VSSC520S-M3 www.vishay.com Vishay General Semiconductor Surface-Mount TMBS® (Trench MOS Barrier Schottky) Rectifier FEATURES • Low profile package • Ideal for automated placement • Trench MOS Schottky technology • Low power losses, high efficiency • Low forward voltage drop SMC (DO-214AB) Cathode • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C Anode • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 LINKS TO ADDITIONAL RESOURCES TYPICAL APPLICATIONS 3D 3D For use in high frequency converters, freewheeling diodes, DC/DC converters and polarity protection applications. 3D Models MECHANICAL DATA PRIMARY CHARACTERISTICS IF(AV) 5.0 A VRRM 200 V IFSM 100 A VF at IF = 5.0 A 0.67 V Case: SMC (DO-214AB) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free and RoHS-compliant, commercial grade TJ max. 150 °C Package SMC (DO-214AB) Circuit configuration Single Terminals: matte tin plated leads, solderable J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test per Polarity: color band denotes the cathode end MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL VSSC520S Device marking code UNIT V5D Maximum repetitive peak reverse voltage Maximum DC forward current VRRM 200 IF (1) 5.0 IF (2) 2.2 V A Peak forward surge current 10 ms single half sine-wave superimposed on rated load IFSM 100 A Voltage rate of change (rated VR) dV/dt 10 000 V/μs TJ, TSTG -40 to +150 °C Operating junction and storage temperature range Notes (1) Units mounted on PCB with 25 mm x 25 mm copper pad areas, 1 oz. FR4 PCB (2) Free air, mounted on recommended PCB 1 oz. pad area ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER Instantaneous forward voltage TEST CONDITIONS IF = 5.0 A VR = 180 V Reverse current per diode VR = 200 V Typical junction capacitance 4.0 V, 1 MHz TYP. MAX. 1.19 1.70 0.67 0.75 TA = 25 °C 2.0 - μA TA = 125 °C 2.0 - mA TA = 25 °C TA = 125 °C TA = 25 °C SYMBOL VF (1) IR (2) TA = 125 °C CJ UNIT V 4 200 μA 3.2 25 mA 280 - pF Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms Revision: 09-Mar-2021 Document Number: 89318 1 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSSC520S-M3 www.vishay.com Vishay General Semiconductor THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER Typical thermal resistance SYMBOL VSSC520S RθJA (1) 95 RθJM (2) 9 UNIT °C/W Notes (1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance R θJA - junction to ambient (2) Units mounted on PCB with 25 mm x 25 mm copper pad areas; thermal resistance R θJM - junction to mount ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE VSSC520S-M3/57T 0.235 57T 850 7" diameter plastic tape and reel VSSC520S-M3/9AT 0.235 9AT 3500 13" diameter plastic tape and reel RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) Axis Title 5 4 3 2 1 TM Measured at Terminal TJ = 150 °C 1000 10 1st line 2nd line 2nd line Instantaneous Forward Current (A) Average Forward Rectified Current (A) 10000 100 6 TJ = 125 °C TJ = 100 °C 1 TJ = 25 °C TJ = -40 °C 0.1 0 0 25 50 75 100 125 150 100 175 0 0.2 0.4 0.6 0.8 1.0 10 1.2 1.4 1.6 TM - Mount Temperature (°C) Instantaneous Forward Voltage (V) Fig. 1 - Maximum Forward Current Derating Curve Fig. 3 - Typical Instantaneous Forward Characteristics Axis Title 4 D = 0.2 3.5 3.0 D = 1.0 D = 0.1 2.5 2.0 T 1.5 1.0 0.5 D = tp/T tp 10 1 1000 0.1 TJ = 150 °C TJ = 125 °C TJ = 100 °C 0.01 100 TJ = 25 °C 0.001 0.0001 TJ = -40 °C 10 0.00001 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1st line 2nd line D = 0.5 D = 0.8 D = 0.3 2nd line Instantaneous Reverse Current (mA) 4.5 Average Power Loss (W) 10000 100 10 20 30 40 50 60 70 80 90 100 Average Forward Current (A) Percent of Rated Peak Reverse Voltage (%) Fig. 2 - Forward Power Loss Characteristics Fig. 4 - Typical Reverse Characteristics Revision: 09-Mar-2021 Document Number: 89318 2 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSSC520S-M3 www.vishay.com Vishay General Semiconductor 1000 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p Transient Thermal Impedance (°C/W) Junction Capacitance (pF) 1000 100 10 0.1 1 10 Junction to Ambient 100 10 1 0.01 100 0.1 10 1 100 Reverse Voltage (V) t - Pulse Duration (s) Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance PACKAGE OUTLINE DIMENSIONS in inches (millimeters) SMC (DO-214AB) Cathode Band Mounting Pad Layout 0.185 (4.69) MAX. 0.246 (6.22) 0.220 (5.59) 0.126 (3.20) 0.114 (2.90) 0.126 (3.20) MIN. 0.280 (7.11) 0.260 (6.60) 0.060 (1.52) MIN. 0.012 (0.305) 0.006 (0.152) 0.320 (8.13) REF. 0.103 (2.62) 0.079 (2.06) 0.060 (1.52) 0.030 (0.76) 0.008 (0.2) 0 (0) 0.320 (8.13) 0.305 (7.75) Revision: 09-Mar-2021 Document Number: 89318 3 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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