10.9
2.5
20.6
12.4
2.5
20.6
12.4
2.6
22.4
14.0
2.6
22.4
14.0
2.7
24.4
15.6
2.7
24.4
15.6
2.8
26.5
17.4
2.8
26.5
17.4
2.9
28.6
19.2
2.9
28.6
19.2
3.0
30.8
21.1
3.0
30.8
21.1
3.1
33.2
23.1
3.1
33.2
23.1
3.2
35.6
25.1
3.2
35.6
25.1
3.3
38.1
27.2
3.3
38.1
27.2
3.4
40.7
29.4
3.4
40.7
29.4
3.5
43.4
31.7
3.5
43.4
31.7
3.6
46.2
34.1
3.6
46.2
34.1
3.7
49.1
36.5
3.7
49.1
36.5
3.8
52.1
39.1
3.8
52.1
39.1
3.9
55.2
41.7
3.9
55.2
41.7
4.0
58.3
44.3
4.0
58.3
44.3
4.1
61.6
47.1
4.1
61.6
47.1
4.2
65.0
50.0
4.2
65.0
50.0
4.3
68.4
52.9
4.3
68.4
52.9
4.4
71.9
55.8
4.4
71.9
55.8
4.5
75.6
59.0
4.5
75.6
59.0
4.6
79.3
62.1
4.6
79.3
62.1
4.7
83.1
65.3
4.7
83.1
65.3
4.8
87.0
68.6
4.8
87.0
68.6
4.9
91.0
72.0
4.9
91.0
72.0
5.0
95.1
75.5
5.0
95.1
75.5
Page 10 of 11
球键合直径
( 密耳 )
Page 10 of 11
AEC - Q100-001 - REV-C
October 8, 1998
Automotive Electronics Council
AEC ‑ Q100‑001 ‑ REV‑C 1998 年 10
月8日
组件技术委员会汽车电子委员会
Component Technical Committee
Revision History
Revision History
变更日期
简要摘要列出受影响的部分
-
1994 年 6 月 9 日
初始发布。
Added copyright statement.
A
1995 年 5 月 19 日
添加了版权声明。
Sept. 6, 1996
Deleted old Sections 1.3.4, 1.3.5, 3.3, 3.9, and 5.0. Added new Sections
1.3.1, 1.3.2, 1.3.6, 3.4 (steps a through g), and 3.6 (steps a through c).
Revised the following: Sections 1.1, 1.2, 1.3.1, 1.3.2, 1.3.3, 1.3.4
(1.3.4.1 through 1.3.4.6), 1.3.5, 1.3.6, 2.1, 2.2, 2.4, 2.5, 3.1, 3.2, 3.3, 3.4
(a, b, c, d, e, f, and g), 3.5, 3.6 (a, b, and c), 3.7, 4.0, 4.1, and 4.2; Table
1; Figures 1, 3, and 4.
B
1996 年 9 月 6 日
删除了旧的 1.3.4 、 1.3.5 、 3.3 、 3.9 和 5.0 章节。新增了 Sectio
ns
1.3.1 、 1.3.2 、 1.3.6 、 3.4 （步骤 a 至 g ）以及 3.6 （步骤 a 至 c ）。
修订了以下部分：1.1 、 1.2 、 1.3.1 、 1.3.2 、 1.3.3 、 1.3.4 节
(1.3.4.1 至 1.3.4.6) 、 1.3.5 、 1.3.6 、 2.1 、 2.2 、 2.4 、 2.5 、 3.1 、 3.2 、 3.3 、 3 .4
(a, b, c, d, e, f 和 g), 3.5, 3.6 (a, b 和 c), 3.7, 4.0, 4.1, 和 4.2; Tab le
1 ；图 1 、 3 和 4。
Oct. 8, 1998
Added new Section 1.3.5. Revised the following: Sections 1.1, 1.3.1,
1.3.4.1, 1.3.4.4, 1.3.4.5, 2.2, 2.5, 3.2, 3.5, 3.6 (b), Figure 3.
C
1998 年 10 月 8
新增第 1.3.5 节。修订了以下部分：第 1.1 节、第 1.3.1 节，
Rev #
Date of change
Brief summary listing affected sections
-
June 9, 1994
Initial Release.
A
May 19, 1995
B
C
Page 11 of 11
修订号
日
1.3.4.1 、 1.3.4.4 、 1.3.4.5 、 2.2 、 2.5 、 3.2 、 3.5 、 3.6 (b) 、图 3
第 11 页，共 11 页