1.
In this lab we are producing photomasks on transparent sheets using the photoplotter. What are two
benefits and two limitations of using transparencies compared to traditional glass photomasks?
Quick and cheap,
Disadvantages doesn’t last very long and dimensional stability isn’t as good
2.
Silicon dioxide is used as a base dielectric layer. What is the importance of using the dielectric in this lab?
To stop current from flowing
3.
[2 marks] One of the stated design parameters is “features must be separated by at least 400 microns”.
What are two possible reasons for this restriction?
So any imperfections don’t spread to the other components, to fill the wafer, easier to differentiate from the other
patterns
4.
[6 marks] Include calculations for the predicted resistance for the resistors in your mask, and explain what
measurements you will need to make during characterization to obtain this information. Include a picture
of your mask showing the critical dimensions of the features.
1.(=NEA
d
(9) (500 x8500)
=
im
X 8.854x10
Fm
500 m
-0.577F
2.
(5)(500x85001m 8.854x10- From
=
1000,
m
I
5
=0.1881 F
........
6
2
3.(1) (1000
x
8500)m 8832x10Frm
x
3000pm
>
3
8
4
=0.02509F
4. ((G) (250Nmx8125pm) x8.859x10 Fum
250 m
=1.367F
5, R
I
=
=(2.65x10m(m)(51000,n)
100 x 500
m
=0.0090/M
6. 2.65x10- 2/,m) (33000m)
1300x3007 m
=
0.00583m
=
(.65x10 2/am)(28500pm)
-
7.
2.65x10-2,m) (78000mm)
=
1300x3007 m
=0.01378
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8.
=
4000,m) (300,m)
0.002518
=