REPORT – SEMICON 2023 (EXHIBITION VISIT)
Name: HUYNH-UYEN-PHUONG NGUYEN (ID: 112502891)
The semiconductor market has experienced significant growth and development in the past few years,
particularly in Taiwan. It was a great honor for me to have to opportunity to visit the SEMICON exhibition
on September 6th. Given that the main concept of the exhibition is to inspire innovation and promote
sustainability, I observed how individuals and organizations have been striving to achieve stable
development without causing any environmental harm.
One of the most intriguing presentations for me was about Green FILTEC Ltd.'s approach to the circular
economy. GreenFILTEC is a chemical filter manufacturer that engages in a variety of collaborations,
including partnerships with TSMC and Micronix, etc. By implementing a product modularization approach,
they have successfully accomplished the objective of 3R (reducing filter waste, reusing frames, and
regenerating filters) which has led to a significant reduction in the overall filter purchase expenses. This
achievement marks a groundbreaking milestone in the industry as they have become the first to receive
second-class environmental protection label certification and the prestigious Yushan Award in the best
product category. Additionally, they have passed the BS 8001:2017 circular economy assessment, and we
remain committed to introducing innovative products that challenge the conventional norms within the
industry. On the flip side, when it comes to innovative advancements, I have found the presentations by
CHIMEI and ThermalView X to be particularly exhilarating. CHIMEI's RUM is employed to enhance the
performance of photoresists in the RDL process. Users can achieve higher resolution and improved vertical
profiles without the need to replace their existing photoresists or equipment; they simply need to apply a
coat of RUM on top of the photoresist. What's fascinating is that RUM can be easily replaced with water
when necessary. In the case of the ThermalViewX MCR-Series, they have introduced an effective solution
for addressing the heat-related issues in small devices. Conventional thermography, even with micro lenses,
tends to fall short for tiny devices due to limitations in resolution, typically limited to a few hundred microns.
This limitation results in significant distortion in the peripheral areas of the images. However, the
ThermalView X MCR-Series offers a superior solution by providing micron-meter-sized information in an
image format with minimal distortion. Notably, it boasts impressive speed, ranging from 30Hz to 4000Hz,
and allows users to choose from fine-resolution options, all while remaining cost-effective. The USIC's
demonstration of IMSi Oxide Wafer has garnered significant attention, as it was asserted to outperform
traditional silicon wafers, primarily due to its superior uniformity and increased dielectric strength. It was
pointed out that conventional Chemical Vapor Deposition (CVD) techniques face several constraints when
attempting to achieve these attributes in dielectric wafers. This development has piqued my interest as it
aligns with the focus of my research efforts.