AGC Multi Material
Business and Product Update
March 2023
AGC Confidential
This presentation is confidential and not to be copied or shared
outside of your company.
AGC Confidential
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AGC Multi Material General
Division
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AGC Confidential
Corporate Profile
Company name
Established
Representative director
Paid-in capital
Consolidated net sales
Consolidated no. of employees
No. of consolidated subsidiaries
AGC Inc.
September 8, 1907
Yoshinori Hirai
¥90.9 billion*
¥1,412.3 billion*
55,999*
206 companies
*As of End-December
2021
World top share products
Float flat glass
Automotive glass
Fluoropolymer
resin ETFE
Fluoropolymer
resin for
on-site coatings
Cover glass for carmounted display
Ultra-thin sheet for Elec
device Soda lime glass
AGC Confidential
Business Overview
AGC Group
Glass
Electronics
Chemicals
Ceramics/Other
(50%)
(18%)
(30%)
(2%)
Flat Glass
-Float flat glass
-Figured glass
-Polished wired glass
-Low-E glass
-Decorative glass
-Fabricated glass for architectural use
（Heat Insulating/shielding glass,
Disaster-resistant/Security glass,
Fire-resistant glass, etc.)
Automotive Glass
-Tempered glass
-Laminated glass
Fluor chemicals
& specialty chemicals
Display
-LCD glass substrates
-Specialty glass for display applications
-Cover glass for car-mounted displays
-Display related materials
-Glass for solar power system
-Fabricated glass for
industrial use
Electronic Materials
-Ceramic products
-Logistics and financial
services, etc.
-Fluorinated resins
-Water and oil repellents
-Gases
-Solvents
-Pharmaceutical and agrochemical
intermediates and
active ingredients
-Iodine-related products
Chlor-alkali & urethane
-Semiconductor process materials
-Optoelectronics materials
-Lighting glass products
-Laboratory glass, etc.
-Vinyl chloride
-Vinyl chloride monomer
-Caustic soda
-Urethane
CCL
-High-speed Digital
-PTFE
-Hydrocarbon
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AGC Confidential
AGC Multi Material General Division
AGC Inc.
Building & Industrial
Glass Company
Technology
Development Gen. Div.
Automotive Company
Display Glass Gen. Div.
Electronics Company
Applied Glass Gen. Div.
AGC Multi Material
America
Chemicals Company
Electronics Materials
Gen. Div.
AGC Multi Material
Singapore
AGC Ceramics
Multi Material Gen. Div.
AGC Multi Material
Europe
AGC Multi Material
China
Korea Taconic Co.
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AGC Confidential
CCL Operation Sites
Nelco
Joined AGC group on Dec 4th, 2018
Taconic
Joined AGC group on Jun 11th, 2019
FR
K
R
C
N
A
Z
J
P
C
A
S
G
Production
Sales
R&D
Production site
PTFE
Hydrocarbon
PPE
Other Thermoset
U.S.A.
AMMA
✔
Singapore
AMMS
✔
✔
✔
✔
S. Korea
KTC
✔
✔
France
AMME
✔
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AGC Confidential
AMMS Expansion
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AGC Confidential
Acquisition of 12 Gul Lane
12 Gul Lane
New acquisition
Land area: 6719.7 m²
Existing floor area:
Current factory
1538.4 m²
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Expansion plan
• Existing floor area: 1538.4 m² → New floor area: 3365.9 m²
• New production facility, warehouse/storage and office area
• Planned completion: Q4 2022
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Meteorwave Applications
AGC Confidential
Meteorwave Line Up
8000
8300
4000
2000
3000
1000
Meteorwave
1000
Meteorwave
2000
Meteorwave
3000
Meteorwave
4000
Meteorwave
8000
Meteorwave
8300
Next Gen
ELL
3.4
3.2
3.4
3.3
3.3
3.0
3.0
Dissipation Factor
(Df)
0.0047
0.0034
0.0039
0.0024
0.0017
0.0025
0.0012
Tg
240°C
240°C
200°C
200°C
185°C
185°C
190°C
>120min
>120min
>120min
>120min
>120min
>120min
>120min
Dielectric
Constant(Dk)
@10GHz
@10GHz
By DMA
T288
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Next Generation
ELL Series
AGC Confidential
AGC Product Positioning
AGC Low Loss Materials
28~56Gbps
Meteorwave
1000
Meteorwave
2000
Meteorwave
3000
56~112Gbps
Meteorwave
4000
Meteorwave
8000
112~224Gbps
ELL-101
(NE)
ELL-102
(NER)
ELL-103
(L2)
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ELL Development Concept
• New ELL resin system
• Resin has superior electrical performance so as to achieve
required SI performance without the use of NER-glass and
L2-glass.
• With NER-glass and L2-glass, ELL can achieve next level SI
performance.
AGC Confidential 15
AGC Ultra and Extremely Low Loss Materials
Lead Free
Compatible
CAF Resistant
Tg °C (DMA)
10 GHz
Dielectric
Constant
10 GHz
Dissipation
Factor
Part No.
Description
Meteorwave
4000 (NE)
PPE Ultra Low
Loss, Very High
Reliability
Yes
Yes
200
3.4
0.0024
Meteorwave
8000 (NE)
PPE Ultra Low
Loss, Very High
Reliability
Yes
Yes
170
3.2
0.0017
ELL 101 (NE)
Extremely Low
Loss, current
gen SI glass
Yes
Yes
180
3.21
0.0011
ELL 102 (NER)
Extremely Low
Loss, next gen
SI glass
Yes
Yes
180
3.07
0.0009
ELL 103 (L2)
Extremely Low
Loss, next gen
SI glass
Yes
Yes
180
3.03
0.0009
Yes
Yes
3.1
0.0012
Competitor M
(L2)
AGC Confidential 16
Fiberglass Properties
Property
Units
E-Glass
SI® Glass
NER-Glass*
Quartz
Density
g/cm3
2.6
2.3
2.3
2.2
Tensile Strength
GPa
3.2
3.1
2.4
Tensile Modulus
GPa
75
64
53
74
X10-6/°C
5.6
3.3
3.3
0.5-0.6
Dielectric Constant
10 GHz
6.6
4.7
4.3
3.7
Dissipation Factor
10 GHz
0.0060
0.0026
0.0018
0.0002
CTE (50 – 200°C)
* L2 glass can be alternative with similar electrical performance
AGC Confidential
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New SI Copper Foil
RTFOIL®
≈ 4.5µm Rz
HVLP & VSP® type foil
≈ 0.8µm - 1.5µm Rz
SI foil
≈ 0.5µm Rz
 Lower profile coppers (with acceptable peel strength) reduces skin effect on signal
integrity and improves system attenuation
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Copper Type & Roughness
AGC Confidential
Microstrip Insertion Loss
• ELL-101 with NE-glass achieves equivalent SI performance as competition with L2-glass.
• ELL-102 and ELL-103 with NER-glass and L2-glass exceeds the SI performance of competition
with equivalent glass
0
Insertion Loss (dB/in)
-0.1
-0.2
-0.3
-0.4
-0.5
ELL-103 (L2)
ELL-102 (NER)
-0.6
ELL-101 (NE)
M8U
-0.7
MW8000
-0.8
-0.9
0
5
10
15
20
25
30
35
40
Frequency (GHz)
AGC Confidential
ELL Stripline Insertion Loss –
Cisco S3
0
0
5
10
15
20
25
30
35
40
45
-0.1
9 mil lines
& spaces
-0.2
dB/in.
-0.3
ELL 102
ELL 101
-0.4
-0.5
-0.6
-0.7
Frequency (GHz)
AGC Confidential 21
SI Test
ELL 101 & ELL 102 Stack-up & Design
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AGC Confidential
SI Test
MW8000 Stack-up & Design
MEG8U Stack-up & Design
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SI Test (Condition)
Inner layer surface treatment: Glicap
Trace length: 100mm
Transmission line: Differential
Calibration method: SOLT (Impedance Standard Substrate:129-241)
Frequancy: 0-50GHz
VNA: Keysight N5227B
Sample precondition: 25°C, 50% 24hours
Sample (4mil core)
Property
ELL101
ELL102
MW8000
MEG8U
Conditioning
Dk @10GHz
3.15
3.18
3.36
3.20
Bake 1 hour @ 120°C
Df @10GHz
0.0013
0.0010
0.0018
0.0012
Bake 1 hour @ 120°C
Dk @10GHz
3.11
3.18
3.36
3.20
Df @10GHz
0.0014
0.0011
0.0019
0.0013
23°C ± 2°C 50 ± 5%
24 hours
23°C ± 2°C 50 ± 5%
24 hours
Split Post Dielectric Resonator method
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AGC Confidential
Test Boards
De-embedding
Two patterns pointed by arrows were used
Calibration
SOLT
(Impedance Standard
Substrate:129-241)
108mm
8mm
THRU
AGC can provide ISU this coupon
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AGC Confidential
SI Test (TDR)
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AGC Confidential
SI Test (S21)
-0.2
0
-0.1
MEG8U-A
MEG8U-B
MW8000-A
MW8000-B
ELL101-A
ELL101-B
ELL102-A
ELL102-B
MEG8U-A
MW8000-A
ELL101-A
ELL102-A
MEG8U-B
MW8000-B
ELL101-B
ELL102-B
-0.2
ELL102
Loss (dB/cm）
Loss (dB/cm）
-0.3
-0.3
-0.4
MEG8U and ELL101
-0.4
Meteorwave8000
-0.5
-0.6
Loss @28GHz
[dB/cm]
ratio
-0.7
0
5
10
15
20
25
30
35
40
45
50
-0.5
25
Frequency(GHz)
MEG8U
MW8000
ELL101
ELL102
-0.312
-0.383
-0.311
-0.297
100.0
122.9
99.8
95.5
30
Frequency(GHz)
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AGC Confidential
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ELL Final Testing & Certification
•
•
•
•
TV1: basic PCB process and reliability study
TV2: advance resin flow study
Intel Delta-L
SI Benchmark Testing
• IST will be ready end Nov ‘22
• CAF for 500 hours on End Nov ‘22; 1000 hours mid Dec ‘22.
• UL sample submitted. Provisional UL estimated Feb ’23.
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AGC Confidential
Thermal Stress Test
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AGC Confidential
ELL TV 1 Fab Info
Fab drawing and sample artwork layers
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ELL TV 1 Process Parameters
• All 4 panels processed together through the same press load
• Press Cycle used:
• Prevac 20 minutes before applying heat and pressure,
• 3°C (6°F) /minute heat up rate
• 450 psi
• 120 minutes cure@ 420 °F (216 °C )
• < 3°C (6°F) cool down rate
• Drill Parameters:
• Union Tool UC series drills
• 500 hits max
• Drill diameters 10, 20, 40 mils
• N4000-13 drilling parameters
• IPC A/B coupons contain 10 & 40 mil drills
• Fabricator’s standard entry and back-up materials
• Chemical desmear process is Atotech
• Typical standard plasma desmear cycle
• No glass etch process used
AGC Confidential
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ELL TV 1 – 10x Thermal Stress
Panels 3 & 4 selected and tested per IPC-TM-650 2.6.8e
10x at 10 seconds @ 550°F (260°C)
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ELL TV 1 – 10x Thermal Stress
10 mil holes
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AGC Confidential
ELL TV1 Summary
•
•
•
•
TV1 is intended to determine basic manufacturability of ELL.
ELL is manufacturable within a reasonable process window.
Fill and flow of 1 oz and less copper is good.
Drill parameters are within industry standards.
•
•
•
•
Hole desmear and etch back are easily achieved.
Material movement (DS) is minimal during fabrication.
ENIG (and ENIG-like) compatible.
Signal integrity (impedance) results meet expected Dk.
• ELL is thermally compliant to expected results.
• Withstands 10x IPC-TM-650 thermal stress (solder float).
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AGC Confidential
TV-2 Complete
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AGC Confidential
ELL-X TV2 Panel 2 Condition
These images show the removed inner core.
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AGC Confidential
ELL-X TV2 Panel 2 Evaluation
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AGC Confidential
Next up TV-3 Dec 2022
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ELL-X Fab/OEM Feedback
Below are paraphrased comments or feedback from fabricators and OEMs.
• OEM ‘C’ comment received 05/22: ELL-X NE, NER, & L2 SITV Df values are competitive with the
other Extremely Low Loss materials we have tested.
• OEM ‘H’ comments received 05/22: The Df of ELL-X with NER is lower than Meg-8U. We are
interested to continue testing this product.
• Fab ‘AV’ feedback received 06/22: ELL-X manufactures like FR4 with no problems.
• Fab ‘AP’ feedback received 07/22: Drill quality was good. We did 6X thermal stress after press, no
deterioration was observed, no inner connect defects (ICDs). Full etchback is achieved.
• OEM ‘I’ comments received on 08/22: ELL-X NER SITV test results align surprising well with their
models.
• OEM ‘Z’ comments received on 08/22: ELL-X NER SITV test results is 3-5% better than M8U. Ready
to proceed with 32L reliability testing.
• OEM ‘S’ feedback received on 09/22: Conclusion is ELLX insertion loss is 3% better than
M8U.
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AGC Confidential
END
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AGC Confidential