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Hardware Difference Between BSC6910
and BSC6900
Hardware
BSC6900
Difference
Issue
1.00
Date
2013-06-06
2013-6-9
Between
BSC6910
HUAWEI Confidential
and
Page i, Total 15
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Page ii, Total 15
About This Document
Author
Prepared by
Shailendra Nalavade
Reviewed by
Date
2013-06-06
Date
Reviewed by
Approved by
2013-6-9
Date
HUAWEI Confidential
Page 3, Total 15
Contents
Author
3
1. Power Connections Between PDF and BSC
5
2. DIP Switches
6
3.Subrack Board Configuration
8
错误
4.Board Level Difference
未定义书签
5.Conclusion
13
错误
References
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未定义书签
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3
1. Power Connection between PDF and BSC
BSC6910:
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In each cabinet, A1 and B1 form a pair of active and standby power supply ports, as do A3 and B3. As
shown in the preceding figure, to create a hot backup, connect ports A1 and A3 to one power supply
group in the PDF, and ports B1 and B3 to a different power supply group.
PEM 00 and PEM 01 work in active and standby mode. As shown in the preceding figure, to create a hot
backup, connect OUTPUT A and OUTPUT B to a different power supply group.
Circuit breakers used on the PDF must be larger than 60 A.
BSC6900:
A1 and B1 in each cabinet serve as a pair of active and standby power supply ports in hot backup mode, and
A3 and B3 in each cabinet serve as a pair of active and standby power supply ports in hot backup mode.
Therefore, as shown in the preceding figure, connect ports A1 and A3 to one power supply group in the PDF,
and ports A3 and B3 to the other power supply group in the PDF.
2. DIP Switches.
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In BSC6910 the DIP switches are Vertical while in BSC6900 they are Horizontal.
BSC6910:
BSC6900:
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Note: The definition of the DIP switches remains the same.
3. Subrack Board Configuration
The Major difference is that the OMU board position is shifted from Rear to front in BSC6910.
BSC6910:
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Configuration of the MPS
BSC6900:
Configuration of the MPS in A over IP mode
4. Board Level Difference.
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i)
The SPU/XPU and DPU processing boards of BSC6900 is replaced by single processing
board EGPU.
This means we have only EGPU boards in BSC6910 for both control and user plane which works in
N+1 configuration.
Also the EGPU boards process both CS and PS user data.
For EGPU board, it automatically adjusts the NodeB or cells on the board. There is no requirement
for specifying Subsystem number while configuring NodeB,
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ii)
The electrical E1/T1 boards are no longer present in BSC6910.
This means EIU,AEU,PEU boards are not present in BSC6910.
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iii)
Only higher versions of earlier interface boards are used in BSC6910 (c and above)
a and b versions interface boards are not used.
So we have only AOUc,UOIc,POUc,FG2c,FG2d,GOUc,GOUd.
XOUa is a new board.
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iv)
Introduction for Evolved OMU and Evolved SAU board.
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v)
Introduction of 10GE interface board - EXOUa
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5. Conclusion:
This document helps to introduce about some basic hardware differences between BSC6900 and BSC6910.
Besides the point mentioned in above documents there are many other differences like Resource Sharing,
Management sharing, heat dissipation and others. There are also changes in the configuration part of
Interfaces. Engineers are advised to study the relevant documents for more details.
References:
1.
Hedex
2.
BSC6910 Training PPT.
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