www.osram-os.com
Produktdatenblatt | Version 1.1
LA T676
 LA T676
TOPLED ®
TOPLED, SMT LED with integrated reflector. With
our great experience in SMT LED we are able to offer a high quality product for all kind of applications.
Applications
—Cluster, Button Backlighting
—Interior Illumination (e.g. Ambient Map)
—Electronic Equipment
—White Goods
Features
—Package: white PLCC-2 package, colorless clear resin
—Chip technology: InGaAlP
—Typ. Radiation: 120° (Lambertian emitter)
—Color: λdom = 615 nm (● amber)
—Corrosion Robustness Class: 3B
—Qualifications: AEC-Q102 Qualified
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)


1 Version 1.5 | 2022-02-02
LA T676
 Ordering Information
Type
Luminous Intensity 1)
IF = 20 mA
Iv
LA T676-Q2T1-24
90 ... 355 mcd


2 Version 1.5 | 2022-02-02
Ordering Code
Q65110A9273
LA T676
 Maximum Ratings
Parameter
Symbol
Operating Temperature
Top
min.
max.
-40 °C
100 °C
Storage Temperature
Tstg
min.
max.
-40 °C
100 °C
Junction Temperature
Tj
max.
125 °C
Forward current
TS = 25 °C
IF
max.
30 mA
Forward current pulsed
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IF pulse
max.
250 mA
Surge current
Single pulses; t ≤ 10µs; TS = 25 °C
IFS
max.
1000 mA
Reverse voltage 2)
TS = 25 °C
VR
max.
12 V
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
VESD


3 Version 1.5 | 2022-02-02
Values
2 kV
LA T676
 Characteristics
IF = 20 mA; TS = 25 °C
Parameter
Symbol
Peak Wavelength
λpeak
typ.
625 nm
Dominant Wavelength 3)
IF = 20 mA
λdom
min.
typ.
max.
612 nm
615 nm
624 nm
Spectral Bandwidth at 50% Irel,max
∆λ
typ.
16 nm
Viewing angle at 50% IV
2φ
typ.
120 °
Forward Voltage 4)
IF = 20 mA
VF
min.
typ.
max.
1.83 V
2.00 V
2.33 V
Reverse current 2)
VR = 12 V
IR
typ.
max.
0.01 µA
10 µA
Temperature Coefficient of Peak Wavelength
-10°C ≤ T ≤ 100°C
TCλpeak
typ.
Real thermal resistance junction/ambient 5)6)
RthJA real
max.
500 K / W
Real thermal resistance junction/solderpoint 5)
RthJS real
typ.
max.
200 K / W
280 K / W


4 Version 1.5 | 2022-02-02
Values
0.13 nm / K
LA T676
 Brightness Groups
Group
Luminous Intensity 1)
IF = 20 mA
min.
Iv
Luminous Intensity. 1)
IF = 20 mA
max.
Iv
Luminous Flux 7)
IF = 20 mA
typ.
ΦV
Q2
90 mcd
112 mcd
300 mlm
R1
112 mcd
140 mcd
380 mlm
R2
140 mcd
180 mcd
480 mlm
S1
180 mcd
224 mcd
610 mlm
S2
224 mcd
280 mcd
760 mlm
T1
280 mcd
355 mcd
950 mlm
Wavelength Groups
Group
Dominant Wavelength 3)
IF = 20 mA
min.
λdom
Dominant Wavelength 3)
IF = 20 mA
max.
λdom
2
612 nm
616 nm
3
616 nm
620 nm
4
620 nm
624 nm


5 Version 1.5 | 2022-02-02
LA T676
 Group Name on Label
Example: Q2-2
Brightness
Wavelength
Q2
2


6 Version 1.5 | 2022-02-02
LA T676
 Relative Spectral Emission
7)
Irel = f (λ); IF = 20 mA; TS = 25 °C
I
LA T676
1.0
: Vλ
: amber
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
λ/
Radiation Characteristics
7)
Irel = f (ϕ); TS = 25 °C
LA T676
ϕ/

-40°
-50°
-20°
-10°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
1.0
-30°
0.8
0.6
-60°
-70°
-80°
-90°

-100°
7 Version 1.5 | 2022-02-02
0.4
0.2
0.0
I
LA T676
 Forward current
Relative Luminous Intensity
7)
IF = f(VF); TS = 25 °C
IF / mA
7), 8)
Iv/Iv(20 mA) = f(IF); TS = 25 °C
LA T676
30
IV
LA T676
1.6
IV(20mA)
1.4
25
1.2
20
1.0
0.8
15
0.6
10
0.4
0.2
5
VF / V


8 Version 1.5 | 2022-02-02
30
2.1
25
2.0
20
1.9
15
1.8
10
1.7
5
0.0
1.6
1
1
1.5
IF / mA
LA T676
 Forward Voltage
Relative Luminous Intensity
7)
ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA
∆VF / V
Iv/Iv(25 °C) = f(Tj); IF = 20 mA
LA T676
0.3
7)
Iv
LA T676
1.6
Iv(25°C)
1.4
0.2
1.2
0.1
1.0
0.0
0.8
0.6
-0.1
0.4
-0.2
0.2
-0.3
-40 -20
0
20
40
60
80 100 120
Tj / °C
Dominant Wavelength
7)
λdom = f(Tj); IF = 20 mA
∆λ dom / nm
LA T676
10

5
0
-5
-10
-40 -20
0
20
40
60
80 100 120

Tj / °C
9 Version 1.5 | 2022-02-02
0.0
-40 -20
0
20
40
60
80 100 120
Tj / °C
LA T676
 Max. Permissible Forward Current
IF = f(T)
IF / mA
30
25
20
: Ts
15
10
5
0
0
20
40
60
80
100
T / °C
Permissible Pulse Handling Capability
IF = f(tp); D: Duty cycle
LA T676
TS = 0°C ... 100°C
IF / A 0.30

0.25
: D = 1.0
: D = 0.5
: D = 0.2
: D = 0.1
: D = 0.05
: D = 0.02
: D = 0.01
: D = 0.005
0.20
0.15
0.10
0.05
10-6
10-5
10-4
10-3 0.01
0.1
1
10

/
10 Version 1.5 | 2022-02-02
LA T676
 Dimensional Drawing
9)
2.1 (0.083)
3.0 (0.118)
2.6 (0.102)
2.3 (0.091)
1.7 (0.067)
0.1 (0.004) (typ.)
A
3.7 (0.146)
3.3 (0.130) 4˚±1
3.4 (0.134)
3.0 (0.118)
(2.4) (0.095)
2.1 (0.083)
0.9 (0.035)
0.7 (0.028)
Cathode marking
0.5 (0.020)
1.1 (0.043)
C
0.18 (0.007)
0.12 (0.005)
0.6 (0.024)
0.4 (0.016)
GPLY6724
Further Information:
Approximate Weight:
34.0 mg
Corrosion test:
Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)


11 Version 1.5 | 2022-02-02
LA T676
 Recommended Solder Pad
9)
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
1.5 (0.059)
4.5 (0.177)
2.6 (0.102)
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Lötstopplack
Solder resist
Cu-Fläche > 16 mm 2
Cu-area > 16 mm 2
OHLPY970
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.


12 Version 1.5 | 2022-02-02
LA T676
 Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature

60
2
3
100
120
2
3
Unit
K/s
s
K/s
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
Time
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
13 Version 1.5 | 2022-02-02
°C
480
s
K/s
s
LA T676
 Taping
9)


14 Version 1.5 | 2022-02-02
LA T676
 Tape and Reel
10)
Reel Dimensions
A
W
Nmin
W1
W2 max
Pieces per PU
180 mm
8 + 0.3 / - 0.1 mm
60 mm
8.4 + 2 mm
14.4 mm
2000
330 mm
8 + 0.3 / - 0.1 mm
60 mm
8.4 + 2 mm
14.4 mm
8000


15 Version 1.5 | 2022-02-02
LA T676
 Barcode-Product-Label (BPL)
Dry Packing Process and Materials
9)
Moisture-sensitive label or print
L
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sela
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k,
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H ou
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tim
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lo
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
OHA00539

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
16 Version 1.5 | 2022-02-02
LA T676
 Type Designation System
Wavelength
(λdom typ.)
A:
617 nm
S:
633 nm
T:
528 nm
Y:
587 nm
O:
606 nm
G:
570 nm
P:
560 nm
R:
625 nm
B:
470 nm
H:
645 nm
V:
505 nm
L:
Emission Color
amber
super red
true green
yellow
orange
green
pure green
red
blue
hyper-red
verde green
Color coordinates according
CIE 1931/Emission color:
W:
white
UW: ultra white
C B:
color on demand blue
CG:
color on demand green
CL:
color on demand lagune
Package Type
T:
TOPLED
Light
emitting
diode
L
A
T
6
´
Lead / Package Properties
6:
folded leads
7:
reverse gullwing leads
T:
folded leads, improved corrosion stability
Au-LF), w/o TiO2 jetting
V:
folded leads and UX:3 w/ improved
corrosion stability (Au-LF), TiO2 jetting
Encapsulant Type / Lens Properties
7:
Colorless clear or white volume conversion
(resin encapsulation)
S:
Silicone (with or without diffuser)


Chip Technology:
1: TSN
3: standard InGaN
4: AlGaAs
5: HOP 2000
6: Standard InGalP
9: TSN low current
B: HOP 2000
C: ATON
D: Small ThinGaN/ Thinfilm (e.g. 6mil)
F: Thinfilm InGaAlP
G: ThinGaN(Thinfilm InGaN)
K: InGaAlP low current
S: standard InGaN low current
0: TSN
17 Version 1.5 | 2022-02-02
7
6
LA T676
 Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes


18 Version 1.5 | 2022-02-02
LA T676
 Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordinate the customer-specific request between OSRAM OS and buyer and/or customer.


19 Version 1.5 | 2022-02-02
LA T676
 Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical characteristics or damage the LED.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.


20 Version 1.5 | 2022-02-02
LA T676
 Revision History
Version
Date
Change
1.4
2021-02-12
Features
Schematic Transportation Box
Dimensions of Transportation Box
Notes
Disclaimer
Glossary
1.5
2022-02-02
Maximum Ratings
Derating (Diagrams)
Electro - Optical Characteristics (Diagrams)
Characteristics


21 Version 1.5 | 2022-02-02
LA T676
 

Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
22 Version 1.5 | 2022-02-02