FLYOVER
TECHNOLOGY
®
samtec.com/flyover
SAMTEC FLYOVER
TECHNOLOGY
®
THE PROBLEM
THE SOLUTION
As bandwidth requirements rapidly increase,
effectively managing heat and routing signals
through lossy PCBs, vias and other components
have become complex challenges.
Samtec Flyover® design breaks the constraints
of traditional signaling substrate and hardware
offerings, resulting in a cost–effective, high–
performance and heat efficient answer to the
challenges of 56 Gbps bandwidths and beyond.
PCB REACH AT
NEXT GEN SPEEDS
SAMTEC FLYOVER® SYSTEMS
BANDWIDTH VS. TRADITIONAL & HIGH–SPEED MATERIALS
FR408
MEGTRON 6
MICRO TWINAX
OPTICS
Gbps
10
up to 10"
10"+
up to 39"
100 m+
Gbps
14
up to 5"
up to 10"
up to 33"
100 m+
Gbps
28
up to 2"
up to 5"
up to 23"
up to 100 m
Gbps
56
0.0"
up to 2"
up to 12"
TBD
112
0.0"
0.0"
up to 6"
TBD
Gbps
(–5 dB Loss Target, Reach Estimate. For OIF VSR applications.)
0
14 GHz
-1.439 dB
-2
28 GHz
-2.142 dB
-4
-6
]
-8
-10
14 GHz
-9.341 dB
-12
-14
28 GHz
-15.266 dB
-16
-18
-20
0
5
10
15
20
25
30
Frequency (GHz)
30 AWG 100 Ω
Low Skew Twinax Cable
samtec.com/flyover
35
40
45
50
MEG6 Backplane PCB trace,
5.7 mil wide, 8.3 mil space
Samtec Flyover® Cable Technology
Samtec Flyover® design provides end option
flexibility to create a high–speed application
specific solution to meet next gen speeds.
Panel, Mid–board and
Backplane Assemblies
Variety of End 2 Options
ULTRA LOW SKEW CABLE TECHNOLOGY
• Ideal for 28–112+ Gbps applications
SAMTEC CABLE
INDUSTRY CABLE
• Tight coupling between signal conductors
• Ultra low skew twinax < 3.5 ps/meter
Good design coupling
with Samtec’s co-extruded
ultra low skew twinax
PERFORMANCE & COST ADVANTAGES
 Bad design coupling with
individually extruded
conductors & drain wire
THERMAL IMPROVEMENT
• 28–56 Gbps NRZ & Beyond
• Simplified Board Layout
• Fewer PCB Layers
• Less Expensive PCB Materials
• Eliminate Expensive Re–timers
SUPPORT
Fully integrated Technology Centers for full system optimization from
Silicon–to–Silicon, including Samtec’s High–Speed Cable Group.
Standard Network Switch vs. Samtec Flyover® Technology
samtec.com/flyover
FLYOVER
PANEL ASSEMBLIES
®
DIRECT ATTACH QSFP28 SYSTEMS
QSFP28 systems utilize Samtec Flyover® technology to route data above lossy PCB, simplifying board layout and
extending signal reach. The modular design enables optimized systems that improve heat management, increase signal
integrity performance, build in scalability for future upgrades and reduce costs by creating a multifunction board.
Standard 1U rack tray with side stackable configurations
Increases panel density and optimizes airflow
samtec.com/flyover
FLYOVER® QSFP28 SYSTEM
4 Channels (x4 bidirectional, 8 differential pairs)
~100 Gbps 28G NRZ aggregate
(~200 Gbps 56G PAM4; ~400 Gbps 112G PAM4)
Compatible with all MSA QSFP pluggables
Heat dissipation: ~3.5 W/cable
FQSFP
Eye Speed® 30 or 34 AWG twinax cable
Multiple end 2 options for design flexibility
Evaluation Kits available,
visit samtec.com/kits
Localized press–fit control and power
contacts eliminate the need for a
secondary cable and connector
FQSFP
High–speed contacts directly soldered
to Eye Speed® ultra low skew twinax
FLYOVER® QSFP DOUBLE DENSITY SYSTEM
8 Channels (x8 bidirectional, 16 differential pairs)
~200 Gbps 28G NRZ aggregate
(~400 Gbps 56G PAM4; ~800 Gbps 112G PAM4)
Belly–to–belly mating for maximum density
Backward compatible with QSFP modules
FQSFP–DD
Heat dissipation: ~7+ W/cable
Variety of end 2 options
Evaluation Kits available,
visit samtec.com/kits
FQSFP–DD
PRODUCT ROADMAP:
FLYOVER® QSFP-DD 800G
Sideband signals are routed
through press–fit contacts
for increased airflow
High–speed contacts directly soldered
to Eye Speed® ultra low skew twinax
• Single to multiple ganged ports
• Belly-to-belly and mezzanine stack configurations
• Contact HDR@samtec.com for more information
samtec.com/flyover
5
FLYOVER
MID-BOARD ASSEMBLIES
®
EXTREME HIGH–SPEED, HIGH–DENSITY CABLE
8 to 32 signal pairs
with two reliable
points of contact
guaranteed;
72 pairs in
development
NVAC
Industry leading aggregate data
rate density — 2x the data rate in
60% of the space
NVAM–C
BGA attach for
density and
optimized trace
breakout region
Proprietary pin to ground
configuration enables very low
crosstalk (to 40 GHz) and very
tight impedance control
Evaluation Kit available,
visit samtec.com/kits
Aggregate Data Rate (NRZ)
448 Gbps
672 Gbps
896 Gbps
1 Bank
NVAC
(2 Bank, 4 Row, 32 Pairs)
2 Row
3 Row
8 Pairs
12 Pairs
1344 Gbps
1792 Gbps
2 Bank
4 Row
2 Row
16 Pairs
samtec.com/novaray
4032 Gbps*
3 Bank*
3 Row
4 Row
6 Row*
24 Pairs
32 Pairs
72 Pairs*
*In development
PRODUCT ROADMAP:
NOVARAY I/O ASSEMBLIES
®
• Up to 1024 Gbps PAM4
aggregate data rate
32 PAIR
• Cable-to-cable bulkhead
panel connection
• 112 Gbps PAM4 solutions in
8, 16, and 32 pair configurations
16 PAIR
• PCI Express® 6.0 solutions in x4
and x8 pair configurations
8 PAIR
• Rugged external shielding
for EMI protection
SLIM CABLE ASSEMBLY
Slimmest cable assembly in the
industry – 7.6 mm body width
High–density 2–row design
8 and 16 pair configurations
(24 pair in development)
Right–angle available
Eye Speed® 34 AWG
ultra low skew twinax
ARC6
Evaluation Kits available,
visit samtec.com/kits
ARF6
ARC6 (8 Pairs)
PRODUCT ROADMAP
Higher pin counts, higher density and right-angle solutions are in
development for the industry’s slimmest high-speed cable system.
Differential Pair, Ganged AcceleRate®
Cable-to-AcceleRate® HP Vertical
Direct Attach • 56 to 112 Gbps PAM4
Highest Aggregate Data Rate in the Industry
AcceleRate® HP High Data Rate /
High Pin Count Cable System
Transition Card
•
400 to 800 Pin Counts
samtec.com/accelerate
Ganged AcceleRate® Cable-toAcceleRate® HP Right-Angle
Mixed DP/SE/Power • 32/64 Gbps PAM4
Blind Mate/High Pin Count
SI-FLY
ASIC-ADJACENT TECHNOLOGY
TM
112 Gbps PAM4, LOW-PROFILE HIGH-DENSITY CABLE SYSTEM
SIUltra-high density configuration
adjacent to the IC package
Up to 16 pairs in an incredibly low
3.4 mm profile
CPC
Co-packaged interconnect option
eludes the BGA and routes signals
from the silicon package through a
long-reach cable, supporting
5x the PCB solutions
An extremely low profile allows
112 Gbps PAM 4 per lane
Si-Fly™ connectors to reside under
heatsinks or other cooling hardware
CPI
PRODUCT ROADMAP
EXTREME CHANNEL PERFORMANCE
25.6 TB
PER LANE
In Develpment: Rugged latching
configuration provides a secure
connection directly adjacent to the
IC package for increased signal
integrity performance
Co-packaged interconnect
configuration for advanced
112G+ data rate requirements
samtec.com/si-fly
~2020-2021
256 Lanes, 512 DP
Current
51.2 TB
PER LANE
~2022-2023
512 Lanes, 1024 DP
Future
FIREFLY
MICRO FLYOVER
SYSTEM
™
™
FIREFLY™ COPPER SYSTEMS
High-performance, high-density
copper Samtec Flyover® solution
ECUE
Pin compatible with FireFly® optical
using the same connector system
(ECUO)
x4, x8 and x12 configurations
UEC5/
UCC8
PCIe® 4.0 system (PCUE)
Evaluation Kit available,
visit samtec.com/kits
ECUE (x12)
PCI–SIG®, PCI Express® and the PCIe®
design marks are registered trademarks
and/or service marks of PCI–SIG.
FIREFLY™ OPTICAL SYSTEMS
Designed for flexibility, optical (ECUO)
for greater distances and copper
(ECUE) for cost optimization
x4 and x12 configurations
PCI Express®–Over–FireFly™
(PCUO) supports PCIe® protocol
for low latency, power savings and
guaranteed transmission;
3.0 and 4.0 solutions
Multiple end 2 options including
MTP®, MXC®, MT and ARINC 801
–40 ºC to +85 ºC extended
temperature system (ETUO)
samtec.com/firefly
ECUO
BACKPLANE
CABLE ASSEMBLIES
HIGH–SPEED BACKPLANE CABLE
Utilizes Samtec’s Eye Speed®
ultra low skew twinax cable
technology for improved signal
integrity, increased flexibility
and routability
EBCF
EBTM/EBCL
Reduce costs due to lower
PCB layer counts
Evaluation Kit available,
visit samtec.com/kits
EBCF
(72 Pairs Total)
ExaMAX® is a registered
trademark of AFCI.
Highly customizable with
modular flexibility
samtec.com/examax
Industry’s lowest mating
force with excellent
contact normal force
EBTF–RA
EBCB
Two reliable points
of contact with a
2.4 mm wipe
Wafer design
increases isolation
for reduced crosstalk
EBCM
Includes one sideband
signal per column
Staggered
differential pairs
provide higher
data rates
30 and 34 AWG ultra low
skew twinax cable to support
various cable lengths
EBCB
EBCF
Designed for
blind-mate systems
Vertical and
right–angle
4 and 6 pairs;
4–16 columns
Intermateable with all
ExaMAX® connectors
(EBTM/EBTF–RA)
Integrated guidance
and keying options
samtec.com/examax
Cable–to–DMO
(Direct Mate Orthogonal)
SUDDEN SERVICE®
UNITED STATES • NORTHERN CALIFORNIA • SOUTHERN CALIFORNIA • SOUTH AMERICA • UNITED KINGDOM
GERMANY • FRANCE • ITALY • NORDIC/BALTIC • BENELUX • ISRAEL • INDIA • AUSTRALIA / NEW ZEALAND
SINGAPORE • JAPAN • CHINA • TAIWAN • HONG KONG • KOREA
samtec.com/flyover