6500 Packet-Optical Platform
Photonics Equipment
Release 12.3
What’s inside...
New in this release and documentation roadmap
Photonics equipment description
Photonics equipment procedures
323-1851-102.6 - Standard Issue 3
December 2019
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In Asia
+81-3-3248-4680 (Japan)
E-mail: sales@ciena.com
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
In India
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6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
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6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
v
Contents
0
New in this release and documentation roadmap
Photonics equipment description
xv
1-1
Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT circuit pack
(NTK554BAE5) 1-5
Overview 1-5
Supported functionality 1-8
Supported SFPs 1-9
Performance monitoring 1-10
Alarms 1-10
Equipping rules 1-11
Technical specifications 1-13
Single Line Amplifier (SLA C-Band) circuit pack (NTK552AAE5) 1-17
Overview 1-17
Supported functionality 1-20
Cross-connection types 1-21
Cross-connection rates 1-21
Performance monitoring 1-21
Alarms 1-24
Equipping rules 1-25
Technical specifications 1-26
Latency 1-28
Midstage Line Amplifier (MLA C-Band) circuit pack (NTK552BAE5) and Midstage
Line Amplifier (MLA L-Band) circuit pack (NTK552BL) 1-29
Overview 1-29
Supported functionality 1-32
Cross-connection types 1-33
Cross-connection rates 1-33
Performance monitoring 1-33
Alarms 1-36
Equipping rules 1-37
Technical specifications 1-38
Latency 1-43
Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs (NTK552FAE5 and
NTK552FB) 1-44
Overview 1-44
Supported functionality 1-49
Cross-connection types 1-50
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
vi Contents
Cross-connection rates 1-50
Performance monitoring 1-50
Alarms 1-54
Equipping rules 1-55
Technical specifications 1-56
Latency 1-61
Midstage Line Amplifier 3 (MLA3 C-Band) circuit pack (NTK552GAE5) and Midstage
Line Amplifier 3 (MLA3 L-Band) circuit pack (NTK552GL) 1-62
Overview 1-62
Supported functionality 1-66
Cross-connection types 1-67
Cross-connection rates 1-67
Performance monitoring 1-67
Alarms 1-71
Equipping rules 1-72
Technical specifications 1-73
Line Interface Module (LIM C-Band) circuit pack (NTK552DAE5) and Line Interface
Module (LIM L-Band) circuit packs (NTK552DL and NTK552DN) 1-80
Overview 1-80
Supported functionality 1-83
Cross-connection types 1-83
Cross-connection rates 1-84
Performance monitoring 1-84
Alarms 1-86
Equipping rules 1-87
Technical specifications 1-89
Latency 1-90
Single Line Raman Amplifier (SRA C-Band) w/Optical Service Channel (OSC) 1xSFP
10/100 BT WSC circuit pack (NTK552JA) 1-91
Overview 1-91
Supported functionality 1-94
Cross-connection types 1-94
Cross-connection rates 1-94
Supported SFPs 1-95
Performance monitoring 1-96
Alarms 1-100
Equipping rules 1-101
Technical specifications 1-103
OSC SFP optical specifications for SRA circuit packs 1-105
Latency 1-105
Switchable Line Amplifier (XLA C-Band) circuit pack (NTK552KA) 1-106
Overview 1-106
Supported functionality 1-109
Performance monitoring 1-109
Alarms 1-112
Equipping rules 1-113
Technical specifications 1-114
Latency 1-117
Service Access Module (SAM C-Band) w/Optical Service Channel (OSC) 1xSFP 10/
100 BT WSC circuit pack (NTK552JN) and Enhanced Service Access Module
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Contents vii
(ESAM C-Band) w/Optical Service Channel (OSC) 1xSFP 10/100 BT WSC
circuit pack (NTK552JT) 1-118
Overview 1-118
Supported functionality 1-123
Cross-connection types 1-123
Cross-connection rates 1-123
Supported SFPs 1-124
Performance monitoring 1-125
Alarms 1-130
Equipping rules 1-131
Technical specifications 1-133
OSC SFP optical specifications for SAM/ESAM circuit packs 1-135
Latency 1-135
WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5) 1-136
Overview 1-136
Supported functionality 1-138
Performance monitoring 1-140
Alarms 1-142
Equipping rules 1-143
Technical specifications 1-145
Latency 1-145
WSS 100 GHz w/OPM C-Band 2x1 circuit pack (NTK553JAE5 and
NTK553JB) 1-146
Overview 1-146
Supported functionality 1-152
Performance monitoring 1-153
Alarms 1-156
Equipping rules 1-157
Technical specifications 1-159
Latency 1-160
WSS 100 GHz w/OPM C-Band 4x1 circuit pack (NTK553HA) 1-161
Overview 1-161
Supported functionality 1-164
Performance monitoring 1-165
Alarms 1-167
Equipping rules 1-168
Technical specifications 1-169
Latency 1-169
WSS 50 GHz w/OPM C-Band 9x1 circuit pack (NTK553FAE5 and NTK553FC) and
WSS Flex C-Band w/OPM 9x1 circuit packs (NTK553LA and
NTK553LB) 1-170
Overview 1-170
Supported functionality 1-176
Performance monitoring 1-178
Alarms 1-182
Equipping rules 1-183
Technical specifications 1-185
Latency 1-187
WSS Flex L-Band w/OPM 8x1 circuit pack (NTK553LM) 1-188
Overview 1-188
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
viii Contents
Supported functionality 1-191
Performance monitoring 1-193
Alarms 1-195
Equipping rules 1-196
Technical specifications 1-197
Latency 1-197
WSS w/OPM Flex C-Band 20x1 circuit pack (NTK553MA) 1-198
Overview 1-198
Supported functionality 1-201
Performance monitoring 1-203
Alarms 1-205
Equipping rules 1-206
Technical specifications 1-207
Latency 1-207
WSS 50 GHz w/OPM C-Band 2x1 circuit packs (NTK553KCE5 and
NTK553KAE5) 1-208
Overview 1-208
Supported functionality 1-214
Performance monitoring 1-215
Alarms 1-218
Equipping rules 1-219
Technical specifications 1-221
Latency 1-221
ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack (NTK553RA) 1-222
Overview 1-222
Supported functionality 1-225
Performance monitoring 1-226
Alarms 1-230
Equipping rules 1-231
Technical specifications 1-232
Latency 1-238
Optical Power Monitor (OPM C-Band) 2 Port circuit pack (NTK553PAE5) and Optical
Power Monitor (OPM Flex C-Band) 2-Port circuit pack (NTK553PB) 1-239
Overview 1-239
Supported functionality 1-243
Performance monitoring 1-244
Alarms 1-247
Equipping rules 1-247
Technical specifications 1-248
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit packs
(NTK508AxE5) 1-250
Overview 1-250
Supported functionality 1-253
Cross-connection types 1-254
Cross-connection rates 1-254
Performance monitoring 1-255
Alarms 1-257
Equipping rules 1-257
Technical specifications 1-259
Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (NTK553GAE5),
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Contents ix
Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (NTK553GB), and
Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack
(NTK553GC) 1-260
Overview 1-260
Supported functionality 1-267
Performance monitoring 1-269
Alarms 1-274
Equipping rules 1-275
Technical specifications 1-276
Latency 1-277
12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack (NTK508FAE5)
and 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit pack
(NTK508FL) 1-278
Overview 1-278
Supported functionality 1-281
Cross-connection types 1-283
Cross-connection rates 1-283
Performance monitoring 1-283
Alarms 1-287
Equipping rules 1-288
Technical specifications 1-289
Latency 1-290
8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band 1xCXM) circuit
pack (NTK508HA) and CCMD8x16 C-Band Expansion Module (CXM C-Band
Type 1) (NTK576BA) 1-291
Overview 1-291
Supported functionality 1-297
Performance monitoring 1-300
Alarms 1-302
Equipping rules 1-303
Technical specifications 1-304
Latency 1-306
Optical multiplexers (OMX) modules (NT0H32xxE5) 1-307
Overview 1-307
OMX 4CH DWDM 1-310
OMX 16CH DWDM 1-318
Alarms 1-327
Equipping rules 1-327
Technical specifications 1-327
Center wavelength frequencies 1-330
OMX engineering rules 1-331
Optical link budgets 1-331
Calculating the link budget - OMX 4CH 1-332
Calculating the link budget - OMX 16CH 1-338
OMX fibering 1-344
44 Channel Mux/Demux (CMD44) 100 GHz C-Band modules (NTT862AAE5 and
NTT862FAE5) 1-349
Overview 1-349
Supported functionality 1-353
Cross-connection types 1-356
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
x Contents
Cross-connection rates 1-356
Alarms 1-356
Equipping rules 1-357
Technical specifications 1-358
Latency 1-359
44 Channel Mux/Demux (CMD44) 50 GHz C-Band modules (NTT862BAE5,
NTT862BBE5, NTT862BCE5, NTT862BDE5) 1-360
Overview 1-360
Supported functionality 1-366
Cross-connection types 1-373
Cross-connection rates 1-373
Performance monitoring 1-373
Alarms 1-375
Equipping rules 1-375
Technical specifications 1-376
Latency 1-376
64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (NTT862JA) 1-377
Overview 1-377
Supported functionality 1-379
Cross-connection types 1-382
Cross-connection rates 1-382
Alarms 1-383
Equipping rules 1-383
Technical specifications 1-384
Latency 1-384
96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (NTT862EA) 1-385
Overview 1-385
Supported functionality 1-387
Cross-connection types 1-392
Cross-connection rates 1-392
Performance monitoring 1-392
Alarms 1-394
Equipping rules 1-394
Technical specifications 1-395
Latency 1-395
16 Channel Mux/Demux (CMD16) 100 GHz C-Band module (NTT862KA) 1-396
Overview 1-396
Supported functionality 1-398
Cross-connection types 1-401
Cross-connection rates 1-401
Alarms 1-401
Equipping rules 1-401
Technical specifications 1-402
Latency 1-402
24 Channel Mux/Demux (CMD24) 100 GHz C-Band module (NTT862LA) 1-403
Overview 1-403
Supported functionality 1-405
Cross-connection types 1-408
Cross-connection rates 1-408
Alarms 1-408
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Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Contents xi
Equipping rules 1-408
Technical specifications 1-409
Latency 1-409
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band modules
(NTK504AxE5) 1-410
Overview 1-410
Supported functionality 1-414
Alarms 1-416
Equipping rules 1-417
Technical specifications 1-418
Broadband Mux/Demux 1x2 module (NTT862DAE5) 1-419
Overview 1-419
Supported functionality 1-420
Alarms 1-422
Equipping rules 1-422
Technical specifications 1-423
Latency 1-423
Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (NTT862DCE5) 1-424
Overview 1-424
Supported functionality 1-425
Alarms 1-427
Equipping rules 1-427
Technical specifications 1-428
Latency 1-428
Monitor Broadband Mux/Demux 1x2 (MBMD2) module (NTT862DDE5) 1-429
Overview 1-429
Supported functionality 1-430
Alarms 1-432
Equipping rules 1-432
Technical specifications 1-433
Latency 1-433
C/L-Band Mux/Demux (CLMD) module (NTK504PA) 1-434
Overview 1-434
Supported functionality 1-436
Alarms 1-437
Equipping rules 1-437
Technical specifications 1-439
Latency 1-439
Upgrade Coupler/Splitter (UCS) module (NTK504PL) 1-440
Overview 1-440
Supported functionality 1-441
Alarms 1-443
Equipping rules 1-443
Technical specifications 1-444
Latency 1-444
10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10 Group Mux/
Demux (GMD10) L-Band module (NTT862GL) 1-445
Overview 1-445
Supported functionality 1-449
Alarms 1-450
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
xii Contents
Equipping rules 1-451
Technical specifications 1-451
Latency 1-452
Fiber Interconnect Modules (FIM) (NTK504CA, NTK504CB, NTK504CD, NTK504CE,
and NTK504CF) 1-453
Overview 1-453
Supported functionality 1-461
Alarms 1-467
Equipping rules 1-468
Technical specifications 1-469
Latency 1-469
Optical Service Channel (OSC) Filter (1516.9 nm) module (NTK504BA) 1-470
Overview 1-470
Supported functionality 1-472
Alarms 1-473
Equipping rules 1-473
Technical specifications 1-474
Dispersion Slope Compensation Modules (DSCM) (NTT870AxE5, NTT870CxE5,
NTT870ExE5, and NTT870GxE5) 1-475
Overview 1-475
Supported functionality 1-477
Alarms 1-478
Equipping rules 1-478
Technical specifications 1-479
Latency 1-481
Fixed Gain Amplifier (FGA C-Band) circuit pack (NTK552AB) 1-482
Overview 1-482
Supported functionality 1-484
Performance monitoring 1-485
Alarms 1-487
Equipping rules 1-488
Technical specifications 1-489
Latency 1-490
Photonic passive equipment 1-491
Overview 1-491
2-Slot Optical Module Chassis (OMC2) (NTK504NA) 1-492
2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001) 1-493
2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900) 1-495
6-slot passive photonic chassis (PPC6) (174-0040-900) 1-497
100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x) 1-500
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module (174-0104900) 1-506
Performance monitoring 1-508
Cross-connection types 1-510
Cross-connection rates 1-510
Latency 1-510
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module (174-0115900) 1-511
Performance monitoring 1-513
Latency 1-515
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Photonics Equipment
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December 2019
Contents xiii
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module (174-0116900) 1-516
Performance monitoring 1-518
Latency 1-520
Band splitter 100 GHz modules (B-720-0020-0xx) 1-521
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module
(B-720-0014-003) 1-527
2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (B-955-0003-00x, B955-0003-3xx, 166-0203-9xx, 166-0403-9xx) 1-528
Supported functionality 1-533
Alarms 1-537
Equipping rules 1-537
Technical specifications 1-540
Photonics equipment procedures
2-1
Photonic circuit packs provisioning procedures 2-1
Non-passive photonic OTS 2-2
Passive photonic OTS 2-3
List of procedures
2-1
Provisioning a circuit pack automatically 2-5
2-2
Provisioning a pluggable automatically 2-10
2-3
Routing fiber-optic cables and electrical cables onto the 6500 shelf 2-11
2-4
Connecting or disconnecting fiber-optic cables to or from circuit packs 2-12
2-5
Setting up the photonic system configurations 2-13
2-6
Changing the primary state of a facility 2-14
2-7
Changing the primary state of a circuit pack or pluggable 2-16
2-8
Deleting a facility from an equipment 2-18
2-9
Deleting a circuit pack, module, or pluggable 2-20
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
xiv Contents
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
xv
New in this release and documentation
roadmap
0
This Technical Publication supports 6500 Packet-Optical Platform (6500)
Release 12.3 software and subsequent maintenance releases for Release
12.3.
Issue 3
The document was up-issued to include
•
the modified equipping rules for ROADM with Line Amplifier (RLA) C-Band
5x1 circuit pack (NTK553RA). See “Equipping rules” on page 1-231 for
details.
•
updated “Equipping rules” on page 1-196 and “Technical specifications”
on page 1-197 of WSS Flex L-Band w/OPM 8x1 (NTK553LM) circuit pack.
Issue 2
Clarified that the L-Band Photonic circuit packs introduced in Release 12.3 are
supported in submarine configurations only.
Issue 1
The following section details what’s new in 6500 Packet-Optical Platform
Photonics Equipment, 323-1851-102.6, Standard Issue 1 for Release 12.3.
The following new/enhanced features are covered in this document.
•
L-Band Photonic hardware
— 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit pack
(NTK508FL)
— 10 Group Mux/Demux (GMD10) L-Band module (NTT862GL)
— Wavelength Selective Switch (WSS) Flex L-Band w/OPM 8x1 circuit
pack (NTK553LM)
— Midstage Line Amplifier 3 (MLA3 L-Band) circuit pack (NTK552GL)
— Line Interface Module (LIM L-Band) circuit pack (NTK552DN)
— C/L-Band Mux/Demux (CLMD) module (NTK504PA)
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
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xvi New in this release and documentation roadmap
•
SMD Flex C-Band 14x8 circuit pack (NTK553GC)
•
16 Channel Mux/Demux (CMD16) 100 GHz C-Band module (NTT862KA)
•
24 Channel Mux/Demux (CMD24) 100 GHz C-Band Module (NTT862LA)
ATTENTION
In the current release, software support for CMD16 and CMD24 modules is
limited to inventory display. Any software feature descriptions that refer to
CMD modules, other than those related to inventory, do not apply to the
CMD16 or CMD24 unless stated otherwise.
This Technical Publication no longer provides latency specifications. All
latency information is available in Latency Specifications, 323-1851-170.
6500 Packet-Optical Platform technical publications
The following two roadmaps identify the technical publications that support the
6500 D-Series and S-Series and the technical publications that support the
6500 T-Series platform for Release 12.3.
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
New in this release and documentation roadmap xvii
6500 D-Series and S-Series roadmap
Planning a Network
Installing,
Commissioning and
Testing a Network
Managing and
Provisioning
a Network
Maintaining and
Troubleshooting
a Network
Circuit Pack-Based
Documentation
Documentation
Roadmap
(323-1851-090)
Planning Parts 1, 2, and 3
(NTRN10ED)
Installation General Information
(323-1851-201.0)
Administration
and Security
(323-1851-301)
Common Equipment
(323-1851-102.1)
Installation 2-slot Shelves
(323-1851-201.1)
Configuration Provisioning &
Operating Parts 1 & 2
(323-1851-310)
Fault Management Performance
Monitoring
(323-1851-520)
Data Comms
Planning & User Guide
(323-1851-101)
Ordering Information
(323-1851-151)
Manufacturing
Discontinued Parts
(323-1851-155)
CLI, REST, gRPC &
Waveserver-6500
Interworking
(323-1851-165)
Latency
Specifications
(323-1851-170)
Pluggable
Datasheets
and Reference
(323-1851-180)
TL-1 Description
(323-1851-190)
CLI Reference
(323-1851-193)
Site Manager
Fundamentals
(323-1851-195)
Installation - 7-slot &
6500-7 packet-optical
Shelves
(323-1851-201.2)
Installation 14-slot Shelves
(323-1851-201.3)
Installation 32-slot Shelves
(323-1851-201.4)
Passive Chassis
(2150 & Photonics),
Filters, and Modules
(323-1851-201.5)
Licensing
(323-1851-210)
Configuration Bandwidth & Data
Services Parts 1,2,3
(323-1851-320)
Configuration Control Plane
(323-1851-330)
Encryption and FIPS
Security Policy
Overview and
Procedures
(323-1851-340)
MyCryptoTool
Certificate
Management and
Quick Start
(323-1851-341)
Electrical
(323-1851-102.2)
Fault Management Alarm Clearing
Parts 1 and 2
(323-1851-543)
Fault Management Module
Replacement
(323-1851-545)
Fault Management SNMP
(323-1851-740)
Fault Management Customer Visible
Logs
(323-1851-840)
OC-n/STM-n
(323-1851-102.3)
WaveLogic Ai, Flex,
100G+, 40G,
OSIC ISS, & SLIC10
(323-1851-102.4)
Broadband/SMUX
OTN FLEX MOTR
(323-1851-102.5)
Photonics
Equipment
(323-1851-102.6)
Data and Layer 2
(323-1851-102.7)
OTN I/F, PKT I/F, &
PKT/OTN I/F
(323-1851-102.8)
Commissioning
and Testing
(323-1851-221)
SAOS-based
Packet Services
Documentation
Command
Reference
(323-1851-610)
Configuration
(323-1851-630)
Fault and
Performance
(323-1851-650)
MIB
Reference
(323-1851-690)
Supporting
Documentation
WaveLogic Photonics
Coherent Select
(323-1851-980)
6500 Data
Application Guide
(NTRN15BA)
6500 Control Plane
Application Guide
(NTRN71AA)
Submarine Networking
Application Guide
(NTRN72AA)
Fiber Node Return
Configuration
(323-1851-985)
Universal AC Rectifier
Application Note
(009-2012-900)
6500 Photonic
Layer Guide
(NTRN15DA)
Common
6500 - 5400 / 8700
Photonic Layer
Interworking Solution
Technical Publications
(323-1851-160)
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
xviii New in this release and documentation roadmap
6500 T-Series roadmap
Planning a Network
Installing,
Commissioning and
Testing a Network
T-Series
Shelf Guide
(323-1851-103)
Installation T-Series Shelves
(323-1851-201.6)
Data Communications
Planning and
User Guide
(323-1851-101)
Licensing
(323-1851-210)
TL-1 Description
for T-Series
(323-1851-191)
T-Series Shelf
Guide
(323-1851-103)
Site Manager
Fundamentals
(323-1851-195)
Managing and
Provisioning
a Network
Maintaining and
Troubleshooting
a Network
Administration
and Security
(323-1851-301)
Fault Management Performance
Monitoring
(323-1851-520)
Configuration Provisioning and
Operating Parts 1 & 2
for T-Series
(323-1851-311)
Configuration Bandwidth
for T-Series
(323-1851-321)
Configuration Control Plane
(323-1851-330)
Fault Management Alarm Clearing
Parts 1 and 2
for T-Series
(323-1851-544)
Fault Management Module
Replacement
for T-Series
(323-1851-546)
Fault Management SNMP
(323-1851-740)
Fault Management Customer Visible
Logs
(323-1851-840)
SAOS-based
Packet Services
Documentation
Command
Reference
(323-1851-610)
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Configuration
(323-1851-630)
Fault and
Performance
(323-1851-650)
MIB
Reference
(323-1851-690)
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-1
Photonics equipment description
1-
This section provides an overview of the 6500 Packet-Optical Platform (6500)
Photonics equipment. See the following table for different circuit packs
covered in this section.
Note: Refer to 6500 Packet-Optical Platform Photonic Layer Guide,
NTRN15DA, for detailed information on Photonic concepts, applications,
and engineering rules supported in this release of 6500.
Table 1-1
Photonic circuit packs and modules in this chapter
Topic
Circuit packs
“Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT circuit pack
(NTK554BAE5)” on page 1-5
“Single Line Amplifier (SLA C-Band) circuit pack (NTK552AAE5)” on page 1-17
“Midstage Line Amplifier (MLA C-Band) circuit pack (NTK552BAE5) and Midstage
Line Amplifier (MLA L-Band) circuit pack (NTK552BL)” on page 1-29
“Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs (NTK552FAE5 and
NTK552FB)” on page 1-44
“Midstage Line Amplifier 3 (MLA3 C-Band) circuit pack (NTK552GAE5) and
Midstage Line Amplifier 3 (MLA3 L-Band) circuit pack (NTK552GL)” on page 1-62
“Line Interface Module (LIM C-Band) circuit pack (NTK552DAE5) and Line Interface
Module (LIM L-Band) circuit packs (NTK552DL and NTK552DN)” on page 1-80
“Single Line Raman Amplifier (SRA C-Band) w/Optical Service Channel (OSC)
1xSFP 10/100 BT WSC circuit pack (NTK552JA)” on page 1-91
“Switchable Line Amplifier (XLA C-Band) circuit pack (NTK552KA)” on page 1-106
“Service Access Module (SAM C-Band) w/Optical Service Channel (OSC) 1xSFP
10/100 BT WSC circuit pack (NTK552JN) and Enhanced Service Access Module
(ESAM C-Band) w/Optical Service Channel (OSC) 1xSFP 10/100 BT WSC circuit
pack (NTK552JT)” on page 1-118
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-2 Photonics equipment description
Table 1-1
Photonic circuit packs and modules in this chapter (continued)
“WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5)” on page 1-136
“WSS 100 GHz w/OPM C-Band 2x1 circuit pack (NTK553JAE5 and NTK553JB)” on
page 1-146
“WSS 100 GHz w/OPM C-Band 4x1 circuit pack (NTK553HA)” on page 1-161
“WSS 50 GHz w/OPM C-Band 9x1 circuit pack (NTK553FAE5 and NTK553FC) and
WSS Flex C-Band w/OPM 9x1 circuit packs (NTK553LA and NTK553LB)” on page
1-170
“WSS Flex L-Band w/OPM 8x1 circuit pack (NTK553LM)” on page 1-188
“WSS w/OPM Flex C-Band 20x1 circuit pack (NTK553MA)” on page 1-198
“WSS 50 GHz w/OPM C-Band 2x1 circuit packs (NTK553KCE5 and NTK553KAE5)”
on page 1-208
“ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack (NTK553RA)” on page
1-222
“Optical Power Monitor (OPM C-Band) 2 Port circuit pack (NTK553PAE5) and
Optical Power Monitor (OPM Flex C-Band) 2-Port circuit pack (NTK553PB)” on page
1-239
“4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit packs (NTK508AxE5)”
on page 1-250
“Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (NTK553GAE5),
Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (NTK553GB), and
Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack (NTK553GC)” on page
1-260
“12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack (NTK508FAE5)
and 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit pack (NTK508FL)”
on page 1-278
“8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band 1xCXM) circuit
pack (NTK508HA) and CCMD8x16 C-Band Expansion Module (CXM C-Band Type
1) (NTK576BA)” on page 1-291
Passive modules/circuit pack/chassis
“Optical multiplexers (OMX) modules (NT0H32xxE5)” on page 1-307
“44 Channel Mux/Demux (CMD44) 100 GHz C-Band modules (NTT862AAE5 and
NTT862FAE5)” on page 1-349
“44 Channel Mux/Demux (CMD44) 50 GHz C-Band modules (NTT862BAE5,
NTT862BBE5, NTT862BCE5, NTT862BDE5)” on page 1-360
6500 Packet-Optical Platform
Release 12.3
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December 2019
Photonics equipment description 1-3
Table 1-1
Photonic circuit packs and modules in this chapter (continued)
“64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (NTT862JA)” on page
1-377
“96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (NTT862EA)” on page
1-385
“16 Channel Mux/Demux (CMD16) 100 GHz C-Band module (NTT862KA)” on page
1-396
“24 Channel Mux/Demux (CMD24) 100 GHz C-Band module (NTT862LA)” on page
1-403
“4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band modules (NTK504AxE5)”
on page 1-410
“Broadband Mux/Demux 1x2 module (NTT862DAE5)” on page 1-419
“Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (NTT862DCE5)” on page
1-424
“Monitor Broadband Mux/Demux 1x2 (MBMD2) module (NTT862DDE5)” on page
1-429
“C/L-Band Mux/Demux (CLMD) module (NTK504PA)” on page 1-434
“Upgrade Coupler/Splitter (UCS) module (NTK504PL)” on page 1-440
“10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10 Group
Mux/Demux (GMD10) L-Band module (NTT862GL)” on page 1-445
“Fiber Interconnect Modules (FIM) (NTK504CA, NTK504CB, NTK504CD,
NTK504CE, and NTK504CF)” on page 1-453
“Optical Service Channel (OSC) Filter (1516.9 nm) module (NTK504BA)” on page
1-470
“Dispersion Slope Compensation Modules (DSCM) (NTT870AxE5, NTT870CxE5,
NTT870ExE5, and NTT870GxE5)” on page 1-475
“Fixed Gain Amplifier (FGA C-Band) circuit pack (NTK552AB)” on page 1-482
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
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December 2019
1-4 Photonics equipment description
Table 1-1
Photonic circuit packs and modules in this chapter (continued)
Photonic passive equipment including:
— “2-Slot Optical Module Chassis (OMC2) (NTK504NA)” on page 1-492
— “2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)” on page
1-493
— “2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900)” on page
1-495
— “6-slot passive photonic chassis (PPC6) (174-0040-900)” on page 1-497
— “100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x)” on page 1-500
— “CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4)
100 GHz modules (B-720-0020-0xx)” on page 1-500
— “CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz modules
(B-720-0022-00x)” on page 1-503
— “Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module (174-0104-900)”
on page 1-506
— “Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module (174-0115-900)”
on page 1-511
— “Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module (174-0116-900)”
on page 1-516
Band splitter 100 GHz modules (B-720-0020-0xx) including:
— “CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm)
module (B-720-0014-003)” on page 1-527
— “2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (B-955-0003-00x,
B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)” on page 1-528
6500 Packet-Optical Platform
Release 12.3
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Photonics equipment description 1-5
Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT
circuit pack (NTK554BAE5)
Overview
The Optical Service Channel (OSC) w/WSC 2 Port SFP 2 Port 10/100BT (also
referred to as 2xOSC) module provides the physical layer communication
across photonic optical spans for the 6500 system. Each module can support
two independent 155 Mbps Ethernet-over-SONET (EOS) communications
channels (one per direction) at 1511 nm that are muxed together with the line
signal in the LIM module of the associated Optical Transmission Section
(OTS). Each OSC channel is generated by a dedicated Small Form Pluggable
(SFP) that has various reach options available.
The OSC signal is divided into two working channels, an internal comms
channel for use by the 6500 OAM&P functions and a customer wayside
channel which provides a layer 2 channel for any customer communication
needs across the span.
Note: The integrated 2xOSC in SPAP-2 w/2xOSC (NTK555NA or
NTK555NB) has the exact same functionality of standalone 2xOSC circuit
pack (NTK554BAE5) described in this section.
Figure 1-1 on page 1-6 shows the faceplate of a 2xOSC circuit pack and
Figure 1-2 on page 1-7 provides a functional block diagram of the 2xOSC
circuit pack.
6500 Packet-Optical Platform
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1-6 Photonics equipment description
Figure 1-1
2xOSC circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
OSC ports
Red/yellow bi-color circle (Fail/LOS)
- Used to communicate Rx Loss of Signal/optical module fail
- Red = module fail;
- Yellow = Rx Loss of Signal
WSC ports
6500 Packet-Optical Platform
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Photonics equipment description 1-7
Figure 1-2
2xOSC circuit pack block diagram (NTK554BAE5)
Backplane
Ethernet
Switch
EOS
Mapper
SFP
1
OSC-1
EOS
Mapper
SFP
OSC-2 2
10/100BT
3
RJ45
Wayside-3
10/100BT
4
RJ45
Wayside-4
Processor
Module
Power
Supply
Legend
EOS
OSC
Ethernet over SONET
Optical service channel
6500 Packet-Optical Platform
Release 12.3
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323-1851-102.6 Standard Issue 3
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1-8 Photonics equipment description
Supported functionality
The 2xOSC circuit pack (NTK554BAE5) provides the following functionality:
•
up to two OSC facilities operating out of band in the 1511 nm CWDM
window provided by two OC3/STM1 SFP ports (see Table 1-2 for function
and connector type for each OSC port).
Table 1-2
2xOSC optical interfaces
Interface name
Physical port #
Function
Connector type
OSC 1 In / Out
1
Out-of-band (1511 nm) OSC input /
output to and from Amplifier
Dual LC
OSC 2 In / Out
2
Out-of-band (1511 nm) OSC input /
output to and from Amplifier
Dual LC
•
for an in-line amplifier application, two SFPs are required and the two
SFPs can both be equipped on the same 2xOSC circuit pack or on
different 2xOSC circuit packs. If equipped on different 2xOSC circuit
packs, it provides datacomms protection if one of the 2xOSC circuit pack
fails.
•
optical generation and termination of each OSC facility
•
Ethernet over SONET (EOS) mapping of each OSC facility
•
wayside access for customer use (IP over 10/100BT Ethernet data
communications for unspecified use by the customer) provided by two
10/100BT ports (RJ-45 MDI-X connectors). The wayside access ports are
called WSC. The default rate for the wayside channel is 10BT Full Duplex.
When configured in 100BT, the wayside traffic will be squelched when the
rate exceeds 45 Mb/sec, this is performed in order to avoid OSC link
congestion and potential impact on management and operations. Refer to
6500 Packet-Optical Platform Photonic Layer Guide, NTRN15DA for more
information on wayside channel.
Note: Each LAN port is configurable as half-duplex 10 Mbit/s, half-duplex
100 Mbit/s, full-duplex 10 Mbit/s, full-duplex 100 Mbit/s, or Automatic. If
you set the configuration to Automatic, auto-negotiation is enabled.
Auto-negotiation automatically senses the speed (10BT/100BT) and
mode (half-/full-duplex) settings of the link. If the configuration is set to
Automatic, the Wayside ports automatically detect the correct MDI/MDI-X
setting to use, so either straight or crossover cables can be used. If the
configuration is not set to automatic, then since the Wayside ports are
MDI-X type, use a straight 10/100BT cable to connect to a MDI interface
or a crossover 10/100BT cable to connect to a MDI-X interface.
6500 Packet-Optical Platform
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Photonics Equipment
323-1851-102.6 Standard Issue 3
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Photonics equipment description 1-9
•
OSC Signal Degrade alarming based on user-provisioned Signal Degrade
Threshold. Signal Degrade Threshold default is 1E-6. Other possible
values are 1E-4, 1E-5, 1E-7, 1E-8, 1E-9 and 1E-10.
•
OSC Estimated Bit Error Rate calculation.
•
RTD and distance measurement
Supported SFPs
The following provides a list of the SFPs that are supported on the 2xOSC
circuit pack.
Table 1-3
Supported SFP modules for the 2xOSC circuit pack (NTK554BAE5)
Pluggable Equipment and
Facilities (Note 1 and Note 2)
Supported SFP modules and rates
• P155M
OC-3/STM-1 CWDM 1511 nm (0-15 dB span)
— OSC, (ADJ, ADJ-FIBER)
(Note 3)
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 CWDM 1511 nm (10-30 dB span)
Part Number
NTK592NPE6
NTK592NBE6
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 CWDM 1511 nm (20-34 dB span)
NTK592NHE6
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 CWDM 1511 nm (0-34 dB span)
NTK592NGE5
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 DWDM 1610.06 nm (12-40 dB span) NTK592NS
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 CWDM 1511 nm (12-42 dB span)
NTK592NVE5
— OC-3/STM-1 (155.52Mb/s)
6500 Packet-Optical Platform
Release 12.3
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1-10 Photonics equipment description
Table 1-3
Supported SFP modules for the 2xOSC circuit pack (NTK554BAE5)
Pluggable Equipment and
Facilities (Note 1 and Note 2)
Supported SFP modules and rates
• P155622M
OC-3/12/STM-1/4 SR1/I1.1_I4.1 1310 nm SFP
— OSC, (ADJ, ADJ-FIBER)
— OC-3/STM-1 (155.52Mb/s)
Part Number
NTTP04BF
— OC-12/STM-4 (622.08Mb/s)
OC-3/12/STM-1/4 IR1/S1.1_S4.1 1310 nm XCT
Enhanced SFPs
NTTP04CF
— OC-3/STM-1 (155.52Mb/s)
— OC-12/STM-4 (622.08Mb/s)
Note 1: Facilities on Photonic circuit packs are auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities that cannot be manually added or deleted.
Note 2: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and One Planner design.
Note 3: The P155M pluggable on the 2xOSC circuit pack supports WSC facilities. These facilities are
not displayed or managed in the Equipment & Facilities Provisioning applications. They are handled by
Comms Setting Management application through LAN option under Interfaces tab. If you provision the
low output power SFP (NTK592NG) or the extended reach SFP (NTK592NV or NTK592NS), the
connected LIM port 4 OPTMON facility will be put OOS automatically to prevent the “Loss of Signal”
alarm from being raised.
Performance monitoring
The 2xOSC circuit pack supports the following monitored entities:
•
PM collection of SONET section (S)/SDH regenerator section (RS) at
OC-3/STM-1 rate for OSC facilities
•
PM collection of SONET line (L)/SDH multiplex section (MS) at
OC-3/STM-1 rate for OSC facilities
•
Physical layer PM collection for OSC facilities
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
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•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Packet Rate Limit Exceeded
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
SLDD Adjacency Loss
Pluggable alarms
• Circuit Pack Missing - Pluggable
•
Circuit Pack Mismatch - Pluggable
•
Circuit Pack Unknown - Pluggable
•
Circuit Pack Failed - Pluggable
•
Autoprovisioning Mismatch - Pluggable
•
Intercard Suspected - Pluggable
•
Provisioning Incompatible - Pluggable
Photonic alarms
• OSC Loss of Signal
•
OSC Signal Degrade
•
OSC OSPF Adjacency Loss
Common equipment alarms
• Software Auto-Upgrade in Progress
•
WAYSIDE 1 Port Failure
•
WAYSIDE 2 Port Failure
Equipping rules
The following equipping rules apply to 2xOSC circuit pack:
•
is a four-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack is not supported for use in slots 7 and 8 of
the 14-slot packet-optical shelf (NTK503SA variant).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
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•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).
•
cannot be equipped in the 2-slot shelf.
ATTENTION
If there is an intention to use Wayside traffic on the 2xOSC circuit pack now or in the
future, it is recommended to equip 2xOSC as follows:
— slot 1 of the 6500-7 packet-optical shelf (for the first pair of 2xOSC circuit packs).
— slots 1 and/or 14 of the 14-slot shelf (for the first pair of 2xOSC circuit packs).
— slots 1, 18, 21, and/or 38 of the 32-slot shelf.
— slots 1 and/or 7 of the 7-slot shelf (for the first pair of 2xOSC circuit packs).
Channels for electrical cable management within the shelf fiber management tray
associated with these slots allow for routing of two RJ-45 Category 5 Ethernet cables
to each of those slots. These channels are separated from the fiber routing area and
can be used to connect to the two Wayside Ethernet ports found on the 2xOSC
circuit pack.
The Wayside Ethernet ports are intended for intrabuilding use only. For the
NTK503KA variant of 7-slot shelf, it is recommended to use the integrated 2xOSC
on the SPAP-2 w/2xOSC (NTK555NA or NTK555NB); the second choice is to equip
a 2xOSC circuit pack in slot 1.
•
up to four 2xOSC circuit packs can be equipped in a 6500-7
packet-optical, 7-slot, 14-slot, or 32-slot 6500 shelf at the same time.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
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The following restrictions on using a cross-connect circuit pack apply when
deploying a 2xOSC circuit pack:
•
the 2xOSC circuit packs do not use any cross-connect capacity and can
be installed in shelves equipped with or without cross-connect circuit
packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a 2xOSC circuit pack
•
In a 14-slot shelf type, when the 2xOSC circuit packs are installed in slot
7 or 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a 2xOSC circuit pack
•
In a 6500-7 packet-optical shelf type, when the 2xOSC circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
Technical specifications
The following lists the weight, power consumption, transmitter, and receiver
specifications for the 2xOSC optical interface circuit pack and 2xOSC ports on
shelf processor SPAP-2 w/2xOSC.
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Table 1-4
Technical specifications for 2xOSC optical interface circuit pack and 2xOSC ports on shelf
processor SPAP-2 w/2xOSC (NTK555NA or NTK555NB)
Parameter
2xOSC (NTK554BAE5) and shelf processor SPAP-2 w/2xOSC
(NTK555NA or NTK555NB)
Weight (estimated)
0.7 kg (1.6 lb)
Power consumption
Typical (W): 20 (Note 1 and Note 4)
Power Budget (W): 20 (Note 2 and Note 4)
Transmitter
Connector type
LC
SFP types (Note 5)
Short reach SFP (0-15 dB span) (NTK592NPE6)
Standard reach SFP (10-30 dB span) (NTK592NBE6)
Premium reach SFP (20-34 dB span) (NTK592NHE6)
Long reach SFP (0-34 dB span) (NTK592NGE5)
Extended reach SFP (12-40 dB span) (NTK592NS)
Extended reach SFP (12-42 dB span) (NTK592NVE5)
Short reach SFP (NTTP04BF)
Intermediate reach SFP (NTTP04CF)
Laser modulation
NRZ
Wavelength range
1511 nm +/- 6.5 nm
Maximum transmit output
power
0 dBm (EOL) for Short reach SFP (0-15 dB span) (NTK592NPE6)
5 dBm (EOL) for Standard reach SFP (10-30 dB span) (NTK592NBE6)
5 dBm (EOL) for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-4 dBm (EOL) for Long reach SFP (0-34 dB span) (NTK592NGE5)
4 dBm (EOL) for Extended reach SFP (12-40 dB span) (NTK592NS)
5 dBm (EOL) for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-8 dBm (EOL) for short reach SFP (NTTP04BF)
-8 dBm (EOL) for intermediate reach SFP (NTTP04CF)
Minimum transmit output
power
-5 dBm (EOL) for Short reach SFP (0-15 dB span) (NTK592NPE6)
0 dBm (EOL) for Standard reach SFP (10-30 dB span) (NTK592NBE6)
1 dBm (EOL) for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-7.5 dBm (EOL) for Long reach SFP (0-34 dB span) (NTK592NGE5)
0 dBm (EOL) for Extended reach SFP (12-40 dB span) (NTK592NS)
1 dBm (EOL) for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-15 dBm (EOL) for short reach SFP (NTTP04BF)
-15 dBm (EOL) for intermediate reach SFP (NTTP04CF)
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Table 1-4
Technical specifications for 2xOSC optical interface circuit pack and 2xOSC ports on shelf
processor SPAP-2 w/2xOSC (NTK555NA or NTK555NB) (continued)
Parameter
2xOSC (NTK554BAE5) and shelf processor SPAP-2 w/2xOSC
(NTK555NA or NTK555NB)
Tx power monitor accuracy +/- 2 dB over the following power ranges:
-8 to 0 dBm for Short reach SFP (0-15 dB span) (NTK592NPE6)
-3 to 5 dBm for Standard reach SFP (10-30 dB span) (NTK592NBE6)
-2 to 5 dBm for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-10.5 to -4 dBm for Long reach SFP (0-34 dB span) (NTK592NGE5)
-3 to 5 dBm for Extended reach SFP (12-40 dB span) (NTK592NS)
-2 to 5 dBm for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-15 to -8 dBm for short reach SFP (NTTP04BF)
-15 to -8 dBm for intermediate reach SFP (NTTP04CF)
Receiver
Receiver sensitivity
-34 dBm (EOL sensitivity) for Short reach SFP (0-15 dB span)
(NTK592NPE6)
-34 dBm (EOL sensitivity) for Standard reach SFP (10-30 dB span)
(NTK592NBE6)
-37 dBm (EOL sensitivity) for Premium reach SFP (20-34 dB span)
(NTK592NHE6)
-44 dBm (EOL sensitivity) for Long reach SFP (0-34 dB span)
(NTK592NGE5)
-40.5 dBm (EOL sensitivity) for Extended reach SFP (12-40 dB span)
(NTK592NS)
-44 dBm (EOL sensitivity) for Extended reach SFP (12-42 dB span)
(NTK592NVE5)
-23 dBm (EOL sensitivity) for short reach SFP (NTTP04BF)
-28 dBm (EOL sensitivity) for intermediate reach SFP (NTTP04CF)
Receiver overload
-1 dBm for Short reach SFP (0-15 dB span) (NTK592NPE6)
-3 dBm for Standard reach SFP (10-30 dB span) (NTK592NBE6)
-10 dBm for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-7 dBm for Long reach SFP (0-34 dB span) (NTK592NGE5)
-7 dBm for Extended reach SFP (12-40 dB span) (NTK592NS)
-7 dBm for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-8 dBm for short reach SFP (NTTP04BF)
-8 dBm for intermediate reach SFP (NTTP04CF)
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Table 1-4
Technical specifications for 2xOSC optical interface circuit pack and 2xOSC ports on shelf
processor SPAP-2 w/2xOSC (NTK555NA or NTK555NB) (continued)
Parameter
2xOSC (NTK554BAE5) and shelf processor SPAP-2 w/2xOSC
(NTK555NA or NTK555NB)
Rx power monitor accuracy +/- 2 dB over the following power ranges:
(Note 6)
-29 to -1 dBm for Short reach SFP (0-15 dB span) (NTK592NPE6)
-37 to -13 dBm for Standard reach SFP (10-30 dB span) (NTK592NBE6)
-37 to -13 dBm for Premium reach SFP (20-34 dB span) (NTK592NHE6)
-44 to -24 dBm for Long reach SFP (0-34 dB span) (NTK592NGE5)
-44 to -24 dBm for Extended reach SFP (12-40 dB span) (NTK592NS)
-44 to -24 dBm for Extended reach SFP (12-42 dB span) (NTK592NVE5)
-23 to -8 dBm for short reach SFP (NTTP04BF)
-28 to -8 dBm for intermediate reach SFP (NTTP04CF)
Maximum link budget
15 dB for Short reach SFP (0-15 dB span) (NTK592NPE6)
30 dB for Standard reach SFP (10-30 dB span) (NTK592NBE6)
34 dB for Premium reach SFP (20-34 dB span) (NTK592NHE6)
34 dB for Long reach SFP (0-34 dB span) (NTK592NGE5)
40 dB for Extended reach SFP (12-40 dB span) (NTK592NS)
42 dB for Extended reach SFP (12-42 dB span) (NTK592NVE5)
7 dB for short reach SFP (NTTP04BF)
12 dB for intermediate reach SFP (NTTP04CF)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggable transceivers must be considered
separately. When estimating the total power for the equipment in a slot or in a system, you must add the
power values for each of the required pluggable devices. For pluggable transceiver power values, refer
to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For this circuit pack that must be equipped with SFPs, the power values published in this table
do not include SFPs power values. You must add 1 W to typical or power budget values per SFP.
Note 5: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and One Planner design.
Note 6: The Rx power monitoring accuracy is undefined outside the mentioned ranges.
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Single Line Amplifier (SLA C-Band) circuit pack (NTK552AAE5)
Overview
The Single Line Amplifier (SLA C-Band) circuit pack (also referred to as SLA)
is used for edge applications and contains a single (pre-amplifier)
erbium-doped fiber amplifier (EDFA), a non-amplified line passthrough with
power monitoring in place of the post amplifier, and a single OSC channel
(1511 nm) splitter/coupler. This circuit pack is equipped at a 6500 site where
pre-amplification is required according to link engineering rules.
The 6500 amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control that
delivers enhanced reach capabilities to ensure each wavelength is amplified
equally.
Figure 1-3 on page 1-18 shows the faceplate of an SLA circuit pack and Figure
1-4 on page 1-19 provides a functional block diagram of the SLA circuit pack.
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Figure 1-3
SLA circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
OSC ports
Line ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Backplane
Figure 1-4
SLA circuit pack block diagram (NTK552AAE5)
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
PD
EDFA
PD
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
Legend
EDFA
Erbium Doped Fiber Amplifier
OSC
PD
Optical service channel
Photodiode
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Supported functionality
The SLA circuit packs (NTK552AAE5) provide the following functionality:
•
wavelength range: C-band 1530.33 nm to 1565.09 nm
•
50 GHz and 100 GHz grid compliant
•
integrated OSC add/drop filters - OSC add/drop ports
•
external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
•
ALSO (Automatic Line Shut Off) functionality
•
APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the SLA circuit pack (NTK552AAE5) is
supported in MuxAmp configurations. The MuxAmp is used in some
networks where lower power interfaces (like the WL3n source) are used.
This configuration requires that the Shelf Processor disables the
Automatic Power Reduction (APR), otherwise APR may be triggered
during normal operation. For this reason, the SLA circuit pack
(NTK552AAE5) is reclassified as Class 1M from IEC 60825-1. When APR
is disabled, clamping is added automatically to ensure safety. Circuit
packs that were originally manufactured with a Hazard Level 1 warning
label can be re-labeled with the Level 1M label kit (part number
415-2818-001). For information on how to apply this label, see the section
on observing product and personnel safety guidelines in Installation General Information, 323-1851-201.0.
•
the following combinations can be used as an alternative to SLA/SLA pair
at uncompensated line-amp sites, as dictated by link-engineering
— MLA2/LIM C-Band
— MLA2 w/VOA/LIM C-Band
— MLA3 C-Band/LIM C-Band
•
SLA is supported for a Cascaded LIM C-Band or a Drop LIM C-Band
configuration
•
see Table 1-5 for function and connector type for each port
Table 1-5
SLA optical interfaces
Interface name
Physical port #
Function
Connector type
Line A In / Out
8/7
Input / output port of Amplifier A
LC
Line B In / Out
6/5
Input / output port of passthrough
channel B
LC
Monitor port for Line A Out
LC
Mon
2
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Table 1-5
SLA optical interfaces (continued)
Interface name
Physical port #
Function
Connector type
Mon
1
Monitor port for Line B Out
LC
OSC A Out
4
Optical Service Channel output
LC
OSC B In
3
Optical Service Channel input
LC
Cross-connection types
The SLA circuit pack supports the following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Cross-connection rates
The SLA circuit pack only supports the OCH (Optical Channel) Photonic
cross-connection rate.
Performance monitoring
The 6500 monitors and collects physical PMs for SLA C-Band circuit pack
facilities. Table 1-6 provides a list of monitor types supported on SLA C-Band
circuit packs. Figure 1-5 on page 1-23 shows the SLA C-Band circuit pack
optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-6
Monitor types table for Photonic SLA C-Band circuit packs
Facility
OPTMON
CHMON
AMP
SDMON
Monitor type
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
OPT-OTS
ORL-OTS
ORLMIN-OTS
ORLMAX-OTS
ORLAVG-OTS
Note 2
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X
Note 1
X
X
X
X
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Table 1-6
Monitor types table for Photonic SLA C-Band circuit packs (continued)
Facility
OPTMON
CHMON
AMP
SDMON
Monitor type
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
Note 3
X
X
X
X
Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 2: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).
Note 3: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.
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Figure 1-5
SLA C-Band circuit pack optical monitoring points
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
Facility: OPTMON port 6
Parameter: OPR-OTS*
Backplane
PD
Facility: CHMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Facility: CHMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7
Parameter: OPT-OTS* ***
Facility: AMP port 8
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS*
EDFA
Facility: OPTMON port 4
Parameter: OPR-OTS*
PD
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
* AVG, MIN, and MAX measurements are also provided.
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
OSC
Photodiode
Optical Service Channel
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Circuit Pack Latch Open
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
High Received Span Loss
•
Low Received Span Loss
Photonic alarms
• Adjacency Far End Not Discovered
•
Adjacency Mismatch
•
Fiber Type Manual Provisioning Required
•
High Fiber Loss
•
Shutoff Threshold Crossed
•
Optical Line Failed
•
Automatic Power Reduction Active
•
Input Loss of Signal
•
Output Loss of Signal
•
Automatic Shutoff
•
Automatic Shutoff Disabled
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Crossed Fibers Suspected
COM alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to SLA circuit packs:
•
is an eight-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack is not supported for use in slots 7 and 8 of
the 14-slot packet-optical shelf (NTK503SA variant).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf
The following restrictions on using a cross-connect circuit pack apply when
deploying a SLA circuit pack:
•
the SLA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a SLA circuit pack
•
In a 14-slot shelf type, when the SLA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a SLA circuit pack
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•
In a 6500-7 packet-optical shelf type, when the SLA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SLA optical interface circuit pack.
Table 1-7
Technical specifications for SLA optical interface circuit packs
Parameter
Weight (estimated)
SLA (NTK552AAE5)
1.8 kg (4.0 lb)
Power consumption Typical (W): 30 (Note 1)
Power Budget (W): 30 (Note 2)
Gain (dB)
Line A
Line B
Design Flat Gain (DFG) = 20
N/A
Typical: 12-20
Extended range: 7 to 25
Gain mask
Noise figure (NF)
(dB)
Maximum output
power (dBm)
See Figure 1-6 on page 1-28
N/A
Different at various gains
N/A
Gain 14-20 (dB)
Gain 12-14 (dB)
N/A
• NF < 7.0
(maximum)
• NF < 8.0
(maximum)
N/A
• NF < 6.2 (typical)
• NF < 7.2 (typical)
17 EOL (on average 1 dB higher)
Wavelength range
(nm)
N/A
1530.33 to 1565.09 (88 channels capable)
Minimum
Maximum
Minimum
Maximum
Line_A_Out to
Line_A_Mon
14.6
18.4
N/A
N/A
Line_B_Out to
Line_B_Mon
N/A
N/A
8.0
12.0
Tap ratio loss (dB)
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Table 1-7
Technical specifications for SLA optical interface circuit packs (continued)
Parameter
SLA (NTK552AAE5)
Insertion loss from
Line_A_In to
Line_A_Out (dB)
N/A (Note 3)
N/A
Line A
Line B
Insertion loss from
Line_B_In to
Line_B_Out (dB)
N/A
1.8 (max.)
Insertion loss from
Line_A_In to
OSC_A_Out (dB)
1.2 (max.)
N/A
Insertion loss from
OSC_B_In to
Line_B_Out (dB)
N/A
1.0 (max.)
Amplifier input and
output LOS
thresholds (dBm)
Minimum
Default
Maximum Minimum
Input LOS threshold
-40
-32
10
Output LOS
threshold
-15
-13
15
-28
Default
Maximum
-20
20
N/A (Note 4)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The EDFA modules do not have insertion loss.
Note 4: There is no output LOS alarms on passive devices.
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1-28 Photonics equipment description
Figure 1-6
SLA line A gain mask
Typical range
20
18
16
14
Output Power (dBm)
12
10
Over Gain
range
8
6
Extended
range
4
2
0
-2
-4
-6
Minimum guaranteed output
power under single channel
-8
-10
-11
-30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10
-8
-6
-4
-2
0
2
4
6
8
10 12
Input Power (dBm)
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 17 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Midstage Line Amplifier (MLA C-Band) circuit pack (NTK552BAE5)
and Midstage Line Amplifier (MLA L-Band) circuit pack (NTK552BL)
Overview
The Midstage Line Amplifier (MLA C-Band) circuit pack (also referred to as
MLA C-Band) and Midstage Line Amplifier (MLA L-Band) circuit pack (also
referred to as MLA L-Band) are used for both edge and core applications and
each MLA C-Band or MLA L-Band contains two erbium-doped fiber amplifiers
(EDFA); one in a pre-amplifier configuration (amplifying the signal as it is
entering the site from the line) and the other in a post-amplifier configuration
(amplifying the signal as it leaves the site onto the line), and a single OSC
channel (1511 nm) splitter/coupler. These circuit packs are equipped at a
6500 site where pre- and post-amplification (booster amplification) is required
per link engineering rules.
The MLA C-Band and MLA L-Band circuit packs are intended for different
applications:
•
the MLA C-Band circuit pack is a gain-controlled amplifier used in
DOC-controlled systems.
•
the MLA L-Band circuit pack is a fixed-gain amplifier used in passive
photonic systems that are manually equalized using pads.
The 6500 Amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control (in case
of MLA C-Band or fixed gain control in case of MLA L-Band) that delivers
enhanced reach capabilities to ensure each wavelength is amplified equally.
Figure 1-7 on page 1-30 shows the faceplate of an MLA C-Band circuit pack.
For MLA L-Band circuit pack, the circuit pack’s faceplate is the same as MLA
C-Band circuit pack’s faceplate with the following exceptions:
•
The MLA C-Band variant shows C-band on its faceplate while The MLA
L-Band variant shows L-Band on its faceplate.
•
“Line A In/Out” and “Line B In/Out” have spring-loaded mechanical
shutters in MLA L-Band variant.
Figure 1-8 on page 1-31 provides a functional block diagram of the MLA
(C-Band or L-Band) circuit pack. For MLA L-Band circuit pack, the circuit
pack’s block diagram is the same as MLA C-Band circuit pack’s block diagram.
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Figure 1-7
MLA (C-Band and L-Band) circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
OSC ports
Line ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-8
MLA (C-Band and L-Band) circuit packs block diagram (NTK552BAE5 and NTK552BL)
Backplane
EDFA
Mon B
1
OSC B In
3
Line B Out 5
PD
PD
EDFA
PD
Line B In
6
Mon A
2
Line A Out 7
Reflective
event
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
Legend
EDFA
OSC
PD
Erbium Doped Fiber Amplifier
Optical service channel
Photodiode
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Supported functionality
The MLA circuit packs (NTK552BAE5 and NTK552BL) provide the following
functionality:
•
wavelength range: C-band 1530.33 nm to 1565.09 nm for MLA C-Band
circuit pack (NTK552BAE5 variant)
•
wavelength range: L-band 1570.22 nm to 1605.94 nm for MLA L-Band
circuit pack (NTK552BL variant)
•
50 GHz and 100 GHz grid compliant for MLA C-Band circuit pack
(NTK552BAE5 variant)
•
200 GHz grid compliant for MLA L-Band circuit pack (NTK552BL variant)
•
integrated OSC add/drop filters - OSC add/drop ports
•
external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
•
ALSO (Automatic Line Shut Off) functionality
•
APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the MLA (NTK552BA variant) is supported in
MuxAmp configurations. The MuxAmp is used in some networks where
lower power interfaces (like the WL3n source) are used. This configuration
requires that the Shelf Processor disables the Automatic Power Reduction
(APR), otherwise APR may be triggered during normal operation. For this
reason, the MLA circuit pack (NTK552BA) is reclassified as Class 1M from
IEC 60825-1. When APR is disabled, clamping is added automatically to
ensure safety. Circuit packs that were originally manufactured with a
Hazard Level 1 warning label can be re-labeled with the Level 1M label kit
(part number 415-2818-001). For information on how to apply this label,
see the section on observing product and personnel safety guidelines in
Installation - General Information, 323-1851-201.0.
•
editing provisioned PEC between MLA C-Band, MLA2, MLA2 w/VOA and
MLA3 C-Band is supported. PEC editing is not supported between MLA
L-Band or MLA3 L-Band and MLA C-Band, MLA2, MLA2 w/VOA, and
MLA3 C-Band). Also PEC editing is not supported between MLA3 L-Band
and LIM L-Band.
•
unlike MLA C-Band variant (NTK552BAE5) that is managed by DOC, MLA
L-Band variant (NTK552BL) is not managed by DOC
•
see Table 1-8 for function and connector type for each port
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Table 1-8
MLA optical interfaces (C-Band and L-Band)
Interface name
Physical port #
Function
Connector type
Line A In / Out
8/7
Input / output port of Amplifier A
LC
Line B In / Out
6/5
Input / output port of Amplifier B
LC
Mon
2
Monitor port for Line A Out
LC
Mon
1
Monitor port for Line B Out
LC
OSC A Out
4
Optical Service Channel output
LC
OSC B In
3
Optical Service Channel input
LC
Note: In MLA L-Band variant (NTK552BL), each optical interface on Line A Out and Line B Out have a
spring-loaded mechanical shutter.
Cross-connection types
The MLA circuit packs support the following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Cross-connection rates
The MLA circuit packs only support the OCH (Optical Channel) Photonic
cross-connection rate.
Performance monitoring
The 6500 monitors and collects physical PMs for MLA circuit pack facilities.
Table 1-9 on page 1-34 provides a list of monitor types supported on MLA
circuit packs. Figure 1-9 on page 1-35 shows the MLA circuit pack optical
monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
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Table 1-9
Monitor types table for MLA circuit pack
Facility
Monitor type
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
OPTMON
CHMON
AMP
NMCMON
SDMON
X
X
X
X
OPT-OTS
X
Note 1
ORL-OTS
ORLMIN-OTS
ORLMAX-OTS
ORLAVG-OTS
Note 2
X
X
X
X
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
Note 3
X
X
X
X
X
X
X
X
Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 2: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.
Note 3: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).
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Figure 1-9
MLA circuit pack optical monitoring points
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Facility: AMP port 6
Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*
EDFA
Backplane
PD
PD
Facility: CHMON port 5,
NMCMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7
Parameter: OPT-OTS* ***
Facility: AMP port 8
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS*
EDFA
Facility: OPTMON port 4
Parameter: OPR-OTS*
PD
Mon A
2
Line A Out
7
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
* AVG, MIN, and MAX measurements are also provided
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
OSC
Photodiode
Optical Service Channel
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Far End Not Discovered (MLA C-band only)
•
Adjacency Mismatch
•
Fiber Type Manual Provisioning Required
•
High Fiber Loss
•
High Received Span Loss (MLA C-band only)
•
Shutoff Threshold Crossed
•
Optical Line Failed
•
Automatic Power Reduction Active
•
Input Loss of Signal
•
Output Loss of Signal
•
Automatic Shutoff
•
Automatic Shutoff Disabled
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Crossed Fibers Suspected (MLA C-band only)
•
Excessive Input Power (MLA L-band variant)
COM alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to MLA circuit packs (C-Band and
L-Band):
•
C-Band variant (NTK552BAE5) is an eight-port single slot interface.
•
L-Band variant (NTK552BL) is an eight-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). These circuit packs are not supported for use in slots 7 and
8 of the 14-slot packet-optical shelf (NTK503SA variant).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf
•
the MLA circuit packs (C-Band) can be followed by interior SLA circuit
packs.
The following restrictions on using a cross-connect circuit pack apply when
deploying an MLA circuit packs (C-Band and L-Band):
•
the MLA circuit packs (C-Band and L-Band) do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains an MLA circuit pack
(C-Band or L-Band)
•
In a 14-slot shelf type, when the MLA circuit packs (C-Band or L-Band) are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a MLA circuit pack (C-Band or L-Band)
•
In a 6500-7 packet-optical shelf type, when the MLA circuit packs (C-Band
or L-Band) are installed in slot 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the MLA (C-Band and L-Band) optical interface circuit
packs.
Table 1-10
Technical specifications for MLA optical interface circuit packs (C-Band and L-Band)
Parameter
MLA C-Band (NTK552BAE5)
MLA L-Band (NTK552BL)
Weight
(estimated)
1.8 kg (4.0 lb)
1.2 kg (2.6 lb)
Power
consumption
Typical (W): 34 (Note 1)
Typical (W): 21 (Note 1)
Power Budget (W): 34 (Note 2)
Power Budget (W): 24 (Note 2)
Line A
Line B
Line A
Line B
Design Flat Gain
(DFG) = 20
Design Flat Gain (DFG)
= 17
Fixed
Fixed
Nominal: 23
Nominal: 23
Typical: 12-20
Typical: 9-17
Extended range: 7 to
25
Extended range: 6 to 22
Gain mask
See Figure 1-10 on
page 1-41
See Figure 1-11 on
page 1-42
See Figure 1-12
on page 1-43
See Figure 1-12
on page 1-43
Noise figure
(NF) (dB)
Different at various
gains
Different at various
gains
Fixed
Fixed
6.0
6.0
Gain (dB)
Gain
14-20
(dB)
Gain 12-14
(dB)
Gain
12-17
(dB)
Gain 9-12
(dB)
NF <
7.0
(max.)
NF < 8.0
(max.)
NF <
7.2
(max.)
NF < 9.7
(max.)
NF < 7.2
(typical)
NF <
6.2
(typical)
NF < 8.8
(typical)
NF <
6.5
(typical)
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Table 1-10
Technical specifications for MLA optical interface circuit packs (C-Band and L-Band) (continued)
Parameter
MLA C-Band (NTK552BAE5)
Line A
Maximum
output power
(dBm)
17 EOL (on average 1
dB higher)
Wavelength
range (nm)
MLA L-Band (NTK552BL)
Line B
Line A
Line B
19 EOL (on average 1
dB higher)
16 EOL (on
average 1 dB
higher)
16 EOL (on
average 1 dB
higher)
1530.33 nm to 1565.09 nm
1570.22 nm to 1605.94 nm
Tap ratio loss
(dB)
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Line_A_Out
to
Line_A_Mon
14.6
18.4
N/A
N/A
14.6
18.4
N/A
N/A
Line_B_Out
to
Line_B_Mon
N/A
N/A
14.4
18.2
N/A
N/A
14.4
18.2
Insertion loss
from
Line_A_In to
Line_A_Out
(dB)
N/A (Note 3)
N/A
N/A (Note 3)
N/A
Insertion loss
from
Line_B_In to
Line_B_Out
(dB)
N/A
N/A (Note 3)
N/A
N/A (Note 3)
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Table 1-10
Technical specifications for MLA optical interface circuit packs (C-Band and L-Band) (continued)
Parameter
MLA C-Band (NTK552BAE5)
Line A
MLA L-Band (NTK552BL)
Line B
Line A
Line B
Insertion loss
from
Line_A_In to
OSC_A_Out
(dB)
1.2 (max.)
N/A
1.2 (max.)
N/A
Insertion loss
from
OSC_B_In to
Line_B_Out
(dB)
N/A
1.0 (max.)
N/A
1.0 (max.)
Amplifier
input and
output LOS
thresholds
(dBm)
Min.
Default Max.
Min.
Default Max. Min.
Input LOS
threshold
-40
-32
10
-30
-22
13
Output LOS
threshold
-15
-13
15
-11
-10
24
Def- Max. Min.
ault
Def- Max.
ault
-40
-36
10
-30
-22
13
-15
-13
15
-11
-10
24
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25
(+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The EDFA modules do not have insertion loss.
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Photonics equipment description 1-41
Figure 1-10
MLA C-Band line A gain mask
Typical range
20
18
16
14
Output Power (dBm)
12
10
Over Gain
range
8
6
Extended
range
4
2
0
-2
-4
-6
Minimum guaranteed output
power under single channel
-8
-10
-11
-30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10
-8
-6
-4
-2
0
2
4
6
8
10 12
Input Power (dBm)
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 17 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
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Figure 1-11
MLA C-Band Line B gain mask
Typical range
22
20
18
Output Power (dBm)
16
Over Gain
range
14
12
10
8
Extended
range
6
4
2
0
-2
Minimum guaranteed output
power under single channel
Extended range minimum output
power under single channel
-4
-6
-20 -18 -16 -14 -12 -10
-8
-6
-4
-2
0
2
4
6
8 10
12 14 16
Input Power (dBm)
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 19 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
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Figure 1-12
MLA L-Band Line A/B gain mask
20
18
Gain = 24 dB
16
14
Output Power (dBm)
12
10
8
Gain = 23 dB
6
Gain = 22 dB
4
2
0
-2
-4
-6
-8
-10
-11
-30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10
-8
-6
-4
-2
0
2
4
6
8
10 12
Input Power (dBm)
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs (NTK552FAE5
and NTK552FB)
Overview
Similar to MLA, the Midstage Line Amplifier 2 (MLA2 C-Band) circuit packs are
used for both edge and core applications.
This release of 6500 supports the following variants of the MLA2 circuit packs:
•
Midstage Line Amplifier 2 (MLA2 C-Band) circuit pack (also referred to as
MLA2) (NTK552FAE5)
•
Midstage Line Amplifier 2 (MLA2 C-Band) with variable optical attenuator
(VOA) circuit pack (also referred to as MLA2 w/VOA) (NTK552FB)
The MLA2 or MLA2 w/VOA circuit pack contains two erbium-doped fiber
amplifiers (EDFA); one in a pre-amplifier configuration (amplifying the signal
as it is entering the site from the line) and the other in a post-amplifier
configuration (amplifying the signal as it leaves the site onto the line), a single
OSC channel (1511 nm) splitter/coupler, and in case of the MLA2 w/VOA
variant (NTK552FB), a variable optical attenuator (VOA) at the output of each
amplifier (required for applications where attenuation is needed to meet link
budget constraints and pads are not desired). The primary difference
comparing to the MLA circuit pack is that the MLA2 or MLA2 w/VOA circuit
pack has a higher gain in both the pre and post amps than the MLA, gaining
more flexibility in link budgets, therefore MLA2 or MLA2 w/VOA circuit pack is
chosen over MLA circuit pack when spans have more losses (as directed by
link engineering). This MLA2 or MLA2 w/VOA circuit pack is equipped at a
6500 site where pre- and post-amplification (booster amplification) is required
per link engineering rules.
The 6500 amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control that
delivers enhanced reach capabilities to ensure each wavelength is amplified
equally.
Figure 1-13 on page 1-45 shows the faceplate of an MLA2 circuit pack and
Figure 1-14 on page 1-46 provides a functional block diagram of the MLA2
circuit pack.
Figure 1-15 on page 1-47 shows the faceplate of an MLA2 w/VOA circuit pack
and Figure 1-16 on page 1-48 provides a functional block diagram of the
MLA2 w/VOA circuit pack.
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Figure 1-13
MLA2 circuit pack faceplate
2
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
OSC ports
Line ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-14
MLA2 circuit pack block diagram (NTK552FAE5)
Backplane
EDFA
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
PD
PD
EDFA
PD
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
Legend
EDFA
OSC
PD
Erbium Doped Fiber Amplifier
Optical service channel
Photodiode
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Figure 1-15
MLA2 w/VOA circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
OSC ports
Line ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-16
MLA2 w/VOA circuit pack block diagram (NTK552FB)
EDFA
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
OSC A Out
4
Line A In
8
Backplane
VOA
PD
PD
PD
EDFA
VOA
PD
Processor
Module
Power
Supply
PD
PD
PD
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
VOA
Variable Optical Attenuator
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Supported functionality
The MLA2 circuit packs (NTK552FAE5) and the MLA2 w/VOA circuit packs
(NTK552FB) provide the following functionality:
•
wavelength range: C-band 1530.33 nm to 1565.09 nm
•
50 GHz and 100 GHz grid compliant
•
integrated OSC add/drop filters - OSC add/drop ports
•
external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
•
a Variable Optical Attenuator at the output of each amplifier (only
applicable to MLA2 w/VOA variant; NTK552FB)
•
ALSO (Automatic Line Shut Off) functionality
•
APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the MLA2 circuit packs (NTK552FAE5 and
NTK552FB variants) are supported in MuxAmp configurations. The
MuxAmp is used in some networks where lower power interfaces (like the
WL3n source) are used. This configuration requires that the Shelf
Processor disables the Automatic Power Reduction (APR), otherwise APR
may be triggered during normal operation. For this reason, the MLA2
circuit packs (NTK552FAE5 and NTK552FB variants) are reclassified as
Class 1M from IEC 60825-1. When APR is disabled, clamping is added
automatically to ensure safety. Circuit packs that were originally
manufactured with a Hazard Level 1 warning label can be re-labeled with
the Level 1M label kit (part number 415-2818-001). For information on how
to apply this label, see the section on observing product and personnel
safety guidelines in Installation - General Information, 323-1851-201.0.
•
editing provisioned PEC between MLA C-Band, MLA2, MLA2 w/VOA and
MLA3 C-Band is supported (PEC editing is not supported between MLA
L-Band or MLA3 L-Band and MLA C-Band, MLA2, MLA2 w/VOA, and
MLA3 C-Band)
•
MLA2/LIM C-Band or MLA2 w/VOA/LIM C-Band combination can be used
as an alternative to SLA/SLA pair at uncompensated line-amp sites, as
dictated by link-engineering
•
gain clamp mode
•
see Table 1-11 for function and connector type for each port
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Table 1-11
MLA2 and MLA2 w/VOA optical interfaces
Interface name
Physical port #
Function
Connector type
Line A In / Out
8/7
Input / output port of Amplifier A
LC
Line B In / Out
6/5
Input / output port of Amplifier B
LC
Mon
2
Monitor port for Line A Out
LC
Mon
1
Monitor port for Line B Out
LC
OSC A Out
4
Optical Service Channel output
LC
OSC B In
3
Optical Service Channel input
LC
Cross-connection types
The MLA2 and MLA2 w/VOA circuit packs support the following
cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Note: Coherent Select configurations support 2WAY connections only.
Cross-connection rates
The MLA2 and MLA2 w/VOA circuit packs only support the OCH (Optical
Channel) Photonic cross-connection rate.
Performance monitoring
The 6500 monitors and collects physical PMs for MLA2 and MLA2 w/VOA
circuit pack facilities. Table 1-12 on page 1-51 provides a list of monitor types
supported on MLA2 and MLA2 w/VOA circuit packs. Figure 1-17 on page 1-52
shows the MLA2 and Figure 1-18 on page 1-53 shows the MLA2 w/VOA circuit
pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
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Table 1-12
Monitor types table for MLA2 and MLA2 w/VOA circuit pack
Facility OPTMON
CHMON
AMP
Monitor type
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
VOA
Note 1
NMCMON
Note 2
X
X
X
X
OPT-OTS
X
Note 3
X
X
X
X
Note 6
ORL-OTS
ORLMIN-OTS
ORLMAX-OTS
ORLAVG-OTS
Note 4 and Note 5
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
Note 7
SDMON
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Note 1: The VOA facility type is only applicable to the MLA2 w/VOA circuit pack.
Note 2: The NMCMON facility type is not applicable to the MLA2 w/VOA circuit pack.
Note 3: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 4: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.
Note 5: Though the ORL readings are against the VOA facility on the MLA2 w/VOA circuit pack (monitor
tap is after the VOA), the associated Automatic Power Reduction alarm is raised against the AMP facility
of the MLA2 w/VOA circuit pack.
Note 6: These monitor types do not apply to the MLA2 w/VOA circuit pack.
Note 7: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).
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Figure 1-17
MLA2 circuit pack optical monitoring points
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Facility: AMP port 6
Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*
EDFA
Backplane
PD
PD
Facility: CHMON port 5,
NMCMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7
Parameter: OPT-OTS* ***
Facility: AMP port 8
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS*
EDFA
Facility: OPTMON port 4
Parameter: OPR-OTS*
PD
Mon A
2
Line A Out
7
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
* AVG, MIN, and MAX measurements are also provided
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
OSC
Photodiode
Optical Service Channel
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Figure 1-18
MLA2 w/VOA circuit pack optical monitoring points
Facility: VOA port 5
Parameter: OPOUT-OTS*,
ORL-OTS*
Facility: AMP port 6
Parameter: OPIN-OTS*
OPOUT-OTS*
Mon B
1
OSC B In
3
Line B Out
5
PD
EDFA
VOA
Backplane
PD
PD
Facility: AMP port 8
Parameter: OPIN-OTS*
OPOUT-OTS*
Facility: CHMON port 5, NMCMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* *** 
Line B In
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7
Parameter: OPT-OTS* *** 
Mon A
EDFA
Line A Out
6
2
7
VOA
Facility: OPTMON port 4
Parameter: OPR-OTS*
PD
PD
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Facility: VOA port 7
Parameter: OPOUT-OTS*, ORL-OTS*
Line A In
8
* AVG, MIN, and MAX measurements are also provided.
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.

Power data is collected from the EDFA monitor and scaling is done using VOA loss
such that the reported power is that at the faceplate port.
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
OSC
Optical Service Channel
VOA
Variable Optical Attenuator
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
High Received Span Loss
AMP alarm
• Minimum Gain
Photonic alarms
• Adjacency Far End Not Discovered
•
Adjacency Mismatch
•
High Fiber Loss
•
Fiber Type Manual Provisioning Required
•
Shutoff Threshold Crossed
•
Optical Line Failed
•
Automatic Power Reduction Active
•
Input Loss of Signal
•
Output Loss of Signal
•
Automatic Shutoff
•
Automatic Shutoff Disabled
•
Loss of Signal
•
VOA Output LOS (applies to MLA2 w/VOA)
•
Gauge Threshold Crossing Alert Summary
•
Crossed Fibers Suspected
COM alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to MLA2 or MLA2 w/VOA circuit packs:
•
is an eight-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). The MLA2 circuit pack is not supported for use in slots 7 and
8 of the 14-slot packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
MLA2 circuit pack can be equipped in slots 1 to 6 of the 6500-7
packet-optical shelf (NTK503RA). This circuit pack is not supported for
use in slots 7 and 8 of the 6500-7 packet-optical shelf (NTK503RA).
•
MLA2 w/VOA circuit pack can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf
•
the MLA2 or MLA2 w/VOA circuit packs can be followed by interior SLA
circuit packs.
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The following restrictions on using a cross-connect circuit pack apply when
deploying an MLA2 and MLA2 w/VOA circuit packs:
•
the MLA2 and MLA2 w/VOA circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains an MLA2 or MLA2
w/VOA circuit pack
•
In a 14-slot shelf type, when the MLA2 or MLA2 w/VOA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains an MLA2 or MLA2 w/VOA circuit pack
•
In a 6500-7 packet-optical shelf type, when the MLA2 or MLA2 w/VOA
circuit packs are installed in slot 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
Technical specifications
Table 1-13 lists the weight and power consumption for the MLA2 and MLA2
w/VOA optical interface circuit packs. Table 1-14 on page 1-57 lists technical
specifications for the MLA2 and MLA2 w/VOA optical interface circuit packs.
Table 1-13
Weight and power consumption for MLA2 and MLA2 w/VOA optical interface circuit packs
Parameter
MLA2 (NTK552FAE5)
MLA2 w/VOA (NTK552FB)
Weight
(estimated)
1.2 kg (2.7 lb)
1.2 kg (2.7 lb)
Power
consumption
Typical (W): 30 (Note 1)
Power Budget (W): 36 (Note 2)
Typical (W): 33 (Note 1)
Power Budget (W): 37 (Note 2)
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Table 1-13
Weight and power consumption for MLA2 and MLA2 w/VOA optical interface circuit packs
Parameter
MLA2 (NTK552FAE5)
MLA2 w/VOA (NTK552FB)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Table 1-14
Technical specifications for MLA2 and MLA2 w/VOA optical interface circuit packs
Parameter
Gain (dB) (Note 1)
Gain mask
Noise figure (NF)
(dB)
MLA2 (NTK552FAE5) and MLA2 w/VOA (NTK552FB)
Line A
Line B
Design Flat Gain (DFG) = 23.5
Design Flat Gain (DFG) = 23.5
Typical: 15-23.5
Typical: 15-23.5
Extended range: 11 to 28
Extended range: 11 to 28
See Figure 1-19 on page 1-60
See Figure 1-20 on page 1-61
Different at various gains
Different at various gains
Gain 17.5-23.5
(dB)
Gain 15-17.5 (dB)
Gain 17.5-23.5 (dB)
• NF < 5.9
(maximum)
• NF < 7.0
(maximum)
• NF < 5.7
(maximum)
• NF < 6.8
(maximum)
• NF < 4.9 (typical)
• NF < 6.0 (typical)
• NF < 5.4 (typical) • NF < 6.5 (typical)
Gain 15-17.5 (dB)
Maximum output
power (dBm)
(applies to MLA2
circuit pack only)
19.5 EOL (on average 1 dB higher)
19 EOL (on average 1 dB higher)
Maximum output
power before the
VOA (dBm)
(applies to MLA2
w/VOA circuit
pack only)
19.5 EOL (on average 1 dB higher)
19 EOL (on average 1 dB higher)
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Table 1-14
Technical specifications for MLA2 and MLA2 w/VOA optical interface circuit packs (continued)
Parameter
Maximum output
power after the
VOA tap (dBm)
(applies to MLA2
w/VOA circuit
pack only)
MLA2 (NTK552FAE5) and MLA2 w/VOA (NTK552FB)
Line A
Line B
18.25 EOL (on average 1 dB higher)
(Note 2)
17.75 EOL (on average 1 dB higher)
(Note 2)
Wavelength range
(nm)
Tap ratio loss (dB)
(applies to MLA2
circuit pack only)
1530.33 to 1565.09 (88 channels capable)
Minimum
Maximum
Minimum
Maximum
Line_A_Out to
Line_A_Mon
14.6
18.4
N/A
N/A
Line_B_Out to
Line_B_Mon
N/A
N/A
14.4
18.2
Minimum
Maximum
Minimum
Maximum
Line_A_Out to
Line_A_Mon
13.6 (Note 3)
17.4 (Note 3)
N/A
N/A
Line_B_Out to
Line_B_Mon
N/A
N/A
13.4 (Note 3)
17.2 (Note 3)
Tap ratio loss (dB)
(applies to MLA2
w/VOA circuit
pack only)
Insertion loss from
Line_A_In to
Line_A_Out (dB)
N/A (Note 4)
N/A
Insertion loss from
Line_B_In to
Line_B_Out (dB)
N/A
N/A (Note 4)
Insertion loss from
Line_A_In to
OSC_A_Out (dB)
1.2 (max.)
N/A
Insertion loss from
OSC_B_In to
Line_B_Out (dB)
N/A
1.0 (max.)
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Table 1-14
Technical specifications for MLA2 and MLA2 w/VOA optical interface circuit packs (continued)
Parameter
MLA2 (NTK552FAE5) and MLA2 w/VOA (NTK552FB)
Line A
Amplifier input
and output LOS
thresholds (dBm)
Minimum
Line B
Default Maximum
Minimum
Default Maximum
Input LOS
threshold
-40
-36
10
-40
-36
10
Output LOS
threshold
-15
-12
24
-15
-12
15
VOA attenuation
setting accuracy
(dB)
(applies to MLA2
w/VOA circuit
pack only)
+/- 0.8
Open loop
attenuation setting
accuracy (dB)
(applies to MLA2
w/VOA circuit
pack only)
(Note 5)
2.0
VOA attenuation
range (dB)
(applies to MLA2
w/VOA circuit
pack only)
20 (max.)
1 (min.)
VOA output LOS
thresholds (dBm)
(applies to MLA2
w/VOA circuit
pack only)
Minimum
Default Maximum
-45
-31
20
Minimum
-45
Default Maximum
-31
20
Note 1: The gain for the MLA2 w/VOA circuit pack is defined from the input connector to a reference point
immediately before the VOA, that is, the VOA and the components after it, are excluded.
Note 2: This value is at minimum attenuation and it varies depending on the VOA attenuation target.
Note 3: This value includes a default VOA loss of 1 dB.
Note 4: The EDFA modules do not have insertion loss.
Note 5: The VOA is in open loop when the EDFA is in shutoff.
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Figure 1-19
MLA2 and MLA2 w/VOA Line A gain mask
Typical range
22
20
18
16
14
Output Power (dBm)
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
Over Gain
range
Extended
range
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0
2
4
6
8 10 12
Input Power (dBm)
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 19.5 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
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Figure 1-20
MLA2 and MLA2 w/VOA Line B gain mask
Typical range
22
20
18
16
14
Output Power (dBm)
12
10
8
6
4
2
0
-2
-4
-6
-8
-10
Over Gain
range
Extended
range
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0
2
4
6
8 10 12
Input Power (dBm)
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 19 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Midstage Line Amplifier 3 (MLA3 C-Band) circuit pack (NTK552GAE5)
and Midstage Line Amplifier 3 (MLA3 L-Band) circuit pack
(NTK552GL)
Overview
Similar to MLA and MLA2, the Midstage Line Amplifier 3 (MLA3 C-Band)
circuit pack (also referred to as MLA3 C-Band) or Midstage Line Amplifier 3
(MLA3 L-Band) circuit pack (also referred to as MLA3 L-Band) is used for both
edge and core applications and contains two erbium-doped fiber amplifiers
(EDFA); one in a pre-amplifier configuration (amplifying the signal as it is
entering the site from the line) and the other in a post-amplifier configuration
(amplifying the signal as it leaves the site onto the line), and a single OSC
channel (1511 nm) splitter/coupler for MLA3 C-Band and a single OSC
channel (1611 nm) splitter/coupler for MLA3 L-Band. The primary difference
with MLA circuit pack is that similar to MLA2, the MLA3 C-Band or MLA3
L-Band has a higher gain in both the pre and post amps than the MLA, gaining
more flexibility in link budgets, therefore MLA3 C-Band or MLA3 L-Band circuit
pack is chosen over MLA circuit pack when spans have more losses (as
directed by link engineering). This circuit pack is equipped at a 6500 site
where pre- and post-amplification (booster amplification) is required per link
engineering rules.
The MLA3 C-Band circuit pack (NTK552GAE5) or MLA3 L-Band circuit pack
(NTK552GL) has similar functionality to the existing MLA2. However, its
typical power consumption is slightly higher than the MLA2. The MLA3
C-Band or MLA3 L-Band also has the same maximum gain as the MLA2 but
has a higher maximum total output power:
•
for Line A, MLA3 C-Band or MLA3 L-Band has 23.5 dBm compared to
19.5 dBm for MLA2.
•
for Line B, MLA3 C-Band or MLA3 L-Band has 23 dBm compared to 19
dBm for MLA2.
MLA3 software and One Planner software have been enhanced to take
advantage of the higher total output power and enable some extra
functionalities compared to MLA2 such as:
•
MLA3 C-Band or MLA3 L-Band can be used in applications where reach
and capacity are limited by output power.
•
MLA3 C-Band or MLA3 L-Band can help with avoiding RAMAN use in
some cases.
•
in some cases MLA3 C-Band or MLA3 L-Band can help remove the need
for regeneration.
•
MLA3 C-Band enables fully filling the C-Band with 100G wavelengths.
•
MLA3 L-Band enables fully filling the L-Band with 200G wavelengths.
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•
In some network scenarios, MLA3 C-Band or MLA3 L-Band can provide
margin improvements.
The MLA3 L-Band circuit packs are only used in Submarine applications.
One Planner will help determine when an MLA3 C-Band or MLA3 L-Band is
required.
The MLA3 C-Band and MLA3 L-Band circuit packs are intended for different
applications:
•
the MLA3 C-Band circuit pack is a gain-controlled amplifier used in
DOC-controlled systems.
•
the MLA3 L-Band circuit pack is a fixed-gain amplifier used in passive
photonic systems that are manually equalized using pads.
The 6500 Amplifier circuit packs are low-noise, high input power modules with
fast transient control and remote software-provisionable gain control (in case
of MLA3 C-Band or fixed gain control in case of MLA3 L-Band) that deliver
enhanced reach capabilities to ensure each wavelength is amplified equally.
Figure 1-21 shows the faceplate of an MLA3 C-Band circuit pack (the MLA3
L-Band variant shows L-Band on its faceplate). Figure 1-22 on page 1-65
provides a functional block diagram of the MLA3 (C-Band or L-Band) circuit
pack. For MLA3 L-Band circuit pack, the circuit pack’s block diagram is the
same as MLA3 C-Band circuit pack’s block diagram.
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Figure 1-21
MLA3 C-Band circuit pack faceplate
3
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
OSC ports
Line ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-22
MLA3 (C-Band and L-Band) circuit pack block diagram (NTK552GAE5 and NTK552GL)
Backplane
EDFA
PD
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
PD
EDFA
PD
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
Legend
EDFA
OSC
PD
Erbium Doped Fiber Amplifier
Optical service channel
Photodiode
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Supported functionality
The MLA3 circuit packs (NTK552GAE5 and NTK552GL) provide the following
functionality:
•
Wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems (NTK552GAE5 variant)
•
Frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems (NTK552GAE5 variant)
•
Wavelength range: L-band channels 1569.8 nm to 1608.98 nm (96 total)
when used in fixed grid systems (NTK552GL variant)
•
Frequency range: L-band 190.975 THz to 186.325 THz when used in
flexible grid systems (NTK552GL)
•
50 GHz and 100 GHz grid compliant for MLA3 C-Band circuit pack
(NTK552GAE5 variant)
•
200 GHz grid compliant for MLA3 L-Band circuit pack (NTK552GL variant)
•
integrated OSC add/drop filters - OSC add/drop ports
•
external monitor at outputs of each amplifier line (Line A Mon and Line B
Mon)
•
ALSO (Automatic Line Shut Off) functionality
•
APR (Automatic Power Reduction) functionality
Note: As of Release 10.2, the MLA3 circuit pack (NTK552GAE5 variant)
is supported in MuxAmp configurations. The MuxAmp is used in some
networks where lower power interfaces (like the WL3n source) are used.
This configuration requires that the Shelf Processor disables the
Automatic Power Reduction (APR), otherwise APR may be triggered
during normal operation. For this reason, the MLA3 circuit pack
(NTK552GAE5) is reclassified as Class 1M from IEC 60825-1. When APR
is disabled, clamping is added automatically to ensure safety. Circuit
packs that were originally manufactured with a Hazard Level 1 warning
label can be re-labeled with the Level 1M label kit (part number
415-2818-001). For information on how to apply this label, see the section
on observing product and personnel safety guidelines in Installation General Information, 323-1851-201.0.
•
editing provisioned PEC between MLA C-Band, MLA2 and MLA3 C-Band
is supported (PEC editing is not supported between MLA L-Band or MLA3
L-Band and MLA C-Band, MLA2, and MLA3 C-Band)
•
MLA3 C-Band/LIM C-Band or MLA3 L-Band/LIM L-Band combination can
be used as an alternative to SLA/SLA pair at uncompensated line-amp
sites, as dictated by link-engineering
•
gain clamp mode
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•
see Table 1-15 for function and connector type for each port
Table 1-15
MLA3 optical interfaces (C-Band and L-Band)
Interface name
Physical port #
Function
Connector type
Line A In / Out
8/7
Input / output port of Amplifier A
LC
Line B In / Out
6/5
Input / output port of Amplifier B
LC
Mon
2
Monitor port for Line A Out
LC
Mon
1
Monitor port for Line B Out
LC
OSC A Out
4
Optical Service Channel output
LC
OSC B In
3
Optical Service Channel input
LC
Cross-connection types
The MLA3 circuit pack supports the following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Note: Coherent Select configurations support 2WAY connections only.
Cross-connection rates
The MLA3 C-Band circuit pack supports Optical Channel (OCH) and Network
Media Channel (NMC) Photonic cross-connection rates.
The MLA3 L-Band circuit pack supports Network Media Channel (NMC)
Photonic cross-connection rates.
Performance monitoring
The 6500 monitors and collects physical PMs for MLA3 C-Band and L-Band
circuit pack facilities. Table 1-16 on page 1-68 provides a list of monitor types
supported on MLA3 C-Band and L-Band circuit packs. Figure 1-23 on page
1-69 shows the MLA3 C-Band circuit pack optical monitoring points. Figure
1-24 on page 1-70 shows the MLA3 L-Band circuit pack optical monitoring
points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
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Table 1-16
Monitor types table for MLA3 C-Band and L-Band circuit packs
Facility
Monitor type
OPTMON
OPR-OTS
X
OPRMIN-OTS
X
OPRMAX-OTS
X
OPRAVG-OTS
X
CHMON
AMPMON
Note 2
AMP
NMCMON
SDMON
OPT-OTS
X
Note 1
ORL-OTS
X
ORLMIN-OTS
X
ORLMAX-OTS
X
ORLAVG-OTS
X
Note 3
OPIN-OTS
X
OPINMIN-OTS
X
OPINMAX-OTS
X
OPINAVG-OTS
X
OPOUT-OTS
X
OPOUTMIN-OTS
X
OPOUTMAX-OTS
X
OPOUTAVG-OTS
X
OPT-OCH
X
X
X
OPTMIN-OCH
X
X
X
OPTMAX-OCH
X
X
X
OPTAVG-OCH
X
X
X
Note 4
Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ
provisioned OPM supported device with Equipment Profile set to FlexibleGrid.
Note 2: The AMPMON facility type is only applicable to the MLA3 L-Band circuit pack.
Note 3: When the ORL reading is not valid because the power into the backward reflective monitor tap
is too low and cannot be measured accurately, the ORL PM reading(s) report “OOR”. The true ORL
reading(s) cannot be determined in this case.
Note 4: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex C-Band circuit packs).
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Figure 1-23
MLA3 C-Band circuit pack optical monitoring points
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Facility: AMP port 6
Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*
EDFA
Backplane
PD
PD
Facility: CHMON port 5,
NMCMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7
Parameter: OPT-OTS* ***
Facility: AMP port 8
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS*
EDFA
Facility: OPTMON port 4
Parameter: OPR-OTS*
PD
Mon A
2
Line A Out
7
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
* AVG, MIN, and MAX measurements are also provided
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
OSC
Photodiode
Optical Service Channel
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Figure 1-24
MLA3 L-Band circuit pack optical monitoring points
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Facility: AMP port 6
Parameter: OPIN-OTS*
OPOUT-OTS*,
ORL-OTS*
EDFA
PD
PD
Facility: CHMON port 5,
NMCMON port 5
AMPMON port 5
Parameter: OPT-OCH* **
Backplane
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7
Parameter: OPT-OTS* ***
Facility: AMP port 8
Parameter: OPIN-OTS*
OPOUT-OTS*, ORL-OTS*
EDFA
Facility: OPTMON port 4
Parameter: OPR-OTS*
PD
Mon A
2
Line A Out
7
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
* AVG, MIN, and MAX measurements are also provided
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the MLA L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
OSC
Photodiode
Optical Service Channel
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Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
High Received Span Loss
•
Output Loss of Signal
•
Automatic Power reduction Active
Photonic alarms
• Adjacency Far End Not Discovered
•
Adjacency Mismatch
•
High Fiber Loss
•
High Optical Power
•
Duplicate Adjacency Discovered
•
Fiber Type Manual Provisioning Required
•
Shutoff Threshold Crossed
•
Optical Line Failed
•
Automatic Power Reduction Active
•
Input Loss of Signal
•
Output Loss of Signal
•
Automatic Shutoff
•
Automatic Shutoff Disabled
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Crossed Fibers Suspected
•
Target Unachievable
•
Min Gain
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COM alarms
• Software Auto-Upgrade in Progress
•
Software Subsystem Failed
Equipping rules
The following equipping rules apply to MLA3 circuit packs (C-Band and
L-Band):
•
is an eight-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf
•
the MLA3 C-Band circuit packs can be followed by interior SLA circuit
packs.
The following restrictions on using a cross-connect circuit pack apply when
deploying an MLA3 circuit pack (C-Band and L-Band):
•
the MLA3 circuit packs (C-Band or L-Band) do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains an MLA3 circuit pack
(C-Band or L-Band)
•
In a 14-slot shelf type, when the MLA3 circuit packs (C-Band or L-Band)
are installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains an MLA3 circuit pack (C-Band or L-Band)
•
In a 6500-7 packet-optical shelf type, when the MLA3 circuit packs
(C-Band or L-Band) are installed in slot 7 or 8, only Broadband circuit
packs or Photonic circuit packs can be provisioned in the other interface
slots (slots 1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
Technical specifications
Table 1-17 lists the weight, power consumption, and other specifications for
the MLA3 (C-Band and L-Band) optical interface circuit pack.
Table 1-17
Technical specifications for MLA3 optical interface circuit packs (C-Band and L-Band)
Parameter
MLA3 C-Band (NTK552GAE5)
MLA3 L-Band (NTK552GL)
Weight
(estimated)
1.4 kg (3.0 lb)
1.4 kg (3.0 lb)
Power
consumption
Typical (W): 36 (Note 1)
Typical (W): 43 (Note 1)
Power Budget (W): 40 (Note 2)
Power Budget (W): 48 (Note 2)
Gain (dB)
Gain mask
Line A
Line B
Line A
Line B
Design Flat Gain
(DFG) = 23.5
Design Flat Gain
(DFG) = 23.5
Design Flat Gain (DFG)
= 23.5
Design Flat Gain
(DFG) = 23.5
Typical: 15-23.5
Typical: 15-23.5
Typical: 15-23.5
Typical: 15-23.5
Extended range: 11 to
28
Extended range: 11 to
28
Extended range: 11 to
28
Extended range: 11 to
28
See Figure 1-25 on
page 1-76
See Figure 1-26 on
page 1-77
See Figure 1-27 on
page 1-78
See Figure 1-28 on
page 1-79
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Table 1-17 (continued)
Technical specifications for MLA3 optical interface circuit packs (C-Band and L-Band)
Parameter
Noise figure (NF)
(dB)
MLA3 C-Band (NTK552GAE5)
MLA3 L-Band (NTK552GL)
Line A
Line B
Line A
Line B
Different at various
gains
Different at various
gains
Different at various
gains
Different at various
gains
Gain
17.5-23.
5 (dB)
Gain
Gain
15-17.5 (dB) 17.5-23.5
(dB)
• NF <
6.6
(max.)
• NF < 8.2
(max.)
• NF <
6.0
(typical)
• NF < 7.5
(typical)
• NF <
6.4
(max.)
• NF <
5.3
(typical)
Gain
15-17.5
(dB)
Gain
Gain
14.5-18.5 18.5-23.5
(dB)
(dB)
Gain
14.5-18.
5 (dB)
Gain
18.5-23.5
(dB)
• NF < 7.9
(max.)
• NF < 9.9 • NF < 7.6
(max.)
(max.)
• NF < 7.4
(max.)
• NF < 7.1
(typical)
• NF < 9 • NF < 6.9
(typical) (typical)
• NF <
9.4
(max.)
Maximum output
power (dBm)
23.5 EOL (on average
1 dB higher)
Wavelength
range (nm)
C-band channels 1528.77 nm to 1566.72 nm
(96 total) when used in fixed grid systems
• NF <
8.5
(typical)
• NF < 6.7
(typical)
23 EOL (on average 1 23.5 EOL (on average 1 23 EOL (on average 1
dB higher)
dB higher)
dB higher)
Frequency range C-band 196.125 THz to 191.325 THz when
(THz)
used in flexible grid systems
L-band channels 1569.8 nm to 1608.98 nm (93
total) when used in fixed grid systems
L-band 190.975 THz to 186.325 THz when used
in flexible grid systems
Tap ratio loss
(dB)
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Line_A_Out to
Line_A_Mon
14.6
18.4
N/A
N/A
14.6
18.4
N/A
N/A
Line_B_Out to
Line_B_Mon
N/A
N/A
14.4
18.2
N/A
N/A
14.4
18.2
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Table 1-17 (continued)
Technical specifications for MLA3 optical interface circuit packs (C-Band and L-Band)
Parameter
MLA3 C-Band (NTK552GAE5)
MLA3 L-Band (NTK552GL)
Line A
Line B
Line A
Line B
Insertion loss
from Line_A_In
to Line_A_Out
(dB)
N/A (Note 3)
N/A
N/A (Note 3)
N/A
Insertion loss
from Line_B_In
to Line_B_Out
(dB)
N/A
N/A (Note 3)
N/A
N/A (Note 3)
Insertion loss
from Line_A_In
to OSC_A_Out
(dB)
1.2 (max.)
N/A
1.2 (max.)
N/A
Insertion loss
from OSC_B_In
to Line_B_Out
(dB)
N/A
1.0 (max.)
N/A
1.0 (max.)
Amplifier input
and output LOS
thresholds (dBm)
Min.
Defa- Max.
ult
Min.
Defa- Max.
ult
Min.
Defa- Max.
ult
Min.
Defa Max.
-ult
Input LOS
threshold
-40
-32
10
-40
-32
10
-39
-36
10
-39
-36
10
Output LOS
threshold
-15
-12
15
-15
-12
15
-15
-12
15
-15
-12
15
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25 (+/-3oC) and
voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered equipment. For practical
purposes, the rounded typical power consumption of equipment can be used as the equipment heat dissipation when
calculating the facilities’ thermal loads (an estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient temperature range
from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered
equipment. These rounded power values must be used in sizing feeders and estimating theoretical maximum power
draw.
Note 3: The EDFA modules do not have insertion loss.
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Figure 1-25
MLA3 C-Band Line A gain mask
Typical range
24
22
20
18
16
14
Output Power (dBm)
12
10
Over Gain
range
8
Extended
range
6
4
2
0
-2
-4
-6
-8
-10
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0
2
4
6
8 10 12
Input Power (dBm)
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 23.5 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
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Figure 1-26
MLA3 C-Band Line B gain mask
Typical range
24
22
20
18
16
14
Output Power (dBm)
12
10
Over Gain
range
Extended
range
8
6
4
2
0
-2
-4
-6
-8
-10
-36 -34 -32 -30 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 -8 -6 -4 -2 0
2
4
6
8 10 12
Input Power (dBm)
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 23 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
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Figure 1-27
MLA3 L-Band Line A gain mask
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 23.5 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
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Figure 1-28
MLA3 L-Band Line B gain mask
1. The dashed lines area (
), identifies the minimum guaranteed output
power when the module is over gained. It is not required to maintain flat
gain in those regions.
2. In the Extended Range, it is not required to meet a maximum output power of 23 dBm
for some gain tilts between 0 and -5dB. The Over Gain range is only supported with
negative gain tilt.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Line Interface Module (LIM C-Band) circuit pack (NTK552DAE5) and
Line Interface Module (LIM L-Band) circuit packs (NTK552DL and
NTK552DN)
Overview
The Line Interface Module (LIM C-Band) circuit pack (also referred to as LIM
C-Band) and Line Interface Module (LIM L-Band) circuit packs (also referred
to as LIM L-Band) are line interface modules with no amplifier but each LIM
C-Band or LIM L-Band (NTK552DL variant) contains a single OSC channel
(1511 nm) splitter/coupler (LIM L-Band NTK552DN variant contains a single
OSC channel (1611 nm) splitter/coupler). LIM is used for point-to-point and
unamplified edge applications and core applications when used with an
MLA2, MLA2 w/VOA, MLA3 C-Band, or MLA3 L-Band. Therefore, The LIM
circuit pack is used in unamplified applications at a 6500 site where no pre- or
post-amplification (booster amplification) is required (per link engineering
rules).
The LIM L-Band (NTK552DN variant) circuit packs are only used in
Submarine applications.
The LIM C-Band and LIM L-Band circuit packs are intended for different
applications:
•
the LIM C-Band circuit pack is used in DOC-controlled systems.
•
the LIM L-Band circuit pack is used in passive photonic systems that are
manually equalized using pads.
Figure 1-29 on page 1-81 shows the faceplate of a LIM C-Band circuit pack.
For LIM L-Band circuit pack, the circuit pack’s faceplate is the same as LIM
C-Band circuit pack’s faceplate with the following exceptions:
•
the LIM C-Band variant shows C-Band on its faceplate while The LIM
L-Band variant shows L-Band on its faceplate.
•
“Line A In/Out” and “Line B In/Out” have spring-loaded mechanical
shutters in LIM L-Band (only NTK552DL variant).
•
the LIM C-Band variant shows Hazard Level 1 on its faceplate while the
LIM L-Band variants show Hazard Level 1M on their faceplates.
The following provides a functional block diagram of the LIM (C-Band or
L-Band) circuit pack. For LIM L-Band circuit pack, the circuit pack’s block
diagram is the same as LIM C-Band circuit pack’s block diagram.
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Figure 1-29
LIM C-Band circuit pack faceplate
LIM
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
OSC ports
Line ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Backplane
Figure 1-30
LIM (C-Band and L-Band) circuit packs block diagram (NTK552DAE5, NTK552DL, and NTK552DN)
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
OSC A Out
4
Line A In
8
PD
PD
Processor
Module
Power
Supply
PD
Legend
OSC
PD
Optical service channel
Photodiode
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Supported functionality
The LIM circuit packs (NTK552DAE5, NTK552DL, and NTK552DN) provide
the following functionality:
•
wavelength range: C-band 1528.77 nm to 1566.72 nm for LIM C-Band
circuit pack (NTK552DAE5 variant)
•
wavelength range: L-band 1570.22 nm to 1605.94 nm for LIM L-Band
circuit pack (NTK552DL variant)
•
wavelength range: L-band 1569.80 nm to 1608.98 nm for LIM L-Band
circuit pack (NTK552DN variant)
•
50 GHz and 100 GHz grid compliant for LIM C-Band circuit pack
(NTK552DAE5 variant)
•
200 GHz grid compliant for LIM L-Band circuit packs (NTK552DL and
NTK552DN variants)
•
integrated OSC add/drop filters - OSC add/drop ports
•
ALSO (Automatic Line Shut Off) functionality
•
MLA L-Band/LIM L-Band, MLA2/LIM C-Band, MLA2 w/VOA/LIM C-Band,
MLA3 C-Band/LIM C-Band, or MLA3 L-Band/LIM L-Band combination can
be used as an alternative to SLA/SLA pair at uncompensated line-amp
sites, as dictated by link-engineering
•
see Table 1-18 for function and connector type for each port
Table 1-18
LIM optical interfaces (C-Band and L-Band)
Interface name
Physical port #
Function
Connector type
Line A In / Out
8/7
Input / output port of passthrough channel A
LC
Line B In / Out
6/5
Input / output port of passthrough channel B
LC
Mon
2
Monitor port for Line A Out
LC
Mon
1
Monitor port for Line B Out
LC
OSC A Out
4
Optical Service Channel output
LC
OSC B In
3
Optical Service Channel input
LC
Cross-connection types
The LIM C-Band circuit pack supports the following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Note: Coherent Select configurations support 2WAY connections only.
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Cross-connection rates
The LIM C-Band circuit pack only supports the OCH (Optical Channel)
Photonic cross-connection rate.
Performance monitoring
The 6500 monitors and collects physical PMs for LIM C-Band and LIM L-Band
circuit pack facilities. Table 1-19 provides a list of monitor types supported on
LIM C-Band and LIM L-Band circuit packs. Figure 1-31 on page 1-85 shows
the LIM C-Band and LIM L-Band circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-19
Monitor types table for Photonic LIM C-Band and LIM L-Band circuit packs
Facility
Monitor type
OPTMON
OPR-OTS
X
OPRMIN-OTS
X
OPRMAX-OTS
X
OPRAVG-OTS
X
CHMON
NMCMON
OPT-OTS
SDMON
X
Note 1
OPT-OCH
X
X
OPTMIN-OCH
X
X
OPTMAX-OCH
X
X
OPTAVG-OCH
X
X
Note 2
Note 1: SDMON OPT-OTS monitor type support requires the OPM embedded
within an ADJ provisioned OPM supported device with Equipment Profile set to
FlexibleGrid.
Note 2: CHMON OPT-OCH monitor type support requires the OPM (embedded
within WSS w/OPM circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs).
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Figure 1-31
LIM C-Band and L-Band circuit pack optical monitoring points
Backplane
PD
Mon B
1
OSC B In
3
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
Facility: CHMON port 5,
NMCMON port 5
Parameter: OPT-OCH* **
Facility: SDMON port 5
Parameter: OPT-OTS* ***
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: SDMON port 7
Parameter: OPT-OTS* ***
PD
OSC A Out 4
Processor
Module
Power
Supply
PD
Line A In
8
PMs collected at all PD locations
Facility: OPTMON port 4,6,8
Parameter: OPR-OTS*
* AVG, MIN, and MAX measurements are also provided.
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the LIM L-Band circuit pack, as there is no corresponding L-Band OPM.
*** SDMON OPT-OTS monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid.
Legend
PD
Photodiode
OSC
Optical Service Channel
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Circuit Pack Latch Open
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Far End Not Discovered (MLA C-band only)
•
Adjacency Mismatch
•
Line Adjacency Manual Provisioning Required
•
High Fiber Loss
•
High Received Span Loss (MLA C-band only)
•
High Optical Power
•
Fiber Type Manual Provisioning Required
•
Shutoff Threshold Crossed
•
Optical Line Failed
•
Input Loss of Signal
•
Automatic Shutoff
•
Automatic Shutoff Disabled
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Crossed Fibers Suspected
•
Duplicate Adjacency Discovered
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COM alarms
• Software Auto-Upgrade in Progress
•
Software Subsystem Failed
•
Hardware Subsystem Failed
Equipping rules
The following equipping rules apply to LIM circuit packs (C-Band and L-Band):
•
C-Band variant (NTK552DAE5) is an eight-port single slot interface.
•
L-Band variants (NTK552DL and NTK552DN) are eight-port single slot
interfaces.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). The NTK552DAE5 and NTK552DL variants of LIM circuit
packs are not supported for use in slots 7 and 8 of the 14-slot
packet-optical shelf (NTK503SA variant).The NTK552DN variant of LIM
circuit packs is supported for use in slots 7 and 8 of the 14-slot
packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
NTK552DAE5 and NTK552DL variants of LIM circuit packs can be
equipped in slots 1 to 6 of the 6500-7 packet-optical shelf (NTK503RA).
These circuit packs are not supported for use in slots 7 and 8 of the 6500-7
packet-optical shelf (NTK503RA).
•
NTK552DN variant of LIM circuit packs can be equipped in slots 1 to 8 of
the 6500-7 packet-optical shelf (NTK503RA).
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•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a LIM circuit packs (C-Band and L-Band):
•
the LIM circuit packs (C-Band and L-Band) do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a LIM circuit pack
(C-Band and L-Band)
•
In a 14-slot shelf type, when the LIM circuit packs (C-Band and L-Band)
are installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a LIM circuit pack (C-Band and L-Band)
•
In a 6500-7 packet-optical shelf type, when the LIM circuit packs (C-Band
and L-Band) are installed in slot 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the LIM (C-Band and L-Band) optical interface circuit pack.
Table 1-20
Technical specifications for LIM optical interface circuit packs (C-Band and L-Band)
Parameter
LIM (NTK552DAE5, NTK552DL, and NTK552DN)
Weight (estimated) 0.9 kg (2.0 lb) for C-Band variant (NTK552DAE5)
1.0 kg (2.2 lb) for L-Band variants (NTK552DL and NTK552DN)
Power
consumption
Typical (W): 8 for C-Band variant (NTK552DAE5) and 9 for L-Band variants (NTK552DL and
NTK552DN) (Note 1)
Power Budget (W): 10 for both C-Band variant (NTK552DAE5) and L-Band variants
(NTK552DL and NTK552DN) (Note 2)
Gain (dB)
N/A (Note 3)
Gain mask
N/A (Note 3)
Noise figure (NF)
(dB)
N/A (Note 3)
Maximum output
power (dBm)
N/A (Note 3)
Wavelength range
(nm)
1528.77 to 1566.72 for C-Band variant (NTK552DAE5) (96 channels capable)
1570.22 to 1605.94 for L-Band variant (NTK552DL)
1560.80 to 1608.98 for L-Band variant (NTK552DN)
Line A
Tap ratio loss (dB)
Line B
Minimum
Maximum
Minimum
Maximum
Line_A_Out to
Line_A_Mon
8.0
12.0
N/A
N/A
Line_B_Out to
Line_B_Mon
N/A
N/A
8.0
12.0
Insertion loss from
Line_A_In to
Line_A_Out (dB)
1.8 (max.)
N/A
Insertion loss from
Line_B_In to
Line_B_Out (dB)
N/A
1.8 (max.)
Insertion loss from
Line_A_In to
OSC_A_Out (dB)
1.2 (max.)
N/A
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Table 1-20
Technical specifications for LIM optical interface circuit packs (C-Band and L-Band) (continued)
Parameter
LIM (NTK552DAE5, NTK552DL, and NTK552DN)
Insertion loss from
OSC_B_In to
Line_B_Out (dB)
Amplifier input and
output LOS
thresholds (dBm)
Input LOS
threshold
N/A
Minimum
Default
-36
-36
1.0 (max.)
Maximum
Minimum
-20
• 30 for
C-Band
variant
• 20 for
L-Band
NTK552DL
variant
Maximum
• 20 for
• -20 for
C-Band
C-Band
variant and
variant and
L-Band
L-Band
NTK552DL
NTK552DL
variant
variant
• 10 for
• -10 for
L-Band
L-Band
NTK552DN NTK552DN
variant
variant
• 10 for
L-Band
NTK552DN
variant
Output LOS
threshold
Default
N/A (Note 4)
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25 (+/-3oC)
and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered equipment.
For practical purposes, the rounded typical power consumption of equipment can be used as the equipment heat
dissipation when calculating the facilities’ thermal loads (an estimate of the long term heat release of the item in
a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient temperature
range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. These rounded power values must be used in sizing feeders and estimating theoretical
maximum power draw.
Note 3: LIM circuit packs (C-Band and L-Band) do not have any EDFA modules (LIM is only used to extract/inject
the OSC signal from the line) and therefore optical characteristics of the EDFA modules are not applicable to LIM
circuit packs (C-Band and L-Band).
Note 4: There is no output LOS alarms on passive devices.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Single Line Raman Amplifier (SRA C-Band) w/Optical Service
Channel (OSC) 1xSFP 10/100 BT WSC circuit pack (NTK552JA)
Overview
The Single Line Raman Amplifier (SRA C-Band) w/Optical Service Channel
(OSC) 1xSFP 10/100 BT WSC circuit pack (also referred to as SRA) is used
for providing Raman amplification and Optical Time-Domain Reflectometry
(OTDR) functionality in Photonic Layer applications. An OTDR is used for
•
estimating the fiber length and overall attenuation, including splice and
mated-connector losses.
•
locating faults, such as breaks, and to measure optical return loss.
•
fault finding on installed systems.
The SRA circuit pack has one Raman-gain amplifier in the incoming Line A
facing direction and by including integrated OSC add/drop filters and OSC
add/drop ports, the SRA circuit pack removes the need for 2xOSC circuit
packs at Line Amp and ROADM sites.
Note: It is recommended to read 6500 Packet-Optical Platform Photonic
Layer Guide, NTRN15DA, for detailed information on RAMAN
amplification and its concept in 6500.
Figure 1-32 on page 1-92 shows the faceplate of an SRA circuit pack and
Figure 1-33 on page 1-93 provides a functional block diagram of the SRA
circuit pack.
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Figure 1-32
SRA circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
WSC port
OSC ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Line ports
Monitor
ports
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Figure 1-33
SRA circuit pack block diagram (NTK552JA)
Wayside
Backplane
Ethernet
Switch
EOS
Mapper
OTDR/
Telemetry
OSC
SFP
1
2
OSC In
3
Mon B
9
Line B Out
5
Line B In
6
Mon A
10
Line A Out
7
OSC Out
4
Line A In
8
PD
PD / 4 Ch.
OPM
PD
Processor
Module
Raman
Power
Supply
Legend
EOS
Ethernet over SONET
OPM
OSC
Optical power monitoring
Optical service channel
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OTDR
PD
Optical time domain reflectometry
Photodiode
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1-94 Photonics equipment description
Supported functionality
The SRA circuit packs (NTK552JA) provide the following functionality:
•
wavelength range: C-band 1528.77 nm to 1566.72 nm
•
50 GHz and 100 GHz grid compliant
•
integrated OSC add/drop filters - OSC add/drop ports
•
integrated coarse 4-band OPM
•
integrated Wayside connection (WSC) port
•
external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
•
Optical Time-Domain Reflectometry (OTDR) to measure integrity of fiber
plant and interconnects
•
ALSO (Automatic Line Shut Off) functionality
•
APR (Automatic Power Reduction) functionality
•
see Table 1-21 for function and connector type for each port
Table 1-21
SRA optical interfaces
Interface name
Physical port #
Function
Connector type
Mon A
10
Monitor port for Line A Out
LC
Mon B
9
Monitor port for Line B Out
LC
Line A In / Out
8/7
Input / output port of Line A
LC
Line B In / Out
6/5
Input / output port of Line B
LC
OSC A Out
4
Optical Service Channel output
LC
OSC B In
3
Optical Service Channel input
LC
OSC SFP In / Out
2
Optical Service Channel SFP pluggable
input/output port
LC
WSC
1
Wayside channel
RJ-45
Cross-connection types
The SRA circuit pack supports the following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Cross-connection rates
The SRA circuit pack only supports the OCH (Optical Channel) Photonic
cross-connection rate.
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Supported SFPs
The following table provides a list of the SFPs that are supported on the SRA
circuit pack.
Table 1-22
Supported SFP modules for the SRA circuit pack (NTK552JA)
Pluggable Equipment and
Facilities (Note 1, Note 2, and
Note 3)
Supported SFP modules and rates
• P155M
OC-3/STM-1 CWDM 1511 nm (0-34 dB span)
— OSC (Note 4)
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 CWDM 1511 nm (12-42 dB span)
Part Number
NTK592NGE5
NTK592NVE5
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 DWDM 1516.9 nm SFP module
(12-44 dB span)
NTK592NR (Note
5)
— OC-3/STM-1 (155.52Mb/s)
Note 1: Facilities on Photonic circuit packs are auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities that cannot be manually added or deleted.
Note 2: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and One Planner design.
Note 3: An SRA has 2 OPTMON facilities (ports 4 and 6), one RAMAN facility (port 8), one AMPMON
facility (port 7), and one TELEMETRY facility (port 5). The P155M pluggable and OSC facility is
supported on port 2.
Note 4: The P155M pluggable on the SRA circuit pack supports WSC facilities. These facilities are not
displayed or managed in the Equipment & Facilities Provisioning applications. They are handled by
Comms Setting Management application through LAN option under Interfaces tab. If you provision the
low output power SFP (NTK592NG) or the extended reach SFP (NTK592NV), the connected LIM port
4 OPTMON facility will be put OOS automatically to prevent the “Loss of Signal” alarm from being
raised.
Note 5: Use this SFP when the fiber type of the span is TWRS and when the CWDM SFP limit is
exceeded. This SFP must always be used in combination with OSC Filter (1516.9 nm) module
(NTK504BA) to reach spans losses of up to 46 dB on all fiber types.
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Performance monitoring
The 6500 monitors and collects physical PMs for SRA circuit pack facilities.
Table 1-23 provides a list of monitor types supported on SRA circuit packs.
Figure 1-34 on page 1-99 shows the SRA circuit pack optical monitoring
points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-23
Monitor types table for SRA circuit pack
Monitor type
Facility
OSC
OPTMON
RAMAN
OTDRCFG
Note 1
SONET Section (S)/SDH Regenerator Section (RS)
CV-S or RS-BBE
X
ES-S or RS-ES
X
SES-S or RS-SES
X
SEFS-S or RS-OFS
X
SONET Line (L)/SDH Multiplex Section (MS)
CV-L or MS-BBE
X
ES-L or MS-ES
X
SES-L or MS-SES
X
UAS-L or MS-UAS
X
FC-L or MS-FC
X
DMMIN-L or L-DMMIN
DMMAX-L or L-DMMAX
DMAVG-L or L-DMAVG
X
X
X
Physical
OPR-OCH
OPRMIN-OCH
OPRMAX-OCH
OPRAVG-OCH
Note 2
X
X
X
X
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Table 1-23
Monitor types table for SRA circuit pack (continued)
Monitor type
Facility
OSC
RAMAN
OTDRCFG
Note 1
ORLIN-OTS
ORLINMIN-OTS
ORLINMAX-OTS
ORLINAVG-OTS
X
X
X
X
X
X
X
X
ORLOUT-OTS
ORLOUTMIN-OTS
ORLOUTMAX-OTS
ORLOUTAVG-OTS
X
X
X
X
X
X
X
X
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
X
X
X
X
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
Note 3
X
X
X
X
SPANLOSS-OCH
SPANLOSSMIN-OCH
SPANLOSSMAX-OCH
SPANLOSSAVG-OCH
X
X
X
X
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
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OPTMON
X
X
X
X
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Table 1-23
Monitor types table for SRA circuit pack (continued)
Monitor type
Facility
OSC
OPTMON
RAMAN
OTDRCFG
Note 1
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
X
X
X
X
OPROSC-OTS
OPROSCMIN-OTS
OPROSCMAX-OTS
OPROSCAVG-OTS
X
X
X
X
X
X
X
X
Note 1: Support for OTDRCFG PM counts is restricted to shelves with SP2 shelf processor types.
Note 2: The accuracy of the monitoring circuitry on SFP and SFP+ pluggables is guaranteed to be at
least 20 dB from the “receive sensitivity” (Min) to the “receive overload” (Max). For certain pluggables
(NTK592xx) the range between Min and Max is greater than 20 dB; therefore, the reporting of the
receive power from the monitoring circuitry may be clamped to a power value that is short of the actual
power. Although the actual power may be within or even outside the Max range, PMs will not set the
OPR power to Invalid (IDF) since the power being reported is short of the Max.
Note 3: The OPT-OCH value is reported with an accuracy of ±0.3 dB.
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Figure 1-34
SRA circuit pack optical monitoring points
Wayside
Ethernet
Switch
OSC
SFP
EOS
Mapper
Backplane
Facility: OSC port 2
Parameter: OPR-OCH*, OPT-OCH*, SPANLOSS-OCH*
OTDR/
Telemetry
1
2
OSC In
3
Mon B
9
Line B Out
5
Line B In
6
Mon A
10
Line A Out
7
OSC Out
4
Line A In
8
PD
Facility: OPTMON port 6
Parameter: OPR-OTS*
PD / 4 Ch.
OPM
Facility: OPTMON port 4
Parameter: OPR-OTS*
PD
Processor
Module
Raman
Power
Supply
*AVG, MIN, and MAX measurements also provided.
Legend
EOS
OPM
OSC
OTDR
PD
Ethernet over SONET
Optical power monitoring
Optical service channel
Optical time domain reflectometry
Photodiode
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Facility: RAMAN port 8
Parameter: ORLIN-OTS*, ORLOUT-OTS*,
OPIN-OTS*, OPOUT-OTS*, OPROSC-OTS*
Facility: OTDRCFG port 8
Parameter: EVC(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVL(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVR(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVLDIS(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVRDIS(SH/LG/SHMAX/LGMAX)-OTS,
CUMEVL(SH/LG/SHMAX/LGMAX)-OTS,
CUMEVR(SH/LG/SHMAX/LGMAX)-OTS,
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
High Received Span Loss
•
Low Received Span Loss
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
SLDD Adjacency Loss
•
Software Subsystem Failed
RAMAN amplifier alarms
• Automatic Power Reduction Active
•
Automatic Shutoff
•
Automatic Shutoff Compromised
•
Calibration Required
•
Shutoff Threshold Crossed
•
Input Loss Of Signal
•
Optical Line Fail
•
Raman Failed To Turn On
•
Target Unachievable
•
Telemetry Loss of Signal
Telemetry alarms
• OTDR Trace In Progress
•
Line A Input OTDR High Loss detected
•
Line A Input OTDR High Reflection detected
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COM alarms
• Software Auto-Upgrade in Progress
Equipping rules
The following equipping rules apply to SRA circuit packs:
•
is a 10-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). If using a 7-slot shelf with 2xOSC ports, the OSC
connections is made on the SRA, not the shelf OSC ports.
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
each SRA in a domain must be at the same software release.
ATTENTION
If there is an intention to use Wayside traffic on the SRA circuit pack now or in the
future, it is recommended to equip SR as follows:
— slots 1 and/or 8 of the 6500-7 packet-optical shelf (for the first pair of SRA circuit
packs).
— slots 1 and/or 14 of the 14-slot shelf (for the first pair of SRA circuit packs).
— slots 1, 18, 21, and/or 38 of the 32-slot shelf.
— slots 1 and/or 7 of the 7-slot shelf (for the first pair of SRA circuit packs).
Channels for electrical cable management within the shelf fiber management tray
associated with these slots allow for routing of two RJ-45 Category 5 Ethernet cables
to each of those slots. These channels are separated from the fiber routing area and
can be used to connect to the one Wayside Ethernet port found on the SRA circuit
pack. The Wayside Ethernet ports are intended for intrabuilding use only.
•
requires high flow cooling fan modules (NTK507LDE5, NTK507MDE5,
NTK507LS, and NTK507MS) when equipped in a 14-slot shelf.
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The following restrictions on using a cross-connect circuit pack apply when
deploying a SRA circuit pack:
•
The SRA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs.
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a SRA circuit pack.
•
In a 14-slot shelf type, when the SRA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a SRA circuit pack
•
In a 6500-7 packet-optical shelf type, when the SRA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SRA optical interface circuit pack.
Table 1-24
Technical specifications for SRA optical interface circuit packs
Parameter
SRA (NTK552JA)
Weight (estimated) 1.6 kg (3.5 lb)
Power
consumption
Typical (W): 85 (Note 1 and Note 3)
Power Budget (W): 110 (Note 2 and Note 3)
Line A
Wavelength range
(nm)
Line B
1528.77 to 1566.72 (96 channels capable)
Insertion loss from
Line_A_In to
Line_A_Out (dB)
1.9 (max.)
N/A
Insertion loss from
Line_B_In to
Line_B_Out (dB)
N/A
1.7 (max.)
Insertion loss from
Line_A_In to
OSC_Out (dB)
2.4 (max.)
N/A
Insertion loss from
OSC_In to
Line_B_Out (dB)
N/A
1.9 (max.)
Minimum
Default
Input LOS
threshold (dBm)
-36
-36
10
OSC A Out LOS
Set (dBm)
-43
-40
0
N/A
APR (dB)
15
24
30
N/A
Shutoff threshold
(dBm)
-60
-39
10
N/A
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Maximum Minimum
-20
Default
Maximum
-10
10
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Table 1-24 (continued)
Technical specifications for SRA optical interface circuit packs
Parameter
SRA (NTK552JA)
Raman specifications
Raman power
(Watt)
1 (achieved using four pumps totaling +30 dB)
Raman pump
wavelength (nm)
Pump 1: 1424 nm
Pump 2: 1465 nm
Pump 3: 1455 nm
Pump 4: 1434 nm
Raman gain (dB)
0 to 24 (depending on the fiber type)
SFP specifications (Note 4)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggable transceivers must be considered
separately. When estimating the total power for the equipment in a slot or in a system, you must add
the power values for each of the required pluggable devices. For pluggable transceiver power values,
refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10ED (Technical specifications):
— “OSC SFP optical specifications in RAMAN spans”
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OSC SFP optical specifications for SRA circuit packs
Table 1-25 lists the OSC SFP specifications for SRA circuit packs.
Table 1-25
OSC SFP specifications for SRA circuit packs
PEC
Description
Mode
Wavelength Transmitter Receiver sensitivity (dBm)
(nm)
power (dBm) (Note 1)
Min.
Max.
Min.
Max.
NTK592NG Low Tx power CWDM 1511
-7.5
-4.0
-44.0
-7.0
NTK592NV Long reach
CWDM 1511
1.0
5.0
-44.0
-7.0
NTK592NR Long reach
(Note 2)
DWDM 1517
3.0
6.0
-43.0
-7.0
Note 1: The Rx power monitoring accuracy is +/- 2 dB over the power range of -44 to -24 dBm and is
undefined outside the documented range.
Note 2: NTK592NR applies to SRA circuit packs only. Use this SFP when the fiber type of the span
is TWRS and when the CWDM SFP limit is exceeded. This SFP must always be used in combination
with OSC Filter (1516.9 nm) module (NTK504BA) to reach spans losses of up to 46 dB on all fiber
types.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Switchable Line Amplifier (XLA C-Band) circuit pack (NTK552KA)
Overview
The Switchable Line Amplifier (XLA C-Band) circuit pack (also referred to as
XLA) is used for providing amplification in Photonic Layer applications. The
XLA circuit pack has one fixed-gain amplifier per outgoing line facing direction
where Line A and Line B can be independently provisioned for either High or
Low Gain values. Unlike SRA circuit packs, there are no OSC filters or WSC
port. An XLA circuit pack must always be paired with an SRA circuit pack
(Raman span/long span) or SAM/ESAM circuit pack (short span) depending
on the requirements.
Figure 1-35 on page 1-107 shows the faceplate of an XLA circuit pack and
Figure 1-36 on page 1-108 provides a functional block diagram of the XLA
circuit pack.
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Figure 1-35
XLA circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Monitor
ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-36
XLA circuit pack block diagram (NTK552KA)
Backplane
EDFA
1
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
Line A In
8
PD
PD
EDFA
PD
Processor
Module
Mon B
Power
Supply
PD
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Supported functionality
The XLA circuit packs (NTK552KA) provide the following functionality:
•
wavelength range: C-band 1528.77 nm to 1566.72 nm
•
50 GHz and 100 GHz grid compliant
•
external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
•
ALSO (Automatic Line Shut Off) functionality
•
APR (Automatic Power Reduction) functionality
•
see below for function and connector type for each port
Table 1-26
XLA optical interfaces
Interface name
Physical port #
Function
Connector type
Line A In / Out
8/7
Input / output port of Amplifier A
LC
Line B In / Out
6/5
Input / output port of Amplifier B
LC
Mon A
2
Monitor port for Line A Out
LC
Mon B
1
Monitor port for Line B Out
LC
Performance monitoring
The 6500 monitors and collects physical PMs for XLA circuit pack facilities.
Table 1-27 provides a list of monitor types supported on XLA circuit packs.
Figure 1-37 on page 1-111 shows the XLA circuit pack optical monitoring
points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
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Table 1-27
Monitor types table for XLA circuit pack
Monitor type
Facility
AMP
ORL-OTS
ORLMIN-OTS
ORLMAX-OTS
ORLAVG-OTS
X
X
X
X
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
NMCMON
CHMON
X
X
X
X
X
X
X
X
Note: CHMON OPT-OCH monitor type support requires the OPM (embedded within
WSS w/OPM circuit packs or on standalone 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs).
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Figure 1-37
XLA circuit pack optical monitoring points
Facility: AMP port 6
Parameter: ORL-OTS*, OPIN-OTS*, OPOUT-OTS*
Facility: CHMON port 5,
NMCMON port 5
Parameter: OPT-OCH* **
Backplane
EDFA
MON B
1
Line B Out
5
Line B In
6
Mon A
2
Line A Out
7
Line A In
8
PD
PD
Facility: CHMON port 7,
NMCMON port 7
Parameter: OPT-OCH* **
Facility: AMP port 8
Parameter: ORL-OTS*, OPIN-OTS*, OPOUT-OTS*
EDFA
PD
Processor
Module
PD
Power
Supply
* AVG, MIN, and MAX measurements also provided.
** CHMON OPT-OCH monitor type support requires the OPM embedded within an ADJ provisioned
OPM supported device with Equipment Profile set to FlexibleGrid. The CHMON OPT-OCH monitor
type is not supported on the LIM L-Band circuit pack, as there is no corresponding L-Band OPM.
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
High Received Span Loss
AMP alarm
• Low Optical Return Loss at Output
Photonic alarms
• Adjacency Far End Not Discovered
•
Adjacency Mismatch
•
High Fiber Loss
•
Fiber Type Manual Provisioning Required
•
Shutoff Threshold Crossed
•
Optical Line Failed
•
Automatic Power Reduction Active
•
Input Loss of Signal
•
Output Loss of Signal
•
Automatic Shutoff
•
Automatic Shutoff Disabled
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Crossed Fibers Suspected
COM alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to XLA circuit packs:
•
is a 6-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
The following restrictions on using a cross-connect circuit pack apply when
deploying a XLA circuit pack:
•
the XLA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a XLA circuit pack
•
In a 14-slot shelf type, when the XLA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a XLA circuit pack
•
In a 6500-7 packet-optical shelf type, when the XLA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the XLA optical interface circuit pack.
Table 1-28
Technical specifications for XLA optical interface circuit packs
Parameter
XLA (NTK552KA)
Weight (estimated)
1.0 kg (2.2 lb)
Power consumption
Typical (W): 36 (Note 1)
Power Budget (W): 40 (Note 2)
Line A and Line B
Maximum output power (dBm)
Wavelength range (nm)
Top offset (Note 3)
23
1528.77 to 1566.72 (96 channels capable)
Minimum
Default
Maximum
-6
0
0
Minimum
Default
Maximum
5
11
19
Amplifier Input LOS threshold (dBm)
-39
-26
-22
Amplifier Output LOS threshold (dBm)
-15
-12
0
Shutoff threshold (dBm)
-42
-29
-22
Minimum
Default
Maximum
Gain (dB)
11
11
29
Amplifier Input LOS threshold (dBm)
-39
-36
-22
Amplifier Output LOS threshold (dBm)
-15
-12
0
Shutoff threshold (dBm)
-42
-39
-22
Low Gain mode (Note 4):
Gain (dB)
High Gain mode (Note 4):
Tap ratio loss (dB)
Minimum
Maximum
Line_A_Out to Line_A_Mon
14.6
18.4
Line_B_Out to Line_B_Mon
14.6
18.4
Gain mask
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See Figure 1-38 on page 1-116 for low gain mode
and Figure 1-39 on page 1-116 for high gain mode
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Table 1-28 (continued)
Technical specifications for XLA optical interface circuit packs
Parameter
XLA (NTK552KA)
Line A and Line B
Noise figure (NF) (dB) (Note 5)
at output power of 23 dBm
Different at various gains
Low Gain mode
High Gain mode
• Gain 5 - 10 dB
NF < 16.6 (maximum)
• Gain 15 - 18 dB
NF < 10.3 (maximum)
• Gain 10 - 15 dB
NF < 9.6 (maximum)
• Gain 18 - 25 dB
NF < 7.8 (maximum)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: TOP Offset is a lever that can be used to maximize link budget (by reducing noise figure), and
the value will be provided by the modeling tools where applicable.
Note 4: Gain mode is defined as NA, High, or Low. Gain mode is set at provisioning from value
provided by One Planner. Gain mode drives minimum and maximum amplifier gain. Gain mode of NA
(Not Applicable) is used for all amplifiers except XLA. On database restore, if the gain mode is different
between the saved database and the actual gain setting on the circuit pack, traffic may be impacted.
You cannot switch from Low Gain mode to High Gain mode if the current target gain is less than 11 dB,
which is outside of the common range (11-19 dB) for the Low Gain setting.
Note 5: Contact Ciena if more information is required.
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Figure 1-38
XLA line A and Line B gain mask (low gain mode)
Extended
range
Typical range
Figure 1-39
XLA line A and Line B gain mask (high gain mode)
Typical range
Extended
range
Extended
range
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Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Service Access Module (SAM C-Band) w/Optical Service Channel
(OSC) 1xSFP 10/100 BT WSC circuit pack (NTK552JN) and Enhanced
Service Access Module (ESAM C-Band) w/Optical Service Channel
(OSC) 1xSFP 10/100 BT WSC circuit pack (NTK552JT)
Overview
The Service Access Module (SAM C-Band) w/Optical Service Channel (OSC)
1xSFP 10/100 BT WSC circuit pack (also referred to as SAM) and Enhanced
Service Access Module (ESAM C-Band) w/Optical Service Channel (OSC)
1xSFP 10/100 BT WSC circuit pack (also referred to as ESAM) are used as
the outgoing line facing circuit packs for short-span configurations in Photonic
Layer applications. By including integrated OSC add/drop filters and OSC
add/drop ports, the SAM and ESAM circuit packs remove the need for 2xOSC
circuit packs at Line Amp and ROADM sites. The ESAM circuit pack also
provides OTDR functionality.
Figure 1-40 on page 1-119 shows the faceplate of a SAM circuit pack and
Figure 1-41 on page 1-120 shows the faceplate of an ESAM circuit pack.
Figure 1-42 on page 1-121 provides a functional block diagram of the SAM
circuit pack and Figure 1-43 on page 1-122 provides a functional block
diagram of the ESAM circuit pack.
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Figure 1-40
SAM circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
WSC port
OSC ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Line ports
Monitor
ports
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Figure 1-41
ESAM circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
WSC port
OSC ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Line ports
Monitor
ports
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Figure 1-42
SAM circuit pack block diagram (NTK552JN)
Wayside
Ethernet
Switch
Backplane
EOS
Mapper
OSC
SFP
1
2
OSC In
3
Mon B
9
Line B Out
5
Line B In
6
Mon A
10
Line A Out
7
OSC Out
4
Line A In
8
PD
PD
Processor
Module
Power
Supply
PD
Legend
EOS
OSC
PD
Ethernet over SONET
Optical service channel
Photodiode
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Figure 1-43
ESAM circuit pack block diagram (NTK552JT)
Wayside
Backplane
Ethernet
Switch
EOS
Mapper
OTDR
OSC
SFP
1
2
OSC In
3
Mon B
9
Line B Out
5
Line B In
6
Mon A
10
Line A Out
7
OSC Out
4
Line A In
8
PD
PD
Processor
Module
Power
Supply
PD
Legend
EOS
Ethernet over SONET
OSC
OTDR
Optical service channel
Optical time domain reflectometry
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Supported functionality
The SAM circuit packs (NTK552JN) and ESAM circuit packs (NTK552JT)
provide the following functionality:
•
wavelength range: C-band 1528.77 nm to 1566.72 nm
•
50 GHz and 100 GHz grid compliant
•
integrated OSC add/drop filters - OSC add/drop ports
•
integrated a Wayside connection (WSC) port
•
external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
•
Optical Time-Domain Reflectometry (OTDR) to measure integrity of fiber
plant and interconnects (only supported in ESAM circuit packs)
•
see below for function and connector type for each port
Table 1-29
SAM and ESAM optical interfaces
Interface name
Physical port #
Function
Connector type
Mon A
10
Monitor port for Line A Out
LC
Mon B
9
Monitor port for Line B Out
LC
Line A In / Out
8/7
Input / output port of Line A
LC
Line B In / Out
6/5
Input / output port of Line B
LC
OSC A Out
4
Optical Service Channel output
LC
OSC B In
3
Optical Service Channel input
LC
OSC SFP In / Out
2
Optical Service Channel SFP pluggable
input/output port
LC
WSC
1
Wayside channel
RJ-45
Cross-connection types
The SAM and ESAM circuit packs support the following cross-connection
types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Cross-connection rates
The SAM and ESAM circuit packs only support the OCH (Optical Channel)
Photonic cross-connection rate.
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Supported SFPs
The following table provides a list of the SFPs that are supported on the SAM
and ESAM circuit pack.
Table 1-30
Supported SFP modules for the SAM and ESAM circuit packs (NTK552JN and NTK552JT)
Pluggable Equipment and
Facilities (Note 1, Note 2, and
Note 3)
Supported SFP modules and rates
• P155M
OC-3/STM-1 CWDM 1511 nm (0-34 dB span)
— OSC (Note 4)
— OC-3/STM-1 (155.52Mb/s)
OC-3/STM-1 CWDM 1511 nm (12-42 dB span)
Part Number
NTK592NGE5
NTK592NVE5
— OC-3/STM-1 (155.52Mb/s)
Note 1: Facilities on Photonic circuit packs are auto-provisioned upon equipment/pluggable equipment
creation. The facilities in brackets are facilities that cannot be manually added or deleted.
Note 2: OSC reach can be guaranteed only when both ends of the link are using the same SFP type.
This is enforced through procedure and One Planner design.
Note 3: An ESAM/SAM has three OPTMON facilities (ports 4, 6, and 8). In addition, an ESAM has one
TELEMETRY facility (port 5). The P155M pluggable and OSC facility is supported on port 2.
Note 4: The P155M pluggable on the SAM or ESAM circuit pack supports WSC facilities. These
facilities are not displayed or managed in the Equipment & Facilities Provisioning applications. They are
handled by Comms Setting Management application through LAN option under Interfaces tab. If you
provision the low output power SFP (NTK592NG) or the extended reach SFP (NTK592NV), the
connected LIM port 4 OPTMON facility will be put OOS automatically to prevent the “Loss of Signal”
alarm from being raised.
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Performance monitoring
The 6500 monitors and collects physical PMs for SAM and ESAM circuit pack
facilities. Table 1-31 provides a list of monitor types supported on SAM and
ESAM circuit packs. Figure 1-44 on page 1-128 and Figure 1-45 on page
1-129 show the SAM and ESAM circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-31
Monitor types table for SAM and ESAM circuit pack
Monitor type
Facility
OSC
OPTMON
OTDRCFG
(ESAM only)
Note 1
SONET Section (S)/SDH Regenerator Section (RS)
CV-S or RS-BBE
X
ES-S or RS-ES
X
SES-S or RS-SES
X
SEFS-S or RS-OFS
X
SONET Line (L)/SDH Multiplex Section (MS)
CV-L or MS-BBE
X
ES-L or MS-ES
X
SES-L or MS-SES
X
UAS-L or MS-UAS
X
FC-L or MS-FC
X
DMMIN-L or L-DMMIN
DMMAX-L or L-DMMAX
DMAVG-L or L-DMAVG
X
X
X
Physical
OPR-OCH
OPRMIN-OCH
OPRMAX-OCH
OPRAVG-OCH
Note 2
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X
X
X
X
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Table 1-31
Monitor types table for SAM and ESAM circuit pack
Monitor type
Facility
OSC
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
Note 3
X
X
X
X
SPANLOSS-OCH
SPANLOSSMIN-OCH
SPANLOSSMAX-OCH
SPANLOSSAVG-OCH
X
X
X
X
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
OPTMON
OTDRCFG
(ESAM only)
Note 1
X
X
X
X
EVCSH-OTS
X
EVCLG-OTS
X
EVCSHMAX-OTS
X
EVCLGMAX-OTS
X
MAXEVLSH-OTS
X
MAXEVLLG-OTS
X
MAXEVLSHMAX-OTS
X
MAXEVLLGMAX-OTS
X
MAXEVRSH-OTS
X
MAXEVRLG-OTS
X
MAXEVRSHMAX-OTS
X
MAXEVRLGMAX-OTS
X
MAXEVLDISSH-OTS
X
MAXEVLDISLG-OTS
X
MAXEVLDISSHMAX-OTS
X
MAXEVLDISLGMAX-OTS
X
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Table 1-31
Monitor types table for SAM and ESAM circuit pack
Monitor type
Facility
OSC
OPTMON
OTDRCFG
(ESAM only)
Note 1
MAXEVRDISSH-OTS
X
MAXEVRDISLG-OTS
X
MAXEVRDISSHMAX-OTS
X
MAXEVRDISLGMAX-OTS
X
CUMEVLSH-OTS
X
CUMEVLLG-OTS
X
CUMEVLSHMAX-OTS
X
CUMEVLLGMAX-OTS
X
CUMEVRSH-OTS
X
CUMEVRLG-OTS
X
CUMEVRSHMAX-OTS
X
CUMEVRLGMAX-OTS
X
Note 1: Support for OTDRCFG PM counts is restricted to shelves with SP2 shelf processor types.
Note 2: The accuracy of the monitoring circuitry on SFP and SFP+ pluggables is guaranteed to be at
least 20 dB from the “receive sensitivity” (Min) to the “receive overload” (Max). For certain pluggables
(NTK592xx) the range between Min and Max is greater than 20 dB; therefore, the reporting of the
receive power from the monitoring circuitry may be clamped to a power value that is short of the actual
power. Although the actual power may be within or even outside the Max range, PMs will not set the
OPR power to Invalid (IDF) since the power being reported is short of the Max.
Note 3: The OPT-OCH/OCH-OPT value is reported with an accuracy of ±0.3 dB.
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Figure 1-44
SAM circuit pack optical monitoring points
Wayside
Ethernet
Switch
OSC
SFP
EOS
Mapper
Facility: OSC port 2
Parameter: OPR-OCH*, OPT-OCH*, SPANLOSS-OCH*
Backplane
Facility: OPTMON port 6
Parameter: OPR-OTS*
1
2
OSC In
3
Mon B
9
Line B Out
5
Line B In
6
Mon A
10
Line A Out
7
OSC Out
4
Line A In
8
PD
PD
Facility: OPTMON port 4
Parameter: OPR-OTS*
Processor
Module
Power
Supply
PD
Facility: OPTMON port 8
Parameter: OPR-OTS*
*AVG, MIN, and MAX measurements also provided.
Legend
EOS
Ethernet over SONET
OSC
Optical service channel
PD
Photodiode
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Figure 1-45
ESAM circuit pack optical monitoring points
Wayside
Wayside
Ethernet
Ethernet
Switch
Switch
OSC
OSC
SFP
SFP
EOS
EOS
Mapper
Mapper
Facility:
Facility: OSC
OSC port
port 22
Parameter:
OPR-OCH*,
Parameter: OPR-OCH*, OPT-OCH*,
OPT-OCH*, SPANLOSS-OCH*
SPANLOSS-OCH*
11
22
OSC
OSC In
In
33
Mon
Mon B
B
99
Facility:
Facility: OPTMON
OPTMON port
port 66
Parameter:
OPR-OTS*
Parameter: OPR-OTS*
Backplane
Backplane
Line
Line B
B Out
Out 55
OTDR
OTDR
PD
PD
Line
Line B
B In
In
66
Mon
Mon A
A
10
10
Line
Line A
A Out
Out 77
PD
PD
Facility:
Facility: OPTMON
OPTMON port
port 44
Parameter:
OPR-OTS*
Parameter: OPR-OTS*
Processor
Processor
Module
Module
Power
Power
Supply
Supply
OSC
OSC Out
Out
44
Line
Line A
A In
In
88
PD
PD
Facility: OPTMON port 8
Parameter: OPR-OTS*
*AVG, MIN, and MAX measurements also provided.
*AVG, MIN, and MAX measurements also provided.
Legend
Legend
EOS
EOS
OSC
OSC
OTDR
OTDR
Ethernet
Ethernet over
over SONET
SONET
Optical
service
Optical service channel
channel
Optical
Time
Domain
Optical Time Domain Reflectometry
Reflectometry
PD
PD
Photodiode
Photodiode
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Facility: OPTMON port 8
Parameter: OPR-OTS*
Facility: OTDRCFG port 8
Parameter: EVC(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVL(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVR(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVLDIS(SH/LG/SHMAX/LGMAX)-OTS,
MAXEVRDIS(SH/LG/SHMAX/LGMAX)-OTS,
CUMEVL(SH/LG/SHMAX/LGMAX)-OTS,
CUMEVR(SH/LG/SHMAX/LGMAX)-OTS,
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Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
High Received Span Loss
•
Low Received Span Loss
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
Automatic Shutoff Compromised
•
SLDD Adjacency Loss
•
Software Subsystem Failed
Adjacency alarms
• Adjacency Far End Not Discovered
•
Adjacency Mismatch
•
High Fiber Loss
•
Fiber Type Manual Provisioning Required
•
Input Loss of Signal
•
Optical Line Failed
Telemetry alarms (ESAM only)
• OTDR Trace In Progress
•
Line A Input OTDR High Loss detected
•
Line A Input OTDR High Reflection detected
COM alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to SAM and ESAM circuit packs:
•
SAM is a 10-port single slot interface.
•
ESAM is a 10-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
•
SAM cannot be equipped in the 2-slot shelf
•
ESAM cannot be equipped in the NTK503MAE5 and NTK503NAE5
variants of 2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA
variant of 2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC
(NTK555NA or NTK555NB).
ATTENTION
If there is an intention to use Wayside traffic on the SAM or ESAM circuit pack now
or in the future, it is recommended to equip SAM or ESAM as follows:
— slots 1 and/or 8 of the 6500-7 packet-optical shelf (for the first pair of SAM or
ESAM circuit packs).
— slots 1 and/or 14 of the 14-slot shelf (for the first pair of SAM or ESAM circuit
packs).
— slots 1, 18, 21, and/or 38 of the 32-slot shelf.
— slots 1 and/or 7 of the 7-slot shelf (for the first pair of SAM or ESAM circuit
packs).
Channels for electrical cable management within the shelf fiber management tray
associated with these slots allow for routing of two RJ-45 Category 5 Ethernet cables
to each of those slots. These channels are separated from the fiber routing area and
can be used to connect to the one Wayside Ethernet port found on the SAM or
ESAM circuit pack. The Wayside Ethernet ports are intended for intrabuilding use
only.
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ATTENTION
Although SAM or ESAM circuit packs can be equipped in slots 1-8, 11-18,
21-28, and 31-38 of a 32-slot shelf, it is recommended to use slots 1, 18, 21,
and/or 38 of the 32-slot shelf. Channels for electrical cable management
within the 32-slot packet-optical shelves (NTK603AAE5 and NTK603AB)
fiber management tray associated with slots 1, 18, 21, and 38 of the 32-slot
shelf allow for routing of two RJ-45 Category 5 Ethernet cables to each of
those slots. These channels are separated from the fiber routing area and
can be used to connect to the one Wayside Ethernet port found on the SAM
or ESAM circuit pack. The Wayside Ethernet port is intended for intrabuilding
use only.
The following restrictions on using a cross-connect circuit pack apply when
deploying a SAM or ESAM circuit pack:
•
The SAM or ESAM circuit packs do not use any cross-connect capacity
and can be installed in shelves equipped with or without cross-connect
circuit packs.
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a SAM or ESAM circuit
pack.
•
In a 14-slot shelf type, when the SAM or ESAM circuit packs are installed
in slot 7 or 8, only Broadband circuit packs or Photonic circuit packs can
be provisioned in the other interface slots (slots 1 to 6 and 9 to14) as
MSPP or PKT/OTN I/F interface circuit packs require a cross-connect
circuit pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and
equipment descriptions) for a full list of supported Broadband and
Photonic circuit packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a SAM or ESAM circuit pack
•
In a 6500-7 packet-optical shelf type, when the SAM or ESAM circuit
packs are installed in slot 7 or 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6)
as MSPP or PKT/OTN I/F interface circuit packs require a cross-connect
circuit pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and
equipment descriptions) for a full list of supported Broadband and
Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SAM and ESAM optical interface circuit packs.
Table 1-32
Technical specifications for SAM and ESAM optical interface circuit packs
Parameter
SAM (NTK552JN) and ESAM (NTK552JT)
Weight (estimated) 0.9 kg (2.0 lb) for SAM and 1.4 kg (3.0 lb) for ESAM
Power
consumption
Typical (W): 25 for SAM and 30 for ESAM (Note 1 and Note 3)
Power Budget (W): 30 for SAM and 35 for ESAM (Note 2 and Note 3)
Line A
Wavelength range
(nm)
Line B
1528.77 to 1566.72 (96 channels capable)
Minimum
Default
Input LOS
threshold (dBm)
-36
-36
10
OSC A Out LOS
Set (dBm)
-43
-40
0
N/A
Shutoff threshold
(dBm)
-60
-39
10
N/A
Maximum insertion
loss from Line A_In
to Line A_Out (dB)
1.0 for SAM
-20
Default
Maximum
-10
10
N/A
1.5 for ESAM
Maximum insertion
loss from Line B_In
to Line B_Out (dB)
N/A
Maximum Insertion
loss from
Line_A_In to
OSC_Out (dB)
1.5 for SAM
Maximum Insertion
loss from OSC_In
to Line_B_Out
(dB)
Maximum Minimum
0.9 for SAM
1.3 for ESAM
N/A
1.8 for ESAM
N/A
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1.2 for SAM
1.3 for ESAM
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Table 1-32
Technical specifications for SAM and ESAM optical interface circuit packs
Parameter
SAM (NTK552JN) and ESAM (NTK552JT)
SFP specifications (Note 4)
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The power consumption values are derated so that pluggable transceivers must be considered
separately. When estimating the total power for the equipment in a slot or in a system, you must add
the power values for each of the required pluggable devices. For pluggable transceiver power values,
refer to Pluggable Datasheets and Reference, 323-1851-180.
Note 4: For optical SFP specifications, see the following sections in Part 3 of 6500 Planning,
NTRN10ED (Technical specifications):
— “OSC SFP optical specifications in RAMAN spans”
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OSC SFP optical specifications for SAM/ESAM circuit packs
The following table lists the OSC SFP specifications for SAM/ESAM circuit
packs.
Table 1-33
OSC SFP specifications for SAM/ESAM circuit packs
PEC
Description
Mode
Wavelength Transmitter Receiver sensitivity (dBm)
(nm)
power (dBm)
Min.
Max.
Min.
Max.
NTK592NG Low Tx power CWDM 1511
-7.5
-4.0
-44.0
-7.0
NTK592NV Long reach
1.0
5.0
-44.0
-7.0
CWDM 1511
Note: The Rx power monitoring accuracy is +/- 2 dB over the power range of -44 to -24 dBm and is
undefined outside the documented range.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5)
Overview
The Wavelength Selective Switch (WSS) 100 GHz w/OPM C-Band 5x1 circuit
pack (also referred to as WSS 100 GHz w/OPM 5x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching. The
combination of WSS 100 GHz w/OPM 5x1 circuit pack and CMD44 modules
(at ROADM or WSS-based terminal sites) are required to perform add/drop
operation. Figure 1-46 shows the faceplate of a WSS 100 GHz w/OPM 5x1
circuit pack and Figure 1-47 on page 1-137 provides a functional block
diagram of the WSS 100 GHz w/OPM 5x1 circuit pack.
Figure 1-46
WSS 100 GHz w/OPM 5x1 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
Monitor
- Used to communicate whether circuit pack can ports
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Switch
ports
Common
ports
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Figure 1-47
WSS 100 GHz w/OPM 5x1 circuit pack block diagram (NTK553EAE5)
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Backplane
Wavelength
Selective Switch
9x1 100GHZ
Switch In-5 11
Switch In-6 13
Switch In-7 14
Switch In-8 15
Switch In-9 16
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
Passive
Demux
1x5
PD
Common
Out
18
Common
In
17
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Legend
PD
Photodiode
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Supported functionality
The WSS 100 GHz w/OPM 5x1 circuit packs (NTK553EAE5) provide the
following functionality:
•
a per wavelength attenuation profile for up to 44 C-band channels at
100 GHz spacing
•
a demultiplexer block which is essentially a 1:5 passive power splitter
•
in-service dynamic per channel add/drop/branching/broadcast
•
embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
•
PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports
•
per channel power control on add and pass-through traffic
•
provides 100% add/drop capability at each site
•
supports 2.5G, 10G, 40G, 100G, and 200G channels
•
per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
•
branching and broadcast (up to five connected nodes)
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
one channel control facility per wavelength
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-34 on page 1-139 for function and connector type for each
port
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Table 1-34
WSS 100 GHz w/OPM 5x1 optical interfaces
Interface name
Physical port #
Function
Connector type
Mon
1
Monitor port for OPM
LC
Mon
2
Monitor port for OPM
LC
Optical input / output from other WSS or
CMD44
LC
DWDM optical input / output to /from the
line amplifier
LC
Switch 1 In / Out
3/4
Switch 2 In / Out
5/6
Switch 3 In / Out
7/8
Switch 4 In / Out
9 / 10
Switch 5 In / Out
11 / 12
Switch 6 In
13
Switch 7 In
14
Switch 8 In
15
Switch 9 In
16
Common In / Out
17 / 18
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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 100 GHz w/OPM 5x1
circuit pack facilities. Table 1-35 provides a list of monitor types supported on
WSS 100 GHz w/OPM 5x1 circuit packs. Figure 1-48 on page 1-141 shows
the WSS 100 GHz w/OPM 5x1 circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-35
Monitor types table for WSS 100 GHz w/OPM 5x1 circuit packs
Monitor type
Facility
OPTMON
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
Note
Note: Use optical terminators on unused input faceplate connectors of
installed WSS w/OPM circuit packs. If dust caps are used instead of optical
terminators on “Switch In” ports, PMs can be reported against the ports and
the ports may appear in-service.
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Figure 1-48
WSS 100 GHz w/OPM 5x1 circuit pack optical monitoring points
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Backplane
Wavelength
Selective Switch
9x1 100GHZ
Switch In-5 11
Switch In-6 13
Switch In-7 14
Switch In-8 15
Switch In-9 16
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,
9,11,13,14,15,16,17
Parameter: OPR-OTS*
Passive
Demux
1x5
PD
Common
Out
18
Common
In
17
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
*AVG, MIN, and MAX measurements also provided
Legend
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Mismatch
•
Adjacency Provisioning Error
•
Channel Opacity Error
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Wavelength Measurement Warning
•
Wavelength Measurement Error
Common equipment alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure detected
•
Channel Controller: Unexpected Loss detected
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Equipping rules
The following equipping rules apply to WSS 100 GHz w/OPM 5x1 circuit
packs:
•
is a double-slot interface.
•
can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 14 since WSS 100 GHz w/OPM 5x1 circuit pack is a double-slot
interface. This circuit pack is not supported for use in slots 7/8 and 8/9 of
the 14-slot packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.
•
can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. WSS 100 GHz w/OPM 5x1 circuit pack cannot be
placed in slot 8, 18, 28, or 38 since WSS 100 GHz w/OPM 5x1 circuit pack
is a double-slot interface.
Note: Due to faceplate dimensions, the following releases of the
double-slot 100 GHz WSS circuit pack cannot be equipped in slots 7/8 or
27/28 of 32-slot shelves:
WSS 100 GHz w/OPM 5x1 (NTK553EAE5): releases 01, 02 and 03
You must use the following releases of the double-slot 100 GHz WSS
circuit pack:
WSS 100 GHz w/OPM 5x1 (NTK553EAE5): releases 04 and above
•
can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 7 since WSS 100 GHz w/OPM 5x1 circuit pack is a double-slot
interface.
•
can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 8 since WSS 100 GHz w/OPM 5x1 circuit pack is a double-slot
interface. This circuit pack is not supported for use in slots 7/8 of the
6500-7 packet-optical shelf (NTK503RA).
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•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS 100 GHz w/OPM 5x1 circuit pack:
•
the WSS 100 GHz w/OPM 5x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, when the WSS 100 GHz w/OPM 5x1 circuit packs
are installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
•
In a 6500-7 packet-optical shelf type, when the WSS 100 GHz w/OPM 5x1
circuit packs are installed in slots 7 and 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 100 GHz w/OPM 5x1 optical interface circuit pack.
Table 1-36
Technical specifications for WSS 100 GHz w/OPM 5x1 optical interface circuit pack
Parameter
WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
Weight (estimated)
2.5 kg (5.5 lb)
Power consumption
Typical (W): 32 (Note 1)
Power Budget (W): 32 (Note 2)
Connector type
LC
OPM power range
-35 dBm to +10 dBm
Wavelength range (nm)
1530.33 to 1565.09 (88 channels capable)
Maximum total input power
24 dBm for Common In, Switch In ports 1-9
Maximum Demux insertion loss
8.7 dB from Common In to Switch Out 1-5 ports
Maximum Mux insertion loss
7 dB from Switch In ports 1-9 to Common Out
Available attenuation per channel
0-18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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WSS 100 GHz w/OPM C-Band 2x1 circuit pack (NTK553JAE5 and NTK553JB)
Overview
The Wavelength Selective Switch (WSS) 100 GHz w/OPM C-Band 2x1 circuit
pack (also referred to as WSS 100 GHz w/OPM 2x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching.
The combination of WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JAE5 or
NTK553JB variant) and CMD44 modules (at ROADM or WSS-based terminal
sites) or the combination of WSS 100 GHz w/OPM 2x1 circuit pack
(NTK553JB variant only) and Photonic Passive Equipment (OMDF4, OMDF8
and BS5 modules, or CMD44 modules) (at ROADM or WSS-based terminal
sites) are required to perform add/drop operation. WSS 100 GHz w/OPM 2x1
circuit packs are mostly used for 1-way Terminal or 2-way ROADM
applications.
The WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JAE5 variant) is a newer
variant of WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5) with
the following distinctions:
•
NTK553EAE5 variant has branching and broadcast capability of up to five
connected nodes (5x1) while NTK553JAE5 variant has branching and
broadcast capability of up to two connected nodes (2x1). In other words,
a WSS 100 GHz w/OPM C-Band 5x1 circuit pack (NTK553EAE5) has five
Switch In ports while a WSS 100 GHz w/OPM 2x1 circuit pack
(NTK553JAE5) has two Switch In ports.
•
demultiplexer block in NTK553EAE5 variant is a 1:5 passive power splitter
while demultiplexer block in NTK553JAE5 variant is a 1:2 passive power
splitter. In other words, a WSS 100 GHz w/OPM C-Band 5x1 circuit pack
(NTK553EAE5) has five Switch Out ports while a WSS 100 GHz w/OPM
2x1 circuit pack (NTK553JAE5) has two Switch Out ports.
•
lower demux insertion loss compared to NTK553EAE5 variant lowers total
network costs since lower power amps can be used in some scenarios.
The WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JB variant) is a newer
variant of the NTK553JAE5 with the following distinctions:
•
NTK553JB circuit pack is single slot-wide while NTK553JAE5 circuit pack
is double slot-wide.
•
NTK553JB circuit pack has less power consumption than NTK553JAE5
circuit pack.
•
NTK553JB adds a power tap/monitor on Common Out port.
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•
different optical technical specifications.
•
the faceplate LC connectors on the NTK553JB circuit pack protrude by an
extra 10 mm compared to faceplate LC connectors on the NTK553JAE5
circuit pack. As a result, in order to avoid unacceptable interference with
the shelf front cover, NTTC50++ patch cords (NTTC50++ patch cords are
Corning standard LC strain relief boots) or approved equivalent must be
used. Also, attenuator pads cannot be mounted on the faceplate of the
NTK553JB circuit pack when the shelf front cover is installed.
Figure 1-49 on page 1-148 shows the faceplate of a WSS 100 GHz w/OPM
2x1 circuit pack (NTK553JAE5 variant) and Figure 1-50 on page 1-149
provides a functional block diagram of the WSS 100 GHz w/OPM 2x1 circuit
pack (NTK553JAE5 variant).
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Figure 1-49
WSS 100 GHz w/OPM 2x1 circuit pack faceplate (NTK553JAE5 variant)
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
Monitor
- Used to communicate whether circuit pack can ports
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Switch
ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Common
ports
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Figure 1-50
WSS 100 GHz w/OPM 2x1 circuit pack block diagram (NTK553JAE5 variant)
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
PD
2x1
Optical
Switch
Monitor-1 1
Monitor-2 2
Switch In-1 3
Switch In-2 5
Backplane
Wavelength
Selective Switch
2x1 100GHz
PD
PD
Common 18
Out
Common
17
In
Isolator
Passive
Demux
1x2
PD
Demux Out-1 4
Demux Out-2 6
Legend
PD
Photodiode
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Figure 1-51 shows the faceplate of a WSS 100 GHz w/OPM 2x1 circuit pack
(NTK553JB variant) and Figure 1-52 on page 1-151 provides a functional
block diagram of the WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JB
variant).
Figure 1-51
WSS 100 GHz w/OPM 2x1 circuit pack faceplate (NTK553JB variant)
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Monitor
ports
Switch
ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Common
ports
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Figure 1-52
WSS 100 GHz w/OPM 2x1 circuit pack block diagram (NTK553JB variant)
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
2x1
Optical
Switch
PD
Monitor-1 1
Monitor-2 2
Switch In-1 3
Switch In-2 5
Backplane
Wavelength
Selective Switch
2x1 100GHz
PD
PD
Common
Out
8
Common
In
7
PD
Isolator
Passive
Demux
1x2
PD
Demux Out-1 4
Demux Out-2 6
Legend
PD
Photodiode
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Supported functionality
The WSS 100 GHz w/OPM 2x1 circuit packs (NTK553JAE5 and NTK553JB)
provide the following functionality:
•
a per-wavelength-attenuation profile for up to 44 C-band channels at 100
GHz spacing
•
a demultiplexer block which is essentially a 1:2 passive power splitter
•
in-service dynamic per channel add/drop/branching/broadcast
•
embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
•
PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports for both NTK553JAE5 and
NTK553JB variants and also at Common Out port for NTK553JB variant
•
per channel power control on add and pass-through traffic
•
provides 100% add/drop capability at each site
•
supports 2.5G, 10G, 40G, 100G, and 200G channels
•
per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
•
branching and broadcast (up to two connected nodes)
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
one channel control facility per wavelength
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-37 for function and connector type for each port
Table 1-37
WSS 100 GHz w/OPM 2x1 optical interfaces
Interface name
Physical port #
Function
Connector type
Mon
1
Monitor port for OPM
LC
Mon
2
Monitor port for OPM
LC
Optical input / output from other WSS or
CMD44
LC
DWDM optical input / output to /from the
17 / 18 on
line amplifier
NTK553JAE5
variant and 7 / 8 on
NTK553JB variant
LC
Switch 1 In / Out
3/4
Switch 2 In / Out
5/6
Common In / Out
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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 100 GHz w/OPM 2x1
circuit pack facilities. Table 1-38 provides a list of monitor types supported on
WSS 100 GHz w/OPM 2x1 circuit packs. Figure 1-53 on page 1-154 shows
the WSS 100 GHz w/OPM 2x1 circuit pack (NTK553JAE5 variant) optical
monitoring points. Figure 1-54 on page 1-155 shows the WSS 100 GHz
w/OPM 2x1 circuit pack (NTK553JB variant) optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-38
Monitor types table for WSS 100 GHz w/OPM 2x1 circuit pack
Monitor type
Facility
OPTMON
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
Note
Note: Use optical terminators on unused input faceplate connectors of
installed WSS w/OPM circuit packs. If dust caps are used instead of optical
terminators on “Switch In” ports, PMs can be reported against the ports and
the ports may appear in-service.
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Figure 1-53
WSS 100 GHz w/OPM 2x1 circuit pack optical monitoring points (NTK553JAE5 variant)
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
PD
2x1
Optical
Switch
Monitor-1 1
Monitor-2 2
Switch In-1 3
Switch In-2 5
Backplane
Wavelength
Selective Switch
2x1 100GHz
PD
PD
Common 18
Out
Facility: OPTMON port 18
Parameter: OPR-OTS*
Common
In
Isolator
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,17
Parameter: OPR-OTS*
Passive
Demux
1x2
PD
17
Demux Out-1 4
Demux Out-2 6
*AVG, MIN, and MAX measurements also provided
Legend
PD
Photodiode
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Figure 1-54
WSS 100 GHz w/OPM 2x1 circuit pack optical monitoring points (NTK553JB variant)
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
2x1
Optical
Switch
PD
Monitor-1 1
Monitor-2 2
Switch In-1 3
Switch In-2 5
Backplane
Wavelength
Selective Switch
2x1 100GHz
PD
PD
Common
Out
8
Common
In
7
PD
Isolator
PM collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,8
Parameter: OPR-OTS*
Passive
Demux
1x2
PD
Demux Out-1 4
Demux Out-2 6
*AVG, MIN, and MAX measurements also provided.
Legend
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Mismatch
•
Adjacency Provisioning Error
•
Channel Opacity Error
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
High Optical Power
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Wavelength Measurement Warning
•
Wavelength Measurement Error
Common equipment alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure detected
•
Channel Controller: Unexpected Loss detected
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Equipping rules
The following equipping rules apply to WSS 100 GHz w/OPM 2x1 circuit packs
(NTK553JAE5 variant):
•
is a double-slot interface.
•
can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). WSS 100 GHz w/OPM 5x1 circuit pack cannot be placed in
slot 14 since WSS 100 GHz w/OPM 5x1 circuit pack is a double-slot
interface. This circuit pack is not supported for use in slots 7/8 and 8/9 of
the 14-slot packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.
•
can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. WSS 100 GHz w/OPM 2x1 circuit pack cannot be
placed in slot 8, 18, 28, or 38 since WSS 100 GHz w/OPM 2x1 circuit pack
is a double-slot interface.
Note: Due to faceplate dimensions, the following releases of the
double-slot 100 GHz WSS circuit pack cannot be equipped in slots 7/8 or
27/28 of 32-slot shelves:
WSS 100 GHz w/OPM 2x1(NTK553JAE5): releases 01 and 02
You must use the following releases of the double-slot 100 GHz WSS
circuit pack:
WSS 100 GHz w/OPM 2x1(NTK553JAE5): releases 03 and above
•
can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). WSS 100 GHz w/OPM 2x1 circuit pack cannot be placed in
slot 7 since WSS 100 GHz w/OPM 2x1 circuit pack is a double-slot
interface.
•
can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). WSS 100 GHz w/OPM 2x1 circuit pack cannot be placed in
slot 8 since WSS 100 GHz w/OPM 2x1 circuit pack is a double-slot
interface. This circuit pack is not supported for use in slots 7/8 of the
6500-7 packet-optical shelf (NTK503RA).
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•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following equipping rules apply to WSS 100 GHz w/OPM 2x1 circuit packs
(NTK553JB variant):
•
is a single slot interface.
•
can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS 100 GHz w/OPM 2x1 circuit pack:
•
the WSS 100 GHz w/OPM 2x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, when the WSS 100 GHz w/OPM 2x1 circuit packs
are installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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•
In a 6500-7 packet-optical shelf type, when the WSS 100 GHz w/OPM 2x1
circuit packs are installed in slots 7 and 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 100 GHz w/OPM 2x1 optical interface circuit pack.
Table 1-39
Technical specifications for WSS 100 GHz w/OPM 2x1 optical interface circuit pack
Parameter
WSS 100 GHz w/OPM 2x1
NTK553JAE5 variant
NTK553JB variant
Weight (estimated)
2.5 kg (5.5 lb)
1.9 kg (4.1 lb)
Power consumption
Typical (W): 32 (Note 1)
Typical (W): 14 (Note 1)
Power Budget (W): 32 (Note 2)
Power Budget (W): 31 (Note 2)
Connector type
LC
LC
OPM power range
-35 dBm to +10 dBm
-35 dBm to -6.5 dBm
Wavelength range (nm)
1530.33 to 1565.09 (88 channels
capable)
1530.33 to 1565.09 (88 channels
capable)
Maximum total input
power
24 dBm for Common In, Switch In
ports 1-2
24 dBm for Common In, Switch In
ports 1-2
Maximum Demux
insertion loss
4.4 dB from Common In to Switch
Out 1-2 ports
5.3 dB from Common In to Switch Out
1-2 ports
Maximum Mux insertion
loss
7 dB from Switch In 1-2 ports to
Common Out
8.8 dB from Switch In 1-2 ports to
Common Out
Available attenuation per 0-18 dB
channel
0-18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
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Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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WSS 100 GHz w/OPM C-Band 4x1 circuit pack (NTK553HA)
Overview
The Wavelength Selective Switch (WSS) 100 GHz w/OPM C-Band 4x1 circuit
pack (also referred to as WSS 100 GHz w/OPM 4x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching. The
combination of WSS 100 GHz w/OPM 4x1 circuit pack and Photonic Passive
Equipment (OMDF4, OMDF8 and BS5 modules only), OMD4, or CMD44,
modules (at ROADM or WSS-based terminal sites) are required to perform
add/drop operation. Figure 1-55 on page 1-162 shows the faceplate of a WSS
100 GHz w/OPM 4x1 circuit pack and Figure 1-56 on page 1-163 provides a
functional block diagram of the WSS 100 GHz w/OPM 4x1 circuit pack.
The WSS 100 GHz w/OPM 4x1 circuit pack (NTK553HA) is a newer variant of
WSS 100 GHz w/OPM 5x1 circuit pack (NTK553EAE5) with the following
distinctions:
•
NTK553HA circuit pack is single slot-wide while NTK553EAE5 circuit pack
is double slot-wide.
•
NTK553HA circuit pack has less power consumption than NTK553EAE5
circuit pack.
•
NTK553HA circuit pack has four switch ports and 4 demux ports while
NTK553EAE5 circuit pack has nine switch ports and five demux ports.
•
different optical technical specifications.
•
the faceplate LC connectors on the NTK553HA circuit pack protrude by an
extra 10 mm compared to faceplate LC connectors on the NTK553EAE5
circuit pack. As a result, in order to avoid unacceptable interference with
the shelf front cover, NTTC50++ patch cords (NTTC50++ patch cords are
Corning standard LC strain relief boots) or approved equivalent must be
used. Also, attenuator pads cannot be mounted on the faceplate of the
NTK553HA circuit pack when the shelf front cover is installed.
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Figure 1-55
WSS 100 GHz w/OPM 4x1 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Monitor
ports
Switch
ports
Common
ports
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Figure 1-56
WSS 100 GHz w/OPM 4x1 circuit pack block diagram (NTK553HA)
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-3 3
Switch In-5 5
Switch In-7 7
Switch In-9 9
Backplane
Wavelength
Selective Switch
4x1 100GHZ
PD
PD
PD
Isolator
PD
Passive
Demux
1x4
PD
Common
Out
12
Common
In
11
Demux Out-4 4
Demux Out-6 6
Demux Out-8 8
Demux Out-10 10
Legend
PD
Photodiode
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Supported functionality
The WSS 100 GHz w/OPM 4x1 circuit packs (NTK553HA) provide the
following functionality:
•
a per wavelength attenuation profile for up to 44 C-band channels at
100 GHz spacing
•
a demultiplexer block which is essentially a 1:4 passive power splitter
•
in-service dynamic per channel add/drop/branching/broadcast
•
embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
•
PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports
•
per channel power control on add and pass-through traffic
•
provides 100% add/drop capability at each site
•
supports 2.5G, 10G, 40G, 100G, and 200G channels
•
per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
•
branching and broadcast (up to four connected nodes)
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
one channel control facility per wavelength
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-40 for function and connector type for each port
Table 1-40
WSS 100 GHz w/OPM 4x1 optical interfaces
Interface name
Physical port #
Function
Connector type
Mon
1
Monitor port for OPM
LC
Mon
2
Monitor port for OPM
LC
Optical input / output from other WSS or
CMD44
LC
DWDM optical input / output to /from the
line amplifier
LC
Switch 1 In / Out
3/4
Switch 2 In / Out
5/6
Switch 3 In / Out
7/8
Switch 4 In / Out
9 / 10
Common In / Out
11 / 12
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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 100 GHz w/OPM 4x1
circuit pack facilities. Table 1-41 provides a list of monitor types supported on
WSS 100 GHz w/OPM 4x1 circuit packs. Figure 1-57 on page 1-166 shows
the WSS 100 GHz w/OPM 4x1 circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-41
Monitor types table for WSS 100 GHz w/OPM 4x1 circuit packs
Monitor type
Facility
OPTMON
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
Note
Note: Use optical terminators on unused input faceplate
connectors of installed WSS w/OPM circuit packs. If dust
caps are used instead of optical terminators on “Switch In”
ports, PMs can be reported against the ports and the ports
may appear in-service.
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Figure 1-57
WSS 100 GHz w/OPM 4x1 circuit pack optical monitoring points
Processor
Module
Power
Supply
Optical Channel
Monitor
100GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-3 3
Switch In-5 5
Switch In-7 7
Switch In-9 9
Backplane
Wavelength
Selective Switch
4x1 100GHz
PD
PD
PD
Isolator
PD
PM collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9,11
Parameter: OPR-OTS*
Passive
Demux
1x4
PD
Common
Out
12
Common
In
11
Demux Out-4 4
Demux Out-6 6
Demux Out-8 8
Demux Out-10 10
*AVG, MIN, and MAX measurements also provided.
Legend
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
Cold Restart Required
Photonic alarms
• Adjacency Mismatch
•
Adjacency Provisioning Error
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
Channel Degrade
•
Channel Opacity Error
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
Common equipment alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure detected
•
Channel Controller: Unexpected Loss detected
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Equipping rules
The following equipping rules apply to WSS 100 GHz w/OPM 4x1 circuit
packs:
•
is a single slot interface.
•
can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS 100 GHz w/OPM 4x1 circuit pack:
•
the WSS 100 GHz w/OPM 4x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, when the WSS 100 GHz w/OPM 4x1 circuit packs
are installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 100 GHz w/OPM 4x1 optical interface circuit pack.
Table 1-42
Technical specifications for WSS 100 GHz w/OPM 4x1 optical interface circuit pack
Parameter
WSS 100 GHz w/OPM 4x1 (NTK553HA)
Weight (estimated)
1.9 kg (4.1 lb)
Power consumption
Typical (W): 14 (Note 1)
Power Budget (W): 31 (Note 2)
Connector type
LC
OPM power range
-35 dBm to -6.5 dBm
Wavelength range (nm)
1530.33 to 1565.09 (88 channels capable)
Maximum total input power
24 dBm for Common In, Switch In ports 1-4
Maximum Demux insertion loss
8.5 dB from Common In to Switch Out 1-4 ports
Maximum Mux insertion loss
11.4 dB from Switch In 1-4 ports to Common Out
Available attenuation per channel
0-18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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WSS 50 GHz w/OPM C-Band 9x1 circuit pack (NTK553FAE5 and NTK553FC) and
WSS Flex C-Band w/OPM 9x1 circuit packs (NTK553LA and NTK553LB)
Overview
The following variants of WSS 50 GHz w/OPM C-Band 9x1 circuit packs are
supported:
•
Wavelength Selective Switch (WSS) 50 GHz w/OPM C-Band 9x1 circuit
pack (triple slot-wide variant) (NTK553FAE5). This circuit pack is also
referred to as WSS 50 GHz w/OPM 9x1.
•
Wavelength Selective Switch (WSS) 50 GHz w/OPM C-Band 9x1 circuit
pack (double slot-wide variant) (NTK553FC). This circuit pack is also
referred to as WSS 50 GHz w/OPM 9x1.
•
Wavelength Selective Switch (WSS) Flex C-Band w/OPM 9x1 circuit
packs (double slot-wide variants) (NTK553LA and NTK553LB). These
circuit packs are also referred to as WSS Flex C-Band w/OPM 9x1.
The WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit
packs are used for flexible per-wavelength add/drop/passthrough and
per-wavelength switching. The combination of WSS 50 GHz w/OPM 9x1 or
WSS Flex C-Band w/OPM 9x1 circuit pack and Photonic Passive Equipment
(OMDF4, OMDF8 and BS5 modules only), OMD4, CMD44, or Enhanced
CMD44 modules (at ROADM or WSS-based terminal sites) are required to
perform add/drop operation.
The WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit
packs offer the same functionality and Table 1-43 on page 1-171 lists some
differences between the three variants.
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Table 1-43
WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs comparison
Functionality
Circuit pack
NTK553FAE5
Double slot-wide variant (Note 1)
Triple slot-wide variant (Note 1)
NTK553FC
NTK553LA
NTK553LB
(Note 2)
√
√
√
√
√
Including a power tap/monitor on Common Out port
√
Support for flexible grid ROADM (Note 2)
ITU 50 GHz spaced C-band
√
√
√
Flex C-band
Note 1: The double slot-wide variants make more efficient use of the slots available in the shelf
comparing to triple slot-wide variant and allow for support of new applications. For example, double
slot-wide variants can be used to support a 2-way ROADM configuration in a 7-slot 6500 shelf while this
is not possible with the use of triple slot-wide variant.
Note 2: The NTK553LB variant is architected to support future flexible grid applications with traffic
channels that are greater than 500 GHz. Use of the NTK553LA variant with traffic channels greater than
500 GHz wide is supported.
Note 1: The faceplate LC connectors on the NTK553FC, NTK553LA, and
NTK553LB circuit packs protrude by an extra 10 mm compared to
faceplate LC connectors on the NTK553FAE5 circuit pack. As a result, in
order to avoid unacceptable interference with the shelf front cover,
NTTC50++ patch cords (NTTC50++ patch cords are Corning standard LC
strain relief boots) or approved equivalent must be used. Also, attenuator
pads cannot be mounted on the faceplate of the NTK553FC, NTK553LA,
or NTK553LB circuit pack when the shelf front cover is installed.
Note 2: Although PEC editing between different variants of WSS 50 GHz
w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs is supported,
some optical specifications are different and therefore, a variant cannot be
used as a direct substitute for another variant without using One Planner
to simulate your particular application.
Figure 1-58 on page 1-172 shows the faceplate of a WSS 50 GHz w/OPM 9x1
circuit pack (NTK553FAE5 is shown as an example) and Figure 1-59 on page
1-173 to Figure 1-61 on page 1-175 provide functional block diagrams of the
WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs.
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Figure 1-58
WSS 50 GHz w/OPM 9x1 circuit pack faceplate (example: NTK553FAE5 is shown)
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Monitor
ports
Switch
ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Common
ports
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Figure 1-59
WSS 50 GHz w/OPM 9x1 circuit pack block diagram (NTK553FAE5 variant)
Processor
Module
Power
Supply
Optical Power
Monitor
50GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
9x1 50GHZ
Switch In-5 11
Switch In-6 13
Backplane
Switch In-7 15
Switch In-8 17
Switch In-9 19
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
PD
Common
Out
22
Common
In
21
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Passive
Demux
1x8
Demux Out-6 14
Demux Out-7 16
EDFA
Passive
Demux 1x2
Demux Out-8 18
Demux Out-9 20
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Figure 1-60
WSS 50 GHz w/OPM 9x1 circuit pack block diagram (NTK553FC variant)
Processor
Module
Power
Supply
Optical Power
Monitor
50GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
9x1 50GHZ
Switch In-5 11
Switch In-6 13
Switch In-7 15
Switch In-8 17
Switch In-9 19
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
Common
Out
22
Common
In
21
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Passive
Demux
1x8
Demux Out-6 14
Demux Out-7 16
EDFA
Passive
Demux 1x2
Demux Out-8 18
Demux Out-9 20
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Figure 1-61
WSS Flex C-Band w/OPM 9x1 block diagram (NTK553LA and NTK553LB variants)
Processor
Module
Power
Supply
Optical Power
Monitor
Flex
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
9x1 Flex
Switch In-5 11
Switch In-6 13
Switch In-7 15
Switch In-8 17
Switch In-9 19
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
Common
Out
22
Common
In
21
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Passive
Demux
1x8
Demux Out-6 14
Demux Out-7 16
EDFA
Passive
Demux 1x2
Demux Out-8 18
Demux Out-9 20
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Supported functionality
The WSS 50 GHz w/OPM 9x1 circuit packs (NTK553FAE5 and NTK553FC)
and WSS Flex C-Band w/OPM 9x1 (NTK553LA and NTK553LB) provide the
following functionality:
•
a per wavelength attenuation profile for up to 88 C-band channels at
50 GHz spacing for NTK553LA, NTK553LB, NTK553FAE5 and
NTK553FC variants
•
a per frequency attenuation profile for Flex C-band for NTK553LA and
NTK553LB variants
•
wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
•
frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems (NTK553LA and NTK553LB variants)
•
a demultiplexer block which is essentially a power splitter with seven
passive drop ports (SW 1 to 7) and two amplified drop ports (Switch 8 and
9)
•
in-service dynamic per channel add/drop/branching/broadcast
•
embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
•
PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common In and Monitor ports for all NTK553FAE5, NTK553FC,
NTK553LA, and NTK553LB variants; and also at Common Out port for
NTK553FC, NTK553LA, and NTK553LB variants
•
supports flexible grid ROADM for NTK553LA and NTK553LB variants
•
per channel power control on add and pass-through traffic
•
provides 100% add/drop capability at each site
•
supports 2.5G, 10G, 40G, 100G, and 200G channels
•
per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
•
branching and broadcast (up to eight connected nodes)
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
one channel control facility per wavelength
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-44 on page 1-177 for function and connector type for each
port
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Table 1-44
WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 optical interfaces
Interface name
Physical port #
Function
Connector type
Mon
1
Monitor port for OPM
LC
Mon
2
Monitor port for OPM
LC
Optical input/output from other WSS
(ports 3 to 16)
LC
Switch 1 In / Out
3/4
Switch 2 In / Out
5/6
Switch 3 In / Out
7/8
Switch 4 In / Out
9 / 10
Switch 5 In / Out
11 / 12
Switch 6 In / Out
13 / 14
Switch 7 In / Out
15 / 16
Switch 8 In / Out
17 / 18
Switch 9 In / Out
19 / 20
Common In / Out
21 / 22
Optical input/output from other CMD44
or Enhanced CMD44 (ports 17 to 20)
DWDM optical input / output to /from the
line amplifier
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Performance monitoring
The 6500 monitors and collects physical PMs for WSS 50 GHz w/OPM 9x1
and WSS Flex C-Band w/OPM 9x1 circuit pack facilities. Table 1-45 provides
a list of monitor types supported on WSS 50 GHz w/OPM 9x1 and WSS Flex
C-Band w/OPM 9x1 circuit packs. Figure 1-62 on page 1-179 and Figure 1-63
on page 1-180 show the WSS 50 GHz w/OPM 9x1 circuit pack optical
monitoring points, and Figure 1-64 on page 1-181 shows the WSS Flex
C-Band w/OPM 9x1 circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-45
Monitor types table for WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 circuit packs
Monitor type
Facility
OPTMON
OPR-OTS (Note 1)
X
OPRMIN-OTS
X
OPRMAX-OTS
X
OPRAVG-OTS
X
AMP
Note 2
DROPGAIN-OTS
X
DROPGAINMIN-OTS
X
DROPGAINMAX-OTS
X
DROPGAINAVG-OTS
X
Note 1: The OPTMON facility OPR-OTS monitor type for the Common In port
on WSS w/OPM circuit packs with amplified ports represents the total input
power on that port, and not the input power of the internal EDFA amplifier. The
internal EDFA amplifier input power is lower as the signal is going through an
Isolator and Passive Demux optical components (as depicted in the optical
monitoring points figures referenced above).
Note 2: Use optical terminators on unused input faceplate connectors of
installed WSS w/OPM circuit packs. If dust caps are used instead of optical
terminators on “Switch In” ports, PMs can be reported against the ports and the
ports may appear in-service.
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Figure 1-62
WSS 50 GHz w/OPM 9x1 circuit pack optical monitoring points (NTK553FAE5 variant)
Processor
Module
Power
Supply
Optical Power
Monitor
50 GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
9x1 50 GHz
Switch In-5 11
Switch In-6 13
Backplane
Switch In-7 15
Switch In-8 17
Switch In-9 19
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
Facility: OPTMON port 22
Parameter: OPR-OTS*
PD
Common
Out
22
Common
In
21
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Passive
Demux
1x8
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9,
11,13,15,17,19,21
Parameter: OPR-OTS*
Demux Out-6 14
Demux Out-7 16
EDFA
Passive
Demux 1x2
Demux Out-8 18
Demux Out-9 20
*AVG, MIN, and MAX measurements also provided
Facility: AMP port 21
Parameter: DROPGAIN-OTS*
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Figure 1-63
WSS 50 GHz w/OPM 9x1 circuit pack optical monitoring points (NTK553FC variant)
Processor
Module
Power
Supply
Optical Power
Monitor
50 GHz
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
9x1 50 GHz
Switch In-5 11
Switch In-6 13
Backplane
Switch In-7 15
Switch In-8 17
Switch In-9 19
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
Common
Out
22
Common
In
21
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Passive
Demux
1x8
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9,
11,13,15,17,19,21,22
Parameter: OPR-OTS*
Demux Out-6 14
Demux Out-7 16
EDFA
Passive
Demux 1x2
Demux Out-8 18
Demux Out-9 20
* AVG, MIN, and MAX measurements also provided.
Facility: AMP port 21
Parameter: DROPGAIN-OTS*
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Figure 1-64
WSS Flex C-Band w/OPM 9x1 circuit pack optical monitoring points (NTK553LA and NTK553LB
variants)
Processor
Module
Power
Supply
Optical Power
Monitor
Flex
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
9x1 Flex
Switch In-5 11
Switch In-6 13
Backplane
Switch In-7 15
Switch In-8 17
Switch In-9 19
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
Common
Out
22
Common
In
21
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Passive
Demux
1x8
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9,
11,13,15,17,19,21,22
Parameter: OPR-OTS*
Demux Out-6 14
Demux Out-7 16
EDFA
Passive
Demux 1x2
Demux Out-8 18
Demux Out-9 20
* AVG, MIN, and MAX measurements also provided.
Facility: AMP port 21
Parameter: DROPGAIN-OTS*
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Mismatch
•
Adjacency Provisioning Error
•
Channel Opacity Error
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
High Optical Power
•
Shutoff Threshold Crossed
•
Input Loss of Signal
•
Output Loss of Signal
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Wavelength Measurement Warning
•
Wavelength Measurement Error
Common equipment alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure detected
•
Channel Controller: Unexpected Loss detected
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Equipping rules
The following equipping rules apply to WSS 50 GHz w/OPM 9x1 circuit packs
(NTK553FAE5 variant):
•
is a triple slot interface.
•
can be equipped in slots 1 to 12 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This variant of WSS 50 GHz w/OPM 9x1 circuit packs cannot
be placed in slot 13 or 14 since it is a triple slot interface. This variant of
WSS 50 GHz w/OPM 9x1 circuit packs is not supported for use in slots
5/6/7 and 6/7/8 of the 14-slot packet-optical shelf (NTK503SA variant).
Note: A maximum of eight of the following Photonic circuit packs in total
can be installed in a single 14-slot shelf as long as the total of number of
equipped slots does not exceed 14:
- WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
- WSS 100 GHz w/OPM 2x1 (NTK553JAE5)
- WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
- WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
- MLA2 (NTK552FAE5)
- LIM C-Band (NTK552DAE5)
However, if you want to use more than eight of these circuit packs, you
must contact your Ciena representative.
•
can be equipped in slots 1-6, 11-16, 21-26, and 31-36 of the 32-slot
packet-optical shelf. This variant of WSS 50 GHz w/OPM 9x1 circuit packs
cannot be placed in slot 7, 8, 17, 18, 27, 28, or 37, 38 since it is a triple
slot interface.
•
can be equipped in slots 1 to 5 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). This variant of WSS 50 GHz w/OPM 9x1 circuit packs cannot
be placed in slot 6 and 7 since it is a triple slot interface.
•
can be equipped in slots 1 to 4 of the 6500-7 packet-optical shelf
(NTK503RA). This variant of WSS 50 GHz w/OPM 9x1 circuit packs
cannot be placed in slot 7 and 8 since it is a triple slot interface. This circuit
pack is not supported for use in slots 5/6/7 or 6/7/8 of the 6500-7
packet-optical shelf (NTK503RA).
•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
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The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS 50 GHz w/OPM 9x1 (NTK553FAE5 variant) circuit pack:
•
these circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
•
in a 14-slot shelf type, when the circuit pack is installed in slots 7, 8, and
9, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 10 to 14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
•
in a 6500-7 packet-optical shelf type, when the circuit pack is installed in
slots 6, 7, and 8, only Broadband circuit packs or Photonic circuit packs
can be provisioned in the other interface slots (slots 1 to 5) as MSPP or
PKT/OTN I/F interface circuit packs require a cross-connect circuit pack.
See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
The following equipping rules apply to WSS 50 GHz w/OPM 9x1 (NTK553FC
variant) and WSS Flex C-Band w/OPM 9x1 (NTK553LA and NTK553LB)
circuit packs:
•
are double-slot interfaces.
•
can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support these
circuit packs). These circuit packs cannot be placed in slot 14 since they
are double-slot interfaces.
•
can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. These circuit packs cannot be placed in slot 8, 18, 28,
or 38 since they are double-slot interfaces.
•
can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). These circuit packs cannot be placed in slot 7 since they are
double-slot interfaces.
•
can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). These circuit packs cannot be placed in slot 8 since they are
double-slot interfaces.
•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
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The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS 50 GHz w/OPM 9x1 (NTK553FC variant) or WSS Flex
C-Band w/OPM 9x1 circuit pack:
•
these circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
•
in a 14-slot shelf type, when the circuit pack is installed in slots 7 and 8,
only Broadband circuit packs or Photonic circuit packs can be provisioned
in the other interface slots (slots 1 to 6 and 9 to 14) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. See Part 1
of 6500 Planning, NTRN10ED (Shelf and equipment descriptions) for a full
list of supported Broadband and Photonic circuit packs.
•
in a 6500-7 Packet-optical shelf type, when the circuit pack is installed in
slots 7 and 8, only Broadband circuit packs or Photonic circuit packs can
be provisioned in the other interface slots (slots 1 to 6) as MSPP or
PKT/OTN I/F interface circuit packs require a cross-connect circuit pack.
See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM
9x1 optical interface circuit packs.
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Table 1-46
Technical specifications for WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 optical
interface circuit packs
Parameter
WSS 50 GHz w/OPM 9x1
NTK553FAE5
WSS Flex C-Band
w/OPM 9x1
NTK553FC
NTK553LA/NTK553LB
Weight (estimated)
4.5 kg (9.9 lb)
2.5 kg (5.5 lb)
Power consumption
Typical (W): 35 (Note 1)
Typical (W): 32 (Note Typical (W): 32 (Note 1)
1)
Power Budget (W): 65
(Note 2 and Note 4)
Power Budget (W):
65 (Note 2 and Note
4)
Power Budget (W): 42
(Note 2 and Note 3)
Connector type
2.5 kg (5.5 lb)
LC
OPM power range
-33 dBm to -5 dBm
-35 dBm to -6.5 dBm -35 dBm to -6.5 dBm
Wavelength range (nm)
1530.33 to 1565.09
(88 channels capable)
1530.33 to 1565.09
(88 channels
capable)
1528.77 to 1566.72
(96 channels capable)
and
Frequency range (THz):
C-Band 196.125 THz to
191.325 THz when used
in flexible grid systems
Maximum total input
power
24 dBm for Common In,
Switch In ports 1-9
Maximum Demux
insertion loss
11.7 dB from Common
11.2 dB from Common In 11.7 dB from
Common In to Switch In to Switch Out ports
to Switch Out ports 1-7
Out ports 1-7 (Note 5) 1-7 (Note 5)
(Note 5)
Maximum Mux insertion
loss
7 dB from Switch In ports 6.8 dB from Switch In 6.8 dB from Switch In
1-9 to Common Out
ports 1-9 to Common ports 1-9 to Common
Out
Out
Output LOS threshold
(Note 6)
N/A
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24 dBm for Common 24 dBm for Common In,
In, Switch In ports 1-9 Switch In ports 1-9
Minimum: -15.0 dBm,
Default: -8.0 dBm,
Maximum: 15 dBm
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Table 1-46
Technical specifications for WSS 50 GHz w/OPM 9x1 and WSS Flex C-Band w/OPM 9x1 optical
interface circuit packs (continued)
Parameter
WSS 50 GHz w/OPM 9x1
NTK553FAE5
Available attenuation per
channel
0-18 dB
WSS Flex C-Band
w/OPM 9x1
NTK553FC
0-18 dB
NTK553LA/NTK553LB
0-18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25
(+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies three slots in the shelf and power is drawn from the right-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
entire power budget to the zone associated with the left-most slot when computing the “Calculated shelf
zone power” parameter even if the right-most slot occupied by the circuit pack is in a different power zone.
Note 4: This circuit pack occupies two slots in the shelf and power is drawn from the left-most slot. When
equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s power
budget to the zone associated with the left-most slot occupied by the circuit pack.
Note 5: For the demux path of the WSS 50 GHz w/OPM 9x1 or WSS Flex C-Band w/OPM 9x1 circuit
packs (NTK553FAE5, NTK553FC, NTK553LA, NTK553LB), there is an embedded EDFA between the
Common In and Switch Out ports 8-9. This amplifier provides between 6 dB and 13 dB gain to
compensate for the maximum total passive loss of 11.7 dB in those paths.
Note 6: The Output LOS Alarm is driven from a power reading internal to the circuit pack before a
splitter and is not accessible at the faceplate. The faceplate reading is approximately 3 dB lower.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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WSS Flex L-Band w/OPM 8x1 circuit pack (NTK553LM)
Overview
The Wavelength Selective Switch (WSS) Flex L-Band w/OPM 8x1 circuit pack
(also referred to as WSS Flex L-Band w/OPM 8x1) is used for add/drop,
passthrough and switching. The combination of WSS Flex L-Band w/OPM 8x1
and CCMD12 L-Band circuit packs is required to perform add/drop operation.
The WSS Flex L-Band w/OPM 8x1 circuit packs are only used in Submarine
applications.
Figure 1-65 on page 1-189 shows the faceplate of a WSS Flex L-Band w/OPM
8x1 circuit pack and Figure 1-66 on page 1-190 provides functional block
diagram of the WSS Flex L-Band w/OPM 8x1 circuit pack.
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Figure 1-65
WSS Flex L-Band w/OPM 8x1 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Monitor
ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Switch
ports
Common
ports
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Figure 1-66
WSS Flex L-Band w/OPM 8x1 block diagram (NTK553LM)
Processor
Module
Power
Supply
Optical Power
Monitor
Flex
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
8x1 Flex
Switch In-5 11
Switch In-6 13
Backplane
Switch In-7 15
Switch In-8 17
PD
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
PD
Common
Out
20
Common
In
19
Demux Out-1 4
Demux Out-2 6
Demux Out-3 8
Demux Out-4 10
Splitter1x8
Demux Out-5 12
Demux Out-6 14
Demux Out-7 16
Demux Out-8 18
Legend
PD
Photodiode
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Supported functionality
The WSS Flex L-Band w/OPM 8x1 (NTK553LM) provides the following
functionality:
•
a per frequency attenuation profile
•
eight flexible grid Mux WSS and eight flexible grid Demux WSS ports
•
a demultiplexer block which is essentially a power splitter with eight
passive drop ports (SW 1 to 8)
•
wavelength range: L-band channels 1569.80 nm to 1608.98 nm (93 total)
when used in fixed grid systems
•
frequency range: L-band 190.975 THz to 186.325 THz when used in
flexible grid systems
•
in-service dynamic per channel add/drop/branching/broadcast
•
embedded Optical Power Monitor provides per channel power monitoring
(on a 6.25GHz granularity) capability for two directions (Monitor 1 and
Monitor 2 ports)
•
PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In, Common ports, and Monitor ports
•
supports flexible grid ROADM
•
per channel power control (on a 6.25GHz granularity) on add and
pass-through traffic
•
provides 100% add/drop capability at each site
•
supports 2.5G, 10G, 40G, 100G, and 200G channels
•
per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
•
branching and broadcast (up to eight connected nodes)
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
one channel control facility per wavelength
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-47 on page 1-192 for function and connector type for each
port
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Table 1-47
WSS Flex L-Band w/OPM 8x1 optical interfaces
Interface name
Physical port #
Function
Connector type
Mon
1
Monitor port for OPM
LC
Mon
2
Monitor port for OPM
LC
Optical input/output from CCMD12
L-Band circuit pack or other WSS (ports
3 to 18)
LC
DWDM optical input / output to /from the
line amplifier
LC
Switch 1 In / Out
3/4
Switch 2 In / Out
5/6
Switch 3 In / Out
7/8
Switch 4 In / Out
9 / 10
Switch 5 In / Out
11 / 12
Switch 6 In / Out
13 / 14
Switch 7 In / Out
15 / 16
Switch 8 In / Out
17 / 18
Common In / Out
19 / 20
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Performance monitoring
The 6500 monitors and collects physical PMs for WSS Flex L-Band w/OPM
8x1 circuit pack facilities. Table 1-48 provides a list of monitor types supported
on WSS Flex L-Band w/OPM 8x1 circuit packs. Figure 1-67 on page 1-194
shows the WSS Flex L-Band w/OPM 8x1 circuit pack optical monitoring
points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-48
Monitor types table for WSS Flex L-Band w/OPM 8x1 circuit packs
Monitor type
Facility
OPTMON
OPR-OTS (Note 1)
X
OPRMIN-OTS
X
OPRMAX-OTS
X
OPRAVG-OTS
X
AMP
DROPGAIN-OTS
X
DROPGAINMIN-OTS
X
DROPGAINMAX-OTS
X
DROPGAINAVG-OTS
X
Note 1: The OPTMON facility OPR-OTS monitor type for the Common In port on
WSS w/OPM circuit packs with amplified ports represents the total input power on
that port, and not the input power of the internal EDFA amplifier. The internal EDFA
amplifier input power is lower as the signal is going through an Isolator and Passive
Demux optical components (as depicted in Figure 1-67 on page 1-194).
Note 2: Use optical terminators on unused input faceplate connectors of installed
WSS w/OPM circuit packs. If dust caps are used instead of optical terminators on
“Switch In” ports, PMs can be reported against the ports and the ports may appear
in-service.
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Figure 1-67
WSS Flex L-Band w/OPM 8x1 circuit pack optical monitoring points
Processor
Module
Power
Supply
Optical Power
Monitor
Flex
2x1
Optical
Switch
PD
Monitor-1
1
Monitor-2
2
Switch In-1 3
Switch In-2 5
Switch In-3 7
Switch In-4 9
Wavelength
Selective Switch
8x1 Flex
Switch In-5 11
Switch In-6 13
Backplane
Switch In-7 15
Switch In-8 17
PD
PD
PD
PD
PD
PD
PD
PD
PD
Isolator
Common
Out
20
Common
In
19
PD
Facility: AMP port 19
Parameter: DROPGAIN-OTS*
Demux Out-1 4
Demux Out-2 6
Passive
Demux
1x8
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7,9,
11,13,15,17,19, 20
Parameter: OPR-OTS*
Demux Out-3 8
Demux Out-4 10
Demux Out-5 12
Demux Out-6 14
Demux Out-7 16
Demux Out-8 18
* AVG, MIN, and MAX measurements a, 20lso provided.
Legend
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
Software Subsystem Failed
•
Hardware Subsystem Failed
Photonic alarms
• Adjacency Mismatch
•
Adjacency Far End Not Discovered
•
Fiber Type Manual Provisioning Required
•
Channel Opacity Error
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
High Optical Power
•
Shutoff Threshold Crossed
•
Input Loss of Signal
•
Output Loss of Signal
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Channel Degrade
Common equipment alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure detected
•
Channel Controller: Unexpected Loss detected
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Equipping rules
The following equipping rules apply to WSS Flex L-Band w/OPM 8x1
(NTK553LM) circuit pack:
•
is a double-slot interface.
•
can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack cannot be placed in slot 14 since this is a
double-slot interface.
•
can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot
packet-optical shelf. This circuit pack cannot be placed in slot 8, 18, 28, or
38 since this is a double-slot interface.
•
can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). This circuit pack cannot be placed in slot 7 since this is a
double-slot interface.
•
can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack cannot be placed in slot 8 since this is a
double-slot interface.
•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS Flex L-Band w/OPM 8x1 circuit pack:
•
WSS Flex L-Band w/OPM 8x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
in a 14-slot shelf type, when the WSS Flex L-Band w/OPM 8x1 circuit pack
is installed in slots 7 and 8, only Broadband circuit packs or Photonic
circuit packs can be provisioned in the other interface slots (slots 1 to 6
and 9 to 14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
•
in a 6500-7 Packet-optical shelf type, when the WSS Flex L-Band w/OPM
8x1 circuit pack is installed in slots 7 and 8, only Broadband circuit packs
or Photonic circuit packs can be provisioned in the other interface slots
(slots 1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS Flex L-Band w/OPM 8x1 optical interface circuit
pack.
Table 1-49
Technical specifications for WSS Flex L-Band w/OPM 8x1 optical interface circuit pack
Parameter
WSS Flex L-Band w/OPM 8x1 (NTK553LM)
Weight (estimated)
2.3 kg (5.0 lb)
Power consumption
Typical (W): 37 (Note 1)
Power Budget (W): 60 (Note 2 and Note 3)
Connector type
LC
OPM power range
-35 dBm to -6.5 dBm
Wavelength range (nm)
1569.80 to 1608.98 (93 channels capable)
Frequency range (THz)
L-Band 190.975 THz to 186.325 THz when used in
flexible grid systems
Maximum total input power
24 dBm for Common In, Switch In ports 1-8
Maximum Demux insertion loss
11 dB from Common In to Switch Out ports 1-8
Maximum Mux insertion loss
7 dB from Switch In ports 1-8 to Common Out
Available attenuation per channel
0-18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies two slots in the shelf and power is drawn from the left-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
power budget to the zone associated with the left-most slot occupied by the circuit pack.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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WSS w/OPM Flex C-Band 20x1 circuit pack (NTK553MA)
Overview
The Wavelength Selective Switch (WSS) Flex C-Band w/OPM 20x1 circuit
pack (also referred to as WSS Flex C-Band w/OPM 20x1) is used for add/drop,
passthrough and switching. The combination of WSS Flex C-Band w/OPM
20x1 and CCMD8x16 or CCMD12 C-Band circuit packs is required to perform
add/drop operation.
Figure 1-68 on page 1-199 shows the faceplate of a WSS Flex C-Band
w/OPM 20x1 circuit pack and Figure 1-69 on page 1-200 provides functional
block diagram of the WSS Flex C-Band w/OPM 20x1 circuit pack.
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Figure 1-68
WSS Flex C-Band w/OPM 20x1 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Monitor
ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Switch
ports
Common
ports
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Figure 1-69
WSS Flex C-Band w/OPM 20x1 circuit pack block diagram (NTK553MA)
Processor
Module
Optical Power
Monitor
Flex
Power
Supply
Monitor-1
1
Monitor-2
2
PD
PD
Common Out-Monitor
3
Common Out
10
PD
Backplane
Wavelength
Selective Switch
Mux 2x20 Flex
5
5
MPO
Connector 5
PD
5
5
CT
PD
5
5
5
5
5
5
MPO
Connector 6
PD
CT
MPO
Connector 7
PD
CT
MPO
Connector 8
PD
EDFA
Wavelength
Selective Switch
Demux 2x20 Flex
5
5
5
5
PD
CT
PD
5
5
PD
Common In
9
PD
Legend
EDFA
MPO
PD
CT
Erbium Doped Fiber Amplifier
Multi-fiber Push On
Photodiode
Cable Trace
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Supported functionality
The WSS Flex C-Band w/OPM 20x1 (NTK553MA) provides the following
functionality:
•
20 flexible grid Mux WSS and 20 flexible grid Demux WSS ports.
•
wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
•
frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems
•
embedded Optical Power Monitor provides per channel power monitoring
(on a 6.25GHz granularity) capability for two directions (Monitor 1 and
Monitor 2 ports)
•
Common Out external tap
•
PD (PIN Detectors) provide power monitoring capability at Switch
A/B/C/D, Common In, and Monitor ports
•
Integrated loopback path with Amplification/ASE continuity source
•
Switch A/B/C/D ports bundle related optical signals in 12-fiber MPO
connectors with Cable Trace for fiber management simplification
•
supports flexible grid ROADM
•
in-service dynamic per channel add/drop
•
per channel power control (on a 6.25GHz granularity) on add and
pass-through traffic
•
provides 100% add/drop capability at each site
•
supports 2.5G, 10G, 40G, 100G, and 200G channels
•
per-wavelength switching. For example, a pass-through wavelength can
be converted to a particular add/drop wavelength or changing a
passthrough degree.
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-50 on page 1-202 for function and connector type for each
port
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Table 1-50
WSS Flex C-Band w/OPM 20x1 optical interfaces
Interface name
Physical port #
Function
Connector type
Monitor 1
1
Monitor port for OPM
LC
Monitor 2
2
Monitor port for OPM
LC
Common monitor out external tap
LC
Common Out
Monitor
3/4
Optical input/output from CCMD8x16
circuit pack via FIM Type 1 or FIM Type 2
or from CCMD12 C-Band circuit pack via
FIM Type 4, FIM Type 5, or FIM Type 6.
Switch A
5
Switch B
6
Switch C
7
Switch D
8
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
9 / 10
DWDM optical input / output to /from the
CCMD8x16 circuit pack
Common In / Out
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12-Fiber
MPO/APC Male
LC
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Performance monitoring
The 6500 monitors and collects physical PMs for WSS Flex C-Band w/OPM
20x1 circuit pack facilities. Table 1-51 provides a list of monitor types
supported on WSS Flex C-Band w/OPM 20x1 circuit packs. Figure 1-70 on
page 1-204 shows the WSS Flex C-Band w/OPM 20x1 circuit pack optical
monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-51
Monitor types table for WSS Flex C-Band w/OPM 20x1 circuit packs
Monitor type
Facility
OPTMON
OPR-OTS (Note 1)
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
Note 2
OPT-OTS
OPTMIN-OTS
OPTMAX-OTS
OPTAVG-OTS
X
X
X
X
OPT-OTS
OPTMIN-OTS
OPTMAX-OTS
OPTAVG-OTS
X
X
X
X
Note 1: The OPTMON facility OPR-OTS monitor type for the Common
In port on WSS w/OPM circuit packs with amplified ports represents the
total input power on that port, and not the input power of the internal
EDFA amplifier. The internal EDFA amplifier input power is lower as the
signal is going through an Isolator and Passive Demux optical
components (as depicted in the optical monitoring points figure
referenced above).
Note 2: For ports 5 to 8 of installed WSS Flex C-Band w/OPM 20x1
circuit packs, PMs can be reported against unused ports and those
ports may appear in-service.
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Figure 1-70
WSS Flex C-Band w/OPM 20x1 circuit pack optical monitoring points
Processor
Module
Optical Power
Monitor
Flex
Monitor-1
1
Monitor-2
2
PD
Power
Supply
PD
Common Out-Monitor
3
Common Out
10
PD
Wavelength
Selective Switch
Mux 2x20 Flex
5 ch
PD
5 ch
Backplane
CT
5 ch
5 ch
MPO
Connector
5
5 ch
MPO
Connector
6
5 ch
MPO
Connector
7
PD
5 ch
PD
5 ch
PD
MPO
Connector 8
5 ch
5 ch
5 ch
5 ch
5 ch
5 ch
PD
EDFA
Wavelength
Selective Switch
Demux 2x20 Flex
CT
PD
PD
5 ch
5 ch
PD
Common In
9
PD
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,6,7,8,9
Parameter: OPR-OTS* and OPT-OTS*
* AVG, MIN, and MAX measurements also provided.
Legend
CT
EDFA
MPO
PD
Cable Trace
Erbium Doped Fiber Amplifier
Multi-fiber Push On
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Circuit Pack Latch Open
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
•
Cable Trace Compromised
Photonic alarms
• Adjacency Mismatch
•
Channel Degrade
•
Channel Opacity Error
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
High Optical Power
•
Loss of Signal
•
Output Loss of Signal
•
Gauge Threshold Crossing Alert Summary
Common equipment alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure detected
•
Channel Controller: Unexpected Loss detected
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Equipping rules
The following equipping rules apply to WSS Flex C-Band w/OPM 20x1 circuit
pack (NTK553MA):
•
is a double-slot interface.
•
can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). WSS Flex C-Band w/OPM 20x1 circuit pack cannot be
placed in slot 14 since WSS Flex C-Band w/OPM 20x1 circuit pack is a
double-slot interface.
•
can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot shelf.
WSS Flex C-Band w/OPM 20x1 circuit pack cannot be placed in slot 8, 18,
28, or 38 since WSS Flex C-Band w/OPM 20x1 circuit pack is a
double-slot interface.
•
can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). WSS Flex C-Band w/OPM 20x1 circuit pack cannot be
placed in slot 7 since WSS Flex C-Band w/OPM 20x1 circuit pack is a
double-slot interface.
•
can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). WSS Flex C-Band w/OPM 20x1 circuit pack cannot be
placed in slot 8 since WSS Flex C-Band w/OPM 20x1 circuit pack is a
double-slot interface.
•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS Flex C-Band w/OPM 20x1 circuit pack:
•
the WSS Flex C-Band w/OPM 20x1 circuit packs do not use any
cross-connect capacity and can be installed in shelves equipped with or
without cross-connect circuit packs
•
In a 14-slot shelf type, when the WSS Flex C-Band w/OPM 20x1 circuit
packs are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6 and 9 to13) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS Flex C-Band w/OPM 20x1 optical interface circuit
packs.
Table 1-52
Technical specifications for WSS Flex C-Band w/OPM 20x1 optical interface circuit packs
Parameter
WSS Flex C-Band w/OPM 20x1
NTK553MA
Weight (estimated)
3.5 kg (7.7 lb)
Power consumption
Typical (W): 40 (Note 1)
Power Budget (W): 60 (Note 2, and Note 3)
Connector type
12-Fiber MPO/APC Male, LC
Wavelength range (nm)
C-Band channels 1528.77 nm to 1566.72 nm (96 total) when used
in fixed grid systems
Frequency range (THz)
C-Band 196.125 THz to 191.325 THz when used in flexible grid
systems
OPM power range
-37 dBm to 9 dBm
Maximum total input power
24 dBm total or 9 dBm/12.5 GHz
Maximum Demux insertion loss
9.6 dB
Maximum Mux insertion loss
9.5 dB
Available attenuation per channel
18 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies two slots in the shelf and power is drawn from the left-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
power budget to the zone associated with the left-most slot occupied by the circuit pack.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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WSS 50 GHz w/OPM C-Band 2x1 circuit packs (NTK553KCE5 and
NTK553KAE5)
Overview
The Wavelength Selective Switch (WSS) 50 GHz w/OPM C-Band 2x1 circuit
pack (also referred to as WSS 50 GHz w/OPM 2x1) is used for flexible
per-wavelength add/drop/passthrough and per-wavelength switching. The
combination of WSS 50 GHz w/OPM 2x1 circuit pack and CMD44, Enhanced
CMD44, or BMD2 modules (at ROADM or WSS-based terminal sites) are
required to perform add/drop operation. WSS 50 GHz w/OPM 2x1 circuit
packs are mostly used for 1-way Terminal or 2-way ROADM applications.
The following variants of WSS 50 GHz w/OPM 2x1 circuit packs are
supported:
•
NTK553KAE5 (single slot-wide):
The Add/Drop port can be connected to a CMD44 50 GHz or Enhanced
CMD44 for 44 channels capacity or a BMD2 for an initial capacity of 44
channels and can be upgraded in-service to 88 channels if BMD2 is
installed day 1.
•
NTK553KCE5 (triple slot-wide):
One Switch port can be connected to a CMD44 50 GHz or Enhanced
CMD44 for 44 channels capacity or a BMD2 for an initial capacity of 44
channels and can be upgraded in-service to 88 channels if BMD2 is
installed day 1.
The WSS 50 GHz w/OPM 2x1 variants offer similar functionality, however
•
the single slot-wide variant (NTK553KAE5) makes more efficient use of
the slots available in the shelf and allows for support of new applications.
For example, this circuit pack can be used to support a 2-way ROADM
configuration in a 7-slot 6500 shelf while this is not possible with the use
of triple slot-wide variant (NTK553KCE5).
•
the triple slot-wide variant (NTK553KCE5) has two switch ports that can
be used for either pass-through traffic or add/drop traffic whereas the
single slot-wide variant (NTK553KAE5) has one dedicated pass-through
port and one dedicated add/drop port.
•
The single slot-wide variant (NTK553KAE5) is only supported in
configurations that use a maximum of two OTSs. This means the single
slot-wide variant (NTK553KAE5) cannot be used in the following
configurations:
— 3-way node configurations
— DIA configurations: the single slot-wide variant (NTK553KAE5) cannot
be used in the DIA configuration backbone OTS or DIA OTS
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•
some optical specifications are different and therefore, single slot-wide
variant (NTK553KAE5) cannot be used as a direct substitute for triple
slot-wide variant (NTK553KCE5) (and vice versa) without using One
Planner to simulate your particular application.
The WSS 50 GHz w/OPM 2x1 circuit pack (NTK553KAE5 or NTK553KCE5)
is similar to the WSS 50 GHz w/OPM C-Band 9x1; NTK553FAE5 with the
following distinctions:
•
NTK553FAE5 variant has branching and broadcast capability of up to nine
connected nodes (9x1) while NTK553KAE5 or NTK553KCE5 variant has
branching capability of up to two connected nodes (2x1).
•
demultiplexer block in NTK553FAE5 variant is a 1:9 power splitter while
demultiplexer block in NTK553KAE5 or NTK553KCE5 variant is a 1:2
passive power splitter.
•
For the demux path of the WSS 50 GHz w/OPM 9x1 circuit pack
(NTK553FAE5), there is an embedded EDFA between the Common In
and Switch Out 8-9 ports. This amplifier provides between 6 and 13dB
gain to compensate for the maximum total passive loss of 14.7dB in those
paths. Since the WSS 50 GHz w/OPM 2x1 circuit pack (NTK553KAE5 or
NTK553KCE5) has less demux path insertion loss, it does not have an
embedded EDFA.
A maximum of eight of the following Photonic circuit packs in total can be
installed in a single 14-slot shelf as long as the total of number of equipped
slots does not exceed 14:
•
WSS 100 GHz w/OPM 5x1 (NTK553EAE5)
•
WSS 100 GHz w/OPM 2x1(NTK553JAE5)
•
WSS 50 GHz w/OPM 9x1 (NTK553FAE5)
•
WSS 50 GHz w/OPM 2x1 (NTK553KCE5)
•
MLA2 (NTK552FAE5)
•
LIM C-Band (NTK552DAE5)
Note: If you want to use more than eight of these circuit packs, you must
contact your Ciena representative.
Figure 1-71 on page 1-210 shows the faceplate of a WSS 50 GHz w/OPM 2x1
circuit pack (triple slot-wide variant; NTK553KCE5) and Figure 1-72 on page
1-211 shows the faceplate of a WSS 50 GHz w/OPM 2x1 circuit pack (single
slot-wide variant; NTK553KAE5). Figure 1-73 on page 1-212 provides a
functional block diagram of the WSS 50 GHz w/OPM 2x1 circuit pack (triple
slot-wide variant; NTK553KCE5) and Figure 1-74 on page 1-213 provides a
functional block diagram of the WSS 50 GHz w/OPM 2x1 circuit pack (single
slot-wide variant; NTK553KAE5).
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Figure 1-71
WSS 50 GHz w/OPM 2x1 circuit pack (triple slot-wide variant; NTK553KCE5) faceplate
Switch
ports
Monitor
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
Monitor - Used to communicate whether circuit pack can
be extracted
ports
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Yellow bi-color circle (LOS)
- Used to communicate Rx Loss of Signal
Common
ports
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Figure 1-72
WSS 50 GHz w/OPM 2x1 circuit pack (single slot-wide variant; NTK553KAE5) faceplate
Switch/Demux
ports
Add/Drop
ports
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Figure 1-73
WSS 50 GHz w/OPM 2x1 circuit pack (triple slot-wide variant; NTK553KCE5) block diagram
Processor
Module
Power
Supply
Optical Power
Monitor
50GHz
PD
2x1
Optical
Switch
Monitor-1 1
Monitor-2 2
Switch In-1 3
Switch In-2 5
Backplane
Wavelength
Selective Switch
2x1 50GHz
PD
PD
Common 8
Out
Common
In
Isolator
Passive
Demux
1x2
7
PD
Demux Out-1 4
Demux Out-2 6
Legend
PD
Photodiode
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Figure 1-74
WSS 50 GHz w/OPM 2x1 circuit pack (single slot-wide variant; NTK553KAE5) block diagram
Processor
Module
Backplane
Power
Supply
Optical Channel
Monitor
50GHz
PD
PD
2x1
Optical
Switch
Monitor-1 1
Monitor-2 2
Switch In
3
Add In
5
Common
Out
8
Common
In
7
PD
Wavelength
Selective Switch
2x1 50GHz
Isolator
PD
Demux Out 4
Drop Out
6
Legend
PD
Photodiode
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Supported functionality
The WSS 50 GHz w/OPM 2x1 circuit packs (NTK553KAE5 and
NTK553KCE5) provide the following functionality:
•
a per wavelength attenuation profile for up to 88 C-band channels at 50
GHz spacing
•
a demultiplexer block which is essentially a 1:2 passive power splitter
•
in-service dynamic per channel add/drop/passthrough
•
embedded Optical Power Monitor provides per channel power monitoring
capability for two directions (Monitor 1 and Monitor 2 ports)
•
PD (PIN Detectors) provide aggregate power monitoring capability at
Switch In (in the case of NTK553KCE5 variant), Add In/Switch In (in the
case of NTK553KAE5 variant), Common In, and Monitor ports
•
Switch In (NTK553KC) and Add In/Switch In (NTK553KA)
•
per channel power control on add and pass-through traffic
•
provides 100% add/drop capability at each site
•
supports 2.5G, 10G, 40G, 100G, and 200G channels
•
per-wavelength switching. For example, a pass-through wavelength can
be converted to an add/drop wavelength.
•
branching (up to two connected nodes)
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
one channel control facility per wavelength
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-53 for function and connector type for each port
Table 1-53
WSS 50 GHz w/OPM 2x1 optical interfaces
Interface name
Physical port #
Function
Connector type
NTK553KCE5 variant
Mon
1
Monitor port for OPM
LC
Mon
2
Monitor port for OPM
LC
Optical input/output from other WSS,
CMD44, or Enhanced CMD44, or
BMD2
LC
DWDM optical input / output to /from
the line amplifier
LC
Switch 1 In / Out
3/4
Switch 2 In / Out
5/6
Common In / Out
7/8
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Table 1-53
WSS 50 GHz w/OPM 2x1 optical interfaces
Interface name
Physical port #
Function
Connector type
NTK553KAE5 variant
Mon
1
Monitor port for OPM
LC
Mon
2
Monitor port for OPM
LC
Switch In / Demux Out
3/4
Optical input/output from other WSS
LC
Add In / Drop Out
5/6
Optical input/output from CMD44, or
Enhanced CMD44, or BMD2
LC
Common In / Out
7/8
DWDM optical input / output to /from
the line amplifier
LC
Performance monitoring
The 6500 monitors and collects physical PMs for WSS 50 GHz w/OPM 2x1
circuit pack facilities. Table 1-54 provides a list of monitor types supported on
WSS 50 GHz w/OPM 2x1 circuit packs. Figure 1-75 on page 1-216 and Figure
1-76 on page 1-217 show the WSS 50 GHz w/OPM 2x1 circuit pack optical
monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-54
Monitor types table for WSS 50 GHz w/OPM 2x1 circuit pack
Monitor type
Facility
OPTMON
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
Note
Note: Use optical terminators on unused input faceplate
connectors of installed WSS w/OPM circuit packs. If dust caps are
used instead of optical terminators on “Switch In” ports, PMs can be
reported against the ports and the ports may appear in-service.
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Figure 1-75
WSS 50 GHz w/OPM 2x1 circuit pack optical monitoring points (triple slot-wide variant,
NTK553KCE5)
Processor
Module
Power
Supply
Optical Channel
Monitor
50GHz
PD
2x1
Optical
Switch
Monitor-2 2
Switch In-3 3
Wavelength
Selective Switch
2x1 50GHz
Backplane
Switch In-5 5
PD
PD
Isolator
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7
Parameter: OPR-OTS*
Monitor-1 1
Passive
Demux
1x2
PD
Common
Out
8
Common
In
7
Demux Out-4 4
Demux Out-6 6
*AVG, MIN, and MAX measurements also provided
Legend
PD
Photodiode
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Figure 1-76
WSS 50 GHz w/OPM 2x1 circuit pack optical monitoring points (single slot-wide variant,
NTK553KAE5)
Processor
Module
Backplane
Power
Supply
Optical Channel
Monitor
50GHz
PD
PD
2x1
Optical
Switch
Monitor-1 1
Monitor-2 2
Switch In
3
Add In
5
Common
Out
8
Common
In
7
PD
Wavelength
Selective Switch
2x1 50GHz
Isolator
PD
Demux Out 4
Drop Out
6
PMs collected at all PD locations
Facility: OPTMON port 1,2,3,5,7
Parameter: OPR-OTS*
*AVG, MIN, and MAX measurements also provided
Legend
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Mismatch
•
Adjacency Provisioning Error
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
High Optical Power
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Wavelength Measurement Warning
•
Wavelength Measurement Error
Common equipment alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure detected
•
Channel Controller: Unexpected Loss detected
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Equipping rules
The following equipping rules apply to WSS 50 GHz w/OPM 2x1 circuit packs:
•
NTK553KAE5 variant is a single slot interface. NTK553KCE5 variant is a
triple slot interface.
•
NTK553KAE5 variant can be equipped in slot 1 to 14 (except slots 7 and
8 if cross-connect circuit packs are provisioned in slots 7 and 8) of the
14-slot shelf.
•
NTK553KCE5 variant can be equipped in slots 1 to 12 (except slots 7 and
8 if cross-connect circuit packs are provisioned in slots 7 and 8) of the
14-slot shelf (except the NTK503GA metro front electrical shelf, which
does not support this circuit pack). WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 13 or 14 since WSS
50 GHz w/OPM 2x1 (triple slot-wide variant) circuit pack is a triple slot
interface. This circuit pack is not supported for use in slots 5/6/7 and 6/7/8
of the 14-slot packet-optical shelf (NTK503SA variant).
•
NTK553KAE5 variant can be equipped in slots 1-8, 11-18, 21-28, and
31-38 of the 32-slot packet-optical shelf.
•
NTK553KCE5 variant can be equipped in slots 1-6, 11-16, 21-26, and
31-36 of the 32-slot packet-optical shelf. WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 7, 8, 17, 18, 27, 28,
or 37, 38 since WSS 50 GHz w/OPM 2x1 (triple slot-wide variant) circuit
pack is a triple slot interface.
•
NTK553KAE5 variant can be equipped in slots 1 to 7 of the 7-slot optical
shelf (NTK503PAE5 or NTK503KA).
•
NTK553KAE5 variant can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA).
•
NTK553KCE5 variant can be equipped in slots 1 to 5 of the 7-slot optical
shelf (NTK503PAE5 or NTK503KA). WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 6 or 7 since WSS
50 GHz w/OPM 2x1 (triple slot-wide variant) circuit pack is a triple slot
interface.
•
NTK553KCE5 variant can be equipped in slots 1 to 4 of the 6500-7
packet-optical shelf (NTK503RA). WSS 50 GHz w/OPM 2x1 (triple
slot-wide variant) circuit pack cannot be placed in slot 7 or 8 since WSS
50 GHz w/OPM 2x1 (triple slot-wide variant) circuit pack is a triple slot
interface. This circuit pack is not supported for use in slots 5/6/7 or 6/7/8
of the 6500-7 packet-optical (NTK503RA).
•
cannot be equipped in the 2-slot shelf except NTK553KA variant that can
be equipped in slots 1 and 2 of the NTK503LA variant of 2-slot shelf when
the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf.
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The following restrictions on using a cross-connect circuit pack apply when
deploying a WSS 50 GHz w/OPM 2x1 circuit pack:
•
the WSS 50 GHz w/OPM 2x1 circuit packs do not use any cross-connect
capacity and can be installed in shelves equipped with or without
cross-connect circuit packs
•
In a 14-slot shelf type, when the WSS 50 GHz w/OPM 2x1 circuit packs
(triple slot-wide variant; NTK553KCE5) are installed in slots 7, 8, and 9,
only Broadband circuit packs or Photonic circuit packs can be provisioned
in the other interface slots (slots 1 to 6 and 10 to14) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. In a 14-slot
shelf type, when the WSS 50 GHz w/OPM 2x1 circuit packs (single
slot-wide variant; NTK553KAE5) are installed in slots 7 or 8, only
Broadband circuit packs or Photonic circuit packs can be provisioned in
the other interface slots (slots 1 to 6 and 9 to14) as MSPP or PKT/OTN I/F
interface circuit packs require a cross-connect circuit pack. See Part 1 of
6500 Planning, NTRN10ED (Shelf and equipment descriptions) for a full
list of supported Broadband and Photonic circuit packs.
•
In a 6500-7 packet-optical shelf type, when the WSS 50 GHz w/OPM 2x1
circuit packs (triple slot-wide variant; NTK553KCE5) are installed in slots
6, 7, and 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 5) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. In a 6500-7
packet-optical shelf type, when the WSS 50 GHz w/OPM 2x1 circuit packs
(single slot-wide variant; NTK553KAE5) are installed in slots 7 or 8, only
Broadband circuit packs or Photonic circuit packs can be provisioned in
the other interface slots (slots 1 to 6) as MSPP or PKT/OTN I/F interface
circuit packs require a cross-connect circuit pack. See Part 1 of 6500
Planning, NTRN10ED (Shelf and equipment descriptions) for a full list of
supported Broadband and Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the WSS 50 GHz w/OPM 2x1 optical interface circuit pack.
Table 1-55
Technical specifications for WSS 50 GHz w/OPM 2x1 optical interface circuit pack
Parameter
WSS 50 GHz w/OPM 2x1
Triple slot-wide variant;
NTK553KCE5
Single slot-wide variant;
NTK553KAE5
Weight (estimated)
4.5 kg (9.9 lb)
1.7 kg (3.8 lb)
Power consumption
Typical (W): 35 (Note 1)
Typical (W): 22 (Note 1)
Power Budget (W): 42 (Note 2)
Power Budget (W): 31 (Note 2)
Connector type
LC
LC
OPM power range
-33 dBm to -5 dBm
-38 dBm to -11 dBm
Wavelength range (nm) 1530.33 to 1565.09 (88 channels
capable)
1530.33 to 1565.09 (88 channels
capable)
Maximum total input
power
24 dBm for Common In, Switch In
ports 1-2
24 dBm for Common In, Switch In
ports 1-2
Maximum Demux
insertion loss
4.4 dB from Common In to Switch
Out 1-2 ports
12.4 dB from Common In to Demux
Out
and
2.0 dB from Common In to Drop Out
Maximum Mux insertion 7 dB from Switch In 1-2 ports to
loss
Common Out
8.4 dB from Add In or Switch In to
Common Out
Available attenuation
per channel
0-18 dB
0-15 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack
(NTK553RA)
Overview
The ROADM with Line Amplifier (RLA) C-Band 5x1 circuit pack (also referred
to as RLA 5x1) includes
•
one 5x1 flexible grid WSS and one passive Demux splitter for broadcast
and select wavelength switching and
•
a dual line EDFA consisting of a switchable gain pre-amp and a variable
gain post-amp.
Figure 1-77 on page 1-223 shows the faceplate of an RLA 5x1 circuit pack and
Figure 1-78 on page 1-224 provides a functional block diagram of the RLA 5x1
circuit pack.
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Figure 1-77
RLA 5x1 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or
software failure state
- Card not failed = LED off,
Card Failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or
software functional state
- Card initializing = Blinking LED;
Card OK = LED on;
Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether
circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on;
Equipment out-of-service = LED off
Monitor ports
OSC ports
Line ports
Yellow circle (LOS)
- Used to communicate
Rx Loss of Signal
Switch/Demux ports
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Figure 1-78
RLA 5x1 circuit pack block diagram (NTK553RA)
Switch In-1 21
Switch In-2 23
Switch In-3 25
Switch In-4 27
Wavelength
Selective Switch
5x1 Flex
Switch In-5 29
PD
PD
PD
PD
PD
EDFA
PD
Line Out
5
OSC In
3
MON B
1
MON A
2
Line In
8
OSC Out
4
PD
PD
Backplane
PD
OPM
EDFA
PD
PD
PD
Demux Out-1 22
Passive Demux
1x5
Demux Out-2 24
Demux Out-3 26
Demux Out-4 28
Demux Out-5 30
Sync
Processor
Module
Power
Supply
Legend
EDFA
Erbium Doped Fiber Amplifier
OSC
OPM
Optical power monitor
PD
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Supported functionality
The RLA 5x1 circuit pack (NTK553RA) provides the following functionality:
•
broadcast and select wavelength switching through a 5-port flexible grid
Mux WSS and 5-port flexible grid Demux broadcast. Flexible grid
operation on a 6.25GHz pitch is provided.
•
optical amplification through a dual line EDFA consisting of a switchable
gain pre-amp and a variable gain post-amp.
•
per channel optical monitoring through a flexible grid Optical Power
Monitor (OPM) (OPM is in-skin and does not need to be externally
fibered). Capability for two directions (Monitor A and Monitor B ports).
•
optical filtering of the optical supervisory channel (OSC) using integrated
OSC add/drop filters.
•
wavelength range: C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
•
frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems
•
supports flexible grid ROADM
•
external tap monitor at outputs of each line facing direction (line A Mon
and line B Mon)
•
EDFAs on both booster-amp and pre-amp directions support ALSO
(Automatic Line Shut Off). Only EDFA on booster-amp direction supports
APR (Automatic Power Reduction).
•
power monitoring capabilities for the line EDFAs.
•
the control loop on WSS (Middle optical control) maintains per-channel
loss profile
•
variable attenuation per channel used by DOC for system optimization
•
see Table 1-56 on page 1-226 for port function and connector type on a
RLA 5x1 circuit pack
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Table 1-56
RLA 5x1 circuit pack port function and connector type
Interface name
Physical port #
Function
Connector type
Mon B/A
1/2
Monitor port for OPM
LC
OSC In / Out
3/4
Optical Service Channel Input / output
LC
Line Out / In
5/8
Output / input port of Line
LC
Switch In /
Demux Out
21 / 22
Optical input / output
LC
23 / 24
25 / 26
27 / 28
29 / 30
Performance monitoring
The 6500 monitors and collects physical PMs for RLA 5x1 module facilities.
Table 1-57 provides a list of monitor types supported on RLA 5x1 modules.
Figure 1-79 on page 1-229 shows the RLA 5x1 module optical monitoring
points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-57
Monitor types table for Photonic RLA 5x1 modules
Facility
OPTMON
OSC
AMP
CHMON
Monitor type
SONET Section (S)/SDH Regenerator Section (RS)
CV-S or RS-BBE
X
ES-S or RS-ES
X
SES-S or RS-SES
X
SEFS-S or RS-OFS
X
SONET Line (L)/SDH Multiplex Section (MS)
CV-L or MS-BBE
X
ES-L or MS-ES
X
SES-L or MS-SES
X
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Table 1-57
Monitor types table for Photonic RLA 5x1 modules (continued)
Facility
OPTMON
OSC
AMP
CHMON
Monitor type
UAS-L or MS-UAS
X
FC-L or MS-FC
X
DMMIN-L or L-DMMIN
X
DMMAX-L or L-DMMAX
X
DMAVG-L or L-DMAVG
X
Physical
OPR-OTS
X
OPRMIN-OTS
X
OPRMAX-OTS
X
OPRVG-OTS
X
OPR-OCH
X
OPRMIN-OCH
X
OPRMAX-OCH
X
OPRAVG-OCH
X
Note 2
OPT-OCH
X
OPTMIN-OCH
X
OPTMAX-OCH
X
OPTAVG-OCH
X
Note 3
SPANLOSS-OCH
X
SPANLOSSMIN-OCH
X
SPANLOSSMAX-OCH
X
SPANLOSSAVG-OCH
X
OPIN-OTS
X
OPINMIN-OTS
X
OPINMAX-OTS
X
OPINAVG-OTS
X
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Table 1-57
Monitor types table for Photonic RLA 5x1 modules (continued)
Facility
OPTMON
OSC
AMP
CHMON
Monitor type
OPOUT-OTS
X
OPOUTMIN-OTS
X
OPOUTMAX-OTS
X
OPOUTAVG-OTS
X
OPT-OCH
X
OPTMIN-OCH
X
OPTMAX-OCH
X
OPTAVG-OCH
X
Note 4
Note 1: For a diagram showing the RLA 5x1 optical monitoring points, refer to Figure 1-79 on page
1-229.
Note 2: The accuracy of the monitoring circuitry on SFP and SFP+ pluggables is guaranteed to be at
least 20 dB from the “receive sensitivity” (Min) to the “receive overload” (Max). For certain pluggables
(NTK592xx) the range between Min and Max is greater than 20 dB; therefore, the reporting of the
receive power from the monitoring circuitry may be clamped to a power value that is short of the actual
power. Although the actual power may be within or even outside the Max range, PMs will not set the
OPR power to Invalid (IDF) since the power being reported is short of the Max.
Note 3: The OPT-OCH value is reported with an accuracy of ±0.3 dB.
Note 4: CHMON OPT-OCH monitor type support requires the OPM (embedded within WSS w/OPM
circuit packs).
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Figure 1-79
RLA 5x1 circuit pack optical monitoring points
Wavelength Selective
Switch
5x1 Flex
Facility: CHMON port 5,
NMCMON port 5,
Parameter: OPT-OCH*
Facility: SDMON port 5
Parameter: OPT-OTS
PD
PD
PD
PD
Switch In-1
21
Switch In-2
23
Switch In-3
25
Switch In-4
27
Switch In-5
In-1
21
29
PD
EDFA
PD
Line Out
5
OSC In
3
Mon B
1
Mon A
2
Line In
8
OSC Out
4
PD
PD
Backplane
PD
Facility: AMP port 5
Parameter: OPIN-OTS*, OPOUT-OTS*
OPM
Facility: CHMON port 8, NMCMON port 8
Parameter: OPT-OCH*
Facility: SDMON port 8
Facility: OPTMON port 1,2,3
Parameter: OPT-OTS
Parameter: OPT-OTS*
EDFA
PD
PD
PD
Passive Demux
1x5
PMs collected at all PD locations
Facility: OPTMON port 4,21,23,25,27,29
Parameter: OPR-OTS*
Facility: AMP port 8
Parameter: OPIN-OTS*, OPOUT-OTS*
Sync
Processor
Module
Demux Out-1
22
Demux Out-2
24
Demux Out-3
26
Demux Out-4
28
Demux Out- 5
30
Power Supply
* AVG, MIN, and MAX measurements also provided.
Legend
EDFA Erbium Doped Fiber Amplifier
OSC
Optical Service Channel
OPM
Optical Power Monitor
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Upgrade Failed
•
Internal Mgmt Comms Suspected
•
High Received Span Loss
•
Low Received Span Loss
•
Automatic Shutoff Compromised
•
Hardware Subsystem Failed
Adjacency alarms
• Adjacency Far End Not Discovered
•
Adjacency Mismatch
•
Fiber Type Manual Provisioning Required
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
Line Adjacency Manual Provisioning Required
Photonic alarms
• Shutoff Threshold Crossed
•
Optical Line Fail
•
Automatic Power Reduction Active
•
Input Loss of Signal
•
Low Optical Return Loss at Output
•
Output Loss of Signal
•
Automatic Shutoff
•
Gauge Threshold Crossing Alert Summary
•
Automatic Shutoff Disabled
•
Minimum Gain
•
Channel Degrade
•
Channel Opacity Error
•
Loss Of Signal
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COM alarms
• Software Auto-Upgrade in Progress
•
Channel Controller: Failure Detected
•
Channel Controller: Unexpected Loss Detected
•
Timing Generation Manual Switch - 1st Ref
•
Timing Generation Manual Switch - 2nd Ref
•
Timing Generation Manual Switch - 3rd Ref
•
Timing Generation Manual Switch - 4th Ref
•
Timing Distribution Manual Switch - 1st Ref
•
Timing Distribution Manual Switch - 2nd Ref
•
Timing Distribution Manual Switch - 3rd Ref
•
Timing Distribution Manual Switch - 4th Ref
Equipping rules
The following equipping rules apply to the RLA 5x1 circuit pack:
•
is a double-slot interface.
•
can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot packet-optical,
14-slot converged optical, converged optical/front electrical, or 14-slot
converged optical/rear electrical shelf. RLA 5x1 circuit pack cannot be
placed in slot 14 since RLA 5x1 circuit pack is a double-slot interface.
•
can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot shelf.
RLA 5x1 circuit pack cannot be placed in slot 8, 18, 28, or 38 since RLA
5x1 circuit pack is a double-slot interface.
•
can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). RLA 5x1 circuit pack cannot be placed in slot 7 since RLA
5x1 circuit pack is a double-slot interface.
•
can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). RLA 5x1 circuit pack cannot be placed in slot 8 since RLA
5x1 circuit pack is a double-slot interface.
•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
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The following restrictions on using a cross-connect circuit pack apply when
deploying a RLA 5x1 circuit pack:
•
the RLA 5x1 circuit packs do not use any cross-connect capacity and can
be installed in shelves equipped with or without cross-connect circuit
packs
•
in a 14-slot shelf type, when the RLA 5x1 circuit packs are installed in slots
7 or 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to13) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
Technical specifications
•
Table 1-58 lists the weight, power, and wavelength range for the RLA 5x1
optical interface circuit pack.
•
Table 1-59 on page 1-233 lists the specifications for the RLA 5x1 optical
interface circuit pack (pre-amp and booster specifications).
•
Table 1-60 on page 1-238 lists the specifications for the RLA 5x1 optical
interface circuit pack (WSS specifications).
Table 1-58
Technical specifications for RLA 5x1 optical interface circuit packs (weight, power, and
wavelength range)
Parameter
RLA 5x1 circuit pack (NTK553RA)
Weight (estimated)
2.5 kg (5.5 lb)
Power consumption
Typical (W): 54 (Note 1)
Power Budget (W): 65 (Note 2)
Wavelength range (nm)
C-band channels 1528.77 nm to 1566.72 nm (96 total)
when used in fixed grid systems
Frequency range (THz)
C-band 196.125 THz to 191.325 THz when used in
flexible grid systems
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V). For practical purposes, the rounded typical power
consumption of an equipment can be used as the equipment heat dissipation when calculating facilities
thermal loads (an estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in a system
operating at an ambient temperature range from 5oC to 40oC at a voltage of 40 Vdc (+/-2.5 V). These
values must be used in sizing feeders and estimating theoretical maximum power draw.
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Table 1-59
Technical specifications for RLA 5x1 optical interface circuit packs (pre-amp and booster
specifications)
Parameter
RLA 5x1 circuit pack (NTK553RA)
Minimum
Default
Pre-amp Booster Pre-amp Booster
Maximum Output
Power (dBm)
Wavelength Range
(nm)
Top offset (Note 3)
Maximum
Pre-amp
Booster
N/A
N/A
23
1528.77
N/A
1566.72
-6
N/A
0
N/A
0
N/A
5
10
5
10
15
20
Amplifier Input LOS
threshold (dBm)
-39
-39
-26
-26
10
10
Amplifier Output LOS
threshold (dBm)
-15
-15
-12
-12
15
15
Shutoff threshold
(dBm)
-42
-42
-29
-29
10
10
Gain (dB)
15
10
15
10
25
20
Amplifier Input LOS
threshold (dBm)
-39
N/A
-36
N/A
10
N/A
Amplifier Output LOS
threshold (dBm)
-15
N/A
-12
N/A
15
N/A
Shutoff threshold
(dBm)
-42
N/A
-39
N/A
10
N/A
Output of Line In to
Mon A
19
N/A
N/A
N/A
24
N/A
Line Out to Mon B
N/A
19
N/A
N/A
N/A
24
Low Gain mode (Note
4):
Gain (dB)
High Gain mode (Note
4):
Tap ratio loss (dB):
Gain mask
See:
• Figure 1-80 on page 1-235 for pre-amp gain mask (low gain mode)
• Figure 1-81 on page 1-236 for pre-amp gain mask (high gain mode)
• Figure 1-82 on page 1-237 for booster gain mask (low gain mode)
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Table 1-59
Technical specifications for RLA 5x1 optical interface circuit packs (pre-amp and booster
specifications) (continued)
Parameter
RLA 5x1 circuit pack (NTK553RA)
Minimum
Default
Maximum
Pre-amp Booster Pre-amp Booster
Pre-amp
Booster
N/A
• Gain 5- 10 dB
NF < 17.1
(maximum)
• Gain 10 - 15 dB
NF < 12
(maximum)
• Gain 10 - 15 dB
NF < 10.1
(maximum)
• Gain 15 - 20 dB
NF < 7.4
(maximum)
• Gain 15- 20 dB
NF < 10.9
(maximum)
N/A
Noise figure (NF) (dB)
(Note 3)
at output power of 23
dBm
Low Gain mode
High Gain mode
N/A
N/A
N/A
N/A
N/A
N/A
N/A
• Gain 20 - 25 dB
NF < 7.1
(maximum)
Note 1: TOP Offset is a lever that can be used to maximize link budget (by reducing noise figure), and
the value will be provided by the modeling tools where applicable.
Note 2: Gain mode is defined as NA, High, or Low. Gain mode is set at provisioning from value provided
by Optical Modeler. Gain mode drives minimum and maximum amplifier gain. Gain mode of NA (Not
Applicable) is used for all amplifiers. On database restore, if the gain mode is different between the
saved database and the actual gain setting on the circuit pack, traffic may be impacted. You cannot
switch from Low Gain mode to High Gain mode if the current target gain is less than 11 dB, which is
outside of the common range (11-19 dB) for the Low Gain settings.
Note 3: Contact Ciena if more information is required.
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Figure 1-80
RLA 5x1 pre-amp gain mask (low gain mode)
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Figure 1-81
RLA 5x1 pre-amp gain mask (high gain mode)
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Figure 1-82
RLA 5x1 booster gain mask (low gain mode)
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Table 1-60
Technical specifications for RLA 5x1 optical interface circuit packs (WSS specifications)
Parameter
RLA 5x1 circuit pack (NTK553RA); WSS
Connector type
LC
Maximum total input power
27 dBm total or 9 dBm/12.5 GHz
Minimum Demux insertion loss
6.0 dB
Maximum Demux insertion loss
8.0 dB
Minimum Mux insertion loss
3.0 dB
Maximum Mux insertion loss
6.5 dB
Minimum attenuation per channel
0 dB
Maximum attenuation per channel
18 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Optical Power Monitor (OPM C-Band) 2 Port circuit pack
(NTK553PAE5) and Optical Power Monitor (OPM Flex C-Band) 2-Port
circuit pack (NTK553PB)
Overview
This release of 6500 supports two variants of the Optical Power Monitor
(OPM) circuit packs:
•
NTK553PAE5: Optical Power Monitor (OPM C-Band) 2 Port circuit pack
(also referred to as 2-Port OPM).
This circuit pack provides the ability to monitor and report the
per-wavelength optical powers on the 50 GHz ITU grid across the entire
C-band supports (96 ITU-T 50GHz channels).
•
NTK553PB: Optical Power Monitor (OPM Flex C-Band) 2-Port circuit pack
(also referred to as 2-Port OPM Flex C-Band)
— similar to 2-Port OPM circuit pack (NTK553PAE5), this circuit pack
provides the ability to monitor and report the per-wavelength optical
powers on the 50 GHz ITU grid across the entire C-band supports (96
ITU-T 50GHz channels).
— this circuit pack also provides the support for Flex spectrum
measurement and therefore ability to monitor and report the
per-frequency (6.25 GHz) optical powers. This results in NTK553PB
variant being used in flexible grid submarine applications while
NTK553PAE5 variant cannot be used in flexible grid submarine
applications.
Figure 1-83 on page 1-240 shows the faceplate of a 2-Port OPM circuit pack
and Figure 1-84 on page 1-241 shows the faceplate of a 2-Port OPM Flex
C-Band circuit pack. Figure 1-85 on page 1-242 provides a functional block
diagram of the 2-Port OPM and 2-Port OPM Flex C-Band circuit packs.
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Figure 1-83
2-Port OPM circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-84
2-Port OPM Flex C-Band circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-85
2-Port OPM circuit pack block diagram (NTK553PAE5 and NTK553PB)
Backplane
Optical Power
Monitor
PD
OPM In-1
1
OPM In-2
2
OPM Validation
3
OPM Validation
4
PD
Processor
Module
Power
Supply
Legend
OPM
Optical Power Monitor
PD
Photodiode
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Supported functionality
The 2-Port OPM circuit pack (NTK553PAE5) and 2-Port OPM Flex C-Band
circuit pack (NTK553PB) provide the following functionality:
•
operates in ITU 50 GHz spaced C-band (NTK553PAE5 variant).
•
operates in Flex C-band (NTK553PB variant).
•
when used with the Enhanced CMD44 50 GHz or CMD96 modules,
provides a check point for service circuit pack Tx powers connected to
CMD44 or CMD96. Installers can validate connections between service
circuit packs and CMD44 or CMD96 without provisioning CMD44 or
CMD96 Tx/Rx adjacency and adding the channel in DOC.
•
when used with an amplifier circuit pack at an amplifier node, provides
per-channel power monitoring capabilities. Per-channel power monitoring
capabilities at a line amp node provides CHMON PM’s for troubleshooting
purposes. DOC does not use the power monitoring capabilities for
optimization purposes.
•
provides two optical connections to the 2-Port OPM or 2-Port OPM Flex
C-Band to be monitored on demand at any port
— connect to Enhanced CMD44 50 GHz or CMD96 module or amplifier
circuit pack to measure the optical power from the Enhanced CMD44
50 GHz or CMD96 module or the amplifier circuit pack.
— power measured at 2-Port OPM or 2-Port OPM Flex C-Band is scaled
and reported against the designated input ports (Port 1 and 2).
•
provides two output optical connections for monitoring of the input ports
— connect to external OSA to validate the 2-Port OPM or 2-Port OPM
Flex C-Band measured powers (if necessary) via 50% tap from each
monitor ports.
— calibrated loss (~3dB) from Port 1 to 3 and from Port 2 to 4
programmed in CCT and displayed in Site Manager. Users can then
use the calibrated loss to add up with the external OSA measurements
in order to relate the measured spectra back at the 2-Port OPM or
2-Port OPM Flex C-Band faceplate.
•
provides updated data for all ports within one second
•
provides per channel as well as total band power monitor capability for
each 2-Port OPM or 2-Port OPM Flex C-Band port
•
see Table 1-61 for function and connector type for each port
Table 1-61
2-Port OPM and 2-Port OPM Flex C-Band optical interfaces
Interface name
Physical port #
Function
Connector type
Mon (In)
1 and 2
Monitor input ports
LC
Mon (Out)
3 and 4
Monitor output ports
LC
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Performance monitoring
The 6500 monitors and collects physical PMs for 2-Port OPM and 2-Port OPM
Flex C-Band circuit pack facilities. Table 1-62 provides a list of monitor types
supported on 2-Port OPM and 2-Port OPM Flex C-Band circuit packs. Figure
1-86 on page 1-245 and Figure 1-87 on page 1-246 show the 2-Port OPM and
2-Port OPM Flex C-Band circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-62
Monitor types table for Photonic 2-Port OPM and 2-Port OPM Flex C-Band
circuit packs
Facility
OPTMON
Monitor Type
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
CHMON
Note 1
SDMON
Note 2
X
X
X
X
X
X
X
X
X
X
X
X
Note 1: CHMON facilities are only supported on 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs that are configured as a standalone OPM.
Note 2: SDMON facilities are only supported on the 2-Port OPM Flex C-Band circuit
pack when configured as a standalone OPM and running the flexible grid equipment
profile.
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Figure 1-86
2-Port OPM circuit pack optical monitoring points
Facility: CHMON port 1, 2
Parameter: OPT-OCH* **
Optical
Power
Monitor
OPM In - 1 1
2x1
Optical
Switch
OPM In - 2 2
PD
Backplane
PD
Processor
Module
OPM
Validation
3
OPM
Validation
4
Power
Supply
PMs collected on all PD locations
Facility: OPTMON port 1, 2
Parameter: OPR-OTS*
* AVG, MIN, and MAX measurements also provided.
** CHMON facilities are only supported on 2-Port OPM circuit packs that are configured
as a standalone OPM.
Legend
OPM
PD
Optical Power Monitor
Photodiode
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Figure 1-87
2-Port OPM Flex C-Band circuit pack optical monitoring points
Facility: CHMON port 1, 2
Parameter: OPT-OCH* **
Facility: SDMON port 1, 2
Parameter: OPT-OCH* ***
Optical
Power
Monitor
OPM In - 1 1
2x1
Optical
Switch
OPM In - 2 2
PD
Backplane
PD
PMs collected on all PD locations
Facility: OPTMON port 1, 2
Parameter: OPR-OTS*
Processor
Module
OPM
Validation
3
OPM
Validation
4
Power
Supply
* AVG, MIN, and MAX measurements also provided.
** CHMON facilities are only supported on 2-Port OPM Flex C-Band circuit packs that are
configured as a standalone OPM.
*** SDMON facilities are only supported on the 2-Port OPM Flex C-Band circuit pack when
configured as a standalone OPM and running the flexible grid equipment profile.
Legend
OPM
PD
Optical Power Monitor
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Loss of Signal
•
Gauge Threshold Crossing Alert Summary
Equipping rules
The following equipping rules apply to 2-Port OPM and 2-Port OPM Flex
C-Band circuit packs:
•
is a single-slot interface.
•
can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
Note: Up to four 2-Port OPM and 2-Port OPM Flex C-Band circuit packs
can be equipped in a 6500 shelf at the same time.
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•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf
The following restrictions on using a cross-connect circuit pack apply when
deploying a 2-Port OPM or 2-Port OPM Flex C-Band circuit pack:
•
the 2-Port OPM and 2-Port OPM Flex C-Band circuit packs do not use any
cross-connect capacity and can be installed in shelves equipped with or
without cross-connect circuit packs
•
In a 14-slot shelf type, when the 2-Port OPM or 2-Port OPM Flex C-Band
circuit packs are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6 and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
•
In a 6500-7 packet-optical shelf type, when the 2-Port OPM or 2-Port OPM
Flex C-Band circuit packs are installed in slots 7 or 8, only Broadband
circuit packs or Photonic circuit packs can be provisioned in the other
interface slots (slots 1 to 6) as MSPP or PKT/OTN I/F interface circuit
packs require a cross-connect circuit pack. See Part 1 of 6500 Planning,
NTRN10ED (Shelf and equipment descriptions) for a full list of supported
Broadband and Photonic circuit packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the 2-Port OPM) and 2-Port OPM Flex C-Band optical
interface circuit packs.
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Table 1-63
Technical specifications for 2-Port OPM and 2-Port OPM Flex C-Band optical interface circuit
packs
Parameter
2-Port OPM (NTK553PAE5)
2-Port OPM Flex C-Band
(NTK553PB)
Weight (estimated)
0.9 kg (2.0 lb)
0.9 kg (2.0 lb)
Power consumption
Typical (W): 8 (Note 1)
Typical (W): 10 (Note 1)
Power Budget (W): 11 (Note 2) Power Budget (W): 12 (Note 2)
Connector type
LC
Maximum total input optical power
+17.5 dBm
Maximum total input power at
monitor-in port
+14.5 dBm
Frequency range (in fixed-channel
mode with 50 GHz spacing)
191.325 THz to 196.125 THz
Wavelength range (in
fixed-channel mode with 50 GHz
spacing)
1528.77 nm to 1566.72 nm
Frequency range (in Flex-grid
mode with 6.25 GHz spacing)
N/A
191.3125 THz to 196.1375 THz
Wavelength range (in Flex-grid
mode with 6.25 GHz spacing)
N/A
1567.03 nm to 1528.48 nm
Total input power range per port
(port 1 and 2)
-36 dBm to +14.5 dBm
Total power monitor accuracy
(input power >= -36.0 dBm)
-0.85 dB to +0.85 dB
Per channel input power range
-28.5 dBm to -0.6 dBm
Per channel input power accuracy
LOS Threshold
-1.05 dB to +1.05 dB
Default: -38 dBm
Minimum: -40 dBm
Maximum: 0 dBm
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
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4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit packs (NTK508AxE5)
Overview
The 4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack (also
known as SCMD4 100 GHz) is a cost effective way to increase capacity. It
provides the ability to add/drop channels, without the requirement of having a
WSS at the site. Channel access sites using SCMD4s instead of WSSs are
referred to as thin terminal or thin OADM sites (TOADMs). The SCMD4 100
GHz circuit pack has passive group filters and passthrough/upgrade ports for
cascading.
Each SCMD4 circuit pack supports four DWDM channels in the 100
GHz-spaced ITU grid. Nine different SCMD4 circuit packs are required to
cover the entire C-band for a total of 36 wavelengths. Those nine SCMD4 100
GHz circuit packs are:
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 1
(NTK508AAE5): 1530.33 nm- 1531.12 nm- 1531.90 nm- 1532.68 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 2
(NTK508ABE5): 1534.25 nm- 1535.04 nm- 1535.82 nm- 1536.61 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 3
(NTK508ACE5): 1538.19 nm- 1538.98 nm- 1539.77 nm- 1540.56 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 4
(NTK508ADE5): 1542.14 nm- 1542.94 nm- 1543.73 nm- 1544.53 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 5
(NTK508AEE5): 1546.12 nm- 1546.92 nm- 1547.72 nm- 1548.51 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 6
(NTK508AFE5): 1550.12 nm- 1550.92 nm- 1551.72 nm- 1552.52 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 7
(NTK508AGE5): 1554.13 nm- 1554.94 nm- 1555.75 nm- 1556.55 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 8
(NTK508AHE5): 1558.17 nm- 1558.98 nm- 1559.79 nm- 1560.61 nm
•
4 Channel Mux/Demux (SCMD4) 100 GHz C-Band circuit pack, Group 9
(NTK508AJE5): 1562.23 nm- 1563.05 nm- 1563.86 nm- 1564.68 nm
Figure 1-88 on page 1-251 shows the faceplate of a SCMD4 100 GHz circuit
pack. Figure 1-89 on page 1-252 provides a functional block diagram of the
SCMD4 100 GHz circuit pack.
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Figure 1-88
SCMD4 100 GHz circuit pack faceplate (example: NTK508AAE5)
In
1531.90
o
Out
In
Out
o
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Common ports
Ch3
o
Channel ports
o
Out
In
Ch5
o
o
Out
In
Ch7
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
Upgrade ports
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Processor
Module
PD
Channel MUX
Upgrade MUX
Figure 1-89
SCMD4 100 GHz circuit pack block diagram (NTK508AxE5)
PD
PD
3
Ch-In 2
5
Ch-In 3
7
Ch-In 4
9
VOA
VOA
VOA
PD
Upgrade In 11
Common Out 2
Power
Supply
Backplane
Ch-In 1
VOA
Common In 1
Isolator
VOA
PD
Channel DeMUX
Upgrade DeMUX
Upgrade Out 12
Ch-Out 1
4
Ch-Out 2
6
Ch-Out 3
8
Ch-Out 4 10
Legend
PD
Photodiode
VOA
Variable Optical Attenuator
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Supported functionality
The SCMD4 100 GHz circuit packs (NTK508AxE5) provide the following
functionality:
•
offers 36 channels Mux/Demux in nine groups at 100 GHz grid listed in
Table 1-64
Table 1-64
SCMD4 100 GHz ITU grid 36 wavelength plan
Channel Wavelength
ID of the 100 GHz (nm)
mux/de
mux
Channel Wavelength
ID of the 100 GHz (nm)
mux/dem
ux
Channel Wavelength
ID of the 100 GHz (nm)
mux/de
mux
Group 1 (NTK508AAE5)
Group 4 (NTK508ADE5)
Group 7 (NTK508AGE5)
1
1530.33
31
1542.14
61
1554.13
3
1531.12
33
1542.94
63
1554.94
5
1531.90
35
1543.73
65
1555.75
7
1532.68
37
1544.53
67
1556.55
Group 2 (NTK508ABE5)
Group 5 (NTK508AEE5)
Group 8 (NTK508AHE5)
11
1534.25
41
1546.12
71
1558.17
13
1535.04
43
1546.92
73
1558.98
15
1535.82
45
1547.72
75
1559.79
17
1536.61
47
1548.51
77
1560.61
Group 3 (NTK508ACE5)
Group 6 (NTK508AFE5)
Group 9 (NTK508AJE5)
21
1538.19
51
1550.12
81
1562.23
23
1538.98
53
1550.92
83
1563.05
25
1539.77
55
1551.72
85
1563.86
27
1540.56
57
1552.52
87
1564.68
•
has express path (upgrade port) that is 50 GHz-compliant.
•
channel level optical power monitor and adjustment via a voltage
controlled optical attenuator (VOA) with 20 dB range on the MUX side for
wavelength optimization support
•
total optical power monitor and adjustment via a voltage controlled optical
attenuator (VOA) with 20 dB range on the demultiplexer side allowing
adjustment of average drop power to connected receivers
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•
VOAs fail to opaque. Hence add traffic lost on power down. Express path
is passive hence no impact with power down.
•
Demux path includes an isolator to ensure the pre-amp APR (Automatic
Power Reduction) does not get triggered with a Tx to Ch Out
misconnection
•
it is required to provision the cascading order when multiple SCMD4 cards
are cascaded.
•
see Table 1-65 for function and connector type for each port.
Table 1-65
SCMD4 100 GHz optical interfaces
Interface name
Physical port #
Function
Connector type
Ch 1 In / Out
Ch 2 In / Out
Ch 3 In / Out
Ch 4 In / Out
3/4
5/6
7/8
9 / 10
Optical input / output from the client-side
interface(s)
LC
Common In / Out
1/2
The SCMD4 Common In/Out ports are
connected to:
LC
• the LIM Line A Out (port 7) of the
amplifier circuit pack when the SCMD4
circuit pack is the first group in the
cascading order.
• the preceding SCMD4 Upgrade In/Out
ports when the SCMD4 circuit pack is
not the first group in the cascading
order.
Upgrade In / Out
11 / 12
Group level bypass input / output
LC (LC/UPC (Note)
terminators are
shipped on the
Demux upgrade
out port)
Note: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).
Cross-connection types
The SCMD4 100 GHz circuit pack supports the following cross-connection
types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Cross-connection rates
The SCMD4 100 GHz circuit pack only supports the OCH (Optical Channel)
Photonic cross-connection rate.
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Performance monitoring
The 6500 monitors physical PMs for SCMD4 circuit pack facilities. Table 1-66
provides a list of monitor types supported on SCMD4 circuit packs. Figure
1-90 on page 1-256 shows the SCMD4 circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-66
Monitor types table for SCMD4 circuit packs
Monitor Type
Facility
VOA
GRPOPOUT-OTS
GRPOPOUTMIN-OTS
GRPOPOUTMAX-OTS
GRPOPOUTAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
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Figure 1-90
SCMD4 circuit pack optical monitoring points
Channel MUX
Upgrade MUX
Processor
Module
PD
PD
PD
PD
Ch-In 1
3
Ch-In 2
5
Ch-In 3
7
Ch-In 4
9
Upgrade-In
11
VOA
VOA
VOA
VOA
Backplane
Common-Out 2
Common-In
Power
Supply
1
PMs collected at all PD locations
Facility VOA port 1,3,5,7,9
Parameter: GRPOPOUT-OTS* port 1
Parameter: OPOUT-OTS* ports 3,5,7,9
Isolator
VOA
PD
Channel DeMUX
Upgrade DeMUX
Upgrade-Out 12
Ch-Out 1
4
Ch-Out 2
6
Ch-Out 3
8
Ch-Out 4
10
*AVG, MIN, and MAX measurements also provided
Legend
PD
VOA
Photodiode
Variable Optical Attenuator
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Autoprovisioning Mismatch
•
Circuit Pack Failed
•
Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Upgrade Failed
•
Database Not Recovered For Slot
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
Photonic alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
Gauge Threshold Crossing Alert Summary
•
Group Loss of Signal
•
Loss of Signal
COM alarms
• Software Auto-Upgrade in Progress
Equipping rules
The following equipping rules apply to SCMD4 100 GHz circuit packs:
•
is a 12-port single slot interface.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). This circuit pack is not supported for use in slots 7 and 8 of
the 14-slot packet-optical shelf (NTK503SA variant).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 6 of the 6500-7 packet-optical shelf
(NTK503RA). This circuit pack is not supported for use in slots 7 and 8 of
the 6500-7 packet-optical shelf (NTK503RA).
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•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with SPAP-2 w/2xOSC (NTK555NA
or NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a SCMD4 100 GHz circuit pack:
•
the SCMD4 100 GHz circuit packs do not use any cross-connect capacity
and can be installed in shelves equipped with or without cross-connect
circuit packs
•
In a 14-slot shelf type, when the SCMD4 100 GHz circuit packs are
installed in slots 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6 and 9
to14) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
•
In a 6500-7 packet-optical shelf type, when the SCMD4 100 GHz circuit
packs are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6) as MSPP or PKT/OTN I/F interface circuit packs require a
cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SCMD4 100 GHz optical interface circuit pack.
Table 1-67
Technical specifications for SCMD4 100 GHz optical interface circuit pack
Parameter
SCMD4 100 GHz (NTK508AxE5)
Weight (estimated)
1.1 kg (2.4 lb)
Power consumption
Typical (W): 7 (Note 1)
Power Budget (W): 10 (Note 2)
Maximum total Input power
Per port for the 4:1 MUX= 14 dBm
Any other optical port (input or output)= 20 dBm
Minimum return loss
40 dB
Working bandwidth
+/- 12.5 GHz
Add path maximum insertion losses
(VOAs = 0 dB)
• Ch-In to Common Out: 4.6 dB
• Upgrade In to Common Out: 1.1 dB
Drop Path maximum insertion losses • Common In to Ch-Out: 5.4 dB
(VOA = 0 dB)
• Common In to Upgrade Out: 0.75 dB
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate
of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
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Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (NTK553GAE5),
Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (NTK553GB), and
Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack (NTK553GC)
Overview
This release of 6500 supports the following variants of the SMD circuit packs:
•
Selective Mux/Demux (SMD) 50 GHz C-Band 8x1 circuit pack (also
referred to as SMD 50 GHz 8x1) (NTK553GAE5)
•
Selective Mux/Demux (SMD) Flex C-Band 8x1 circuit pack (also referred
to as SMD Flex 8x1) (NTK553GB)
•
Selective Mux/Demux (SMD) Flex C-Band 14x8 circuit pack (also referred
to as SMD Flex 14x8) (NTK553GC)
The SMD 50 GHz 8x1, SMD Flex 8x1, or SMD Flex 14x8 circuit pack is used
together with the CCMD12 C-Band circuit pack (NTK508FAE5) to provide
colorless add/drop per-wavelength switching.
The SMD Flex 8x1 or SMD Flex 14x8 circuit pack offers similar functionality
as SMD 50 GHz 8x1 circuit pack with some variations on technical
specifications and power consumption (see Table 1-72 on page 1-276 for
details). Also, unlike NTK553GAE5 and NTK553GB variants, the SMD Flex
14x8 circuit pack (NTK553GC) offers the colorless mux and the directional
switching functions in a single circuit pack.
The SMD Flex 8x1 (NTK553GB) and SMD Flex 14x8 (NTK553GC) circuit
pack variants are flexible grid-capable hardware and support flexible grid
COADM-based colorless applications.
The following figures are available:
•
Figure 1-91 on page 1-261 shows the faceplate of a SMD 50 GHz 8x1
circuit pack.
•
Figure 1-92 on page 1-262 shows the faceplate of a SMD Flex 8x1 circuit
pack. SMD Flex 8x1 faceplate is similar but using Flex instead of 50 GHz
on its faceplate label.
•
Figure 1-93 on page 1-263 shows the faceplate of a SMD Flex 14x8 circuit
pack.
•
Figure 1-94 on page 1-264 provides the functional block diagram of the
SMD 50 GHz 8x1 circuit pack.
•
Figure 1-95 on page 1-265 provides the functional block diagram of the
SMD Flex 8x1 circuit pack.
•
Figure 1-96 on page 1-266 provides the functional block diagram of the
SMD Flex 14x8 circuit pack.
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Figure 1-91
SMD 50 GHz 8x1 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
Monitor
(on->no pull, off->can be pulled)
ports
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Channel
ports
Common
ports
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Figure 1-92
SMD Flex 8x1 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Monitor
ports
Common
ports
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ports
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Figure 1-93
SMD Flex 14x8 circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Common Mux/Demux
ports
Add/drop switch
ports
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Figure 1-94
SMD 50 GHz 8x1 circuit pack block diagram (NTK553GAE5)
Processor
Module
Demux Out-1 12
Power
Supply
Demux Out-3 16
Demux Out-2 14
Demux Out-4 18
1529.94 nm filter
Wavelength
Selective Switch
2x8
Demux Out-5 20
Demux Out-6 22
Demux Out-7 24
Demux Out-8 26
PD
2x1
Optical
Switch
PD
1
Monitor 2
2
Monitor 3
3
Monitor 4
4
Monitor 5
5
Monitor 6
6
Monitor 7
7
Monitor 8
8
Common-In
9
8x1 Combiner
Backplane
Optical
Power
Monitor
50 GHz
Monitor 1
PD
Isolator
Common-Out 10
PD
PD
PD
PD
PD
PD
PD
PD
Switch In-1 11
Switch In-2 13
Switch In-3 15
Switch In-4 17
Wavelength
Selective Switch
8x2
Switch In-5 19
Switch In-6 21
Switch In-7 23
Switch In-8 25
Legend
OPM
Optical Power Monitor
PD
Photodiode
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Figure 1-95
SMD Flex 8x1 circuit pack block diagram (NTK553GB)
Processor
Module
Demux Out-1 12
Power
Supply
Demux Out-3 16
Demux Out-2 14
Demux Out-4 18
Wavelength
Selective Switch
2x8
Demux Out-5 20
Demux Out-6 22
Demux Out-7 24
Demux Out-8 26
Optical Power
Monitor Flex
Monitor 1
1
Monitor 2
2
Monitor 3
3
Monitor 4
4
Backplane
8x1 Combiner
PD
Monitor 5
5
Monitor 6
6
Monitor 7
7
Monitor 8
8
Common-In
9
PD
PD
Isolator
Common-Out 10
PD
PD
PD
PD
PD
PD
PD
PD
Switch In-1 11
Switch In-2 13
Switch In-3 15
Switch In-4 17
Wavelength
Selective Switch
8x2
Switch In-5 19
Switch In-6 21
Switch In-7 23
Switch In-8 25
Legend
OPM
Optical Power Monitor
PD
Photodiode
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Figure 1-96
SMD Flex 14x8 circuit pack block diagram (NTK553GC)
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Supported functionality
The SMD 50 GHz 8x1 circuit pack (NTK553GAE5), SMD Flex 8x1 circuit pack
(NTK553GB), and SMD Flex 14x8 circuit pack (NTK553GC) provide the
following functionality:
•
wavelength range:
— for NTK553GAE5 variant, C-band channels 1530.33 nm to 1565.092
nm (88 channels capable) when used in fixed grid systems
— for NTK553GB and NTK553GC variants, C-band channels 1528.77
nm to 1566.72 nm (96 channels capable) when used in fixed grid
systems
•
frequency range: C-band 196.125 THz to 191.325 THz when used in
flexible grid systems (only applicable to NTK553GB and NTK553GC
variants)
•
provides two independently controlled wavelength selective switches
(WSS) to select each of the 88 channels in the band plan from any of its 8
ports
•
provides blocking of channels on unselected ports of either the mux or
demux path
•
provides per channel attenuation of all channels in either the mux or
demux path
•
provides an internal loopback connection between the two WSSs. The
loopback path has a fixed filter to only allow wavelength 1529.94 nm.
•
provides monitoring (total power) on all Switch In ports and the Common
In port
•
provides optical isolation on the demux Common In path to eliminate
return loss and extraneous connection reverse-propagating power from
exiting the demux common
•
provides 8 monitor ports that are combined into a single input to an
internal optical power monitor (OPM) (meant to be used in conjunction
with CCMD12 C-band monitor ports in the demux direction). This allows
power measurement and power setting of drop channels.
•
provides per channel as well as total band power monitor capability for
each OPM port
•
provides an internal fiber connection from the Common Out path of the
SMD 50 GHz 8x1 or SMD Flex 8x1 circuit pack to a dedicated OPM port.
This allows power measurement and power setting of add channels.
•
flexible grid COADM-based colorless application support for NTK553GB
and NTK553GC variants.
•
see Table 1-68 on page 1-268 for function and connector type for each
port
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Table 1-68
SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interfaces
Interface name
Physical port # Function
Connector
type
SMD 50 GHz 8x1 and SMD Flex 8x1 circuit packs
Mon
1 to 8
Input Monitor ports for the SMD 50 GHz
8x1 or SMD Flex 8x1. Up to 8 CCMD12
C-Band Mon Out ports can be
connected.
LC-UPC
Common In / Out
9 / 10
DWDM optical input / output connected
to DIA or OADM configurations.
LC-UPC
Demux Out 1 / Switch In 1
12 / 11
LC-UPC
Demux Out 2 / Switch In 2
14 / 13
Optical input/output from CCMD12
C-Band
Demux Out 3 / Switch In 3
16 / 15
Demux Out 4 / Switch In 4
18 / 17
Demux Out 5 / Switch In 5
20 / 19
Demux Out 6 / Switch In 6
22 / 21
Demux Out 7 / Switch In 7
24 / 23
Demux Out 8 / Switch In 8
26 / 25
SMD Flex 14x8 circuit packs
Switch Out 1 / Switch In 1
6/5
Switch Out 2 / Switch In 2
8/7
Switch Out 3 / Switch In 3
10 / 9
Switch Out 4 / Switch In 4
12 / 11
Switch Out 5 / Switch In 5
14 / 13
Switch Out 6 / Switch In 6
16 / 15
Switch Out 7 / Switch In 7
18 / 17
Switch Out 8 / Switch In 8
20 / 19
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Optical input/output from CCMD12
C-Band for add/drop
LC-UPC
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Table 1-68
SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interfaces
Interface name
Physical port # Function
Demux In 1 / Mux Out 1
1/A
Demux In 2 / Mux Out 2
Demux In 3 / Mux Out 3
Demux In 4 / Mux Out 4
Demux In 5 / Mux Out 5
2/B
Connector
type
DWDM optical input / output common
ports connected to DIA or OADM
configurations.
12-Fiber
MPO/APC
Male
Use MPO(F)-MPO(F), APC, 12 Fiber,
SM fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
Demux In 6 / Mux Out 6
Demux In 7 / Mux Out 7
Demux In 8 / Mux Out 8
Demux In 9 / Mux Out 9
3/C
Demux In 10 / Mux Out 10
Demux In 11 / Mux Out 11
Demux In 12 / Mux Out 12
Demux In 13 / Mux Out 13
4/D
Demux In 14 / Mux Out 14
Performance monitoring
The 6500 monitors and collects physical PMs for SMD 50 GHz 8x1 circuit
pack (NTK553GAE5), SMD Flex 8x1 circuit pack (NTK553GB), and SMD Flex
14x8 circuit pack (NTK553GC) facilities. Table 1-69 provides a list of monitor
types supported on SMD 50 GHz 8x1 circuit pack (NTK553GAE5), SMD Flex
8x1 circuit pack (NTK553GB), and SMD Flex 14x8 circuit pack (NTK553GC).
Figure 1-97 on page 1-271, Figure 1-98 on page 1-272, and Figure 1-99 on
page 1-273 show the SMD 50 GHz 8x, SMD Flex 8x1, and SMD Flex 14x8
circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
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Table 1-69
Monitor types table for Photonic SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex
14x8 circuit packs
Facility
Monitor Type
OPTMON
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
OPT-OTS
OPTMIN-OTS
OPTMAX-OTS
OPTAVG-OTS
X
X
X
X
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
SDMON
Note 1
NMCMON
Note 2
CHMON
Note 3
X
X
X
X
X
X
X
X
X
X
X
X
Note 1: SDMON facilities are only supported on the SMD Flex 8x1 circuit pack.
Note 2: NMCMON facilities are only supported on the SMD 50 GHz 8x1 and SMD
Flex 8x1 circuit packs.
Note 3: CHMON facilities are not supported on the SMD Flex 14x8 circuit pack.
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Figure 1-97
SMD 50 GHz 8x1 circuit pack optical monitoring points
Demux Out 1
Processor
Module
12
Demux Out 2 14
Demux Out 2 16
Power
Supply
Demux Out 2 18
Wavelength
Selective Switch
2x8
1529.94 nm
filter
Demux Out 2 20
Demux Out 2 22
Demux Out 2 24
Demux Out 2 26
Monitor1
Optical Power
Monitor 50GHz
Monitor 2
2
Monitor 3
3
Monitor 4
4
Monitor 5
5
Monitor 6
6
Monitor 7
7
Monitor 8
8
Common-In
9
Backplane
8x1 Combiner
2x1 Optical Switch
PD
1
PD
PD
Isolator
PD
PD
PD
PD
PD
PD
PD
PD
Common-Out 10
Switch In 1 11
Switch In 2 13
Switch In 3 15
Switch In 4 17
Wavelength
Selective Switch
8x2
Switch In 5 19
Switch In 6 21
Switch In 7 23
Switch In 8 25
PMs collected at all PD locations (except PD between 2x1 Optical Switch and 8x1 combiner)
Facility: OPTMON port 9,11,13,15,17,19,21,23,25
Parameter: OPR-OTS*
Facility: OPTMON port 10
Parameter: OPT-OTS*
Facility: CHMON port 10, NMCMON port 10
Parameter OPT-OCH*
*AVG, MIN, and MAX measurements also provided.
Le gend
OPM
Optical Power Monitor
PD
Photodiode
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Figure 1-98
SMD Flex 8x1 circuit pack optical monitoring points
PMs collected at all PD locations
Facility: OPTMON port 9,11,13,15,17,19,21,23,25
Parameter: OPR-OTS*
Facility: OPTMON port 10
Parameter: OPT-OTS*
Facility: CHMON port 10, SDMON port 10
Parameter: OPT-OCH*
Facility: NMCMON port 10
Parameter: OPT-OTS
* AVG, MIN, and MAX measurements also provided.
Demux Out-1 12
Demux Out-2 14
Demux Out-3 16
Demux Out-4 18
Wavelength
Selective Switch
2x8
Demux Out-5 20
Demux Out-6 22
Processor
Module
Demux Out-7 24
Demux Out-8 26
Power
Supply
Optical Power
Monitor Flex
Monitor 1
1
Monitor 2
2
Monitor 3
3
Monitor 4
4
Monitor 5
5
Monitor 6
6
Monitor 7
7
Monitor 8
8
Common-In
9
Backplane
8x1 Combiner
PD
PD
PD
Isolator
Common-Out 10
PD
PD
PD
PD
PD
PD
PD
PD
Switch In-1 11
Switch In-2 13
Switch In-3 15
Switch In-4 17
Wavelength
Selective Switch
8x2
Switch In-5 19
Switch In-6 21
Switch In-7 23
Switch In-8 25
Legend
OPM
Optical Power Monitor
PD
Photodiode
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Figure 1-99
SMD Flex 14x8 circuit pack optical monitoring points
PD
DFLM
CT
x4
x4
14x9 Mux
Wavelength
Selective
Switch
x4
x4
PD
PD
x4
PD
PD
Processor
Module
x4
x4
PD
PD
2
MPO
Connector
3
MPO
Connector
4
CT
x2
x2
x2
MPO
Connector
CT
x4
x4
14x8 Demux
Wavelength
Selective
Switch
1
CT
x4
x4
x4
MPO
Connector
x2
Backplane
PD
5
6
7
8
Power
Supply
9
10
11
12
13
14
15
16
17
18
19
20
PD
PD PD
PD
PD
PD
PD
PD
PD
PD
PD
PMs collected at all PD locations
Facility: OPTMON port 1,2,3 (sub-ports 7 to 10),4 (sub-ports 7 and 8),5,7,9,11,13,15,17,19
Parameter: OPR-OTS*
Facility: OPTMON port 1,2,3, (sub-ports 3 to 6),4 (sub-ports 5 and 6),6,8,10,12,14,16,18,20
Parameter: OPT-OTS*
PD
PD
PD
PD
PD
* AVG, MIN, and MAX measurements also provided.
Legend
CT
DFLM
MPO
PD
Cable Trace
Dark Fiber Loss Measurement
Multi-fiber Push On
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• High Fiber Loss
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
Common equipment alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to SMD 50 GHz 8x1, SMD Flex 8x1, and
SMD Flex 14x8 circuit packs:
•
Shelf/slot support: follow the instructions on the following tables:
Table 1-70
Shelf/slot support for SMD 50 GHz 8x1 and SMD Flex 8x1 circuit packs
Shelf type
Slot number
All 2-slot shelf types
Not supported
All 7-slot shelf types
Not supported
6500-7 shelf type
Not supported
All 14-slot shelf types (except the NTK503GA
metro front electrical shelf)
slots 1 to 13
All 32-slot shelf types
slots 1-7, 11-17, 21-27, and 31-37
Note: The SMD circuit pack is a double-slot
interface and cannot be placed in slot 14 of a 14-slot
shelf type.
Note: The SMD circuit pack is a double-slot
interface and cannot be placed in slot 8, 18, 28, and
38 of a 32-slot shelf type.
Table 1-71
Shelf/slot support for SMD Flex 14x8 circuit pack
Shelf type
Slot number
All 2-slot shelf types
Not supported
7-slot shelf types (only NTK503KA variant)
slots 1 to 6
Note: The SMD circuit pack is a double-slot
interface and cannot be placed in slot 7 of a 7-slot
shelf type.
6500-7 shelf type
slots 1 to 7
Note: The SMD circuit pack is a double-slot
interface and cannot be placed in slot 8 of a 6500-7
shelf type.
only 14-slot Converged shelf types
(NTK503ADE5, NTK503BDE5, and
NTK503CDE5 variants)
slots 1 to 13
All 32-slot shelf types
Not supported
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Note: The SMD circuit pack is a double-slot
interface and cannot be placed in slot 14 of a 14-slot
shelf type.
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•
requires that the 6500 shelf is equipped with the SP-2 shelf processor
(NTK555FAE5 variant) or SPAP-2 w/2xOSC (NTK555NA or NTK555NB),
otherwise the SMD 50 GHz 8x1, SMD Flex 8x1, or SMD Flex 14x8
equipment does not provision.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a SMD 50 GHz 8x1, SMD Flex 8x1, or SMD Flex 14x8 circuit pack:
•
the SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 circuit packs do
not use any cross-connect capacity and can be installed in shelves
equipped with or without cross-connect circuit packs
•
In a 14-slot shelf type, when the SMD 50 GHz 8x1, SMD Flex 8x1, and
SMD Flex 14x8 circuit packs are installed in slots 7, 8, and 9, only
Broadband circuit packs or Photonic circuit packs can be provisioned in
the other interface slots (slots 1 to 6 and 10 to14) as MSPP or PKT/OTN
I/F interface circuit packs require a cross-connect circuit pack. See Part 1
of 6500 Planning, NTRN10ED (Shelf and equipment descriptions) for a full
list of supported Broadband and Photonic circuit packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the SMD 50 GHz 8x1, SMD Flex 8x1, SMD Flex 14x8 optical
interface circuit packs.
Table 1-72
Technical specifications for SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interface
circuit packs
Parameter
SMD 50 GHz 8x1
(NTK553GAE5)
SMD Flex 8x1
(NTK553GB)
SMD Flex 14x8
(NTK553GC)
Weight (estimated)
2.8 kg (6.2 lb)
3 kg (6.6 lb)
2.3 kg (5.0 lb)
Power consumption
Typical (W): 24 (Note 1)
Connector type
LC-UPC
LC-UPC
12-Fiber MPO/APC
Male, LC-UPC
Wavelength range (nm)
1530.33 to 1565.09
(88 channels capable)
1528.77 to 1566.72
(96 channels capable)
1528.77 to 1566.72
(96 channels
capable)
Frequency range (THz)
N/A
C-Band 196.125 THz to 191.325 THz when
used in flexible grid systems
Typical (W): 35 (Note 1) Typical (W): 20
Power Budget (W): 27 (Note Power Budget (W): 70 (Note 1)
Power Budget (W):
(Note 2, and Note 3)
2 and Note 3)
70 (Note 2, and
Note 3)
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Table 1-72
Technical specifications for SMD 50 GHz 8x1, SMD Flex 8x1, and SMD Flex 14x8 optical interface
circuit packs
Parameter
SMD 50 GHz 8x1
(NTK553GAE5)
SMD Flex 8x1
(NTK553GB)
SMD Flex 14x8
(NTK553GC)
SMD Mux/DeMux loss
2.2 dB to 7.3 dB
2.5 dB to 7.1 dB
4.5 dB to 9.5 dB
Maximum attenuation
range
18 dB
18 dB
10 dB
Loopback In 1 to Out 1
Loss
Loopback In 8 to Out 8
Loss
4.5 dB to 15.7 dB
N/A
N/A
Loopback In x to Out x
Loss
x=2,3,4,5,6,7
4.5 dB to 13.5 dB
N/A
N/A
Loopback In x to Out x
Loss
x=1,2,3,4,5,6,7,8
N/A
5 dB to 15 dB
N/A
Maximum total input
24 dBm
power at Common In port
24 dBm
24 dBm
Maximum total input
18 dBm
power at Switch input port
18 dBm
18 dBm
Maximum input power in
any 50 GHz channel
passband
12 dBm
12 dBm
12 dBm
Maximum total input
power at monitor input
port
14.5 dBm
14.5 dBm
N/A
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of an
equipment can be used as the equipment heat dissipation when calculating facilities thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies two slots in the shelf and power is drawn from the left-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
power budget to the zone associated with the left-most slot occupied by the circuit pack.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack
(NTK508FAE5) and 12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit
pack (NTK508FL)
Overview
This release of 6500 supports two variants of the CCMD12 circuit packs:
•
12 Channel Colorless Mux/Demux (CCMD12 C-Band) circuit pack (also
referred to as CCMD12 C-Band).The CCMD12 C-Band circuit pack is
used together with the
— SMD 50 GHz 8x1 (NTK553GAE5), SMD Flex 8x1 (NTK553GB), or
SMD Flex 14x8 (NTK553GC) circuit pack to provide colorless
add/drop per-wavelength switching.
— GMD10 C-Band modules (NTT862GA) or FIM Type 4 (NTK504CD) as
a cost effective way to provide a multiplexing point for channels from
CCMD12 C-Band circuit packs.
•
12 Channel Colorless Mux/Demux (CCMD12 L-Band) circuit pack (also
referred to as CCMD12 L-Band). The CCMD12 L-Band circuit pack is
used together with the GMD10 L-Band modules (NTT862GL) as a cost
effective way to provide a multiplexing point for channels from CCMD12
L-Band circuit packs. The CCMD12 L-Band circuit packs are only used in
Submarine applications.
See “10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10
Group Mux/Demux (GMD10) L-Band module (NTT862GL)” on page 1-445 for
more information on GMD10 modules. See “Fiber Interconnect Modules (FIM)
(NTK504CA, NTK504CB, NTK504CD, NTK504CE, and NTK504CF)” on page
1-453 for more information on FIM Type 4 modules.
Figure 1-100 on page 1-279 shows the faceplate of a CCMD12 C-Band circuit
pack (the CCMD12 L-Band variant shows L-Band on its faceplate). Figure
1-101 on page 1-280 provides a functional block diagram of the CCMD12
(C-Band or L-Band) circuit pack. For CCMD12 L-Band circuit pack, the circuit
pack’s block diagram is the same as CCMD12 C-Band circuit pack’s block
diagram.
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Figure 1-100
CCMD12 C-Band circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Channel
ports
Common
ports
Monitor
port
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Figure 1-101
CCMD12 (C-Band and L-Band) circuit pack block diagram (NTK508FAE5 and NTK508FL)
Ch 1 In
1
Ch 2 In
3
Ch 3 In
5
Ch 4 In
7
Ch 5 In
9
Ch 6 In
11
Ch 7 In
13
Ch 8 In
15
Ch 9 In
17
Ch 10 In
19
Ch 11 In
21
Ch 12 In
23
12 Channel Mux
Processor
Module
Backplane
PD PD PD PD PD PD PD PD PD PD PD PD
EDFA
Common Out 26
Drop Mon
Power
Supply
EDFA
12 Channel Demux
27
Common In 25
Ch 1 Out
2
Ch 2 Out
4
Ch 3 Out
6
Ch 4 Out
8
Ch 5 Out
10
Ch 6 Out
12
Ch 7 Out
14
Ch 8 Out
16
Ch 9 Out
18
Ch 10 Out
20
Ch 11 Out
22
Ch 12 Out
24
Legend
PD
Photodiode
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Supported functionality
The CCMD12 circuit packs (NTK508FAE5 and NTK508FL) provide the
following functionality:
•
provide 12 mux ports without filtering
•
provide 12 demux ports without filtering
•
provide monitoring (total power) on all mux ingress ports
•
provides an erbium-doped fiber amplifier (EDFA) at the common input port
of the demux path
•
provide an erbium-doped fiber amplifier (EDFA) at the common output port
of the mux path
•
provide total power monitoring at both the input and output of both EDFAs
•
provide an external monitor port at the output of the demux EDFA. In
CCMD12 C-Band variant (NTK508FAE5), this port connects to the SMD
50 GHz 8x1 or SMD Flex 8x1 monitor ports in colorless configuration. In
CCMD12 L-Band variant (NTK508FL), this port connects to the GMD10
L-Band module monitor ports in colorless configuration.
•
CCMD12 C-Band variant (NTK508FAE5) connects to GMD10 C-Band
modules (NTT862GA), or FIM Type 4 modules (NTK504CD) as a cost
effective way to provide a multiplexing point for channels from CCMD12
C-Band circuit packs
•
CCMD12 L-Band variant (NTK508FL) connects to GMD10 L-Band
modules (NTT862GL) as a cost effective way to provide a multiplexing
point for channels from CCMD12 L-Band circuit packs
•
provide optical isolation in the EDFAs to eliminate return loss and
extraneous connection reverse-propagating power
•
see Table 1-73 on page 1-282 for function and connector type for each
port
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Table 1-73
CCMD12 optical interfaces (C-Band and L-Band)
Interface name
Drop Mon
Physical port # Function
27
Connector type
For CCMD12 C-Band (NTK508FAE5 variant):
LC-UPC
For DWDM optical output to the
• SMD 50 GHz 8x1 or SMD Flex 8x1 circuit
pack Monitor port in colorless configuration,
or
• GMD10 C-Band
• FIM Type 4
For CCMD12 L-Band (NTK508FL variant):
For DWDM optical output to the
• GMD10 L-Band
Common In / Out
25 / 26
For CCMD12 C-Band (NTK508FAE5 variant):
LC-UPC
DWDM optical input /output to/from the
• SMD 50 GHz 8x1 or SMD Flex 8x1 circuit
pack Demux Out/Switch In in colorless
configuration, or
• GMD10 C-Band
• FIM Type 4
For CCMD12 L-Band (NTK508FL variant):
DWDM optical input /output to/from the
• GMD10 L-Band
Channel 1 In / Out
1/2
Channel 2 In / Out
3/4
Channel 3 In / Out
5/6
Channel 4 In / Out
7/8
Channel 5 In / Out
9 / 10
Channel 6 In / Out
11 / 12
Channel 7 In / Out
13 / 14
Channel 8 In / Out
15 / 16
Channel 9 In / Out
17 / 18
Channel 10 In / Out
19 / 20
Channel 11 In / Out
21 / 22
Channel 12 In / Out
23 / 24
Optical input / output from transponders
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Cross-connection types
The CCMD12 circuit pack only supports the 2WAY (Bidirectional)
cross-connection type.
Cross-connection rates
The CCMD12 C-Band circuit pack supports Optical Channel (OCH) and
Network Media Channel (NMC) Photonic cross-connection rates.
The CCMD12 L-Band circuit pack supports Network Media Channel (NMC)
Photonic cross-connection rates.
Performance monitoring
The 6500 monitors and collects physical PMs for CCMD12 circuit pack
facilities. Table 1-74 provides a list of monitor types supported on CCMD12
circuit packs. Figure 1-102 on page 1-285 shows the CCMD12 C-Band circuit
pack optical monitoring points and Figure 1-102 on page 1-285 shows the
CCMD12 L-Band circuit pack optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
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Table 1-74
Monitor types table for CCMD12 circuit packs
Monitor Type
Facility
OPTMON
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
OPT-OTS
OPTMIN-OTS
OPTMAX-OTS
OPTAVG-OTS
X
X
X
X
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
SDMON
Note
NMCMON
CHMON
X
X
X
X
X
X
X
X
X
X
X
X
AMP
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
Note: The SDMON facility on port 25 is only supported when the CCMD12 circuit
pack is connected to an SMD Flex 1x8 circuit pack.
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Figure 1-102
CCMD12 C-Band circuit pack optical monitoring points
Ch 1 In
1
Ch 2 In
3
Ch 3 In
5
Ch 4 In
7
Ch 5 In
9
Ch 6 In
11
Ch 7 In
13
Ch 8 In
15
Ch 9 In
17
Ch 10 In
19
Ch 11 In
21
Ch 12 In
23
12 Channel Mux
Processor
Module
PD PD PD PD PD PD PD PD PD PD PD PD
Backplane
EDFA
Facility: AMP port 26
Parameter: OPIN-OTS*
Parameter: OPOUT-OTS*
Power
Supply
Common Out 26
Drop Mon
EDFA
27
Common In 25
Ch 1 Out
2
Ch 2 Out
4
Ch 3 Out
6
Ch 4 Out
8
Ch 5 Out
10
Ch 6 Out
12
Ch 7 Out
14
Ch 8 Out
16
Ch 9 Out
18
Ch 10 Out
20
Ch 11 Out
22
Ch 12 Out
Facility: AMP port 25
Parameter: OPIN-OTS*
Parameter: OPOUT-OTS*
Facility: CHMON port 25, SDMON port 25,
NMCMON port 25
Parameter: OPT-OCH*
24
12 Channel Demux
PMs collected at all PD locations and Ch # Out ports
Facility: OPTMON port 1,3,5,...,21,23
Parameter: OPR-OTS*
Facility: OPTMON port 2,4,6,...,22,24
Parameter: OPT-OTS*
* AVG, MIN, and MAX measurements also provided
Le gend
ED FA
PD
Erbium Doped Fiber Amplifier
Photodiode
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Figure 1-103
CCMD12 L-Band circuit pack optical monitoring points
Ch 1 In
1
Ch 2 In
3
Ch 3 In
5
Ch 4 In
7
Ch 5 In
9
Ch 6 In
11
Ch 7 In
13
Ch 8 In
15
Ch 9 In
17
Ch 10 In
19
Ch 11 In
21
Ch 12 In
23
12 Channel Mux
Processor
Module
PD PD PD PD PD PD PD PD PD PD PD PD
Backplane
EDFA
Facility: AMP port 26
Parameter: OPIN-OTS*
Parameter: OPOUT-OTS*
Power
Supply
Common Out 26
Drop Mon
EDFA
27
Common In 25
Ch 1 Out
2
Ch 2 Out
4
Ch 3 Out
6
Ch 4 Out
8
Ch 5 Out
10
Ch 6 Out
12
Ch 7 Out
14
Ch 8 Out
16
Ch 9 Out
18
Ch 10 Out
20
Ch 11 Out
22
Ch 12 Out
Facility: AMP port 25
Parameter: OPIN-OTS*
Parameter: OPOUT-OTS*
Facility: CHMON port 25, SDMON port 25,
NMCMON port 25
Parameter: OPT-OCH*
24
12 Channel Demux
PMs collected at all PD locations and Ch # Out ports
Facility: OPTMON port 1,3,5,...,21,23
Parameter: OPR-OTS*
* AVG, MIN, and MAX measurements also provided
Le gend
ED FA
PD
Erbium Doped Fiber Amplifier
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Photonic alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
Loopback Active - Facility
•
High Fiber Loss
•
Shutoff Threshold Crossed
•
Input Loss of Signal
•
Output Loss of Signal
•
Loss of Signal
•
Automatic Power reduction Active
•
Gauge Threshold Crossing Alert Summary
Common equipment alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to CCMD12 circuit packs (C-Band and
L-Band):
•
are single slot interfaces.
•
can be equipped in slots 1 to 14 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
CCMD12 C-Band can be equipped in slots 1 to 7 of the 7-slot optical shelf
(NTK503PAE5 or NTK503KA) only for the use in CDA solution (CCMD12
C-Band/ WSS Flex C-Band w/OPM 20x1). The CCMD12 C-Band is not
supported in other configurations in the 7-slot shelf (NTK503PAE5 or
NTK503KA).
•
CCMD12 L-Band can be equipped in slots 1 to 7 of the 7-slot optical shelf
(NTK503PAE5 or NTK503KA) only for the use in GMD10 solution
(CCMD12 L-Band/ GMD10 L-Band/ WSS Flex L-Band w/OPM 8x1). The
CCMD12 L-Band is not supported in other configurations in the 7-slot
shelf (NTK503PAE5 or NTK503KA).
•
CCMD12 C-Band can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA) only for the use in CDA solution
(CCMD12 C-Band/ WSS Flex C-Band w/OPM 20x1). The CCMD12
C-Band is not supported in other configurations in the 6500-7 shelf.
•
CCMD12 L-Band can be equipped in slots 1 to 8 of the 6500-7
packet-optical shelf (NTK503RA) only for the use in GMD10 solution
(CCMD12 L-Band/ GMD10 L-Band/ WSS Flex L-Band w/OPM 8x1). The
CCMD12 L-Band is not supported in other configurations in the 6500-7
shelf.
•
can be equipped in slots 1 and 2 of the NTK503LA variant of 2-slot shelf
for applications such as the 6500-Waveserver Flex-12 (50GHz)
configuration when the shelf is equipped with SPAP-2 w/2xOSC
(NTK555NA or NTK555NB)
•
require that the 6500 shelf is equipped with the SP-2 shelf processor
(NTK555CAE5, NTK555EAE5, or NTK555FAE5), otherwise the CCMD12
equipment does not provision.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
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The following restrictions on using a cross-connect circuit pack apply when
deploying a CCMD12 circuit pack (C-Band or L-Band):
•
the CCMD12 circuit packs (C-Band or L-Band) do not use any
cross-connect capacity and can be installed in shelves equipped with or
without cross-connect circuit packs
•
In a 14-slot shelf type, when the CCMD12 circuit packs (C-Band or
L-Band) are installed in slots 7 or 8, only Broadband circuit packs or
Photonic circuit packs can be provisioned in the other interface slots (slots
1 to 6 and 9 to14) as MSPP or PKT/OTN I/F interface circuit packs require
a cross-connect circuit pack. See Part 1 of 6500 Planning, NTRN10ED
(Shelf and equipment descriptions) for a full list of supported Broadband
and Photonic circuit packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CCMD12 (C-Band and L-Band) optical interface circuit
packs.
Table 1-75
Technical specifications for CCMD12 optical interface circuit packs (C-Band and L-Band)
Parameter
CCMD12 C-Band
(NTK508FAE5)
CCMD12 L-Band
(NTK508FL)
Weight (estimated)
1.8 kg (4.0 lb)
Power consumption
Typical (W): 17 (Note 1)
Power Budget (W): 25 (Note 2)
Connector type
Wavelength range (nm)
Drop EDFA gain
Drop EDFA design flat gain
LC-UPC
1528.77 to 1566.72 (96 channels 1569.80 to 1608.98 (93
capable)
channels capable)
17 dB to 23 dB (Note 3)
19.5 dB to 20.5 dB
Drop EDFA gain ripple
Drop EDFA total input power
Drop EDFA total output power
Drop EDFA noise figure
Add EDFA gain
Add EDFA design flat gain
Add EDFA gain ripple
1 dB
-15.5 dBm to -4.5 dBm
5 dBm to 15 dBm
4.5 dB to 4.8 dB
5.8 dB to 6.1 dB
17 dB to 23 dB (Note 3)
19.5 dB to 20.5 dB
0.5 dB
Add EDFA total input power
-25.5 dBm to -4 dBm
Add EDFA total output power
-5.5 dBm to 15 dBm
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Table 1-75
Technical specifications for CCMD12 optical interface circuit packs (C-Band and L-Band)
Parameter
CCMD12 C-Band
(NTK508FAE5)
CCMD12 L-Band
(NTK508FL)
Add EDFA noise figure
4.5 dB to 4.8 dB
1x12 split/combiner loss
11.2 dB to 13.4 dB
Tap loss for OPM
8 dB to 11 dB
Maximum total input power at Common In
port
24 dBm
Maximum total input power at Mux input
port
24 dBm
Maximum input power in any 50 GHz
channel passband
12 dBm
Note 1: The typical power consumption values are based on operation at an ambient temperature of 25
(+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of AC-powered
equipment. For practical purposes, the rounded typical power consumption of equipment can be used as
the equipment heat dissipation when calculating the facilities’ thermal loads (an estimate of the long term
heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage range
in the case of AC-powered equipment. These rounded power values must be used in sizing feeders and
estimating theoretical maximum power draw.
Note 3: Although the CCMD12 circuit pack can support different gains, the circuit pack is intended to be
operated at the design flat gain of 20 dB.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band
1xCXM) circuit pack (NTK508HA) and CCMD8x16 C-Band Expansion
Module (CXM C-Band Type 1) (NTK576BA)
Overview
The 8-Degree 16-Channel Colorless Mux/Demux (CCMD8x16 C-Band
1xCXM) circuit pack (also referred to as CCMD8x16) is a colorless 16 Mux/16
Demux-channel circuit pack used with up to 16 transponders being switched
to up to 8-degrees. The optical source from each transponder can be switched
to any of the 8-Degree’s and amplified on board the CCMD8x16 circuit pack
before connecting to a WSS circuit pack. The main fixed EDFA module on
CCMD8x16 circuit pack supports up to four degrees (4xMux + 4xDemux). A
pluggable EDFA CCMD8x16 C-Band Expansion Module (also referred to as
CXM C-Band Type 1) can be equipped in-service in a sub-slot of the
CCDM8x16 circuit pack for an additional four degrees to support up to eight
degrees in total. The CCMD8x16 circuit pack comes with a CCDM8x16
sub-slot filler panel/cover (410-5819-001) which must only be removed when
a CXM is equipped in the sub-slot. The CXM C-Band Type 1 module comes
with an optical patchcord, MPO(F)-MPO(F), APC, SM, riser, bend insensitive,
12 Fiber, Tx-Rx, 0.35 meterNTTC97AXV6.
Figure 1-104 on page 1-292 and Figure 1-105 on page 1-293 show the
faceplate of a CCMD8x16 circuit pack and Figure 1-106 on page 1-294
provides a functional block diagram of the CCMD8x16 circuit pack.
Figure 1-107 on page 1-295 shows the faceplate of a CXM C-Band Type 1
module and Figure 1-108 on page 1-296 provides a functional block diagram
of the CXM C-Band Type 1 module.
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Figure 1-104
CCMD8x16 circuit pack faceplate (with sub-slot filler panel/cover (410-5819-001) in place, without
CXM C-Band Type 1)
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Common A port
Upgrade CXM port
LC connections to/from
transponders
Yellow uni-color circle (LOS)
- Used to communicate Rx Loss
of Signal
- Yellow = Rx Loss of Signal
Sub-slot filler panel/cover
(410-5819-001)
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Figure 1-105
CCMD8x16 circuit pack faceplate (with CXM C-Band Type 1 in place)
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can
be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment
out-of-service = LED off
Common A port
Upgrade CXM port
LC connections to/from
transponders
Yellow uni-color circle (LOS)
- Used to communicate Rx Loss
of Signal
- Yellow = Rx Loss of Signal
Pluggable EDFA array
(CXM C-Band Type 1; NTK576BA)
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Legend
Figure 1-106
CCMD8x16 circuit pack block diagram (NTK508HA)
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Figure 1-107
CXM C-Band Type 1 module faceplate
Upgrade CCMD port
Common B port
Red triangle (Fail)
- Used to communicate hardware or software
failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software
functional state
- Card initializing = Blinking LED; Card OK = LED
on; Card not ready = LED off
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Figure 1-108
CXM C-Band Type 1 module block diagram (NTK576BA)
Legend
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Supported functionality
The CCMD8x16 circuit pack (NTK508HA) and CXM C-Band Type 1 modules
(NTK576BA) provide the following functionality:
•
CCMD8x16 circuit pack provides
— one fixed-module erbium-doped fiber amplifier (EDFA) array having
four Mux + four Demux amplifiers
— one fixed module multicast switch having 32x8-by-1 switches and
16x16-by-1 passive splitters
— Upgrade (UPG CXM) and Common A ports bundle related optical
signals in 12-fiber MPO connectors with Cable Trace for fiber
management simplification
— total power monitoring at both the input and output of EDFA
— a common port A to connect to the FIM Type 1 or FIM Type 2
— an upgrade port to connect to the upgrade port of a CXM C-Band Type
1 module
— total power monitoring at both input and output of channel ports
See Table 1-76 on page 1-298 for function and connector type for each
port on a CCMD8x16 circuit pack.
•
CXM C-Band Type 1 module provides
— one pluggable erbium-doped fiber amplifier (EDFA) array for providing
an extra four Mux + four Demux amplifiers to the host CCMD8x16
circuit pack
— two MPO connectors on the faceplate, one connects to the Multicast
Switch on the host CCMD8x16 circuit pack and the other connects to
the network
— total power taps on every fiber
— a common port B to connect to the FIM Type 1 or FIM Type 2
— an upgrade port to connect to the upgrade port of the host CCMD8x16
circuit pack
See Table 1-77 on page 1-299 for function and connector type for each
port on a CXM C-Band Type 1 module.
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Table 1-76
CCMD8x16 optical interfaces
Interface name
UPG CXM
Physical port #
34
Function
Connector type
Port used for MPO cable connection to the
upgrade CCMD port (UPG CCMD) of CXM
C-Band Type 1 module.
12-Fiber
MPO/APC Male
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
Common A
33
Port used for MPO cable connection to the
FIM Type 1 or FIM Type 2 module.
12-Fiber
MPO/APC Male
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
Channel 1 In / Out
1/2
Channel 2 In / Out
3/4
Channel 3 In / Out
5/6
Channel 4 In / Out
7/8
Channel 5 In / Out
9 / 10
Channel 6 In / Out
11 / 12
Channel 7 In / Out
13 / 14
Channel 8 In / Out
15 / 16
Channel 9 In / Out
17 / 18
Channel 10 In / Out
19 / 20
Channel 11 In / Out
21 / 22
Channel 12 In / Out
23 / 24
Channel 13 In / Out
25 / 26
Channel 14 In / Out
27 / 28
Channel 15 In / Out
29 / 30
Channel 16 In / Out
31 / 32
Optical input Mux/ output Demux to
transponder Tx/Rx
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Table 1-77
CXM C-Band Type 1 optical interfaces
Interface name
UPG CCMD
Physical port #
35
Function
Connector type
Port used for MPO cable connection to the
upgrade CXM port (UPG CXM) of host
CCMD8x16 circuit pack.
12-Fiber
MPO/APC Male
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
Common B
36
Port used for MPO cable connection to the
FIM Type 1 or FIM Type 2.
12-Fiber
MPO/APC Male
Use MPO(F)-MPO(F), APC, 12 Fiber, SM
fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
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Performance monitoring
The 6500 monitors and collects physical PMs for CCMD8x16 circuit pack and
CXM C-Band Type 1 module facilities. Table 1-78 provides a list of monitor
types supported on CCMD8x16 circuit packs and CXM C-Band Type 1
modules. Figure 1-109 on page 1-301 and Figure 1-110 on page 1-302 show
the CCMD8x16 circuit pack and CXM C-Band Type 1 module optical
monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-78
Monitor types table for CCMD8x16 circuit packs and CXM C-Band Type 1
modules
Monitor Type
Facility
OPTMON
Note
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
X
X
X
X
OPT-OTS
OPTMIN-OTS
OPTMAX-OTS
OPTAVG-OTS
X
X
X
X
AMP
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
Note: OPTMON facilities only apply to CCMD8x16 circuit packs.
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PD
PD
PD
PD
PD
PD
PD
CT Cable Trace
CXM C-Band Expansion Module
MCS Multi-Cast Switch
Legend
PD
PD
PD
PD
PD
PD
PD
PD
MPO Multi-fiber Push On
PD
Photodiode
UPG Upgrade Port
PD
CT
PMs collected at all PD locations
Facility: OPTMON port 1,3,5,7,...,25,27,29,31
Parameter: OPR-OTS*
Facility: OPTMON port 2,4,6,8,...,26,28,30,32
Parameter: OPT-OTS*
Facility: AMP port 33 (sub-ports 3 to 10)
Parameter: OPIN-OTS*
Facility: AMP port 33 (sub-ports 3 to 10)
CT
Parameter: OPOUT-OTS*
* AVG, MIN, and MAX measurements also provided.
Power
Supply
MCS Switch
PD
PD
PD
PD
PD
PD
PD
PD
Inventory
PD
PD
Processor
Module
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
Common A MPO 33
UPG CXM MPO
PD
PD
CXM Pluggable Module
PD
PD
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
Photonics equipment description 1-301
Figure 1-109
CCMD8x16 circuit pack optical monitoring points
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Backplane
1-302 Photonics equipment description
Figure 1-110
CXM C-Band Type 1 module optical monitoring points
UPG CCMD MPO 35
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
PD
Common B MPO 36
Inventory &
Control
PMs collected at all PD locations
Facility: AMP port 33,36 (sub-ports 3 to 10)
Parameter: OPIN-OTS*
Facility: AMP port 33,36 (sub-ports 3 to 10)
Parameter: OPOUT-OTS*
* AVG, MIN, and MAX measurements also provided.
Legend
CCMD
MPO
Colorless Channel Mux/Demux
Multi-fiber Push On
PD
UPG
Photodiode
Upgrade Port
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Intercard Suspected
•
Internal Mgmt Comms Suspected
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•
Cold Restart Required
•
Provisioning Incompatible
•
Database Not Recovered For Slot
•
Circuit Pack Upgrade Failed
Pluggable alarms
• Circuit Pack Missing - Pluggable
•
Circuit Pack Mismatch - Pluggable
•
Circuit Pack Failed - Pluggable
•
Autoprovisioning Mismatch - Pluggable
•
Intercard Suspected - Pluggable
•
Provisioning Incompatible - Pluggable
Photonic alarms
• Adjacency Far End Not Discovered
•
Adjacency Mismatch
•
Adjacency Provisioning Error
•
High Fiber Loss
•
High Optical Power
•
Shutoff Threshold Crossed
•
Input Loss of Signal
•
Output Loss of Signal
•
Loss of Signal
Common equipment alarms
• Software Auto-Upgrade in Progress
Equipping rules
The following equipping rules apply to CCMD8x16 circuit packs:
•
is a double-slot interface.
•
can be equipped in slots 1 to 13 (except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack). CCMD8x16 circuit pack cannot be placed in slot 14 since
CCMD8x16 circuit pack is a double-slot interface.
•
can be equipped in slots 1-7, 11-17, 21-27, and 31-37 of the 32-slot shelf.
The CCMD8x16 circuit pack cannot be placed in slots 8, 18, 28, or 38
since the CCMD8x16 circuit pack is a double-slot interface.
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•
can be equipped in slots 1 to 6 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA). The CCMD8x16 circuit pack cannot be placed in slot 7 since
the CCMD8x16 circuit pack is a double-slot interface.
•
can be equipped in slots 1 to 7 of the 6500-7 packet-optical shelf
(NTK503RA). The CCMD8x16 circuit pack cannot be placed in slot 8 since
the CCMD8x16 circuit pack is a double-slot interface.
•
cannot be equipped in the 2-slot shelf.
•
all equipment that is part of an OTS must be located within the same
physical shelf.
The following restrictions on using a cross-connect circuit pack apply when
deploying a CCMD8x16 circuit pack:
•
the CCMD8x16 circuit packs do not use any cross-connect capacity and
can be installed in shelves equipped with or without cross-connect circuit
packs
•
In a 14-slot shelf type, when the CCMD8x16 circuit packs are installed in
slots 7 or 8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to13) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CCMD8x16 optical interface circuit pack and CXM
C-Band Type 1 expansion module.
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Table 1-79
Technical specifications for CCMD8x16 optical interface circuit pack and CXM C-Band Type 1
module
Parameter
Weight (estimated)
CCMD8x16 (NTK508HA)
2.1 kg (4.7 lb)
CXM C-Band Type 1 (NTK576BA)
0.5 kg (1.1 lb)
Dimension:
• Height: 141 mm / 5.55 in
• Width: 24 mm / 0.94 in.
• Depth: 211 mm / 8.31 in. for CXM
modules (NTK576BA)
Depth: 15 mm / 0.59 in. for subslot
filler panel/cover (410-5819-001)
included with the CCMD8x16 circuit
pack (NTK508HA)
Typical (W): 34 (Note 1)
Typical (W): 9 (Note 1)
Power Budget (W): 41 (Note 2
(Note 3)
Power Budget (W): 13 (Note 2)
Connector type
12-Fiber MPO/APC Male, LC
12-Fiber MPO/APC Male
Wavelength range (nm)
1528.77 to 1566.72
(96 channels capable)
1528.77 to 1566.72
(96 channels capable)
Power consumption
Drop EDFA gain
18.5 dB to 21.5 dB (Note 4)
Drop EDFA design flat gain
18.5 dB to 21.5 dB
Drop EDFA gain ripple (Pk-Pk
C-Band)
1.0 dB
Drop EDFA total input power
-18 dBm to 2.5 dBm (typical)
-26 dBm to -18 dBm (extended)
Drop EDFA total output power
Drop EDFA noise figure
(typical range)
0.5 dBm to 21 dBm
Demux EDFA Gain = 20 dB to 12.8 dB, Pin = -18 dBm
Demux EDFA Gain = 20 dB to 12.0 dB, Pin = 0 dBm
Add EDFA gain
Add EDFA design flat gain
13.5 dB to 16.5 dB (Note 4)
13.5 dB to 16.5 dB
Add EDFA gain ripple (Pk-Pk
C-Band)
1.0 dB
Add EDFA total input power
-20 dBm to -0.5 dBm (typical)
-28 dBm to -20 dBm (extended)
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Table 1-79
Technical specifications for CCMD8x16 optical interface circuit pack and CXM C-Band Type 1
module
Parameter
CCMD8x16 (NTK508HA)
Add EDFA total output power
Add EDFA noise figure
CXM C-Band Type 1 (NTK576BA)
-5 dBm to 13 dBm
Mux EDFA Gain = 15 dB to 6.8 dB, Pin = -20 dBm
Mux EDFA Gain = 15 dB to 6.0 dB, Pin = -1 dBm
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: This circuit pack occupies two slots in the shelf and power is drawn from the right-most slot.
When equipped in a 14-slot packet-optical or 32-slot shelf, the shelf processor applies this circuit pack’s
entire power budget (including the power budget any equipped CXM) to the zone associated with the
left-most slot when computing the “Calculated shelf zone power” parameter even if the right-most slot
occupied by the circuit pack is in a different power zone.
Note 4: Although the CCMD8x16 circuit pack can support different gains, the circuit pack is intended
to be operated at the design flat gain of 15 dB in Mux direction and 20 dB in Demux direction.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Optical multiplexers (OMX) modules (NT0H32xxE5)
Overview
The optical multiplexer (OMX) can be used with the 6500 shelves and is a
stand-alone unit.
•
can be equipped with the 14-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the OMX modules are passive modules and therefore do not require DC
power.
•
although the OMX module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMX module's
RJ-45 port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the OMX module's RJ-45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMX module's RJ-45 port to the NTK505PAE5 access
panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMX module's
RJ-45 port to the NTK555NA or NTK555NB external slot ports).
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— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the OMX module's RJ-45 port to the NTK505JA access panel external
slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMX module's RJ-45 port to the access panel external
slot ports).
•
the OMX module must be located in the same bay as the access panel (in
6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
OMX module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly).
The following table shows the supported circuit packs and pluggables that can
be used with OMX.
Table 1-80
Supported circuit packs and pluggables working with OMX
Circuit pack or pluggable
PEC
Alarm
correlation
OC-192/STM-64 DWDM circuit pack
NTK526xxE5
NTK527xxE5
OTM1
Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503MAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (DC-powered)
Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503NAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (AC-powered)
OTN FLEX MOTR circuit pack
NTK532BAE5
OTM1
2.5G MOTR circuit pack
NTK530NAE5 OTM2
NTK530NCE5 OTM2
OTM1
2x10G OTR circuit pack
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Table 1-80
Supported circuit packs and pluggables working with OMX
Circuit pack or pluggable
PEC
Alarm
correlation
4x10G OTR circuit packs
NTK530QA
NTK530QE
NTK530QM
OTM2
SuperMux with XFP circuit pack
NTK535FAE5
OTM2
L2 MOTR circuit pack
NTK531VAE5
OTM2
40G OCLD circuit packs
NTK539PxE5
Wavelength-Selective 40G OCLD circuit pack
NTK539RxE5
OTM3 (Note
1)
100G OCLD circuit packs
NTK539TxE5
100G WL3/WL3e OCLD circuit packs
NTK539Ux
Flex2 WL3/WL3e OCLD circuit packs
NTK539Bx
Flex3 WL3e OCLD circuit packs
NTK539Qx
Flex4 WL3e OCLD circuit packs
NTK539Fx
100G WL3e OTR
NTK538Ux
100G WL3n MOTR
NTK538Bx
OTM4 (Note
2)
DWDM XFP modules (when equipped in the circuit packs listed above NTK588xxE5
provided the circuit pack supports the pluggable)
NTK587xxE5
NTK583AAE5
NTK589xxE5
N/A
DWDM SFP modules (when equipped in the circuit packs listed above NTK585xxE5
provided the circuit pack supports the pluggable)
NTK586xxE5
N/A
DWDM DPO modules
N/A
NTK580xxE5
Note 1: The client circuit pack that mates with 40G OCLD circuit pack can be 40G MUX OCI, 40G OCI,
or 40/43G OCI circuit pack.
Note 2: The client circuit pack that mates with 100G OCLD, 100G WL3 OCLD, Flex4 WL3e OCLD,
Flex3 WL3e OCLD, or Flex2 WL3/WL3e OCLD circuit pack can be 10x10G MUX or 100G OCI circuit
pack.
The 6500 supports two types of DWDM OMX:
•
OMX 4CH DWDM
•
OMX 16CH DWDM
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OMX 4CH DWDM
The OMX 4CH DWDM multiplexes and demultiplexes up to four optical
channels in one band.
Each OMX 4CH DWDM is a 1U high external drawer that contains optical
filters, a small patch panel with bulkhead connectors, and fiber management
components. The drawers can be mounted anywhere in a rack (see
“Configuration rules” section in Planning - Ordering Information,
323-1851-151). Each OMX 4CH DWDM uses bulkhead connectors and patch
cords to connect circuit packs. The OMX has locking latches to prevent trays
from being pulled out completely.
The following variants of the OMX 4CH DWDM are available:
•
200 GHz
— Standard OMX 4CH DWDM (NT0H32xE)
— OMX 4CH DWDM Enhanced (NT0H32xF) - provides higher isolation
and lower insertion loss
Note 1: 200 GHz C-band 4-CH OMX PECs are available for Bands 1, 2,
3 and 4. 200 GHz L-band 4-CH OMX PECs are available for Bands 5, 6,
7 and 8.
Note 2: The standard 4CH OMX modules (NT0H32xE) have been
manufacture discontinued and are no longer available. You must use the
enhanced variant (NT0H32xF). For replacement information, see
Planning - Ordering Information, 323-1851-151.
•
100 GHz
— OMX 4CH DWDM, odd (NT0H32xG)
— OMX 4CH DWDM, even (NT0H32xH)
The OMX 4CH DWDM assembly (NT0H32xE, NT0H32xF, NT0H32xG, and
NT0H32xH) has one filter module. The filter module adds and drops four
specific ITU DWDM channels and optically passes through all other ITU
DWDM channels supported by 6500 Packet-Optical Platform. See Planning Ordering Information, 323-1851-151 for different ordering codes.
Figure 1-111 on page 1-311 shows the OMX 4CH DWDM with the tray open.
The following figures show the block diagrams of OMX 4CH DWDM
equipment:
•
Figure 1-112 on page 1-312
•
Figure 1-113 on page 1-313
•
Figure 1-114 on page 1-314
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Figure 1-111
OMX 4CH DWDM equipment drawer
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Figure 1-112
OMX 4CH DWDM equipment block diagram (NT0H32xF)
Band ADF
11 THRU In
OTS Out 2
12 THRU Out
Band ADF
Channel MUX
Ch. Ch. Ch.
3
1
2
In
In
In
Ch.
4
In
5
9
3
7
Channel DEMUX
OTS In
Inventory
1
Equipment
inventory
(RJ-45)
Ch. Ch. Ch. Ch.
3
1
2
4
Out Out Out Out
4
6
8
10
Legend
ADF
OTS
Add/Drop filter
Optical trunk switch
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Figure 1-113
OMX 4CH DWDM equipment block diagram (100 GHz Odd; NT0H32xG)
Band ADF
11 THRU In
OTS Out 2
12 THRU Out
Band ADF
OTS In
1
Band Drop/Rx
Band Add/Tx
Inventory
Channel MUX/DEMUX
Ch. 7
9
10
Ch. 3
5
6
Ch. 5
Ch. 1
7
3
8
Equipment
inventory
(RJ-45)
4
Legend
ADF
Add/Drop filter
OTS
Optical trunk switch
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Figure 1-114
OMX 4CH DWDM equipment block diagram (100 GHz Even; NT0H32xH)
Band ADF
11 THRU In
OTS Out 2
12 THRU Out
Band ADF
OTS In
1
Band Add/Tx
Band Add/Tx
Inventory
Channel MUX/DEMUX
Ch. 8
9
10
Ch. 2
3
Ch. 6
Ch. 4
7
5
4
8
Equipment
inventory
(RJ-45)
6
Legend
ADF
Add/Drop filter
OTS
Optical trunk switch
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OMX 4CH DWDM features
All variants of OMX 4CH DWDM have the following common features.
•
Each OMX multiplexes and demultiplexes four channels.
•
An OMX can add and drop up to four optical channels in a band.
•
An OMX cannot add or drop optical channels that are outside the band
assigned to it. It also cannot bypass optical channels within the band
assigned to it.
•
An OMX can pass through all channels that are not in band.
•
The band add-drop filters (ADF) add and drop one wavelength band and
allows the other bands to pass through the filters. The channel multiplexer
and demultiplexer add and drop the optical channels, respectively.
The distinguishing features of the OMX 4CH DWDM 100 GHz are as follows:
•
The Optical Multiplexer 4CH (OMX 4CH) multiplexes and demultiplexes up
to four channels to support 32 channels in the C-band.
•
The physical design of the OMX 4CH DWDM 100 GHz module is the same
as the original OMX 4CH DWDM Enhanced variants.
•
The OMX 4CH 100 GHz supports 32 channels in the C-band.
•
The filter module adds and drops four specific ITU DWDM channels and
optically passes through all other ITU DWDM channels supported by 6500
Packet-Optical Platform.
•
The OMX 4CH 100 GHz modules are supported in linear and ring
systems. These passive OADM modules provide add, drop and
passthrough capabilities which allow support of hubbed, dual-hubbed,
and meshed traffic, in addition to point-to-point traffic.
•
100 GHz Bands and 200 GHz Bands can be deployed using both the older
and newer OMXs on the same unamplified optical layer. However, if a
band is designated as 100 GHz, all OMX modules on that band must be
an OMX 4CH DWDM 100 GHz module.
•
The OMX 4CH modules use SC connectors for installing fiber-optic patch
cords.
•
offers 32 channels Mux/Demux at 100 GHz grid listed in Table 1-81 on
page 1-316
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Table 1-81
OMX 4CH 100 GHz ITU grid 32 wavelength plan
Port name
Port#
B/C
Wavelength 100 GHz (nm)
B/C
Wavelength 100 GHz (nm)
In Out
OTS
1
2
Thru
11 12
NT0H32AGE5
NT0H32AHE5
Band 1 Odd
Band 1 Even
Ch-1
3
4
B1C1
1528.77
B1C2
1533.47
Ch-2
5
6
B1C3
1530.33
B1C4
1531.90
Ch-3
7
8
B1C5
1529.55
B1C6
1532.68
Ch-4
9
10
B1C7
1531.12
B1C8
1534.25
NT0H32BGE5
NT0H32BHE5
Band 2 Odd
Band 2 Even
Ch-1
3
4
B2C1
1538.19
B2C2
1542.94
Ch-2
5
6
B2C3
1539.77
B2C4
1541.35
Ch-3
7
8
B2C5
1538.98
B2C6
1542.14
Ch-4
9
10
B2C7
1540.56
B2C8
1543.73
NT0H32CGE5
NT0H32CHE5
Band 3 Odd
Band 3 Even
Ch-1
3
4
B3C1
1547.72
B3C2
1552.52
Ch-2
5
6
B3C3
1549.32
B3C4
1550.92
Ch-3
7
8
B3C5
1548.51
B3C6
1551.72
Ch-4
9
10
B3C7
1550.12
B3C8
1553.33
NT0H32DGE5
NT0H32DHE5
Band 4 Odd
Band 4 Even
Ch-1
3
4
B4C1
1557.36
B4C2
1562.23
Ch-2
5
6
B4C3
1558.98
B4C4
1560.61
Ch-3
7
8
B4C5
1558.17
B4C6
1561.42
Ch-4
9
10
B4C7
1559.79
B4C8
1563.05
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•
offers 32 channels Mux/Demux at 200 GHz grid listed in Table 1-82
Table 1-82
OMX 4CH 200 GHz ITU grid 32 wavelength plan
Port name
Port#
B/C
Wavelength 200 GHz (nm)
B/C
Wavelength 200 GHz (nm)
In Out
OTS
1
2
Thru
11 12
NT0H32AFE5
NT0H32BFE5
Band 1
Band 2
Ch-1
3
4
B1C1
1528.77
B2C1
1538.19
Ch-2
5
6
B1C2
1533.47
B2C2
1542.94
Ch-3
7
8
B1C3
1530.33
B2C3
1539.77
Ch-4
9
10
B1C4
1531.90
B2C4
1541.35
NT0H32CFE5
NT0H32DFE5
Band 3
Band 4
Ch-1
3
4
B3C1
1547.72
B4C1
1557.36
Ch-2
5
6
B3C2
1552.52
B4C2
1562.23
Ch-3
7
8
B3C3
1549.32
B4C3
1558.98
Ch-4
9
10
B3C4
1550.92
B4C4
1560.61
NT0H32EFE5
NT0H32FFE5
Band 5
Band 6
Ch-1
3
4
B5C1
1570.42
B6C1
1580.35
Ch-2
5
6
B5C2
1575.37
B6C2
1585.36
Ch-3
7
8
B5C3
1572.06
B6C3
1582.02
Ch-4
9
10
B5C4
1573.71
B6C4
1583.69
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Table 1-82
OMX 4CH 200 GHz ITU grid 32 wavelength plan
Port name
Port#
B/C
Wavelength 200 GHz (nm)
B/C
Wavelength 200 GHz (nm)
NT0H32GFE5
NT0H32HFE5
Band 7
Band 8
Ch-1
3
4
B7C1
1590.41
B8C1
1600.60
Ch-2
5
6
B7C2
1595.49
B8C2
1605.74
Ch-3
7
8
B7C3
1592.10
B8C3
1602.31
Ch-4
9
10
B7C4
1593.79
B8C4
1604.03
OMX 16CH DWDM
The OMX 16CH DWDM multiplexes and demultiplexes up to 16 optical
channels. Each OMX 16CH DWDM is a 2U high passive shelf that can be
mounted anywhere in a rack. The OMX 16CH DWDM module minimizes
overall insertion loss for 32-wavelength DWDM applications while maximizing
the reach of unamplified point-to-point systems. The OMX 16CH DWDM
module also reduces footprint requirements at terminal sites.
The following variants of the OMX 16CH DWDM are available:
•
standard 200 GHz OMX 16CH DWDM (NT0H32JA and NT0H32KA)
The OMX 16CH DWDM 200 GHz is a stand-alone unit that multiplexes
and demultiplexes up to 16 channels. Two variants are available: C-band
for DWDM bands 1, 2, 3, and 4, and L-band for DWDM bands 5, 6, 7, and
8.
•
100 GHz OMX 16CH DWDM (NT0H32JB and NT0H32JC)
The OMX 16CH DWDM 100 GHz is a stand-alone unit that multiplexes
and demultiplexes up to 16 channels. Two C-band variants are available:
band 1 and 2, band 3 and 4.
The following figures show the block diagrams of OMX 16CH DWDM
equipment:
•
Figure 1-115 on page 1-319
•
Figure 1-116 on page 1-320
•
Figure 1-117 on page 1-321
•
Figure 1-118 on page 1-322
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Figure 1-115
OMX 16CH DWDM equipment block diagram (C-band; NT0H32JA)
C/L Band
filter
C/L Band
filter
1 OTS In
OTS Out 2
L-band
Upgrade 35
In
L-band
36 Upgrade
Out
Inventory
Add filter
Drop filter
Band 1
Band 2
Band 3
Equipment
inventory
(RJ-45)
Band 4
Band 1
Band 2
Band 3
Band 4
4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33
Legend
OTS
Optical trunk switch
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Figure 1-116
OMX 16CH DWDM equipment block diagram (L-band; NT0H32KA)
1
OTS In
OTS Out 2
Inventory
Add filter
Drop filter
Band 1
Band 2
Band 3
Equipment
inventory
(RJ-45)
Band 4
Band 1
Band 2
Band 3
Band 4
4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33
Legend
OTS
Optical trunk switch
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Figure 1-117
OMX 16CH DWDM equipment block diagram (100 GHz Band 1 and 2; NT0H32JB)
Band 1 & 2
Drop filter
OTS In
Band 1 & 2
Add filter
1
OTS Out 2
C-band (3-4)/
L-band (5-8)/ 35
Thru In
C-band (3-4)/
36 L-band (5-8)/
Thru Out
Inventory
Add filter
Drop filter
Band 1
Equipment
inventory
(RJ-45)
Band 2
Band 1
Band 2
4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33
Legend
OTS
Optical trunk switch
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Figure 1-118
OMX 16CH DWDM equipment block diagram (100 GHz Band 3 and 4; NT0H32JC)
Band 3 & 4
Drop filter
Band 3 & 4
Add filter
1
OTS In
OTS Out 2
C-band (1-2)/
L-band (5-8)/ 35
Thru In
C-band (1-2)/
36 L-band (5-8)/
Thru Out
Equipment
inventory
(RJ-45)
Inventory
Add filter
Drop filter
Band 3
Band 4
Band 3
Band 4
4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33
Legend
OTS
Optical trunk switch
OMX 16CH DWDM features
The distinguishing features of the OMX 16CH DWDM are as follows:
•
The physical design of the OMX 16CH DWDM minimizes the module size
through the use of slider adapter on the faceplate. Each slider adapter
contains either two dual LC adapters or two single SC adapters.
Note: By using the slider adapter, you can clean back-side fibers without
the need for sliding drawers or fiber patch cord blocks inside the chassis.
The slider adapters increase connector density on the faceplate and
reduce the risk of accidental fiber pinching.
•
The OMX 16CH DWDM module permits in-service channel addition and
removal without the need to disable line-side traffic. If you plan to fully fill
your 6500 DWDM system with 32 channels, you must deploy the OMX
16CH DWDM C-band module prior to adding the L-band module.
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•
The C-band OMX 16CH DWDM 200 GHz has a total of 36 optical ports:
— 16 channel add and drop ports (32 LC-LC ports)
— OTS IN and OTS OUT ports (2 SC-SC ports)
— L-band OUT and L-band IN upgrade ports (2 SC-SC ports)
Note: The L-band upgrade ports on the C-band OMX 16CH DWDM
module eliminate the need for C and L splitter/coupler trays.
•
The L-band OMX 16CH DWDM 200 GHz has a total of 34 optical ports:
— 16 channel add and drop ports (32 LC-LC ports)
— OTS IN and OTS OUT ports (2 SC-SC ports)
Note 1: Direct padding on the LC-LC slider adapters is supported using
LC-LC attenuators. You must place LC-LC attenuators in the OMX 16CH
DWDM between the slider adapters and the internal fibers. You cannot
place the LC-LC attenuators between the slider adapters and the client
fibers. Direct padding using SC-SC attenuators is not supported on the
OMX 16CH DWDM.
Note 2: Fiber management is not provided in the OMX 16CH DWDM
chassis. The Fiber Manager tray (NT0H57BB) can be used for fiber
management, if required.
The distinguishing features of the OMX 16CH DWDM 100 GHz are as follows:
•
The OMX 16CH DWDM 100 GHz supports 32 channels in the C-band.
•
The physical design of the OMX 16CH DWDM 100 GHz module is the
same as the 200 GHz variants (NT0H32JA and NT0H32KA).
•
The C/L splitter and coupler components are integrated into the C-band
OMX 16CH DWDM 100 GHz module. The C and L splitter/coupler inside
the C-band OMX 16CH DWDM 100 GHz module does not support any
faceplate accessible monitoring taps and has a lower isolation in order to
reduce the insertion loss. Direct optical monitoring of the line-side fibers
(OTS IN and OTS OUT) is supported with the OSC Splitter/Coupler.
•
The OMX 16CH DWDM 100 GHz supports THRU IN and THRU OUT
functions.
•
The OMX 16CH DWDM 100 GHz C-band has a Thru In port and a Thru
Out port, eliminating the need for C and L splitter/coupler trays. These
Thru ports support L-band signals as well as the other C-band signals
(OMX 16CH DWDM 100 GHz Band 1 and Band 2 supports Band 3,
Band 4, and L-band signals on Thru ports. OMX 16CH DWDM 100 GHz
Band 3 and Band 4 supports Band 1, Band 2, and L-band signals on Thru
ports). The OMX 16CH DWDM 100 GHz also supports optical Pass-Thru.
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•
Like the 200 GHz variants, the OMX 16CH DWDM 100 GHz module is
typically deployed at terminal sites in point-to-point networks or at the hub
of a ring network. In unamplified networks, the OMX 16CH DWDM 100
GHz module permits in-service channel addition and removal without the
need to disable line-side traffic.
•
To fully fill 6500 systems with 32 channels, it is possible to deploy either
100 GHz bands (C-band only) or 200 GHz bands (C-band and L-band). It
is also possible to deploy both 100 GHz bands using the newer OMXs in
the C-band and 200 GHz bands using the older OMXs in L-band on the
same optical layer bringing the total number of channels in the system to
48 channels. For the OMX 16CH DWDM 100 GHz, if a band is designated
as 100 GHz, then this band together with its adjacent band (band 1 is
adjacent to band 2 and band 3 is adjacent to band 4 due to hardware) will
also be designated as a 100 GHz band.
•
100 GHz Bands and 200 GHz Bands can be deployed using both the older
and newer OMXs on the same unamplified optical layer. However, if a
band is designated as 100 GHz, all OMX modules on that band must be
an OMX 16CH DWDM 100 GHz module.
•
The OMX 16CH DWDM 100 GHz module permits in-service channel
addition and removal without the need to disable line-side traffic. If you
plan to fully fill your 6500 DWDM system with 48 channels, you must
deploy the OMX 16CH DWDM 100 GHz C-band module prior to adding
the L-band module.
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•
offers 32 channels Mux/Demux at 100 GHz grid listed in Table 1-83
Table 1-83
OMX 4CH 100 GHz ITU grid 32 wavelength plan
Port name
Port#
B/C
Wavelength 100 GHz (nm)
B/C
Wavelength 100 GHz (nm)
In Out
OTS
1
2
Thru
35 36
NT0H32JBE5
NT0H32JCE5
Band 1 and Band 2
Band 3 and Band 4
Ch-1
3
4
B1C1
1528.77
B3C1
1547.72
Ch-2
5
6
B1C2
1533.47
B3C2
1552.52
Ch-3
7
8
B1C3
1530.33
B3C3
1549.32
Ch-4
9
10
B1C4
1531.90
B3C4
1550.92
Ch-5
11 12
B1C5
1529.55
B3C5
1548.52
Ch-6
13 14
B1C6
1532.68
B3C6
1551.72
Ch-7
15 16
B1C7
1531.12
B3C7
1550.12
Ch-8
17 18
B1C8
1534.25
B3C8
1553.33
Ch-9
19 20
B2C1
1538.19
B4C1
1557.36
Ch-10
21 22
B2C2
1542.94
B4C2
1562.23
Ch-11
23 24
B2C3
1539.77
B4C3
1558.98
Ch-12
25 26
B2C4
1541.35
B4C4
1560.61
Ch-13
27 28
B2C5
1538.98
B4C5
1558.17
Ch-14
29 30
B2C6
1542.14
B4C6
1561.42
Ch-15
31 32
B2C7
1540.56
B4C7
1559.79
Ch-16
33 34
B2C8
1543.73
B4C8
1563.05
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•
offers 32 channels Mux/Demux at 200 GHz grid listed in Table 1-84
Table 1-84
OMX 4CH 200 GHz ITU grid 32 wavelength plan
Port name
Port#
B/C
Wavelength 200 GHz (nm)
B/C
Wavelength 200 GHz (nm)
In Out
OTS
1
2
Thru
35 36
NT0H32JAE5
NT0H32KAE5
C-band
L-band
Ch-1
3
4
B1C1
1528.77
B5C1
1570.42
Ch-2
5
6
B1C2
1533.47
B5C2
1575.37
Ch-3
7
8
B1C3
1530.33
B5C3
1572.06
Ch-4
9
10
B1C4
1531.90
B5C4
1573.71
Ch-5
11 12
B2C1
1538.19
B6C1
1580.35
Ch-6
13 14
B2C2
1542.94
B6C2
1585.36
Ch-7
15 16
B2C3
1539.77
B6C3
1582.02
Ch-8
17 18
B2C4
1541.35
B6C4
1583.69
Ch-9
19 20
B3C1
1547.72
B7C1
1590.41
Ch-10
21 22
B3C2
1552.52
B7C2
1595.49
Ch-11
23 24
B3C3
1549.32
B7C3
1592.10
Ch-12
25 26
B3C4
1550.92
B7C4
1593.79
Ch-13
27 28
B4C1
1557.36
B8C1
1600.60
Ch-14
29 30
B4C2
1562.23
B8C2
1605.74
Ch-15
31 32
B4C3
1558.98
B8C3
1602.31
Ch-16
33 34
B4C4
1560.61
B8C4
1604.03
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Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Duplicate Adjacency Discovered
•
Group Loss of Signal
•
Loss of Signal
Equipping rules
The OMX is external equipment.
Technical specifications
The following table lists the physical specifications for OMX.
Table 1-85
Physical specifications for OMX
Equipment
Physical
specification
Notes
Power
Typical (W)
Power
Budget (W)
0
0
0
0
OMX 4CH DWDM modules
Height
Width
1U (43 mm / 1.70 in.) The width specified is with the
mounting brackets installed.
443.0 mm / 17.44 in.
Depth
279.0 mm / 11 in.
OMX 16CH DWDM modules
Height
2U (88.0 mm / 3.48
in.)
Width
448.8 mm / 17.67 in. 448.8 mm / 17.67 in. with a
437.1 mm /17.21 in. setback from front to mounting
flange equal to 35.6 mm (1.4 in.),
279.0 mm / 11 in.
127 mm (5.0 in.), or 152.4 mm
(6.0 in.).
Depth
The width specified is with the
mounting brackets installed.
437.1 mm / 17.21 in. with a
setback from front to mounting
flange equal to 165.1 mm (6.5
in.).
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The following table lists the optical specifications for the OMX 4CH modules.
Table 1-86
OMX 4CH DWDM specifications
Characteristic
Value or range
4 CH + Fiber Manager
4 CH Enhanced
4CH 100 GHz
Maximum total input
power
17 dBm
17 dBm
24 dBm
Minimum return loss
40 dB
45 dB
45 dB
Passband
Center wavelength ± 0.25 nm (see Table 1-88)
Center wavelength ±
0.1 nm (see Table
1-89)
Drop
20 dB
35 dB
25 dB
Thru Out
12 dB
20 dB
14 dB
Minimum band isolation
Insertion loss
Maximum
Typical
Maximum Typical Maximum Typical
Add path
4.5 dB
3.2 dB
2.8 dB
2.1 dB
3.3 dB
2.1 dB
Drop path
4.9 dB
3.5 dB
3.1 dB
2.4 dB
3.6 dB
2.4 dB
Pass-through 1.2 dB
0.7 dB
1.0 dB
0.7 dB
1.1 dB
0.7 dB
Note: For single-shelf OADM sites with a standard OMX (where the THRU OUT is wired to the
THRU IN of the same OMX), one connector is saved between the two band filters. Because the
values in this table include the most common connector losses (typical is 0.2 dB, worst case is 0.3
dB), you must subtract the value of one connector from the table values. For example, the typical
OMX pass-through losses for a single-shelf OADM site are:
0.7 dB x 2 (standard pass-through losses, including connectors) – 0.2 dB (one less connector) =
1.2 dB (total OMX pass-through losses).
This rule does not apply to single-shelf sites with the OMX + Fiber Manager 4CH or OMX 4CH
Enhanced.
The following table lists the optical specifications for the OMX 16CH modules.
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Table 1-87
OMX 16CH DWDM specifications
Value or range
Characteristic
OMX 16CH DWDM
C-band
OMX 16CH DWDM
L-band
OMX 16CH DWDM
100 GHz C-band
Maximum total input power
21 dBm
21 dBm
24 dBm
Minimum return loss
40 dB
40 dB
40 dB
Passband
Center wavelength
± 0.25 nm
(see Table 1-88)
Center wavelength
± 0.25 nm
(see Table 1-88)
Center wavelength
± 0.1 nm
(see Table 1-89)
Minimum Channel Add
isolation and Drop
30 dB
30 dB
25 dB
THRU In and Out 18 dB
18 dB
15 dB
Insertion
loss
Maximum Typical
Maximum
Typical
Maximum
Typical
Add path
4.5 dB
3.9 dB
4.1 dB
3.5 dB
5.1 dB
3.6 dB
Drop path
4.5 dB
3.9 dB
4.1 dB
3.5 dB
5.1 dB
3.5 dB
L-band upgrade: 1.1 dB
OTS IN to L OUT
L IN to OTS OUT
0.8 dB
Not
applicable
Not
Not
applicable applicable
Not
applicable
Pass-THRU
Not
Not
Not
applicable applicable applicable
Not
1.2 dB
applicable
0.8 dB
Add and Drop
(16 channel
C-band or
L-band only,
end-to-end)
6.9 dB
5.0 dB
5.7 dB
Add and Drop
(32 channel
C-band only,
end-to-end)
Not
Not
Not
applicable applicable applicable
Not
10.2 dB
applicable
6.8 dB
Add and Drop
(32 channel [16
channel C-band
and 16 channel
L-band],
end-to-end)
6.9 dB
6.6 dB
6.4 dB
Add and Drop
(48 channel,
end-to-end)
Not
Not
Not
applicable applicable applicable
5.7 dB
5.7 dB
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6.0 dB
8.2 dB
7.8 dB
8.5 dB
Not
10.9 dB
applicable
7.8 dB
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Center wavelength frequencies
The following table lists the DWDM-6500 200 GHz center wavelengths.
Table 1-88
ITU-T DWDM grid wavelengths for 200 GHz OMXs used on 6500
OMX Band
C-band
L-band
Center wavelength
Channel 1
Channel 2
Channel 3
Channel 4
1
1528.77 nm
1533.47 nm
1530.33 nm
1531.90 nm
2
1538.19 nm
1542.94 nm
1539.77 nm
1541.35 nm
3
1547.72 nm
1552.52 nm
1549.32 nm
1550.92 nm
4
1557.36 nm
1562.23 nm
1558.98 nm
1560.61 nm
5
1570.42 nm
1575.37 nm
1572.06 nm
1573.71 nm
6
1580.35 nm
1585.36 nm
1582.02 nm
1583.69 nm
7
1590.41 nm
1595.49 nm
1592.10 nm
1593.79 nm
8
1600.60 nm
1605.73 nm
1602.31 nm
1604.03 nm
The following table lists the DWDM-6500 100 GHz center wavelengths of each
band and channel in a 6500 DWDM system.
Table 1-89
ITU-T DWDM grid wavelengths for 100 GHz OMXs used on 6500
OMX
Band
C-band
Center wavelength (nm)
Channel Channel Channel Channel Channel Channel Channel Channel
1
2
3
4
5
6
7
8
1
1528.77 1533.47 1530.33 1531.90 1529.55 1532.68 1531.12 1534.25
2
1538.19 1542.94 1539.77 1541.35 1538.98 1542.14 1540.56 1543.73
3
1547.72 1552.52 1549.32 1550.92 1548.51 1551.72 1550.12 1553.33
4
1557.36 1562.23 1558.98 1560.61 1558.17 1561.42 1559.79 1563.05
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OMX engineering rules
DWDM circuit packs, DWDM XFP, SFP, and DPO modules must be used with
a specific OMX module. See Planning - Ordering Information, 323-1851-151
(Circuit packs, modules, pluggable modules, and interface hardware) for
wavelengths, band, and channel number details.
The OMX module is a passive optical multiplexer and does not regenerate or
amplify signals. Optical reach between 6500 shelves is dependent on the
number of intermediate OMX modules. DWDM OMX modules introduce some
signal loss when a wavelength is added or dropped, and cascaded OMX
modules of different DWDM bands introduce pass-through signal loss.
Optical link budgets
Link budgets are specified for typical conditions and apply to all optical fiber
types (NDSF). Repair margin or connector losses at a fiber distribution frame
are not included and should be allocated as required. The recommended
repair margin is 10% of the total fiber plant loss for each site-to-site fiber span.
Link budgets are accurate for operating temperatures between 0oC and 40oC
(32oF to 104oF).
The link budgets for unamplified networks are based on power calculations for
each band.
The optical link budget specifies the typical loss supported for a connection
between the point where it originates and the point where it terminates. The
link budgets are calculated by adding the loss for each individual fiber sections
between the two ends of a connection. The loss must be calculated for each
band because the various bands are subject to different attenuation
depending on the path and the number of network elements that it passes
through.
The link budgets listed are based on NDSF optical fiber.
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Calculating the link budget - OMX 4CH
Link budgets are calculated for every band for both directions, from each shelf
on a particular band in a site to an adjacent site that contains a shelf with the
same band.
To calculate the link budget, you must determine the number and type of
OMXs that any one band must pass through to establish its connection.
See Figure 1-119 on page 1-333 for loss for one band in an add/drop
configuration. See Table 1-90 for loss details for this configuration.
Table 1-90
Loss summary—OMX 4CH
Parameter
Loss (dB)
Add loss
(Note 1)
3.2 dB typical (standard OMX)
2.1 dB typical (enhanced OMX)
2.1 dB typical (100 GHz OMX)
Drop loss
(Note 1)
3.5 dB typical (standard OMX)
2.4 dB typical (enhanced OMX)
2.4 dB typical (100 GHz OMX)
Connector loss
(Note 1)
0.3 dB
Pass-through loss
(Note 1)
1.2 dB typical (standard OMX)
1.0 dB typical (enhanced OMX)
1.1 dB typical (100 GHz OMX)
Seam add/drop values
0.5 dB for each band
Fiber loss
(Note 1)
Fiber loss with additional 0.5 dB for connectors/splice
or other interconnection loss
Transmit power
(Note 2)
+2.6 dBm to +4.2 dBm (OC-192/STM-64 DWDM)
+2.6 dBm to +4.2 dBm (OC-48/STM-16 DPO DWDM)
0.0 dBm to +4.0 dBm (OC-48/STM-16 SFP DWDM)
Receiver sensitivity
(includes path penalty)
(Note 2)
-23 dBm (OC-192/STM-64 DWDM)
-26 dBm (OC-48/STM-16 DPO DWDM)
-26 dBm (OC-48/STM-16 SFP DWDM)
Note 1: All loss figures quoted include connector losses.
Note 2: These are typical values for the mentioned circuit packs. However, refer
to Part 3 of 6500 Planning, NTRN10ED (Technical specifications) to find out
exact values for each circuit pack.
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For receive powers greater than -8 dBm (OC-192/STM-64 DWDM), -9 dBm
(OC-48/STM-16 DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM),
there must be sufficient attenuation in the fiber path so that the overload
requirement of -8 dBm (OC-192/STM-64 DWDM), -9 dBm (OC-48/STM-16
DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM) is not exceeded.
Note: These are typical values for the mentioned circuit packs. However,
refer to Part 3 of 6500 Planning, NTRN10ED (Technical specifications) to
find out exact values for each circuit pack.
Figure 1-119
Optical loss in an add/drop configuration
Drop OMX
Add OMX
Pass-through
loss 1.4 dB
Band 1-4 in
Drop loss
3.5 dB (Std)
2.4 dB (Enh)
2.4 dB (100 GHz)
Bands 2-4 through
Patch panel
Patch panel
Patch loss
0.4 dB
Band 1-4 through
Add loss
3.2 dB (Std)
2.1 dB (Enh)
2.1 dB (100 GHz)
Patch loss
0.4 dB
Band 1 drop
Band 1 add
Link budgets for a hubbed-ring OMX 4CH only configuration
To calculate the link budgets, you must calculate the OMX losses for each
band in each direction. For a three band unamplified hubbed-ring
configuration shown in Figure 1-120 on page 1-334, the losses in the OMXs
for band 1 in the east-bound and west-bound directions are as follows:
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Figure 1-120
Physical connections in a hubbed-ring configuration—OMX 4CH only
Terminal site A
OMX OMX OMX
1
2
3
OADM site B
OADM site C
OMX
1
OMX
3
OMX
2
The following calculations use typical loss figures for the OMXs and standard
fibering (see “OMX fibering” on page 1-344).
•
East-bound
— Losses at Terminal Site A
–
Add losses: 1 x 3.2 dB (Std) or 1 x 2.1 dB (Enh or 100 GHz OMX)
–
Pass-through losses: 2 x 0.7 dB (as band 1 passes through the
filters of OMX for band 2 and 3)
–
Patch losses: 0.4 dB
–
Total: 5 dB (Std) or 3.9 dB (Enh or 100 GHz OMX)
— Losses at OADM Site B
–
Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh or 100 GHz OMX)
–
Patch losses: 0.4 dB
–
Total: 3.9 dB (Std) or 2.8 dB (Enh or 100 GHz OMX)
— Total for band 1 east-bound: 8.9 dB (Std) or 6.7 dB (Enh or 100 GHz
OMX)
•
West-bound
— Losses at Terminal Site A
–
Add losses: 1 x 3.2 dB (Std) or 1 x 2.1 dB (Enh or 100 GHz OMX)
–
Pass-through losses: 0 dB (as band 1 does not pass through the
filters of OMX for band 2 and 3)
–
Patch losses: 0.4 dB
–
Total: 3.6 dB (Std) or 2.5 dB (Enh or 100 GHz OMX)
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— Losses at OADM Site C
–
Pass-through losses: 2 x 0.7 dB
–
Total: 1.4 dB (Std) or 1.4 dB (Enh or 100 GHz OMX)
— Losses at OADM Site B
–
Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh or 100 GHz OMX)
–
Pass-through losses: 1 x 0.7 dB
–
Patch losses: 0.4 dB
–
Total: 4.6 dB (Std) or 3.5 dB (Enh or 100 GHz OMX)
— Total for band 1 west-bound: 9.6 dB (Std) or 7.4 dB (Enh or 100 GHz
OMX)
You must also calculate the OMX losses the band 2 and 3 west-bound. For the
three band unamplified hubbed-ring configuration in Figure 1-120 on page
1-334, each band has a maximum of three path-through losses (same as
band 1 west-bound) so the OMX losses for the band 1 west-bound are used
for the following estimates.
The band link budget for a three band unamplified hubbed-ring configuration
in Figure 1-120 on page 1-334 is therefore:
•
Tx power - Rx power - OMX losses
— OC-48/STM-16 DPO DWDM
–
+2.6 dBm - -26 dBm - 9.6 dB (Std OMX) = 19.0 dB
–
+2.6 dBm - -26 dBm - 7.4 dB (Enh or 100 GHz OMX) = 21.2 dB
— OC-48/STM-16 SFP DWDM
–
0.0 dBm - -26 dBm - 9.6 dB (Std OMX) = 16.4 dB
–
0.0 dBm - -26 dBm - 7.4 dB (Enh or 100 GHz OMX) = 18.6 dB
— OC-192/STM-48 DWDM
–
+2.6 dBm - -23 dBm - 9.6 dB (Std OMX) = 16.0 dB
–
+2.6 dBm - -23 dBm - 7.4 dB (Enh or 100 GHz OMX) = 18.2 dB
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See Table 1-91 for link budget estimates of other hub-based configurations.
The span length is based on 0.3 dB/km loss.
Table 1-91
Estimates of link budgets for hub-based configurations
Number Number Power budget (dB)
of
of
bands
channels
Furthest For equally spaced sites
add/drop
Total
Distance
span
circumference
between
(km)
(km) (Note)
remotes
(km)
1
21.8 (OC-48/STM-16 DPO) & Std OMX
73
145
73
24.0 (OC-48/STM-16 DPO) & Enh/100 GHz
OMX
80
160
80
19.2 (OC-48/STM-16 SFP) & Std OMX
64
128
64
21.4 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 71
143
71
18.8 (OC-192/STM-64) & Std OMX
63
125
63
21.0 (OC-192/STM-64) & Enh/100 GHz OMX
70
140
70
20.4 (OC-48/STM-16 DPO) & Std OMX
68
102
34
22.6 (OC-48/STM-16 DPO) & Enh/100 GHz
OMX
75
113
38
17.8 (OC-48/STM-16 SFP) & Std OMX
59
89
30
20.0 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 67
100
33
17.4 (OC-192/STM-64) & Std OMX
58
87
29
19.6 (OC-192/STM-64) & Enh/100 GHz OMX
65
98
33
19.0 (OC-48/STM-16 DPO) & Std OMX
63
84
21
21.2 (OC-48/STM-16 DPO) & Enh/100 GHz
OMX
71
94
24
16.4 (OC-48/STM-16 SFP) & Std OMX
55
73
18
18.6 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 62
82
21
16.0 (OC-192/STM-64) & Std OMX
53
71
18
18.2 (OC-192/STM-64) & Enh/100 GHz OMX
61
81
20
2
3
4
8
12
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Table 1-91
Estimates of link budgets for hub-based configurations
Number Number Power budget (dB)
of
of
bands
channels
Furthest For equally spaced sites
add/drop
Total
Distance
span
circumference
between
(km)
(km) (Note)
remotes
(km)
4
18.0 (OC-48/STM-16 DPO) & Std OMX
59
73
15
19.8 (OC-48/STM-16 DPO) & Enh/100 GHz
OMX
66
82
16
15.0 (OC-48/STM-16 SFP) & Std OMX
50
62
12
17.2 (OC-48/STM-16 SFP) & Enh/100 GHz OMX 57
72
14
14.6 (OC-192/STM-64) & Std OMX
49
61
12
16.8 (OC-192/STM-64) & Enh/100 GHz OMX
56
70
14
16
Note: The link budget specifies the maximum loss of the ring circumference. The loss for individual fiber
sections does not affect the link budget because the channel travels along the ring circumference.
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Calculating the link budget - OMX 16CH
Use the following guidelines for unamplified DWDM networks when using the
OMX 16CH:
•
amplification is not supported
•
optical pass-through is not supported by the OMX 16CH, it can be only
used at terminal or hub sites
•
mixing the OMX 16CH with any other OMX type is not supported at the
same site
Link budgets are calculated for every band for both directions, from each shelf
on a particular band in a site to an adjacent site that contains a shelf with the
same band.
To calculate the link budget, you must determine the number and type of
OMXs that any one band must pass through to establish its connection. See
Table 1-92 for loss details for the OMX 16CH module.
Table 1-92
Loss summary—OMX 16CH
Parameter
Loss (dB)
Add loss
3.9 dB typical (C-band OMX 16CH)
3.5 dB typical (L-band OMX 16CH)
3.6 dB typical (100 GHz OMX 16CH)
Drop loss
3.9 dB typical (C-band OMX 16CH)
3.5 dB typical (L-band OMX 16CH)
3.5 dB typical (100 GHz OMX 16CH)
Passthrough loss (Note 1)
0.7 dB typical (100 GHz OMX 16CH)
L-band upgrade
(OTS IN to L OUT,
L IN to OTS OUT)
0.8 dB typical (C-band OMX 16CH)
Add/drop loss (16 channel C-band
or L-band only, end-to-end)
5.7 dB typical (C-band OMX 16CH)
5.0 dB typical (L-band OMX 16CH)
5.7 dB typical (100 GHz OMX 16CH)
Add/drop loss (32 channel C-band
and L-band, end-to-end)
5.7 dB typical (C-band OMX 16CH)
6.6 dB typical (L-band OMX 16CH)
6.4 dB typical (100 GHz OMX 16CH)
Add/drop loss (32 channel
6.8 dB typical (100 GHz OMX 16CH)
C-band only, end-to-end)
Connector loss
0.4 dB
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Table 1-92
Loss summary—OMX 16CH
Parameter
Loss (dB)
Fiber loss
Fiber loss with additional 0.5 dB for connectors/splice or other
interconnection loss
Transmit power (Note 2)
+2.6 dBm to +4.2 dBm (OC-192/STM-64 DWDM)
+2.6 dBm to +4.2 dBm (OC-48/STM-16 DPO DWDM)
0.0 dBm to +4.0 dBm (OC-48/STM-16 SFP DWDM)
Receiver sensitivity (includes path
penalty) (Note 2)
-23 dBm (OC-192/STM-64 DWDM)
-26 dBm (OC-48/STM-16 DPO DWDM)
-26 dBm (OC-48/STM-16 SFP DWDM)
Note 1: Passthrough loss is only applicable to 100 GHz OMX modules.
Note 2: These are typical values for the mentioned circuit packs. However, refer to Part 3 of 6500
Planning, NTRN10ED (Technical specifications) to find out exact values for each circuit pack.
For receive powers greater than -8 dBm (OC-192/STM-64 DWDM), -9 dBm
(OC-48/STM-16 DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM),
there must be sufficient attenuation in the fiber path so that the overload
requirement of -8 dBm (OC-192/STM-64 DWDM), -9 dBm (OC-48/STM-16
DPO DWDM), or -8 dBm (OC-48/STM-16 SFP DWDM) is not exceeded.
Note: These are typical values for the mentioned circuit packs. However,
refer to Part 3 of 6500 Planning, NTRN10ED (Technical specifications) to
find out exact values for each circuit pack.
OMX 16CH point-to-point configurations
For OMX 16CH point-to-point configurations, you can use the end-to-end
combined add/drop loss for a pair of OMX 16CH modules (see Table 1-92).
The following considerations apply:
•
C-band only networks, use the add and drop (16 channel C-band only,
end-to-end) loss
•
L-band only networks, use the add and drop (16 channel L-band only,
end-to-end) loss
•
C-band and L-band networks, use the add and drop (32 channel C-band
and L-band, end-to-end) loss
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Link budgets for a hubbed-ring configuration - OMX 16CH (C-band)
terminal and OMX 4CH OADM
To calculate the link budgets, you must calculate the OMX losses for each
band in each direction. For a three band unamplified hubbed-ring
configuration shown in Figure 1-121, C-band OMX 16CH is used at the
terminal site and OMX 4CH is used at the OADM sites. The losses in the
OMXs for band 1 in the east-bound and west-bound directions are as follows
(refer to Table 1-90 on page 1-332 and Table 1-92 on page 1-338 for loss
details):
Figure 1-121
Physical connections in a hubbed-ring configuration—OMX 16CH (C-band) terminal and OMX
4CH OADM
Terminal site B
OMX OMX OMX OMX OMX
1
2
3
4
5
OADM site C
OADM site A
OMX
1
OMX
5
OMX
2
OMX
3
OMX
4
The following calculations use typical loss figures for the OMXs and standard
fibering (see “OMX fibering” on page 1-344).
•
East-bound
— Losses at Terminal Site A
–
Add losses: 1 x 3.9 dB
–
Patch losses: 0.4 dB
–
Total: 4.3 dB
— Losses at OADM Site B
–
Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh)
–
Patch losses: 0.4 dB
–
Total: 3.9 dB (Std) or 2.8 dB (Enh)
— Total for band 1 east-bound: 8.2 dB (Std) or 7.1 dB (Enh)
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•
West-bound
— Losses at Terminal Site A
–
Add losses: 1 x 3.9 dB
–
Patch losses: 0.4 dB
–
Total: 4.3 dB
— Losses at OADM Site C
–
Pass-through losses: 2 x 0.7 dB
–
Total: 1.4 dB (Std) or 1.4 dB (Enh)
— Losses at OADM Site B
–
Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh)
–
Pass-through losses: 1 x 0.7 dB
–
Patch losses: 0.4 dB
–
Total: 4.6 dB (Std) or 3.5 dB (Enh)
— Total for band 1 west-bound: 10.3 dB (Std) or 9.2 dB (Enh)
You must also calculate the OMX losses the band 2 and 3 west-bound. For the
three band unamplified hubbed-ring configuration in Figure 1-121 on page
1-340, each band has a maximum of three path-through losses (same as
band 1 west-bound) so the OMX losses for the band 1 west-bound are used
for the following estimates.
The band link budget for a three band unamplified hubbed-ring configuration
in Figure 1-121 on page 1-340 is therefore:
•
Tx power - Rx power - OMX losses
— OC-48/STM-16 DPO DWDM
–
+2.6 dBm - -26 dBm - 10.3 dB (Std OMX) = 18.3 dB
–
+2.6 dBm - -26 dBm - 9.2 dB (Enh OMX) = 19.4 dB
— OC-48/STM-16 SFP DWDM
–
0.0 dBm - -26 dBm - 10.3 dB (Std OMX) = 15.7 dB
–
0.0 dBm - -26 dBm - 9.2 dB (Enh OMX) = 16.8 dB
— OC-192/STM-48 DWDM
–
+2.6 dBm - -23 dBm - 10.3 dB (Std OMX) = 15.3 dB
–
+2.6 dBm - -23 dBm - 9.2 dB (Enh OMX) = 16.4 dB
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Link budgets for a hubbed-ring configuration - OMX 16CH (C-band and
L-band) terminal and OMX 4CH OADM
To calculate the link budgets, you must calculate the OMX losses for each
band in each direction. For a five band unamplified hubbed-ring configuration
shown in Figure 1-122, C-band and L-band OMX 16CH modules are used at
the terminal site and OMX 4CH is used at the OADM sites. The losses in the
OMXs for band 5 in the east-bound and west-bound directions are as follows
(refer to Table 1-90 on page 1-332 and Table 1-92 on page 1-338 for loss
details):
Figure 1-122
Physical connections in a hubbed-ring configuration—OMX 16CH (C-band and L-band) terminal
and OMX 4CH OADM
Terminal site B
OMX OMX OMX OMX OMX
2
1
3
4
5
OADM site C
OADM site A
OMX
1
OMX
5
OMX
2
OMX
3
OMX
4
The following calculations use typical loss figures for the OMXs and standard
fibering (see “OMX fibering” on page 1-344).
•
East-bound
— Losses at Terminal Site B
–
Add losses: 1 x 3.5 dB
–
Pass-through losses (L-band upgrade): 1 x 0.8 dB
–
Patch losses: 0.4 dB
–
Total: 4.7 dB
— Losses at OADM Site C
–
Pass-through losses: 6 x 0.7 dB
–
Total: 4.2 dB (Std) or 4.2 dB (Enh)
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— Losses at OADM Site C
–
Drop losses: 1 x 3.5 dB (Std) or 1 x 2.4 dB (Enh)
–
Pass-through losses: 1 x 0.7 dB
–
Patch losses: 0.4 dB
–
Total: 4.6 dB (Std) or 3.5 dB (Enh)
— Total for band 5 east-bound: 13.5 dB (Std) or 12.4 dB (Enh)
You must also calculate the OMX losses the other east-bound and
west-bound bands. For the five band unamplified hubbed-ring configuration in
Figure 1-122 on page 1-342, each band has a maximum of eight path-through
losses (same as band 5 west-bound) so the OMX losses for the band 5
east-bound are used for the following estimates.
The band link budget for a five band unamplified hubbed-ring configuration in
Figure 1-122 on page 1-342 is therefore:
•
Tx power - Rx power - OMX losses
— OC-48/STM-16 DPO DWDM
–
+2.6 dBm - -26 dBm - 13.5 dB (Std OMX) = 15.1 dB
–
+2.6 dBm - -26 dBm - 12.4 dB (Enh OMX) = 16.2 dB
— OC-48/STM-16 SFP DWDM
–
0.0 dBm - -26 dBm - 13.5 dB (Std OMX) = 12.5 dB
–
0.0 dBm - -26 dBm - 12.4 dB (Enh OMX) = 13.6 dB
— OC-192/STM-48 DWDM
–
+2.6 dBm - -23 dBm - 13.5 dB (Std OMX) = 12.1 dB
–
+2.6 dBm - -23 dBm - 12.4 dB (Enh OMX) = 13.2 dB
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OMX fibering
The ordering of the OMXs depends on the order in which the OMXs are
fibered together. The fibering method affects the number of OMX filters a
signal passes through, and therefore affects the link budget of that signal. It is
important to understand the supported OMX fibering methods in order to
properly plan your optical layer.
West and east fiber pairs
At all sites in ring topologies or at intermediate sites in linear topologies, there
are two fiber pairs that carry traffic in and out of the site. The west fiber pair
refers to the fiber that is connected to OMX modules that add and drop traffic
from the West direction. The east fiber pair refers to the fiber that is connected
to OMX modules that add and drop traffic from the East direction.
For terminal sites that are the end points of a linear network, only one fiber
pair entering the site and at the OADM sites, there are two fiber pairs entering
the site. The east and west concept applies to both terminal and OADM sites.
Each fiber pair has a Rx fiber on which the signal is received and a Tx fiber on
which the signal is transmitted. The Rx fiber is often referred to as OTS IN and
the Tx fiber is often referred to as OTS OUT. All OMX connections, regardless
of ordering or fibering method are bounded by an OTS IN and an OTS OUT
for each fiber pair, as shown in Figure 1-123.
Figure 1-123
Fiber in and out of WDM functional block
West fiber
to OTS IN
from OTS OUT
East fiber
Wavelength
Division
Multiplexing/
De-multiplexing
(add/drop)
from OTS OUT
to OTS IN
OMX fibering refers to the way that the OMXs are interconnected and apply to
DWDM systems that support multiple OMXs per direction with optical
pass-through. There are four methods for fibering OMXs:
•
standard fibering
•
stacked fibering
•
single-band fibering
•
OMX 16CH DWDM fibering
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Table 1-93 lists the features and applications for each fibering method.
Table 1-93
OMX fibering methods
Method
Use
Applicable to site
type
standard
optimal link budgets
• terminal
• OADM
• bridge
stacked
single-band
allows for the addition of shelves
without breaking a fiber
• terminal
single-band site
• OADM
• bridge
• bridge
OMX 16CH
DWDM
terminal or bridge site with more than
16 channels
• terminal
• bridge
Standard OMX fibering
Use standard fibering for optimal link budgets. Adding OMXs to sites with
standard fibering involves breaking the fiber. All the drops are executed first
followed by all the adds. Drops and adds are executed in the same order:
•
drop 1, drop 2, drop 3
•
add 1, add 2 and add 3
If all bands are being dropped and then added at a site, there is no need to
optically connect the west OMX modules with the east OMX modules. In this
case, there is no optical pass-through at this site and this site is referred to as
a terminal site and is said to use terminal standard fibering. Terminal sites can
exist in linear or ring network topologies.
If there are bands carrying signals on the fiber entering the site that are not
dropping and adding, they optically pass through this site. In this case, you
must connect the west OMX modules to the east OMX modules. The site is
referred to as an OADM site and is said to use OADM standard fibering.
Figure 1-124 on page 1-346 shows an example of OMXs with standard OMX
fibering. These diagrams show the traffic flowing one direction only. For the
opposite direction, the signal flow is reversed.
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Figure 1-124
Standard OMX fibering
Terminal
drop
β3, west
β3, east
add
drop
β2, west
β2, east
add
drop
β1, west
β1, east
add
drop
β3, west
β3, east
add
drop
β2, west
β2, east
add
drop
β1, west
β1, east
add
OADM
Stacked fibering
Use stacked fibering if you will be adding more shelves to a terminal site in the
future. All drops are done first, then all adds are done. Drops and adds are
executed in reverse order:
•
drop 1, drop 2, drop 3,
•
add 3, add 2 and add 1
Stacked fibering is only used if all bands are being optically dropped (to the
client interface or for electrical regeneration) and added at a site, and there is
therefore no need to optically connect the west OMX modules with the east
OMX modules. This includes cases where a channel is being regenerated,
(since in this case it is being electrically passed-through the shelf there is no
need for optical pass-through). In this case, there is no optical pass-through
at this site and this site is referred to as a terminal site and is said to use
terminal stacked fibering. Terminal sites can appear in a linear or ring network.
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Figure 1-125 shows an example of OMXs with stacked fibering. This diagram
shows the traffic flow in one direction only. For the opposite direction, the
signal flow is reversed.
Figure 1-125
Stacked OMX fibering
drop
β3, west
β3, east
add
drop
β2, west
β2, east
add
drop
β1, west
β1, east
add
Single-shelf fibering
Use single shelf fibering to drop and add bands and wavelengths at a site with
only one band in a single shelf.
If there are other bands in the network that must optically pass through this
site, then the west OMX must be fibered to the east OMX. This is a special
case of standard OADM fibering, where there is only one band. Figure 1-126
shows an example of single-band fibering. These diagrams show the traffic
flow in one direction only. For the opposite direction, the signal flow is
reversed.
Figure 1-126
Single-shelf OMX fibering
drop
β1, west
β1, east
add
Single-shelf fibering at a multi-shelf site
In some instances, it may be desirable to fiber all OMX modules within a shelf
using single-shelf fibering even though there is more than one shelf at the site.
This is not recommended since it is costly from a link budget perspective and
it does not allow shelves to be added without breaking the fiber. This method
of fibering always has optical pass-through; any site that is fibered using
single-shelf fibering must be an OADM site.
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Figure 1-127 shows an example of single-shelf fibering at a multi-shelf site.
The drops and adds are interleaved:
•
drop 1, add 1
•
drop 2, add 2,
•
drop 3, add 3
These diagrams show the traffic flow in one direction only. For the opposite
direction, the signal flow is reversed.
Figure 1-127
Single-shelf OMX fibering at a multi-shelf site
drop
β3, west
β3, east
add
drop
β2, west
β2, east
add
drop
β1, west
β1, east
add
OMX 16CH DWDM fibering
Use OMX 16CH DWDM fibering at a terminal or bridge site which has more
than 16 channels. Figure 1-128 shows an example of OMX 16CH DWDM
fibering. The L-band OMX 16CH DWDM is not needed if the channel count is
16 channels or less.
Figure 1-128
OMX 16CH DWDM fibering
drop
L-band
west
L-band
east
add
drop
C-band
west
C-band
east
add
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44 Channel Mux/Demux (CMD44) 100 GHz C-Band modules
(NTT862AAE5 and NTT862FAE5)
Overview
The 44 Channel Mux/Demux (CMD44) 100 GHz C-Band module (also known
as CMD44 100 GHz) is a cost effective module for multiplexing up to 44 optical
DWDM channels into a single fiber pair and is used for both ROADMs and
WSS-based terminals.
The CMD44 100 GHz module has two 100 GHz temperature stable arrayed
waveguide grating (AWG) optical mux/demux modules, one for multiplexing
and one for demultiplexing. Therefore one CMD44 100 GHz module is used
per facing direction (if the direction requires local channel add/drop). This
module is a 2U height and intended to be mounted in a bay. The CMD44 100
GHz module is compatible with all 100 GHz versions of WSS modules.
Two variants of CMD44 100 GHz modules are available:
•
44 Channel Mux/Demux (CMD44) 100 GHz C-Band module
(NTT862AAE5)
•
Enhanced 44 Channel Mux/Demux (eCMD44) 100 GHz C-Band module
(NTT862FAE5)
Both CMD44 100 GHz variants offer same functionality but NTT862FAE5
variant also includes a one way optical isolator on the common In port.
Although both the NTT862AAE5 and NTT862FAE5 variants can be used with
a drop LIM at TOADM applications, it is recommended that the NTT862FAE5
variant be used since the embedded isolator prevents the SLA from entering
the APR (Automatic Power Reduction) state if a user were to accidentally
misconnect the Tx and Rx signals from the service equipment to the CMD44
Ch In and Ch Out ports. When in the APR state, the SLA’s total output power
is reduced to +3 dBm maximum for safety reasons, this reduction in power can
lead to traffic loss on all drop channels carried by the CMD44 attached. The
isolator in the NTT862FAE5 blocks any optical light that is input in any of the
Ch Out ports from being transferred to the Common In port thus preventing
the reflection monitor on the SLA’s output port from reading any undesired
power. This allows the SLA’s reflection monitor to perform its normal function
of measuring return loss to help identify any dirty or misconnected patch
cords.
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Figure 1-129 shows the faceplate of a CMD44 100 GHz module. Figure 1-130
on page 1-351 and Figure 1-131 on page 1-352 provide functional block
diagrams of the CMD44 100 GHz modules.
Figure 1-129
CMD44 100 GHz module faceplate (NTT862AAE5 variant)
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Figure 1-130
CMD44 100 GHz ports block diagram (NTT862AAE5)
Equipment Inventory (RJ-45)
Mux AWG
Demux AWG
Inventory
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Common In
Ch-87 Out
Ch-85 Out
Ch-83 Out
Ch-81 Out
Ch-79 Out
Ch-77 Out
Ch-75 Out
Ch-73 Out
Ch-71 Out
Ch-69 Out
Ch-67 Out
Ch-65 Out
Ch-63 Out
Ch-61 Out
Ch-59 Out
Ch-57 Out
Ch-55 Out
Ch-53 Out
Ch-51 Out
Ch-49 Out
Ch-47 Out
Ch-45 Out
Ch-43 Out
Ch-41 Out
Ch-39 Out
Ch-37 Out
Ch-35 Out
Ch-33 Out
Ch-31 Out
Ch-29 Out
Ch-27 Out
Ch-25 Out
Ch-23 Out
Ch-21 Out
Ch-19 Out
Ch-17 Out
Ch-15 Out
Ch-13 Out
Ch-11 Out
Ch-9 Out
Ch-7 Out
Ch-5 Out
Ch-3 Out
Ch-1 Out
Common Out
Ch-87 In
Ch-85 In
Ch-83 In
Ch-81 In
Ch-79 In
Ch-77 In
Ch-75 In
Ch-73 In
Ch-71 In
Ch-69 In
Ch-67 In
Ch-65 In
Ch-63 In
Ch-61 In
Ch-59 In
Ch-57 In
Ch-55 In
Ch-53 In
Ch-51 In
Ch-49 In
Ch-47 In
Ch-45 In
Ch-43 In
Ch-41 In
Ch-39 In
Ch-37 In
Ch-35 In
Ch-33 In
Ch-31 In
Ch-29 In
Ch-27 In
Ch-25 In
Ch-23 In
Ch-21 In
Ch-19 In
Ch-17 In
Ch-15 In
Ch-13 In
Ch-11 In
Ch-9 In
Ch-7 In
Ch-5 In
Ch-3 In
Ch-1 In
89
88
86
84
82
80
78
76
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
90
87
85
83
81
79
77
75
73
71
69
67
65
63
61
59
57
55
53
51
49
47
45
43
41
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
Physical port numbers for
Demux channel outputs
Note: Ch-# refers to Channel ID.
For the wavelength associated
to each channel ID, see next table.
Physical port numbers for
Mux channel inputs
Legend
AWG
Arrayed Waveguide Grating
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Figure 1-131
Enhanced CMD44 100 GHz ports block diagram (NTT862FAE5)
Inventory
Equipment Inventory (RJ-45)
Mux AWG
Demux AWG
Isolator
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Common In
Ch-87 Out
Ch-85 Out
Ch-83 Out
Ch-81 Out
Ch-79 Out
Ch-77 Out
Ch-75 Out
Ch-73 Out
Ch-71 Out
Ch-69 Out
Ch-67 Out
Ch-65 Out
Ch-63 Out
Ch-61 Out
Ch-59 Out
Ch-57 Out
Ch-55 Out
Ch-53 Out
Ch-51 Out
Ch-49 Out
Ch-47 Out
Ch-45 Out
Ch-43 Out
Ch-41 Out
Ch-39 Out
Ch-37 Out
Ch-35 Out
Ch-33 Out
Ch-31 Out
Ch-29 Out
Ch-27 Out
Ch-25 Out
Ch-23 Out
Ch-21 Out
Ch-19 Out
Ch-17 Out
Ch-15 Out
Ch-13 Out
Ch-11 Out
Ch-9 Out
Ch-7 Out
Ch-5 Out
Ch-3 Out
Ch-1 Out
Common Out
Ch-87 In
Ch-85 In
Ch-83 In
Ch-81 In
Ch-79 In
Ch-77 In
Ch-75 In
Ch-73 In
Ch-71 In
Ch-69 In
Ch-67 In
Ch-65 In
Ch-63 In
Ch-61 In
Ch-59 In
Ch-57 In
Ch-55 In
Ch-53 In
Ch-51 In
Ch-49 In
Ch-47 In
Ch-45 In
Ch-43 In
Ch-41 In
Ch-39 In
Ch-37 In
Ch-35 In
Ch-33 In
Ch-31 In
Ch-29 In
Ch-27 In
Ch-25 In
Ch-23 In
Ch-21 In
Ch-19 In
Ch-17 In
Ch-15 In
Ch-13 In
Ch-11 In
Ch-9 In
Ch-7 In
Ch-5 In
Ch-3 In
Ch-1 In
89
88
86
84
82
80
78
76
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
90
87
85
83
81
79
77
75
73
71
69
67
65
63
61
59
57
55
53
51
49
47
45
43
41
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
Physical port numbers for
Demux channel outputs
Note: Ch-# refers to Channel ID.
For the wavelength associated
to each channel ID, see next table.
Physical port numbers for
Mux channel inputs
Legend
AWG
Arrayed Waveguide Grating
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-353
Supported functionality
The CMD44 100 GHz modules (NTT862AAE5 and NTT862FAE5) provide the
following functionality:
•
the CMD44 100 GHz modules are passive modules and therefore do not
require DC power
•
although the CMD44 100 GHz module is a passive device,
autoprovisioning and automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 100
GHz RJ-45 port to the NTK505MBE5 access panel external slot
ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD44 100 GHz RJ-45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 100 GHz RJ-45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 100
GHz RJ-45 port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD44 100 GHz RJ-45 module's RJ-45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 100 GHz RJ-45 port to the access panel
external slot ports).
•
offers 44 channels Mux/Demux at 100 GHz grid listed in Table 1-94 on
page 1-354.
6500 Packet-Optical Platform
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-354 Photonics equipment description
Table 1-94
CMD44 100 GHz ITU grid 44 wavelength plan and interface ports descriptions
Physical port #
Channel ID of the Wavelength 100 GHz Function
mux/demux
(nm)
(Note)
1/2
Ch 1 In / Out
1530.33
3/4
Ch 3 In / Out
1531.12
5/6
Ch 5 In / Out
1531.90
7/8
Ch 7 In / Out
1532.68
9 / 10
Ch 9 In / Out
1533.47
11 / 12
Ch 11 In / Out
1534.25
13 / 14
Ch 13 In / Out
1535.04
15 / 16
Ch 15 In / Out
1535.82
17 / 18
Ch 17 In / Out
1536.61
19 / 20
Ch 19 In / Out
1537.40
21 / 22
Ch 21 In / Out
1538.19
23 / 24
Ch 23 In / Out
1538.98
25 / 26
Ch 25 In / Out
1539.77
27 / 28
Ch 27 In / Out
1540.56
29 / 30
Ch 29 In / Out
1541.35
31 / 32
Ch 31 In / Out
1542.14
33 / 34
Ch 33 In / Out
1542.94
35 / 36
Ch 35 In / Out
1543.73
37 / 38
Ch 37 In / Out
1544.53
39 / 40
Ch 39 In / Out
1545.32
41 / 42
Ch 41 In / Out
1546.12
43 / 44
Ch 43 In / Out
1546.92
45 / 46
Ch 45 In / Out
1547.72
47 / 48
Ch 47 In / Out
1548.51
49 / 50
Ch 49 In / Out
1549.32
51 / 52
Ch 51 In / Out
1550.12
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Optical input / output from
the client-side interface(s)
Connector
type
LC
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-355
Table 1-94
CMD44 100 GHz ITU grid 44 wavelength plan and interface ports descriptions
Physical port #
Channel ID of the Wavelength 100 GHz Function
mux/demux
(nm)
(Note)
53 / 54
Ch 53 In / Out
1550.92
55 / 56
Ch 55 In / Out
1551.72
57 / 58
Ch 57 In / Out
1552.52
59 / 60
Ch 59 In / Out
1553.33
61 / 62
Ch 61 In / Out
1554.13
63 / 64
Ch 63 In / Out
1554.94
65 / 66
Ch 65 In / Out
1555.75
67 / 68
Ch 67 In / Out
1556.55
69 / 70
Ch 69 In / Out
1557.36
71 / 72
Ch 71 In / Out
1558.17
73 / 74
Ch 73 In / Out
1558.98
75 / 76
Ch 75 In / Out
1559.79
77 / 78
Ch 77 In / Out
1560.61
79 / 80
Ch 79 In / Out
1561.42
81 / 82
Ch 81 In / Out
1562.23
83 / 84
Ch 83 In / Out
1563.05
85 / 86
Ch 85 In / Out
1563.86
87 / 88
Ch 87 In / Out
1564.68
89 / 90
Common In / Out
N/A
Connector
type
Optical input / output from
the client-side interface(s)
LC
AMP Line A Out /Line B In
or
LC
WSS Switch Out port /
Switch In port
Note: “Ch In” and “Ch Out” labels reflect the 88-channel plan corresponding to the
6500 Photonic 50 GHz grid.
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-356 Photonics equipment description
•
the channels on the CMD44 100 GHz module have 100% add/drop
capability at each side, allowing one to 44 channels to be added or
dropped. The combination of WSS 100 GHz w/OPM 5x1, WSS 100 GHz
w/OPM 2x1 (double slot-wide and single slot-wide variants), WSS 100
GHz w/OPM 4x1, or WSS 50 GHz w/OPM 9x1, or WSS 50 GHz w/OPM
2x1 (triple slot-wide and single slot-wide variants) circuit pack and CMD44
100 GHz modules (at ROADM or WSS-based terminal sites) is required to
perform add/drop operation.
•
the CMD44 100 GHz module has no variable optical attenuators (VOA),
optimization is carried out through the wavelength selective switch (WSS).
Cross-connection types
The CMD44 100 GHz and Enhanced CMD44 100 GHz modules support the
following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Cross-connection rates
The CMD44 100 GHz and Enhanced CMD44 100 GHz modules only support
the OCH (Optical Channel) Photonic cross-connection rate.
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
Loss of Signal
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-357
Equipping rules
The following equipping rules apply to CMD44 100 GHz modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this circuit pack) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the CMD44 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD44 100 GHz module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly) and its assigned OTS
reside.
•
the CMD44 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-358 Photonics equipment description
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD44 100 GHz optical interface module.
Table 1-95
Technical specifications for CMD44 100 GHz optical interface modules
Parameter
CMD44 100 GHz (NTT862AAE5/NTT862FAE5)
Dimension
Height: 2U (88 mm / 3.5 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated)
7.5 kg (16.7 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
45 dB
0.5 dB Passband width (full Bandwidth)
>46 GHz
3 dB Passband width (full Bandwidth)
>76 GHz
0.5 dB net half Bandwidth
>21.3 GHz
3 dB net half Bandwidth
>34.1 GHz
Max insertion loss per channel (Add or Drop) 6.0 dB for NTT862AAE5
6.6 dB drop loss and 6.0 dB add loss for NTT862FAE5
Minimum insertion loss (all ports)
4 dB
Maximum insertion loss variation (port to port) 1 dB
Minimum tap insertion loss (Monitor Out port) N/A
Maximum tap insertion loss (Monitor Out port) N/A
6500 Packet-Optical Platform
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-359
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-360 Photonics equipment description
44 Channel Mux/Demux (CMD44) 50 GHz C-Band modules (NTT862BAE5,
NTT862BBE5, NTT862BCE5, NTT862BDE5)
Overview
The 44 Channel Mux/Demux (CMD44) 50 GHz C-Band module (also known
as CMD44 50 GHz) and Enhanced 44 Channel Mux/Demux (CMD44) 50 GHz
C-Band module (also known as Enhanced CMD44 50 GHz) are cost effective
modules for multiplexing up to 44 optical DWDM channels into a single fiber
pair and are used for both ROADMs and WSS-based terminals.
The CMD44 50 GHz or Enhanced CMD44 50 GHz module has two 50 GHz
temperature stable arrayed waveguide grating (AWG) optical mux/demux
modules, one for multiplexing and one for demultiplexing. Therefore, one or
two CMD44 50 GHz or Enhanced CMD44 50 GHz modules is used per facing
direction (if the direction requires local channel add/drop). This module is a 2U
height and intended to be mounted in a bay. The CMD44 50 GHz and
Enhanced CMD44 50 GHz modules are compatible with all 50 GHz versions
of WSS modules.
This release of 6500 supports four variants of 44 Channel Mux/Demux
50 GHz C-Band module:
•
NTT862BAE5: 44 Channel Mux/Demux (CMD44) 50 GHz C-Band (Blue)
module (also referred to as CMD44 50 GHz [Blue]). The wavelength range
is 1530.33 nm to 1547.32 nm.
•
NTT862BBE5: 44 Channel Mux/Demux (CMD44) 50 GHz C-Band (Red)
module (also referred to as CMD44 50 GHz [Red]). The wavelength range
is 1547.72 nm to 1565.09 nm.
•
NTT862BCE5: Enhanced 44 Channel Mux/Demux (CMD44) 50 GHz
C-Band (Blue) module (also referred to as Enhanced CMD44 50 GHz
[Blue]). The wavelength range is 1530.33 nm to 1547.32 nm.
•
NTT862BDE5: Enhanced 44 Channel Mux/Demux (CMD44) 50 GHz
C-Band (Red) module (also referred to as Enhanced CMD44 50 GHz
[Red]). The wavelength range is 1547.72 nm to 1565.09 nm.
6500 Packet-Optical Platform
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-361
The CMD44 50 GHz (NTT862BAE5 and NTT862BBE5) and Enhanced
CMD44 50 GHz (NTT862BCE5 and NTT862BDE5) variants offer the same
functionality. However, the Enhanced variants (NTT862BCE5 and
NTT862BDE5) provide the following additional features:
•
a passive 5% tap added on the Common Out port which allows the
Monitor Out signal to be monitored with an external OSA, the 2-Port OPM
circuit pack (NTK553PAE5), or the 2-Port OPM Flex C-Band circuit pack
(NTK553PB).
•
two additional LC connectors added on the faceplate (total 92 LC
connectors). The Monitor Out is port# 92 and port# 91 is unconnected and
not labeled.
•
0.5 dB higher insertion loss.
Figure 1-132 shows the faceplate of a CMD44 50 GHz module (NTT862BAE5
is shown as an example; others are similar). Figure 1-133 on page 1-362 and
Figure 1-134 on page 1-363 provide functional block diagrams of the CMD44
50 GHz modules. Figure 1-135 on page 1-364 and Figure 1-136 on page
1-365 provide functional block diagrams of the Enhanced CMD44 50 GHz
modules.
Figure 1-132
CMD44 50 GHz module faceplate (example: NTT862BAE5)
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-362 Photonics equipment description
Figure 1-133
CMD44 50 GHz ports- Blue block diagram (NTT862BAE5)
Equipment Inventory (RJ-45)
Mux AWG
Demux AWG
Inventory
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Common In
Ch-44 Out
Ch-43 Out
Ch-42 Out
Ch-41 Out
Ch-40 Out
Ch-39 Out
Ch-38 Out
Ch-37 Out
Ch-36 Out
Ch-35 Out
Ch-34 Out
Ch-33 Out
Ch-32 Out
Ch-31 Out
Ch-30 Out
Ch-29 Out
Ch-28 Out
Ch-27 Out
Ch-26 Out
Ch-25 Out
Ch-24 Out
Ch-23 Out
Ch-22 Out
Ch-21 Out
Ch-20 Out
Ch-19 Out
Ch-18 Out
Ch-17 Out
Ch-16 Out
Ch-15 Out
Ch-14 Out
Ch-13 Out
Ch-12 Out
Ch-11 Out
Ch-10 Out
Ch- 9 Out
Ch- 8 Out
Ch- 7 Out
Ch- 6 Out
Ch- 5 Out
Ch- 4 Out
Ch- 3 Out
Ch- 2 Out
Ch- 1 Out
Common Out
Ch-44 In
Ch-43 In
Ch-42 In
Ch-41 In
Ch-40 In
Ch-39 In
Ch-38 In
Ch-37 In
Ch-36 In
Ch-35 In
Ch-34 In
Ch-33 In
Ch-32 In
Ch-31 In
Ch-30 In
Ch-29 In
Ch-28 In
Ch-27 In
Ch-26 In
Ch-25 In
Ch-24 In
Ch-23 In
Ch-22 In
Ch-21 In
Ch-20 In
Ch-19 In
Ch-18 In
Ch-17 In
Ch-16 In
Ch-15 In
Ch-14 In
Ch-13 In
Ch-12 In
Ch-11 In
Ch-10 In
Ch- 9 In
Ch- 8 In
Ch- 7 In
Ch- 6 In
Ch- 5 In
Ch- 4 In
Ch- 3 In
Ch- 2 In
Ch- 1 In
89
88
86
84
82
80
78
76
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
90
87
85
83
81
79
77
75
73
71
69
67
65
63
61
59
57
55
53
51
49
47
45
43
41
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
Physical port numbers for
Demux channel outputs
Note: Ch-# refers to Channel ID.
For the wavelength associated
to each channel ID, see next table.
Physical port numbers for
Mux channel inputs
Legend
AWG
Arrayed Waveguide Grating
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-363
Figure 1-134
CMD44 50 GHz ports- Red block diagram (NTT862BBE5)
Equipment Inventory (RJ-45)
Mux AWG
Demux AWG
Inventory
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Common In
Ch-88 Out
Ch-87 Out
Ch-86 Out
Ch-85 Out
Ch-84 Out
Ch-83 Out
Ch-82 Out
Ch-81 Out
Ch-80 Out
Ch-79 Out
Ch-78 Out
Ch-77 Out
Ch-76 Out
Ch-75 Out
Ch-74 Out
Ch-73 Out
Ch-72 Out
Ch-71 Out
Ch-70 Out
Ch-69 Out
Ch-68 Out
Ch-67 Out
Ch-66 Out
Ch-65 Out
Ch-64 Out
Ch-63 Out
Ch-62 Out
Ch-61 Out
Ch-60 Out
Ch-59 Out
Ch-58 Out
Ch-57 Out
Ch-56 Out
Ch-55 Out
Ch-54 Out
Ch-53 Out
Ch-52 Out
Ch-51 Out
Ch-50 Out
Ch-49 Out
Ch-48 Out
Ch-47 Out
Ch-46 Out
Ch-45 Out
Common Out
Ch-88 In
Ch-87 In
Ch-86 In
Ch-85 In
Ch-84 In
Ch-83 In
Ch-82 In
Ch-81 In
Ch-80 In
Ch-79 In
Ch-78 In
Ch-77 In
Ch-76 In
Ch-75 In
Ch-74 In
Ch-73 In
Ch-72 In
Ch-71 In
Ch-70 In
Ch-69 In
Ch-68 In
Ch-67 In
Ch-66 In
Ch-65 In
Ch-64 In
Ch-63 In
Ch-62 In
Ch-61 In
Ch-60 In
Ch-59 In
Ch-58 In
Ch-57 In
Ch-56 In
Ch-55 In
Ch-54 In
Ch-53 In
Ch-52 In
Ch-51 In
Ch-50 In
Ch-49 In
Ch-48 In
Ch-47 In
Ch-46 In
Ch-45 In
89
88
86
84
82
80
78
76
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
90
87
85
83
81
79
77
75
73
71
69
67
65
63
61
59
57
55
53
51
49
47
45
43
41
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
Physical port numbers for
Demux channel outputs
Note: Ch-# refers to Channel ID.
For the wavelength associated
to each channel ID, see next table.
Physical port numbers for
Mux channel inputs
Legend
AWG
Arrayed Waveguide Grating
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-364 Photonics equipment description
Figure 1-135
Enhanced CMD44 50 GHz ports—Blue block diagram (NTT862BCE5)
Equipment Inventory (RJ-45)
Mux AWG
Demux AWG
Inventory
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Common In
Ch-44 Out
Ch-43 Out
Ch-42 Out
Ch-41 Out
Ch-40 Out
Ch-39 Out
Ch-38 Out
Ch-37 Out
Ch-36 Out
Ch-35 Out
Ch-34 Out
Ch-33 Out
Ch-32 Out
Ch-31 Out
Ch-30 Out
Ch-29 Out
Ch-28 Out
Ch-27 Out
Ch-26 Out
Ch-25 Out
Ch-24 Out
Ch-23 Out
Ch-22 Out
Ch-21 Out
Ch-20 Out
Ch-19 Out
Ch-18 Out
Ch-17 Out
Ch-16 Out
Ch-15 Out
Ch-14 Out
Ch-13 Out
Ch-12 Out
Ch-11 Out
Ch-10 Out
Ch- 9 Out
Ch- 8 Out
Ch- 7 Out
Ch- 6 Out
Ch- 5 Out
Ch- 4 Out
Ch- 3 Out
Ch- 2 Out
Ch- 1 Out
MON Out
Common Out
Ch-44 In
Ch-43 In
Ch-42 In
Ch-41 In
Ch-40 In
Ch-39 In
Ch-38 In
Ch-37 In
Ch-36 In
Ch-35 In
Ch-34 In
Ch-33 In
Ch-32 In
Ch-31 In
Ch-30 In
Ch-29 In
Ch-28 In
Ch-27 In
Ch-26 In
Ch-25 In
Ch-24 In
Ch-23 In
Ch-22 In
Ch-21 In
Ch-20 In
Ch-19 In
Ch-18 In
Ch-17 In
Ch-16 In
Ch-15 In
Ch-14 In
Ch-13 In
Ch-12 In
Ch-11 In
Ch-10 In
Ch- 9 In
Ch- 8 In
Ch- 7 In
Ch- 6 In
Ch- 5 In
Ch- 4 In
Ch- 3 In
Ch- 2 In
Ch- 1 In
89
88
86
84
82
80
78
76
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
92
90
87
85
83
81
79
77
75
73
71
69
67
65
63
61
59
57
55
53
51
49
47
45
43
41
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
Physical port numbers for
Demux channel outputs
Note: Ch-# refers to Channel ID.
For the wavelength associated
to each channel ID, see next table.
Physical port numbers for
Mux channel inputs
Legend
AWG
Arrayed Waveguide Grating
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-365
Figure 1-136
Enhanced CMD44 50 GHz ports—Red block diagram (NTT862BDE5)
Equipment Inventory (RJ-45)
Mux AWG
Demux AWG
Inventory
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Common In
Ch- 88 Out
Ch- 87 Out
Ch- 86 Out
Ch- 85 Out
Ch- 84 Out
Ch- 83 Out
Ch- 82 Out
Ch- 81 Out
Ch- 80 Out
Ch- 79 Out
Ch- 78 Out
Ch- 77 Out
Ch- 76 Out
Ch- 75 Out
Ch- 74 Out
Ch- 73 Out
Ch- 72 Out
Ch- 71 Out
Ch- 70 Out
Ch- 69 Out
Ch- 68 Out
Ch- 67 Out
Ch- 66 Out
Ch- 65 Out
Ch- 64 Out
Ch- 63 Out
Ch- 62 Out
Ch- 61 Out
Ch- 60 Out
Ch- 59 Out
Ch- 58 Out
Ch- 57 Out
Ch- 56 Out
Ch- 55 Out
Ch- 54 Out
Ch- 53 Out
Ch- 52 Out
Ch- 51 Out
Ch- 50 Out
Ch- 49 Out
Ch- 48 Out
Ch- 47 Out
Ch- 46 Out
Ch- 45 Out
MON Out
Common Out
Ch- 88 In
Ch- 87 In
Ch- 86 In
Ch- 85 In
Ch- 84 In
Ch- 83 In
Ch- 82 In
Ch- 81 In
Ch- 80 In
Ch- 79 In
Ch- 78 In
Ch- 77 In
Ch- 76 In
Ch- 75 In
Ch- 74 In
Ch- 73 In
Ch- 72 In
Ch- 71 In
Ch- 70 In
Ch- 69 In
Ch- 68 In
Ch- 67 In
Ch- 66 In
Ch- 65 In
Ch- 64 In
Ch- 63 In
Ch- 62 In
Ch- 61 In
Ch- 60 In
Ch- 59 In
Ch- 58 In
Ch- 57 In
Ch- 56 In
Ch- 55 In
Ch- 54 In
Ch- 53 In
Ch- 52 In
Ch- 51 In
Ch- 50 In
Ch- 49 In
Ch- 48 In
Ch- 47 In
Ch- 46 In
Ch- 45 In
89
88
86
84
82
80
78
76
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
92
90
87
85
83
81
79
77
75
73
71
69
67
65
63
61
59
57
55
53
51
49
47
45
43
41
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
Physical port numbers for
Demux channel outputs
Note: Ch-# refers to Channel ID.
For the wavelength associated
to each channel ID, see next table.
Physical port numbers for
Mux channel inputs
Legend
AWG
Arrayed Waveguide Grating
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-366 Photonics equipment description
Supported functionality
The CMD44 50 GHz and Enhanced CMD44 50 GHz modules (NTT862BAE5,
NTT862BBE5, NTT862BCE5, and NTT862BDE5) provide the following
functionality:
•
the CMD44 50 GHz and Enhanced CMD44 50 GHz modules are passive
modules and therefore do not require DC power
•
although the CMD44 50 GHz and Enhanced CMD44 50 GHz module are
passive devices, autoprovisioning and automatic inventory support are
still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 50
GHz or Enhanced CMD44 50 GHz module's RJ-45 port to the
NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD44 50 GHz or
Enhanced CMD44 50 GHz module's RJ-45 port to the NTK605MAE5
access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 50 GHz or Enhanced CMD44 50 GHz module's
RJ-45 port to the NTK505PAE5 access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD44 50
GHz or Enhanced CMD44 50 GHz module's RJ-45 port to the
NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD44 50 GHz RJ-45 module's RJ-45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD44 50 GHz module's RJ-45 port to the access
panel external slot ports).
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Photonics equipment description 1-367
•
CMD44 50 GHz (Blue) (NTT862BAE5) or Enhanced CMD44 50 GHz
(Blue) (NTT862BCE5) module offers 44 channels Mux/Demux at 50 GHz
grid (1530.33 nm to 1547.32 nm) and CMD44 50 GHz (Red)
(NTT862BBE5) or Enhanced CMD44 50 GHz (Red) (NTT862BDE5)
module offers 44 channels Mux/Demux at 50 GHz grid (1547.72 nm to
1565.09 nm). The channels are listed in the following table.
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Table 1-96
CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions
Physical port #
Channel ID of the Wavelength 50 GHz (nm)
mux/demux
Function
Connector
type
Blue wavelengths plan (NTT862BAE5 and NTT862BCE5)
1/2
Ch 1 In / Out
1530.33
3/4
Ch 2 In / Out
1530.72
5/6
Ch 3 In / Out
1531.12
7/8
Ch 4 In / Out
1531.51
9 / 10
Ch 5 In / Out
1531.90
11 / 12
Ch 6 In / Out
1532.29
13 / 14
Ch 7 In / Out
1532.68
15 / 16
Ch 8 In / Out
1533.07
17 / 18
Ch 9 In / Out
1533.47
19 / 20
Ch 10 In / Out
1533.86
21 / 22
Ch 11 In / Out
1534.25
23 / 24
Ch 12 In / Out
1534.64
25 / 26
Ch 13 In / Out
1535.04
27 / 28
Ch 14 In / Out
1535.43
29 / 30
Ch 15 In / Out
1535.82
31 / 32
Ch 16 In / Out
1536.22
33 / 34
Ch 17 In / Out
1536.61
35 / 36
Ch 18 In / Out
1537.00
37 / 38
Ch 19 In / Out
1537.40
39 / 40
Ch 20 In / Out
1537.79
41 / 42
Ch 21 In / Out
1538.19
43 / 44
Ch 22 In / Out
1538.58
45 / 46
Ch 23 In / Out
1538.98
47 / 48
Ch 24 In / Out
1539.37
49 / 50
Ch 25 In / Out
1539.77
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Optical input / output LC
from the client-side
interface(s)
Photonics Equipment
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December 2019
Photonics equipment description 1-369
Table 1-96 (continued)
CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions
Physical port #
Channel ID of the Wavelength 50 GHz (nm)
mux/demux
Function
Connector
type
51 / 52
Ch 26 In / Out
1540.16
53 / 54
Ch 27 In / Out
1540.56
Optical input / output LC
from the client-side
interface(s)
55 / 56
Ch 28 In / Out
1540.95
57 / 58
Ch 29 In / Out
1541.35
59 / 60
Ch 30 In / Out
1541.75
61 / 62
Ch 31 In / Out
1542.14
63 / 64
Ch 32 In / Out
1542.54
65 / 66
Ch 33 In / Out
1542.94
67 / 68
Ch 34 In / Out
1543.33
69 / 70
Ch 35 In / Out
1543.73
71 / 72
Ch 36 In / Out
1544.13
73 / 74
Ch 37 In / Out
1544.53
75 / 76
Ch 38 In / Out
1544.92
77 / 78
Ch 39 In / Out
1545.32
79 / 80
Ch 40 In / Out
1545.72
81 / 82
Ch 11 In / Out
1546.12
83 / 84
Ch 42 In / Out
1546.52
85 / 86
Ch 43 In / Out
1546.92
87 / 88
Ch 44 In / Out
1547.32
89 / 90
Common In / Out
N/A
LC
WSS Switch Out
port / Switch In port
(if WSS is a
NTK553KCE5
variant)
WSS Drop Out port /
Add In port (if WSS
is a NTK553KAE5
variant)
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Table 1-96 (continued)
CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions
Physical port #
Channel ID of the Wavelength 50 GHz (nm)
mux/demux
Function
92
MON (Note)
Monitor port for Mux LC
Out
N/A
Connector
type
Red wavelengths plan (NTT862BBE5 and NTT862BDE5)
1/2
Ch 45 In / Out
1547.72
3/4
Ch 46 In / Out
1548.11
5/6
Ch 47 In / Out
1548.51
7/8
Ch 48 In / Out
1548.91
9 / 10
Ch 49 In / Out
1549.32
11 / 12
Ch 50 In / Out
1549.72
13 / 14
Ch 51 In / Out
1550.12
15 / 16
Ch 52 In / Out
1550.52
17 / 18
Ch 53 In / Out
1550.92
19 / 20
Ch 54 In / Out
1551.32
21 / 22
Ch 55 In / Out
1551.72
23 / 24
Ch 56 In / Out
1552.12
25 / 26
Ch 57 In / Out
1552.52
27 / 28
Ch 58 In / Out
1552.93
29 / 30
Ch 59 In / Out
1553.33
31 / 32
Ch 60 In / Out
1553.73
33 / 34
Ch 61 In / Out
1554.13
35 / 36
Ch 62 In / Out
1554.54
37 / 38
Ch 63 In / Out
1554.94
39 / 40
Ch 64 In / Out
1555.34
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Optical input / output LC
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interface(s)
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December 2019
Photonics equipment description 1-371
Table 1-96 (continued)
CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions
Physical port #
Channel ID of the Wavelength 50 GHz (nm)
mux/demux
Function
41 / 42
Ch 65 In / Out
1555.75
43 / 44
Ch 66 In / Out
1556.15
Optical input / output LC
from the client-side
interface(s)
45 / 46
Ch 67 In / Out
1556.55
47 / 48
Ch 68 In / Out
1556.96
49 / 50
Ch 69 In / Out
1557.36
51 / 52
Ch 70 In / Out
1557.77
53 / 54
Ch 71 In / Out
1558.17
55 / 56
Ch 72 In / Out
1558.58
57 / 58
Ch 73 In / Out
1558.98
59 / 60
Ch 74 In / Out
1559.39
61 / 62
Ch 75 In / Out
1559.79
63 / 64
Ch 76 In / Out
1560.20
65 / 66
Ch 77 In / Out
1560.61
67 / 68
Ch 78 In / Out
1561.01
69 / 70
Ch 79 In / Out
1561.42
71 / 72
Ch 80 In / Out
1561.83
73 / 74
Ch 81 In / Out
1562.23
75 / 76
Ch 82 In / Out
1562.64
77 / 78
Ch 83 In / Out
1563.05
79 / 80
Ch 84 In / Out
1563.45
81 / 82
Ch 85 In / Out
1563.86
83 / 84
Ch 86 In / Out
1564.27
85 / 86
Ch 87 In / Out
1564.68
87 / 88
Ch 88 In / Out
1565.09
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Connector
type
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1-372 Photonics equipment description
Table 1-96 (continued)
CMD44 50 GHz or Enhanced CMD44 50 GHz ITU grid 88 wavelength plan and interface ports
descriptions
Physical port #
Channel ID of the Wavelength 50 GHz (nm)
mux/demux
Function
89 / 90
Common In / Out
LC
WSS Switch Out
port / Switch In port
(if WSS is a
NTK553KCE5
variant)
N/A
Connector
type
WSS Drop Out port /
Add In port (if WSS
is a NTK553KAE5
variant)
92
MON (Note)
N/A
Monitor port for Mux LC
Out
Note: Only applicable to Enhanced CMD44 50 GHz modules (NTT862BCE5 and NTT862BDE5).
•
the channels on the CMD44 50 GHz and Enhanced CMD44 50 GHz
modules have 100% add/drop capability at each side, allowing 44
channels for each CMD44 50 GHz or Enhanced CMD44 50 GHz module
(i.e. 44 for blue CMD44 50 GHz or Enhanced CMD44 50 GHz and 44 for
red CMD44 50 GHz or Enhanced CMD44 50 GHz) to be added or
dropped. The combination of WSS 100 GHz w/OPM 5x1, WSS 100 GHz
w/OPM 2x1 (double slot-wide and single slot-wide variants), WSS 100
GHz w/OPM 4x1, or WSS 50 GHz w/OPM 9x1, or WSS 50 GHz w/OPM
2x1 (triple slot-wide and single slot-wide variants) circuit pack and CMD44
50 GHz or Enhanced CMD44 50 GHz modules (at ROADM or WSS-based
terminal sites) is required to perform add/drop operation. However, it is
recommended to use 50 GHz WSS circuit packs with CMD44 50 GHz or
Enhanced CMD44 50 GHz modules since by using 100 GHz WSS circuit
packs with CMD44 50 GHz or Enhanced CMD44 50 GHz modules, you
can only use 100 GHz channels.
•
the CMD44 50 GHz or Enhanced CMD44 50 GHz module has no variable
optical attenuators (VOA), optimization is carried out through the
wavelength selective switch (WSS).
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Cross-connection types
The CMD44 50 GHz and Enhanced CMD44 50 GHz modules support the
following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Note: Coherent Select configurations support 2WAY connections only.
Cross-connection rates
The CMD44 50 GHz and Enhanced CMD44 50 GHz modules only support the
OCH (Optical Channel) Photonic cross-connection rate.
Performance monitoring
The 6500 monitors and collects physical PMs for Enhanced CMD44 50 GHz
module facilities. Table 1-97 provides a list of monitor types supported on
Enhanced CMD44 50 GHz modules. Figure 1-137 on page 1-374 shows the
Enhanced CMD44 50 GHz module optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-97
Monitor types table for Enhanced CMD44 50 GHz modules
Monitor type
Facility
OPTMON
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
CHMON
X
X
X
X
Note
OPT-OCH
OPTMIN-OCH
OPTMAX-OCH
OPTAVG-OCH
X
X
X
X
Note
Note: The retrieved OPTMON OPR-OTS and CHMON OPT-OCH
PM counts for Enhanced CMD44 50 GHz modules used with the
2-Port OPM circuit packs have +/-3 dB precision.
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Figure 1-137
Enhanced CMD44 50 GHz module optical monitoring points
Equipment Inventory (RJ-45)
Demux AWG
Inventory
Mux AWG
Facility: OPTMON port 1,3,5,7...,85,87
Parameter: OPR-OTS*
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Common In
Ch-44 Out
Ch-43 Out
Ch-42 Out
Ch-41 Out
Ch-40 Out
Ch-39 Out
Ch-38 Out
Ch-37 Out
Ch-36 Out
Ch-35 Out
Ch-34 Out
Ch-33 Out
Ch-32 Out
Ch-31 Out
Ch-30 Out
Ch-29 Out
Ch-28 Out
Ch-27 Out
Ch-26 Out
Ch-25 Out
Ch-24 Out
Ch-23 Out
Ch-22 Out
Ch-21 Out
Ch-20 Out
Ch-19 Out
Ch-18 Out
Ch-17 Out
Ch-16 Out
Ch-15 Out
Ch-14 Out
Ch-13 Out
Ch-12 Out
Ch-11 Out
Ch-10 Out
Ch- 9 Out
Ch- 8 Out
Ch- 7 Out
Ch- 6 Out
Ch- 5 Out
Ch- 4 Out
Ch- 3 Out
Ch- 2 Out
Ch- 1 Out
89
88
86
84
82
80
78
76
74
72
70
68
66
64
62
60
58
56
54
52
50
48
46
44
42
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
92
Mon Out
Common Out 90
87
Ch-44 In
85
Ch-43 In
83
Ch-42 In
81
Ch-41 In
79
Ch-40 In
77
Ch-39 In
75
Ch-38 In
73
Ch-37 In
71
Ch-36 In
69
Ch-35 In
67
Ch-34 In
65
Ch-33 In
63
Ch-32 In
61
Ch-31 In
59
Ch-30 In
57
Ch-29 In
55
Ch-28 In
53
Ch-27 In
51
Ch-26 In
49
Ch-25 In
47
Ch-24 In
45
Ch-23 In
43
Ch-22 In
41
Ch-21 In
Ch-20 In
39
37
Ch-19 In
35
Ch-18 In
33
Ch-17 In
31
Ch-16 In
29
Ch-15 In
27
Ch-14 In
25
Ch-13 In
23
Ch-12 In
21
Ch-11 In
19
Ch-10 In
Ch- 9 In
17
Ch- 8 In
15
13
Ch- 7 In
11
Ch- 6 In
9
Ch- 5 In
7
Ch- 4 In
5
Ch- 3 In
Ch- 2 In
3
1
Ch- 1 In
Physical port numbers for
Demux channel outputs
Facility: CHMON port 92
Parameter: OPT-OCH
Physical port numbers for
Mux channel inputs
Note: Ch-# refers to the Channel ID.
For the Blue module, # = 1 to 44.
For the Red module, # = 45 to 88.
*AVG, MIN, and MAX measurements
also provided.
Legend
AWG
Arrayed Waveguide Grating
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-375
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
Loss of Signal
Equipping rules
The following equipping rules apply to CMD44 50 GHz modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this circuit pack) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the CMD44 50 GHz or Enhanced CMD44 50 GHz module must be located
in the same bay as the access panel (in 6500-7 packet-optical, 7-slot shelf,
14-slot shelf, 32-slot shelf), shelf processor w/access panel (SPAP) circuit
pack (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD44 50 GHz or Enhanced CMD44 50 GHz module
connects to (by using the NTTC09BME6 or NTTC09DM cable assembly)
and its assigned OTS reside.
•
the CMD44 50 GHz and Enhanced CMD44 50 GHz modules do not use
any cross-connect capacity and can be used with shelves equipped with
or without cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD44 50 GHz optical interface module.
Table 1-98
Technical specifications for CMD44 50 GHz optical interface modules
Parameter
CMD44 50 GHz
(NTT862BAE5 and
NTT862BBE5)
Dimension
Enhanced CMD44 50
GHz (NTT862BCE5 and
NTT862BDE5)
Height: 2U (88 mm / 3.5 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated)
7.6 kg (16.9 lb)
7.6 kg (16.9 lb)
Power consumption
Typical (W): 0
Typical (W): 0
Power Budget (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
24 dBm
Minimum return loss
36 dB
36 dB
Max insertion loss per channel (Add or Drop)
7.0 dB
7.5 dB
Minimum insertion loss (all ports)
4 dB
4 dB
Maximum insertion loss variation (port to port)
1.5 dB
1.5 dB
Minimum tap insertion loss (Monitor Out port)
N/A
12 dB
Maximum tap insertion loss (Monitor Out port)
N/A
14 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (NTT862JA)
Overview
The 64 Channel Mux/Demux (CMD64) 75 GHz C-Band module (also known
as CMD64) is a cost effective module for multiplexing up to 64 optical DWDM
channels into a single fiber pair.
The CMD64 module has two 75 GHz temperature stable arrayed waveguide
grating (AWG) optical mux/demux modules, one for multiplexing and one for
demultiplexing. This module is a 2U height and intended to be mounted in a
bay.
The CMD64 module includes a passive 5% tap added on the Common In and
Common Out ports which allows the signals to be monitored with an external
OSA, the 2-Port OPM Flex C-Band circuit pack (NTK553PB).
The CMD64 includes a one-way optical isolator on the Common In port. The
isolator prevents the preceding amplifier from entering the APR (Automatic
Power Reduction) state if a user accidentally misconnects the Tx and Rx
signals from the service equipment to the CMD64 Ch In and Ch Out ports.
When in the APR state, the amplifier's total output power is reduced to +3 dBm
maximum for safety reasons, this reduction in power can lead to traffic loss on
all drop channels carried by the CMD64 attached. The isolator in the CMD64
blocks any optical light that is input in any of the Ch Out ports from being
transferred to the Common In port thus preventing the reflection monitor on
the amplifier’s output port from reading any undesired power. This allows the
amplifier’s reflection monitor to perform its normal function of measuring
return loss to help identify any dirty or misconnected patch cords.
Figure 1-138 shows the faceplate of a CMD64 module and Figure 1-139 on
page 1-378 provides the functional block diagram of the CMD64 module.
Figure 1-138
CMD64 module faceplate
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Figure 1-139
CMD64 block diagram (NTT862JA)
Physical port
numbers for
Demux frequency
outputs
Physical port
numbers for
Mux frequency
inputs
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Supported functionality
The CMD64 module (NTT862JA) provides the following functionality:
•
is a passive module and therefore does not require DC power
•
although the CMD64 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD64
module's RJ-45 port to the NTK505MBE5 access panel external slot
ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD64 module's RJ-45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD64 module's RJ-45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD64
module's RJ-45 port to the NTK555NA or NTK555NB external slot
ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD64 module's RJ-45 port to the NTK505JA access panel
external slot ports).
— shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD64 module's RJ-45 port to the access panel’s external slot
ports).
•
64 frequencies Mux/Demux at 75 GHz grid (191.3625 THz to 196.0875
THz). The frequencies are listed in Table 1-99 on page 1-380.
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Table 1-99
CMD64 ITU grid 64 frequency plan and interface port descriptions
Physical port #
(Note)
Frequency of the mux/demux
Function
Connector
type
1/2
196.0875 THz In / Out
LC
3/4
196.0125 THz In / Out
Optical input / output from the
client-side interface(s)
5/6
195.9375 THz In / Out
7/8
195.8625 THz In / Out
9 / 10
195.7875 THz In / Out
11 / 12
195.7125 THz In / Out
13 / 14
195.6375 THz In / Out
15 / 16
195.5625 THz In / Out
17 / 18
195.4875 THz In / Out
19 / 20
195.4125 THz In / Out
21 / 22
195.3375 THz In / Out
23 / 24
195.2625 THz In / Out
25 / 26
195.1875 THz In / Out
27 / 28
195.1125 THz In / Out
29 / 30
195.0375 THz In / Out
31 / 32
194.9625 THz In / Out
33 / 34
194.8875 THz In / Out
35 / 36
194.8125 THz In / Out
37 / 38
194.7375 THz In / Out
39 / 40
194.6625 THz In / Out
41 / 42
194.5875 THz In / Out
43 / 44
194.5125 THz In / Out
45 / 46
194.4375 THz In / Out
47 / 48
194.3625 THz In / Out
49 / 50
194.2875 THz In / Out
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Table 1-99
CMD64 ITU grid 64 frequency plan and interface port descriptions
Physical port #
(Note)
Frequency of the mux/demux
Function
Connector
type
51 / 52
194.2125 THz In / Out
LC
53 / 54
194.1375 THz In / Out
Optical input / output from the
client-side interface(s)
55 / 56
194.0625 THz In / Out
57 / 58
193.9875 THz In / Out
59 / 60
193.9125 THz In / Out
61 / 62
193.8375 THz In / Out
63 / 64
193.7625 THz In / Out
65 / 66
193.6875 THz In / Out
67 / 68
193.6125 THz In / Out
69 / 70
193.5375 THz In / Out
71 / 72
193.4625 THz In / Out
73 / 74
193.3875 THz In / Out
75 / 76
193.3125 THz In / Out
77 / 78
193.2375 THz In / Out
79 / 80
193.1625 THz In / Out
81 / 82
193.0875 THz In / Out
83 / 84
193.0125 THz In / Out
85 / 86
192.9375 THz In / Out
87 / 88
192.8625 THz In / Out
89 / 90
192.7875 THz In / Out
91 / 92
192.7125 THz In / Out
93 / 94
192.6375 THz In / Out
95 / 96
192.5625 THz In / Out
97 / 98
192.4875 THz In / Out
99 / 100
192.4125 THz In / Out
101 / 102
192.3375 THz In / Out
103 / 104
192.2625 THz In / Out
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Table 1-99
CMD64 ITU grid 64 frequency plan and interface port descriptions
Physical port #
(Note)
Frequency of the mux/demux
Function
Connector
type
105 / 106
192.1875 THz In / Out
LC
107 / 108
192.1125 THz In / Out
Optical input / output from the
client-side interface(s)
109 / 110
192.0375 THz In / Out
111 / 112
191.9625 THz In / Out
113 / 114
191.8875 THz In / Out
115 / 116
191.8125 THz In / Out
117 / 118
191.7375 THz In / Out
119 / 120
191.6625 THz In / Out
121 / 122
191.5875 THz In / Out
123 / 124
191.5125 THz In / Out
125 / 126
191.4375 THz In / Out
127 / 128
191.3625 THz In / Out
129 / 130
Common In / Out
AMP Line A Out /Line B In or WSS
Switch Out port / Switch In port
131 / 132
Monitor Out / Out
Monitor output for common in/out
Note: All physical ports have an LC connector type.
Cross-connection types
The CMD64 module supports the following cross-connection types:
•
1WAY (Unidirectional)
•
2WAY (Bidirectional)
Cross-connection rates
The CMD64 module supports network media channel (NMC) Photonic
connections.
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
Gauge Threshold Crossing Alert Summary
•
Loss of Signal
Equipping rules
The following equipping rules apply to CMD64 modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 6500 2-slot optical Type 2 shelf (NTK503LA).
Cannot be equipped with any other 2-slot shelf types (NTK503MAE5 and
NTK503NAE5).
•
the CMD64 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf) or shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, that CMD64 module
connects to (by using the NTTC09BME6 or NTTC09DM cable assembly)
and its assigned OTS reside.
•
can be only used with coherent interfaces (different from CMD44
modules).
•
the CMD64 module does not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD64 optical interface module.
Table 1-100
Technical specifications for CMD64 optical interface modules
Parameter
CMD64 (NTT862JA)
Dimension
Height: 2U (88 mm / 3.5 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated)
6.0 kg (13.2 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
36 dB
0.5 dB net half Bandwidth
> 22.5 GHz
3 dB net half Bandwidth
> 36.0 GHz
Port to port insertion loss variation (over all 64 wavelengths)
< 1.5 dB
Mux insertion loss
Minimum: 4 dB
Maximum: 6.5 dB
Demux insertion loss
Minimum: 4 dB
Maximum: 7.1 dB
Monitor port insertion loss (Mux Monitor)
Minimum: 12 dB
Maximum: 13.5 dB
Monitor port insertion loss (Demux Monitor)
Minimum: 12.2 dB
Maximum: 14.5 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (NTT862EA)
Overview
The 96 Channel Mux/Demux (CMD96) 50 GHz C-Band module (also known
as CMD96) is a cost effective module for multiplexing up to 96 optical DWDM
channels into a single fiber pair.
The CMD96 module has two 50 GHz temperature stable arrayed waveguide
grating (AWG) optical mux/demux modules, one for multiplexing and one for
demultiplexing. This module is a 3U height and intended to be mounted in a
bay.
The CMD96 module includes a passive 5% tap added on the Common In and
Common Out ports which allows the Monitor Out and Monitor In signals to be
monitored with an external OSA, the 2-Port OPM circuit pack (NTK553PAE5),
or the 2-Port OPM Flex C-Band circuit pack (NTK553PB).
The CMD96 includes a one-way optical isolator on the Common In port. The
isolator prevents the preceding amplifier from entering the APR (Automatic
Power Reduction) state if a user accidentally misconnects the Tx and Rx
signals from the service equipment to the CMD96 Ch In and Ch Out ports.
When in the APR state, the amplifier's total output power is reduced to +3 dBm
maximum for safety reasons, this reduction in power can lead to traffic loss on
all drop channels carried by the CMD96 attached. The isolator in the CMD96
blocks any optical light that is input in any of the Ch Out ports from being
transferred to the Common In port thus preventing the reflection monitor on
the amplifier’s output port from reading any undesired power. This allows the
amplifier’s reflection monitor to perform its normal function of measuring
return loss to help identify any dirty or misconnected patch cords.
Figure 1-140 shows the faceplate of a CMD96 module and Figure 1-141 on
page 1-386 provides the functional block diagram of the CMD96 module.
Figure 1-140
CMD96 module faceplate
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Figure 1-141
CMD96 block diagram (NTT862EA)
Physical port numbers for
Demux channel outputs
Note: Ch-# refers to Channel ID of the mux/demux.
For the wavelength associated to each
Channel ID of the mux/demux, see next table.
Physical port numbers for
Mux channel inputs
Legend
AWG
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Supported functionality
The CMD96 module (NTT862EA) provides the following functionality:
•
is a passive module and therefore does not require DC power
•
although the CMD96 is a passive device, autoprovisioning and automatic
inventory support are possible if using
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD96
module's RJ-45 port to the NTK555NA or NTK555NB external slot
ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD96 module's RJ-45 port to the NTK505JA access panel
external slot ports).
— shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD96 module's RJ-45 port to the access panel’s external slot
ports).
•
96 channels Mux/Demux at 50 GHz grid (1528.77 nm to 1566.72 nm). The
channels are listed in the following table.
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Table 1-101
CMD96 ITU grid 96 wavelength plan and interface port descriptions
Physical port #
(Note)
Channel ID of
Wavelength
the mux/demux 50 GHz (nm)
Function
Connector type
1/2
Ch 93 In / Out
1528.77
LC
3/4
Ch 94 In / Out
1529.16
Optical input / output
from the client-side
interface(s)
5/6
Ch 95 In / Out
1529.55
7/8
Ch 96 In / Out
1529.94
9 / 10
Ch 1 In / Out
1530.33
11 / 12
Ch 2 In / Out
1530.72
13 / 14
Ch 3 In / Out
1531.12
15 / 16
Ch 4 In / Out
1531.51
17 / 18
Ch 5 In / Out
1531.90
19 / 20
Ch 6 In / Out
1532.29
21 / 22
Ch 7 In / Out
1532.68
23 / 24
Ch 8 In / Out
1533.07
25 / 26
Ch 9 In / Out
1533.47
27 / 28
Ch 10 In / Out
1533.86
29 / 30
Ch 11 In / Out
1534.25
31 / 32
Ch 12 In / Out
1534.64
33 / 34
Ch 13 In / Out
1535.04
35 / 36
Ch 14 In / Out
1535.43
37 / 38
Ch 15 In / Out
1535.82
39 / 40
Ch 16 In / Out
1536.22
41 / 42
Ch 17 In / Out
1536.61
43 / 44
Ch 18 In / Out
1537.00
45 / 46
Ch 19 In / Out
1537.40
47 / 48
Ch 20 In / Out
1537.79
49 / 50
Ch 21 In / Out
1538.19
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Table 1-101
CMD96 ITU grid 96 wavelength plan and interface port descriptions
Physical port #
(Note)
Channel ID of
Wavelength
the mux/demux 50 GHz (nm)
Function
Connector type
51 / 52
Ch 22 In / Out
1538.58
LC
53 / 54
Ch 23 In / Out
1538.98
Optical input / output
from the client-side
interface(s)
55 / 56
Ch 24 In / Out
1539.37
57 / 58
Ch 25 In / Out
1539.77
59 / 60
Ch 26 In / Out
1540.16
61 / 62
Ch 27 In / Out
1540.56
63 / 64
Ch 28 In / Out
1540.95
65 / 66
Ch 29 In / Out
1541.35
67 / 68
Ch 30 In / Out
1541.75
69 / 70
Ch 31 In / Out
1542.14
71 / 72
Ch 32 In / Out
1542.54
73 / 74
Ch 33 In / Out
1542.94
75 / 76
Ch 34 In / Out
1543.33
77 / 78
Ch 35 In / Out
1543.73
79 / 80
Ch 36 In / Out
1544.13
81 / 82
Ch 37 In / Out
1544.53
83 / 84
Ch 38 In / Out
1544.92
85 / 86
Ch 39 In / Out
1545.32
87 / 88
Ch 40 In / Out
1545.72
89 / 90
Ch 41 In / Out
1546.12
91 / 92
Ch 42 In / Out
1546.52
93 / 94
Ch 43 In / Out
1546.92
95 / 96
Ch 44 In / Out
1547.32
97 / 98
Ch 45 In / Out
1547.72
99 / 100
Ch 46 In / Out
1548.11
101 / 102
Ch 47 In / Out
1548.51
103 / 104
Ch 48 In / Out
1548.91
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Table 1-101
CMD96 ITU grid 96 wavelength plan and interface port descriptions
Physical port #
(Note)
Channel ID of
Wavelength
the mux/demux 50 GHz (nm)
Function
Connector type
105 / 106
Ch 49 In / Out
1549.32
LC
107 / 108
Ch 50 In / Out
1549.72
Optical input / output
from the client-side
interface(s)
109 / 110
Ch 51 In / Out
1550.12
111 / 112
Ch 52 In / Out
1550.52
113 / 114
Ch 53 In / Out
1550.92
115 / 116
Ch 54 In / Out
1551.32
117 / 118
Ch 55 In / Out
1551.72
119 / 120
Ch 56 In / Out
1552.12
121 / 122
Ch 57 In / Out
1552.52
123 / 124
Ch 58 In / Out
1552.93
125 / 126
Ch 59 In / Out
1553.33
127 / 128
Ch 60 In / Out
1553.73
129 / 130
Ch 61 In / Out
1554.13
131 / 132
Ch 62 In / Out
1554.54
133 / 134
Ch 63 In / Out
1554.94
135 / 136
Ch 64 In / Out
1555.34
137 / 138
Ch 65 In / Out
1555.75
139 / 140
Ch 66 In / Out
1556.15
141 / 142
Ch 67 In / Out
1556.55
143 / 144
Ch 68 In / Out
1556.96
145 / 146
Ch 69 In / Out
1557.36
147 / 148
Ch 70 In / Out
1557.77
149 / 150
Ch 71 In / Out
1558.17
151 / 152
Ch 72 In / Out
1558.58
153 / 154
Ch 73 In / Out
1558.98
155 / 156
Ch 74 In / Out
1559.39
157 / 158
Ch 75 In / Out
1559.79
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Table 1-101
CMD96 ITU grid 96 wavelength plan and interface port descriptions
Physical port #
(Note)
Channel ID of
Wavelength
the mux/demux 50 GHz (nm)
Function
Connector type
159 / 160
Ch 76 In / Out
1560.20
LC
161 / 162
Ch 77 In / Out
1560.61
Optical input / output
from the client-side
interface(s)
163 / 164
Ch 78 In / Out
1561.01
165 / 166
Ch 79 In / Out
1561.42
167 / 168
Ch 80 In / Out
1561.83
169 / 170
Ch 81 In / Out
1562.23
171 / 172
Ch 82 In / Out
1562.64
173 / 174
Ch 83 In / Out
1563.05
175 / 176
Ch 84 In / Out
1563.45
177 / 178
Ch 85 In / Out
1563.86
179 / 180
Ch 86 In / Out
1564.27
181 / 182
Ch 87 In / Out
1564.68
183 / 184
Ch 88 In / Out
1565.09
185 / 186
Ch 89 In / Out
1565.50
187 / 188
Ch 90 In / Out
1565.90
189 / 190
Ch 91 In / Out
1566.31
191 / 192
Ch 92 In / Out
1566.72
193 / 194
Common In / Out N/A
AMP Line A Out /Line B
In or WSS Switch Out
port / Switch In port
195 / 196
Monitor Out / Out N/A
Monitor output for
common in/out
Note: All physical ports have an LC connector type.
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Cross-connection types
The CMD96 module supports the 2WAY (Bidirectional) cross-connection type
only.
Cross-connection rates
The CMD96 module only supports the OCH (Optical Channel) Photonic
cross-connection rate.
Performance monitoring
The 6500 monitors and collects physical PMs for CMD96 module facilities.
Table 1-102 provides a list of monitor types supported on CMD96 modules.
Figure 1-142 on page 1-393 shows the CMD96 optical monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-102
Monitor types table for CMD96 modules
Facility
OPTMON
SDMON
Monitor type
OPR-OTS
X
OPRMIN-OTS
X
OPRMAX-OTS
X
OPRAVG-OTS
X
Note 3
OPT-OTS
X
OPTMIN-OTS
X
OPTMAX-OTS
X
OPTAVG-OTS
X
Note 3
Note 1: PM support on the CMD96 module requires the OPM on the
standalone 2-Port OPM circuit pack.
Note 2: For a diagram showing the Photonic CMD96 module optical
monitoring points, refer to Figure 1-142 on page 1-393.
Note 3: The retrieved OPTMON OPR-OTS and SDMON OPT-OTS PM
counts for Photonic CMD64 modules used with the 2-Port OPM or
2-Port OPM Flex C-Band circuit packs have +/-3 dB precision.
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Figure 1-142
CMD96 module optical monitoring points
Equipment Inventory
(RJ-45)
Inventory
Mon Out
Mux / Demux
...
Isolator
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193
Ch 92 Out
Ch 91 Out
Ch 90 Out
192
190
188
Ch 16 Out
Ch 15 Out
Ch 14 Out
Ch 13 Out
Ch 12 Out
Ch 11 Out
Ch 10 Out
Ch 9 Out
Ch 8 Out
Ch 7 Out
Ch 6 Out
Ch 5 Out
Ch 4 Out
Ch 3 Out
Ch 2 Out
Ch 1 Out
Ch 96 Out
Ch 95 Out
Ch 94 Out
Ch 93 Out
40
38
36
34
32
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
Mon Out
Common Out
Physical port numbers for
Demux channel outputs
Facility: CHMON port 194
Parameter: OPT-OCH
196
194
Ch 92 In
Ch 91 In
Ch 90 In
191
189
187
Ch 16 In
Ch 15 In
Ch 14 In
Ch 13 In
Ch 12 In
Ch 11 In
Ch 10 In
Ch 9 In
Ch 8 In
Ch 7 In
Ch 6 In
Ch 5 In
Ch 4 In
Ch 3 In
Ch 2 In
Ch 1 In
Ch 96 In
Ch 95 In
Ch 94 In
Ch 93 In
39
37
35
33
31
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
...
Facility: OPTMON port 1,3,5,7...,189,191
Parameter: OPR-OTS*
195
Common In
Physical port numbers for
Mux channel inputs
Note: Ch-# refers to Channel ID.
*AVG, MIN, and MAX
measurements also provided.
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Alarms
The following alarms can be raised on the CMD96 module:
•
Adjacency Mismatch
•
Autoprovisioning Mismatch
•
Circuit Pack Mismatch
•
Circuit Pack Missing
•
Duplicate Adjacency Discovered
•
Gauge Threshold Crossing Alert Summary
•
Loss Of Signal (OPTMON)
Equipping rules
The following equipping rules apply to CMD96 modules:
•
cannot be equipped with the 14-slot shelves.
•
cannot be equipped with the 32-slot shelves.
•
can be equipped with the 7-slot shelf (NTK503KA variant only) by using
the shelf processor and access panel. Cannot be equipped with the
NTK503PAE5 variant of 7-slot shelf types.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 6500 2-slot optical Type 2 shelf (NTK503LA).
Cannot be equipped with any other 2-slot shelf types (NTK503MAE5 and
NTK503NAE5).
•
the CMD96 module must be located in the same bay as the
— access panel (in 6500-7 packet-optical)
— shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB)
that CMD96 module connects to (by using the NTTC09BME6 or
NTTC09DM cable assembly).
•
can be only used with coherent interfaces (different from CMD44
modules).
•
the CMD96 module does not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
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Photonics equipment description 1-395
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD96 optical interface module.
Table 1-103
Technical specifications for CMD96 optical interface modules
Parameter
CMD96 (NTT862EA)
Dimension
Height: 3U (133 mm / 5.2 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280.0 mm / 11.02 in.
Weight (estimated)
7.2 kg (15.8 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
36 dB
0.5 dB net half Bandwidth
> 14.0 GHz
3 dB net half Bandwidth
> 23.0 GHz
Max insertion loss per channel (Add or Drop)
Add: 7.0 dB
Drop: 7.6 dB
Minimum insertion loss (all ports)
4 dB
Maximum insertion loss variation (port to port)
1.5 dB
Minimum tap insertion loss (Monitor Out port)
12 dB
Maximum tap insertion loss (Monitor Out port)
14 dB
Minimum tap insertion loss (Monitor In port)
12.2 dB
Maximum tap insertion loss (Monitor In port)
15 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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16 Channel Mux/Demux (CMD16) 100 GHz C-Band module
(NTT862KA)
Overview
The 16 Channel Mux/Demux (CMD16) 100 GHz C-Band module (also known
as CMD16 100 GHz) is a cost effective module for multiplexing up to 16 optical
DWDM channels into a single fiber pair to provide the ability to add/drop
channels in either non-ROADM applications (i.e. without the requirement to
have a WSS at the site) or Metro ROADM configurations.
The CMD16 100 GHz module is a purely passive module containing WDM
thin-film 2x band splitters and 2x 8-channel filters each in the Mux/Demux
directions for multiplexing and demultiplexing of the 16 100 GHz channels with
frequency range from 195.90 to 194.30 THz (corresponding to a wavelength
range of 1530.33 to 1542.94 nm). The supported channels are listed in Table
1-104 on page 1-399. All other channels are passed through unchanged via
the upgrade port.
The CMD16 100 GHz module also contains one upgrade port each in the
Mux/Demux directions for expansion purpose when combined with CMD24
100 GHz module to cover up to 40 add/drop channels.
This CMD16 100 GHz module is a 1U height and intended to be mounted in
a bay.
Figure 1-143 shows the faceplate of a CMD16 100 GHz module. Figure 1-144
on page 1-397 provides functional block diagrams of the CMD16 100 GHz
module.
Figure 1-143
CMD16 100 GHz module faceplate
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Figure 1-144
CMD16 100 GHz ports block diagram (NTT862KA)
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Supported functionality
The CMD16 100 GHz module (NTT862KA) provides the following
functionality:
•
the CMD16 100 GHz module is a passive module and therefore does not
require DC power
•
although the CMD16 100 GHz module is a passive device, automatic
inventory support is still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD16 100
GHz RJ-45 port to the NTK505MBE5 access panel external slot
ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD16 100 GHz RJ-45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD16 100 GHz RJ-45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD16 100
GHz RJ-45 port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD16 100 GHz RJ-45 module's RJ-45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD16 100 GHz RJ-45 port to the access panel
external slot ports).
•
offers 16 channels Mux/Demux at 100 GHz grid listed in Table 1-104 on
page 1-399.
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Table 1-104
CMD16 100 GHz ITU grid 16 wavelength plan and interface ports descriptions
Physical port #
Channel ID of the Wavelength
mux/demux
100 GHz (nm)
Frequency
(THz)
Function
Out / In
Ch 1
1530.33
195.90
Out / In
Ch 2
1531.12
195.80
Out / In
Ch 3
1531.90
195.70
Optical input /
output from the
client-side
interface(s)
Out / In
Ch 4
1532.68
195.60
Out / In
Ch 5
1533.47
195.50
Out / In
Ch 6
1534.25
195.40
Out / In
Ch 7
1535.04
195.30
Out / In
Ch 8
1535.82
195.20
Out / In
Ch 9
1537.40
195.00
Out / In
Ch 10
1538.19
194.90
Out / In
Ch 11
1538.98
194.80
Out / In
Ch 12
1539.77
194.70
Out / In
Ch 13
1540.56
194.60
Out / In
Ch 14
1541.35
194.50
Out / In
Ch 15
1542.14
194.40
Out / In
Ch 16
1542.94
194.30
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Connector
type
LC/UPC
(Note 1)
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1-400 Photonics equipment description
Table 1-104
CMD16 100 GHz ITU grid 16 wavelength plan and interface ports descriptions
Physical port #
Channel ID of the Wavelength
mux/demux
100 GHz (nm)
Frequency
(THz)
Function
Connector
type
Out / In
Common
N/A
N/A
DWDM optical
input / output to
/from the line
amplifier
LC/UPC
Out / In
Upgrade
N/A
N/A
Upgrade ports
for bypass input
/ output and for
expansion to 40
channels
(separate
CMD24 module
needed)
LC/UPC
(Note 2)
Note 1: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).
Note 2: Low reflection terminators are shipped on the Demux upgrade out port to prevent Low ORL
alarms when Common ports connected to AMP.
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•
the channels on the CMD16 100 GHz module have 100% add/drop
capability at each side, allowing one to 16 channels to be added or
dropped.
•
has express path (upgrade port) that is 100 GHz-compliant.
ATTENTION
In the current release, software support for CMD16 modules is limited to
inventory display. Any software feature descriptions that refer to CMD
modules, other than those related to inventory, do not apply to the CMD16
unless stated otherwise.
Cross-connection types
The CMD16 module supports the 2WAY (Bidirectional) cross-connection type
only.
Cross-connection rates
The CMD16 module only supports the OCH (Optical Channel) Photonic
cross-connection rate.
Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Equipping rules
The following equipping rules apply to CMD16 100 GHz modules
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
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•
the CMD16 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD16 100 module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly).
•
the CMD16 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD16 100 GHz optical interface module.
Table 1-105
Technical specifications for CMD16 100 GHz optical interface modules
Parameter
CMD16 100 GHz (NTT862KA)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280 mm / 11.02 in.
Weight (estimated)
4.4 kg (9.8 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Add path maximum insertion losses
• Ch-In to Common Out: 4.8 dB
• Upgrade In to Common Out: 1.2 dB
Drop Path maximum insertion losses
• Common In to Ch-Out: 4.8 dB
• Common In to Upgrade Out: 1.2 dB
Minimum return loss
45 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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24 Channel Mux/Demux (CMD24) 100 GHz C-Band module
(NTT862LA)
Overview
The 24 Channel Mux/Demux (CMD24) 100 GHz C-Band module (also known
as CMD24 100 GHz) is a cost effective module for multiplexing up to 24 optical
DWDM channels into a single fiber pair to provide the ability to add/drop
channels in either non-ROADM applications (i.e. without the requirement to
have a WSS at the site) or Metro ROADM configurations.
The CMD24 100 GHz module is a purely passive module containing WDM
thin-film 3x band splitters and 3x 8-channel filters each in the Mux/Demux
directions for multiplexing and demultiplexing of the 24 100 GHz channels with
frequency range from 194.10 to 191.60 THz (corresponding to a wavelength
range of 1544.53 to 1564.68 nm). The supported channels are listed in Table
1-104 on page 1-399. All other channels are passed through unchanged via
the upgrade port.
The CMD24 100 GHz module also contains one upgrade port each in the
Mux/Demux directions for expansion purpose when combined with CMD16
100 GHz module to cover up to 40 add/drop channels.
This CMD24 100 GHz module is a 1U height and intended to be mounted in
a bay.
Figure 1-145 shows the faceplate of a CMD24 100 GHz module. Figure 1-146
on page 1-404 provides functional block diagrams of the CMD24 100 GHz
module.
Figure 1-145
CMD24 100 GHz module faceplate
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1-404 Photonics equipment description
Figure 1-146
CMD24 100 GHz ports block diagram (NTT862LA)
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Supported functionality
The CMD24 100 GHz module (NTT862LA) provides the following
functionality:
•
the CMD24 100 GHz module is a passive module and therefore does not
require DC power
•
although the CMD24 100 GHz module is a passive device, automatic
inventory support is still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD24 100
GHz RJ-45 port to the NTK505MBE5 access panel external slot
ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CMD24 100 GHz RJ-45 port
to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD24 100 GHz RJ-45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CMD24 100
GHz RJ-45 port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CMD24 100 GHz RJ-45 module's RJ-45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CMD24 100 GHz RJ-45 port to the access panel
external slot ports).
•
offers 24 channels Mux/Demux at 100 GHz grid listed in Table 1-106 on
page 1-406.
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Table 1-106
CMD24 100 GHz ITU grid 24 wavelength plan and interface ports descriptions
Physical port #
Channel ID of the Wavelength
mux/demux
100 GHz (nm)
Frequency
(THz)
Function
Out / In
Ch 1
1544.53
194.10
Out / In
Ch 2
1545.32
194.00
Out / In
Ch 3
1546.12
193.90
Optical input /
output from the
client-side
interface(s)
Out / In
Ch 4
1546.92
193.80
Out / In
Ch 5
1547.72
193.70
Out / In
Ch 6
1548.51
193.60
Out / In
Ch 7
1549.32
193.50
Out / In
Ch 8
1550.12
193.40
Out / In
Ch 9
1551.72
193.20
Out / In
Ch 10
1552.52
193.10
Out / In
Ch 11
1553.33
193.00
Out / In
Ch 12
1554.13
192.90
Out / In
Ch 13
1554.94
192.80
Out / In
Ch 14
1555.75
192.70
Out / In
Ch 15
1556.55
192.60
Out / In
Ch 16
1557.36
192.50
Out / In
Ch 17
1558.98
192.30
Out / In
Ch 18
1559.79
192.20
Out / In
Ch 19
1560.61
192.10
Out / In
Ch 20
1561.42
192.00
Out / In
Ch 21
1562.23
191.90
Out / In
Ch 22
1563.05
191.80
Out / In
Ch 23
1563.86
191.70
Out / In
Ch 24
1564.68
191.60
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Connector
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LC/UPC
(Note 1)
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Photonics equipment description 1-407
Table 1-106
CMD24 100 GHz ITU grid 24 wavelength plan and interface ports descriptions
Physical port #
Channel ID of the Wavelength
mux/demux
100 GHz (nm)
Frequency
(THz)
Function
Connector
type
Out / In
Common
N/A
N/A
DWDM optical
input / output to
/from the line
amplifier
LC/UPC
Out / In
Upgrade
N/A
N/A
Upgrade ports
for bypass input
/ output and for
expansion to 40
channels
(separate
CMD24 module
needed)
LC/UPC
(Note 2)
Note 1: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).
Note 2: Low reflection terminators are shipped on the Demux upgrade out port to prevent Low ORL
alarms when Common ports connected to AMP.
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•
the channels on the CMD24 100 GHz module have 100% add/drop
capability at each side, allowing one to 24 channels to be added or
dropped.
•
has express path (upgrade port) that is 100 GHz-compliant.
ATTENTION
In the current release, software support for CMD24 modules is limited to
inventory display. Any software feature descriptions that refer to CMD
modules, other than those related to inventory, do not apply to the CMD24
unless stated otherwise.
Cross-connection types
The CMD24 module supports the 2WAY (Bidirectional) cross-connection type
only.
Cross-connection rates
The CMD24 module only supports the OCH (Optical Channel) Photonic
cross-connection rate.
Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
Gauge Threshold Crossing Alert Summary
•
Loss of Signal
Equipping rules
The following equipping rules apply to CMD24 100 GHz modules
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
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•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the CMD24 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that CMD24 100 module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly).
•
the CMD24 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CMD24 100 GHz optical interface module.
Table 1-107
Technical specifications for CMD24 100 GHz optical interface modules
Parameter
CMD24 100 GHz (NTT862LA)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 280 mm / 11.02 in.
Weight (estimated)
4.4 kg (9.8 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Add path maximum insertion losses
• Ch-In to Common Out: 5.1 dB
• Upgrade In to Common Out: 1.4 dB
Drop Path maximum insertion losses
• Common In to Ch-Out: 4.8 dB
• Common In to Upgrade Out: 1.4 dB
Minimum return loss
45 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
6500 Packet-Optical Platform
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4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band modules (NTK504AxE5)
Overview
The 4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module (also
known as OMD4 100 GHz) is a cost effective module to increase capacity by
multiplexing up to 4 optical DWDM channels into a single fiber pair to provide
the ability to add/drop channels in either non-ROADM applications (i.e.
without the requirement to have a WSS at the site) or Metro ROADM
configurations.
The OMD4 100 GHz modules have passive group filters and
passthrough/upgrade ports for cascading, therefore each OMD4 is able to add
and drop specific wavelengths assigned to that OMD4 and to allow other
wavelengths to pass through unchanged via the upgrade port.
Each OMD4 100 GHz module is a purely passive module containing WDM
thin-film filters for multiplexing and demultiplexing the four 100 GHz channels
in each of the nine WDM groups. Additionally, an isolator is placed in the
Demux path to ensure limited light is output from the Common In port in the
event of a mistake in connecting the OMD4 ports. One OMD4 100 GHz
module is used per facing direction (if the direction requires local channel
add/drop). This module is a 1U height and intended to be mounted in a bay.
Each OMD4 module supports four DWDM channels in the 100 GHz-spaced
ITU grid. Nine different OMD4 modules are required to cover the entire
C-band for a total of 36 wavelengths. Those nine OMD4 100 GHz modules
are:
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
1 (NTK504AAE5): 1530.33 nm- 1531.12 nm- 1531.90 nm- 1532.68 nm
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
2 (NTK504ABE5): 1534.25 nm- 1535.04 nm- 1535.82 nm- 1536.61 nm
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
3 (NTK504ACE5): 1538.19 nm- 1538.98 nm- 1539.77 nm- 1540.56 nm
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
4 (NTK504ADE5): 1542.14 nm- 1542.94 nm- 1543.73 nm- 1544.53 nm
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
5 (NTK504AEE5): 1546.12 nm- 1546.92 nm- 1547.72 nm- 1548.51 nm
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
6 (NTK504AFE5): 1550.12 nm- 1550.92 nm- 1551.72 nm- 1552.52 nm
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
7 (NTK504AGE5): 1554.13 nm- 1554.94 nm- 1555.75 nm- 1556.55 nm
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•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
8 (NTK504AHE5): 1558.17 nm- 1558.98 nm- 1559.79 nm- 1560.61 nm
•
4 Channel Optical Mux/Demux (OMD4) 100 GHz C-Band module, Group
9 (NTK504AJE5): 1562.23 nm- 1563.05 nm- 1563.86 nm- 1564.68 nm
Table 1-108 shows the supported circuit packs and pluggables that can be
used with OMD4.
Table 1-108
Supported circuit packs and pluggables working with OMD4
Circuit pack or pluggable
PEC
Alarm
correlation
Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503MAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (DC-powered)
Integrated OTN FLEX MOTR circuit pack in 6500 2-slot shelf w/SP + NTK503NAE5 OTM1
OTN Flex MOTR 8xSFP shelf assembly (AC-powered)
OTN FLEX MOTR circuit pack
NTK532BAE5
OTM1
FLEX MOTR circuit pack
NTK531YAE5
OTM2
2.5G MOTR circuit pack
NTK530NAE5 OTM2
NTK530NCE5 OTM2
OTM1
10G OTSC circuit pack
NTK528AAE5
2x10G OTR circuit pack
NTK530PGE5 OTM2
NTK530PME5
4x10G OTR circuit packs
NTK530QA
NTK530QE
NTK530QM
OTM2
SuperMux with XFP circuit pack
NTK535FAE5
OTM2
L2 MOTR circuit pack
NTK531VAE5
OTM2
40G MUX OCI circuit pack
NTK525CAE5 OTM2
NTK525CFE5
40G OCLD circuit packs
NTK539PxE5
Wavelength-Selective 40G OCLD circuit pack
NTK539RxE5
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OTM2
OTM3 (Note
1)
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Table 1-108
Supported circuit packs and pluggables working with OMD4
Circuit pack or pluggable
PEC
Alarm
correlation
100G OCLD circuit packs
NTK539TxE5
100G WL3/WL3e OCLD circuit packs
NTK539Ux
OTM4 (Note
2)
Flex2 WL3/WL3e OCLD circuit packs
NTK539Bx
Flex3 WL3e OCLD circuit packs
NTK539Qx
Flex4 WL3e OCLD circuit packs
NTK539Fx
100G WL3e OTR
NTK538Ux
100G WL3n MOTR
NTK538Bx
DWDM XFP modules (when equipped in the circuit packs listed above NTK588xxE5
provided the circuit pack supports the pluggable)
NTK587xxE5
NTK583AAE5
NTK589xxE5
N/A
DWDM SFP modules (when equipped in the circuit packs listed above NTK585xxE5
provided the circuit pack supports the pluggable)
NTK586xxE5
N/A
OTM4 (Note
2)
Note 1: The client circuit pack that mates with 40G OCLD circuit pack can be
40G MUX OCI, 40G OCI, or 40/43G OCI circuit pack.
Note 2: The client circuit pack that mates with 100G OCLD, 100G WL3 OCLD, Flex4 WL3e OCLD,
Flex3 WL3e OCLD, or Flex2 WL3/WL3e OCLD circuit pack can be 10x10G MUX or 100G OCI circuit
pack.
Figure 1-147 shows the faceplate of an OMD4 100 GHz module. Figure 1-148
on page 1-413 provides functional block diagrams of the OMD4 100 GHz
modules.
Figure 1-147
OMD4 100 GHz module faceplate
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Channel MUX
Upgrade MUX
Figure 1-148
OMD44 100 GHz ports block diagram
Ch-In 1
3
Ch-In 2
5
Ch-In 3
7
Ch-In 4
9
Upgrade In 11
Common Out 2
Common In
1
Channel DeMUX
Upgrade DeMUX
Upgrade Out 12
Isolator
Inventory
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Ch-Out 1
4
Ch-Out 2
6
Ch-Out 3
8
Ch-Out 4
10
Equipment Inventory (RJ-45)
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Supported functionality
The OMD4 100 GHz modules (NTK504AxE5) provide the following
functionality:
•
the OMD4 100 GHz modules are passive modules and therefore do not
require DC power
•
although the OMD4 100 GHz module is a passive device, autoprovisioning
and automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMD4 100
GHz module's RJ-45 port to the NTK505MBE5 access panel external
slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the OMD4 100 GHz module's
RJ-45 port to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMD4 100 GHz module's RJ-45 port to the
NTK505PAE5 access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OMD4 100
GHz module's RJ-45 port to the NTK555NA or NTK555NB external
slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the OMD4 100 GHz RJ-45 module's RJ-45 port to the NTK505JA
access panel external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OMD4 100 GHz module's RJ-45 port to the access
panel external slot ports).
•
offers 36 channels Mux/Demux in nine groups at 100 GHz grid listed in
Table 1-109 on page 1-415
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Table 1-109
OMD4 100 GHz ITU grid 36 wavelength plan
Channel Wavelength
ID of the 100 GHz (nm)
mux/de
mux
Channel Wavelength
ID of the 100 GHz (nm)
mux/dem
ux
Channel Wavelength
ID of the 100 GHz (nm)
mux/de
mux
Group 1 (NTK504AAE5)
Group 4 (NTK504ADE5)
Group 7 (NTK504AGE5)
1
1530.33
31
1542.14
61
1554.13
3
1531.12
33
1542.94
63
1554.94
5
1531.90
35
1543.73
65
1555.75
7
1532.68
37
1544.53
67
1556.55
Group 2 (NTK504ABE5)
Group 5 (NTK504AEE5)
Group 8 (NTK504AHE5)
11
1534.25
41
1546.12
71
1558.17
13
1535.04
43
1546.92
73
1558.98
15
1535.82
45
1547.72
75
1559.79
17
1536.61
47
1548.51
77
1560.61
Group 3 (NTK504ACE5)
Group 6 (NTK504AFE5)
Group 9 (NTK504AJE5)
21
1538.19
51
1550.12
81
1562.23
23
1538.98
53
1550.92
83
1563.05
25
1539.77
55
1551.72
85
1563.86
27
1540.56
57
1552.52
87
1564.68
•
the channels on the OMD4 100 GHz module have 100% add/drop
capability at each side, allowing one to 4 channels to be added or dropped.
•
has express path (upgrade port) that is 100 GHz-compliant.
•
unlike the SCMD4 circuit packs, the OMD4s does not have voltage
controlled optical attenuator (VOA) for channel level optical power
monitoring and adjustment
•
Demux path includes an isolator to ensure the pre-amp APR (Automatic
Power Reduction) does not get triggered with a Tx to Ch Out
misconnection
•
see Table 1-110 on page 1-416 for function and connector type for each
port.
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Table 1-110
OMD4 100 GHz optical interfaces
Interface name
Physical port #
Function
Connector type
Ch 1 In / Out
Ch 2 In / Out
Ch 3 In / Out
Ch 4 In / Out
3/4
5/6
7/8
9 / 10
Optical input / output from the client-side
interface(s)
LC
Common In / Out
1/2
The OMD4 Common In/Out ports are
connected to:
LC
• the office fiber plant or the LIM Line A
Out (port 7) of the amplifier circuit pack
when the OMD4 circuit pack is the first
group in the cascading order.
• the preceding OMD4 Upgrade In/Out
ports when the OMD4 circuit pack is
not the first group in the cascading
order.
Upgrade In / Out
11 / 12
Group level bypass input / output
LC (LC/UPC (Note)
terminators are
shipped on the
Demux upgrade
out port)
Note: UPC stands for “Ultra Polished Connector”. The ORL from a UPC connector type is better than
that of a PC connector type, but not as good as that of an APC (angled PC).
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Duplicate Adjacency Discovered
•
Group Loss of Signal
•
Loss of Signal
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Equipping rules
The following equipping rules apply to OMD4 100 GHz modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the OMD4 100 GHz module must be located in the same bay as the
access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot
shelf), shelf processor w/access panel (SPAP) circuit pack
(NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC 2xSFP
(NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf, or
integrated access panel (in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf) that OMD4 100 GHz module connects to (by using the
NTTC09BME6 or NTTC09DM cable assembly).
•
the OMD4 100 GHz modules do not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the OMD4 100 GHz optical interface modules.
Table 1-111
Optical specifications for OMD4 modules
Parameter
OMD4 (NTK504AxE5)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated)
3.0 kg (6.6 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
40 dB
Working bandwidth
+/- 12.5 GHz
Add path maximum insertion losses
• Ch-In to Common Out: 2.5 dB
• Upgrade In to Common Out: 1.1 dB
Drop Path maximum insertion losses
• Common In to Ch-Out: 3.3 dB
• Common In to Upgrade Out: 0.75 dB
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Broadband Mux/Demux 1x2 module (NTT862DAE5)
Overview
The Broadband Mux/Demux 1x2 module (also known as BMD2) is a cost
effective way to increase capacity. It provides low cost 50 GHz Mux/Demux for
ROADMs and WSS-based terminals.
The BMD2 module is used together with a WSS 50 GHz w/OPM 2x1 (triple
slot-wide and single slot-wide variants) circuit pack to allow full 88 channel
support and freeing up a switch port for passthrough traffic.
The BMD2 module has two wide-band optical couplers that perform the
function of coupler on the MUX side and power splitter on the DEMUX side.
The BMD2 module is a 1U height and intended to be mounted in a bay.
Figure 1-149 shows the faceplate of a BMD2 module and Figure 1-150 on
page 1-420 provides a functional block diagram of the BMD2 module.
Figure 1-149
BMD2 module faceplate
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Figure 1-150
BMD2 module block diagram (NTT862DAE5)
Common Out 2
Passive
Mux
2x1
Isolator
Passive
Demux
1x2
Inventory
Mux In 1
3
Mux In 2
5
Common In
1
Demux Out-1 4
Demux Out-2 6
Equipment
Inventory
(RJ-45)
Supported functionality
The BMD2 module (NTT862DAE5) provides the following functionality:
•
the BMD2 modules are passive modules and therefore do not require DC
power
•
although the BMD2 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the BMD2 RJ-45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the BMD2 RJ-45 port to the
NTK605MAE5 access panel external slot ports).
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— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the BMD2 RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the BMD2 RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the BMD2 module's RJ-45 port to the NTK505JA access panel
external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the BMD2 RJ-45 port to the access panel external slot
ports).
•
the channels on the BMD2 module have 100% add/drop capability at each
side, allowing one to 88 channels to be added or dropped. The
combination of WSS 50 GHz w/OPM 2x1 (triple slot-wide and single
slot-wide variants) circuit pack and CMD44, Enhanced CMD44, or BMD2
modules (at ROADM or WSS-based terminal sites) is required to perform
add/drop operation.
•
the BMD2 module can be used as a Transponder Protection Tray (TPT) to
provide line and/or client protection for 2x10G OTR and SuperMux circuit
packs.
•
see Table 1-112 for function and connector type for each port.
Table 1-112
BMD2 module
Interface name
Common In / Out
Physical port #
1/2
Function
Connector type
WSS Switch Out port / Switch In port (if
WSS is a NTK553KCE5 variant)
LC
WSS Drop Out port / Add In port (if WSS
is a NTK553KAE5 variant)
Input 1 In / Out
Input 2 In / Out
3/4
5/6
CMD44 50 GHz or Enhanced CMD44 50
GHz Common Out/CMD44 50 GHz or
Enhanced CMD44 50 GHz Common In
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Equipping rules
The following equipping rules apply to BMD2 modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the BMD2 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
BMD2 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
•
the BMD2 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the BMD2 optical interface module.
Table 1-113
Technical specifications for BMD2 optical interface modules
Parameter
BMD2 (NTT862DAE5)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated)
4.2 kg (9.0 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
45 dB
Working bandwidth
1528 to 1570 nm
Max insertion loss (Mux ports)
3.8 dB
Max insertion loss (Demux ports)
4.15 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (NTT862DCE5)
Overview
The Upgrade Broadband Mux/Demux 1x2 (UBMD2) module (also known as
UBMD2) is a cost effective way to increase capacity and performs three main
functions:
•
50/50 upgrade splitter/combiner that allows the Ciena SLTE to be inserted
into an existing wet plant that is to be shared with an existing incumbent’s
SLTE as part of an upgrade.
•
isolator, as it stops the counter propagating power from reaching the
amplifier.
•
transmit monitoring by using its transmit signal monitoring port intended
for connection to an external OSA.
This module is a 1U height and intended to be mounted in a bay.
The UBMD2 modules are only used in Submarine applications.
Figure 1-151 shows the faceplate of a UBMD2 module and Figure 1-152 on
page 1-425 provides a functional block diagram of the UBMD2 module.
Figure 1-151
UBMD2 module faceplate
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Figure 1-152
UBMD2 module block diagram (NTT862DCE5)
OSA Monitor Out
Passive
Mux 2x2
Common Out 2
Passive
Demux 1x2
Mux In 1
3
Mux In 2
5
Common In
Isolator
Inventory
9
1
Demux Out 1
4
Demux Out 2
6
Isolator In
7
Isolator Out
8
Equipment
Inventory
(RJ-45)
Legend
OSA
Optical Spectrum Analyzer
Supported functionality
The UBMD2 module (NTT862DCE5) provides the following functionality:
•
the UBMD2 modules are passive modules and therefore do not require
DC power
•
although the UBMD2 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UBMD2 RJ-45
port to the NTK505MBE5 access panel external slot ports).
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— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the UBMD2 RJ-45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UBMD2 RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UBMD2 RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the UBMD2 module's RJ-45 port to the NTK505JA access panel
external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UBMD2 RJ-45 port to the access panel external slot
ports).
•
see Table 1-114 for function and connector type for each port.
Table 1-114
UBMD2 module
Interface name
Physical port #
Function
Connector type
Common In / Out
1/ 2
50/50% Coupler / Splitter Common
SC / SC
In Mux 1 / Out Demux 1
3/4
Upgrade in/out pair 1 (50% or 3dB)
SC / SC
In Mux 2 / Out Demux 2
5/ 6
Upgrade in/out pair 2 (50% or 3dB)
SC / SC
Isolator In / Out
7/ 8
Optical Isolator
SC / SC
OSA Monitor Out
9
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A copy of the common out signal
SC
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Equipping rules
The following equipping rules apply to UBMD2 modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the UBMD2 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
UBMD2 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
•
the UBMD2 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the UBMD2 optical interface module.
Table 1-115
Technical specifications for UBMD2 optical interface modules
Parameter
UBMD2 (NTT862DCE5)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated)
4.2 kg (9.0 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
45 dB
Working bandwidth
1528 to 1570 nm
Max insertion loss (Add or Drop)
3.8 dB
Max insertion loss (Isolator)
0.7 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Monitor Broadband Mux/Demux 1x2 (MBMD2) module (NTT862DDE5)
Overview
The Monitor Broadband Mux/Demux 1x2 (MBMD2) module (also known as
MBMD2) is a cost effective way to increase capacity and to provide a point
where submarine line monitoring equipment can be inserted and extracted.
As submarine lines use a Coherent (or Correlated) OTDR (C-OTDR) test set
to detect repeater and fiber conditions (cuts, reflection points, etc.), the
MBMD2 provides a 90/10 Splitter/Combiner port where the CODTR or other
equipment can be connected for fiber measurements. The 10% splitter output
is also connected to the OSIC Rx port during normal operation, when the
submarine line has an OSIC supported supervisory capability.
This module is a 1U height and intended to be mounted in a bay.
The MBMD2 modules are only used in Submarine applications.
Figure 1-153 shows the faceplate of a MBMD2 module and Figure 1-154 on
page 1-430 provides a functional block diagram of the MBMD2 module.
Figure 1-153
MBMD2 module faceplate
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Figure 1-154
MBMD2 module block diagram (NTT862DDE5)
Common Out 2
Passive
90% / 10%
Mux 2x1
Mux In 1 (90%) 3
Passive
90% / 10%
Demux 1x2
Common In
Mux In 2 (10%) 5
1
Demux Out 1 (90%) 4
Demux Out 2 (10%) 6
Inventory
Equipment
Inventory
(RJ-45)
Supported functionality
The MBMD2 modules (NTT862DDE5) provide the following functionality:
•
the MBMD2 modules are passive modules and therefore do not require
DC power
•
although the MBMD2 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the MBMD2 RJ-45
port to the NTK505MBE5 access panel external slot ports).
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— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the MBMD2 RJ-45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the MBMD2 RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the MBMD2 RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the MBMD2 module's RJ-45 port to the NTK505JA access panel
external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the MBMD2 RJ-45 port to the access panel external slot
ports).
•
see Table 1-116 for function and connector type for each port.
Table 1-116
MBMD2 module
Interface name
Physical port #
Function
Connector type
Common In / Out
1/ 2
90/100% Coupler / Splitter Common
SC / SC
In Mux 1 / Out Demux 1
3/4
Through in/out pair 1 (90% or 1dB)
SC / SC
In Mux 2 / Out Demux 2
5/ 6
Monitor in/out pair 2 (10% or 10-dB)
SC / SC
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Equipping rules
The following equipping rules apply to MBMD2 modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the MBMD2 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
MBMD2 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
•
the MBMD2 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the MBMD2 optical interface module.
Table 1-117
Technical specifications for MBMD2 optical interface modules
Parameter
MBMD2 (NTT862DDE5)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated)
4.2 kg (9.0 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
45 dB
Working bandwidth
1528 to 1570 nm
Max insertion loss (Add or Drop), 90% path
1.1 dB
Max insertion loss (Add or Drop), 10% path
11.5 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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C/L-Band Mux/Demux (CLMD) module (NTK504PA)
Overview
The C/L-Band Mux/Demux (CLMD) module (also known as CLMD) is a cost
effective way to increase capacity and performs three main functions:
•
multiplexing (combining) or demultiplexing (splitting) the C and L-Band
signals.
•
isolator, as it stops the counter propagating power from reaching the
amplifier.
•
transmit monitoring by using its transmit signal monitoring port intended
for connection to an external OSA.
The CLMD module is a 1U height and intended to be equipped in an OMC2
chassis.
The CLMD modules are only used in Submarine C-Band or L-Band
applications.
Figure 1-155 shows the faceplate of a CLMD module and Figure 1-156
provides a functional block diagram of the CLMD module.
Figure 1-155
CLMD module faceplate
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Figure 1-156
CLMD module block diagram (NTK504PA)
C-Band In
3
L-Band In
5
Common-Out
Isolator
Isolator
2
Monitor 2 Out
12
Monitor 1 Out
11
Common In
1
C-Band Out
4
L-Band Out
6
C-Band Isolator In
7
C-Band Isolator Out
8
L-Band Isolator In
9
L-Band Isolator Out 10
Inventory
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Supported functionality
The CLMD module (NTK504PA) provides the following functionality:
•
the CLMD modules are passive modules and therefore do not require DC
power
•
although the CLMD module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CLMD RJ-45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the CLMD RJ-45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CLMD RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the CLMD RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the CLMD module's RJ-45 port to the NTK505JA access panel
external slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the CLMD RJ-45 port to the access panel external slot
ports).
•
see Table 1-118 for function and connector type for each port.
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Table 1-118
CLMD module
Interface name
Physical port #
Function
Connector type
Common In / Out
1/ 2
Combined C/L-Band input/output
LC / LC
C-Band In / C-Band Out
3/4
C-Band mux/demux signal
LC / LC
L-Band In / L-Band Out
5/6
L-Band mux/demux signal
LC / LC
C-Band Isolator In / Out
7/ 8
C-Band optical Isolator
LC / LC
L-Band Isolator In / Out
9/ 10
L-Band optical Isolator
LC / LC
Monitor 1 Out
11
Monitor port for C-Band mux/demux
signal
LC
Monitor 2 Out
12
Monitor port for L-Band mux/demux
signal
LC
Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Equipping rules
The following equipping rules apply to CLMD modules:
•
occupies one of the half-width slots of OMC2 chassis
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
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•
the CLMD module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
CLMD module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
•
the CLMD modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the CLMD optical interface module.
Table 1-119
Technical specifications for CLMD optical interface modules
Parameter
CLMD (NTK504PA)
Weight (estimated)
1.2 kg (2.6 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Transmission/Reflection working C-Band bandwidth
1504.5 to 1565.3 nm/1569.8 to 1610.5 nm
Transmission/Reflection working L-Band bandwidth
1569.8 to 1610.5 nm/1504.5 to 1565.3 nm
Max Common In to C-Band Out EOL
2.25 dB
Max Common In to L-Band Out EOL
2.05 dB
Min C-Band In to Common Out EOL
0.4 dB (in addition to the maximum insertion
loss)
Max C-Band In to Common Out EOL
1.85 dB
Min L-Band In to Common Out EOL
0.4 dB (in addition to the maximum insertion
loss)
Max L-Band In to Common Out EOL
1.65 dB
Max insertion loss (Isolator)
0.7 dB
Output monitor insertion loss EOL
12.2 to 14.1 dB
Input monitor insertion loss EOL
13 to 14.4 dB
Minimum return loss
45 dB
Min Common In to L-Band Out filter isolation
30 dB
Min Common In to C-Band Out filter isolation
35 dB
Min C-Band In to Common Out filter isolation
20 dB
Min L-Band In to Common Out filter isolation
15 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Upgrade Coupler/Splitter (UCS) module (NTK504PL)
Overview
The Upgrade Coupler/Splitter (UCS) module (also known as UCS) is a cost
effective way to increase capacity and performs three main functions:
•
50/50 upgrade splitter/combiner that allows the Ciena SLTE to be inserted
into an existing wet plant that is to be shared with an existing incumbent’s
SLTE as part of an upgrade.
•
isolator, as it stops the counter propagating power from reaching the
amplifier.
•
transmit monitoring by using its transmit signal monitoring port intended
for connection to an external OSA.
The UCS module is 1U in height and intended to be equipped in an OMC2
chassis.
The UCS modules are only used in Submarine C-Band or L-Band
applications.
Figure 1-157 shows the faceplate of a UCS module and Figure 1-158 on page
1-441 provides a functional block diagram of the UCS module.
Figure 1-157
UCS module faceplate
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Upgrade
Mux
Figure 1-158
UCS module block diagram (NTK504PL)
Ch-In 1
3
Ch-In 2
5
Common-Out
Upgrade
DeMux
Isolator
Isolator
Inventory
2
OSA Monitor Out
9
Common-In
1
Ch-Out 1
4
Ch-Out 2
6
C-Band Isolator In
7
C-Band Isolator Out
8
Equipment
Inventory
(RJ-45)
Legend
OSA
Optical Spectrum Analyzer
Supported functionality
The UCS module (NTK504PL) provides the following functionality:
•
the UCS modules are passive modules and therefore do not require DC
power
•
although the UCS module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
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— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UCS RJ-45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the UCS RJ-45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UCS RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the UCS RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the UCS module's RJ-45 port to the NTK505JA access panel external
slot ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the UCS RJ-45 port to the access panel external slot ports).
•
see Table 1-120 for function and connector type for each port.
Table 1-120
UCS module
Interface name
Physical port #
Function
Connector type
Common In / Out
1/ 2
50/50% Coupler / Splitter Common
LC / LC
Mux In 1 / Demux 1 Out
3/4
Upgrade in/out pair 1 (50% or 3dB)
LC / LC
Mux In 2 / Demux 2 Out
5/ 6
Upgrade in/out pair 2 (50% or 3dB)
LC / LC
Isolator In / Out
7/ 8
Optical Isolator
LC / LC
OSA Monitor Out
9
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A copy of the common out signal
LC
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Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Adjacency alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
High Fiber Loss
Equipping rules
The following equipping rules apply to UCS modules:
•
occupies one of the half-width slots of OMC2 chassis.
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the UCS module must be located in the same bay as the access panel (in
6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
the UCS module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
•
the UCS modules do not use any cross-connect capacity and can be used
with shelves equipped with or without cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the UCS optical interface module.
Table 1-121
Technical specifications for UCS optical interface modules
Parameter
UCS (NTK504PL)
Weight (estimated)
1.2 kg (2.6 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
24 dBm
Minimum return loss
45 dB
Working bandwidth
1527 to 1610.5 nm
Max insertion loss (Add or Drop)
3.9 dB
Max insertion loss (Isolator)
0.7 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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10 Group Mux/Demux (GMD10) C-Band module (NTT862GA) and 10
Group Mux/Demux (GMD10) L-Band module (NTT862GL)
Overview
The 10 Group Mux/Demux (GMD10) C-Band module (also known as GMD10
C-Band) and 10 Group Mux/Demux (GMD10) L-Band module (also known as
GMD10 L-Band) are cost effective ways to provide multiplexing points for
channels from CCMD12 C-Band and CCMD12 L-Band circuit packs. The
GMD10 C-Band and GMD10 L-Band are passive modules and enable the
system to utilize the spectrum better as they remove the restrictions on
channel spacing within the groups. The GMD10 C-Band module is used
together with CCMD12 C-Band circuit pack and the GMD10 L-Band module
is used together with CCMD12 L-Band circuit pack. The GMD10 L-Band
modules are only used in Submarine applications.
Each GMD10 C-Band or GMD10 L-Band module includes 10 wide groups
(one Mux/Demux port per group) with no restrictions on channel spacing
within the groups. Table 1-122 on page 1-446 shows the supported frequency
range and wavelength range for each group in GMD10 C-Band module. Table
1-123 on page 1-446 shows the supported frequency range and wavelength
range for each group in GMD10 L-Band module.
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Table 1-122
Supported frequency range and wavelength range for each group in a GMD10
C-Band module
Group#
Frequency range (THz)
Wavelength range (nm)
1
196.215 to 195.485
1527.88 to 1533.58
2
195.735 to 195.005
1531.62 to 1537.36
3
195.255 to 194.525
1535.39 to 1541.15
4
194.775 to 194.045
1539.17 to 1544.96
5
194.295 to 193.565
1542.98 to 1548.79
6
193.815 to 193.085
1546.80 to 1552.64
7
193.335 to 192.605
1550.64 to 1556.51
8
192.855 to 192.125
1554.50 to 1560.40
9
192.375 to 191.645
1558.38 to 1564.31
10
191.895 to 191.165
1562.27 to 1568.24
Table 1-123
Supported frequency range and wavelength range for each group in a GMD10
L-Band module
Group#
Frequency range (THz)
Wavelength range (nm)
1
191.156 to 190.426
1568.31 to 1574.33
2
190.676 to 189.946
1572.26 to 1578.30
3
190.196 to 189.466
1576.23 to 1582.30
4
189.716 to 188.986
1580.22 to 1586.32
5
189.236 to 188.506
1584.23 to 1590.36
6
188.756 to 188.026
1588.25 to 1594.42
7
188.276 to 187.546
1592.30 to1598.50
8
187.796 to 187.066
1596.37 to 1602.60
9
187.316 to 186.586
1600.46 to 1606.73
10
186.836 to 186.106
1604.58 to 1610.87
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Figure 1-159 shows the faceplate of a GMD10 (C-Band or L-Band) circuit
pack. Figure 1-160 on page 1-448 provides a functional block diagram of the
GMD10 (C-Band or L-Band) circuit pack. For GMD10 L-Band circuit pack, the
circuit pack’s block diagram is the same as GMD10 C-Band circuit pack’s
block diagram.
Figure 1-159
GMD10 C-Band module faceplate
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Figure 1-160
GMD10 (C-Band and L-Band) module block diagram (NTT862GA and NTT862GL)
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Supported functionality
The GMD10 modules (NTT862GA and NTT862GL) provide the following
functionality:
•
the GMD10 modules are passive modules and therefore do not require DC
power
•
although the GMD10 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the GMD10 RJ-45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the GMD10 RJ-45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the GMD10 RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the GMD10 RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the GMD10 RJ-45 port to the NTK505JA access panel external slot
ports).
•
see Table 1-124 on page 1-450 for function and connector type for each
port.
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Table 1-124
GMD10 module (C-Band and L-Band)
Interface name
Physical port #
Common In / Out
1/2
Function
Connector type
• For GMD10 C-Band variant: Optical
input /output to/from the WSS Flex
C-Band w/OPM 9x1 or MBMD2 circuit
pack
LC
• For GMD10 L-Band variant: Optical
input /output to/from the WSS Flex
L-Band w/OPM 8x1 circuit pack
Group 1 In / Out
3/4
Group 2 In / Out
5/6
Group 3 In / Out
7/8
Group 4 In / Out
9 / 10
Group 5 In / Out
11 / 12
Group 6 In / Out
13 / 14
Group 7 In / Out
15 / 16
Group 8 In / Out
17 / 18
Group 9 In / Out
19 / 20
Group 10 In / Out
21 / 22
Monitor Out
24
• For GMD10 C-Band variant: Optical
input / output channels from Common
In / Out ports of CCMD12 C-Band
LC
• For GMD10 L-Band variant: Optical
input / output channels from Common
In / Out ports of CCMD12 L-Band
Monitor port for GMD10 Mux Out
LC
Alarms
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Adjacency alarms
• Adjacency Mismatch
•
Duplicate Adjacency Discovered
•
High Fiber Loss
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Equipping rules
The following equipping rules apply to GMD10 modules (C-Band and L-Band):
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
cannot be equipped with the 2-slot shelf.
•
the GMD10 module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf) that
GMD10 module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
•
the GMD10 modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the GMD10 (C-Band and L-Band) optical interface module.
Table 1-125
Technical specifications for GMD10 optical interface modules (C-Band and L-Band)
Parameter
GMD10 C-Band (NTT862GA) GMD10 L-Band (NTT862GL)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated)
3.6 kg (7.9 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Maximum total Input power
27 dBm
Frequency range
196.215 THz to 191.165 THz
191.156 THz to 186.106 THz
Wavelength range
1527.88 nm to 1568.24 nm
1568.31 nm to 1610.87 nm
Maximum insertion loss (Demux
ports)
6.5 dB
Minimum insertion loss (Demux ports)
5.5 dB
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Table 1-125
Technical specifications for GMD10 optical interface modules (C-Band and L-Band)
Parameter
GMD10 C-Band (NTT862GA) GMD10 L-Band (NTT862GL)
Maximum insertion loss (Mux ports)
7.0 dB
Minimum insertion loss (Mux ports)
6.0 dB
Maximum insertion loss (Monitor port)
18.5 dB
Minimum insertion loss (Monitor port)
15.5 dB
Maximum Insertion loss variation
across all groups
0.5 dB
Minimum return loss
45 dB
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Fiber Interconnect Modules (FIM) (NTK504CA, NTK504CB,
NTK504CD, NTK504CE, and NTK504CF)
Overview
The FIM modules are intended to be mounted in a bay and Table 1-126 lists
the different variants of FIM Modules supported in this release.
Table 1-126
Supported FIM modules
Name (order code)
Also known Function
as
Upgrade support
Fiber Interconnect
Module (FIM) Type 1
(NTK504CA)
FIM Type 1
The upgrade ports on a FIM
Type 1 can be used to perform
add/drop expansion for
CCMD8x16 channels by using
FIM Type 2 (supported in a
future release).
Provides simplified
interconnects for up to
• eight WSS Flex C-Band
w/OPM 20x1 circuit packs
(degree connections), and
• 11 CCMD8x16 circuit packs
(add/drop ports)
Fiber Interconnect
Module (FIM) Type 2
(NTK504CB)
FIM Type 2
N/A
Provides simplified
interconnects for up to
• eight WSS Flex C-Band
w/OPM 20x1 circuit packs
(degree connections), and
• 20 CCMD8x16 circuit packs
(add/drop ports)
Fiber Interconnect
Module (FIM) Type 4
(NTK504CD)
FIM Type 4
N/A
Provides simplified
interconnects for up to four
WSS Flex C-Band w/OPM 20x1
circuit packs and 20 CCMD12
C-Band circuit packs.
Fiber Interconnect
Module (FIM) Type 5
(NTK504CE)
FIM Type 5
Provides simplified
interconnects for up to five WSS
Flex C-Band w/OPM 20x1
circuit packs.
Fiber Interconnect
Module (FIM) Type 6
(NTK504CF)
FIM Type 6
N/A
Provides simplified
interconnects for up to ten WSS
Flex C-Band w/OPM 20x1
circuit packs.
The upgrade ports on a FIM
Type 5 can be used to perform
add/drop expansion
(supported in a future release).
•
Figure 1-161 on page 1-454 shows the faceplate of a FIM Type 1 module
•
Figure 1-162 on page 1-454 shows the faceplate of a FIM Type 2 module.
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•
Figure 1-163 on page 1-455 shows the faceplate of a FIM Type 4 module.
•
Figure 1-164 on page 1-455 shows the faceplate of a FIM Type 5 module.
•
Figure 1-165 on page 1-455 shows the faceplate of a FIM Type 6 module.
•
Figure 1-166 on page 1-456 provides a functional block diagram of the FIM
Type 1 module
•
Figure 1-167 on page 1-457 provides a functional block diagram of the FIM
Type 2.
•
Figure 1-168 on page 1-458 provides a functional block diagram of the FIM
Type 4.
•
Figure 1-169 on page 1-459 provides a functional block diagram of the FIM
Type 5.
•
Figure 1-170 on page 1-460 provides a functional block diagram of the FIM
Type 6.
Figure 1-161
FIM Type 1 module faceplate
Figure 1-162
FIM Type 2 module faceplate
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Figure 1-163
FIM Type 4 module faceplate
Figure 1-164
FIM Type 5 module faceplate
Figure 1-165
FIM Type 6 module faceplate
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Legend
Figure 1-166
FIM Type 1 module block diagram (NTK504CA)
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Legend
Figure 1-167
FIM Type 2 module block diagram (NTK504CB)
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Legend
Figure 1-168
FIM Type 4 module block diagram (NTK504CD)
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Legend
Figure 1-169
FIM Type 5 module block diagram (NTK504CE)
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Legend
Figure 1-170
FIM Type 6 module block diagram (NTK504CF)
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Supported functionality
The FIM Type 1 module (NTK504CA), FIM Type 2 module (NTK504CB), FIM
Type 4 module (NTK504CD), FIM Type 5 module (NTK504CE), and
FIM Type 6 module (NTK504CF) provide the following functionality:
•
are passive modules and therefore do not require DC power.
•
see Table 1-127 for supported loopback modules in FIMs.
Table 1-127
FIM optical interfaces, loopback modules and dust caps
FIM type
MPO ports
Duplex LC connector positions
Number of pre-installed
MPO loopback modules
(APC, SM, 12 Fiber)
(299-1576-001) (Note 1,
Note 2, and Note 3)
Number of
dust caps
Number of pre-installed Number of
dust caps
duplex LC Loopback
(SM) modules
(299-1575-001)
FIM Type 1
50 (MPO ports 5 to 54)
4 (MPO ports
1 to 4)
16 (one for each duplex
LC connector position)
0
FIM Type 2
68 (MPO ports 5 to 72)
4 (MPO ports
1 to 4)
N/A
N/A
FIM Type 4
0
4 (MPO ports
1 to 4)
20 (one for each duplex
LC connector position)
0
FIM Type 5
4 (MPO ports 2 to 5)
1 (MPO port 1) 5 (one for each duplex LC 0
connector position)
FIM Type 6
8 (MPO ports 2 to 5 and
ports 7 to 10)
2 (MPO ports
1 and 6)
N/A
N/A
Note 1: In addition to providing the optical loopback operation required by applications that use the FIM,
these loopback modules act as dust caps for the optical connectors.
Note 2: Do not remove the loopback modules except as part of a fiber installation procedure. Any FIM
connector not equipped with a loopback module or fiber patch cord must be equipped with a dust cap.
The FIM tray assembly includes a bag of dust caps that must be put on any loopback module that is
being removed and saved for future use. Removing the loopback and replacing with a simple dust cap
in FIMs could result in High Fiber Loss.
Note 3: With the exception of Upgrade (UPG) and CMD In/Out ports on the FIM Type 4, related optical
signals are bundled through 12-fiber MPO connectors for fiber management simplification. Use
MPO(F)-MPO(F), APC, 12 Fiber, SM fiber crossover patchcords such as NTTC97Ax or NTTC97AxV6.
Refer to “Cables” section in Planning - Ordering Information, 323-1851-151.
•
although the FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and FIM
Type 6 modules are passive devices, autoprovisioning and automatic
inventory support are still possible if using
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— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the FIM module’s RJ-45 port to the
NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the FIM module’s RJ-45 port to the NTK605MAE5
access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09DM cable assembly is required to connect the FIM
module’s RJ-45 port to the NTK505PAE5 access panel external slot
ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly
is required to connect the FIM module’s RJ-45 port to the NTK555NA
or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the FIM module’s
RJ-45 port to the NTK505JA access panel external slot ports).
•
see the following table for function and connector type for each port.
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Table 1-128
FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and FIM Type 6 modules
Interface name Physical port # FIM Type
Function
Connector type
WSS ports (applied to all FIM types)
WSS1 A/B/C/D
WSS2 A/B/C/D
WSS3 A/B/C/D
WSS4 A/B/C/D
WSS5 A/B/C/D
WSS6 A/B/C/D
WSS7 A/B/C/D
WSS8 A/B/C/D
1/2/3/4
5/6/7/8
9/10/11/12
13/14/15/16
17/18/19/20
21/22/23/24
25/26/27/28
29/30/31/32
12-Fiber
• FIM Type 1 WSS ports on FIM Type 1 or
MPO/APC Male
FIM
Type
2
module
are
• FIM Type 2
connected to WSS Flex C-Band
w/OPM 20x1 circuit packs (up
to eight).
1
2
3
4
1
2
3
4
FIM Type 4
(Note)
12-Fiber
WSS ports on FIM Type 4
module are connected to WSS MPO/APC Male
Flex C-Band w/OPM 20x1
circuit packs (up to four). In this
release, two MPO ports on a
FIM Type 4 are dedicated to the
same WSS Flex C-Band
w/OPM 20x1 circuit pack,
therefore a FIM Type 4 module
can be connected to up to only
two different WSS Flex C-Band
w/OPM 20x1 circuit packs. In
future releases, a FIM Type 4
module can be connected to up
to four different WSS Flex
C-Band w/OPM 20x1 circuit
packs.
(Note)
1
2
3
4
5
1
2
3
4
5
FIM Type 5
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12-Fiber
WSS ports on FIM Type 5
module are connected to WSS MPO/APC Male
Flex C-Band w/OPM 20x1
circuit packs (up to five).
(Note)
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Table 1-128
FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and FIM Type 6 modules
Interface name Physical port # FIM Type
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9
10
FIM Type 6
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Function
Connector type
12-Fiber
WSS ports on FIM Type 6
module are connected to WSS MPO/APC Male
Flex C-Band w/OPM 20x1
circuit packs (up to ten).
(Note)
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Table 1-128
FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and FIM Type 6 modules
Interface name Physical port # FIM Type
Function
Connector type
Upgrade ports (applied to FIM Type 1 and FIM Type 5 modules)
UPG1A In/Out
UPG1B In/Out
UPG2A In/Out
UPG2B In/Out
UPG3A In/Out
UPG3B In/Out
UPG4A In/Out
UPG4B In/Out
UPG5A In/Out
UPG5B In/Out
UPG6A In/Out
UPG6B In/Out
UPG7A In/Out
UPG7B In/Out
UPG8A In/Out
UPG8B In/Out
33/34
35/36
37/38
39/40
41/42
43/44
45/46
47/48
49/50
51/52
53/54
55/56
57/58
59/60
61/62
63/64
FIM Type 1
LC-UPC
Up to eight upgrade ports on
FIM Type 1 module are
connected to WSS Flex C-Band
w/OPM 20x1 circuit packs for
add/drop expansion.
UPG 1 Out/In
UPG 2 Out/In
UPG 3 Out/In
UPG 4 Out/In
UPG 5 Out/In
10/11
20/21
30/31
40/41
40/41
FIM Type 5
Upgrade ports on FIM Type 5 LC-UPC
module are connected to WSS
Flex C-Band w/OPM 20x1
circuit packs (up to five).
Upgrade ports on FIM Type 5
module are not supported in this
release.
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Table 1-128
FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and FIM Type 6 modules
Interface name Physical port # FIM Type
Function
Connector type
CMD ports (applied to FIM Type 1, FIM Type 2 and FIM Type 4 modules)
CMD1 A/B
CMD2 A/B
CMD3 A/B
CMD4 A/B
CMD5 A/B
CMD6 A/B
CMD7 A/B
CMD8 A/B
CMD9 A/B
CMD10 A/B
CMD11 A/B
65/66
67/68
69/70
71/72
73/74
75/76
77/78
79/80
81/82
83/84
85/86
FIM Type 1
CMD1 A/B
CMD2 A/B
CMD3 A/B
CMD4 A/B
CMD5 A/B
CMD6 A/B
CMD7 A/B
CMD8 A/B
CMD9 A/B
CMD10 A/B
CMD11 A/B
CMD12 A/B
CMD13 A/B
CMD14 A/B
CMD15 A/B
CMD16 A/B
CMD17 A/B
CMD18 A/B
CMD19 A/B
CMD20 A/B
33/34
35/36
37/38
39/40
41/42
43/44
45/46
47/48
49/50
51/52
53/54
55/56
57/58
59/60
61/62
63/64
65/66
67/68
69/70
70/72
FIM Type 2
CMD ports on FIM Type 1
module are connected to
CCMD8x16 ports (up to 11).
12-Fiber
MPO/APC Male
(Note)
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CMD ports on FIM Type 2
module are connected to
CCMD8x16 ports (up to 20).
12-Fiber
MPO/APC Male
(Note)
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323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-467
Table 1-128
FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and FIM Type 6 modules
Interface name Physical port # FIM Type
CMD1 Out/In
CMD2 Out/In
CMD3 Out/In
CMD4 Out/In
CMD5 Out/In
CMD6 Out/In
CMD7 Out/In
CMD8 Out/In
CMD9 Out/In
CMD10 Out/In
CMD11 Out/In
CMD12 Out/In
CMD13 Out/In
CMD14 Out/In
CMD15 Out/In
CMD16 Out/In
CMD17 Out/In
CMD18 Out/In
CMD19 Out/In
CMD20 Out/In
10/11
12/13
14/15
16/17
18/19
20/21
22/23
24/25
26/27
28/29
30/31
32/33
34/35
36/37
38/39
40/41
42/43
44/45
46/47
48/49
FIM Type 4
Function
Connector type
CMD ports on FIM Type 4
module are connected to
CCMD12 C-Band ports (up to
20).
LC-UPC
Note: For these ports, use MPO(F)-MPO(F), APC, 12 Fiber, SM fiber crossover patchcords such as
NTTC97Ax or NTTC97AxV6.
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
•
Cable Trace Compromised
Photonic alarms
• Adjacency Mismatch
•
Adjacency Far End Not Discovered
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Equipping rules
The following equipping rules apply to FIM modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
cannot be equipped with the 2-slot shelf.
•
the FIM modules must be located in the same bay as the access panel (in
6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in 7-slot Type 2 shelf that FIM module connects to (by using
the NTTC09DM cable assembly) and its assigned OTS reside.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and
FIM Type 6 optical interface modules.
Table 1-129
Technical specifications for FIM Type 1, FIM Type 2, FIM Type 4, FIM Type 5, and FIM Type 6
optical interface modules
Parameter
FIM Type 1 FIM Type 2
(NTK504CA) (NTK504CB)
Dimension
Height: 3U (133 mm / 5.2 in.)
Height: 1U (43 mm / 1.7 in.)
Width: 439 mm / 17.25 in.
Width: 438.1 mm / 17.25 in.
Depth: 281 mm / 11.06 in.
Depth: 280 mm / 11.02 in.
7.8 kg (17.2 lb)
5.3 kg (11.7 lb) 5.2 kg (11.5 lb) 4.2 kg (9.3 lb)
Weight (estimated)
Power consumption
FIM Type 4
(NTK504CD)
FIM Type 5
(NTK504CE)
FIM Type 6
(NTK504CF)
Typical (W): 0
Power Budget (W): 0
Maximum total Input
power
24 dBm (Note)
Minimum return loss
50 dB
Working bandwidth
1528 to 1570 nm
Max insertion loss:
MPO-MPO connections
Max insertion loss:
MPO-LC connections
1.4 dB
1.1
N/A
N/A
1.4
1.4
1.1
1.1
N/A
Note: For a FIM Type 4 module and to respect the 1M laser safety limit on the aggregate MPO output,
the individual input powers to the LC ports must be <=13dBm.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Optical Service Channel (OSC) Filter (1516.9 nm) module (NTK504BA)
Overview
The Optical Service Channel (OSC) Filter (1516.9 nm) module (also known as
OSC Filter (1516.9 nm) is used to alleviate ASE issues for Four Wave Mixing
(FWM) in TWRS fiber.
The NTK592NR OSC SFP must always be used with the OSC Filter
(1516.9 nm) module. It is only used in conjunction with the SRA circuit pack.
The NTK592NR SFP must be used if TWRS fiber is present on the span or
the span is over the CWDM SFP limits.
Figure 1-171 shows the faceplate of an OSC Filter (1516.9 nm) module and
Figure 1-172 on page 1-471 provides a functional block diagram of the OSC
Filter (1516.9 nm) module.
Figure 1-171
OSC Filter (1516.9 nm) module faceplate
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Figure 1-172
OSC Filter (1516.9 nm) module block diagram (NTK504BA)
Out
In
Equipment
Inventory
(RJ-45)
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Supported functionality
The OSC Filter (1516.9 nm) modules (NTK504BA) provide the following
functionality:
•
the OSC Filter (1516.9 nm) modules are passive modules and therefore
do not require DC power
•
although the OSC Filter (1516.9 nm) module is a passive device,
autoprovisioning and automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OSC Filter
[1516.9 nm] RJ-45 port to the NTK505MBE5 access panel external
slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the OSC Filter [1516.9 nm]
RJ-45 port to the NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the OSC Filter [1516.9 nm] RJ-45 port to the NTK505PAE5
access panel external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the OSC Filter
[1516.9 nm] RJ-45 port to the NTK555NA or NTK555NB external slot
ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the OSC Filter [1516.9 nm] RJ-45 port to the NTK505JA access panel
external slot ports).
•
see Table 1-130 for function and connector type for each port.
Table 1-130
OSC Filter (1516.9 nm) module
Interface name
In / Out
Physical port #
1/2
Function
Connector type
Input port is connected to OSC A Out
port of SRA circuit pack
LC
Output port is connected to OSC SFP
of SRA circuit pack
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Equipping rules
The following equipping rules apply to OSC Filter (1516.9 nm) modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
cannot be equipped with the 2-slot shelf.
•
the OSC Filter (1516.9 nm) module must be located in the same bay as
the access panel (in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf,
32-slot shelf) that OSC Filter (1516.9 nm) module connects to (by using
the NTTC09BME6 or NTTC09DM cable assembly) and its assigned OTS
reside.
•
the OSC Filter (1516.9 nm) modules do not use any cross-connect
capacity and can be used with shelves equipped with or without
cross-connect circuit packs.
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Technical specifications
The following table lists the weight, power consumption, and other
specifications for the OSC Filter (1516.9 nm) optical interface module.
Table 1-131
Technical specifications for OSC Filter (1516.9 nm) optical interface modules
Parameter
OSC Filter (1516.9 nm) (NTK504BA)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 438.1 mm / 17.25 in.
Depth: 278.5 mm / 10.96 in.
Weight (estimated)
3.4 kg (7.5 lb)
Power consumption
Typical (W): 0
Power Budget (W): 0
Insertion loss
1.2 dB
Maximum total Input power
22 dBm
Minimum return loss
45 dB
Working bandwidth
1516.9 nm +/- 0.11
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Dispersion Slope Compensation Modules (DSCM) (NTT870AxE5, NTT870CxE5,
NTT870ExE5, and NTT870GxE5)
Overview
The Dispersion Slope Compensation Module (also referred to as DSCM) is a
passive device used to provide chromatic dispersion compensation and slope
compensation introduced by the inherent characteristics of the transmission
fiber as a light pulse travels through the fiber over long distances. DSCMs are
therefore used to maximize the performance of the 6500 system.
DSCMs are available for various fiber types and they come in different fiber
lengths for varying amounts of accumulated dispersion. DSCM types and
lengths available include:
•
DSCM Type 1 is used for the compensation of NDSF fiber spans. DSCM
Type 1 units are available in a 5 km length and in lengths ranging from
10 km to 140 km (in 10 km increments).
•
DSCM Type 2 is used for the compensation of TWRS fiber spans. DSCM
Type 2 units are available in a 20 km length and in lengths ranging from
40 km to 320 km (in 40 km increments).
•
DSCM Type 3 is used for the compensation of TWCL fiber spans. DSCM
Type 3 units are available in a 20 km length and in lengths ranging from
40 km to 120 km (in 40 km increments).
•
DSCM Type 5 is used for the compensation of ELEAF fiber spans. DSCM
Type 5 units are available in a 12.5 km length and in lengths ranging from
25 km to 150 km (in 25 km increments).
The DSCM consists of a DSCM variant, a bulkhead equipped with two SC-SC
adaptors and a plate to secure the DSCM to the DSCM drop-in plate assembly
in the 1U DSCM drawer. The DSCM is a field-replaceable unit. DSCM module
must be housed in the DSCM drawer (NT0H57LA).
Figure 1-173 on page 1-476 shows a DSCM and an interior view of the FM
with DSCM and Figure 1-174 on page 1-476 provides a functional block
diagram of the DSCM module.
DSCM module must be housed in the DSCM drawer (NT0H57LA).
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Figure 1-173
Interior view of the 1U DSCM drawer equipped with DSCM drop-in plate assembly and DSCM
Figure 1-174
DSCM module block diagram (NTT870xx)
OUT
IN
Equipment
Inventory (RJ-45)
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Supported functionality
The DSCM modules (NTT870AAE5-AHE5/AJE5-ANE5/APE5-AQE5,
NTT870CAE5-CHE5/CJE5, NTT870EAE5-EDE5, and NTT870GAE5-GGE5)
provide the following functionality:
•
the DSCM is a passive module and therefore does not require DC power
•
although the DSCM module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the DSCM RJ-45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the DSCM RJ-45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the DSCM RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the DSCM RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the DSCM RJ-45 port to the NTK505JA access panel external slot
ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the DSCM RJ-45 port to the access panel external slot
ports).
•
see Table 1-132 on page 1-478 for function and connector type for each
port
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Table 1-132
DSCM optical interfaces
Interface name
Physical port #
Function
Connector type
DCSM In
Input to DSCM
DCSM In
SC
DSCM Out
Compensated
output
DSCM Out
SC
Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Equipping rules
The following equipping rules apply to DSCM modules:
•
can be equipped with the 14-slot shelf (except the NTK503GA metro front
electrical shelf, which does not support this module) by using the shelf
processor and access panel.
•
can be equipped with the 32-slot shelf by using the shelf processor and
access panel.
•
can be equipped with the 7-slot shelf (NTK503PAE5 or NTK503KA) by
using the shelf processor and access panel.
•
can be equipped with the 6500-7 packet-optical shelf (NTK503RA) by
using the shelf processor and access panel.
•
can be equipped with the 2-slot shelf by using the integrated shelf
processor/access panel in NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf or shelf processor w/access panel (SPAP) (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf.
•
the DSCM module must be located in the same bay as the access panel
(in 6500-7 packet-optical, 7-slot shelf, 14-slot shelf, 32-slot shelf), shelf
processor w/access panel (SPAP) circuit pack (NTK555LA)/shelf
processor w/access panel (SPAP-2) w/2xOSC 2xSFP (NTK555NA or
NTK555NB) in NTK503LA variant of 2-slot shelf, or integrated access
panel (in NTK503MAE5 and NTK503NAE5 variants of 2-slot shelf) that
DSCM module connects to (by using the NTTC09BME6 or NTTC09DM
cable assembly) and its assigned OTS reside.
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•
the DSCM modules do not use any cross-connect capacity and can be
used with shelves equipped with or without cross-connect circuit packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the DSCM optical interface modules. Table 1-134 lists the
maximum insertion loss for DSCM optical interface modules.
Table 1-133
Technical specifications for DSCM optical interface modules (NTT870xx variants)
Parameter
DSCM (NTT870AA-AH/AJ-AN/AP-AQ,
NTT870CA-CH/CJ, NTT870EA-ED, and
NTT870GA-GG)
Dimension
Height: 1U (43 mm / 1.7 in.)
Width: 443 mm / 17.44 in.
Depth: 279.0 mm / 11 in. (including mounting
brackets installed)
Weight (estimated)
4.5 kg (9.9 lb) (Note 1)
Wavelength range
1528 nm to 1565 nm
Maximum total input power
24 dBm (Note 2)
Minimum return loss
45 dB (Note 3 and Note 4)
Maximum insertion loss
Variable (see Table 1-134) (Note 5)
Note 1: The specified weight includes the Fiber Manager (FM) chassis and drawer assembly, DSCM
drop-in plate assembly, and DSCM.
Note 2: To avoid module damage, the maximum optical input power must not exceed 24 dBm.
Note 3: Module loss is the worst case insertion loss of any wavelength within the specified C-Band.
Note 4: When the DSCM is added to the network, the total optical return loss decreases.
Note 5: The insertion loss includes 0.3 dB connector loss for two mated connections.
Table 1-134
Dispersion Slope Compensation Modules (DSCM) (NTT870xx variants)
Description
Equivalent fiber
length (km)
Order code
Maximum
Notes
insertion loss (dB)
DSCM-5 Type 1 C-Band SC
5
NTT870AA
2.0
Note
DSCM-10 Type 1 C-Band SC
10
NTT870AB
2.3
Note
DSCM-20 Type 1 C-Band SC
20
NTT870AC
2.9
Note
DSCM-30 Type 1 C-Band SC
30
NTT870AD
3.5
Note
DSCM-40 Type 1 C-Band SC
40
NTT870AE
4.1
Note
DSCM-50 Type 1 C-Band SC
50
NTT870AF
4.7
Note
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Table 1-134
Dispersion Slope Compensation Modules (DSCM) (NTT870xx variants)
Description
Equivalent fiber
length (km)
Order code
Maximum
Notes
insertion loss (dB)
DSCM-60 Type 1 C-Band SC
60
NTT870AG
5.4
Note
DSCM-70 Type 1 C-Band SC
70
NTT870AH
6.0
Note
DSCM-80 Type 1 C-Band SC
80
NTT870AJ
6.6
Note
DSCM-90 Type 1 C-Band SC
90
NTT870AK
7.2
Note
DSCM-100 Type 1 C-Band SC
100
NTT870AL
7.8
Note
DSCM-110 Type 1 C-Band SC
110
NTT870AM
9.5
Note
DSCM-120 Type 1 C-Band SC
120
NTT870AN
10.1
Note
DSCM-130 Type 1 C-Band SC
130
NTT870AP
10.9
Note
DSCM-140 Type 1 C-Band SC
140
NTT870AQ
11.5
Note
DSCM-20 Type 2 C-Band SC
20
NTT870CA
2.5
Note
DSCM-40 Type 2 C-Band SC
40
NTT870CB
2.9
Note
DSCM-80 Type 2 C-Band SC
80
NTT870CC
3.9
Note
DSCM-120 Type 2 C-Band SC
120
NTT870CD
5.0
Note
DSCM-160 Type 2 C-Band SC
160
NTT870CE
6.1
Note
DSCM-200 Type 2 C-Band SC
200
NTT870CF
7.1
Note
DSCM-240 Type 2 C-Band SC
240
NTT870CG
8.2
Note
DSCM-280 Type 2 C-Band SC
280
NTT870CH
9.3
Note
DSCM-320 Type 2 C-Band SC
320
NTT870CJ
10.3
Note
DSCM-20 Type 3 C-Band SC
20
NTT870EA
4.1
Note
DSCM-40 Type 3 C-Band SC
40
NTT870EB
5.1
Note
DSCM-80 Type 3 C-Band SC
80
NTT870EC
6.9
Note
DSCM-120 Type 3 C-Band SC
120
NTT870ED
8.2
Note
DSCM-12.5 Type 5 C-Band SC
12.5
NTT870GA
3.7
Note
DSCM-25 Type 5 C-Band SC
25
NTT870GB
4.3
Note
DSCM-50 Type 5 C-Band SC
50
NTT870GC
5.5
Note
DSCM-75 Type 5 C-Band SC
75
NTT870GD
7.0
Note
DSCM-100 Type 5 C-Band SC
100
NTT870GE
8.2
Note
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Table 1-134
Dispersion Slope Compensation Modules (DSCM) (NTT870xx variants)
Description
Equivalent fiber
length (km)
Order code
Maximum
Notes
insertion loss (dB)
DSCM-125 Type 5 C-Band SC
125
NTT870GF
8.8
Note
DSCM-150 Type 5 C-Band SC
150
NTT870GG
10.0
Note
Note: The maximum insertion loss values include effects of temperature, aging, polarization
dependent loss (PDL) and one mated connector.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Fixed Gain Amplifier (FGA C-Band) circuit pack (NTK552AB)
Overview
The Fixed Gain Amplifier (FGA C-Band) circuit pack (also referred to as FGA)
is used for edge and core passive Photonic layer applications and contains a
single (pre-amplifier) erbium-doped fiber amplifier (EDFA).
This circuit pack can provide both pre-amplification and post-amplification and
if link engineering permits, FGA can be placed anywhere in the passive
network including pre-amp position, post-amp position, cascaded-amp
position, and anywhere in between filters, except between transponders and
filter channel ports. There is no tilt control via software so FGA circuit pack
does not have capability to ensure equal amplification on wavelengths. FGA
monitor ports monitor FGA circuit pack input and output power.
Figure 1-175 shows the faceplate of an FGA circuit pack and Figure 1-176 on
page 1-483 provides a functional block diagram of the FGA circuit pack.
Figure 1-175
FGA circuit pack faceplate
Red triangle (Fail)
- Used to communicate hardware or software failure state
- Card not failed = LED off, Card failed = LED on
Green rectangle (Ready)
- Used to communicate hardware or software functional state
- Card initializing = Blinking LED; Card OK = LED on; Card not ready = LED off
Blue diamond (In Use)
- Used to communicate whether circuit pack can be extracted
(on->no pull, off->can be pulled)
- Equipment in-service = LED on; Equipment out-of-service = LED off
Monitor ports
Line ports
Yellow circle (LOS)
- Used to communicate Rx Loss of Signal
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Figure 1-176
FGA circuit pack block diagram (NTK552AB)
EDFA
Backplane
PD
Mon Out
2
Line Out
3
Mon In
1
Line In
4
PD
PD
Processor
Module
Power
Supply
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Supported functionality
The FGA circuit packs (NTK552AB) provide the following functionality:
•
supports a per wavelength amplification for up to 88 C-band channels at
50 GHz spacing
•
provides fast transient suppression
•
provides automatic gain control (AGC) circuitry to maintain desired
performance at a fixed gain
•
provides total output power (TOP) control, with TOP target
•
provides fixed gain with ASE compensation
•
provides flat gain when operated in the desired range
•
external monitor at outputs of each amplifier line (Line In Mon and Line Out
Mon)
Note: The FGA circuit pack does not support ALSO (Automatic Line Shut
Off), APR (Automatic Power Reduction), or DOC functionality.
•
see Table 1-135 for function and connector type for each port in FGA
Table 1-135
FGA optical interfaces
Interface name
Physical port #
Function
Connector type
Mon
1
Monitor port for Line In
LC
Mon
2
Monitor port for Line Out
LC
Line Out
3
output port of Amplifier passthrough
channel
LC
Line In
4
Input port of Amplifier
LC
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Performance monitoring
The 6500 monitors and collects physical PMs for FGA circuit pack facilities.
Table 1-136 provides a list of monitor types supported on FGA circuit packs.
Figure 1-177 on page 1-486 shows the FGA circuit pack optical monitoring
points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-136
Monitor types table for FGA circuit pack
Monitor type
Facility
AMP
OPIN-OTS
OPINMIN-OTS
OPINMAX-OTS
OPINAVG-OTS
X
X
X
X
OPOUT-OTS
OPOUTMIN-OTS
OPOUTMAX-OTS
OPOUTAVG-OTS
X
X
X
X
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Figure 1-177
FGA circuit pack optical monitoring points
EDFA
Backplane
PD
Mon Out
2
Line Out
3
Mon In
1
Line In
4
PD
PD
Processor
Module
Power
Supply
PMs collected at all PD locations
Facility: AMP port 1,3,4
Parameter: OPIN-OTS* and OPOUT-OTS*
Legend
EDFA
Erbium Doped Fiber Amplifier
PD
Photodiode
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Circuit Pack Failed
•
Autoprovisioning Mismatch
•
Internal Mgmt Comms Suspected
•
Circuit Pack Latch Open
•
Database Not Recovered For Slot
•
Excessive Input Power
•
Circuit Pack Upgrade Failed
•
High Received Span Loss
•
Low Received Span Loss
Photonic alarms
• Fiber Type Manual Provisioning Required
•
High Fiber Loss
•
Shutoff Threshold Crossed
•
Input Loss of Signal
•
Output Loss of Signal
•
Automatic Shutoff Disabled
•
Gauge Threshold Crossing Alert Summary
•
Crossed Fibers Suspected
COM alarms
• Software Auto-Upgrade in Progress
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Equipping rules
The following equipping rules apply to FGA circuit packs:
•
is a four-port single slot interface for FGA.
•
can be equipped in any slot (1-14 except slots 7 and 8 if cross-connect
circuit packs are provisioned in slots 7 and 8) of the 14-slot shelf (except
the NTK503GA metro front electrical shelf, which does not support this
circuit pack).
•
can be equipped in slots 1-8, 11-18, 21-28, and 31-38 of the 32-slot
packet-optical shelf.
•
can be equipped in slots 1 to 7 of the 7-slot optical shelf (NTK503PAE5 or
NTK503KA).
•
can be equipped in slots 1 to 8 of the 6500-7 packet-optical shelf
(NTK503RA).
•
cannot be equipped in the NTK503MAE5 and NTK503NAE5 variants of
2-slot shelf. Can be equipped in slots 1 and 2 of the NTK503LA variant of
2-slot shelf when the shelf is equipped with shelf processor w/access
panel (SPAP) (NTK555LA) or SPAP-2 w/2xOSC (NTK555NA or
NTK555NB).
•
all equipment that is part of an OTS must be located within the same
physical shelf
The following restrictions on using a cross-connect circuit pack apply when
deploying a FGA circuit pack:
•
the FGA circuit packs do not use any cross-connect capacity and can be
installed in shelves equipped with or without cross-connect circuit packs
•
In a 14-slot shelf type, you cannot provision a cross-connect circuit pack
in slot 7 or 8 if one of these slots already contains a FGA circuit pack
•
In a 14-slot shelf type, when the FGA circuit packs are installed in slot 7 or
8, only Broadband circuit packs or Photonic circuit packs can be
provisioned in the other interface slots (slots 1 to 6 and 9 to14) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
•
In a 6500-7 packet-optical shelf type, you cannot provision a
cross-connect circuit pack in slot 7 or 8 if one of these slots already
contains a FGA circuit pack
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•
In a 6500-7 packet-optical shelf type, when the FGA circuit packs are
installed in slot 7 or 8, only Broadband circuit packs or Photonic circuit
packs can be provisioned in the other interface slots (slots 1 to 6) as MSPP
or PKT/OTN I/F interface circuit packs require a cross-connect circuit
pack. See Part 1 of 6500 Planning, NTRN10ED (Shelf and equipment
descriptions) for a full list of supported Broadband and Photonic circuit
packs.
Technical specifications
The following table lists the weight, power consumption, and other
specifications for the FGA optical interface circuit pack.
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Table 1-137
Technical specifications for FGA optical interface circuit packs
Parameter
FGA (NTK552AB)
Weight (estimated)
1.0 kg (2.4 lb)
Power consumption
Typical (W): 24 (Note 1)
Power Budget (W): 33 (Note 2)
Gain (dB)
23 (fixed gain and not provisionable by the user)
Maximum noise figure (NF) (dB)
5.5
Maximum output power (dBm)
17 EOL (on average 1 dB higher)
Wavelength range (nm)
1530.33 to 1565.09 (88 channels capable)
Tap ratio loss (dB)
Minimum
Maximum
Line_Out to Line_Out_Mon
14.6
18.4
Line_In to Line_In_Mon
18.5
21.5
Insertion loss from Line_In to Line_Out (dB)
N/A (Note 3)
Amplifier input and output LOS thresholds (dBm)
Minimum
Default
Maximum
Input LOS threshold
-40
-34
10
Output LOS threshold
-15
-12
20
Note 1: The typical power consumption values are based on operation at an ambient temperature of
25 (+/-3oC) and voltage of 54 V dc (+/-2.5 V) or in the full operational voltage range in the case of
AC-powered equipment. For practical purposes, the rounded typical power consumption of equipment
can be used as the equipment heat dissipation when calculating the facilities’ thermal loads (an
estimate of the long term heat release of the item in a system).
Note 2: The power budget values are based on the maximum power consumption in an ambient
temperature range from 5oC to 40oC at a voltage of 40 V dc (+/-2.5 V) or in the full operational voltage
range in the case of AC-powered equipment. These rounded power values must be used in sizing
feeders and estimating theoretical maximum power draw.
Note 3: The EDFA modules do not have insertion loss.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Photonic passive equipment
Overview
The following table lists Photonic passive equipment that can be used with the
6500 shelves and covered in this section:
Table 1-138
Photonic passive equipment covered in this section
Topic
“2-Slot Optical Module Chassis (OMC2) (NTK504NA)” on page 1-492
“2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)” on page 1-493
“2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900)” on page 1-495
“6-slot passive photonic chassis (PPC6) (174-0040-900)” on page 1-497
“100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x)” on page 1-500 including:
• “CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
(B-720-0020-0xx)” on page 1-500
• “CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz modules (B-720-0022-00x)” on
page 1-503
“Band splitter 100 GHz modules (B-720-0020-0xx)” on page 1-521
“CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module (B-720-0014-003)”
on page 1-527
“2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (B-955-0003-00x, B-955-0003-3xx,
166-0203-9xx, 166-0403-9xx)” on page 1-528
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2-Slot Optical Module Chassis (OMC2) (NTK504NA)
The 2-Slot Optical Module Chassis (OMC2) (also known as OMC2 chassis) is
a stand-alone passive chassis designed to accommodate up to two passive
modules. Those passive modules include:
•
“C/L-Band Mux/Demux (CLMD) module (NTK504PA)” on page 1-434
•
“Upgrade Coupler/Splitter (UCS) module (NTK504PL)” on page 1-440
The OMC2 chassis is 1U in height and intended to be mounted in a bay and
includes two half-width slots.
Note: If you equip the passive modules in an OMC2 chassis, the 6500 can
support autoprovisioning and automatic inventory through the RJ45
interfaces in the passive modules which directly connect to the 6500 shelf
access panel.
It is mandatory that the empty half-width sub-slots in an OMC2 chassis are
filled with a Filler Panel (for OMC2 slot) (NTK504PY).
Figure 1-178 shows the faceplate of passive modules in an OMC2 chassis.
Figure 1-178
OMC2 chassis (B-310-0142-001)
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2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)
The 2150 Passive Optical Multiplexer (6-slot) chassis (also known as
2150 (6-slot) chassis) is a stand-alone passive chassis designed to
accommodate up to six passive modules. Those passive modules include:
•
100 GHz DWDM passive filter modules. See “100 GHz DWDM filters
(B-720-0020-0xx and B-720-0022-00x)” on page 1-500 for more
information.
•
100 GHz band splitter modules. See “Band splitter 100 GHz modules
(B-720-0020-0xx)” on page 1-521 for more information.
•
OSC filter modules. See “CN-51S-00 Optical Service Channel Filter (1-Ch
OSCF CWDM 1511 nm) module (B-720-0014-003)” on page 1-527 for
more information.
The 2150 (6-slot) chassis can accept passive modules from the Ciena 4200
platform. The 2150 (6-slot) chassis is 2U in height and intended to be mounted
in a bay.
The modular platform of a 2150 (6-slot) chassis offers invest-as-you-grow
scalability. Possible configurations include:
•
six half-width slots
•
four half-width slots and a full-width slot
•
two half-width slots and two full-width slots
Note: The 6500 does not support autoprovisioning and automatic
inventory on the passive modules equipped in a 2150 (6-slot) chassis
since 2150 (6-slot) chassis cannot be connected to 6500 shelf access
panel external slots. Hence, you must manually provision the 2150 (6-slot)
chassis and any passive modules in its sub-slots.
You cannot order 2150 (6-slot) chassis (B-310-0142-001) separately. You
must order one of the following kits where the kit includes the mounting
brackets and optional fiber management bar and cover:
•
B-967-0001-002 (2150 Passive Optical Multiplexer (6-slot) chassis with 19
inch brackets, fiber management bar and cover)
This kit includes 19 inch brackets (B-395-0003-001), fiber management
bar (B-395-0004-001), and cover (B-310-0156-001).
•
B-967-0002-002 (2150 Passive Optical Multiplexer (6-slot) chassis with 23
inch brackets, fiber management bar and cover)
This kit includes 23 inch brackets (B-395-0003-002), fiber management
bar (B-395-0004-001), and cover (B-310-0156-001).
•
B-967-0003-002 (2150 Passive Optical Multiplexer (6-slot) chassis with
ETSI inch brackets, fiber management bar and cover)
This kit includes ETSI inch brackets (B-395-0003-003), fiber management
bar (B-395-0004-001), and cover (B-310-0156-001).
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It is recommended that the empty half-width sub-slots in a 2150 (6-slot)
chassis are filled with half-width blank (filler panel) (B-390-0069-001). It is
recommended that the empty full-width sub-slots in a 2150 (6-slot) chassis are
filled with full-width blank (filler panel) (B-720-0016-001).
The following shows the faceplate of a 2150 (6-slot) chassis.
Figure 1-179
2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001)
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2150 Passive Optical Multiplexer (3-Slot) chassis (174-0064-900)
The 2150 Passive Optical Multiplexer (3-slot) chassis (also known as 2150
(3-slot) chassis) is a stand-alone passive chassis designed to accommodate
up to three passive modules. Those passive modules include:
•
100 GHz DWDM passive filter modules. See “100 GHz DWDM filters
(B-720-0020-0xx and B-720-0022-00x)” on page 1-500 for more
information.
•
100 GHz band splitter modules. See “Band splitter 100 GHz modules
(B-720-0020-0xx)” on page 1-521 for more information.
•
OSC filter modules. See “CN-51S-00 Optical Service Channel Filter (1-Ch
OSCF CWDM 1511 nm) module (B-720-0014-003)” on page 1-527 for
more information.
•
OBMD 1x8 modules. See “Optical Broadband Mux/Demux (OBMD 1x8
C-Band) module (174-0104-900)” on page 1-506 for more information.
•
OBB 2x2x2 modules. See “Optical Bridge and Broadcast (OBB 2x2x2
C-Band) module (174-0115-900)” on page 1-511 for more information.
•
OBB 2x4x1 modules. See “Optical Bridge and Broadcast (OBB 2x4x1
C-Band) module (174-0116-900)” on page 1-516 for more information.
The 2150 (3-slot) chassis can also accept passive modules from the Ciena
4200 platform. The 2150 (3-slot) chassis is 1U in height and intended to be
mounted in a bay. The 2150 (3-slot) chassis (174-0064-900) offers the same
functionality as 2150 (6-slot) chassis (B-310-0142-001) but it can free 1U of
space.
The modular platform of a 2150 (3-slot) chassis offers invest-as-you-grow
scalability. Possible configurations include:
•
three half-width slots
•
one half-width slots and one full-width slots
Note: The 6500 does not support autoprovisioning and automatic
inventory on the passive modules equipped in a 2150 (3-slot) chassis
since 2150 (3-slot) chassis cannot be connected to 6500 shelf access
panel external slots. Hence, you must manually provision the 2150 (3-slot)
chassis and any passive modules in its sub-slots.
The exception is OBMD 1x8 (174-0104-900), OBB 2x2x2 (174-0115-900),
and OBB 2x4x1 (174-0116-900) modules equipped in a 2150 (3-slot)
chassis where these modules include tap/photodetectors powered
through a connection to the 6500 access panel and therefore supporting
autoprovisioning and automatic inventory.
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You cannot order 2150 (3-slot) chassis (174-0064-900) separately. You must
order one of the following kits where the kit includes the mounting brackets
and cover:
•
K80-0002-901 (2150 Passive Optical Multiplexer (3-slot) chassis with 19
inch, 23 inch, and ETSI brackets)
This kit includes 19 inch, 23 inch, and ETSI brackets (174-0096-900) and
cover (174-0095-900).
•
K80-0002-902 (2150 Passive Optical Multiplexer (3-slot) chassis with 19
inch, 23 inch, and ETSI brackets and cover)
This kit includes 19 inch, 23 inch, and ETSI brackets (174-0096-900) and
cover (174-0095-900).
It is recommended that the empty half-width sub-slots in a 2150 (3-slot)
chassis are filled with half-width blank (filler panel) (B-390-0069-001). It is
recommended that the empty full-width sub-slots in a 2150 (3-slot) chassis are
filled with full-width blank (filler panel) (B-720-0016-001).
The following shows the faceplate of a 2150 (3-slot) chassis.
Figure 1-180
2150 Passive Optical Multiplexer (3-slot) chassis (174-0064-900)
Module slots
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6-slot passive photonic chassis (PPC6) (174-0040-900)
The 6-slot passive photonic chassis (also known as PPC6) is a stand-alone
passive chassis designed to accommodate up to six passive modules. Those
passive modules include:
•
100 GHz DWDM passive filter modules. See “100 GHz DWDM filters
(B-720-0020-0xx and B-720-0022-00x)” on page 1-500 for more
information.
•
100 GHz band splitter modules. See “Band splitter 100 GHz modules
(B-720-0020-0xx)” on page 1-521 for more information.
•
OSC filter modules. See “CN-51S-00 Optical Service Channel Filter (1-Ch
OSCF CWDM 1511 nm) module (B-720-0014-003)” on page 1-527 for
more information.
The PPC6 chassis can accept passive modules from the 2150 (6-slot), 2150
(3-slot) chassis, and Ciena 4200 platform. The PPC6 chassis has similar
functionality as existing 2150 (6-slot) or 2150 (3-slot) chassis
(B-310-0142-001). However, the PPC chassis includes an RJ-45 interface to
allow connection to 6500 shelf Access Panel for auto-provisioning and
inventory support. The PPC6 chassis is 2U in height and intended to be
mounted in a bay.
The modular platform of a PPC6 offers invest-as-you-grow scalability.
Possible configurations include:
•
six half-width slots
•
four half-width slots and a full-width slot
•
two half-width slots and two full-width slots
Note: If you equip the passive modules in a PPC6, the 6500 supports
autoprovisioning and automatic inventory via the built-in PPC6 inventory
control logic which interfaces directly with the 6500 shelf access panel.
The passive modules do not directly report to the 6500 shelf access panel.
You cannot order PPC6 (174-0040-900) separately. You must order one of the
following kits where the kit includes the mounting brackets and optional fiber
management bar and cover:
•
K80-0001-001 (6-slot Passive Photonics Chassis (PPC6) with 19 inch and
23 inch brackets)
This kit includes 19 inch and 23 inch brackets (174-0042-001).
•
K80-0001-002 (6-slot Passive Photonics chassis (PPC6) with 19 inch and
23 inch brackets, fiber management bar and cover)
This kit includes 19 inch and 23 inch brackets (174-0042-001), fiber
management bar and cover (174-0043-001).
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•
K80-0001-003 (6-slot Passive Photonics chassis (PPC6) with ETSI
brackets)
This kit includes ETSI brackets (174-0042-002).
•
K80-0001-004 (6-slot Passive Photonics chassis (PPC6) with ETSI
brackets, fiber management bar and cover)
This kit includes ETSI brackets (174-0042-002), fiber management bar
and cover (174-0043-001).
You can also order the following equipment separately:
•
174-0042-001 (6-slot Passive Photonics chassis (PPC6) mounting kit with
19 inch and 23 inch brackets)
•
174-0042-002 (6-slot Passive Photonics chassis (PPC6) mounting kit with
ETSI brackets)
•
174-0043-001 (6-slot Passive Photonics chassis (PPC6) kit with fiber
management bar and cover)
•
174-0059-001 (6-slot Passive Photonics chassis (PPC6) slot divider kit,
top and bottom)
It is mandatory that the empty half-width sub-slots in a PPC6 are filled with
half-width blank (filler panel) (B-390-0069-001). It is mandatory that the empty
full-width sub-slots in a PPC6 are filled with full-width blank (filler panel)
(B-720-0016-001).
Figure 1-181 shows the faceplate of a 6-slot passive Photonic chassis.
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Figure 1-181
6-slot passive photonic chassis faceplates (174-0040-900)
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100 GHz DWDM filters (B-720-0020-0xx and B-720-0022-00x)
These optical filters are designed to manage DWDM wavelengths that
conform to the ITU-T 694.1 100 GHz grid specification, thus enabling them to
filter any DWDM wavelength that conforms to this standard and grid. The
filters comprising this category align into two classes:
•
Wavelength filter modules, which mux/demux some set of individual
wavelength channels into and from one of the 100 GHz wavelength
groups. In this release, these wavelength filter modules include OMDF4
and OMDF8 passive modules. For more information, see “CN-100-x4L
and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz
modules (B-720-0020-0xx)” on page 1-500 and “CN-100-x80 8-channel
Optical Mux/Demux Filter (OMDF8) 100 GHz modules (B-720-0022-00x)”
on page 1-503.
•
Band splitters, which mux/demux an aggregated DWDM signal into one or
more of the five 100 GHz DWDM wavelength groups. For more
information, see “Band splitter 100 GHz modules (B-720-0020-0xx)” on
page 1-521.
CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter
(OMDF4) 100 GHz modules (B-720-0020-0xx)
The CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter
(OMDF4) 100 GHz modules (also known as OMDF4 modules) are half-width
modules and are used to mux/demux four 100 GHz DWDM signals into and
from an aggregated DWDM signal. Ten modules are available; one for each
set of four wavelengths:
•
CN-100-E4L, 4-Ch OMDF 100 GHz Group E-Low (1562-1564 nm)
(B-720-0020-022)
•
CN-100-E4H, 4-Ch OMDF 100 GHz Group E-High (1558-1561 nm)
(B-720-0020-023)
•
CN-100-D4L, 4-Ch OMDF 100 GHz Group D-Low (1554-1557 nm)
(B-720-0020-024)
•
CN-100-D4H, 4-Ch OMDF 100 GHz Group D-High (1551-1554 nm)
(B-720-0020-025)
•
CN-100-C4L, 4-Ch OMDF 100 GHz Group C-Low (1547-1550 nm)
(B-720-0020-026)
•
CN-100-C4H, 4-Ch OMDF 100 GHz Group C-High (1544-1546 nm)
(B-720-0020-027)
•
CN-100-B4L, 4-Ch OMDF 100 GHz Group B-Low (1540-1542 nm)
(B-720-0020-028)
•
CN-100-B4H, 4-Ch OMDF 100 GHz Group B-High (1537-1539 nm)
(B-720-0020-029)
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Photonics equipment description 1-501
•
CN-100-A4L, 4-Ch OMDF 100 GHz Group A-Low (1533-1535 nm)
(B-720-0020-030)
•
CN-100-A4H, 4-Ch OMDF 100 GHz Group A-High (1530-1532 nm)
(B-720-0020-031)
Figure 1-182 on page 1-501 shows the faceplates of the OMDF4 modules.
Figure 1-184 on page 1-502 provides functional block diagram of the OMDF4
modules.
Figure 1-182
OMDF4 modules faceplates (B-720-0020-0xx)
NTWK EXPR Ch 16 Ch 17 Ch 18 Ch 19 MON
NTWK EXPR Ch 20 Ch 21 Ch 22 Ch 23 MON
R
R
T
T
CN-100-E4L
CN-100-E4H
NTWK EXPR Ch 25 Ch 26 Ch 27 Ch 28 MON
NTWK EXPR Ch 29 Ch 30 Ch 31 Ch 32 MON
R
R
T
TT
CN-100-D4L
CN-100-D4H
NTWK EXPR Ch 34 Ch 35 Ch 36 Ch 37 MON
NTWK EXPR Ch 38 Ch 39 Ch 40 Ch 41 MON
R
R
T
T
TT
CN-100-C4L
CN-100-C4H
NTWK EXPR Ch 43 Ch 44 Ch 45 Ch 46 MON
NTWK EXPR Ch 47 Ch 48 Ch 49 Ch 50 MON
R
R
T
T
TT
CN-100-B4L
CN-100-B4H
NTWK EXPR Ch 52 Ch 53 Ch 54 Ch 55 MON
NTWK EXPR Ch 56 Ch 57 Ch 58 Ch 59 MON
R
R
T
T
T
T
CN-100-A4L
CN-100-A4H
Note: The wavelength corresponding to each channel port is indicated
underneath the channel port’s connector (an example is shown in Figure
1-183).
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323-1851-102.6 Standard Issue 3
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1-502 Photonics equipment description
Figure 1-183
Example showing markings for C-band wavelengths
Figure 1-184
OMDF4 modules block diagram (B-720-0020-0xx)
Express R
4
Express T
Sub-Band Filter
3
Network T
2
Network R
1
Monitor T
14
Monitor R
13
Channel Mux/Demux
Ch. ww
5
6
Ch. xx
7
8
Ch. yy
Ch. zz
9 10
11 12
ww = 16, 20, 25, 29, 34, 38, 43, 47, 52, 56
xx = 17, 21, 26, 30, 35, 39, 44, 48, 53, 57
yy = 18, 22, 27, 31, 36, 40, 45, 49, 54, 58
zz = 19, 23, 38, 32, 37, 41, 46, 50, 55, 59
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Photonics equipment description 1-503
CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz
modules (B-720-0022-00x)
The CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz
modules (also known as OMDF8 modules) are full-width modules and are
used to mux/demux eight of the supported 100 GHz DWDM wavelengths. Five
modules are available; one for each set of eight wavelengths:
•
CN-100-A80, 8-Ch OMDF 100 GHz Group A (1530-1535 nm)
(B-720-0022-001)
•
CN-100-B80, 8-Ch OMDF 100 GHz Group B (1537-1542 nm)
(B-720-0022-002)
•
CN-100-C80, 8-Ch OMDF 100 GHz Group C (1544-1550 nm)
(B-720-0022-003)
•
CN-100-D80, 8-Ch OMDF 100 GHz Group D (1551-1557 nm)
(B-720-0022-004)
•
CN-100-E80, 8-Ch OMDF 100 GHz Group E (1558-1564 nm)
(B-720-0022-005)
Figure 1-185 shows the faceplates of the OMDF8 modules. Figure 1-186 on
page 1-505 provides functional block diagram of the OMDF8 modules.
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1-504 Photonics equipment description
Figure 1-185
OMDF8 modules faceplates (B-720-0022-00x)
NTWK
CH 16
CH 17
CH 18
CH 19
CH 20
CH 21
CH 22
CH 23
MON
CH 25
CH 26
CH 27
CH 28
CH 29
CH 30
CH 31
CH 32
MON
R
T
CN-100-E80
NTWK
R
T
CN-100-D80
NTWK
CH 34
CH 35
CH 36
CH 37
CH 38
CH 39
CH 40
CH 41
MON
CH 43
CH 44
CH 45
CH 46
CH 47
CH 48
CH 49
CH 50
MON
CH 52
CH 53
CH 54
CH 55
CH 56
CH 57
CH 58
CH 59
MON
R
T
CN-100-C80
NTWK
R
T
CN-100-B80
NTWK
R
T
CN-100-A80
Note: The wavelength corresponding to each channel port is indicated
underneath the channel port’s connector (an example is shown in Figure
1-183 on page 1-502).
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Photonics equipment description 1-505
Figure 1-186
OMDF8 modules block diagram (B-720-0022-00x)
Network T
2
Network R
1
Monitor T
20
Monitor R
19
Channel Mux/Demux
Ch. ss
Ch. tt
Ch. uu
Ch. vv
Ch. ww
Ch. xx
Ch. yy
Ch. zz
3
5
7
9
10
11 12
13 14
15 16
17 18
4
6
8
ss = 16, 25, 34, 43, 52
tt = 17, 26, 35, 44, 53
uu = 18, 27, 36, 45, 54
vv = 19, 28, 37, 46, 55
ww = 20, 29, 38, 47, 56
xx = 21, 30, 39, 48, 57
yy = 22, 31, 40, 49, 58
zz = 23, 32, 41, 50, 59
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1-506 Photonics equipment description
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module
(174-0104-900)
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) module (also known as
OBMD 1x8) is a full-width module and is part of WaveLogic Photonics
Coherent Select passive architecture. The Coherent Select nodes use a
combination of existing 6500 circuit packs (amplifiers, OSC, CMD44, BMD2)
and OBMD 1x8 modules.
The OBMD 1x8 module includes:
•
8x Mux/Demux ports (in/out)
•
1x Common port (in/out)
•
An RJ45 port for equipment inventory
Figure 1-187 shows the faceplate of the OBMD 1x8 module. Figure 1-188 on
page 1-507 provides functional block diagram of the OBMD 1x8 module.
Figure 1-187
OBMD 1x8 module faceplate (174-0104-900)
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Photonics equipment description 1-507
Figure 1-188
OBMD 1x8 module block diagram (174-0104-900)
Equipment
inventory
(RJ-45)
Inventory
Common Out 18
Common In 17
PD
1:8 Splitter/Combiner
PD
PD
PD
PD
PD
2 In
2 Out
3 In
3 Out
4 In
4 Out
5 In
5 Out
6 In
6 Out
7 In
7 Out
8 In
8 Out
PD
1 Out
PD
1 In
PD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Although the OBMD 1x8 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the OBMD 1x8 RJ-45 port to the
NTK505MBE5 access panel external slot ports).
•
NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the OBMD 1x8 RJ-45 port to the NTK605MAE5
access panel external slot ports).
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1-508 Photonics equipment description
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot shelf
type (NTTC09DM cable assembly is required to connect the OBMD 1x8
RJ-45 port to the NTK505PAE5 access panel external slot ports).
•
NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly is
required to connect the OBMD 1x8 RJ-45 port to the NTK555NA or
NTK555NB external slot ports).
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the OBMD 1x8
module's RJ-45 port to the NTK505JA access panel external slot ports).
•
integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access panel
(SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09DM cable assembly is required to connect the OBMD 1x8 RJ-45
port to the access panel external slot ports).
Performance monitoring
The 6500 monitors and collects physical PMs for OBMD 1x8 module facilities.
Table 1-139 provides a list of monitor types supported on OBMD 1x8 modules.
Figure 1-189 on page 1-509 shows the OBMD 1x8 module optical monitoring
points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-139
Monitor types table for Photonic OBMD 1x8 modules
Facility
OPTMON
Monitor type
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
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Photonics equipment description 1-509
Figure 1-189
OBMD 1x8 module optical monitoring points
PMs collected at all PD locations
Facility: OPTMON port 1,3,5,7,9,11,13,15,17
Parameter: OPR-OTS*
* AVG, MIN, and MAX measurements also provided.
Equipment
inventory
(RJ-45)
Inventory
Common Out 18
Common In 17
PD
1:8 Splitter/Combiner
PD
PD
PD
PD
PD
2 In
2 Out
3 In
3 Out
4 In
4 Out
5 In
5 Out
6 In
6 Out
7 In
7 Out
8 In
8 Out
PD
1 Out
PD
1 In
PD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Legend
PD
Photodiode
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Adjacency Mismatch
•
Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
Duplicate Adjacency Discovered
•
High Fiber Loss
•
Unassigned Channel in Use
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1-510 Photonics equipment description
Cross-connection types
The OBMD 1x8 supports the 2WAY (Bidirectional) cross-connection type.
Cross-connection rates
The OBMD 1x8 only supports the OCH (Optical Channel) Photonic
cross-connection rate.
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
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Photonics equipment description 1-511
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module
(174-0115-900)
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) module (also known as
OBB 2x2x2) is a half-width module and is part of WaveLogic Photonics
Coherent Select passive architecture. The Coherent Select nodes use a
combination of existing 6500 circuit packs (amplifiers, OSC, CMD44, BMD2)
and OBB 2x2x2 modules.
The OBB 2x2x2 module includes:
•
2x Line 1 ports (in/out)
•
2x Line 2 ports (in/out)
•
2x CMD 1 ports (in/out)
•
2x CMD 2 ports (in/out)
•
An RJ45 port for equipment inventory
Figure 1-190 shows the faceplate of the OBB 2x2x2 module. Figure 1-191 on
page 1-512 provides functional block diagram of the OBB 2x2x2 module.
Figure 1-190
OBB 2x2x2 module faceplate (174-0115-900)
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1-512 Photonics equipment description
Figure 1-191
OBB 2x2x2 module block diagram (174-0115-900)
Equipment
inventory
(RJ-45)
Inventory
Splitter/Combiner
PD
6 Line 1 Out
Splitter/Combiner
5 Line 1 In
Line 2 Out 8
Line 2 In
7
PD
Isolator
Isolator
2:2 Splitter/Combiner
PD
CMD1 In
CMD1 Out
CMD2 In
CMD2 Out
PD
1
2
3
4
Although the OBB 2x2x2 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the OBB 2x2x2 RJ-45 port to the
NTK505MBE5 access panel external slot ports).
•
NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x2x2 RJ-45 port to the NTK605MAE5
access panel external slot ports).
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Photonics equipment description 1-513
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot shelf
type (NTTC09DM cable assembly is required to connect the OBB 2x2x2
RJ-45 port to the NTK505PAE5 access panel external slot ports).
•
NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x2x2 RJ-45 port to the NTK555NA or
NTK555NB external slot ports).
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the OBB 2x2x2
module's RJ-45 port to the NTK505JA access panel external slot ports).
•
integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access panel
(SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09DM cable assembly is required to connect the OBB 2x2x2 RJ-45
port to the access panel external slot ports).
Performance monitoring
The 6500 monitors and collects physical PMs for OBB 2x2x2 module facilities.
Table 1-140 provides a list of monitor types supported on OBB 2x2x2
modules. Figure 1-192 on page 1-514 shows the OBB 2x2x2 module optical
monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-140
Monitor types table for Photonic OBB 2x2x2 modules
Facility
OPTMON
Monitor type
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
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Photonics Equipment
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1-514 Photonics equipment description
Figure 1-192
OBB 2x2x2 module optical monitoring points
PMs collected at all PD locations
Facility: OPTMON port 1,3,5,7
Parameter: OPR-OTS*
PMs collected for
Facility: OPTMON port 2,4
Parameter: OPT-OTS*
Splitter/Combiner
PD
6 Line 1 Out
Splitter/Combiner
5 Line 1 In
Equipment
inventory
(RJ-45)
Inventory
* AVG, MIN, and MAX measurements also provided.
Line 2 Out 8
Line 2 In
7
PD
Isolator
Isolator
2:2 Splitter/Combiner
PD
CMD1 In
CMD1 Out
CMD2 In
CMD2 Out
PD
1
2
3
4
Legend
PD
Photodiode
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Photonics equipment description 1-515
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
High Fiber Loss
•
High Optical Power
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
6500 Packet-Optical Platform
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1-516 Photonics equipment description
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module
(174-0116-900)
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) module (also known as
OBB 2x4x1) is a half-width module and is part of WaveLogic Photonics
Coherent Select (Coherent Select) passive architecture. The Coherent Select
nodes use a combination of existing 6500 circuit packs (amplifiers, OSC,
CMD44, BMD2) and OBB 2x4x1 modules.
The OBB 2x4x1 module includes:
•
2x Line 1 ports (in/out)
•
2x Line 2 ports (in/out)
•
2x CMD 1 ports (in/out)
•
2x CMD 2 ports (in/out)
•
2x CMD 3 ports (in/out)
•
2x CMD 4 ports (in/out)
•
An RJ45 port for equipment inventory
Figure 1-193 shows the faceplate of the OBB 2x4x1 module. Figure 1-194 on
page 1-517 provides functional block diagram of the OBB 2x4x1 module.
Figure 1-193
OBB 2x4x1 module faceplate (174-0116-900)
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Figure 1-194
OBB 2x4x1 module block diagram (174-0116-900)
Equipment
inventory
(RJ-45)
Inventory
Splitter/Combiner
Splitter/Combiner
9 Line 1 In
PD
10 Line 1 Out
PD
CMD4 In
CMD4 Out
4
CMD3 In
3
PD
CMD3 Out
CMD2 In
CMD2 Out
CMD1 In
CMD1 Out
2
11
Isolator
Isolator
PD
PD
1
Line 2 In
1:2 Splitter/Combiner
1:2 Splitter/Combiner
PD
Line 2 Out 12
1
2
3
4
Although the OBB 2x4x1 module is a passive device, autoprovisioning and
automatic inventory support are still possible if using
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09DM cable
assembly is required to connect the OBB 2x4x1 RJ-45 port to the
NTK505MBE5 access panel external slot ports).
•
NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x4x1 RJ-45 port to the NTK605MAE5
access panel external slot ports).
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1-518 Photonics equipment description
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot shelf
type (NTTC09DM cable assembly is required to connect the OBB 2x4x1
RJ-45 port to the NTK505PAE5 access panel external slot ports).
•
NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09DM cable assembly is
required to connect the OBB 2x4x1 RJ-45 port to the NTK555NA or
NTK555NB external slot ports).
•
NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09DM cable assembly is required to connect the OBB 2x4x1
module's RJ-45 port to the NTK505JA access panel external slot ports).
•
integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access panel
(SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2) w/2xOSC
2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of 2-slot shelf
(NTTC09DM cable assembly is required to connect the OBB 2x4x1 RJ-45
port to the access panel external slot ports).
Performance monitoring
The 6500 monitors and collects physical PMs for OBB 2x4x1 module facilities.
Table 1-141 provides a list of monitor types supported on OBB 2x4x1
modules. Figure 1-195 on page 1-519 shows the OBB 2x4x1 module optical
monitoring points.
For detailed information and procedures associated with performance
monitoring, refer to Fault Management - Performance Monitoring,
323-1851-520.
Table 1-141
Monitor types table for Photonic OBB 2x4x1 modules
Facility
OPTMON
Monitor type
OPR-OTS
OPRMIN-OTS
OPRMAX-OTS
OPRAVG-OTS
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Photonics equipment description 1-519
Figure 1-195
OBB 2x4x1 module optical monitoring points
PMs collected at all PD locations
Facility: OPTMON port 1,3,5,7,9,11
Parameter: OPR-OTS*
PMs collected for
Facility: OPTMON port 2,4,10,12
Parameter: OPT-OTS*
* AVG, MIN, and MAX measurements also provided.
Equipment
inventory
(RJ-45)
Inventory
Splitter/Combiner
Splitter/Combiner
9 Line 1 In
PD
10 Line 1 Out
Line 2 In
11
Isolator
Isolator
1:2 Splitter/Combiner
1:2 Splitter/Combiner
PD
Line 2 Out 12
PD
PD
CMD1 Out
CMD2 In
CMD2 Out
CMD3 In
CMD3 Out
CMD4 In
CMD4 Out
PD
CMD1 In
PD
1
2
3
4
1
2
3
4
Legend
PD
Photodiode
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1-520 Photonics equipment description
Equipment alarms
• Circuit Pack Missing
•
Circuit Pack Mismatch
•
Autoprovisioning Mismatch
Photonic alarms
• Loss of Signal
•
Gauge Threshold Crossing Alert Summary
•
High Fiber Loss
•
High Optical Power
Latency
This Technical Publication no longer provides latency specifications. All
latency information is available in “Latency Specifications, 323-1851-170”.
6500 Packet-Optical Platform
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Photonics equipment description 1-521
Band splitter 100 GHz modules (B-720-0020-0xx)
A variety of Band splitter 100 GHz modules (also known as BS modules)
support the 100 GHz DWDM filter modules by dividing an aggregated DWDM
signal into the one or more of the five bands that comprise the 100 GHz
DWDM channel plan. The BS modules provide a practical and convenient
means of facilitating an upgrade path for those who want to equip only a few
initial wavelengths while maintaining the ability to deploy additional channels
at some future time.
Positionally, the BS modules are placed ahead of the channel filter modules.
When used, they act as the first stage(s) of a multi-stage filter configuration,
with the BS(s) interfacing the network fibers and the channel filter modules
interfacing the BS(s) from their network ports and the equipment interfaces
from their channel ports.
The following Band Splitter modules are available as:
•
CN-BS1-x 1-Group Band Splitter 100 GHz modules (also known as BS1
modules)
These filters mux/demux one of the supported 100 GHz DWDM
wavelength groups: A, B, C, D, or E. Five modules are available, one for
each group:
— CN-BS1-A, Band Splitter 100 GHz C-Band Group A (B-720-0020-036)
— CN-BS1-B, Band Splitter 100 GHz C-Band Group B (B-720-0020-037)
— CN-BS1-C, Band Splitter 100 GHz C-Band Group C (B-720-0020-038)
— CN-BS1-D, Band Splitter 100 GHz C-Band Group D (B-720-0020-039)
— CN-BS1-E, Band Splitter 100 GHz C-Band Group E (B-720-0020-040)
Figure 1-196 shows the faceplates of the BS1 modules. Figure 1-197 on page
1-522 provides functional block diagram of the BS1 modules.
Figure 1-196
BS1 modules faceplates (B-720-0020-036, 037, 038, 039, 040)
NTWK
EXPR
GRP A
MON
R
NTWK
EXPR
GRP B
MON
NTWK
EXPR
GRP D
MON
R
T
T
CN-BS1-A
CN-BS1-B
NTWK
EXPR
GRP C
MON
R
R
T
T
T
T
CN-BS1-C
CN-BS1-D
NTWK
EXPR
GRP E
MON
R
T
T
CN-BS1-E
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Figure 1-197
BS1 modules block diagram (B-720-0020-036, 037, 038, 039, 040)
Express R
4
Express T
Group Splitter
3
Network T
2
Network R
1
Monitor T
7
Monitor R
8
Group X
5
6
X = A or B or C or D or E
•
CN-BS2-xx 2-Group Band Splitter 100 GHz modules (also known as BS2
modules)
These filters mux/demux two of the supported 100 GHz DWDM
wavelength groups: A and B or C and D. Two modules are available:
— CN-BS2-AB, Band Splitter 100 GHz C-Band Groups A, B
(B-720-0020-034)
— CN-BS2-CD, Band Splitter 100 GHz C-Band Groups C, D
(B-720-0020-035)
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Figure 1-198 shows the faceplates of the BS2 modules. Figure 1-199 provides
functional block diagram of the BS2 modules.
Figure 1-198
BS2 modules faceplates (B-720-0020-034, 035)
NTWK EXP GRP A
GRP B
MON
NTWK EXP GRP C
R
GRP D
MON
R
T
T
CN-BS2-AB
CN-BS2-CD
Figure 1-199
BS2 modules block diagram (B-720-0020-034, 035)
Express R
4
Express T
Group Splitter
3
Group X
Group Y
5
7
6
Network T
2
Network R
1
Monitor T
9
Monitor R
10
8
XY = AB or CD
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•
CN-BS3-ABE 3-Group Band Splitter 100 GHz modules (also known as
BS3 modules)
This filter muxes/demuxes three of the supported 100 GHz DWDM
wavelength groups: A, B, and E. One module is available:
— CN-BS3-ABE, Band Splitter 100 GHz C-Band Groups A, B, E
(B-720-0020-033)
Figure 1-200 shows the faceplates of the BS3 modules. Figure 1-201 on page
1-525 provides functional block diagram of the BS3 modules.
Figure 1-200
BS3 modules faceplates (B-720-0020-033)
NTWK
GRP A
GRP B
GRP E
R
T
CN-BS3-ABE
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Figure 1-201
BS3 modules block diagram (B-720-0020-033)
Network T
2
Network R
1
Group Splitter
•
Group A
Group B
Group E
3
5
7
4
6
8
CN-BS5 5-Group Band Splitter 100 GHz modules (also known as BS5
modules)
This filter muxes/demuxes all five of the supported 100 GHz DWDM
wavelength groups: A through E. One module is available:
— CN-BS5, Band Splitter 100 GHz C-Band Groups A, B, C, D, E
(B-720-0020-032)
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Figure 1-202 shows the faceplates of the BS5 modules. Figure 1-203 provides
functional block diagram of the BS5 modules.
Figure 1-202
BS5 modules faceplates (B-720-0020-032)
NTWK GRP A GRP B GRP C GRP DGRP E MON
R
T
CN-BS5
Figure 1-203
BS5 modules block diagram (B-720-0020-032)
Network T
2
Network R
1
Monitor T
13
Monitor R
14
Group Splitter
Group A
Group B
Group C
Group D
Group E
3
5
7
9
11
4
6
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CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm)
module (B-720-0014-003)
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm)
module (also known as OSCF) is a half-width 1-channel filter module that
muxes/demuxes one CWDM signal into and from an aggregated CWDM
signal.
Figure 1-204 shows the faceplates of the OSCF module. Figure 1-205 on
page 1-527 provides functional block diagram of the OSCF module.
Figure 1-204
OSCF module faceplate (B-720-0014-003)
NTWK
EXPR
1511
R
T
CN-51S-00
Figure 1-205
OSCF module block diagram (B-720-0014-003)
Express R
4
Express T
OSC MUX/DEMUX
3
Network T
2
Network R
1
1511
5
6
OSC = Optical service channel
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2110-Tx-xxxx Dispersion Compensation Modules (DCMs)
(B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)
The 2110-Tx-xxxx Dispersion Compensation Modules (DCMs) (also referred
to as 2110 DCMs) are passive devices and are used to provide chromatic
dispersion compensation and slope compensation introduced by the inherent
characteristics of the transmission fiber as a light pulse travels through the
fiber over long distances. The 2110 DCMs are therefore used to maximize the
performance of the 6500 system. Unlike DSCM modules
(NTT870AAE5-AHE5/AJE5-ANE5/APE5-AQE5, NTT870CAE5-CHE5/CJE5,
NTT870EAE5-EDE5, and NTT870GAE5-GGE5) supported in previous
releases of 6500, the 2110 DCMs (B-955-0003-00x, B-955-0003-3xx,
166-0203-9xx, 166-0403-9xx) cannot be automatically inventoried on a 6500
shelf. However, they can be inventoried in 6500 shelves by manual
provisioning. The users who want DCMs automatic inventory information on a
6500 shelf need to use the DSCM modules
(NTT870AAE5-AHE5/AJE5-ANE5/APE5-AQE5, NTT870CAE5-CHE5/CJE5,
NTT870EAE5-EDE5, and NTT870GAE5-GGE5).
The 2110 DCMs must be equipped in one of the following shelves:
•
2110 shelf with 19 inch brackets for EIA or NEBS equipment racks
(B-955-0004-005)
•
2110 shelf with 23 inch brackets for EIA or NEBS equipment racks
(B-955-0004-006)
•
2110 shelf with ETSI bracket configured for 300 mm rack brackets
(B-955-0004-008)
Note: The 6500 does not support autoprovisioning and automatic
inventory on the 2110 DCMs equipped in a 2110 shelf since 2110 shelf
cannot be connected to 6500 shelf access panel external slots. You must
use the DSCM variants NTT870xx if you need automatic inventory
support.
The following 2110 DCMs are supported:
•
G.652 (NDSF) standard 2110 DCMs including:
— 2110-T0-10, DCM -10 Type 1 C-Band (Half-Width) (B-955-0003-001)
— 2110-T0-20, DCM -20 Type 1 C-Band (Half-Width) (B-955-0003-002)
— 2110-T0-30, DCM -30 Type 1 C-Band (Half-Width) (B-955-0003-003)
— 2110-T0-40, DCM -40 Type 1 C-Band (Half-Width) (B-955-0003-004)
— 2110-T0-50, DCM -50 Type 1 C-Band (Half-Width) (B-955-0003-005)
— 2110-T0-60, DCM -60 Type 1 C-Band (Half-Width) (B-955-0003-006)
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•
G.652 (NDSF) low loss 2110 DCMs including:
— 2110-T0-70L, DCM -70 Low Loss Type 1 C-Band (Half-Width)
(166-0203-907)
— 2110-T0-80L, DCM -80 Low Loss Type 1 C-Band (Half-Width)
(166-0203-908)
— 2110-T0-90L, DCM -90 Low Loss Type 1 C-Band (Full-Width)
(166-0203-909)
— 2110-T0-100L, DCM -100 Low Loss Type 1 C-Band (Full-Width)
(166-0203-910)
— 2110-T0-110L, DCM -110 Low Loss Type 1 C-Band (Full-Width)
(166-0203-911)
— 2110-T0-120L, DCM -120 Low Loss Type 1 C-Band (Full-Width)
(166-0203-912)
— 2110-T0-130L, DCM -130 Low Loss Type 1 C-Band (Full-Width)
(166-0203-913)
— 2110-T0-140L, DCM -140 Low Loss Type 1 C-Band (Full-Width)
(166-0203-914)
— 2110-T0-150L, DCM -150 Low Loss Type 1 C-Band (Full-Width)
(166-0203-915)
— 2110-T0-160L, DCM -160 Low Loss Type 1 C-Band (Full-Width)
(166-0203-916)
— 2110-T0-170L, DCM -170 Low Loss Type 1 C-Band (Full-Width)
(166-0203-917)
•
G.655 (ELEAF) standard 2110 DCMs including:
— 2110-T3-20, DCM -20 Type 5 C-Band (Half-Width) (B-955-0003-302)
— 2110-T3-40, DCM -40 Type 5 C-Band (Half-Width) (B-955-0003-304)
— 2110-T3-60, DCM -60 Type 5 C-Band (Half-Width) (B-955-0003-306)
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•
G.655 (ELEAF) low loss 2110 DCMs including:
— 2110-T3-80L, DCM -80 Low Loss Type 5 C-Band (Half-Width)
(166-0403-908)
— 2110-T3-100L, DCM -100 Low Loss Type 5 C-Band (Full-Width)
(166-0403-910)
— 2110-T3-120L, DCM -120 Low Loss Type 5 C-Band (Full-Width)
(166-0403-912)
— 2110-T3-140L, DCM -140 Low Loss Type 5 C-Band (Full-Width)
(166-0403-914)
–
2110-T3-160L, DCM -160 Low Loss Type 5 C-Band (Full-Width)
(166-0403-916)
— 2110-T3-180L, DCM -180 Low Loss Type 5 C-Band (Full-Width)
(166-0403-918)
It is recommended that the empty sub-slots in a 2110 shelf are filled with 2110
blank (filler panel) (B-955-0004-001).
Figure 1-206 shows the faceplates of the 2110 DCM modules. Figure 1-207
on page 1-532 provides functional block diagram of the 2110 DCM modules.
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Figure 1-206
2110 DCM faceplates (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)
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Figure 1-207
2110 DCM block diagram (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, 166-0403-9xx)
OUT
IN
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Supported functionality
Photonic passive equipment provides the following functionality:
•
The following shows ports descriptions for OMDF4 modules, OMDF8
modules, BS, and OSCF module.
Table 1-142
Ports descriptions for OMDF4 modules, OMDF8 modules, BS, and OSCF module
Passive
modules
OMDF4
modules
OMDF8
modules
BS modules
OSCF
module
Ch #
NTWK
EXPR
(network (Express/ (channel
port)
Expansion ports)
port)
√
√
√
(Note 1
and
Note 7)
(Note 4
and
Note 7)
(Note 6
and
Note 7)
√
N/A
√
(Note 1
and
Note 7)
Number
of
channel
ports
Channel
(1511)
GRP #
(group
ports)
4
N/A
N/A
MON
Number
(monitor
of
port)
group
ports
N/A
(Note 12)
8
N/A
N/A
N/A
(Note 6
and
Note 7)
√
√
(Note 2
and
Note 8)
(Note 5
and
Note 7)
√
√
(Note 3
and
Note 9)
(Note 4
and
Note 9)
√
√
(Note 12)
N/A
N/A
N/A
N/A
N/A
√
√
1, 2, 3, or
√
5
(Note 11)
(Note 12)
N/A
N/A
N/A
(Note 10)
Note 1: NTWK (network port) provides input/output ports to the aggregate DWDM signal and is typically
connected either to the jumpers leading to the network (for example, outside plant) or to the relevant
Group port of a 100 GHz DWDM band splitter module.
Note 2: NTWK (network port) provides input/output ports to the aggregate CWDM signal and is typically
connected to the jumpers leading to the network (for example, outside plant or transmission fibers).
Note 3: NTWK (network port) provides input/output ports to the aggregate DWDM signal and is typically
connected to the jumpers leading to the network (for example, outside plant).
Note 4: EXPR (Express/Expansion port) provides input/output ports for the pass-through channels and
may be connected to the network. They may also be connected to a companion filter either for additional
downstream filtering or in the construction of an OADM node.
Note 5: EXPR (Express/Expansion port) provides input/output ports for the pass-through channel groups
and may be connected to the network. They may also be connected to a companion filter either for
additional downstream filtering or in the construction of an OADM node.
Note 6: Channel ports provide input/output ports for the channels that are muxed/demuxed by their
respective filters. The channel ports are typically connected to the optical transceivers of one or more
network elements.
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Table 1-142
Ports descriptions for OMDF4 modules, OMDF8 modules, BS, and OSCF module
Passive
modules
Ch #
NTWK
EXPR
(network (Express/ (channel
port)
Expansion ports)
port)
Number
of
channel
ports
Channel
(1511)
GRP #
(group
ports)
MON
Number
(monitor
of
port)
group
ports
Note 7: In the demux direction, the aggregated DWDM signal entering the NTWK port passes through
four channel filters (in case of a 4-channel passive module) or eight channel filters (in case of a 8-channel
passive module), which separate the intended wavelengths from the composite signal and routes them
to their respective channel ports. In a 4-channel passive module, the remaining DWDM signal passes to
the EXPR port. In a 8-channel passive module, and since 8-channel passive module do not support an
express passband, any pass-through traffic must be filtered and passed by another module (e.g. band
splitter), bypassing this filter. In the mux direction, the converse occurs. All ports use LC connectors.
Note 8: For the BS1 module and in the demux direction, the aggregated DWDM signal entering the
NTWK port passes through the group filter, which separates the group band from the composite signal
and routes it to the group port. The remaining DWDM signal passes to the EXPR port. All ports use LC
connectors. For the 2-group, 3-group, and BS5 modules and in the demux direction, the aggregated
DWDM signal entering the NTWK port passes through the group filters, which separate the group bands
from the composite signal and route them to their respective group ports. The remaining DWDM signal
passes to the EXPR port except for 3-group and BS5 modules which do not support an express
passband; hence, any passthrough traffic must be filtered by another module, bypassing this filter. All
ports use LC connectors.
Note 9: In the demux direction, the aggregated signal entering the NTWK port passes through a channel
filter, which separates the intended wavelength from the composite signal and routes it to the channel
port. The remaining CWDM signal passes to the EXPR port. In the mux direction, the converse occurs.
All ports use LC connectors.
Note 10: Channel (1511) provides input/output ports for the single channel that is muxed/demuxed by
the filter. The channel ports are typically connected to the optical transceiver of a network element.
Note 11: Group ports provide input/output ports for a wavelength group that is muxed/demuxed by the
group filter. The group ports are typically connected to the NTWK ports of a cascaded DWDM channel
filter.
Note 12: MON (monitor port) provides 1% output and 5% input taps with which to monitor the aggregated
DWDM signal at the NTWK interfaces. These taps are useful for monitoring the DWDM spectrum in an
unobtrusive manner. While the BS3 modules can be connected directly to the network fibers and serve
as first stage mux/demux in a manner similar to that of the BS2 modules, it is designed primarily to serve
as a 3- band, 24-channel expansion module. In this scenario the NTWK ports connect to the Expansion
port of the BS2 module, which in turn connects to the network fibers. For this reason, this module does
not support the MON ports, since monitoring can be performed either from the BS2 module connected to
the network fiber (if present) or from the cascaded channel filters.
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•
The following shows 40-wavelength 100 GHz grid planning in 6500 for
OMDF4 modules, OMDF8 modules, and band splitter modules.
Table 1-143
Photonic passive modules 100 GHz ITU grid 40 wavelength plan
Band
Sub-band
4200 channel #
(written on faceplate
of the module)
6500 channel #
6500
Wavelength
100 GHz (nm)
Band A (or Group A)
Band A ch 1
Sub-band A4H ch 1
59
1
1530.33
Band A ch 2
Sub-band A4H ch 2
58
3
1531.12
Band A ch 3
Sub-band A4H ch 3
57
5
1531.90
Band A ch 4
Sub-band A4H ch 4
56
7
1532.68
Band A ch 5
Sub-band A4L ch 1
55
9
1533.47
Band A ch 6
Sub-band A4L ch 2
54
11
1534.25
Band A ch 7
Sub-band A4L ch 3
53
13
1535.04
Band A ch 8
Sub-band A4L ch 4
52
15
1535.82
Band B (or Group B)
Band B ch 1
Sub-band B4H ch 1
50
19
1537.40
Band B ch 2
Sub-band B4H ch 2
49
21
1538.19
Band B ch 3
Sub-band B4H ch 3
48
23
1538.98
Band B ch 4
Sub-band B4H ch 4
47
25
1539.77
Band B ch 5
Sub-band B4L ch 5
46
27
1540.56
Band B ch 6
Sub-band B4L ch 6
45
29
1541.35
Band B ch 7
Sub-band B4L ch 7
44
31
1542.14
Band B ch 8
Sub-band B4L ch 8
43
33
1542.94
Band C (or Group C)
Band C ch 1
Sub-band C4H ch 1
41
37
1544.53
Band C ch 2
Sub-band C4H ch 2
40
39
1545.32
Band C ch 3
Sub-band C4H ch 3
39
41
1546.12
Band C ch 4
Sub-band C4H ch 4
38
43
1546.92
Band C ch 5
Sub-band C4L ch 1
37
45
1547.72
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Table 1-143
Photonic passive modules 100 GHz ITU grid 40 wavelength plan
Band
Sub-band
4200 channel #
(written on faceplate
of the module)
6500 channel #
6500
Wavelength
100 GHz (nm)
Band C ch 6
Sub-band C4L ch 2
36
47
1548.51
Band C ch 7
Sub-band C4L ch 3
35
49
1549.32
Band C ch 8
Sub-band C4L ch 4
34
51
1550.12
Band D (or Group D)
Band D ch 1
Sub-band D4H ch 1
32
55
1551.72
Band D ch 2
Sub-band D4H ch 2
31
57
1552.52
Band D ch 3
Sub-band D4H ch 3
30
59
1553.33
Band D ch 4
Sub-band D4H ch 4
29
61
1554.13
Band D ch 5
Sub-band D4L ch 5
28
63
1554.94
Band D ch 6
Sub-band D4L ch 6
27
65
1555.75
Band D ch 7
Sub-band D4L ch 7
26
67
1556.55
Band D ch 8
Sub-band D4L ch 8
25
69
1557.36
Band E (or Group E)
Band E ch 1
Sub-band E4H ch 1
23
73
1558.98
Band E ch 2
Sub-band E4H ch 2
22
75
1559.79
Band E ch 3
Sub-band E4H ch 3
21
77
1560.61
Band E ch 4
Sub-band E4H ch 4
20
79
1561.42
Band E ch 5
Sub-band E4L ch 1
19
81
1562.23
Band E ch 6
Sub-band E4L ch 2
18
83
1563.05
Band E ch 7
Sub-band E4L ch 3
17
85
1563.86
Band E ch 8
Sub-band E4L ch 4
16
87
1564.68
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Alarms
For a complete list of alarm clearing procedures for 6500, refer to Part 1 and
Part 2 of Fault Management - Alarm Clearing, 323-1851-543.
Equipment alarms
• Circuit pack Missing
•
Circuit Pack Mismatch
Facility alarm
• Duplicate adjacency discovered
•
Loss of signal
•
Group loss of signal
Equipping rules
The following equipping rules apply to Photonic passive equipment:
•
2150 Passive Optical Multiplexer (6-slot) chassis (B-310-0142-001) or
2150 Passive Optical Multiplexer (3-slot) chassis (174-0064-900) can be
manually provisioned (although not automatically) and 2-Slot Optical
Module Chassis (OMC2) or 6-slot passive Photonic chassis (PPC6)
(174-0040-900) can be automatically provisioned in external slots of
— 14-slot shelf (except the NTK503GA metro front electrical shelf, which
does not support this module) by using the shelf processor and access
panel.
— 32-slot shelf by using the shelf processor and access panel.
— 7-slot shelf (NTK503PAE5 or NTK503KA) by using the shelf processor
and access panel.
— 6500-7 packet-optical shelf (NTK503RA) by using the shelf processor
and access panel.
— 2-slot shelf by using the integrated shelf processor/access panel in
NTK503MAE5 and NTK503NAE5 variants or shelf processor
w/access panel (SPAP) (NTK555LA)/shelf processor w/access panel
(SPAP-2) w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA
variant.
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Note: Maximum ten 2150 Passive Optical Multiplexer (6-slot) chassis
(B-310-0142-001), 2150 Passive Optical Multiplexer (3-slot) chassis
(174-0064-900), 2-Slot Optical Module Chassis (OMC2), or 6-slot passive
Photonic chassis (PPC6) (174-0040-900) can be provisioned in a 2-slot
(NTK503LA variant), 6500-7 packet-optical, 7-slot, 14-slot, or 32-slot
shelves. Maximum seven 2150 Passive Optical Multiplexer (6-slot)
chassis (B-310-0142-001), 2150 Passive Optical Multiplexer (3-slot)
chassis (174-0064-900), 2-Slot Optical Module Chassis (OMC2), or 6-slot
passive Photonic chassis (PPC6) (174-0040-900) can be provisioned in a
2-slot shelf (NTK503MAE5 and NTK503NAE5 variants).
•
although the PPC6 is a passive device, autoprovisioning and automatic
inventory support are still possible if using
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505MBE5 access panel in a 14-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the PPC6's RJ-45
port to the NTK505MBE5 access panel external slot ports).
— NTK555EAE5 or NTK555FAE5 shelf processor and NTK605MAE5
access panel in a 32-slot shelf type (NTTC09BME6 or NTTC09DM
cable assembly is required to connect the PPC6's RJ-45 port to the
NTK605MAE5 access panel external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505PAE5 access panel in the NTK503PAE5 variant of a 7-slot
shelf type (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the PPC6's RJ-45 port to the NTK505PAE5 access panel
external slot ports).
— NTK555NA or NTK555NB shelf processor w/access panel in the
NTK503KA variant of a 7-slot shelf type (NTTC09BME6 or
NTTC09DM cable assembly is required to connect the PPC6's RJ-45
port to the NTK555NA or NTK555NB external slot ports).
— NTK555EAE5, NTK555CAE5, or NTK555FAE5 shelf processor and
NTK505JA access panel in a 6500-7 packet-optical shelf type
(NTTC09BME6 or NTTC09DM cable assembly is required to connect
the PPC6's RJ-45 port to the NTK505JA access panel external slot
ports).
— integrated shelf processor/access panel in NTK503MAE5 and
NTK503NAE5 variants of 2-slot shelf or shelf processor w/access
panel (SPAP) (NTK555LA)/shelf processor w/access panel (SPAP-2)
w/2xOSC 2xSFP (NTK555NA or NTK555NB) in NTK503LA variant of
2-slot shelf (NTTC09BME6 or NTTC09DM cable assembly is required
to connect the PPC6's RJ-45 port to the access panel external slot
ports).
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-539
•
The 2-Slot Optical Module Chassis (OMC2) contains two sub-slots and
can be equipped with:
— CLMD modules (NTK504PA); single-slot, one per sub-slot (any
sub-slot)
— UCS modules (NTK504PL); single-slot, one per sub-slot (any sub-slot)
•
The 2150 (6-slot) chassis or PPC6 contains six sub-slots (1, 2, 3 in the first
row from left to right and 4, 5, 6 in the second row from left to right) and
can be equipped with:
— OMDF4 modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OMDF8 modules (B-720-0022-00x); double-slot, in sub-slots 1+2 and
4+5 only
— BS modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OSCF modules (B-720-0014-003); single-slot, one per sub-slot (any
sub-slot)
•
The 2150 (3-slot) chassis contains three sub-slots (1, 2, 3) and can be
equipped with:
— OMDF4 modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OMDF8 modules (B-720-0022-00x); double-slot, in sub-slots 1+2 only
— BS modules (B-720-0020-0xx); single-slot, one per sub-slot (any
sub-slot)
— OSCF modules (B-720-0014-003); single-slot, one per sub-slot (any
sub-slot)
Note: The 6500 does not support autoprovisioning and automatic
inventory on the passive modules equipped in a 2150 (6-slot) or 2150
(3-slot) chassis since 2150 (6-slot) or 2150 (3-slot) chassis cannot be
connected to 6500 shelf access panel external slots. Hence, you must
manually provision the 2150 (6-slot) or 2150 (3-slot) chassis and any
passive modules in its sub-slots. However, if you equip these passive
modules in a PPC6, the 6500 supports autoprovisioning and automatic
inventory through the built-in PPC6 inventory control logic which interfaces
directly with the 6500 shelf access panel. The passive modules OMDF4,
OMDF8, BS1, BS2, BS3, BS5, and OSCF do not directly report to the
6500 shelf access panel. Also, if you equip the passive modules (CLMD
and/or UCS) in an OMC2 chassis, the 6500 can support autoprovisioning
and automatic inventory through the RJ45 interfaces in the passive
modules which directly connect to the 6500 shelf access panel.
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-540 Photonics equipment description
•
2110 DCMs (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx,
166-0403-9xx) can be also manually provisioned (although not
automatically) in external slots of 2-slot, 6500-7 packet-optical, 7-slot,
14-slot, and 32-slot shelf types.
Note: The 6500 does not support autoprovisioning and automatic
inventory on the 2110 DCMs equipped in a 2110 shelf since 2110 shelf
cannot be connected to 6500 shelf access panel external slots. You must
use the DSCM variants NTT870xx if you need automatic inventory
support.
•
Photonic passive equipment does not use any cross-connect capacity and
can be used with shelves equipped with or without cross-connect circuit
packs.
•
Photonic passive equipment are passive modules and therefore do not
require DC power.
Technical specifications
The following tables show different technical specifications for the Photonic
passive equipment supported in this release of 6500:
•
Table 1-144 on page 1-541 lists the weight, dimensions and power
consumption for the chassis.
•
Table 1-145 on page 1-543 lists the weight, dimensions and power
consumption for the 2110-Tx-xxxx Dispersion Compensation Modules
(DCMs).
•
Table 1-146 on page 1-544 lists the weight and power consumption for the
CN-xxx modules.
•
Table 1-147 on page 1-544 lists the weight and power consumption for the
OBB and OBMD modules.
•
Table 1-148 on page 1-545 and on page 1-545 provide the optical
characteristics of the CN-100-x4L and CN-100-x4H 4-channel Optical
Mux/Demux Filter (OMDF4) 100 GHz modules (B-720-0020-0xx).
•
Table 1-150 on page 1-547 and Table 1-151 on page 1-548 provide the
optical characteristics of the CN-100-x80 8-channel Optical Mux/Demux
Filter (OMDF8) 100 GHz modules (B-720-0022-00x).
•
Table 1-152 on page 1-549 and Table 1-153 on page 1-549 provide the
optical characteristics of the OBMD 1x8 C-Band modules.
•
Table 1-154 on page 1-549 and Table 1-155 on page 1-550 provide the
optical characteristics of the OBB 2x2x2 C-Band modules.
•
Table 1-156 on page 1-550 and Table 1-157 on page 1-551 provide the
optical characteristics of the OBB 2x4x1 C-Band modules.
6500 Packet-Optical Platform
Release 12.3
Copyright© 2010-2019 Ciena® Corporation
Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-541
•
Table 1-158 on page 1-551 and Table 1-159 on page 1-552 provide the
optical characteristics of the CN-BS1-x 1-Group Band Splitter 100 GHz
modules.
•
Table 1-160 on page 1-553 and Table 1-161 on page 1-553 provide the
optical characteristics of the CN-BS2-xx 2-Group Band Splitter 100 GHz
modules.
•
Table 1-162 on page 1-554 and Table 1-163 on page 1-555 provide the
optical characteristics of the CN-BS3-ABE 3-Group Band Splitter 100 GHz
module.
•
Table 1-164 on page 1-556 and Table 1-165 on page 1-557 provide the
optical characteristics of the CN-BS5 5-Group Band Splitter 100 GHz
module.
•
Table 1-166 on page 1-558 and Table 1-167 on page 1-559 provide the
optical characteristics of the OSCF module.
•
Table 1-168 on page 1-560 provides the optical characteristics of the 2110
DCMs.
Table 1-144
Weight, dimensions, power consumption for the chassis
Photonic passive equipment
and PEC
Weight (estimated)
Dimensions
Power
consumption
2-Slot Optical Module Chassis
(OMC2) (NTK504NA)
4.6 kg (10.1 lb)
Height: (43 mm / 1.7 in.)
0
Width: 438.1 mm / 17.25 in.)
Depth: 278.5 mm / 10.96 in.
2150 Passive Optical Multiplexer 4.5 kg (9.9 lb)
including brackets,
(6-slot) chassis
fiber management bar
(B-310-0142-001):
and cover and fully
• 2150 Passive Optical
Multiplexer (6-slot) chassis with equipped with
modules
19 inch brackets, fiber
management bar and cover
(B-967-0001-002)
Height: 88.9 mm / 3.5 in.
0
Width: 445 mm / 17.5 in.
Depth: 260.0 mm / 10.2 in.
(chassis only),
300.0 mm / 11.8 in. (chassis
w/optional fiber guard)
• 2150 Passive Optical
Multiplexer (6-slot) chassis with
23 inch brackets, fiber
management bar and cover
(B-967-0002-002)
• 2150 Passive Optical
Multiplexer (6-slot) chassis with
ETSI inch brackets, fiber
management bar and cover
(B-967-0003-002)
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
1-542 Photonics equipment description
Table 1-144
Weight, dimensions, power consumption for the chassis
Photonic passive equipment
and PEC
Weight (estimated)
2150 Passive Optical Multiplexer 5.4 kg (11.9 lb)
(3-slot) chassis (174-0064-900): including brackets
and cover and fully
• 2150 Passive Optical
Multiplexer (3-slot) chassis with equipped with
modules
19 inch, 23 inch, and ETSI
Dimensions
Power
consumption
Height: 43 mm / 1.7 in.
0
Width: 437 mm / 17.2 in.
Depth: 279 mm / 11 in.
brackets (K80-0002-901)
• 2150 Passive Optical
Multiplexer (3-slot) chassis with
19 inch, 23 inch, and ETSI
brackets and cover
(K80-0002-902)
6-slot passive photonic chassis
(174-0040-900):
• 6-slot Passive Photonics
chassis (PPC6) with 19 inch
and 23 inch brackets
(K80-0001-001)
7.7 kg (17.0 lb)
including brackets,
fiber management bar
and cover and fully
equipped with
modules
Height: 86.9 mm / 3.4 in.
0
Width: 432 mm / 16.9 in.
Depth: 290.6 mm / 11.4 in.
(chassis only)
• 6-slot Passive Photonics
chassis (PPC6) with 19 inch
and 23 inch brackets, fiber
management bar and cover
(K80-0001-002)
• 6-slot Passive Photonics
chassis (PPC6) with ETSI
brackets (K80-0001-003)
• 6-slot Passive Photonics
chassis (PPC6) with ETSI
brackets, fiber management
bar and cover (K80-0001-004)
6500 Packet-Optical Platform
Release 12.3
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Photonics Equipment
323-1851-102.6 Standard Issue 3
December 2019
Photonics equipment description 1-543
Table 1-144
Weight, dimensions, power consumption for the chassis
Photonic passive equipment
and PEC
Weight (estimated)
Dimensions
Power
consumption
2110 shelf for Dispersion
Compensation Modules:
13.6 kg (30.0 lb)
including brackets
and one full width
DCM or two half-width
DCMs
Height: 43 mm / 1.7 in.
0
• 2110 shelf with 19 inch
brackets for EIA or NEBS
equipment racks
(B-955-0004-005)
Width: 437 mm / 17.2 in.
(excluding mounting
brackets)
Depth: 279 mm / 11 in.
• 2110 shelf with 23 inch
brackets for EIA or NEBS
equipment racks
(B-955-0004-006)
• 2110 shelf with ETSI bracket
configured for 300 mm rack
brackets (B-955-0004-008)
Table 1-145
Weight, dimensions, power consumption for the 2110-Tx-xxxx Dispersion Compensation
Modules (DCMs)
Photonic passive equipment
and PEC
Weight (estimated)
Dimensions
Power
consumption
• B-955-0003-00x (half-width)
<1.5 kg (< 3.3 lb)
Height: 40 mm / 1.6 in.
0
Width: 213 mm / 8.4 in. for
half-width modules and
428 mm / 16.9 in. for
full-width modules
• B-955-0003-3xx (half-width)
• 166-0203-9xx (half-width)
• 166-0403-9xx (half-width)
• 166-0203-9xx (full-width)
<2.7 kg (< 5.9 lb)
Depth: 275 mm / 10.9 in
0
• 166-0403-9xx (full-width)
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1-544 Photonics equipment description
Table 1-146
Power consumption for the CN-xxx modules
Photonic passive equipment and PEC
Weight (estimated)
Power
consumption
CN-100-x4L and CN-100-x4H 4-channel Optical
Mux/Demux Filter (OMDF4) 100 GHz modules
(B-720-0020-0xx)
<0.4 kg (< 0.9 lb)
0
CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8)
100 GHz modules (B-720-0022-00x)
0
CN-BS1-x 1-Group Band Splitter 100 GHz modules
(B-720-0020-0xx)
0
CN-BS2-xx 2-Group Band Splitter 100 GHz modules
(B-720-0020-03x)
0
CN-BS3-ABE 3-Group Band Splitter 100 GHz module
(B-720-0020-033)
0
CN-BS5 5-Group Band Splitter 100 GHz module
(B-720-0020-032)
0
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF
CWDM 1511 nm) module (B-720-0014-003)
0
Table 1-147
Power consumption for the OBB and OBMD modules
Photonic passive equipment and PEC
Weight (estimated)
Power
consumption
Optical Broadband Mux/Demux (OBMD 1x8 C-Band)
module (174-0104-900)
0.6 kg (1.2 lb)
0
Optical Bridge and Broadcast (OBB 2x2x2 C-Band)
module (174-0115-900)
0.3 kg (0.7 lb)
0
Optical Bridge and Broadcast (OBB 2x4x1 C-Band)
module (174-0116-900)
0.3 kg (0.7 lb)
0
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Photonics equipment description 1-545
Table 1-148
CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
insertion loss
EXPR
DWDM Channels
Network Port
Port name for OMDF4 modules
Insertion
Loss
(Note)
E4L
E4H
D4L
D4H
C4L
C4H
B4L
B4H
A4L
A4H
Ntwk Out
(Mux)
16 In
20 In
25 In
29 In
34 In
38 In
43 In
47 In
52 In
56 In
1.0
1.7
Ntwk Out
(Mux)
17 In
21 In
26 In
30 In
35 In
39 In
44 In
48 In
53 In
57 In
1.2
2.0
Ntwk Out
(Mux)
18 In
22 In
27 In
31 In
36 In
40 In
45 In
49 In
54 In
58 In
1.4
2.3
Ntwk Out
(Mux)
19 In
23 In
28 In
32 In
37 In
41 In
46 In
50 In
55 In
59 In
1.6
2.6
Ntwk In
(Demux)
16
Out
20
Out
25
Out
29
Out
34
Out
38
Out
43
Out
47
Out
52
Out
56
Out
1.7
2.8
Ntwk In
(Demux)
17
Out
21
Out
26
Out
30
Out
35
Out
39
Out
44
Out
48
Out
53
Out
57
Out
1.5
2.5
Ntwk In
(Demux)
18
Out
22
Out
27
Out
31
Out
36
Out
40
Out
45
Out
49
Out
54
Out
58
Out
1.3
2.2
Ntwk In
(Demux)
19
Out
23
Out
28
Out
32
Out
37
Out
41
Out
46
Out
50
Out
55
Out
59
Out
1.1
1.9
Ntwk Out
(Mux)
Ex In Ex In Ex In Ex In Ex In Ex In Ex In Ex In Ex In Ex In 1.2
2.0
Ntwk In
(Demux)
Ex
Out
2.7
Ex
Out
Ex
Out
Ex
Out
Ex
Out
Ex
Out
Ex
Out
Ex
Out
Ex
Out
Ex
Out
Typ Max
(dB) (dB)
1.6
Note: Losses include two connector pairs for fiber-to-fiber measurement.
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Table 1-149
CN-100-x4L and CN-100-x4H 4-channel Optical Mux/Demux Filter (OMDF4) 100 GHz modules
optical specifications
General
MON
EXPR
DWDM Channels
Parameter
Min
Channel Passband (nm) (Note)
c±0.125
Total Channel Bandwidth (0.5 dB) (nm)
0.4
Typ
Max
c±0.15
Insertion Loss Variation (65% of 0.5 dB passband width) (dB)
0.4
Adjacent Channel Isolation (Demux) (dB)
28
Adjacent Channel Isolation (Mux) (dB)
25
Non-Adjacent DWDM Channel Isolation (dB)
40
Expr Passbanda (excl. 1 through 4) (nm)
1529
1566
Insertion Loss Variation (full passband) (dB)
0.3
Isolation: Expr port Out (dB)
22
Isolation: Expr port In (dB)
12
Ntwk Input (%)
5
Ntwk Output (%)
1
Insertion loss temperature sensitivity (dB/oC)
0.005
Polarization Dependent Loss (dB)
0.15
Polarization Mode Dispersion (ps)
0.15
Directivity (dB)
50
Backreflection (All ports) (dB)
40
Optical Power Handling (mW)
250
Note: All passbands are specified at 0.5 dB bandwidth.
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Table 1-150
8-channel Mux/Demux modules (OMDF8) insertion loss
Network Port
Port name for OMDF8 modules
DWDM Channels
E80
D80
C80
B80
Insertion Loss
(Note)
A80
Typ (dB)
Max (dB)
Ntwk Out (Mux)
16 In
25 In
34 In
43 In
52 In
1.0
1.7
Ntwk Out (Mux)
17 In
26 In
35 In
44 In
53 In
1.2
2.0
Ntwk Out (Mux)
18 In
27 In
36 In
45 In
54 In
1.4
2.3
Ntwk Out (Mux)
19 In
28 In
37 In
46 In
55 In
1.6
2.6
Ntwk Out (Mux)
20 In
29 In
38 In
47 In
56 In
1.7
2.9
Ntwk Out (Mux)
21 In
30 In
39 In
48 In
57 In
1.9
3.2
Ntwk Out (Mux)
22 In
31 In
40 In
49 In
58 In
2.1
3.5
Ntwk Out (Mux)
23 In
32 In
41 In
50 In
59 In
2.3
3.8
Ntwk In (Demux)
16 Out
25 Out
34 Out
43 Out
52 Out
2.4
4.0
Ntwk In (Demux)
17 Out
26 Out
35 Out
44 Out
53 Out
2.2
3.7
Ntwk In (Demux)
18 Out
27 Out
36 Out
45 Out
54 Out
2.0
3.4
Ntwk In (Demux)
19 Out
28 Out
37 Out
46 Out
55 Out
1.9
3.1
Ntwk In (Demux)
20 Out
29 Out
38 Out
47 Out
56 Out
1.7
2.8
Ntwk In (Demux)
21 Out
30 Out
39 Out
48 Out
57 Out
1.5
2.5
Ntwk In (Demux)
22 Out
31 Out
40 Out
49 Out
58 Out
1.3
2.2
Ntwk In (Demux)
23 Out
32 Out
41 Out
50 Out
59 Out
1.1
1.9
Note: Losses include two connector pairs for fiber-to-fiber measurement.
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Table 1-151
CN-100-x80 8-channel Optical Mux/Demux Filter (OMDF8) 100 GHz modules optical specifications
General
MON
DWDM Channels
Parameter
Min
Channel Passband (nm) (Note)
c±0.125
Total Channel Bandwidth (0.5 dB) (nm)
0.4
Typ
Max
c±0.15
Insertion Loss Variation (65% of 0.5 dB passband width) (dB)
0.4
Adjacent Channel Isolation (Demux) (dB)
28
Adjacent Channel Isolation (Mux) (dB)
25
Non-Adjacent DWDM Channel Isolation (dB)
40
Ntwk Input (%)
5
Ntwk Output (%)
1
Insertion loss temperature sensitivity (dB/oC)
0.005
Polarization Dependent Loss (dB)
0.2
Polarization Mode Dispersion (ps)
0.15
Directivity (dB)
50
Backreflection (All ports) (dB)
40
Optical Power Handling (mW)
250
Note: All passbands are specified at 0.5 dB bandwidth.
6500 Packet-Optical Platform
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Photonics equipment description 1-549
Table 1-152
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) (174-0104-900) module insertion loss
From
To
Insertion loss (dB)
Min
Max
Common In
1/2/3/4/5/6/7/8 Out
9.8
11
1/2/3/4/5/6/7/8 In
Common Out
10.1
11.3
Table 1-153
Optical Broadband Mux/Demux (OBMD 1x8 C-Band) (174-0104-900) module power monitoring
dynamic range
Port
Dynamic range (dBm)
Min
Max
Common In
-9.0
19
1/2/3/4/5/6/7/8 In
-11.0
4
Table 1-154
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) (174-0115-900) module insertion loss
From
To
Insertion loss (dB)
Min
Max
Line 2 Out
20.3
21.3
CMD1 Out
CMD2 Out
4.2
5.4
Line 1 Out
20.3
21.3
CMD1 Out
CMD2 Out
4.2
5.4
CMD 1 In
Line 1 Out
Line 2 Out
5.2
6.4
CMD 2 In
Line 1 Out
Line 2 Out
5.2
6.4
Line 1 In
Line 2 In
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Table 1-155
Optical Bridge and Broadcast (OBB 2x2x2 C-Band) (174-0115-900) module power monitoring
dynamic range
Port
Dynamic range (dBm)
Min
Max
Line 1 In
-4.0
24
Line 2 In
-4.0
24
CMD 1 In
-21.0
7
CMD 2 In
-21.0
7
Table 1-156
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) (174-0116-900) module insertion loss
From
To
Insertion loss (dB)
Min
Max
Line 2 Out
20.3
21.3
CMD1 Out
CMD2 Out
4.2
5.4
Line 1 Out
20.3
21.3
CMD3 Out
CMD4 Out
4.2
5.4
CMD 1 In
Line 1 Out
5.2
6.4
CMD 2 In
Line 1 Out
5.2
6.4
CMD 3 In
Line 2 Out
5.2
6.4
CMD 4 In
Line 2 Out
5.2
6.4
Line 1 In
Line 2 In
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Table 1-157
Optical Bridge and Broadcast (OBB 2x4x1 C-Band) (174-0116-900) module power monitoring
dynamic range
Port
Dynamic range (dBm)
Min
Max
Line 1 In
-4.0
24
Line 2 In
-4.0
24
CMD 1 In
-21.0
7
CMD 2 In
-21.0
7
CMD 3 In
-21.0
7
CMD 4 In
-21.0
7
Table 1-158
CN-BS1-x 1-Group Band Splitter 100 GHz modules insertion loss
Port names
Insertion Loss
(Note)
EXPR
GRP
Typ (dB)
Max (dB)
Ntwk Out (Mux) to Group x In
1.1
1.9
Ntwk In (Demux) to Group x Out
1.3
2.1
Ntwk Out (Mux) to Expr In
0.7
1.2
Ntwk In (Demux) to Expr Out
1.1
1.8
Note: Losses include two connector pairs for fiber-to-fiber measurement.
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Table 1-159
CN-BS1-x 1-Group Band Splitter 100 GHz modules optical specifications
-C
-B
-A
Groups (-Module)
-D
-E
Parameter
Min
Typ
Group E Passband (nm) (Note)
1558.82
1564.84
Ntwk to EXPR passband (nm) (Note)
1529.00
1558.17
Group D Passband (nm) (Note)
1551.56
1557.53
Ntwk to EXPR passband (excl. groupD ±.8nm) (nm)
(Note)
1529.00
1566.00
Group C Passband (nm) (Note)
1544.37
1550.28
Ntwk to EXPR passband (excl. groupC ±.8nm) (nm)
(Note)
1529.00
1566.00
Group B Passband (nm) (Note)
1537.24
1543.10
Ntwk to EXPR passband (excl. groupB ±.8nm) (nm)
(Note)
1529.00
1566.00
Group A Passband (nm) (Note)
1530.18
1535.98
Ntwk to EXPR passband (nm) (Note)
1536.61
1566.00
MON
Passband Insertion Loss Variation (excl. outermost 5GHz
either side of passband, Grp and Expr ports) (dB)
General
Max
0.3
Isolation (Ntwk In to Expr Out) (dB)
26
Isolation (Ntwk Out to Expr In) (dB)
16
Isolation (Ntwk to Grp port) (dB)
20
Ntwk Input (%)
5
Ntwk Output (%)
1
Insertion loss temperature sensitivity (dB/oC)
0.005
Polarization Dependent Loss (dB)
0.1
Polarization Mode Dispersion (ps)
0.15
Directivity (dB)
50
Backreflection (All ports) (dB)
40
Optical Power Handling (mW)
250
Note: All passbands are specified at 0.5 dB bandwidth.
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Table 1-160
CN-BS2-xx 2-Group Band Splitter 100 GHz modules insertion loss
Port names
Insertion Loss
(Note)
EXPR
GRP
Typ (dB)
Max (dB)
Ntwk Out (Mux) to Group x In
1.2
2.0
Ntwk Out (Mux) to Group y In
1.3
2.2
Ntwk In (Demux) to Group x Out
1.4
2.4
Ntwk In (Demux) to Group y Out
1.3
2.1
Ntwk Out (Mux) to Expr In
1.0
1.6
Ntwk In (Demux) to Expr Out
1.1
1.8
Note: Losses include two connector pairs for fiber-to-fiber measurement.
Table 1-161
CN-BS2-xx 2-Group Band Splitter 100 GHz modules optical specifications
MON
-AB
Groups (-Module)
-CD
Parameter
Min
Typ
Max
Group D Passband (nm) (Note)
1551.56
1557.53
Group C Passband (nm) (Note)
1544.37
1550.28
Ntwk to EXPR passband (excl. lgroupsC+D ±.8nm) (nm) 1529.00
(Note)
1556.00
Group B Passband (nm) (Note)
1537.24
1543.10
Group A Passband (nm) (Note)
1530.18
1535.98
Ntwk to EXPR Passbanda (excl. lgroupsA+B ±.8nm) (nm) 1529.00
(Note)
1556.00
Passband Insertion Loss Variation (excl. outermost 5GHz
either side of passband, Grp and Expr ports) (dB)
0.3
Isolation (Ntwk In to Expr) (dB)
16
Isolation (Ntwk to Grp port) (dB)
20
Ntwk Input (%)
5
Ntwk Output (%)
1
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Table 1-161
CN-BS2-xx 2-Group Band Splitter 100 GHz modules optical specifications
General
Parameter
Min
Typ
Max
Insertion loss temperature sensitivity (dB/oC)
0.005
Polarization Dependent Loss (dB)
0.1
Polarization Mode Dispersion (ps)
0.15
Directivity (dB)
50
Backreflection (All ports) (dB)
40
Optical Power Handling (mW)
250
Note: All passbands are specified at 0.5 dB bandwidth
Table 1-162
CN-BS3-ABE 3-Group Band Splitter 100 GHz modules insertion loss
Port names
Insertion Loss
(Note)
GRP
Typ (dB)
Max (dB)
Ntwk Out (Mux) to Group A In
0.8
1.4
Ntwk Out (Mux) to Group B In
1.0
1.7
Ntwk Out (Mux) to Group C In
1.2
2.0
Ntwk In (Demux) to Group A Out
1.2
2.0
Ntwk In (Demux) to Group B Out
1.0
1.7
Ntwk In (Demux) to Group C Out
0.8
1.4
Note: Losses include two connector pairs for fiber-to-fiber measurement.
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Table 1-163
CN-BS3-ABE 3-Group Band Splitter 100 GHz modules optical specifications
Parameter
Min
Groups
Max
Group E Passband (nm) (Note)
1558.82
1564.84
Group B Passband (nm) (Note)
1537.24
1543.10
Group A Passband (nm) (Note)
1530.18
1535.98
Passband Insertion Loss Variation (excl. outermost 5GHz
either side of passband, Grp ports) (dB)
General
Typ
0.3
Isolation (Ntwk In to Grp E Out) (dB)
20
Isolation (Ntwk In to Grp B Out) (dB)
20
Isolation (Ntwk In to Grp A Out) (dB)
16
Isolation (Ntwk Out to Grp E In) (dB)
16
Isolation (Ntwk Out to Grp B In) (dB)
20
Isolation (Ntwk Out to Grp A In) (dB)
20
Insertion loss temperature sensitivity (dB/oC)
0.005
Polarization Dependent Loss (dB)
0.1
Polarization Mode Dispersion (ps)
0.15
Directivity (dB)
50
Backreflection (All ports) (dB)
40
Optical Power Handling (mW)
250
Note: All passbands are specified at 0.5 dB bandwidth.
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Table 1-164
CN-BS5 5-Group Band Splitter 100 GHz modules insertion loss
Port names
Insertion Loss
(Note)
GRP
Typ (dB)
Max (dB)
Ntwk Out (Mux) to Group A In
1.2
2.0
Ntwk Out (Mux) to Group B In
1.3
2.2
Ntwk Out (Mux) to Group C In
1.5
2.5
Ntwk Out (Mux) to Group D In
1.7
2.8
Ntwk Out (Mux) to Group E In
1.9
3.1
Ntwk In (Demux) to Group A Out
1.9
3.2
Ntwk In (Demux) to Group B Out
1.8
3.0
Ntwk In (Demux) to Group C Out
1.6
2.7
Ntwk In (Demux) to Group D Out
1.4
2.4
Ntwk In (Demux) to Group E Out
1.2
2.1
Note: Losses include two connector pairs for fiber-to-fiber measurement.
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Table 1-165
CN-BS5 5-Group Band Splitter 100 GHz modules optical specifications
Parameter
Min
Groups
Max
Group E Passband (nm) (Note 1 and Note 2)
1558.82
1564.84
Group D Passband (nm) (Note 1)
1551.56
1557.53
Group C Passband (nm) (Note 1)
1544.37
1550.28
Group B Passband (nm) (Note 1)
1537.24
1543.10
Group A Passband (nm) (Note 1 and Note 3)
1530.18
1535.98
Passband Insertion Loss Variation
(excl. outermost 5GHz either side of passband, Grp ports) (dB)
MON
Typ
0.3
Isolation (Ntwk In to Grp E Out) (dB)
20
Isolation (Ntwk In to Grp D Out) (dB)
20
Isolation (Ntwk In to Grp C Out) (dB)
20
Isolation (Ntwk In to Grp B Out) (dB)
20
Isolation (Ntwk In to Grp A Out) (dB)
16
Isolation (Ntwk Out to Grp E In) (dB)
16
Isolation (Ntwk Out to Grp D In) (dB)
20
Isolation (Ntwk Out to Grp C In) (dB)
20
Isolation (Ntwk Out to Grp B In) (dB)
20
Isolation (Ntwk Out to Grp A In) (dB)
20
Ntwk Input (%)
5
Ntwk Output (%)
1
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Table 1-165 (continued)
CN-BS5 5-Group Band Splitter 100 GHz modules optical specifications
General
Parameter
Min
Typ
Max
Insertion loss temperature sensitivity (dB/oC)
0.005
Polarization Dependent Loss (dB)
0.1
Polarization Mode Dispersion (ps)
0.15
Directivity (dB)
50
Backreflection (All ports) (dB)
40
Optical Power Handling (mW)
250
Note 1: All passbands are specified at 0.5 dB bandwidth.
Note 2: The Group E Input port is directly connected to the Group D add filter express port. As a result,
the Group E Input port has different out-of-band spectral characteristics compared to Output ports A to
D. Nevertheless, the specifications in this table are all applicable.
Note 3: The Group A Output port is directly connected to the Group B drop filter express port. As a result,
the Group A Output port has different out-of-band spectral characteristics compared to Output ports B to
E. Nevertheless, the specifications in this table are all applicable.
Table 1-166
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module insertion loss
Port names
Insertion Loss
(Note)
EXPR CWDM Channel
Typ (dB)
Max (dB)
Ntwk Out (Mux) to Channel In
0.8 (0.9)
1.4 (1.6)
Ntwk In (Demux) to Channel Out
0.8 (1.0)
1.4 (1.7)
Ntwk Out (Mux) to Expr In
0.5 (0.7)
0.9 (1.2)
Ntwk In (Demux) to Expr Out
0.5 (0.7)
0.9 (1.2)
Note: Losses include two connector pairs for fiber-to-fiber measurement. Parenthetical numbers
pertain to extended temperature range conditions; all other numbers pertain to standard operating
conditions.
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General
EXPR
CWDM channel
Table 1-167
CN-51S-00 Optical Service Channel Filter (1-Ch OSCF CWDM 1511 nm) module optical
specifications
Parameter
Min
Typ
Channel Passband (nm) (Note 1)
c±6.5
c±7.2
Insertion Loss Variation: Ntwk to Channel (dB)
0.08
CWDM Channel Isolation: Ntwk to Expr (dB)
15
20
Adjacent CWDM Channel Isolation (Demux) (dB)
35
>40
Adjacent CWDM Channel Isolation (Mux) (dB)
20
>40
Non-Adjacent CWDM Channel Isolation (dB)
45
>55
Expr Passband (excl. lc±10nm) (nm) (Note 1)
1460
Insertion Loss Variation: Ntwk to Expr (dB) (Note 2)
Max
0.3
1621
0.15 (0.25) 0.3 (0.5)
Insertion loss temperature sensitivity (dB/oC)
0.005
Polarization Dependent Loss (Ntwk to Channel) (dB)
0.1
Polarization Dependent Loss (Ntwk to Expr) (dB)
0.05
Polarization Mode Dispersion (ps)
0.1
Directivity (dB)
55
Backreflection (All ports) (dB)
45
Optical Power Handling (mW)
250
Note 1: All passbands are specified at 0.5 dB bandwidth.
Note 2: Parenthetical numbers pertain to extended temperature range conditions; all other numbers
pertain to both operating conditions.
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Table 1-168
2110 DCM specifications (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, and 166-0403-9xx
variants)
2110 DCM Module
PEC
Maximum
2110 DCM tilt (dB)
insertion loss (dB)
2110-T0-10, DCM -10 Type 1
C-Band (Half-Width)
B-955-0003-001
2.53
0.1
2110-T0-20, DCM -20 Type 1
C-Band (Half-Width)
B-955-0003-002
3.16
0.07
2110-T0-30, DCM -30 Type 1
C-Band (Half-Width)
B-955-0003-003
3.79
0.04
2110-T0-40, DCM -40 Type 1
C-Band (Half-Width)
B-955-0003-004
4.42
0.01
2110-T0-50, DCM -50 Type 1
C-Band (Half-Width)
B-955-0003-005
5.05
-0.03
2110-T0-60, DCM -60 Type 1
C-Band (Half-Width)
B-955-0003-006
5.68
-0.06
2110-T0-70L, DCM -70 Low Loss
Type 1 C-Band (Half-Width)
166-0203-907
4.4
-0.29
2110-T0-80L, DCM -80 Low Loss
Type 1 C-Band (Half-Width)
166-0203-908
4.9
-0.32
2110-T0-90L, DCM -90 Low Loss
Type 1 C-Band (Full-Width)
166-0203-909
5.4
-0.38
2110-T0-100L, DCM -100 Low Loss 166-0203-910
Type 1 C-Band (Full-Width)
5.9
-0.41
2110-T0-110L, DCM -110 Low Loss 166-0203-911
Type 1 C-Band (Full-Width)
6.4
-0.45
2110-T0-120L, DCM -120 Low Loss 166-0203-912
Type 1 C-Band (Full-Width)
6.9
-0.50
2110-T0-130L, DCM -130 Low Loss 166-0203-913
Type 1 C-Band (Full-Width)
7.4
-0.54
2110-T0-140L, DCM -140 Low Loss 166-0203-914
Type 1 C-Band (Full-Width)
7.9
-0.58
2110-T0-150L, DCM -150 Low Loss 166-0203-915
Type 1 C-Band (Full-Width)
8.4
-0.61
2110-T0-160L, DCM -160 Low Loss 166-0203-916
Type 1 C-Band (Full-Width)
8.9
-0.68
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Table 1-168
2110 DCM specifications (B-955-0003-00x, B-955-0003-3xx, 166-0203-9xx, and 166-0403-9xx
variants)
2110 DCM Module
PEC
Maximum
2110 DCM tilt (dB)
insertion loss (dB)
2110-T0-170L, DCM -170 Low Loss 166-0203-917
Type 1 C-Band (Full-Width)
8.9
-0.72
2110-T3-20, DCM -20 Type 5
C-Band (Half-Width)
B-955-0003-302
4.0
-0.07
2110-T3-40, DCM -40 Type 5
C-Band (Half-Width)
B-955-0003-304
4.8
-0.05
2110-T3-60, DCM -60 Type 5
C-Band (Half-Width)
B-955-0003-306
5.7
-0.02
2110-T3-80L, DCM -80 Low Loss
Type 5 C-Band (Half-Width)
166-0403-908
5.0
-0.06
2110-T3-100L, DCM -100 Low Loss 166-0403-910
Type 5 C-Band (Full-Width)
5.9
-0.03
2110-T3-120L, DCM -120 Low Loss 166-0403-912
Type 5 C-Band (Full-Width)
6.8
-0.06
2110-T3-140L, DCM -140 Low Loss 166-0403-914
Type 5 C-Band (Full-Width)
7.4
-0.11
2110-T3-160L, DCM -160 Low Loss 166-0403-916
Type 5 C-Band (Full-Width)
7.4
-0.19
2110-T3-180L, DCM -180 Low Loss 166-0403-918
Type 5 C-Band (Full-Width)
7.4
-0.20
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2-1
Photonics equipment procedures
2-
Photonic circuit packs provisioning procedures
The following flowcharts provide the various steps/procedures to perform in
order to provision the different photonic circuit packs involved in the photonic
OTS.
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2-2 Photonics equipment procedures
Non-passive photonic OTS
Make sure the required passive modules such as CMD, BMD, or DSCM are installed.
See the Installation technical publication specific to the respective 6500 shelf type.
Install and provision required service slot circuit packs such as OSC and SFP(s), LIM, WSS, etc.
See the procedures in this chapter.
Route and connect fiber-optic cables to circuit packs
See the procedure in this chapter.
or
Provision photonic OTS using the original model
See the “Photonic layer provisioning procedures”
chapter in Commissioning and Testing, 323-1851-221.
Provision photonic OTS using the new model
See the "Photonic Configuration Management"
section in Part 2 of Configuration Provisioning and Operating, 323-1851-310
For Submarine applications, see
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Submarine Networking Application Guide,
NTRN72AA
Does the system
include root equipment, such as
FIM or GMD10?
Yes
No
Provision the
TID slot sequence
See Part 2 of
Configuration - Provisioning
and Operating, 323-1851-310
Provision photonic parameters
See the “Photonic layer provisioning procedures”
chapter in Commissioning and Testing, 323-1851-221.
Provision adjacencies
See the “Photonic layer provisioning procedures” chapter in Commissioning and Testing, 323-1851-221.
Connect intra-NE fibers
See the “Photonic layer site testing procedures” chapter in Commissioning and Testing, 323-1851-221.
Test the applicable configuration
See the “Photonic layer site testing procedures” chapter in Commissioning and Testing, 323-1851-221.
Equalize a thin terminal system if applicable
See the “Photonic layer site testing procedures” chapter in Commissioning and Testing, 323-1851-221.
Proceed to "Photonic Network SLAT" in the Photonic Layer Guide, NTRN15DA
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Photonics equipment procedures 2-3
Passive photonic OTS
See Commissioning and Testing, 323-1851-221,
“Passive OTS network procedures” chapter,
to perform the following tasks:
Provision the required passive components
Create the required passive OTS or
passive configuration
Provision line adjacencies
Equalize the passive network
End
Procedure
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2-4 Photonics equipment procedures
The table below provides references to procedures covered in this section.
Figure 2-1
Procedures in this section
Topic
Procedure 2-1, “Provisioning a circuit pack automatically”
Procedure 2-2, “Provisioning a pluggable automatically”
Procedure 2-3, “Routing fiber-optic cables and electrical cables onto the 6500 shelf”
Procedure 2-4, “Connecting or disconnecting fiber-optic cables to or from circuit packs”
Procedure 2-5, “Setting up the photonic system configurations”
Procedure 2-6, “Changing the primary state of a facility”
Procedure 2-7, “Changing the primary state of a circuit pack or pluggable”
Procedure 2-8, “Deleting a facility from an equipment”
Procedure 2-9, “Deleting a circuit pack, module, or pluggable”
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Photonics equipment procedures 2-5
Procedure 2-1
Provisioning a circuit pack automatically
If automatic equipping is enabled, when inserted in the shelf, a photonic circuit
pack and any SFPs (if applicable) auto-provision and facilities are autocreated. See Table 2-1 on page 2-7 for facilities supported on the photonic
circuit packs.
In a 14-slot shelf, the high flow fan requirement must be met before an SRA,
ESAM, SAM, or XLA circuit pack can auto-provision. For more information on
the shelf actual cooling capacity, see node information in Administration and
Security, 323-1851-301.
Note 1: The 2150 chassis (6-slot and 3-slot) and the passive modules
equipped in the 2150 chassis do not support auto-provisioning.
Note 2: The 6-slot passive photonics chassis (PPC6) and the passive
modules equipped in the 6-slot passive photonics chassis (PPC6) support
auto-provisioning if the 6-slot passive photonics chassis (PPC6) are
connected via Ethernet cables to unused and available external I2C slots
on the access panel.
To enable automatic equipping, refer to the “Enabling/disabling slot-based
automatic equipping” procedure in Administration and Security, 323-1851301.
For supported slots for photonic circuit packs, refer to the Equipping rules
section for each circuit pack.
Note 1: For double width or triple width WSSOPM circuit packs, the two
or three adjacent slots in the shelf must be valid and unprovisioned for the
WSSOPM circuit pack to auto-provision.
Note 2: For double width OMDF8 passive modules, the two adjacent slots
(1 and 2, or 4 and 5) in the 6-slot passive photonics chassis (PPC6) must
be valid and unprovisioned for the OMDF8 modules to auto-provision.
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2-6 Photonics equipment procedures
Procedure 2-1 (continued)
Provisioning a circuit pack automatically
CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.
Prerequisites
To provision equipment for an empty equipment slot, ensure the last
equipment that occupied the slot and its related facilities and cross-connects
have been deleted.
Step
Action
1
Wear an appropriate ESD personal grounding device to dissipate
electrostatic charges. If you are wearing an antistatic wrist strap, connect the
cord on the shelf installed in a grounded rack/cabinet or clip to a suitable
ground point.
2
Insert the circuit pack in the correct slot in the shelf.
If you are logged in to Site Manager when you automatically provision a circuit
pack, click Refresh in the Equipment & Facility Provisioning application to
display the circuit pack in the list of available equipment.
3
Repeat step 1 for all circuit packs to be provisioned.
—end—
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Photonics equipment procedures 2-7
Table 2-1
Facilities supported on photonic circuit packs and modules (Note 1)
Circuit pack (Equipment) Facilities on the circuit pack Note SFP
2)
equipment
Facilities on the SFP
(Note 2)
2xOSC (2xOSC)
NTK554BA
none
• P155M
SPAP-2 w/2xOSC (SP)
NTK555NA/NTK555NB
none
• P155M
SRA (SRA) NTK552JA
(Note 4)
OPTMON, (RAMAN, TELEMETRY,
OTDRCFG, AMPMON, ADJ,
ADJ-FIBER, ADJ-LINE)
P155M
OSC (Note 3)
SAM (SAM) NTK552JN
(Note 4)
OPTMON, (ADJ, ADJ-FIBER,
ADJ-LINE)
P155M
OSC (Note 3)
ESAM (ESAM) NTK552JT OPTMON, (OTDRCFG, ADJ, ADJ(Note 4)
FIBER, ADJ-LINE)
P155M
OSC (Note 3)
CCMD8x16 (CCMD8x16)
NTK508HA
PCXM
OPTMON, AMP,
(ADJ, ADJ-FIBER)
SLA, MLA, MLA2, MLA2 w/ VOA (applicable to MLA2 w/VOA
only), AMP (AMPMON), OPTMON,
VOA, MLA3 (LIM)
NTK552AA/BA/FA/GA/FB/ (ADJ, ADJ-LINE, ADJ-FIBER)
BL (Note 5)
N/A
N/A
XLA (XLA) (Note 6)
NTK552KA
AMP (AMPMON), (ADJ,
ADJ-FIBER)
N/A
N/A
LIM (LIM) (Note 7)
NTK552DA/DL
OPTMON (ADJ, ADJ-LINE,
ADJ-FIBER)
N/A
N/A
FGA (FGA) (Note 8)
NTK552AB
AMP (AMPMON), (ADJ,
ADJ-FIBER)
N/A
N/A
WSS 100GHz w/OPM 5x1, OPTMON, (ADJ, ADJ-FIBER), (CHC N/A
4x1, WSS 50 or 100GHz w/ Note 9)
OPM 2x1 (WSSOPM)
NTK553EA/KC/JA/KA/HA/
JB
N/A
WSS 50GHz w/OPM 9x1, AMP, OPTMON, (ADJ, ADJ-FIBER), N/A
WSS Flex C-Band w/OPM (CHC Note 9) or CHC (SSC) (Note
9x1, WSS Flex C-Band w/ 10)
OPM 20x1 (WSSOPM)
NTK553FA/FC/LA/MA
N/A
2-port OPM (OPM)
NTK553PA/PB
N/A
(PC), OPTMON, AMP, ADJ-TX,
ADJ-RX, (ADJ, ADJ-FIBER)
OPTMON, (ADJ, ADJ-FIBER)
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OSC, (ADJ,
• P155622M ADJ-FIBER) (Note 3)
OSC, (ADJ,
• P155622M ADJ-FIBER) (Note 3)
N/A
Photonics Equipment
323-1851-102.6 Standard Issue 2
December 2019
2-8 Photonics equipment procedures
Table 2-1
Facilities supported on photonic circuit packs and modules (Note 1)
Circuit pack (Equipment) Facilities on the circuit pack Note SFP
2)
equipment
Facilities on the SFP
(Note 2)
SMD 50GHz/Flex 8x1
(SMD) NTK553GA/GB
OPTMON, (ADJ, ADJ-FIBER), (CHC N/A
Note 9)
N/A
CCMD12 (CCMD12)
NTK508FA
AMP, OPTMON, ADJ-TX, ADJ-RX,
(ADJ, ADJ-FIBER)
N/A
N/A
N/A
N/A
SCMD4 (CMD4)
VOA, ADJ-TX, ADJ-RX, (ADJ,
NTK508AA to NTK508AH, ADJ-FIBER)
NTK508AJ
44 Channel Mux/Demux
100GHz or 50GHz
(CMD44) NTT862AA/FA,
NTT862BA to NTT862BD
OPTMON, ADJ-TX, ADJ-RX, (ADJ,
ADJ-FIBER)
N/A
N/A
OMD4 (OMD) NTK504AA
to NTK504AH, NTK504AJ
OPTMON, ADJ-TX, ADJ-RX, (ADJ)
N/A
N/A
OMX 4CH or 16CH (OMX) OPTMON, ADJ-TX, ADJ-RX, (ADJ)
NT0H32xx
N/A
N/A
N/A
N/A
N/A
N/A
OPTMON, (ADJ, ADJ-FIBER)
N/A
N/A
OPTMON, ADJ-TX, ADJ-RX, (ADJ,
ADJ-FIBER)
N/A
N/A
FIM (FIM) NTK504CA/CB, (ADJ)
CD/CE/CF
N/A
N/A
10 group Mux/Demux
(GMD10) NTT862GA
(ADJ, ADJ-FIBER)
N/A
N/A
4-ch OMDF (OMDF4)
OPTMON, ADJ-TX, ADJ-RX, (ADJ,
ADJ-FIBER)
N/A
N/A
Dispersion Slope
Compensation Module
(DSCM) NTT870xx and
4200 series
(DISP Note 11. ADJ, ADJ-FIBER)
(ADJ, ADJ-FIBER)
Broadband Mux/Demux
1x2 (BMD) NTT862DA/DC/
DD
OBB 2x2x2 (OBB)
174-0115-900
OBB 2x4x1 (OBB)
174-0116-900
OBMD 1x8 (OBMD8)
174-0104-900
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Photonics equipment procedures 2-9
Table 2-1
Facilities supported on photonic circuit packs and modules (Note 1)
Circuit pack (Equipment) Facilities on the circuit pack Note SFP
2)
equipment
Facilities on the SFP
(Note 2)
8-ch OMDF (OMDF8)
OPTMON, ADJ-TX, ADJ-RX, (ADJ,
ADJ-FIBER)
N/A
N/A
Band Splitter (BS)
OPTMON, (ADJ, ADJ-FIBER)
N/A
N/A
OSC Filter (OSCF)
(ADJ, ADJ-FIBER)
N/A
N/A
Note 1: Refer to Planning - Ordering Information, 323-1851-151, for the engineering rules associated
with each supported circuit pack and SFP module in this release.
Note 2: Facilities on photonic circuit packs/modules are auto-provisioned upon equipment/pluggable
equipment creation. The facilities in brackets are facilities that cannot be manually added or deleted.
When you delete an ADJ-TX (or ADJ-RX), the corresponding ADJ-RX (or ADJ-TX) is also deleted if the
Paired Rx or Paired Tx parameter for this adjacency is set to Yes.
Note 3: The P155M pluggable on the SRA, SAM, ESAM, 2xOSC or SPAP-2 w/2xOSC circuit pack
supports WSC facilities. These facilities are not displayed or managed in the Equipment & Facilities
Provisioning applications. They are handled by Comms Setting Management application through LAN
option under Interfaces tab.
Note 4: An SRA has two OPTMON facilities (ports 4 and 6), one RAMAN facility (port 8), one AMPMON
facility (port 7), one TELEMETRY facility (port 5), and one OTDRCFG facility (port 8). An ESAM/SAM
has three OPTMON facilities (ports 4, 6, and 8). An ESAM also has one OTDRCFG facility (port 8). The
P155M pluggable and OSC facility is supported on port 2.
Note 5: An MLA/MLA2/MLA2 w/VOA/MLA3 has LIM with two AMPMON facilities (ports 5 and 7), one
OPTMON facility (port 4), and two AMP facilities (ports 6 and 8). The MLA2 w/VOA has one VOA facility
per direction (ports 5 and 7). An SLA has LIM with one AMPMON facility (port 7), two OPTMON facilities
(ports 4 and 6), and one AMP facility (port 8). If an SLA is configured as a DropLIM or cascaded LIM in
an OTS before the equipment is provisioned, the two OPTMON facilities will not auto-provision when the
SLA equipment is provisioned.
Note 6: An XLA has two AMP facilities (ports 6 and 8) and two AMPMON facilities (ports 5 and 7).
Note 7: A LIM has LIM with three OPTMON facilities (ports 4, 6 and 8) and no AMP facility.
Note 8: An FGA has one AMP facility (port 4) and one AMPMON facility (port 3).
Note 9: CHC facilities are auto-created and deleted against WSSOPM equipment. On the WSS Flex
C-Band w/OPM 9x1, CHC facilities are auto-created only when the equipment profile is set to
FIXEDGRID. If the equipment profile is set to FLEXIBLEGRID, the CHC facilities must be manually
provisioned and the child SSC facilities are auto-created.
Note 10: Applicable to WSS Flex C-Band w/OPM 9x1 with FLEXIBLEGRID equipment profile only.
Note 11: DISP facilities are auto-created and deleted against DSCM equipment. The Add and Delete
buttons are visible and always disabled in this facility screen.
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2-10 Photonics equipment procedures
Procedure 2-2
Provisioning a pluggable automatically
If automatic equipping is enabled, when inserted in the SRA, SAM, ESAM,
2xOSC or SPAP-2 w/2xOSC circuit pack, an SFP is automatically provisioned
and the OSC and ADJ facilities are auto-created. If auto OSC/OSPF
provisioning is enabled in the System tab of Node Information application, an
associated OSPF circuit is automatically created. When a CXM pluggable is
inserted in the CCMD8x16, pluggable equipment and facilities are autocreated.
To enable automatic equipping, refer to the “Enabling/disabling slot-based
automatic equipping” procedure in Administration and Security, 323-1851301.
CAUTION
Risk of equipment damage
Electrostatic discharge can damage electrostatic sensitive
devices. Use antistatic protection to avoid damaging circuit
packs.
Prerequisites
To provision a pluggable for an empty circuit pack port, ensure the last
pluggable that occupied the circuit pack port and its related facilities have
been deleted.
Step
Action
1
Wear an appropriate ESD personal grounding device to dissipate
electrostatic charges. If you are wearing an antistatic wrist strap, connect the
cord on the shelf installed in a grounded rack/cabinet or clip to a suitable
ground point.
2
Insert the pluggable in the correct circuit pack port. SFPs are supported in
ports 1 and 2 of the SRA, SAM, ESAM, 2xOSC or SPAP-2 w/2xOSC circuit
pack. CXM pluggables are supported in port 1 of the CCMD8x16 circuit pack.
The pluggable is automatically provisioned with the same primary state as the
circuit pack.
3
Repeat step 1 for all pluggables to be provisioned.
—end—
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Photonics equipment procedures 2-11
Procedure 2-3
Routing fiber-optic cables and electrical cables onto
the 6500 shelf
Refer to the procedure on routing fiber-optical cables onto the 6500 shelf, in
the Installation technical publication specific to the respective 6500 shelf type.
—end—
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2-12 Photonics equipment procedures
Procedure 2-4
Connecting or disconnecting fiber-optic cables to or
from circuit packs
Refer to the procedure on connecting or disconnecting fiber-optic cables to or
from circuit packs, in the Installation technical publication specific to the
respective 6500 shelf type.
—end—
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Photonics equipment procedures 2-13
Procedure 2-5
Setting up the photonic system configurations
Refer to the overviews and the procedures in the following sections of
Commissioning and Testing, 323-1851-221:
•
for non-passive configurations (see the flowchart for “Non-passive
photonic OTS” on page 2-2):
— “Photonic layer provisioning procedures”
— “Photonic layer site testing procedures”
•
for passive configurations (see the flowchart for “Passive photonic OTS”
on page 2-3:
— “Passive OTS network procedures”
—end—
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2-14 Photonics equipment procedures
Procedure 2-6
Changing the primary state of a facility
Use this procedure to change the primary state of a facility.
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a loss of
traffic.
The primary state of adjacency facilities of type ADJ, ADJ-LINE and ADJFIBER is not editable. However, you can change the primary state of nonderived ADJ-TX or ADJ-RX facilities to OOS by changing the Transmitter/
Receiver type to UNKNOWN or Far end address to Null. In turn, an OOS ADJTX or ADJ-RX can be changed to IS by editing its Transmitter/Receiver type
to a supported type other than UNKNOWN or the Far end address to a valid
end point. To put ADJ-TX or ADJ-RX facilities to OOS, the optical channel
must be unmanaged first from DOC.
Prerequisites
To perform this procedure you must use an account with a level 3 or higher
UPC.
Step
Action
1
Select the required network element in the navigation tree.
2
Select Equipment & Facility Provisioning from the Configuration dropdown menu to open the Equipment & Facility Provisioning application.
3
Select the required shelf from the Shelf drop-down list.
4
In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack or SFP whose facility state you want to change.
5
Select the appropriate facility from the Facility Type drop-down list.
6
In the Facility area, select the facility whose state you want to change.
7
Click Edit in the Facility area to open the Edit facility dialog box.
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Procedure 2-6 (continued)
Changing the primary state of a facility
Step
Action
8
Select OOS or IS from the Primary state drop-down list.
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.
9
Click OK.
10
If changing the primary state to OOS, click Yes in the warning dialog box.
—end—
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2-16 Photonics equipment procedures
Procedure 2-7
Changing the primary state of a circuit pack or
pluggable
Use this procedure to change the primary state of a circuit pack or pluggable
to in-service or out-of-service. You must change the primary state of any
related facilities (AMP, OPTMON, OSC, or CHC) to out-of-service before
changing the primary state of a circuit pack or SFP to out-of-service. See
Procedure 2-6, “Changing the primary state of a facility”.
The primary state of adjacency facilities of type ADJ, ADJ-LINE and ADJFIBER is not editable. However, you can change the primary state of nonderived ADJ-TX or ADJ-RX facilities to OOS by changing the Transmitter/
Receiver type to UNKNOWN or Far end address to Null. In turn, an OOS ADJTX or ADJ-RX can be put IS by editing its Transmitter/Receiver type to a
supported type other than UNKNOWN or the Far end address to a valid end
point.
You cannot change the primary state of an SFP to IS if the associated circuit
pack is OOS.
Changing the primary state of a circuit pack automatically changes the
primary state of any provisioned SFPs on that circuit pack to the same state.
To change the primary state of the 2150 chassis, 3-slot or 6-slot passive
photonics chassis (PPC6) to OOS, all of the passive filters in its subslots must
be OOS. Passive filters cannot be changed to IS if the 2150 chassis, 3-slot or
6-slot passive photonics chassis (PPC6) is OOS.
Prerequisites
To perform this procedure, you must use an account with a level 3 or higher
UPC.
Step
Action
1
Select the required network element in the navigation tree.
2
Select Equipment & Facility Provisioning from the Configuration dropdown menu to open the Equipment & Facility Provisioning application.
3
Select the required shelf from the Shelf drop-down list.
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Procedure 2-7 (continued)
Changing the primary state of a circuit pack or pluggable
4
5
If you are changing the primary state to
Then go to
OOS
step 5
IS
step 6
Ensure are any related facilities are out-of-service. See Procedure 2-6,
“Changing the primary state of a facility”.
CAUTION
Risk of service interruption
If you place a facility out-of-service, you can cause a
loss of traffic.
6
Select the circuit pack or SFP in the Equipment area.
7
Click Edit in the Equipment area to open the Edit Equipment dialog box.
8
Select IS or OOS from the Primary state drop-down list.
9
Click OK.
10
If you are changing the primary state to OOS, click Yes in the warning dialog
box.
—end—
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2-18 Photonics equipment procedures
Procedure 2-8
Deleting a facility from an equipment
Use this procedure to delete a facility.
CAUTION
Risk of service interruption
If you delete a facility, you can cause a loss of traffic.
Note: If you delete an OSC facility, you can cause a loss of Comms,
depending on the Comms configuration.
You cannot manually delete a CHC facility. It will be auto-deleted as the
corresponding WSSOPM equipment is deleted. The exception is on the WSS
Flex C-Band w/OPM 9x1 in FLEXIBLEGRID mode, where the CHC facilities
must be manually provisioned and deleted. The child SSC facilities are autocreated and deleted with the parent CHC facilities.
You cannot delete adjacency facilities except ADJ-TX and ADJ-RX.
Prerequisites
To perform this procedure, you must
•
ensure the end-to-end service to be deleted is not carrying traffic
•
ensure the facility to be deleted is out-of-service and is not in maintenance
state
•
delete the cross-connects of the entire path. Refer to the “Deleting
photonic cross-connects” procedure in Part 1 of Configuration - Bandwidth
and Data Services, 323-1851-320.
•
delete the OSPF circuit (if provisioned) on the OSC facility (for SFPs on
2xOSC circuit packs). See “Deleting an entry in the communications
settings” in Part 1 of Configuration - Provisioning and Operating, 3231851-310.
•
use an account with a level 3 or higher UPC
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Procedure 2-8 (continued)
Deleting a facility from an equipment
Step
Action
1
Select the required network element in the navigation tree.
2
Select Equipment & Facility Provisioning from the Configuration dropdown menu to open the Equipment & Facility Provisioning application.
3
Select the required shelf from the Shelf drop-down list.
4
In the Equipment area of the Equipment & Facility Provisioning application,
select the circuit pack or SFP whose facilities you want to delete.
5
Select the appropriate facility from the Facility Type drop-down list.
6
In the Facility area, select the facility you want to delete.
7
Ensure the Primary state of the selected facility or facilities is out-of-service
(OOS). See Procedure 2-6, “Changing the primary state of a facility”.
8
Click Delete in the Facility area.
9
Click Yes in the warning dialog box.
—end—
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2-20 Photonics equipment procedures
Procedure 2-9
Deleting a circuit pack, module, or pluggable
Use this procedure to delete a circuit pack, module or pluggable equipment
from the list of provisioned equipment in the Equipment and Facility
Provisioning application. Deleting a circuit pack automatically deletes any
provisioned pluggables on that circuit pack.
Passive components (OMDF4, OMDF8, BS, OSCF, FGA, CMD44, and 6500/
4200 DSCM) cannot be deleted if they are part of a slot sequence. The 2150
chassis, 3-slot or 6-slot passive photonics chassis (PPC6) cannot be deleted
if any passive filters in its subslots are not deleted.
Prerequisites
To perform this procedure, you must
•
use an account with a level 3 or higher UPC
•
put the circuit pack or pluggable to be deleted out-of-service. See
Procedure 2-7, “Changing the primary state of a circuit pack or pluggable”.
•
delete all cross-connects provisioned through the equipment. Refer to the
“Deleting photonic cross-connects” procedure in Part 1 of Configuration Bandwidth and Data Services, 323-1851-320.
For photonic cross-connects, the optical channel must be unmanaged
from all DOCs and deleted on all nodes that are carrying the channel.
Photonic cross-connects with a Derived status are auto-created/deleted
by the system. To delete a photonic equipment (LIM, WSSOPM, CMD, or
BMD), make sure the derived cross-connects going through the
equipment are deleted by placing all the ADJ-TX/ADJ-RX associated with
the cross-connects to OOS (by changing the Tx type and Rx type to
Unknown or Far end address to Null) on all end to end nodes. See
Procedure 2-6, “Changing the primary state of a facility”.
•
ensure the photonic equipment to be deleted is not part of a slot sequence
(including the TID slot sequence)
•
delete all facilities (AMP, OPTMON, VOA, OSC, and ADJ-TX) on the circuit
pack and its associated pluggables. You cannot and do not need to delete
the facilities on the DSCM module. See Procedure 2-8, “Deleting a facility
from an equipment”.
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Procedure 2-9 (continued)
Deleting a circuit pack, module, or pluggable
Note that if the BMD is manually deleted then re-created, the WSS
adjacency must be manually provisioned, instead of automatically
provisioned by the system.
•
Make sure the following steps are done when deleting a WSS circuit pack:
— Put all CHC facilities OOS and delete (CHC deletion is applicable to
WSS Flex C-Band w/OPM 9x1 in FLEXIBLEGRID mode only)
— Put the AMP facility OOS and delete (applicable to WSS 50GHz w/
OPM 9x1/WSS Flex C-Band w/OPM 9x1 only)
— Put all OPTMON facilities OOS and delete
— Change the far end address to Null for ADJ facilities of WSS/CMD type
that are not derived
— Change the far end address to Null for ADJ-FIBER facilities of WSS/
CMD type that are not derived
— Put the WSS equipment OOS
Step
Action
1
Select the required network element in the navigation tree.
2
Select Equipment & Facility Provisioning from the Configuration dropdown menu to open the Equipment & Facility Provisioning application.
3
Select the required shelf from the Shelf drop-down list.
4
In the Equipment area, select the equipment (circuit pack or SFP) you want
to delete.
5
Click Delete in the Equipment area.
6
Click Yes in the warning dialog box.
Note: If the circuit pack or pluggable is part of an OTS, make sure you edit
the OTS to reflect the change.
—end—
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2-22 Photonics equipment procedures
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6500 Packet-Optical Platform
Photonics Equipment
Copyright© 2010-2019 Ciena® Corporation. All rights reserved.
Release 12.3
Publication: 323-1851-102.6
Document status: Standard
Issue 3
Document release date: December 2019
CONTACT CIENA
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web site at www.ciena.com