10.1
Failed Die Identification
Every die on the wafer not passing Atmel test sequence is marked with inch.
The inch dot specification:
• Dot size: 200 µm
• Position: center of die
• Color: black
Figure 10-5. NOA2 Micromodule
9.5±0.03
4.75
+0.02
4.625
1.42±0.05
0.03 A B
1.42±0.05
31.83
25.565
21.815
∅ 2±0.05
Note 1
15.915
12.165
Dimensions in mm
6.265
B
technical drawings
according to DIN
specifications
X
2.515
0
1.585
A
2.375
2.375
Note 3
5.15±0.03
8-0.02
Note 4
Note 2
R1.5±0.03
0.09-0.01
R0.2 max.
0.03 B
0.03 A
0.38-0.04
8.1±0.03
Note 2
Note:
1. Reject hole by device testing
2. Punching cutline
recommendation for singulation
3. Total package thickness
excludes punching burr
4. Module dimension
after galvanic seperation
4.8±0.05
5.1±0.05
X5:1
R1.1±0.03 (4x)
Drawing refers to following types: Micromodule
Drawing-No.: 6.549-5034.01-4
5.06±0.03
Note 4
Issue: prel.; 25.09.02
Subcontractor: NedCard
30
T5557
4517J–RFID–03/06
T5557
Figure 10-6. Shipping Reel
41,4 to
max 43,0
Ø329,6
120˚ (3x)
Ø298,5
R1,14
2,3
Ø13
Ø171
Ø175
16,7
2
2,2
31
4517J–RFID–03/06