·a. up ---i Ec E7P ge wou Zam zen i i Forward Bias : t i - ↳i in - a (Vbi-Vf] . . . . . . Esp------- I due bias to internal E opposes - Voi-V-Barrier V = V =- Y Vr in FB + - in R B . pot . Reverse Bias Tr - Ei zap Esp - - - I C Ezn Erm - w = xwa)V) (Vsi = NaNd %i - - T -+ da duno -> - -x - du e i--> ↳ & i un - gNa gen , i i +V am c d = dD c Depletion capacitance -> gANadUno= = = = gANadupo gANd Ano dVR I watral I noo-val c - = = /is (Vxi-v)"- c'< N] - holt ↳ used . " a sanctypepet cap Variable turned in cap ekt . c = ( EA (Ubi-V) #wal)" In c A = - W Id plate cap DOPING # fe Na Nd e x = 0 Epitaxial junct we surface 4 = 0 Linearly graded junct doped show juncti m No-Na m = - x = 3 m = 2 m 2 1 = Na pt i m Linearly graded junct = 1 e When m Higher Linearly - = values of depends profile) low denote depends Voi iC on Gx = Hyper abrupt junct in desends physical doped junct on changes nature C -> C 0 doped junct Fa = = No - ne 0 Nd x m = V & Vi on- funchon type changes Idopuy of junch => W & - ion - (C/mi) Space charge density ((n) qGx ; : +o do ~ X L - x D = 0 no = Ge slope of dopingnon e an - Poisson = n AE(u) +(m) = : jdz(n) = = 2 (udn E(x) A n = 1. = No V(u) u At m Vo = = = = - Ro n. S - ni) (z(u) du enteragendary -> v = 0 - no=[ 2-20 : C q(n = - V(x) A = . E(u) + b)" I ↳rate - ⑳ - ↑D C ⑳ nt Metal semi conductor junctions Metal ⑪ ② -> conductor semi I unctions junct Rectifying/Schotthey contacts Non- - Junction -I* equilibrium y ↓ "gus i - - - - - - - - . . . . --Ei Er - Evac i : same - peplate region ↳ I g(Vo-Vf] I : can't This - L barrie I In . B : - cross this Evac const . 84 = q(Pm-Us) - ... This z . Be R B . + - L 2 ↓ q(Vo can b & I flow of V) - = = 0 er -> changed be g(0m-Ps) - - - - - - - - x same + barrier a qVo i --------in W - makes - ↑ ↑ barrier remains This &..... ↓ a - ↑ eginity Ess - Ps > flowd) (n-type) Evac Evac At high speed :minosity Semiconductor Pm : : Metal Assume types carrer /ohmic Schottkey 2 - Ec Ess - moves Efm Zw Ess not same i Ibarrie reduces easy Barrie in up n-type # I Atype Majority role No Pm Rectifying property - of carrie minority -I* I -> no flow majority flow 4 Schottkey diodes Om <@s , faster (p-type) Semiconductor Metal Evac an conduct current >Ps (n-type) : p-type exa - Yards - - - - - - - Zem e · Pm < Ev Os marget we harl I ! i - Ev e Pm<5 ⑧ tydue ae Even ou zi - Ev > Accumulat i t I nin. -> ev - man ions . Eva - Es - more ne - a Ec EEs -Ev - I ↳ - mic - - metal & Current m-type - have of plentyboth conduct direct e in or s Pr >4 - pmcps Dope b Schottkey/Rectifigon Cutty Res (p-type) (n-type) I Now-rectifying/ side semiconductor junath G-21 to create obnic m-type - : heavily Chmic ! mps I ev er -- Ec - i I in n M ↳ = er 0 metal S 1 If surface of m-type Si created SiOz - left is as it is , insulator SiOz . The determine traps/creates charges charges called These properties of junct interface · are . charges . == -- e- trafed a S - SiO2 - I - Ev It In may Homojunct · Eg : junct case a on unction Ec . . . . - - - Es - - - . . . Ea W EE - - - ↳ Erac- letter capital global - Erac (10c) -> Ito Local for for highe Eg level vacuum that convenience) zar--ggi zenit - Discont , I . Dza remains I - - - - - - Ev N I - same (just (abrupt jump) a - bending - - - no , level vaccum so material constant - infinity) Bands ↳ Egi Ev - - - - P I= a sid - - zv a . --Evac - . of junct rides for materials used ferent Z . . both for same this in material same Heterojunct · If below go Ecz - - ~ 2 zvz ↓ Egn & alligned Es = case S conduct + Azc 194 = ben i + , e Er ) Egi) 1Dz1 = - ~ 4 = . discontinuity band q(x, = AEv Ec ↑ - DEc general already here (84- - /Azg! _ i - - zg2) + --- er e I I - Zez I - . . . I EF1 Evi - - - e ! P - - Ecl E F Evi - - - - - - - Efz e - - Li i A zVz Ev I n I - . . . -- ! Evac - in Ec . I - - - - - - - - - - - ! DEr TS physical phenomenc same Ecz E Eve I as p-u juncti (homojunct GaAs-AlmGa , As totter junct Lattice matching important for incr L-22 : neterog Ave to Dislocat charges change lattice mismatch present- defect are thapfed & properties a changes changing ste eBandgapheterojunct , of LPE -> , Band layers LVD) Ez Ensure Earne - I --Ez Ernie staggered hellojuncti Ev2 GaAs engineering : - straddling heterojmcth a . Epitaxial /MBE - e 400 As - . - St -Alo , · blende Eve Ea Ev . . Ecz - -Evz Broken · Based gup material type of Aniso + y ① on <P -n xe N Isotype pN Eg p - nP smalle -n P : - I wider & used xN - -> PP N P - - ------ ↓ Ea EF Eve 1Ec - qu ↓ , . Ec . . i - g(x- = & Ev = DEg ↓ I T ----. . ------- - x . ) -IEc · Ev . ↓ qUz . . - I - Ecz 212 - Evz N P - - - - - - T . - in i i EF - Eve - - - I I - - - I - - I - P Evz - N n - EC , EF - - - - Ecz - - ↑ - - i I Ec - - Ecz EF2 - Eine ily doped slightly doped GaAs Zes Al - ~1A~ - Evz GaAs Jee - - Zz Evi in - - - - - - - - -↳ zez - - I A Ev - tele no depleth layer . Accumulate layer is present . Eve N I i= - - - AlGaAs GaAs , - VI2] 1 ~ levels Energy quantized here fatial well created at junct energy levels quantized Triangular potential V(z) = qz well > 2 ; z = >z there D O ; 2 DEG - - - - 2 - ~ electrow quanle D gas direct AlGaAs GaAs - - mobility well all . There eron Gats scattering is low temp lattice M hig h We , is highly to y in junct direct a but not direct (quantized levels) energy Emquinity At not -=> dopede of in in . direct current y conduct in Livel -> cont levels energy and doped side very high low baoz seattering created & ? N etcross is potential low . lightly doped ? streetman A Donald L - 23 MOS Banerjee Neamen ictr for mostet for . - : ④ - Metal E z1TF--foxide A . . . Eox I kamud adenee d V e - bir when-we semiconductor appried interface # accumulate holes of - ④ Metal z4+e oxide + ⑳ p-type f - - W - - pation I oxide . + at T ↑ - when regin E7 BIAS p-type --te -Ent at a instant - -- - - - i 3 p-type (Depleth region width) ==== ! --- = - Sina / Harge) Esi e- Band is bending functi becomes m-type bias from come material => Ep mosses at of bias Mos interface semiconductor oxide voltage . oxide ↳tagamit-I - el I p-type Ec --<epsp I= I S ↳ be considered as one sided i ↓ - - zI un - -> Ei -- - cam e ! ud pro e Moderate I junct - Ev the applied bias Exi Es = epp = w = Je merei I In() = potential / (a "wa)]" potential ept face ps ind= V = contact - p-n junct larger Ppp : e Yogio mos width p-type e zc -- -- E - - - 2qs = 247p L 24 ↓ I p - - - - fr ePAp ↑ I - . . . . . . . 7 - - -Ev S I Ei - - - - - - 2 pyp Ezi = - ZE ↳- ad I come at , oxide-semiconductor interface-hole bulk come . In p-type sein conductor This gate holt. If Temp ad at occurs not , 4 . certain . much more , e Further gate voltage Ec change created in . be can Ud inc . in maximizes (invlayer - 4) inc -S 247p = corresponding ma = -> gate (p) Threshold inversion holt threshold . is " max. value pt . voltage fold . at inversion pt . . small very M Evan S n e If y -Jedio zojen: Frnt- I - . . . modified work com ~------ functio Devac Ew) - =m - Ec ---------Ei . . . . . EF - -Ev 11 Eco very close freeL-24 e trac to . Ev the needssmallever I late : - ↓ ----- eV OXO - - - ...... i - - - pin Ec Ey/z - epso x Ev > equilibrium - I - - - In zvan t - - Modified f te moth ~metal affinity e defined - m to reference conduct band e) Voxo potential -> surface pso- drop softential / of energiesto from of side metal fermi the - conductor epin e + Voxo side + semiconductor formi sum at zelobias oxide across - level level at o on on bias the semi- . Voxo ex'+ = + pso=-[Pi-IX'+ ePIp-epso + 22 Pep(I - = Pms - (x S Pn - + + 2 Pep) /metalconducte funct difference und work metal degenerately -> doped poly entI - si - ↑ epeei ~ Er Earne I - W -- 1 -10 (n+ poly si) I m Melting pt . of Al $700 S (p-type) Ev done Dofing temp high - by substrate p-type I +1 n -> gate self aligned For Si poly For p-type pas= (2' - avoid 4ns ) + x = . poly - = metting problem (x' z 45p) + (2 4-r) & poly si p (v - EF - 4 + - = p) Pep + E - P (n) S Ec Hat + + = p'n-(4 Mo El used to si substrate m-type - - - - - Band condit done is 2 substrate - Gas which process E = For implantat" Al melts down iou i zv which nott for Gate is there is no band bed a fe a t scasion F additional Broken/ Dangling bond-contributeinterface charges at oxide semiconductor interface in minimize is on volt If gate applied - Vi , X-25 : = done Vox charges appears which It . depends Als -Noxo)+(0s-Pso) Vox Vox argon) Pms + Nox = (like . static why - = A Vox = Va temp- +450 = bonds dangling rise to the oxidat atmosphere inert gives reason voxo Si-SiOz . Annealing to This at atoms floating Ps + 4s + + Pms Gms + gate Flatbandvoltage molt -I I I ↑ - & VER - - which For Ea EI : - - === - s -Er mo Va VIB = S bad e band No Oss - sen bending trapped charge conductor - 0 M Ps = = 0 (surface potential) unit pur ale interface at oxide S(p-type) A On induced -charge Ndeplet Om Voxo + 450 + ↳ Va V = Dss = = here - 0 = per I no unit area deplet at neutrality charge condit -Gms serface potential AVox = = Vox charge laych metal on A + ps Nox-Voxo) Vox + at (Ps obias - Pso) 4s+ Oms + ; Cox -oxide cap per unit area Nox - = Ver =Va - = (Ps ums + 0 = at F . condit) pusthreshold At Patr -> ↳ max . S O M I- * - MAT - - I 19 = Rit+Rss 19's Va DVox = = Va = Vox Viw V = e (max . Na IQ'ss (max) = (max) 1 eNaxdT = Als + Ps + Pms GS= 20yp , Voxe + 2 + ↳ nolt . 45p across + Pms oxide at B threshold ) ! UdY Voxe = [10s(wex) 1-D's] = I = Threshold Ver - Ex (l@ss = nott when p-type VEB substrate used Vir (max)1 + Pas + 24 P Pas -x = &max) = & ss) - VFB + 2 PEP + 20x Form-ty/ substrate s - Vip -2max)) = Oss= ! ↑iOss= + ...... in ........ w() ↑ / -- / ~ & ss - -> = 0 5 -> Oss = x 24 + 10" ......... 1 & V VEB + -2 am 10" am 101 -2 #why trend - - ... 1 1613 jo'n ~i &n In inte : I 1991 Pan . -3) (n strong Accumn- - - lation = L - Io ou - inversion - Deplete - > wick Is 4 P # de this ? L - 26 · consider & is V + 10" um2 = w substrate p-type tox= , > = pop r's &' (max) , (max) Na e = /max.) Vin 3 = =-0 . . 89 . layer So charge inversion . is - d , 83V . (capacitance i jus - - . 43 Pep & 2200 of deplet region um Clam2 the dol it induces -> layer red &Oms at Fou . age is induce even volt) mad . Past -> why-ve ? layer ve 2 +10-9 In & oxide cr Na= 10 Pms=-0 , max-width = 341V is 0 = W Trapped charges (9ss) inversion chargeit Also lightly is it enough CV SiO2 essy - (p(" : R'ss - 300K = , # en() v= = was VEN 500 T Y = Ver get at in low - version doping characteristics Assumpth -ve nort he No ve - We . conc - fixed charges (D's = 0) , vn-ve 3 regions c = e Accumulation - 14die V DC -> + depletion , Differential change Differential small charge in change inversion in holt . AC m S 0 M i -Ze --------- Eri . . . . . . . . . . -Ef -Er Accumulat ( - Now effect ideal charges , M can frequency & S 0 I from fixed come interface changes veva) oxide . Fildal + I charge e distribut # - !.. X 190' Capacitance C acc= here cox = only due -> to oxide in charges - accumulation region S M j prtype Ec - . . . . . un Depletion Id - S 0 M Er I + Q nd- * ar top" C'ap + : + Cox s mage we acitance cap I pation acrol I - cox/cion Lox = i x C dep cisp = I -(ad -> min : und is When max - At theshold inversion Ma= : not -> max . pleti layer ci= width *) was O M =* M re Ec EI - I Inversion 1 M = # i + S 0 I ( veva) -S I - = - da dete FT ↳ Einv = Cox Inversion - de 2no = x cap ar Cim= x, Cix = charge B e Ex change -lett by charge is in differential change - ~ en charge 2 / I Cox Accumulation Strong inversion -------> YseplW et" ion j I W c'dep I weak . . . · ↓ inversion Cin - w Vo