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EP30LTE-LO

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EP30LTE-LO
EP30LTE-LO Technical Data Sheet
Master Bond
Polymer System
Two component, low viscosity epoxy for bonding, sealing, coating and encapsulating
Key Features
33 Room temperature curing
33 Superior dimensional stability
33 Low shrinkage upon cure
33 Passes fungus resistance MIL-STD-810G
33 Very low coefficient of thermal expansion
33 Withstands 1,000 hours 85°C/85% RH
Product Description
Master Bond EP30LTE-LO is a specialty epoxy system
featuring an exceptionally low coefficient of thermal
expansion (CTE) that meets NASA low outgassing
specifications. It can be used in bonding, coating, sealing
and encapsulation applications. This lower viscosity
system will cure at room temperature or more quickly at
elevated temperatures. To optimize the properties, it is
recommended to cure at room temperature for 12-24 hours,
followed by a post cure of a few hours at 150-200°F. The
CTE is in the range of 15-18 x 10-6 in/in/°C; markedly lower
than other systems. Additionally, it has very good thermal
conductivity and is highly electrically insulative. EP30LTELO is also noteworthy for its superior dimensional stability.
Its linear shrinkage upon curing is exceptionally low, less
than 0.01%.
EP30LTE-LO bonds well to a wide variety of substrates
including metals, glass, ceramics and many rubbers and
plastics. It is 100% reactive and does not contain any
solvents or diluents. This system offers excellent resistance
to many chemicals, such as water, fuels and oils, as well as
a number of acids and bases. It is serviceable over the wide
temperature range of 4K to +250°F, enabling it to be using
in cryogenic conditions. Part A of this system is off-white
in color and Part B is clear. Master Bond EP30LTE-LO is
especially used in aerospace, optical, electronic, specialty
OEM and other applications where an ultra low CTE along
with low outgassing is desirable.
Product Advantages
ƒƒ 100% reactive, contains no diluents or solvents
ƒƒ Very low shrinkage upon cure
ƒƒ Lower viscosity; good flow properties—ideal for small
to moderate sized castings
ƒƒ Exceptionally low thermal expansion coefficient:
about 15-18 x 10-6 in/in/°C
ƒƒ Good thermal conductivity while still electrically
insulative
ƒƒ Superior dimensional stability
ƒƒ Passes NASA low outgassing tests
Typical Properties
Tensile lap shear strength, aluminum to aluminum, 75°F
1,000-1,200 psi
Tensile strength, 75°F
6,000-7,000 psi
Tensile modulus, 75°F
550,000-600,000 psi
Compressive strength, 75°F
24,000-26,000 psi
Hardness, 75°F
85-95 Shore D
Hardness after 1,000 hours 85°C/85% RH
90 Shore D
Coefficient of thermal expansion, 75°F
15-18 x 10-6 in/in/°C
Thermal conductivity, 75°F
7-9 BTU•in/ft2•hr•°F [1.01-1.30 W/(m•K)]
Volume resistivity, 75°F
>1015 ohm-cm
Dielectric constant, 75°F, 60 Hz
4.5
Service temperature range
4K to +250°F [4K to +121°C]
Master Bond Inc. | Tel: +1 (201) 343-8983 | www.masterbond.com | techinfo@masterbond.com
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EP30LTE-LO Technical Data Sheet
Mixing and Curing
Mixing ratio, Parts A to B
10:1 by weight
Viscosity of Part A, 75°F
35,000-70,000 cps
Viscosity of Part B, 75°F
290-500 cps
Working life after mixing, 75°F; 100 gram batch
45-75 minutes
Cure schedule options
75°F
48-72 hours
200°F
2-3 hours
Shelf life at 75°F, in original, unopened containers
Preparation of Adhesive
Master Bond EP30LTE-LO is prepared for use by thoroughly
mixing Part A with Part B in a ten to one mix ratio by
weight.
By weight:
1 lb
Part A
+ 0.10 lb = 1.10 lbs
Part B
Total
Mixing should be done slowly so as to avoid entrapping air.
The working life of a mixed 100 gram batch is about 45-75
minutes at 75°F. It can be substantially lengthened by using
shallower mixing vessels and/or mixing smaller batches.
Preparation of Bonding Surfaces
All bonding surfaces should be carefully cleansed,
degreased and dried to obtain maximum bond strength.
Also, when bonding to metal surfaces, chemical etching
is recommended when the bonded joints are to exhibit
optimum environmental durability. If chemical etching is not
feasible, all surfaces should be roughened mechanically or
with sandpaper in order to maintain a coarse surface.
Application and Assembly
EP30LTE-LO can be conveniently applied with a spatula,
knife, trowel, brush, paint roller, etc., or it can be readily
cast. For bonding or sealing applications, sufficient material
should be mixed so that a final film thickness of 4-6 mils
is obtained. Porous surfaces may require somewhat more
material to fill the voids than non-porous ones. Thicker
bond lines do not as a rule increase the strength of a joint
but do not necessarily give inferior results as the EP30LTELO system does not contain any volatiles. The parts to be
joined together should be held in position with just enough
pressure to obtain and maintain intimate contact during
cure. Care should be taken not to squeeze out the material
minimum 3 months, maximum 6 months
when fixturing. When casting, EP30LTE-LO is easily used in
a variety of potting and encapsulation applications ranging
up to ¾-1 inch deep. It may be necessary to vacuum degas
to remove any bubbles that may have been formed when
mixing.
Cure
Master Bond EP30LTE-LO can be cured at ambient
temperatures or more quickly at elevated temperatures as
desired. At ambient temperatures, EP30LTE-LO cures within
48-72 hours. Faster cures can be realized at 2-3 hours at
200°F. To optimize the properties, it is recommended to
cure at room temperature for 12-24 hours, followed by a
post cure of a few hours at 150-200°F. When curing, the
thinner the section, the slower the rate of cure. Remove any
excess material promptly before it hardens with a spatula
then wipe with a rag or solvent such as toluene or acetone.
Packaging
Product is available in:
ƒƒ 1/2 Pint kits
ƒƒ Pint kits
ƒƒ Quart kits
ƒƒ Gallon kits
ƒƒ 5 Gallon kits
Handling and Storage
All epoxy resins should be used with good ventilation and
skin contact should be avoided. For safe handling details,
please consult the product SDS. Optimum storage is at
or below 75°F in closed containers. No special storage
conditions are necessary. Containers should, however,
be kept closed when not in use to avoid contamination.
Cleanup of spills and equipment is readily achieved with
aromatic or ketone solvents employing proper precautions
of ventilation and flammability.
Master Bond Inc. | Tel: +1 (201) 343-8983 | www.masterbond.com | techinfo@masterbond.com
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EP30LTE-LO Technical Data Sheet
Certifications
Not to Be Used for Specification Purposes
/
The values contained herein are considered typical
properties only and are not intended to be used
as specification limits. For assistance in preparing
specifications, please contact Master Bond technical
support for further details.
Notice
Master Bond believes the information on the data sheets
is reliable and accurate as is technical advice provided by
the company. Master Bond makes no warranties, expressed
or implied, regarding the accuracy of the information, and
assumes no liability regarding the handling and use of this
product.
F28C18
Master Bond Inc. | Tel: +1 (201) 343-8983 | www.masterbond.com | techinfo@masterbond.com
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