HDM180223-NY-02
An example of cure profile of HD-7110
(In the case of 180C/2h cure)
200
Temp(C)
150
100
50
0
0
50
100
Time(min)
150
200
Step1: Ramp-up from RT to 180C(Rate: 5C/min)
Step2: Holding: 180C/120min
Step3: Cooling: 180C - 100C/30-60min
* Under N2 gas (O2 concentration for Cu substrate </= 20ppm)
1
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