d=sqrt(D^2-(D-(2P/(HB)(pi)(D))) for indention. Diffusion:atomic motion..Activation-energy:reaction to
occur..shear modulous:slope of linear elastic..modulous of elasticity:stress/strain in elastic
region..yeildstrength:stress above plastic deformation..offset yield strength:0.2%
toughness:brittle..Resiliences:elastic..true stress:load/instantanous cross section area..crack propogates
through gains in transganular fracture..impact test is energy absorbed.. Fracture toughness:brittle
fracture..creep:progressive deform at elevated temp..Critical shear stress:min amoutn of force to initiat
slip..grain boundry:acts as barrier..Solid solutionstrengthening: alloy with solute atoms.
The driving force for recrystallization is the difference in internal energy between the strained and
unstrained material
The driving force for grain growth is the reduction in grain boundary energy
as the total grain boundary area decreases
Diffusion of carbon in iron – formation of steel
Diffusion of Phosphorus in silicon – N type semiconductor – used in transistors