4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Upcoming Hardware Launches 2023 (Updated Apr 2023)
Discuss
in our
Forums
320
by W1zzard, on Apr 6th, 2023, in Other. Manufacturer: N/A
(320 Comments) »
Introduction
In this article, which our team will regularly update, we will maintain a growing list of information pertaining to upcoming hardware releases based
on leaks and official announcements as we spot them. There will obviously be a ton of rumors on unreleased hardware, and it is our goal to—
based on our years of industry experience—exclude the crazy ones. In addition to these upcoming hardware release news, we will regularly adjust
the structure of this article to better organize information. Each time an important change is made to this article, it will re-appear on our front page
with a "new" banner, and the additions will be documented in the forum comments thread. This article will not leak information we signed an NDA
for.
Feel free to share your opinions and tips in the forum comments thread and subscribe to the same thread for updates.
Last Update (Apr 6th):
Updated AMD Zen 4 APUs
Updated AMD Zen 4 Threadripper
Updated AMD Zen 5 / Ryzen 8000
Updated Intel Emerald Rapids
Updated Intel Sierra Forest
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
1/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Added Intel Clearwater Forest
Updated NVIDIA RTX 4050
Updated NVIDIA RTX 4060 Ti
Updated NVIDIA RTX 4070
Updated Intel Battlemage
Updated Intel Celestial
Added Kioxia 218-layer NAND
Added Hynix 300-layer NAND
Removed launched products: AMD A620 chipset
With the 2023 update we're adding source links to every line instead of the expandable "Sources" section. This will be added only for new and
updated entries, not for the old ones.
Older Updates
Processors
AMD Zen 4 APUs [updated]
Release Date: 2023
Successor to "Rembrandt"
Based on Zen 4 CPU cores
RDNA2 graphics on Dragon Range
55 W TDP for "Dragon Range"
Socket AM5, DDR5
"Phoenix" designed for thin and light, with 35 - 45 W
"Phoenix Point" is Zen 4 APU, with 3DV Cache and RDNA3 graphics using a monolithic die
Dragon SKUs: Ryzen 9 7980HX: 16c/32t, Ryzen 9 7900HX: 12c/24t, Ryzen 7 7800HX: 8c/16t, Ryzen 5 7600HX: 6c/12t, 4.8 to 5.x GHz Boost, 3.6
to 4.x GHz Base
Ryzen 9 7845HX Dragon Range, 12c/24t, 130 W, 5.25 GHz Boost, 4.7 GHz base, 25000 points in Cinebench #
Phoenix SKUs: Ryzen 9 7980HS: 8c/16t, 12 CU, Ryzen 9 7900HS: 8c/16t, 12 CU, Ryzen 7 7800HS: 8c/16t, 12 CU, Ryzen 5 7600HS: 6c/12t, 6 CU,
100-000000709-23_N
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
2/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Phoenix Ryzen 5 7540U is 6c/12t, Radeon 740M GPU, in Lenovo LNVNB161216 and ASUS ROG Flow X13 #
Phoenix Ryzen 5 7640U is 6c/12t, 6 MB L2, 16 MB L3, 3.5 GHz base, 4.9 GHz boot, RX 760M iGPU with 8 CU / 512 cores #
No support for PCIe 5.0 #
Ryzen 7040: 20 Gen 4 lanes from the CPU, plus 4 for the chipset #
Memory support: DDR5-5600, LPDDR5-7600, higher with overclocking #
iGPU: Radeon 780M, based on RDNA3, 12 CU, 768 cores, same dual-issue as Navi 31, up to 2.9 GHz #
Radeon 780M offers performance comparable to GeForce GTX 1650 #
DisplayPort 21, HDMI 2.1, AV1 encode #
4 nm TSMC EUV, 178 mm², 25 billion transistors #
Could have hybrid cores # #
Sources
AMD Zen 4 Threadripper / Threadripper 7000 [updated]
Release Date: H2 2023 or 2024 # #
Up to 96c/192t, also seen 64c/128t
Platform name: Storm Peak
TR5 platform #
Based on Zen 4 EPYC Genoa with higher frequencies
12-channel DDR5 memory, could also be 8-channel only, maybe 4 for HEDT #
128-160 PCIe 5.0 lanes, 64-lanes for HEDT #
Sources
AMD Zen 4 for Socket AM4
Release Date: 2023
Based on Zen 4 CPU cores paired with Zen 3's IO die
Support for DDR4 and PCIe Gen 4
Sources
AMD Zen 5 / Ryzen 8000 Series [updated]
Release Date: 2023 #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
3/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
5 nm or 3 nm TSMC process
DDR5 memory support
PCI-Express Gen 5
Codename "Granite Ridge"
Another codename "Strix Point" could feature big.LITTLE core design, similar to Alder Lake
Server platform codename "Turin"
Uses Socket SP5 for server, desktop uses Socket AM5
CCDs built on 4 nm TSMC
Shrink to 3 nm possible later in the lifetime of the product
Could also be built on 3 nm TSMC #
3DV Cache included with specific SKUs
New frontend with better parallelism
All processors come with integrated GPU
AI/ML enhancements, possibly Xilinx IP-based fixed function hardware, called AIE (AI inference accelerator)
Phoenix point is built on 5 nm TSMC, with RDNA3 graphics
Related: XDNA, which is the first AI-acceleration FPGA architecture by Xilinx
Sources
Intel Raptor Lake Refresh
Release Date: Q3 2023 # # #
Could be either on existing LGA1700 or new LGA1851 # #
Could see increases to core counts or segmentation #
Intel Alder Lake-N
Release Date: Unknown, possibly canceled
Gracemont cores only, no Golden Cove cores
Possibly for embedded designs or Chromebooks
No PCIe lanes from the CPU
Gen 12.2 iGPU GT1 with 32 EUs
Sources
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
4/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Intel Alder Lake-X
Release Date: 2022, possibly canceled
Xeon W5-3433: 16c/32t, 32 MB L2, 45 MB L3, 1.99 GHz
Codename: FishHawk Falls
Use W790 chipset
Could be a desktop version of Sapphire Rapids
Sources
Intel Grand Ridge
Release Date: 2023, could be canceled
Produced on 7 nm HLL+ process
Successor to Atom "Snow Ridge"
24 cores across 6 clusters with 4 cores each
4 MB L2 per cluster, plus L3 cache
Uses Gracemont CPU core
Dual-channel DDR5
PCI-Express Gen 4 with 16 lanes
Sources
Intel Meteor Lake
Release Date: 2H 2023 #
Probably mobile first (2023) and desktop later (2024)
Taped in as of May 2021
First test production: Nov 2021
"Powering on" in Q2 2022
Succeeds "Alder Lake"
New microarchitecture for P-Cores, "Redwood Cove", two generations ahead of "Golden Cove"
Serious IPC improvements for P and E-Cores
E-Cores are Crestmont
Hybrid processor—big.LITTLE architecture
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
5/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Multi-chip-module using Foveros packaging technology
Produced on various processes, at different fabs, even non-Intel
Four distinct tiles, interposer made on 22 nm Intel
Compute tile on Intel 4 (7 nm), 6P+16E, GNA 3.5 for AI
Graphics tile on TSMC N5
Comes with standalone media unit
SOC tile on TSMC 6 nm (contains memory controller, PCIe, etc)
IO tile on TSMC 6 nm
Integrated graphics use Xe-LPG architecture, "Adaptix power sharing", ray tracing support, but no XeSS
iGPU has 128 EUs at 2.0 GHz, uses Xe MTL architecture, twice as fast as Raptor Lake #
PCI-Express 5.0, 20 lanes, plus 12 lanes of Gen 4 #
Uses Z890 chipset, which provides another 24 lanes #
DDR5 + LPDDR5X
50% improvement in energy efficiency over Raptor Lake #
Uses new Socket LGA1851, retains cooler compatibility with LGA1700 #
VPU architecture based on Movidius's designs
Adds support for Wi-Fi 7 #
As of late 2020, Intel is adding support for Meteor Lake to the Linux Kernel
Sources
Intel Rialto Bridge
Release Date: Canceled as of Mar 2023 #
AI and HPC data center GPU
Up to 160 Xe cores
OAM 2.0
Uses tile based approach similar to Sapphire Rapids
Sources
Intel Falcon Shores
Release Date: Unknown
Successor to Ponte Vecchio #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
6/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
AI and HPC data center "XPU" #
Combines multiple tiles of various architectures #
Intel Arrow Lake
Release Date: 2024 or 2025 #
Succeeds "Meteor Lake"
Core counts up to 8P+16E
P-Cores get a performance uplift
Same E-Cores as Meteor Lake
Built on Intel 20A process
Graphics tile built on TSMC 3 nanometer #
Uses same Socket LGA1851 as Meteor Lake, retains cooler compatibility with LGA1700 #
Sources
Intel Lunar Lake
Release Date: 2025 or 2026 #
Succeeds "Arrow Lake"
Uses Intel 18A process paired with external foundry services
Sources
Intel Panther Lake
Release Date: 2026 or 2027 #
Succeeds "Lunar Lake" #
17th Gen Intel Core processors #
iGPU features Xe3 "Celestial" graphics architecture #
Intel Emerald Rapids [updated]
Release Date: Q4 2023 #
Successor to Sapphire Rapids #
Up to 64 Raptor Cove cores #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
7/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
For enterprise / data center #
Intel Trusted Domain Extensions (TDX) #
8-channel DDR5 at higher speeds #
PCI-Express 5.0 with 80 lanes #
Intel 7 process (10 nm) #
Same platform as 4th Gen Xeon (Sapphire Rapids) #
Intel Granite Rapids
Release Date: 2024, after Sierra Forest #
For enterprise / data center #
Successor to Sapphire Rapids #
Up to 120 Redwood Cove P-Cores (same cores as Meteor Lake) #
Another leaks suggests up to 128 cores #
8-channel DDR5 or more #
Up to 500 W TDP #
PCIe 5.0, possibly PCIe 6.0 #
Intel 3 node (4 nm) #
P-Cores only #
Platform name: Eagle Stream
Sources
Intel Sierra Forest [updated]
Release Date: H1 2024 #
Sampling as of March 2023 #
Successor to Sapphire Rapids Xeons #
For cloud, server and enterprise, high-density, efficiency compute #
Platform name: Birch Stream #
Uses Socket LGA-7529 # #
Up to 500 W TDP #
12-channel memory #
Intel 3 process #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
8/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
144 cores #
Only E-Cores, no P-Cores #
E-Cores are "Crestmont" architecture #
Intel Lunar Lake
Release Date: 2024 or later #
15 W ultra-low power CPUs #
Design focus on performance per watt #
Intel 18A process or TSMC #
Intel Clearwater Forest [added]
Release Date: 2025 #
Intel 18A process #
VIA CenTaur / Zhaoxin KaiXian
Release Date: H2 2020
Eight-core 64-bit CPU, 2.5 GHz
AVX-512 supported
16 nm FinFET TSMC
195 mm² die size
Use LGA socket
Codename: "CHA", pronounced "C-H-A"
Separate AI co-processor "NCORE"
All cores + NCORE connected using a ring bus
Integrated VIA S3 graphics with DirectX 11.1
16 MB shared L3 cache
Four-channel DDR4-3200 memory support
44 PCI-Express 3.0 lanes
Sold as Zhaoxin KaiXian KX-6780A in China (end of Jan 2020): 8 core, 8 threads, 2.7 GHz, 8 MB cache, dual-channel DDR4-3200
Southbridge integrated
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
9/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Multi-socket capable
Sources
Graphics / GPUs
NVIDIA GeForce RTX 4050 [added]
Release Date: Summer June 2023 #
Uses 5 nm AD107 graphics processor #
6 GB GDDR6, 128-bit #
NVIDIA GeForce RTX 4060
Release Date: Summer 2023
Uses 5 nm AD106 graphics processor
Could also use full 5 nm AD107 GPU #
3072 cores, 24 SM, 96 Tensor cores, 96 TMUs #
8 GB GDDR6 18 Gbps, 24 MB L2 cache #
115 W TGP, 1x 6-pin #
Performance similar to RTX 3070
3DMark TSE: 6551, Fire Strike 35676 #
PCI-Express x8 interface
8-pin power connector #
Unknown if PCIe Gen 4 or Gen 5
Sources
NVIDIA GeForce RTX 4060 Ti [updated]
Release Date: May 2023 # #
Uses AD106 graphics processor #
GPU variant: AD106-350-A1 #
5 nanometer TSMC #
Board codename is PG190 #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
10/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Uses 16-pin power connector #
160 W TGP #, another leak claims 220 W TDP #
4352 cores, 32 SM, 32 RT cores, 128 Tensor cores, 128 TMUs #
8 GB GDDR6 128-bit, 32 MB L2 cache #
18 Gbps memory speed #
16-pin power connector #
NVIDIA GeForce RTX 4070 [updated]
Release Date: April 13th # #
Reviews: April 12th Founders Edition, April 13th custom designs #
Uses AD104 graphics processor #
TSMC 5 nanometer (4N) #
294.5 mm², 35.8 billion transistors, 292 mm² by another leak #
5888 cores, 46 SM, 64 ROPs, 184 Tensor Cores, 46 RT Cores #
36 MB L2 Cache #
12 GB 192-bit GDDR6X memory at 21 Gbps #
250 W TDP #
Average gaming power draw of 186 W #
Could come in three variants: 10 GB, 12 GB and 16 GB #
Performance between RTX 3080 and RTX 3080 Ti / comparable to RX 6900 XT #
Support for DLSS 3 and AV1 #
16-pin connector is optional #
$600 for FE, custom up to $800 # #
Sources
NVIDIA GeForce RTX 4090 Ti / RTX Titan Ada
Release Date: 2023 or 2024
Uses AD102 graphics processor (same as RTX 4090)
18432 core, 568 Tensor cores, 142 RT cores
24 or 48 GB of GDDR6X, 384-bit
Huge quad-slot cooler on the FE #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
11/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Sources
NVIDIA Blackwell
Release Date: 2022 or 2023
Focused on compute (not gaming)
GPUs: GB100 and GB102
Sources
AMD Radeon RX 7600 XT
Release date: 2023
Uses Navi 33 GPU
2560 cores, 32 Compute Units
Sources
AMD Radeon RX 7700 XT
Release date: 2023
Uses Navi 32 GPU
3840 cores, 60 Compute Units
Sources
AMD RDNA 4
Release Date: 2024
Uses Navi 4x GPU family
Focus on gaming performance, without going overboard with AI #
Improvements to draw calls #
Sources
AMD CDNA 3
Release Date: 2023
GPU compute focused architecture
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
12/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Combined x86 CPU cores with GPU compute units
5 nm TSMC process for compute dies
6 nm IO die
Infinity Cache
Unified memory between CPU and GPU
Up to 5x higher AI performance per watt than CDNA2
HBM memory
Up to 8 silicon dies linked together
MI300 accelerator taped out by Jun 2022, first si con in Q3
APU design (combines GPU dies, core-logic and CPU CCDs into one package)
Sources
Intel Alchemist+ Architecture
Release Date: 2023, probably H2 # #
Refreshed "Alchemist" architecture #
Could be on an improved node, better than TSMC 6 nm #
Possibly higher core speeds with same core counts #
Intel Battlemage Architecture [updated]
Release Date: H2 2024 #
Successor to "Alchemist" #
New architecture #
Newer foundry node and higher performance #
Two variants: "Xe2 HPG" (high-performance) and "Xe2 LPG" (low-power) #
Xe2 LPG will be first used in Meteor Lake IGP #
Xe core count doubled to 64, or 1024 EUs #
Clocks up to 3 GHz #
IPC improvements and new math formats #
256-bit memory, high mem clock #
GPU codename: BMG-G10 #
Fabricated on TSMC 4 nm process #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
13/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Sources
Intel Celestial Architecture [updated]
Release Date: H2 2026 #
Discrete GPU architecture
Successor to "Battlemage" architecture
Also called "Xe3 HPG"
Fabricated on TSMC N3X (3 nm) #
Targets "Ultra Enthusiast" segment
Sources
Intel Druid Architecture
Release Date: Not before 2025
Discrete GPU architecture
Successor to "Celestial" architecture
Also called "Xe Next HPG"
Sources
Zhaoxin Discrete GPU
Release Date: unknown
Discrete GPU
Produced on 28 nanometer production process
70 W TDP
Based on VIA S3 graphics IP
Sources
Chipsets
Memory
DDR6 System Memory
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
14/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Release Date: Unknown
Four channels per module (2x that of DDR5, 4x that of DDR4)
64 banks
Speeds starting at 12800 MT/s, up to 17,000 MT/s with OC
Sources
GDDR6+ Graphics Memory
Release Date: Unknown
Production: 2021
Up to 24,000 MT/s
Production process: 1z nm
Sources
GDDR6W Graphics Memory
Release Date: Unknown
Builds on Samsung's Fan-Out Wafer-Level Packaging (FOWLP) technology
Mounts the silicon memory dies on a wafer instead of a PCB
Up to 22 Gbps per pin
With a 512 bit interface that would be 1.4 TB/s
Up to 24,000 MT/s
Could be renamed GDDR6+
Sources
GDDR7 Graphics Memory
Release Date: H2 2024 #
Speeds: 36,000 MT/s #
Over time up to 50,000 MT/s #
Uses PAM3 signalling # #
"Real-time error protection feature", maybe some kind of ECC? #
Improved power efficiency #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
15/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Will be used by NVIDIA GeForce 50 and AMD RDNA4
Read clock can be configured to "always running", "disabled", "start with RCK start", "start with read" #
Able to issue commands in parallel #
Sources
HBM3 Graphics Memory
Specification released: Jan 2022
Products: some time in 2022
Double the memory bandwidth per stack
Twice the number of channels: 16 vs 8 on HBM2
8 Gb to 32 Gb capacity per layer
On-die ECC
Expected to be produced using 7 nm technologies
NVIDIA working on GPUs with HBM3 support
Hynix in Oct 2021: 6.4 Gbps per pin, stack bandwidth 819 GB/s, 24 GB and 16 GB stacks
Hynix in March 2022: up to 12-Hi-stack, 24 GB, 16 channels, 6.4 Gbps
Hynix in June 2022: working with NVIDIA to supply HBM3 for H100 GPU, shipping in Q3 2022
Rambus announced in August 2021 that their memory controller is ready, up to 8.4 Gbps
1024-bit bus width
Sources
HBMNext Memory
Release Date: late 2022 or 2023
JEDEC work in progress
Micron involved
Sources
Silicon Fabrication Tech
TSMC 4 nanometer+
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
16/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
First tape outs: H2 2022
Codename "N4P"
11% performance boost over N5, 6% over N4
22% better power vs N5
6% higher density than N5
Sources
TSMC 3 nanometer
April 2020: on track
Risk production: H2 2021
Volume production: H2 2022 (confirmed as of Apr 2022)
FinFET technology
"FinFlex", offers standard cells with a 3-2 fin configuration for performance, 2-1 for power, 2-2 for balanced
Uses TSMC's third implementation of EUV (Extreme Ultra Violet)
Depending on FinFlex cell: 11%–33% speed improvement, 12%-30% power reduction, 0.64x to 0.85x area improvement
30,000 wafers per month at the start, 105,000 by 2023
12-inch wafer size
Will also be produced in upcoming Arizona fab in 2026
Intel has announced they have placed two orders for processors based on this process
Seven customers as of Aug 2022 (Apple, AMD, Broadcom, Intel, MediaTek, NVIDIA and Qualcomm)
TSMC N3E making good progress, now in 2023
Sources
TSMC 3 nanometer+
Release date: 2023
First client will be Apple
Sources
TSMC 2 nanometer
Release Date: 2023 (risk production)
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
17/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Volume production: 2025
June 2020: TSMC is accelerating R&D
Sep 2020: fab construction has begun
Will use Gate-All-Around (GAA) technology
Multi-bridge channel field effect transistor (MBCFET) architecture
10-15% speed improvement over N3 at same power, or 25-30% power at same speed
Nanosheet transistors
Sources
TSMC 1 nanometer
Release Date: around 2027
Uses Semi-metal bismuth for contact electrodes
Chip plan planning has started as of Nov 2022
Might be a 1.4 nm node that gets rounded to "1 nm"
Sources
Samsung 6 nanometer
Release Date: unknown
First product taped out as of Q2 2019
Uses EUV (Extreme Ultra Violet)
Special variant for customers
Sources
Samsung 5 nanometer
Release Date: 2021
Ready for customer sample production as of Q2 2019
In production as of Q4 2020
Yields are challenging as of Q2 2020
Yields below 50% as of Q3 2021
Plans to build fab in Austin TX, for $18B
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
18/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Uses EUV (Extreme Ultra Violet)
Up to 25% the density of 7 nm
20% lower power consumption
10% higher performance
Sources
Samsung 4 nanometer
Release Date: H1 2023 #
Used by Google Tensor G3 SoC in Pixel 7 #
Samsung 3 nanometer
Mass Production: H12022
"Initial production" started as of Jun 30th 2022
Uses Gate All Around FET transistors (GAA), Multi-Bridge-Channel FET (MBCFET)
45% less power while delivering 23% more performance
35% less silicon space taken per transistor (vs. 7 nm)
16% less silicon space taken per transistor (vs. 5 nm)
2nd generation 3 nm expected in 2025, reduces power by 50%, improves perf by 30%, reduces area by 35%
Sources
Samsung 2 nanometer
In early development as of Oct 2021, mass production in 2025
Uses Multi-Bridge-Channel FET (MBCFETTM)
Sources
Samsung 1.4 nanometer
In planning as of Oct 2022
Mass Production: 2027
GAA (gate-all-around)
2.5D/3D integration
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
19/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Micro-bumps
Sources
Intel 4 (7 nanometer)
Release Date: 2023
Uses EUV (Extreme Ultra Violet)
4x reduction in design rules
Planned to be used on multiple products: CPU, GPU, AI, FPGA, 5G networking
Used for Meteor Lake
Twice the transistor count for the same area
20% perf/watt over 10 nm SuperFin ("Intel 7")
21% gain in frequency at 0.65 V, 10% at 0.84 V
40% lower power at 2.1 GHz
Jan 2021: Intel reports "issues fixed"
Jul 2021: Intel renames this process to "Intel 4"
Sources
Intel 3
Release Date: 2023
Uses EUV (Extreme Ultra Violet)
Possibly still a 7 nanometer node, with improvements
18% perf/watt vs Intel 4
Denser HP library
more EUV
Improve drive-current and via resistance
Sources
Intel 20A
Release Date: H1 2024 #
20 Angstrom = 2 nanometer
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
20/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
New transistors called RibbonFET
PowerVia to connect silicon dies
15% perf/watt improvement over Intel 3 #
Sources
Intel 18A
Release Date: H2 2024 #
18 Angstrom = 1.8 nanometer
Improvements to RibbonFET for higher transistor density #
10% perf/watt improvement over Intel 20A #
Sources
Other
PCI-Express 5.0 SSDs
Release Date: Phison H2-2022, Kioxia Q4-2021
Mainstream PCIe 5.0 SSDs only in 2024
Uses new PCIe 5.0 interface to double transfer rates per lane, up to 16 GB/s
Kioxia: U.2 and M.2 support, up to 14 GB/s
Phison: PS5026-E26 controller, PCIe dual port, SR-IOV, ONFI 5.x, NVMe 2.0, ARM R5 CPU TSMC 12 nm, 12 GB/s read, 11 GB/s write, 1.5M IOPS
read, 2M IOPS write, support for TLC and QLC
Phison demo at Computex 2022: 12 GB/s read, 10 GB/s write
Silicon Motion controller is called MonTitan or SM8366, up to 14 GB/s, enterprise only
Silicon Motion's SM2504XT is produced on 7 nm, to reduce heat output, 4 channels, up to 3600 MT/s, NVMe 2.0, Sep 2023 #
Corsair MP700: up to 10 GB/s read, 9.5 GB/s write
MSI Spatium M570: 10 GB/s, bronze-colored-aluminium heatsink, up to 4 TB capacity, Phison E26
Probably targeted more at enterprise (Intel Sapphire Rapids) than consumer (Intel Alder Lake)
Phison working closely with AMD to release their controller when Zen 4 hits the market
SSD width increases to 25 mm, might not fit some older motherboards
Samsung 990 Pro will not use PCIe 5, it's a PCIe 4 design
For best performance, 232-layer NAND flash from Micron is required
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
21/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Sources
Toshiba/WD 5-Bit-per-Cell NAND Flash (PLC)
Release Date: Delayed to 2025
Stores an additional bit of information per cell (compared to QLC)
32 states per cell
Will enable even cheaper SSDs, probably at a performance cost
Sources
Toshiba XL-Flash
Developed by Toshiba
Uses existing SLC flash technology to improve latencies
1/10th the read latency of TLC
Good for random IOPS and better QoS at shallow queue depth
Can combine SLC and TLC/QLC for tiered, cost-optimized storage
Intel Optane memory competitor
128 gigabit (Gb) die (in a 2-die, 4-die, 8-die package)
4 KB page size for more efficient operating system reads and writes
16-plane architecture for more efficient parallelism
Fast page read and program times
Sources
Kioxia / WD 218-layer 3D NAND Flash [added]
Release Date: 2023 #
Sampling as of Mar 2023 #
Uses CMOS directly Bonded to Array technology #
1 Tb TLC and QLC #
Density increased by 50% #
3.2 GB/s #
20% improvement in write performance and read latency #
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
22/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Hynix 238-layer 3D NAND Flash
Release Date: 2023
2.4 Gbps
21% lower energy
512 Gb samples shipping as of Aug 22
1 Tb in 2023
Sources
Hynix 300-layer 3D NAND Flash [added]
Release Date: 2024 or 2025 #
Transfer rate increased from 164 MB/s to 194 MB/s #
1 Tb capacity with TLC #
20 Gb/mm² #
16 KB page size, 4 planes #
2400 MT/s #
Samsung 236-layer 3D NAND Flash
Release Date: 2022
8th generation V-NAND
TLC, 1 Tbit capacity
Probably 236 layers
Will be used on PCIe 4.0 and 5.0 SSDs
2.4 Gbps speed (20% higher than 7th gen)
Sources
Intel CXL Interconnect
New interconnect for high-bandwidth devices like GPUs
Targeted at enterprise and servers
Competitor to NVLink, Infinity Fabric, and PCI-Express
Uses PCIe physical layer
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
23/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Link layer designed for low latency
32 Gbps per lane, per direction (like PCIe Gen 5.0)
Samsung has announced open-source Scalable Memory Development Kit (SMDK) in Oct 2021
Sources
PCI-Express 6.0
Release Date: 2022
Spec version 1.0 published as of Jan 2022
Spec version 0.9 published as of Oct 2021
Spec version 0.5 published as of Feb 2020
Spec version 0.7 published as of Nov 2020
64 GT/s raw bit rate, up to 256 GB/s with x16
Rambus has controller IP ready as of Jan 2022
Rambus has PHY and controller ready as of Oct 2022
Includes low-latency Forward Error Correction (FEC) with additional mechanisms to improve bandwidth efficiency
Maintains backwards compatibility with all previous generations of PCIe technology
New physical layer with PAM4 (pulse amplitude modulation) signaling replacing NRZ (non-return to zero)
Sources
PCI-Express 7.0
Release Date: 2025
Spec is work in process as of 2022
128 GT/s raw bit rate, up to 512 GB/s with x16
PAM4 signaling
Improved power efficiency
Backwards compatible with all previous versions of PCIe
Sources
Thunderbolt 5
Release Date: unknown
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
24/25
4/10/23, 4:06 PM
Upcoming Hardware Launches 2023 (Updated Apr 2023) | TechPowerUp
Four lanes with 40 Gbps each
Speeds up to 80 Gbps bidirectional, 120 Gbps when using 3/1 lane config
Works with existing cables up to 1 m
Built on the USB4 v2 specification
Uses PAM-3 technology for higher transfer rates
Test chip manufactured on 6 nm at TSMC
Sources
Discuss
(320 Comments)
Copyright © 2004-2023 www.techpowerup.com. All rights reserved.
All trademarks used are properties of their respective owners.
https://www.techpowerup.com/review/future-hardware-releases/#zen4apu
25/25