IMX250 / IMX252 / IMX264 / IMX265 Support Package Preliminary The data except this specification conform to those of IMX250, IMX252, IMX264, IMX265. 1. Description This support package is intended to support product development. 2. Description Items ◆ Guideline for designing the printed circuit board ◆ Low voltage serial LVDS output interface c. ◆ Communication port (4-wire serial) In 2 ◆ Communication port (I C) es ◆ Pattern Generator (PG) function gi ◆ How to get sensor information lo ◆ Lens design guideline no ◆ FD white spots FR AM O S Te ch ◆ FAQ Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. Rev. 2.0 1 IMX250 / IMX252 / IMX264 / IMX265 Support Package Contents 1. Description ---------------------------------------------------------------------------------------------------------------------------------- 1 2. Description Items -------------------------------------------------------------------------------------------------------------------------- 1 3. Guideline for designing the printed circuit board ------------------------------------------------------------------------------------ 4 3.1. Application circuit.---------------------------------------------------------------------------------------------------------------------- 4 3.1.1. Power supply pins ------------------------------------------------------------------------------------------------------------------ 4 3.1.2. Other Pins ---------------------------------------------------------------------------------------------------------------------------- 6 3.2. (Reference) Component -------------------------------------------------------------------------------------------------------------- 7 3.2.1. Power supply IC -------------------------------------------------------------------------------------------------------------------- 7 3.2.2. Decoupling capacitors ------------------------------------------------------------------------------------------------------------- 8 3.3. Notes for designing patterns of printed circuit board. --------------------------------------------------------------------------- 9 Power supply pins ------------------------------------------------------------------------------------------------------------------ 9 3.3.2. Wiring patterns for image output signals ( Low-voltage LVDS serial output ) -----------------------------------------12 c. 3.3.1. In 4-wire Serial Communication Port ----------------------------------------------------------------------------------------------------13 4.1. Overview --------------------------------------------------------------------------------------------------------------------------------13 4.2. es 4. Register write/read operation -------------------------------------------------------------------------------------------------------14 I C interface communication port -----------------------------------------------------------------------------------------------------16 lo 5. gi 2 Overview --------------------------------------------------------------------------------------------------------------------------------16 5.2. Overview of the communication protocol-----------------------------------------------------------------------------------------18 ch no 5.1. State control (start, restart, stop of the communication) -------------------------------------------------------------------18 5.2.2. Acknowledge bit -------------------------------------------------------------------------------------------------------------------18 S Te 5.2.1. Write/read operation of the registers ----------------------------------------------------------------------------------------------19 O 5.3. Note for access to register--------------------------------------------------------------------------------------------------------------20 7. Pattern Generator ------------------------------------------------------------------------------------------------------------------------21 FR AM 6. 7.1. Feature ----------------------------------------------------------------------------------------------------------------------------------21 7.2. Register map for pattern generator function -------------------------------------------------------------------------------------22 7.3. Common setting item for the PG ---------------------------------------------------------------------------------------------------26 7.4. 8. List of Pattern --------------------------------------------------------------------------------------------------------------------------27 How to get sensor information ---------------------------------------------------------------------------------------------------------30 8.1. Register map for sensor information ----------------------------------------------------------------------------------------------30 8.2. The description of reading data ----------------------------------------------------------------------------------------------------30 8.2.1. Type name Information -----------------------------------------------------------------------------------------------------------30 8.2.2. Monochrome / Color Information -----------------------------------------------------------------------------------------------30 9. Lens design guideline -------------------------------------------------------------------------------------------------------------------31 9.1. 10. Optical system -------------------------------------------------------------------------------------------------------------------------31 9.1.1. IMX250 / IMX264 Optical dimension ------------------------------------------------------------------------------------------31 9.1.2. IMX252 / IMX265 Optical dimension ------------------------------------------------------------------------------------------32 9.1.3. CRA characteristics of recommended lens -----------------------------------------------------------------------------------33 FD white spots ----------------------------------------------------------------------------------------------------------------------------35 Rev. 2.0 2 IMX250 / IMX252 / IMX264 / IMX265 Support Package 11. FAQ -----------------------------------------------------------------------------------------------------------------------------------------37 11.1. In case the image cannot be displayed with the finished sensor board ---------------------------------------------------37 11.2. In case there is noise observed in the output image---------------------------------------------------------------------------37 FR AM O S Te ch no lo gi es In c. Revision History ------------------------------------------------------------------------------------------------------------------------------------38 Rev. 2.0 3 IMX250 / IMX252 / IMX264 / IMX265 Support Package 3. Guideline for designing the printed circuit board In this section we explain the design guideline of the printed circuit board layout and mount. 3.1. Application circuit. 3.1.1. Power supply pins (1). Please design the suitable filter in power supply line to reduce influence of a power supply noise and to prevent an unnecessary radiation. Especially, the parts to analog power supply pin need to choose the one that is small direct current resistance because that pin is sensitive to the voltage change. The voltage change becomes the factor of horizontal line noise. (2). We suggest that the use of reasonable noise filters on the power-line for suppressing the radiation noise from the lines. (3). B5, F11, H5, K12, L5, B9.Pin (Analog 3.3V) is sensitive signals for noise. So these pins and other power supply should not have the common impedance. c. (4). Please mount peripheral parts (capacitor) near the element as much as possible. In (5). Please make patterns of Power supply (3.3V, 1.8V, 1.2V) as wide as possible. gi es (6). Please put capacitors at each power pin. And avoid putting a capacitor of total capacity value at multiple pins in order to reduce parts. no ch As short as possible As short as possible VDDHOFG(3.3V) B5 VDDHPX A9 VSSHPX 0.1uF VDDHOFG F8 F11 VDDHPX C4 VSSHPX H5 0.1uF C5 VDDHTRX D8 VDDHAN(3.3V) VDDHCM VDDHAN B9 C3 VSSHCM VSSHAN C9 C15 VDDHCM VSSHAN D10 C14 VSSHCM VSSHAN E10 0.1uF 0.1uF 10uF 4.7uF VDDHRST(3.3V) 0.1uF VSSHPX VSSHPX E5 VSSHPX VSSHPX VSSHPX VDDHCM VSSHCM H13 VSSHCM J4 VSSHCM J13 VSSHCM K4 VSSHCM G5 VDDHCP D7 VSSHCP G4 VDDHTRG VSSHCP B12 VDDHTM C12 VSSHTM 10uF H4 VSSHPX K13 VSSHPX L4 VSSHPX B4 1.0uF VDDHCP(3.3V) 0.1uF VSSHPX VSSHPX VDDSUB F6 1.0uF E11 VDDSUB(3.3V) 0.1uF VSSHPX E8 J12 D14 VDDHTRG(3.3V) 0.1uF E7 VSSHCM 0.1uF 0.1uF E4 VDDHCM 10uF VSSHPX D11 J5 D3 0.1uF F7 VDDHPX VDDHPX E9 C2 0.1uF VDDHTRX(3.3V) VSSHPX L5 E6 As short as possible VDDHPX VDDHRST K12 0.1uF 0.1uF As short as possible 22uF F5 FR AM 0.1uF VDDHCM(3.3V) 10uF S 0.1uF O 22uF Te VDDHPX1(3.3V) 22uF The inserted components are preferred to have small DC resistance. Because analog power lines is sensitive to the voltage change. If it is possible, should not put the parts. However, for noise removal, please consider placing it near the filter circuit of power source. lo The inserted components are preferred to have small DC resistance. Because analog power lines is sensitive to the voltage change. If it is possible, should not put the parts. However, for noise removal, please consider placing it near the filter circuit of power source. VDDHTM(3.3V) VDDHSEL(3.3V) F9 4.7uF VDDHSEL 0.1uF 1.0uF 0.1uF As short as possible Reference design for analog power supply pins. Rev. 2.0 4 IMX250 / IMX252 / IMX264 / IMX265 Support Package As short as possible Ferrite beads or Filter circuit As short as possible As short as possible VDDMIF(1.8V) VDDLSC(1.2V) 4.7uF 4.7uF N8 VDDMIF N5 VSSMIF N9 VDDMIF N6 VSSMIF VDDLCN(1.2V) 10uF F16 VDDLSC VDDLCN H16 F15 VSSLSC VSSLCN H15 G1 VDDLSC VDDLCN J1 G2 VSSLSC VSSLCN J2 M1 VDDLSC VDDLCN K16 M2 VSSLSC VSSLCN K15 M9 VDDLSC M6 VSSLSC M16 VDDLSC M8 VSSLSC M15 VSSLSC U8 VSSLSC 0.1uF 0.1uF 0.1uF 0.1uF N7 VSSMIF N10 VSSMIF N11 VSSMIF N12 VSSMIF P8 VSSMIF P9 VSSMIF R8 VSSMIF R9 VSSMIF 0.1uF 0.1uF 4.7uF 0.1uF 4.7uF 0.1uF 4.7uF 0.1uF VDDLCB(1.2V) VDDLCB D2 VDDMIO(1.8V) 1uF 0.1uF 0.1uF VDDLCB D15 0.1uF PVLM(1.2V) VDDLCB H12 0.1uF M7 F10 0.1uF 4.7uF PVLM 0.1uF VDDLCB K5 VDDLPA(1.2V) VDDLPA M10 VSSLPA M11 0.1uF 4.7uF Te ch no lo gi es In c. 0.1uF O S Reference design for digital power supply pins. FR AM 1.0uF VDDMIO Rev. 2.0 5 IMX250 / IMX252 / IMX264 / IMX265 Support Package (7). We recommend to implement the power supply IC as close to the sensor as possible. If cannot, use wider power supply pattern of lower DC resistance, implement the large (10uF or more) decoupling capacitor close to the sensor. With regard to pattern, please refer to “3.3. Notes for designing pattern of printed circuit board”. GND GND Sensor 10~22μF Analog power IC for sensor 1μF or 4.7μF Power supply board 0.1μF Wireing length 10cm (If it is possible) Bypass capacitor : 10 -22 uF (If necessary) It is preferable to put capacitor separately in each power pin If you bring power line together, please bring it together near the IC, and make pattern wide to reduce common impedance As short as possible GND In c. Please keep the route of the return current by making GND path fat as well as power supply line. The pattern between power IC and image sensor should be close as much as possible lo Other Pins ch no VCP1, VCP2, VBGR pin is sensitive to noise. Please place the capacitors near the pins. As for the capacity of a capacitor, it is desirable to insert the value according to the example of an application circuit. As short as possible Te As short as possible S C7 VCP2 VCP1 D6 4.7uF 4.7uF 4.7uF O 4.7uF FR AM 3.1.2. gi es Layout of power supply IC and decoupling capacitors of large capacity B8 VRLOFG B7 VRLTRX VRLTRG C6 VRLWSS A7 A8 VRLSEL VRLRST C11 C10 VBGR VRLGND C8 0.22uF As short as possible Reference design for other pins. Rev. 2.0 6 IMX250 / IMX252 / IMX264 / IMX265 Support Package 3.2. (Reference) Component The following describes the components used reference information. When in actual use, please contact the manufacture for each component. Power supply IC Please select the power supply IC of better PSRR characteristics. Fluctuation of the power supply voltage will cause the horizontal line noise. In that case, we recommend that you use a series regulator. Please note that when using switching power regulator of the following points. (1). When using switching power regulator, magnetic field inducted by inductor might cause the noise of the image. (2). Encapsulated (shield) type inductor is recommended. In c. (3). Mounting direction of the inductor also affects (increase or decrease) the noise level. Good Wire-wound drum type (non-encapsulated) Wire-wound drum type (encapsulated) Good Lamination layer type (similar to encapsulated) O S Te ch no lo gi es Bad Encapsulated/non-encapsulated type inductor FR AM 3.2.1. Rev. 2.0 7 IMX250 / IMX252 / IMX264 / IMX265 Support Package Decoupling capacitors Please use non-polar capacitors. It is possible to operate the sensor by using typical ceramic capacitors. (1). All the power supply voltage are smaller than 3.3 V so you can use any 1608M size capacitors of any characteristics in the graph. When you use 1005M size capacitors, you should select characteristics-B device. Characteristics-F device should not be chosen. (2). Decoupling capacitors for each pin are sensitive to image quality. Please implement sufficient capacity of the decoupling capacitors according to the power supply condition. If you use capacity that is small one and large one, please put the small one near the sensor. Please refer to Application circuit for details. (3). The capacity of the laminated layer ceramic capacitors will decrease in regard to the impressed DC bias voltage by piezo-electric effect. It will be more obvious when using smaller size and larger capacity, please check the specification sheet of each devices. (Graph below shows the characteristics.) Capacitance: 0.1μF c. 110% In 100% 90% 1005_X5R_16V es 80% 1005_B_16V gi 70% 60% lo 0603_X5R_6.3V no 50% 40% 0603_B_6.3V ch 30% 1005_X5R_25V 1005_F_16V 20% Te Capacitor Charge [%] 0% 1 O 0 S 10% FR AM 3.2.2. 2 3 4 5 6 7 8 9 10 DC Bias Voltage [V] DC bias vs. capacity Rev. 2.0 8 IMX250 / IMX252 / IMX264 / IMX265 Support Package 3.3. Notes for designing patterns of printed circuit board. 3.3.1. Power supply pins (1). The peripheral devices (capacitors) of the sensor should be mounted as close to the power supply pins as possible. Longer wire length might cause the degradation of the image quality. (2). Surface power/ground plane and inner layer power/ground plane should be connected with enough number of the vias ( Vertical Interconnect Access ) . Please make each pattern the same electric potential. Stacked ceramic capacitor Staked ceramic capacitor Please connect ground plane and internal layer by a lot of via. (Please make each pattern the same electric potential.) c. In es gi Sensor PWB FR AM O S PWB PAD pattern lo Te ch no PAD pattern Please connect ground plane and internal layer by a lot of via. (Please make each pattern the same electric potential.) As close as possible. Sensor Mount the capacitors as close to the pin as possible with using “pad on hole” technology. Mount the sensor and capacitors on the same side of print circuit board surface. Sensor and capacitors are mounted on the different sides of print circuit board surface. Example of capacitor mounting Rev. 2.0 9 IMX250 / IMX252 / IMX264 / IMX265 Support Package (3). The noise on the B5 / F11 / H5 / K12 / L5.pin (VDDHPX), and B9.pin (VDDHAN) degrades the image quality. So VDDHPX and VDDHAN should not have the common impedance. Following drawing is the example of the layout of the power supply patterns. Analog Power Supply (3.3 V) Analog GND Interface Power Supply (1.8 V) Interface GND Digital Power Supply (1.2 V) Digital GND Clock Data output In GND A1 Out U1 Other VDDH pin Signal I/O VDDHPX (B5, H5, L5.pin) Via to Analog Power plane Other VDDH pin Top View Analog Power plane VDDHPX (F11, K12) VDDHAN (B9.pin) A16 gi es U16 In c. Other VDDH pin no lo An example of B5 / F11 / H5 / K12 / L5, and B9.pin wiring patterns. (With 3-terminal regulator) Te ch (4). Loop of the ground pattern might propagate the noise to the other patterns (ex. Power supply pattern) so the ground pattern recommends Land pattern. Its recommended to use the common single GND plane for Analog GND and Digital GND. A1 FR AM O S U1 Analog Power Supply (3.3 V) Analog GND Interface Power Supply (1.8 V) Interface GND Digital Power Supply (1.2 V) Digital GND Clock Data output Signal I/O Via to GND plane Top View Don’t make the ground loop. It’s recommended to use the common single GND plane for Analog GND and Digital GND. GND plane U16 A16 GND pattern Rev. 2.0 10 IMX250 / IMX252 / IMX264 / IMX265 Support Package Other notes Digital signal pattern on the other layer should not be in parallel with the power supply patterns, terminals of VCP1, VCP2, VRLSEL, VRLTRX, VRLOFG, VRLTRG, VRLGND, VRLRST, VBGR and these lines. U1 A1 Analog Power Supply (3.3 V) Analog GND Interface Power Supply (1.8 V) Interface GND Digital Power Supply (1.2 V) Digital GND Clock Data output Signal I/O Good c. Top View lo gi es In Bad A16 no U16 FR AM O S Te ch Signal Wire Routing Rev. 2.0 11 IMX250 / IMX252 / IMX264 / IMX265 Support Package Wiring patterns for image output signals ( Low-voltage LVDS serial output ) (1). When choosing low-voltage LVDS output mode, signal wires ( DLOPxy and DLOMxy, DLCKPy and DLCKMy ) must be paired. (2). Meander pattern should make pattern as close to the output pins ( near the sensor ) as possible. U1 Meander pattern >90° Terminal resistance :100Ω To Receiver no lo gi es In c. Delay tune routing Top View ch U16 S Te Example of wiring patterns for LVDS serial output signal O (3). We recommend delay tune wiring for image signals, especially delay of each differential pair signal and Data and its Strobe signal should be controlled by using meander wiring. Turning point angle of the wire should be greater or equal to 90 degree. ( obtuse angle ) FR AM 3.3.2. (4). Decoupling capacitors for power supply for image signal output ( VDDM ) should be mounted close to the power supply pins of the package of the sensor with using small size ( 1005M or 0603M ) laminated layer ceramic capacitor. <For your reference> Validity of the image signal can be checked by “eye pattern” of the signals. With the adequate loading and delay tuned condition, you can see clear “eye pattern” with sufficient margin of the threshold and the noise level for the receiver. This is an example of eye pattern. Typical Amplitude Eye Pattern 1 bit Eye pattern of the image signal Rev. 2.0 12 IMX250 / IMX252 / IMX264 / IMX265 Support Package 4. 4-wire Serial Communication Port This section describes the operation of 4-wire serial interface. Overview Characteristics of 4-wire serial interface. (1). 3-wire serial interface consists of serial data input ( SDI ), serial clock ( SCK ), and chip enable ( XCE ). SDO is the data output port for read out the value in the registers. (2). Data transfer is done in unit of 8bit ( 1byte ). In case of continuous communication, no limitation for the numbers of byte for the communications. ( However, limited by communication period. ) (3). LSB first protocol. Ex.) When sending 8’h28 LSB first transfer is 0001 0100. Serial data input SDO Serial data output Maximum frequency is 13.5 MHz Change the value at falling edge of SCK, latch the value by rising edge Output the value synchronous to the falling edge of SCK no lo gi SDI Communication is active for XCE is low. c. SCK description Initialize the register value. In XCE function Initialize the system Enable the communication Serial clock for communication es Terminal name XCLR ch CMOS Sensor XCLR when low, all the registor values are initialized. Te [K3.pin] XCLR Input [L2.pin] XCE Input [L3.pin] SCK Input O S XCE While XCE is low, communication is activated. After XCE is low, 1st byte is the ChipID[7:0], 2nd byte Is the address[7:0] of the register, and followings are the data from/to registers. FR AM 4.1. SCK Write/Read operation is synchronized to SCK SDI input the ChipID, address, and the register value [M3.pin] SDI Input SDO output the register value when ChipID is declared 82h to 92h. [L1.pin] SDO Output 4-wire Communication Function Rev. 2.0 13 IMX250 / IMX252 / IMX264 / IMX265 Support Package Register write/read operation Both of register write and read operation, ChipID, address and register value are declared to SDI. When ChipID is 02h to 12h, value is written to the register designated by the address. When ChipID is 82h to 92h, the value is read out from the register designated by the address. Write and read operation can be done continuously while XCE is low. XCE SCK SDI Chip.ID 02h to 12h Address xxh DATA xxh SDO In es Write Operation c. DATA no lo gi When write operation, the order of the commands to SDI is as follows. 1st byte: ChipID is selected among from 02h to 12h, 2nd byte: address to write, 3rd byte and after: register value. SDO output the current value ( Before write ) of the register designated by the address. Te ch XCE SDI SDO O S SCK FR AM 4.2. Chip.ID 82h to 92h Address xxh DATA xxh DATA xxh Read Operation When read operation, the order of the commands to SDI is as follow. 1st byte: ChipID is selected among from 82h to 92h, 2nd byte: address to read, 3rd byte and after : invalid data SDO output the value of the register designated by the address. Rev. 2.0 14 IMX250 / IMX252 / IMX264 / IMX265 Support Package The example of communication timing to writing to continuous address as shown table 1 is shown below. Table1. The example of writing registers XCE bit Default value 20h [7:0] 00h 00h E8h 21h [7:0] 00h 00h 10h 22h [7:0] 00h 00h 01h SCK SDI 02h 20h SDO E8h 10h 01h 00h 00h 00h Setting value before After Address Write operation to continuous address es In c. Write E8h to address 20h first. And with keeping XCE low, by writing 10h, 01h in succession, these values are set to consecutive addresses (21h and 22h). The example of reading communication timing to writing to continuous address as shown table 1 as shown table 2 is shown below. gi Table2. The example of reading registers no lo XCE 82h 20h 00h 00h 00h bit Default value 20h [7:0] 00h E8h E8h 21h [7:0] 00h 10h 10h 22h [7:0] 00h 01h 01h E8h FR AM SDO O S SDI Te ch SCK Setting value before After Address 10h 01h Read operation to continuous address In case of reading out the value from the registers, write 82h to 92h as the ChipID then designate the address to read. After that input the dummy data to SDI. In read mode, input data are discarded and no register is updated, current register values are output from SDO continuously. Rev. 2.0 15 IMX250 / IMX252 / IMX264 / IMX265 Support Package 5. I2C interface communication port 2 This section describes the operation of I C interface. 5.1. Overview 2 I C Communication mode. Mode Data rate Correspondant Standard mode 100 kbps ○ Fast mode 400 kbps ○ High speed mode 3.4 Mbps × Slave address MSB SLAMODE = 0 Slave Address [7:1] 10h SLAMODE = 1 1Ah LSB [6] [5] [4] [3] [2] [1] [0] 0 0 1 0 0 0 0 R/W 0 0 1 1 0 1 0 R/W In c. [7] es Slave address gi Characteristics of I2C communication no lo - I2C consists of 2 wires of serial data and serial clock. - Unit of the communication is 8 bit ( 1 byte ), bi-directional communication. ch And in case of continuous communication, no limitation for the numbers of byte for the communications.(However, limited by Te communication period. ) S - Acknowledge bit ( ACK/NACK ) is required at the end of communication. FR AM O - MSB first protocol Ex.) When sending 28h MSB first : 0010 1000. 2 - I C is the bi-directional communication and the “master” side controls the communication, the “slave” side is controlled by master. - IC is the bi-directional communication and the “master” side controls the communication, the “slave” side is controlled by master. The “master” always provides the for the data. -While communication, the device transferring the data is the transmitter, and the device receiving the data is the receiver. The “slave” provides acknowledge bit. - The sensor will be the slave. Rev. 2.0 16 IMX250 / IMX252 / IMX264 / IMX265 Support Package Master Slave(CMOS Sensor) Slave address ・Start condition ・Repeated-start condition ・Stop condition Transmitter Receiver Data(SDA) Clock(SCL) ACK/NACK Receiver Transmitter Clock(SCL) Data(SDA) In c. ACK/NACK gi es Relation between the sensor and the ISP when I2C communication. no lo Master execute the following communication. - Generate slave address ( declare the device to be slave. Sensor is the slave here. ) Te ch - Generate “start condition”, “repeated start condition”, and “stop condition”. While communication, the device transforming the data is the transmitter, and the device receiving the data is the receiver. S Master can work as both transmitter and receiver, slave also work as both. Transmitter generates the data ( SDA ) and the acknowledge bit. FR AM O clock ( SCL ), receiver generates the acknowledge Bit ( ACK/NACK ) and master always generates the clock ( SCL ) for Reference design for I2C serial communication is shown below. Please connect XCE and OVDD when I2C communication. In addition, SCL, SDA, please pull up to 1 kΩ OVDD. I2C communication 1.8V 10kΩ L2 XCE SDO L1 SLAMODE K1 OPEN 1.8V 1kΩ 1kΩ 10Ω L3 SCL M3 SDA Reference design for I2C serial communication Rev. 2.0 17 IMX250 / IMX252 / IMX264 / IMX265 Support Package 5.2. Overview of the communication protocol Data is transferred by SDA port. The transition timing of the SDA follows the rule below. - State control ( start, restart, stop of the communication ) is done while SCL is “high”. - When data transfer, SDA toggles while SCL is “low” 5.2.1. State control (start, restart, stop of the communication) The conditions of start ( start condition ), restart ( repeated start condition ), and stop ( stop condition ) of the communication is shown below. State control is done by master device. State condition condition SDA toggles from High to Low while SCL is high Repeated start condition start condition while stop condition is of the previous data transfer is In c. Start condition es not Declared SDA toggles from Low to High while SCL is High. no Acknowledge bit ch 5.2.2. lo gi Stop condition Te Data transfer is done in unit of 8 bit ( 1 byte ). The acknowledge bit is generated for every 8 bit data transfer and added after S the last ( 8th ) bit to indicate that receiver normally received the data. When receiver wants to stop the communication by the FR AM O internal interrupt or etc. receiver generates the negative acknowledge bit ( NACK ). - Master must send the slave address after declaration of the “Start condition” and “Repeated start condition”. - When slave generators the negative acknowledge bit, master declares the stop condition and stops the communication immediately. Rev. 2.0 18 IMX250 / IMX252 / IMX264 / IMX265 Support Package 5.3. Write/read operation of the registers Write/read operation of the registers are executed as shown below. Master:Transmission Slave:Reception Master:Reception Slave:Transmission Internal processing of the sensor Start Condition Sensor is Slave device and slave address is fixed Sensor is Slave device and slave address value (0010000 at SLAMODE=0) or (0011010 at is fixed value (0011010) b SLAMODE=1). Slave Address[7:1] Optional Designate the address of the register Select whether designate the register address or not designate the register address. In case of “not designate”, data cannot be written into the register. Held (Read Only) 0 ACK: acknowledge NACK: negative acknowledge *when sensor generates the NACK, master must stop the communication immediately by generating “stop condition”. c. ACK In Address[15:8] ACK es Designate the address of register to access. 16 bit address, send in MSB first protocol. Receiver will generate the ACK/NACK for every 8 bit communications. lo gi Address[7:0] Write Te Operation DATA[7:0] ACK/NACK O S Read Repeated Start Conditon no ACK FR AM 1 ch Register Address Slave Address[7:1] 1 Continuance Write End Stop Condition When write the data to the registers of continuous address, address will be automatically incremented so write data can be sent right after the ACK without designating the address. When terminate the communication, declare “stop condition”. When sensor(slave) generates the NACK, master must declare “stop condition” and terminate the communication. ACK DATA Readout End NACK Address increment Continuance ACK Address increment Stop Condition I2C Register setting flow chart Rev. 2.0 19 IMX250 / IMX252 / IMX264 / IMX265 Support Package 6. Note for access to register When writing the value to registers, we recommend “Read-modify-write” to avoid the trouble caused by inadequate over write of the register. For example “VREVERSE” value is assigned to address of 0Eh [0] , “HREVERSE” value is assigned to address of 0Eh [1]. When update HREVERSE value after writing VREVERSE, VREVERSE value in address of 0Eh [0] should be kept. “Read-modify-write” can prevent the wrong overwrite of the value Ex.) In case of writhing the value 1d to VREVERSE and HREVERSE In case of “no Read-modify-write” 1) HREVERSE = 1d … set value 02h to address: 0Eh Address: 0Eh 0 0 0 0 0 0 1 0 2) VREVERSE = 1d … set value 01h to address: 0Eh c. 01h 0 0 0 0 0 0 VREVERSE=1d lo gi HREVERSE=0d 1 es 0 In Address: 16h Te ch no Writing the VREVERSE value 01h to address 0Eh without considering HREVERSE bit in 0Eh [1], HREVERSE will be changed. S In case of “Read-modify-write” FR AM Address: 0Eh 0 0 0 0 0 O 1) VREVERSE = 1d … set value 02h to address: 0Eh 0 1 0 0 1 0 2) Read register value 0 0 0 0 0 Read out the current value and store the value in the memory area of MCU 3) HREVERSE = 1d … set value 01h to address: 0Eh 01h Address: 0Eh 0 0 0 0 0 0 1 1 Bit operation “add” with the value stored in step 2) 03h Address: 0Eh 0 0 0 0 0 0 1 HREVERSE=1d 1 VREVERSE=1d Write value after bit operation (No overwrite of VREVERSE value) Rev. 2.0 20 IMX250 / IMX252 / IMX264 / IMX265 Support Package 7. Pattern Generator This chapter explains the pattern generator function. Feature The pattern generator provides the following patterns. ◆ Multiple Pixels Pattern ◆ Sequence Pattern 1 ◆ Sequence Pattern 2 ◆ Gradation Pattern ◆ Horizontal 1 Row Pattern ◆ Vertical 1 Column Pattern ◆ Horizontal 1 Row and Vertical 1 Column Pattern ◆ Stripe Pattern of the Arbitrary Value ◆ Checks Pattern of the Arbitrary Value c. ◆ Color Bar which Changes Horizontally O S Te ch no lo gi es In ◆ Color Bar which Changes Vertically FR AM 7.1. Rev. 2.0 21 IMX250 / IMX252 / IMX264 / IMX265 Support Package Register map for pattern generator function The Register map for Pattern Generator is shown below. Please set via sensor standby. Please refer to the datasheet for registers setup other than those lists. Chip ID = 04 (Write: Chip ID = 02h, Read: Chip ID = 82h, I2C: 30**h) Address bit 22h [7:0] Register Name Default value after reset By By register address 01h 01h Description Fixed to F0h Reflection timing S Chip ID = 04 (Write: Chip ID = 04h, Read: Chip ID = 84h, I2C: 32**h) Register Name PGREGEN [0] 1 PGTHRU [0] 2 PGCLKEN [0] PG operation enabled 0h : PG OFF 1h : PG ON Back Ground Transient 0h : Invalid PGMODE=00h / 06h; The background is fixed to "0h". PGMODE=04h / 05h; The background is set to PGDATA2. 1h : Valid Clock control for PG 0h : Clock stop 1h : Clock operation Set to “1h” when using Pattern Generator PG mode setting 00h: Multiple pixels Pattern 01h: Sequence Pattern 1 02h: Sequence Pattern 2 03h: Gradation Pattern 04h: Horizontal 1 Row Pattern 05h: Vertical 1 Column Pattern 06h: Horizontal 1 Row and Vertical 1 Column Pattern 07h: Stripe Pattern of the arbitrary value 08h: Checks pattern of the arbitrary value 0Ah: Color bar which changes horizontally 0Bh: Color bar which changes vertically Others: Setting prohibited c. 0 Description In bit Default value after reset By By register address Reflection timing 0 S 1 S 1 S S 3 4 5 6 O 38h Te ch no lo gi es Address FR AM 7.2. PGMODE [4:0] 7 06h 00h S Rev. 2.0 22 IMX250 / IMX252 / IMX264 / IMX265 Support Package 3Dh 3Eh 3Fh Reflection timing LSB 00h Horizontal Start Address 0 or more is valid. PGHPOS [12:0] 0000h S 00h MSB Fixed to 0 Fixed to 0 Fixed to 0 LSB - Vertical Start Address 0 or more is valid. 00h 000h S ch no lo gi PGVPOS [11:0] es In c. 0 0 0 MSB Fixed to 0 Fixed to 0 Fixed to 0 Fixed to 0 Te 3Ch Description 0 0 0 0 S 3Ah 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 Register Name O 39h bit FR AM Address Default value after reset By By register address 00h - PGHSTEP [7:0] Interval of horizontal pixels 00h is prohibited 00h 00h S PGVSTEP [7:0] Interval of vertical pixels 00h is prohibited 00h 00h S Rev. 2.0 23 IMX250 / IMX252 / IMX264 / IMX265 Support Package 45h 46h 47h Reflection timing PGHPNUM [7:0] Number of horizontal pixels 00h is prohibited 01h 01h S PGVPNUM [7:0] Number of vertical pixels 00h is prohibited 01h 01h S In c. LSB Set PGDATA1 gi es 00h 0000h S ch no lo PGDATA1 [12:0] Te 44h Description 00h MSB Fixed to 0 Fixed to 0 Fixed to 0 LSB 0 0 0 S 41h 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 Register Name O 40h bit FR AM Address Default value after reset By By register address PGDATA2 [12:0] - 00h Set PGDATA2 0000h S 00h MSB Fixed to 0 Fixed to 0 Fixed to 0 0 0 0 - Rev. 2.0 24 IMX250 / IMX252 / IMX264 / IMX265 Support Package 55h 0Ah 0 1 0 1 0 0 0Ah 0Ah 0h - Reflection timing S S - - 3Ch 03Ch S gi es BLKLEVEL [11:0] In Black level offset value setting Set to “000h” when using Pattern Generator c. LSB lo 54h Do not rewrite MSB Fixed to 0 Fixed to 0 Fixed to 0 Fixed to 0 no 4Ah to 53h PGHGSTEP [1:0] ch 49h 0 1 2 3 4 5 6 7 [7:0] to [7:0] 0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7 Color bar width setting 16 pixels unit 00h and 01h are prohibited Fixed to 0 Fixed to 1 Fixed to 0 Fixed to 1 Fixed to 0 Fixed to 0 The increment of gradation pattern 00b; +1 / 01b: +2 / 10b: +4 / 11b: prohibited COLORWIDTH [7:0] Te [7:0] Description 0 0 0 0 00h - S 48h Register Name O bit FR AM Address Default value after reset By By register address Rev. 2.0 25 IMX250 / IMX252 / IMX264 / IMX265 Support Package Common setting item for the PG The output area of the PG pattern is the effective area of each mode. ( The area shown in the blue of the following figure is output area. ) In a pattern ( 0, 4, 5, 6 ) that specifies the location, the origin of horizontal is the next pixel of SAV4th and the origin of vertical is the next line of frame information line. By the register PGTHRU, the background can be selected to "Fixed 0h ( Pattern 0, 6 )" and "Setting PGADATA2 ( pattern 4, 5 )" and "Through" (imaging data). The figure below shows the details. SAV Invalid line EAV Invalid line Frame Information Line ( PGHPOS, PGVPOS ) = ( 0, 0 ) EAV Valid line es In c. SAV Valid line gi SAV Invalid line EAV Invalid line no lo Output Area of Pattern Generator Te ch PG settings O The range of the signal output S The output range for each output resolution is limited with the value of the following table. FR AM 7.3. Output value Resolution Min. Max. 01h FEh 10bit 001h 3FEh 12bit 001h FFEh 8bit * IMX264 / IMX265 support only 12bit . Rev. 2.0 26 IMX250 / IMX252 / IMX264 / IMX265 Support Package List of Pattern The pattern which it outputs by this function is shown below. * IMX264 / IMX265 support only 12bit. 0. Multiple pixels Pattern Register PGMODE = 00h PGDATA1 PGDATA2 PGHPOS PGVPOS PGHPSTEP PGVPSTEP PGHPNUM PGVPNUM Pattern Notes Generate multiple pixels pattern. PGDATA1: Data pattern at the location specified by PGVPOS and PGHPOS The output level of the next point to the right is PGDATA1 + PGDATA2. Since (every each vertical line) The output level is increasing at PGDATA1 + PGDATA2 × n (n=2, 3, 4…). It clips with the MAX value and returns to the startup level. In c. PGVPOS: Specify the vertical start address PGHPOS: Specify the horizontal start address PGHPSTEP: Interval of horizontal pixels ( 0h is prohibited ) PGVPSTEP: Interval of vertical pixels ( 0h is prohibited ) PGHPNUM: Number of horizontal pixels ( 0h is prohibited ) PGVPNUM: Number of vertical pixels ( 0h is prohibited ) es gi lo no ch Te 1. Sequence Pattern 1 Register PGMODE = 01h Notes Outputs the sequential pattern of 1 pixel width O S Pattern 12bit: FFEh/555h/AAAh/001h 10bit: 3FEh/155h/2AAh/001h 8bit: FEh/55h/AAh/01h FR AM 7.4. 2. Sequence Pattern 2 Register PGMODE = 02h Pattern Notes Outputs the following sequential pattern 12bit: FFEh/FFEh/FC0h/FC0h/C3Ch /C3Ch/ 333h/333h/AAAh/AAAh/001h/FFEh 10bit: 3FEh/3FEh/3F0h/3F0h/30Fh/30Fh/ 0CCh/0CCh/2AAh/2AAh/001h/3Feh 8bit: FEh/FEh/FCh/FCh/C3h/C3h/ 33h/33h/AAh/AAh/01h/FEh Rev. 2.0 27 IMX250 / IMX252 / IMX264 / IMX265 Support Package 3. Gradation Pattern Register PGMODE = 03h PGHGSTEP Pattern Notes Outputs the following gradation pattern Minimun* to Maximun It reaches the max and increases from 000h* again. * : Output value is set to 001 h. PGHGSTEP : increment 00b; +1 / 01b: +2 / 10b: +4 / 11b: prohibited 4. Horizontal 1 Row Pattern Register PGMODE = 04h PGDATA1 PGVPOS Pattern Notes Outputs 1 row pattern with 1 pixel width at registered address. ( Valid in the effective pixel region ) 5. Vertical 1 Column Pattern Register PGMODE = 05h PGDATA1 PGHPOS lo gi es In c. PGDATA1: Specify the output value PGVPOS: Specify the vertical address Te ch no Pattern Notes Outputs 1 column pattern with 1 pixel width at registered address. ( Valid in the effective pixel region ) FR AM O S PGDATA1: Specify the output value PGHPOS: Specify the horizontal address 6. Horizontal 1 Row and Vertical 1 Column Pattern Register Pattern PGMODE = 06h PGDATA1 PGDATA2 PGHPOS PGVPOS Notes Outputs 1column/row pattern with 1 pixel width at registered address. ( Valid in the effective pixel region ) PGDATA1: Specify the output value of the column. PGDATA2: Specify the output value of the row. PGHPOS: Specify the horizontal address for column. PGVPOS: Specify the vertical address for row. Rev. 2.0 28 IMX250 / IMX252 / IMX264 / IMX265 Support Package 7. Stripe Pattern of the arbitrary value Register PGMODE = 07h PGDATA1 PGDATA2 Notes Outputs the vertical stripe pattern of the arbitrary value by 1-pixel width. PGDATA1: Specify the output value PGDATA2: Specify the output value Pattern Notes Outputs the checkered pattern of the one pixel spacing with the arbitrary value. PGDATA1: Specify the output value PGDATA2: Specify the output value 10. Color bar which changes horizontally Register PGMODE = 0Ah COLORWIDTH lo gi es In c. 8. Checks pattern of the arbitrary value Register PGMODE = 08h PGDATA1 PGDATA2 Pattern Te ch no Pattern Notes Outputs the color bar which changes horizontally. COLORWIDTH: Color bar width setting * 00h and 01h are prohibited FR AM O S COLORWIDTH ×16 pixel unit COLORWIDTH 11. Color bar which changes vertically Register Pattern PGMODE = 0Bh COLORWIDTH COLORWIDTH Notes Outputs the color bar which changes vertically. COLORWIDTH: Color bar width setting * 00h and 01h are prohibited COLORWIDTH ×16 pixel unit Rev. 2.0 29 IMX250 / IMX252 / IMX264 / IMX265 Support Package 8. How to get sensor information Following sensors can be confirmed the sensor information of Type name and monochrome (LL) / color (LQ) by reading the values of the register as shown below. 8.1. Register map for sensor information The Register map for sensor information is shown below. Please refer to the datasheet for registers setup other than those lists. Chip ID = 03 (Write: Chip ID = 03h, Read: Chip ID = 83h, I2C: 31**h) Address bit Register Name Description 6 7 [6:0] 7 49h Type name Information Monochrome / Color Information Type name 011111010 IMX250 011111100 IMX252 100001000 IMX264 100001001 IMX265 Te ch no lo gi Data es In 8.2. The description of reading data 8.2.1. Type name Information 0 1 Monochrome / Color O Data S Monochrome / Color Information Color (LQ) FR AM 8.2.2. Read only c. 48h Reflection timing Monochrome (LL) Rev. 2.0 30 IMX250 / IMX252 / IMX264 / IMX265 Support Package 9. Lens design guideline This section describes the information to select the lens. IMX250 / IMX264 Optical dimension ◆ Image size Diagonal 11.1 mm (type 2/3) ◆ Number of recommended recording pixels All pixel scan : 2448 (H) × 2048 (V) 1080p-Full HD : 1920 (H) × 1080 (V) approx. 5.01 M pixels approx. 2.07 M pixels ◆ Unit cell size 3.45 µm (H) × 3.45 µm (V) In c. ◆ Recommended lens F number 2.8 and larger ( close side ) gi es ◆ Recommended Exit Pupil Distance - 100mm to -∞ (for B/W) ch no lo Image formation on IMX250 / IMX264 with the lens for type 1/1(16 mm) and 2/3 (11 mm) is shown below. Note to be caused the mechanical vignetting in using type 2/3 at the corner, a little. 16 mm 16 mm 11 mm S Te 11 mm O 9.1.1. Optical system FR AM 9.1. 7.093 mm 3.781 mm 11.07 mm 7.67 mm 6.679 mm 8.501 mm All-pixel 1080p-Full HD Relation between Image Circle and the Pixel Area Rev. 2.0 31 IMX250 / IMX252 / IMX264 / IMX265 Support Package IMX252 / IMX265 Optical dimension ◆ Image size Diagonal 8.9 mm (type 1/1.8) ◆ Number of recommended recording pixels All pixel scan : 2048 (H) × 1536 (V) 1080p-Full HD : 1920 (H) × 1080 (V) approx. 3.15 M pixels approx. 2.07 M pixels ◆ Unit cell size 3.45 µm (H) × 3.45 µm (V) ◆ Recommended lens F number 2.8 and larger ( close side ) ◆ Recommended Exit Pupil Distance - 100mm to -∞ (for B/W) 11 mm es 11 mm In c. Image formation on IMX252 / IMX265 with the lens for type 2/3(11 mm) and 1/2 (8 mm) is shown below. Note to be caused the mechanical vignetting in using type 1/2 at the corner, a little. 8 mm no lo gi 8 mm 8.89 mm 3.781 mm 7.67 mm 6.679 mm O S Te 7.121 mm ch 5.327 mm FR AM 9.1.2. All-pixel 1080p-Full HD Relation between Image Circle and the Pixel Area Rev. 2.0 32 IMX250 / IMX252 / IMX264 / IMX265 Support Package 9.1.3. CRA characteristics of recommended lens The recommended CRA characteristics is 0.0 degrees all over the image height (0 – 100 %), because the target E.P.D. is infinite. *We assume that the worst case of E.P.D. is -100mm. The CRA characteristics of -100mm E.P.D. is described below. The real CRA should be smaller than the table below. CRA characteristics of IMX250 / IMX264 3.00 2.00 1.50 1.00 0.50 50 60 70 80 90 100 es 40 gi Image height [%] ch no lo 100% 0% 2056pixels 30 Te 20 S 10 CRA (deg) 0.00 0.16 0.32 0.48 0.63 0.79 0.95 1.11 1.27 1.43 1.59 1.74 1.90 2.06 2.22 2.38 2.54 2.69 2.85 3.01 3.17 O 0 In 0.00 Image height (mm) 0.00 0.28 0.55 0.83 1.11 1.38 1.66 1.94 2.21 2.49 2.77 3.04 3.32 3.60 3.87 4.15 4.43 4.70 4.98 5.26 5.54 Optical center FR AM CRA [deg] 2.50 (%) 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 c. 3.50 2464 pixels Rev. 2.0 33 IMX250 / IMX252 / IMX264 / IMX265 Support Package CRA characteristics of IMX252 / IMX265 3.00 2.50 1.50 1.00 0.50 0.00 0 10 20 30 40 50 60 70 80 90 100 Image height [%] CRA (deg) 0.00 0.13 0.25 0.38 0.51 0.64 0.76 0.89 1.02 1.15 1.27 1.40 1.53 1.65 1.78 1.91 2.04 2.16 2.29 2.42 2.55 no lo gi 1544pixels 0% es In c. 100% Image height (mm) 0.00 0.22 0.44 0.67 0.89 1.11 1.33 1.56 1.78 2.00 2.22 2.44 2.67 2.89 3.11 3.33 3.56 3.78 4.00 4.22 4.45 S O 2064 pixels Te ch Optical center FR AM CRA [deg] 2.00 (%) 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 CRA characteristics CRA ( Chief Ray Angle ) indicates the optimum angle of the chief ray for the image height, independent from the aperture size of the lens. This sensor assumes the recommended EPD ( Recommended exit pupil distance ) is farther than -100mm and the angle of chief ray is theoretically directional light ( perpendicular for the imaging plane ). CRA characteristics table shown above is calculated with assuming short exit pupil distance case, precisely -100mm. CRA EPD Image height Sensor CRA characteristics Rev. 2.0 34 IMX250 / IMX252 / IMX264 / IMX265 Support Package 10. FD white spots This sensor takes the common floating diffusion transistor (FD) architecture to widen the aperture ratio of the pixel. When FD has the leak current or other defect, white spot consist of 2 pixels (vertical 2 pixels) will appear. Gb TRG1 R or Output TRG0 B FD Gr In Overview of FD white spot c. FD White spot Single-pixel white spot O S Te ch Level(mV) no lo gi es The signal level of single-pixel white spots (due to the defect of single pixel) increases according to the accumulation time. On the other hand, FD white spot is constant to the accumulation time. There exist the dependency to the temperature, but characteristics are various according to the cause of the spots. FR AM FD white spot 1/120 [sec] 1/60 [sec] 1/30 [sec] Feature of FD white spot (Both single-pixel white spots and FD white spots are same level at 60 frame/s) Rev. 2.0 35 IMX250 / IMX252 / IMX264 / IMX265 Support Package FD white spot is different from single white pixel, cluster spots, then usual dynamic compensation might not be able to conceal it. Static compensation will be necessary. Please consider to use the static compensation of the ISP. Image data ISP (static compensation circuit) Sensor output with FD white spots Image data After compensation Read out the address information of FD white spots from the memory Store the address information of FD white spots previously Memory (internal / external of the ISP) FR AM O S Te ch no lo gi es In c. Address information of FD white spots of the sensor Rev. 2.0 36 IMX250 / IMX252 / IMX264 / IMX265 Support Package 11. FAQ 11.1. In case the image cannot be displayed with the finished sensor board Description Remark Please confirm that the power supply design is according to the specification - Please confirm that the applied power supply voltage level is within the recommended range (Analog Power 3.3 ±0.15V Interface Power: 1.8 ±0.1V , Digital power: 1.2 ±0.1V.) - Please confirm that the power supply capacity is enough for the total current consumption requirement of the board including the sensor - Please confirm that the direction of the sensor (the foot print of the board and the chip) is correct Refer to the DC characteristics section of the specification Please confirm that the register communication is done correctly - Please confirm that the sensor has come out of the standby mode. Read register of address 00h and confirm that 00h has been written in the register. (See the specification or the register communication description of this document for the register read sequence ) - Please double check the communication protocol if the register cannot be written correctly. - In case of 4-wire serial communication, the LSB first protocol should be followed for both register read and write. - In case of 4-wire serial communication, it is necessary to assign the ChipID and Address again after the XCE has been set high. - Please reset the sensor through the XCLR pin right after power-on - After power-on and exit of the standby mode, the default setting is 16ch output in All-pixel 12bit mode. Please make the register settings according to the desired operation mode. Refer to P.13 of this document no lo gi es In c. Check Item Te ch 11.2. In case there is noise observed in the output image Noise Condition Check Item Remark - Please confirm that the decoupling capacitor of the power supply has sufficient capacitance and is put close to the sensor pin. - Please also confirm that the decoupling capacitor of VCP1, VCP2, VBGR pin has sufficient capacitance as well. Refer to P. 4 of this document Horizontal stripes with random timing, not always present - Please confirm that the register communication timing and the sensor data output timing are not overlapped. Conduct the register communication during the assigned period of the operation mode. Posterization, bit loss - Please confirm that the bit depth of the captured image data and that of the output image data are matched - It is possible that the data capture timing is critical. Please compare the output waveform of the DO pin against that of the DCK pin to confirm that there is no problem with the data capture timing. Regarding the communication timing, refer to the Operation mode section of the specification. Regarding the timing, refer to the AC characteristics section of the specification. FR AM O S Vertical or horizontal stripes, always present Rev. 2.0 37 IMX250 / IMX252 / IMX264 / IMX265 Support Package Revision History Version Date Page Rev.1.0 30-Jan-15 --- Rev.1.1 10-Feb-15 P6 Remarks First edition Correction : Figure of Reference design for digital power supply pins Add : Section of IMX252 Optical dimension Rev.1.2 06-Mar-15 P38 Section of IMX252 CRA characteristics Correction : c. Recording pixels of All Pixel scan Add : In All page es IMX264, IMX265 P14 to 16 Chapter of Package center, optical center, Package Outline and lo 18-Sept-15 no Rev.1.3 gi Delete : The sections written on Datasheet ch Reflow Profile Add : Te P33 Rev.1.5 25-Sept-15 FR AM Rev.1.4 O S Section of How to get sensor information 13-Nov-15 Correction : P33 - 34 CRA characteristics Correction : P17 Figure of Reference design for I2C serial communication Rev. 2.0 38 IMX250 / IMX252 / IMX264 / IMX265 Support Package Version Date Page Remarks Correction : P22 Chip ID = 02, Address = 22h.Setting value Correction : P22 - 25 Chapter of “Register map for pattern generator function” Add : P25, P29 Constrained condition of COLORWIDTH register 15-Apr-16 Correction : P30 Type name Information Correction : P31 Correction : In P32 c. Figure of 1080p Pixel Area for IMX250 / IMX264 O S Te ch no lo gi es Figure of 1080p Pixel Area for IMX252 / IMX265 FR AM Rev.2.0 Rev. 2.0 39