Name
Stereolithography
Direct Light Processing
Solid Ground Curing
Acronym
SLA
SGC
PolyJet
Beam Interference Solidification
BIS
Fused Deposition Modelling
FDM
Laser Metal Wire Deposition
Laminated Object Manufacturing
Binder Jetting
Selective Laser Sintering/Melting
Electron Beam Direct Manufacturing
Direct Metal Deposition
Jet Fusion
BPM
LMWD
UV flash
Liquid
based
Extrusion
process
LOM
DMD
JF
Photoresist
Photoresist
Pros
Cons
Trans. mat., precise (point to point), fast,
One mat., only photoresist, exp. mat.,
rapid manufacturing
post processing, support, prop. change
(c. SLA) price and simp. of mach., faster
(c. SLA) less precise, smaller work
fabrication time (one layer at a time)
surface, support
(c. SLA) price and simp. of mach., no
(c. SLA) poor acc., complex system, high
Photoresist
support (wax acts as support)
operating costs
UV flash,
Photoresist
Price and simp. of mach., precise,
No scale effect of parts
nozzles
Min. 2 mat.
combine color at mat., const./support
Laser
Photoresist
Heated
-
-
ABS for c.,
Simple operation, metallic part possible,
Slow, bad quality for big parts, less acc.
nozzles
wax for s.
cheap
(c. SLA, PolyJet), support, warping
Not heated
Diff. molten
(c. FDM) cheap material, faster
(c. FDM) low mech. properties, support
nozzles
wax for c./s.
fabrication time for same acc.
Molten
Metal parts, high strength, precise, fast,
Exp. mach. and mat., best for small parts,
metal wire
diff. metal wire at the same time
complex process, rough surface
Simple process, low price, metal parts
Not precise (c. SLA, SLS), no complex
Laser
Nozzle
SLS/SLM
Material
UV flash
Laser cutter
BJ
EBDM
Source
Laser beam
DLP
Photopolymer Jetting
Ballistic Particle Manufacturing
Type
Foil and glue
possible, readily available mat.
geometries possible
Powder and
Fast (5-10 times faster than SLA), cheap
Poor acc. (c. SLA, PolyJet), poor mech.
binder
machine, mix color and mat., no support
properties without post process., hole
Easy recycling of powder, many mat. (c.
Sometimes post processing, exp. mach.,
Laser beam
Powder
SLA), robust, high acc., norm. no support
cool down time -> longer fabrication time
Powder
Electron
Metal
(c. SLS, SLM) denser parts, higher mech.
(c. SLS, SLM) exp. mach., complex mach.,
process
beam
powder
properties, higher building speed
only metals, less acc., cooling time
Laser beam,
Metal
(c. SLS, SLM) no support, mix mat., low
(c. SLS, SLM) exp. mach., thermal stress,
nozzle
powder
heat applied during whole process, DoF
less resolution
IR flash,
Polymer
Fast (5-10 times faster than SLA), better
Few mat., very long cooling time.
nozzle agent
powder
mach. prop. (c. BJ), recycling, acc., supp.