This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 1 An Analytical Model for Capacitive Pressure Transducers With Circular Geometry Ira O. Wygant , Member, IEEE, Mario Kupnik, Senior Member, IEEE, and Butrus T. Khuri-Yakub, Fellow, IEEE Abstract— This paper derives an analytical model of a capacitive pressure transducer based on equations for deflection and fundamental mode shape of a clamped circular plate. The derived model enables efficient large-signal electromechanical simulations and calculation of an equivalent circuit. The model shows good agreement with finite element analysis and experiments. The spring-mass-damper system used in the model is calculated for uniform, anisotropic, and layered plate materials. A cubic spring constant captures large plate deflections. Use of the clamped-plate shape function leads to a simple expression for capacitance as a function of deflection and to closedform equations for pull-in voltage. Comparison of the model with finite element analysis for several air-coupled capacitive micromachined ultrasonic transducer designs shows better than 10% agreement for deflection, resonant frequency, and pullin voltage. The model also compares well with characterized devices. The analytical model could be further improved with additional damping sources and methods to model a compliant plate boundary. [2017-0161] Fig. 1. The capacitive pressure transducer modeled in this paper (threequarter section view). Force on the plate causes it to deflect, which changes the capacitance between the plate and substrate. Analytical equations that are a function of the dimensions and material properties of the plate, cavity, and insulator accurately describe the transducer’s behavior. Index Terms— Capacitive micromachined ultrasonic transducer (CMUT), capacitive pressure sensor, equivalent circuits, microelectromechanical devices, sensor device modeling. I. I NTRODUCTION L EVERAGING expressions for the deflection of a clamped circular plate, this paper derives an analytical model of a capacitive pressure transducer. The derivation results in simple closed-form modeling equations that are a function of transducer geometry and material properties. These equations show good agreement with simulated and measured data. Furthermore, they yield convenient design expressions, straightforward calculations of an equivalent electromechanical circuit, and efficient frequency- and time-domain simulations. While the model could be extended to other plate shapes, this paper considers capacitive transducers with circular uniform-thickness plates. This type of transducer, shown in Fig. 1 and Fig. 2, is widely used in applications such as pressure and ultrasonic sensing. Manuscript received July 20, 2017; revised March 30, 2018; accepted March 31, 2018. Subject Editor C. Mastrangelo. (Corresponding author: Ira O. Wygant.) I. O. Wygant was with Texas Instruments Inc., Santa Clara, CA 95051 USA. He is now with Swift Sensing Inc., Palo Alto, CA 94301 USA (e-mail: ira.wygant@swiftsensing.com). M. Kupnik is with the Department of Electrical Engineering and Information Technology, Technische Universität Darmstadt, 64289 Darmstadt, Germany. B. T. Khuri-Yakub is with the Department of Electrical Engineering, Stanford University, Stanford, CA 94305 USA. Color versions of one or more of the figures in this paper are available online at http://ieeexplore.ieee.org. Digital Object Identifier 10.1109/JMEMS.2018.2823200 Fig. 2. Axisymmetric cross section of the transducer in polar coordinates r and θ . Key dimensions for the transducer model are the plate radius a, post width w post , plate thickness h, cavity height h cav , and insulator thickness h ins . Force applied to the plate causes it to deflect. Peak plate deflection, w pk , occurs at the plate’s center (r = 0). Deflection averaged over the plate area, wavg , always equals one-third peak deflection. When designed as a pressure sensor, the transducer can measure static or slowly varying pressure and has applications in automobiles, home appliances, industrial equipment, and consumer products. Many categories of pressure sensors exist. A pressure sensor with a vacuum-sealed cavity, such as a barometric pressure sensor, measures absolute pressure; a sensor with a second pressure port for the plate’s back side measures differential pressure. MEMS (microelectromechanical systems) pressure sensors are small and often tightly integrated with electronics. Whereas pressure sensors manufactured with conventional methods, like those constructed 1057-7157 © 2018 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information. This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. 2 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS as a function of plate displacement; (4) implement the model as a set of differential equations or as an equivalent circuit. The following sections describe these steps. FEA and experiment verify the model for typical air-coupled CMUT designs with three different radii. These designs range from a CMUT with moderate linear deflection to a CMUT with significantly nonlinear deflection and large deflection relative to the gap. II. P LATE S PRING AND M ASS C ONSTANTS Fig. 3. Schematic representation of the transducer model. A spring and mass model the plate’s compliance and modal mass. Damping is due to radiated sound and other sources of energy loss. The transducer capacitance, C, changes with the plate’s average deflection, wavg . The model has two ports. The electrical port relates voltage, V , and current, I . The mechanical port relates force, F, and plate velocity, U . from a metal foil, are rugged and suitable for harsh environments. The model developed in this paper applies to pressure sensors from all categories. When designed as a CMUT (capacitive micromachined ultrasonic transducer), the same transducer structure radiates and senses high-frequency sound pressure. CMUT applications are similar to those of traditional bulk piezoelectric ultrasound transducers. These applications include medical imaging, level and fluid flow sensing, and proximity sensing. Most of the model also applies to capacitive microphones. However, this work neglects squeeze film damping, which is critical to microphone performance. Extending the model to microphones would require combining it with a squeeze-filmdamping model like that described in [5]. For all types of capacitive transducers, analytical models help transducer development. Without analytical models, engineers typically use FEA (finite element analysis) for transducer design and analysis. However, analytical models are faster and more efficient than FEA; and furthermore, they reveal the parameter relationships and physics that govern the transducer’s operation. Even when FEA is required, for example to validate a final design, analytical models help verify the FEA’s correctness. Despite the utility of analytical models, existing capacitive transducer models can be improved. This paper extends on the model first described by Wygant et al. [6]. Models published prior to [6] depended in part on either FEA [7] or numerical iteration [8] to derive an equivalent circuit. Since [6], others have followed a similar analytical modeling approach, and incorporated anisotropic material properties [9], rectangularshaped plates [9], two-layered plates [9], and implementations in hardware descriptive language [10], [11]. Unlike other models, this work accounts for the nonlinearity of large plate deflection. Large plate deflection is important to CMUT air transducers where wider bandwidth requires a thin plate and for pressure sensors where linear deflection with pressure is desired. Fig. 3 gives a schematic representation of the transducer model. The steps to derive this model are: (1) calculate lumped spring and mass constants for the plate; (2) estimate damping due to radiation impedance; (3) derive capacitance The transducer’s plate is a continuous structure that can take on any shape; thus, it has infinite degrees of freedom. One approach for simplifying analysis of the plate is to express the plate’s deflection as the sum of its orthogonal mode shape functions [12]. Each mode and its shape function corresponds to a simple independent spring-mass-damper system governed by Fm (t) = m m ϕ̈m − bm ϕ̇m − km ϕm , (1) where Fm (t) is the modal force acting on the plate for a mode m. The modal mass, damping, and spring constants are m m , bm , and km , respectively. Numerical techniques exist for deriving and solving (1) for a given force and initial conditions. Summing just a few modal solutions often gives an answer close to the exact solution. This paper uses just the plate’s fundamental mode. Neglecting all higher-order modes simplifies the analysis yet yields accurate results for frequencies up to and exceeding the plate’s fundamental resonant frequency. This frequency range satisfies the requirements for many transducer analyses. A. Mode Frequencies and Shapes The plate’s mode frequencies and mode shapes are known assuming the plate is thin, perfectly clamped, and subject to a uniform pressure [12], [13]. These assumptions introduce relatively small errors when compared to a more realistic finite element analysis (Section VII), even though an actual transducer plate is not perfectly clamped and the electrostatic force acting on it is not uniform. For the plate geometry in Fig. 2, the free undamped modal frequencies, i.e. the plate’s resonant frequencies, equal λ2ns D (2) ωns = 2 a ρh for plate radius a and plate thickness h. The plate’s density and flexural rigidity are ρ and D, respectively. The nondimensional modal frequency λns for a wide range of mode numbers n and s can be calculated or found in standard references [12]. For the fundamental (s = 0, n = 0) and first axisymmetric (s = 1, n = 0) mode, λns is 3.197 and 6.306, respectively. The plate’s density and flexural rigidity are ρ and D, respectively. The plate’s mode shape functions equal r Jn (λns ) r In λns Wns (r, θ ) = Jn λns − cos(nθ ), (3) a In (λns ) a where Jn and In are Bessel and modified Bessel functions of the first kind [12]. Note that axisymmetric modes (n = 0) This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. WYGANT et al.: ANALYTICAL MODEL FOR CAPACITIVE PRESSURE TRANSDUCERS WITH CIRCULAR GEOMETRY are more likely to be excited in a transducer where the impinging pressure is uniform and the electrostatic actuation is axisymmetric. The shape function 2 r2 W0 (r ) ≈ 1 − 2 (4) a is a good approximation of (3) for the plate’s fundamental mode. Compared to (3), the benefits of using (4) are that it equals the exact solution for the plate’s static deflection [13] and it yields a closed-form equation for the transducer’s capacitance as a function of deflection. For design calculations, (3) and (4) are close enough to be interchangeable. However, (3) is slightly more appropriate for resonant frequency and modal mass calculations whereas (4) is better for static calculations. For a given peak plate deflection, w pk , the plate’s displacement as a function of radial position equals 2 2 r2 r2 (5) w(r ) = w pk W0 (r ) = w pk 1− 2 = 3wavg 1− 2 . a a Averaging (5) over the plate area shows that the plate’s average deflection, wavg , is always one-third its peak deflection. Because the plate’s shape function is independent of amplitude, the plate’s continuous deflection is representable with a single amplitude parameter—this representation is what enables modeling the plate with the single-degree-of-freedom system described by (1). The choice of amplitude parameter or reference point, e.g. wavg or w pk , does not affect the solution to the plate’s vibration but it does affect scaling of the spring, mass, and damper constants. Acoustic calculations favor the use of average deflection because acoustic impedance depends on volume displacement, which is the product of wavg and the plate’s area. As a result, we use wavg for the modal amplitude parameter. B. Modal Mass The kinetic energy of the continuous plate must equal the kinetic energy of its modal representation according to 1 KE= 2 1 2πρh ω0 w pk W0 (r ) r dr = m 0 (ω0 wmod )2 , 2 2 (6) 0 where wmod is the modal amplitude parameter. Solving (6) for the fundamental mode’s modal mass yields a m 0 = 2πρh 0 w pk W0 (r ) wmod 2 r dr = 1.88πa 2ρh. plate’s center. The mass ratio is greater than one because the plate’s center has more kinetic energy than the reference point wavg . Using w pk for the amplitude parameter results in a ratio of 0.2 If the plate moved as a perfect piston, then the mass ratio would be one. As described in [14], the medium in which the CMUT operates, e.g. water, contributes additional mass. With this addition, the modal mass equals ρf a ), (8) m 0,liquid = m 0 (1 + ρ h where ρ f is the medium’s density. The theoretical value of is between 0.47 and 0.67 depending on the acoustic boundary conditions. One study reports an empirical value of 0.55 [15]. This added mass from the medium is approximate as these studies assume the plate diameter is large relative to the wavelength, which is not true for many transducer applications. C. Modal Spring Constant Calculating the modal spring constant from the modal mass m 0 and frequency ω0 gives 192.2π D . (9) a2 Alternatively, we can derive the spring constant from the expression for the plate’s static deflection [13]. A clamped circular plate subject to a uniform pressure, q, has a shape function equal to (4). The peak deflection equals, k0,mod = m 0 ω02 = qa 4 , 64D which results in a spring constant equal to w pk = k0 = F 3 192π D = πa 2 q = , wavg w pk a2 (7) This solution uses (3) for the shape function and wavg for the modal amplitude parameter. Note that the modal mass equals 1.88-times the plate’s physical mass (using (4) in place of (3) for the shape function yields a ratio of 1.8). The modal mass does not equal the plate’s physical mass because not all parts of the vibrating plate contribute equally to its kinetic energy; for example, regions close to the clamped edge contribute less than the (10) (11) which is very close to (9). The spring constant depends on the plate’s flexural rigidity D. For uniform isotropic materials, flexural rigidity equals Diso = a 3 Eh 3 , 12(1 − ν 2 ) (12) where E is the material’s isotropic Young’s modulus and ν is its Poisson ratio. For anisotropic materials like silicon, [16] provides the following equations for calculating the flexural rigidity: s22 −s12 c11 = , c12 = , 2 2 s11 s22 − s12 s11 s22 − s12 s11 1 c22 = , c66 = 2 s66 s11 s22 − s12 α3 = 3c11 + 3c22 + 2c12 + 4c66 α3 3 h , Daniso = (13) 96 where sx x are the components of the inverse of the material’s stiffness matrix. A typical MEMS device is made from anisotropic (100) silicon, where the X, Y, and Z directions correspond to This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. 4 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS the [110], [1̄10], and [001] crystal directions, respectively [2]. For this type of silicon, it is sometimes convenient to derive isotropic values of Young’s modulus and Poisson ratio that yield the same flexural rigidity as (12). Applying (12) and (13) yields an equivalent isotropic Young’s modulus of 150.5 GPa for a Poisson ratio of 0.177. This value for Poisson ratio is the radial average value and is the correct value for the largedeflection calculations made in the following section. The plate may also comprise multiple layers of different materials. For example, a silicon plate could be covered with conducting or passivation layers. For multilayer plates, [17] and [18] give a procedure for calculating the equivalent flexural rigidity for an arbitrary number of layers. D. Large Deflections For most transducer applications, the plate’s deflection is small relative to its thickness. For larger deflections, tensile forces in the plate’s midplane become more significant relative to the plate’s bending forces [19]. For these cases, the deflection no longer varies linearly with the applied force. Following the procedure in [13] yields a modified spring constant for these large-deflection forces. Applying this procedure, the plate’s radial displacement, u r , due to midplane tension is assumed to take the form ∞ u r = r (a − r ) Cn r n , (14) n=0 where Cn are constants. Neglecting n greater than three and calculating Cn that gives the minimum energy for the deflected plate results in the following expression for the energy associated with the midplane tension: Ut = 6π D 4 wavg Cν , a 2t 2 where Cν is a constant that depends on Poisson ratio: 896585 + 529610ν − 342831ν 2 . 29645 The energy associated with plate bending equals [13] Cν = Ub = 96π D (15) (16) 2 wavg . (17) a2 Differentiating the total energy with respect to wavg gives the following expressions for mechanical force in terms of k0 and a nonlinear spring constant k0,t : Fspr = d (Ut + Ub ) wavg = wavg 2 24π DCν wavg k0 + a2 h2 3 = k0 wavg + k0,t wavg (18) where, k0,t = 24π DCν . a2h2 (19) Taking the ratio of the cubic tensile force term to the linear bending force term in (18) yields (20) 3 k0,t wavg Cν w pk 2 Ft ension = = . (20) Fbend k0 wavg 72 h This expression shows that tensile forces are negligible when the plate’s deflection is small relative to its thickness. If the plate’s peak deflection is less than about one-seventh its thickness, the tensile force is less than 1% of the bending force. Since Cν does not vary much between materials, this effect is true for any plate material. E. Damping Damping equates to energy loss and equivalently mechanical noise [20]. An important and sometimes dominant damping mechanism is the radiation impedance, which is a result of energy dissipated to the surrounding medium. If we approximate the radiation impedance with the planewave radiation impedance, then the damping constant equals the product of the plate area and the specific acoustic impedance of the medium, Z 0 , according to b0 |plane wave = πa 2 Z 0 . (21) This approximation is valid when the diameter of the transducer, which may consist of multiple cells, exceeds about two wavelengths. Assuming damping equals (21) leads to an expression for the plate’s quality factor: 9 ρhω0 m 0 ω0 = . (22) Q= b0 5 Z0 This expression shows that for a given resonant frequency, quality factor is proportional to plate thickness. For this reason, a thinner plate results in a transducer with wider bandwidth. Transducers are often less than one wavelength in width or height. In this case, the radiation impedance is a complex value that varies with frequency. The radiation impedance for a circular piston radiator equals J1 (2kar ) H1 (2kar ) , (23) + j Z = Z0 1 − kar kar where H1 is the Struve function, ar is the piston radius, and k is the wavenumber [21]. A similar expression exists for a radiator with velocity profile like (4) [21]. A CMUT element usually consists of multiple cells operating in parallel. Tightly packed cells act roughly like a single radiator with volume velocity equal to the sum of the cells’ volume velocities. For less tightly packed cells, accounting for the cells’ mutual impedance gives a better estimate for the net radiation impedance [22]. To model the complex radiation impedance as an equivalent circuit, we can use a circuit that matches (23) over a wide frequency range [23]. Or we can add a mass equal to the reactive part of the damping constant around a single frequency [7]. Beyond radiation impedance, other forms of damping include energy loss to the substrate and thermoeleastic damping. These sources of damping are harder to predict analytically and, without more analysis, are best derived empirically or with finite element analysis. This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. WYGANT et al.: ANALYTICAL MODEL FOR CAPACITIVE PRESSURE TRANSDUCERS WITH CIRCULAR GEOMETRY III. C APACITANCE Writing (30) in terms of the model parameters yields Capacitance depends on the transducer’s gap height and plate deflection. To account for an insulating layer in the cavity, we use an effective gap height g0 = h cav + h ins , εr,ins (24) where, h cav is the cavity height, h ins is the insulator thickness (Fig. 2), and εr,ins is the insulator’s relative permittivity. Using shape function (4) and integrating over the plate area gives 3wwavg 2 ε a tanh πa 0 a g0 2πr ε0 dr = C= 2 3g0wavg r2 0 g −3w 0 avg 1− a 2 (25) for the capacitance as a function of average deflection. The first and second derivatives of capacitance equal ε0 πa 2 dC = C = dwavg 2g0 wavg 1 − 3wavg g0 − C , 2wavg (26) 2 dwavg = C = − πa 2 3ε0 2 3w 2g02 wavg 1− gavg 0 C ε0 πa 2 1 + 2 − C , (27) 3wavg 2w 2w 2 avg avg 2g0 wavg 1− g0 respectively. Calculation of electrostatic force and pull-in require these derivatives. IV. E LECTROSTATIC F ORCE AND P ULL -I N Applying the principal of virtual work gives the electrostatic force, Fe , on the plate for a voltage V : 1 2 V C. (28) 2 The net mechanical force, Fm , equals the sum of the spring restoring force and force due to impinging pressure: Fe = 3 − πa 2 P. Fm = k0 wavg + k0,t wavg 2 )C = 0, −Fm C + (k0 + 3k0,t wavg which we can solve for the average deflection at pull-in. We denote this deflection as wavg, pi . The pull-in voltage in terms of wavg, pi [24] equals dUm (wavg, pi ) 2Fm (wavg, pi ) VP I = 2 /C = . (33) dwavg C Under certain conditions, closed-form solutions exist for wavg, pi and Vpi . For some transducer designs we can neglect large-deflection forces (k0,t = 0) and atmospheric pressure (P = 0). With these assumptions, the transducer always pulls in when the plate’s average deflection is 15% of the gap: wavg,P I (34) k0,t =0,P=0 = 0.15 g0 and the pull-in voltage equals 3k g g03 Qω0 Rb 0 0 V P I k0,t =0,P0 =0 = 0.39 = 0.39 . πa 2 ε0 πa 2 ε0 (29) w pi, pp 1 k0,t =0,P=0 = g0 3 and where Um is the total mechanical energy. = 0,t =0,P=0 (35) 8 27 and = 3 =0 (30) 2(k0 wavg, pi − πa 2 P) . C (wavg, pi ) (37) (39) As described in [25] and [26], a nonlinear spring extends the travel range of the transducer. Assuming k0,t dominates (k0 = 0) and neglecting atmospheric pressure yields (40) wavg, pi k0 =0,P=0 = 0.24 and V pi k 0 =0,P=0 (31) g03 k0 g03 k0 = 0.54 . 2 πa ε0 πa 2 ε0 (36) Assuming the expressions for a pressure transducer have the same form as those for a parallel-plate transducer enables us to derive approximate expressions that account for atmospheric pressure: wavg, pi k0,t =0 ≈ 0.15(1 + 1.18wavg,P ) g0 πa 2 P/k0 = 0.15 1 + 1.18 (38) g0 V pi k for wavg gives the plate’s static deflection for a given dc voltage and applied pressure. When the applied voltage exceeds the pull-in voltage, V pi , no wavg satisfies (29). For these voltages, the plate is unstable and snaps to the bottom of the cavity. Following the procedure in [24], we can calculate V pi . At the brink of pull-in, the deflection, wavg, pi , satisfies d 2 Um dC dUm d 2 C − = 0, 2 2 dw dwavg dwavg dwavg avg V pi, pp k Solving the sum of these forces, Fe + Fm = 0, (32) Interestingly (33) and (34) look like the corresponding expressions for a parallel-plate transducer, which are and d 2C 5 = 0.08 g05 k0,t . πa 2 ε0 (41) Comparing V with (34) we see that a nonlinear spring extends the travel range from 15% to 24% of the gap. This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. 6 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS V. G OVERNING D IFFERENTIAL E QUATION Having derived the electrical and mechanical model parameters of the transducer, we can write the transducer’s governing differential equations. The net force, F, on the transducer plate equals the sum of the mechanical and electrical forces: 1 3 − V 2C . F = m 0 ẅavg + k0 wavg + k0,t wavg 2 (42) The current, I , flowing into the transducer’s terminals equals the sum of the currents from the changing voltage and the moving plate: I = C V̇ + V C ẇavg . (43) Together, (42) and (43) form the governing differential equations for the transducer’s operation. Solving these equations numerically gives the transducer’s response to electrical and mechanical inputs. Implementing them in a hardware descriptive language enables simulation with electrical circuits [10], [11]. Writing them as state equations provides other options for simulation and analysis [26]. Fig. 4. Electromechanical equivalent circuits of the transducer. a) Basic twoport equivalent circuit. For a given transducer design and dc operating condition, expressions (48)-(53) give component values. The through and across variables at the electrical port are current, I , and voltage, V , respectively. At the mechanical port, they are velocity, U , and force, F. b) Equivalent circuit with additional model components: input voltage source, Vs ; source resistance, Rs ; parasitic capacitance, C par ; mass loading of the medium, L med ; added damping, Rdamp ; and applied force, Fs . Based on (51), this circuit divides the plate’s compliance into a mechanical part, Cm0 , and a negative spring-softening part, Cs . TABLE I V ERIFICATION W ITH FEA FOR I SOTROPIC , O RTHOTROPIC , AND L AYERED P LATES VI. L INEAR E QUIVALENT C IRCUIT Expressions (42) and (43) support a two-port model of the transducer. They relate the transducer’s electrical port (voltage and current) to its mechanical port (force and velocity). For this two-port model, following the procedure in [26] yields the linear equivalent circuit in Fig. 4. This equivalent circuit is valid for small variations in plate deflection at a specific operating point. Solving (29) gives the plate deflection at the specified operating point. To calculate the equivalent circuit, we first write the Jacobian, ⎡ δV ⎤ g δV q dV ⎥ δq ⎢ δg (44) = AB = ⎣ δδq F δ F ⎦ δg , dF g q δq δg that gives the linearized relationship between the two ports of the transducer. Matrix A in (44) is expressible in terms of the transducer model parameters as follows: A11 A12 A22 1 d V d q = = = g dq dQ C C 2 Vdc d V d F q C = 2 C = A21 = = = q g dg dq q C d F d F e 2 = q = k 0 + 3k 0,t wavg − dg dwavg 2 1 2 2C C 2 = k0 + 3k0,t wavg + q − 2 . 2 C3 C parameters in terms of the number of parallel cells, N. The circuit parameters are as follows: C0 = NC, A12 = N V C , n=N A11 A211 1 1 1 ke2 = 3 = , N A12 A22 N nC A22 1 = N A22 (1 − ke2 ), Cm L m = Nm 0 , (45) (46) (47) Next, we write the equivalent circuit parameters in terms of the coefficients of matrix A. Since a transducer element can consist of multiple cells in parallel, we write the circuit (48) (49) (50) (51) (52) and Rb = Nb0 . (53) These are the basic equivalent circuit elements. With additional elements, we can also model other mechanical and This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. WYGANT et al.: ANALYTICAL MODEL FOR CAPACITIVE PRESSURE TRANSDUCERS WITH CIRCULAR GEOMETRY 7 Fig. 5. Axisymmetric geometry for verifying pull-in voltage and analyzing effects of post width, w post with finite element analysis. For the clamped-edge condition, the plate displacement is fixed for r = a plate . TABLE II FEM V ERIFICATION OF P ULL -I N V OLTAGE Fig. 6. The effect of post width on the plate’s deflection and resonant frequency for the a = 560 μm design in Table II. Results are from finite element analysis for the geometry in Fig. 5. Compared to the clamped-edge assumption made for the analytical model, a plate with a finite post width is at least 8% more compliant. This result suggests using a slightly more compliant spring constant to model a more realistic plate boundary condition. TABLE III E XPERIMENTAL VALIDATION OF R ESONANT F REQUENCY AND P ULL -I N V OLTAGE electrical effects, e.g., mass loading given by [7], complex radiation impedance described in [23], or parasitic capacitance. Fig. 4(b) gives an example of an equivalent circuit with additional model elements. VII. C OMPARISON W ITH F INITE E LEMENT A NALYSIS Two finite-element models implemented with ANSYS help verify the analytical model. A three-dimensional quartersymmetry model constructed from SHELL281 elements verifies clamped plate deflection and resonant frequency for isotropic, anisotropic, and layered plate materials. For the transducer designs in Table I, the analytical model agrees with the finite element model with less than 0.5% error. An axisymmetric model (Fig. 5), constructed from PLANE183 elements, verifies pull-in voltage and evaluates the effect of a compliant post. Table II shows that for the clamped plate, the analytical pull-in voltage matches the finite element results to better than 10%. The biggest mismatch occurs for the design with the largest deflection (a = 585 μm). This design’s Fig. 7. Comparison of measured and modeled transducer admittance for the a = 560 μm design in Table III and a 24-V dc bias. The model accurately predicts the resonant frequency and magnitude of the impedance but underpredicts the amount of damping. a) Admittance curves. b) Equivalent circuit and component values corresponding to the admittance curves. The measured equivalent circuit is the result of a fit to the measured admittance curve. The circuits match well except that the measured parallel resistance, R x , is about 3.8-times higher than the modeled R x . This mismatch indicates the model does not capture all sources of damping. plate-shape differs the most from the analytical plate shape (4) because it has the most midplane tension. The axisymmetric model also helps evaluate the effect of a compliant post (Fig. 5). For the simulation results in Fig. 6, post widths greater than 50-μm (roughly 3.5-times the platethickness) give deflections 8% larger than the perfectlyclamped plate. This result suggests the use of a slightly reduced flexural rigidity in design calculations. Table II shows that using a reduced flexural rigidity better predicts the pull-in voltage of a device with a compliant post. This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. 8 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS VIII. C OMPARISON W ITH E XPERIMENT Comparison with characterized examples of airborne CMUT devices further helps to validate the model. Table III compares modeled and measured resonant frequency and pull-in voltage for three different radii. The results show good agreement; however, the model slightly overpredicts the pull-in voltage, which suggests using a further reduced flexural rigidity to model the compliant post. Fig. 7 compares modeled and measured electrical impedance. The model accurately predicts the transducer’s motional impedance except that it underpredicts the amount of damping. Using a better model for radiation impedance than (23) and including additional damping sources would improve this mismatch. IX. C ONCLUSION This work shows that starting from the geometry and material properties of a capacitive transducer, we can derive an accurate model that agrees with finite element analysis and experiment. Critical modeling equations are (7), (11), (19), and (21) for the spring-mass-damper model of the plate and, (4) and (25) for the plate’s deflection and capacitance. With these equations, we can calculate an equivalent circuit or solve (42) and (43) for arbitrary time-varying electrical and mechanical inputs. While these equations meet basic analysis needs, the model could be improved in several ways. For example, including higher-order modes would give a better prediction of a CMUT’s wideband frequency response in liquid. Film stress, temperature, and additional sources of damping are important to typical sensing applications but are not included in the model. These and other effects are topics for continued research. [9] M. F. L. Cour, T. L. Christiansen, J. A. Jensen, and E. V. Thomsen, “Electrostatic and small-signal analysis of CMUTs with circular and square anisotropic plates,” IEEE Trans. Ultrason., Ferroelect., Freq. Control, vol. 62, pp. 1563–1579, Aug. 2015. [10] S. Frew, H. Najar, and E. Cretu, “VHDL-AMS behavioural modelling of a CMUT element,” in Proc. IEEE Behavioral Modeling Simulation Workshop, Sep. 2009, pp. 19–24. [11] H. Koymen et al., “An improved lumped element nonlinear circuit model for a circular CMUT cell,” IEEE Trans. Ultrason., Ferroelect., Freq. Control, vol. 59, no. 8, pp. 1791–1799, Aug. 2012. [12] A. W. Leissa and M. S. Qatu, Vibrations of Continuous Systems. New York, NY, USA: McGraw-Hill, 2011. [13] S. Timoshenko and S. Woinowsky- Kreiger, Theory of Plates and Shells, 2nd ed. New York, NY, USA: McGraw-Hill Higher, 1964. [14] M. K. Kwak and K. C. Kim, “Axisymmetric vibration of circular plates in contact with fluid,” J. Sound Vibrat., vol. 146, no. 3, pp. 381–389, 1991. [15] J. H. Powell and J. H. T. Roberts, “On the frequency of vibration of circular diaphragms,” Proc. Phys. Soc. London, vol. 35, no. 1, p. 170, 1922. [16] E. Illing, “The bending of thin anisotropic plates,” Quart. J. Mech. Appl. Math., vol. 5, no. 1, pp. 12–28, 1952. [17] K. S. Pister and A. M. Dong, “Elastic bending of layered plates,” J. Eng. Mech. Division, vol. 84, no. 4, pp. 1–10, 1959. [18] E. Ventsel and T. Krauthammer, Thin Plates and Shells: Theory, Analysis, and Applications. New York, NY, USA: Marcel Dekker, 2001. [19] M. Kupnik, I. O. Wygant, and B. T. Khuri-Yakub, “Finite element analysis of stress stiffening effects in CMUTs,” in Proc. IEEE Ultrason. Symp., Nov. 2008, pp. 487–490. [20] T. B. Gabrielson, “Mechanical-thermal noise in micromachined acoustic and vibration sensors,” IEEE Trans. Electron Devices, vol. 40, no. 5, pp. 903–909, May 1993. [21] M. Greenspan, “Piston radiator: Some extensions of the theory,” J. Acoust. Soc. Amer., vol. 65, no. 3, pp. 608–621, 1979. [22] R. L. Pritchard, “Mutual acoustic impedance between radiators in an infinite rigid plane,” J. Acoust. Soc. Amer., vol. 32, no. 6, pp. 730–737, 1960. [23] A. Bozkurt, “A lumped-circuit model for the radiation impedance of a circular piston in a rigid baffle,” IEEE Trans. Ultrason., Ferroelect., Freq. Control, vol. 55, no. 9, pp. 2046–2052, Sep. 008. [24] Y. Nemirovsky and O. Bochobza-Degani, “A methodology and model for the pull-in parameters of electrostatic actuators,” J. Microelectromech. Syst., vol. 10, no. 4, pp. 601–615, Dec. 2001. [25] E. S. Hung and S. D. Senturia, “Extending the travel range of analogtuned electrostatic actuators,” J. Microelectromech. Syst., vol. 8, no. 4, pp. 497–505, Dec. 1999. [26] S. D. Senturia, Microsystem Design. New York, NY, USA: Kluwer, 2001. R EFERENCES [1] S. Adler, P. Johnson, and I. Wygant, “Low frequency CMUT with thick oxide,” U.S. Patent 8 455 289 B1, Jun. 4, 2013. [2] M. A. Hopcroft, W. D. Nix, and T. W. Kenny, “What is the Young’s modulus of silicon?” J. Microelectromech. Syst., vol. 19, no. 2, pp. 229–238, Apr. 2010. [3] J. J. Vlassak and W. D. Nix, “A new bulge test technique for the determination of Young’s modulus and Poisson’s ratio of thin films,” J. Mater. Res., vol. 7, no. 12, pp. 3242–3249, 1992. [4] O. Tabata, K. Kawahata, S. Sugiyama, and I. Igarashi, “Mechanical property measurements of thin films using load-deflection of composite rectangular membranes,” Sens. Actuators, vol. 20, pp. 135– 141, Nov. 1989. [5] D. Homentcovschi and R. N. Miles, “Modeling of viscous damping of perforated planar microstructures. Applications in acoustics,” J. Acoust. Soc. Amer., vol. 116, no. 5, pp. 2939–2947, 2004. [6] I. O. Wygant, M. Kupnik, and B. T. Khuri-Yakub, “Analytically calculating membrane displacement and the equivalent circuit model of a circular CMUT cell,” in Proc. IEEE Ultrason. Symp., Nov. 2008, pp. 2111–2114. [7] A. Lohfink and P.-C. Eccardt, “Linear and nonlinear equivalent circuit modeling of CMUTs,” IEEE Trans. Ultrason., Ferroelect., Freq. Control, vol. 52, no. 12, pp. 2163–2172, Dec. 2005. [8] A. Nikoozadeh, B. Bayram, G. G. Yaralioglu, and B. T. Khuri-Yakub, “Analytical calculation of collapse voltage of CMUT membrane [capacitive micromachined ultrasonic transducers],” in Proc. IEEE Ultrason. Symp., vol. 1. Aug. 2004, pp. 256–259. Ira O. Wygant received the B.S. degree in electrical engineering and computer science from the University of Wyoming, Laramie, in 1999, and the M.S. and Ph.D. degrees in electrical engineering from Stanford University, in 2002 and 2008, respectively. His Ph.D. research at Stanford was focused on capacitive micromachined ultrasonic transducer technology and its integration with frontend electronics. From 2008 to 2017, he was with Texas Instruments Inc., Santa Clara, CA, USA, in research and engineering roles to develop microelectromechanical transducer technologies. This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. WYGANT et al.: ANALYTICAL MODEL FOR CAPACITIVE PRESSURE TRANSDUCERS WITH CIRCULAR GEOMETRY Mario Kupnik received the Dipl.Ing. degree in electrical engineering from the Graz University of Technology, Austria, in 2000, and the Ph.D. degree in electrical engineering from the University of Leoben, Austria, in 2004. From 2005 to 2011, he was a Post-Doctoral Researcher, a Research Associate, and a Senior Research Scientist with the Edward L. Ginzton Laboratory, Stanford University, USA. From 2011 to 2014, he was a Full Professor of electrical engineering with the Brandenburg University of Technology, Cottbus, Germany. Since 2015, he has been a Full Professor with the Technische Universität Darmstadt, Germany, heading the Measurement and Sensor Technology Group. 9 Butrus (Pierre) T. Khuri-Yakub (F’95) received the B.S. degree from the American University of Beirut, the M.S. degree from Dartmouth College, and the Ph.D. degree from Stanford University, all in electrical engineering. He is currently a Professor of electrical engineering with Stanford University. He has authored over 600 publications and has been a principal inventor or coinventor of 102 U.S. and international issued patents. His current research interests include medical ultrasound imaging and therapy, ultrasound neuro-stimulation, chemical/biological sensors, gas flow and energy flow sensing, micromachined ultrasonic transducers, and ultrasonic fluid ejectors. He received the Medal of the City of Bordeaux in 1983 for his contributions to nondestructive evaluation, the Distinguished Advisor Award from the School of Engineering, Stanford University, in 1987, the Distinguished Lecturer Award from the IEEE UFFC Society in 1999, the Stanford University Outstanding Inventor Award in 2004, the Distinguished Alumnus Award from the School of Engineering, American University of Beirut, in 2005, the Stanford Biodesign Certificate of Appreciation for commitment to educate mentor and inspire Biodesign Fellows in 2011, and the IEEE 2011 Rayleigh Award. He was elected as a Fellow of the AIMBE in 2015.