Maxμm Ultra
Automatic Ball Bonder
Volume 2: Maintenance Manual
98868-0000-002-03
The information in this document is the property of Kulicke & Soffa. Any reproduction, publication or distribution to a third party is
strictly forbidden unless written permission is given by an authorized agent of Kulicke & Soffa.
Copyright © 2007 Kulicke & Soffa Industries Inc.
All Rights Reserved. No part of this publication may be reproduced, stored in a data
retrieval system, or transmitted by any form or by any means electronic, mechanical,
photocopying, or recording without written permission from:
The Engineering-OPS Department
Kulicke & Soffa Pte Ltd
6 Serangoon North Avenue 5,
#03-16, Singapore 554 910
The information contained in this manual was correct on the date of publication,
but is subject to change without notice.
Safety Information
Safety Information
S.1 Introduction
The following information provides a description of the safety features of
the K&S Maxµm Ultra Ball Bonding Platform.
It is YOUR responsibility to read and understand this safety section before
operating your equipment. Remember that you are the key to safety. Practice all other usual and customary safe working precautions and above all:
REMEMBER, SAFETY IS UP TO YOU. YOU CAN PREVENT SERIOUS
INJURY OR DEATH.
S.2 Symbols and Messages
The following symbols and messages are used in this manual:
WARNING:
Warnings advise the reader that there is a possibility of personal injury or
death, if sufficient care is not taken when performing a specific procedure.
WARNINGs precede the procedure to which they apply. All WARNINGs are
printed in BOLD BLOCK CAPITALS.
CAUTION:
Cautions advise the reader that if sufficient care is not taken when performing a specific procedure, there is a possibility of damage to the following:
•
Product
•
System
•
Facility
•
Process program
•
Machine Dependent Parameters
CAUTIONs precede the procedure to which they apply. All CAUTIONs are
printed in Bold upper/lower case block letters.
NOTE: Notes provide the reader with additional helpful information. This information may be:
•
Helpful, but not essential, information
•
A reference to another paragraph or volume.
This information is not critical as that in warnings and cautions. These
usually precede, but may also follow, the procedure to which they apply.
Notes are printed upper/lower case in block letters.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
S.3 Equipment-Specific Warnings
WARNING: TYPE 4 ELECTRICAL HAZARD! DO NOT TOUCH THE ELECTRONIC
FLAME-OFF (EFO) WAND OR THE GOLD WIRE DURING OPERATION
OR WHEN MANUALLY FIRING THE EFO. THE SYSTEM PRODUCES A
SPARK BETWEEN THE EFO WAND AND WIRE WHICH CAN CAUSE
AN ELECTRICAL SHOCK IF CONTACTED DURING EFO FIRING. THE
POTENTIAL SHOCK HAZARD IS NOT USUALLY CONSIDERED LIFE
THREATENING (AS DESCRIBED IN IEC PUBLICATION NO. 479),
HOWEVER, K&S RECOMMENDS THAT PERSONS WITH ABNORMAL
HEART CONDITIONS OR ARTIFICIAL HEART STIMULATION DEVICES
(E.G. PACEMAKERS) SHOULD NOT BE PERMITTED TO OPERATE OR
SERVICE THE EQUIPMENT.
WARNING: TYPE 4 ELECTRICAL HAZARD! THE EFO PRODUCES UP TO 4.5 KV ON
VARIOUS PARTS INSIDE OF THE EFO CONTROL BOX AND ON THE
HIGH-VOLTAGE CABLE. DO NOT OPEN THE EFO BOX. IF IT
BECOMES NECESSARY TO HANDLE THE HIGH-VOLTAGE CABLE
OR REMOVE THE BOX, UNPLUG THE EFO BOX POWER CABLE AND
WAIT AT LEAST FIVE (5) MINUTES. USE HIGH-VOLTAGE TECHNIQUES AND PRECAUTIONS AT ALL TIMES WHEN HANDLING THIS
UNIT
WARNING: ELECTROMAGNETIC FIELDS! SERVO MOTORS USED TO POSITION THE
BOND HEAD AND OPTICS GENERATE STRONG MAGNETIC FIELDS.
HEART STIMULATION DEVICES (E.G. PACEMAKERS) MAY BE
ADVERSELY AFFECTED DURING BOND HEAD POSITIONING.
THEREFORE, PERSONS USING SUCH DEVICES SHOULD NOT BE
NEAR THE EQUIPMENT WHILE IT IS IN OPERATION.
WARNING: TYPE 4 ELECTRICAL HAZARD! DO NOT TOUCH THE CLAMP ASSEMBLY
WHEN MACHINE POWER IS ON! THE CLAMP IS OPERATED BY AN
ELECTRICAL POTENTIAL OF UP TO 330 VOLTS DC, WHICH CAN
CAUSE AN ELECTRICAL SHOCK IF CONTACTED. THE POTENTIAL
SHOCK HAZARD IS NOT CONSIDERED LIFE THREATENING.
WARNING: CLASS II LASER HAZARD! THE BOND HEAD Z-AXIS ENCODER HAS A
CLASS II LASER. WHILE THE ENCODER SENSOR HEAD IS
MOUNTED ON THE BOND HEAD, THE LASER IS NO DANGER TO THE
USER OR MAINTENANCE TECHNICIAN. HOWEVER, WHEN THE SENSOR HEAD IS REMOVED AND MACHINE POWER IS ON, THE LASER
LIGHT CAN CAUSE EYE DAMAGE IF VIEWED DIRECTLY ON AXIS.
ALWAYS TURN OFF MACHINE POWER BEFORE REMOVING THE
ENCODER SENSOR HEAD FROM THE BOND HEAD.
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Safety Information
WARNING: HAZARDOUS MATERIAL! SOME OF THE STRUCTURAL COMPONENTS
OF THE BOND HEAD ARE MADE FROM A BERYLLIUM ALLOY THAT
SHOULD BE CONSIDERED A POTENTIAL CARCINOGEN. HAZARDOUS DUST IS PRODUCED WHEN THIS MATERIAL IS MACHINED,
FILED, OR GROUND. DO NOT MACHINE OR OTHERWISE ATTEMPT
TO REWORK THE BOND HEAD. USE CARE NOT TO GOUGE THE
LINK WHEN WORKING AROUND THE BOND HEAD AREA WITH
SMALL, SHARP TOOLS AS THIS MAY PRODUCE CHIPS OR SPLINTERS THAT CAN PENETRATE SKIN. A MATERIAL SAFETY DATA
SHEET THAT PROVIDES MORE INFORMATION CONCERNING
BERYLLIUM AND ITS SAFE HANDLING IS AVAILABLE FROM K&S
UPON REQUEST.
WARNING: IMPACT HAZARD! AVOID CRUSHING, SHEARING AND IMPACT IN THE
MHS AND BOND HEAD AREAS WHILE THE MACHINE IS OPERATING.
S.4 General Precautions
The following general safety precautions should be observed whenever
operating, adjusting, or servicing this equipment:
•
Components of the workholder are very hot! Do not allow fingers, or
any material with a low melting point to contact heated areas.
•
Observe all WARNINGS and CAUTIONS noted in the texts of the technical publications for the bonder.
•
Always disable all motors before putting hands near the bond head,
XY table, MHS and other powered systems.
•
Keep hands clear of the bond area while the machine is operating.
•
Operate the bonder with covers installed at all times.
•
Disconnect electrical service to the bonder before removing the rear
covers or opening the cardrack door, unless machine power is
required to perform a specific maintenance task.
•
Standard precautions related to live electrical circuits must be taken at
all times when adjusting or servicing the equipment.
•
Never rest tools or materials on the MHS or bonder while servicing.
•
Observe the manufacturer's recommended safety precautions when
handling and using chemical substances.
•
Solvents and aerosols, if used, must be compatible with the bonder
operating environment and the process.
S.5 Trained Operators and Service Technicians
Personnel operating and servicing the machine must receive training in
machine operation and maintenance provided by K&S. The Performance
Based Equipment Training (P.B.E.T.) provided by K&S ensures that participants master job skills to meet measurable learning objectives. The training is split into two (2) levels:
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
•
Level One (1)
Level One training includes basic machine operation and simple maintenance. Machine operators must successfully complete this training before
operating the machine.
•
Level Two (2)
Level Two training covers advanced machine operation and maintenance.
Service technicians must successfully complete both the Level One and
Level Two training courses.
Details concerning training courses and locations can be found on the
K&S website "www.kns.com". Click on the "Support Services" link at the
top of the page, then click on the "Equipment Training" link at the left side
of the Support Services page.
S.6 Servicing Electrical Equipment
S.6.1 Servicing Electrical Equipment
CAUTION: Before applying AC power to the machine, read through the items
outlined in the safety check list below.
•
Read through the Safety Information (this section) thoroughly.
•
Read through Item A; Types of Electrical Hazards below.
•
Read through Item B; Verifying Power Supply Configuration below.
•
Read through Item C; Lockout/Tagout Procedure below.
S.6.2 Types of Electrical Hazards
At times the operator or maintenance technician may be required to
access certain areas of the machine in order to perform setup procedures,
calibrations or regular maintenance routines. If the work to be performed
in these areas relate to components near exposed energized circuits; the
steps to perform the work, as outlined in the Maxµm Ultra Operations,
Maintenance or MHS manuals, will define the type of electrical hazard.
The types of electrical hazards are:
•
Type 1: Equipment is fully de-energized (electrically cold)
•
Type 2: Equipment is energized. Live circuits are covered or insulated.
•
Type 3: Equipment is energized. Live circuits are exposed and accidental contact is possible. Potential exposures are less than 30 volts
RMS (42.2 volts peak)
•
Type 4: Equipment is energized. Live circuits are exposed and accidental contact is possible. Potential exposures are greater than 30
volts RMS (42.2 volts peak) or radio frequency is present.
•
Type 5: Equipment is energized. Measurements and/or adjustments
require physical entry into the equipment or equipment configuration
does not allow the use of clamp-on probes.
NOTE: Work in electrical hazard types 3 through 5 are brought to the readers
attention in the Maxµm Ultra Operations, Maintenance and MHS manuals.
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Safety Information
S.6.3 Power Supply
CAUTION: Applying power to the machine that is below the specified voltage
range may damage machine equipment. Do not connect the
machine to facility power unless the facility power is within the
range of 200 VAC to 240 VAC. If the facility power is below this
range, a step-up transformer is required (see NOTE below).
NOTE: If the customers facility input voltage is within the range of 100 VAC to
120VAC, a step-up transformer is required to raise the input voltage to
the required 200 to 240 VAC range. The step-up transformer is installed
between the Maxµm Ultra bonder power supply and the facility input
voltage. Contact your local K&S sales representative for more information about this feature.
DC and AC power to all components in the Maxµm Ultra bonder are distributed by a power supply. The power supply does not need to be configured to comply with the facility AC line voltage as long as the facility AC
line voltage is within the range of 200 VAC to 240 VAC. Facility input voltage frequency differences are also handled automatically.
S.6.4 Lockout/Tagout Procedure
K&S strongly recommends that the user provide a power connector locking device. When removing power from the machine, implement the usersupplied locking device on the power cable to prevent unintentional or
accidental restoration of power to the machine during servicing. The
attachment of a tagout device on the lockout device is also recommended.
This provides a prominent warning to all personnel that the machine may
not be operated until the tagout device and the lockout device are
removed. Refer to OSHA standard 29 CFR 1910.147 for detailed information on the control of hazardous energy using lockout/tagout procedures.
S.7 Safe Handling of Heated Material and Equipment
The workholder heaters are typically heated to a temperature that will
immediately burn unprotected skin if contact is made with the heaters, or
with machine components close to the workholder. Precautions must be
taken when loading/unloading heated materials and parts or servicing
equipment in the area around the workholder (work area) to avoid injury.
S.7.1 User's Responsibilities for Personal Safety
It is the user's responsibility to operate and service the machine safely. It
is expected that personnel who operate or service the machine will make
themselves aware of all hazards to their safety by carefully reviewing all of
the safety information provided with the equipment, reading the WARNING notices within the technical manuals that support the machine, and
noting the areas of the machine that are labeled as hazardous.
S.7.2 Servicing Heated Equipment
If a maintenance procedure in the work area must be performed, the
workholder heaters must be turned off. Allow sufficient time for the
workholder heaters to cool completely before starting the maintenance
procedure. To verify that the workholder heaters have cooled:
A. Turn off the heaters (Temperature Configuration dialog, set 1 TURN
ALL ZONES to OFF.). Refer to Temperature Configuration in Section
5: Configuration of Maxµm Ultra Volume 1: Operation.
B. Observe the heating zone temperatures displayed on the monitor
screen.
C. When the displayed temperatures equal the ambient temperature
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© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
S.8 Fire Safety
S.8.1 Fire Suppression
It is assumed that the machine will be operated in a clean room equipped
with fire detection and fire suppression equipment. The only requirement
for the wire bonding machine is that the fire extinguishing agent should be
suitable for suppression of electrical fires. The machine contains no combustible liquids or gases, nor are any used in the process performed by
the machine. If there is no area fire suppression system in place where
the machine operates, fire extinguishing equipment should be available
close to the machine. Use an extinguishing device suitable for electrical
and electronic equipment and compatible with the products used with the
machine. Only personnel trained to fight fires should use fire extinguishers. In the event of a fire, the machine will produce only those substances
that ordinarily result from the combustion of electrical or electronic equipment. Standard venting and clean-up methods should be used.
S.8.2 Flammable Maintenance Supplies
Some machine preventive maintenance procedures specify use of isopropyl alcohol and grain alcohol for cleaning and degreasing, which are flammable liquids. Large quantities of alcohol (more than 1 liter) should be
stored in accordance with local regulations. At a minimum, the alcohol
should be kept in approved containers that are clearly labeled, and the
containers should be stored outside of the production area in fireproof
lockers. When alcohol is required for machine maintenance, small
amounts should be taken to the machine in labeled and tightly closed containers. When in use, keep the alcohol away from open flames or other
sources of ignition.
S.9 Emergency Stop Switch
S.9.1 Emergency Stop Switch Overview
The Maxµm Ultra Emergency Stop Switch is located on the front righthand side of the upper console (see Figure S-2). It is a latching switch
with a large red knob surrounded by a yellow label. The switch is large,
highly visible and conveniently placed to ensure that Trained Operators or
Trained Service Personnel can easily locate and activate it, if an emergency power down of the system is required.
An emergency power down is initiated by pressing the switch knob in.
This causes the main power supply contactor to open, removing all AC
power from the equipment. To power up the bonder after an emergency
power down, the Emergency Stop Switch must be reset (unlatched) and
activate the main power switch “ON" button to power up the machine.
CAUTION: Initiating an Emergency Off condition by pressing the Emergency
Off switch during bonding operations may result in the loss of the
process program and possible damage to the product being
bonded. If an Emergency Off condition does occur during bonding
operations, clear all leadframes from the material handling system
workholder and restart the bonder.
S.9.2 Emergency Stop Switch Specifications
vi
•
Switch Location- Front, right-hand corner of the upper console (see
Figure S-2).
•
Switch Description- Latching switch with large red knob, surrounded by
a yellow label imprinted with the words "EMERGENCY STOP". When
activated, the switch latches in the active position. The switch knob
must be rotated clockwise to unlatch and de-activate the switch.
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All Rights Reserved
Safety Information
•
Functions:
1. Emergency Stop- Push the Emergency Off Switch. Pushing in the
switch cuts off all A.C. power to the system by tripping the Main
Power supply contactor.
2. When the Emergency Stop switch is pressed it remains in the
latched position to prevent unauthorized use of the machine. If the
“ON” switch button is pressed with the emergency stop switch still
latched down, the machine power will still remain off. Go to the next
step to restart from Emergency Stop.
3. Restart from Emergency Stop- Reset the Emergency Off Switch by
turning the switch knob clockwise to unlatch the switch. This will
release the switch and allow it to reset to the “out” position. Press
the “ON" switch button to power up the machine.
NOTE: The equipment will not restart unless the Emergency Off Switch is reset
to the “out" position.
S.9.3 Testing Emergency Stop Switch Operation
A test of Emergency Stop switch operation must be performed regularly
as part of the scheduled machine preventive maintenance. The test
should also be performed immediately after the machine is installed in the
user's facility, during initial power-up.
In this test the trained service technician should operate the switch to
ensure that power is immediately removed from the machine and verify
that the Main Power switch will not return power to the machine when the
Emergency Stop switch is activated (latched down).
S.10 Other Safety Features: Cover Panels
The MHS Workholder Cover; the Input Magazine Handler and Output
Magazine Handler Covers; the Upper Console Cover Panel; and Lower
Console Cover Panel protect Trained Operators from many of the hazards
presented by the moving mechanical parts, heating elements and electrical subsystems of the equipment. The covers should be in place and
secured during all normal operations. They should be opened or removed
by Trained Service Personnel only.
Volume 2: Maintenance
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Maxµm Ultra Ball Bonder
S.11 Machine Emissions
S.11.1 Ionizing and Non-Ionizing Radiation
•
Ionizing and Non-Ionizing Radiation: the machine produces no ionizing
radiation.
•
Non-ionizing Radiation: the machine has been tested to show compliance with EN 61000-6-4, "Generic Emissions for Industrial
Environments".
S.11.2 Vibration
If the machine is installed as described in the Maxµm Ultra Machine
Installation Guide, with the machine resting on its leveling feet and with no
contact between the machine and facility walls or other equipment, no
appreciable vibration will be emitted by the machine when operating.
Elastomer vibration isolators are used on the leveling feet to support the
machine and prevent vibrations produced by the bonding and material
handling equipment from being coupled to the facility floor.
S.11.3 Noise
Continuous acoustical noise emitted by the machine will not exceed 85
dB(A), measured from the operator position as prescribed in ANSI S1.13
“Methods for the Measurement of Sound Pressure Levels."
S.11.4 Gases, Vapor, Dust
The machine produces no gases, vapors, or dust as a result of its operations.
S.12 Warning and Safety Label Descriptions
The following section describes the safety and identification labels on the
Maxµm Ultra bonder. The safety labels inform Trained Operators and
Trained Service Personnel that a hazardous condition may exist in the
general area of each of those labels, requiring additional caution if any
actions must be performed in those areas. The identification labels are
informational in nature and intended to assist Trained Operators and
Trained Service Personnel in performing their duties.
S.12.1 Emergency Stop
Figure S-1 Emergency Stop Label
viii
•
Label- Emergency Stop Label (see Figure S-1)
•
Description- The label further identifies and increases the visibility of
the Emergency Off Switch to ensure that Trained Operators and Service Personnel are fully aware of its location and function.
•
Color- Black on Yellow
•
Location- See Figure S-2, item A.
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Safety Information
ITEM B ITEM C ITEM D ITEM E
ITEM B – WARNING, BURN
HAZARD, SEE SECTION S.12.2.
ITEM C – WARNING, PINCH POINT
HAZARD, SEE SECTION S.12.3.
ITEM D – WARNING, ELECTRICAL
SHOCK, SECTION S.12.4.
ITEM E – WARNING, GENERAL
DANGER, SECTION S.12.5.
ITEM A
EMERGENCY OFF SWITCH
SEE SECTION S.12.1
ITEM C2
WARNING, PINCH
POINT HAZARD, SEE
SECTION S.12.3.
ITEM C1
WARNING, PINCH
POINT HAZARD, SEE
SECTION S.12.3.
MACHINE FRONT
ITEM R
OPERATOR ESD
COONECTION
POINT LABEL, SEE
SECTION S.12.7
Item E4
Warning, Magnetic Field
Hazard Label
See Section S.12.15
ITEM F
EQUIPMENT CONFIGURATION TAG
WARNING, CHECK LINE VOLTAGE
BEFORE CONNECTING
SEE SECTION S.13.2
ITEM D1
WARNING, ELECTRICAL
SHOCK, SEE SECTION S.12.4
REAR VIEW
Figure S-2 Exterior Safety Label Tags
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Maxµm Ultra Ball Bonder
ITEM D2
WARNING, ELECTRICAL
SHOCK, SEE SECTION S.12.4
ITEM F
DISCONNECT POWER
BEFORE OPENING
SEE SECTION S.12.6
ITEM D8
WARNING, ELECTRICAL SHOCK
(ON CLAMP DRIVER BOARD, X
AMP BOARD & Y AMP BOARD).
SEE SECTION S.12.4
ITEM G
EQUIPMENT IDENTIFICATION TAG
SEE SECTION S.13.1
LOWER CONSOLE FRONT
(WITHOUT COVER)
CARD RACK
CARD RACK
(COVER OPEN)
EFO BOX
(HIDDEN)
ITEM D6
WARNING, ELECTRICAL
SHOCK (On the underside of the EFO Box),
SEE SECTION S.12.4.
ITEM E1, ITEM D3
WARNING, GENERAL DANGER AND
ELECTRICAL HAZARD (On top hor-
izontal surfaces of the X–Axis
& Y Axis Linear Motors)
SEE SECTION S.12.5 AND S.12.4
ITEM E2, ITEM D4
WARNING, GENERAL DANGER
AND ELECTRICAL HAZARD
(GENERAL WARNING OF POTENTIAL HAZARDS IN THE UPPER AND LOWER CONSOLES
WHEN THE COVERS ARE REMOVED FOR MAINTENENCE/
SERVICE)
SEE SECTION S.12.5 AND S.12.4
ITEM D5
WARNING, ELECTRICAL
SHOCK, SEE SECTION S.12.4
MACHINE REAR (WITHOUT COVERS)
Figure S-3 Internal Safety Label Tags
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ITEM H
ORDERING NOTICE
(On the underside of
the EFO Box),
SEE SECTION S.13.3.
ITEM J
Equipment Grounding IEC
Label
SEE SECTION S.12.7
Safety Information
ITEM D7
WARNING, ELECTRICAL
HAZARD
SEE SECTION S.12.4.
ITEM E3
WARNING, GENERAL DANGER
(On the bottom horizontal surface of the Z–Link)
SEE SECTION S.12.5
ITEM B1
WARNING, HEAT
HAZARD
SEE SECTION S.12.2.
ITEM K
READ MAINTENANCE MANUAL BEFORE SERVICNG THIS ASSEMBLY, (On
the bottom horizontal surface of
the Z–Link)
SEE SECTION S.12.8
Return to Previ-
Figure S-4 Bond Head and Optics Safety Label Tags
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Maxµm Ultra Ball Bonder
LIFT USING BASE TABS.
DO NOT LIFT BY RAILS.
ITEM L
CAUTION, LIFT USING
BASE TABS. DO NOT LIFT
BY RAILS Label
SEE SECTION S.12.9.
WORKHOLDER (FRONT)
ITEM Q
CAUTION, HEAVY. DO NOT
LIFT ALONE Label
SEE SECTION S.12.10.
WORKHOLDER (SIDE VIEW)
See Figure S–2,
Item C1
See Figure S–2,
Item C2
OUTPUT
MAGAZINE
HANDLER
INPUT
MAGAZINE
HANDLER
ITEM P
NOTICE, DAMAGE TO MACHINE
COULD RESULT. Do not lubri-
cate any leadscrews Label.
SEE SECTION S.12.11
BEARING RAIL AREA MUST BE
SUPPORTED DURING LIFTING
ITEM N
CAUTION, BEARING RAIL
AREA MUST BE SUPPORTED
DURING LIFTING Label
ITEM M
CAUTION, HEAVY DO NOT
LIFT MAGAZINE HANDLER
ALONE Label
SEE SECTION S.12.13
SEE SECTION S.12.12
Return to Previ-
Figure S-5 MHS Safety Label Tags
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Safety Information
S.12.2 Warning, Heat Hazard
Figure S-6 Warning, Heat Hazard Label
WARNING: HOT TEMPERATURES CAN EXCEED 200°C.
•
Label- Warning, Heat Hazard (see Figure S-6).
•
Description-Trained Operators and Service Personnel are warned of
hot surfaces in the workholder area and on the bond head and optics
assembly.
•
Color- Black on Yellow.
•
Locations:
1. Figure S-2, item B2.
2. Figure S-4, item B1.
S.12.3 Warning, Pinch Point Hazard
Figure S-7 Warning, Pinch Point Label
•
Label- Warning, Pinch Point Hazard (see Figure S-7).
•
Description-Trained Operators and Service Personnel are warned to
keep hands and fingers clear of the area. This applies to the front loading area of the input and output magazine handlers and on the front of
the workholder area.
•
Color- Black on Yellow.
•
Location: Figure S-2, item C, item C1 and C2.
S.12.4 Warning, Electrical Hazard
Figure S-8 Warning, Electrical Hazard Label
•
Label- Warning, Electrical Hazard (see Figure S-8).
•
Description- This label alerts Trained Service Personnel to the presence of high voltage in the area.
•
Color- Black on Yellow.
•
Locations:
1. Figure S-2, item D and D1.
2. Figure S-3, item D2, D3, D4, D5, D6 and D8.
3. Figure S-4, item D7.
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Maxµm Ultra Ball Bonder
S.12.5 Warning, General Hazard
Figure S-9 Warning, General Hazard Label
•
Labels- Warning, General Hazard Label (see Figure S-9)
•
Description- This label alerts Trained Service Personnel (TSP) to the
presence of danger at the workholder area, on the X and Y axis
motors, Upper and lower console area when covers are taken out and
on the bond head Z-link. It is required for the TSP to follow-up on the
related labels (located next to the General Hazard Label) and read the
safety information before attempting to service the equipment.
•
Color- Black on Yellow.
•
Locations:
1. Figure S-2, item E
2. Figure S-3, item E1 & E2
3. Figure S-4, item E3
S.12.6 Disconnect Power Label
Figure S-10 Disconnect Power Before Servicing Label
•
Labels- Disconnect Power Before Servicing label (see Figure S-10).
•
Description- The label notifies Trained Service Personnels that the
input power cord of the power supply assembly should be disconnected before servicing equipment within the lower console of the
machine.
•
Color- White on blue.
•
Location: See Figure S-3, item F.
S.12.7 Equipment Grounding IEC
Figure S-11 Equipment Grounding Label
xiv
•
Labels- Equipment Grounding IEC Symbol (see Figure S-11).
•
Description-Symbol: Equipment Grounding IEC, label identifies the
connecting point for input power ground.
•
Color- Black on White
•
Location: See Figure S-3, item J.
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Safety Information
S.12.8 Operator ESD Grounding Point Label
Figure S-12 Operator ESD Connector Point Label
•
Labels- Operator ESD connector Point Label (see Figure S-12).
•
Description- Label identifies the connecting point to attach the ESD
wriststrap. This is to avoid equipment damage from electrostatic discharge.
•
Color- Black on White
•
Location: See Figure S-2, item R.
S.12.9 Read Maintenance Manual Before Servicing Label
Figure S-13 Read Maintenance Manual Before Servicing Label
•
Labels- Read Maintenance Manual Before Servicing. (see Figure S13).
•
Description- Trained Service Personnel are directed to the User Manual for safety information concerning parts made from beryllium alloy,
which can represent a health hazard under certain conditions. During
normal machine operations and maintenance actions, the beryllium
alloy does not represent a hazard to machine users or service technicians. Refer to Maxµm Ultra Volume 2: Maintenance, Sections 5 for
more information.
•
Color- White on blue
•
Location: See Figure S-4, item K (bottom of the Bond Head Z-link).
S.12.10 Caution, Heavy
Figure S-14 Caution, Heavy Label
•
Labels- Caution, Heavy, Do not lift alone (see Figure S-14)
•
Description- Trained Service Personnel are cautioned not to lift
workholder alone, it weighs approximately 85 pounds (38 kilograms)
and should be lifted by two or more people.
•
Color- Black on Yellow; Black on White
•
Location: See Figure S-5, item Q.
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xv
Maxµm Ultra Ball Bonder
S.12.11 Caution, Lift Using Base Tabs
LIFT USING BASE TABS.
DO NOT LIFT BY RAILS.
Figure S-15 Caution, Lift Using Base Tabs Label
•
Labels- Caution, Lift using base tabs. Do not lift by rails (see Figure S15).
•
Description- Trained Service Personnel are instructed to lift the
workholder by the tabs on the workholder base, not by the rails at the
top of the workholder. Lifting the workholder incorrectly may cause
damage to the workholder.
•
Color- Black on Yellow; Black on White
•
Locations: See Figure S-5, item L.
S.12.12 Caution, Heavy
Figure S-16 Caution, Heavy Label
•
Labels- Caution, Heavy, Do not lift magazine handler alone (see Figure
S-16).
•
Description- Trained Service Personnel are cautioned not to lift magazine handlers alone. They are very heavy and should be lifted by two
or more people.
•
Color- Black on Yellow; Black on White
•
Location: See Figure S-5, item M.
S.12.13 Notice, Do Not Lubricate
Figure S-17 Notice, Do Not Lubricate Any Leadscrew
xvi
•
Labels- Notice, Damage to Machine Could Result, Do not lubricate any
leadscrews (see Figure S-17).
•
Description- Trained Service Personnel are notified that damage to
machine could result if they lubricate any lead screws on the input/output magazine handler assemblies as shown.
•
Color- Black on Yellow; Black on White
•
Location: See Figure S-5, item P.
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Safety Information
S.12.14 Caution, Bearing Rail Area Must Be Supported
BEARING RAIL AREA MUST BE
SUPPORTED DURING LIFTING
Figure S-18 Caution, Bearing Rail Area Must Be Supported During Lifting
•
Labels- Caution, Bearing Rail Area Must Be Supported During Lifting
(see Figure S-18).
•
Description- Trained Service Personnel are cautioned to support the
area of the base plate under the Y-axis rails when lifting the magazine
handler. If not properly supported, the rails will bend and be permanently damaged when the magazine handler is lifted off of the
machine.
•
Color- Black on White
•
Location: See Figure S-5, item N.
S.12.15 Warning, Magnetic Field
Figure S-19 Warning, Magnetic Field Label
•
Label- Warning, Magnetic Field Hazard Label (see Figure S-19)
Description- This label alerts Trained Operators and Trained Service
Personnels to the presence of strong magnetic field generated by the
X-Y servo motors. Heart stimulation devices such as the pacemaker
may be adversely affected during bond head positioning. Therefore,
persons using such devices should stay at least 6 inches (153 mm)
away from the equipment while it is in operation.
•
Color- Black on White, Yellow on White, and Red on White
Location- See Figure S-2, item E4.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
xvii
Maxµm Ultra Ball Bonder
S.13 Identification Label Descriptions
The following paragraphs provide descriptions of each identification label,
including label location, color(s) and purpose, meaning, additional instructions, etc.
S.13.1 Equipment Identification Label
Figure S-20 Equipment Identification Label
•
Label- Equipment Identification Label (see Figure S-20)
•
Description- The label specifies the Equipment Identification Numbers
(model number, serial number, series, date manufactured.), identifies
the country of origin, and indicates CE compliance. It also shows information on the AC power configuration of the system on the date
shipped and informs the customers and Trained Maintenance Personnel of the expected maximum power consumption of the bonder at
listed nominal operating voltages. It also directs Trained Maintenance
Personnel to consult the Machine Operations Manual before attempting to reconfigure the system.
•
Color- Black on Gray
•
Location- See Figure S-3, item G.
S.13.2 Equipment Configuration Tag
Figure S-21 Equipment Configuration Tag
xviii
•
Label- Equipment Configuration Tag (see Figure S-21)
•
Description- This tag provides Trained Service Personnel with the AC
power configuration of the equipment, as shipped. It also instructs
them to refer to the Maintenance Manual if the line voltage and frequency is out the specification.
•
Color- Black on Beige Card Stock
•
Location- See Figure S-2, item F.
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Safety Information
S.13.3 EFO Box Ordering Notice Label.
Figure S-22 EFO Box Ordering Notice Label
•
Label- Equipment Configuration Tag (see Figure S-22)
•
Description- This label informs the Trained Service Personnel to take
note of the full part number including the last two digits when ordering
a new or replacement EFO Box. It also instructs them to consult the
customer service representative if required.
•
Color- Black on Beige Card Stock
•
Location- See Figure S-3, item H
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
xix
Maxµm Ultra Ball Bonder
.
This page is left intentionally blank
xx
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Use of This Manual
Use of This Manual
General Introduction
The purpose of this manual is to provide technical information for application design on the K&S Maxµm Ultra Gold Ball Bonding Platform.
The Table of Contents and the Index at the back of the manual should be
used to quickly locate specific information within the manual.
The following manuals should be referred to if additional information is
required:
•
Maxµm Ultra Volume 1: Operations
•
Maxµm Ultra Volume 3: Material Handling System (MHS)
Terms and Conventions used in this manual
The following format is used in this publication:
•
System modes are capitalized. Example: PROGRAM mode
•
Control Panel and keyboard buttons are in brackets, capitalized and in
bold. Example: [ENTER]
•
Graphical User Interface (GUI) buttons are capitalized and in bold
without brackets. Example: PROGRAM
•
Numeric “hot keys” are in brackets and in bold, followed by the function
name. Example: [1] Auto (Mode); [3] Delete (Menu Option)
•
Monitor messages are in quotes. Example: “Enable eye point
reteach”
•
Alphabetic displays where any letter may appear are represented by a
capital letter (X).
•
Numeric displays where any number may appear are represented
using the pound symbol (#).
The following terminology is used in this manual:
Term
Explanation
Chess
Moving the XY table or bond head using the mouse or arrow keys.
Select
Selection is initiated by:
1) Place pointer on a button or menu item and press [b1](left mouse button).
2) If item is highlighted (box around item), press [Enter].
3) Press menu item’s ‘hot key’.
Click or
Click On
Placing the pointer on a screen button or menu item. [b1] (left mouse button)
is pressed to initiate the selection.
Drag
Repositioning or resizing of an item on the display. This is done by using
the mouse and [b1] (left mouse button) in a held state during the drag.
Releasing [b1] terminates the drag function.
Index
Initiating workholder motion.
Scroll
Moving a text field in such a way as to have the data move up or down
within the field. Arrow keys or sliders are used to accomplish this function.
Target
Using chessing hardware to place the monitor crosshair or scan box at a
specific location in one of the display windows.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
xxi
Maxµm Ultra Ball Bonder
This page is left intentionally blank
xxii
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Record of Changes
Record of Changes
Change
No
Description
Affected
Pages
Revised
Date
0
Launch Release (S/W Version 9-58-2-32d-2)
ALL
7/2005
1
1. Section A.6.1.2, Perform Rail Calibration.
- Added black paint on the notched (cutout) portion of the
rear rail to create contrast for ease of crosshair location
during rail calibration.
A-32
7/2005
2. Section A.6.3.2, Perform indexer Calibration & Section A.6.4.2,
Perform X Registration Sensor Calibration.
- Calibration wafer changed to 08021-0901-011-xx.
A-35
A-37
3. Section 1.8, Special Tools and Fixtures
- Added 03119-0926-000-00, Magazine Handler calibration
gauges and removed Y-Z guage and magazine gauge from
08858-0901-000-xx, Adjustment tool kit.
- Added Force Sensor Calibration tool, 08858-0901-001-xx.
- Bond Force Calibration Weight Assy P/n changed to
08858-0901-020-xx
- MJT Shoulder Screw P/n changed to 08088-0901-007-xx
- Calibration Wafers P/n cahnged to 08021-0901-001-xx &
03501-0901-001-xx.
1-28
4. Section A.5.4, Bond Force Calibration & Section A.5.3.1,
Transducer Alignment
- Changed bondhead calibration weight P/n
08858-0901-016-xx to 08858-0901-020-xx and its
description.
A-19
A-14
5. Section A.5.3.1, Transducer Alignment
- Changed shoulder screw P/n 08088-0901-015-xx to MJT
shoulder screw, P/n: 08828-0901-007-xx.
A-14
6. Section 5.4.2.7, Clean Z encoder Grating & 5.4.2.8,
Replace Z encoder Read head & Grating
- Added Z encoder benching surface reference & description.
5-15
5-20
7. Section 5.4.2.15, Replacing the contact force sensor assy
- Added Piezo tightening torque of 16 oz in.
5-42
8. Set all capillary clamp screw torque to 35 Oz in and removed
all torque set to 25 Oz in.
9. Section 5.4.2.6, Clean Clamp Jewels (for 200hours)
- Added 200hrs wire clmp cleaning procedure.
5-13
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
xxiii
Maxµm Ultra Ball Bonder
Change
No
Description
1. Section 2: Lower Console. New fuses added to TDI Power
Supply. As a result, fuse numbers re-assigned.
- Edited Table 2-14.
- Edited Section 2.7.3 FRU list.
- Edited pictures in Figure 2-20 to Figure 2-26.
Affected
Pages
Revised
Date
2-42
2-42
2-37
2-48
7/2005
2
2. Section 3.5.3 Replace Wire Feed/BITS Board.
- Edited Figure 3-14, removed J15, J16, J19 and J20, and deleted
the pictorial connectors.
3-26
3. Section 3.5.3 Replace Wire Feed/BITS Board.
- Edited Figure 3-15, deleted J50 and its connections.
3-27
i-i
11/2005
1. Section 3.7.5 Replace Work Light Lamp Part Number to
12970-6002-002
3-34
10/2007
2. Added Appendix C: System Wiring Diagram.
C-1
3. Added Warning Label: Magnetic Field Hazard
(see Section Figure S-3and Figure S-19
i-xvii
Replace Safety Information with new Safety Information.
3
4. Removed previous Section 3.4.3.3 - Replace Conductive Spool
Contact Spring and deleted all its related preventive maintenance
schedule.
xxiv
5. Changed Clamp Screw replacement frequency from every
100th capillary replacement to 60th capillary replacement.
See Figure 1-2.
1-29
6. Changed Fuse Part Number for F3 & F4 to 18538-6003-001.
See Section 2.7.3
2-42
7. Changed Air Guide and Tensioner pneumatic settings. See
Section 3.3.2.2.
3-8
8. Changed EFO wand adjustment description. See Section
5.5.2.1
5-48
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Table of Contents
Safety Information - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - i
S.1
S.2
S.3
S.4
S.5
S.6
Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - i
Symbols and Messages - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -i
Equipment-Specific Warnings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ii
General Precautions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - iii
Trained Operators and Service Technicians - - - - - - - - - - - - - - - - - - - - - - - - - - - - - iii
Servicing Electrical Equipment - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - iv
S.6.1
S.6.2
S.6.3
S.6.4
Servicing Electrical Equipment - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - iv
Types of Electrical Hazards - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - iv
Power Supply - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - v
Lockout/Tagout Procedure - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - v
S.7 Safe Handling of Heated Material and Equipment - - - - - - - - - - - - - - - - - - - - - - - - v
S.7.1 User's Responsibilities for Personal Safety - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - v
S.7.2 Servicing Heated Equipment- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - v
S.8 Fire Safety - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vi
S.8.1 Fire Suppression - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vi
S.8.2 Flammable Maintenance Supplies - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vi
S.9 Emergency Stop Switch - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vi
S.9.1 Emergency Stop Switch Overview - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vi
S.9.2 Emergency Stop Switch Specifications - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vi
S.9.3 Testing Emergency Stop Switch Operation - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vii
S.10 Other Safety Features: Cover Panels - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - vii
S.11 Machine Emissions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - viii
S.11.1
S.11.2
S.11.3
S.11.4
Ionizing and Non-Ionizing Radiation - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Vibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Noise - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Gases, Vapor, Dust - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
viii
viii
viii
viii
S.12 Warning and Safety Label Descriptions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - viii
S.12.1 Emergency Stop - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - viii
S.12.2 Warning, Heat Hazard - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiii
S.12.3 Warning, Pinch Point Hazard - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiii
S.12.4 Warning, Electrical Hazard- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiii
S.12.5 Warning, General Hazard - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiv
S.12.6 Disconnect Power Label- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiv
S.12.7 Equipment Grounding IEC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiv
S.12.8 Operator ESD Grounding Point Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xv
S.12.9 Read Maintenance Manual Before Servicing Label- - - - - - - - - - - - - - - - - - - - - - - - - - - xv
S.12.10Caution, Heavy - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xv
S.12.11Caution, Lift Using Base Tabs - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvi
S.12.12Caution, Heavy - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvi
S.12.13Notice, Do Not Lubricate- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvi
S.12.14Caution, Bearing Rail Area Must Be Supported- - - - - - - - - - - - - - - - - - - - - - - - - - - - xvii
S.12.15Warning, Magnetic Field - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvii
S.13 Identification Label Descriptions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xviii
S.13.1 Equipment Identification Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xviii
S.13.2 Equipment Configuration Tag - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xviii
S.13.3 EFO Box Ordering Notice Label.- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xix
Use of This Manual - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xxi
•
General Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xxi
Terms and Conventions used in this manual - - - - - - - - - - - - - - - - - - - - - - - - - - - - xxi
• Record of Changes - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xxiii
1 Maintenance Guide - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-1
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
TOC - 1
Maxµm Ultra Ball Bonder
1.1 Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-1
1.1.1 Maintenance Manual Contents - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-1
1.2 Maxµm Ultra Publications - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-2
1.3 Equipment Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-2
1.3.1
1.3.2
1.3.3
1.3.4
1.3.5
1.3.6
1.3.7
1.3.8
General - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-2
XY Table/Bond Head - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-4
Material Handling System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-4
Lower and Upper Consoles - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-4
User Interface - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-5
Optics & Vision System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-6
Software - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-6
Specifications - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-7
1.3.8.1 Facility Requirements - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-7
1.3.8.2 Operating Environment - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-7
1.3.8.3 Material Handling Capability - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-7
1.3.8.4 Wire Bonding Capability - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-8
1.3.8.5 Dimensions and Weight - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-10
1.4 Safety Considerations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-10
1.4.1 Warnings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-10
1.4.1.1 General Safety Precautions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-11
1.5 Machine Installation - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-12
1.6 Setup Guides - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-12
1.6.1 Simple Setup - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-12
1.6.2 Detailed Setup - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-15
1.7 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-19
1.7.1 Maintenance Schedule - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-19
1.7.1.1 8–Hour Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-19
1.7.1.2 40–Hour Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-19
1.7.1.3 200–Hour Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-19
1.7.1.4 1000–Hour Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-19
1.7.1.5 3000–Hour Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-19
1.7.1.6 15000–Hour Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-21
1.7.1.7 Conditional Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-21
1.7.2 Preventive Maintenance Guides - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-22
1.7.2.1 General & Special Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-22
1.7.2.2 Lower Console - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-22
1.7.2.3 Upper Console - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-23
1.7.2.4 Vision System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-24
1.7.2.5 Bond Head and Related Components - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-25
1.7.2.6 XY Table Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-27
1.7.3 Material Handling System Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - 1-27
1.8 Routine Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-28
1.8.1 Replace Capillary - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-28
1.8.2 Replace Wire Spool - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-30
1.8.3 Clean Wire Feed Air Guide - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-33
1.9 Troubleshooting - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-33
1.9.1 Machine Troubleshooting Checklists - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-34
1.9.1.1 Vision System/Optics - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-34
1.9.1.2 Bond Head - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-35
1.9.1.3 XY Table - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-37
1.9.1.4 Lower Console - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-38
1.9.1.5 Miscellaneous - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-39
1.9.2 Wire Bond Troubleshooting Guide - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-40
1.9.2.1 Looping Problems - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-41
1.9.2.2 Bond Integrity Test System Errors - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-43
1.9.2.2.1 Non–Stick on Pad Errors (NSOP) - - - - - - - - - - - - - - - - - - - - - - 1-43
1.9.2.2.2 NSOP - Broken Wire - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-45
TOC - 2
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Table of Contents
1.9.2.3
1.9.2.4
1.9.2.5
1.9.2.6
1.10
1.11
1.12
1.9.2.2.3 False NSOP Error Indications - - - - - - - - - - - - - - - - - - - - - - - - 1.9.2.2.4 Non Stick on Lead (NSOL) Errors - - - - - - - - - - - - - - - - - - - - - 1.9.2.2.5 False NSOL Error Indications - - - - - - - - - - - - - - - - - - - - - - - - 1.9.2.2.6 Short Tail Error (SHTL) - - - - - - - - - - - - - - - - - - - - - - - - - - - EFO Open Errors - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Bond Placement - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Deformed Bonds - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Wire Feed/Wire Sensor Troubleshooting - - - - - - - - - - - - - - - - - - - - - - - - -
1-45
1-46
1-47
1-48
1-49
1-49
1-51
1-53
Recommended Spares - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-55
Special Tools and Fixtures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-55
Torque Specifications - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-56
2 Lower Console - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-1
2.1 About This Section - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-1
2.2 Overview - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-2
2.3 Control System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-4
2.3.1 System Organization - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-4
2.3.2 Card Rack Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-4
2.3.2.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-4
2.3.2.2 Monolithic Backplane Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-5
2.3.2.3 VMEbus - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-5
2.3.3 System Circuit Board Assemblies - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-5
2.3.3.1 VME Bridge Board, P/N 08001-4325-000-xx - - - - - - - - - - - - - - - - - - - - - - 2-9
2.3.3.2 Illumination Interface Board, P/N 08001-4246-000-xx - - - - - - - - - - - - - - - 2-10
2.3.3.3 I/O and Temperature Controller Board, P/N 08002-4192-000-xx - - - - - - - - 2-11
2.3.3.4 Stepper/Sensor Board, P/N 08001-4176-000-xx - - - - - - - - - - - - - - - - - - - - 2-13
2.3.4 Circuit Board Information in Other Sections and Volumes - - - - - - - - - - - - - - - - - - - - 2-15
2.3.5 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-15
2.3.6 Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-16
2.3.6.1 Replace Circuit Board Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-16
2.3.6.2 Check/Replace Card Rack Air Filter - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-17
2.3.6.3 Replace Input Air Filter - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-17
2.4 Operator Interface - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-19
2.4.1 Interface Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.1.1 MMI Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.1.2 Power Controls - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.2 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.3 Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.3.1 Clean MMI and Mouse - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.3.2 Remove and Install MMI Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.3.3 Replace Mouse - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.4.3.4 Replace MMI Keypad - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
2-19
2-19
2-21
2-21
2-21
2-21
2-22
2-23
2-23
2.5 System Computer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-26
2.5.1
2.5.2
2.5.3
2.5.4
System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Floppy Disks - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Floppy Disk Storage and Handling - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - System Computer Handling Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.5.4.1 Electrostatic Discharge (ESD) Protection - - - - - - - - - - - - - - - - - - - - - - - 2.5.4.2 Temperature and Humidity - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.5.4.3 Unpacking the System Computer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.5.4.4 General Handling Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.5.4.5 Operating Precautions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.5.5 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.5.6 Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2.5.6.1 Replace the System Computer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
2-26
2-26
2-26
2-26
2-27
2-27
2-27
2-27
2-28
2-28
2-28
2-28
2.6 Lower Console Cables - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-32
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
TOC - 3
Maxµm Ultra Ball Bonder
2.7 Power System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-36
2.7.1 System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-36
2.7.1.1 Power Supply Assembly Organization - - - - - - - - - - - - - - - - - - - - - - - - - - 2-36
2.7.1.2 AC Power Distribution - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-39
2.7.1.3 DC Power Distribution - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-39
2.7.1.4 Testpoints and Indicators - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-40
2.7.1.5 Status Lights - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-41
2.7.2 Surge and Spike Protection - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-41
2.7.2.1 Mains input and AC Fusing Specification and Location - - - - - - - - - - - - - - - 2-42
2.7.3 Corrective Maintenance/Field–Replaceable Units - - - - - - - - - - - - - - - - - - - - - - - - - - 2-42
2.7.4 Access to Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-43
2.7.5 Check/Replace Fan Filters - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-43
2.7.6 Check DC Outputs - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-44
2.7.7 Remove and Install Power Supply Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-46
2.8 Connectors for External Equipment - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-48
3 Upper Console- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-1
3.1 About This Chapter - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-1
3.2 Overview - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-2
3.3 Pneumatic System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-4
3.3.1 System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-4
3.3.2 Pneumatic Controls and Indicators - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-6
3.3.2.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-6
3.3.2.2 Initial Settings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-8
3.3.3 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-9
3.3.4 Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-9
3.3.4.1 Clean Input Air Filter - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-9
3.3.4.2 Replace Input Air Filter - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-9
3.3.4.3 Set Up Low Air Pressure Sensor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-10
3.3.4.4 Replace Air Solenoid Valves - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-11
3.4 Wire Feed System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-12
3.4.1 System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-12
3.4.1.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-12
3.4.1.2 Wire Feed Control System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-14
3.4.1.3 BITS Theory of Operation - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-16
3.4.2 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-17
3.4.3 Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-17
3.4.3.1 Replace Wire Spool - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-17
3.4.3.2 Clean Air Guide - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-20
3.4.3.3 Clean Wire Tensioner - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-21
3.4.3.4 Air Guide Optical Sensor Set Up - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-23
3.4.3.5 Bond Integrity Test System Set Up - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-24
3.5 Wire Feed/BITS Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-25
3.5.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-25
3.5.2 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-26
3.5.3 Replace Wire Feed/BITS Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-26
3.6 LCD Monitor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-28
3.6.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-28
3.6.2 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-28
3.6.3 Monitor Cables - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-28
3.7 Signal Light Tower and Work Light - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-30
3.7.1 Signal Light Tower - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-30
3.7.1.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-30
3.7.1.2 Signal Light Tower Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-30
3.7.2 Work Light - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-32
3.7.3 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-32
TOC - 4
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Table of Contents
3.7.4 Adjust Signal Light Tower Height - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-32
3.7.5 Replace Work Light Lamp - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-34
3.8 Microscope - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-35
3.8.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.8.2 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.8.3 Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.8.3.1 Adjust Focus - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.8.3.2 Adjust Microscope Field of View - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3.8.3.3 Clean Microscope Lenses - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
3-35
3-35
3-35
3-35
3-36
3-36
4 Vision System and Optics - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-1
4.1
4.2
4.3
4.4
About This Section - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-1
Overview - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-2
Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-6
Dual-Magnification Optics Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-6
4.4.1 System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-6
4.4.2 Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-8
4.4.2.1 Replace Optics Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-8
4.4.2.2 Optics Housing Alignment - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-11
4.4.2.3 Clean Objective Lens - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-13
4.4.2.4 Adjust Optics Focus - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-14
4.4.2.5 Adjust Camera Linearity - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-15
4.4.2.6 Adjust Magnification - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-16
4.4.2.7 Monitor Adjustments and Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - 4-18
4.4.2.7.1 Front Panel Controls/Indicator - - - - - - - - - - - - - - - - - - - - - - - - 4-18
4.4.2.8 On Screen Display (OSD) Mode - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-19
4.5 Illuminators - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-20
4.5.1 Illumination Control - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-20
4.5.2 Replace Illumination Flex Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-21
4.5.3 LED Illuminator Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-23
4.6 Solid-State Video Camera System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-24
4.6.1 System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.6.2 Replacement Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.6.2.1 Replace camera head - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.6.2.2 Replace Video Monitor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4.6.2.3
Replace Camera Control Unit (CCU) - - - - - - - - - - - - - - - - - - - - - - - - -
4-24
4-25
4-25
4-26
4-26
4.7 Vision System Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-29
4.7.1
4.7.2
4.7.3
4.7.4
4.7.5
4.7.6
4.7.7
4.7.8
System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-29
Vision System Assembly Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-30
Vision System Power Supply - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-30
Vision System Controls and Indicators - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-30
Vision System Unit Configuration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-32
Vision System Cable Connections - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-32
Replace Vision System Unit - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-33
Optimize Vision System (PRS/VLL) Performance - - - - - - - - - - - - - - - - - - - - - - - - - - 4-35
4.7.8.1 Illumination - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-35
4.7.8.2 Optics and Camera: - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-35
4.7.8.3 Electronics - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-36
4.7.8.4 Bonder XY Table - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-36
4.7.8.5 MHS Workholder - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-37
4.7.8.6 PRS Eyepoints: - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-37
4.7.8.7 VLL Diagnostics - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-37
5 Bond Head- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-1
5.1 About This Chapter - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-1
5.2 Overview - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-2
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
TOC - 5
Maxµm Ultra Ball Bonder
5.3 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-4
5.3.1 Beryllium Product Warning - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-4
5.4 Bond Head Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-5
5.4.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-5
5.4.2 Bond Head Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-7
5.4.2.1 Replace Capillary - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-7
5.4.2.2 Inspect Capillary Clamp Screw - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-9
5.4.2.3 Adjust Wire Clamp Lateral Position - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-9
5.4.2.4 Adjust Wire Clamp Gap - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-10
5.4.2.5 Clean Clamp Jewels (40 hours) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-12
5.4.2.6 Clean Clamp Jewels (for 200 hours) - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-13
5.4.2.7 Check Z Encoder Signal Amplitude/Clean Encoder Grating - - - - - - - - - - - - 5-15
5.4.2.8 Replace Z Encoder Read Head and Grating - - - - - - - - - - - - - - - - - - - - - - - 5-20
5.4.2.9 Set Bond Head Height - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-23
5.4.2.10 Remove and Install Bond Head - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-24
5.4.2.11 Replace Bond Head Flexure Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - 5-28
5.4.2.12 Replace 24V ZTC Heater - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-30
5.4.2.13 Adjust Upper and Lower Mechanical Limits - - - - - - - - - - - - - - - - - - - - - - 5-32
5.4.2.14 Align Transducer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-36
5.4.2.15 Replacing the Contact Force Sensor Assembly - - - - - - - - - - - - - - - - - - - - - 5-42
5.4.2.16 Replace Wire Clamp - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-43
5.4.2.17 Clean and Inspect Wire Feed Tube - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-45
5.5 Electronic Flame Off - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-46
5.5.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-46
5.5.1.1 System Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-46
5.5.1.2 EFO Box Assembly, P/N 08002-1120-000-16 - - - - - - - - - - - - - - - - - - - - - 5-46
5.5.2 EFO Maintenance Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-48
5.5.2.1 Adjust EFO Wand Position - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-48
5.5.2.2 Adjust MEFO Wand Theta and Y Position (Optional) - - - - - - - - - - - - - - - - 5-50
5.5.2.3
Clean EFO Wand - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-51
5.5.2.4 Replace EFO Wand - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-51
5.5.2.5 Replace EFO Box Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-52
5.6 Wire Clamp Driver - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-53
5.6.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-53
5.6.2 Wire Clamp Driver Board, P/N 08002-4165-000-xx - - - - - - - - - - - - - - - - - - - - - - - - - 5-54
5.7 Ultrasonic Generator and Transducer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-56
5.7.1 Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-56
5.7.1.1 System Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-56
5.7.1.2 Ultrasonic Generator (USG) Board, P/N 08001-4302-000-xx - - - - - - - - - - - 5-56
5.7.2 Replace USG Circuit Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-59
5.7.3 Replace Transducer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-60
5.8 Bond Head Control System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-62
5.8.1 System Organization - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-62
5.8.2 Control System Circuit Boards - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-63
5.8.2.1 Servo CPU (CPU2) Board, P/N 08002-4238-000-xx - - - - - - - - - - - - - - - - - 5-64
5.8.2.2 Servo Preamplifier Board, P/N 08002-4344-000-xx - - - - - - - - - - - - - - - - - 5-66
5.8.2.3 Z Amplifier Board, P/N 08001-4145-000-xx - - - - - - - - - - - - - - - - - - - - - - 5-67
5.8.3 System Electrical Connections - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-68
5.8.3.1 Cable List - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-68
5.8.3.2 Bond Head Interconnect Board Assembly - - - - - - - - - - - - - - - - - - - - - - - - 5-69
5.8.3.3 Replace Bond Head Interconnect Board - - - - - - - - - - - - - - - - - - - - - - - - - 5-70
6 XY Table - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-1
6.1 About This Chapter - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-1
6.2 Overview - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-2
6.3 Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-4
TOC - 6
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Table of Contents
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
Access to XY Table Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-5
Clean X and Y Motors - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-10
Lubricate X and Front Y Slide Bearings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-12
Lubricate Rear Y Slide Bearings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-13
Lubricate Rear Y Coupling Bearing - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-16
Replacement Procedures - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-18
6.3.6.1 Replace Y Motor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-18
6.3.6.2 Replace X Motor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-22
6.3.7 Replace Rear Y Slide Bearings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-25
6.4 XY Table Control System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-29
6.4.1 System Description - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6.4.2 Servo System Circuit Boards - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6.4.2.1 Servo CPU (CPU2) Board, P/N 08002-4238-000-xx - - - - - - - - - - - - - - - - 6.4.2.2 Servo Preamplifier Board, P/N 08002-4344-000-xx - - - - - - - - - - - - - - - - 6.4.2.3 Servo Power Amplifier Board, P/N 08002-4105-000-xx - - - - - - - - - - - - - 6.4.2.4 X and Y Servo Power Amplifier Board, P/N 08002-4105-000-xx - - - - - - - 6.4.3 XY Table Wiring Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
6-29
6-30
6-31
6-33
6-34
6-35
6-37
A Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-1
A.1 Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-1
A.2 Calibration Sequence - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-3
A.3 Servo - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-4
A.3.1
A.3.2
A.3.3
A.3.4
A.4
Tune X Axis - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-4
Tune Y Axis - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-4
Tune Z Axis - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-4
Tuned Servo Parameters - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-4
Pattern Recognition System (PRS) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-5
A.4.1 PRS Calibration Setup - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-5
A.4.1.1 Selecting the Eye Point - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-5
A.4.1.2 Setting PRS Parameters - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-5
A.4.1.3 Related Operations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-6
A.4.2 Performing the PRS Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-6
A.5 Bond Head Calibrations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-7
A.5.1 Crosshair Offset - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-8
A.5.1.1 Setting Calibration Conditions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-8
A.5.1.2 Calibration Procedure - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-9
A.5.2 EFO (Electronic Flame Off) Height - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-11
A.5.2.1 Calibration Procedure - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-11
A.5.2.2 Procedures for Moveable EFO Wand Application - - - - - - - - - - - - - - - - - - - A-12
A.5.2.3 Procedures for Fixed Wand Application - - - - - - - - - - - - - - - - - - - - - - - - - A-12
A.5.3 Z Axis Adjustments - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-13
A.5.3.1 Transducer Alignment - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-14
A.5.3.1.1 Calibration Procedure - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-14
A.5.3.2 Set Z Reset - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-19
A.5.4 Bond Force Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-19
A.5.4.1 Calibration Procedure - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-20
A.5.4.2 Bond Force Verification - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-23
A.5.5 USG (Ultrasonic Generator) Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-25
A.5.5.1 Calibration Procedure - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-26
A.5.6 Capillary (Cap) Change - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-27
A.5.7 BITS AGC - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-30
A.6 Workholder - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-31
A.6.1
Rail Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-31
A.6.1.1 Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-31
A.6.1.2 Perform Rail Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-32
A.6.2 Clamp Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-33
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
TOC - 7
Maxµm Ultra Ball Bonder
A.6.3
A.6.4
A.6.5
A.6.6
A.6.7
A.6.8
A.6.2.1 Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-33
A.6.2.2 Perform Clamp Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-34
Indexer Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-35
A.6.3.1 Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-35
A.6.3.2 Perform Indexer Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-35
X Registration Sensor Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-36
A.6.4.1 Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-36
A.6.4.2 Perform X Registration Sensor Calibration - - - - - - - - - - - - - - - - - - - - - - -A-37
Tucker Eject Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-38
A.6.5.1 Introduction - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-38
A.6.5.2 Perform Tucker Eject Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-38
RailsZ (Rail Height Adjustment) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-39
Gripper - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-42
A.6.7.1 Index Sensor Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-42
A.6.7.2 Index Gripper Upper Jaw Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - -A-43
A.6.7.3
Eject Sensor and Eject Gripper Upper Jaw Calibrations - - - - - - - - - - - - -A-43
A.6.7.4 Eject Gripping Force Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-43
A.6.7.5 Gripper Calibration Result - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-45
Workholder Calibrations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-45
A.7 Magazine (Mag) Handler - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-46
A.7.1
Input/Output Trays Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-46
A.7.2 Input/Output Slot Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-48
A.7.3 Calibration Results - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-50
A.8 Incomplete Calibrations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-51
A.9 XY Table Characterization - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-51
A.10 Gap Sensor - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-53
A.11 Process Program Portability Factors - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-56
A.11.1
EFO Current Offset - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-56
A.11.1.1 EFO Current Offset (Parameter Definition) - - - - - - - - - - - - - - - - - - - - - - -A-57
A.11.2 Loop Height Factor/Offset - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-57
A.11.2.1 Loop Height Factor/Offset (Parameter Definitions) - - - - - - - - - - - - - - - -A-57
A.11.3 Bond Force Offset - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-57
A.11.3.1 Bond Force Offset (Parameter Definition) - - - - - - - - - - - - - - - - - - - - - -A-58
A.11.4 USG Personality Values - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-58
A.11.4.1 USG Personality Values (Parameter Definitions) - - - - - - - - - - - - - - - - - -A-59
B Glossary of Terms & Abbreviations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - B-1
C System Wiring Diagram- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - C-1
TOC - 8
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
List of Figures
Figure S-1 Emergency Stop Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - viii
Figure S-2 Exterior Safety Label Tags - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - ix
Figure S-3 Internal Safety Label Tags - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - x
Figure S-4 Bond Head and Optics Safety Label Tags - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xi
Figure S-5 MHS Safety Label Tags - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xii
Figure S-6 Warning, Heat Hazard Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiii
Figure S-7 Warning, Pinch Point Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiii
Figure S-8 Warning, Electrical Hazard Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiii
Figure S-9 Warning, General Hazard Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiv
Figure S-10 Disconnect Power Before Servicing Label - - - - - - - - - - - - - - - - - - - - - - - - - - - xiv
Figure S-11 Equipment Grounding Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xiv
Figure S-12 Operator ESD Connector Point Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xv
Figure S-13 Read Maintenance Manual Before Servicing Label - - - - - - - - - - - - - - - - - - - - - - xv
Figure S-14 Caution, Heavy Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xv
Figure S-15 Caution, Lift Using Base Tabs Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvi
Figure S-16 Caution, Heavy Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvi
Figure S-17 Notice, Do Not Lubricate Any Leadscrew - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvi
Figure S-18 Caution, Bearing Rail Area Must Be Supported During Lifting - - - - - - - - - - - - xvii
Figure S-19 Warning, Magnetic Field Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xvii
Figure S-20 Equipment Identification Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xviii
Figure S-21 Equipment Configuration Tag - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xviii
Figure S-22 EFO Box Ordering Notice Label - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - xix
Figure 1-1 Maxµm Ultra Automatic Ball Bonder, Major Assemblies - - - - - - - - - - - - - - - - - - 1-3
Figure 1-2 Replace Capillary - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-29
Figure 1-3 Connect Wire End to Spring Plunger Contact - - - - - - - - - - - - - - - - - - - - - - - - - 1-30
Figure 1-4 Wire Spool Replacement - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-32
Figure 1-5 Clean Air Guide - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1-33
Figure 2-1 Lower Console: Locations of Subsystems - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-3
Figure 2-2 Card Rack Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-4
Figure 2-3 Air Filter and Cooling Fan - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-4
Figure 2-4 Circuit Board Assembly Locations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-6
Figure 2-5 PCB locations in the System Computer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-8
Figure 2-6 VME Bridge Board, P/N 08001-4325-000-xx, Major Components - - - - - - - - - - - - 2-9
Figure 2-7 Illumination Interface Board, P/N 08001-4246-000-xx, Major Components - - - - 2-10
Figure 2-8 I/O & Temperature Controller Board, P/N 08002-4192-000-xx,
Major Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-12
Figure 2-9 Stepper/Sensor Board, P/N 08001-4176-000-xx, Major Components - - - - - - - - - - 2-14
Figure 2-10 Input Air Filter/Moisture Trap - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-18
Figure 2-11 Lower Console: Operator Interface Components - - - - - - - - - - - - - - - - - - - - - - 2-20
Figure 2-12 MMI Exploded Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-25
Figure 2-13 HP USB Disk Storage Format Tool - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-30
Figure 2-14 Standby Mode Screen - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-31
Figure 2-15 Cable connection coming out from card rack - - - - - - - - - - - - - - - - - - - - - - - - - 2-32
Figure 2-16 Backplane Connections - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-33
Figure 2-17 Backplane Connectors - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-34
Figure 2-18 Non-Backplane Connections within the Lower Console - - - - - - - - - - - - - - - - - 2-35
Figure 2-19 Power System Layout - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-36
Figure 2-20 Power System Physical Layout - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-37
Figure 2-21 Power System Physical Layout 2 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-38
Figure 2-22 Power Supply Rear face testpoints and indicators - - - - - - - - - - - - - - - - - - - - - - 2-40
Figure 2-23 Access to Power System Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-43
Figure 2-24 Power Supply Connection Location - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-46
Figure 2-25 Replace Power Supply Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-47
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
LOF - 1
Maxµm Ultra Ball Bonder
Figure 2-26 Electrical Connector for External Equipment - - - - - - - - - - - - - - - - - - - - - - - - - 2-48
Figure 3-1 Upper Console, Major Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-3
Figure 3-2 Pneumatic System, Schematic Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-4
Figure 3-3 Pneumatic System Component Locations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-5
Figure 3-4 Pneumatic Controls and Indicators - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-7
Figure 3-5 Wire Feed System - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-13
Figure 3-6 Wire Feed Subsystem, Simplified Block Diagram - - - - - - - - - - - - - - - - - - - - - - 3-15
Figure 3-7 Connect Wire End to Spring Plunger Contact - - - - - - - - - - - - - - - - - - - - - - - - - 3-18
Figure 3-8 Wire Spool Replacement - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-19
Figure 3-9 Clean Air Guide - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-20
Figure 3-10 Remove and Clean Wire Tensioner - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-22
Figure 3-11 Air Guide Optical Sensor Amplifier Controls/Indicators - - - - - - - - - - - - - - - - - 3-23
Figure 3-12 Air Guide Assembly Showing Sensor Setup - - - - - - - - - - - - - - - - - - - - - - - - - 3-24
Figure 3-13 WireFeed/ BITS Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-25
Figure 3-14 Replace Wire Feed/ BITS Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-26
Figure 3-15 WireFeed/ BITS Board Wiring Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-27
Figure 3-16 LCD Monitor Connections - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-29
Figure 3-17 Signal Light Tower and Work Light Assemblies - - - - - - - - - - - - - - - - - - - - - - 3-31
Figure 3-18 Access Hole for Signal Light Tower Locking Collar Screw - - - - - - - - - - - - - - - 3-33
Figure 3-19 Zoom Microscope and Microscope Mount - - - - - - - - - - - - - - - - - - - - - - - - - - 3-35
Figure 4-1 Dual–Magnification Optics Assembly - Optical Path - - - - - - - - - - - - - - - - - - - - - 4-3
Figure 4-2 Vision System Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-4
Figure 4-3 Dual Magnification with Matrox Vision System, Functional Diagram - - - - - - - - - - 4-5
Figure 4-4 Dual–Magnification Optics Assembly - Major Parts - - - - - - - - - - - - - - - - - - - - - - 4-7
Figure 4-5 Replace Optics Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-8
Figure 4-6 Benching position - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-9
Figure 4-7 Replace Optics Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-10
Figure 4-8 Monitor Control Button - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-18
Figure 4-9 Display Menu Screen - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-19
Figure 4-10 Illumination Control, Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-20
Figure 4-11 Vertical and Oblique Illuminator Maintenance (Sheet 1 of 2) - - - - - - - - - - - - - - 4-22
Figure 4-12 Vertical and Oblique Illuminator Maintenance (Sheet 2 of 2) - - - - - - - - - - - - - - 4-23
Figure 4-13 Camera System Block and Cabling Diagram - - - - - - - - - - - - - - - - - - - - - - - - - 4-24
Figure 4-14 Camera Control Unit Cabling - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-27
Figure 4-15 Camera System Block and Cabling Diagram - - - - - - - - - - - - - - - - - - - - - - - - - 4-29
Figure 4-16 Vision System Unit, Mounting Location in Lower Console - - - - - - - - - - - - - - - 4-30
Figure 4-17 Vision System Unit - Cable Connections at Front and Back Panel - - - - - - - - - - 4-31
Figure 5-1 Bond Head Assembly and Related Components, Locator - - - - - - - - - - - - - - - - - - 5-3
Figure 5-2 Bond Head Assembly, Major Components - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-5
Figure 5-3 Replace Capillary - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-8
Figure 5-4 Adjust Wire Clamp Lateral Position - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-10
Figure 5-5 Adjust Wire Clamp Gap - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-11
Figure 5-6 3M Lapping paper inserted between the jewels - - - - - - - - - - - - - - - - - - - - - - - - 5-14
Figure 5-7 Clean room lint free paper with 1/3 portion of the paper dry - - - - - - - - - - - - - - - 5-14
Figure 5-8 Lint-free paper inserted between the jewels - - - - - - - - - - - - - - - - - - - - - - - - - - 5-14
Figure 5-9 Clean Linear Encoder Grating/Replace Encoder Assembly - - - - - - - - - - - - - - - - 5-17
Figure 5-10 Inserting the 0.75mm Shim between the glass scale and the encoder - - - - - - - - - 5-18
Figure 5-11 Inserting the Y spacer and benching the encoder to the rear and left hand side - - 5-18
Figure 5-12 Inserting the 0.75mm Shim between the glass scale and the encoder - - - - - - - - - 5-21
Figure 5-13 Inserting the Y spacer and benching the encoder to the rear and left hand side - - 5-22
Figure 5-14 Remove and Install Bond Head - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-27
Figure 5-15 Replace 24V ZTC Heater, P/N 08088-0563-000-xx - - - - - - - - - - - - - - - - - - - - 5-32
Figure 5-16 Set Bond Head Upper and Lower Mechanical Limits - - - - - - - - - - - - - - - - - - - 5-35
LOF - 2
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
List of Figures
Figure 5-17 Transducer Alignment: Step 1 Instruction - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-36
Figure 5-18 Transducer Alignment: Step 2 Instruction - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-37
Figure 5-19 Transducer Alignment: Step 3 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - 5-37
Figure 5-20 Gauge Placement (Top View) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-38
Figure 5-21 Gauge Positioning, Side-to-Side Perpendicularity (Top View) - - - - - - - - - - - - - 5-38
Figure 5-22 Transducer Alignment: Step 4 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - 5-40
Figure 5-23 Gauge Positioning, Front to Back Perpendicularity (Top View) - - - - - - - - - - - - 5-40
Figure 5-24 Transducer Alignment: Step 5 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - 5-41
Figure 5-25 Removing the Contact Force Sensor Assembly - - - - - - - - - - - - - - - - - - - - - - - 5-42
Figure 5-26 Replace Wire Clamp Assembly - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-44
Figure 5-27 EFO Box Location and Box Detail Drawings - - - - - - - - - - - - - - - - - - - - - - - - - 5-47
Figure 5-28 Adjust EFO Wand X and Y Axes - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-48
Figure 5-29 Adjust EFO Wand Position - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-49
Figure 5-30 Adjust MEFO Wand Theta and Y Axes - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-50
Figure 5-31 Wire Clamp Operation - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-53
Figure 5-32 Wire Clamp Driver Board, P/N 08002-4165-000-xx, Block Diagram - - - - - - - - 5-54
Figure 5-33 Wire Clamp Driver Board, P/N 08002-4165-000, Location and Major Components 5-55
Figure 5-34 USG Board, P/N 08001-4302-000-xx, Location and Major Components - - - - - - 5-57
Figure 5-35 Ultrasonic Generator, Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-58
Figure 5-36 Replace Transducer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-60
Figure 5-37 Z–Axis Servo System, Block Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-62
Figure 5-38 Z Axis Servo System Circuit Board Locations - - - - - - - - - - - - - - - - - - - - - - - 5-63
Figure 5-39 Servo CPU (CPU2) Board, P/N 08002-4238-000-xx, Major Components - - - - - - 5-65
Figure 5-40 XY Servo Preamplifier Board, P/N 08002-4344-000-xx, Major Components - - - 5-66
Figure 5-41 Z Amplifier Board, P/N 08001-4145-000-xx, Major Components - - - - - - - - - - - 5-67
Figure 5-42 Bond Head Control Cabling Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-68
Figure 5-43 Location of the Bond Head Interconnect Board Assembly - - - - - - - - - - - - - - - - 5-69
Figure 5-44 Replace Bond Head Interconnect Board Assembly - - - - - - - - - - - - - - - - - - - - - 5-70
Figure 6-1 XY Table, Component Locations - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-3
Figure 6-2 Access to XY Table Area for Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-5
Figure 6-3 Clean XY Table Motors - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-11
Figure 6-4 Lubricate X and Front Y Slide Bearings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-12
Figure 6-5 Lubricate Rear Y Slide Bearings - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-15
Figure 6-6 Lubricate Rear Y Coupling Bearing - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-17
Figure 6-7 Replace XY Motor Assemblies, Sheet 1 of 2 - - - - - - - - - - - - - - - - - - - - - - - - - - 6-19
Figure 6-8 Replace XY Motor Assemblies, Sheet 2 of 2 - - - - - - - - - - - - - - - - - - - - - - - - - - 6-20
Figure 6-9 Replace Rear Y Slide Bearings (Sheet 1 of 2) - - - - - - - - - - - - - - - - - - - - - - - - - 6-25
Figure 6-10 Replace Rear Y Slide Bearings (Sheet 2 of 2) - - - - - - - - - - - - - - - - - - - - - - - - 6-27
Figure 6-11 XY Table Servo System, Simplified Block Diagram - - - - - - - - - - - - - - - - - - - - 6-29
Figure 6-12 XY Servo System Circuit Board Locations - - - - - - - - - - - - - - - - - - - - - - - - - - 6-30
Figure 6-13 Servo CPU (CPU2) Board, P/N 08002-4238-000-xx, Major Components - - - - - - 6-32
Figure 6-14 XY Servo Preamplifier Board, P/N 08002-4344-000-xx, Major Components - - - 6-34
Figure 6-15 XY Servo Power Amplifier Board, P/N 08002-4105-000-xx, Major Components 6-35
Figure 6-16 XY Servo Power Amplifier Board, P/N 08002-4105-000-xx, Block Diagram - - - 6-36
Figure 6-17 XY Table Wiring Diagram - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-37
Figure A-1 Calibration Sequence - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-3
Figure A-2 Servo Calibration Menu - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-4
Figure A-3 Tuned Servo Parameters Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-4
Figure A-4 Calibrate Eye Point Values Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-5
Figure A-5 Unsuccessful Calibration Results Prompt - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-7
Figure A-6 Pixels to Axis Pulse Ratios - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-7
Figure A-7 Bond Head Calibration Menu - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-8
Figure A-8 Crosshair Offset Calibration Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-8
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
LOF - 3
Maxµm Ultra Ball Bonder
Figure A-9 Manual Crosshair Offset Calibration Sequence - - - - - - - - - - - - - - - - - - - - - - - - A-10
Figure A-10 Crosshair Offset Calibration Decision Box - - - - - - - - - - - - - - - - - - - - - - - - - - A-10
Figure A-11 EFO Height Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-11
Figure A-12 Turn On Z Chessing Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-11
Figure A-13 Set Correct Wand Height Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-11
Figure A-14 Z Axis Adjustments Menu - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-13
Figure A-15 Transducer Alignment: Step 1 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - A-14
Figure A-16 Transducer Alignment: Step 2 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - A-15
Figure A-17 Transducer Alignment: Step 3 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - A-15
Figure A-18 Gauge Positioning, (Top View) - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-16
Figure A-19 Gauge Positioning, Side-to-Side Perpendicularity (Top View) - - - - - - - - - - - - - A-16
Figure A-20 Transducer Alignment: Step 4 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - A-17
Figure A-21 Gauge Positioning, Front to Back Perpendicularity (Top View) - - - - - - - - - - - - A-18
Figure A-22 Transducer Alignment: Step 5 Instructions - - - - - - - - - - - - - - - - - - - - - - - - - - A-19
Figure A-23 Bond Force Calibration and Results Dialog Box - - - - - - - - - - - - - - - - - - - - - - A-20
Figure A-24 Bond Force Calibration Step 1 Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - A-21
Figure A-25 Bond Force Calibration Step 2 Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - A-21
Figure A-26 Installing the Reference Weight - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-22
Figure A-27 Bond Force Calibration Step 3 dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - A-22
Figure A-28 Force Sensor Calibration Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-22
Figure A-29 Force Sensor Calibration Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-23
Figure A-30 Bond Force Calibration Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-23
Figure A-31 Bond Force Verification Step 1 Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - A-24
Figure A-32 Bond Force Verification Step 2 Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - A-24
Figure A-33 Bond Force Verification Step 3 Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - A-24
Figure A-34 Bond Force Verification Step 4 Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - A-25
Figure A-35 USG Calibration Dialog Flow - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-25
Figure A-36 USG Tune Results Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-27
Figure A-37 Capillary Change Dialog Box Flow - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-29
Figure A-38 BITS AGC Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-30
Figure A-39 BITS AGC Calibration Dialog - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-30
Figure A-40 Workholder Calibration Menu - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-31
Figure A-41 MHS Rail Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-33
Figure A-42 MHS Clamp Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-35
Figure A-43 MHS Indexer Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-36
Figure A-44 X Registration Sensor Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-38
Figure A-45 Rail Height/Heat Block Height Example - - - - - - - - - - - - - - - - - - - - - - - - - - - A-40
Figure A-46 Rail Height Measurement Dialog Box - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-40
Figure A-47 Rail Height Adjustment Mechanism - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-41
Figure A-48 Gripper Calibration Menu - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-42
Figure A-49 Index Sensor Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-42
Figure A-50 Installing of Calibration Gauge for Index Sensor Calibration - - - - - - - - - - - - - - A-42
Figure A-51 Index Sensor Calibration - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-43
Figure A-52 Eject Gripping Force Calibration Menu - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-43
Figure A-53 Placement of the Calibration Gauge - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-44
Figure A-54 Calibration Gauge dialog - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-44
Figure A-55 Press the upper jaw to close dialog - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-44
Figure A-56 Manually press down the upper jaw - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-45
Figure A-57 Gripper Calibration Results - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-45
Figure A-58 Magazine Handler Calibration Menu - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-46
Figure A-59 Touching Benching Buttons (Side View) - - - - - - - - - - - - - - - - - - - - - - - - - - - A-47
Figure A-60 Magazine-Sized Gauge and Y-Z Gauge - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-48
Figure A-61 Inserting the Y-Z Gauge - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - A-50
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98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
List of Figures
Figure A-62
Figure A-63
Figure A-64
Figure A-65
Figure A-66
Figure A-67
Figure A-68
Figure A-69
Figure A-70
Figure A-71
Figure A-72
Bond Force Calibration and Results Dialog Box - - - - - - - - - - - - - - - - - - - - - -A-51
General Outlook of the GAP sensor box - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-53
Gap sensor calibration screens - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-53
Gap Sensor Calibration Step 1 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-54
Gap Sensor Calibration Step 2 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-54
Gap Sensor Calibration Step 3 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-55
Gap Sensor Calibration Step 3 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-55
Portability Factor - EFO Current Offset - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-56
Portability Factors - Loop Height Factor/Offset - - - - - - - - - - - - - - - - - - - - - - -A-57
Portability Factor - Bond Force Offset - - - - - - - - - - - - - - - - - - - - - - - - - - - - -A-58
Portability Factors - USG Personality Values - - - - - - - - - - - - - - - - - - - - - - - -A-58
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
LOF - 5
Maxµm Ultra Ball Bonder
LOF - 6
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
List of Tables
Table 1-1 Tightening Torque Values in in.Ibs. for Common Fasteners - - - - - - - - - - - - - - - - 1-56
Table 2-1 Circuit Board Assemblies, Upper Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-7
Table 2-2 Circuit Board Assemblies, Lower Deck - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-8
Table 2-3 Circuit Board Assemblies, in the system computer - - - - - - - - - - - - - - - - - - - - - - - 2-8
Table 2-4 VME Bridge Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-9
Table 2-5 Illumination Interface Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-10
Table 2-6 I/O and Temperature Controller Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-11
Table 2-7 Stepper/Sensor Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-13
Table 2-8 Circuit Board and Electrical Assembly Information - - - - - - - - - - - - - - - - - - - - - - 2-15
Table 2-9 Acclimation Times for System Computer Stored at Low Temperature - - - - - - - - - 2-27
Table 2-10 Cable list for the System Computer - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-29
Table 2-11 Power Supply DC Outputs - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-39
Table 2-12 Test points and indicators Table - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-40
Table 2-13 Power Supply Fault Table - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-41
Table 2-14 Fuse Specification - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-42
Table 2-15 Cable list for power supply - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 2-46
Table 3-1 Initial Settings for Pneumatic Equipment - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-8
Table 3-2 Pneumatic System Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - 3-9
Table 4-1 Optics and Vision System Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - 4-6
Table 4-2 Vision System Assembly Controls/Indicators - - - - - - - - - - - - - - - - - - - - - - - - - - 4-31
Table 4-3 Vision System Unit Connections - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 4-32
Table 5-1 Bond Head and Related Systems Preventive Maintenance - - - - - - - - - - - - - - - - - - 5-4
Table 5-2 Reticle Division to Gap Conversion - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-11
Table 5-3 EFO Box Assembly, P/N 08002-1120-000-xx - - - - - - - - - - - - - - - - - - - - - - - - - 5-46
Table 5-4 Wire Clamp Driver Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-54
Table 5-5 Ultrasonic Generator Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-56
Table 5-6 Servo CPU (CPU2) Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-64
Table 5-7 Servo Preamp Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-66
Table 5-8 Z Amplifier Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 5-67
Table 6-1 XY Table Preventive Maintenance - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-4
Table 6-2 Servo CPU (CPU2) Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-31
Table 6-3 Servo Preamp Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-33
Table 6-4 X and Y Servo Power Amplifier Board - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 6-35
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
LOT - 1
Maxµm Ultra Ball Bonder
LOT - 2
98868-0000-002-03
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1
Maintenance Guide
1.1
Introduction
1.1.1
Maintenance Manual Contents
The Maxµm Ultra Maintenance Manual (Volume 2 of the Maxµm Ultra
Manual Set) provides maintenance information for the machine as a system and for all major components individually with the exception of the
material handling system, which is covered in another volume. The
Maxµm Ultra Maintenance Manual is divided into six sections, including:
•
Section 1: Maintenance Guide
Includes a general introduction, specifications, Setup, Preventive
Maintenance and Troubleshooting Guides, a list of special tools/fixtures, and a list of recommended spare parts.
•
Section 2: Lower Console With TDI Power Supply
Covers maintenance information for assemblies within or mounted on
the Maxµm Ultra console: control system (card rack assembly and
card rack circuit board assemblies), system computer, operator interface devices, cabling, and power system.
•
Section 3: Upper Console
Provides descriptions and maintenance information for components of
the machine upper console: pneumatic system, wire feed system,
Bond Integrity Test System (BITS), video monitor, logic bulkhead, and
light tower assembly. Preventive maintenance requirements and maintenance procedures are provided along with descriptive information for
these components. The stereo–zoom microscope is also found in this
section.
•
Section 4: Vision System and Optics
The vision system components include the optics assembly, video
cameras, bond site illuminators, and the vision system assembly.
•
Section 5: Bond Head
Covers the bond head assembly and its associated systems: ultrasonics, electronic flame off (EFO), wire clamp, and servo control system. A
short description of the wire feed system can be found in this section;
fuller coverage is provide in Section 3.
•
Section 6: XY Table
Describes and provides maintenance information for the XY table and
its servo control system.
Two appendixes are at the end of this manual. Appendix A provides procedures for machine calibrations and a general sequence for MHS calibration. (MHS calibrations procedures can be found in Volume 3 of the
Maxµm Ultra manual set.) Appendix B defines terms and abbreviations
used in this manual that may not be familiar to the reader.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-1
Maxµm Ultra Ball Bonder
1.2
Maxµm Ultra Publications
The Maxµm Ultra Manual Set presently consists of eight volumes. In addition to this volume (described in the previous paragraph) seven other publications are shipped with the machine:
•
Volume 1: Maxµm Ultra Operations Manual
Covers machine operation, programming, and use of the many
machine software functions.
•
Volume 3: Maxµm Ultra Model Material Handling System Manual
Covers the setup, operation, programming, and maintenance of the
Model Material Handling System (MHS) currently used.
•
Volume 4: Maxµm Ultra Illustrated Parts Book
Contains illustrated parts lists for machine assemblies, which can be
used to identify machine parts and assemblies. In addition, it also provides a recommended spare parts list, field–replaceable units (FRU)
list, and lists of special tools and materials required for maintenance.
•
Maxµm Ultra Operations Handbook
Provides operating, maintenance, and troubleshooting information
useful to machine operators. Printed on clean–room paper in a smaller
format than the other manuals, it is for use at a machine in the production area.
•
Maxµm Ultra Electrical Documents Book
Contains electrical schematic diagrams, circuit board assembly drawings, wiring diagrams, and other information useful when troubleshooting and repairing electrical problems within the machine.
•
Maxµm Ultra Installation Guide
Identifies machine operating site requirements and provides procedures for unpacking, machine installation, and power–up tests. Also
includes instructions for repacking a Maxµm Ultra machine for reshipment.
1.3
Equipment Description
1.3.1
General
The K&S Maxµm Ultra Gold Ball Bonding Platform (Figure 1-1) was
designed to make gold wire interconnections on semiconductor integrated
circuit (IC) devices. The machine makes wire connections by means of a
thermosonic ball bonding process that uses heat, force, and ultrasonic
energy to fuse each end of the wire to the device.
The term ‘ball bonding’ refers to the process whereby the leading edge of
each wire (i.e., the first bond) is melted to form a ball prior to bonding.
The machine features an integrated vision system that includes a pattern
recognition system (PRS) and video lead locator (VLL) system. It also has
a configurable automatic material handling system (CMHS), with magazine handling subsystems that can be configured for magazine loading
and unloading from the front, top, or back of the machine. Refer to Volume
3: Maxµm Ultra Material Handling System for more information.
1-2
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
Signal Tower
(See Section 3)
LCD Monitor
(See Sections 3 and 4)
Microscope
(See Section 3)
Upper Console
(See Section 3)
Optics Assembly
(behind microscope)
(See Section 4)
MHS Input
Magazine Handler
(See Volume 3)
MHS Output
Magazine Handler
(See Volume 3)
XY Table
(See Section 6)
Bond Head
(behind microscope)
(See Section 5)
MMI
(See Section 2)
MHS Workholder
(behind cover)
(See Volume 3)
Lower Console
(See Section 2)
Power Control
(See Section 2)
Figure 1-1 Maxµm Ultra Automatic Ball Bonder, Major Assemblies
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-3
Maxµm Ultra Ball Bonder
1.3.2
XY Table/Bond Head
The XY table consists of sliders, mechanical couplings, and drive systems
mounted on a large casting. Individual linear servomotors are responsible
for “X” (left–right) and “Y” (front–back) motions.
The bond head is a motor driven mechanism that raises and lowers the
capillary (bond tool) in the Z direction. It applies force and ultrasonic
energy to bonds, working with the wire clamp to break the wire free at second bond, and forms a ball through the firing of the EFO on the wire prior
to first bond. The XY table assembly positions the bond head assembly
over the work in the X and Y direction.
1.3.3
Material Handling System
The Material Handling System is supported by its own manual. Refer to
Volume 3: Maxµm Ultra Material Handling System.
1.3.4
Lower and Upper Consoles
The lower console of the bonder contains power supply and distribution
systems, PC boards for the bonder and vision system, cabling, air pressure input filter, disk drives, and cooling system. The upper console supports the video monitor, video camera control box, and signal light tower. It
contains wire feed equipment, a wire feed/BITS circuit board, pneumatic
equipment, and the EFO electronics.
•
Lower Console
All Maxµm Ultra operations are controlled by an electronic control system housed within the lower console. This control system has a two–
level card rack assembly that contains circuit board assemblies of two
basic types. A monolithic backplane board assembly mounted at the
rear of the card rack assembly interconnects the circuit boards and
provides electrical connections to external devices: motors, solenoid
valves, interface circuit boards, etc.
The power system consists of a power cord, power supply assembly,
and cabling that connects the power supply outputs to alternating current (AC) or direct current (DC) powered electrical devices. All AC–to–
DC power conversion takes place within the power supply assembly.
The Z temperature controller (ZTC), mounted atop the power supply,
performs AC–to–AC conversion needed for ZTC operation. There are
no other power transformers or additional power supplies in the
machine, although there are some DC–to–DC converters mounted on
circuit boards where a DC voltage is required that is not available
directly from the power supply.
The TDI power supply has an auxiliary power supply module that supplies the vision system unit and ZTC. A system computer that contains
all of the software for machine operation, device programming and
bonding is mounted in the lower console. In addition, a USB PORT are
provided to back up bond programs, load operating software, or operate the bonder. The hard disk drive in the system computer is used primarily for storage of process programs and machine operating
software. The floppy drive records process programs, enables transfer
of process programs between machines, and allows loading of operating software upgrades.
Many electrical cables are present within the lower console. Cable
maintenance is limited to identification and replacement of defective
cables.
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Section 1: Maintenance Guide
•
Upper Console
The bonder uses a 2″ (51 mm) diameter wire spool that is mounted on
the front face of the upper console. A motor turns the spool to feed
wire as needed. Wire feed is controlled by an optical sensor, which
maintains a constant length of wire between the spool and the capillary. When the gold wire moves away from in front of the optical sensor, motor operation is enabled. The motor is disabled when the wire
triggers the sensor or after a minimum duration feed. Controls are also
provided to feed wire manually for maintenance tasks.
The pneumatic system components mounted in the upper console regulate and control application of compressed air and vacuum used in
the wire feed system. Compressed air is also routed to a solenoid
valve assembly at the MHS and to a vacuum pump that creates vacuum to secure leadframe die paddles at the workholder heat block.
Pressure is used in the MHS to maintain gripping force on leadframes
during indexing operations. Other uses of compressed air include X, Y,
and Z axes servomotor cooling, stabilization of the bond site video
image during PRS eye point find operations, and cooling of bond head
components to limit bond location drift during bonding operations.
Other assemblies enclosed within the upper console are the Wire
Feed/Bond Integrity Test System (BITS) circuit board, which operates
the wire feed system and detects non–stick bonds and the EFO electronics that create a high–voltage charge at the bond head EFO wand
for ball formation.
A microscope with zoom capability is provided for general–purpose
inspection of the device. This unit is designed for easy removal when
not in use.
1.3.5
User Interface
User interface components mounted on the lower console include the
Man Machine Interface (MMI) assembly and power control. The MMI
assembly consists of a membrane keypad, a three–button mouse pointing
device and a compartmented tool drawer. The main power control is
located at the right–front of the lower console.
The machine software communicates with the operator through a graphical user interface (GUI) displayed on the screen of the video monitor. The
GUI has virtual keys that can be selected to perform machine functions
and gain access to programming, operation, and configuration menus.
Two “windows” in the GUI show live bond site video and a graphical representation of the current process program. Other information is constantly
displayed for the operator’s convenience (MHS heater temperatures, X, Y,
and Z axes positions, operating prompts, etc.) For a complete description
of the GUI and instructions for use of its many functions, refer to
Volume 1: Maxµm Ultra Operations. Other indicators include the signal
light tower and audible alarm (also mounted on the upper console) that
inform the operator of machine status (normal operation, material requirement, or error condition) during production operations.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-5
Maxµm Ultra Ball Bonder
1.3.6
Optics & Vision System
The electronic optical system used on the Maxµm Ultra includes a dual–
magnification optics assembly (objective lens and mirror systems) on
which is mounted two progressive scan video camera heads and bond
site illuminators. All are mounted on the front Y slide above the bond
head. The electronic crosshair in the video window of the GUI display corresponds to the position of the capillary over the device during bonding
operations. Some optical parameters (lighting, etc.) are software–adjustable.
A camera control box is mounted on top of the upper console beneath the
video monitor. The two camera heads are connected to the control box.
The control box sends composite video to the vision system for image
processing and monitor display.
The matrox vision system assembly is a self–contained computer that
communicates with the bonder control system through a local area network (LAN) interface. It is an independent image processing system that
allows the bonder to operate without user attention by automatically finding device reference points (”eye points”) before each device is bonded.
The bonder can compensate for variations in die position from package to
package based on the location of the found reference points. The Video
Lead Locator (VLL), a subsystem of the vision system, operates in a similar manner. It finds the exact taught location of bond positions on the outer
leads of each device to ensure accurate second bond placement.
The VLL maintains information about each taught lead, which includes the
position, angle, width, and illumination levels. When running in Auto
Mode, the VLL will locate the leads as part of the package alignment process and will return any lead displacements to the bonder to ensure correct bond placement.
The vision system takes its video image directly from the camera control
box. This makes it easier to adjust lighting for optimum effect. Images are
stored, processed, and analyzed by a dedicated processor and memory
system which is part of the vision system. Other machine functions performed by the vision system include generating monitor graphics and displays, controlling the LED bond site illuminators, and providing an
interface for the MMI. Video output of the vision system, which includes
color graphics displays and live bond site video, is displayed on a liquid
crystal display (LCD) monitor mounted at the top of the upper console
assembly.
1.3.7
Software
The software is organized by “modes”, with related or interdependent procedures grouped together within each mode. Software is menu–driven
with options displayed on the video monitor. Mode menus may have up to
three levels.
English language messages and prompts on the monitor are used to
inform the operator of machine status or request entry of needed information. The keyboard and three–button mouse are used to respond when
appropriate. The monitor will also display error messages in the event of a
system error.
Refer to Volume 1: Operations for detailed information about the machine
software.
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Section 1: Maintenance Guide
1.3.8
1.3.8.1
Specifications
Facility Requirements
•
Electrical Requirement for TDI Power Supply
Line Voltage: The power supply does not need to be configured to
comply with the facility AC line voltage as long as the facility AC line
voltage is within the range of 200 VAC to 240 VAC. Facility input voltage frequency differences are also handled automatically.
Input Rush Current (estimated):
•
100 A for 10 msec
•
75 A for 100 msec
•
42 A for 300 msec
CAUTION: Applying power to the machine that is below the specified
voltage range may damage machine equipment. Do not connect the machine to facility power unless the facility power is
within the range of 200 VAC to 240 VAC. If the facility power is
below this range, a step-up transformer is required (see
NOTE below).
NOTE: If the customer’s facility input voltage is within the range of 100 VAC to
120 VAC, a step-up transformer is required to raise the input voltage to
the required 200 to 240 VAC range. The step-up transformer is installed
between the Maxµm Ultra bonder power supply and the facility input voltage. Contact your local K&S sales representative for more information
about this feature.
•
Power Consumption: 2.0 kVA (nominal)
•
Compressed Air
Minimum Pressure: 50 psi (3.5 kg/cm2)
Air Consumption (flow rate): ≤6.5 SCFM @ 65 psi (≤185 liters/min. @ 4.6
kg/cm2)
Filtration: 0.3 µm
Dew point: 41°F @ 65 psi (5°C @ 4.6 kg/cm2)
1.3.8.2
Operating Environment
•
Temperature
59° - 86°F (15° - 30°C)
•
Atmospheric Pressure
21.2 - 31.9 in. Hg (540 - 810 mm Hg)
•
Relative Humidity
30 - 70% RH (non–condensing)
1.3.8.3
Material Handling Capability
•
Leadframe Dimensions
•
Length: 3.5 to 10.5 in. (90 to 267 mm)
•
Width: 0.60 to 3.2 in. (15.2 to 81.3 mm)
•
Thickness: 0.004 to 0.035 in. (0.10 to 0.89 mm)
•
Die Pad Down–Set: Up to 0.090 in. (2.3 mm)
•
Die Site Pitch: 0.1 to 3.5 in. (2.5 to 90 mm)
•
Lead Pitch (minimum): 0.0026 in. (66 µm) with 1 mil (25 µm) wire
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-7
Maxµm Ultra Ball Bonder
•
•
1.3.8.4
•
Lead Width (minimum): 0.0016 in. (40 µm) with 1 mil (25 µm) wire
•
Minimum Lead Spacing: 1 mil (25 µm)
Magazine Dimensions
•
Width: 0.8 to 3.75 in. (20 to 95.3 mm)
•
Length: 5.00 to 10.75 in. (127 to 273 mm)
•
Height: 2.0 to 7.0 in. (50 to 178 mm)
•
Slot Pitch: 0.05 to 1 inch (1.27 to 25 mm)
•
Maximum Weight (loaded): 10 pounds (4.5 kilograms)
Die Characteristics
•
Minimum Die Size: 0.010 in. (0.25 mm) square
•
Maximum Rotation: ±5 Degrees @ default box size of 0.020 x 0.020
in. (0.5 mm x 0.5 mm)
•
Maximum Tilt: ±0.0024 in. (60 µm) corner–to–corner
Wire Bonding Capability
•
Bonding Area
2.2 in. x 2.6 in. (56 mm x 66 mm) - for leadframe widths up to 3.2 in.
(81.3 mm). For leadframes greater than 3.2 in. (81.3 mm), the bondable area will be reduced in the Y direction to 2.3 in. (58.4 mm).
•
Bond Height Differential
0.9 mm (35 mils) maximum offset between first bond and second bond
with 2X and 6X focus at respective bond plane.
•
Wire Capacity
3000 wires per process program, standard; 10,000 wires, optional
•
Wire Diameter
0.6 mil (15 µm) to 1.3 mils (33 µm), standard
•
Eyepoint Capacity
300 Pattern Recognition System (PRS) eyepoints per process program
NOTE: Some loop shape options are added–cost premium features, and are
not included in the standard machine software version. Premium looping
features must be added at the factory before machine shipment. Contact any K&S Sales and Service representative for more information.
•
•
1-8
Loop Shape Options - Standard Software Version
•
LF2: Standard Loop
•
LF2: Worked Loop
•
BGA2 Loop
•
BGA2 Worked Loop
Loop Shape Options - Added–Cost Premium Features
•
Chip Scale Package Loop
•
Spider–Loop
•
Security Bond
•
J–wire Loop
•
Stand–Off Stitch
•
BGA3 Low–Loop (M–Loop, LDLP, Low–Loop)
•
BGA4 CD Loop (SBGA, CDBGA, Tail Kink)
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
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Section 1: Maintenance Guide
•
Maximum Wire Length
0.300 in. (7.6 mm) for standard/low loop (other loop shape options may
increase/decrease maximum wire length)
•
•
•
•
Programmable Bond Force
•
Minimum: 5 grams
•
Maximum: 300 grams (subject to maximum power limit)
•
Resolution: 1 gram
•
Accuracy: ±10% @ 5 to 50 g, ±5 g @ 50 to 300 g
•
Programmability: Operator programmable on a per bond basis
Programmable Bond Time
•
Minimum: 1 millisecond (msec)
•
Maximum: 2000 msec (subject to maximum bond power limit)
•
Accuracy: +1, -0 msec
•
Resolution: 1 msec
•
Programmability: Operator programmable on a per bond basis
Pre/Post Bond Ultrasonics Delay
•
Maximum: 30 msec
•
Accuracy: +1, -0 msec
•
Resolution: 1 msec
•
Programmability: Operator programmable on a per bond basis. Delay
can be inserted either before or after ultrasonic bond time.
Temperature Control (Pre Heat/Bond Site/Post Heat/ZTC)
Temperature control is required for the three (3) indexer zones (pre
heat, bond site, and post heat) and for thermal management (ZTC) of
the bond head and optics assemblies.
•
•
Minimum (Pre Heat/Bond Site/Post Heat/ZTC): Ambient Temperature
•
Maximum (Pre Heat/Bond Site): 300° C
•
Maximum (Post Heat): 200° C
•
Resolution: 1° C
•
Variability: ±5° C about set point temperature (display versus bond
site heat block)
•
Variability: ±10° C about set point temperature (display versus pre
heat/post heat blocks)
Total Bond Placement Error
First bond: ±2.5 µm, 3σ (includes machine accuracy, repeatability and
real–time thermal drift compensation)
Second bond: ±9.0 µm, 3σ (includes machine accuracy and repeatability, VLL accuracy and repeatability and real–time thermal drift compensation)
•
Ball Size Control (programmable target settings for unbonded balls)
•
Minimum: 1.4 times wire diameter
•
Maximum: 3.0 times wire diameter
•
Resolution of Programmable Setting: 0.1 wire diameter
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-9
Maxµm Ultra Ball Bonder
•
Repeatability about Target Setting: ±5.0 µm (±0.2 mils) @ 3σ
NOTE: These values assume standard capillary design.
•
•
Ball Squash Diameter Control
•
Minimum Average: 32 µm (1.26 mils)
•
Variability about Target Setting for >50 mm: ±6% @ 3σ
•
Variability about Target Setting for 50 mm: ±10% @ 3σ
Ball Squash Height Control
•
Minimum: 5.0 µm (0.2 mils)
•
Maximum: 30.0 µm (1.2 mils)
•
Offset from Nominal: ±15% @ 3σ
NOTE: Ball squash height is measured from the bond pad to the tool mark on
the ball.
1.3.8.5
Dimensions and Weight
•
•
1.4
Machine Dimensions (approximate, with front load magazine handlers)
•
Width: 42 in. (1067 mm)
•
Depth: 35 in. (889 mm)
•
Height: 70.75 in. (1797 mm) to top of monitor
Weight (estimated)
•
Machine: 1310 lb. (595 kg)
•
Machine and Shipping Crate: 1750 lb. (795 kg)
Safety Considerations
The Maxµm Ultra has been designed and manufactured to operate safely.
However, as with any production machine, certain specific warnings
(paragraph 1.4.1 below) and general safety precautions (paragraph
1.4.1.1) should always be observed. Other WARNINGS and CAUTIONS
have been added where appropriate throughout the text of this manual
and in the other volumes of the Maxµm Ultra manual set.
All users should read the Maxµm Ultra Safety Supplement before attempting to use the machine. The Safety Supplement is shipped as part of the
Maxµm Ultra manual set. If it is missing or has been misplaced, a replacement can be ordered directly from K&S spares in Willow Grove.
1.4.1
Warnings
WARNING: ELECTRICAL SHOCK HAZARD! DO NOT TOUCH THE ELECTRONIC
FLAME–OFF (EFO) WAND OR THE GOLD WIRE DURING OPERATION
OR WHEN MANUALLY FIRING THE EFO. THE SYSTEM PRODUCES A
SPARK BETWEEN THE EFO WAND AND WIRE WHICH CAN CAUSE
AN ELECTRICAL SHOCK IF CONTACTED DURING EFO FIRING. THE
POTENTIAL SHOCK HAZARD IS NOT USUALLY CONSIDERED LIFE
THREATENING (AS DESCRIBED IN IEC PUBLICATION NO. 479),
HOWEVER, K&S RECOMMENDS THAT PERSONS WITH ABNORMAL
HEART CONDITIONS OR ARTIFICIAL HEART STIMULATION
DEVICES (E.G. PACEMAKERS) SHOULD NOT BE PERMITTED TO
OPERATE OR SERVICE THE EQUIPMENT.
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Section 1: Maintenance Guide
WARNING: HIGH VOLTAGE! THE EFO PRODUCES UP TO 4.5 KV ON VARIOUS
PARTS INSIDE OF THE EFO CONTROL BOX AND ON THE HIGH–
VOLTAGE CABLE. DO NOT OPEN THE EFO BOX. IF IT BECOMES
NECESSARY TO HANDLE THE HIGH–VOLTAGE CABLE OR REMOVE
THE BOX, UNPLUG THE EFO BOX POWER CABLE AND WAIT AT
LEAST FIVE (5) MINUTES. USE HIGH–VOLTAGE TECHNIQUES AND
PRECAUTIONS AT ALL TIMES WHEN HANDLING THIS UNIT.
WARNING: ELECTROMAGNETIC FIELDS! SERVOMOTORS USED TO POSITION
THE BOND HEAD AND OPTICS GENERATE STRONG MAGNETIC
FIELDS. HEART STIMULATION DEVICES (E.G. PACEMAKERS) MAY
BE ADVERSELY AFFECTED DURING BOND HEAD POSITIONING.
THEREFORE, PERSONS USING SUCH DEVICES SHOULD NOT BE
NEAR THE EQUIPMENT WHILE IT IS IN OPERATION.
WARNING: ELECTRICAL SHOCK HAZARD! DO NOT TOUCH THE CLAMP
ASSEMBLY WHEN MACHINE POWER IS ON! THE CLAMP IS OPERATED BY AN ELECTRICAL POTENTIAL OF UP TO 400 VOLTS DC,
WHICH CAN CAUSE AN ELECTRICAL SHOCK IF CONTACTED. THE
POTENTIAL SHOCK HAZARD IS NOT CONSIDERED LIFE THREATENING.
WARNING: CLASS II LASER HAZARD! THE BOND HEAD Z–AXIS ENCODER HAS
A CLASS II LASER. WHILE THE ENCODER SENSOR HEAD IS
MOUNTED ON THE BOND HEAD, THE LASER IS NO DANGER TO THE
USER OR MAINTENANCE TECHNICIAN. HOWEVER, WHEN THE SENSOR HEAD IS REMOVED AND MACHINE POWER IS ON, THE LASER
LIGHT CAN CAUSE EYE DAMAGE IF VIEWED DIRECTLY ON AXIS.
ALWAYS TURN OFF MACHINE POWER BEFORE REMOVING THE
ENCODER SENSOR HEAD FROM THE BOND HEAD.
WARNING: HAZARDOUS MATERIAL! THE BOND HEAD LINK IS MADE FROM A
BERYLLIUM ALLOY THAT SHOULD BE CONSIDERED A POTENTIAL
CARCINOGEN. HAZARDOUS DUST IS PRODUCED WHEN THIS
MATERIAL IS MACHINED, FILED, OR GROUND. DO NOT MACHINE
OR OTHERWISE ATTEMPT TO REWORK THE BOND HEAD. USE
CARE NOT TO GOUGE THE LINK WHEN WORKING AROUND THE
BOND HEAD WITH SHARP TOOLS AS THIS MAY PRODUCE CHIPS
OR SPLINTERS THAT CAN PENETRATE SKIN. A MATERIAL SAFETY
DATA SHEET THAT PROVIDES MORE INFORMATION CONCERNING
BERYLLIUM AND ITS SAFE HANDLING IS AVAILABLE FROM K&S
UPON REQUEST.
1.4.1.1
General Safety Precautions
The following general safety precautions should always be observed
whenever operating, adjusting, or servicing this equipment:
•
Read all of the Maxµm Ultra Safety Supplement supplied with the
Maxµm Ultra Manual Set before attempting to operate the machine.
•
Be sure to observe all WARNINGS and CAUTIONS contained within
the manuals of the Maxµm Ultra Manual Set.
•
Be sure to comply with all approved and established safety precautions while working around powered machinery.
•
Components of the workholder are VERY HOT! Do not allow fingers,
or any material with a low melting point to contact heated areas.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-11
Maxµm Ultra Ball Bonder
1.5
•
Hands or tools should NEVER be placed in the material handling system area or near other moving parts when the system is operating.
Press [motor stop] key before putting hands near powered components.
•
Always operate equipment with covers installed.
•
Standard precautions concerning live electrical circuits should be taken
at all times when adjusting or servicing equipment.
•
Be sure to observe manufacturer’s safety precautions and disposal
procedures when handling chemical substances. Refer to the Manufacturer’s Safety Data Sheet (MSDS) for guidance.
Machine Installation
Refer to the Maxµm Ultra Installation Guide for site preparation, unpacking, machine installation, and power–up test procedures. If it is ever necessary to ship the machine to another location, use the machine
repacking instructions in the guide.
1.6
Setup Guides
Two setup guides are provided in the paragraphs that follow. The first
guide, Simple Setup (paragraph 1.6.1) should be followed when preparing
a machine that has previously been in use for production. It specifies the
actions required to apply power to the machine, check whether the
machine is ready to operate, and prepare the machine for a production
run. Where necessary, explanatory notes and references to other information in the Maxµm Ultra Manual Set are supplied.
The Detailed Setup Guide (paragraph 1.6.2) specifies actions required to
prepare a newly–installed machine for operation. The guide is organized
by machine subsystem, and lists all of the operations required to prepare
each subsystem, tools and materials needed to complete each operation,
a specification (where required), and explanatory notes/references.
1.6.1
Simple Setup
Action
1. Pre–Operation check
Notes
References
A. Make sure that the power cord is connected to the
facility receptacle.
B. Check compressed air pipe connection at right side
(viewed from front) of the lower console.
C. Verify that facility air pressure is at least 65 psi and
less than 80 psi.
D. Make sure EMERGENCY STOP mushroom switch
is in the OUT position.
E. Make sure there is no material in the workholder
and there are no magazines on the magazine handlers.
Action
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Notes
References
Section 1: Maintenance Guide
2. Apply power to the
machine
A. Press the POWER ON (green button) switch to
start the machine. When messages appear on the
monitor screen (dialog boxes), select OK with the
cursor to continue initialization.
Volume 1
B. Verify that the initialization process is completed
successfully. If not, machine may require service.
C. Machine calibration data (machine dependent
parameters or MDPs) is loaded from the system
computer during initialization. If the display indicates that calibration data could not be loaded, calibrate the machine. Refer to Volume 1: Maxµm
Ultra Operations for calibration procedures.
3. Load or teach process
program.
Volume 1
A. If there is an existing process program for the
device stored on the hard disk drive or floppy disk
drive or USB Port thumb drive, load the program
from the source drive accordingly. Edit the program
as needed.
B. If there is no process program stored for the device
to be bonded, teach a process program for the
device.
C. Procedures to load, edit, or teach process programs can be found in Volume 1: Operations.
Volume 3
4. Load material and
A. Load magazines filled with leadframes onto the
check material handling.
input magazine handler load tray (lower of two trays
at front of magazine handler).
B. Load empty magazines onto the output magazine
handler load tray (upper of two trays.)
C. Cycle several leadframes through the material handling system (MHS). Make sure MHS picks up and
positions magazines properly and handles leadframes without damaging them.
Action
Notes
References
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-13
Maxµm Ultra Ball Bonder
5. Install capillary
(if required).
A. Use the capillary change software tool. It can be
selected in the graphical user interface (GUI) display with the screen cursor.
B. If the software tool is used, the monitor screen will
prompt the user to remove the old capillary (if
present), insert and bench the new capillary, then
tighten the clamp screw to the specified torque
value.
Paragraph 1.8.1
Volume 1,
Section 4
Appendix A
C. After the new capillary is installed, perform an ultrasonic generator (USG) calibration. See Volume 1 or
Appendix A of this volume for instructions.
D. The crosshair offset value must be updated. Follow
the instructions on the monitor screen or select
crosshair offset from calibration menu. (See Volume 1 or Appendix A of this volume for instructions.)
E. Check capillary relationship to EFO wand by performing the EFO Wand Height Calibration. See Volume 1 or Appendix A of this volume for instructions
F. Teach bond height by selecting the Bnd Ht Relrn
tool on the GUI tool bar.
6. Load wire (if required).
A. Make sure wire unreels from spool in the direction
set in software (clockwise or counterclockwise).
Paragraph
1.8.2
B. Thread wire through wire feed, tensioner, wire
clamps, and capillary as shown in Figure 1-4.
C. Bond off excess wire when done
7. Perform test bonding.
1-14
Bond several devices and verify that machine is oper- Volume 1
ating properly. See Volume 1 for operating procedures.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
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Section 1: Maintenance Guide
1.6.2
Detailed Setup
Item
Action
Tools
Specification
Notes/Ref.
1. All shipping materials removed.
2. Shipping bracket
removed (right–side
of bond head.)
3. Machine connected to power and
air pressure.
4. Power–up tests
completed.
Refer to
Maxµm Ultra
Installation
Guide.
Machine unpacking
and installation
Verify that all machine None
unpacking and installation procedures were
competed.
Power Supply
DC Outputs
Connect machine to
facility power. Verify
that each DC output is
within specification.
Multimeter
See table in Section
2
Power supply must be
replaced if an
output is out
of specification.
See Section
2.
Optics/Vision
System
1. Microscope
Adjust scope mount
Hex wrench
Field of view centered on bond area
at limits of zoom.
See Section
3.
Adjust focus
None
Image clear and
sharp at maximum
zoom.
See Section
3.
None
Graphics clear and
sharp on monitor
screen.
See Section
4.
Verify that all LEDs are None
on (lit).
All oblique LEDs on
and equally bright.
Replace Illuminator flex
cable if any
LED is off
(dark).
See Section
4.
Check uniformity.
Adjust as needed.
Light uniformly distributed across
device.
View device
on monitor.
Adjust
oblique
brightness as
needed.
2. Video Monitor Adjust picture
3. Oblique Illuminator
None
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-15
Maxµm Ultra Ball Bonder
Item
Action
4. Vertical and
High Angle
(option) Illuminators
5. Optics
6. Diffuser
1-16
Tools
Specification
Notes/Ref.
Verify that all vertical
None
and high angle (option)
LEDs are on (lit).
All LEDs on (lit).
Replace Illuminator flex
cable if any
LED is off
(dark).
See Section
4.
Check uniformity.
Adjust as needed.
Hex driver for
socket of M1.5
screw
Light centered on
device.
View device
on monitor.
Adjust illuminator jacking
screws and
vertical and
high angle
(option)
brightness as
needed.
See Section
4.
Check magnification.
Adjust if necessary.
Hex driver set
Pixels to Pulse
ratios:
Low Magnification
XX= 0.1772 ±.010
YY= 0.1772 ±.010
High Magnification
XX= 0.0591 ±.001
YY= 0.0591 ±.001
Perform PRS
calibration to
calculate
ratios. If XX
or YY values
are not per
specification,
adjust magnification.
See Section
4.
Check camera linearity (rotation). Adjust as
needed.
Hex driver set
Pixels to Pulse
ratios:
Low Magnification
XY= 0.000 ±.003
YX= 0.000 ±.003
High Magnification
XY= 0.0000 ±.001
YX= 0.0000 ±.001
1. Perform
PRS calibration to calculate ratios. If
XY or YX values are not
per specification, adjust
camera rotation.
2. Procedure
must be done
twice, once
for each camera head.)
See Section
4.
Check focus. Adjust as Torque wrench
needed.
Hex wrench set
Clamped device in
good focus on monitor screen.
See Section
4.
Check air pressure
10 - 15 psi (0.7 - 1.0
kg/cm2)
See Section
3.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
None
Section 1: Maintenance Guide
Item
Bond Head
1. Bond Head
Link
2. Wire Clamp
Action
Tools
Specification
Notes/Ref.
Check/adjust capillary
perpendicularity
See transducer
Perpendicularity set– See Section
5.
alignment proce- up gauge sits flat
dure in Section 5. (within 32 Z axis
encoder pulses) on
heat block, front–to–
back and side–to–
side.
Install capillary
Torque wrench,
35 oz. in. (0.25
Nm)
1. Capillary benched
against top of transducer bore.
2. Capillary clamp
screw torque:
• Ceramic - 35 oz.
in. (0.25 Nm).
• Ruby - 20 oz. in.
(0.14 Nm).
1. Use capillary installation software
tool. Also see
paragraph
1.8.1.
2. Crosshair
Offset, USG,
and Wand
Height calibrations must
be done after
capillary
installation.
See Appendix
A.
Verify bond force
BondForce Calibration Weight
Assy
Measured force
required to lift transducer equal to programmed bond
force.
Use bond
force verification procedure that is
part of Bond
Force Calibration.
See Appendix
A.
Check bond plane cali- None
bration.
Clamp is at the
proper height when
the heat block is at
the clamped position.
Use MHS
clamp calibration to establish bond
plane height.
See Appendix
A.
Check/adjust clamp
gap.
Use reticle in microscope eyepiece to
adjust clamp gap.
See Section 5
for procedure.
0.9 mm hex
wrench, P/N
27777-6002-000
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-17
Maxµm Ultra Ball Bonder
Item
Action
Tools
Specification
Notes/Ref.
3. Electronic
flame off
(EFO) wand
Check/adjust wand
position.
Hex wrench set
Torque wrench,
40 oz. in. (0.28
Nm)
Shims:
3 mil (0.07 mm)
4 mil (0.1 mm)
5 mil (0.12 mm)
10 mil (0.25 mm)
1. Wand height
approximately 5 mils
(0.12 mm) above
open MHS
workholder clamp.
2. Gap between the
EFO wand tip and
capillary is less than
5 mils (0.12 mm).
3. Final, more precise, EFO height will
be determined during
EFO Wand Height
calibration.
See Section
5.
EFO Wand
Height Calibration
required after
setup. See
Appendix A.
4. Wire Feed
Mount wire spool and
thread wire
None
Wire unreels in direction (CW or CCW)
set in software. Wire
path per Figure 1-4.
See paragraph 1.8.2.
See Volume 1
to change
spool rotation direction.
5. Wire Tensioner
Set air pressure
None
8 psi (0.56 kg/cm2)
See Section
3.
6. Air Guide
Set air pressure
None
22 psi (1.55 kg/cm2)
See Section
3.
7. Ultrasonic
Generator
(USG)
Calibrate USG
None
1. USG tuned to resonant frequency of
transducer.
2. Ultrasonic system
impedance between
15 to 60 Ohms.
Use USG calibration routine.
See Appendix
A.
None
Servo gains for Z
axis tuned.
Use servo
calibration
routine.
See Appendix
A.
Calibrate XY servos
None
Servo gains tuned
for each axis.
Use servo
calibration
routine.
See Appendix
A.
Set up MHS
workholder and magazine handlers
Hand Tools.
Sample leadframes and magazine.
Set up for material
used in production.
P–parts for specific
device (heat block
insert and clamp
insert) must be on
hand.
See Volume 3
8. Servo system Calibrate Z servo
XY Table
Servo system
Material Handling
System (MHS)
1-18
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1.7
Preventive Maintenance
1.7.1
1.7.1.1
Maintenance Schedule
8–Hour Maintenance
A. Upper Console
1. Clean air guide (non–clean–room environment).
2. Check wire path.
B. Bond Head
1. Check capillary condition.
C. General
1. Inspect and clean bonder.
1.7.1.2
40–Hour Maintenance
A. Perform 8–hour maintenance (paragraph 1.7.1.1).
B. Bond Head
1. Clean wire clamp jewels.
2. Check clamp gap.
1.7.1.3
200–Hour Maintenance
A. Perform 8–hour maintenance (paragraph 1.7.1.1).
B. Perform 40–hour maintenance (paragraph 1.7.1.2).
C. Lower Console
1. Clean MMI and mouse.
D. Bond Head
1. Check EFO wand setup/condition.
E. Upper Console
1. Clean air guide (clean–room environment).
2. Test EMO switch (Emergency Stop) function
1.7.1.4
1000–Hour Maintenance
A. Perform 8–hour maintenance (paragraph 1.7.1.1).
B. Perform 40–hour maintenance (paragraph 1.7.1.2).
C. Perform 200–hour maintenance (paragraph 1.7.1.3).
D. Lower Console
1. Check power supply air filters. Replace filters as needed.
2. Check card rack air filter. Replace filter as needed.
E. General
1. Inspect air/vacuum hoses.
2. Inspect attaching hardware/connectors.
1.7.1.5
3000–Hour Maintenance
A. Perform 8–hour maintenance (paragraph 1.7.1.1).
B. Perform 40–hour maintenance (paragraph 1.7.1.2).
C. Perform 200–hour maintenance (paragraph 1.7.1.3).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-19
Maxµm Ultra Ball Bonder
D. Perform 1000–hour maintenance (paragraph 1.7.1.4).
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© 2007 kulicke & Soffa Industries Inc
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Section 1: Maintenance Guide
E. Lower Console
1. Check power supply DC voltages.
F. Bond Head
1. Check transducer alignment.
2. Check Z encoder signal amplitude.
G. XY Table
1. Clean X and Y motors.
2. Check condition of X and Y motor air hoses.
1.7.1.6
15000–Hour Maintenance
A. Perform 8–hour maintenance (paragraph 1.7.1.1).
B. Perform 40–hour maintenance (paragraph 1.7.1.2).
C. Perform 200–hour maintenance (paragraph 1.7.1.3).
D. Perform 1000–hour maintenance (paragraph 1.7.1.4).
E. Perform 3000–hour maintenance (paragraph 1.7.1.5).
F. XY Table
1. Lubricate X slide and front Y slide bearings.
2. Lubricate rear Y slide bearings.
3. Lubricate rear Y coupling bearing.
4. Check hardware that secures Y axis ground strap.
1.7.1.7
Conditional Maintenance
A. General
1. Inspect external air pressure system - as required.
2. Check input air pressure and inspect input air filter - as required.
B. Upper Console
1. Check for vibration at wire feed - at every wire spool change.
C. Bond Head
1. Check capillary clamp screw condition - at every tenth capillary
replacement. Replace capillary clamp screw at every 60th capillary
replacement.
2. Clean/inspect wire clamp feed tube - at every spool change or after
1000 feet (303 meters) of wire usage.
D. Vision System
1. Clean objective lens - as required.
2. Clean LCD monitor screen - as required.
3. Calibrate PRS - as required.
4. Check optics focus - as required.
5. Check oblique illuminator uniformity - as required.
6. Clean microscope lenses - as required.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-21
Maxµm Ultra Ball Bonder
1.7.2
Preventive Maintenance Guides
1.7.2.1
General & Special Maintenance
Service
Frequency
Tools/Materials
Notes
Inspect/clean bonder.
8 hours
Vacuum cleaner
Lint–free cloth
Remove dust, dirt, and foreign
material.
Inspect air/vacuum
hoses.
1000 hours
None
Inspect for:
Inspect attaching hardware/connectors.
Inspect external air pressure system.
1.7.2.2
1000 hours
As required
Hand tools
None
•
Cracks, cuts, or leaks.
•
Pinching or kinks loose fittings
•
Signs of wear or stretching.
Inspect for:
•
Loose electrical connections
•
Loose/missing attaching
hardware.
Remove dirt/water from air filters.
Check facility pressure. Must be
set to 65 - 80 psi.
Lower Console
Service
Frequency
Tools/Materials
Notes
Clean MMI and mouse.
200 hours
Mild detergent
Soft cloth
Clean MMI top surface and
mouse ball with cloth dampened
in dilute solution of detergent and
water.
Check/replace card rack
air filter. Replace filter as
needed.
1000 hours
Filter, P/N 080881030-009
Flat–blade screwdriver
Large plastic bag
1. Loosen 2 captive screws on filter drawer at top of card rack.
Pull out and check filter.
2. If filter is clogged, seal it in a
large plastic bag and remove it
from the production area.
3. Install a clean filter. Either a
new filter or a previously–used filter that has been cleaned may be
used.
Check DC voltages.
3000 hours
Digital multimeter
Measure at test points on the rear
edge of the power logic circuit
board. If any supply is out of
specification, power supply
needs service. See Section 2.
Small container
Filter Element, P/N
14800-0010-001
1. Check for oil or moisture in filter.
2. Check condition of filter element.
3. Drain filter and/or replace filter
element as needed.
Check system input air fil- As required
ter.
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Section 1: Maintenance Guide
1.7.2.3
Upper Console
Service
Frequency
Tools/Materials
Notes
Clean wire feed air guide. 8 hours (non–
clean room)
200 hours
(clean room)
Soft, lint–free cloth
Isopropyl alcohol
Remove front air guide plate.
Remove accumulated dust with a
cloth moistened in alcohol. Make
sure wire feed sensor hole is
clear.
Test
Emergency Stop
switch function.
200 hours
None
1. With machine power on, place
machine in Standby mode (press
[MOTOR STOP]
.)
2. Press the
EMERGENCY STOP
switch. Verify that machine
power goes off immediately.
3. Try to press the
POWER
On/ Off switch to
ON
position one time. Machine
power should not turn on.
4. Unlatch the
EMERGENCY STOP
switch with key. Power up
machine.
Check system air pressure.
As required
None
Check pressure at gauge
mounted on main air manifold
assembly. Should be set to 55
psi. Adjust input air regulator as
needed. If pressure cannot be set
to 55 psi, check external air system.
Check for wire vibration at Every wire
wire feed.
spool change
None
Adjust air guide pressure to minimize vibration between wire
spool and diverter during wire
feed operations.
Clean wire tensioner
Ultrasonic cleaner
Grain alcohol
Tweezers
Hex wrench
See Section 3 for procedure.
Soft lens tissue
Cotton swab
Mild detergent
1. Wipe with soft lens tissue to
remove dust.
2. Clean lenses gently with detergent solution.
3. Dry lenses with a cotton swab.
Every wire
spool change
Clean microscope lenses. As required
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-23
Maxµm Ultra Ball Bonder
1.7.2.4
Vision System
Service
Frequency
Tools/Materials
Notes
Clean objective lens.
As required
Dust–free blower
Cotton swab
Lens tissue
Neutral soap solution
Grain alcohol
Distilled water
Polyethylene gloves
1. Remove loose dust with
blower.
2. Clean remaining dust from
lens with an alcohol soaked
swab.
3. If any fingerprints, oil spots,
etc. remain, clean lens with
swabs soaked with soap solution,
then distilled water. Repeat step
2.
Clean LCD monitor
screen.
As required
Screen cleaner
1. Shut off monitor power.
2. Clean screen with any effective screen cleaning product.
Check optics focus.
As required
Hex wrench
Torque wrench
Sample device
(clamped at bond
site)
See Section 4 for procedure.
Calibrate PRS.
As required
Sample device
(clamped at bond
site)
Perform calibration routine and
verify that scale factors are correct. If XX or YY is incorrect,
adjust magnification, If XY or YX
is incorrect, adjust camera linearity.
See Appendix A for calibration
procedure. See Section 4 for
optics adjustment procedures.
Check oblique illuminator
uniformity.
As required
None
Set vertical and high angle
(option) light to minimum. Check
video window for uniform contrast
and lack of glare (adjust brightness as needed.)
1-24
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1.7.2.5
Bond Head and Related Components
Service
Inspect
.
Frequency
8 hours
Clean wire clamp jewels. 40 hours
200 hours
Tools/Materials
Notes
None
Check first and second bonds
for crispness and uniformity. If
bonds are not crisp and uniform, replace capillary. See
paragraph 1.8.1. for replacement procedure.
Clean, lint–free
paper
Ethanol (grain alcohol), 98% purity
or better
CAUTION: Use only the specified solvent. Other solvents will
damage the clamp jewels!
3M lapping film 3mm
grain size (261X) cut
to about 1/4” x 3”
long
Clean, lint–free
paper
Ethanol (grain alcohol), 98% purity
or better
CAUTION: Use only the specified solvent. Other solvents will
damage the clamp jewels!
1. Clean jewels with paper
moistened with a few drops of
ethanol.
2. Dry jewels with another piece
of paper.
3. Use
[F8]
key to open/close clamps.
See Section 5 for procedure.
1. Clean jewels with lapping film
moistened with a few drops of
ethanol.
2. Clean jewels with paper
moistened with a few drops of
ethanol.
3. Dry jewels with another piece
of paper.
4. Use
[F8]
key to open/close clamps.
See Section 5 for procedure.
Check/adjust clamp gap. 40 hours
0.9 mm hex wrench, Use reticle in microscope eyeP/N 27777-6002-000 piece to adjust clamp gap.
See Section 5 for procedure.
Check EFO wand setup
and condition.
Hex wrench
Cotton swab
Isopropyl alcohol
Hex wrench set
Torque wrench, 40
oz. in. (0.28 Nm)
Shims:
3–mil (0.07 mm)
4–mil (0.1 mm)
5–mil (0.12 mm)
10–mil (0.25 mm)
200 hours
1. See Section 5 for procedure.
2. Clean any gold/dirt from
wand with swab moistened in
alcohol.
3. Perform Wand Height Calibration after setup. See Appendix A.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-25
Maxµm Ultra Ball Bonder
Service
Check Z encoder signal
amplitude.
Frequency
3000 hours
Tools/Materials
Notes
Hand tools
1. Connect oscilloscope to SIN3
Two–channel oscillo- and COS3 test points on the
scope
Servo Pre Amp Board.
2. Check encoder signal while
moving bond head link vertically. If signal is not between
1.425 to 1.65V with a mean dc
value of 2.5 V, then encoder
should be cleaned.
3. If cleaning does not correct
problem, then encoder head
assembly should be replaced.
See Section 5.
Check transducer alignment.
3000 hours
See Section 5.
See Section 5.
Inspect capillary clamp
screw.
Inspect at every
tenth capillary
change;
replace at every
60th capillary
replacement
Hex wrench
Clamp screw, P/N
70752-0016-010
Torque wrench, 35
oz. in. (0.25 Nm).
1. Remove wire and capillary.
2. Remove capillary clamp
screw. Inspect screw threads.
Replace if damaged.
3. Install capillary and clamp
screw in transducer. Tighten
clamp screw to:
• Ceramic capillary: 35 oz. in.
(0.25 Nm).
• Ruby capillary: 20 oz. in.
(0.14 Nm)
See Section 5.
Hex wrench
Tweezers
Ultrasonic cleaner
Alcohol
Low–pressure compressed air
1. Remove feed tube from wire
clamp and inspect it.
2. Replace feed tube if damaged.
3. If not damaged, clean feed
tube in ultrasonic cleaner and
dry it with compressed air.
4. Mount feed tube on wire
clamp.
See Section 5.
Clean/inspect wire clamp Every wire spool
feed tube.
change or after
1000 ft. (303 m)
of wire usage
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1.7.2.6
XY Table Assembly
Service
Frequency
Tools/Materials
Notes
Clean X and Y servomotors.
3000 hours
Low–pressure compressed air
Vacuum cleaner
Hand tools
Non–ferrous probe
1. Inspect motors for accumulation of dust.
2. If present, carefully remove
dust with compressed air and
vacuum.
3. Check outside of motor housing and inside coil area for small
pieces of hardware. Remove any
that are found.
See Section 6.
Check condition of X and
Y motor air hoses.
3000 hours
Polyurethane tubing, P/N 82719–
3000–000
Check condition of air tubing and
pneumatic connections. Replace
tubing or remake connections as
needed.
Lubricate X slide and front 9000 hours
Y slide bearings.
Lubricant (10 ml. in
syringe), P/N 277905020-000
Lint–free cloth
1. Clean slider gibs of front Y
slide.
2. Apply 0.5 ml. of lubricant and
work slide back–and–forth 5
times to distribute lubricant.
3. Remove excess lubricant.
4. Repeat steps 1, 2, and 3.
5. Repeat procedure to lubricate
X slide.
See Section 6.
Lubricate rear Y slide
bearings.
9000 hours
THK AFC Grease
Grease gun
(THK MG70 or
equivalent)
1. Use only the specified grease
and grease gun.
2. Inject grease into grease fitting
on each of the four bearing
blocks that support the rear Y
slide.
3. Manually move the rear Y slide
to front and back limits several
times to distribute the grease.
See Section 6.
Lubricate rear Y
coupling bearing.
9000 hours
THK AFC Grease
Grease gun
(THK MG70 or
equivalent)
See Section 6.
Check hardware that
secures Y axis ground
strap.
9000 hours
Hand tools
Check Y axis ground strap hardware at rear of the front Y slide
and top of the Y motor. Tighten
loose hardware as needed.
1.7.3
Material Handling System Preventive Maintenance
Refer to Volume 3: Maxµm Ultra MHS for MHS preventive maintenance
schedule and procedures. Both the 3119 workholder and 3419 configurable magazine handling system are covered in Volume 3.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-27
Maxµm Ultra Ball Bonder
1.8
Routine Maintenance Procedures
1.8.1
Replace Capillary
Purpose
•
Replace a worn or damaged capillary.
Tools/ Materials
•
Torque wrench, 35 oz. in. (0.25 Nm)
•
Tweezers
•
Capillary
NOTE: A capillary change software tool is available through two of the GUI pull–
down menus (Manual Mode menu and Bond Head Calibration menu).
Selecting the tool starts a software function that leads the operator
through the capillary change procedure. To change a capillary without
using the software tool, follow the relevant procedure below as written. If
using the software tool, follow screen instructions and use the procedure
below only as a guide.
CAUTION:
If using a Micro–Swiss Sigma capillary, do not touch the capillary
with tweezers or try to remove it from the transducer while the USG
(Function [f7]) is active.
Procedure
A. Park the MHS workholder components by selecting the PARK INDEXER GUI
button. Use the mouse to move the bond head to a location where the
capillary can be easily removed.
B. Check the AIR GUIDE and TENSIONER indicators. If either indicator is lit,
press the push button switch on the MMI.
C. Remove wire from the capillary.
CAUTION: Use care when removing the capillary to avoid damaging
the EFO wand assembly.
D. Loosen the capillary clamp screw to release the capillary (seeFigure 12). Use tweezers to remove the capillary from the transducer.
E. Use tweezers to remove the new capillary from its storage vial. Insert
the capillary into the capillary clamp in the transducer. Move the capillary upward until it benches against the top of the capillary clamp.
F. Use the torque wrench to tighten the capillary clamp screw to 35 oz. in.
(0.25 Nm).
G. Perform an ultrasonic generator (USG) calibration. Refer to Appendix
A for instructions.
H. Teach Crosshair Offset following the procedure in Appendix A.
I. Perform an EFO Wand Height calibration. Refer to Appendix A for
instructions.
J. Select the BND HT RELRN (bond height relearn) GUI toolbar button. The
bonder will lower the capillary to find contact height with the die at the
bond site.
K. Thread bonding wire through the capillary bore. Use the [F8] key to open
the wire clamps. If necessary, turn on the USG by selecting the USG
1-28
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
GUI button (or by pressing its associated function key) to help the wire
pass through the capillary bore.
L. Use the mouse to target a device lead and press [B1] (mouse button 1)
to bond off the excess wire. Tensioner should turn on after this is done.
M. Verify that there is a ball present on the bonding wire below the capillary. If not, use the EFO button on the GUI toolbar to fire the EFO and
form a ball on the wire.
N. If the tool usage limit function is being used, reset the tool usage
counter. Refer to Volume 1: Operations for instructions.
Transducer
Capillary
Clamp Screw
Tighten to 35 Oz.in. (0.25 Nm) for Ceramic Cap
Tighten to 20 Oz.in. (0.14 Nm) for Ruby Cap
NOTE:
Inspect Clamp
clamp screw
10th
capillary
change;
Screwevery
at every
10th
Capillary
Change
replace screw
100th
capillary
Replace
Clampevery
Screw
at every
60thchange.
Capillary replacement
Figure 1-2 Replace Capillary
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-29
Maxµm Ultra Ball Bonder
1.8.2
Replace Wire Spool
Purpose
Replace empty bonding wire spool on wire feed assembly with a full spool
of wire.
Tools/ Materials
•
Tweezers
•
Spool of bonding wire
NOTE: Proper orientation of the wire spool is very important when loading wire
onto the conductive spool holder. The end of the spool where the wire
begins to unreel must be towards the front of the machine and the finishing end (tail end) of the spool must be towards the rear of the machine
so that wire tail can be connected to the spring plunger electrical contact.
Procedure
A. Press the AIR GUIDE and TENSIONER push button on the MMI Keypad. Verify that the indicator LEDs below the buttons are off.
B. Remove the bonding wire from the capillary and tensioner. Check the
tail end of the wire on the spool. If it is in the spring plunger contact,
press the plunger on the contact and remove the wire (see Figure 1-3).
Remove the spool from the spool holder.
Spring Plunger Contact
Wrap Spool End Tail Around Shaft
Leave Minimum Length End
Push
Wire Spool Mount
Spring Plunger Contact
Spring Plunger Contact
Keep Wire Tail Toward
Front of Spool
Wire Spool Mount
Wire Spool
Side View
Figure 1-3 Connect Wire End to Spring Plunger Contact
1-30
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© 2007 kulicke & Soffa Industries Inc
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Section 1: Maintenance Guide
C. Mount a new spool on the spool holder. Make sure that:
1. The side of the spool where the bonding wire begins to reel off of
the spool is toward the front of the machine; the side of the spool
where the end of the wire is taped to the spool flange is toward the
rear of the machine.
2. The spool is turned so that the end of the wire taped to the spool
flange is close to the spring plunger electrical contact on the spool
mount assembly.
3. The wire unreels in the direction (clockwise or counterclockwise)
set in the Miscellaneous dialog box of the Auto Configuration menu.
NOTE: In the next step, make sure the wire tail in the spring plunger contact will
not contact the sheet metal of the upper console, the motor mounting
screws, or the conductive surface of the spool cover. This will interfere
with the Bond Integrity Test System (BITS) signal. Leave a minimal tail
beyond the spring plunger contact and position it as shown in Figure 13.
D. Detach the end of wire taped to the rear flange of the spool. Push in
the spring load plunger of the contact and place the wire end under the
contact point. Release the spring plunger. Make sure the wire end is
toward the spool and can’t contact any exposed metal surfaces on the
machine during spool rotation (See “Side View” in Figure 1-3 and previous NOTE).
WARNING: CAUTION! ELECTRICAL SHOCK HAZARD! DO NOT TOUCH THE
WIRE CLAMP WITH HANDS OR UNINSULATED TOOLS.
E. Inspect the glass feed tube mounted on the wire clamps. Clean it if
necessary. Refer to Section 5 of this volume for procedure.
F. Thread wire through the wire feed as shown in Figure 1-4. Press the
FEED push button on the upper console as needed to pay out wire from
the spool. Press [F8] on the MMI to open or close the clamps when
needed.
G. Press the AIR GUIDE and TENSIONER on the MMI Keypad. Verify that the
indicator LEDs below the buttons are lid.
H. Use the mouse to target a device outer lead. Press [b1] (mouse button
1) to perform a bond off.
I. Verify that there is a ball present on the bonding wire below the capillary. If not, use the EFO button on GUI toolbar to fire the EFO and form
a ball on the wire.
J. Check for wire vibration between air guide and tensioner. If any is
seen, adjust air guide pressure to remove vibration.
K. If the “Wire Usage” software is being used, reset the wire usage statistics by selecting: [4] Configure, [8] Wire Usage, [4] Change Wire Spool.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-31
Maxµm Ultra Ball Bonder
Air Guide Sensor
(hidden)
Air Guide
DIFFUSER
CCW
Rotation
AIR GUIDE
Air Guide Optical
Sensor Preamp
TENSIONER
Air Guide
Adjust
Diffuser
Adjust
Thread assist
Button
Wire
Wire Tensioner
Glass Wire
Feed Tube
Wire Clamps
Transducer
Capillary
Figure 1-4 Wire Spool Replacement
1-32
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1.8.3
Clean Wire Feed Air Guide
Purpose
Remove accumulated dust from wire feed air guide.
Tools/ Materials
•
Soft, lint–free cloth
•
Isopropyl alcohol
Frequency
Every 200 hours of operation (clean–room environment) or every 8 hours
of operation (non–clean–room environment) or more often if dirt build–up
in the guide is causing wire feed problems.
Procedure
A. Press the AIR GUIDE and TENSIONER buttons on the MMI key pad. Verify
that the indicator LEDs are off (dark).
B. Loosen the captive screw in the front air guide plate and remove the
plate (see Figure 3-1).
C. Lightly moisten the cloth in alcohol. Gently wipe the air surfaces of the
front and rear air guide plates. Allow the plates to dry.
D. Remove the sensor cover and check the sensor fiber optic opening in
the sensor plate. Make sure it is clean. Remove built–up dirt if necessary.
E. Lightly moisten the cloth in alcohol. Gently wipe the inner surface of
the sensor cover. Allow the plates to dry.
F. Install the front air guide plate. Tighten the thumbscrews to secure the
plate.
G. Install the sensor cover and tighten the capscrew with washers accordingly.
H. Press the AIR GUIDE and TENSIONER buttons on the MMI keypad. Verify
that the LED indicators light on the keypad.
Sensor Cover & Plate
(Ensure there is no dust on the inside surfaces)
Captive Screw
Front and Rear
air guide surface plates
(Ensure there is no dust on the inside surfaces)
Figure 1-5 Clean Air Guide
1.9
Troubleshooting
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-33
Maxµm Ultra Ball Bonder
1.9.1
Machine Troubleshooting Checklists
Use the following lists as guides for checking machine assemblies and
subsystems for possible causes of bonding problems.
1.9.1.1
Vision System/Optics
Check:
‰ Magnification
Use PRS Calibration to check. XX and YY scale factors should be
within tolerance given in calibration procedure. If not, adjust optics
magnification to bring scale factors within tolerance. See Appendix A
for PRS Calibration procedure. See Section 4 for magnification adjustment procedure.
‰ Linearity
Use PRS Calibration to check. XY and YX scale factors should be
within tolerance given in calibration procedure. If not, rotate the video
camera head to bring scale factors within tolerance. This must be done
twice, once for each camera head. See Appendix A for PRS Calibration procedure. See Section 4 for camera linearity adjustment procedure.
‰ PRS Scale Factors
Run PRS Calibration. Make sure scale factors are within tolerance
given in calibration procedure. If not, adjust optics magnification and
linearity. See Appendix A for PRS Calibration procedure. See Section
4 for optics adjustment procedures.
‰ “Noise” in video window
Check video cable connections at video camera control box and vision
system assembly. Check continuity of video cable conductors/shield
and replace cable if any defect is found. Check monitor extension
cable connections at vision system faceplate and at monitor signal
cable. Check continuity of monitor extension cable conductors/shield
and replace cable if any defect is found.
‰ Contrast in video window
Adjust monitor controls as needed. (See illustration in Section 4.) If a
low–contrast problem cannot be corrected at the monitor, check the
objective lens on the optics assembly. Clean lens if dirty. Refer to Section 4 for procedure.
‰ Even lighting across video window
Increase vertical, oblique, and high angle (option) illumination as
needed. If lighting is still not sufficient, check that all LEDs are lit. If any
LEDs are off while others are on, replace the illuminator flex cable. If
all LEDs are off, check illuminator flex cable connection at bond head
interconnect board. If connection is good, check I/O & temperature
controller board. See Section 4 for illuminator flex cable replacement.
See Section 2 for information concerning the I/O & temperature controller board.
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Section 1: Maintenance Guide
‰ Bond site illumination
If there is no bond site illumination, first verify that illuminator settings
are correct. If they are, check the illuminator cabling continuity for both
vertical and oblique illuminator. If there is continuity, check all LEDs
with a multimeter with diode test dunction. If all LEDs are functioning,
check the cable (P/N 08088-2005-000-xx) contiuity. If it is in good condition, change the temporary I/O board (P/N 08001-4192-000-xx).
‰ Spots in video window
Remove both video camera heads and blow dust off of the charge–
coupled device (CCD) sensor within the camera heads using low–
pressure compressed air.
‰ Rejection of eyepoints
Change bond site illumination and/or increase diffuser air pressure. Try
eyepoint find again. Continue to adjust diffuser pressure and illumination until eyepoint find is successful.
‰ Optics housing secure
Check mounting screws at right–side and left–side of optics housing. If
all screws are loose, perform the optics alignment procedure in Section 4. Tighten all mounting screws to 20 in. lb. (2.26 Nm) when done.
Make sure to bias the optics housing to the rear while tightening the
screws.
‰ Objective lens tube clamp tight
Make sure clamp that secures objective lens is tight. If not, check/
adjust focus (see Section 4 for procedure), then tighten the objective
lens clamp screws to 35 oz. in. (0.25 Nm).
‰ Objective lens is not damaged
Check lens. Replace lens if it is damaged. See Section 4.
‰ Relay lens tight
Check screws that secure the two relay lenses. If loose, run PRS calibration to check magnification and adjust if necessary. Tighten screws
when done. See Appendix A for PRS calibration procedure. See Section 4 for magnification adjustment procedure.
1.9.1.2
Bond Head
Check:
‰ No EFO wand interference with workholder clamp up.
Wand should be 5 mils (0.12 mm) above an open MHS workholder
clamp. If not, adjust height of wand, then perform EFO wand height
calibration. Refer to Section 5 for EFO wand setup procedure. See
Appendix A for EFO Wand Height Calibration procedure.
‰ EFO wand not contacting the capillary
Wand must not contact the capillary shaft. If necessary, use the EFO X
and Y adjustment screws to adjust EFO wand position. Refer to Section 5 for EFO wand setup procedure.
‰ EFO wand height correctly calibrated
EFO wand is 260 to 280 mils (0.66 to 0.71 mm) above the bond plane.
If not, perform EFO wand height calibration. Refer to Appendix A.
‰ EFO wand not damaged, dirty, or bent
Clean EFO wand if it appears dirty. Wand must be replaced if it is bent
or otherwise damaged. Refer to Section 5 for procedures.
‰ Locking screw on EFO assembly secure
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-35
Maxµm Ultra Ball Bonder
There is a locking screw on the left side of the EFO wand to prevent
the wand from losing its adjustment in the Y axis. Make sure it is tight.
See EFO wand illustration in Section 5.
‰ Clamp gap correct
Check clamp gap and adjust if necessary. Refer to Section 5 for procedure.
‰ Clamp jewels not dirty or damaged
Clean jewels if the clamp damages wire during operation, if false
NSOL or NSOP errors are frequently reported, or if there are frequent
SHTL errors. Use clamp cleaning procedure in Section 5. Check clamp
for damaged jewels and make sure clamp opens properly. Refer to
Section 5 for clamp disassembly and parts replacement procedures.
‰ Alignment of wire clamp feed tube/wire clamp and capillary hole
correct
Wire clamp feed tube mounted on the wire clamp bracket must be vertically aligned with the bore of the capillary. If not, reposition the wire
clamp assembly to align the feed tube with the capillary bore. Refer to
Section 5.
‰ Correct capillary installation
Capillary must be benched at the top of the transducer capillary bore.
The capillary clamp screw must be tightened to the specified torque
value. See paragraph 1.8.1 “Replace Capillary” procedure in this section.
‰ Z encoder grating not damaged or dirty
Z motion problems may be caused by a dirty or damaged Z encoder
grating. The encoder output signal should be checked on a regular
basis. Refer to Section 5 for procedure. If the output signal can’t be
brought within specification by adjusting the encoder head position,
clean the encoder grating and inspect the grating for damage. Make
sure to use only the specified solvent (methanol) when cleaning the
grating; other solvents may damage it. Replace encoder parts as
needed.
‰ Correct wire tensioning
Wire tensioning problems may cause defective looping or other bond
defects. Make sure the air guide is clean and that air guide pressure is
set correctly. Make sure air guide sensor amplifier has been correctly
adjusted. Make sure tensioner vacuum is on and correctly adjusted.
Make sure that tensioner parts are clean. Refer to Section 3 for more
information.
‰ Transducer in place, secure, aligned, and properly torqued
A transducer that is not secured to the bond head link or that does not
hold the capillary perpendicular to the work will cause many different
types of bond defects. Use the transducer setup gauge to make sure
the capillary is perpendicular to the bond plane. Make sure that the two
(2) transducer mounting screws are tightened to the specified torque
value. See Section 5 for procedure.
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Section 1: Maintenance Guide
‰ Cable clamps not pulling transducer wires
Transducer must be able to move through its entire range of motion
without putting any tension on the transducer wires. If any tension is
seen as the bond head is moved up and down, loosen the cable
clamps that secure the transducer wires. Pull the wires gently toward
the transducer to form a generous service loop, then tighten the cable
clamps. Check as above when done.
‰ Bond head flexure bearing operates smoothly
A damaged bond head flexure assembly will cause inaccuracies in Z
motion, resulting in bond defects and loop formation problems. If the
flexure assembly does not operate smoothly, it must be replaced. See
Section 5 for procedure.
‰ Bond head at correct height for leadframe thickness
The Maxµm Ultra has a fixed–height bond. The workholder (indexer)
front and rear rail height must be set to the correct vertical position for
the material being processed. Refer to Volume 3: Maxµm Ultra MHS
Material Handling System for the rail height adjustment procedure.
‰ Piezo Sensor Functionality
If contact detection in F mode is erratic, the piezo sensor calibration
(part of Bondforce calibration) may be useful in indicating whether
there is a problem with the piezo sensor - either low or missing signal
(may cause high impact or error message) or too much noise (may
cause false contact)
1.9.1.3
XY Table
Check:
‰ All hardware in place and secure
Check hardware at: Y motor/XY base, X motor/XY base, Y motor coil/
rear Y slide, X motor coil/X slide (right side). Replace hardware if missing. Tighten screws to specified torque value if loose. Refer to motor
replacement procedures in Section 6 for hardware locations and
torque values.
‰ X, front and rear Y slides and Y coupling mechanism are properly lubricated
Make sure that the mechanisms are lubricated at the specified preventive maintenance intervals (refer to paragraph 1.7.2.6). Lubricant
should be visible on the slides. If any of these appear dry, perform the
appropriate lubrication procedure. Refer to Section 6 for procedures.
‰ All cable connections tight (motor and encoder cables)
Check at encoder amplifier boxes attached to the upper console supports and at the motor cable connectors in the top of the lower console.
Make sure screw locks securing motor and encoder cable connectors
are tight.
‰ X or Y motor coil does not contact motor housing
Make sure there is space between the coil and motor housing throughout the motor range of motion. Check above and below the top and
bottom of the coil. If there is any contact, loosen the coil mounting
screws and use shims to position the coil in relation to the motor housing. Tighten the coil mounting screws to the specified torque value.
See the motor replacement procedures in Section 6.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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1-37
Maxµm Ultra Ball Bonder
‰ Motors located against bench points
Make sure the base plates of the X and Y motors are against their
bench points on the XY base. It should not be possible to fit a 1 mil
(0.025 mm) shim between a motor base plate and any of the three (3)
bench points. If necessary, loosen the mounting screws and push the
base plate against the bench points. Check with the 1 mil shim, then
tighten the mounting screws to the specified torque values. See the
motor replacement procedure in Section 6.
‰ X and Y motor air supply sufficient
X motor or Y motor overtemperature error indications may be caused
by a lack of cooling air at the motor. Verify air flow at X and Y cooling
air fittings on the input air manifold. Check the supply hoses to make
sure they are not kinked or cracked. Make sure the hoses are tight on
the barb fittings at the motor and main air manifold.
‰ Linear encoders operational
Make sure that the Servo CPU (CPU2) board and Servo Preamp
board are both properly installed in the card rack. Check for encoder
signal at test points on the servo preamp board while moving X and Y
axes. If no signal, check continuity of encoder cable. If cable is good,
replace servo preamp with a known good board, and check again. If
there is an encoder signal, replace the servo preamp board. If not,
then the problem is probably in the linear encoder, which means that
the XY table assembly must be replaced. Refer to Section 6 for information concerning the servo preamp board.
1.9.1.4
Lower Console
Check:
‰ Fans in card rack and power supply operational
Defective fans in the power supply or card rack will cause over–temperature error indications that interrupt machine operation. If not corrected, damage to equipment will result. The card rack fan is
replaceable; the fans in the power supply are not replaceable. If there
is a problem with fans in the power supply, then the power supply
assembly must be replaced.
‰ Air filters are clean (power supply and card rack)
Clogged air filters in the power supply or card rack will cause over–
temperature error indications that interrupt machine operation. If not
corrected, damage to equipment will result. The two (2) filters at the
lower console rear cover panel and the single filter at the top of the
card rack should be checked regularly and replaced if clogged. Damaged filters must be discarded. Undamaged filters may be cleaned and
re–used.
‰ Printed circuit board (PCB) assembly face plates are seated
properly and secured to card rack
All face plates should be flush with face plates of adjacent PCBs. Make
sure captive screws are tight and hold the face plate in good contact
with the card rack frame.
‰ Cables are properly strain relieved
Make sure strain–reliefs for all cables are in place and securely hold
the cables. Improper strain relief can cause damage to cable jackets,
wire insulation, and conductors.
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Section 1: Maintenance Guide
‰ Cables connections are good
Make sure cable connectors are correctly installed in mating connectors on the backplane or on other equipment/cables. Make sure all
securing hardware (screwlocks, etc.) is tight.
1.9.1.5
Miscellaneous
Check:
‰ Red, yellow, and green signal lights are functional
Use software functions to check signal light operation. (Refer to Volume 1: Operations for procedures.) Replace signal light tower assembly if any defects are found.
‰ All covers fit properly and are not damaged
Visually inspect covers. They should be held flat against their mounting surfaces. All mounting hardware, latches, and hinges should be
functional. There should be no visible damage. Replace covers as
needed.
‰ Machine level and sits firmly on floor (raised off of casters)
The machine must be level and raised off of its casters at all four leveling feet. Adjust the leveling feet as necessary.
‰ Heat block vacuum sensor is operational and correctly set up (if
present)
A vacuum sensor that detects vacuum at the workholder bond site
heat block is available as an option for the Maxµm Ultra. If the vacuum
sensor is present, it can be checked through the Sensor Display in
Diagnostics Mode. Block and unblock the vacuum hole in the heat
block and verify that the appropriate line in the Sensor Display shows a
change in the switch state. Refer to Volume 3: Maxµm Ultra 3112 MHS
for sensor set up procedure.
‰ Proper air pressure supplied
Facility air pressure must be 65 psi or greater (80 psi maximum) to
ensure sufficient pressure at the machine. Make sure machine pressure (indicated on digital gauge at right side of lower console) is set to
55 psi.
‰ Pressure regulators operational; locks working
Check the main air regulator (on right side of lower console) and four
(4) regulators at the right side of the upper console. Make sure the lock
on the main regulator prevents the regulator knob from turning. DO
NOT SET INPUT AIR PRESSURE ABOVE 65 PSI WHEN CHECKING MAIN AIR REGULATOR.
‰ Wire and capillary per requirements
Verify that the correct wire and capillary for the process are installed in
the machine. Replace the wire or capillary if necessary.
‰ No foreign objects on machine (hardware, tools, etc.)
Make sure there are no foreign objects anywhere on the machine while
it is operating. Small tools can be kept in the MMI slide–out drawer.
‰ Wire not hung up at spool
Check spool to make sure the wire is laid up so that it will come easily
off of the spool. If not, unreel wire from the spool and rewind the spool
so that the wire will come off of the spool easily.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-39
Maxµm Ultra Ball Bonder
‰ Spool mounting good (not loose)
Make sure the wire spool is not loose on the wire feed spool mount. If it
is loose, replace the wire spool.
‰ Machine is clean
The machine should be cleaned at the end of every shift to prevent
dust and dirt build–up that may later cause problems in machine operation.
‰ MHS workholder and magazine handlers against bench points
Make sure the MHS assemblies are tight against their bench points. A
1–mil (0.025 mm) thick shim should not fit between the assembly and
the bench point. If it does, loosen the mounting screws that secure the
assembly, push it against the bench points, then tighten the mounting
screws to the specified torque value. Refer to Volume 3: Maxµm Ultra
MHS.
1.9.2
Wire Bond Troubleshooting Guide
The following paragraphs list particular bonding problems and give probable causes and solutions. The paragraphs are organized into the following
categories:
1-40
•
Looping Problems (1.9.2.1)
•
Bond Integrity Test System (BITS) Errors (1.9.2.2): Non–Stick on Pad
(NSOP), Non–Stick on Lead (NSOL), and Short Tail (SHTL) errors.
•
EFO Open Errors (1.9.2.3)
•
Bond Placement (1.9.2.4)
•
Deformed Bonds (1.9.2.5)
•
Wire Feed/Wire Sensor Troubleshooting (1.9.2.6).
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1.9.2.1
Looping Problems
Symptom
Sagging loops short at the
leadframe
Tight loops short
Trouble Area
Corrective Action
a. Second bond placement too close Reteach bond program to
to the end of the lead.
increase lead surface area
between 2nd bond and lead tip.
b. Too much wire in loop.
• Increase reverse loop
• Check wire tensioner vacuum.
• Adjust looping parameters.
c. Improper wire size (wire diameter
does not agree with capillary).
Replace wire or capillary with
proper size
d. Leadframe fingers not clamped
properly, fingers floating.
• Calibrate clamp (MHS Calibration).
• Reteach indexing (MHS
Teach).
e. Bond height not set properly.
Select
Bnd Ht Relrn
tool.
a. Looping parameters incorrect.
• Adjust looping parameters.
• Adjust reverse loop.
b. Damaged or dirty capillary tip.
Replace with a new capillary.
c. Wire is contaminated or the wrong Replace wire with new spool.
size.
d. The glass feed tube on wire clamp • Clean the glass feed tube.
is damaged or dirty, and damages
• Replace feed tube assembly if
the wire.
glass tube is damaged.
Erratic and varying loops
e. Clamp gap too small.
Use reticle in microscope eyepiece to adjust clamp gap.
f. Second bond too close to first
bond, with respect to height difference between first and second
bond.
Reteach second bond farther
away from first bond.
g. Automatic Wire Feed:
• Wire “hanging up” coming off spool
and through air guide
• Wire feed not properly adjusted.
• Replace spool if damaged.
• Clean diverter and air guide.
• Be sure wire path is clean,
clear.
• Adjust air guide pressure and
tensioner vacuum.
i. Die paddle not clamped properly floating in the air.
• Calibrate clamp (MHS Calibration).
• Reteach indexing (MHS
Teach).
a. Damaged, dirty, or wrong type of
capillary.
Replace with a new capillary to
match the wire size.
b. Adjacent wires are taught so
close together that the capillary hits
the first wire while bonding the second wire.
• Reteach the two wires farther
apart, if possible.
• Use capillary designed for fine–
pitch bonding.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-41
Maxµm Ultra Ball Bonder
Symptom
Erratic and varying loops
(Continued)
Crooked or Kinked Loops
Broken wire at 1st bond
1-42
Trouble Area
Corrective Action
c. Wire being damaged, kinked, or
pulled while in the wire path to the
capillary.
• Clean wire clamp feed tube.
• Make sure wire has clean path
through wire feed.
d. Flattening of wire:
• Clamp gap too large or too small
• Clamp jewels do not close evenly
and are not parallel
• Clamp not opening properly.
• Adjust clamp gap to proper
gap.
• Replace wire clamp assembly if
damaged.
• Check clamp amplifier and
cabling. Replace amplifier or
cables as needed.
• Replace plate actuator assembly.
e. If die height changes (higher or
lower) wires will be pulled tight or
high.
Reteach bond height (select
Bnd Ht Relrn
tool).
f. “S”ing of wire.
Check for tightness on:
• bond head
• Optics
• XY table
• MHS workholder.
a. Z height not set properly.
Reteach bond height (select
Bnd Ht Relrn
tool).
b. Capillary damaged or dirty.
Replace with new capillary.
c. Loose bond head parts.
Tighten loose parts.
d. Loop parameters (kinked loops).
Adjust looping parameters.
e. Wire tensioner air pressure.
Adjust tensioner air pressure so
that wire does not twist or
vibrate.
a. Not enough wire for loop length.
Adjust looping parameters.
b. Kink height too small for wire.
Increase kink height.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1.9.2.2
Bond Integrity Test System Errors
1.9.2.2.1
Possible Cause
Parameters/Ultrasonics
Bond Placement
Non–Stick on Pad Errors (NSOP)
Check
Corrective Action
a. Check ultrasonics.
• Perform ultrasonics calibration.
• Check capillary clamp screw
torque.
• Check transducer mounting screw
torque.
b. Check bond parameters (power,
time, bond force, ball size, wire size,
temperature settings).
Adjust parameter values to correct
settings for first and second bond as
required.
a. Check crosshair offset.
Correct as required.
b. Check if correct bond program has
been loaded or taught.
Obtain correct program or reteach,
as needed.
c. Check for tightness at:
• transducer
• optics
• XY table
• MHS workholder
• bond head.
Tighten as required.
d. Check that the transducer is perpen- Use gauge and 1–mil (.025 mm)
dicular to the work.
shim to check transducer alignment.
Re–align transducer, if necessary.
Initial contact force
Workholder
e. Diffuser setting
Check/adjust diffuser air pressure
setting.
f. PRS fully operational.
Perform PRS Calibration and verify
eyepoint find/scale factors.
a. Incorrect bond heights taught.
Reteach bond height. Select
Bnd Ht Relrn
tool.
b. Dirt or foreign matter in Z motor.
Clean Z motor.
c. Interference with Z motion.
Check EFO wand setup. Check for
any other mechanical interference
between bond head link and other
machine components.
d. Piezo Sensor signal noisy or missing
Perform Bondforce Calibration
e. Bad bond head flexure assembly.
If the flexure assembly does not
operate smoothly, it should be
replaced.
a. First bond - die paddle is flush on
heat block. No die paddle rock.
• Recalibrate workholder clamp.
• Reteach MHS indexing.
• Make sure vacuum holds die paddle down.
• Clean/replace heat block insert and
clamp insert.
b. Second bond - fingers are flat on
heat block.
• Recalibrate workholder clamp.
• Reteach MHS indexing.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-43
Maxµm Ultra Ball Bonder
Possible Cause
Check
Corrective Action
Workholder (continued)
c. Check heat block for agreement with Adjust set point temperature offset
temperature settings.
values for preheat and bond site.
Requires digital thermometer.
Capillary
Check capillary for:
• cleanliness
• damage
• proper type or size
• good round tool marks
• correct capillary clamp screw torque
• correct extension.
Wire Path
IMPORTANT
Check wire path for:
• cleanliness
• mechanical alignment of wire clamps Wire should go through center of
wire clamps and capillary without
with capillary.
touching sides of jewels or inside
wall of capillary.
Operator Errors
Check for:
• incorrect chip
• incorrect leadframes
• incorrect bond program entered or
loaded from disk.
• incorrect wire or capillary.
Correct as required.
Materials
Check for:
• poor metalization on die
• damaged chip
• damaged or contaminated wire.
• Replace damaged materials.
• Replace damaged chip.
• Replace wire.
Ultrasonics
Check USG board, cables, and transducer.
• Replace ultrasonic generator
(USG) board/cables.
• Clean capillary clamp. Make sure
torque on clamp screw is correct.
• Replace transducer.
Calibration
Following not performed or incorrect:
• Bond Force Calibration
• USG Calibration.
Perform:
• Bond Force Calibration
• USG Calibration.
Poor Ball Formation
a. Non stick on lead (NSOL) not
detected on previous wire
• Check clamp–to–heat block alignment
• Check for accurate NSOL detection
b. Ball undersized:
1. Electronic Flame–Off (EFO)
• Set up EFO wand.
• Clean EFO wand. Replace wand if
necessary.
• Clean wire clamp. Replace clamp
parts as needed if clamp is malfunctioning.
• Replace EFO HV cable if necessary.
• Clean up another grounding path
for EFO firing.
2. Wire contamination
Replace bonding wire.
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All Rights Reserved
Replace capillary if necessary.
Section 1: Maintenance Guide
Possible Cause
Poor Ball Formation
(Continued)
1.9.2.2.2
Check
Corrective Action
• Reduce bond force at second
bond.
• Clean wire feed path. Adjust wire
clamp position to align wire feed
path.
3. Short tail
NSOP - Broken Wire
Possible Cause
Check
Corrective Action
Capillary
Check capillary for:
• cleanliness
• damage
• proper type or size
• good round tool marks
• correct capillary clamp screw torque
• correct extension.
Replace capillary if necessary.
Wire Path
Check wire path for:
• cleanliness
• mechanical alignment of wire clamps
with capillary.
• wire tensioner air pressure
• bad wire clamp
• Clean wire feed path
• Align wire clamp with capillary
• Reduce tensioner air pressure
• Replace wire clamp assembly
Materials
Check for:
• kink in wire
• bad wire
Replace wire.
Parameters
Loop parameters
Adjust loop parameters (reduce
reverse loop)
Vibration
Workholder clamping
• Calibrate workholder clamp.
• Perform MHS Teach procedure
(indexing teach)
• Replace heat block insert and
clamp insert (”P–parts”)
1.9.2.2.3
Possible Cause
False NSOP Error Indications
Check
Corrective Action
Materials
High device resistance (edge die/
bond pads may appear dark)
• Disable Bond Integrity Test System (BITS) for individual wires with
greater than MΩ resistance.
• If all wires show high resistance,
disable BITS for all wires.
Detection circuit
Check:
• BITS polarity
• Bad wire clamp
• Wire Feed/BITS board and cables
• Switch to opposite BITS polarity.
• Clean wire clamp. Replace
defective wire clamp assembly.
• Replace Wire Feed/BITS board
and/or cables as needed.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-45
Maxµm Ultra Ball Bonder
1.9.2.2.4
Non Stick on Lead (NSOL) Errors
Possible Cause
Trouble Area
Parameters/Ultrasonics a. Check ultrasonics.
Bond Placement
Corrective Action
• Perform ultrasonics calibration.
• Check capillary clamp screw
torque.
• Check transducer mounting
screw torque.
b. Check bond parameters (power,
time, bond force, wire size, temperature settings).
Adjust parameter values to correct
settings for second bond as
required.
a. Check crosshair offset.
Correct as required.
b. Check if correct bond program has
been loaded or taught.
Obtain correct program or reteach,
as needed.
c. Check for tightness on:
• transducer
• optics
• XY table
• MHS workholder
• bond head.
Tighten as required.
d. Check that the transducer is perpen- Use gauge and 1–mil (.025 mm)
dicular to the work.
shim to check transducer alignment. Re–align transducer, if necessary.
Initial contact force
Workholder
e. Diffuser setting
Check/adjust diffuser air pressure
setting.
f. Video Lead Locator (VLL)
Reteach VLL
g. PRS fully operational.
Perform PRS Calibration and verify eyepoint find/scale factors.
a. Incorrect bond heights taught.
Reteach bond height.
b. Dirt or foreign matter in Z motor.
Clean Z motor.
c. Interference with Z motion.
Check EFO wand setup. Check for
any other mechanical interference
between bond head link and other
machine components.
d. Piezo Sensor signal noisy or missing
Perform Bondforce Calibration
e. Bad bond head flexure assembly
If the flexure assembly does not
operate smoothly, it should be
replaced.
a. Fingers are flat on heat block.
• Recalibrate workholder clamp.
• Reteach MHS indexing.
• Clean heat block insert. Replace
heat block insert/clamp insert if
wrong type installed for device.
b. Check heat block for agreement with Adjust set point temperature offset
temperature settings.
values for preheat and bond site.
Requires digital thermometer.
1-46
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
Possible Cause
Trouble Area
Corrective Action
Replace if necessary.
Capillary
Check capillary for:
• cleanliness
• damage
• proper type or size
• good round tool marks
• correct capillary clamp screw torque
• correct extension.
Wire Path
IMPORTANT
Check wire path for:
Wire should go through center of
• cleanliness
• mechanical alignment of wire clamps wire clamps and capillary without
touching sides of jewels or inside
with capillary.
wall of capillary.
Operator Errors
Check for:
• incorrect chip
• incorrect leadframes
• incorrect bond program entered or
loaded from disk.
• incorrect wire or capillary.
Correct as required.
Materials
Check for:
• bent leads
• contaminated leads
• poor plating on leads
• burn: under–etched or over–etched
• damaged or contaminated wire.
• Replace damaged materials.
• Replace wire.
Ultrasonics
Check USG board, cables, and transducer.
• Replace ultrasonic (USG) board/
cables.
• Clean capillary clamp. Make sure
torque on clamp screw is correct.
• Replace transducer.
Calibration
Following not performed or incorrect:
• Bond Force Calibration
• USG Calibration.
Perform:
• Bond Force Calibration
• USG Calibration.
Contact Detection
a. Constant velocity (CV) too low
Increase CV parameter for second
bonds.
b. Circuit noise
1.9.2.2.5
Possible Cause
False NSOL Error Indications
Trouble Area
Corrective Action
Materials
High device resistance
• Disable Bond Integrity Test System (BITS) for individual wires
with greater than MΩ resistance.
• If all wires show high resistance,
disable BITS for all wires. Test out
AC BITS feasibility.
Detection circuit
Check:
• short to ground in detection path
• incorrect detection window setting
• bad wire clamp
• Wire Feed/BITS board and cables
• Find and correct short to ground.
• Change detection window setting
• Clean wire clamp. Replace
defective wire clamp assembly.
• Replace Wire Feed/BITS board
and/or cables as needed.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-47
Maxµm Ultra Ball Bonder
1.9.2.2.6
Short Tail Error (SHTL)
Possible Cause
Trouble Area
Corrective Action
Capillary
Check capillary for:
• cleanliness
• damage
• proper type or size
• good round tool marks
• correct capillary clamp screw torque
• correct extension.
Replace if necessary.
Workholder
a. Fingers are flat on heat block.
• Recalibrate workholder clamp.
• Reteach MHS indexing.
b. Dirty or damaged heat block insert
or clamp insert
Clean heat block insert. Replace
heat block insert/clamp insert if
either is damaged.
Parameters
Check second bond parameters
Adjust parameter values to correct
(power, bond force, and contact angle) settings for second bond as
required.
Bond Placement
a. Check crosshair offset.
Correct as required.
b. Check if correct bond program has
been loaded or taught.
Obtain correct program or reteach,
as needed.
c. Check for tightness on:
• transducer
• optics
• XY table
• MHS workholder
• bond head.
Tighten as required.
d. Check that the transducer is perpen- Use gauge and 1–mil (.025 mm)
dicular to the work.
shim to check transducer alignment. Re–align transducer, if necessary.
e. Diffuser setting
Check/adjust diffuser air pressure
setting.
f. PRS fully operational.
Perform PRS Calibration and verify
eyepoint find/scale factors.
Materials
Check for:
• poor metalization on die or leadframes
• damaged chip
• damaged or contaminated wire.
Wire Path
Check wire path for:
• cleanliness
• mechanical alignment of wire clamps
with capillary.
• wire tensioner air pressure
• bad wire clamp
1-48
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
• Replace damaged materials.
• Replace damaged chip.
• Replace wire.
• Clean wire feed path
• Align wire clamp with capillary
• Reduce tensioner air pressure
• Replace wire clamp assembly
Section 1: Maintenance Guide
1.9.2.3
EFO Open Errors
Possible Cause
Abnormal wire tail
Parameters
1.9.2.4
Trouble Area
Corrective Action
a. BITS short tail detection off
Turn short tail (SHTL) detection
on.
b. Bad EFO
• Setup EFO wand.
• Clean or replace EFO wand.
• Clean or replace wire clamp.
• Replace EFO HV cable.
• Make sure there is a path to
ground for EFO firing
c. NSOL not detected on previous wire
• Check NSOL detection window.
Change window if necessary.
• Correct clamp to heat block
alignment.
• Correct bond placement.
Check second bond parameters (power, Adjust parameter values to corbond force, and contact angle).
rect settings for second bond as
required.
Bond Placement
Possible Cause
Trouble Area
Corrective Action
Operator Errors
Check for the following:
• incorrect crosshair offset
• poorly aligned operator or eyepoints
• poorly taught bond placement in the
process program.
Inaccurate XY Table
Positioning
Check for the following:
• excess play or incorrect preload in XY
table slides.
• loose X motor bracket
• loose motor mounting/poorly located
motor
• no lubrication
• incorrect crosshair offset
• XY servos not tuned.
Bond Head Inaccura- Check the following for tightness or
cies
damage:
• bond head mounting screws
• bond head flexure assembly
• capillary
• Z axis linear encoder
• transducer
• optics assembly
• camera mounting.
• Correct crosshair offset.
• Reteach alignment points.
• Reteach bond locations.
• Replace XY table.
• Tighten loose parts and screws as
necessary.
• Relocate motors against bench
points as necessary.
• Lubricate y coupling mechanism
and rear Y slide bearings as
needed.
• Reteach crosshair offset.
• Calibrate XY servos.
• Replace damaged parts.
• Tighten loose screws.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-49
Maxµm Ultra Ball Bonder
Possible Cause
Trouble Area
Corrective Action
Workholder
Check the following:
• MHS workholder is bolted down tightly • Bench workholder against bench
points and tighten workholder capand securely.
tive screws.
• Calibrate and reteach MHS
• die paddle is clamped tight and
workholder.
doesn’t move.
• leadfingers clamped tight and do not • Check for presence of bond site
vacuum.
move (no lead fingertips floating).
Servo System
Check the following:
• Servo Calibration
• Encoders (XY encoders on XY table
assembly; Z encoder on bond head.)
• CALIBRATION mode - tune X, Y,
and Z servos.
• Replace XY table assembly if
there is an X or Y encoder problem.
• Check Z encoder output. Reposition encoder sensor head if output
not to specification.
• Check whether Z encoder grating
is clean. If cleaning grating does not
correct the problem, replace Z
encoder sensor head.
Bond area cooling
air/diffuser settings
Check the following:
• Optics cooling air setting.
• Bond head cooling air setting.
• Z motor cooling air setting.
• Diffuser setting.
PRS
a. Check PRS calibration pixels to pulse Pixels to Pulse Ratios:
ratios.
• Low Magnification:
XX = 0.1772 ±.010
XY = 0.0000 ±.003
YX = 0.0000 ±.003
YY = 0.1772 ±.010
• High Magnification:
XX = 0.0591 ±.001
XY = 0.0000 ±.001
YX = 0.0000 ±.001
YY = 0.0591 ±.001
b. First bonds drift but second bonds do
not:
•poorly selected eye points
•eye points too close together
•PRS calibration not taught.
1-50
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
• Adjust air controls to proper settings for package being processed.
Perform following:
• Reteach eye points on area with
higher contrast.
• Reteach eye points farther apart,
at opposite die corners.
• Perform PRS Calibration.
Section 1: Maintenance Guide
1.9.2.5
Deformed Bonds
Symptom
Bonds Oversquashed
Bonds Undersquashed
Trouble Area
Corrective Action
a. Ultrasonics too high.
Lower ultrasonic power and/or
bond time.
b. Bond force too high.
Lower bond force.
c. Temperature too high.
Lower preheat and bond site temperature.
d. Initial bond force too high.
Lower initial bond force (25 to 30
grams). Calibrate piezo sensor via
Bondforce calibration procedure.
e. Ball or wire size too small.
Set to size of wire.
f. Bond force calibration not taught.
Perform bond force calibration.
g. Worn, damaged, or wrong capillary.
Replace capillary.
h. USG calibration not done.
Perform USG calibration.
j. Early impact due to change in die
height.
Reteach bond height (select
Bnd Ht Relrn
tool).
a. Bond force, contact threshold, temperature, or ultrasonics too low.
Increase as necessary.
b. Ball or wire size too large.
Correct free air ball (FAB) size setting or install correct size wire.
c. Capillary worn, damaged, or wrong
size.
Replace capillary.
d. Wire wrong size.
Replace wire to match capillary.
Bonds Undere. Bad clamping.
squashed (Continued)
Perform workholder clamp calibration; reteach MHS indexing.
f. Later impact due to reduced die
height.
Reteach bond height (select
Bnd Ht Relrn
tool).
g. Incorrect:
•USG calibration
•bond force calibration.
Perform:
• USG calibration
• bond force calibration.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-51
Maxµm Ultra Ball Bonder
Clubbed Balls
a. Tensioner off, not adjusted properly,
or dirty.
• Make sure
TENSIONER
LED is lit.
• Increase tensioner air pressure to
help eliminate clubbed balls.
• Make sure wire guide tubes in
tensioner are clean.
b. Worn, dirty, damaged or incorrect
capillary.
Replace capillary.
c. Wire clamp jewels dirty or damaged. • Clean jewels. Use grain alcohol
to clean jewels.
• Check for clamp jewel damage.
Replace wire clamp assembly as
needed.
d. Non–stick bond on previous lead.
Symptom
Clubbed Balls (Continued)
1-52
Trouble Area
See paragraph 1.9.2.2.4.
Corrective Action
e. Glass feed tube damaged or dirty.
• Replace glass feed tube if damaged.
• If dirty, clean tube using alcohol
in an ultrasonic cleaner, then dry
tube with compressed air.
f. Glass feed tube, wire clamps and
capillary do not line up correctly.
Reposition wire clamp. Wire must
go straight through glass feed tube
into center of clamp, without touching sides of jewels (clamp open),
then into center of capillary without
touching inside wall of capillary.
g. Wire contaminated or incorrect size.
Replace with correct wire (be careful not to touch the wire with fingers).
h. Ball and wire size parameters.
Make sure that correct wire diameter and free air ball (FAB) size have
been entered.
i. Deformed ball before 1st bond
Check that the EFO is firing for the
length of time compatible with the
programmed ball size.
j. EFO wand setup.
• Make sure wand is properly positioned (Section 5).
• With bond head at reset height,
make sure top surface of wand is
level with tip of capillary, with display indicating Z= 260 to 280 (EFO
Wand Height Calibration).
• Be sure there is a minimum 5
mils (0.12 mm) of clearance
between the wand and the
workholder clamp when clamp is in
up position. After any adjustment
to wand, check EFO wand height
calibration.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
Tail At Second Bond
a. Temperature too high.
Reduce bond site heat block temperature setting.
b. Dirty, damaged or wrong size capillary.
Replace capillary.
c. Second bond placement too close to Reteach bond in the middle of the
edge of leadfinger.
leadfinger.
d. Second bond power or force too low. Increase as necessary.
e. Incorrect wire elongation.
Symptom
Skidded bonds
1.9.2.6
Symptom
Select wire with elongation of 3%
to 6%.
Trouble Area
Corrective Action
a. XY servo calibration.
Perform servo tune calibration for
X and Y axes.
b. Looseness in XY table.
• Tighten XY table hardware, if
necessary.
• Check tightness of motor mounting. Move motor against bench
points and tighten, if necessary.
• Check for play or lack of sufficient
preload in XY slides. If found,
replace XY table assembly.
c. Bond head parts loose.
Tighten as necessary.
d. Workholder clamping: die paddle
and leadfingers.
• Calibrate workholder clamp.
• Reteach MHS indexing.
• Check for presence of heat block
vacuum.
e. Z encoder parts loose or changing
pulses.
• Tighten as required.
• Clean encoder grating.
• Adjust sensor head position.
• Replace encoder sensor head
and grating if either is defective.
f. Incorrect bond heights taught.
Reteach bond height (select
Bnd Ht Relrn
tool).
Wire Feed/Wire Sensor Troubleshooting
Trouble Area
Corrective Action
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-53
Maxµm Ultra Ball Bonder
A. Air guide obstructed or dirty.
Wire detector sensor
set up did not succeed
or wire feed operation B. Air pressure not sufficient to suphas become erratic.
port the wire loop.
1-54
Clean air guide and tip of fiber optic
cable (in air guide back wall).
• Adjust air guide pressure (if
required).
• Make sure air guide air holes are
clear.
• Check pneumatic system.
C. Fiber optic incorrectly connected to
optical sensor (Red light from fiber
optic cable tip appears as a point
of light, not as a ring of light).
Red light from fiber optic tip in air
guide back wall (sensor emitter)
should appear as a coaxial ring of
red light, not as a single point. To
correct:
1. Disconnect the fiber optics from
the sensor amplifier.
2. Swap the fiber optics between
the two holes in end of the sensor
amp.
3. Verify that the sensor emitter
appears as a coaxial ring of light.
D. Fiber optics damaged.
Replace fiber optics.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 1: Maintenance Guide
1.10
Recommended Spares
A Recommended Spare Parts List has been developed for Maxµm Ultra
machines, based on actual usage of parts by our customers worldwide.
This list is available upon request from the K&S Distribution and Logistics
department.
The list contains the part number and description for replaceable items.
To request recommended spares lists, contact the Distribution and Logistics department through the K&S Customer Support Center (North American locations) or the local K&S Sales & Service Representative (other
locations). Please be ready to supply machine serial numbers and the
dates machines were installed when making this request.
1.11
Special Tools and Fixtures
Special tools and fixtures are required for setup and maintenance of the
Maxµm Ultra. These tools are described and their K&S part numbers are
provided in the list that follows. The complete set can be ordered from
K&S spares under part number 08858-0901-000-xx
.
Part Number
Description
08088-0901-014-xx
Perpendicularity Set-up Gauge (Transducer)
08828-0901-007-xx
MJT Shoulder Screw (Transducer)
08858-0901-020-xx
Bond Force Calibration Weight Assembly (Bondhead)
08021-0901-011-xx
Calibration Wafer (Workholder)
03501-0901-001-xx
Calibration Wafer - for BGA (Workholder)
27777-6002-000
Wrench, Allen 0.9mm socket Size Long Arm (Wire clamp)
18538-6021-000
Fuse 1/4 x 1-1/4 4A 250V Fast Glass
08021-0901-006-00
Screw, Theta Adjust (Workholder)
08021-0901-008-00
Pivot, Theta Screw (Workholder)
08020-0069-005-00
Set-Up Tool
27795-6000-001
T-Handle Wrench 5mm Hex (Workholder)
08088-0901-001-00
Solenoid Gauge (Workholder)
08088-0901-002-00
G/P Jaw Gauge (Workholder)
08088-0901-003-00
Heat Block Gauge (Workholder)
08088-0901-004-00
Eccentric Tool (Workholder)
08088-0004-000-00
Alignment and Force Equalization Tool Set (Workholder)
08089-0901-025-00
Alignment Wedge Tools. Optics (Optics)
03117-0014-076-01
Gap Gauge (Workholder)
03117-0014-075-01
Lower Jaw Gauge (Workholder)
03127-0901-004-03
Gripper Setup Gauge (Workholder)
03127-0902-000-01
Ejector Gripper Force Gauge (Workholder)
03412-0901-008-00
Gripper Calibration Gauge (Workholder)
08858-0904-000-xx
Tensioner Alignment Jig (Tensioner)
19033-6035-310
Shim, ADJ, Z micro Encoder
08858-0901-004-00
Micro Z Spacer A
08858-0901-005-00
Micro Z Spacer B
08088-0901-030-00
Y Sensor Cal Gauge
08088-0950-000-00
Y Sensor Setup Gauge
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
1-55
Maxµm Ultra Ball Bonder
The Magazine handler calibration gauges can be ordered from K&S
spares under part number 03119-0926-000-00. The following part numbers
are the breakdown of the assembly.
Part Number
1.12
Description
03127-0901-006-01
Y-Z Gauge (Magazine Handler)
03412-0999-007-01
Magazine Gage (Magazine Handler)
Torque Specifications
Unless specified otherwise, Table 1-1 provides the amount of tightening
(torque) required to correctly secure hardware used on the Maxµm Ultra
bonder. The listing is organized by the type of material used and the size
of the screw. All values are expressed in inch–pounds (in.Ibs) unless otherwise stated and are the nominal settings to be used on the torque
device. Allowable deviation is ±10%.
Table 1-1 Tightening Torque Values in in.Ibs. for Common Fasteners
Size
1-56
Stainless
Steel
Alloy
Steel
Torque
Torque
Terminal
Boards
Aluminum
Size
Torque
Size
Torque
M1.6 x 0.35
12 in.oz.
34 in.oz.
M1.6 x 0.35 1.7
5
5.5
M2 x 0.4
M2.5 x 0.45
25 in.oz.
54 in.oz.
73 in.oz.
10
M2 x 0.4
M3 x 0.5
3.5
9
6
8
7.0
14
M3 x 0.5
6
18
M4 x 0.7
34.5
10
20
M4 x 0.7
14
41
M5 x 0.8
52.5
1/4
50
M5 x 0.8
30
86
M6 x 1.0
93.75
M6 x 1.0
50
146
M8 x 1.25
225
M8 x 1.25
124
362
M10 x 1.5
375
M10 x 1.5
249
724
M12 x 1.75
950
M12 x 1.75
437
1272
M16 x 2
1114
3240
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2
Lower Console
2.1
About This Section
Here’s what you will find in this section:
•
Section 2.2, Overview, describes the various components within and
mounted on the Lower Console. It contains basic component information
and location of each component in the lower console.
• Each section from Section 2.3 through 2.8 describes a functional system and its major components. It explains how to replace, adjust and do
preventive maintenance on each component.
•
Section 2.3, Electronic Control System
•
Section 2.4, Operator Interface
•
Section 2.5, System Computer
•
Section 2.6, Lower Console Cables
•
Section 2.7, Power System
•
Section 2.8, External Connection
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-1
Maxµm Ultra Ball Bonder
2.2
Overview
This section contains maintenance information for assemblies within or
mounted on the Maxµm Ultra console: control system (card rack assembly and card rack circuit board assemblies), disk system, operator interface devices, cabling, and power system (see Figure 2-1). Topics covered
include system descriptions, setup, preventive maintenance, and parts
replacement for each of these assemblies and subsystems.
•
Electronic Control System
All Maxµm Ultra operations are controlled by an electronic control system housed within the lower console. This control system is comprised
of a two–level card rack assembly and circuit board assemblies. A
monolithic backplane board assembly mounted at the rear of the card
rack assembly interconnects the circuit boards and provides electrical
connections to external devices: motors, solenoid valves, interface circuit boards.
•
System Computer
This is a self contained IBM compatible PC based computer that uses
an Intel processor chip. It has a 1.44MB floppy drive and an internal
hard disk drive unit used for data storage and transfer. The system
computer handles the main control logic of the machine including the
job of storing and executing the process programs and Machine
Dependant Parameters (MDPs).
There is a Ethernet port used for PC to VME Bus Communication and
also 2 USB ports at the front for initially installing host software on the
hard drive. Process program storage for both host and vision software
upgrades are done via the USB port on the Matrox vision system
accessed through the port on the MMI.
•
Operator Interface
Operator interface components on the lower console include the Man
Machine Interface (MMI) assembly and the start/ stop switch. The MMI
assembly, also called the control panel assembly, consists of a membrane keypad, a USB utility port for the Vision system, a three–button
mouse pointing device and a compartmented tool drawer. A start stop
switch to control machine power is located at the front of the lower console.
•
Vision System Unit
The vision system unit, which provides pattern recognition and video
lead location functions to enable automated device alignment, is
located within the lower console. Information concerning the unit can
be found in Section 4 of this manual, which covers the machine vision
system.
•
System Cabling
A number of electrical cables are present within the lower console.
Cable maintenance is limited to identification and replacement of
defective cables. This section contains a wiring diagram that provides
cable part numbers, names, sources, and destinations, as well as references to an illustration showing cable terminations on the control
system backplane board.
2-2
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
•
Power System
The main power system consists of a power cord, and a fully enclosed
power supply which includes line voltage filtering, fusing, contactor
relay for power supply shutdown, voltage generation, power supply
sequencing/power shutdown control, power supply protection circuitry
and cablings that connects the power supply outputs to alternating current (AC) or direct current (DC) powered electrical devices. The Power
system protects connected equipment through fuses and electical limiters.
Lower Console Frame
(covers removed)
Card Rack Assembly
Power On/Off Switch
System Computer
Front View
Ethernet Connector
Leveling Jacks
(4 places)
Power Supply
Casters
(4 places)
Rear View
Figure 2-1 Lower Console: Locations of Subsystems
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-3
Maxµm Ultra Ball Bonder
2.3
Control System
2.3.1
System Organization
The Maxµm Ultra Wiring Diagram shows the basic organization of the
control system, including system circuit board assemblies, stepper and
servo motor control systems, vision system, sensor interfaces, and other
electronic controls. This drawing can be found in ?????
2.3.2
2.3.2.1
Card Rack Assembly
Description
With the exception of MHS interface circuit boards, the electronic flame off
(EFO) electronics, power logic circuit board, vision system unit, bond
head interconnect board, piezo logic board and the bond integrity test system (BITS)/wire feed control electronics, circuit board assemblies are
located in a two–level card rack mounted within the lower console (see
Figure 2-2). The upper section of the card rack contains circuit boards
with either two 96–pin edge connectors or one 96–pin connector and one
128–pin connector. These are double–height or 6U boards (one U equals
1.75” or 44 mm) designed to be compatible with a standard or industrial
Versa Module Europa (VME) bus. The lower section of the card rack contains single–height (or 3U) circuit board assemblies that have a single
edge connector. At the rear of the card rack is a backplane board that
interconnects circuit boards within the card rack, and also acts as a bulkhead that connects the circuit boards to external equipment.
Lower Console Frame
(covers removed)
Card Rack Upper Deck
Card Rack Lower Deck
Captive Screw
(2 places)
Hinged Card Rack Cover
Figure 2-2 Card Rack Assembly
The card rack assembly in Figure 2-3 shows a cooling air fan, mounted
below the card rack, pulls air downward through a filter located at the top
and through the circuit board assemblies.
Air Filter
Air Filter Holder
Captive Screws
(2 places)
SHCS M4x10mm
(4 places)
Cooling Fan
SHCS M4x8mm
(2 places)
Fan Cover
Figure 2-3 Air Filter and Cooling Fan
2-4
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.3.2.2
Monolithic Backplane Assembly
The backplane circuit board assembly (P/N 08002-4191-000-xx) is
attached to the rear of the card rack assembly. It interconnects all of the
circuit board assemblies in the card rack, supplies operating power to the
circuit boards, and provides connection points for external equipment.
Signals transmitted through the backplane include:
•
Control and date to and from the PC Host System Computer via the
VME bridge card.
•
VMEbus data, address, and control signals
•
Specialized data, control, and address signals that control specific
pieces of external equipment and pass machine state information
between system circuit boards.
•
Command and status signals to and from the power supply.
•
Serial data that carries sensor outputs, temperature controller communications with the System computer, commands and data to and from
the wire feed system, bits system, and factory automation port. Also,
the bond site illumination control signals are taken from the vision system assembly.
•
Motor drive signals and amplified motor drive power.
In construction, the backplane is a monolithic, multilayer circuit board. On
the side of the board mounted toward the card rack (front) are connectors
that mate with circuit board edge connectors. On the opposite side of the
board (rear) are connectors that receive cables from circuit boards and
other equipment mounted throughout the machine. Power and ground
connections are made at several terminals located on the rear of the
backplane.
The backplane board requires no preventive maintenance and should
require no other maintenance action during the life of the machine. In the
event of a malfunction traced to the backplane, the board should be
replaced. No attempt should be made to repair the board.
2.3.2.3
VMEbus
The VMEbus standard defines the physical configuration of the Maxµm
Ultra card rack and the circuit boards, specifies backplane/circuit board
connectors, and provides a basic architecture for the processing system.
Detailed information concerning the VMEbus standard can be found in
The VMEbus Handbook, available from the VMEbus Futurebus+
Extended Architecture (VFEA) International Trade Association (VITA).
This handbook is not available from K&S. Make inquiries directly to VITA.
2.3.3
System Circuit Board Assemblies
Printed circuit board (PCB) assembly locations within the card rack
assembly are shown in Figure 2-4 and the boards are identified in Table 21 and Table 2-2. Any circuit board may be located its slot number in the
appropriate table with reference to Table 2-4.
On the front of each board in the card rack, there is hinged sheet metal
box designed to enclose all the cards in the rack and at the same time,
enclose cables that mount to the front of the boards. When the hinged
cover is closed, it forms a continuous wall that helps to contain and control
cooling air flow through the card rack; the cover also presses on the cards
to lock them in place and prevent vibration. The hinged box opens from
the top and there is a label inside the box showing the positions of each
printed circuit card by assembly number and mounting location.
There are also two [2] PCB cards residing in the system computer. They
are detailed in Table 2-3 and shown in Figure 2-5.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-5
2-6
USG (08001--4302--000--xx)
SERVO CPU (08002--4238--000--xx)
SERVO PREAMP (08002--4344--000--xx)
STEPPER/SENSOR (08001--4176--000--xx)
TEMP I/O (08002--4192--000--xx)
2
3
4
5
6
7
8
X--Y AMP (08002--4105--000--xx)
X--Y AMP (08002--4105--000--xx)
5
7
6
4
5
UPPER DECK BOARDS
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
9
6
7
8
10
1
2
3
4
5
6
7
8
9
LOWER DECK BOARDS
Figure 2-4 Circuit Board Assembly Locations
DUAL HS (08001--4200--000--xx)
4
DUAL HS (08001--4166--000--xx)
Card Rack
Assembly
SOLENIOD DRIVER (08002--4020--000--xx)
Z AMP (08001--4145--000--xx)
9
DUAL HS (08001--4166--000--xx)
3
DUAL HS (08001--4166--000--xx)
1
DUAL HS (08001--4166--000--xx)
2
MS AMP (08089--4000--000--xx)
Lower Deck
(3U Boards)
DUAL HS (08001--4200--000--xx)
3
CLAMP DRIVER (08002--4165--000--XX)
Upper Deck
(6U Boards)
2
MEFO (OPTIONAL) (08002--4005--000--xx)
1
SPARE
ILLUMINATOR (08001--4246--000--xx)
1
VME BRIDGE (08001--4325--000--xx)
SPARE
Maxµm Ultra Ball Bonder
Power
On/ Off Switch
10
8
System
Computer
11
9 10 12
10 11 12
Section 2: Lower Console
Table 2-1 Circuit Board Assemblies, Upper Deck
Slot No.
Part Number
PCB Assembly Name
Function/Reference
1
SPARE
2
08001-4325-000-xx
VME Side Bridge
Communicates to PC Host System computer; Generates VME
bus for 6U cards and provides 4
serial ports. See Para 2.3.3.1
3
08001-4246-000-xx
Illuminator Interface
Controls bond site illumination.
Para. 2.3.3.2.
4
08001-4302-000-xx
Ultrasonic Generator
Generates ultrasonic energy
applied to bond head transducer. Power level, mode, power
profile are programmable
through machine software. Section 5.
5
08002-4238-000-xx
Servo CPU (CPU 2)
CPU dedicated to control of the
X, Y, and Z servo systems and
optional MEFO. Section 5 (Z
Axis) or 6 (X and Y Axes).
6
08002-4344-000-xx
Servo Preamplifier
Preamplifier for Z servo system.
Conditions force and velocity
feedback for Z servo system.
Interpolates linear encoder
count to improve positional resolution in X and Y servo axes.
Section 5 (Z Axis) or 6 (X and Y
Axes). Signal conditioning for
piezo signal and MEFO hall
effect position.
7
08001-4176-000-xx
Stepper/Sensor
CPU dedicated to control of halfstepper and microstepper
motors. Specialized interface for
sensor input data and source of
solenoid drive signals. Para.
2.3.3.4 and Volume 3.
8
08002-4192-000-xx
I/O and Temp Controller
Provides general system input/
output (I/O) functions. Para.
2.3.3.3.
Controls temperature of MHS
workholder heaters. Contains
illumination drivers. Programmable through machine software.
Voume 3.
9
10
SPARE
08002-4005-000-xx
Moving EFO Wand Board
(MEFO) - Optional
Provides control and drive for a
voice coil moving efo wand.
Receives and filters MEFO position signal.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-7
Maxµm Ultra Ball Bonder
Table 2-2 Circuit Board Assemblies, Lower Deck
Slot No.
Part Number
PCB Assembly Name
Function/Reference
1
08002-4165-000-xx
Wire Clamp Driver
Drives wire clamp assembly. Section 5.
2
08001-4200-000-xx
Dual Half Stepper Amplifier
2A/0.8A
Drives two (2) workholder halfstepper motors. Volume 3.
3
08089-4000-000-xx
Microstepper Amplifier
Drives MHS workholder X–axis
micro stepper motor. Provides
motor velocity information to
Roller Jam detect. Volume 3.
4
08001-4166-000-xx
Dual Half Stepper Amplifier
2A/2A
Drives two (2) workholder halfstepper motors. Volume 3.
5
08001-4166-000-xx
Dual Half Stepper Amplifier
2A/2A
Drives two (2) magazine handler
halfstepper motors. Volume 3.
6
08001-4166-000-xx
Dual Half Stepper Amplifier
2A/2A
Drives two (2) magazine handler
halfstepper motors. Volume 3.
7
08002-4145-000-xx
Z Amplifier
Drives Z axis linear servo motor.
Section 5.
8
08002-4105-000-xx
140V XY Power Amplifier
Drives Y axis linear servo motor.
Section 6.
9
08002-4105-000-xx
140V XY Power Amplifier
Drives X axis linear servo motor.
Section 6.
10
08002-4020-000-xx
Solenoid Driver
Contains driver circuits for solenoids, solenoid valves, and DC
motors. Volume 3.
11
08001-4166-000-xx
Dual Half Stepper Amplifier
2A/2A
Drives two (2) magazine handler
halfstepper motors. Volume 3.
12
08001-4200-000-xx
Dual Half Stepper Amplifier
2A/0.8A
Drives two (2) workholder halfstepper motors. Volume 3.
Table 2-3 Circuit Board Assemblies, in the system computer
Part Number
PCB Assembly Name
Function
08001-4324-000-xx
PCI Bridge Card
Provides a bridge between the local 32-bit PCI
data bus to a 16-bit VME data bus.
19065-6019-003-xx
Ethernet Adapter board
Connects PC to a network. Send and receive networking communications through an ethernet
cable. Only one ethernet is used on the Maxµm
Ultra
System Computer
(without top casing)
Ethernet Port
Ethernet
Card
PCI Bridge
card
PCI bridge
Port
Figure 2-5 PCB locations in the System Computer
2-8
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.3.3.1
VME Bridge Board, P/N 08001-4325-000-xx
Major functions of the VME Bridge Board are described in Table 2-4. The
table also defines controls and indicators. There are no test points on the
board. See Figure 2-4 for the VME Bridge board location in the card rack
assembly.
Table 2-4 VME Bridge Board
Functions
None
• Provides a bridge
between an off board 32bit PCI data bus to a local
16-bit VME data bus
• Contains 4 serial ports
that are accessible
through P2 Connector
Controls/Indicators
Test Points
None
References
Figure 2-4, Figure 2-6
P1
LVDS Interface
J4
To BackPlane
P2
To BackPlane
Figure 2-6 VME Bridge Board, P/N 08001-4325-000-xx, Major Components
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-9
Maxµm Ultra Ball Bonder
2.3.3.2
Illumination Interface Board, P/N 08001-4246-000-xx
Major functions of the Illumination Interface circuit board assembly are
described in Table 2-5. The table also defines controls and indicators.
There are no test points on the board. See Figure 2-4 for the Illumination
Interface board location in the card rack assembly.
Table 2-5 Illumination Interface Board
Function
Controls/Indicators
None
• Controls intensity of vertical, high-angle,
and oblique bond site illuminators.
• For each illuminator, the vision system
issues a control data word and asserts a
strobe signal that loads the data into a digital to analog converter (DAC) on the illuminator interface. DAC output is a illuminator
driver control voltage that is proportional to
the value of the input data word.
Illumination Control
Cable Connector
Test Points
None
Reference
Figure 2-4,
Figure 2-7
P1
To BackPlane
P2
To BackPlane
Figure 2-7
2-10
Illumination Interface Board, P/N 08001-4246-000-xx, Major Components
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.3.3.3
I/O and Temperature Controller Board, P/N 08002-4192-000-xx
Major functions of the I/O and Temperature Controller circuit board
assembly are described in Table 2-6. The table also defines controls and
test points on the board. See Figure 2-4 for the I/O and Temperature Controller board location in the card rack assembly.
Table 2-6 I/O and Temperature Controller Board
Functions
Controls/Indicators
• Generates solenoid drive
enable.
• Communicates with bond
head wire clamp driver and
wire feed board.
• Controls interface with
EFO box and power supply.
• Drivers for signal tower
(lamps and alarm) and
work light.
• On–board thermal switch
monitors card rack temperature.
• Monitors XY table motor
temperature sensors.
• Has eight temperature
controller circuits. Temperatures and other parameters
are programmable through
machine software.
• Monitors zone temperature via type K thermocouples mounted near heating
elements.
• Controller pulse width
modulated (PWM) output
switches 240 Vac to heater
elements by means of a
solid–state relay.
DIP Switch SW1:
Configures board:
All eight (8) switches
should be set to the ON
position.
Jumper W1:
Vertical/oblique LED
operations.
Jumper W2:
Vertical/oblique LED
operations.
Jumper W3:
Temperature operations.
Jumper W4:
DAC operations.
Jumper W5:
DAC operations.
Jumper W6:
Vertical/oblique LED
operations.
Test Points
Reference
Test points TP1 through Figure 2-4,Figure
TP11 are process moni- 2-8
tor signals.
TP1: PM TP1
TP2: PM TP2
TP3: PM TP3
TP4: PM TP4
TP5: PM WC OPEN
TP6: PM EFO OPEN
TP7: PM WBMS CUR
SEL
TP8: PM WBMS POL
TP9: PM WBMS OFF
TP10: PM WBMS STATUS
TP11: PM EFO DONE
TP12: DGND
TP13: GCS0
TP14: GCS1
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-11
Maxµm Ultra Ball Bonder
Test
Points
P1
To BackPlane
Debug
Port
SSR Outputs
Bond Area
Thermocouples
P2
To BackPlane
Workholder
Thermocouples
Figure 2-8 I/O & Temperature Controller Board, P/N 08002-4192-000-xx,
Major Components
2-12
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.3.3.4
Stepper/Sensor Board, P/N 08001-4176-000-xx
Major functions of the Stepper/Sensor board are described in Table 2-7.
The table also defines controls and test points on the board. See Figure 24 for the Stepper/Sensor board location in the card rack assembly.
Table 2-7 Stepper/Sensor Board
Functions
• Receives synchronous
serial sensor data from
sensor interface boards.
• Distributes sensor state
data to other circuit boards
in system.
• Creates signals that operate individual solenoid drivers from VME data input.
General solenoid enable
signal (activates/deactivates all solenoid drivers)
comes from I/O and Temp.
Controller board.
• Interface for communications with leadframe jam
detector digital signal processor (DSP).
• Generates stepper control
signals (STEP, RUN, DIR,
AUX) for up to 14 halfstepper motors under control of
onboard CPU.
• Monitors MHS sensor
data and stepper fault signals from stepper drivers.
• Communicates with
CPU1 through dual–port
RAM. Has onboard 128
Kbyte Flash ROM and
128K RAM.
Controls/Indicators
Test Points
TP1: Lock
RESET (SW1)
TP2: Rframe
Push Button Switch.
Resets the stepper controller CPU.
DIP Switch SW2
Selects the VME byte
address space.
Reference
Figure 2-4, Figure
2-9
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-13
Maxµm Ultra Ball Bonder
RESET
Switch
RS232
Interface
P1
To BackPlane
System
Emulator
P2
To BackPlane
Figure 2-9 Stepper/Sensor Board, P/N 08001-4176-000-xx, Major Components
2-14
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.3.4
Circuit Board Information in Other Sections and Volumes
Table 2-8 Circuit Board and Electrical Assembly Information
Subsystem/Board
Section/Volume
Upper Console/
Wire Feed / BITS Board, 08828-4019-000-xx
Section 3
Vision System/
850 MHz Vision System Unit (PRS/VLL), Matrox 4SightII
Section 4
Bond Head/
Servo CPU (CPU2) Board, 08002-4238-000-xx
Section 5
Servo Preamp Board, 08002-4344-000-xx
Section 5
Z Servo Amplifier Board, 08001-4145-000-xx
Section 5
Ultrasonic Generator (USG) Board, 08001-4302-000-xx
Section 5
Electronic Flame Off (EFO) Box Assembly, 08002-1120-000-xx (Board P/N Section 5
08001-4169-000-xx)
Wire Clamp Driver Board, 08002-4165-000-xx
Section 5
XY Table/
Servo CPU (CPU2) Board, 08002-4238-000-xx
Section 6
Servo Preamp Board, 08002-4344-000-xx
Section 6
X and Y Power Amplifiers Board, 08002-4105-000-xx
Section 6
Material Handling System (MHS)/
Stepper/Sensor Board, 08001-4176-000-xx
Volume 3
Stepper Driver Boards: 08001-4166-000-xx, 08001-4200-000-xx, or 08089- Volume 3
4000-000-xx
I/O & Temperature Controller Board, 08002-4192-000-xx
Volume 3
Solenoid Driver Board, 08002-4020-000-xx
Volume 3
2.3.5
Preventive Maintenance
Preventive maintenance for the card rack assembly consists of the following:
•
Check the condition of the air filter and replace it as needed (every
1000 hours of operation). Refer to paragraph 2.3.6.2 for procedure.
No other maintenance should be required for the card rack assembly over
the life of the machine.
No preventive maintenance is required for the circuit board assemblies in
the card rack. The only maintenance action that may need to be performed is replacement of a non–functional assembly. A circuit board
replacement procedure is provided in paragraph 2.3.6.1.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-15
Maxµm Ultra Ball Bonder
2.3.6
Maintenance Procedures
2.3.6.1
Replace Circuit Board Assembly
Purpose
•
Replace a circuit board assembly within the card rack assembly.
Tools/ Materials/ Parts
•
ESD Protective Equipment/Materials
CAUTION: Obey all established ESD procedures when handling or storing circuit
board assemblies.
CAUTION: PC boards must be installed in the correct slot in the card rack. If a PC
board is in the wrong slot, the PC board or other machine equipment
may be damaged when power is turned on.
WARNING: MAKE SURE MACHINE POWER IS OFF BEFORE REMOVING ANY CIRCUIT BOARD FROM THE CARD RACK. WAIT AT LEAST THREE HUNDRED (300) SECONDS AFTER SWITCHING POWER OFF AT THE
POWER START/STOP BUTTON SWITCH BEFORE PULLING ANY CIRCUIT BOARD OUT OF THE RACK. THIS DELAY ALLOWS ANY RESIDUAL CHARGE IN THE POWER SUPPLY TO DISSIPATE.
Procedure
A. Press MOTOR STOP. Turn off machine power and wait for five [5] minutes to discharge all hazardous voltages.
B. Open the front door of the lower console.
C. Unscrew the two (2) captive screws on the card cage front cover and
open the cover as shown in Figure 2-2.
D. Remove circuit board assembly from card rack.
1. If necessary, disconnect cables at connectors on the edge of the
circuit board assembly
2. Using each hand to hold on to the card puller on the top and bottom
edges of the card, eject the card by pulling out the card puller.
3. Immediately place the circuit board assembly in an ESD–protective
enclosure.
E. Install the replacement circuit board in the card rack.
1. Slide the circuit board into its slot in the card rack until the connector/s seats in mating connector/s on the backplane board.
2. Press firmly on the top and bottom edges of the card, with equal
pressure until the board connector/s fully seat in the backplane
connector/s. Do not press against connectors, switches, or indicators on the board edge (if any).
3. Make any cable connections if necessary.
4. Re-attach the card cage cover and tighten the captive screws.
F. Close the lower console front door.
G. Turn on machine power. Initialize the machine and verify that the
machine operates normally.
2-16
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.3.6.2
Check/Replace Card Rack Air Filter
Purpose
•
Check condition of air filter at top of the card rack assembly. Filter
should be replaced if it appears clogged with dust.
Tools/ Materials/ Parts
•
Screwdriver
•
Large plastic bag
•
Filter, Foam, P/N 08088-1030-009-xx
Frequency
•
Filter should be checked after every 1000 hours of operation.
Procedure
A. Open front door of lower console.
B. Loosen two (2) captive screws that secure the filter drawer at the top of
the card rack assembly (see Figure 2-3 for location). Slide the filter
drawer out of the machine.
C. Remove the filter from the filter drawer and check its condition.
D. If the filter does not appear clogged with dust, return the filter to the filter drawer. If it appears clogged:
1. Immediately seal the filter in a large plastic bag.
2. Remove the filter from the production area.
3. Install a replacement filter in the housing.
E. Slide the filter drawer into the machine and tighten the captive screws.
Close the lower console front door.
F. Used filters may either be discarded or cleaned and reused. To clean
the filter:
1. Thoroughly inspect the filter. Filters that are damaged in any way
must be discarded.
2. Reverse–clean the filter with mild detergent and warm water.
3. Rinse the filter with warm, running water.
4. Dry it thoroughly with low–pressure compressed air, then store it for
later use.
2.3.6.3
Replace Input Air Filter
Purpose
•
Replace the pneumatics system input air filter.
Tools/ Materials/ Parts
•
Small container
•
Replacement Filter Element, P/N 14800-0010-001
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-17
Maxµm Ultra Ball Bonder
Procedure
WARNING: MAIN AIR SUPPLY TO THE BONDER MACHINE IS
REQUIRED TO BE SHUTOFF BEFORE ANY REMOVAL OF THE QUICK
DISCONNECT VALVE FROM THE BONDER MACHINE LOCATED AT
THE RIGHT SIDE OF THE LOWER CONSOLE.
A. Press MOTOR STOP. Turn off machine power.
B. Locate the input air filter/moisture trap assembly and input air connection. The assembly is at the right side of the lower console (viewed
from front of machine - see Figure 2-10).
Facility Air Input
Air Filter/Moisture Trap
Drain Valve
Front View
Input Air Filter/Moisture Trap
Figure 2-10 Input Air Filter/Moisture Trap
C. Drain the moisture trap.
1. Place a small container underneath the air filter to catch the fluid.
2. Press the drain valve at the bottom of the filter to drain the fluid out
of the filter into the container.
D. Disconnect the machine from facility air pressure.
E. Remove and discard the filter element.
1. Press down on the filter bowl catch and turn the bowl 45° in any
direction to detach bowl from filter.
2. Grasp the bottom of the air filter element.
3. Remove the filter element by turning it counterclockwise.
4. Discard the soiled air filter element.
F. Mount the replacement air filter element and tighten the element by
turning it clockwise.
G. Press down on the filter bowl catch, insert bowl onto filter and turn the
bowl 45° in any direction. Release the catch and the bowl will snap
back into position.
H. Connect the machine to facility air pressure.
2-18
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.4
Operator Interface
2.4.1
Interface Components
Components for user control of machine operation are mounted on the
lower console (Figure 2-11). These are the Operation Control Panel (MMI
assembly) at the top front of the lower console and the power control at
the right side of the lower console front face.
2.4.1.1
MMI Assembly
The MMI assembly consists of a three–button optical mouse pointing
device, a membrane keypad, and a compartmented tool drawer. The optical mouse is used to move the screen cursor or XY table assembly (when
motion control is enabled). After the screen cursor is positioned, the
mouse buttons are pressed (as defined on the monitor screen) to complete the operation. The membrane keypad has:
•
keys for specific machine functions (AUTO INDEX, INDEX, RUN/STOP,
MOTOR STOP, WIRE FEED, TENSIONER, AIRGUIDE etc.)
•
keys that move the screen cursor or X, Y, and Z axes of motion
•
a numeric keypad for entry of numeric data
•
ten (10) function keys whose functions are defined/ referenced in the
graphical user interface (GUI) display on the video monitor
•
an alphanumeric keypad to make mode/function selections or enter
alphanumeric data when required.
Communications between the MMI and the control system are handled by
the vision system assembly (mounted inside the lower console assembly).
The MMI mouse and keyboard are each connected to the 4 port USB hub
as shown in the Figure 2-11. This Hub then connects to the Matrox vision
system through its USB2 port. There is also a pass through USB connection on the right side of the keyboard assembly which connects to the
Matrox USB1 connector. This port is used for storage and retrieval of process programs and upgrades to both host and vision software code sets.
Preventive maintenance for the MMI consists of cleaning membrane keypad periodically. Other maintenance actions that may be required are
replacement of the entire MMI or any of its subsystems (mouse, membrane keypad, or mouse pad) if they malfunction. Procedures for performing these actions appear later in this section.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-19
Maxµm Ultra Ball Bonder
Numeric
Keypad
MMI Assembly
Function Keys (10)
Mouse Buttons
B1, B2, B3
Optical
Mouse
Wire Feed Controls
Main
Machine
Control
Functions
Alpha
Keypad
Power
Start/Stop Switch
ESD Wrist Strap
Connector
Vision
System
Unit
Serial Data
84104--1100--000
USB2
Port
4 Port
USB Hub
Serial Data
12710--9100--000
System
Computer
Serial Data
11590--4006--001
Wire Feed/ BITS Board
08828--1096
--000--00
Numeric Keypad
Alpha Keypad
Main Machine
Control Functions
Wire Feed Controls
USB1
Port
Ethernet
3--Button
Optical
Mouse
USB
REMOTE
PORT
MMI BLOCK DIAGRAM
Figure 2-11 Lower Console: Operator Interface Components
2-20
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
USB Port
Section 2: Lower Console
2.4.1.2
Power Controls
The POWER Start/ stop button switch is located on a panel at the right side
of the card rack assembly. It switches input power to the main power supply. The Power Start/ stop switch comes with a green pilot light. When the
pilot light is lit, it means the machine is plugged into a live outlet and does
not indicate that the machine is powered on.
The Emergency Stop (ESTOP) is a latching mushroom switch mounted on
the front face of the upper console control panel. When the switch is
pressed down to latch, the main system power ON/OFF switch is set to
OFF, immediately removing all power from the machine. Before the
machine can be restarted, the Emergency Stop switch must be released.
If not, the main power switch will still be OFF even when POWER ON is
pressed. This switch should be used only in emergencies when it is necessary to remove machine power immediately for the protection of the
user; it should NOT be used to remove power when routinely shutting
down the machine.
Restarting the machine after an Emergency Stop shut down includes
releasing the Emergency Stop switch, clearing material from the machine
and checking for mechanical interference between machine components,
then performing a normal power up procedure.
2.4.2
Preventive Maintenance
Preventive maintenance for operator controls consists of:
2.4.3
2.4.3.1
•
Cleaning the MMI top surface and mouse after every 200 hours of
machine operation. Refer to paragraph 2.4.3.1.
•
Testing ESTOP switch operation on a regular basis (recommended frequency: every 1000 hours of operation). Press the switch down and
make sure that machine power goes off immediately. Then press
POWER ON with ESTOP latched down and verify that power cannot be
switched on.
Maintenance Procedures
Clean MMI and Mouse
Purpose
•
Clean the MMI keypad and mouse.
Tools/ Materials/ Parts
•
Soft, lint–free cloth
•
Mild detergent
•
Warm water
•
Small soft–bristle brush
Frequency
•
Every 200 hours of operation
Procedure
A. Press MOTOR STOP. Turn off machine power.
B. Prepare a dilute solution of detergent and warm water. Immerse the
cloth in the solution, then wring the cloth out so that it is just damp.
C. Invert the mouse. Turn the ball retainer clockwise to release it.
Remove the ball retainer and ball.
D. Use the dampened cloth to clean the ball, then dry it with a dry cloth.
E. Inspect the interior of the mouse. Remove any visible dust or lint with a
soft brush. Make sure that the rollers that contact the ball are clean.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-21
Maxµm Ultra Ball Bonder
F. Place the ball in the ball retainer. Install the retainer and ball in the
mouse, then turn the ball retainer counterclockwise to lock it in place.
G. Wipe the MMI keypad surface with the dampened cloth, then dry the
keypad with the dry cloth.
2.4.3.2
Remove and Install MMI Assembly
Purpose
•
Remove the MMI assembly from the lower console and mount the MMI
on the lower console. The assembly will need to be removed for
access to the MHS workholder or XY table assembly, or if the assembly or any of its subassemblies need to be replaced.
•
Hex wrench set
•
MMI Assembly, P/N 08858-0020-000-xx (if replacement is required)
Procedure
A. Press MOTOR STOP. Turn off machine power.
B. Remove MMI from the machine.
1. Remove the rear cover from the lower console. Inside the lower
console, locate the vision system unit and USB 4 port hub mounted
in a bracket attached to the underside of the machine base.
NOTE: The front panel of the vision system unit faces the right side of the lower
console when viewed from the rear of the machine. The back panel
faces the left side of the lower console. Electrical connections are made
at both panels. Refer to Section 4 for illustrations of the vision system
unit.
2. Disconnect the MMI keypad and mouse USB cables from the USB
hub. Disconnect the USB cable (84104-1100-000) from the USB1
connector on the Matrox unit. Disconnect the wire feed control
cable (08828-1096-000) from the back of the MMI.
3. Remove two (2) screws with flat washers that secure the MMI to
the front of the machine base (beneath MMI assembly).
4. Remove two (2) screws with flat washers at the rear of the MMI that
secure it to the top of the machine base.
5. Lift the MMI and carefully pull the MMI cables up through the hole in
the top of the machine base. Remove the MMI from the machine.
C. Install MMI on the machine.
1. Position the MMI over the mounting location. Route the MMI keyboard, mouse and wirefeed cables down through the hole in the top
of the machine base, into the lower console.
2. Bench the MMI against the front edge of the machine base.
3. Install two (2) screws with flat washers behind the MMI, and two (2)
screws with flat washers underneath the MMI, to secure it to the
machine base. Tighten all MMI mounting screws to 90 in. lb. (10.2
Nm).
4. Route the mouse and keyboard cables to the USB hub and the
vision system.
5. Connect the USB cable (84104-1100-000) to the rectangular USB1
connector on the vision system assembly faceplate. Connect the
Keyboard and mouse cable to the USB hub.
6. Route and connect the wirefeed cable to the wirefeed extension
cable.
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Section 2: Lower Console
7. Close the front door of the lower console. Install the rear cover on
the lower console.
D. Turn on machine power and initialize the machine. Use the mouse and
keyboard to verify operation.
2.4.3.3
Replace Mouse
Procedure
•
The mouse assembly should be replaced if the cursor can’t be moved
with the mouse or if the cursor motion does not follow mouse motion.
NOTE: Always clean the mouse ball (paragraph 2.4.3.1), then verify that its still
not operating properly, before replacing the mouse. Cursor motion problems are often caused by dirt on the mouse ball and on the rollers inside
the mouse that contact the ball.
Tools/ Materials/ Parts
•
Hex wrench set
•
USB Mouse Pointing Device, P/N 11950-4006-001
Procedure
A. Press MOTOR STOP. Turn off machine power.
B. Remove MMI assembly (refer to paragraph 2.4.3.2, step B.).
C. Remove the mouse.
1. At the rear of the MMI, remove the mouse cable from the cable clip.
2. Push down on the two (2) slide latches on the MMI rear cover plate,
tilt the cover plate away from the MMI and remove the mouse cable
from the rubber grommet at the bottom of the cover plate. Remove
the mouse assembly.
D. Install a replacement mouse assembly.
1. Place the mouse cable into the cable clip at the rear of the MMI, so
that approximately 6 in. (15.2 cm) of the cable is available at the
rear of the MMI.
2. Install the MMI rear cover plate.
a. Place the mouse cable into the rubber grommet at the bottom of
the cover plate.
b. Install the rear cover plate.
E. Install the MMI (refer to paragraph 2.4.3.2, steps C. through D.).
2.4.3.4
Replace MMI Keypad
Purpose
•
The MMI keypad assembly should be replaced if any key switch
becomes non–functional or intermittent.
Tools/ Materials/ Parts
•
Hex wrench set
•
ESD protective equipment/materials
•
Isopropyl alcohol
•
MMI Keypad, P/N 08858-0020-005-xx
Procedure
A. Press MOTOR STOP. Turn off machine power.
B. Remove the MMI assembly (refer to paragraph 2.4.3.2., step B.).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
CAUTION: To prevent damage to equipment, use electrostatic discharge (ESD)
protective measures when handling MMI internal parts. The person
performing the procedure should use a static–dissipative wrist strap
and clothing made of static–dissipative fabric when disassembling
the MMI.
C. Remove four (4) screws that secure the MMI bezel to the MMI bezel
mount (Figure 2-12).
D. Carefully open the MMI bezel/bezel mount assembly to gain access to
the inside of the MMI.
E. Remove the M4 x 16 mm screw and ground strap that secure the MMI
board to the support plate. Slide the board to the side, then lift it away
from its standoffs. Note how the MMI keypad flex cable is folded
between the support plate and MMI board.
F. Disconnect the MMI keypad flex cable from connector J4 on the MMI
board.
G. On the top surface of the MMI, peel the MMI keypad away from the
MMI bezel. Remove the MMI keypad from the MMI.
H. Clean the adhesive residue from the top surface of the MMI bezel with
isopropyl alcohol.
I. Guide the flex cable of the replacement MMI keypad through the slot in
the top of the MMI bezel. Connect the cable to J4 on the MMI board.
CAUTION: In the next step, the flex cable must be folded between the MMI board
and support plate to avoid interference with tool tray operation.
J. Fold the cable as was observed in step E. and position the MMI board
on the standoffs on the support plate. Slide the board to the side and
install the M4 x 16 mm screw (and ground strap) to secure the board.
K. Position the MMI bezel face–up to prepare for bonding the keypad to
the bezel.
CAUTION: In the succeeding steps, exercise care when handling the keypad with
its exposed adhesive backing. If the keypad is improperly placed on
the bezel, it is difficult to remove without damaging the keypad.
L. On the back of the MMI keypad, peel away the small piece of backing
from the area under which the flex cable connects to the keypad. Then,
peel away the backing from the bottom several inches of the MMI keypad; leave the top several inches of backing in place for now.
M. Carefully position the bottom edge of the keypad on the MMI bezel,
benched against the bottom lip of the bezel and centered left–to–right.
Slowly lay the keypad down on the bezel while peeling the remainder
of the backing away. Use your fingers to apply gentle pressure to the
top surface of the keypad between the key switches to ensure proper
adhesion. Avoid pressing on the key switches.
N. Position the MMI bezel on the MMI bezel mount and install four (4)
screws to secure the assembly.
O. Install the MMI assembly (refer to paragraph 2.4.3.2, step C.).
P. Turn on machine power and initialize the machine. Use the mouse and
keypad to verify operation.
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Section 2: Lower Console
NOTE:
MMI keypad flex cable
not shown
MMI Keyboard
MMI Bezel
Support Plate
USB Port
MMI Board
Screw
(M4x16mm)
MMI Bezel Mount
Figure 2-12 MMI Exploded Assembly
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-25
Maxµm Ultra Ball Bonder
2.5
System Computer
2.5.1
System Description
This is a IBM compatible system consisting of an Intel Celeron processor
chip with 128MB RAM memory. It also has a 1.44MB floppy disk drive unit
and a 30 Gigabyte hard disk drive unit (both installed in the system computer).
The hard disk drive is used primarily for storage of process programs and
machine operating software. The floppy disk drive can be used to record
process programs, save machine-dependent parameters (MDPs), transfer process programs between machines.
2.5.2
Floppy Disks
The Standard 1.44MB, 3.5 inch (90 mm) floppy disk is used in the Maxµm
Ultra floppy disk drive. The disk may be removed by pressing the disk
eject button, which releases the disk and moves it out of the disk drive to a
point where it can be grasped by the user. The disk should never be
removed when the floppy disk drive activity indicator is lit, as this may
damage the disk or disk drive.
2.5.3
Floppy Disk Storage and Handling
The 3.5–inch disks used in the Maxµm Ultra are enclosed in a stiff plastic
casing that protects the disk surface from damage during normal use. The
disks can be damaged, however, if they are mishandled or stored improperly. Observe the following precautions when handling or storing floppy
disks.
•
2.5.4
Do not manually open the disk head shutter and touch the disk surface.
•
Avoid dropping floppy disks. Do not place any object on top of a disk.
•
Never place or store disks at a location where they may be exposed to
a magnetizing force in excess of 50 Oersted. The 50 Oersted level is
reached at a distance of approximately 3 inches (76mm) from a typical
source, e.g., motors, generators, transformers.
•
When not in use, store floppy disks in containers designed for storage
of 3.5–inch floppy disks.
•
Do not store floppy disks in direct sunlight.
•
Do not store floppy disks where the temperature may exceed 125° F
(52° C) or drop below 50° F (10° C).
•
Insert the disk into disk drive carefully. Never force the disk into the
drive. If the disk fails to load, press the eject button and re–insert.
•
Never attempt to remove the disk from the disk drive (press eject button) when the disk drive BUSY indicator is lit. This can damage both
the disk and the disk drive.
System Computer Handling Instructions
The information that follows provides safe handling instructions for the
hard disk drive units installed in Maxµm Ultra bonding machines. Please
read and follow these instructions before removing or installing a system
computer. Even when a system computer is installed in the machine, certain precautions must be taken to avoid damaging the hard drive, particularly when moving the machine or performing other maintenance.
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Section 2: Lower Console
2.5.4.1
Electrostatic Discharge (ESD) Protection
Follow standard ESD procedures whenever handling the system. These
procedures should include:
2.5.4.2
•
Keep the system computer in the static–protective container in which it
was shipped until it is time to install in the machine.
•
Use an ESD wrist strap whenever handling the system computer. Use
of static–dissipative clothing is also recommended.
•
Rest system computer only on approved anti–static foam padded surfaces.
•
Do not place any other objects into the static–protective container with
the system computer.
•
Do not touch the system computer circuit board or circuit board components with hands or tools.
Temperature and Humidity
Do not expose the system computer to extreme heat or extreme humidity.
If it has been stored in a low–temperature environment, or may have been
in such an environment during shipment, allow sufficient acclimation time
at room temperature before installing the drive and applying power to it.
Table 2-9 provides acclimation times for various storage temperatures.
Table 2-9 Acclimation Times for System Computer Stored at Low Temperature
2.5.4.3
2.5.4.4
Storage Temperature _C (_F)
AcclimationTime
4°C (40°F)
13 hours
-1°C (30°F)
15 hours
-7°C (20°F)
16 hours
-12°C (10°F)
17 hours
-18°C (0°F)
18 hours
-23°C (-10°F)
20 hours
-29°C (-20°F)
22 hours
-34°C (-30°F) or less
27 hours
Unpacking the System Computer
•
Follow the proper ESD guidelines whenever handling the system computer (see paragraph 2.5.4.1 above).
•
Pick up the ESD bag containing the system computer by the edge of
the bag.
•
When opening the ESD bag, hold the bag below the V–notch with one
hand and tear off the top of the bag with the other hand.
•
Remove the system computer from the bag by grasping the sides of
the system computer.
General Handling Instructions
•
When the system computer is not in the machine, store the system
computer in its original shipping container.
•
Be extremely careful not to drop, bump, or shake the system computer.
A drop of 0.5 in. (12.7 mm) onto a hard surface can destroy the system
computer.
•
Do not stack the system computer.
•
Do not stand the system computer on their sides. Rest it on its bottom
surface only.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
2.5.4.5
2.5.5
•
Do not place anything on top of the system computer.
•
Never apply power to a system computer when it is in an ESD bag.
Operating Precautions
•
Use care when moving Maxµm Ultra machines to minimize bumps and
shocks to the system computer. Avoid rolling the machine over cracks,
bumps, or other obstructions on the floor that could send excessive
shocks through the machine.
•
Always close the front door of the lower console gently. Slamming the
lower console door can damage the system computer, especially when
the drive is reading from or writing to the disk.
Preventive Maintenance
The floppy disk drive and hard disk drive require no preventive maintenance. The only maintenance action that is required is the replacement of
the system computer.
2.5.6
Maintenance Procedures
2.5.6.1
Replace the System Computer
Procedure
•
Replace a defective system computer unit.
Tools/ Materials/ Parts
•
Hex wrench set
•
Phillips screwdriver
•
System Computer, P/N 11950-1686-200
Procedure
NOTE: If possible, backup all MDPs, process programs or any other important
information pertaining to the bonder to a floppy or external drive.
A. Backup all MDPs, process programs or any other important information pertaining to the bonder to a floppy or external drive, if possible.
B. Press [MOTOR STOP]. Turn off machine power. Disconnect the input
power cable from the mains at the rear of the lower console. Wait at
least 300seconds (5 minutes) to allow high voltages to bleed down to a
safe level. Open the front door of the lower console.
CAUTION: To prevent damage to equipment, use electrostatic discharge (ESD)
protective measures when handling the system computer. The person
performing the procedure should use a static–dissipative wrist strap
and/or clothing made of static–dissipative fabric when handling the
disk drives.
WARNING: MAKE SURE MACHINE POWER IS OFF BEFORE GOING INSIDE THE
LOWER CONSOLE TO SERVICE OR REMOVE THE SYSTEM COMPUTER. WAIT AT LEAST THREE HUNDRED (300) SECONDS AFTER
SWITCHING POWER OFF AT THE POWER START/STOP BUTTON
SWITCH. THIS DELAY ALLOWS ANY RESIDUAL CHARGE IN THE
POWER SUPPLY TO DISSIPATE.
CAUTION: Read all of the system computer handling instructions in paragraph
2.5.4 before starting the system computer replacement procedure.
When not in its shipping container or mounted in the machine, the
system computer can be easily damaged through mishandling.
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Section 2: Lower Console
C. Remove the defective system computer.
1. Locate the system computer on the right side of the lower console
card rack. Remove the face plate that prevents the system computer from sliding out.
2. Disconnect the cables shown in Table 2-10 and located at the rear
of the system computer (remove the lower console rear cover to
access the cables):
Table 2-10 Cable list for the System Computer
PC Connection Point
Cable part number
Cable Description
Cable Connector
AC Input Power
CBL_PCIAB_PWR
08858-2010-000-00
P1
Network Port
CBL_NULL _MODEM
11950-0002-006
-
Ethernet Port
Ethernet Crossover Cable
11950-0300-000
-
PCI Bridge Card
CBL_SHIELD_ETHERNET
08858-2006-000
P1
PCI Ethernet Card
Ethernet Cable
08828-1104-000-06
P1
Grounding point
CBL_PCIAB_GND
08858-2007-000-00
P1
3. Loosen 4x M4 retainer screws at the rear (2x Top and 2x Bottom).
4. Slowly slide the defective system computer out of the lower console.
D. Install the new system computer.
1. Place the new system computer in the lower console and slide it in
until it is inline with the front face.
2. Re-connect the cables listed in Table 2-10 at the rear side of the
system computer.
3. Install the face plate previously taken out in step C..
NOTE: The system computer is properly configured and ready for use before
they are shipped. If after installation the machine control system does
not allow access to the drive and displays an error message, contact a
K&S Sales and Service Representative immediately. Be ready to supply
the text of the error message and any accompanying error codes during
the call.
E. Download software from the bonder software website.
1. Go to http://bondersoftware.com/software/ (password required).
Select the desired version of the software and download into the
hard drive.
2. Execute “.exe” file to automatically self extract the installation files
and Operating Software onto your hard drive. After extraction, three
[3] folders should exist on your hard drive in a folder named
KNS_USB_Downloads. These folders names, path and their contents
are shown in the following:
a. C:\KNS_USB_Downloads\
[Root folder]
b. C:\KNS_USB_Downloads\USB_Formatting_Utility\
[Formatting utility needed to format the USB device prior for
use.]
c. C:\KNS_USB_Downloads\SoftwareVersionNumber\
[Files that need to be copied to the USB device after formatting.]
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© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
d. C:\KNS_USB_Downloads\Documentation\
[Release notes for the software to be installed to the bonder.]
F. Prepare the USB device for bonder installation.
1. Insert the USB device into the USB port of the PC.
2. Run USB formatting utility (.exe file) located in the
C:\KNS_USB_Downloads\USB_Formatting_Utility folder. The format-
ting utility will install onto your PC.
3. Select <START> from the PC desktop, then select <All Programs><
Hewlett Packard Company > and run <HP USB Disk Storage Format
Tool>. This will startup the application (see Figure 2-13).
4. Format the USB device with startup files.
a. Verify USB Device.
b. Check “Create a DOS Startup disk” Box.
c. Check “using DOS system files are locating at:”.
d. Enter the folder path where the USB files are located at.
C:\KNS_USB_Downloads\SoftwareVersionNumber
e. Press “Start”.
Step #1
Verify USB Device
Step #2
Check Create a DOS startup
disk" Box
Step #3
Check using DOS
system files located at:
Step #4
Enter path where the
USB files are located at
Step #5
Press Start"
Figure 2-13 HP USB Disk Storage Format Tool
5. After formatting the USB device, copy all the files from
C:\KNS_USB_Downloads\SoftwareVersionNumber\ on to the USB
device. Select <Yes to All> to overwrite files being copied on to the
USB device.
6. Safely remove the USB device from the PC using icon on the bottom right of PC.
G. Installing the software onto the system computer.
1. Insert USB device into the USB port located at the front of the system computer.
2. Switch <Off> the bonder and wait for 5 minutes.
3. Switch <On> the bonder and allow the bonder to boot from the USB
device.
4. At standby mode (see Figure 2-14), select the bottom of the virtual
window button to enter windows desktop screen.
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Section 2: Lower Console
Select the
bottom of the
Virtual Window"
button
Figure 2-14 Standby Mode Screen
5. Scroll the mouse to the bottom of the screen to display the windows
taskbar. Select the wb_console program to maximise screen.
6. Press ENTER button on the keypad to prompt “A:>”.
7. Type “install install.inf” and press ENTER/RETURN.
8. The bonder will notify the user when the installation is complete and
will prompt the user to reboot the bonder when the software is
installed successfully.
NOTE: Remove the USB device after a successful installation and before
rebooting the bonder.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
2.6
Lower Console Cables
A number of cable assemblies are located within the lower console. Cable
assemblies are considered replaceable, not repairable, items. Therefore,
cable maintenance is limited to locating a defective cable, removing it
from the machine, and installing a replacement cable. As an aid to cable
replacement, Figure 2-17 shows locations and reference designators of
connectors on the backplane board assembly to which lower console
cables are connected.
Each connector shown on the drawing has an individual reference designator. To identify the cable installed at a connector, note the location
where it is connected to the backplane, find the connector in Figure 2-16
and then locate its reference designator. Read across the wiring diagram
for part number, name, and cable terminations. To locate where a cable
should be connected to the backplane, find the cable part number in Figure 2-16 and note its backplane reference designator, then locate the connector with the same designator in Figure 2-17.
Figure 2-18 shows cables in the lower console that do not terminate on
the backplane board. These are point–to–point connections within the
lower console (vision system assembly to video equipment, temperature
controller board to workholder heater thermocouples, etc.). Figure 2-15
shows the cable connection coming out of the card rack.
Upper Deck 6U Boards
Lower Deck
3U Board
Figure 2-15 Cable connection coming out from card rack
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Section 2: Lower Console
Figure 2-16 Backplane Connections
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-33
Maxµm Ultra Ball Bonder
J33
J36
J37
J39
J38
J35
J70
J53
J47
J34
TB29
TB21
TB30
TB25
TB19
TB20
TB24
TB26
J41
J46
J43
J45
J71
J40
J44
J48
J52
J50
J51
J49
J42
TB3
TB7
TB4
TB13
TB17
J72
TB5
TB10
J57
TB12
J61
TB15
TB11
J66
J65
J67
J62
J58
TB6
J63
J69
J68
J64
J60
Figure 2-17 Backplane Connectors
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J59
J56
Section 2: Lower Console
Figure 2-18 Non-Backplane Connections within the Lower Console
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-35
Maxµm Ultra Ball Bonder
2.7
Power System
2.7.1
System Description
The power supply system is a multiple output power unit capable of operating from AC input lines of 200 to 240VAC at 50/60Hz. It supplies all the
DC and AC requirements of the wire bonder. The power supply is
mounted on a common support plate that allows easy removal and maintenance of the system. Power system components are described in the
paragraphs that follow.
2.7.1.1
Power Supply Assembly Organization
The block diagram in Figure 2-19 shows the organization of the power
supply assembly, P/N 08858-0012-000-xx. The power system layout is
shown in Figure 2-20 and Figure 2-21.
Heater control
Inputs
240VSSR
Heaters
240VAC
Output
Overcurrent
protection
Inverter
AC
Line
DC Bus
+5VDC
rectifier and
power factor
correction
Standby
power
source
240VAC
Computer
Outputs
+12VDC
On/ Off
Hold-up
Capacitor
-12VDC
+5AUX
+12AUX
Control
-12AUX
Start Switch
INH*
DC to DC
Converters
Stop Switch
+36VDC
+48VDC
EMO Switch
Indicator
lights
-48VDC
Test points
+132VDC
DC to DC
Converters
Figure 2-19 Power System Layout
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Logic I/O
Section 2: Lower Console
Power Supply
Lower Console
To Power Source
TOP FACE
(See Figure 2-21)
REAR FACE
(See Figure 2-21)
*NOTE: Pictures may differ due to on-going improvements
Figure 2-20 Power System Physical Layout
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© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
Error Code
Test Points
Main Power Cable
F1
F2
REAR FACE
J6
F7 J1
F8
PC
J9
J16
J7
J12
J8 J13
J10 J11 F3 F4 F5 F6 J2 J3 J4 J5
HEATERS
AC ACCESSORIES
TOP FACE
Figure 2-21 Power System Physical Layout 2
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Section 2: Lower Console
2.7.1.2
AC Power Distribution
All AC-powered components were designed to operate from facility line
voltage in the range 200 to 240VAC at 50/60Hz. These components
require no configuration to operate from a specific line voltage and frequency. Figure 2-18 shows the distribution of AC power throughout wire
bonder. AC loads include heater elements, a computer, LCD monitor, ZTC
and blower fan.
The heater outputs are three (3) switch controlled outputs that are fed
from 240VAC. Each heater output is independently controlled by a discrete signal. The load on each of these outputs is a resistance heating
element having a rating of 100 to 200Watts @ 240VAC.
2.7.1.3
DC Power Distribution
The output DC power is supplied via the rectifier and power factor correction. Specifications for each DC output power supply can be found in
Table 2-11. Outputs can be checked at the numbered test points at the
rear of the power supply as shown in Figure 2-22. DC loads include digital and analog electronics, sensors, relays and solenoids, stepper motors,
servo motors, and fans.
Table 2-11 Power Supply DC Outputs
Voltage
Current (Amps)
Minimum/Maximum
Regulation (Volts)
Minimum/Maximum
Ground
Reference
+5VDC
7.29/30.0
4.90/5.20
DGND
+12VDC
0.27/9.8
11.6/12.4
DGND
-12VDC
0.17/1.0
-11.6/-12.4
DGND
+5AUX
0.45/3.8
4.8/5.3
PGND
+12AUX
0.92/14
11.6/12.4
PGND
-12AUX
0.02/0.6
-11.6/12.4
PGND
+36VDC
1.9/10.0
33.0/40.0
PGND
+48VDC
0.07/4.0
42.0/48.5
PGND
-48VDC
0.02/2.9
-42.0/-48.5
PGND
+132VDC
0.07/6.0
125/135
PGND
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
2.7.1.4
Testpoints and Indicators
On the rear face of the power supply assembly shown in Figure 2-21 are
six (6) status indicator LED lamps and fifteen (15) testpoints which are
viewable from the rear of the lower console when the rear cover is
removed. Locations of the indicators and testpoints are shown in Figure 222; indications and testpoints are defined in Table 2-12.
Under Voltage Error Code
Test Points
Figure 2-22 Power Supply Rear face testpoints and indicators
Table 2-12 Test points and indicators Table
Reference
2-40
Type
Colour
Description
ERR1
LED
Red
Under/Over Voltage Error Code Indicator
ERR2
LED
Red
Under/Over Voltage Error Code Indicator
ERR3
LED
Red
Under/Over Voltage Error Code Indicator
ERR4
LED
Red
Under/Over Voltage Error Code Indicator
INH/ PFA
LED
Yellow
Lit when machine is in motor stop mode which represents no high votage present or power fail has just
occurred.
PSOK
LED
Green
Normally lit. It will unlit when there is an undervoltage (UV) or overvoltage (OV). It will also unlit
momentarily after motor stop occurred
PGND
Testpoint
Black
Power Ground
DGND
Testpoint
Black
Digital Ground
-48V
Testpoint
Black
Z Servo Motor
-12V AUX
Testpoint
Black
Analog Electronics
12V
Testpoint
Red
Analog Electronics, Solenoids
-12V
Testpoint
Black
Analog Electronics
5V
Testpoint
Red
Digital Electronics
PSOK
Testpoint
Red
Power Supply Good:P/S outputs are within specification.
POC
Testpoint
Red
Power On Clear: Asserted 1 second after +5V supply rises above undervoltage trip level.
PFA
Testpoint
Red
Power Fail Alert: Monitors the input power line voltage and issue a signal to the host system whenever
it falls below the minimum AC line voltage.
5V AUX
Testpoint
Red
Digital Electronics
12V AUX
Testpoint
Red
Analog Electronics, Solenoids
36V
Testpoint
Red
Stepper Motors
48V
Testpoint
Red
Z Servo Motor, EFO System
132V
Testpoint
Red
XY Servo Motors
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
2.7.1.5
Status Lights
The four [4] red LEDs (labeled ERR1, ERR2, ERR3 and ERR4) are used
in the event of an undervoltage (UV) or overvoltage (OV) occurence
detected on any output. Depending on the output error, each LED will light
up according to the output signal to identity the fault. The LEDs can be
cleared by cycling power on the unit. See Table 2-13 for the power supply
fault table.
Table 2-13 Power Supply Fault Table
Fault Specification
Code #
2.7.2
Condition
1=LED ON, 0=LED OFF
ERR
1
Signal
ERR
2
ERR
3
ERR
4
Clear Code by:
Power Supply off, on
0
Normal
NA
0
0
0
0
NA
1
UV
+5V
0
0
0
1
X
2
UV
+12V
0
0
1
0
X
3
UV
-12V
0
0
1
1
X
4
UV
+5V AUX
0
1
0
0
X
5
UV
+12V AUX
0
1
0
0
X
6
UV
-12V AUX
0
1
1
0
X
7
UV
+36V
0
1
1
1
X
8
UV
+48V
1
0
0
0
X
9
UV
-48V
1
0
0
1
X
10
UV
+132V
1
0
1
0
X
11
OV
+5V,+12V,12V
1
1
0
0
X
12
OV
+5V AUX, 1
+12V AUX,
-12V AUX
1
0
0
X
13
OV
+36V
1
1
0
1
X
14
OV
+48V,-48V
1
1
1
0
X
15
OV
+132V
1
1
1
1
X
Surge and Spike Protection
The Power System are internally surge and spike protected. Additionally,
in the event of a catastrophic hardware failure, the unit is fused to ensure
that harmful levels of electrical energy do not further damage equipment.
These fuses are user replaceable without opening or disassembling the
power supply unit.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-41
Maxµm Ultra Ball Bonder
2.7.2.1
Mains input and AC Fusing Specification and Location
The AC Input fuses are located at the rear face of the power supply
assembly with reference from F1 to F2. The AC accessories fusing are
located on top face of the power supply unit. All fuses are field replaceable
without disassembling the unit. See Fuse specification in Table 2-14 and
Figure 2-21 for the fuse location.
Table 2-14 Fuse Specification
Fuse #
2.7.3
Circuit Location
Function
Amp Rating
F1 (rear)
AC Line(Brown) input
AC input protection 15A
F2 (rear)
AC Line(Blue) input
AC input protection 15A
F3 (top)
AC Line (Brown) to pin 2,4 & 6 of J11
Heater protection
5A
F4 (top)
AC Line (Blue) to three SSRs
Heater protection
5A
F5 (top)
AC Line (Blue) to pin 1 of Auxiliary AC out- Aux AC output pro- 5A
puts (J2,J3,J4,J5)
tection
F6 (top)
AC Line(Brown) to pin 2 of Auxiliary AC
outputs (J2,J3,J4,J5)
F7 (top)
Pin 1 of J9 to Pin 1 of J1 to Inverter Output PC protection
to Pin 3 of J1
2A
F8 (top)
Pin 3 of J9 to pin 3 of J1 to Inverter Output PC protection
to pin 1 of J1
2A
Aux AC output pro- 5A
tection
Corrective Maintenance/Field–Replaceable Units
No attempt should be made to repair any of the power supply components. If the machine is under warranty, doing so will void warranty protection on the power supply. The only maintenance required for this power
supply is to check and replace the fan filters. See Section 2.7.5 for details.
•
Power Supply Assembly
The entire power supply assembly is considered a Field–Replaceable
Unit (FRU), but not a field–repairable unit. If a problem is encountered
with the power supply, K&S recommends replacement of the power
supply with a new or serviced unit. The defective power supply should
be returned to K&S for evaluation and repair.
•
Power System FRU List
The following power system components are considered FRUs:
FRU
2-42
Part Number
Location
Ref.
TDI Power Supply Assembly
08858-0012-000-xx
Lower Console
Start/ Stop Switch
15850-6067-000
Lower Console
EMO switch
15850-6045-000
Upper Console
Fan Filter
Qualtek Filter, P/N
09325-M/45
Lower Console
2.7.5
F1 and F2 (15A/ 250V)
18538-6004-002
Power Supply Assembly
2.7.2.1
F3 & F4(5A/ 250V)
18538-6003-001
Power Supply Assembly
2.7.2.1
F5 & F6 (5A/ 250V)
18538-6091-000
Power Supply Assembly
2.7.2.1
F7 & F8 (2A/ 250V)
18538-6042-000
Power Supply Assembly
2.7.2.1
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
2.7.7
Section 2: Lower Console
2.7.4
Access to Components
Access to the power supply and some other power system components
can be gained by removing the rear cover of the machine console. Figure
2-23 shows how the panel is removed.
Lower Console
Power Supply
Mounting Screw
(6 places)
Frame Ground Terminal
Rear Cover
Figure 2-23 Access to Power System Components
2.7.5
Check/Replace Fan Filters
Purpose
Check condition of fan filter. Filter should be replaced if it appears clogged
with dust.
Tools/ Materials/ Parts
•
Screwdriver
•
Large plastic bag
•
Qualtek Filter, P/N 09325-M/45
NOTE: Use of alternate filters could damage the power supply and will void the
warranty.
Frequency
•
Filter should be checked after every 6 months of operation.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-43
Maxµm Ultra Ball Bonder
Procedure
A. Open the rear cover of the lower console.
B. Locate the power supply filter by disengaging the filter housing at the
rear of the power supply.
C. Inspect the filter. If the filter does not appear clogged with dust, return
the filter to the filter housing and snap it onto the power supply. If it
appears clogged:
1. Immediately seal the filter in a large plastic bag.
2. Remove the filter from the production area.
3. Install a replacement filter in the housing.
2.7.6
Check DC Outputs
Purpose
Verify presence and regulation of power supply outputs. Outputs are
checked at the test points on the rear of the power supply assembly.
Tools/ Materials/ Parts
•
Digital Multimeter
Frequency
•
All DC outputs should be checked immediately after machine installation and after every 3000 hours of machine operation.
Procedure
WARNING: DANGER! HIGH VOLTAGE! - USE CAUTION WHEN WORKING ON
EQUIPMENT WITHIN THE LOWER CONSOLE WHEN MACHINE
POWER IS ON.
A. Make sure the machine power cord is connected to facility power.
B. Make sure that the bolts (M6- captive screws shown in Figure 2-25)
connecting the power supply to the lower console are tight. These
bolts ensure a good ground between the power supply and the rest of
the machine.
C. Make sure the machine is powered up. If not, using a quick motion,
press the POWER Start Button switch to start the machine.
D. Remove the rear cover of the lower console and the protective cover (if
any) of the DC testpoints as shown in Figure 2-22.
NOTE: Refer to Table 2-11 for minimum and maximum voltages for each output
(under Regulation in the table.) The table also identifies the test point for
each output.
E. Check DC voltages at test points using a digital multimeter (See Figure
2-22 and Table 2-11 for test point locations and output ratings):
1. Check +5 V, +12 V, and -12 V, using the DGND as the reference.
(multimeter black or ground lead attached to DGND).
2. Check +5 VAux, +12 VAux, and -12 VAux, using the PGND as the
reference (multimeter black or ground lead attached to PGND).
2-44
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
3. Press Motor ’ON’ on MMI keypad and check +36V, +48V, -48V, and
132VDC using the PGND as the reference (multimeter black or
ground lead attached to PGND).
NOTE: 1. Voltage at +132VDC test point are one–tenth (1/10) of actual voltage.
Multiply the reading at the test point by 10.
NOTE: 2. These test points are meant for multimeter measurements. If an
oscilloscope is used to record the voltage waveforms, the waveforms
may show high frequency noise, due to the low impedance of PGND
and DGND.
NOTE: 3. The +5V requires a connection to the machine backplane in order to
read within the regulation range. If during debugging, backplane connections are removed, the +5V will read close to +5.7V.
F. Check PSOK, PFA, and POC referenced to DGND (PSOK, PFA, and
POC should measure approximately +5 V (logic high).
G. If any DC output is outside of its specified range (see note 3 above), do
the following:
1. Turn off machine power. Disconnect the machine power cord from
the facility receptacle. Do not attempt to use the machine until the
power supply problem has been resolved.
CAUTION: Do not attempt to repair or adjust the power supply modules! There
are no user–serviceable parts within the power supply module cases.
2. If the machine is under warranty, notify the local K&S Sales/Service
office immediately. If the machine is not under warranty, remove
and replace the power supply assembly. There are no user–serviceable or adjustable components within the power supply assembly.
H. If all DC outputs are good, install back the protective cover and the
rear panel on the lower console.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-45
Maxµm Ultra Ball Bonder
2.7.7
Remove and Install Power Supply Assembly
Purpose
Remove the power supply assembly from the machine. Install a replacement power supply assembly in the machine.
Tools/ Materials/ Parts
•
Hand tools
•
Hex wrench set
Procedure
A. Press MOTOR STOP. Turn off machine power.
B. Disconnect machine power cord from the power supply receptacle.
C. Remove the rear cover from the machine console (see Figure 2-23).
D. Disconnect all the cables that is connected to the power supply in
order to remove the unit (see Table 2-15 and Figure 2-24).
J6
F7 J1
J9
J16 J7 J12 J8 J13
J14
J10 J11 F3 F4 F5 F6 J2 J3 J4 J5
F8
PC
HEATERS
AC ACCESSORIES
TOP FACE
Figure 2-24 Power Supply Connection Location
Table 2-15 Cable list for power supply
Power Supply
Connection Point
Cable Part Number
Cable
Connector
J1
CBL_PCIAB_PWR
08858-2010-000-00
P2
J10
CBL_HEAT_SIG
08858-2016-000-00
P1
J2
CBL_ZTC_PWR
08858-2011-000-00
P2
J3
CBL_LPC_MON_PWR
08088-2081-000
P2
J4
CBL_VISION_POWER
08828-1015-000-00
J5
CBL_FAN_PWR
08858-2018-000
P1
J6
CBL_POWER2_TDI
08858-2022-000
P1
J7
CBL_ULTRA_PS3
08858-2077-000
P1
CBL_PS_SIGNAL
08089-1009-000
J12
J8
2-46
Cable Description
-
P4
P1
J13
CBL_SW-START/STOP LED 08858-2009-000-00
P1
J14
CBL_EMO_HI/LO
08858-2008-000
P1
J9
CBL_POWER1_TDI
08858-2021-000
P1
J11
CBL_HEATERS
08858-2015-000
P1
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 2: Lower Console
WARNING: THE POWER SUPPLY WEIGHS 44 POUNDS (20 KILOGRAMS). AT
LEAST TWO PEOPLE SHOULD BE PRESENT TO LIFT THE POWER
SUPPLY OUT OF THE MACHINE OR INSTALL THE POWER SUPPLY
IN THE MACHINE.
E. Loosen two captive screws that secure the power supply tray to the
lower console frame. Using at least two personnel, slide the power
supply out of the lower console and then lift the power supply using the
lifting handles on the side.
Lower Console
(Covers and machine
base removed for clarity)
Power Supply
Power Supply
Stopper pins
M6 Captive screws (2x)
Figure 2-25 Replace Power Supply Assembly
CAUTION: Before pushing the power supply into the lower console in the next
step, make sure there are no cables between the power supply and
the card rack backplane board. Cables may be damaged if pressed
against the backplane by the power supply tray.
F. Using at least two personnel, use the side handles for sliding and lifting
the power supply assembly out of the lower console.
G. Connect all cables previously taken out in step D. (see Table 2-15 and
Figure 2-24 for cable reference).
H. Ensure that the AC Input selector is set to the right factory voltage rating.
I. Make sure there are no cables blocking between the power supply and
the backplane board. Push the power supply slowly but firmly toward
the front of the machine until it stops against the locating screw (see
Figure 2-25).
J. Tighten two (2) captive screws to secure the power supply to the
frame.
K. Connect the machine power cord to the facility receptacle.
NOTE: The green indicator on the start/ stop switch will lit when the machine
power cord is connected to the facility receptacle.
L. Turn on machine power and verify that the green PSOK indicator lamp
lights.
M. After machine initialisation (release of motor stop), verify that the green
PSOK indicator lamp is lit. Mount the rear cover back to the lower console.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
2-47
Maxµm Ultra Ball Bonder
2.8
Connectors for External Equipment
At the rear of the lower console is a Cat 5 cable connection point used for
equipment external to the Maxµm Ultra (see Figure 2-26). This is a RJ45
connector (female to female) clipped at the lower console rear frame and
connected to an ethernet cable routed and linked to a PCI bus ethernet
card in the system computer.
RJ45 Connector
(Female)
Figure 2-26 Electrical Connector for External Equipment
2-48
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
3
Upper Console
3.1
About This Chapter
Here’s what you will find in this section:
Section 3.2, Overview, describes the various components within and
mounted on the Upper Console. It contains basic component information
and location of each component in the upper console.
•
Each section from Section 3.3 through 3.8 covers a functional system
and its major components. It explains how to replace, adjust and do
preventive maintenance on each component.
•
Section 3.3, Pneumatic System
•
Section 3.4, Wire Feed System
•
Section 3.5, Wire Feed/ BITS Board
•
Section 3.6, LCD Monitor
•
Section 3.7, Signal Light and Work Light
•
Section 3.8, Microscope
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-1
Maxµm Ultra Ball Bonder
3.2
Overview
This section contains maintenance information for assemblies within or
mounted on the Maxµm Ultra upper console: pneumatic system controls,
wire feed system, wire feed/BITS board, color monitor, and signal light
tower (see Figure 3-1). Topics covered include system descriptions,
setup, preventive maintenance, and parts replacement for each of these
assemblies and subsystems.
•
Pneumatic System
The pneumatic system supplies and controls compressed air and vacuum to the wire feed system, air diffuser, servo motors, and the material handling system (MHS). Vacuum, developed from compressed air,
is used at the workholder heat block to hold down the device during
wire bonding. This section contains general information concerning the
pneumatic system and maintenance procedures for the input air filter
and air control devices. The controls and indicators for the machine
pneumatic system are mounted on the upper console and on the Operator Control Panel (MMI). See Section 3.3 for further details.
•
Wire Feed System with Bond Integrity Test System (BITS)
The wire feed system consists of a motorized spool mount, air pressure and vacuum devices, and control electronics that together ensure
precise wire feed and tension. The Bond Integrity Test System (BITS),
part of the wire feed control electronics, tests for the outcome of the
bonding process. The wire feed/BITS circuit board, mounted within the
upper console, contains the wire feed control electronics, BITS circuitry and sensor interface circuitry for XY table limit sensors. See
Section 3.4 and Section 3.5 for further details.
•
LCD Monitor
A color LCD monitor is mounted on top of the upper console. The monitor displays menus of software options, a graphical representation of
the device being bonded, cursor–selectable option ”keys”, and a live
video window that shows the device at the bond site. Screen displays
are fully described and procedures for their use are provided in Volume
1: Maxµm Ultra Operations. Monitor maintenance includes periodic
cleaning of the monitor screen, adjustment of monitor controls, and
replacement of the monitor if it stops functioning properly. No other
maintenance should be required.
•
Signal Light Tower with Audible Alarm
The three–lamp (LED) signal light tower at the top rear or the machine
is used to indicate normal machine operation, material requirements,
or machine problems to the operator during production runs. The lights
are positioned and are bright enough so that they can be easily seen
from a distance. The height of the signal tower above the upper console can also be adjusted to suit individual facility requirements. An
audible alarm that can generate several different sounds is part of the
signal light tower. It will sound (if enabled) to indicate material needs or
machine errors. The conditions under which the lights go on or the
alarm sounds can be programmed by the operator through machine
software.
•
Work Light
As a convenience for the user, a work light is attached to the underside
of the upper console. It can be switched on and off by making a selection on the monitor screen display, and positioned to illuminate any
part of the area around the bond site. A software interlock prevents the
work light from being switched on when the machine is operating in
3-2
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
Auto Mode, or if the light is on, switches it off when automatic operation begins. This prevents pattern recognition system/video lead locator (PRS/VLL) errors caused by light from the work light altering bond
site illumination during eyepoint and lead find operations.
•
Microscope
The Microscope located at the machine front is used as a zoom-in
visual tool to check the bondsite processes and bonding quality. Also,
it can be used to assist wire threading. See Section 3.8 for preventive
maintenance and replacement procedures.
Air Guide Assembly
Pressure Gauges (3)
Emergency Stop Switch
Wire Feed
Manifold Assembly
EFO Box
Wire Feed/BITS Board
Signal Light
Tower Clamp
Work Light
Figure 3-1 Upper Console, Major Components
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-3
Maxµm Ultra Ball Bonder
3.3
Pneumatic System
3.3.1
System Description
The pneumatic system in the Maxµm Ultra supplies compressed air to the
following devices from a single facility air pressure source:
•
Wire feed air guide
•
Wire tensioner
•
Thread assist
•
XY table assembly
•
Bond site diffuser
•
Bond head
•
Material handling system (MHS) workholder
Vacuum is produced from compressed air to hold down devices at the
workholder heat block and tension bonding wire between the air guide
and capillary.
A schematic diagram of the pneumatic system is shown in Figure 3-2.
This diagram is also printed on label attached to the inside of the upper
console rear cover. Figure 3-3 shows the locations of pneumatic system:
regulators, input air regulator/ filter/ pressure gauge and controls/indicators.
Input air pressure from the facility supply is connected to an air filter/air
regulator/pressure gauge assembly attached to the right side of the lower
console. The pressure regulator regulates the input air pressure to 55 psig
(3.87 kg/cm2). The digital gauge reports regulated pressure to the user.
The machine control system monitors air pressure from the facility by
means of a pressure sensor (integral to the digital pressure gauge)
mounted in the input air line after the pressure regulator.
Figure 3-2 Pneumatic System, Schematic Diagram
3-4
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
The air pressure from the input regulator is connected to a manifold valve
which distributes the air to all the pneumatic equipment. The main output
of the the air pressure goes to the wire feed system, XY table cooling,
vacuum generation, diffuser and cooling on the bondhead and vision
assemblies.
Except for MHS workholder pneumatic applications, solenoid valves
located within the manifold are operated by the control system, controlling
the output of air to each application.
The user can regulate air flow to the air guide, the tensioner and the diffuser by adjusting sub-regulators on the upper console front. Also, the
user can trigger On/Off the air guide and tensioner by pressing push button switches on the MMI assembly. Gauges on the front face of the upper
console report air pressure at the air guide, tensioner and diffuser location.
There are also 3 airflow outputs catered to cool the X and Y servo motors,
Z motor and LED illumination on the bondhead assembly. They each
serve to regulate heat transfer within the subsystem to maintain an
acceptable operating temperature of the each equipment.
Vacuum is required at the workholder bond site to secure the device during the bonding process and also used for auto-wire threading at the top
of the wire feed tube. Vacuum is generated by a vacuum generator
located within the manifold valve. This is then distributed to the
workholder and to the wire feed tube. Vacuum at the wirefeed tube can be
activated by triggering the vacuum wire threading button (spring return
type) located at the upper console front panel and by switching off the tensioner. When vacuum is activated, the air guide will switch from high flow
to low flow operation so as to assist in wire threading. The Workholder
bond site vacuum is controlled by a solenoid valve located at the rear of
the workholder. No user adjustment or control of heat block vacuum is
required.
System Pressure
Regulator
Facility
Air Input
System Pressure
Guage
Pressure Controls
and Indicators
Air Filter/
Moisture Trap
Upper Console
Input Air Supply Unit
Front View
Figure 3-3 Pneumatic System Component Locations
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-5
Maxµm Ultra Ball Bonder
3.3.2
3.3.2.1
Pneumatic Controls and Indicators
Description
The following pneumatic controls and indicators are mounted on the lower
console. Their locations are shown in Figure 3-4.
•
Input Air Regulator/Digital Pressure Gauge/Pressure Sensor
The input air regulator/digital pressure gauge assembly is mounted on
the right side of the lower console. Input air pressure from the facility
supply is connected to an air filter/moisture trap which is part of the
regulator/pressure gauge assembly. The air is routed to the input air
regulator, where pressure is regulated to 55 psig (3.87 kg/cm2). The
digital gauge on the assembly reports regulated pressure to the user.
The machine control system monitors air pressure from the facility by
means of a pressure sensor that is part of the digital pressure gauge.
The pressure sensor monitors two user–selected thresholds. When air
pressure drops below the first preset threshold, which is close to the
pressure level below which the machine cannot operate, the machine
will issue an alarm indication to warn the operator, but machine operation continues. If air pressure drops below the second preset threshold, which is below the pressure level at which the machine can
reliably operate, the machine will indicate an error and stop operating.
•
Wire Feed Pneumatic Controls/Indicators
Pneumatic controls for the wire feed system are mounted on the front
panel. Refer to Table 3-1 for initial settings for these regulators. Refer
to paragraph 3.4.1 for a description of the wire feed system.
•
TENSIONER pressure adjuster: adjusts pressure at the wire ten-
sioner mounted on the optics assembly.
•
TENSIONER pressure gauge: reports pressure at the wire tensioner.
•
AIR GUIDE pressure adjustor: adjusts pressure at the air guide
mounted on the front face of the upper console.
•
•
•
Diffuser Control and Indicator
•
DIFFUSER pressure adjustor: adjusts air flow directing to the bond
site area. This is mounted on the workholder clamp arm. Refer to
Section 4 of this manual for a description of diffuser function.
•
DIFFUSER pressure gauge: reports air pressure at the air diffuser.
Vacuum Wire Threading Control
•
3-6
AIR GUIDE pressure gauge: reports air pressure at the air guide.
VACUUM WIRE THREADING Button: When pressed (with tensioner
button turned OFF), a vacuum suction will develop at the top opening of the wire feed tube which then sucks the wire into the tube.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
Diffuser Pressure Gauge
Air Guide Pressure Gauge
Tensioner Vacuum Gauge
Input Air Pressure
Regulator
1
Input Air
Pressure Gauge
and Sensor
2
Manifold Assembly
(See Detail below)
Right Side
Lower Console
Upper Console
Hi/Low AirGuide
Solenoid
AirGuide
Solenoid
Vacuum Exhaust
Bond Site Vacuum
Y Motor
Cooling
Regulated
Air Pressure
Tensioner
Solenoid
Diffuser
Needle
Valve
Z Cooling
Solenoid
5
Z Motor
Cooling
Air Guide
Needle
3
Valve
X Motor
Cooling
Thread Assist
Button
4
Tensioner
Needle Valve
Detail -- Manifold Assembly
Figure 3-4 Pneumatic Controls and Indicators
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-7
Maxµm Ultra Ball Bonder
3.3.2.2
Initial Settings
During machine setup, adjust pneumatic controls according to Table 3-1.
These settings may be changed as needed when operating the machine.
Index numbers in the table (Index column) are from Figure 3-5.
Table 3-1 Initial Settings for Pneumatic Equipment
Index
Name
Setting
Notes
System pressure is reported on
input air pressure gauge (digital
display). The regulator/gauge
assembly is mounted on the right
side of the lower console.
1
Input Air Regulator
2
Air pressure sensor (part Low pressure warning =
of digital pressure gauge) 52 psi (3.66 kg/cm2)
Low pressure error = 48
psi (3.38 kg/cm2)
Sensor set up:
d (digital)
H (hysteresis)
S (psi units)
1. Machine issues low pressure
warning when air pressure goes
below low pressure warning level,
but operation does not stop.
2. Machine operation stopped if air
pressure goes below low pressure
error level.
Refer to paragraph 3.3.4.3 for sensor set up procedure.
3
Air Guide
1. Press AIR GUIDE switch on the
MMI key pad. Make sure indicator
LED lights.
2. Adjust air guide regulator to
adjust pressure (indicated on
gauge).
3. Turn off air on the MMI keypad
(LED dark) when done.
55 psi (3.87 kg/cm2)
Nominal:
22 psi (1.55kg/cm2)
Range:
12 to 36 psi
(0.84 to 2.53kg/cm2)
4
Wire Tensioner
Nominal:
8 psi (0.56kg/cm2)
Range:
3 to 10 psi
(0.21 to 0.7kg/cm2)
5
Air Diffuser
-
X,Y and Z Servo Motors
3-8
10 - 15 psi (0.7 - 1.06 kg/
cm2) initial setting
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
1. Press TENSIONER switch on
the MMI key pad. Make sure indicator LED lights.
2. Adjust wire tensioner regulator
for initial setting as reported on
pressure gauge.
3. Turn off tensioner (LED off) on
the MMI keypad when done.
4. Adjust later as needed to correct
for clubbed balls (air pressure low)
or uneven loops (air pressure
high).
1. Adjust diffuser regulator for initial setting as reported on diffuser
gauge.
2. Increase pressure if PRS can’t
find eyepoints during teaching or
operation.
Not Adjustable by User
Section 3: Upper Console
3.3.3
Preventive Maintenance
Preventive maintenance requirements for the pneumatic system are summarized in Table 3-2.
Table 3-2 Pneumatic System Preventive Maintenance
Service
Frequency
Notes/Reference
Clean wire feed air guide
8 hours (nonclean–room), 200
hours (cleanroom)
Refer to Paragraph 3.4.3.2.
Check for vibration at wire
feed
Every wire spool
change
At air guide regulator, adjust air flow to minimize
vibration between wire spool and diverter during
wire feed operations.
Inspect air/vacuum hoses
1000 hours
Inspect for:
• cracks, cuts, or leaks
• pinching or kinks
• loose fittings
• signs of wear or stretching
Inspect external air pressure system
As required
Check facility pressure. Must be set to 65 psi
(4.58 kg/cm2) minimum, 80 psi (5.64 kg/cm2)
maximum).
Inspect/clean input air filter
As required
1. Remove water/oil from moisture trap.
2. Replace filter element if it appears clogged or
dirty.
Refer to paragraphs 3.3.4.1 and 3.3.4.2
3.3.4
3.3.4.1
Maintenance Procedures
Clean Input Air Filter
Purpose
Remove water/oil from the filter moisture trap. Inspect filter element and
replace it if necessary.
Tools/ Materials/ Parts
•
Small container
Frequency
•
As required
Procedure
A. Turn off machine power.
B. Locate the input air filter/moisture trap assembly on the right side of
the lower console (see Figure 3-4).
C. Visually check the moisture trap. Remove any fluid in the trap.
1. 1. Place a small container underneath the air filter to catch the
fluid.
2. 2. Press the drain valve at the bottom of the filter to drain the fluid
out of the filter into the container.
D. D. Visually check the condition of the air filter through the clear plastic
window in the moisture trap. If it appears clogged or dirty, perform the
procedure in paragraph 2.3.6.3 to replace the filter.
3.3.4.2
Replace Input Air Filter
The input air filter is mounted on the lower console assembly. Refer to
Section 2 of this manual for the input air filter replacement procedure.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-9
Maxµm Ultra Ball Bonder
3.3.4.3
Set Up Low Air Pressure Sensor
Purpose
Set up the conditions under which the low air pressure sensor operates.
Two pressure levels are set:
•
Level at which the machine will warn the user that air pressure is low
but will not stop operating.
•
Level at which the machine will stop operating and indicate an error
condition.
Basic operating options for the sensor are also set in this procedure.
Tools/ Materials/ Parts
•
None
Procedure
A. Disconnect the machine from facility air pressure. Locate the digital air
pressure gauge/pressure sensor on the right side of the lower console
(see Figure 3-3).
B. Unlock Pressure Sensor
1. Press the MODE key and DOWN arrow key simultaneously till [UnC]
appears.
C. Zero Reset (If the value is not zero)
1. Press and hold the MODE key for 3 seconds to reset the set value
to zero.
D. Output Configuration
1. Press the MODE key and UP arrow key simultaneously till to display [ou1], press the UP or DOWN key till to display [ou1] [n.o.]
alternatively. Then press the MODE key once and press the UP or
DOWN arrow key till to display [ou2] [n.o.] alternatively.
2. Press the MODE key once to display the unit of measurement,
press the UP or DOWN arrow key till to display [PS] to set to psi
unit.
3. Press the MODE key once to display [ESY], press the UP or
DOWN arrow key till to display [ESY] and [off] alternatively.
4. Press the MODE key to display [End].
E. Set Hysteresis Mode
1. Press the MODE key twice to display [-2-], wait for three seconds to
display [ou1], press the UP or DOWN arrow key till to display
[HYS].
2. Press the MODE key to display [End].
F. Setting of Pressure Values
1. Press the MODE key once to display [-1-], press the UP or DOWN
arrow key till to display [H-1] and [52] alternatively.
2. Press the MODE key once to display [h-1], press the UP or DOWN
arrow key till to display [h-1] and [4] alternatively.
3. Press the MODE key to display [END].
G. Lock Out
1. Press the MODE key and DOWN arrow key simultaneously till
[LoC] appears.
H. Connect facility air pressure to the machine.
3-10
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
3.3.4.4
Replace Air Solenoid Valves
Purpose
•
Replace a non–functional air solenoid valve on the air manifold assembly. The Maxµm Ultra has two (2) identical solenoid valves on the manifold, one each for the wire feed air guide and wire tensioner.
Tools/ Materials/ Parts
•
Hex wrench set
•
Solenoid Valve, 3–Way, P/N 28070-6050-005
Procedure
A. Press [MOTOR STOP].Turn off machine power.
B. Disconnect the machine from facility air pressure.
C. Locate the manifold assembly under the right side of the upper console
(see Figure 3-5).
D. Remove four (4) screws and washers that secure the manifold assembly to the upper console.
E. Disconnect two (2) wires connected to the valve to be replaced.
F. Remove two (2) screws and gasket that secure the valve to the manifold.
G. Position the replacement valve and gasket on the manifold and secure
with two (2) screws.
H. Connect two (2) wires removed in step E. to the replacement valve.
I. Position the manifold assembly in place under the right side of the
upper console and secure with four (4) screws removed in step D..
J. Power up the machine and verify solenoid valve operation.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-11
Maxµm Ultra Ball Bonder
3.4
Wire Feed System
3.4.1
3.4.1.1
System Description
Description
The wire feed system (Figure 3-6) consists of the following components:
•
Motorized Spool Mount
Holds and rotates the wire spool to provide the precise length of wire
required for bonding. The wire feed is controlled by an optical sensor
which maintains a more or less constant length of wire between the
spool and bonding tool. When the optical sensor sense the wire, motor
operation is enabled. The motor is disabled when the wire moves out
of the sensor range or after a minimum duration of wirefeed.
The wire feed controller circuit also provides a time–out as a second
safeguard against uncontrolled wire feeding. The motor will be stopped
if it has been running for a maximum feed duration.
•
Air Guide and Optical Wire Detector Sensor
The air guide guides wire between the wire spool and the wire tensioner (mounted on the optics assembly). Air jets within the guide lift
the wire to form a generous service loop and position the wire within
the detection area of the optical wire detector sensor.
The optical wire detector sensor detects the presence of the wire
within the air guide only when there is a demand for wire. When there
is no demand, the wire is spooled out of the sensor, which disables the
feed motor. When enough wire has been fed so that the air jets can lift
the wire out of the sensor detection area, the feed motor is disabled.
•
Wire Tensioner
Guides and maintains tension on wire from the air guide to the bond
head. Pressure is applied to provide wire tension. The tensioner is
mounted in the vertical illuminator housing on the right side of the
optics assembly.
•
Vacuum Wire Threading Button
When threading wire, the tensioner button must be off. To aid the operator to thread the wire through the tensioner, the vacuum wire threading button is pressed to create a vacuum suction that will feed in the
wire into the tensioner tube body.
•
Wire Feed Circuit Board
Most of the wire feed logic is contained on the Wire Feed/BITS circuit
board, which is mounted inside the rear of the upper console. This
board also has Bond Integrity Test System (BITS) circuitry used to
detect non–stick bonds at the die or package lead during auto bonding.
The BITS circuit can also detect short–tail conditions (not enough wire
extending below the capillary for ball formation after second bond).
The circuit board is easily accessible so that it can be replaced if necessary.
Wire–feed–related switches and indicators are contained on the Wire
Feed Interface circuit board, which is mounted inside the front face of
the upper console. This board interfaces to the Wire Feed/BITS board.
3-12
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
Spool Cover
Air Guide
and wire detector sensor
Diverter
DIFFUSER
AIR GUIDE
TENSIONER
Spool Holder
Air Guide
Regulator
Air Guide
Amplifier
Tensioner
Regulator
Thread Assist
Button
To wire tensioner
Detail A - Controls/Indicators
Air Guide Control/
Indicator
Wire Feed Control
Tensioner Control/
Indicator
Detail B - Control buttons and indicators on MMI
Figure 3-5 Wire Feed System
•
Controls and Indicators
Electrical and pneumatic controls/indicators for the wire feed are
located on the front face of the upper console (see Figure 3-6). In addition to the pneumatic controls and indicators (described in paragraph
3.3.2.1), the following electrical controls and indicators are present:
•
WIRE FEED Button
Wire spool rotates to feed wire when button is pressed.
•
TENSIONER Button
Pressing button turns “ON” vacuum and wire tensioner to “OFF”.
•
TENSIONER Indicator
LED lights when vacuum to wire tensioner is ON.
•
AIR GUIDE Button
Pressing button turns air pressure to air guide ON and OFF.
•
AIR GUIDE Indicator
LED lights when air pressure to air guide is ON.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-13
Maxµm Ultra Ball Bonder
3.4.1.2
Wire Feed Control System
Wire feed functions are controlled by the Wire Feed/BITS circuit board
mounted inside the upper console. A simplified block diagram of the wire
feed subsystem is shown in Figure 3-7. The Wire Feed/BITS board drives
the wire spool stepper motor and opens or closes the solenoid valves that
supply air pressure to the air guide and vacuum to the wire tensioner. It
also monitors the optical wire sensor in the wire guide, turning the wire
spool to feed wire when the sensor indicates wire demand. BITS circuitry
is also part of this circuit board. Refer to paragraph 3.4.1.3 for BITS theory
of operation.
Inputs to the board are buttons on the MMI assembly to enable the user to
control the wire feed, output of the optical wire sensor in the air guide, and
RS232 serial data communications lines and control signals from the control system. These signals include a wire feed reset signal (WFRESET), a
signal that enables or disables the wire feed motor (WF_ENB), and a signal that allows the control system to trigger wire feed motor operation
(SPOOL_TRIG).
A micro controller IC controls all wire feed operations based on the inputs
from the control system, switch inputs, wire feed sensor state, and the
program stored in the on–board EPROM. From control system data and
WFRESET, the wire feed controller supervisor circuit sets the direction in
which the wire feed spool will turn (WD0 and WD1) and creates the on–
board system reset signal (SYS_RST). The micro controller operates two
driver circuits that open and close the air guide and tensioner solenoids.
Driver outputs also turn on indicator LEDs when the solenoid valves are
open.
Wire spool stepper motor control takes place through four (4) control lines
generated by the micro controller: PHASE0, PHASE1, PHASE2, and
PHASE3. Each of these signals operates an individual driver circuit. The
motor is turned by the micro controller strobing single control lines and
pairs of control lines in a set sequence. The sequence is programmed so
that the driver outputs energize sets of motor coils to turn the rotor, each
step in the sequence turning the rotor through a small angle. Motor speed
is determined by the rate at which the steps are generated. Motor direction can be changed by running the sequence of steps in reverse.
If there is a wire feed error, the wire feed controller can inform the control
system by changing the state of the FEED_ERROR signal. Other status
signals and control signals between the control system and Wire Feed/
BITS board are involved with the BITS circuitry. (Refer to paragraph
3.4.1.3.)
A micro controller IC controls all wire feed operations based on the inputs
from the control system, switch inputs, wire feed sensor state, and the
program stored in the on–board EPROM. From control system data and
WFRESET, the wire feed controller supervisor circuit sets the direction in
which the wire feed spool will turn (WD0 and WD1) and creates the on–
board system reset signal (SYS_RST). The micro controller operates two
driver circuits that open and close the air guide and tensioner solenoids.
Driver outputs also turn on indicator LEDs when the solenoid valves are
open.
Wire spool stepper motor control takes place through four (4) control lines
generated by the micro controller: PHASE0, PHASE1, PHASE2, and
PHASE3. Each of these signals operates an individual driver circuit. The
motor is turned by the micro controller strobing single control lines and
pairs of control lines in a set sequence. The sequence is programmed so
that the driver outputs energize sets of motor coils to turn the rotor, each
step in the sequence turning the rotor through a small angle. Motor speed
3-14
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
is determined by the rate at which the steps are generated. Motor direction can be changed by running the sequence of steps in reverse.
If there is a wire feed error, the wire feed controller can inform the control
system by changing the state of the FEED_ERROR signal. Other status
signals and control signals between the control system and Wire Feed/
BITS board are involved with the BITS circuitry. (Refer to paragraph
3.4.1.3.)
WD0
WF_ENB
POWER ENABLE
CURRENT
ENABLE
SYS_RST
PHASE0
PHASE1
PHASE2
PHASE3
WD1
Supervisor
Spool
Motor
Motor
Drivers
WF_RESET
RXD3
RS--232
Interface
TXD3
Microcontroller
Tensioner
LED
Tension.
FEED_ERROR
SPOOL
TRIGGER
Tensioner
Solenoid
Driver
Solenoid
Valve
Air
Guide
Contact
Bounce
Eliminator
Tensioner
Feed
Air
LED
Air Guide
Pushbuttons
on MMI
Solenoid
Driver
Optical
Sensor
Solenoid
Valve
Air
Guide
EEPROM
Figure 3-6 Wire Feed Subsystem, Simplified Block Diagram
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-15
Maxµm Ultra Ball Bonder
3.4.1.3
BITS Theory of Operation
The bond integrity test system (BITS) was designed to detect and report
the following bonding faults:
•
Nonstick on pad (NSOP)
•
Nonstick on lead (NSOL)
•
Short Tail (SHTL)
The system can use either DC or AC excitation and these modes are GUI
programmable.
In the DC legacy mode, the BITS system impresses a DC voltage through
a resistor on an electrically isolated wire. Current flow is monitored from
the device bond pad or lead to machine chassis ground. From this “continuity signature”, software interpretation determines if an NSOP, NSOL, or
SHTL fault has occurred.
The AC mode is designed to measure resistance or capacitance when
wire bonds are occurring. During the downward Z motion of first bond, an
AC signal is generated on the electrically isolated bond wire prior to first
bond contact. Resultant calibration array data is stored. After calibration,
the AC signal is constantly generated, monitored and compared to the reference calibration array. If the array is attenuated in amplitude or shifted in
phase, a contact determination is made. If the signal reverts back to the
calibration data, a wire tear is indicated. The same status signal and timing for NSOP, NSOL, and SHTL are used for AC and DC BITS operation.
The Wire bond Monitor System (WBMS) has three input digital control
lines to control BITS and one output digital status. The three input digital
control lines consist of:
1. Enable: (On/Off)
2. Calibration: (On/Off)
3. Polarity: (+ or -) DC only
If enable option is switched off, it turns the BITS off by shorting the wire to
ground through a resistor. In this way, there is an option to prevent current
flowing through a device being bonded. The BITS is also turned off during
the time the EFO fires.
The polarity signal reverses the ±1 or 2.1 Volt DC source, which changes
the direction of the sense current through the wire.
The Calibration signal is used for calibration when using BITS in the AC
mode. The DC BITS is selectable at ±1 or 2.1 Volt source while the AC
BITS uses a 2 Volts Peak to Peak source.
The output status signal is then used by the software to determine the
integrity of the bond.
This high speed serial communication also includes three major programmable features. They are mode change (AC/DC), high or low current (1 or
2.1 DC Volts) and threshold value setting (AC/DC).
As shipped from the factory, the machine is configured to operate in DC
BITS mode of operation. A command to the Wire Feed/BITS board must
be changed so that AC BITS mode of operation may be used. Refer to
paragraph 3.5.1 for details.
3-16
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
3.4.2
Preventive Maintenance
The wire feed system requires the following preventive maintenance
actions:
3.4.3
3.4.3.1
•
Clean air guide after every 200 hours of operation (or more often if wire
feed problems occur caused by dirt build–up in the air guide). Refer to
paragraph 3.4.3.2.
•
Clean tensioner at every wire spool replacement or after 1000 feet
(300 meters) of wire usage (or more often if wire feed problems occur
caused by dirt build–up in the tensioner tubes). Refer to paragraph
3.4.3.3.
•
Check for bonding wire vibration between spool and diverter after
every wire spool replacement. Adjust air flow to air guide to decrease
vibration, if necessary.
Maintenance Procedures
Replace Wire Spool
Purpose
•
Replace empty bonding wire spool on wire feed assembly with a full
spool of wire.
Tools/ Materials/ Parts
•
Tweezers
•
Spool of bonding wire
NOTE: Proper orientation of the wire spool is very important when loading wire
onto the conductive spool holder. The end of the spool where the wire
begins to unreel must be towards the front of the machine and the finishing end (tail end) of the spool must be towards the rear of the machine
so that wire tail can be connected to the spring plunger electrical contact.
Procedure
A. Press the AIR GUIDE and TENSIONER buttons on the MMI key pad. Verify that the indicator LEDs are off.
B. Remove the bonding wire from the capillary and tensioner. Check the
tail end of the wire on the spool. If it is in the spring plunger contact,
press the plunger on the contact and remove the wire (see Figure 3-7).
Remove the spool from the spool holder.
C. Mount a new spool on the spool holder. Make sure that:
1. The side of the spool where the bonding wire begins to reel off of
the spool is toward the front of the machine; the side of the spool
where the end of the wire is taped to the spool flange is toward the
rear of the machine.
2. The spool is turned so that the end of the wire taped to the spool
flange is close to the spring plunger electrical contact on the spool
mount assembly.
3. The wire unreels in the direction (clockwise or counterclockwise)
set in the Miscellaneous dialog box of the Auto Configuration menu.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-17
Maxµm Ultra Ball Bonder
NOTE: In the next step, make sure the wire tail in the spring plunger contact will
not contact the sheet metal of the upper console, the motor mounting
screws, or the conductive surface of the spool cover. This will interfere
with the Bond Integrity Test System (BITS) signal. Leave a minimal tail
beyond the spring plunger contact and position it as shown in Figure 37.
Spring Plunger Contact
Wrap Spool End Tail Around Shaft
Leave Minimum Length End
Push
Wire Spool Mount
Spring Plunger Contact
Spring Plunger Contact
Keep Wire Tail Toward
Front of Spool
Wire Spool Mount
Wire Spool
Side View
Figure 3-7 Connect Wire End to Spring Plunger Contact
D. Detach the end of wire taped to the rear flange of the spool. Push in
the spring load plunger of the contact and place the wire end under the
contact point. Release the spring plunger. Make sure the wire end is
toward the spool and can’t contact any exposed metal surfaces on the
machine during spool rotation (See “Side View” in Figure 3-7 and previous NOTE).
WARNING: CAUTION! ELECTRICAL SHOCK HAZARD! DO NOT TOUCH THE WIRE
CLAMP WITH HANDS OR UNINSULATED TOOLS
E. Inspect the glass feed tube mounted on the wire clamps. Clean it if
necessary. Refer to Section 5 of this volume for procedure.
F. Thread wire through the wire feed as shown in Figure 3-8. Press the
FEED push button on the upper console as needed to pay out wire from
the spool. Press [F8] on the control panel to open or close the clamps
when needed.
G. Press the AIR GUIDE and TENSIONER buttons on the MMI key pad. Verify that the LED indicators are lid.
3-18
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© 2007 kulicke & Soffa Industries Inc
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Section 3: Upper Console
H. Use the mouse to target a device outer lead. Press [b1] (mouse button
1) to perform a bond off.
I. Verify that there is a ball present on the bonding wire below the capillary. If not, use the EFO button on GUI toolbar to fire the EFO and form
a ball on the wire.
J. Check for wire vibration between air guide and tensioner. If any is
seen, adjust air guide pressure to remove vibration.
K. If the “Wire Usage” software is being used, reset the wire usage statistics by selecting: [4] Configure, [8] Wire Usage, [4] Change Wire Spool.
Air Guide Sensor
(hidden)
Air Guide
DIFFUSER
CCW
Rotation
AIR GUIDE
Air Guide Optical
Sensor Preamp
TENSIONER
Air Guide
Adjust
Diffuser
Adjust
Thread assist
Button
Wire
Wire Tensioner
Glass Wire
Feed Tube
Wire Clamps
Transducer
Capillary
Figure 3-8 Wire Spool Replacement
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-19
Maxµm Ultra Ball Bonder
3.4.3.2
Clean Air Guide
Purpose
•
Remove accumulated dust from wire feed air guide.
Tools/ Materials/ Parts
•
Soft, lint–free cloth
•
Isopropyl alcohol
Frequency
•
Every 200 hours of operation (clean–room environment) or every 8
hours of operation (non–clean–room environment) or more often if dirt
build–up in the guide is causing wire feed problems.
Procedure
A. Press the AIR GUIDE and TENSIONER buttons on the MMI key pad. Verify that the indicator LEDs are off (dark).
B. Loosen the captive screw in the front air guide plate and remove the
plate (see Figure 3-9).
C. Lightly moisten the cloth in alcohol. Gently wipe the air surfaces of the
front and rear air guide plates. Allow the plates to dry.
D. Remove the sensor cover and check the sensor fiber optic opening in
the sensor plate. Make sure it is clean. Remove built–up dirt if necessary.
E. Lightly moisten the cloth in alcohol. Gently wipe the inner surface of
the sensor cover. Allow the plates to dry.
F. Install the front air guide plate. Tighten the thumbscrews to secure the
plate.
G. Install the sensor cover and tighten the capscrew with washers accordingly.
H. Press the AIR GUIDE and TENSIONER buttons on the MMI keypad. Verify that the LED indicators light on the keypad.
Sensor Cover & Plate
(Ensure there is no dust on the inside surfaces)
Captive Screw
Front and Rear
air guide surface plates
(E
th
i
d t
th i
id
f
)
Figure 3-9 Clean Air Guide
3-20
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 3: Upper Console
3.4.3.3
Clean Wire Tensioner
Purpose
•
Clean tensioner tubes to remove build–up of dirt and wire lubricants
that may impede wire passage or damage wire.
Tools/ Materials/ Parts
•
Hex wrench set
•
Ultrasonic cleaner
•
Tweezers
•
Grain alcohol
Frequency
•
Clean at every wire spool change or after 1000 feet (300 meters) of
wire usage.
Procedure
A. Press the AIR GUIDE and TENSIONER buttons on the MMI keypad. Verify that the indicator LEDs are off (dark).
B. Remove wire:
1. Enter Manual mode.
2. Press [F8] or select F8 in display to open wire clamp. (F8 in display
reads “Close”.)
3. Remove wire from the tensioner.
4. Press [MOTOR STOP] to place the machine in Standby mode.
C. Remove tubes from tensioner (see Figure 3-10).
1. Loosen the quick disconnect fitting at the rear of the Optics assembly.
2. On the front of the tensioner block, loosen and remove the two [2]
X-adjustment screws and washers that secure the tensioner
assembly and remove the tensioner.
3. At a workbench, loosen the funnel preload screw, remove
(unscrew) the funnel at the top of the tensioner. Remove the four [4]
tubes from the tensioner.
D. Clean wire tensioner tubes (see Figure 3-10):
1. Fill an ultrasonic cleaner tank with grain alcohol.
2. Place the four tubes and the funnel in the ultrasonic cleaning bath
tank. Clean the parts ultrasonically until dirt and contaminants are
removed.
3. Remove the tubes from the tank. Dry tubes using clean, low pressure air.
E. Install tubes in wire tensioner (see Figure 3-10):
1. The tubes have scribed lines on the outer diameter to guide the
reassembly process. The lower two [2] tubes have double scribed
lines and the upper two [2] tubes have a single scribed line. Using
tweezers, insert the tubes into the tensioner bore. See Detail A of
Figure 3-10 for the standard orientation of the tube assembly.
2. Make sure the lower tube seats in the collar at the bottom of the
tensioner bore.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-21
Maxµm Ultra Ball Bonder
3. Install the funnel onto threads at the top of the tensioner, making
sure that the hole in the funnel fits onto the smaller diameter end of
the upper tube.
4. Retighten the screw for the funnel preload.
F. Install the tensioner into the tensioner block.
1. Install the two screws and washers on to the left and right threaded
holes. Use the stopper pin at the right end to bench the X-position
before tightening.
G. Select OK in the Standby mode dialog box to start machine initialization. When completed, install bonding wire (refer to paragraph 3.4.3.1,
steps F. through H.).
Quick Disconnect
Y Adjustment Screws
Funnel
Pre--Load
Funnel
Funnel
Funnel Preload
Stopper Pin
Dual Port Tensioner Assembly
Stopper Pin
X Adjustment Screws
Funnel
Tensioner Tubes
(see detail A)
Funnel
Preload
Single
Scribed
Line
Single
Scribed
Line
P4
P3
Dual Port Tensioner
Assembly (Exploded)
Double
Scribed
Line
P2
P1
Detail A
Tensioner Tubes, Exploded
(Standard)
P4
Single
P3
Scribed
Line Tube
P1- Tapered Lower
P2
08828-0194-048-01
Double
P2- Polished Tapered Lower Tube
Scribed
P1
08828-0194-018-01
Line
P3- Polished Tube Middle
08828-0194-046-01
Detail B
P4- Tensioner
Upper Tapered
Tube Exploded
Tubes,
08828-0194-044-02
(For wire
diameter of 0.8 mil or less)
Note: Tube No. P3 is reversed as compared
to the Standard orientation
Figure 3-10 Remove and Clean Wire Tensioner
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Section 3: Upper Console
3.4.3.4
Air Guide Optical Sensor Set Up
Purpose
This adjustment sets the sensitivity of the optical sensor to detect the
bonding wire in the air guide.
•
Tools
•
Tweezers
Procedure
NOTE: This adjustment is performed prior to shipment from the factory. There is
no requirement to routinely perform this procedure. The sensor should
only be adjusted when changing to wire of different diameter or after
replacing the optical sensor amplifier.
A. Locate the air guide optical sensor amplifier located within a small window in the front face of the upper console (see Figure 3-8 and Figure
3-11).
B. Make sure the wire is routed through the wire guide.
C. Verify that the AIR GUIDE LED indicator is on. If it is not, press the AIR
GUIDE button on the MMI Key pad to turn on air pressure to the air
guide assembly. The air pressure will cause the wire to move away
from the sensor inside the air guide.
NOTE: The wire spool moves during the following adjustment procedure.
Ensure that the wire is still blocking the sensor. This can be verified by
carefully and slightly turning the wire spool by hand.
NOTE: In step D, the optical sensor will be put into TEACH mode. During
TEACH mode, the optical sensor will sample the two possible sensing
conditions (light and dark) and store them in its memory. If step E is not
performed within 20 seconds of entering TEACH mode, the sensor will
leave TEACH mode and return to RUN mode. If this occurs, repeat step
D.
Teach
ON
SIG
Signal Strength
Indicator (Red)
Power On
Indicator (Green)
Teach
Push Button
Output Indicator
(Yellow)
Figure 3-11 Air Guide Optical Sensor Amplifier Controls/Indicators
D. Press and hold the TEACH button on the amplifier for more than two
(2) seconds. This puts the optical sensor into TEACH mode, which is
indicated by the Power On (green) LED flashing at a 1–Hz rate.
E. With wire not blocking the air guide sensor, press the TEACH button.
This is TEACH Condition #1, which establishes the “off” state of the
sensor output. The Power On (green) LED will flash at a 2–Hz rate and
the Signal Strength (red) LED pulses to indicate relative received signal strength.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-23
Maxµm Ultra Ball Bonder
F. Turn air guide pressure off by pressing the AIR GUIDE button on the
MMI assembly. The AIR GUIDE indicator on the MMI assembly should
go off (not lit).
G. Make sure the sensor inside the air guide (see Figure 3-12) is blocked
by the wire.
H. Press the TEACH button. This is TEACH Condition #2, which establishes the “on” state of the optical sensor output. The Power On
(green) LED, Signal Strength (red) LED, and Output Indicator (yellow)
LED will all flash simultaneously one to four times to indicate relative
sensing contrast, after which the optical sensor will exit TEACH mode
and return to RUN mode. The number of LED flashes is interpreted as
follows:
Number of Flashes at end of
TEACH mode
Relative Contrast
1
Unacceptable
2
Low
3
Moderate
4
High
NOTE: If the relative contrast level is unacceptable (1 flash), the program will
return to TEACH Condition #1.
1. To verify correct operation, slowly pull on the end of the wire and
observe that the wire spool turns to feed additional wire.
Sensor Holder
Bar
Air Guide
Bars (2x) wire rests upon
Wire: Unblocked Location
Sensor
Wire: Blocked Location
Figure 3-12 Air Guide Assembly Showing Sensor Setup
3.4.3.5
Bond Integrity Test System Set Up
Refer to Volume 1: Operations for BITS setup information and definitions
of BITS options and parameters.
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Section 3: Upper Console
3.5
Wire Feed/BITS Board
3.5.1
Description
The Wire Feed/BITS circuit board (P/N 08828-4019-000-xx) is mounted at
the top of the upper console (See Figure 3-13). It controls wire feed functions and has a Bond Integrity Test System (BITS) circuit used to detect
non–stick bonds at the die or leadframe during auto bonding. It also provides a connection point for electrical devices in the upper part of the
machine, allowing them to be connected to cable assemblies that go
down into the lower console assembly.
The board also has active sensor handling circuitry that receives inputs
from low air pressure sensor, then loads sensor data onto the serial port.
2 Volts AC Peak to Peak, 1 Volt DC, and 2.1 Volts DC modes are GUI programmable via high speed serial port to Wire Feed/Bits board. This
replaces the mode select jumper on the older version of the Wire Feed/
BITS board. High speed serial port replaces serial sensor bus.
As shipped from the factory, the machine is configured to operate in DC
BITS mode of operation.
he Wire Feed/BITS circuit board operates in conjunction with the MMI,
which is mounted inside the keyboard. The wire feed controls and indicators are mounted on this board. The LEDs and push button switches on
the board are displayed on the MMI assembly.
There are no user–repairable or replaceable components on the Wire
Feed/BITS board. If any problem is experienced that can be traced to this
board, the board should be removed and replaced. A procedure to do this
is given in paragraph 3.5.3.
Wirefeed/ BITS Board
Figure 3-13 WireFeed/ BITS Board
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-25
Maxµm Ultra Ball Bonder
3.5.2
Preventive Maintenance
The Wire Feed/BITS board require no preventive maintenance.
3.5.3
Replace Wire Feed/BITS Board
Purpose
•
Replace a non–functional Wire Feed/BITS board.
Tools/ Materials/ Parts
•
Hex wrench set
•
Phillips screwdriver
•
Wire Feed/ATX BITS Board, P/N 08828-4019-000-xx
Procedure
A. Press [MOTOR STOP] key. Turn off machine power.
B. Remove rear top console cover of the upper console.
C. Locate the Wire Feed/BITS board attached to the rear of the upper
console (See Figure 3-13).
CAUTION: Obey all established ESD procedures when handling or storing the
Wire Feed/BITS board.
D. Disconnect all electrical cables from the board. Connector locations
are shown in Figure 3-14 and Figure 3-15.
E. Locate one (1) screw that secures the board to the upper console.
Loosen the screw and slide the board to the right, then pull it away
from the standoffs. Store the board in an ESD–protective container.
F. Position the replacement board against the standoffs, making sure the
head of the mounting screw passes through hole in the board. Slide
the board to the left. Tighten the mounting screw to secure the board.
G. Connect cables to the replacement board. Make sure all cables disconnected in step D. have been reconnected correctly by checking
against Figure 3-14 and Figure 3-15.
H. Install the top console rear cover.
I. Turn on machine power. Operate the machine to verify normal operation.
J50
J2
J49
J22 J21 J27 J23 J48
J41
J45
J47
J10
J42
J4
TQP1
J5
Standoff
(5 places)
J24
J25
J12
J6
Screw Position
J1
J13 J14
J17
J30
Figure 3-14 Replace Wire Feed/ BITS Board
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Section 3: Upper Console
Figure 3-15 WireFeed/ BITS Board Wiring Diagram
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-27
Maxµm Ultra Ball Bonder
3.6
LCD Monitor
3.6.1
Description
The Maxµm Ultra has a 15” (381 mm) screen, Liquid Crystal Display
(LCD) color monitor mounted on top of the upper console. Figure 3-16
shows how the monitor is mounted on the machine, locations of controls/
connectors, and routing of the two monitor cables (power and video).
During machine set up, the monitor controls should be adjusted so that:
•
The display fills and is centered on the screen
•
All items in the display (alphanumeric characters, video window,
device graphic window, crosshair) are clear and easily readable.
No other adjustments should be necessary.
For information concerning monitor integration into the vision system,
refer to Section 4 of this manual.
3.6.2
Preventive Maintenance
The monitor screen should be cleaned when required using any effective
screen cleaning product. The monitor requires no other preventive maintenance.
3.6.3
Monitor Cables
The monitor has two cables: a power cord (08088-2081-000-xx) and a
monitor signal cable, which is permanently attached to the monitor. The
power cord is connected to an AC outlet on the power supply assembly in
the lower console. The monitor signal cable is routed to the lower console
where it connects to the monitor extension cable (P/N 08088-3006-000xx). The extension cable is routed to the rear of the card rack in the lower
console and connected to the TV out1 connector on the Vision System
Front Panel face plate. Routing of the cables is shown in Figure 3-16.
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Section 3: Upper Console
Insert and Tighten 4X M4x10mm SHCS with washer (Torque to 9 in.Ib)
Power Cord connecting to
Power supply cable:
08088-2081-000-xx
Signal Cable connecting to
monitor extension cable:
08088-3006-000-xx
Note: Rear Cover removed for clarity
Route both cables through the rear top of the upper
console and into the lower Console. See pictures
below:
LCD Power Adaptor
Signal Cable to extension cable
Figure 3-16 LCD Monitor Connections
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-29
Maxµm Ultra Ball Bonder
3.7
Signal Light Tower and Work Light
3.7.1
3.7.1.1
Signal Light Tower
Description
Three colored signal lights and an audible alarm are in a tower assembly
mounted at the left–rear of the upper console. (See Figure 3-17) The conditions that cause the lights to automatically illuminate or flash are specified during machine setup, but in general they indicate normal Auto mode
operation, material requirements, or machine errors. The lights are powered by drivers on the VME I/O & Temperature Controller circuit board
assembly.
Typically, none of the lights will be lit when the machine is idle or being
operated manually. The green signal light is usually programmed to light
when the machine is operating normally in Auto mode. The yellow light is
most often set to illuminate when a process error, non–critical machine
malfunction, or MOTOR STOP condition occurs, such as:
•
PRS non–recognition
•
Missing ball detection
•
No magazine
•
Workholder or magazine handler jam
•
Warm or cold start (power up/system reset)
•
MOTOR STOP key pressed
•
Motion Error
•
Logic Activated Emergency Stop Condition
•
RAM parity error
The red light will illuminate in the event of a critical error that causes automatic machine shutdown. This light also comes on for a short time during
the power up and system reset sequences.
The conditions under which the audible alarm will sound, and which one
of several available alarm sounds will be used, are programmed during
machine setup. Like the lamps, the alarm is powered by three drivers on
the VME I/O & Temperature Controller circuit board. Use of multiple drivers enables generation of many different alarm sounds. The volume of the
audible alarm can be adjusted by turning the baffle located at the base of
the signal light tower (see Figure 3-19).
3.7.1.2
Signal Light Tower Maintenance
The signal light tower should require no maintenance over the life of the
machine. The lamps in the tower are high–output light–emitting diodes
(LEDs) that have a service life of approximately 100,000 hours, so they
should never need replacement. If there is any problem with the light
tower, the entire assembly should be replaced.
Height of the light tower can be adjusted to suit the needs of the manufacturing facility. A procedure to do this is provided in paragraph 3.7.4.
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Section 3: Upper Console
Figure 3-17 Signal Light Tower and Work Light Assemblies
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-31
Maxµm Ultra Ball Bonder
3.7.2
Work Light
A work light is installed under the right side of the upper console (see Figure 3-18). The goose neck mount allows the user to position the light to
illuminate any part of the bond site area. Like the light tower and audible
alarm, power for the work light lamp is from a driver on the I/O & Temperature Control circuit board. This allows both the user and machine control
system to turn the lamp on or off. The user controls the work light by
selecting a virtual button in the machine GUI display. If the light is on, the
machine control system turns it off during Auto mode operations, since
work light illumination may interfere with detection of eyepoints or
device
Housing
Signal Light Tower
Socket
Alarm Volume Baffle
leads.
Work Light
Base
Work Light
The lamp
in the
work light
can be
easily
replaced if
it burns
out. Refer
to the
replacement procedure in
paragraph
3.7.5.
Bulb
Lamp Replacement
3.7.3
Preventive Maintenance
The signal light tower and work light do not require any preventive maintenance.
J23
Part of 08088–3063–000–xx
Cable Assembly
Host CPU VMEbus
Lamp Drivers
(4)
VME
Inter–
face
J7
12970–6002–002
J48
Alarm Drivers
(3)
I/O & Temp Control Board
Wire Feed/BITS
Board
Work
Light
3.7.4
Adjust
Red
Lamp
Yellow
Lamp
Green
Lamp
Signal Light
Tower Height
LED Signal Tower Assembly
08001–1262–000–xx
Purpose
•
Adjust the height of the signal tower above the
machine.
Audible
Alarm
Signal Tower
Parts
Signal Lamp and Alarm Drive, Functional Diagram Tools/Materials/
• Hex wrench set
Procedure
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Section 3: Upper Console
A. Through a hole in the upper right corner of the upper console rear
cover, locate the set screw in the locking collar around the signal light
tower shaft. (See Figure 3-18)
B. While supporting the signal tower, loosen the set screw in the locking
collar.
C. Raise or lower the signal tower to the desired height. Tighten the set
screw in the locking collar.
Signal Light Tower
Upper Console
Rear Cover
Access Hole for
Signal Light Locking
Collar Screw
Figure 3-18 Access Hole for Signal Light Tower Locking Collar Screw
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-33
Maxµm Ultra Ball Bonder
3.7.5
Replace Work Light Lamp
Purpose
•
Replace the lamp in the work light assembly.
Part
•
Work Light Lamp, P/N 12970-6002-002
Procedure
A. Make sure the work light is off. If on, click on the appropriate button at
the bottom of the display.
B. Turn the front of the lamp housing counterclockwise until it comes free
from the lamp base (see Figure 3-18).
C. Pull the lamp out of its socket. Discard the lamp.
D. Install the replacement lamp in the lamp base socket.
E. Click on the appropriate display button to turn on the work light. Verify
that the lamp lights. Click on the button again to turn off the lamp.
F. Thread the lamp housing onto the lamp base. Turn the housing clockwise until it is tight.
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Section 3: Upper Console
3.8
Microscope
3.8.1
Description
The Maxµm Ultra has a stereo zoom microscope for inspection of bonded
devices. The zoom feature allows easy change of magnification without
requiring change of focus. The microscope is mounted on a hinged slide
shaft (see Figure 4-1). The microscope may be swung out to gain access
to the bond head area.
3.8.2
Preventive Maintenance
Preventive maintenance for the microscope consists of cleaning the eyepiece lenses as required. A procedure can be found in paragraph 3.8.3.3.
No other preventive maintenance is required.
3.8.3
Maintenance Procedures
3.8.3.1
Adjust Focus
Purpose
•
To obtain clear focus on a device clamped in the workholder at the limits of microscope magnification.
Tools/ Materials/ Parts
•
None
Procedure
A. Position eyepiece tubes closer together or farther apart as needed for
comfortable viewing.
B. Turn zoom knob to highest magnification (see Figure 3-19).
C. Viewing with the right eye only, turn focus adjustment knob to obtain
sharp, clear focus.
D. Viewing with the left eye only, turn the fine focus collar on the left eyepiece tube to obtain sharp, clear focus.
Zoom Knob
Fine Focus
Pivot Support
Casting
Focus Knob
Microscope Mount
Stop Screw
Microscope Lock Knob
Carriage
Slide Shaft
Figure 3-19 Zoom Microscope and Microscope Mount
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
3-35
Maxµm Ultra Ball Bonder
3.8.3.2
Adjust Microscope Field of View
Purpose
•
To ensure microscope field of view covers the bonding area.
Tools/ Materials/ Parts
•
Hex wrench set
Procedure
A. Check:
1. Focus microscope on bonding area at minimum magnification.
2. Look through the microscope. Check whether microscope field of
view is centered on the workholder clamp window. If not, adjust the
microscope mount.
B. Adjust:
1. Move microscope toward bond head until the microscope is
stopped.
2. Adjust the stop screw until the slide shaft is parallel to the machine
X axis (see Figure 3-19).
3.8.3.3
Clean Microscope Lenses
Purpose
•
To prevent dirt build–up on microscope eyepiece lenses.
Tools/ Materials/ Parts
•
Soft lens tissue
•
Clean cotton swab
•
Mild detergent
Frequency
•
As required
Procedure
A. Wipe dust from eyepiece lenses with the soft lens tissue.
B. If dust on lenses is gritty or greasy:
1. Clean each lens with a dilute solution of detergent and warm water.
2. Wipe each lens dry with a cotton swab.
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Section 4: Vision System and Optics
4
Vision System and Optics
4.1
About This Section
Here’s what you will find in this section:
•
Section 4.2 , Overview, describes the various components within and
mounted on the Vision & Optics assembly . It contains basic component information and location of each component.
•
Each section from Section 4.3 through 4.7 describes a functional system and its major components. It explains how to replace and adjust
each component.
•
Section 4.3, Preventive Maintenance
•
Section 4.4, Dual-Magnification Optics Assembly
•
Section 4.5, Illuminators
•
Section 4.6, Solid-State Video Camera System
•
Section 4.7, Vision System Assembly
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-1
Maxµm Ultra Ball Bonder
4.2
Overview
Targeting of devices is accomplished by the vision system and optics (Figure 4-2). This system, consisting of optics, illuminators, video cameras,
vision system assembly (pattern recognition/video graphics processing
electronics), produces the magnified video image and graphic displays
necessary for automatic device alignment and operator interaction.
•
Optics and Assembly
The dual magnification optics assembly consists of optical components, illumination and camera head mounting. The optics housing has
two optical paths (see Figure 4-1) that terminate at individual video
camera heads. Each of the optical paths provides a different magnification of the bond site: low magnification (2x standard), and high magnification (6x standard). They can also be individually set to different
focus height ranges to enable focusing the low magnification path on
the lead reference system and the high magnification path on the die
reference system.
•
Illuminators
Two (2) LED illuminators are part of the standard optics assembly.
They provide illumination for the bonding site. A third illuminator (”high
angle”) is available as an option. The vertical illuminator casts light on
the work that is coaxial to and centered on the video optical path. It
consists of a high-output LED with a light-scattering diffuser. The
optional high angle illuminator casts light on the bond area at a high
angle or near-vertical from the bond plane. It consists of six (6) highoutput LEDs. The vertical and optional high angle illuminators are
mounted on the optical housing above the objective lens.
The oblique illuminator casts light on the bond area at a lower angle
from the bond plane compared to the optional high angle illuminator. It
consists of a semi-ring array of ten (10) discrete high-output LEDs
mounted in a housing around the objective lens of the optics assembly.
The oblique illuminator housing attaches to the underside of the optics
housing.
There are no external on/off control switches for these illuminators.
They are controlled by software through the vision system. Brightness
control for the illuminators is accessed by way of the graphical user
interface (GUI) controls in various machine-operating modes. Additional information on lighting adjustments can be found in Volume 1:
Maxµm Ultra Operations.
•
Video Cameras
The Maxµm Ultra utilizes two progressive scan camera heads and a
camera control unit. Each video camera head is mounted at the rear of
the optics housing and is connected by a cable to the control unit
mounted at the top of the upper console behind the video monitor. The
camera control unit sends a digital video signal to the vision system.
Control signals interface the camera control unit to the vision system
so that images can be transferred for processing and display. The
power for the camera is connected directly to the camera control unit.
•
Vision System
The Vision System acquires images produced by the camera for live
video and image processing. This system provides capability for pattern recognition system (PRS) for automatic alignment, Video Lead
Location (VLL), automatic pad location/centering capabilities, and ball
finder for Post Bond Inspection (PBI). In operation, the PRS capability
of the vision system uses video images to locate specific features
(eyepoints) on a device at or near areas programmed at teach time by
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© 2007 kulicke & Soffa Industries Inc
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Section 4: Vision System and Optics
the operator, for automatic alignment prior to bonding. The VLL capability is a high-speed video image analysis technique that enables the
bonder to ”find” individual outer leads of an IC package before bonding. The technique is especially suited for use on devices having large
numbers of closely spaced leads or leads subject to variations in width
and location from device to device, and serves to enhance bonding
accuracy with minimal effect on cycle time. The automatic pad location/centering feature was designed to increase speed and accuracy
when teaching the locations of bond pads. When enabled, the vision
system should be able to automatically locate all of the bond pads that
are part of a die reference system after the operator has taught the
appearance of a sample bond pad and the pitch distance between
adjacent pads.
Since operation of the vision system depends on the optics, illumination, and camera systems, careful consideration must be given to all
elements of the system to assure optimum performance. In addition to
its PRS/VLL functions, the vision system provides a Universal Serial
Bus (USB) interface with the Man Machine Interface (MMI) keyboard
and mouse and handles the monitor display. The vision system communicates with the bonder processing system via an Ethernet local
area network (LAN) interface.
•
LCD Monitor
The Maxµm Ultra has a 15” (381 mm) color LCD monitor that uses 12
VDC from the machine power supply convenience outlet panel. The
monitor operates at 1024 x 768 screen resolution with a 60-Hz screen
update rate. Displays on the monitor screen include virtual ”keys” and
menus of software options that can be selected using the mouse, definitions of operator panel function keys, an area or ”window” that contains a graphical representation of the device being processed, and a
window that shows live video from the camera. LCD screen graphics
are generated by the vision system assembly as requested by the
bonder control system, and mixed with camera video for display on the
monitor. The monitor signal cable connects to the TV Out1 connector
on the vision system assembly front panel.
•
Diffuser
The diffuser, mounted on the microscope mount assembly, directs a
stream of compressed air at the area just above the device clamped at
the bond site. This stabilizes the video image by displacing turbulent,
heated air, which would otherwise distort the image picked up by the
camera. Instability in the video image can lead to inaccurate eyepoint/
lead find, affecting device indexing, PRS automatic alignment, and
VLL scanning operations. The diffuser is part of the pneumatic system.
Refer to Section 3 for more information concerning diffuser initial setup
and maintenance.
High Magnification
Camera Head
High Magnification
Relay lenses
Mirrors
Aperture
Low Magnification
Camera Head
Objective
Lens
Low Magnification
Relay lens
Camera
Beamsplitter
LED Beamsplitter
Figure 4-1 Dual–Magnification Optics Assembly - Optical Path
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-3
Maxµm Ultra Ball Bonder
Monitor
Camera Control Unit
(Behind the Monitor)
Video Camera
Heads (2)
(hidden from view)
Optics Assembly
(hidden from view)
Vision System Assembly
(inside lower console,
behind card rack)
Illuminator Interface
(in card rack)
Figure 4-2 Vision System Components
4-4
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 4: Vision System and Optics
Oblique Drive
LED Driver Circuits
(On I/O & Temp
Controller board)
High-Angle Drive
Vertical Drive
Parallel Interface
(10 Lines)
Illuminator Interface
Circuit Board
Bond Head
Parallel Interface
Interconnect Board
Machine
Host
Processor
Ethernet
Control Signals, Sync
Vision System
Unit
Digital Video
LCD
(Live Video and Graphics)
Monitor
Serial Data
(USB)
Serial Data
(USB)
Camera
Control Unit
Video
(Low Mag)
Video
(High Mag)
Vertical
Illum.
Hi Ang.
Illum.
Numeric Keypad
Alpha Keypad
Camera
Head
Dual-Mag. Optics
Oblique Illuminator
Camera
Head
3-Button USB Mouse
MMI
Bond Plane
Figure 4-3 Dual Magnification with Matrox Vision System, Functional Diagram
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-5
Maxµm Ultra Ball Bonder
4.3
Preventive Maintenance
Preventive maintenance for the vision system, video equipment, optics,
bond site illuminators, and microscope is defined in Table 4-1.
Table 4-1 Optics and Vision System Preventive Maintenance
Service
4.4
Frequency
Reference
Clean objective lens
As required
4.4.2.3
Inspect/clean LCD monitor screen
As required
4.4.2.7
Calibrate vision system
As required
Appendix A
Check optics focus
As required
4.4.2.4
Check illuminator hardware
As required
4.5.3
Dual-Magnification Optics Assembly
4.4.1
System Description
The dual-magnification optics system (Figure 4-4) consists of an optic
housing assembly with two optical paths, which each terminate at a progressive scan camera head. The two optical paths are identified as high
and low magnification. Focus for the high mag path is provided by the
objective lens, while the low mag relay lens focuses the low mag path.
The magnification for the high mag path is adjusted by the high mag relay
lens. The low mag path has a fixed magnification. The relay lenses of
each optics path, coupled with the pixel size of the cameras, provide the
magnification resolution and field of view required for accurate PRS. The
standard low magnification path provides 4.50 microns/pixel resolution
and is referred to as 2x. The standard high mag path provides 1.50
microns/pixel and is referred to as 6x. Half-mirrors and front-surface mirrors fold the optical paths to fit the required focal lengths into the available
space. One of the half-mirrors allows coaxial light. The other half-mirror
divides light into the two optical paths. All of these items, along with internal baffles, have been tailored for the magnification ranges, depth of field,
and light acquisition levels needed for PRS, VLL, and monitor display
applications.
NOTE: In order to get optimal performance, the low magnification path should
be focused on the lead magnification system and the high magnification
path should be focused on the die reference system.
The LED illuminators are mounted on the optics assembly. The oblique
illuminator is attached to the underside of the optics housing, held just
below the optics assembly objective lens. The vertical and optional high
angle illuminators are attached to the top of the optics housing above the
objective lens. A light-scattering diffuser below the vertical and high angle
illuminators spreads the light from the LED into a diffuse spot. The halfmirror allows the vertical light to pass through to the bond site while
reflecting the bond site image to the remaining optics in the system.
Optics assembly maintenance includes periodic cleaning of the objective
lens and checking the tightness of attaching hardware/electrical connections. Adjustments that can be made at this assembly are focus (at the
objective lens), magnification (at the relay lens), and linearity (by rotating
the camera head to align it with a device clamped in the workholder). A
PRS calibration must be done after any adjustment or other change to the
optics assembly. Refer to Appendix A of this volume for the PRS calibration procedure.
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Section 4: Vision System and Optics
Camera Head Clamp
(2 places)
Low Magnification Camera Head
Adjustment Clamp Screw
High Magnification Camera Head
Adjustment Clamp Screw
Mounting Hole
(4 places)
Objective Lens Clamp
Objective Lens
Objective Lens Clamp
Adjustment Screw
Optics Housing, Right Side
High Magnification Relay Lens
Adjustment Screw
(2 places)
High Magnification Camera Position
(Camera not shown)
Camera Head
Fixed Clamp Screw
Vertical and High Angle (option) Illuminators
(Part of Illuminator Flex Cable)
Low Magnification Camera Position
(Camera not shown)
Optics Housing,
Left Side
Vertical Illuminator
Adjustment Plate
Low Magnification Relay Lens
Adjustment Screw
Oblique Illuminator
(Part of Illuminator Flex Cable)
Figure 4-4 Dual–Magnification Optics Assembly - Major Parts
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-7
Maxµm Ultra Ball Bonder
4.4.2
Maintenance Procedures
4.4.2.1
Replace Optics Assembly
Purpose
•
Replace optics assembly
Tools/ Materials/ Parts
•
Hex wrench set
•
Optics Alignment Wedge Tool, P/N 08089-0901-025-xx
•
Dual Optics Assembly, P/N 08868-0090-000-xx
Procedure
A. Press [MOTOR STOP] switch. Turn off machine power.
B. Remove both camera heads from the optics housing. Refer to paragraph 4.6.2.1 for instructions.
C. Remove the two screws and washers and remove the tensioner assy.
Disconnect the wire tensioner vacuum hose at the quick–disconnect
fitting at the top–rear of the optics housing (see Figure 4-4).
D. At the top–center of the optics assembly, remove the screw and the
thermocouple wire. Remove the thermocouple wire (see Figure 4-5).
Vacuum Hose
Quick Disconnect
Illumination Flex Cable
Thermocouple Wire
(under the stand-off)
To Bond Head
Interconnect Board, J6
2xM2 SHCS and washer
Tensioner Assembly
Figure 4-5 Replace Optics Assembly
E. Remove the optics housing (See Figure 4-7).
1. Disconnect the illumination flex cable from connector J6 on the
bond head interconnect board at the right–rear of the optics housing.
2. Remove four (4) screws and washers that secure the optics housing to the front Y slide.
3. Lift the optics housing away from the machine.
F. Install the optics housing on the front Y slide (See Figure 4-7).
1. Place the optics housing on the front Y slide. Install four (4) screws
and washers in the optics housing mounting holes. Do not tighten.
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Section 4: Vision System and Optics
2. Place the optics alignment wedge tool as shown in Figure 4-7
between the rear of the optics assembly and the pins on the front Yslide. Push the optics housing toward the rear of the machine so
that it benches against the optics alignment tool and the pins on the
front Y slide. Position the housing in so that it does not interfere
with the wire clamp assembly.
3. Snug down, but do not fully tighten the four (4) screws. The screws
will be fully tightened later during the optics housing alignment procedure.
G. Install the thermocouple wire and screw removed in step D.
H. Connect the tensioner hose to its quick–disconnect connector and
install back the tensioner assembly using the 2x M2 SHCS and
washer.
I. Mount the camera heads on the optics assembly as shown in Figure 44. Refer to paragraph 4.6.2.1 for instructions. If necessary, connect the
camera heads to the appropriate connectors on the camera control
unit as shown in Figure 4-14.
Right Benching Pin
Left Benching Pin
Optics Alignment
Wedge Tool
(Benched to Pins)
Benching Direction
Benching Direction
Dual Optics Assembly
(Benched to Optics Alignment Wedge Tool)
Figure 4-6 Benching position
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-9
Maxµm Ultra Ball Bonder
Mounting Screw and Washer
(4 places)
Optics Alignment
Wedge Tool
Front Y Slide
Integrated Table Assembly
Figure 4-7 Replace Optics Assembly
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Section 4: Vision System and Optics
J. Connect the illumination flex cable to connector J6 on the bond head
interconnect board.
K. Perform the following adjustments and calibrations:
1. Turn on machine power. When the Standby Mode dialog box
appears, select OK to start the machine. Allow 30 minutes for the
machine to warm up.
2. Adjust optics housing for a 0.400” (10.16 mm) offset in the X axis
between the centerline of the bond tool and centerline of the optical
path. Refer to paragraph 4.4.2.2.
3. Check/adjust camera linearity (refer to paragraph 4.4.2.5).
4. Check/adjust optics focus (refer to paragraph 4.4.2.4).
5. Perform PRS calibration (refer to Appendix A).
4.4.2.2
Optics Housing Alignment
Purpose
Align the optics housing using the crosshair offset calibration so that there
is an 0.400” (10.16 mm) offset in the X axis between the centerline of the
bond tool and the centerline of the optical path. This must be done:
•
When the optics housing is being remounted on the front Y slide.
•
Before tightening the optics housing mounting screws, if the mounting
screws have been loosened for any reason.
This alignment is done to avoid mechanical interference between the
optics housing and the wire clamp assembly and ensure full XY table
travel.
Tools/ Materials/ Parts
•
Hex wrench set
•
Optics Alignment Wedge Tool, P/N 08089-0901-025-xx
•
Torque wrench, 25 in. lb. (2.8 Nm)
Procedure
A. If machine power is off, press the POWER circuit breaker to ON. When
the Standby Mode dialog box appears, select OK to start the machine.
Allow 30 minutes for the machine to warm up.
B. Make sure there is a device clamped at the bond site.
C. Select CALIBRATE from the GUI mode bar. Select [3] BOND HEAD from
the Calibration Mode menu.
NOTE: For more information concerning crosshair offset calibration, including
illustrations of dialog boxes and the manual calibration sequence, refer
to the Crosshair Offset Calibration procedure in Appendix A.
D. Perform a manual crosshair offset calibration to determine the X
crosshair offset value.
1. Select [1] CROSSHAIR OFFSET from the Bond Head calibration
menu.
2. In the crosshair offset calibration dialog box, set MODE to DRY
CYCLE. Turn on low magnification.
3. Adjust illumination if necessary - recommended values: Vertical=13, Oblique=0, optional High Angle=0.
4. Bond site video should be in the larger of the two windows in the
GUI. If not, press [F1] to move video into the larger window.
5. Use [B2] and trackball to move the crosshair over a clear area on
the die.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-11
Maxµm Ultra Ball Bonder
6. Press [B1] to make a tool mark on the die. Use [B2] and the trackball to move the crosshair so that it is centered on the tool mark.
7. Press [F2] (Z Video) twice to magnify the view of the tool mark.
Carefully center the crosshair on the tool mark.
8. Press [B3] to calibrate.
9. When the calibration is completed, record the X calibration offset
shown in the dialog box on the screen. The X calibration offset is
the first of the two numbers shown on the “X hair offsets:” line of the
dialog box.
E. Calculate the X offset position and move the table to this position.
1. Subtract the X calibration offset value from 400.00 to derive the X
error value:
•
400.00 - X Calibration Offset Value = X Error
2. Add the X error to the current X–axis XY table position to derive the
X Offset Position:
•
X Error + X Axis Table Position = X Offset Position
NOTE: The current X axis table position is displayed in the upper right corner of
the GUI (X=###.##).
3. Use the mouse to move the table in the X axis only to the calculated X Offset Position ±1 mil. (X Table position value in the upper
right corner of the GUI equals the X Offset Position.) Position error
must be 1 mil or less as shown in the display.
F. Calculate the Y offset position and move the table to this position.
1. Subtract the Y calibration offset value from 0.00 to derive the Y
error value: 0.00 - Y Calibration Offset Value = Y Error
2. Add the Y error to the current Y–axis XY table position to derive the
Y Offset Position:
•
Y Error + Y Axis Table Position = Y Offset Position
NOTE: The current Y axis table position is displayed in the upper right corner of
the GUI (Y=###.##).
3. Use the mouse to move the table in the Y-axis only to the calculated
Y Offset Position ±1 mil. (Y Table position value in the upper right
corner of the GUI equals the X Offset Position.) Position error
must be 1 mil or less as shown in the display.
G. Position the optics housing with the table at the desired X offset position.
1. Loosen the four (4) optics housing mounting screws (see Figure 47). Make sure the optics housing remains flat on its mounting surface on the Y slide.
2. Place the optics alignment wedge tool between the rear of the
optics assembly and the bench pins on the Front-Y-Slide as shown
in Figure 4-6.
3. Slide the optics housing to the right or left until the Y-axis of the
crosshair is centered on the tool mark. Slide the wedge to the left or
right until the X-axis of the crosshair is centered on the tool mark
while making certain that the optics housing remains benched
against the alignment tool and the alignment tool maintains contact
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Section 4: Vision System and Optics
with the alignment pins on the front Y slide throughout the adjustment. If there is not enough adjustment in the Y-axis, get the
crosshair as close as possible.
NOTE: Keep the optics housing located against the optics alignment wedge tool
and keep the alignment tool located against the dowel pins in the Y slide
while adjusting optics assembly position in the X and Y axes. If this is
not done, the optical path may not be parallel to the machine Y axis after
the adjustment is completed, which will casue problems with PRS/VLL
operations.
4. Tighten the four (4) optics housing mounting screws to 25 in. lb.
(2.8 Nm). Make sure that the optics housing remains benched in
the Y axis and that the crosshair remains centered on the tools
mark while the screws are tightened.
5. Remove the Optics alignment wedge tool.
H. Perform crosshair offset calibration.
1. Press [F2] (Z Video) twice to return to normal video magnification.
2. Perform a manual crosshair offset calibration (repeat steps D5.
through D8.).
3. Note the X calibration offset value. It should be 400.000 ±1 mil. If
not, repeat this procedure from step d. If the X calibration offset
value is within the acceptable range, select OK to accept the calibration.
4. Select DONE.
5. Press [F2] (Z Video) once to return to normal video magnification.
6. Press [ESCAPE] as needed to close all menus.
I. Turn on high magnification (6x) and repeat steps D5. through D8. to
perform crosshair offset calibration.
4.4.2.3
Clean Objective Lens
Purpose
•
To prevent dirt build–up on lens.
Frequency
•
Check/clean lens as required (look for decreased contrast in video
image).
Tools/ Materials/ Parts
•
Dust–free blower (filtered, dry nitrogen blown through an anti–static
nozzle recommended)
•
Polyethylene lab gloves
•
Cotton swabs
•
Lens tissues
•
Grain alcohol, spectroscopic grade
•
Mild, neutral soap, 1% solution in water
•
Distilled water
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-13
Maxµm Ultra Ball Bonder
Procedure
A. Press [MOTOR STOP].
WARNING: WEAR POLYETHYLENE GLOVES WHEN CLEANING THE LENS. SOLVENTS USED MAY IRRITATE SKIN.
B. Remove dust from lens:
1. Use the dust–free blower to blow loose dust off of the lens.
2. If any dust is left on the lens, wrap a piece of lens tissue around a
cotton swab and soak it in alcohol.
3. Wipe the lens, moving the swab in one direction with a gentle, figure–eight motion.
C. Inspect the lens. If there are any fingerprints, oil spots, or water spots,
perform steps 1 through 4 below. Otherwise, go to step d.
1. Wrap a piece of lens tissue around a cotton swab and soak it in the
soap solution.
2. Wipe the lens in one direction using a gentle, figure–eight motion.
3. Repeat steps 1 and 2, but soak the swab in distilled water only.
4. Repeat steps 1 and 2, but soak the swab in alcohol.
D. Adjust focus if needed (paragraph 4.4.2.4).
4.4.2.4
Adjust Optics Focus
Purpose
•
To obtain a sharp, clear video image of device for targeting and pattern
recognition.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 35 oz. in. (0.25 Nm), 9 in. lb (1.0 Nm)
Procedure
A. Make sure device is in bond position.
B. If necessary, press the [F1] key to swap the video and graphics windows so that video is in larger window of the monitor display. Turn on
the high magnification (6x) view.
C. Use the mouse to center the die image in the video window.
D. Adjust the high magnification relay lens assembly (see Figure 4-4).
1. Check the location of the two (2) adjustment screws that secure the
high magnification relay lens assembly. If they are centered, go to
step E.
2. Loosen the two (2) adjustment screws and move the relay lens
assembly so that the screws are at the center of the slots.
3. Bench the relay lens assembly down and tighten the adjustment
screws to 9 in. lb. (1.0 Nm).
E. Loosen the objective lens clamp adjustment screw enough to allow
rotation of the lens holder while keeping enough tension to prevent
severe image movements.
F. Rotate the slotted lens tube adjustment collar as needed to obtain a
sharp, clear device image on the monitor.
G. Tighten the objective lens clamp adjustment screw to 35 oz. in. (0.25
Nm).
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Section 4: Vision System and Optics
H. Perform a PRS calibration at high magnification (refer to Appendix A
for procedure). Check the XX and YY pixels to pulse ratios to make
sure that magnification is correct. Adjust camera linearity if required
(refer to paragraph 4.4.2.5). If magnification is not correct, adjust magnification (refer to paragraph 4.4.2.6), then repeat steps E. through G..
I. Turn on low magnification view.
J. Use the mouse to center the lead image in the video window.
K. Adjust the low magnification relay lens assembly.
1. Loosen the adjustment screw that secures the low magnification
relay lens assembly.
2. Move the adjustment screw to obtain a sharp, clear device image
on the monitor screen (focus on the leads).
3. Tighten the adjustment screw to 9 in. lb (1.0 Nm).
NOTE: After focus has been adjusted, teach crosshair offset. Refer to “Appendix A: Calibration Procedures” in this manual or Volume 1:Maxµm Ultra
Operations for procedures.
4.4.2.5
Adjust Camera Linearity
Purpose
•
To ensure that the camera heads are aligned with the table X and Y
axes for targeting and pattern recognition.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 9 oz. in. (0.064 Nm)
Procedure
A. Check:
1. With a device in the bond area, turn on the high magnification view.
2. Locate an isolated feature of die image in the video window. Use
the mouse to align an identifiable point of the feature along top of
the horizontal video crosshair at the left side of the video window.
3. Move feature to the right along entire length of crosshair in the X
axis only.
4. Check that alignment of the feature point and crosshair remains
constant during X motion of die image. If feature moved away from
crosshair during the motion, adjust high magnification camera head
linearity as in step B. After adjusting the high magnification camera
head, check the low magnification camera head linearity by performing step A5.
5. Switch to the low magnification view. Perform steps A2., A3., and
A6..
6. Check that alignment of the feature point and crosshair remains
constant during X motion of die image. If feature moved away from
crosshair during the motion, adjust low magnification camera head
linearity as in step B.
B. Adjust:
1. Loosen the camera head clamp adjustment screw for the camera
being adjusted (see Figure 4-15).
2. Rotate camera head as needed.
3. Check linearity (step a) and re–adjust as needed.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-15
Maxµm Ultra Ball Bonder
4. Tighten the camera head clamp adjustment screw to 9 oz. in.
(0.064 Nm) while pushing the camera head/camera mount toward
the front of the machine.
5. If the remaining camera head in the system requires adjustment,
repeat steps B1. through B4. for that camera head.
C. Check/adjust the following items:
1. Check XY and YX pixels to pulse ratios by performing a PRS Calibration (refer to Appendix A for procedure). Both factors should
equal:
•
Low Magnification (2x ref) = 0.0000 ±0.003
•
High Magnification (6x ref) = 0.0000 ±0.001
If not, re–adjust linearity (step b), then recheck pixels to pulse ratios.
2. Check focus, adjust if necessary (refer to paragraph 4.4.2.4). If
focus is adjusted, check magnification (paragraph 4.4.2.6).
3. Teach Crosshair Offset. Refer to Appendix A for procedure.
4.4.2.6
Adjust Magnification
Purpose
•
To establish correct relation between pixels of video image and actual
area on device for PRS displacement calculations.
Tools/ Materials/ Parts
•
Hex wrench set
Procedure
A. Check:
1. Make sure illumination is on and properly adjusted. Use illumination
that will be used for program teaching and production operation. To
adjust illumination:
a. Select illumination adjustment tool from tool bar at bottom edge
of GUI.
b. Enter values for oblique, vertical, and optional high angle illuminators to set illumination to the desired level. Each illuminator
can be set from 0 (off) to 255 (full intensity).
c. Select DONE from the illumination control dialog box when done.
2. Make sure high magnification view is selected.
3. Perform PRS calibration. Refer to “Appendix A: Calibration Procedures” in this manual (or Volume 1) for the PRS optics calibration
procedure. Verify XX and YY PRS pixels to pulse ratios are within
acceptable limits indicated in the procedure:
•
XX = 0.0591 ±0.001
•
YY = 0.0591 ±0.001
•
XY = 0.0000 ±0.001
•
YX = 0.0000 ±0.001
If XX and YY pixels to pulse ratios are not within specification, adjust
high (6x) optics magnification as stated in step B.
NOTE: If XY and YX pixels to pulse ratios are not within specification (0.0000
±0.001), adjust linearity for high magnification optics (camera rotation,
paragraph 4.4.2.5) and re–check as needed.
4. Switch to low magnification.
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Section 4: Vision System and Optics
5. Perform PRS calibration. Verify PRS pixels to pulse ratios are
within acceptable limits indicated in the procedure:
•
XX = 0.1772 ±0.010
•
YY = 0.1772 ±0.010
•
XY = 0.0000 ±0.003
•
YX = 0.0000 ±0.003
If XX and YY pixels to pulse ratios are not within specification, adjust low
optics magnification as stated in step C.
NOTE: If XY and YX pixels to pulse ratios are not within specification, adjust linearity for low magnification optics (camera rotation, paragraph 4.4.2.5)
and re–check as needed.
B. Adjust high magnification.
1. Loosen two (2) magnification adjustment screws for the high magnification relay lens assembly (right side of the optics housing, see
Figure 4-5). The screws secure and allow adjustment of the relay
lens position within the optics housing, which changes magnification.
2. If XX and YY pixels to pulse ratios are greater than the specified
range, (i.e., magnification too low) slide the adjustment screws forward. If less than the specified range (i.e., magnification too high),
slide the screws backward. Make sure to bias the screws to the
right so that relay lens housing remains benched.
3. Tighten magnification adjustment screws while benching the relay
lens housing to the right.
4. Check focus. If necessary, adjust focus by performing steps E.
through G. of the adjust magnification procedure in paragraph
4.4.2.4. Do not move the high magnification relay lens while adjusting focus.
5. Select (7) PERFORM PRS CALIBRATION from the PRS calibration
menu to run the calibration routine. Calibration results are displayed.
6. Re–check and re–adjust magnification (repeat steps 1. through 5.)
as needed to achieve pixels to pulse ratios as follows:
•
XX = 0.0591 ±0.003
•
YY = 0.0591 ±0.003
•
XY = 0.0000 ±0.001
•
YX = 0.0000 ±0.001
NOTE: If above numbers for XY and YX cannot be achieved, adjust camera linearity (refer to paragraph 4.4.2.5) and re–check as needed.
7. Repeat PRS Calibration three times. Note pixels to pulse ratios for
XX and YY.
8. Check that XX and YY numbers from readings taken in step 6. are
within 0.001 of each other. If not, re–adjust magnification. If problem persists, contact K&S.
NOTE: After magnification has been adjusted, re–teach crosshair offset. Refer
to Appendix A in this manual for procedure.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-17
Maxµm Ultra Ball Bonder
C. Adjust low magnification focus if necessary.
1. Select low magnification view.
2. If the focus is acceptable, go to step 5. If not, loosen the adjustment
screw that secures the low magnification relay lens assembly.
3. Move the adjustment screw to obtain a sharp, clear device image
on the monitor screen (focus on the leads).
4. Tighten the adjustment screw to 9 in. lb (1.0 Nm).
5. Select (7) PERFORM PRS CALIBRATION from the PRS calibration menu to run
the calibration routine. Calibration results are displayed.
6. Re–check and re–adjust magnification (repeat steps 2. through 5.)
as needed to achieve pixels to pulse ratios as follows:
•
XX = 0.1772 ±0.010
•
YY = 0.1772 ±0.010
•
XY = 0.0000 ±0.003
•
YX = 0.0000 ±0.003
NOTE: If above numbers for XY and YX cannot be achieved, adjust linearity (camera rotation,
paragraph 4.4.2.5) and re–check as needed.
7. Repeat PRS Calibration three times. Note pixels to pulse ratios for
XX and YY.
8. Check that XX and YY numbers from readings taken in step 6. are
within 0.001 of each other. If not, re–adjust magnification. If problem persists, contact K&S.
4.4.2.7
Monitor Adjustments and Maintenance
Adjustment of the monitor is for viewing convenience only and does not
affect operation of the vision system. User controls are located below the
monitor screen (see Figure 4-8). There are no other user controls accessible from outside the monitor case. There are no user controls or user–serviceable components inside the monitor case.
The monitor screen should be inspected regularly (every 200 hours of
operation) and cleaned when required. Any effective screen cleaning
method may be used. The monitor requires no other preventive maintenance.
4.4.2.7.1
Front Panel Controls/Indicator
The functions of the LCD screen controls and indicator are as follows
(See Figure 4-8):
Monitor Controls
Monitor-Front View
Figure 4-8 Monitor Control Button
1.
Power switch: Push the button to turn the monitor on or
off.
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Section 4: Vision System and Optics
2.
Power LED: Lit when monitor is on.
3.
- Shift the highlighted icon to the right side or downwards.
- To increase the value of the parameter selected in the OSD.
- To increase the brightness value when OSD is not activated.
4.
-: Shift the highlighted icon to left side or upwards.
-: To decrease the value of the parameter selected in the OSD.
-: To decrease the brightness when OSD menu is not activated.
5.
-: Press to enter the OSD menu for adjustments
- : Enter button
6. 6.
4.4.2.8
Auto Button: One touch auto adjustment.
On Screen Display (OSD) Mode
After powering up, the OSD is used to adjust the screen display. Press the
Menu button to enter OSD mode. The remaining front panel buttons (+, -,
Auto) are used to select and adjust attributes. The main menu is shown in
Figure 4-9 and described below:
Colour
- Contrast, Brightness, Gamma Correction and Colour Adjustment (RED/
GREEN/BLUE)
Picture
- Horizontal position, Vertical position, Sharpness, Phase and Clock.
Function
- Auto Adjustment, Auto Positioning, Auto Phasing, Auto Clocking and
Auto Colouring.
OSD
- Language, Horizontal Positioning, Vertical Positioning, Timer and Translucent.
Miscellaneous
- Signal Source, Mode Select and Reset
Figure 4-9 Display Menu Screen
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
4-19
Maxµm Ultra Ball Bonder
4.5
Illuminators
4.5.1
Illumination Control
The block diagram in Figure 4-10 illustrates how the vision system controls the intensity of the illuminator LEDs. The vision system assembly
encodes the illumination intensity values into an 8-bit control command,
based on inputs from the Maxµm Ultra control system or from vision system memory. With 8-bit control, 256 different intensity levels can be
selected for each illuminator. The vision system communicates with a digital-to-analog converter (DAC) on the I/O & Temperature Controller circuit
via the Illuminator Interface Board and the Backplane. Each illuminator
has a dedicated DAC output, which controls LED driver(s) for each of the
illuminators. The LED drivers limit the current in each of the LED circuits,
thereby controlling the LED intensity levels.
Dual Optics Assembly 08868–0090–000–xx
Illumination Flex Cables
Red Vertical/ Oblique:
08001–4231–000–xx (Standard)
Red Vertical/ High Angle/ Oblique:
08001–4227–000–xx (Optional)
Blue Vertical/ Red High Angle/ Oblique:
08002–4227–000–xx (Optional)
J1
J6
Bondhead
Interconnect Bd
08001–4193–000–xx
J1
Vision System
08001–0520–000–xx
AUX I/O
P9
LED/Z/Clamps
Cable
08858–2017–000–xx
P1
LPC Vision Cable
08088–2090–000–xx
P1
P2
P5
P3
Illumination Interface Bd
08001–4246–000–xx
P1
J3
LCC Illumination/
BITS Cable
08858–2000–000–xx
I/O Temp Ctrl Bd
08002–4192–000–xx
P1
J8
P2
J13
P2
J18
P2
J35
Backplane 08002–4191–000–xx
Figure 4-10 Illumination Control, Block Diagram
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Section 4: Vision System and Optics
4.5.2
Replace Illumination Flex Assembly
Purpose
Replace non–functional illumination flex assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
Allen wrench, 0.9 mm socket, long arm, P/N 27777-6002-000
•
Torque wrench, 25 oz. in. (0.18 Nm)
•
Illumination Flex Assembly, P/N 08001-4231-000-xx
Procedure
A. Press [MOTOR STOP]. Turn off machine power.
B. Remove the illumination flex cable (see Figure 4-11).
1. At the right side of the optics assembly, disconnect the illumination
flex cable from connector J6 on the bond head interconnect board.
2. Remove two (2) screws that secure the vertical illuminator alignment plate to the vertical illuminator housing.
3. Loosen the objective lens clamp screw. Remove one (1) screw that
secures the oblique illuminator to the underside of the optics housing. Remove the illuminator. (see Figure 4-12).
4. Remove the screw that secures the illumination flex assembly to
the top of the optics housing. Remove the illumination flex assembly.
5. Unscrew the objective lens mount from the oblique illuminator.
Install the objective lens mount on the replacement oblique illuminator.
C. Install the replacement illumination flex cable.
1. Hold the replacement oblique illuminator at its mounting location
under the optics housing, being sure to engage the two (2) alignment pins (see Figure 4-13). Bench the illuminator by turning it in a
clockwise direction (viewed from the underside of the optics assembly).
2. Install one (1) screw to secure the oblique illuminator to the optics
housing. Tighten the screw.
3. Position the vertical illuminator alignment plate onto the top of the
vertical illuminator housing. Secure the alignment plate with two (2)
screws. Do not tighten the screws.
4. Tighten the objective lens clamp screw.
5. Install the screw that secures the illumination flex assembly to the
top of the optics housing.
6. Connect the illumination flex cable to connector J6 on the bond
head interconnect board.
D. Turn on machine power. Make sure all illuminators are lit.
E. Adjust the vertical illuminator jacking screws so that vertical illumination is centered in the video image of the bond site.
1. Index a leadframe into the workholder until a device is clamped at
the bond site. Set oblique illumination level to zero.
2. Adjust the four vertical illuminator jacking screws so the vertical illumination is centered in the video window of the GUI display. Tighten
the two (2) screws in the alignment plate to 25 oz. in. (0.18 Nm).
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© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
Illuminator Flex Cable
SHCS
To Bond Head
Interconnect Board, J6
Vertical Illuminator Housing
Objective Lens Clamp Screw
Oblique Illuminator
Optics Assembly
Alignment Plate
Vertical Illuminator
Illuminator Flex Cable
Vertical Illuminator Mounting
Screw (3 places)
Illuminator Jacking Screw
(4 places)
Alignment Plate Screw
(2 places)
Detail A – Vertical Illuminator, Top View
Figure 4-11 Vertical and Oblique Illuminator Maintenance (Sheet 1 of 2)
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Section 4: Vision System and Optics
Bench Direction
Alignment Pin
Oblique Illuminator
Oblique Illuminator
Mounting Screw
Objective Lens
Objective Lens Holder
Alignment Pin
Figure 4-12 Vertical and Oblique Illuminator Maintenance (Sheet 2 of 2)
4.5.3
LED Illuminator Maintenance
The LED illuminators do not require any set up, alignment, or adjustment
after installation of the illumination flex cable. However, the hardware that
secures the illuminators should be checked on a regular basis.
Purpose
To eliminate vibration at the illuminators.
Frequency
Check every 200 hours
Tools/ Materials/ Parts
Hex wrench
Procedure
A. Check for play and looseness at the oblique illuminator bracket. Make
sure the oblique illuminator mounting screw is tight (see Figure 4-12).
B. Make sure that the screws that hold the flex cable oblique illuminator
LED array on the bracket are all tight.
C. Check for play and looseness at the vertical illuminator (see Figure 411). Make sure that the two (2) screws that secure the vertical illuminator alignment plate to the top of the vertical illuminator housing are
tight.
D. Make sure that the three (3) screws that secure the flex cable vertical
illuminator are tight.
E. Check that the illumination flex cable is properly seated in connector
J6 on the bond head interconnect board (at right side of front Y slide).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
4.6
Solid-State Video Camera System
4.6.1
System Description
The camera system (see Figure 4-13) consists of two camera heads
mounted on the optics assembly and a camera control unit mounted
beneath the video monitor on the upper console. The camera heads are
mounted at the rear of the optics housing. An integral cable connects
each camera head to the camera control unit mounted on the upper console beneath the video monitor. Camera power (+12 VDC) is supplied by
the power supply. The synchronization signals (H_SYNC and V_SYNC)
are provided to the camera control unit by the vision system assembly in
the lower console card rack.
The camera control unit sends digital video to the vision system assembly.
No user adjustment, repair, or preventive maintenance of the camera system is required. If there is a problem that can be traced to a camera head
or control unit, then that camera component should be replaced. Camera
heads or the control unit can be replaced individually. Camera system
components are not matched as they were in some earlier solid-state
cameras used on K&S equipment. Do not attempt to repair or adjust the
camera system components as this will lead to problems with PRS/VLL
operation.
If any camera system component needs replacement, the component
used must be a spare supplied by K&S. Video camera systems are modified by the original equipment manufacturer and carefully adjusted to
meet K&S specifications before they are installed on Maxµm Ultra
machines or accepted for use as spares. An off-the-shelf camera system
of the same type may not function in the Maxµm Ultra vision system, or if
it does, may decrease the accuracy of PRS/VLL operations.
Vision System
08001–0520–000–xx
Digital Video IN 1
Serial Port 2
Digital CCU Cable
08828–1149–000–xx
Digital Video
Camera Control Unit
08868–0095–000–xx
Camera B
Camera A
Camera Head
08868–0096–000–xx
Camera Head
08868–0096–000–xx
Low Magnification
Camera Mounting
High Magnification
Camera Mounting
Dual Magnification Optics Assembly
08868–0090–000–xx
Figure 4-13 Camera System Block and Cabling Diagram
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Section 4: Vision System and Optics
4.6.2
4.6.2.1
Replacement Procedures
Replace camera head
Purpose
Replace a defective camera head.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 9 oz. in. (0.064 Nm)
•
Camera Head, P/N 08868-0096-000-xx
Procedure
A. Remove the camera from the optics assembly (See Figure 4-5).
1. Press [MOTOR STOP]. Turn off machine power.
2. Remove the LCD monitor bracket cover to gain access to the camera control unit (refer to paragraph 4.6.2.2). Disconnect the camera
head cable from the connector (CAMERA A or CAMERA B) on the
camera control unit. The control unit is located within the video
monitor mounting bracket at the top of the upper console.
3. At the top-inside of the upper console, locate the cable clamp that
secures the camera head cables. Note how the clamp is oriented
and the cables dressed. Remove the cable clamp.
4. Remove the mounting screw(s) and washer(s) that secure the camera head cable(s) to the camera head bracket.
5. Loosen the camera head clamp adjustment screw. Pull the camera
head mount (with camera head attached) toward the rear of the
machine, out of the optics housing.
B. Install the replacement camera head on the optics assembly.
1. Thread the camera head cable through the cutout in the top of the
upper console, near the camera control unit.
2. Insert the front of the camera head into the camera head mount
clamp at the rear of the optics housing. Push the camera head
mount into the optics housing until stopped. Position the camera
head mount so the camera mount set screw is facing up. Snug
down, but do not fully tighten, the camera head clamp adjustment
screw.
3. Install the camera head cable clamp removed in step A3. Be sure
to orient the clamp and dress the cables to allow full XY table travel.
4. Connect the camera head cable to the appropriate connector on
the camera control unit front face:
•
Low magnification camera head connects to CAMERA B connector
•
High magnification camera head connects to CAMERA A connector.
5. Secure the camera head cable clamp removed in step A4. Check to
make sure that full XY table travel is allow before tightening the
screw(s).
6. Install back the LCD monitor bracket cover.
C. Perform checks/adjustments:
1. Turn on machine power. Select OK to start machine initialization.
2. Calibrate crosshair offset (refer to Appendix A).
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© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
3. Check/adjust camera linearity (refer to paragraph 4.4.2.5). Tighten
the camera head clamp adjustment screw to 9 oz. in. (0.064 Nm)
when done.
4. Check/adjust optics focus (refer to paragraph 4.4.2.4).
5. Check/adjust magnification (refer to paragraph 4.4.2.6).
6. Perform PRS calibration (refer to Appendix A).
4.6.2.2
Replace Video Monitor
Purpose
Replace a defective monitor. This procedure may also be used to remove
and install the monitor if access to the camera control unit is needed.
Tools/ Materials/ Parts
•
15” LCD Monitor (P/N 33800-6057-000)
•
Hex wrench set
Purpose
A. Press [MOTOR STOP]. Turn off machine power.
B. Remove the four (4) mounting screws and washers at the side of the
LCD monitor bracket cover. Then proceed to remove the cover.
C. Disconnect the signal cable and the power cable.
D. Remove the LCD monitor by removing the four (4) mounting screws.
E. Mount the new LCD with the four (4) mounting screws.
F. Connect the signal and power cables back to the LCD.
G. Install the LCD monitor bracket cover back with the four (4) screws
and washers.
4.6.2.3
Replace Camera Control Unit (CCU)
Purpose
Replace a defective camera control unit.
NOTE: The camera system used on the Maxµm Ultra has been modified by the
manufacturer for K&S. A camera control unit of the same type bought
off–the–shelf will not operate properly. Use only a camera control unit
supplied by K&S that has the part number given below.
Tools/ Materials/ Parts
•
Hex wrench set
•
Camera Control Unit, P/N 08868-0095-000-xx
Procedure
A. Press [MOTOR STOP]. Turn off machine power.
B. Refer to paragraph 4.6.2.2 to remove the video monitor from the
machine.
C. Remove the camera control unit (see Figure 4-14).
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Section 4: Vision System and Optics
Power Cable Connector
(08089–1018–000–xx Cable)
–
Low Magnification Camera Head Cable
(08868–0096–000–xx)
DIGITAL INTERFACE
CAMERA B
CAMERA A
+
12 VDC
0.7 A
Vision System Assembly Cable
(08089–1060–000–xx)
High Magnification Camera Head Cable
(08868–0096–000–xx)
Figure 4-14 Camera Control Unit Cabling
1. Disconnect two camera head cables from the CAMERA A and
CAMERA B connectors at the front of the camera control unit.
2. Disconnect the video output cable (from the vision system unit)
from the 68–pin DIGITAL INTERFACE connector on the front of the
camera control unit.
3. Disconnect the power input cable from the connector labeled
12 VDC/0.7 A at the left side of the camera control unit.
4. Remove two (2) nuts that secure the camera control unit hold–
down bracket. Remove the hold–down bracket and camera control
unit.
D. Install the replacement camera control unit.
1. Place the camera control unit within the monitor bracket at the top
of the upper console. Make sure the camera head connectors face
toward the front of the machine.
2. Install the hold–down bracket and secure with two (2) nuts.
3. Connect the video output cable (P/N 08089-1060-000-xx) to the
DIGITAL INTERFACE connector on the camera control unit.
4. Connect the power input cable (P/N 08089-1018-000-xx) to the
two–pin connector labeled 12 VDC/0.7 A on the camera control
unit. Note that the polarity of the connector is indicated to the left of
the power connector.
5. Locate the label on each of the camera heads that will be connected to the camera control unit. Write down the serial number
and three (3) gain values printed on each label. Clearly identify
each set of gain values/serial number as coming from the high–
mag (6x) or low–mag camera head.
6. Connect the camera head cables disconnected in step C1. to the
appropriate connectors on the camera control unit:
•
Connect low magnification camera head to CAMERA B connector.
•
Connect high magnification camera head to CAMERA A connector.
E. Refer to paragraph 4.6.2.2 to install the video monitor from the
machine.
F. Turn on machine power. Select OK to initialize the machine. Verify that
video appears in the video window of the GUI display. If not, check:
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© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
1. Turn off machine power. Check input power cable connection at
camera control unit to make sure connection is good and that connector polarity is correct (cable “+” contact connected to lower pin
of control unit connector). Check power cable for open or shorted
conductors.
2. Video cable from vision system: Make sure the 08828-1149-000-xx
cable is connected properly to control unit DIGITAL INTERFACE connector and to the connector on the Vision System unit back panel.
Make sure that connector screwlocks have been tightened at the
control unit and vision system.
3. Camera head cables: make sure connection is good at control unit
camera head connectors (CAMERA A, CAMERA B).
4. Turn on machine power and verify camera operation.
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Section 4: Vision System and Optics
4.7
Vision System Assembly
4.7.1
System Description
NOTE: The Pattern recognition system (PRS), video lead location (VLL), and
automatic pad location/centering functions are controlled by a separate
vision system microprocessing unit (MPU) and its software. The bonder
CPU1 and software coordinate all vision system functions with other
bonder operations. The vision system electronics are contained within
the matrox vision assembly mounted inside the lower console assembly.
Connections for the video camera, monitor, MMI, bond site illumination
control, and vision system/host communications are made at connectors
mounted on the vision system unit front and back panels. Communications between the vision system unit and bonder processing system
take place through an Ethernet local area network (LAN) interface.
The PRS function of the vision system converts video signals from the
camera to data for determining the unique features of a scene and its
position (i.e., an “eyepoint”). This information is then used during the
alignment phase of automatic bonding to determine the bond positions of
the current device at bond. When a bond program is taught, the vision
system stores the eyepoint data. When the program is run, the vision system characterizes the scene being viewed and compares it to the stored
data, then indicates to the bonder the X and Y displacement of the eyepoint in both whole pixel and fractional pixel units. Each pixel of the camera sensor corresponds to a small area on the work (4.5 microns/pixel for
low magnification (2x), 1.5 microns/pixel for high magnification (6x). The
exact pixel size is measured during the Pattern Recognition System
(PRS) Optics Calibration routine when the actual ratio of XY table motor
pulses per pixel is determined. A technique employed by the vision system further enhances the optical resolution. The Video Lead Locator
(VLL) capability is a high-speed video image analysis technique, which
enables the bonder to ”find” individual outer leads of an IC package before
bonding. Information provided by the VLL during the ”find” sequence is
subsequently used by the bonder to compensate for any positional variations or lead shifts unique to the current device at bond so that accurate
bond placements on the leads can be made. The VLL process is therefore
especially suited for use on devices having large numbers of closely
spaced leads or leads subject to variations in width and location from
device to device, serving to enhance bonding accuracy with minimal effect
on cycle time.
System Computer
Ethernet Port
Network Port
Modem Cable
11950–0002–006–xx
Ethernet Cable
11950–0300–000–xx
Ethernet 1
Serial Port 1
Vision System
TV Out
08001–0520–000–xx
USB 1
USB 2
USB Cable
USB Shielded Cable
84104–1100–000–xx
12710–9100–000–xx
Keyboard
Monitor Ext Cable
08088–3006–000–xx
Monitor
33800–6057–000
Mouse
MMI Assembly
08858–0020–000–xx
USB Port
Figure 4-15 Camera System Block and Cabling Diagram
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
4.7.2
Vision System Assembly Maintenance
During normal operation, no maintenance or adjustment of the vision system assembly is necessary. Aside from the power switch, there are no
user controls or test points on or inside the vision system unit. If the vision
system stops operating or if there is a problem caused by a defect within
the system, no attempt to repair the vision system assembly should be
made. The defective vision system assembly should be replaced as a unit
by following the procedure in paragraph 4.7.2.
Vision System
Power Supply Bracket
Matrox Vision Assembly
(Hidden)
TDI Power Supply
Vision System
Power Supply Bracket
Figure 4-16 Vision System Unit, Mounting Location in Lower Console
4.7.3
Vision System Power Supply
The vision system power supply consists of a power supply module. The
power supply module converts ac line voltage to +12 VDC operating
power for the vision system unit. An input power cable, which is connected to the power output on the MPS (modular power supply), and output power cable, which is connect to the vision system unit are integral
parts of the power supply module. The power supply module is not adjustable or repairable.
The power supply module is mounted inside the machine lower console,
held in a bracket attached to the right side of the lower console frame
(viewed from the rear of the machine, see Figure 4-16).
4.7.4
Vision System Controls and Indicators
There are no control buttons except for the power on/off button. There are
also Six LED indicators located on the front and rear panel. These indicators will be helpful when diagnosing vision system problems. Table 4-2
lists the indicators and describes their functions. External cables should
be connected only to those identified in Figure 4-17.
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Section 4: Vision System and Optics
Ethernet Cable
11950-0300-000
(to System Computer, Ethernet Port at Slot 1)
100 Mbps
Activity
Power
12V
12V DC Power Cable
MMI KeyPad/ Mouse
Via USB HUB
2
1
Aux I/O
MMI USB Port
84104-1100-000
Monitor Extension Cable
08088-3006-000-00
(to Monitor Cable)
1
Modem Cable
11950-0002-006
(to System Computer, RS232 Port)
2
TV out
CBL_DIGITAL_CCU
08828-1149-000
(to CCU/ Data out)
Digital Video in
CBL_LPC_Vision
08088-2090-000
(to illum Bd)
On
STR
Diag
HDD
Indicators
1
2
Power button
Matrox Ground Cable
08828-1143-000-00
(to the Mounting Bracket)
Figure 4-17 Vision System Unit - Cable Connections at Front and Back Panel
Table 4-2 Vision System Assembly Controls/Indicators
Control/Indicator
Type
Function
Front side of unit
ON
LED Indicator (Grn)
ON when vision system unit power is on.
STR (Suspend to RAM) LED Indicator (Red)
ON when vision system unit is in Sleep mode.
Diag(nostic)
LED Indicator (Red)
Flashes to report vision system power–on self
test errors detected before video is initialized.
After video initialization, error messages
appear on the video monitor. The patterns of
flashes identify specific errors.
HDD (Hard Disk Drive)
LED Indicator (Red)
ON when vision system unit hard disk drive is
operating.
Activity
LED Indicator (Yellow)
Indicates Ethernet data transfers. LED is ON
when vision system unit is connected to network (host processor). Blinks rapidly during
data transfers. OFF if unit is not connected to
network.
100 MBPS
LED Indicator (Green)
ON if network interface is in 100BaseT mode.
OFF if network interface is in 10BaseT mode.
Rear side of unit
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© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
4.7.5
Vision System Unit Configuration
The Matrox vision system unit used in the Maxµm Ultra bonder does not
require any configuration or other preparation by the user prior to its installation in the machine. Follow the instructions in paragraph 4.7.7 to install a
replacement vision system unit in the machine.
4.7.6
Vision System Cable Connections
External cables should be connected only to those connectors identified in
Table 4-3, which lists vision system cable connections for the standard
Maxµm Ultra configuration. Several connectors on the unit are not used.
Connector locations are shown in Figure 4-17.
Table 4-3 Vision System Unit Connections
Cable P/N
Connector
Type
To
Left side of unit (viewed from rear of machine)
08828-1149-000-xx
68-pin VHDCI, Female Camera Control Unit,
Digital Video In
DIGITAL INTERFACE
& 9-pin D-SUB,
(upper connector of
connector
two) and Communica- Female
tion Port 2 (lower connector of two)
08088-2090-000-xx
Aux I/O
25-pin D-type submin., Illuminator Interface
Male
board (08001-4246000-xx)faceplate connector
N/A (part of vision system
power supply module)
DC Input
7-pin circular connector
Vision Sys. Power
Supply Module
11950-0002-006-xx
Serial Port 1
9-pin D-Type Submin,
Male (upper of two
Serial Port connectors)
Machine host Processor Serial Port
Right side of unit (viewed from rear of machine)
11950-0900-000
USB 1
Universal Serial Bus
(USB) connector
MMI Keyboard/mouse
84104-1100-000-xx
USB 2
Universal Serial Bus
(USB) connector
MMI USB Mouse
08088-3006-000-xx
TV out 1
15-pin D-type submin., Monitor LCD Cable
Female (upper of two
TV Out connectors)
11950-0300-000
10/100BaseT Ethernet
8-pin RJ45
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CPU1 PC brd. faceplate RJ45 connector
Section 4: Vision System and Optics
4.7.7
Replace Vision System Unit
Purpose
•
Remove and replace the vision system unit in the lower console card
rack.
Tools/ Materials/ Parts
•
Hand tools
•
ESD–protective storage box or bag, sized to the vision system unit.
•
ESD–protective equipment/materials
•
Matrox Vision Assembly, P/N 08001-0520-000-00
CAUTION: Make sure machine power is off before starting the vision system unit
removal procedure or disconnecting any cables from the vision system unit.
CAUTION: Obey all established ESD procedures when handling or storing the vision
system unit.
Procedure
A. Press [MOTOR STOP]. Turn off machine power.
B. Remove the rear cover from the lower console.
C. Locate the bracket attached to the underside of the machine base that
supports the vision system unit (see Figure 4-16).
D. Remove the vision system unit from the lower console.
1. Disconnect cables at the following connectors on the vision system
unit front and back panels:
a. Front panel:
•
Monitor Extension Cable at connector labeled TV out 1.
•
USB Hub connector labeled USB 1.
•
USB Cable at connector labeled USB 2.
•
Vis. Sys. to CPU1 Ethernet cable at connector next to LED
labeled 10/100 BaseT.
b. Back panel:
•
Video Cable at upper connector of two connectors labeled Digital Video In.
•
Video camera communications cable from lower of two RS-232
serial port connectors (9–pin D–type connectors.)
•
Vision system power supply module cable at connector located
below power switch.
•
Illuminator Interface cable at connector labeled Aux I/O.
See Table 4-3 for cable part numbers.
2. Dismount vision system bracket from underside of machine base
and remove vision system unit.
a. While supporting the vision system bracket from below, remove
four (4) SHCSs that secure the bracket to the underside of the
machine base. Remove the bracket and vision system unit from
the lower console.
b. At an ESD-protected work station, remove four (4) screws that
secure the unit in the bracket. Set the screws aside for re-use.
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Maxµm Ultra Ball Bonder
These screws, or screws of the same length, must be used to
secure the replacement unit in the bracket.
c. Pull the vision system unit out of the bracket.
3. Immediately place the vision system unit in an ESD–protective
enclosure.
CAUTION: Do not remove the new vision system unit from its ESD–protective shipping
package until ready to install it in the machine.
E. Install the replacement vision system unit:
CAUTION: Use the screws removed in step D. to secure the vision system unit to its
bracket. If screw replacement is required due to loss or damage, use screws
that are the same length as the original screws [M4]. Installing longer screws
will damage components inside the vision system unit.
1. Place the vision system unit into the mounting bracket. make sure
the fan in the side of the vision system is aligned with the fan opening in the bracket. From below the bracket, install and tighten the
four (4) screws to secure the vision system unit to the bracket.
Tighten the screws.
2. Hold the vision system unit and bracket inside the lower console
below its mounting location. Make sure that the front panel of the
unit is toward the right side of the lower console frame (when
viewed from rear of machine)
3. Install four (4) SHCSs to secure the mounting bracket to the underside of the machine base.
4. Make cable connections at connectors mounted on the front and
back panels of the vision system unit:
NOTE: When installed, the front panel of the vision system unit faces the rightside of the lower console frame when viewed from the rear of the lower
console. The back panel faces the left side.
a. Front panel:
•
Monitor Extension Cable at TV1 connector.
•
USB Hub cable at USB1 connector.
•
USB Cable at USB2 connector.
•
Vis. Sys. to CPU1 Ethernet cable at ethernet connector (next to
LED indicator labeled 10/100 BaseT).
b. Back panel (see Figure 4-17):
CAUTION: Use care when connecting the video camera cable to the vision system Digital Video In connector. The contact pins in the 68-pin cable
connector are fragile and can easily be bent or broken during connection to the panel mount connector.
4-34
•
Video Camera Cable at Digital Video In connector (upper of two
68-pin connectors at this location.)
•
Video camera communications cable at serial port connector
(lower of two 9–pin male D–type connectors.)
•
Vision system power cable at DC In connector.
•
Illuminator Interface cable at Aux I/O connector.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
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Section 4: Vision System and Optics
F. Turn on machine power.
G. Press the vision system power switch (back panel of unit) and make
sure that the ON indicator LED lights. Verify that the machine completes initialization and operates normally.
H. Install the lower console cover.
4.7.8
Optimize Vision System (PRS/VLL) Performance
The performance of the Pattern Recognition System (PRS) and Video
Lead Locator (VLL) depends on the performance and interaction of many
elements in the vision, material handling, and bond head positioning systems. The system elements include bond site illumination, optics, the
camera, vision system electronics and software, the bonder’s XY table
with its controls, and the workholder. For optimum PRS/VLL operation,
careful attention must be given to each element: making adjustments
when necessary, adhering to preventive maintenance schedules, and
periodically checking component integrity.
The following paragraphs provide a set of guidelines for checking each
item for proper function.
4.7.8.1
Illumination
Correct Choice of Oblique, Vertical and Optional High Angle Light:
A. PRS Considerations:
Look for good contrast and consistency from die to die. When using
oblique light, avoid “street lights” or other specular reflection. Variations due to apparent color of the die can be minimized by using more
vertical light.
B. VLL Considerations:
The illumination selected for the outer leads should be directed at
obtaining the maximum possible contrast between the lead finger and
its surrounding area. Oblique, vertical, optional high angle, or a combination can be used. In the case of lead frames, care should be taken to
avoid/minimize reflections from the workholder heat block.
C. General:
Use higher levels of vertical and optional high angle illumination compared to oblique illumination. Do not set vertical light intensity so high
that the video image is saturated. Saturation will decrease the dynamic
separation between signal and background, making it difficult for the
PRS/VLL to distinguish die features or leads.
4.7.8.2
Optics and Camera:
A. Cleanliness and Stability:
Check that the monitor image of the field of view is clear, has adequate
contrast, and has no blemishes. Spots that do not move when the
image moves indicate dirt on the camera CCD sensor surface. Dirt
elsewhere in the optics tends to reduce contrast.
B. Vibration:
Check that the optical system shows no sign of looseness. Any vibration of the optics or camera during operation will severely degrade performance.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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4-35
Maxµm Ultra Ball Bonder
C. Adjustments:
The camera requires no field adjustment. However, all optics adjustments (focus, linearity, magnification) must be maintained for optimum
performance.
D. Troubleshooting:
The following items should be checked when troubleshooting the camera or the optics:
1. Camera CCD sensor surface should be free of dust or other particles.
2. The focus adjustment ring and the locking collar that secures the
camera are tight.
3. Magnification and linearity should be adjusted such that when a
PRS calibration is performed, the pixels to pulse ratios reported
are:
a. Low Magnification (2x):
XX = 0.1772 ±0.010
YY = 0.1772 ±0.010
XY = 0.000 ±0.003
YX = 0.000 ±0.003
b. High Magnification (6x):
XX = 0.0591 ±0.001
YY = 0.0591 ±0.001
XY = 0.0000 ±0.001
YX = 0.0000 ±0.001
4. Repeated attempts at PRS calibration are unnecessary.
E. Illumination should be set high enough to get good contrast on the die
surface. Outside area brightness can be ignored.
4.7.8.3
Electronics
a. Self Test:
The vision system self test checks the operation of the system
electronics. If the self test finds a malfunction, an error code will
be displayed that identifies the problem within the module. The
error code should be supplied to K&S when requesting service
for the PRS. Refer to Volume 1: Maxµm Ultra Operations for
more information concerning the vision system self test.
b. Inspection:
Routine visual and tactile checks of cables and connectors are
important preventive maintenance functions.
4.7.8.4
Bonder XY Table
a. Accuracy:
The table must respond accurately and consistently to each
motion command issued by bonder software. Table motion is
tested during PRS calibration. If a good eyepoint is properly set,
predictable and consistent pulse/pixel ratios will be reported.
b. Stability:
Servos, table bearings, couplings, the optical system, and the
workholder all contribute to the stability of the opto–mechanical
system.
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Section 4: Vision System and Optics
4.7.8.5
MHS Workholder
For video lead location, the workholder heat block must be leveled so that
all lead fingers are level, in order to obtain uniform reflectance. Proper
clamping of the lead fingers is equally essential. Improperly clamped lead
fingers can result in some leads becoming bent, causing inconsistent
reflections that can cause failures.
4.7.8.6
PRS Eyepoints:
A. Selection:
The eyepoint should be chosen in an area having edges or sharp
changes in feature intensity in both X and Y directions. The “Guide To
Teaching Eyepoints” appendix in Volume 1: Maxµm Ultra Operations
provides helpful insights for selecting eyepoints.
B. Test After Teach:
The bonder automatically exercises the PRS and table after each eyepoint teach. In order for this test to be successful, the reports of displacement made by the PRS must be in close agreement with the
bonder’s four movement commands to the table. If a nearby scene by
chance happens to closely match the chosen eyepoint scene, that
scene may be accepted instead, making the test fail. The test will also
fail if the required opto–mechanical stability or table motion is faulty.
4.7.8.7
VLL Diagnostics
Prior to teaching leads to the VLL, it is recommended that VLL Lighting
Setup be performed to establish optimum lead–to–lead illumination, and
to ensure that all leads can be taught. Lead illumination can be taught for
individual leads, or, in the case of lead associations, for each group of
leads that forms an association. The VLL teach sequence should be commenced, however, only after it is clear that illumination intensities are satisfactory. Refer to Volume 1:Maxµm Ultra Operations for more information
concerning VLL Lighting Setup.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
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Section 5: Bond Head
5
Bond Head
5.1
About This Chapter
Here’s what you will find in this section:
•
Section 5.2, Overview, describes the various components within and
mounted on the Bond head assembly. It contains basic component
information and location of each component in the Bond head.
•
Section 5.3, Preventive Maintenance, describes preventive maintenance requirements for the bond head.
•
Each section from Section 5.4 through 5.8 covers a functional system
and its major components. It explains how to replace, adjust and do
preventive maintenance on each component.
•
Section 5.4, Bond Head Assembly
•
Section 5.5, Electronic Flame Off Assembly
•
Section 5.6, Wire Clamp Driver
•
Section 5.7,Ultrasonic Generator and Transducer
•
Section 5.8, Bond Head Controls
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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5-1
Maxµm Ultra Ball Bonder
5.2
Overview
Wire bonding is accomplished by the following mechanisms and controls.
See Figure 5-1 for their locations on the machine.
•
Bond Head
The bond head is a motor driven assembly that raises and lowers the
capillary (bond tool). It applies force and ultrasonic energy to bonds,
breaks wire free at second bond, and includes an electronic flame–off
(EFO) wand assembly to form a ball on the wire prior to first bond. The
XY table assembly positions the bond head assembly in relation to the
work. Refer to Section 6 for XY table information.
•
Wire Feed System/Bond Integrity Test System
The wire feed system has a motorized spool mount and air pressure
devices for precise wire feed and tension that are controlled by the
wire feed/BITS circuit board. The bond integrity test system (BITS),
part of the wire feed control electronics, tests for the outcome of the
bonding process. The wire feed/BITS circuit board is mounted within
the upper console; other wire feed components are mounted on or
within the upper console and on the optics housing assembly. Refer to
Section 3 of this manual for detailed descriptions and maintenance
procedures. A short description of the wire feed/BITS is included in this
section.
•
EFO Assembly
The EFO assembly generates a computer–controlled high voltage discharge for wire ball formation. This assembly consists of an EFO circuit board within an aluminum box, an EFO bracket assembly mounted
to the side of the bond head, an EFO wand and a high-voltage cable.
•
Wire Clamp and Clamp Driver Circuit Board
The wire clamp (mounted above the capillary) is opened to allow wire
to feed during most of the bond cycle. After second bond is made, the
clamp closes to hold the wire while the bond head moves upward,
tearing the wire away from second bond and leaving a tail of wire
below the capillary for ball formation. A clamp drive circuit board
assembly creates and modulates the electrical potential that opens
and closes the wire clamp assembly. The circuit board assembly is
located in the card rack inside the lower console.
•
Ultrasonic Generator
The ultrasonic generator (USG) is a circuit board that generates computer–controlled ultrasonic energy. This energy is delivered to the
transducer mounted on the bond head. The transducer converts ultrasonic energy to mechanical vibrations, which are coupled to the capillary. Mechanical vibrations, along with heat and force, promote bond
formation when the wire is held in contact with a device bond pad or
package lead. The USG circuit board assembly is located in the card
rack assembly inside the lower console.
•
Bond Head Controls
Bond head controls are circuit boards for precise computer control of
bond head motions and operations. These are the Servo CPU board
(which also controls XY table motion), the Servo Preamp board, and
the Z Amplifier board. All of these boards are located in the card rack
within the lower console.
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Section 5: Bond Head
EFO Box
(Inside Upper
Console)
Wire Feed System
(behind microscope)
Bond Head
(behind microscope)
Clamp Driver, Ultrasonic
Generator, Bond Head
Servo System (in card rack,
behind door)
Figure 5-1 Bond Head Assembly and Related Components, Locator
To ensure optimum bonding, refer to setup instructions in Section 1 of this
manual and the Preventive Maintenance requirements in paragraph 5.3
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-3
Maxµm Ultra Ball Bonder
5.3
Preventive Maintenance
Preventive maintenance requirements for the bond head and its related
systems are listed in Table 5-1
Table 5-1 Bond Head and Related Systems Preventive Maintenance
Service
Frequency
Reference
Inspect capillary
Check bonds for crispness and unifor- If capillary change is necesmity every 8 hours. If necessary,
sary, refer to paragraph
change capillary.
5.4.2.1
Check wire clamp gap
40 hours
Paragraph 5.4.2.4
Clean wire clamp jewels
40 hours
Paragraph 5.4.2.5
Clean wire clamp jewels
200 hours
Paragraph 5.4.2.6
Check EFO setup/condition
200 hours
Paragraph 5.5.2.1, 5.5.2.3
Check Z encoder signal
amplitude
3000 hours
Paragraph 5.4.2.7
Check transducer alignment
3000 hours
Paragraph 5.4.2.14
Inspect capillary clamp screw Check every 10th capillary change,
replace screw every 100th capillary
change
Clean and inspect wire feed
tube (on wire clamp)
5.3.1
Paragraph 5.4.2.2
Every wire spool change or after 1000 Paragraph 5.4.2.17
ft. (303 m) of wire usage
Beryllium Product Warning
WARNING: THE BOND HEAD LINK IS MADE FROM A BERYLLIUM ALLOY THAT
IS A POTENTIAL CARCINOGEN. HAZARDOUS DUST IS PRODUCED
WHEN THIS MATERIAL IS MACHINED, FILED, OR GROUND. DO NOT
MACHINE OR OTHERWISE ATTEMPT TO REWORK THE BOND HEAD
LINK. USE CARE NOT TO GOUGE OR CHIP THE LINK WHEN WORKING AROUND THE BOND HEAD WITH SHARP TOOLS.
The label shown below is affixed to the bond head link:
!
WARNING
BERYLLIUM
PRODUCT
(See User Manual)
Link material is a beryllium alloy that represents no hazard to the user
when it is left undisturbed. However, if the link is filed, ground, or
machined, dust will be generated that is a potential carcinogen. UNDER NO
CIRCUMSTANCE SHOULD THE USER ATTEMPT TO MODIFY OR OTHERWISE
REWORK THE LINK. Care should always be exercised when working
around the link with sharp tools to avoid gouging the link, as this may produce small chips or splinters that can penetrate the skin.
A Material Safety Data Sheet (MSDS) that describes the hazards associated with the specific beryllium alloy used in the link, and provides information concerning its safe handling, is available upon request from K&S.
Contact any K&S Sales and Service office to order this data sheet.
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Section 5: Bond Head
5.4
Bond Head Assembly
5.4.1
Description
The bond head (Figure 5-2) performs all motions and operations necessary to bond gold wire to the device surface. Basic components of the
bond head are:
Z Motor Housing
Z Encoder
EFO Assembly
Wire Clamp
Link
Transducer
Modular Flexure
Assembly
Piezo Sensor
Air Knife
Figure 5-2 Bond Head Assembly, Major Components
NOTE: Above figure illustrates Bond Head Assembly with a STANDARD wire
clamp assembly.
•
Link
The link is the component that connects all of the bond head dynamic
components together. The link pivots on a modular flexure bearing
assembly. The link is configured to:
•
provide a good foundation for the ultrasonic transducer and wire
clamp assembly.
•
provide mechanical coupling between dynamic components.
•
support the Z encoder grating.
Link temperature is monitored by the I/O & Temperature Controller circuit board through a thermocouple attached to the link. The control
system can modify the Y axis crosshair offset value based on changes
in link temperature. This is done to limit bond drift caused by the different thermal expansion rates of the link and optics assembly.
Link material is a beryllium aluminum alloy that is considered a hazardous material under some circumstances. It is not a hazard during ordinary machine operations. Refer to paragraph 5.3.1 for more
information.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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5-5
Maxµm Ultra Ball Bonder
•
Z–Axis Motor
The Z–axis motor is a flat coil design that drives the dynamic components of the bond head (link, transducer, etc.) in the vertical or z axis
direction. The motor is controlled based on the desired position of the
capillary and the commanded bond force. Link/capillary position is
monitored by the Z–axis encoder, while bond force is monitored
directly by the Z–motor control system. Compressed air is constantly
blown through the motor via the air knife. The cooling air is used in
conjunction with a thermocouple–controlled heater located on top of
the Z motor to keep Z motor temperature constant at 50° C. This flat
heater is connected to the Z Temperature Controller (ZTC) which
resides on the I/O & Temperature Control circuit board. A thermocouple is attached to the top of the Z motor housing and provides feedback to the ZTC Controller.
•
Ultrasonic Transducer
The ultrasonic transducer converts electrical energy from the USG circuit board to mechanical energy in the form of vibration. The vibration
is an energy input to the bonding process, applied through the capillary
mounted at the front of the transducer housing. The Maxµm Ultra uses
a Ultra-T transducer, which is made of titanium.
•
Wire Clamp
The wire clamp grasps the wire during the tear operation after second
bond, thereby supplying the tail for ball formation prior to the next
bond. The clamp remains closed to hold the wire until the ball is
formed on the wire prior to the next first bond. During the rest of the
bond cycle, the clamp is either open to allow wire to feed through the
capillary or closed, when payout of wire is not desired. The clamp is
opened and closed by a modulated direct current (dc) high voltage
from the clamp driver board in the lower console card rack.
•
EFO
The EFO converts electrical energy into heat energy to form the ball on
the wire. The EFO accomplishes this by establishing an electrical
potential difference between the wire and the EFO wand. A spark
occurs, and the electrical energy passing through the spark gap melts
the tip of the wire, which then forms into a spherical shape and solidifies. The EFO wand assembly is attached to the front Y slide.
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Section 5: Bond Head
5.4.2
Bond Head Maintenance Procedures
WARNING: THE BOND HEAD LINK IS MADE FROM A BERYLLIUM ALLOY THAT
IS A POTENTIAL CARCINOGEN. READ THE BERYLLIUM PRODUCT
WARNING (PARAGRAPH 5.3.1) BEFORE PERFORMING ANY MAINTENANCE ON OR NEAR THE BOND HEAD LINK.
5.4.2.1
Replace Capillary
Purpose
Replace a worn or damaged capillary with a new capillary.
Tools/ Materials/ Parts
•
Torque wrench, 35 oz. in. (0.25 Nm)
•
Tweezers
•
Capillary
NOTE: A capillary change software tool is available through two of the GUI pull–
down menus (Manual Mode menu and Bond Head Calibration menu).
Selecting the tool starts a software function that leads the operator
through the capillary change procedure. To change a capillary without
using the software tool, perform the following procedure. If using the
software tool, follow screen instructions and use the procedure below
only as a guide.
CAUTION: If using a Micro–Swiss Sigma capillary, do not touch the capillary with
tweezers or try to remove it from the transducer while the USG (Function [f7]) is active.
Procedure
A. Park the MHS workholder components by selecting the PARK INDEXER
GUI button. Use the mouse to move the bond head to a location where
the capillary can be easily removed.
B. Check the AIR GUIDE and TENSIONER indicators on the MMI keypad. If
either indicator is lit, press the push button switch to turn off the application.
C. Remove wire from the capillary.
CAUTION: Use care when removing the capillary to avoid damaging the EFO
wand assembly.
D. Loosen the capillary clamp screw to release the capillary (see Figure
5-3). Use tweezers to remove the capillary from the transducer.
E. Use tweezers to remove the new capillary from its storage vial. Insert
the capillary into the capillary clamp in the transducer. Move the capillary upward until it benches against the top of the capillary clamp.
F. Use the torque wrench to tighten the capillary clamp screw to 35 oz. in.
(0.25 Nm).
G. Perform an ultrasonic generator (USG) calibration. Refer to Appendix
A for instructions.
H. Teach Crosshair Offset following the procedure in Appendix A.
I. Perform an EFO Wand Height calibration. Refer to Appendix A for
instructions.
Volume 2: Maintenance
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5-7
Maxµm Ultra Ball Bonder
J. Select the BND HT RELRN (bond height relearn) GUI toolbar button. The
bonder will lower the capillary to find contact height with the die at the
bond site.
K. Thread bonding wire through the capillary bore. Use the [F8] key to
open the wire clamps. If necessary, turn on the USG by selecting the
USG GUI button (or by pressing its associated function key) to help the
wire pass through the capillary bore.
L. Use the mouse to target a device lead and press [B1] (mouse button 1)
to bond off the excess wire. Tensioner should turn on after this is done.
M. Verify that there is a ball present on the bonding wire below the capillary. If not, use the EFO button on the GUI toolbar to fire the EFO and
form a ball on the wire.
N. If the tool usage limit function is being used, reset the tool usage
counter. Refer to Maxµm Ultra Volume 1: Operations for instructions.
Transducer
Capillary
Clamp Screw
Tighten to 35 oz.in. (0.25Nm)
NOTE:
Inspect clamp screw every 10th capillary change;
replace screw every 100th capillary change. Use
only screws provided by K&S.
Figure 5-3 Replace Capillary
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Section 5: Bond Head
5.4.2.2
Inspect Capillary Clamp Screw
Purpose
To detect stripping of screw threads and wear in the socket of the clamp
screw.
Frequency
Inspect clamp screw every 10th capillary change. Clean or replace, as
required. Replace the clamp screw every 100th capillary change.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 35 oz. in. (0.25 Nm)
•
Clamp Screw, SHCS M1.6 x 4 mm, P/N 70759-0016-004
Procedure
A. Press [MOTOR STOP] key.
NOTE: Use tweezers to handle the capillary. Do not touch capillary with fingers.
B. If capillary is installed, loosen capillary clamp screw and remove capillary using tweezers. Remove the clamp screw.
C. Inspect the clamp screw for thread stripping, damage to the socket in
the head of the screw, and overall condition. If conditions warrant, discard clamp screw.
NOTE: Use only clamp screws provided by K&S. Commercially available off–
the–shelf screws may alter the expected ultrasonic response.
D. Install the replacement clamp screw into the transducer.
E. Install the capillary (refer to paragraph 5.4.2.1).
5.4.2.3
Adjust Wire Clamp Lateral Position
NOTE: The wire clamp lateral position and clamp gap adjustments interact with
each other. After adjusting the clamp lateral position, check the wire
clamp gap (refer to paragraph 5.4.2.4).
Purpose
Make sure the wire path is centered in the wire clamps to avoid excess
wire path drag.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 40 oz. in. (0.28 Nm)
Procedure
A. Slightly loosen two (2) screws that secure the clamp to the front of the
bond head link (see Figure 5-4). Use care not to loosen too much there should still be slight pressure on the washers under the screws.
B. Adjust the wire clamp lateral position screw until the wire path is centered in the wire clamp. Tighten the two (2) clamp mounting screws to
40 oz. in. (0.28 Nm). Check wire clamp gap (paragraph 5.4.2.4).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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5-9
Maxµm Ultra Ball Bonder
Clamp Lateral Position
Adjustment Screw
(hidden from view)
Clamp Mounting Screw
(2 places)
Bond Head - Front View
Figure 5-4 Adjust Wire Clamp Lateral Position
5.4.2.4
Adjust Wire Clamp Gap
NOTE: The wire clamp lateral position and clamp gap adjustments interact with
each other. After adjusting the wire clamp gap, check the clamp lateral
position (refer to paragraph 5.4.2.3).
Purpose
Make sure the gap between wire clamp jewels is correct to avoid higher
impact force on the wire and to avoid wire path drag.
Frequency
Check clamp gap after every 40 hours of operation or if the wire clamp
operates erratically.
Tools/ Materials/ Parts
Insulated Hex wrench, 0.9 mm
Procedure
WARNING: ELECTRICAL SHOCK HAZARD! DO NOT TOUCH THE WIRE CLAMP
WITH HANDS OR UNINSULATED TOOLS WHEN MACHINE POWER IS
ON!
A. Turn on the work light (press [F9]) to illuminate the wire clamp jewels
and position the bond head and microscope so the bottom of the
clamp jewels can be seen.
B. Increase the microscope magnification to 4X and adjust the focus as
necessary. Rotate the microscope eyepiece so the reticle is horizontal
in the field of view.
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Section 5: Bond Head
C. Press [F8] to open the wire clamp. Align a major reticle division with the
edge of the conductive jewel. The easiest way to position the jewels
under high magnification is to use table chessing by placing the cursor
in the live video window, press button [B2] and move the mouse.
WARNING: ELECTRICAL SHOCK HAZARD! DO NOT TOUCH THE WIRE CLAMP
WITH HANDS OR UNINSULATED TOOLS WHEN MACHINE POWER IS
ON!
D. Insert the insulated hex wrench into the wrench guide to locate the
clamp adjustment screw. Adjust the clamp adjustment screw as
required to obtain the correct gap value according to Table 5-2, which
shows the correlation between major reticle divisions and gap in mils.
The gaps listed in the table are gaps at the wire position.
Table 5-2 Reticle Division to Gap Conversion
Divisions
Gap (mils)
2.0
2.5
3.0
3.5
4.0
2.5
3.1
3.7
4.3
4.9
E. Repeat steps C. to D. until the desired gap is obtained. Check wire
clamp lateral position (paragraph 5.4.2.3).
Clamp Adjustment Screw
(hidden from view)
Read Warning Label First!
Insert the insulated
0.9mm Hex Wrench
Wrench Guide
Bond Head - Right Side
Figure 5-5 Adjust Wire Clamp Gap
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-11
Maxµm Ultra Ball Bonder
5.4.2.5
Clean Clamp Jewels (40 hours)
Purpose
To prevent sticking of wire clamp.
Frequency
Every 40 hours, or sooner if:
•
wire clamp operates erratically, or
•
occurrence of false BITS non–stick on pad (NSOP) indications (Intermittent)
Tools/ Materials/ Parts
•
Clean, white, lint–free paper
•
Ethanol (grain alcohol), 98% purity or better
Procedure
CAUTION: Only ethanol (grain alcohol) should be used to clean the clamp jewels.
Do not use other solvents (potassium iodide, Lime–Away, etc.), as
they will chemically react with and damage the conductive clamp
jewel material.
WARNING: ETHANOL (GRAIN ALCOHOL) IS A VOLATILE FLAMMABLE LIQUID.
EXERCISE CARE WHEN USING IT.
NOTE:
Wire clamp cleaning will be performed with bonder under power.
A. Press [F8] switch (clamp opens). If present, remove wire from between
clamp jewels.
B. Apply a few drops of alcohol to moisten a piece of lint–free paper.
Insert moistened paper between the clamp jewels.
C. Press [F8] (clamp closes). Carefully move the paper back–and–forth
within clamp jewels.
D. Press [F8] (clamp opens). Discard moistened paper.
E. Insert a dry piece of lint–free paper between the clamp jewels and
press [F8] (clamp closes).
F. Withdraw the paper between the closed jewels in one smooth motion.
Discard the paper.
G. Press [F9] (Clamp opens). Blow canned air over the clamp jewel.
H. Press [F8] several times to open and close the clamp. Verify that the
jewels do not stick.
I. Visually check between the clamp jewels for residue or paper fibers
and remove them as needed.
J. Repeat procedure as required
K. Fill in the machine wire clamp cleaning log.
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Section 5: Bond Head
5.4.2.6
Clean Clamp Jewels (for 200 hours)
Purpose
To prevent sticking of wire clamp.
Frequency
Every 200 hours, or when:
•
wire clamp operates erratically, or
•
occurrence of false BITS non–stick on pad (NSOP) indications (Intermittent)
Tools/ Materials/ Parts
•
3M lapping film 3µm grain size (261X) cut to about 1/4” x 3” long
•
Clean, white, lint–free paper
•
Ethanol (grain alcohol), 98% purity or better
Procedure
WARNING: ELECTRICAL SHOCK HAZARD! DO NOT TOUCH THE WIRE CLAMP
WITH HANDS OR UNINSULATED TOOLS WHEN MACHINE POWER IS
ON!
CAUTION: Only ethanol (grain alcohol) should be used to clean the clamp jewels.
Do not use other solvents (potassium iodide, Lime–Away, etc.), as
they will chemically react with and damage the conductive clamp
jewel material.
WARNING: ETHANOL (GRAIN ALCOHOL) IS A VOLATILE FLAMMABLE LIQUID.
EXERCISE CARE WHEN USING IT.
NOTE: Wire clamp cleaning will be performed with bonder under power.
A. Press [F8] switch (clamp opens). If present, remove wire from between
clamp jewels.
B. Remove the feed tube block to facilitate access to the jewels.
C. Apply a few drops of alcohol to moisten the 3M lapping paper.
D. Face the coarse side of the moistened lapping paper on the jewel surface targeted to clean and insert the lapping paper between the clamp
jewels. Protrude the paper to approximately 1/2” from the bottom of the
clamp. Figure 5-6 shows the left jewel surface is to be cleaned.
E. Press [F8] (clamp closes). Carefully slide the paper vertically up and
down within the clamp jewels, making sure the full surface of the jewel
is covered during the motion.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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5-13
Maxµm Ultra Ball Bonder
3M Lapping Paper
Right hand to hold
the upper end
Clamp Jewel
Left Side
Clamp Jewel
Right Side
Coarse side
Left hand to hold
the lower end
Wire Clamp Front Side
Figure 5-6 3M Lapping paper inserted between the jewels
F. Slide the strip 1/2” downwards and repeat the up and down motion
until the upper length of the strip is consumed.
G. Press [F8] (clamp opens). Discard moistened paper.
H. Repeat step C. to G. on the other jewel surface of the wire clamp.
I. Apply a few drops of alcohol to moisten the clean room lint-free paper
(2” length), leaving 1/3 portion of the paper dry as shown in Figure 5-7.
Moistened Portion
Dry Portion
Figure 5-7 Clean room lint free paper with 1/3 portion of the paper dry
J. Insert the dry portion of the lint–free paper between the clamp jewels
and press [F8] (clamp closes).
K. Carefully slide the paper down using the right hand with the left hand
holding on to a pair of tweezers/wrench to support the against the
motion of paper until the opposite end is reached as shown in Figure 58.
Lint--free paper
Wet Portion
Clamp Jewel
Movable Left side
Tweezers/ wrench
Use left hand to hold
a tweezer/ Wrench
to support the
left jewel arm.
Clamp Jewel
Fixed Right side
Dry Portion
Wire Clamp Front Side
Right hand to hold
and pull the paper.
Fi Lint-free
5 8 Li t fpaper inserted
i
t d bbetween
t
th the
j
l
Figure 5-8
jewels
L. Insert a completely dry piece of lint–free paper between the clamp jewels and press [F8] (clamp closes).
M. Withdraw the paper between the closed jewels in one smooth motion.
Discard the paper.
N. Press [F9] (Clamp opens). Blow canned air over the clamp jewel.
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Section 5: Bond Head
O. Press [F8] several times to open and close the clamp. Verify that the
jewels do not stick.
P. Visually check between the clamp jewels for residue or paper fibers
and remove them as needed.
Q. Repeat procedure as required.
R. Install the glass tube block.
S. Fill in the machine wire clamp cleaning log.
5.4.2.7
Check Z Encoder Signal Amplitude/Clean Encoder Grating
Purpose
Check Z encoder signal amplitude. If not within specification, clean the
encoder grating to ensure accurate bond head position feedback to servo
system. If signal amplitude can still not be brought within specification, the
encoder assembly should be replaced (refer to paragraph 5.4.2.8).
Frequency
Every 3000 hours
Tools/ Materials/ Parts
•
Hex wrench set
•
Oscilloscope, 2–channel, with two (2) X10 probes
If cleaning the encoder grating is required, the following are also required:
•
Torque wrench, 35 in. lb. (4 Nm), 40 oz. in. (0.28 Nm)
•
Cotton swab
•
Methanol
•
Thread locking compound (Loctite 222 or equivalent)
•
0.75mm Miro Z-Encoder adjustment Shim (19033-6035-310)
•
Miro Y Spacer (08858-0901-002-xx)
Procedure
A. If the indexer heaters are on, perform the following steps to turn them
off. If heaters are already off, proceed to step B.
1. Using the mouse and [B1], select the CONFIGURE mode button (in
the mode bar of the GUI).
2. Move the cursor to the TEMPERATURE button, in the pop up window,
and press [B1].
3. Move the cursor to the ALL ZONES OFF button and press [B1].
4. Move the cursor to the DONE button and press [B1].
B. Check encoder output signal amplitude.
1. Press [MOTOR STOP] to place the machine in Standby mode.
2. Open the front door of the lower console.
3. Locate the Servo Preamp circuit board in the lower console card
rack assembly.
4. Connect a two–channel oscilloscope to the test points on the Servo
Preamp as follows. Each oscilloscope probe must have its own
ground lead attached.
•
Connect the channel one probe to the SIN3 test point, TP16.
•
Connect the channel two probe to the COS3 test point, TP15.
•
Connect the ground leads from channel one probe and channel
two probe to the Ground test point, TP1.
5. Turn on the oscilloscope and configure it to read a Lissajous voltage signal. Put the oscilloscope in RUN mode.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-15
Maxµm Ultra Ball Bonder
6. Rapidly move the bond head link up and down while observing the
oscilloscope screen. Verify that the voltage amplitude along both
the X and Y axes is between 1.425 to 1.65V peak–to–peak and the
mean (dc) value is 2.5 V. If not, clean the encoder grating as in step
C. If the encoder output is within specification, go to step G.
C. Clean Z encoder grating.
WARNING: CLASS II LASER HAZARD! THE BOND HEAD Z–AXIS ENCODER HAS
A CLASS II LASER THAT IS EMBEDDED AND NOT ACCESSIBLE TO
THE USER. WHILE THE ENCODER SENSOR HEAD IS MOUNTED ON
THE BOND HEAD, THE LASER IS NO DANGER TO THE USER OR
MAINTENANCE TECHNICIAN. HOWEVER, WHEN THE SENSOR HEAD
IS REMOVED AND MACHINE POWER IS ON, THE LASER LIGHT CAN
CAUSE EYE DAMAGE IF VIEWED DIRECTLY ON AXIS. ALWAYS
TURN OFF MACHINE POWER BEFORE REMOVING THE ENCODER
SENSOR HEAD FROM THE BOND HEAD.
WARNING: THE LINK AND FRONT Y SLIDE ARE MADE FROM A BERYLLIUM
ALLOY THAT IS A POTENTIAL CARCINOGEN. READ THE BERYLLIUM PRODUCT WARNING (PARAGRAPH 5.3.1 BEFORE PERFORMING ANY MAINTENANCE ON OR NEAR THESE ASSEMBLIES.
1. Verify that the machine is in Standby mode. Turn off machine
power.
2. Dismount the optics housing assembly (see Figure 4-8 for parts
location).
a. Disconnect the wire tensioner vacuum hose at the quick–disconnect fitting at the top–rear of the optics housing.
b. Disconnect the illuminator flex cable from connector J6 on the
bond head interconnect board at the right–rear of the optics
housing.
c. Remove four (4) screws and washers that secure the optics
housing to the front Y slide.
d. Lift the optics housing assembly away from the front Y slide and
move it to a position where it allows access to the Z axis
encoder read head. Do not disconnect the remote camera
heads from the camera control unit.
3. Remove two (2) screws and washers that secure the encoder read
head to the front Y slide (see Figure 5-9).
4. Remove the cable clamp that secures the encoder read head cable
to the top of the front Y slide.
CAUTION: Be very careful to avoid contact with the encoder grating when removing or mounting the encoder head. The glass grating can be easily
broken.
5. Move the read head forward, then upward, being careful not to contact the glass encoder grating nor stress the read head cable. Rest
the read head on the front Y slide.
CAUTION: Use only methanol to clean the grating. Do not use any other solvent.
Other solvents may remove the lines from the encoder grating.
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All Rights Reserved
Section 5: Bond Head
CAUTION: While cleaning, keep side force applied to the encoder grating to a
minimum. The glass grating can be easily broken.
6. Dampen a swab in methanol. Gently clean the encoder grating on
both sides by wiping in the direction of the grating. Allow the grating
to dry.
SHCS and Washer
(2 places)
Encoder
Read Head
SHCS
(4 places)
Encoder
Grating Assembly
Scribe Line
Front Y Slide
Figure 5-9 Clean Linear Encoder Grating/Replace Encoder Assembly
NOTE: Above figure illustrates Bond Head Assembly with a STANDARD wire
clamp assembly.
D. Return the encoder read head to its original location on the front Y
slide, making sure the grating enters the slot in the read head. Again,
be very careful to avoid contact between the read head and grating.
1. Slot in the 0.75mm shim between the glass scale and read head
towards the right hand side as shown in Figure 5-10.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-17
Maxµm Ultra Ball Bonder
0.75mm Shim
Slot it on the right
side of the glass scale
Figure 5-10 Inserting the 0.75mm Shim between the glass scale and the encoder
2. Place the Miro Y Spacer gage behind the read head to bench the
read head parallel to the Front Y machined surface as shown in
Figure 5-11. Bench the read head towards the rear side and left
side and slightly tighten the mounting screws. Ensure the 0.75mm
shim moves freely between the glass scale and read head.
Miro Y spacer
Place it behind the read
side of the glass scale
the front Y machines surface
Benching Directions
Figure 5-11 Inserting the Y spacer and benching the encoder to the rear and left hand
side
3. Apply thread locking compound to the two (2) screws that will
secure the read head to the front Y slide. Install the two (2) screws
with flat washers through the read head mounting holes into the
front Y slide. Snug down, but do not tighten the screws.
4. Install the cable clamp that secures the encoder read head cable to
the top of the front Y slide.
E. Check the read head for signal verification.
1. The oscilloscope probes should still be connected to the Servo
Preamp board. The oscilloscope should be configured to read a
Lissajous voltage signal. If not, perform steps B4. through B5.
2. Turn machine power on. When the Standby mode dialog box
appears, leave the machine in Standby mode (DO NOT select OK to
start initialization).
3. Move the Z-link rapidly up and down. At the same time, look at the
signal on the oscilloscope screen.
4. The voltage signal should read between 1.425 to 1.65V in both the X
and Y axes.
5. Tighten the mounting screws to 40 oz. in. (0.28 Nm).
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Section 5: Bond Head
6. Remove the shim and the spacer.
NOTE: If the read head voltage signal is not between 1.425 to 1.65V with a
mean (dc) value of 2.5 V, then loosen the encoder screws slightly. Move
to the left or right hand side along the x position of the encoder to fine
adjust the encoder. Check the signal again. If problem still persist, the
encoder assembly (encoder grating and read head) should be replaced.
Refer to paragraph 5.4.2.8
F. Mount the optics housing assembly on the front Y slide.
1. Place the optics housing at its mounting location on the front Y
slide. Verify that none of the wires or cables are trapped between
the optics housing and the front Y slide.
2. Apply thread locking compound to the four (4) screws that will
secure the optics housing to the front Y slide. Install the four (4)
screws and washers in the optics housing mounting holes. Do not
tighten.
3. Push the optics housing toward the rear of the machine so that it
benches against the front Y slide. Position the optics housing in the
X axis so that the housing does not interfere with the wire clamp
assembly.
4. Snug down, but do not fully tighten, all four (4) mounting screws.
The screws will be fully tightened later during the optics housing
alignment procedure.
5. Connect the illuminator flex cable to connector J6 on the bond head
interconnect board.
6. Connect the wire tensioner vacuum hose at the quick–disconnect
connector.
G. Return the machine to operating condition.
1. Disconnect the oscilloscope probes from the Servo Preamp board.
Close the lower console front door.
2. Select OK in the GUI display to start machine initialization. Verify
that initialization is successfully completed.
3. If the optics housing was dismounted to allow the encoder grating
to be cleaned, perform optics housing alignment. Refer to paragraph 4.4.2.2 in Section 4 for procedure. After alignment, perform
PRS calibration before operating the machine. Refer to Appendix A
for procedure.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-19
Maxµm Ultra Ball Bonder
5.4.2.8
Replace Z Encoder Read Head and Grating
Purpose
Replace the Z axis linear encoder read head and grating.
Tools/ Materials/ Parts
•
Torque wrench, 25 oz. in. (0.18 Nm), 40 oz. in. (0.28 Nm), 35 in. lb.
(4 Nm)
•
Hex drivers
•
Diagonal cutters
•
Oscilloscope, 2–channel, with two (2) X10 probes
•
Thread locking compound (Loctite 222 or equivalent)
•
Cable ties
•
Z Encoder Assembly, P/N 08021-0067-007-xx
•
0.75mm Miro Z-Encoder adjustment Shim (19033-6035-310)
•
Miro Y Spacer (08858-0901-002-xx)
Procedure
WARNING: CLASS II LASER HAZARD! THE BOND HEAD Z–AXIS ENCODER HAS
A CLASS II LASER THAT IS EMBEDDED AND NOT ACCESSIBLE TO
THE USER. WHILE THE ENCODER SENSOR HEAD IS MOUNTED ON
THE BOND HEAD, THE LASER IS NO DANGER TO THE USER OR
MAINTENANCE TECHNICIAN. HOWEVER, WHEN THE SENSOR HEAD
IS REMOVED AND MACHINE POWER IS ON, THE LASER LIGHT CAN
CAUSE EYE DAMAGE IF VIEWED DIRECTLY ON AXIS. ALWAYS
TURN OFF MACHINE POWER BEFORE REMOVING THE ENCODER
SENSOR HEAD FROM THE BOND HEAD.
WARNING: THE LINK AND FRONT Y SLIDE ARE MADE FROM A BERYLLIUM
ALLOY THAT IS A POTENTIAL CARCINOGEN. READ THE BERYLLIUM PRODUCT WARNING (PARAGRAPH 5.3.1) BEFORE PERFORMING ANY MAINTENANCE ON OR NEAR THESE ASSEMBLIES.
A. Press [MOTOR STOP]. Power down the machine.
B. Remove two (2) screws that secure the upper console rear cover. Stow
the cover in a safe place.
C. Dismount the optics housing assembly (see Figure 4-8 for parts location).
1. Disconnect the wire tensioner vacuum hose at the quick–disconnect fitting.
2. Disconnect the illuminator flex cable from connector J6 on the bond
head interconnect board. Do not disconnect the remote camera
head cables from the camera control unit.
3. Remove four (4) screws and washers that secure the optics housing to the front Y slide.
4. Lift the optics housing off of the front Y slide. Move the assembly to
a position that allows access to the Z encoder read head.
D. Trace the encoder read head cable to where it connects to the cable
labeled CBL_Z-ENCODER_EXT in the rear of the upper console. The
cable is secured by cable clamps, spiral wraps and cable ties. Make
note of the cable routing; the replacement encoder cable must be
routed identically.
E. Disconnect the encoder read head cable from the CBL_ZENCODER_EXT cable in the rear of the upper console.
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Section 5: Bond Head
F. Cut cable ties, unwrap spiral wraps and remove cable clamps to free
the encoder read head cable.
G. Remove the Z encoder (see Figure 5-9).
1. Remove two (2) screws and flat washers that secure the encoder
read head to the front Y slide. Remove the encoder read head.
2. Remove four (4) screws that secure the encoder grating to the top
of the bond head link. Remove the encoder.
H. Install the replacement encoder components.
CAUTION: Avoid touching the glass encoder scale. Fingerprints and oils from
skin will make the scale dirty and degrade encoder output. If it is
touched, clean the scale with methanol (refer to paragraph 5.4.2.7)
before installing it on the bond head link.
1. Remove the new encoder components from the shipping package
and verify that the serial numbers on the back of the encoder read
head and on the underside of the encoder grating support plate are
the same.
NOTE: The encoder grating support plate has a scribe line (see Figure 5-9).
When looking at the bond head from the front of the machine, the
encoder grating must be oriented so that the scribe line is towards the
right side of the bond head.
2. Apply thread locking compound to the four (4) screws that will
secure the encoder grating to the front Y slide. Install the four (4)
screws and attach the encoder grating to the bond head link. Do
not tighten the screws.
3. Center the encoder grating on the link and bench it forward against
the benching edge on the link. Tighten each of the four mounting
screws to 25 oz. in. (0.18 Nm).
CAUTION: Be very careful to avoid contact with the encoder grating when removing or mounting the encoder read head. The glass grating can be easily broken.
4. Apply thread locking compound to the two (2) screws that will
secure the encoder read head to the front Y slide. Loosely attach
the encoder read head to the front Y slide using two (2) screws and
flat washers. The cable from the read head exits towards the rear of
the machine.
5. Slot in the 0.75mm shim between the glass scale and read head
towards the right hand side as shown in Figure 5-12.
0.75mm Shim
Slot it on the right
side of the glass scale
Figure 5-12 Inserting the 0.75mm Shim between the glass scale and the encoder
6. Place the Miro Y Spacer gage behind the read head to bench the
read head parallel to the Front Y machined surface as shown in
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-21
Maxµm Ultra Ball Bonder
Figure 5-13. Bench the read head towards the rear and left side
and slightly tighten the mounting screws. Ensure the 0.75mm shim
moves freely between the glass scale and read head.
Miro Y spacer
Place it behind the read
side of the glass scale
the front Y machines surface
Benching Directions
Figure 5-13 Inserting the Y spacer and benching the encoder to the rear and left hand
side
7. Route the read head cable back through the machine as was noted
in step D. and connect it to the cable labeled CBL_ZENCODER_EXT. Secure the read head cable with the cable
clamps, spiral wraps and cable ties.
I. Check the read head for signal verification.
NOTE: An oscilloscope is to be used and configured to read a sine–cosine Lissajous signal. The encoder read head must be aligned to attain a Lissajous measurement of 1.425 to 1.65V with a mean dc value of 2.5 V.
1. Open the front door of the lower console.
2. Locate the Servo Preamp board in the lower console card rack.
3. Attach a two–channel oscilloscope to test points on the Servo
Preamp board as listed below. Each oscilloscope probe must have
its own ground lead attached.
•
Connect the channel one probe to the SIN3 test point, TP16.
•
Connect the channel two probe to the COS3 test point, TP15.
•
Connect the ground leads from channel one probe and channel
two probe to the Ground test point, TP1.
4. Turn machine power on. When the Standby mode dialog box
appears, leave the machine in Standby mode (DO NOT select OK to
start initialization).
5. Turn on the oscilloscope and configure it to read the Lissajous voltage signal. Put the oscilloscope in RUN mode.
6. Move the Z-link rapidly up and down. At the same time, look at the
signal on the oscilloscope screen.
7. The voltage signal should read between 1.425 to 1.65 with a mean
dc value of 2.5 V.
8. Tighten the mounting screws to 40 oz. in. (0.28 Nm).
9. Remove the shim and the spacer.
J. Install the optics housing and route the encoder cable.
1. Verify that the machine is in Standby mode. Power down the
machine.
2. Place the optics housing at its mounting location on the front Y
slide. Verify that none of the wires or cables are trapped between
the optics housing and the front Y slide.
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Section 5: Bond Head
3. Apply thread locking compound to the four (4) screws that will
secure the optics housing to the front Y slide. Install the four (4)
screws and washers in the optics housing mounting holes. Do not
tighten.
4. Push the optics housing toward the rear of the machine so that it
benches against the front Y slide. Position the optics housing in the
X axis so that the housing does not interfere with the wire clamp
assembly.
5. Snug down, but do not fully tighten, all four (4) mounting screws.
The screws will be fully tightened later during the optics housing
alignment procedure.
6. Connect the illuminator flex cable to connector J6 on the bond head
interconnect board.
7. Connect the wire tensioner vacuum hose at the quick–disconnect
connector.
8. Dress the encoder read head cable and link thermocouple wires
with the twist cable ties removed earlier in this procedure.
9. Bundle the cables at the rear of the machine with cable ties, similar
to their original bundling.
K. Return the machine to operating condition.
1. Disconnect the oscilloscope probes from the Servo Preamp board.
Close the lower console front door.
2. Install the upper console rear cover.
3. Turn on machine power.
4. Select OK in the GUI display to start machine initialization. Verify
that initialization is successfully completed.
5. Perform the optics housing alignment procedure. Refer to paragraph 4.4.2.2 in Section 4. After alignment, perform PRS calibration
before operating the machine. Refer to Appendix A for procedure.
5.4.2.9
Set Bond Head Height
Purpose
The bond head vertical position is fixed and not adjustable. Instead, the
workholder rails must be raised or lowered to the optimal height relative to
the heat block height for the carrier (leadframe, flat boat, etc.) that will be
processed. After any change is made to device thickness (one of the
Device Parameter settings in CONFIGURE Mode), or if a process program is loaded for a new device type, a display on the monitor will prompt
the user to adjust the height of the workholder rails.
Refer to Section 8 of Maxµm Ultra Volume 1: Operations for a detailed
explanation of the Adjust Rail Height procedure.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-23
Maxµm Ultra Ball Bonder
5.4.2.10
Remove and Install Bond Head
Purpose
Remove the bond head for maintenance. Install a replacement or serviced
bond head.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 25 oz. in. (0.18 Nm), 40 oz. in. (0.28 Nm), 8 in. lb.
(0.9 Nm), 9 in. lb. (1.02 Nm), 35 in. lb. (4 Nm)
•
Spring hook
•
Oscilloscope, 2–channel, with two (2) X10 probes
•
Thread locking compound (Loctite 222 or equivalent)
•
Bond Head Assembly, P/N 08088-0166-000-xx (if replacement is necessary)
Procedure
A. Press [MOTOR STOP] and turn off machine power. Remove the bonding
wire from the capillary.
WARNING: THE LINK AND FRONT Y SLIDE ARE MADE FROM A BERYLLIUM ALLOY
THAT IS A POTENTIAL CARCINOGEN. READ THE BERYLLIUM PRODUCT
WARNING (PARAGRAPH 5.3.1) BEFORE PERFORMING ANY MAINTENANCE
ON OR NEAR THESE ASSEMBLIES.
B. Dismount the optics housing assembly (see Figure 4-8 for parts location).
1. Disconnect the wire tensioner vacuum hose at the quick–disconnect fitting at the top of the optics housing.
2. Disconnect the illuminator flex cable from connector J6 on the bond
head interconnect board at the right–rear of the optics housing.
3. Remove two (2) screws and washers that secure the camera head
cables at the camera head bracket.
4. Remove four (4) screws and washers that secure the optics housing to the front Y slide.
5. Lift the optics housing off the front Y slide and carefully lay it on top
of the X motor to allow access to the bond head assembly.
C. Disconnect cables from the bond head assembly.
1. Disconnect the following cables from the bond head interconnect
board:
•
Wire clamp assembly (connector J12)
•
Ultrasonic transducer (connector J5)
•
Z link thermocouple (connector J10)
•
Z flex (connector J11)
2. Remove the cable clamp at the right–front of the front Y slide that
secures the cables to the slide.
3. Loosen the captive screw on the EFO arm that secures the EFO
high voltage cable spade lug terminal. Pull the terminal off.
4. At the left side of the front Y slide, loosen the screw that secures
the BITS return wire.
5. Remove two (2) screws with washers that secure the Z flex cable to
the top of the front Y slide.
D. Remove the EFO arm assembly.
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Section 5: Bond Head
1. Use a spring hook to disconnect the counterweight spring between
the EFO arm and link. Set the spring aside for later installation.
2. Remove two (2) screws that secure the EFO arm assembly to the
front Y slide (see Figure 5-14).
E. Dismount the Z encoder read head.
CAUTION: Be very careful to avoid contact with the encoder grating when removing or mounting the encoder head. The glass grating can be easily
broken
1. Remove two (2) screws and washers that secure the encoder read
head to the front Y slide.
2. Remove the cable clamp that secures the encoder read head cable
to the top of the front Y slide.
3. Move the read head forward, then upward, being careful not to contact the glass encoder grating nor stress the read head cable. Rest
the read head on the front Y slide.
F. If this bond head is to be reinstalled on the machine, go to step G. If a
different bond head will be installed, the Z encoder grating must be
removed for reuse on the replacement bond head. To remove the Z
encoder grating:
CAUTION: Avoid touching the glass encoder scale. Fingerprints and oils from
skin will make the scale dirty and degrade encoder output. If it is
touched, clean the scale with methanol (refer to paragraph 5.4.2.7)
before installing it on the bond head link.
1. Remove four (4) screws that secure the grating to the top of the
bond head link.
G. Remove the bond head assembly from the front Y slide.
1. While supporting the bond head, remove the four (4) screws that
secure the bond head to the front Y slide.
2. Move the bond head out of the front Y slide, taking care to avoid
damaging the flex cable.
H. Mount the bond head on the front Y slide and make electrical connections.
1. Carefully feed the Z flex cable through the opening in the front of
the front Y slide and position the bond head in place on the front Y
slide. Bench the bond head to the right against the machined surface on the front Y slide.
2. Install four (4) screws to secure the bond head on the front Y slide.
Torque the screws to 8 in. lb. (0.9 Nm).
3. Route the Z flex cable on the top of the front Y slide. Secure the
cable with two (2) screws and washers removed in step C5.
a. At the front–center on the top of the front Y slide, secure the Z
flex cable with an M2 x 4 mm screw and M2 flat washer. Torque
the screw to 25 oz. in. (0.18 Nm).
b. At the right side on the top of the front Y slide, secure the Z flex
cable with an M3 x 6 mm screw and M3 flat washer. Torque the
screw to 40 oz. in. (0.28 Nm).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-25
Maxµm Ultra Ball Bonder
I. If a different bond head is being installed, install the Z encoder grating
removed in step F., otherwise go to step J. To install the Z encoder
grating:
CAUTION: Avoid touching the glass encoder scale. Fingerprints and oils from
skin will make the scale dirty and degrade encoder output. If it is
touched, clean the scale with methanol (refer to paragraph 5.4.2.7)
before installing it on the bond head link.
NOTE: The encoder grating support plate has a scribe line (see Figure 5-9).
When looking at the bond head from the front of the machine, the
encoder grating must be oriented so that the scribe line is towards the
right side of the bond head.
1. Apply thread locking compound to the four (4) screws that will
secure the encoder grating to the front Y slide. Install the four (4)
screws and attach the encoder grating to the bond head link. Do
not tighten the screws.
2. Center the encoder grating on the link and bench it forward against
the benching edge on the link. Tighten each of the four mounting
screws to 25 oz. in. (0.18 Nm).
J. Set the bond head link upper and lower mechanical limits. Refer to
paragraph 5.4.2.13, steps D. through J.
K. Mount the Z encoder read head on the front Y slide. Refer to paragraph 5.4.2.7, step D.
L. Install the EFO arm assembly.
1. Position the EFO arm assembly at the left side of the front Y slide.
Install two (2) screws to secure the assembly to the front Y slide.
Torque the screws to 6 in. lb. (0.68 Nm).
2. Use a spring hook to connect the counterweight spring between the
EFO arm and link.
M. Connect the cables disconnected in step C1. through C4. Place cables
in cable clamps and secure the clamps.
N. Check the read head for signal verification. Refer to paragraph 5.4.2.7
steps E.
O. Mount the optics housing assembly on the front Y slide.
1. Place the optics housing at its mounting location on the front Y
slide. Verify that none of the wires or cables are trapped between
the optics housing and the front Y slide.
2. Apply thread locking compound to the four (4) screws that will
secure the optics housing to the front Y slide. Install the four (4)
screws and washers in the optics housing mounting holes. Do not
tighten.
3. Push the optics housing toward the rear of the machine so that it
benches against the front Y slide. Position the optics housing in the
X axis so that the housing does not interfere with the wire clamp
assembly.
4. Snug down, but do not fully tighten, all four (4) mounting screws.
The screws will be fully tightened later during the optics housing
alignment procedure.
5. Connect the illuminator flex cable to connector J6 on the bond head
interconnect board.
6. Connect the wire tensioner vacuum hose at the quick–disconnect
connector.
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Section 5: Bond Head
7. Install the two (2) screws and washers that secure the camera head
cables to the camera head bracket. Do not tighten the screws at
this stage yet, tighten the screws only when all the alignment and
calibration are done.
NOTE: Give allowance for full XY table travel.
P. Set bond head height (adjust rail height) for leadframe thickness. Refer
to paragraph 5.4.2.9
Q. Perform the optics housing alignment. Refer to paragraph 4.4.2.2.
R. Perform the following adjustment and calibrations:
1. Transducer alignment (refer to paragraph 5.4.2.14)
2. Servo tune (refer to Appendix A)
3. Clamp calibration and maximum clamp opening adjustment (refer
to Volume 3: MHS Manual, Section 2)
4. Bond force calibration (refer to Appendix A)
5. Wand position (refer to paragraph 5.5.2.1)
6. Wand height calibration (refer to Appendix A)
Mounting Screw and Washer
(2 places)
Z Encoder
Read Head
Mounting Screw
(2 places)
EFO Arm Assembly
Z Encoder
Glass Grating
Mounting Screw
(4 places)
Bond Head
Assembly
Mounting Screw
(4 places)
Front Y Slide
Figure 5-14 Remove and Install Bond Head
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-27
Maxµm Ultra Ball Bonder
5.4.2.11
Replace Bond Head Flexure Assembly
Purpose
Replace a defective bond head flexure assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 40 oz. in. (0.28 Nm), 8 in. lb. (0.90 Nm), 6 in. lb.
(0.68 Nm), 35 in. lb. (4 Nm)
•
Spring hook
•
Oscilloscope, 2–channel, with two (2) X10 probes
•
Thread locking compound (Loctite 222 or equivalent)
•
Flexure Assembly, P/N 08088-0165-000-xx
Procedure
WARNING: CLASS II LASER HAZARD! THE BOND HEAD Z–AXIS ENCODER HAS
A CLASS II LASER THAT IS EMBEDDED AND NOT ACCESSIBLE TO
THE USER. WHILE THE ENCODER SENSOR HEAD IS MOUNTED ON
THE BOND HEAD, THE LASER IS NO DANGER TO THE USER OR
MAINTENANCE TECHNICIAN. HOWEVER, WHEN THE SENSOR HEAD
IS REMOVED AND MACHINE POWER IS ON, THE LASER LIGHT CAN
CAUSE EYE DAMAGE IF VIEWED DIRECTLY ON AXIS. ALWAYS
TURN OFF MACHINE POWER BEFORE REMOVING THE ENCODER
SENSOR HEAD FROM THE BOND HEAD.
WARNING: THE LINK AND FRONT Y SLIDE ARE MADE FROM A BERYLLIUM
ALLOY THAT IS A POTENTIAL CARCINOGEN. READ THE BERYLLIUM PRODUCT WARNING (PARAGRAPH 5.3.1) BEFORE PERFORMING ANY MAINTENANCE ON OR NEAR THESE ASSEMBLIES.
A. Press [MOTOR STOP]. Turn off machine power.
B. Dismount the dual optics assembly.
1. Disconnect the illuminator flex cable from connector J6 on the bond
head interconnect board.
2. Disconnect the wire tensioner vacuum hose at the quick–disconnect fitting at the top–rear of the optics housing.
3. Remove two (2) screws and washers that secure the camera head
cables at the camera head bracket.
4. Remove four (4) screws and washers that secure the optics assembly to the front Y slide.
5. Carefully position the optics assembly away from the bond head
link.
CAUTION: Be very careful to avoid contact with the encoder grating when removing or mounting the encoder head. The glass grating can be easily
broken.
NOTE: It is helpful to place a cloth over the workholder and under the bond
head link before continuing the procedure. The cloth will catch any
screws and washers that may be accidently dropped.
NOTE: In the next step, the Z encoder read head will be removed to reduce the
risk of damage to the encoder glass grating later in the procedure when
the bond head link is not secured to the front Y slide.
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Section 5: Bond Head
C. Remove two (2) screws and washers that secure the Z encoder read
head to the front Y slide. Carefully set the Z encoder read head aside,
being careful not to contact the glass encoder grating.
D. Remove two (2) screws that secure the EFO arm to the front Y slide
and position it out of the way.
E. Remove the flexure assembly.
1. Use a spring hook to disconnect the counterweight spring between
the EFO arm and link. Set the spring aside for later installation.
2. Remove four (4) screws that secure the flexure assembly to the
front Y slide.
3. Fully loosen, but do not remove five (5) screws that secure the link
to the flexure assembly. Remove the flexure assembly.
F. Install the replacement flexure assembly.
1. Apply a small amount of Loctite 222 in the five (5) screw holes in
the upper bar of the flexure assembly. Wipe off any excess.
2. Carefully position the flexure assembly under the link and against
the front Y slide. Tighten the five (5) screws that were loosened in
step E3. and torque to 54 oz-in.
3. Apply a small amount of Loctite 222 in the threads of the four (4)
screws that secure the flexure assembly to the front Y slide.
4. Install the four (4) screws removed in step E2. to secure the flexure
assembly to the front Y slide. Torque the screws to 54 oz-in.
G. Apply a small amount of Loctite 222 in the threads of the two (2)
screws that secure the EFO arm to the front Y slide.
H. Position the EFO arm in place on the front Y slide. Bench the arm to
the left and rear. Install the two (2) screws removed in step D. to
secure the EFO arm to the front Y slide. Torque the screws to 9 in. lb.
(1.02 Nm).
I. Place the counterweight spring (removed in step E1.) into position and
attach it between the EFO arm and link.
J. Set the bond head link upper and lower mechanical limits. Refer to
paragraph 5.4.2.13, steps D. through J.
CAUTION: Be very careful to avoid contact with the encoder grating when removing or
mounting the encoder head. The glass grating can be easily broken.
K. Mount the Z encoder read head on the front Y slide. Refer to paragraph 5.4.2.7, step D.
L. Check the read head for signal verification. Refer to paragraph 5.4.2.7
steps E.
M. Install the dual optics assembly.
1. Place the optics housing at its mounting location on the front Y
slide. Verify that none of the wires or cables are trapped between
the optics housing and the front Y slide.
2. Apply thread locking compound to four (4) screws that will secure
the optics housing to the front Y slide. Install the four (4) screws
and washers in the optics housing mounting holes. Do not tighten.
3. Push the optics housing toward the rear of the machine so that it
benches against the front Y slide. Position the optics housing in the
X axis so that the housing does not interfere with the wire clamp
assembly.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
4. Snug down, but do not fully tighten, all four (4) mounting screws.
The screws will be fully tightened later during the optics housing
alignment procedure.
5. Connect the illuminator flex cable to connector J6 on the bond head
interconnect board.
6. Connect the wire tensioner vacuum hose at the quick–disconnect
connector.
7. Install the two (2) screws and washers that secure the camera head
cables to the camera head bracket. Do not tighten the screw yet.
Tighten only after all the alignment and calibration are completed.
NOTE: Give allowance for full XY travel.
8. Perform the optics housing alignment. Refer to paragraph 4.4.2.2.
N. Perform the following calibrations (refer to Appendix A for procedures):
1. X, Y, Z servo tune
2. Clamp calibration and maximum clamp opening adjustment (refer
to Volume 3: MHS Manual, Section 2)
3. Bond force
4. Crosshair offset
5. Transducer alignment (refer to paragraph 5.4.2.14)
5.4.2.12
Replace 24V ZTC Heater
Purpose
Replace a non–functional ZTC heater assembly
Tools/ Materials/ Parts
•
Hex wrench set
•
Swab
•
Isopropyl alcohol
•
ZTC Heater Assembly (24V), P/N 08088-0563-000-xx
Procedure
A. Press [MOTOR STOP] and turn off machine power. Remove the bonding
wire from the capillary.
B. Dismount the optics housing assembly (see Figure 4-8 for parts location).
1. Disconnect the wire tensioner vacuum hose at the quick–disconnect fitting at the top of the optics housing.
2. Disconnect the illuminator flex cable from connector J6 on the bond
head interconnect board at the right–rear of the optics housing.
3. Remove four (4) screws and washers that secure the optics housing to the front Y slide.
4. Remove two (2) screws and washers that secure the camera head
cables to the camera head bracket.
5. Lift the optics housing off the front Y slide and carefully lay it on top
of the X motor to allow access to the bond head assembly.
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Section 5: Bond Head
C. Remove the ZTC heater.
1. At the top of the Z motor assembly, disconnect the ZTC heater connector at the clamp plate (see Figure 5-15).
2. Remove one (1) screw that secures the ZTC heater to the top of the
Z motor assembly housing (see Figure 5-15. Remove the clamp
plate and ZTC heater.
D. Install the replacement ZTC heater.
1. Lightly moisten a swab with isopropyl alcohol.
2. Use the swab to clean the top surface of the Z motor assembly
where the replacement ZTC heater will be mounted.
3. Place the replacement ZTC heater and clamp plate in position on
top of the Z motor assembly.
4. Install one (1) screw to secure the ZTC heater to the top of the Z
motor assembly housing.
5. Connect the ZTC heater connector at the clamp plate.
E. Mount the optics housing assembly on the front Y slide.
1. Place the optics housing at its mounting location on the front Y
slide. Verify that none of the wires or cables are trapped between
the optics housing and the front Y slide.
2. Apply thread locking compound to the four (4) screws that will
secure the optics housing to the front Y slide. Install the four (4)
screws and washers in the optics housing mounting holes. Do not
tighten.
3. Push the optics housing toward the rear of the machine so that it
benches against the front Y slide. Position the optics housing in the
X axis so that the housing does not interfere with the wire clamp
assembly.
4. Snug down, but do not fully tighten, all four (4) mounting screws.
The screws will be fully tightened later during the optics housing
alignment procedure.
5. Connect the illuminator flex cable to connector J6 on the bond head
interconnect board.
6. Connect the wire tensioner vacuum hose at the quick–disconnect
connector.
7. Install the two (2) screws and washers that secure the camera head
cables to the camera head bracket. Do not tighten the screws at
this stage yet, tighten the screws only after the alignment is done.
NOTE: Give allowance for full XY table travel.
F. Perform the optics housing alignment. Refer to paragraph 4.4.2.2.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
ZTC Heater Connector
Figure 5-15 Replace 24V ZTC Heater, P/N 08088-0563-000-xx
5.4.2.13
Adjust Upper and Lower Mechanical Limits
NOTE: Bond head mechanical limits should be adjusted only if the bond head or
bond head flexure assembly is removed/replaced.
Purpose
Set positions of mechanical stops that limit bond head link motion at the
top and bottom of its travel. The upper limit stop also sets the Z–axis reference position during machine initialization.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 35 in. lb. (3.95 Nm)
•
Shim, 10–mil (0.25 mm)
•
Thread locking compound (Loctite 222 or equivalent)
•
Safety Solvent
Procedure
A. Press [MOTOR STOP] and turn off machine power. Remove bonding
wire from the capillary.
B. Dismount the optics housing assembly (see Figure 4-8 for parts location).
1. Disconnect the wire tensioner vacuum hose at the quick–disconnect fitting at the top of the optics housing.
2. Disconnect the illuminator flex cable from connector J6 on the bond
head interconnect board at the right–rear of the optics housing.
3. Remove two (2) screws and washers that secure the camera head
cables to the camera head bracket.
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Section 5: Bond Head
4. Remove four (4) screws and washers that secure the optics housing to the front Y slide. Lift the optics housing off the front Y slide
and carefully lay it on top of the X motor to allow access to the bond
head assembly.
C. Dismount the Z encoder read head.
CAUTION: Be very careful to avoid contact with the encoder grating when removing or mounting the encoder head. The glass grating can be easily
broken.
1. Remove two (2) screws and washers that secure the encoder read
head to the front Y slide (see Figure 5-9).
2. Remove the cable clamp that secures the encoder read head cable
to the top of the front Y slide.
3. Move the read head forward, then upward, being careful not to contact the glass encoder grating nor stress the read head cable. Rest
the read head on the front Y slide.
D. Back out both limit set screws two or three full turns (see Figure 5-16).
Use safety solvent to clean thread locking compound from the set
screws. Apply a small amount of thread locking compound to the
threads of both set screws.
E. Loosen four (4) screws and washers that secure the Z motor housing
assembly to the front Y slide. The screws should be loose enough to
allow positioning of the Z motor housing assembly.
F. Insert a 10–mil (0.25 mm) shim on each side of the motor coil, between
the coil and magnets inside the Z motor housing.
G. Set the bond head upper mechanical limit.
1. Pivot the bond head link upward at the front (motor coil will move
downward). Hold the bond head link in this position.
2. Turn the upper limit set screw clockwise until it just makes contact
with the link. Turn the screw an additional one–eighth (1/8) of a turn
until it drives the link down slightly against your holding force to
confirm that the screw is acting as the stop.
H. Set the bond head lower mechanical limit.
1. Pivot the bond head link downward at the front (motor coil will move
upward). Hold the bond head link in this position.
2. Turn the lower limit set screw clockwise in one–eighth (1/8) turn
increments until it just makes contact with the link. Turn the screw
an additional one–eighth (1/8) of a turn until it drives the link up
slightly against your holding force to confirm that the screw is acting
as the stop.
I. Verify that the Z motor housing assembly is properly seated in the front
Y slide and the shims are in place to provide an equal air gap on both
sides of the motor coil.
J. Torque four (4) Z motor housing mounting screws and washers to
35 in. lb. (3.95 Nm). Remove the shims. Torque the screws to 14 in.Ibs
(1.58Nm)
K. Mount the Z encoder read head on the front Y slide.
1. Return the encoder read head to its original location on the front Y
slide, making sure the grating enters the slot in the read head.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
2. Apply thread locking compound to two (2) screws that will secure
the read head to the front Y slide. Install the two (2) screws with flat
washers through the read head mounting holes into the front Y
slide. Snug down, but do not tighten the screws.
3. Install the cable clamp that secures the encoder read head cable to
the top of the front Y slide.
L. Mount the Z encoder read head on the front Y slide. Refer to paragraph 5.4.2.7, step D.
M. Check the read head for signal verification. Refer to paragraph 5.4.2.7
steps E.
N. Mount the optics housing assembly on the front Y slide.
1. Place the optics housing at its mounting location on the front Y
slide. Verify that none of the wires or cables are trapped between
the optics housing and the front Y slide.
2. Apply thread locking compound to the four (4) screws that will
secure the optics housing to the front Y slide. Install the four (4)
screws and washers in the optics housing mounting holes. Do not
tighten.
3. Push the optics housing toward the rear of the machine to benching
it against the front Y slide. Position the optics housing in the X axis
so the housing does not interfere with the wire clamp assembly.
Snug down, but do not fully tighten, all four (4) mounting screws.
The screws will be fully tightened later during the optics housing
alignment procedure.
4. Connect the illuminator flex cable to connector J6 on the bond head
interconnect board. Connect the wire tensioner vacuum hose at the
quick–disconnect connector.
5. Secure the camera head cables to the camera head bracket with
two (2) original screws and washers. Do not tighten the screws at
this stage yet, tighten the screws only when the alignment is done.
NOTE: Leave allowance for full XY table travel.
O. Perform the optics housing alignment. Refer to paragraph Leave allowance for full XY table travel.
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Section 5: Bond Head
Upper Limit Set Screw
View A
Lower Limit Set Screw
View B
Figure 5-16 Set Bond Head Upper and Lower Mechanical Limits
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-35
Maxµm Ultra Ball Bonder
5.4.2.14
Align Transducer
Purpose
This mechanical calibration assures that the capillary is perpendicular to
the work surface during bonding.
Frequency
Every 3000 hours or as conditions indicate.
Tools/ Materials/ Parts
•
Hand tools
•
Torque driver, 35 oz. in. (0.25 Nm)
•
MJT Shoulder Screw, P/N 08828-0901-007-xx
•
Perpendicularity Set–Up Gauge, P/N 08088-0901-014-xx
•
Bond Force Calibration Weight Assembly, P/N 08858-0901-020-xx
•
Shim, 2–mil (0.05 mm), metal
Procedure
A. Click on CALIBRATION at the mode bar. The Calibration menu appears.
B. Press [3]. The Bond Head menu appears.
C. Press [3]. The ‘Z Axis Adjustments’ menu appears (see Figure 5-17).
D. Select [1] TRANSDUCER ALIGNMENT from the menu. The instruction
dialog box for Step 1 appears (see Figure 5-17).
E. Select [1] START from the ‘Step 1’ dialog box. This causes all material
to be ejected from the workholder. The puller and indexer are moved to
their parked position. Wait until all motions have stopped before continuing with the next step.
Figure 5-17 Transducer Alignment: Step 1 Instruction
WARNING: HEATED SURFACES MAY EXIST DURING NEXT STEP! DO NOT
TOUCH THE CLAMP INSERT WITH UNPROTECTED HANDS. WHEN
REMOVING OR MOUNTING THE CLAMP INSERT, INSTALL TWO
SCREWS IN THE INSERT AND GRASP THE SCREWS WITH PLIERS.
THERE ARE TWO M4 TAPPED HOLES IN THE CLAMP INSERT FOR
THIS PURPOSE.
F. Remove the clamp insert.
G. Install the heat block insert. The heat block insert cavity must be small
enough so that the 4 feet of the perpendicularity gauge straddle the
heat block insert cavity.
H. Select [2] CONTINUE from the ‘Step 1’ dialog box. The bond head is
centered above the heat block insert. Then, the heat block insert is
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Section 5: Bond Head
brought to its last calibrated bond plane position. The ‘Step 2’ dialog
box appears (see Figure 5-18).
Figure 5-18 Transducer Alignment: Step 2 Instruction
I. Remove the EFO wand by loosening the Z-axis lock screw that
secures the wand to the bond head. Remove the EFO wand and set
aside. Carefully chess the bond head so that the transducer is positioned over the center of the heat block insert.
J. Select [2] CONTINUE from the ‘Step 2’ dialog box. This causes ‘force’ to
be removed from the Z axis servo. heat block insert chessing is also
enabled. The ‘Step 3’ dialog box appears (see Figure 5-20).
Figure 5-19 Transducer Alignment: Step 3 Instructions
K. Remove the capillary from the transducer.
WARNING: THE Z AXIS IS DISABLED. WHEN USING X/Y CHESSING, ENSURE
THAT THE BOND HEAD DOES NOT COME IN CONTACT WITH
WORKHOLDER COMPONENTS.
L. Adjust side-to-side perpendicularity:
1. Install the perpendicularity gauge on the heat block insert. Orientate the gauge so that the two touch pads (A and B) are positioned
as shown in Figure 5-20. Ensure that the gauge is centered over
the cavity and that the feet on the gauge do not fall into the cavity
but are all seated on the heat block insert surface. For ease of positioning, the up/down arrow keys on the MMI can be used to raise or
lower the heat block insert.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
Transducer
A
B
Perpendicularity
Gauge
Heat Block
Figure 5-20 Gauge Placement (Top View)
CAUTION: To prevent dropping the transducer mounting hardware into the
workholder during the next step, move the bond head to a front, center position or install a drop cloth over the workholder.
2. Remove the mounting screw from the right side of the transducer.
Install the shoulder screw (supplied with gauge) and tighten 1 to 2
turns.
NOTE: If the transducer mounting tabs are touching the mounting screws at the
end of the alignment, there could be a negative effect on the performance of the ultrasonics. The shoulder screw centers the left mounting
tab of the transducer. This prevents the transducer from resting against
the mounting screws when the alignment is complete.
3. Loosen the right transducer mounting screw 1/4 turn ensuring that
the transducer is now free to move. Tighten the shoulder screw
until it seats, then back it off 1/4 turn. Ensure that the transducer is
free to rotate around the shoulder screw.
4. Carefully chess the bond head to the center position of the heat
block insert. Align the bottom surface of the transducer mounting
tabs over the perpendicularity gauge on the heat block insert.
Adjust the position so that when the transducer is pressed down,
the transducer mounting tabs rest on the two touch pads of the perpendicularity gauge as shown in Figure 5-21.
Perpendicularity
Gauge
A
B
Heat Block
Transducer
Figure 5-21 Gauge Positioning, Side-to-Side Perpendicularity (Top View)
NOTE: At this point, ensure that the bond head link is not resting on the perpendicularity gauge. Center the gauge so that all of its feet are on the heat
block insert surface. Ensure that the transducer mounting tabs are centered and resting on the two touch pads of the gauge.
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Section 5: Bond Head
5. Hold the transducer flat on the gauge. Use a metric ball driver or
the tip of a screwdriver to apply light pressure to the top side of the
transducer mounting tabs. Tighten the transducer mounting screws
lightly (alternately) and ensure that the transducer mounting tabs
remain flat on the gauge.
NOTE: During this calibration, the Z Axis position display, located at the top right
corner of the monitor screen, will not display engineering units. The display will represent actual Z Axis encoder pulses. This display should be
referred to when the user is instructed to record the ‘Z encoder value’ (Zcount).
6. Carefully lift the bond head and place a flat, 2 mil (.05 mm) shim
between the left transducer mounting tab and the touch pad of the
perpendicularity gauge. Be careful not to position the shim beyond
the mounting tab and under the bond head link. This can bias and
affect the reading. Allow the weight of the bond head to rest on the
shim. Do not press down on the gauge.
7. Record the Z encoder value (Z-count) for the left side.
8. Carefully lift the bond head and place a flat, 2 mil (.05 mm) shim
between the right transducer mounting tab and the touch pad of the
perpendicularity gauge. Be careful not to position the shim beyond
the mounting tab and under the bond head link. This can bias and
affect the reading. Allow the weight of the bond head to rest on the
shim. Do not press down on the gauge.
9. Record the Z encoder value (Z-count) for the right side.
10.Carefully lift up the bond head, place a flat, 2 mil shim between the
right transducer mounting tab and the touch pad of the perpendicularity fixture, generally let bond head site down.
11. Record the Z encoder value as displayed on the monitor for the
right side.
12.Calculate the difference between the two sides. This difference
should be 0 +/-40 counts (0 +/-1mil). If the difference is greater than
+/-40, redo the set-up. If the highest count is on the right side,
rotate the transducer CCW, if the highest count is on the left side,
rotate the transducer CW.
13.Record the new Z-count values and calculate the difference by
repeating the steps above.
14.When the difference is within 0 +/-40, torque right mounting screw
to 35 in-oz (0.25Nm). Remove the shoulder screw and replace it
with the original mounting screw. Re-check the difference to verify
that transducer did not move. Torque left mounting screw to 35 inoz (0.25Nm). If results are in tolerance, continue. If not, repeat
above steps until results are within tolerance.
15.Select [1] CONTINUE from the ‘Step 3’ dialog box. The ‘Step 4’ dialog
box appears (see Figure 5-22).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
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Maxµm Ultra Ball Bonder
Figure 5-22 Transducer Alignment: Step 4 Instructions
WARNING: THE Z AXIS IS DISABLED. WHEN USING X/Y CHESSING, ENSURE
THAT THE BOND HEAD DOES NOT COME IN CONTACT WITH
WORKHOLDER COMPONENTS.
M. Adjust front-to-back perpendicularity:
1. Install the perpendicularity gauge on the heat block insert so that
touch pads ‘A’ and ‘B’ are perpendicular to the rails (see Figure 523).
Transducer
Perpendicularity
Gauge
A
B
Heat Block
Figure 5-23 Gauge Positioning, Front to Back Perpendicularity (Top View)
2. Position the bond head so that the bottom, flat surface of the transducer, i.e., the area between the capillary mounting hole and the
crystals, rest on pads A and B of the perpendicularity gauge.
Ensure that the feet on the gauge do not fall into the heat block
insert cavity but are all seated on the heat block insert surface.
Ensure that the rear touch pad of the gauge is not touching the
transducer crystals.
3. Carefully lift the bond head and place a 2 mil (.05 mm) shim
between the transducer and the rear touch pad of the perpendicularity gauge, ensuring that all four feet of the gauge are touching
the heat block insert surface. Allow the weight of the bond head to
rest on the shim. Do not press down on the gauge.
4. Chess the heat block insert up or down until the shim can be
removed with just a slight friction opposing its movement. Record
the rear Z encoder value (Z-count).
5. Carefully lift the bond head and place a 2 mil (.05 mm) shim
between the transducer and the front touch pad of the perpendicularity gauge, ensuring that all four feet of the gauge are touching
the heat block insert surface. Allow the weight of the bond head to
rest on the shim. Do not press down on the gauge.
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Section 5: Bond Head
6. Chess the heat block insert up or down until the shim can be
removed with just a slight friction opposing its movement. Record
the front Z encoder value (Z-count).
NOTE: As a final test, repeat the procedure for the front and back, ensuring that
there is a slight friction when removing the shim from between the front
and back pads on the gauge and the transducer. Record the Z-count
values each time.
7. Calculate the difference between the two positions. This difference
should be 0 +/-40 counts (0 +/-1mil). If the difference is greater than
+/-40, adjust the height of the bond head by chess heat block up/
down.
8. When the heat block insert is within specification with the bond
head, select [1] CONTINUE from the ‘Step 4’ dialog box. This causes
the software to disable heat block insert chessing and sets the
bond plane Z servo reference (zeros it) to the current Z encoder
position. This value is stored by the software for future reference.
The ‘Step 5’ dialog box appears (see Figure 5-24).
Figure 5-24 Transducer Alignment: Step 5 Instructions
N. Remove the perpendicularity gauge. Install the capillary, EFO wand
and clamp insert, then select [1] CONTINUE. The Z servo is enabled and
the bond head is raised to a safety position. This completes the calibration sequence.
O. Perform the following adjustments/calibrations:
•
Rail height
•
Clamp
•
EFO height
•
Crosshair offset
•
Bond force
•
Z Encoder Map
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-41
Maxµm Ultra Ball Bonder
5.4.2.15
Replacing the Contact Force Sensor Assembly
Purpose
Remove and replace the contact force sensor assembly if necessary.
Tools/ Materials/ Parts
•
Hex wrench Set
•
Torque driver, 16 oz. in. (0.11 Nm)
•
Torque driver, 35 oz. in. (0.25 Nm)
•
Piezo Sensor Assembly, P/N 08858-0065-000-xx
J7 of Piezo Logic Board
P-Clamps
See Detail A
2X M1.6X4mm
Transducer
Piezo
Sensor Assy
2X M1.6X8mm
with Wax
Detail A
Figure 5-25 Removing the Contact Force Sensor Assembly
Procedure
The Piezoelectric sensor assembly is a field replaceable unit (FRU). It is
essential that the piezoelectric sensor be installed on the machine so that
the centerline of the mounting holes line up as closely to the axes of the
screws as possible. This ensures maximum signal sensitivity and minimum variation. This centering will be achieved by installing the sensor
assembly onto precisely located pins on the mounting surface.
A. Chess bond head to the front right corner.
B. Press [MOTOR STOP]. TURN OFF MACHINE POWER. WAIT AT LEAST FIVE (5) MINUTES BEFORE
PROCEEDING.
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Section 5: Bond Head
C. Remove wire from capillary.
D. Remove the capillary.
E. Remove the Contact Force Sensor Assembly.
1. Remove the two [2] x M1.6 x 8mm capscrew securing the transducer and the contact force sensor assembly (see Figure 5-25).
Take care not to drop the screws onto the workholder.
2. Unplug connector J7 from the Piezo Logic Board (08002-4040-000xx) and release the cable by removing the P-clamps.
3. Remove the two S.H.C.S. [2] x M1.6 x 4mm securing the piezo sensor to the link and remove the piezo sensor assembly.
F. Install the new Contact Force Sensor Assembly.
1. Plug connector to J7 of the Piezo Logic Board (08002-4040-000-xx)
and secure cabling by tightening the p-clamp to location.
2. Place the contact force sensor assembly into the pin holes to bench
the assembly. Tighten the piezo sensor using the two S.H.C.S. [2]x
M1.6 x 4mm while holding on to the assembly in position. Torque
the screws to 16 oz.in. (0.11Nm).
3. Insert the transducer over the piezo sensor and tighten the two [2] x
M1.6 x8mm capscrew. Torque the screws to 35 oz.in (0.25Nm).
Ensure that the screw threads are not in contact with the hole edge
of the transducer.
4. Turn on machine.
G. Refer to section 5.4.2.14 to align the transducer.
H. Perform bond force calibration.
5.4.2.16
Replace Wire Clamp
Purpose
Remove and replace a non–functional wire clamp assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 40 oz. in. (0.28 Nm)
•
Wire Clamp Assembly, P/N 08088-01w373-000-xx
•
Lower Wire Clamp Assembly, P/N 08099-0073-000-xx
Procedure
WARNING: THE BOND HEAD LINK IS MADE FROM A BERYLLIUM ALLOY THAT
IS A POTENTIAL CARCINOGEN, READ THE BERYLLIUM PRODUCT
WARNING (TECHNICAL MANUAL VOLUME 2: MAINTENANCE, PARAGRAPH 5.3.1) BEFORE PERFORMING ANY WORK ON OR NEAR THE
BOND HEAD LINK.
A. Press [MOTOR STOP]. Turn off machine power. Wait at least five (5)
minutes before proceeding.
B. Remove two (2) screws and their associated washers that secure the
wire clamp assembly to the front of the bond head link (see Figure 526). To aid re–assembly, note the arrangement of washers at each
screw.
C. Mount the replacement wire clamp assembly on the bond head.
1. Position the wire clamp assembly at the front of the bond head link.
2. Pass the upper screw first through a flat washer, followed by a
nylon shoulder bushing then a non-ANSI washer, and the ring terminal of the BITS wire cable and into the bond head link. Snug, but
do not tighten the screw.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-43
Maxµm Ultra Ball Bonder
3. Pass the lower screw first through a flat washer, followed by a nylon
shoulder bushing, then a non–ANSI flat washer and into the bond
head link. Snug, but do not tighten the screw.
4. Adjust the wire clamp lateral position screw until the wire path is
centered in the wire clamp.
5. Tighten the two (2) clamp mounting screws to 40 oz. in. (0.28 Nm).
D. Turn on machine power. After 30 minutes, check/adjust clamp gap
(refer to paragraph 5.4.2.4).
Clamp Mounting Screw
(2 places)
Feed Tube Assembly
Mounting Screw
Feed Tube Assembly
Wire Clamp Assembly
Clamp Lateral Position
Adjustment Screw
Lower Wire Clamp
Assembly
2x Mounting Screws
for Lower Wire Clamp
Clamp Assembly
Clamp Lateral Position
Adjustment Screw
Figure 5-26 Replace Wire Clamp Assembly
NOTE: Above figure illustrates Bond Head Assembly with a STANDARD wire
clamp assembly.
5-44
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 5: Bond Head
5.4.2.17
Clean and Inspect Wire Feed Tube
Purpose
Remove and clean the glass feed tube mounted on the wire clamp
assembly. Inspect the feed tube and replace it if necessary.
Frequency
Every wire spool change or after 1000 feet (303 meters) of wire usage.
Tools/ Materials/ Parts
•
Hex wrench set
•
Tweezers
•
Ultrasonic cleaner with alcohol
•
Low–pressure compressed air
•
Feed Tube & Block Assembly, P/N 08099-0174-000-xx (if replacement
is required)
Procedure
A. Press [MOTOR STOP]. TURN OFF MACHINE POWER.
B. Remove wire from capillary.
C. Carefully remove glass feed tube and block assembly from the wire
clamp assembly.
1. Loosen the screw that secures the feed tube assembly to the top of
the clamp bracket assembly (see Figure 5-26).
2. Grasp the feed tube bracket with tweezers. Lift the feed tube
assembly up, then pull it to the right, away from the clamp assembly.
D. Place the feed tube assembly in an alcohol cleaning bath. Place the
cleaning bath container in an ultrasonic cleaner. Clean the feed tube
assembly until dirt and contaminants are removed.
E. Dry the feed tube using clean, low–pressure compressed air.
F. Inspect to make sure the glass feed tube is not damaged or cracked.
Replace the feed tube assembly if the feed tube is not in good condition.
G. Using tweezers, install the feed tube assembly on the clamp bracket of
the wire clamp assembly. Make sure that the flat washer on the screw
is above the bracket.
H. Bench the feed tube bracket back and to the left. Tighten the screw to
secure the feed tube.
I. Turn on machine power and initialize the machine. Thread bonding
wire through the capillary.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-45
Maxµm Ultra Ball Bonder
5.5
Electronic Flame Off
5.5.1
Description
5.5.1.1
System Components
The purpose of the electronic flame off (EFO) is to form a ball on the tail of
wire left below the capillary after a second bond is made. The ball is
formed by an electrical discharge between the EFO wand and wire, which
melts the gold wire tail. Surface tension pulls the molten gold into a round
ball, which then rapidly solidifies.
Components of the EFO are the EFO wand mounted on the bond head
assembly, the electronics (EFO box - See Figure 5-27 for location) that
create the high–voltage potential between the EFO wand and bonding
wire, the high–voltage cable that connects the EFO box to the wand, and
other cables that carry input power and control signals to the EFO box.
5.5.1.2
EFO Box Assembly, P/N 08002-1120-000-16
WARNING: ELECTRICAL SHOCK HAZARD! UP TO 4500 VOLTS DC IS
PRESENT WITHIN THE EFO BOX WHEN THE EFO FIRES. DO
NOT OPEN THE EFO BOX. THERE ARE NO USER–SERVICEABLE COMPONENTS INSIDE THE EFO BOX.
The EFO box consists of a printed circuit board assembly, P/N 080014169-000-xx, inside a metal enclosure. Test points and LED indicators are
mounted within openings in the enclosure faceplate. Connectors for
power input, data and control input/output, and high–voltage output are
located on the right–side and rear faces of the EFO box. See Figure 5-27
for the location of the EFO box and detail drawings showing the test
points. indicators, and connectors. Table 5-3 describes the EFO box
assembly.
Table 5-3 EFO Box Assembly, P/N 08002-1120-000-xx
Functions
Indicators
Power LED
- Lit when +48 V power supply is on.
Disable LED
- Lights when enable (ENB)
signal from host is off (low).
Fault LED
Current: 4-64 mA(Ultra)
- Lights when EFOFAULT
Current: 4-128 mA(Elite)
signal to host is active.
Time: 256 µs-32 ms
Detects short (wire touch- Short LED
ing EFO wand) and open - Lights if a short condition is
detected during the EFO fir(no tail at capillary tip)
conditions at EFO wand. ing sequence.
Open LED
- Lights if an open condition
is detected during the EFO
firing sequence.
Data LED
- Lights when EFODATA signal to host is active.
Creates the high voltage
pulse and sustaining voltage for ball formation.
Current and time are digitally programmable:
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All Rights Reserved
Test Points
Reference
GND
Figure 5-27
- Power Ground
PWM
- PWM signal from EFO
controller.
I (current)
- EFO output current
(scaled). 5V at test point
(TP) = 128 mA.
V (voltage)
- EFO output voltage
(scaled). 1 V at TP = 1 kV
output.
Test Points
DATA
OPEN
FAULT
SHORT
POWER
DISABLE
I (5V=128mA)
V (1V=1KV)
DC GND
PWM
DC GND
Section 5: Bond Head
LEDs
EFO Box Front View
J3 - EFO High Voltage
Output Connector
J6
Power Input
Connector
J2
Data I/O
Connector
EFO Box Rear View
Figure 5-27 EFO Box Location and Box Detail Drawings
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-47
Maxµm Ultra Ball Bonder
5.5.2
EFO Maintenance Procedures
5.5.2.1
Adjust EFO Wand Position
Purpose
This adjustment provides the user with a precise setup procedure that
ensures the proper gap between the EFO wand tip and the capillary.
Adjusting the EFO wand position is just an initial setting; the wand is
adjusted to its final height during EFO wand height calibration.
Tools/ Materials/ Parts
•
Hex wrench set
•
Plastic Shim, 4 mils (0.1 mm)
•
Shim, 5 Mils (0.12 mm)
•
Torque wrench, 20 oz. in. (0.14 Nm) with 1.5mm Hex driver
Procedure
A. Adjust EFO wand X and Y Axes so that the gap between the EFO
wand tip and the outer edge of the capillary facing the tip is not more
than 5 mils.
1. Loosen the X-axis lock screw and Y-axis lock screw (see Figure 528).
2. Rotate the X-axis adjustment screw to move the EFO wand along
the X direction. Clockwise screw rotation moves the EFO wand
towards the right direction while anit-clickwise screw rotation moves
the EFO wand towards the left direction.
3. Rotate the Y-axis adjustment screw to move the EFO wand along
the Y direction. Clockwise screw rotation moves the EFO wand
towards the rear and anti-clockwise screw rotation moves the EFO
wand towards the front.
4. Check the gap by inserting a 4 mils plastic shim between the EFO
wand tip and capillary. Make sure the gap is not more tha 5 mils.
5. Tighten the X and Y axes lock screws by half a turn. Do not over
tighten.
EFO Arm
Benching
Edge
EFO Wand
Clamp block
X-Axis
Lock
Screw
Z-Axis
Adjustment
& Lock Screw
X-Axis
Adjustment
Screw
EFO Wand
Top View
Y-Axis Lock Screw
Y-Axis Adjustment Screw
Z-Axis Adjustment & Lock Screw
EFO Wand
Figure 5-28 Adjust EFO Wand X and Y Axes
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Section 5: Bond Head
B. Adjust EFO wand Z axis.
WARNING: OPENING THE WORKHOLDER CLAMP IN THE FOLLOWING STEPS
CAUSES THE BOND HEAD TO MOVE TO ITS HOME POSITION. KEEP
HANDS CLEAR OF THE BOND HEAD AREA DURING THIS OPERATION.
1. Open and home the workholder clamp by performing the following:
2. Select W/H OPER from the upper function bar. The ‘Workholder Utilities’ dialog box appears.
3. Select [6] CLAMP from the ‘Workholder Utilities’ dialog box. The
‘Clamp’ dialog box appears.
4. Select [1] OPEN from the ‘Clamp’ dialog box. The clamp opens and
the bond head automatically moves to its home position.
5. Select [3] HOME from the ‘Clamp’ dialog box. The clamp moves to
its home position which is at a higher point than its open position.
1. Slowly chess the Bond Head all the way to its extreme forward
position. If there is an interference between the workholder clamp
and the EFO Wand, loosen the Z-axis adjustment and lock screw
and adjust the EFO wand up slightly to avoid the interference (see
Figure 5-28 for location).
2. Chess the bond head so that the EFO wand is positioned over the
flat surface of the workholder clamp, at the right side of the clamp
window (see Figure 5-29).
EFO Wand
Shim
Clamp
Figure 5-29 Adjust EFO Wand Position
3. Insert a 5–mil (0.12 mm) shim between the EFO wand and the
clamp surface. Loosen the Z–axis adjustment and lock screw and
lower the EFO wand until it sits on the shim.
4. Bench the EFO wand clamp unit against the EFO arm (see Figure
5-28 Top View)
5. Tighten the Z-axis lock screw to 20 oz. in. (0.14 Nm). Do not over
tighten.
C. Perform the EFO Wand Height calibration to ensure that the capillary
tip is just above the EFO wand tip (refer to Appendix A for calibration
procedure). When performing the calibration, the acceptable range for
the EFO wand height is 260 to 280 mils (6.60 to 7.11 mm) with 270
mils (6.86 mm) being the ideal value. This is the distance measured
from the surface of the heat block to the center of the EFO wand tip.
Perform the Crosshair Offset calibration (refer to Appendix A for calibration procedure).
D. Perform test bonding and verify that the EFO is operating normally.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-49
Maxµm Ultra Ball Bonder
5.5.2.2
Adjust MEFO Wand Theta and Y Position (Optional)
Purpose
This adjustment provides the user with a precise setup procedure that
ensures the proper gap between the MEFO wand tip and the capillary.
Adjusting the MEFO wand position is just an initial setting; the wand is
adjusted to its final height during MEFO wand height calibration.
Tools/ Materials/ Parts
•
Hex wrench set
•
Shim, 3–mil (0.07 mm), 4–mil (0.1 mm), plastic, 5–mil (0.12 mm), 10–
mil (0.25 mm)
•
Torque wrench, 40 oz. in. (0.28 Nm)
Procedure
WARNING: OPENING THE WORKHOLDER CLAMP IN THE FOLLOWING STEPS
CAUSES THE BOND HEAD TO MOVE TO ITS HOME POSITION. KEEP
HANDS CLEAR OF THE BOND HEAD AREA DURING THIS OPERATION.
A. Open and home the workholder clamp by performing the following:
1. Select W/H OPER from the upper function bar. The ‘Workholder Utilities’ dialog box appears.
2. Select [6] CLAMP from the ‘Workholder Utilities’ dialog box. The
‘Clamp’ dialog box appears.
3. Select [1] OPEN from the ‘Clamp’ dialog box. The clamp opens and
the bond head automatically moves to its home position.
4. Select [3] HOME from the ‘Clamp’ dialog box. The clamp moves to
its home position which is at a higher point than its open position.
B. Slowly chess the bond head all the way to its extreme forward position.
Y–Axis
Lock
Screw
Z–Axis
Lock Screw
MEFO
Electrode
Y–Axis
Adjustment Nut
Theta
Adjustment
Screw
Figure 5-30 Adjust MEFO Wand Theta and Y Axes
C. Adjust MEFO wand Theta, Y and Z Axes
1. For MEFO Z adjustment, refer to Section 5.5.2.1, Step C..
CAUTION: Use 25 oz. in. to tighten the Z-axis lock screw and theta adjustment
screw. Do not over-tighten the screws.
2. Loosen the Theta Adjustment Screw so that it can rotate freely.
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Section 5: Bond Head
3. Rotate the theta adjustment nut until the wand entirely clears the
transducer when the wand is held against the left hard stop.
4. Tighten the Theta Adjustment Screw.
5. Verify that the wand tip is at the right of the capillary tip when the
wand is pushed against its right hard stop.
6. Loosen the Y-Axis Lock Screw, and rotate the Y-Axis adjustment
nut using the MEFO adjustment wrench (P/N 08088-0168-016-xx)
until the tip of the wand is aligned with the tip of the capillary during
the arc motion of the wand.
7. Tighten the Y-Axis lock screw.
NOTE: Refer to Maxµm Ultra Volume 1: Operations, Section 4.5.2 for teaching
of clear and under position.
5.5.2.3
Clean EFO Wand
Purpose
To remove any dirt and contaminants on the EFO wand that can impede
EFO discharge.
Frequency
Every 200 hours, or as conditions require.
Tools/ Materials/ Parts
•
Swab
•
Isopropyl alcohol
Procedure
A. Press [MOTOR STOP].
B. Manual raise bond head link so capillary is above EFO wand tip.
C. Lightly moisten swab with alcohol.
D. Gently wipe tip of EFO wand clean of dirt, gold, etc.
E. Gently lower the bond head link.
5.5.2.4
Replace EFO Wand
Purpose
Remove and replace EFO wand assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
Electrode Assembly, P/N 08020-0515-000-xx
Procedure
A. Press [MOTOR STOP]. Turn off machine power. Wait five (5) minutes
before touching the EFO wand.
B. Loosen the Z–axis lock screw (see 5.). Remove the EFO wand assembly.
C. Mount the replacement EFO wand assembly, making sure it is
between the benching edges of the wand assembly mount. Tighten the
Z–axis lock screw only enough to hold the assembly in place.
D. Raise the wand so that its top surface is level with the capillary tip,
then snug down the Z–axis lock screw.
E. Adjust EFO wand position (refer to paragraph 5.5.2.1). Perform EFO
Wand Height Calibration (refer to Appendix A).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-51
Maxµm Ultra Ball Bonder
5.5.2.5
Replace EFO Box Assembly
Purpose
Remove and replace a defective EFO box assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
EFO Box Assembly, Fine Pitch, P/N 08002-1120-000-xx
CAUTION: ELECTRICAL SHOCK HAZARD! UP TO 4500 VOLTS DC IS
PRESENT WITHIN THE EFO BOX WHEN THE EFO FIRES. DO
NOT OPEN THE EFO BOX. THERE ARE NO USER-SERVICEABLE COMPONENTS INSIDE THE EFO BOX.
Procedure
A. Press [MOTOR STOP]. Turn off machine power. Wait five (5) minutes
before continuing with the procedure.
B. Remove two (2) screws that secure the left side of the EFO box to the
upper console chassis.
C. At the right side of the EFO box, loosen the screw that secures the
EFO box to the bracket (part of the upper console).
D. Move the left side of the EFO box up, move the box to the right, then
carefully lower the EFO box.
E. Disconnect the following cables from the EFO box (see Figure 5-27):
•
EFO High–Voltage Cable from connector J3 (right side of box)
•
Power cable from connector J6 (rear panel of box)
•
Data cable from connector J2 (rear panel of box)
F. Remove the EFO box from the machine.
G. Hold the replacement EFO box close to its mounting location in the
upper console. The EFO test point and indicator lamps should be
toward the front of the machine. The high–voltage cable connector (J3)
should be to the right.
H. Connect cables to the EFO box.
•
EFO High–Voltage Cable to J3 (right side of box)
•
Power cable to J6 (rear panel of box)
•
Data cable to J2 (rear panel of box)
I. Place the left edge of the box above the lip at the left side of the upper
console chassis. Align the two (2) mounting holes with the tapped
holes in the EFO box.
J. Place the right side of the EFO box above the bracket. A mounting
hole in the bracket should line up with a tapped hole in the box. Install
a screw to secure the bracket to the box.
K. Install two (2) screws to secure the EFO box to the left side of the
upper console chassis.
L. Turn on machine power and initialize the machine. Perform test bonding and verify that the EFO is working properly.
5-52
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 5: Bond Head
5.6
Wire Clamp Driver
5.6.1
Description
The wire clamp opens and closes by means of an electrical signal applied
to the plate actuator assembly of the clamp. Figure 5-31 shows a cross–
section of plate actuator. Note that 300 Volts maximum is applied across
the lower (outer) portion of the clamp, while the upper (inner) portion of
the clamp is held at 0 volts. The center section is modulated between a
low voltage (clamp open) and high voltage (clamp closed).
A driver board mounted in the lower console card rack creates the clamp
drive signal. This board is described in paragraph 5.6.2 and its location is
shown in Figure 5-33. A block diagram of the driver circuit is provided in
Figure 5-32.
The plate actuator assembly has been placed inside the bond head link as
shown in Figure 5-5 and has been insulated with a conformal coating to
prevent electrical shocks through contact. The coating can, however, be
accidentally pierced by small tools. Use extreme caution when working
around the clamp assembly or performing clamp maintenance, particularly when adjusting wire clamp gap.
0 Volts
Brass
Shim
300 Volts
0 to 300 Volts
(0 Volts opens clamp
300 Volts closes clamp)
Figure 5-31 Wire Clamp Operation
WARNING: TIPS OF SMALL TOOLS (HEX WRENCHES, SCREWDRIVERS, ETC.)
CAN PIERCE THE CONFORMAL COATING ON THE PLATE ACTUATOR
AND CREATE AN ELECTRICAL SHOCK HAZARD. BE VERY CAREFUL
WHEN USING TOOLS NEAR THE WIRE CLAMPS.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-53
Maxµm Ultra Ball Bonder
5.6.2
Wire Clamp Driver Board, P/N 08002-4165-000-xx
Major functions of the wire clamp driver circuit board assembly are
described in Table 5-4. The table also defines controls and indicators visible through the board assembly face plate. See Figure 5-33 for location of
the wire clamp driver in the card rack.
Table 5-4 Wire Clamp Driver Board
Functions
Controls
RESET Switch (SW1)
Creates and switches the
Resets the fault detec300 Vdc that opens and
closes the clamp assembly. tion circuit.
Protection circuit compares
300 Vdc power supply output to reference. Fault signal
is issued if output varies
from nominal.
Protection circuit also provides for overcurrent fault on
the driver output.
Indicators
Reference
Figure 5-32,
ENB/FLT LED (DS1)
Lights red if FAULT sig- Figure 5-33
nal is asserted.
Lights green if the clamp
driver is on.
NOTE: The test points visible through the board face plate are not defined.
WC OPEN
300V DC
WIRE
CLAMP
300V AMPLIFIER
12 V AUX
300V POWER
SUPPLY
WC FAULT
PROTECTION
CIRCUIT
REF V
FAULT LIGHT
WC FAULT
+12 V AUX
(POWER–ON
RESET)
Figure 5-32 Wire Clamp Driver Board, P/N 08002-4165-000-xx, Block Diagram
Wire feed components are mounted on the upper console assembly and
on the optics housing assembly. Refer to Section 3 of this manual for
more information concerning the wire feed and BITS.
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All Rights Reserved
Section 5: Bond Head
Card Rack
Assembly
Power
On/ Off Switch
1
Upper Deck
(6U Boards)
3
5
4
2
9
7
10
8
6
System
Computer
Lower Deck
(3U Boards)
2
Wire Clamp Driver
08002–4165–000–xx
Slot #1
1
4
3
6
5
7
8
11
9 10 12
CIRCUIT BOARD LAYOUT
TP1
TP2
TP3
TP4
TP5
TP6
Test
Points
DS1
Backplane
Connector
SW1
Figure 5-33 Wire Clamp Driver Board, P/N 08002-4165-000, Location and Major Components
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-55
Maxµm Ultra Ball Bonder
5.7
Ultrasonic Generator and Transducer
5.7.1
5.7.1.1
Description
System Components
Ultrasonic vibrations coupled through the capillary (along with force and
heat) promote formation of a bond between bonding wire and a substrate
material (bond pad on die or a device lead). The system that creates and
applies the ultrasonic energy has three components:
•
Programmable Ultrasonic Generator Circuit Board (Figure 5-34)
The ultrasonic generator (USG) board creates an electrical signal at
ultrasonic frequency. Programmable functions include operating mode
(constant voltage, constant current, or constant power) and amplitude
profile. The board can also automatically tune its output to the resonant frequency of the ultrasonic system (transducer, cabling, etc.) The
USG circuit board is mounted in the top row of the card rack within the
lower console.
•
Ultrasonic Transducer
The transducer converts the electrical signal from the USG board into
mechanical vibrations. These vibrations are coupled to the capillary
which is mounted in a clamp at the front of the transducer. The bond
head link holds the transducer, moving it vertically to place the capillary
in contact with the work. The Maxµm Ultra uses the Ultra T transducer
which is made of Titanium.
•
Cabling
The signal from the USG board is carried by the CBL_USG_COAX
cable (P/N 08858-2020-000-xx) from the front of the USG card to the
bond head interconnect board assembly (P/N 08002-4193-000-xx)
connector J13. The transducer assembly connects to J4 of the interconnect board.
5.7.1.2
Ultrasonic Generator (USG) Board, P/N 08001-4302-000-xx
Table 5-5 describes the major functions of the Ultrasonic Generator circuit
board assembly, P/N 08001-4302-000-xx. The table also defines test
points. There are no controls or indicators on the Ultrasonic Generator
board.
Table 5-5 Ultrasonic Generator Board
Functions
Controls/Indicators
Supplies high–power ultrasonic None
energy to the ultrasonic transducer in the bond head.
Programmable functions
include output frequency (up to
200 kHz), amplitude profile, and
operating mode: Constant
Power, Constant Voltage, or
Constant Current.
Software calibration tunes output to the resonant frequency
and impedance of the ultrasonic system.
Operates independently of
CPU1. Starts when a signal is
received from CPU1, follows
the programmed profile, then
interrupts CPU1 when done.
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Test Points
Reference
TP1 Vref -COMMAND Figure 5-34,
TP2 AMP_IN
Figure 5-35
TP3 USGOUT+
TP4 PLL_FILTER
TP5 I_SENSE
TP6 I_ENV
TP7 IRES
TP8 MWD_ENV
TP9 PHASE_XOR
TP10 VMECONTACT
TP11 V_ENV
TP12 Analog GND
Section 5: Bond Head
Figure 5-34 USG Board, P/N 08001-4302-000-xx, Location and Major Components
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-57
Maxµm Ultra Ball Bonder
Ultrasonic Generator Board
Card Rack
Host Assembly
VME Bus
CPU
Shared
Memory
Register
VME
Interface
1
3
5
4
2
Upper Deck
(6U Boards)
9
7
Power
On/ Off Switch
10
8
6
System
Computer
DSP
Range
ADC
Tune
Voltage
Lower Deck
(3U Boards)
Current
2
1
4
3
6
5
7
8
11
9 10 12
Phase
Lock Loop
DAC
Ref. Profile
Scale
USG Board
08001–4302–000–xx
Slot #4
Error
AMP
Current
Frequency
Generator
Scale
Attentuator
Current
Envelope
Detection
J3
Voltage and
Current Phase
Detector
TP12
TP1
Voltage
Envelope
Detection
Amp
P1
Modulator
Power
Amplifier
Feedback
Feedback
USGOUT
J2
Alternate
Power Input
J4
High Side
Current Sense
Kill Switch P2
Output
Transducer
Figure 5-35 Ultrasonic Generator, Block Diagram
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Ultrasonic Energy
Section 5: Bond Head
5.7.2
Replace USG Circuit Board
Purpose
Replace a non–functional ultrasonic generator circuit board assembly.
Tools/ Materials/ Parts
•
ESD–protective equipment/materials
•
USG Circuit Board Assembly, P/N 08001-4302-000-xx
Procedure
CAUTION: Obey all established ESD procedures when handling or storing circuit
board assemblies.
CAUTION: Make sure machine power is off before removing any circuit board
from the card rack.
A. Press [MOTOR STOP]. Turn off machine power.
B. Open the front door of the lower console.
C. Remove circuit board assembly from card rack.
1. Open the card cage door by loosening the 2x Captive screws.
2. Locate the USG board in the card rack (see Figure 5-34). If necessary, disconnect cables at connectors on the edge of the circuit
board assembly
3. Using each hand to hold on to the card puller on the top and bottom
edges of the card, eject the card by pulling out the card puller.
4. Immediately place the circuit board assembly in an ESD–protective
enclosure.
D. Install the replacement ultrasonic generator assembly in the card rack.
1. Slide the circuit board into its slot in the card rack until the connector/s seats in mating connector/s on the backplane board.
2. Press firmly on the top and bottom of the assembly, with equal
pressure until the board connector/s fully seat in the backplane
connector/s. Do not press against connectors, switches, or indicators on the board edge.
3. Make any cable connections if necessary and re-attach the card
cage cover and tighten the captive screws. Close the lower console
front door.
E. Turn on machine power. Initialize the machine and verify that the
machine operates normally.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-59
Maxµm Ultra Ball Bonder
5.7.3
Replace Transducer
Purpose
Replace ultrasonic transducer assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 35 oz. in. (0.25 Nm)
•
Tweezers
•
Transducer Assembly, P/N 08858-0086-000-xx
Procedure
A. Press [MOTOR STOP]. Turn off machine power.
WARNING: THE BOND HEAD LINK IS MADE FROM A BERYLLIUM ALLOY THAT
IS A POTENTIAL CARCINOGEN. READ THE BERYLLIUM PRODUCT
WARNING (PARAGRAPH 5.3.1) BEFORE PERFORMING ANY MAINTENANCE ON OR NEAR THE BOND HEAD LINK.
Bond Head Assembly
Mounting Tab
(1 each side)
Mounting Screw
(2 places)
MOAT Transducer
Figure 5-36 Replace Transducer
B. Remove the ultrasonic transducer from the bond head link.
1. Loosen the capillary clamp. Use tweezers to remove the capillary
from the capillary clamp.
2. Disconnect the transducer from connector J5 on the bond head
interconnect board assembly.
3. The transducer cable is routed along the right side of the bond
head link and front Y slide and is secured by four (4) cable clamps.
Remove the cable clamps. Note the routing of the cable to aid
installation of the replacement transducer.
4. While supporting the transducer body, remove the two (2) screws in
the transducer mounting tabs that secure the transducer to the
bond head link. Remove the transducer from the link.
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Section 5: Bond Head
C. Install the replacement transducer.
1. Place the transducer at its mounting position on the bond head link.
2. Install two (2) screws removed in step B4. through the transducer
mounting tabs into tapped holes in the front face of the bond head
link. Snug down, but do not tighten the two screws. They will be
properly torqued in step E.
3. Install the four (4) cable clamps and route the transducer cable as
noted in step B3..
4. Connect the transducer to connector J5 on the bond head interconnect board assembly.
5. Install the capillary (refer to paragraph 5.4.2.1).
D. Turn on machine power. Initialize the machine.
E. Adjust the transducer so the capillary is perpendicular to the work surface. Refer to paragraph 5.4.2.14.
F. Perform the following checks/adjustments:
1. Perform USG calibration (free air) (refer to Appendix A).
2. Perform crosshair offset calibration (refer to Appendix A).
3. Check EFO electrode position. Adjust if necessary (refer to paragraph 5.5.2.1). Perform EFO wand height calibration (refer to
Appendix A).
4. Check wire clamp alignment with capillary. Adjust clamp position if
necessary (refer to paragraph 5.4.2.3).
5. Perform MHS Clamp calibration (refer to Appendix A).
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-61
Maxµm Ultra Ball Bonder
5.8
Bond Head Control System
5.8.1
System Organization
Bond head Z–axis motion is controlled by a servo system that has five
major components, indicated in the block diagram in Figure 5-37. Motion
commands in digital form are passed from CPU1 to CPU2 (Servo CPU)
via the VMEbus. CPU2 interprets the commands and creates an analog
motor drive signal, which is then passed to the servo preamp assembly.
The servo preamp passes it in turn to the servo amplifier, which puts current through the motor to drive the link.
After a motion is begun, bond head link position feedback is returned to
CPU2 from a linear encoder mounted on the bond head. Position feedback modifies the drive signal by means of a servo algorithm to control the
vertical motion of the link.
Bond force is applied by the Z motor driving the link downward after the
capillary makes contact with the work. The amount of force exerted is proportional to the current in the motor circuit, which is monitored by the
CPU2.
In addition, a piezo sensor (piezo flex board 8001-4262-000) mounted
between the transducer and link generates a force signal, which is routed
to the piezo logic board (8002-4040-000). The piezo logic board processes and amplifies the signal, where it travels to the front of the servo
preamp via a coaxial cable. The piezo logic board needs timing information from the servo CPU. This information is send via
CBL_PIEZO_POWER (8858-2001-000) to the piezo logic board.
Host
Processor
(CPU 1)
Motion
Command
Motor Drive
VMEbus
Power
Amp
Servo
CPU
(CPU 2)
Servo
Preamp
Motor
Current
Current Feedback
Force
Signal
Force Feedback
Bond Head
(DC Motor,
Link, Clamp,
Transducer)
Piezo
Logic
Board
Encoder Count
Encoder
Interpolator
Piezo Out
Timing Information
Encoder
Encoder Signal
Figure 5-37 Z–Axis Servo System, Block Diagram
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Section 5: Bond Head
5.8.2
Control System Circuit Boards
The servo system is implemented on three printed circuit boards. The
location of the boards is shown in Figure 5-38 and detailed information on
each board follows.
Servo CPU (CPU2) Board
P/N 08002–4238–000–xx
Slot #5
Servo Preamp Board
P/N 08002–4344–000–xx
Slot #6
Card Rack
Assembly
Power
On/ Off Switch
1
3
5
2
Upper Deck
(6U Boards)
9
7
4
10
8
6
System
Computer
2
Lower Deck
(3U Boards)
4
1
3
6
5
11
9 10 12
8
7
UPPER DECK BOARDS
SOLENIOD DRIVER (08002–4020–000–xx)
1
2
3
4
5
6
7
8
9
10 11 12
DUAL HS (08001–4200–000–xx)
X–Y AMP (08002–4105–000–xx)
10
DUAL HS (08001–4166–000–xx)
X–Y AMP (08002–4105–000–xx)
9
Z AMP (08001–4145–000–xx)
8
DUAL HS (08001–4166–000–xx)
TEMP I/O (08002–4192–000–xx)
7
DUAL HS (08001–4166–000–xx)
STEPPER/SENSOR (08001–4176–000–xx)
6
DUAL HS (08001–4166–000–xx)
SERVO PREAMP (08002–4344–000–xx)
5
MS AMP (08089–4000–000–xx)
SERVO CPU (08002–4238–000–xx)
4
DUAL HS (08001–4200–000–xx)
USG (08001–4302–000–xx)
3
CLAMP DRIVER (08002–4165–000–XX)
ILLUMINATOR (08001–4246–000–xx)
2
MEFO (OPTIONAL) (08002–4005–000–xx)
VME BRIDGE (08001–4325–000–xx)
1
SPARE
SPARE
Z Amplifier Board
P/N 08001–4145–000–xx
Slot #7
LOWER DECK BOARDS
Figure 5-38 Z Axis Servo System Circuit Board Locations
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
5.8.2.1
Servo CPU (CPU2) Board, P/N 08002-4238-000-xx
Table 5-6 describes the functions of the Servo CPU (CPU2) circuit board
assembly, P/N 08002-4238-000-xx. This assembly consists of a single
surface–mount printed circuit board installed at the location shown in Figure 5-38.
Table 5-6 Servo CPU (CPU2) Board
Functions
Independent processing
system for control of
servo axes (X, Y, Z and
optional MEFO). Designated CPU2 in machine
control system.
Monitors position of X,
Y, Z axes and optional
MEFO.
Interprets motion
requests from the host
processor.
Generates Z motor
drive signal based upon
motion requests, current bond head link
position, and application of motion algorithms.
Servo gains can be
tuned starting from
default or user–entered
values in CALIBRATION mode.
5-64
Controls/Indicators
RESET (S1)
Push–Button Switch
CPU2 Reset switch
CR1 Indicator
RUN - Indicator is
green to indicate that
program cross-load is
completed.
FAIL - Indicator is red
to indicate cross-load
failed or watchdog
timed out.
W1 Jumper
Watchdog Timer (controlled by 5MHz clock)
W2 Jumper
Watchdog Timer (controlled by software)
S2 DIP Switch
Used to set the VME
address space.
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Test Points
References
TP1 X AXIS DAC
TP2 T AXIS DAC
TP3 Y AXIS DAC
TP4 Z AXIS DAC
TP5 Z FORCE DAC
TP6 Spare DAC
TP7 MEFO DAC
TP8 Spare DAC
TP9 Periodic Timer
TP10 Test DAC #1
TP11 Test DAC #2
TP12 Digital GND
TP13 Digital GND
TP14 TP15 Digital S/w programmable
TP16 Digital S/w programmable
TP17 Digital S/w programmable
TP18 Analog GND
TP19 Analog GND
TP20 Digital GND
TP21 Digital GND
TP22 TP23 TP24 TP25 -
Figure 5-38,
Figure 5-39
Maxµm Ultra Electrical Documents
Section 5: Bond Head
P1
Emulator Port, J1
TP21
TP20
TP17
TP1
TP19
TP18
Reset, S1
W2
W1
Run/ Fail, CR1
P2
TP25
TP24
TP23
TP22
Piezo Control, J3
Figure 5-39 Servo CPU (CPU2) Board, P/N 08002-4238-000-xx, Major Components
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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5-65
Maxµm Ultra Ball Bonder
5.8.2.2
Servo Preamplifier Board, P/N 08002-4344-000-xx
Major functions of the Servo Preamplifier circuit board assembly are
described in Table 5-7. The table also defines test points. There are no
controls or indicators on the preamplifier board. See Figure 5-38 for the
Servo Preamplifier board location in the card rack assembly. Also, refer to
Section 6 of this volume for Servo Preamplifier functions in the X and Y
axes servo systems.
Table 5-7 Servo Preamp Board
Functions
Controls/Indicators
Filters current feedbacks for the X, Y and
Z axes.
Contact detection circuitry detects surface
contact.
Also used in the Z
servo axis to provide:
• an interface between
CPU2 and the Z axis
power amplifier.
• electrical damping of
the Z Prime axis resonances.
Test Points
TP1 Digital GND
TP2 TP3 Connector J4 - connects TP4 XCUR1/ Z force
via coaxial cable to front TP5 YCUR1/ MEFO
TP6 ERRY *see note
of movable EFO Wand
TP7 ERRX *see note
board, where it carries
TP8 YSIN2
the hall effect signal.
TP9 YCOS2
TP10 FFT
TP11 ZCUR1
TP12 XSIN1
TP13 XCOS1
TP14 ZCUR2
TP15 COS3
TP16 SIN3
TP17 ERRZ *see note
TP18 Digital GND
For MEFO Optional Kit
only
Reference
5.8.2.3,
Figure 5-38
Maxµm Ultra Electrical Documents
NOTE: ERRY/ ERRX/ ERRZ means Or’ed quadrature and interpolation faults. It
is useful in determining faults in the encoder.
TP18
P1
TP1
J2
J3
P2
J4
Figure 5-40 XY Servo Preamplifier Board, P/N 08002-4344-000-xx, Major Components
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Section 5: Bond Head
5.8.2.3
Z Amplifier Board, P/N 08001-4145-000-xx
Major functions of the Z Amplifier circuit board assembly are described in
Table 5-8. See Figure 5-38 for the Z Amplifier board location in the card
rack assembly.
Table 5-8 Z Amplifier Board
Functions
Controls/Indicators
TP1 + PREAMP IN
TP2 - PREAMP IN
TP3 Z ENB
TP4 DIFFERENTIAL
PREAMP IN
TP5 MOTOR CURRENT
TP6 PGND
TP7 VME GND
Reference
Figure 5-41,
Figure 5-38
Maxµm Ultra Electrical Documents
TP1
TP7
TP6
TP5
TP4
TP3
TP2
Amplifies current com- None
mand from servo
preamp to drive the Z
linear servo motor.
Test Points
Figure 5-41 Z Amplifier Board, P/N 08001-4145-000-xx, Major Components
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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5-67
Maxµm Ultra Ball Bonder
5.8.3
5.8.3.1
System Electrical Connections
Cable List
Bond head control system cable assemblies are detailed in Figure 5-42.
Figure 5-42 Bond Head Control Cabling Diagram
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 5: Bond Head
5.8.3.2
Bond Head Interconnect Board Assembly
The bond head interconnect board assembly provides electrical connections between devices mounted on or near the bond head (transducer,
bond site illuminator, Z motor, wire clamp) and cables from the lower console control electronics. Board conductors route signals from the cables to
the connector of the appropriate device. The assembly consists of a single
printed circuit board. The board is attached to the right side of the front Y
slide.
Figure 5-43 shows the location of the board. Figure 5-42 details the connections at the bond head interconnect board. The connectors on the
board are identified in Figure 5-44.
The interconnect board needs no preventive maintenance. The only maintenance that may be required is replacement of a defective interconnect
board assembly (refer to the procedure in paragraph 5.8.3.3).
Bond Head
Interconnect Board
(Attached to Front
Y Slide)
Front Y Slide
XY Table Base
Figure 5-43 Location of the Bond Head Interconnect Board Assembly
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-69
Maxµm Ultra Ball Bonder
5.8.3.3
Replace Bond Head Interconnect Board
Purpose
Replace a defective bond head interconnect board assembly
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 8 in. lb. (0.9 Nm)
•
Bond Head Interconnect Board Assembly, P/N 08002-4193-000-xx
Procedure
A. Turn off machine power.
B. Remove the output magazine handler side panel to gain easy access
to the right side of the XY table area.
1. At the right–rear of the machine, remove four (4) screws that
secure the output motor/PCB cover.
2. At the output magazine handler, remove five (5) screws that secure
the side panel to the magazine handler side wall and upper console.
3. Move the panel toward the rear of the machine, then remove it from
the machine.
C. Disconnect all cables and bond head devices from connectors on the
bond head interconnect board assembly.
D. Remove three (3) screws that secure the bond head interconnect
board to the front Y slide.
E. Position the replacement bond head interconnect board on the front Y
slide. Install three (3) screws to secure the board to the front Y slide.
Torque the screws to 8 in. lb. (0.9 Nm).
F. Connect cables and bond head devices removed in step C. to the
bond head interconnect board connectors. Refer to Figure 5-42 and
Figure 5-44 to identify connectors.
Screw Hole
(3 places)
Figure 5-44 Replace Bond Head Interconnect Board Assembly
G. Install the output magazine handler side panel.
1. From the rear of the output magazine handler, position the side
panel between the Z axis tower and upper console.
2. Move the panel until the mounting holes in the panel are aligned
with tapped holes in the upper console and magazine handler side
plate and install five (5) screws to secure the panel.
3. Position the output motor/PCB cover on the machine and install
four (4) screws.
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Section 5: Bond Head
H. Power up and initialize the machine.
1. Verify that the machine completes initialization successfully.
2. Perform test bonding and verify operation of bond head Z motor,
ultrasonics transducer, EFO, and BITS. Make sure all bond site illuminator LEDs are on.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
5-71
Maxµm Ultra Ball Bonder
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
6
XY Table
6.1
About This Chapter
Here’s what you will find in this section:
•
Section 6.2, Overview, describes the various components within and
mounted on the XY Table assembly and its control system. It contains
basic component information and location of each component in the
XY Table Assembly.
•
Section 6.3, Preventive Maintenance, lists the activities required to
maintain the XY table assembly. It explains how to replace, adjust and
do preventive maintenance on each component.
•
Section 6.4, XY Table Control System, describes the functional aspect
of the control system. It also explains how to replace and adjust each
component of the control system.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-1
Maxµm Ultra Ball Bonder
6.2
Overview
The XY table moves the bond head and optics assemblies horizontally to
position the tool and optics over the work. Its major components are
shown in Figure 6-1.
The XY table is composed of the following components:
•
Table Mechanism
The table mechanism consists of a cast iron base casting with X axis
slide, front Y axis slide, rear Y axis slide, rear Y coupling bearing, and
two linear servo motors. The X slide (right/left motion) and Y slides
(front/back motion) are pushed or pulled along their respective tracks
by individual linear servo motors. The rear Y coupling bearing transfers
Y axis motion from the motor–driven rear Y slide to the front Y slide
and decouples X motion from the rear Y slide. The X slide and front Y
slide use caged roller bearings to provide the sliding motion. The rear
Y slide is supported by linear carriage bearings. Each axis has an integral linear encoder assembly that returns axis position feedback to the
servo control system.
Table motion is limited by software. These limits are based upon the
positions at the extremes of motion in each axis, which are located
during machine initialization. These mechanical limit stops will stop
table motion if a machine error allows the table to be driven past a software limit.
The XY table motors are linear–motion dc voice–coil motors. Compressed air is supplied to air knife assemblies mounted on the motor
coils to cool the motors as they operate. Each motor has a temperature sensor that activates if motor temperature rises above the maximum operating temperature, causing the control system to report an
error condition and shut down machine operation.
•
Servo Controls
Servo controls are the printed circuit board (PCB) assemblies for computer control of linear voice–coil servo motors, and their associated
cabling. The PCBs, housed in the card rack within the lower console
assembly, include:
•
Servo CPU (CPU2)
•
Servo Preamplifier
•
Two (2) Servo Amplifiers
Cabling in the system includes motor cables (one per axis of motion),
encoder cables (one per axis), and a motor temperature sensor cable.
The encoder cables are connected to the encoder amplifier box connectors at the ends of cables from the slider assembly linear encoders.
All cables in the system terminate at connectors on the card rack backplane assembly. Refer to paragraph 6.4 for more information concerning the servo control system.
6-2
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
To optimize table operation, refer to Setup in Section 1 of this manual and
Preventive Maintenance Requirements in paragraph 6.3.
No attempt should be made to disassemble and repair the XY slider bearings or the linear encoders. If there is a problem with the bearings or with
encoder operation, the XY table assembly must be replaced as a unit.
Special fixtures, tools, and other equipment are required when assembling and testing the cross roller bearing slides and their integral encoders
to ensure specified performance. The rear Y slide linear carriage bearings, X and Y axis servo motors, and rear Y coupling bearing and rail
assembly may be replaced by the user if necessary.
Y Axis
Servo Motor
Rear Y Coupling
Bearing
Rear Y Slide
Bearing (2 places)
Rear
Y Slide
Ground Strap
Front
Y Slide
X Slide Bearing
(2 places)
X Axis
Servo Motor
Front Y Slide
Bearing (2 places)
X Slide
Air Knife
Top & Bottom Plates
(air cooling)
XY Table Base
Figure 6-1 XY Table, Component Locations
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-3
Maxµm Ultra Ball Bonder
6.3
Preventive Maintenance
Preventive maintenance requirements for the XY table are summarized in
Table 6-1. Paragraph 6.3.1 contains a procedure for removing access
panels and machine equipment to allow access to the XY table area.
Table 6-1 XY Table Preventive Maintenance
Service
Clean X and Y motors
Frequency
3000 hours
Notes/Reference
1. Inspect motors for accumulation of dust and small
pieces of hardware between the coil and field plates.
2. If present, use a non–ferrous tool to carefully remove
any items inside the motor.
3. If present, carefully remove dust with compressed air
and vacuum.
Refer to paragraph 6.3.2.
Check condition of X and 3000 hours
Y motor cooling air hoses
1. Check hose connections and make sure they are tight.
2. Check condition of hoses. Replace hoses if they
appear kinked, cracked, or show other signs of wear.
Lubricate X slide and
front Y slide bearings.
9000 hours
1. Clean slider gibs at front of Y slide.
2. Apply 0.5 ml. of lubricant and work slide back–and–
forth 5 times to distribute lubricant. Remove excess lubricant.
3. Repeat steps 1 and 2.
4. Repeat at left side of X slide.
Refer to paragraph 6.3.3
Lubricate rear Y slide
bearings
9000 hours
Use grease gun to inject grease into each of the four (4)
bearing blocks.
Refer to paragraph 6.3.4.
Lubricate rear Y coupling bearing
9000 hours
Use grease gun to inject grease into the bearing block.
Refer to paragraph 6.3.5
Check Y axis ground
strap
9000 hours
Check tightness of attaching hardware that secures the Y
axis ground strap at the rear of the front Y slide and the
top of the Y motor. Tighten any loose hardware as
needed.
WARNING: ELECTROMAGNETIC FIELDS! SERVO MOTORS USED TO POSITION
THE BOND HEAD AND OPTICS GENERATE STRONG MAGNETIC FIELDS.
HEART STIMULATION DEVICES (E.G. PACEMAKERS) MAY BE ADVERSELY
AFFECTED DURING BOND HEAD POSITIONING. THEREFORE, PERSONS
USING SUCH DEVICES SHOULD NOT BE NEAR THE EQUIPMENT WHILE IT
IS IN OPERATION.
CAUTION: A strong magnetic field is present around the motor assembly.
Remove watch, pens, or any other objects that may contain ferrous
metals before working around the motor. Be careful when using steel
tools near the motor assembly.
6-4
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
6.3.1
Access to XY Table Components
Purpose
Gain access to XY table motors or slider assembly for maintenance. For
most maintenance, only the Man Machine Interface (MMI), MHS
workholder, and/or the output magazine handler side panel must be
removed. For some maintenance actions (i.e. XY table assembly removal)
MHS magazine handlers may need to be removed as well.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 90 in. lb. (10.2 Nm)
•
Screwdriver, flat–blade
•
Shim, 1–mil (0.025 mm)
Input Magazine
Handler
Input Magazine
Handler Side Panel
(Held by 7 screws)
Input Magazine
Handler Base Plate
(Held by 14 screws)
Workholder Front Cover
(Held by 2 captive screws
and 2 sliding locking pins)
Output Magazine
Handler
Output Magazine
Handler Side Panel
(Held by 5 screws)
Output Magazine
Handler Base Plate
(Held by 14 screws)
Man Machine Interface (MMI)
(Held by 4 screws on Lower
Console base plate - see Section 2)
Workholder (hidden from view)
(Held by 3 captive screws on
Lower Console base plate)
NOTE:
Input motor/PCB cover and output motor/PCB cover
are not shown. They are located at the rear of the
input and output magazine handlers, respectively.
Each is held by four (4) screws.
Figure 6-2 Access to XY Table Area for Maintenance
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-5
Maxµm Ultra Ball Bonder
Procedure
A. Press [MOTOR STOP]. Turn off machine power and disconnect the air
supply from the main air input unit.
B. Remove the MMI assembly (see Figure 6-2).
1. Remove the rear cover from the lower console. Inside the lower
console, locate the vision system unit and USB 4 port hub mounted
in a bracket attached to the underside of the machine base.
NOTE: The front panel of the vision system unit faces the right side of the lower
console when viewed from the rear of the machine. The back panel
faces the left side of the lower console. Electrical connections are made
at both panels. Refer to Section 4 for illustrations of the vision system
unit.
2. Disconnect the MMI keypad and mouse USB cables from the USB
hub. Disconnect the USB cable (84104-1100-000) from the USB1
connector on the Matrox unit. Disconnect the wire feed control
cable (08828-1096-000) from the back of the MMI.
3. Remove two (2) screws with flat washers that secure the MMI to
the front of the machine base (beneath MMI assembly).
4. Remove two (2) screws with flat washers at the rear of the MMI that
secure it to the top of the machine base.
5. Lift the MMI and carefully pull the MMI cables up through the hole in
the top of the machine base. Remove the MMI from the machine.
C. Remove input magazine handler side panel.
1. At the left–rear of the machine, remove four (4) screws that secure
the input motor/PCB cover.
2. At the input magazine handler, remove seven (7) screws that
secure the side panel to the magazine handler side wall and upper
console.
3. Move the panel toward the rear of the machine, then remove it from
the machine.
D. Remove output magazine handler side panel.
1. At the right–rear of the machine, remove four (4) screws that
secure the output motor/PCB cover.
2. At the output magazine handler, remove five (5) screws that secure
the side panel to the magazine handler side wall and upper console.
3. Move the panel toward the rear of the machine, then remove it from
the machine.
E. Remove MHS workholder assembly from machine. (Refer to Section 2
of Volume 3: Max∝m Ultra Material Handling System.)
1. Remove the rear cover from the lower console. If the input magazine handler side panel has not been removed, remove it now (see
step C.).
2. Disconnect two (2) air lines (one vacuum and 1 air pressure) from
the output magazine handler side wall. Disconnect three (3) thermocouple connectors from the connector plate. Disconnect three
(3) workholder heater connectors from the connector plate.
3. Remove the screw that secures the input leadframe stop to the
input end of the workholder rear rail. Remove the input leadframe
stop and set it aside.
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© 2007 kulicke & Soffa Industries Inc
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Section 6: XY Table
4. Remove the screw that secures the output leadframe stop to the
output end of the workholder rear rail. Remove the output leadframe stop.
5. Loosen the workholder mounting screws (these screws are captive).
6. Slide the workholder forward until the connectors at the rear of the
workholder are clear from under the XY table base. Support the
workholder at front.
7. Disconnect the power cables (2) and the sensor cable from the
workholder indexer interface board.
WARNING: THE MHS WORKHOLDER WEIGHS 85 POUNDS (38 KILOGRAMS). AT
LEAST TWO PEOPLE SHOULD BE PRESENT TO LIFT THE
WORKHOLDER OFF OF THE MACHINE.
8. Lift the workholder off of the machine base. Place it on a clean, flat
supporting surface.
F. Remove MHS magazine handlers, if necessary.
1. Loosen and remove the hardware that secures the input and output
magazine handlers.
2. Disconnect the power cable and the sensor cable from the magazine handler interface boards.
WARNING: EACH MAGAZINE HANDLER WEIGHS APPROXIMATELY 75 POUNDS
(34 KILOGRAMS). AT LEAST TWO PEOPLE SHOULD BE PRESENT
TO LIFT MAGAZINE HANDLERS OFF OF THE MACHINE.
3. Using sufficient personnel, lift each magazine handlers off the
machine. Grasp the left and right sides of the magazine handler
bottom plate near the center of the bottom plate when lifting the
magazine handler off of the machine. Do no lift the ends of the bottom plate as this may bend the plate and the Y axis slides.
G. Perform whatever XY table maintenance procedure is required. Re–
assemble machine by completing this procedure when done.
WARNING: EACH MAGAZINE HANDLER WEIGHS APPROXIMATELY 75 POUNDS
(34 KILOGRAMS). AT LEAST TWO PEOPLE SHOULD BE PRESENT
TO LIFT MAGAZINE HANDLERS ONTO THE MACHINE.
H. Install magazine handlers, if necessary.
1. Using sufficient personnel, lift the input magazine handler onto the
left side of the machine lower console and slide it to the rear and
right against the three (3) benching pins.
2. Install 13 M6 mounting screws through the magazine handler base
plate.
3. Tighten the screws to 90 in. lb. (10.2 Nm), starting at the middle of
the plate and working outward to the front and rear in a diagonal
pattern.
4. Install the screw that secures the magazine handler side plate to
the upper console. Tighten the screw to 90 in. lb. (10.2 Nm).
5. Use a 1–mil (0.025 mm) thick shim to verify that the input magazine
handler is benched against all three (3) benching pins. If not:
a. Loosen all mounting screws.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-7
Maxµm Ultra Ball Bonder
b. Bench the magazine handler against the benching pins again.
c. Repeat step 3.
6. Using sufficient personnel, lift the output magazine handler onto the
right side of the machine lower console and slide it to the rear and
left against the two (2) benching pins.
7. Install 14 M6 mounting screws through the magazine handler base
plate.
8. Tighten the screws to 90 in. lb. (10.2 Nm), starting at the middle of
the plate and working outward to the front and rear in a diagonal
pattern.
9. Install the screw that secures the magazine handler side plate to
the upper console. Tighten the screw to 90 in. lb. (10.2 Nm).
10.Use a 1–mil (0.025 mm) thick shim to verify that the input magazine
handler is benched against the rear benching pin (forward benching
pin is not accessible.). If not:
a. Loosen all mounting screws.
b. Bench the magazine handler against the benching pins again.
c. Repeat step 8.
d. Connect the power and sensor cables to the magazine handler
interface board on both the input and output magazine handlers.
I. Install MHS workholder assembly.
WARNING: THE MHS WORKHOLDER WEIGHS 85 POUNDS (38 KILOGRAMS). AT
LEAST TWO PEOPLE SHOULD BE PRESENT TO LIFT THE
WORKHOLDER ONTO THE MACHINE.
1. Using sufficient personnel, lift the workholder onto the front of the
lower console base plate.
2. While supporting the workholder at the front, connect the power
and sensor cables to the workholder indexer interface board.
3. Slide the workholder back and under the XY table base until it contacts the benching pins located at the left and rear of the
workholder.
4. Tighten the workholder mounting screws.
5. Connect air lines (2) to the workholder located at the output magazine handler side wall. Connect the heater connectors (3) and thermocouple connectors (3) to the connectors on the bracket.
6. Place the output leadframe stop on top of the output end (right side,
from operator position) of the workholder rear rail. Install a screw
with flat washer through the slot in the leadframe stop into a tapped
hole in the rear rail. Do not tighten the screw. Move the leadframe
stop so that its right edge has a +.005/-.000 gap with the outside
surface of the output magazine handler side wall. Tighten the
screw.
7. Place the input leadframe stop on top of the input end (left side) of
the workholder rear rail. Install a screw with flat washer through the
slot in the leadframe stop into a tapped hole in the rear rail. Do not
tighten the screw. Move the leadframe stop so that its left edge has
a +.000/-.005 gap with the outside surface of the input magazine
handler side wall. Tighten the screw.
8. Install the rear cover on the lower console.
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Section 6: XY Table
J. Install input magazine handler side panel.
1. From the rear of the input magazine handler, position the side panel
between the Z axis tower and upper console.
2. Move the panel until the mounting holes in the panel are aligned
with tapped holes in the upper console and magazine handler side
plate.
3. Install seven (7) screws to secure the panel. Tighten the screws.
4. Position the input motor/PCB cover on the machine and install four
(4) screws. Tighten the screws.
K. Install output magazine handler side panel.
1. From the rear of the output magazine handler, position the side
panel between the Z axis tower and upper console.
2. Move the panel until the mounting holes in the panel are aligned
with tapped holes in the upper console and magazine handler side
plate.
3. Install five (5) screws to secure the panel. Tighten the screws.
4. Position the output motor/PCB cover on the machine and install
four (4) screws. Tighten the screws.
L. Install the MMI assembly.
1. Position the MMI over the mounting location. Route the MMI keyboard, mouse and wirefeed cables down through the hole in the top
of the machine base, into the lower console.
2. Bench the MMI against the front edge of the machine base.
3. Install two (2) screws with flat washers behind the MMI, and two (2)
screws with flat washers underneath the MMI, to secure it to the
machine base. Tighten all MMI mounting screws to 90 in. lb. (10.2
Nm).
4. Route the mouse and keyboard cables to the USB hub and the
vision system.
5. Connect the USB cable (84104-1100-000) to the rectangular USB1
connector on the vision system assembly faceplate. Connect the
Keyboard and mouse cable to the USB hub.
6. Route and connect the wirefeed cable to the wirefeed extension
cable.
7. Close the front door of the lower console. Install the rear cover on
the lower console.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-9
Maxµm Ultra Ball Bonder
6.3.2
Clean X and Y Motors
Purpose
Clean accumulated dust, small pieces of hardware, and other foreign
material from inside X and Y axes motors. This must be done on a regular
schedule to avoid damage to motor coils and prevent motor overheating.
Frequency
Motors should be cleaned after every 3000 hours of machine operation.
Tools/ Materials/ Parts
•
Hex wrench set
•
Vacuum cleaner
•
Non–ferrous tool (aluminum, plastic, wood, etc.)
•
Inspection mirror
•
Flashlight
•
Compressed air (less than 20 psi (138 kPa)
Procedure
WARNING: ELECTROMAGNETIC FIELDS! SERVO MOTORS USED TO POSITION
THE BOND HEAD AND OPTICS GENERATE STRONG MAGNETIC
FIELDS. HEART STIMULATION DEVICES (E.G. PACEMAKERS) MAY
BE ADVERSELY AFFECTED DURING BOND HEAD POSITIONING.
THEREFORE, PERSONS USING SUCH DEVICES SHOULD NOT BE
NEAR THE EQUIPMENT WHILE IT IS IN OPERATION.
CAUTION: A strong magnetic field is present around the motor assembly.
Remove watch, pens, or any other objects that may contain ferrous
metals before working around the motor. Be careful when using steel
tools near the motor assembly.
A. Press [MOTOR STOP]. Turn off machine power.
B. Gain access to the front and right side of the XY table by removing the
MMI assembly, output magazine handler access panel, and MHS
workholder assembly. Refer to paragraph 6.3.1 for procedure. Remove
the upper console rear cover to gain access to the rear of the XY table.
C. Inspect servo motor assemblies for dust and foreign material in the coil
area (see Figure 6-3). Use an inspection mirror and flashlight to
inspect each motor in the area between the coil and magnets. Check
for build up of dust, small pieces of hardware, or other foreign material.
If found, clean the motors (step D.). If cleaning is not necessary, proceed to step E.
D. If necessary, clean motor assemblies.
CAUTION: Be extremely careful when using tools close to the motor coil. The
coil wiring can be easily damaged. If this happens, the motor assembly must be replaced.
1. If present, remove any pieces of small hardware that may be stuck
to the motor housing. Use tools made from non–ferrous materials
to probe within the motor and remove hardware or other foreign
objects. Be careful not to damage the coil wiring while probing in
this area.
2. Use compressed air and vacuum to remove dust within the motor.
E. Install the MHS workholder and MMI. Install the output magazine handler access panel. Refer to paragraph 6.3.1. Install the rear cover on
the upper console.
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© 2007 kulicke & Soffa Industries Inc
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Section 6: XY Table
F. Position the bond head over the MHS workholder clamp plate window.
Turn on machine power and verify that XY table initialization is completed successfully.
Check motor housing for
small hardware, etc.
2
Check motor housing for
small hardware, etc.
2
Check this area (and
below coil) for dust
and foreign objects.
1
Check this area (and
below coil) for dust
and foreign objects.
1
NOTES:
1
Use only non-ferrous tools (plastic, aluminum, wood, etc.)
when probing inside of the motor.
2
A strong magnetic field exists around the motor housing.
Remove watches, pens, tools, and other objects containing
ferrous metals before working around the motor.
Figure 6-3 Clean XY Table Motors
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-11
Maxµm Ultra Ball Bonder
6.3.3
Lubricate X and Front Y Slide Bearings
Purpose
Lubricate X slide and front Y slide bearings in the XY slider assembly.
Frequency
X and front Y slide bearings should be lubricated every 15000 hours of
operation.
Tools/ Materials/ Parts
•
Hex wrench set
•
T–Handle wrench, 5 mm, P/N 27795-6000-001
•
Lint–free cloth
•
Lubricant (10 ml., supplied in syringe), P/N 27790-5020-000
Procedure
A. Press [MOTOR STOP]. Turn off machine power.
B. Remove the MMI assembly. Refer to paragraph 6.3.1, step B.
C. Loosen five (5) captive screws that secure the workholder. Move the
workholder as far forward as possible, but do not remove the
workholder from the machine.
CAUTION: Make sure that grease does not contact the encoder scales in the X and Y
slides. If it does, the XY slider assembly will need to be replaced.
D. Lubricate the front Y axis slide bearings (see Figure 6-4).
Gib
Y Slide (fully forward)
X Slide (fully to right)
V-Groove
XY Table Base
Gib
Apply 0.5 ml of grease to
bearing contact surfaces
of v-groove
View from Front-Right of Machine
Figure 6-4 Lubricate X and Front Y Slide Bearings
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Section 6: XY Table
1. Move the front Y slide as far forward as possible to expose the v–
groove on each side of the slide.
2. Clean old grease from the bearing contact surfaces of the v–
grooves using a lint–free cloth.
3. Apply a strip of grease (approximately 0.5 ml.) to the bearing contact surface at the top and bottom of each of the two (2) v–grooves
(four (4) surfaces total).
4. Manually move the front Y slide to its front and back limits of travel.
Repeat this motion 5 times. Use the cloth to remove any excess
grease from the ends of the v–grooves.
5. Move the front Y slide as far rearward as possible to expose the v–
groove on each side of the slide. Repeat steps 2. through 4. to
lubricate the rear area of the v–grooves.
E. Lubricate X axis slide bearings.
1. Move the X slide as far to the right as possible to expose the v–
groove on each side of the slide.
2. Clean old grease from the exposed bearing contact surfaces of the
v–grooves using the lint free cloth.
3. Apply a strip of grease (approximately 0.5 ml.) to the upper and
lower bearing contact surfaces of each of the two (2) v–grooves
(four (4) surfaces total).
4. Manually move the X slide to its left and right limits of travel. Repeat
this motion 5 times. Use the cloth to remove any excess grease
from the ends of the v–grooves.
5. Move the X slide as far to the left as possible to expose the v–
groove on each side of the slide. Repeat steps 1. through 4. to
lubricate the left area of the v–grooves.
F. Move the workholder back to its operating position and secure the five
(5) captive screws.
G. Install the MMI on the lower console. Refer to paragraph 6.3.1 step L.
H. Turn on machine power and initialize the machine.
6.3.4
Lubricate Rear Y Slide Bearings
Purpose
Lubricate the rear Y slide bearings.
Frequency
Rear Y slide bearings should be lubricated after every 15000 hours of
machine operation.
Tools/ Materials/ Parts
NOTE: The bearings blocks have a specially–designed end plate to recirculate
the balls within the bearing. Care is required when adding grease to prevent damage to the end plate. It is important to avoid use of grease guns
that have high discharge pressures or high discharge volumes. The recommended THK MG70 grease gun has a maximum discharge pressure
of 200 kgf/cm2 and discharges a volume of 0.6 cm3/stroke. If another
type of grease gun is used, it must have the same or lesser discharge
pressure and volume specifications. The volume capacity of each bearing block is 0.4 cm3.
•
Hex wrench set
•
THK MG70 grease gun
•
THK AFC grease
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-13
Maxµm Ultra Ball Bonder
•
Lint–free cloth
•
Safety solvent (or other grease cutting solvent)
Procedure
A. Press [MOTOR STOP]. Turn off machine power.
B. Remove covers and access panels as needed for access to the front
and rear of the rear Y slide. Refer to paragraph 6.3.1.
C. Locate the bearing blocks under the rear Y slide (see Figure 6-5).
There are four (4) bearing blocks: two (2) on each of the two (2) slides
under the rear Y slide.
D. Use lint–free cloth to remove any old grease from the rails of the rear Y
slide bearings.
CAUTION: Use only the recommended grease gun (or equivalent) to lubricate
bearing blocks. Use of a grease gun that discharges grease at higher
pressure or in greater volume may damage the bearing block end
plate. See NOTE above.
E. Lubricate one of the bearings:
NOTE: On the front bearing block of each slide, the grease fitting is in the bearing block face that is toward the front of the machine. The grease fitting
is in the face toward the rear of the machine on the remaining bearing
block on each slide.
1. Attach the grease gun to the grease fitting on the bearing block.
Make sure that the grease gun is in line with the grease fitting and
perpendicular to the side of the bearing block. Make sure the
grease gun does not pinch the grease fitting and be sure not to
apply unnecessary force to the fitting.
2. Squeeze the grease gun lever 2/3 of one full stroke in a slow,
smooth motion. It should take at least one (1) second to squeeze
the lever.
3. Remove the grease gun from the fitting.
F. Repeat step E. at each of the three (3) remaining bearing blocks.
G. After all four (4) bearing blocks have been lubricated, slowly move the
rear Y slide back and forth several times to work the grease through
the bearing blocks.
H. Install covers and access panels removed in step B.
I. Turn on machine power and initialize the machine. Verify that X and Y
axis initialization is completed successfully.
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All Rights Reserved
Section 6: XY Table
Rear Y Slide
Y Motor
Rail
(see Detail)
Bearing Block
(see Detail)
Bearing Block
(see Detail)
Rear Y Slide
Y Motor
Grease Fitting
Rail
Bearing Block
Detail - Rear Y Slide Bearing, from Rear of XY Table
Figure 6-5 Lubricate Rear Y Slide Bearings
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-15
Maxµm Ultra Ball Bonder
6.3.5
Lubricate Rear Y Coupling Bearing
Purpose
Lubricate rear Y coupling bearing.
Frequency
Rear Y coupling bearing should be lubricated after every 15000 hours of
machine operation.
Tools/ Materials/ Parts
NOTE: The bearings blocks have a specially–designed end plate to recirculate
the balls within the bearing. Care is required when adding grease to prevent damage to the end plate. It is important to avoid use of grease guns
that have high discharge pressures or high discharge volumes. The recommended THK MG70 grease gun has a maximum discharge pressure
of 200 kgf/cm2 and discharges a volume of 0.6 cm3/stroke. If another
type of grease gun is used, it must have the same or lesser discharge
pressure and volume specifications. The volume capacity of each bearing block is 0.4 cm3.
•
Hex wrench set
•
THK MG70 grease gun
•
THK AFC grease
•
Lint–free cloth
•
Safety solvent (or other grease cutting solvent)
Procedure
A. Press [MOTOR STOP]. Turn off machine power.
B. Remove access panel in output magazine handler side wall for access
to the rear Y coupling bearing. Refer to paragraph 6.3.1.
C. Use lint–free cloth to remove any old grease from the rail of the rear Y
coupling bearing.
CAUTION: Use only the recommended grease gun (or equivalent) to lubricate
bearing blocks. Use of a grease gun that discharges grease at higher
pressure or in greater volume may damage the bearing block end
plate. See NOTE above.
D. Lubricate the rear Y coupling bearing (see Figure 6-6).
1. Attach the grease gun to the grease fitting on the bearing block.
Make sure that the grease gun is in line with the grease fitting and
perpendicular to the side of the bearing block. Make sure the
grease gun does not pinch the grease fitting and be sure not to
apply unnecessary force to the fitting.
2. Squeeze the grease gun lever 2/3 of one full stroke in a slow,
smooth motion. It should take at least one (1) second to squeeze
the lever.
3. Remove the grease gun from the fitting.
4. Manually move the X slide to its left and right limits of travel. Repeat
this motion 5 times.
5. Remove any grease that may have gotten onto other parts on the
XY table.
E. Install the access panel in the output magazine handler side wall.
F. Turn on machine power. Initialize the machine.
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
Rear Y Coupling Bearing
Grease Fitting
Rear Y
Slide
Rear Y Coupling
Bearing Block
NOTE:
Bond head interconnect board removed
for clarity.
Figure 6-6 Lubricate Rear Y Coupling Bearing
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-17
Maxµm Ultra Ball Bonder
6.3.6
Replacement Procedures
6.3.6.1
Replace Y Motor
Purpose
Replace non–functional Y axis servo motor assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 70 in. lb. (7.9 Nm), 90 in. lb. (10.2 Nm)
•
Plastic shims, 0.002” (0.051 mm), 0.010” (0.25 mm), 0.015” (0.38 mm),
0.020” (0.51 mm)
•
Y Motor Assembly, P/N 08088-1012-000-xx
Procedure
WARNING: ELECTROMAGNETIC FIELDS! THE X AND Y SERVO MOTORS GENERATE STRONG MAGNETIC FIELDS. HEART STIMULATION DEVICES
(E.G. PACEMAKERS) MAY BE ADVERSELY AFFECTED. THEREFORE,
PERSONS USING SUCH DEVICES SHOULD NOT BE NEAR THE
EQUIPMENT.
CAUTION: A strong magnetic field is present around the motor assembly.
Remove watch, pens, or any other objects that may be sensitive to
magnetic fields before working around the motor. Be careful when
using steel tools near the motor assembly.
A. Press [MOTOR STOP]. Turn off machine power and disconnect the
machine from the facility air pressure source. Remove covers and
assemblies as needed to gain access to the Y servo motor. Refer to
paragraph 6.3.1.
B. Disconnect the Y motor.
1. At the left side of the Y motor (viewed from the front), locate the
cable from the Y motor coil to the left–rear of the upper console
frame.
2. Remove screw locks that secure the cable connector to the upper
console.
3. Locate the air hose connected to the Y motor assembly. Disconnect
the hose from the Y motor barb fitting.
C. Uncouple the Y motor from the rear Y slide and remove the ground
strap bracket (see Figure 6-7).
1. Remove two (2) screws and washers that secure the Y motor coil to
the rear Y slide at the right side.
2. Remove two (2) screws and washers that secure the motor coil to
the rear Y slide at the left side.
3. Remove two (2) screws that secure the ground strap bracket to the
top of the Y motor housing. Set the bracket aside.
CAUTION: Do not attempt to disassemble the motor assembly. It cannot be re–
assembled without special tools and fixtures.
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© 2007 kulicke & Soffa Industries Inc
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Section 6: XY Table
Motor Mounting Screw
(4 places - see sheet 2)
Coil Mounting Screw
with Flat Washer
(2 each side of motor)
Air Knife Plates
(Top and Bottom)
Y Motor
Ground Strap Bracket
Motor Mounting Screw
(4 places - see sheet 2)
Rear Y Slide
X Motor
X Slide
Air Knife Plates
(Top and Bottom)
Coil Mounting Screw
with Flat Washer
(2 each side of motor)
Figure 6-7 Replace XY Motor Assemblies, Sheet 1 of 2
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-19
Maxµm Ultra Ball Bonder
Y Motor
Mounting Surface
X Motor
Mounting Surface
Motor Bench Points
Place shims between the motor and
the top and bottom air knife plates
Top Air Knife Plate Screw
(2 places)
Top Air Knife Plate
Bottom Air Knife Plate
Bottom Air Knife Plate Screw
(2 places, not shown)
Adjust Motor Air Knife Plates
Figure 6-8 Replace XY Motor Assemblies, Sheet 2 of 2
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
WARNING: THE Y MOTOR WEIGHS APPROXIMATELY 36 POUNDS (16 KILOGRAMS).
D. Remove the Y motor from the XY table base.
1. Remove four (4) screws that secure the Y motor to the base casting.
2. Lift the motor assembly away from the base casting and remove it
from the machine.
E. Mount the replacement Y motor (see Figure 6-8).
CAUTION: The motor is shipped with paper shims between the motor coil and
the motor housing. Do not remove the shims until instructed to do so
in steps that follow. Removing the shims ahead of time may allow
motor coil damage during handling.
1. On the replacement motor, loosen two (2) screws on the bottom air
knife plate. This plate will be adjusted later in the procedure.
2. Place the motor on its mounting surface on the base casting. Make
sure the motor is benched against the three (3) Y motor bench
points indicated in Figure 6-8 (at front and left side of the motor
base plate, from front of machine).
3. Install four (4) screws through the holes in the motor base plate and
torque the screws in a diagonal pattern (shown in Figure 6-8) to 90
in. lb. (10.2 Nm).
4. Try to insert a 0.002” (0.051 mm) thick shim between the motor
base plate and each of the motor bench points. If the shim can be
inserted at any bench point, loosen the four mounting screws,
bench the motor and torque the screws as in steps 2. and 3., then
check spacing with the 0.002” (0.051 mm) shim.
5. Remove the paper shims between the motor coil and motor housing.
CAUTION: Make sure equal torque is applied to the upper and lower mounting
screws when fastening the motor coil to the rear Y slide at each side.
Unequal torque applied during screw tightening may break the
ceramic insulator.
6. Install two (2) screws with flat washers through the motor coil
mounting holes into the left arm of the rear Y slide. Do not tighten
the screws.
7. Install two (2) screws with flat washers through the motor coil
mounting holes into the right arm of the rear Y slide. Do not tighten
the screws.
8. Insert a 0.015” (0.38 mm) shim between the top of the motor coil
and the motor body and another 0.015” (0.38 mm) shim between
the bottom of the motor coil and the motor body.
9. Torque the four (4) coil mounting screws to 70 in. lb. (7.9 Nm).
Remove the two shims. Make sure the Y slide moves freely.
10.Position the ground strap bracket at the top of the Y motor housing
and secure with two (2) screws removed in step C3.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-21
Maxµm Ultra Ball Bonder
F. Adjust Y motor air knife plates.
1. Loosen two (2) screws on the top air knife plate.
2. Place 0.015” (0.38 mm) shims between the motor and the top and
bottom air knife plates.
3. Tighten all four screws in the air knife plates while holding the
plates against the shims. Remove the shims.
4. Use a 0.010” (0.25 mm) shim and a 0.020” (0.51 mm) shim to
check the gap over the full travel of the Y motor; the 0.010” (0.25
mm) shim must fit in the gaps while the 0.020” (0.51 mm) shim
should not fit in the gaps. Remove the shims from the motor.
5. If the 0.020” shim fits in the gaps, loosen the top and bottom air
knife plate screws and repeat steps 2. through 4.
G. Connect the Y motor air hose to the barb fitting in the side of the air
knife.
H. Connect motor cable.
1. Use two (2) screwlocks to attach the Y motor cable to the connector
at the left–rear of the upper console.
2. Tighten the screw locks to secure the cable connection.
I. Mount assemblies and/or access covers removed in step A.
J. Connect the machine to facility air pressure. Power up the machine
and verify that initialization is completed successfully.
K. Perform Y axis servo calibration. See Appendix A for procedure.
6.3.6.2
Replace X Motor
Purpose
Replace non–functional X motor assembly.
Tools/ Materials/ Parts
•
Hex wrench set
•
Plastic shims, 0.002” (0.051 mm), 0.010” (0.25 mm), 0.015” (0.38 mm),
0.020” (0.51 mm)
•
Torque wrench, 70 in. lb. (7.9 Nm), 90 in. lb. (10.2 Nm)
•
X Motor Assembly, P/N 08088-1012-000-xx
Procedure (Figure 6-7, Figure 6-8)
WARNING: ELECTROMAGNETIC FIELDS! THE X AND Y SERVO MOTORS GENERATE STRONG MAGNETIC FIELDS. HEART STIMULATION DEVICES
(E.G. PACEMAKERS) MAY BE ADVERSELY AFFECTED. THEREFORE,
PERSONS USING SUCH DEVICES SHOULD NOT BE NEAR THE
EQUIPMENT.
CAUTION: A strong magnetic field is present around the motor assembly.
Remove watch, pens, or any other objects that may be sensitive to
magnetic fields before working around the motor. Be careful when
using steel tools near the motor assembly.
A. Press [MOTOR STOP]. Turn off machine power and disconnect the
machine from the facility air pressure source. Remove covers and
assemblies as needed to gain access to the X motor. Refer to paragraph 6.3.1.
B. Disconnect the X motor.
1. At the rear of the X motor, locate the cable from the X motor coil to
the right–rear of the upper console frame.
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
2. Remove screw locks that secure the cable connector to the upper
console.
3. At the front of the X motor, locate the air hose connected to the X
motor assembly. Disconnect the hose from the X motor barb fitting.
C. Uncouple the X axis motor from the X slide (see Figure 6-7).
1. Remove two (2) screws and washers that secure the X motor coil to
the X slide at the front of the motor.
2. Remove two (2) screws and washers that secure the X motor coil to
the X slide at the rear of the motor.
CAUTION: Do not attempt to disassemble the motor assembly. The motor cannot
be re–assembled without special tools and fixtures.
WARNING: THE X MOTOR WEIGHS APPROXIMATELY 36 POUNDS (16 KILOGRAMS).
D. Remove the X motor from the XY table base.
1. Remove four (4) screws that secure the X motor to the base casting.
2. Lift the motor assembly away from the base casting and remove it
from the machine.
E. Mount the replacement X axis motor (see Figure 6-8).
CAUTION: The motor is shipped with paper shims between the motor coil and
the motor housing. Do not remove the shims until instructed to do so
in steps that follow. Removing the shims ahead of time may allow
motor coil damage during handling.
1. On the replacement motor, loosen two (2) screws on the bottom air
knife plate. This plate will be adjusted later in the procedure.
2. Place the motor on its mounting surface on the base casting, being
careful not to pinch the X encoder cable under the motor. Make
sure the motor is benched against the three (3) X motor bench
points indicated in Figure 6-8 (at rear and left side of the motor
base plate, from front of machine).
3. Install four (4) screws through the holes in the motor base plate and
torque the screws in a diagonal pattern (shown in Figure 6-8) to 90
in. lb. (10.2 Nm).
4. Try to insert a 0.002” (0.051 mm) thick shim between the motor
base plate and each of the motor bench points. If the shim can be
inserted at any bench point, loosen the four mounting screws,
bench the motor and torque the screws as in steps 2. and 3., then
check spacing with the 0.002” (0.051 mm) shim.
5. Remove the paper shims between the motor coil and motor housing.
CAUTION: Make sure equal torque is applied to the upper and lower mounting
screws when fastening the motor coil to the X slide at each side.
Unequal torque applied during screw tightening may break the
ceramic insulator.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-23
Maxµm Ultra Ball Bonder
6. Install two (2) screws with flat washers through the motor coil
mounting holes into the front arm of the X slide. Do not tighten the
screws.
7. Install two (2) screws with flat washers through the motor coil
mounting holes into the rear arm of the X slide. Do not tighten the
screws.
8. Insert a 0.015” (0.38 mm) shim between the top of the motor coil
and the motor body and another 0.015” (0.38 mm) shim between
the bottom of the motor coil and the motor body.
9. Torque the four (4) coil mounting screws to 70 in. lb. (7.9 Nm).
Remove the two shims. Make sure the X slide moves freely.
F. Adjust X motor air knife plates.
1. Loosen two (2) screws on the top air knife plate.
2. Place 0.015” (0.38 mm) shims between the motor and the top and
bottom air knife plates.
3. Tighten all four screws in the air knife plates while holding the
plates against the shims. Remove the shims.
4. Use a 0.010” shim and a 0.020” (0.5 mm) shim to check the gap
over the full travel of the X motor; the 0.010” shim must fit in the
gaps while the 0.020” shim should not fit in the gaps. Remove the
shims from the motor.
5. If the 0.020” shim fits in the gaps, loosen the top and bottom air
knife plate screws and repeat steps 2. through 4.
G. Connect the X motor air hose to the barb fitting in the side of the air
knife.
H. Connect motor cable.
1. Use two (2) screwlocks to attach the X motor cable to the connector
at the right–rear of the upper console.
2. Tighten the screw locks to secure the cable connection.
I. Mount assemblies and/or access covers removed in step A.
J. Connect the machine to facility air pressure. Power up the machine
and verify that initialization is completed successfully.
K. Perform X axis servo calibration. See Appendix A for procedure.
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
6.3.7
Replace Rear Y Slide Bearings
Purpose
•
Replace linear bearings that support the rear Y slide.
Tools/ Materials/ Parts
•
Hex wrench set
•
Torque wrench, 12 in. lb. (1.36 Nm), 36 in. lb. (4.07 Nm), 70 in. lb. (7.9
Nm). An extension and ball–end hex drivers must be used for the 12
in. lb. (1.36 Nm) and 36 in. lb. (4.07 Nm) values.
•
Shims, 0.001” (0.025 mm), 0.010” (0.25 mm), 0.015” (0.38 mm),
0.020” (0.51 mm)
•
Linear Carriage Bearing, P/N 37500-6055-000
•
Health Check Tool Kit. *see note
NOTE: This replacement requires XY Table re-qualification and this procedure
is usually performed at factory level. Our engineers are currently developing a health check tool kit to enable on-site XY table qualification.
Kindly contact K&S customer service support for more information.
Procedure
A. Press [MOTOR STOP]. Turn off machine power and disconnect the
machine from the facility air pressure source.
B. Remove the upper console rear cover. Remove the access panel from
the output magazine handler side wall. Refer to paragraph 6.3.1.
C. Uncouple the rear Y slide from the front Y slide (see Figure 6-9).
Rear Y Slide
Rear Y Slide
Mounting Screws
(8 places)
Y Motor
Flat Washer
(2 each side of motor)
Coil Mounting Screw
(2 each side of motor)
Side Plate Mounting Screws
(10 pcs per side)
Captive Mounting Screw
(5 places)
Rear Y Coupling
Bearing Assembly
NOTE:
Some assemblies have been
removed for clarity.
Figure 6-9 Replace Rear Y Slide Bearings (Sheet 1 of 2)
1. Remove five (5) captive screws that secure the rail of the rear Y
coupling bearing to the front of the rear Y slide. Move the front Y
slide as needed for access to the screws.
2. Move the rear Y slide to the rear, away from the front Y slide. Move
the front Y slide fully forward.
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© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-25
Maxµm Ultra Ball Bonder
D. Remove the sideplates on each the rear Y slide by loosening and
removing the ten (10) screws on each side of each side plate.
E. Remove the rear Y slide from the bearings.
1. Remove the four (4) screws and washers that secure the rear Y
slide to the Y motor coil.
2. Lift the Y motor coil so there is no contact between the coil and
motor housing. Move the coil to its rear–most position, then gently
lower the coil.
3. Remove eight (8) screws that secure the rear Y slide to the left and
right bearing assembies.
4. Lift the rear Y slide off the machine and set it aside.
F. Replace one or both bearings, as needed.
1. Remove four (4) screws that secure the bearing rail to the XY table
base (see Figure 6-10). Remove the bearing assembly from the XY
table base.
2. Use a lint–free cloth to clean the XY table base area where the
replacement bearing assembly will be mounted.
3. Place the replacement bearing assembly on the XY table base. Be
sure that the double black line on the underside of the rail is
towards the two (2) bench points. Make sure the rail is against the
two (2) bench points.
4. Install four (4) screws to secure the bearing assembly. Move the
two bearing blocks as needed for access to the rail mounting holes.
Snug down, but do not tighten the screws.
5. Make sure the rail is against the two bench points. If not gently
press against the rail to adjust its position. When the rail is against
the bench points, tighten each of the screws to 36 in. lb. (4.07 Nm).
6. Use a 0.001” (0.025 mm) shim to verify that the rail is against the
bench points. If not, loosen all four screws until just snug and
repeat steps 5. and 6.
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© 2007 kulicke & Soffa Industries Inc
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Section 6: XY Table
Rail Mounting Screw
(4 places)
Rail Mounting Screw
(4 places)
Bearing Assembly
(2 places)
Bearing Block
(2 places)
Bearing Assembly
Bench Points
Bearing Assembly
Bench Point
XY Table Base
Bearing Assembly
Bench Point
Figure 6-10 Replace Rear Y Slide Bearings (Sheet 2 of 2)
G. Install the rear Y slide and couple it to the Y servo motor.
1. Place the rear Y slide on the bearing blocks. Position the bearing
blocks so that the mounting holes in the rear Y slide are aligned
with the tapped holes in the blocks.
2. Install eight (8) screws through the rear Y slide mounting holes into
the tapped holes in the bearing blocks. Do not tighten the screws.
The rear Y slide should be free to move left or right.
3. Bench the rear Y slide to the right (viewed from front of machine)
and torque the eight (8) screws to 36 in. lb. (4.07 Nm) in a crisscross pattern.
H. Couple the rear Y slide to the front Y slide.
1. Move the rear Y slide forward until it contacts the rail of the Y coupling bearing on the front Y slide.
2. Install the five (5) captive screws from the Y coupling bearing rail
into tapped holes in the front face of the rear Y slide as follows:
a. Start with the middle screw then alternate left and right while
moving outward toward the ends of the rail.
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© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-27
Maxµm Ultra Ball Bonder
b. Torque all five (5) screws to 12 in. lb. (1.36 Nm), then torque all
to 36 in. lb. (4.07 Nm).
I. Couple the rear Y slide to the Y servo motor.
1. Install two (2) screws with flat washers through the motor coil
mounting holes into the left arm of the rear Y slide. Do not tighten
the screws.
2. Install two (2) screws with flat washers through the motor coil
mounting holes into the right arm of the rear Y slide. Do not tighten
the screws.
3. Insert a 0.015” (0.38 mm) shim between the top of the motor coil
and the motor body and another 0.015” (0.38 mm) shim between
the bottom of the motor coil and the motor body.
4. Torque the four (4) coil mounting screws to 70 in. lb. (7.9 Nm).
Remove the two shims. Make sure the Y slide moves freely.
J. Install the sideplates back to the rear Y slide by installing and tightening the ten (10) screws on each side of each side plate.
K. Check the Y motor air knife gaps (see Figure 6-8).
1. Use a 0.010” (0.25 mm) shim to check the gap over the full travel of
the Y motor; the 0.010” (0.25 mm) shim must fit in the gaps while a
0.020” (0.51 mm) shim should not fit in the gaps. Remove the
shims from the motor.
2. If the 0.010” (0.25 mm) shim does not fit or if the 0.020” (0.51 mm)
shim does fit in the gaps, the air knife gaps must be adjusted (refer
to paragraph 6.3.6.1, steps B3. through G.).
L. Install the output magazine handler access panel. Install the rear cover
on the upper console. Refer to paragraph 6.3.1.
M. Connect the machine to the facility air pressure source. Power up and
initialize the machine.
N. Install the health check tool kit on to the bonder. *see note
NOTE: This replacement requires XY Table re-qualification and this procedure is usually performed at factory level. Our engineers are currently developing a
health check tool kit to enable on-site XY table qualification. Kindly contact
K&S customer service support for more information.
6-28
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
6.4
XY Table Control System
6.4.1
System Description
Bond head XY axis motion is controlled by a servo system that has four
major elements, indicated in the block diagram in Figure 6-11.
Motion commands in digital form are passed from the Host CPU (on the
System Computer) to the Servo CPU (CPU2) via the bridge card and the
VMEbus. CPU2 interprets the commands and creates X and Y analog
motor drive signals, which are then passed to the X and Y servo amplifier
assemblies. Each servo amplifier outputs current to its motor, driving the
slider to which the motor is coupled. After a motion is begun, slider position feedback is returned to CPU2 from linear encoders mounted on the X
and Y slides via the Servo Preamplifier circuit board, where an interpolation function is performed to improve encoder resolution. Velocity is
derived from the change in encoder count over time. Both types of feedback modify the drive signal being created by CPU2.
Y Overtemp
I/O & Temperature
Controller Board
X Overtemp
Servo CPU (CPU2)
Processor
VME
Interface
VME
&
Bus
Signal
Processing
Motion
Command
Y Drive
Input
D/A
Converters
X Drive
Input
Position
Feedback
Y
Amp
X
Amp
Y Drive
X Drive
Y
Motor
XY
X
Slider
Motor Assembly
Encoder
Interface
Y Encoder
Signal
Y Encoder Count
X Encoder Count
Servo
Preamplifier
X Encoder Signal
Figure 6-11 XY Table Servo System, Simplified Block Diagram
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-29
Maxµm Ultra Ball Bonder
6.4.2
Servo System Circuit Boards
Locations of XY servo system circuit board assemblies are shown in Figure 6-12. Detailed information on each board follows.
Servo Preamp
P/N 08002–4344–000–xx
Slot #6
Servo CPU (CPU2)
P/N 08002–4238–000–xx
Slot #5
Card Rack
Assembly
Power
On/ Off Switch
1
3
5
4
2
9
7
Upper Deck
(6U Boards)
10
8
6
System
Computer
2
4
1
3
6
5
7
8
11
9 10 12
UPPER DECK BOARDS
Z AMP (08001–4145–000–xx)
X–Y AMP (08002–4105–000–xx)
X–Y AMP (08002–4105–000–xx)
SOLENIOD DRIVER (08002–4020–000–xx)
DUAL HS (08001–4166–000–xx)
9
DUAL HS (08001–4166–000–xx)
8
DUAL HS (08001–4166–000–xx)
7
DUAL HS (08001–4166–000–xx)
TEMP I/O (08002–4192–000–xx)
6
MS AMP (08089–4000–000–xx)
STEPPER/SENSOR (08001–4176–000–xx)
5
DUAL HS (08001–4200–000–xx)
SERVO PREAMP (08002–4344–000–xx)
4
CLAMP DRIVER (08002–4165–000–XX)
SERVO CPU (08002–4238–000–xx)
3
X Axis Servo Amplifier
P/N 08002–4105–000–xx
Slot #9
MEFO (OPTIONAL) (08002–4005–000–xx)
USG (08001–4302–000–xx)
2
SPARE
ILLUMINATOR (08001–4246–000–xx)
1
VME BRIDGE (08001–4325–000–xx)
SPARE
Y Axis Servo Amplifier
P/N 08002–4105–000–xx
Slot #8
10
1
2
3
4
5
6
7
8
9
10
11 12
LOWER DECK BOARDS
Figure 6-12 XY Servo System Circuit Board Locations
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
DUAL HS (08001–4200–000–xx)
Lower Deck
(3U Boards)
Section 6: XY Table
6.4.2.1
Servo CPU (CPU2) Board, P/N 08002-4238-000-xx
Table 6-2 describes the functions of the Servo CPU (CPU2) circuit board
assembly, P/N 08002-4238-000-xx. This assembly consists of a single
surface–mount printed circuit board installed at the location shown in Figure 6-12.
Table 6-2 Servo CPU (CPU2) Board
Functions
Independent processing
system for control of
servo axes (X, Y, Z and
optional MEFO). Designated CPU2 in machine
control system.
Monitors position of X,
Y, Z axes and optional
MEFO axis.
Interprets motion
requests from the host
processor.
Generates Z motor
drive signal based upon
motion requests, current bond head link
position, and application of motion algorithms.
Servo gains can be
tuned starting from
default or user–entered
values in CALIBRATION mode.
Controls/Indicators
RESET (S1)
Push–Button Switch
CPU2 Reset switch
CR1 Indicator
RUN - Indicator is
green to indicate that
program cross-load is
completed.
FAIL - Indicator is red
to indicate cross-load
failed or watchdog
timed out.
W1 Jumper
Watchdog Timer (controlled by 5MHz clock)
W2 Jumper
Watchdog Timer (controlled by software)
S2 DIP Switch
Used to set the VME
address space.
Test Points
TP1 X AXIS DAC
TP2 T AXIS DAC
TP3 Y AXIS DAC
TP4 Z AXIS DAC
TP5 Z FORCE DAC
TP6 Spare DAC
TP7 MEFO DAC
TP8 Spare DAC
TP9 Periodic Timer
TP10 Test DAC #1
TP11 Test DAC #2
TP12 Digital GND
TP13 Digital GND
TP14 TP15 Digital S/w programmable
TP16 Digital S/w programmable
TP17 Digital S/w programmable
TP18 Analog GND
TP19 Analog GND
TP20 Digital GND
TP21 Digital GND
TP22 TP23 TP24 TP25 -
References
Figure 6-12,
Figure 6-13
Maxµm Ultra Electrical Documents
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-31
Maxµm Ultra Ball Bonder
P1
Emulator Port, J1
TP21
TP20
TP17
TP1
TP19
TP18
Reset, S1
W2
W1
Run/ Fail, CR1
TP25
TP24
TP23
TP22
P2
Piezo Control, J3
Figure 6-13 Servo CPU (CPU2) Board, P/N 08002-4238-000-xx, Major Components
6-32
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
6.4.2.2
Servo Preamplifier Board, P/N 08002-4344-000-xx
Major functions of the Servo Preamplifier circuit board assembly are
described in Table Table 6-3. The table also defines test points. There are
no controls or indicators on the preamplifier board. See Figure 6-12 for the
Servo Preamplifier board location in the card rack assembly.
Table 6-3 Servo Preamp Board
Functions
Controls/Indicators
For MEFO Optional Kit
Filters current feedbacks for the X, Y and Z only
axes.
Connector J4 - connects
via coaxial cable to front
Contact detection cirof movable EFO Wand
cuitry detects surface
board, where it carries
contact.
the hall effect signal.
Also used in the Z servo
axis to provide:
• an interface between
CPU2 and the Z axis
power amplifier.
• electrical damping of
the Z Prime axis resonances.
Test Points
TP1 Digital GND
TP2 TP3 TP4 XCUR1/ Z force
TP5 YCUR1/ MEFO
TP6 ERRY*see note
TP7 ERRX*see note
TP8 YSIN2
TP9 YCOS2
TP10 FFT
TP11 ZCUR1
TP12 XSIN1
TP13 XCOS1
TP14 ZCUR2
TP15 COS3
TP16 SIN3
TP17 ERRZ*see note
TP18 Digital GND
Reference
Figure 6-12,
Figure 6-14
Maxµm Ultra Electrical Documents
NOTE: ERRY/ ERRX/ ERRZ means Or’ed quadrature and interpolation faults. It
is useful in determining faults in the encoder.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-33
Maxµm Ultra Ball Bonder
Section 6: XY Table
TP18
P1
W9 W8 W7 W6
TP1
W5
J2
J3
W2 W3 W4
P2
J4
Figure 6-14 XY Servo Preamplifier Board, P/N 08002-4344-000-xx, Major Components
6.4.2.3
6-34
Servo Power Amplifier Board, P/N 08002-4105-000-xx
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
6.4.2.4
X and Y Servo Power Amplifier Board, P/N 08002-4105-000-xx
Two (2) identical power amplifier circuit board assemblies are part of the
XY table servo system, one for each axis of motion. Table 6-4 describes
the power amplifier assembly major functions, controls/indicators, and test
points.
Table 6-4 X and Y Servo Power Amplifier Board
Functions
Controls/Indicators
Amplifies the motor drive
signal from the Servo CPU
board to drive one of the
linear voice coil motors.
STATUS LED Indicator
Indicates power amplifier
status as follows:
Green - amplifier status is
good.
Has over-voltage, short cirRed - there is a fault condicuit, over-current, and
tion or the amplifier is not
overheating protections.
Axis is shut down if any of enabled.
these conditions is
detected.
Test Points
OFFSET
Not Used
PGND
Signal Ground
Reference
Figure 6-12,
Figure 6-15,
Figure 6-16
Maxµm Ultra Electrical Documents
CUR. MON.
Current Monitor
CUR. REF.
Current Reference
FFT
Fast Fourier Transform
STATUS
Indicator
PGND
CUR. MON.
CUR. REF.
FFT
Figure 6-15 XY Servo Power Amplifier Board, P/N 08002-4105-000-xx, Major Components
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-35
Maxµm Ultra Ball Bonder
Current
Reference
7.5V Max.
+REF IN
-
Ref. In Gain
+
-REF IN
-
U3
-
U1
U4
Current
Limit
+
+
+5V
Offset
Signal Ground
+5V 5mA Output
-5V
-5V 5mA Output
FFT
INH
INH+5V
+5V
INH+
+5V
BRAKE
+5V
Current Loop
Gain
High Voltage
Integrator
Power Ground
SW2
MOTOR +
-
PWM
+
Control
Logic
MOSFET
Drive
MOTOR -
U5
Current
Sense
+
Current Feedback
Current Monitor
Figure 6-16 XY Servo Power Amplifier Board, P/N 08002-4105-000-xx, Block Diagram
6-36
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section 6: XY Table
6.4.3
XY Table Wiring Diagram
XY servo system cables and connections are shown in Figure 6-17.
Figure 6-17 XY Table Wiring Diagram
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
6-37
Maxµm Ultra Ball Bonder
6-38
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Appendix A: Calibration
A Calibration
This section will guide the user through a series of machine calibrations
that are to be performed before bonding can take place. During an initial
start-up, a sequence is recommended for a thorough step-by-step calibration of the entire machine. Subsequently, individual calibrations can be
carried out.
Here is what you will find:
•
Section A.1 Introduction
•
Section A.2 Calibration Sequence
•
Section A.3 Servo
•
Section A.4 Pattern Recognition System (PRS)
•
Section A.5 Bond Head Calibrations
•
Section A.6 Workholder
•
Section A.7 Magazine Handler
•
Section A.8 Incomplete Calibration
•
Section A.9 XY Table Characterization
•
Section A.10 Gap Sensor
•
Section A.11 Process Program Portability Factors
A.1 Introduction
Calibration ensures that various bonder components function within specification and that the bonder is optimized for indexing and bonding. Calibration results are machine dependent parameters (MDPs) and cannot be
transferred from one bonder to another.
A properly installed bond tool (capillary) is required for performing many of
the calibration routines. The machine is shipped with a standard capillary
installed in the bond head. However, this capillary may not be appropriate
for all applications. If capillary replacement is required, refer to the directions supplied in Section 3, Bond Tool Replacement. A brief overview of
each item in the calibration menu (see Figure A-1) is presented below.
Figure A-1 Calibration Menu
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
A-1
Maxµm Ultra Ball Bonder
SERVO: Calibrates the X, Y axes of the XY table and Z axis of the Bond
Head motor. It also calibrates the X and Y axes of the table to compensate
for heat related expansion.
PRS: Calibrates the Pattern Recognition System. It determines the degree
of magnification and linearity of the optical system. The user or technician
corrects any errors such as camera rotation for linearity.
BOND HEAD: Calibrates all aspects of the Bond Head and incorporates a
step by step procedure to guide the user or technician through the entire
capillary change and related procedures.
WORKHOLDER: Calibrates all functions of the workholder. Included are
clamp positions, rail positions and sensors, indexer positions and sensors,
leadframe X position sensor, leadframe jam detect software, and tucker
eject software sensor.
MAG HANDLER: Calibrates the trays and slots of the input and output mag-
azine handlers. The calibrations set the positioning limits of the magazine
handlers relative to the workholder. Also set are the locations of each set
of trays used in loading and unloading magazines.
INCOMPLETE CALIBRATIONS: Provides a list of all of the calibrations that
have not been completed or not performed at all.
XY TABLE CHARACTERIZATION: Calibrates the X and Y offsets as a function of table position and then use the data to translate ideal coordinates
to the closest encoder count. This feature will calculate alignment and
bond locations based on a perfectly orthogonal XY plane.
GAP SENSOR: The Displacement Gap Sensor Premium Kit (DGSPK) was
introduced to improve machine parameter portability by determining the
USG personality factors based upon the capillary displacement measurements in a free air condition.
A-2
98868-0000-002-02
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Appendix A: Calibration
A.2 Calibration Sequence
Figure A-1 shows a typical calibration sequence. Any individual calibration
may be performed without doing the entire sequence. A thorough initial
calibration should be done at machine set up.
START
Workholder
Calibrations....
Temperature
Configuration
> Rails
(See NOTE)
> Clamp
> Indexer
> X Sensor
> Tucker Eject
> Grippers
Servo Tune
> RailsZ
PRS
Mag Handler
Calibrations....
Crosshair Offset
> Input Trays
> Output Trays
Bond Force
> Input Slot
> Output Slot
USG
XY Table Characterization
EFO Height
DONE
NOTE:
Temperature settings
are done in CONFIGURE mode.
Refer to Section 5 of this manual.
Figure A-1 Calibration Sequence
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A-3
Maxµm Ultra Ball Bonder
A.3 Servo
Servo calibrations allow the user to adjust, or tune the servo gains of the
X, Y, and Z axes. All movement of the bond head is based on these values. Therefore, these calibrations must be done prior to other calibrations
which use bond head movement as part of their procedure. The Servo
calibration menu is accessed by selecting [1] SERVO from the Calibration
menu. Once this is done, the desired calibration routine can be selected.
Figure A-2 shows the choices that reside in the Servo menu.
Figure A-2 Servo Calibration Menu
A.3.1
Tune X Axis
This calibration automatically adjusts the servo gain of the X axis. The calibration completes all necessary steps once started by the operator. The
only option is at the end of calibration, the results may be saved or
rejected.
A.3.2
Tune Y Axis
This calibration automatically adjusts the servo gain of the Y axis. The calibration completes all necessary steps once started by the operator. The
only option is at the end of calibration, the results may be saved or
rejected.
A.3.3
Tune Z Axis
This calibration automatically adjusts the servo gain of the Z axis. The calibration completes all necessary steps once started by the operator. The
only option is at the end of calibration, the results may be saved or
rejected.
A.3.4
Tuned Servo Parameters
Selecting [5] TUNED SERVO PARAMETERS from the Servo menu displays
the Tuned Servo Parameters dialog box. Repeatedly clicking on [1] SERVO
AXIS in the Tuned Servo Parameters dialog box causes the parameter display to toggle between the X, Y and Z axis servo parameters. The X axis
parameters are shown in Figure A-3. The parameters are for display purposes only and cannot be changed by the user.
Figure A-3 Tuned Servo Parameters Dialog Box
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Appendix A: Calibration
A.4
Pattern Recognition System (PRS)
PRS calibration establishes the relationship between the number of pixels
of video image and the actual physical distance represented. PRS calibration is done by using the ‘Calibrate Eye Point Values’ dialog box. The ‘Calibrate Eye Point Values’ dialog box is accessed by selecting PRS from the
Calibration menu (see Figure A-4). Some enhancements in the dialog box
include the following:
•
“Switch Magnification” selection to change the active magnification.
During the calibration, the High/Low magnification toggle button on the
monitor screen is disabled.
•
Both sets of active calibration values (High Mag/Low Mag)
•
PRS calibration algorithm selection (Die or Lead)
Figure A-4 Calibrate Eye Point Values Dialog Box
The PRS calibration data is used in PRS/VLL displacement calculations.
Unless it is successfully accomplished, eye points cannot be taught. Poor
PRS calibration may result in poor bond placement. Bonds may shift randomly from device to device. On a single device, bonds will shift as a
group, especially bonds closest to the problem eye point.
A.4.1
PRS Calibration Setup
NOTE: PRS calibration requires a consistent, reliable and identifiable object to
view. For example, die eye points or lead eye points. Therefore, a production device must be present at the bond site.
A.4.1.1
Selecting the Eye Point
A. Ensure that a production device is clamped at the bond site with the
vacuum on. Ensure that the live video is displayed in the monitor’s
large display window and that the diffuser is set to 10 psi (.70 kg/cm2)
B. Click on CALIBRATION at the mode bar, then select PRS from the menu.
C. Move the PRS Teach Window to a good eye point location using the
mouse button [B2] (refer to Appendix C, Guidelines for Eye Point
Selection.
D. Set the PRS calibration parameters (see paragraph A.4.1.2).
A.4.1.2
Setting PRS Parameters
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A-5
Maxµm Ultra Ball Bonder
ALGORITHM: Set ALGORITHM to DIE or LEAD as required. Typically, PRS
calibration is performed on a die image with sharp and crisp edges. However, some devices may contain features that are less sharp and look like
lead eye points (example: a scene containing discrete components such
as capacitors or diodes). If the user is forced to perform the PRS calibration on this type of scene, the LEAD algorithm should be used. The subsequent calibration results will not be affected by the choice of the algorithm.
MAGNIFICATION: Set MAGNIFICATION to High (6x) or Low (2x) magnification. Perform the PRS calibration for both high and low magnification. During PRS calibration, the High/Low magnification button on the monitor
screen is disabled.
WINDOW SIZE: The ‘Calibrate Eye Point Values’ dialog box allows the
user to adjust the size of the PRS Teach window. The teach window is a
green rectangular box centered on the cross hair. The window sets the
search limits relative to the eye point pattern. Set the window dimensions
by selecting VERTICAL and/or HORIZONTAL from the ‘Calibrate Eye Point
Values’ dialog box. Working in the data entry field, enter the desired value
for the selected dimension, then press [ENTER].
ILLUMINATION: Select function button F10. This causes the ‘Lighting’ dialog box to appear. Working in the dialog box, adjust the illumination for
high contrast. Sharp contrast at edges is desirable. A higher vertical illumination level is recommended when teaching eye points on the die. A
higher oblique illumination level is recommended when teaching eye
points on the leads.
A.4.1.3
Related Operations
CROSSHAIR OFFSET
Accesses the dialog box used to correct crosshair offset.
This subject is covered in detail later in this section in paragraph A.5.1.
CLAMP UTILITIES Accesses a dialog box which allows the user to force clamp
operations. These may be required during the PRS calibration procedure
to reposition the viewed device.
LEADFRAME PARAMETERS Selecting the EDIT PARAMETERS item displays the ‘L/
F Parameters’ dialog box which allows the user to adjust any leadframe
parameters. Refer to Volume 1, Section 5, paragraph 5.7.1.2 for additional information on parameters contained in the ‘L/F Parameters’ dialog
box.
A.4.2
Performing the PRS Calibration
Adjust the eye point parameters for the best illumination, viewing and
magnification (see Calibration Setup, paragraph 4.4.1). Press mouse button [B1] to start the calibration. If the PRS calibration is successful, the calibration results are saved automatically and the “Calibrate Eye Point
Values” dialog box is updated with the current PRS information.
NOTE: When the calibration completes successfully for one magnification setting, perform the PRS calibration for the other magnification setting (i.e.,
High or Low).
If the calibration does not complete correctly, The user is prompted with
an “unsuccessful calibration” message. These messages are as follows:
•
Eye Point Teach Process Was Unsuccessful
•
Not Enough Edges
•
Pattern Not Unique
In most cases, the user can correct the cause of the failure by repositioning the teach window over the eye point target, sizing the window and/or
altering the lighting combination. An unsuccessful PRS calibration may
also be caused by the optics hardware being out of adjustment. If this is
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Appendix A: Calibration
the case, a ‘PRS Calibration Failed’ prompt appears similar to the one
shown in Figure A-5. The prompt displays pixels to axis pulse ratios.
Figure A-5 Unsuccessful Calibration Results Prompt
Any pixels to axis pulse ratio values (see Figure A-6) that are out of range
indicate that an adjustment to the optics magnification and/or camera
rotation may be required. “x per y” and “y per x” values that do not fall
within range may require a camera rotation adjustment. “x per x” and “y
per y” values that do not fall within range may require a magnification
adjustment. Refer to Volume 2, Maintenance Manual, Section 4 for
detailed information on these adjustments.
Figure A-6 Pixels to Axis Pulse Ratios
A.5 Bond Head Calibrations
The bond head calibrations allow the user to set all aspects of bond head
operation except those related to motion (motion related calibrations are
done in the SERVO calibration function).
Capillary change sequence is also incorporated into this menu even
though it is not a calibration. Placing the operation here guarantees that
the necessary calibrations are done as part of a properly performed capillary change.
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A-7
Maxµm Ultra Ball Bonder
Figure A-7 Bond Head Calibration Menu
A.5.1
Crosshair Offset
There are two methods of crosshair correction, manual or automatic. This
section covers the manual Crosshair Offset calibration. The configuration
of Auto Crosshair Correction is done in CONFIGURE mode and is covered in detail in Volume 1, Section 5, paragraph 5.2.7.
The manual Crosshair Offset calibration compensates for the X axis and Y
axis displacement between the target viewed through the optics and the
actual position where the bond tool tip touches the work. This offset can
occur as a result of one or more of the following: replacing the capillary;
adjusting the optics; a change in device thickness; or adjustments made
to the bond head. Once this offset is measured and corrected, the capillary will contact the exact point targeted by the electronic crosshair.
A.5.1.1
Setting Calibration Conditions
The ‘Crosshair Offset Calib’ dialog box is accessed by selecting [1]
CROSSHAIR OFFSET from the ‘Bond Head’ menu (see Figure A-8). The
‘Crosshair Offset Calib’ dialog box contains a high/Low magnification
selection and a display showing both sets of active crosshair offset values. The delta between the low magnification offset and the high magnification offset is also displayed.
The main calibration dialog box allows a full range of options to be
selected and set. The following defines each option.
•
CURRENT CROSSHAIR OFFSET: Displays the current crosshair offset
values for the X and Y axes for both magnification optics (high [6x] &
low [2x]). The delta between the low magnification offset and the high
magnification offset is also displayed.
•
BALL SIGNATURE: Displays Taught or NOT Taught. If taught, the
crosshair offset calibration will use the ball finder option which is set in
Ball Find Configure to locate the position of the ball and its results will
be used to determine the crosshair offset. If not taught, crosshair offset
calibration will be done using the tool mark option.
•
MODE: Setting Mode to Live Cycle causes the software to perform a
bond cycle with ball formation. Setting Mode to Dry Cycle causes the
software to perform a bond cycle without forming a ball but creates a
tool mark on the work surface.
*See Note
Figure A-8 Crosshair Offset Calibration Dialog Box
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Appendix A: Calibration
NOTE: If existing Crosshair Offset calibration data were found, a dialog will
appear for the user to select either to calibrate High magnification only
or high and low magnification. The high magnification only selection
uses previously calibrated offset values between the 2 cameras so that
the user need not re-teach the low magnification offset again. This
option is only applicable for capillary and package changes.
•
PRS ASSISTANCE: When set to On, the Pattern Recognition System
assists in locating the target. When set to Off, the Pattern Recognition
System does not assist in locating the target. The PRS Assistance
item is not active (grayed) when Mode is set to Dry Cycle.
•
ALIGNMENT BOX SIZE: This parameter may be displayed in English or
Metric units as set in System Configuration (see Section 5, Configuration). When Mode is set to Live Cycle and PRS Assistance is set to
On, ball diameter size is displayed. If PRS Assistance is set to Off,
alignment box size is displayed. When Mode is set to Dry Cycle, alignment box size is always displayed.
•
MAGNIFICATION: Set MAGNIFICATION to High or Low magnification as
required (if configured). Perform the crosshair offset calibration for
both high and low magnification. During the calibration, the High/Low
magnification button on the monitor screen is disabled.
•
A.5.1.2
CLAMP UTILITIES: Accesses the dialog box which allows the operator
to force clamp operations. These may be required during the PRS calibration procedure to reposition the viewed device.
Calibration Procedure
NOTE: Since the magnitude of crosshair offset is not known, the location targeted by the crosshair may not be where the tip touches the die. Activate Z Chess on the upper function buttons and lower the capillary to
contact the work surface. Identify this location using the microscope.
This method simplifies the search for the tool mark since its general
location is identified.
Required Material:
Production device
PROCEDURE:
A. Ensure that a production device is clamped at the bond site with the
vacuum on and the live video is displayed in the monitor’s large display
window.
B. If required, press [F10] and adjust the illumination on the device. Select
DONE when finished.
C. Click on CALIBRATION at the mode bar. The Calibration menu appears.
D. Press [3]. The Bond Head menu appears.
E. From the Bond Head menu, select [1] CROSSHAIR OFFSET . The
‘Crosshair Offset Calibration’ dialog box appears (see Figure A-8).
F. Working in the ‘Crosshair Offset Calibration’ dialog box, set MODE to
‘Dry Cycle’. Set MAGNIFICATION to ‘High’.
G. Using the mouse and button [B2], position the crosshair over a clear
area on the die (see Figure A-9).
H. Press [B1] to make a tool mark on the die (see Figure A-9).
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All Rights Reserved
A-9
Maxµm Ultra Ball Bonder
I. Using the mouse and button [B2], position the crosshair so that it is
centered on the tool mark. Magnify the video image by pressing [F2] (Z
Video) to ensure that the crosshair is truly centered on the tool mark.
J. Press [B3] to perform the calibration. The offset is measured, applied
to the vision system, and stored to disk.
K. Set MAGNIFICATION to ‘Low’, then repeat steps G. through J..
When offset calibration is completed the decision box shown in Figure A10 appears on the monitor. It displays: the resulting X and Y offset values;
the X and Y placement of the tool mark; and the X and Y position of
crosshair during X-Y positioning. The operator is directed to select OK to
save the calibration or CANCEL to discard it and repeat the procedure.
Tool Mark
Position capillary
above die
Press B1 to
make tool mark
Position crosshair
and press B3
Figure A-9 Manual Crosshair Offset Calibration Sequence
Figure A-10 Crosshair Offset Calibration Decision Box
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Appendix A: Calibration
A.5.2
EFO (Electronic Flame Off) Height
EFO Height calibration establishes the proper distance between the capillary tip and the EFO wand allowing proper ball formation. The height of
the wand is established in distance (mils or mm) of the bond head Z axis
travel. Calibration is required after capillary or wand replacement. Selecting [2] EFO HEIGHT from the Bond Head menu displays the EFO Height
dialog box (see Figure A-11).
Figure A-11 EFO Height Dialog Box
NOTE: Item [3] CHANGE EFO CURRENT OFFSET is a password protected feature
that allows the user to program a compensation value (portability factor)
for the EFO Current Offset. For more information on this feature, refer to
Process Program Portability Factors, paragraph A.11.
A.5.2.1
Calibration Procedure
PROCEDURE:
A. Click on CALIBRATION at the mode bar. The Calibration menu appears.
B. Press [3]. The Bond Head menu appears.
C. Select [2] EFO HEIGHT from the Bond Head menu. The ‘EFO Height’
dialog box appears (see Figure A-11).
D. Select the Z CHESS button from the tool bar. This allows the use of the
Up/Down arrow keys on the MMI to pulse the Z Axis motor up and
down. The user is made known of this by instructions that appear in
the information box on the monitor screen (see Figure A-12).
Figure A-12 Turn On Z Chessing Instructions
E. Using the Up/Down arrow keys, chess the Z axis so that the wand
height is between 260 mils and 280 mils. While chessing the Z axis,
the user should monitor the Z Axis position indicator until the desired
value is obtained. The Z Axis position indicator is located in the upper
right corner of the monitor screen. If, during the Z axis height adjustment, the Z axis position is not within the proper range, instructions
appear in the information box similar to those shown in Figure A-13.
Z axis height
not in range
Figure A-13 Set Correct Wand Height Instructions
Volume 2: Maintenance
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All Rights Reserved
A-11
Maxµm Ultra Ball Bonder
NOTE: The acceptable range for the EFO wand height is 260 to 280 mils (6604
to 7112 µm) with 270 mils (6858 µm) being the ideal value. A prompt
appears in the information box alerting the user that the range has been
exceeded in either the positive or negative direction. If this range cannot
be obtained, CANCEL the calibration and adjust the EFO wand position
(see ATX2 Maintenance Manual, Section 5), then repeat the calibration.
F. When the Z Axis position indicator displays the desired value, click on
[1] ACCEPT to retain the data or [2] CANCEL to not retain the data.
A.5.2.2
Procedures for Moveable EFO Wand Application
A. Select menu command [5] CALIBRATION at the mode bar. The Calibration menu appears.
B. Select [3] BOND HEAD. The bond head menu appears.
C. Select [2] EFO from the bond head menu. The ‘EFO Calibration’ dialog
box appears.
D. Change [5] WAND STATE TO MOVING.
E. Select the Z/D CHESS button from the function bar. This allows the use
of the Up/Down buttons to move the bond head up and dpwn (Z axis)
and the Left/Right buttons on the MMI to move the MEFO Wand in and
out (D axis).
F. Chess the bond head up and down using arrow keys on the MMI until
the relative position between the capillary and MEFO tip can be clearly
observed.
G. Chess the MEFO wand away from the capillary using the arrow keys
on the MMI until the MEFO wand tip totally clears the capillary circumferences, then click [3] SET CLEAR POSITION to save this setting.
H. Chess the MEFO wand towards the capillary using the arrow keys on
the MMI until the MEFO tip is right below the capillary tip, then click [2]
SET UNDER POSITION to save this setting.
I. Set WAND POSITION to UNDER TOOL
J. Chess the bond head downward until the capillary tip just touched the
MEFO wand tip. Then click [1] SET EFO HEIGHTN
NOTE: The optimal EFO height is 260 to 280 mil.
A.5.2.3
K.
De-select the Z/D CHESS button from the function bar.
L.
Click DONE to exit.
Procedures for Fixed Wand Application
A. Select menu command [5] CALIBRATION at the mode bar. The Calibration menu appears.
B. Select [3] BOND HEAD. The bond head menu appears.
C. Select [2] EFO from the bond head menu. The ‘EFO Calibration’ dialog
box appears.
D. Change [5] WAND STATE to FIXED.
E. Select the Z/D CHESS button from the function bar. This allows the use
of the Up/Down buttons to move the bond head up and dpwn (Z axis)
and the Left/Right buttons on the MMI to move the MEFO Wand in and
out (D axis).
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Appendix A: Calibration
F. Chess the bond head up and down using arrow keys on the MMI until
the relative position between the capillary and MEFO tip can be clearly
observed.
G. Chess the MEFO wand towards the capillary using the arrow keys on
the MMI until the MEFO wand tip totally clears the capillary circumferences, then click [3] SET CLEAR POSITION to save this setting.
H. Chess the MEFO wand towards the capillary using the arrow keys on
the MMI until the MEFO tip is in line with the capillary tip, then click [2]
SET FIXED POSITION to save this setting.
I. Set WAND POSITION to FIXED TOOL
J. Adjust MEFO wand Theta and Y axes (refer to Maxµm Ultra Volume 2:
Maintenance, Section 6.4.2.2). Push down on the bond head manually
to ensure that the gap between the MEFO wand tip and the capillary
circumference is less than 5 mil (0.12 mm).
K. Chess the bond head downward until the capillary tip is at the same
height as the MEFO wand tip. Click [1] SET EFO HEIGHT
NOTE: The optimal EFO height is 260 to 280 mil.
L. De-select the Z/D CHESS button from the function bar.
M. Click DONE to exit.
A.5.3
Z Axis Adjustments
Z Axis adjustments allows the operator or technician to establish proper Z
Axis function of the bond head. Selecting [3]Z AXIS ADJUSTMENTS from the
Bond Head menu displays the Z Axis Adjustments menu (see Figure A14).
Figure A-14 Z Axis Adjustments Menu
NOTE: Selection [3] LOOP HEIGHT FACTOR/OFFSET is a password protected feature that allows the user to program a compensation value (portability
factor) for the Loop Height Scaling Factor and Loop Height Offset. Portability factors are part of the machine dependent parameters (MDPs). It
is the responsibility of the customer to manually calibrate the portability
factors such that the same process program can be used for different
machines to achieve the same process performance. For more information on this feature, refer to Process Program Portability Factors, paragraph A.11.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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A-13
Maxµm Ultra Ball Bonder
A.5.3.1
Transducer Alignment
NOTE: Transducer Alignment is an involved technical procedure and should be
done on an as needed basis by qualified trained personnel only.
This mechanical calibration assures that the capillary is perpendicular to
the work surface during bonding.
The bond plane for the Maxµm Ultra is fixed and the workholder rails must
be raised or lowered to match the bond plane depending on the thickness
of the device.
The Transducer Alignment calibration takes the user through a sequence
of dialog boxes containing instructions along with a concurrent explanation of what is happening in the MHS software. The sequence continues
until complete or aborted. If an errors occurs during the sequence, it will
abort and a pop-up error message appears indicating why the sequence
aborted.
A.5.3.1.1
Calibration Procedure
TOOLS/GAUGES:
•
Hand tools
•
Torque driver, 35 oz. in. (0.25 Nm)
•
Perpendicularity Set-Up Gauge, P/N 08088-0901-014-00
•
Bond force calibration weight assembly, P/N 08858-0901-020-xx
•
MJT Shoulder Screw, P/N 08828-0901-007-xx
•
2 mil (.05 mm) thick shim
PROCEDURE:
A. Click on CALIBRATION at the mode bar. The Calibration menu appears.
B. Press [3]. The Bond Head menu appears.
C. C. Press [3]. The ‘Z Axis Adjustments’ menu appears (see Figure A14).
D. D. Select [1] TRANSDUCER ALIGNMENT from the menu. The instruction
dialog box for Step 1 appears (see Figure A-15).
E. E. Select [1] START from the ‘Step 1’ dialog box. This causes all material to be ejected from the workholder. The puller and indexer are
moved to their parked position. Wait until all motions have stopped
before continuing with the next step.
Figure A-15 Transducer Alignment: Step 1 Instructions
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Appendix A: Calibration
WARNING: HEATED SURFACES MAY EXIST DURING NEXT STEP! DO NOT
TOUCH THE CLAMP INSERT WITH UNPROTECTED HANDS. WHEN
REMOVING OR MOUNTING THE CLAMP INSERT, INSTALL TWO
SCREWS IN THE INSERT AND GRASP THE SCREWS WITH PLIERS.
THERE ARE TWO M4 TAPPED HOLES IN THE CLAMP INSERT FOR
THIS PURPOSE.
F. Remove the clamp insert.
G. Install the heat block. The heat block cavity must be small enough so
that the 4 feet of the perpendicularity gauge straddle the heat block
cavity.
H. Select [2] CONTINUE from the ‘Step 1’ dialog box. The bond head is
centered above the heat block. Then, the heat block is brought to its
last calibrated bond plane position. The ‘Step 2’ dialog box appears
(see Figure A-16).
Figure A-16 Transducer Alignment: Step 2 Instructions
I. Remove the EFO wand by loosening the Z-axis lock screw that
secures the wand to the bond head. Remove the EFO wand and set
aside. Carefully chess the bond head so that the transducer is positioned over the center of the heat block.
J. Select [2] CONTINUE from the ‘Step 2’ dialog box. This causes ‘force’ to
be removed from the Z axis servo. Heat block chessing is also
enabled. The ‘Step 3’ dialog box appears (see Figure A-17).
Figure A-17 Transducer Alignment: Step 3 Instructions
K. Remove the capillary from the transducer.
L. Adjust side-to-side perpendicularity:
1. Install the perpendicularity gauge on the heat block. Orientate the
gauge so that the two touch pads (A and B) are positioned as
shown in Figure A-18. Ensure that the gauge is centered over the
cavity and that the feet on the gauge do not fall into the cavity but
are all seated on the heat block surface. For ease of positioning,
the up/down arrow keys on the MMI can be used to raise or lower
the heat block.
Volume 2: Maintenance
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All Rights Reserved
A-15
Maxµm Ultra Ball Bonder
Figure A-18 Gauge Positioning, (Top View)
CAUTION: To prevent dropping the transducer mounting hardware into the
workholder during the next step, move the bond head to a front, center position or install a drop cloth over the workholder.
2. Remove the mounting screw and washer from the left side of the
transducer. Install the shoulder screw (supplied with gauge) and
tighten 1 to 2 turns.
NOTE: If the transducer mounting tabs are touching the mounting screws at the
end of the alignment, there could be a negative effect on the performance of the ultrasonics. The shoulder screw centers the left mounting
tab of the transducer. This prevents the transducer from resting against
the mounting screws when the alignment is complete.
3. Loosen the right transducer mounting screw 1/4 turn ensuring that
the transducer is now free to move. Tighten the shoulder screw
until it seats, then back it off 1/4 turn. Ensure that the transducer is
free to rotate around the shoulder screw.
4. Carefully chess the bond head to the center position of the heat
block. Align the bottom surface of the transducer mounting tabs
over the perpendicularity gauge on the heat block (see Figure A19). Adjust the position so that when the transducer is pressed
down, the transducer mounting tabs rest on the two touch pads of
the perpendicularity gauge.
Figure A-19 Gauge Positioning, Side-to-Side Perpendicularity (Top View)
NOTE: At this point, ensure that the bond head link is not resting on the perpendicularity gauge. Center the gauge so that all of its feet are on the heat
block surface. Ensure that the transducer mounting tabs are centered
and resting on the two touch pads of the gauge.
5. Hold the transducer flat on the gauge. Use a metric ball driver or
the tip of a screwdriver to apply light pressure to the top side of the
transducer mounting tabs. Tighten the transducer mounting screws
lightly (alternately) and ensure that the transducer mounting tabs
remain flat on the gauge.
6. Place the bond force calibration weight (P/N 08858-0901-020-xx)
onto the bond head link so that a steady force is applied to the Z
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Appendix A: Calibration
axis. Install the calibration weight according to instructions illustrated in Figure A-26.
NOTE: During this calibration, the Z Axis position display, located at the top right
corner of the monitor screen, will not display engineering units. The display will represent actual Z Axis encoder pulses. This display should be
referred to when the user is instructed to record the ‘Z encoder value’ (Zcount).
7. Carefully lift the bond head and place a flat, 2 mil (.05 mm) shim
between the left transducer mounting tab and the touch pad of the
perpendicularity gauge. Be careful not to position the shim beyond
the mounting tab and under the bond head link. This can bias and
affect the reading. Allow the weight of the bond head to rest on the
shim. Do not press down on the gauge.
8. Record the Z encoder value (Z-count) for the left side.
9. Carefully lift the bond head and place a flat, 2 mil (.05 mm) shim
between the right transducer mounting tab and the touch pad of the
perpendicularity gauge. Be careful not to position the shim beyond
the mounting tab and under the bond head link. This can bias and
affect the reading. Allow the weight of the bond head to rest on the
shim. Do not press down on the gauge.
10.Record the Z encoder value (Z-count) for the right side.
11. Calculate the difference between the two sides. The difference
should be 0 (zero) ±40 Z-counts (0 ±1 mil, 0 ±.02mm). If the difference is greater than ±40, perform one of the following:
•
If the highest count is on the right side, rotate the transducer
counterclockwise, then record the new Z-count values by
repeating the steps above.
•
If the highest count is on the left side, rotate the transducer
clockwise, then record the new Z-count values by repeating the
steps above.
12.When the difference is within 0 ±40, remove the shoulder screw
from the transducer mount and replace it with the original mounting
screw and washer. Torque each screw in alternating sequence and
in steps of 10 oz. in., to a final torque value of 35 oz. in. (0.25 Nm).
Remove the bond force calibration weight and the perpendicularity
gauge. Remove all shims from the bond head area.
13.Select [1] CONTINUE from the ‘Step 3’ dialog box. The ‘Step 4’ dialog
box appears (see Figure A-20).
Figure A-20 Transducer Alignment: Step 4 Instructions
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Maxµm Ultra Ball Bonder
M. Adjust front-to-back perpendicularity:
1. Install the perpendicularity gauge on the heat block so that touch
pads ‘A’ and ‘B’ are perpendicular to the rails (see Figure A-21).
Figure A-21 Gauge Positioning, Front to Back Perpendicularity (Top View)
2. Position the bond head so that the bottom, flat surface of the transducer, i.e., the area between the capillary mounting hole and the
crystals, rest on pads A and B of the perpendicularity gauge.
Ensure that the feet on the gauge do not fall into the heat block cavity but are all seated on the heat block surface. Ensure that the rear
touch pad of the gauge is not touching the transducer crystals.
3. Place the bond force calibration weight (P/N 08858-0901-020-xx)
onto the bond head so that a steady force is applied to the Z axis.
4. Carefully lift the bond head and place a 2 mil (.05 mm) shim
between the transducer and the rear touch pad of the perpendicularity gauge, ensuring that all four feet of the gauge are touching
the heat block surface. Allow the weight of the bond head to rest on
the shim. Do not press down on the gauge.
5. Chess the heat block up or down until the shim can be removed
with just a slight friction opposing its movement. When the heat
block is at the correct height, insert the shim again and record the
rear Z encoder value (Z-count).
6. Carefully lift the bond head and place a 2 mil (.05 mm) shim
between the transducer and the front touch pad of the perpendicularity gauge, ensuring that all four feet of the gauge are touching
the heat block surface. Allow the weight of the bond head to rest on
the shim. Do not press down on the gauge.
7. Chess the heat block up or down until the shim can be removed
with just a slight friction opposing its movement. When the heat
block is at the correct height, insert the shim again and record the
front Z encoder value (Z-count). Remove the shim.
NOTE: As a final test, repeat the procedure for the front and back, ensuring that
there is a slight friction when removing the shim from between the front
and back pads on the gauge and the transducer. Record the Z-count
values each time.
8. Calculate the difference of the Z-count between the front and back.
The difference should be 0 (zero) ±40 Z-counts). If the difference is
greater than ± 40 Z-counts, repeat the steps 4. through 8..
9. When the heat block is within specification and with the transducer
being pressed against the gauge by the calibration weight, select
[1] CONTINUE from the ‘Step 4’ dialog box. This causes the software
to disable heat block chessing and sets the bond plane Z servo reference (zeros it) to the current Z encoder position. This value is
stored by the software for future reference. The ‘Step 5’ dialog box
appears (see Figure A-22).
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Appendix A: Calibration
Figure A-22 Transducer Alignment: Step 5 Instructions
N. Remove the perpendicularity gauge and calibration weight. Install the
capillary, EFO wand and clamp insert, then select [1] CONTINUE. The Z
servo is enabled and the bond head is raised to a safety position. This
completes the calibration sequence.
O. Perform the following adjustments/calibrations:
A.5.3.2
•
Rail height (refer to paragraph A.6.6)
•
Clamp (refer to paragraph A.6.2)
•
EFO height (refer to paragraph A.5.2).
•
Crosshair offset (refer to paragraph A.5.1)
Set Z Reset
Selecting [2] SET Z RESET from the ‘Z Axis Adjustments’ menu causes the
Maxµm Ultra to automatically measure and calculate the Z reset position
relative to the home and bond plane positions. This calculation is done
during normal machine power up. It is possible that the data may become
lost or corrupted during operation. This automated calibration allows the
user to initiate a correction.
A.5.4
Bond Force Calibration
Bond Force Calibration measures the amount of electrical current
required to move the bond head in the air and the amount of electrical current required to apply 50 grams of force, thus standardizing bond force.
Screen information displays the current required for 0 grams (movement
in air), the current required for 50 grams of bond force, and the scale factor. The operator may then choose to perform a calibration or quit the
bond force calibration functions without performing either. The bond force
calibration weight assembly (P/N 08858-0901-020-xx) is required for this
calibration.
The Bond Force Calibration dialog box appears when [4] BOND FORCE is
selected from the ‘Bond Head’ menu (see Figure A-23). The results of the
last calibration are displayed along with the selection choices of: [1] CALIBRATE, [2] VERIFY and [3] CHANGE BOND FORCE OFFSET . To perform cali-
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Maxµm Ultra Ball Bonder
bration the user selects [1] CALIBRATE and follows the on-screen
instructions.
NOTE: Selection [3] CHANGE BOND FORCE OFFSET is a password protected feature that allows the user to program a compensation value (portability
factor) for the Bond Force Offset. Portability factors are part of the
machine dependent parameters (MDPs). It is the responsibility of the
customer to manually calibrate the portability factors such that the same
process program can be used for different machines to achieve the
same process performance. For more information on this feature, refer
to Process Program Portability Factors, paragraph 4.11.
NOTE: The following dialog boxes are examples. Values shown in the dialog
boxes may not be true calibration results.
Figure A-23 Bond Force Calibration and Results Dialog Box
WARNING: HEATED SURFACES! DO NOT TOUCH THE HEATBLOCK INSERT,
CLAMP PLATE, OR OTHER WORKHOLDER PARTS WITH UNPROTECTED HANDS.
A.5.4.1
Calibration Procedure
REQUIRED TOOLS/MATERIAL:
•
Torque wrench, 35 oz. in. (0.25 Nm)
•
Tweezers
•
Calibration reference weight (P/N 08858-0901-020-xx)
•
Force Sensor Calibration Tool (P/n 08858-0901-001-xx)
PROCEDURE:
A. Select [1] CALIBRATE. The dialog box for ‘Step 1’ appears (see Figure
A-24).
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Appendix A: Calibration
Figure A-24 Bond Force Calibration Step 1 Dialog Box
NOTE: It is preferable to install the capillary before proceeding to Zero Gram
Calibration. This setup corresponds to actual conditions and therefore
performs a more accurate zero gram calibration than without the capillary.
B. Perform the instructions in the Step 1 dialog box:
1. Verify that the clamp insert is removed.
2. Secure wire as the wire clamp will open.
3. Chess the bond head to the left of the heatblock cavity.
WARNING: BONDHEAD WILL MAKE A SERIES OF RAPID UP AND DOWN MOVEMENTS PRIOR TO MEASURING THE ZERO GRAM OFFSET.
4. Select [1] PERFORM ZERO GRAM CALIBRATION. The heat block is
lowered, followed by the bond head descending in the Z axis allowing the software to calculate the force required to move the bond
head without opposition. When the calculation completes, the heat
block is raised and the dialog box for ‘Step 2’ appears (see Figure
A-25).
Figure A-25 Bond Force Calibration Step 2 Dialog Box
C. Perform the instructions in the Step 2 dialog box:
1. Remove the capillary (if capillary is present).
2. Install the reference weight (P/N 08858-0901-020-xx) by latching it
onto the wire clamp fixed bracket insulated clamp as shown in Figure A-26.
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A-21
Maxµm Ultra Ball Bonder
Reference Weight
Latch the Ref. weight
onto the wire clamp
insulated clamp
Figure A-26 Installing the Reference Weight
3. Select [1] PERFORM WEIGHTED CALIBRATION. The heat block is lowered, followed by the bond head descending in the Z axis allowing
the software to calculate the force required to move the bond head
with the reference weight attached. When the calculation completes, the dialog box for ‘Bond Force Calibration Step 3’ will
appear (see Figure A-27).
Figure A-27 Bond Force Calibration Step 3 dialog Box
4. Remove the reference weight as directed. Select [1] ACCEPT to
accept the results or [2] DISCARD to discard.
D. Perform the instructions in the Force Sensor Calibration procedures:
1. Use a tweezer to install the Force Sensor Calibration Tool (P/n:
08858-0901-001-xx) into the capillary clamp in the transducer and
tighten the clamp screw to a torque of 35 oz. in. (0.25 Nm) as
shown in Figure A-28.
Figure A-28 Force Sensor Calibration Dialog Box
2. Chess the bond head over to the heat block mesa or flat surface.
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Appendix A: Calibration
Force Sensor
Calibration Tool
Force Sensor
Calibration Tool
Figure A-29 Force Sensor Calibration Dialog Box
3. Select [1] START CALIBRATION (see Figure A-28) to start the force
sensor calibration. The bondhead will make a series of rapid movements to calibrate the force sensor for contact detection and force
feedback.
4. After the calibration, the ‘Bond Force Calibration’ dialog box shown
in Figure A-30 will appear. Select DONE to complete bond force calibration. (see Bond Force Verification, paragraph A.5.4.2).
Figure A-30 Bond Force Calibration Dialog Box
A.5.4.2
Bond Force Verification
Verification allows the operator to test the bond force against a calibrated
gram force gauge. This is accomplished by the software providing a specified amount of force to the bond head Z motor. That force is then checked
using a gram force gauge to counter the force. When the software
releases the Z motor energy due to the opposition, the resulting reading
on the gram force gauge is the actual force applied. This test may be done
at any time, but must be done after a Bond Force calibration to confirm
accuracy.
REQUIRED TOOLS/MATERIAL:
•
Gram force gauge
PROCEDURE:
A. A. Select [2] VERIFY from the ‘Bond Force Calibration’ dialog box (see
Figure A-23). The ‘Bond Force Verification Step 1’ dialog box appears
(see Figure A-31).
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Maxµm Ultra Ball Bonder
Figure A-31 Bond Force Verification Step 1 Dialog Box
B. Working in the ‘Bond Force Verification Step 1’ dialog box, perform the
following:
1. Select [1] TESTING FORCE.
2. Enter the desired gram force to be generated. Press [ENTER].
NOTE: Testing force may be any value within the specifications of the bonder.
3. Click on NEXT to continue. The ‘Bond Force Verification Step 2’ dialog box appears (see Figure A-32).
Figure A-32 Bond Force Verification Step 2 Dialog Box
C. Working in the ‘Bond Force Verification Step 2’ dialog box, perform the
following:
1. Verify that the clamp is closed.
2. Remove the EFO wand (if not already removed from calibration
procedure). Refer to Volume 2: Maintenance, Section 5 for procedure.
3. Using the mouse and mouse button [B2], position the bond head
over the die of a production device so that when the capillary
descends it will make contact with the die.
4. Select [1] PERFORM VERIFY CALIBRATION. The ‘Bond Force Verification Step 3’ dialog box appears (see Figure A-33).
Figure A-33 Bond Force Verification Step 3 Dialog Box
D. Working in the ‘Bond Force Verification Step 3’ dialog box, perform the
following:
1. Lift the front of the transducer with a gram force gauge until the
green video disappears.
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Appendix A: Calibration
NOTE: The gauge must be held level and perpendicular to the transducer for
accurate results.
2. As soon as the green video disappears, compare the amount of
force applied to lift the transducer with the force being applied (the
Testing Force).
E. Working in the ‘Bond Force Verification Step 4’ dialog box (see Figure
A-34), select [1] RETRY to perform verification again. Select [2] DONE
when verification is complete.
Figure A-34 Bond Force Verification Step 4 Dialog Box
F. Install the EFO wand (refer to Volume 2: Maintenance, Section 5).
A.5.5
USG (Ultrasonic Generator) Calibration
The transducer is used to provide energy to make bonds on the work surface. The transducer also provides a ‘bleed voltage’ used during looping
which helps pay out the wire through the capillary. The USG calibration
matches the output of the USG electronics to the actual impedance load
of the transducer. By doing this, the ultrasonic energy applied to the transducer may be known during actual production. USG calibration should be
done after any of the following:
•
Capillary or transducer replacement.
•
Transducer alignment
•
Ultrasonic generator electronics or cable replacement.
The USG Calibration dialog box is accessed by selecting [5] USG from the
Bond Head menu (see Figure A-35). The TUNED FREQUENCY item displays the frequency at which maximum power is applied to the transducer.
The IMPEDANCE item indicates the measured opposition, in ohms, to ultrasonic power application determined during calibration.
Figure A-35 USG Calibration Dialog Flow
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Maxµm Ultra Ball Bonder
NOTE: Selection [8] USG PERSONALITY VALUES is a password protected feature
that allows the user to program a compensation value (portability factor)
for specific USG parameters. Portability factors are part of the machine
dependent parameters (MDPs). It is the responsibility of the customer to
manually calibrate the portability factors such that the same process
program can be used for different machines to achieve the same process performance. For more information on this feature, refer to Process
Program Portability Factors, paragraph A.11.
CAUTION: The K&S Micro-Swiss Sigma capillary provides a more sensitive
bonding process, making it suitable for fine pitch applications as well
as sensitive die packages. Please follow these guidelines for obtaining the best performance with Sigma capillaries.
A.5.5.1
•
Use K&S standard USG calibration.
•
Do not touch the capillary with tweezers or try to remove it from the
transducer while the USG calibration is in progress or whenever the
USG function bar selection (Function F7) is active.
•
When cleaning the Sigma capillary by turning on the USG (Function
F7), the ‘USG Clean Volts’ parameter should not exceed 2000 mVolts
(See Section 5, “Tool Usage Configuration”).
•
Use recommended bond parameters (see Sect. 6, “Edit Bond Parameters”).
Calibration Procedure
REQUIRED MATERIAL: None.
PROCEDURE:
A. Working in the ‘USG Calibration’ dialog box, set the following parameters as needed.
[1] TUNING SITE Currently, this item defaults to Free Air. It cannot be changed by
the user.
[2] START FREQUENCY Displays the frequency at which the calibration scan
operation is to start. The user can set a desired minimum starting frequency rather
than using the software default.
[3] FREQUENCY STEP This parameter defines how often, during the frequency
range, measurements and calculations are made to determine if a resonant frequency has been found. For example, a step value of 40 Hz would initiate resonant frequency calculations to be made at every 40 HZ during the frequency scan.
END FREQUENCY The frequency at which the calibration scan operation is to
end. This parameter cannot be set by the user. Its value is automatically calculated
and inserted by the software whenever a change is made to the Start Frequency
or Frequency Step parameters.
[6] USG HARDWARE SETTINGS By selecting this option, a new dialog will
appear as shown in Figure A-35.
•
[1] CALIBRATION SETTINGS allows the user to key in values that will
•
[2] START CALIBRATION By selecting this option, the system hardware
override the default setting values.
relating to USG will be calibrated. This hardware calibration must be
done first before selecting [7] CALIBRATE of the previous dialog.
•
[3] OSE/AMP RESULTS Displays the hardware calibration results previ-
ously done.
B. When all parameters are set as required, calibrate the USG by performing the following:
1. Select [7] CALIBRATE. This action initiates the calibration cycle
according to the conditions set up in the ‘USG Calibration’ dialog
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Appendix A: Calibration
box. The ‘USG Tune Results’ dialog box is then presented to the
user allowing the selection of accepting or canceling (rejecting) the
calibration (see Figure A-36).
2. Select [3] ACCEPT to save the results of calibration to memory and
quit USG calibration. Select [4] CANCEL to quit USG calibration
without saving the results to memory.
NOTE: Acceptable Ultrasonic System Impedance should be less than 60 Ohms.
Figure A-36 USG Tune Results Dialog Box
NOTE: A USG calibration may fail due to one of the following:
A.5.6
•
Improper transducer or capillary installation.
•
Wire clamp misalignment.
•
Loose or bad transducer cabling.
Capillary (Cap) Change
The Capillary Change sequence steps the user through the procedures
necessary to replace the capillary in the transducer. Even though it is not
a calibration, it does incorporate the calibrations necessary after a capillary change on a Maxµm Ultra machine. The sequence is started by
selecting [6] CAPILLARY CHANGE from the Bond Head menu. This action
causes the first dialog box to appear. The following is a step by step
description of each operation in the sequence. Refer to Figure A-37 which
shows all of the dialog boxes that appear in the sequence.
This dialog box briefly describes the
steps required to remove and install a capillary. These directions serve
primarily as a guide or reminder assuming that the user is familiar with
capillary replacement. Refer to Section 3, Bond Tool Replacement, for
detailed instructions on how to perform this procedure. After the capillary
has been replaced, the user clicks on the DONE button which causes the
next dialog box to appear.
REMOVE AND INSERT CAPILLARY:
The USG Calibration dialog box appears. The user
sets the parameters accordingly and performs the calibration. See paragraph A.5.5 for details. When the USG Calibration has been done, the
user clicks on the DONE button. This causes the next dialog box to appear.
USG CALIBRATION:
The Crosshair Offset Calibration dialog box appears. The user sets the parameters accordingly and performs
the calibration. See paragraph A.5.1 for details. When the Crosshair Off-
CROSSHAIR OFFSET CALIBRATION:
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Maxµm Ultra Ball Bonder
set Calibration has been done, the user clicks on the DONE button. This
causes the next dialog box to appear.
The EFO Height Calibration dialog box appears. The user
performs the calibration. When the EFO Height Calibration has been
done, the user selects [1] ACCEPT. This causes the next dialog box to
appear.
EFO HEIGHT:
The Relearn Bond Height dialog box appears.
The user performs the operation by selecting the BND HT RELRN button
from the upper function bar. The bond head moves down in the Z axis so
that the software can learn the point at which the capillary touches the
work surface. When the bond height has learned, the next dialog box
appears.
RELEARN BOND HEIGHT:
The Thread Wire dialog box appears listing the steps
required to perform this task. The operator threads wire as directed and
then performs a ‘Bond Off’ to form a ball at the capillary tip. The user
develops their own skill set relating to feeding wire. The USG should not
be turned on until the wire is properly threaded in the capillary.
THREAD WIRE:
Upon completion, the operator clicks on DONE. The capillary has been
changed and all necessary calibrations and adjustments have been performed to assure product quality at the resumption of automatic wire
bonding.
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Appendix A: Calibration
Select #6
Figure A-37 Capillary Change Dialog Box Flow
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Maxµm Ultra Ball Bonder
A.5.7
BITS AGC
The Bond Integrity Test System Auto Gain Control (BITS AGC) is a feature aimed at compensating the cable capacitance and maintaining a consistent inject signal within the BITS circuits to optimize BITS performance.
BITS is the major sub-system in K&S ball bonders for detection of bonding
error real time. A signal generated from BITS board is routed to the bonding wire, injected on the device and measured to check the bonding integrity. Since the equivalent cable capacitance of the route is highly
dependant on the cable used and the routing layout, the injection signal
may vary and be inconsistent. Therefore this feature will modulate the signal being injected on devices under test and is unaffected by the wiring
route from BITS board to bonding wire. It also enhances the communication between BITS board and CPU1 host and ultimately provides a reliable and accurate BITS.
Figure A-38 BITS AGC Dialog Box
After selecting [9] BITS AGC from the ‘Bond Head’ menu (see Figure A-38),
a dialog will appear to prompt the user to thread the wire in the capillary
and do a complete bondoff procedure (see Figure A-39).
Figure A-39 BITS AGC Calibration Dialog
Then press OK to trigger the BITS AGC calibration. Wait till the calibration
is completed. Normally, the BITS AGC calibration can be done within 700
ms and the time out value is set to 2 seconds.
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Appendix A: Calibration
A.6 Workholder
Workholder calibrations bring all the six component parts of the
workholder into proper alignment with one another. This assures that
leadframes will be properly loaded, indexed, and ejected.
Figure A-40 Workholder Calibration Menu
Calibrations confirming heat block cavity automatically position the bond
head to the previously taught position. These are done during: heat block
operator point teach; indexer calibration; X sensor calibration; and rail calibration. The bond head does not position automatically if the heat block
data is invalid or if the limit seeks were not performed.
WARNING: WORKHOLDER CALIBRATIONS SHOULD BE PERFORMED WITH
WORKHOLDER HEATERS AT OPERATING TEMPERATURE FOR
MOST ACCURATE RESULTS. IF THE WORKHOLDER IS HEATED,
AVOID TOUCHING HEATED PARTS WHEN REMOVING PARTS OR
MATERIAL (LEADFRAMES, HEAT BLOCK INSERT, CLAMP INSERT)
OR WHEN PERFORMING OTHER OPERATIONS.
NOTE: a) The following calibration procedures are designed to provide parameters which allow for the alignment of the workholder so as to ensure correct center lines of bond.
b) Calibrations should be performed with no material in the workholder
or magazine handlers.
c) It is assumed that the die cavity of the heat block targeted during
workholder calibrations is on the workholder X and Y center lines.
d) MHS calibration cannot be done unless the X, Y, and Z servo motion
axes have been tuned and crosshair offset has been calibrated.
A.6.1
A.6.1.1
Rail Calibration
Introduction
In the rail calibration, the front and rear rail home positions are taught with
respect to center of bond in the Y axis. Rail calibration should be performed after any significant adjustment to the workholder which may affect
the Y center line of index.
The procedure uses the heat block die cavity front and back edges
(located by the user with the horizontal crosshair) to find the center of
bond in the Y axis, and then move the rails close to the heat block. The
user is asked to position the horizontal crosshair at the edge of the vertical
leadframe stopping surface of each rail, which completes the calibration.
The die cavity of the heat block insert used in this calibration must be centered with respect to workholder Y axis center line when the insert is
mounted on the heat block mount. If the insert mounted on the workholder
does not meet this requirement, it must be replaced with one that does
before performing the rail calibration.
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Maxµm Ultra Ball Bonder
A.6.1.2
Perform Rail Calibration
A. Select CALIBRATION, then select WORKHOLDER from the calibration
menu.
WARNING: DO NOT TOUCH THE CLAMP INSERT OR HEAT BLOCK WITH
UNPROTECTED HANDS IF THE WORKHOLDER HEATERS ARE AT
OPERATING TEMPERATURE. WHEN REMOVING OR MOUNTING THE
CLAMP INSERT, INSTALL TWO SCREWS IN THE INSERT AND GRASP
THE SCREWS WITH PLIERS. WHEN REMOVING THE HEAT BLOCK,
INSTALL A SCREW AT THE RIGHT SIDE OF THE HEAT BLOCK AND
GRASP THE SCREW WITH PLIERS. THERE ARE TWO M4 TAPPED
HOLES IN THE CLAMP INSERT AND ONE M4 TAPPED HOLE IN THE
HEAT BLOCK FOR THIS PURPOSE.
B. Select RAILS from the workholder calibration menu. The rails open and
the user is asked to remove the leadframe and clamp insert. After
removing leadframes (if any) and the clamp insert, select OK.
C. When prompted to do so, align the horizontal line of the crosshair with
the front edge of the heat block insert die cavity (see Figure A-41).
Select OK.
D. Align the horizontal line of the crosshair with the rear edge of the die
cavity, then select OK. The machine calculates the center of the die
cavity in the Y axis and uses this value as the front–back center of the
workholder.
NOTE: If a contamination removal system (CRS) is installed on the machine,
move the head of the CRS to a position where it will not interfere with
removal of the heatblock insert before performing the next step.
E. Remove the heat block insert when prompted. Select OK. The rails
close in toward each other.
NOTE: Previously, a small tool (tweezers, etc) is suggested to be used for
detecting the stop edge of the rear rail. It is not allowable with Maxµm
Ultra and Elite. The black paint on the stop edge will have enough contrast to locate via the video screen.
F. Locate the notched (cutout) portion of the rear rail (see Figure A-41).
The width of the notch represents the depth of the slot in the rail that
supports the carrier. Do not use any sharp tool to locate the stop edge.
The black paint on the stop edge will have enough constrast to locate
via the video screen. Align the horizontal crosshair with the back edge
of the notch (stopping surface of the rear rail). Select OK.
NOTE: It may be difficult to see the edge of the carrier stopping surface in the
video window. It is recommended to use the edge approximately 1” to
the left of the heat block along the front rail as the front rail edge reference. Do not use the chamfered edge as reference.
G. Align the horizontal crosshair with the leadframe stopping surface of
the front rail (approximately 1” to the left of the heat block along the
ront rail). Select OK.
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Appendix A: Calibration
Carrier stopping surface (rear rail)
Place crosshair on the rear edge
of notch. Do not use a sharp tool
to detect the rear edge.
The black paint on the rear edge
will have sufficient contrast to locate.
Black Painted Edge
Black Painted Surface
(Notch)
Rear Edge
Front Edge
Carrier Stop Surface
( Front Rail )
1. Locate front and back edges of die cavity.
Approx. 1" to left of the heat block center
2. Locate front and rear rail carrier
stopping surfaces.
Figure A-41 MHS Rail Calibration
CAUTION: do not attempt to mounts a cold heat block insert onto a heat block
mount that is at operating temperature. the heat will jam on the mount
and will be very difficult to remove.
H. Install the heat block insert and clamp insert. Move the CRS head back
to its operating position (if present). Select OK.
I. Press the [ESCAPE] key as needed to exit calibration mode.
A.6.2
Clamp Calibration
A.6.2.1
Introduction
The purpose of clamp calibration is to teach clamp insert height in relation
to bond plane height. This calibration should be performed after every
major adjustment to the clamp or heat block mechanism. In this procedure, the user is asked to remove the clamp insert and position the capillary over a machined surface on the heat block. After the capillary is
moved down to contact the heat block, the user is asked to install clamp
insert and position the capillary over a machined surface on the clamp
insert. The heat block and clamp insert then move up together until contact with the capillary is sensed.
WARNING: IF THE W/H HEATERS ARE AT OPERATING TEMPERATURE:
1. DO NOT TOUCH THE CLAMP INSERT WITH UNPROTECTED HANDS. WHEN REMOVING OR
MOUNTING THE CLAMP INSERT, INSTALL TWO SCREWS IN THE INSERT AND GRASP THE
SCREWS WITH PLIERS. THERE ARE TWO M4 TAPPED HOLES IN THE CLAMP INSERT FOR
THIS PURPOSE.
2. DO NOT TOUCH THE HEAT BLOCK INSERT WITH UNPROTECTED HANDS. WHEN REMOVING OR MOUNTING THE HEAT BLOCK INSERT, INSTALL A SCREW IN THE RIGHT END OF
THE INSERT AND GRASP THE SCREW WITH PLIERS. THERE IS AN M4 TAPPED HOLE IN THE
HEAT BLOCK INSERT FOR THIS PURPOSE.
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Maxµm Ultra Ball Bonder
A.6.2.2
Perform Clamp Calibration
A. Select CALIBRATION, then select WORKHOLDER from the calibration
menu.
B. Select CLAMP from the Workholder Calibration menu. The rails open. A
dialog box appears requesting removal of the EFO wand and asking
the user to verify that P-part dimensions and bond head Z adjustment
match with the physical P-parts and bond head setup.
C. Loosen the screw that secures the EFO wand and remove the EFO
wand from the L-block (refer to Section 5 of Maxµm Ultra, Volume 2:
Maintenance for EFO wand removal procedure, if necessary.)
D. Verify that the bond head Z adjustment is correct and that the rail
height has been adjusted for the current heat block position. Select OK
to continue.
E. Install the heat block insert on the heat block, if necessary. Select OK
to continue.
NOTE: If XY table limits or bond head position have not been determined by the
machine, a warning message will appear stating that the capillary will be
lowered straight down to contact the heatblock (not moved over to the
crosshair position before it descends). If this message appears, make
sure that the capillary (not the crosshair) is positioned over a machined
area of the heatblock before selecting OK to continue.
F. The heat block comes up between the rails until it is at the nominal
bond plane height. Position the crosshair over the top surface of the
heat block. DO NOT position it over the die cavity. Target the crosshair
so that it is to the right of X center to avoid EFO wand contact with the
clamp arm during table motion (see Figure 4-43). After doing this,
select OK to continue.
G. The bond head moves down until contact with the heat block is
sensed, then moves up.
NOTE: If XY table limits or bond head position have not been determined by the
machine, a warning message will appear stating that the capillary will be
lowered straight down to contact the clamp insert (not moved over to the
crosshair position before it descends). If this message appears, make
sure that the capillary (not the crosshair) is positioned over a machined
area of the clamp insert before selecting OK to continue.
H. Install the clamp insert, then select OK.
NOTE: At this time, before performing the next step, the user has the option to
check the clamp home position (maximum clamp opening). For step by
step instructions, see Maxµm Ultra, Volume 3: MHS, Section 2: “Clamp
Home Position Adjustment”. When satisfied with the clamp home position, continue with step I.
I. Position the crosshair over the top surface of the clamp insert (highest
machined surface). DO NOT position it over the clamp insert window.
Target the crosshair so that it is to the right of X center to avoid EFO
wand contact with the clamp arm during table motion (see Figure A42). After doing this, select OK to continue.
J. The clamp closes. The capillary comes down, touches the clamp
insert, and then rises. The heat block moves up to nominal position.
The capillary moves down to contact the clamp surface, then rises.
The heat block position is adjusted to raise the clamp, after which the
capillary again moves down to contact the clamp. This is repeated until
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Appendix A: Calibration
the clamp is raised eight (8) mils. This step ensures that the clamp is at
the proper height when the heat block is at the clamped position.
K. Select OK in response to ‘Calibration was Successful’ dialog box.
L. Install EFO wand on the L-block. Adjust EFO wand height and perform
EFO calibration (refer to Section 5 of Maxµm Ultra, Volume 2: Maintenance for EFO wand installation and adjustment procedures.)
M. Press the [ESCAPE] key twice to exit the calibration mode menus.
Figure A-42 MHS Clamp Calibration
A.6.3
Indexer Calibration
A.6.3.1
Introduction
Indexer calibration teaches the index gripper assembly home position with
regard to center–of–bond position in the X direction. This calibration
should be performed after any significant adjustment to the index gripper
which may affect the X center line of index, or the X origin. In this procedure, the left and right edges of the heat block die cavity are located using
the vertical crosshair. From these locations the machine determines the
center of bond in the X axis. The index gripper is then moved close to the
bond site. The user is asked to insert a calibration wafer and align the vertical crosshair with the right edge of the wafer. Confirming the location of
this point completes the procedure.
A.6.3.2
Perform Indexer Calibration
A. Select CALIBRATION, then select WORKHOLDER from the calibration
menu.
WARNING: CLAMP AND HEAT BLOCK INSERTS MAY BE HOT. WHEN REMOVING OR MOUNTING THE INSERTS, INSTALL SCREW(S) IN THE
INSERT AND GRASP THE SCREW(S) WITH PLIERS. THERE ARE M4
TAPPED HOLES IN THE CLAMP AND HEAT BLOCK INSERTS FOR
THIS PURPOSE.
B. Select INDEXER from the Workholder Calibration menu. Remove carrier (if present) and the clamp insert. Select OK when done.
NOTE: When performing steps C. and D. using a BGA heat block or other heat
block that does not contain a down set, align the vertical crosshair with
the outer edge of the left–side hole (step C.) and then the outer edge of
the right–side hole (step D.) in the heat block insert. The holes were
machined into the heat block insert for this purpose.
C. Align the vertical line of the crosshair with the left edge of the heat
block insert die cavity (see Figure A-43). Select OK when done.
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Maxµm Ultra Ball Bonder
D. Align the vertical line of the crosshair with the right edge of the heat
block die cavity and select OK. The machine calculates the center of
the die cavity and uses this value as the left–right center of the
workholder.
NOTE: If a contamination removal system (CRS) is installed on the machine,
move the head of the CRS to a position where it will not interfere with
removal of the heatblock insert before performing the next step.
E. Remove the heat block insert. Select OK when done.
F. Place the Calibration Wafer (P/N 08021-0901-011-xx) on the rails
benching it against the rear rail and the left side of the closed indexer
gripper jaws (see Figure A-43). Select OK when done.
G. Align the vertical line of the crosshair with the right edge of the wafer
(see Figure A-43). Select OK when done.
H. Remove the Calibration Wafer. Select OK when done.
I. Replace the heat block insert and clamp insert. Move the CRS head
back to its operating position (if present). Select OK when done. Press
the [ESCAPE] key as needed to exit calibration mode.
Figure A-43 MHS Indexer Calibration
A.6.4
X Registration Sensor Calibration
A.6.4.1
Introduction
X registration sensor calibration determines the distance from the sensing
point of the X registration sensor to the bond site in the X axis. This calibration must be performed after every adjustment to the workholder, or
when the X registration sensor is adjusted or replaced.
NOTE: The Rail calibration must have been done before performing this calibration.
WARNING: DO NOT TOUCH THE CLAMP OR HEAT BLOCK INSERTS IF THE
WORKHOLDER HEATERS ARE ON. WHEN REMOVING OR MOUNTING THE CLAMP INSERT, INSTALL TWO SCREWS IN THE INSERT
AND GRASP THE SCREWS WITH PLIERS. THERE ARE TWO M4
TAPPED HOLES IN THE CLAMP INSERT FOR THIS PURPOSE. WHEN
REMOVING OR MOUNTING THE HEAT BLOCK INSERT, INSTALL A
SCREW IN RIGHT END OF THE INSERT AND GRASP THE SCREW
WITH PLIERS. THERE IS AN M4 TAPPED HOLE IN THE HEAT BLOCK
INSERT FOR THIS PURPOSE.
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Appendix A: Calibration
A.6.4.2
Perform X Registration Sensor Calibration
A. Select CALIBRATION, then select WORKHOLDER from the calibration
menu.
B. Select X SENSOR from the workholder calibration menu. Remove the
material (if any) from the workholder and remove the clamp insert. Verify that the heat block insert is installed. Select OK when done.
NOTE: When performing steps C. and D. using a BGA heat block or other heat
block that does not contain a down set, align the vertical crosshair with
the outer edge of the left–side hole (step C.) and then the outer edge of
the right–side hole (step D.) in the heat block insert. The holes were
machined into the heat block insert for this purpose.
C. Align the vertical line of the crosshair with the left edge of the heat
block insert die cavity (see Figure A-44, step 1), then select OK.
D. Align the vertical line of the crosshair with the right edge of the heat
block insert die cavity (see Figure A-44, step 1), then select OK.
NOTE: If a contamination removal system (CRS) is installed on the machine,
move the head of the CRS to a position where it will not interfere with
removal of the heatblock insert before performing the next step.
E. Remove the heat block insert and select OK. The front rail moves to
place the X registration sensor under the left–side clamp arm (see Figure A-44, step 2).
F. Locate the two (2) sensor amplifiers under the left side of the
workholder front rail. The X registration sensor amplifier is the lower of
the two stacked sensor amplifiers at this location (the upper sensor
amplifier is the Y registration sensor amplifier.)
G. Use a small tool to press the TEACH pushbutton on the X registration
sensor amplifier and hold it for approximately two (2) to three (3) seconds until the green and red LEDs are flashing.
H. Press the TEACH pushbutton two (2) times. This causes all three LEDs
to flash together three (3) times. Then, the green and yellow LEDs will
flash together. The sensor amplifier teach is now complete. Select OK
to continue.
I. Place the metal calibration wafer (P/N 08021-0901-011-xx) onto the
workholder rails. Slide the calibration wafer to the right or left so that it
covers the X sensor (see Figure A-44, step 3). Select OK.
J. The index gripper moves left and grips the calibration wafer. The gripper rapidly pulls the wafer to the left and then to the right to locate the
point where the sensor sees the right edge of the wafer. It then pulls
the wafer to the bond site (see Figure A-44, step 4).
K. Align the vertical line of the crosshair in the GUI video window with the
right edge of the wafer (see Figure A-44, step 4). Select OK.
L. Remove the calibration wafer from the workholder. Select OK. Install
the heat block insert and clamp insert. Move the CRS head back to its
operating position (if present). Select OK.
M. Press [ESCAPE] twice to exit Calibration mode.
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© 2007 Kulicke & Soffa Industries Inc
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Maxµm Ultra Ball Bonder
X Registration Sensor
X Registration Sensor
Left Edge
Right Edge
1. Locate the left and right edges of the
heat block die cavity. Remove heat block
insert when done.
2. Front rail moves to position where the
left side clamp arm covers the X
Registration Sensor. Teach the sensor
amplifier.
Calibration Wafer
Calibration Wafer
X Registration Sensor
3. Place calibration wafer on workholder
rails. Make sure it is benched against
the rear rail. Move the wafer left or
right until is covers the X sensor.
4. Gripper pulls the wafer left then right
to locate the X sensor, then moves it
to the bond site. Locate the right
edge of the wafer with the crosshair.
Figure A-44 X Registration Sensor Calibration
A.6.5
Tucker Eject Calibration
A.6.5.1
Introduction
Tucker calibration determines the distance from the index gripper home
position to the index gripper position where the working end of the tucker
is aligned with the outer surface of the output magazine handler side wall.
This calibration must be performed after every adjustment to the index
gripper, or when the tucker is removed/replaced.
A.6.5.2
Perform Tucker Eject Calibration
A. Select CALIBRATION, then select WORKHOLDER from the calibration
menu.
B. Select TUCKER EJECT from the workholder calibration menu. Observe
the displayed Warning (see below.)
WARNING: THE OUTPUT MAGAZINE COULD BE EJECTED AS PART OF THE
CALIBRATION. REMOVE HANDS FROM MAG HANDLER BEFORE
SELECTING OK.
C. Select OK.
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Appendix A: Calibration
D. Use the left/right arrow keys (a and ') on the control panel to move the
index gripper in the X axis until the right edge of the eject tucker blades
are flush with the outside surface of the output magazine handler side
wall (see illustration below).
E. Select OK.
F. Press [ESCAPE] as needed to exit calibration mode.
NOTE: The lower eject gripper jaw should be set 5 mils (0.125mm) above the
top surface of the front rail. If these specifications are not met, perform
the lower eject gripper jaw calibration. Refer to section 2.9.5.1 of this
manual for detailed information
A.6.6
RailsZ (Rail Height Adjustment)
This procedure sets the workholder rails to the optimal height relative to
the heat block height for the carrier (leadframe, flat boat, etc.) that will be
processed. After any change is made to Device Thickness (one of the
Device Parameter settings in CONFIGURE Mode), or if a process program is loaded for a new device type, a display on the monitor will prompt
the user to adjust the height of the workholder rails.
When ‘RailsZ’ is selected from the ‘Workholder’ calibration menu, the software displays a dialog box (see Figure A-46) that shows the last measured rail height, the optimal rail height based on carrier thickness, the
direction (clockwise or counterclockwise) that the user should turn the rail
height adjustment screw to remove any difference between the measured
rail height and optimal rail height, and whether the last measured rail
height is considered optimal, acceptable, or unacceptable.
Options in the dialog box allow the user to check device configuration and
device parameters, and to measure the current rail height. If that option is
selected, the machine will determine rail height by contacting the top of
the rear rail leadframe support surface with the capillary. The measured
rail height, direction to turn the rail height adjustment screw, and a new
position rating then appear in the dialog box. Once the rails have been
adjusted to an optimal or acceptable height, the user can accept the current rail position and end the procedure.
The optimal rail height is 5.0 mils below the height of the heat block.
Depending upon the thickness of the material, the height of the heat block
is equal to the bond plane height (zero) minus the thickness of the mate-
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Maxµm Ultra Ball Bonder
rial. For example, if a leadframe is 8 mils thick, the height of the heat block
will be at -8 mils relative to the bond plane being at zero. The optimal rail
height would be at -13.0 mils (5.0 mils below the height of the heat block).
We therefore arrive at the following equation for optimal height: (optimal
height = bond plane height - (carrier thickness + 5.0 mils). This example is
illustrated in Figure A-45.
Bondplane (0)
Leadframe, Thickness = 8 mils
Rail Height
-13.0 mils
Heat Block
Heat Block
Height, -8 mils
Rail
Figure A-45 Rail Height/Heat Block Height Example
Figure A-46 Rail Height Measurement Dialog Box
Adjust the rail height by performing the following. It is assumed that the
‘Rail Height Measurement’ dialog box is displayed on the monitor screen.
A. Select [1] DEVICE CONFIGURATION from the dialog box. This allows the
user to verify and/or edit the device configuration by displaying the
‘Device Configuration’ dialog box. The device may be set to be of the
leadframe, flatboat singulated or flatboat non-singulated type. This is
the same dialog box which is displayed from the Configuration menu in
CONFIGURE mode. See Section 5 for more details.
B. Select [2] DEVICE PARAMETERS from the dialog box. This allows the
user to set the parameters for a Standard Leadframe, Flatboat Nonsingulated or Flatboat Singulated devices. Which dialog box is displayed is dependent upon the ‘Device’ setting in the ‘Device Configuration’ dialog box. See Section 5 for more details.
NOTE: Proceed with Step C. when all device configuration parameters are set
correctly.
C. Select [3] MEASURE CURRENT POSITION from the dialog box. This
causes the bond head to go back in the Y axis and come down in the Z
axis to where the capillary makes contact with a notched-out area on
the rear rail. In turn, this causes the calculated rail height to appear in
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Appendix A: Calibration
the ‘Rail Height’ indicator of the dialog box. The ‘Position’ indicator will
reflect OPTIMAL, ACCEPTABLE or UNACCEPTABLE.
NOTE: The workholder will index if the position rating is OPTIMAL or ACCEPTABLE. However, accepting an ACCEPTABLE rating may cause a
decrease in throughput. The workholder will not index if an UNACCEPTABLE rating is accepted. Because of the possible decrease in throughput, always try to adjust the rail height to an OPTIMAL position rating.
D. If the POSITION rating is OPTIMAL or ACCEPTABLE, the current rail
height may be accepted by selecting the DONE button. If this is the
case, go to step F.. If POSITION is UNACCEPTABLE, go to step E..
E. If the POSITION rating is UNACCEPTABLE, adjust rail height and
remeasure.
1. Calculate the difference between the rail height and optimal rail
height displayed in the dialog box. This is the amount of adjustment
(in mils) needed to set the rails to optimal height.
2. Turn the rail height adjustment screw (see Note below and Figure
A-47) in the direction (CW or CCW) indicated in the dialog box the
number of mils required to move the rails to optimal height.
NOTE: While turning the screw, the user must be aware of the ratchet-like clicks
of the mechanism. Each click is equal to a 1 mil change in the rail height.
3. Select 3 MEASURE CURRENT POSITION. Go to step D..
F. Press [ESCAPE] twice to dismiss all menus
Adjustment
Screw
Model 3119 Workholder
(Front View)
Rail Height
Adjustment Mechanism
Figure A-47 Rail Height Adjustment Mechanism
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Maxµm Ultra Ball Bonder
A.6.7
Gripper
Selecting [7] GRIPPER from the ‘Workholder’ calibration menu displays the
‘Gripper Calibration’ dialog box (see Figure A-48).
Figure A-48 Gripper Calibration Menu
A.6.7.1
Index Sensor Calibration
NOTE: [1] INDEX SENSOR calibration must be done first before proceeding to [2]
INDEX GRIPPER UPPER JAW calibration. This is required because of the
data shared by both calibrations.
A. When [1] INDEX SENSOR is selected from the “Gripper Calibration” dialog box, a message will appear to prompt the user to insert the calibration gauge (P/N 03127-0901-008-xx), see Figure A-49
Figure A-49 Index Sensor Calibration
B. Insert the calibration gauge as instructed by the message box shown
in Figure A-49. See Figure A-50 for the correct placing of the calibration gauge. Make sure it is benched against the left edge of the gripper
jaw.
Make sure it is benched against the gripper jaw
This is the first of
the four [4] slots
required for
this calibration.
Index
Gripper
Calibration Guage
Figure A-50 Installing of Calibration Gauge for Index Sensor Calibration
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Appendix A: Calibration
C. Press “OK” to start the index sensor calibration process, or “Cancel” to
abort the process. After pressing “OK”, wait for the calibration to complete. Visually check that the first calibration process should start at the
far left slot of the gauge. After which a message (not shown) will
appear to instruct the user to remove the calibration gauge.
A.6.7.2
Index Gripper Upper Jaw Calibration
NOTE: [1] INDEX SENSOR calibration must be done first before proceeding to [2]
INDEX GRIPPER UPPER JAW calibration. This is required because of the
data shared by both calibrations
When [2] INDEX GRIPPER UPPER JAW is selected, a message will appear to
prompt the user to wait for the calibration to complete. During this calibration, a series of movements will be done by the upper jaw.
Figure A-51 Index Sensor Calibration
A.6.7.3
Eject Sensor and Eject Gripper Upper Jaw Calibrations
NOTE: [3] EJECT SENSOR calibration must be done first before proceeding to [4]
EJECT GRIPPER UPPER JAW calibration. This is required because of the
data shared by both calibrations.
The calibration procedures for [3] EJECT SENSOR, and [4] EJECT GRIPPER
UPPER JAW are similar to the procedures used for calibrating the Index
Sensor as illustrated in Section A.6.7.1 and Index Gripper Upper Jaw as
illustrated in Section A.6.7.2. There are no difference in the placement of
gauge.
A.6.7.4
Eject Gripping Force Calibration
NOTE: [3] EJECT SENSOR and [4] EJECT GRIPPER UPPER JAW calibrations must be
done first before proceeding to [5] EJECT GRIPPING FORCE calibration. This is
required because of the data shared by these calibrations.
A. When [5] EJECT GRIPPING FORCE is selected from the “Gripper Calibration” dialog box, a message will appear to prompt the user to insert the
calibration gauge (P/N 03127-0902-000-xx), see Figure A-52
Figure A-52 Eject Gripping Force Calibration Menu
B. Insert the force calibration weight gauge and bench against the upper
arm assembly and tighten the gauge as instructed by the message box
shown in Figure A-52. Figure A-53 shows the correct placing of the
force calibration weight gauge.
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Maxµm Ultra Ball Bonder
Bench against the
rear of the upper
arm assembly
Force Calibration
Weight Gauge
Figure A-53 Placement of the Calibration Gauge
C. Press “OK” to continue. After pressing “OK”, another dialog (Figure A54) will appear to prompt the user to install the calibration gauge into
the rails of the workholder. Select “OK” to proceed.
Figure A-54 Calibration Gauge dialog
D. After pressing “OK”, the calibration gauge will move to the eject gripper
location. Then, another dialog (Figure A-55) will appear to prompt the
user to press the upper jaw down to close the upper jaw and let go
(see Figure A-56). Select “OK” to proceed. There will be a total of four
[4] different height levels to calibrate and the user will be prompted to
press down the upper jaw before proceesing to the next level. After the
calibration is done, a message (not shown) will appear to instruct the
user to remove the calibration gauge.
Figure A-55 Press the upper jaw to close dialog
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Appendix A: Calibration
Manually press down the upper jaw and let go
Figure A-56 Manually press down the upper jaw
A.6.7.5
Gripper Calibration Result
Selecting [8] GRIPPER CALIBRATIONS RESULT from the ‘Gripper’ menu displays a dialog box (see Figure A-57) containing the results of all the gripper calibrations. All of the items in the dialog box are for viewing purposes
only and cannot be changed by the user.
Figure A-57 Gripper Calibration Results
A.6.8
Workholder Calibrations
Selecting [9] WORKHOLDER CALIBRATIONS from the ‘Workholder’ menu
displays a dialog box containing the results of all the workholder calibrations. All of the items in the dialog box are for viewing purposes only and
cannot be changed by the user.
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Maxµm Ultra Ball Bonder
A.7 Magazine (Mag) Handler
The Magazine Handler calibrations consist of software routines that are
used to calibrate the input trays, output trays, input slot and output slot.
Using a series of dialog boxes, the software steps the user through each
calibration process.
Figure A-58 Magazine Handler Calibration Menu
NOTE: Each magazine handler calibration must be executed in its entirety.
Clicking on the CANCEL button at any time before the calibration is
complete requires a restart of the calibration procedure.
A.7.1
Input/Output Trays Calibration
The Input/Output Trays calibrations consist of software routines that
prompt the user to move the input/output magazine handler gripper
assembly to specific positions in the Y axis thereby teaching the machine
the correct positions for picking up and ejecting magazines.
WARNING: DURING THE CALIBRATION PROCEDURES, MAG HANDLER COMPONENTS MOVE. BEFORE EXECUTING EACH STEP, REMOVE
HANDS FROM THE MAG HANDLER AREA.
WARNING: HOT SURFACES EXIST ON HEAT BLOCKS AND HEAT BLOCK
INSERTS. BE CERTAIN TO EXERCISE EXTREME CAUTION WHEN
WORKING IN THESE AREAS.
NOTE: a) The steps for calibrating the input trays and the output trays are the
same. Therefore, only ‘Input Trays’ calibration operations are presented.
b) Either an empty magazine or a straightedge may be used in this calibration. In the steps below, the use of a magazine is described.
Required Gauges
•
Empty magazine or straightedge
Tools/ Materials/ Parts
•
None
Procedure
A. Select CALIBRATION from the mode bar, then select MAG HANDLER
from the Calibration mode menu. This causes the ‘Mag Handler’ menu
to appear (see Figure A-58).
B. From the ‘Mag Handler’ menu, select INPUT TRAYS. This causes the
first in a series of instructional dialog boxes to appear.
C. Remove magazines or other material from the input magazine handler’s top and bottom trays. Select OK when done.
D. Following the instructions in the dialog box and the steps below, align
the input magazine handler’s top tray.
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Appendix A: Calibration
1. Place an empty magazine on the input magazine handler’s top tray,
benching it to the rear right corner of the tray.
2. Using the Left and Right Arrow keys on the MMI, chess the input
magazine handler’s gripper (fork) to where the benching buttons
above the bottom gripper pad just contact the magazine wall (see
Figure A-59).
3. Select OK in the dialog box when the gripper is at the correct position.
E. Following the instructions in the dialog box and the steps below, verify
the top tray calibration.
1. Remove the magazine from the top tray.
2. Select OK in the dialog box. The tray sensor at the front of the gripper finds the sensor flag at the top tray. When done, the gripper
moves near the bottom tray and stops. The next dialog box appears
on the display.
F. Following the instructions in the dialog box and the steps below, align
the input magazine handler’s bottom tray.
1. Place an empty magazine on the input magazine handler’s bottom
tray, benching it to the rear right corner of the tray.
2. Using the Left and Right Arrow keys on the MMI, chess the input
magazine handler’s gripper (fork) to where the benching buttons
above the bottom gripper pad just contact the magazine wall. This
is the same procedure that was performed for the top tray.
3. Select OK in the dialog box when the gripper is at the correct position.
G. Following the instructions in the dialog box and the steps below, verify
the bottom tray calibration.
1. Remove the magazine from the bottom tray.
2. Select OK in the dialog box. The tray sensor at the front of the gripper finds the sensor flag at the bottom tray.
NOTE: This completes the Input Trays calibration procedures. If needed, perform the Output Trays calibration procedures.
Figure A-59 Touching Benching Buttons (Side View)
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Maxµm Ultra Ball Bonder
A.7.2
Input/Output Slot Calibration
The Input/Output Slot calibrations consist of software routines that prompt
the user to move the input/output magazine handler gripper assembly to
specific positions in the Y and Z axes thereby teaching the machine the
correct slot positions for leadframe injection and ejection. Figure A-60
identifies the gauges used in the Input/Output Slot calibrations. The figure
describes each gauge relating to how it is used when performing the Input
and Output Slot calibrations. This figure should be referenced when performing the calibrations.
Figure A-60 Magazine-Sized Gauge and Y-Z Gauge
WARNING: DURING THE CALIBRATION PROCEDURES, MHS COMPONENTS
MOVE. BEFORE EXECUTING EACH STEP, REMOVE HANDS FROM
THE MAG HANDLER AND WORKHOLDER AREAS.
WARNING: HOT SURFACES EXIST ON HEAT BLOCKS AND HEAT BLOCK
INSERTS. BE CERTAIN TO EXERCISE EXTREME CAUTION WHEN
WORKING IN THESE AREAS.
NOTE: The steps for calibrating the input slot and output slot are the same.
Therefore, only the operations required to perform the ‘Input Slot’ calibrations are given in the steps that follow.
•
Required Gauges
1. Magazine-Sized Gauge, P/N 03412-0999-007-xx
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Appendix A: Calibration
2. Y-Z Gauge, P/N 03127-0901-006-xx
•
Tools/Material
None
•
Procedure
A. Select CALIBRATION, from the mode bar, then select MAG HANDLER
from the Calibration mode menu.
B. From the Mag Handler menu, select INPUT SLOT. This causes the first
in a series of instructional prompts to appear.
C. Remove all leadframes from the workholder. Select OK.
D. Remove hands from the workholder area, then select OK in the ‘Warning’ prompt.
CAUTION: During the next step the rail height is measured by the bond head
descending and making contact with the rear rail. Make sure there is
no ball in the capillary before executing this step.
E. Observe the warning in the dialog box and select OK to continue with
the rail height measurement.
NOTE: If rail height is not correct, the user should perform the rail height adjustment before performing this calibration. Refer to paragraph A.6.6 for
instructions on the rail height adjustment.
F. Remove all material from the workholder. Remove the clamp and heat
block inserts. If present, swing up the cleaning head of the contamination removal system (CRS). Select OK when done.
G. Insert the magazine and Y-Z gauges by executing the following.
1. Place the magazine-sized gauge on the input mag handler load
tray. Position the gauge for pickup by benching it against the input
mag handler wall. Ensure that the label FRONT is facing the front of
the machine.
2. Insert the Y-Z gauge in the workholder, positioning its pins along the
rear rail. Carefully bench the Y-Z gauge (use very little pressure)
against the rear rail (see Figure A-61).
3. Select OK in the dialog box. This causes the input mag handler to
pick up the magazine-sized gauge.
H. Position the magazine-sized gauge at the correct Z axis location by
performing the following.
1. Using the Up and Down arrow keys on the MMI, chess the gripper
(fork) so that the Y-Z gauge input pin can be inserted freely into the
Z Axis hole on the magazine-sized gauge (observe CAUTION
below).
2. When alignment is correct, move the Y-Z gauge back into the
workholder, ensuring that the pin is free of the magazine gauge.
When the Y-Z gauge is positioned correctly, select OK in the dialog
box.
CAUTION: Do not leave the Y-Z gauge inserted into the magazine gauge when
chessing gripper.
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Maxµm Ultra Ball Bonder
Figure A-61 Inserting the Y-Z Gauge
I. Position the magazine-sized gauge at the correct lower Y axis location
by executing the following.
1. Using the Left and Right Arrow keys on the MMI, chess the gripper
(fork) so that the Y-Z gauge input pin can be inserted freely into the
lower Y Axis hole on the magazine gauge.
2. When alignment is correct, move the Y-Z gauge back into the
workholder, ensuring that the pin is free of the magazine gauge.
When the Y-Z gauge is positioned correctly, select OK in the dialog
box.
J. Position the magazine-sized gauge at the correct upper Y axis location
by executing the following.
1. Using the Left and Right Arrow keys on the MMI, chess the gripper
(fork) so that the Y-Z gauge input pin can be inserted freely into the
upper Y Axis hole on the magazine gauge.
2. When alignment is correct, move the Y-Z gauge back into the
workholder, ensuring that the pin is free of the magazine gauge.
When the Y-Z gauge is positioned correctly, select OK in the dialog
box.
K. Adjust the width of the unload tray magazine guide so that it clears the
magazine gauge when the gauge is ejected. Select OK in the dialog
box to eject the magazine gauge.
L. Remove the Y-Z gauge from the workholder rails. Select OK when
done.
M. Install heat block and clamp inserts. Select OK when done.
NOTE: This completes the Input Slot calibration procedures. If needed, perform
the Output Slot calibration procedures.
A.7.3
Calibration Results
Selecting [9] CALIBRATION RESULTS from the ‘Mag Handler’ menu displays
a dialog box containing the results of all the magazine handler calibrations. All of the items in the dialog box are for viewing purposes only and
cannot be changed by the user.
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Appendix A: Calibration
A.8 Incomplete Calibrations
Selecting [6] INCOMPLETE CALIBRATIONS from the Calibration menu displays the ‘Incomplete Calibrations’ dialog box. This dialog box will contain
a list of the incomplete calibrations for the bonder or the calibrations that
have not been done at all. If all required calibrations have been completed
successfully, the dialog box will be empty and the user can dismiss the
dialog by clicking on the DONE button. Any calibrations listed in the dialog
box should be performed before the user attempts bonding.
A.9 XY Table Characterization
Figure A-62 Bond Force Calibration and Results Dialog Box
Table mapping is a feature that will calibrate the X and Y offsets as a function of table position and then use the data to translate ideal coordinates
to the closest encoder count. This feature will calculate alignment and
bond locations based on a perfectly orthogonal XY plane.
WARNING: DURING THE CALIBRATION PROCEDURE, MHS COMPONENTS WILL
MOVE. BEFORE EXECUTING EACH STEP, REMOVE HANDS FROM
THE MAG HANDLER AND WORKHOLDER AREAS.
WARNING: HOT SURFACES EXIST ON HEAT BLOCKS AND HEAT BLOCK
INSERTS. BE CERTAIN TO EXERCISE EXTREME CAUTION WHEN
WORKING IN THESE AREAS.
NOTE: This calibration procedure should be applied with the heat block temperature lower than 30ºC. Turn off the workholder heaters and diffuser.
Allow the workholder to cool off for 90 minutes.
•
Required Gauges
1. XY Table/ Optics Map Gauge (P/N 08088-0912-002-04)
•
Tools/Material
1. Heatblock for BGA or an equivalent (flat on top surface)
•
Procedure
A. Turn off the workholder heaters and diffuser. Allow the workholder to
cool off for 60-90 minutes.
B. Remove the capillary, the clamp and heatblock insert from the
workholder.
C. Select CALIBRATION from the mode bar.
D. Select [7] XY TABLE CHARACTERIZATION from the ‘Calibration’ menu.
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Maxµm Ultra Ball Bonder
E. Follow the screen instructions to carry on the table mapping.
1. Workholder mechanism ready to move (rails will open wide). Keep
hands out of workholder until assistance requested. Select OK
2. When prompt to install the Heatblock, install the BGA Heatblock
and then select OK.
3. Then insert the XY Table/ Optics Map Gauge (08088-0912-002-04)
on the heatblock and select OK.
F. Setup XY Table/ Optics Map Guage.
1. Adjust the focus using the arrow keys until a sharp image is
obtained.
2. Adjust the glass scale theta alignment manually using the patterns
as reference by chessing from side to side (Activate XY chessing).
Turn off the heatblock vacuum when doing the alignment.
3. Press CENTER or F5 and then manually locate the center pattern
and position the cursor in the middle.
G. Setup Box size.
1. Select Box size vertical and set as 50 mils.
2. Select Box size horizontal and set as 50 mils.
H. Select F7 START CHARATERIZATION and table mapping will automatically commence.
I. Without changing the setup, chess to the center pattern again and
select the F8 VERIFICATION.
J. After table map verification is completed and passed, follow the
prompts to remove the glass scale. If verification fails after the mapping:
1. Check optics assembly and ensure that the glass scale must be
held down tightly by vacuum. Repeat step F. to step I..
2. If verification still fails, a follow-up screen will prompt the user to
export the data out. Insert a floppy disk into the system computer to
proceed exporting the data.
K. If the no errors were reported during the verification test. Data could
still be extracted by using a console (if available) and type the following
command: copy “sd0/datacoll/verdata.map”,“/fd0/verdata.map”
ENTER.
L. Calibration data can also be extracted by typing the following command on the console (if available):
copy “sd0/datacoll/caldata.map”,“/fd0/caldata.map” ENTER.
M. Exit table menu by pressing ESC on the MMI.
N. Remove the gauge and Heatblock and re-initialize the bonder.
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Appendix A: Calibration
A.10
Gap Sensor
The Displacement Gap Sensor Premium Kit (DGSPK) was introduced to
improve machine parameter portability by determining the USG personality factors based upon the capillary displacement measurements in a free
air condition. The DGSPK is intended to make the process of USG displacement measurement more automated.
Figure A-63 General Outlook of the GAP sensor box
NOTE: The GAP sensor head should be connected to the GAP receiver and
should be powered for 25 minutes before it is used for any setup or data
collection.
To power up the GAP sensor, connect the AC cord to a power source and
connect the 12v jack at the back of the GAP sensor box. Connect the sensor cable to the GAP sensor box on the sensor female connector and then
press the [MOD] button and ensure the status LED is RED. GAP device is
in setup mode.
To prepare the machine before GAP sensor calibration, remove the old
capillary and replace with a 60um capillary and torque to 35 oz in. Do a
USG calibration and then Crosshair offset calibration.
NOTE: If one of more of the calibrations mentioned above is/are not done, there
will be a pop up error to do the calibrations.
To start the calibration, select [8] GAP SENSOR from the Calibration menu (see
Figure A-64). Before the calibration begins the heater and diffuser will be
turned off, illumination will be set to zero and any MHS motions will be disabled. The Heater temperature will be monitored and the calibration will
not proceed until the temperatures are within a safe range. After completion of the calibration, all settings will be restored to their previous state.
Personality Factors will be non editable during the Gap Sensor Calibration.
Figure A-64 Gap sensor calibration screens
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Maxµm Ultra Ball Bonder
NOTE: This calibration procedure should be applied with the heat block temperature lower than 30ºC. Turn off the workholder heaters and diffuser.
Allow the workholder to cool off for 90 minutes.
NOTE: Remove the top clamp and EFO wand before proceeding to the next
step. Turn off air guide and work light.
A. Select ESCAPE to abort the operation, or OK to continue with the operation. If any of the calibration mentioned previously is not done or not
properly performed, the user will be asked to perform that particular
calibration. If all the calibrations are properly done, the dialog box for
Step 1 of the Gap Sensor Calibration appears (see Figure A-65)
Figure A-65 Gap Sensor Calibration Step 1
B. The first menu of the GAP calibration provides step by step procedure
to be followed by the operator.
1. Insert the heatblock (68L or BGA substrate).
2. Close the clamp from workholder menu.
3. Adjust the illumination accordingly.
4. Target the crosshair to the center of the heatblock and press B1 to
update the crosshair position.
5. Select 3 to move to the center of the GAP sensor and select OK to
confirm heatblock center position.
6. Replace heatblock with gap sensor as prompted and select OK
when done.
NOTE: Carefully place the GAP sensor on the heatblock pedestal. The wire
connector (white cable) from the sensor must be on the left side. Do not
touch this cable during the activation of USG.
C. The second menu of the GAP sensor now appears. Perform the steps
listed in Figure A-66.
Figure A-66 Gap Sensor Calibration Step 2
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Appendix A: Calibration
1. After selecting MOVE THE BONDHEAD TO THE Z POSITION, the user
should see the value updated on GAP sensor box panel display.
2. Press DONE to proceed to the next menu.
D. The third menu will now display as shown in Figure A-67. Follow the
step by step instructions.
Figure A-67 Gap Sensor Calibration Step 3
1. 1. Press SHIFT + F8 to activate XY chessing. Use the UP/DOWN
keys in the Y direction to obtain an initial reading of 1090 S to 1110
S (on the front panel of GAP sensor display).
2. 2. Press MOD once and then press RANGE twice to change the display of the front panel of GAP sensor box to ORANGE colour.
3. 3. The GAP sensor is now ready to take the reading from the transducer movement.
NOTE: Display value on front panel may vary due to the resonance of z encoder
or due to the following reasons: Diffuser turned ’ON’, illumination turned
’ON’ and/ or sensor head cable not secure or disrupted during any
movement while USG is activated.
4. Check and change USG current based on the capillary installed on
the transducer. See USG current specification below:
a. 90um capillary process = 100mAmp
b. 60um capillary process = 60mAmp
c. 45um capillary process = 58mAmp
E. Select ACTIVATE USG to activate the USG and read the displacement
from the front panel of GAP sensor box and document it. See Figure A68 for a table guideline of three process displacement values. Select
DEACTIVATE USG to deactivate USG firing.
Figure A-68 Gap Sensor Calibration Step 3
F. If any process is below or above the given specification from the table,
select USG PERSONALITY VALUES and adjust the current factor using a
lower or higher value. Select DONE from USG PERSONALITY menu.
Repeat step E and F until correct displacement is achieved. Select
DONE when complete.
G. Remove GAP sensor from workholder when prompted.
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Maxµm Ultra Ball Bonder
H. Load the process program based on the capillary installed and do the
bonding and record all the results using the production checklist. If all
the results are within specification, the calibration is complete.
A.11
Process Program Portability Factors
Process Program Portability Factors is a feature that enhances the
Maxµm Ultra by making process programs 100% portable from bonder to
bonder. This feature is intended to allow the user to program compensation values (portability factors) for following bond parameters: EFO Current Offset, Loop Height Scaling Factor and Loop Height Offset, Bond
Force Offset, USG Current Offset, USG Power Offset and USG Voltage
Offset. These portability factors are part of the machine dependent parameters (MDPs). It is the responsibility of the customer to manually calibrate
those portability factors such that the same process program can be used
for different machines to achieve the same process performance.
The portability factors supported in this feature are presented to the user
through their associated calibration dialog boxes and menus. The user
manually calibrates those portability factors such that the same process
program can be used for different machines to achieve the same process
performance.
Each of the portability factors are password protected (if a password has
been set). If no password exists, a dialog box appears informing the user
of the same. To continue, the user must click on the OK button in the dialog box.
Any calibrations performed on the bonder does not change the portability
factors established. However, offset values may have to be adjusted if
there are changes to the USG components and/or the bond head. If the
user has modified the machine default portability factors, a warning message is displayed to remind the user that the portability factor may have to
be adjusted after the calibration has been completed. The portability factors are applicable to the corresponding process parameters used in manual/auto bonding, bondoff and crosshair calibration functions.
The following topics discuss each individual portability factor.
A.11.1
EFO Current Offset
The EFO Current Offset portability factor is accessed by the user first
selecting [2] EFO HEIGHT from the ‘Bond Head’ calibration menu. The user
then selects [3] CHANGE EFO CURRENT OFFSET from the ‘EFO Height’ calibration dialog box. The user then enters the password (if a password
exists) or selects OK. In either case, the ‘Change EFO Current Offset’ dialog box appears (see Figure A-69).
Enter Password
or Select OK
Figure A-69 Portability Factor - EFO Current Offset
The user may change the EFO Current Offset by selecting [1] EFO CURRENT OFFSET from the ‘Change EFO Current Offset’ dialog box. When all
changes have been made, the user selects DONE.
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Appendix A: Calibration
A.11.1.1
EFO Current Offset (Parameter Definition)
EFO CURRENT OFFSET This parameter offsets the EFO current; thereby
compensating for differences in the EFO system that could effect the output current and ultimately effect the Free-Air-Ball size (FAB). The value of
this parameter is added to the value of the ‘EFO Current’ parameter which
resides in the ‘Edit Ball Parameters’ dialog box (see Section 6, Edit Bond
Parameters). The result of the calculation is then sent to the EFO box.
The value of this parameter is expressed in milliamperes (mAmps). The
value range is ± 5 mAmps with the default value being set to 0 (zero).
A.11.2
Loop Height Factor/Offset
The Loop Height Factor/Offset portability factors are accessed by the user
first selecting [3] Z AXIS ADJUSTMENTS from the ‘Bond Head’ calibration
menu. The user then selects [3] LOOP HEIGHT FACTOR/OFFSET from the ‘Z
Axis Adjustments’ menu. This causes the ‘Change Loop Height Scale/Offset’ dialog box to appear. From this dialog box, the user selects [1]
CHANGE LOOP HEIGHT SCALE/OFFSET. The user then enters the password
(if a password exists) or selects OK. In either case, the ‘Change Loop
Height Scale/Offset’ dialog box appears (see Figure A-70).
Enter Password
or Select OK
Figure A-70 Portability Factors - Loop Height Factor/Offset
Working in the ‘Change Loop Height Scale/Offset’ dialog box, the user
may change the ‘Loop Height Scale Factor’ or ‘Loop Height Offset’ by
selecting [1] or [2] respectively. When all changes have been made, the
user selects DONE.
A.11.2.1
Loop Height Factor/Offset (Parameter Definitions)
This parameter is used to scale the loop
height; thereby compensating for differences in the Z motions that could
effect the loop height consistency. The range is between 0.95 to 1.05, and
the default scale should be 1.0 ( 1.0 = 100%). The resolution of the scale
factor is 0.0001.
LOOP HEIGHT OFFSET This parameter is used to offset the loop height;
thereby compensating for differences in the Z motions that could effect
loop height consistency. The resolution of the offset value is .01 mils. The
range is ± 2 mils with the offset default value being 0 (zero).
LOOP HEIGHT SCALE FACTOR
A.11.3
Bond Force Offset
The Bond Force Offset portability factor is accessed by the user first
selecting [4] BOND FORCE from the ‘Bond Head’ calibration menu. The
user then selects [3] CHANGE BOND FORCE OFFSET from the ‘Bond Force
Calibration’ dialog box. The user then enters the password (if a password
exists) or selects OK. In either case, the ‘Change Bond Force Offset’ dialog box appears (see Figure A-71).
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Enter Password
or Select OK
Figure A-71 Portability Factor - Bond Force Offset
The user may change the Bond Force Offset by selecting [1] BOND FORCE
OFFSET from the ‘Change Bond Force Offset’ dialog box. When all
changes have been made, the user selects DONE.
A.11.3.1
Bond Force Offset (Parameter Definition)
BOND FORCE OFFSET This parameter is a value expressed in grams and
is used to offset the actual bond force applied by compensating for differences in the bond head system that effects bond force and ultimately ball
size and shear. The resolution of the value is 1 gram and the range is ± 5
grams with the default value being 0 (zero).
A.11.4
USG Personality Values
The USG portability factors (Personality Values) are accessed by the user
first selecting [5] USG from the ‘Bond Head’ calibration menu. The user
then selects [8] USG PERSONALITY VALUES from the ‘USG Calibration’ dialog box. The user then enters the password (if a password exists) or
selects OK. In either case, the ‘USG Personality Values’ dialog box
appears (see Figure A-72).
Enter Password
or Select OK
Figure A-72 Portability Factors - USG Personality Values
The user may change any of the USG Personality Values by selecting
items [1] through [6] from the ‘USG Personality Values’ dialog box. Clicking
repeatedly on item [7] allows the user to display the values in machine or
engineering units. When all changes have been made, the user selects
DONE.
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Appendix A: Calibration
A.11.4.1
USG Personality Values (Parameter Definitions)
Voltage Factor is used to normalize the USG behavior
of the bonder. The value of this parameter is multiplied by the value of the
‘USG Volts’ parameter which resides in the ‘Edit Bond Parameters’ dialog
box (see Section 6, Edit Bond Parameters). The result of the calculation is
then sent to the USG board.
VOLTAGE OFFSET Voltage Offset is used to offset the actual USG voltage
applied; thereby compensating for differences in the bond head and transducer system which effect the amplitude of the ultrasonic scrub, and ultimately ball size and shear. The value of this parameter is added to the
value of the ‘USG Volts’ parameter which resides in the ‘Edit Bond Parameters’ dialog box (see Section 6, Edit Bond Parameters). The result of the
calculation is then sent to the USG board. The value of this parameter is
expressed in millivolts (mVolts). The value range is ± 2000 mVolt with the
default value being set to 0 (zero).
VOLTAGE FACTOR
Current Factor is used to normalize the USG behavior
of the bonder. The value of this parameter is multiplied by the value of the
‘USG Current’ parameter which resides in the ‘Edit Bond Parameters’ dialog box (see Section 6, Edit Bond Parameters). The result of the calculation is then sent to the USG board.
CURRENT FACTOR
CURRENT OFFSET Current Offset is used to offset the actual USG current
applied; thereby compensating for differences in the bond head and transducer system that effects the amplitude of the ultrasonic scrub, and ultimately ball size and shear. The value of this parameter is added to the
value of the ‘USG Current’ parameter which resides in the ‘Edit Bond
Parameters’ dialog box (see Section 6, Edit Bond Parameters). The result
of the calculation is then sent to the USG board. The value of this parameter is expressed in milliamperes (mAmps). The value range of this
parameter is ± 25 mAmps with the default value being set to 0 (zero).
Power Factor is used to normalize the USG behavior of
the bonder. The value of this parameter is multiplied by the value of the
‘USG Power’ parameter which resides in the ‘Edit Bond Parameters’ dialog box (see Section 6, Edit Bond Parameters). The result of the calculation is then sent to the USG board.
POWER FACTOR
Power Offset is used to offset the actual USG power
applied; thereby compensating for differences in the bond head and
transducer system that effects the amplitude of the ultrasonic scrub, and
ultimately ball size and shear. The value of this parameter is added to the
value of the ‘USG Power’ parameter which resides in the ‘Edit Bond
Parameters’ dialog box (see Section 6, Edit Bond Parameters). The result
of the calculation is then sent to the USG board. The value of this
parameter is expressed in milliwatts (mWatts). The value range is ± 50
mWatt with the default value being set to 0 (zero).
POWER FACTOR
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Appendix B: Glossary of Terms & Abbreviations
B Glossary of Terms & Abbreviations
-AALIAS:
Area or feature on a die or leadframe which may be mistaken by the PRS for a valid eye
point.
ALIGNMENT: Material alignment is the positioning of the material at the bondsite. This positioning may
be accomplished by the use of the Pattern Recognition System or by the operator depending on the parameters and settings in the bond program.
ALIGNMENT TOLERANCE: Maximum allowable deviation from the programmed distance between the
two operator points of a reference system. Valid only for 2-point reference systems. Suggested tolerance should be 10% of the smallest bond pad dimension. For outer leads, it
should be referenced to the lead with tolerance and may be somewhat greater to allow for
the potentially larger expansion.
ALTERNATE EYE POINT: An eye point for an alternate reference. For example: if there are two possible
vendors of a particular die that the manufacture uses where the two die are not identical,
the program would call out an alternate reference system/eye point. See also "Backup Eye
point".
AXIS POSITION INDICATORS: X, Y and Z values at the upper right of the monitor screen. X and Y values
of the crosshair are relative to the previously entered X-Y zero. Z refers to the bondhead
height, again with reference to a previously entered zero location.
-BBACKUP EYE POINT: Another eye point on the same die in a different location. Its purpose is to give the
vision system a second chance to find an eye point for alignment purposes.
BITS:
Bond Integrity Test System. Used to detect non-stick bonds at the die (NSOP), non-stick
bonds at the leadframe, or short tails (SHTL) during auto bonding.
BIMODAL:
Only two primary brightness levels are present.
BOND FORCE: The force applied to promote a good bond (capable of providing an electrical connec-
tion). It is the contact force, in grams, exerted on the wire during bonding.
BOND HEIGHT: The height at which the bonding tool touches the work surface.
BOND OFF: A process for forming a gold ball once the wire is loaded through the capillary (with a frac-
tion of an inch extended beyond the capillary). Used when repairing a broken wire or
replacing a wire spool.
BOND POWER: The ultrasonic energy exerted by the USG during bond time.
BOND PROGRAM: see Process Program.
BOND TIME: The length of time that the USG is turned ON for each bond. This affects the strength of
the bond. If bond time is too low or too high, the bonds will be relatively weak. Experimentation using shear tests will reveal the optimum setting.
BONDING:
Bonding requires the calculation of bond locations based on the alignment data and the
control of all the subsystems necessary to accomplish the bonding.
BOOT/BOOTING: The initial activity of the machine after a reset or power up to re-load the machine’s
software and prepare it for processing.
BUTTON:
A button may be square, rectangular, or triangular in shape. When clicked on, it starts a
process, brings up a dialog box, steps through a list of choices, increases/decreases a
value, or opens an edit field.
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Maxµm Ultra Ball Bonder
-CC/V:
see Constant Velocity Value.
CALIBRATION MODE: A mode of the machine that allows the operator to calibrate parameters of the
machine to ensure valid measurements. For example: to set the distance between the tool
and the optics (crosshair offset),find limits, set the pixels to pulse ratio in the PRS.
CAMERA IMAGE: The window that displays the image from the camera on the machine’s screen.
CAMERA LINEARITY: Alignment of the video camera CCD image element with the machine axes of
motion. This is accomplished by rotating the camera body.
CHESSING: Moving the work table (in the X and Y directions) corresponding to manual controls by using
the mouse and mouse button [B2]. Holding the Arrow button down will cause the auto
repeat function to take effect and the image will move at a continuous rate. Chessing only
applies to the graphics and video image window. There are three forms of chessing available to the operator:
•
JUMPING - Position the cursor at the desired location and press B2.
•
DRAGGING - Press and hold B2 then drag the image.
•
INCHING - Use the cursor keys on the keyboard to move a single pixel
at a time (depending upon the zoom factor).
COMPONENT FILES: The other files used with the Process Program File to create a process program.
The process program file has the .BND extension and may have a filename of up to 80
characters. A component file has a REF., .PRM, OPR, .CHG, .WIR, .PDL, or a .EYE
extension and may have a filename of up to 40 characters.
CONFIGURE MODE: A mode of the machine that allows the operator to configure or style the machine to
meet the factory’s needs.
CONSTANT VELOCITY VALUE (C/V): The speed of the capillary descending to the work surface after TIP
and, therefore, the constant velocity of the capillary against the work. If set too high,
bonds may be squashed. If set too low, the operating times may be unacceptably high.
Value is expressed in microns/msec or mmps.
CROSSHAIR: On-screen horizontal and vertical cross image which are used with the X, Y, and Z direc-
tional buttons to locate eye points, operator points, etc. for the process program. The large
yellow crosshair appears initially in the center of the graphics and the video image windows. The two windows and their crosshair are handled slightly differently. The crosshair
on the video image window is always centered. Selecting a new position causes the video
image to shift and the crosshair is automatically recentered. Hence, it is possible to "work
your way" across the bond site. The graphics image crosshair can be moved to any position in the graphics window and depending upon the zoom factor this may include the
entire work area or only a very small portion of it. Manipulation of either window will cause
an appropriate change in the other window.
CROSSHAIR OFFSET: A taught distance which compensates for the fact that the objective lens and the
capillary are not in line above a device. This adjustment is necessary when the crosshair is
being used to represent the location of the bond tool over the device.
CURSOR: The on-screen "+" used to point to and click on menus, menu items, and buttons and to grab
and adjust slide bars.
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Appendix B: Glossary of Terms & Abbreviations
-DDE-SELECT: To close or turn off a menu, menu item, function, or state by positioning the cursor on top
of the desired item and clicking the B1 (left) mouse button. If a state is de-selected, the
highlighting will be turned off to show that the state is no longer active.
DEFAULT BUTTON: A square button with a “D” in the center of it. Clicking on this button will set a
parameter value to its pre-determined default value.
DEFAULT BUTTON
DIALOG BOX:A window that appears temporarily to request information or to allow adjustment or selec-
tion of settings/parameters.
DOUBLE-CLICK: To rapidly press and release the mouse button [B1] twice without moving the cursor.
DRAG:
To move an item on the screen by first positioning the cursor over the item and then pressing and holding the mouse button [B1] while manipulating the mouse to move the cursor.
DRY CYCLE: Cycle the MHS workholder with or without material present in the workholder, without
bonding wire.
-EEFO:
see Electronic Flame-Off.
EFO GAP:
The vertical distance between the EFO electrode and the tip of the wire on the capillary
when the bond head is at its reset position.
EFO OPEN: Refers to an error condition that occurs when the wire tail is too short or no wire is at the tip
of the capillary or the EFO Gap is too great.
EFO TIME:
The time that the EFO is turned on.
EJECT:
This refers to the activity of transferring materials from one mechanical sub-system to
another. For example: eject a leadframe refers to the process of moving a leadframe from
the output side of the workholder to the output magazine in the output elevator. To eject a
magazine means to move it from the elevator to the output platform.
ELECTRONIC FLAME-OFF: The hardware that produces the electronic spark to make the gold ball form
at the end of the wire exposed at the tip of the capillary.
ENTER:
Using the MMI keypad or the keyboard to enter and edit information.
EYE POINT: A human and machine identifiable feature of the material. The number of eye points and
their location can be specified in process program. This reference point is learned by the
PRS during the teach sequence. For each reference system, the number of eye points
must equal the number of operator points. Die eye points make use of the fine detail typically found on die reference systems. Lead eye point looks for long straight edges such as
those normally found in an outer lead reference system.
EXCEPTION: Failure, fault, or unusual occurrence.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
B-3
Maxµm Ultra Ball Bonder
-FFACTORY AUTOMATION SERVER/SYSTEM: A computer which can supervise the wire bonder through a
communications link using the SEMI SECS protocol.
FAS:
Factory Automation Server/System.
FORCE:
see Bond Force.
FUNCTION BUTTONS: Two rows each containing 10 buttons at the bottom of the screen. These buttons
are used to begin or end an action. The function associated with a button may change
when certain types of operations are performed.
FUNCTION KEYS: The row of 10 keys at the top of the keypad located on the MMI. These keys perform
the same functions as the bottom row of Function buttons. The function associated with a
key may change when certain types of operations are performed.
-GGUI:
An abbreviation for the term Graphical User Interface.
-HHOST:
A remote computer that can gather or issue process information from/to the machine,
select process programs for the equipment, and control the machine.
HOST INTERFACE: A technique to exchange information between a host computer and the machine.
The host computer may also exert control over the machine using this interface.
HOT KEY:
The numeric character associated with an item in a menu or dialog box. When working in
menus or dialog boxes, pressing the item’s Hot Key selects the that item. By selecting the
item, a data entry field may open, an operation may be performed or another menu or dialog box may appear.
HOT
KEY
-IIC:
A device with two reference systems: the outer leads or substrate and the die.
ICON:
A symbol that represents a window or action/s.
INDEXING:
Indexing moves new material into position for bonding. Indexing may occur after an entire
unit has been processed or after a partial unit has been processed. The index may present
an entirely new unit to the bond location or a new part of the same unit.
INJECT:
Generally this term refers to leadframes and usually means a leadframe will be moved
from the input magazine into the workholder.
-JJ WIRE:
A Kulicke and Soffa technique to lay designed bent wires. This technique puts a J-shape
into the bonding wire by using a parameter called lateral motion.
JOG:
A term to indicate a vertical index of a mag handler’s gripper assembly.
B-4
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© 2006 kulicke & Soffa Industries Inc
All Rights Reserved
Appendix B: Glossary of Terms & Abbreviations
-KKEYBOARD: A QWERTY keyboard (keypad) located on the MMI (see MMI).
KINK HEIGHT:The vertical distance between the first bond and the position above the first bond where
the XY table starts the Reverse Motion.
-LL/F:
LeadFrame.
LEADFRAME:Carrier for IC devices incorporating metal leads to which wires from IC bond pads are
attached
LIGHT TOWER:A post on which a number of signal lights are mounted to indicate the machine’s state
(Motors stopped, operating automatically, error, etc.).
LINEARITY: Camera rotation. See Camera Linearity.
LOT:
A grouping of materials for tracking purposes.
LOT ID:
A name or number associated with a lot for identification purposes.
LOT TRACKING:A technique to monitor the process and collect data for historical purposes.
LOW LOOPING:The Kulicke and Soffa process for making very low wire loops.
LOWER CONSOLE:The machine’s main card rack, electronics(cards), power supplies, amps for the ser-
vos and steppers, the disk drives, the chassis, and the fans.
LTOL:
An abbreviation for the term “line tolerance”. Line tolerance is used to ensure that the
placement of operator points and eye points are valid.
-MM/C:
Machine.
MACHINE DEPENDENT PARAMETER: A bonder or machine specific parameter.
MAN MACHINE INTERFACE (MMI): Means through which the machine operator communicates with the
control system. Operator controls via the mouse, buttons, function keys, and keypad on
the lower console.
MANUAL:
Depending upon context this term may refer to the Manual Mode of the machine’s operation or indicate human intervention is required to complete a process.
MANUAL MODE: A machine mode that allows the operator to bond wires in a manual fashion. That is,
designate the location of bond sites and lay a single wire.
MATERIAL HANDLING SYSTEM: The Material Handling System consists of the electronics, mechanics,
and controlling software that is used to move material through the machine. The Material
Handling System may be considered as part of the process if the heating elements are
controlled by the Material Handling System.
MATRIX:
An array of chips, devices or device groups that are arranged in columns and rows.
MBD:
Missing Ball Detector.
MDP:
see Machine Dependent Parameter
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
B-5
Maxµm Ultra Ball Bonder
MENU:
A list of available commands in a window. Menu titles may appear in the banner at the top
of the window. The illustration shows the MANUAL mode menu.
MODE
BAR
MENU
MHS:
see Material Handling System.
MMI:
see Man Machine Interface.
MODE:
A logical grouping of related tasks or functions usually accessed by selecting the “mode” of
operation in a dialog box or menu (e.g., “Add” mode when teaching operator points). This
term could also be used to refer to an operating state of the machine such as Auto mode,
Manual mode, Program mode, etc.
MODE BAR: The horizontal bar that contains the names of the program’s major sections or modes. The
mode bar is at the top of the display screen. The illustration above shows the leftmost
modes in the mode bar. MANUAL mode is the active mode
MOTORIZED WIRE SPOOL: Activated by a sensor indicating the wire loop is getting taunt and deacti-
vated by a sensor indicating the wire loop is getting slack.
MOUSE:
Input device with three buttons and a ball used to position an on-screen cursor and make
selections or adjustments (see illustration).
MOUSE BUTTONS: The three mouse buttons are located on the mouse and are referred to as B1, B2,
and B3 on the screen. The function of each button changes depending on the operations
being performed on the screen. Refer to the screen for the current button functions. Some
of the possible functions for the three buttons are listed below.
Mouse Buttons
B1, B2, B3
Mouse
•
B1 = Left Button: Select, Add/Learn, Unselect, Next, Step
•
B2 = Center Button: Chess
•
B3 = Right Button: Delete, Unselect, Auto Learn, Relearn, Assign,
Disassociate, Reverse
MTBA:
Mean Time Between Assists. Average length of time between bonder-detected errors.
MTBF:
Mean Time Between Failures. Average length of time between events that require actual
repair by a technician.
MTTA:
Mean Time To Assist. Average amount of time to fix a bonder program.
MTTR:
Mean Time To Repair. Average amount of time needed for a technician to complete the
repair.
MWS:
see Motorized Wire Spool
MULTI-CHIP: A device with more than 2 reference systems: one for outer leads or substrate and one for
each die on the device.
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© 2006 kulicke & Soffa Industries Inc
All Rights Reserved
Appendix B: Glossary of Terms & Abbreviations
-NNSOL:
No Stick on Lead. BITS error message indicating wedge is lifted from the second bond.
NSOP:
No Stick on Pad. BITS error message indicating ball is lifted from the first bond.
-OON-LINE HELP:A window is displayed containing text that explains an indicated object for the machine
operator. Note: once On-line Help is activated other topics are available for review.
ON-LINE PROCEDURE: A window with information for the machine operator that gives step by step
instructions for some procedure to be performed on the machine. For example: threading
the wire.
OPEN:
To display the contents of a file in a window or to enlarge an icon to a window.
OPERATOR POINT: A location on the die or outer lead that a machine operator can identify to ensure
the device is properly aligned. This reference point is taught by the operator. Used if the
PRS fails. Must be targeted before device can be bonded. Preferred location is on bond
pad or streets.
OPTICS OFFSET:The displacement between the center of the optical path and the bonding tool.
-PPAD FIND:
This function uses the PRS to automatically center first bonds on bond pads.
PATTERN RECOGNITION SYSTEM (PRS): A part of the Vision System. This term usually refers to the elec-
tronics and software that actually recognize patterns at the work site for alignment purposes. The PRS allows the bonder to operate without attention by automatically finding
eye points before each device is bonded. Compensates for variations in die location from
package to package.
PERFORMANCE LOGGING: Refers to statistical information that can be automatically gathered by the
machine and includes such information as MTBA, MTTA, MTBF, MTTR, and Utilization
time.
PFR:
see Power Failure Recovery.
PIXEL:
The smallest graphic unit that can be displayed on the screen, usually a single dot.
POINT:
Moving the cursor to a specific area on the screen.
POWER FAILURE RECOVERY: This routine provides resumption of automatic operation after power fail-
ure.
PREHEAT:
Heating the device before it reaches the bond station.
PROCESS PROGRAM (PP): Made up of re-usable modules of ASCII text that can be read, modified,
saved, and restored. These modules contain the instructions and parametric information
that the machine will need to process materials.
PROCESS PROGRAM FILE:Main file of a process program. Component Files are the other files used
with this file to create a process program. The process program file has the .BND extension and may have a filename of up to 80 characters.
PROCESS STATISTICS:Refers to information automatically gathered by the machine while the equip-
ment is automatically bonding. Included in this set of statistics would be: number of
devices bonded, and number of bonds since capillary was replaced.
PROGRAM MODE:A mode that allows the operator to load, edit or teach a process program.
PROMPT:
A program initiated statement which indicates an operator action is needed. Prompts are
normally located in dialog boxes or in the monitor screen’s information boxes, below the
Mode bar.
PRS:
see Pattern Recognition System.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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B-7
Maxµm Ultra Ball Bonder
PRS CALIBRATION:A procedure to establish the relationship between the vision systems pixels and the
machines motion pulses particularly to ensure orthogonality between the two systems.
-Q-RRADIO BUTTON:A diamond shaped button. Radio buttons are grouped in sets of two or more. Only one
radio button per set can be active at a time. As shown in the example, “Normal Index” is
selected.
RADIO
BUTTONS
REFERENCE SYSTEMS:A reference system is a logical grouping of bond sites, typically all the bond sites
of a particular object in the work area, always of the same height. Examples of reference
systems are:
•
all the bond sites on a die
•
all the bond sites on the outer lead (lead shelf)
The goal of the reference system technique is to allow the mixing and matching of die and
outer lead without the necessity of re-teaching. A complete process program would contain the definition of all of the reference systems in the work area in addition to instructions
regarding the wiring of the device.
REFERENCE SYSTEM ORIGIN: The origin (0,0) of an instance of a reference system.
REVERSE BONDING: Refers to the reverse sequence of bonding. Where typically, when ball bonding,
the first (ball) bond is on the die and the second (wedge) bond is on the lead. In reverse
bonding the first bond is on the lead and the second bond is on the die pad.
REVERSE MOTION: The reverse motion causes the XY table to move a defined distance in the reverse
direction (away from the second bond) after the bond head has risen to a preset height
(Kink Height) while still above the first bond to achieve a unique wire shape.
-SS ING:
This term refers to unintentionally curved wires. When viewed from the overhead position
these wires take on a slight “S” shape.
SCAN CORRIDOR: The area and direction that the VLL will scan when searching for the lead.
SCREEN: The display area of the monitor.
SCROLL BAR: A horizontal or vertical bar within a dialog box containing a center button which can be
moved to show additional text or choices.
SELECT:
To choose or turn on a menu, menu item, function, or state by positioning the cursor on top
of the desired item and clicking mouse button B1. If a state is selected, the selection will be
highlighted to show that it is active. Items in dialog boxes and menus may also be selected
by pressing the item’s “Hot Key” if a number is to the left of the item.
SEQUENCE STOP MODE: A mode the machine enters when the operator presses the sequence Stop
Button while the machine is in automatic mode. Its effect is to pause the action at the earliest safe place in the process. For example: at the end of a wire or at the end of an index.
While in Sequence Stop mode the operator may operate the machine as if it were in Manual mode. While generally it is assumed the operator will release the sequence stop button
and continue processing materials, it is possible to escape automatic operation entirely
from this mode of the machine
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© 2006 kulicke & Soffa Industries Inc
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Appendix B: Glossary of Terms & Abbreviations
SHTL:
Short Tail. BITS error message indicating that the wire tail formed after the second bond is
too short.
SITE:
Depending on context it can mean a bonding site (a die pad or lead bonding site), a die, a
die and outer lead, device group, or all the area accessible by the bond head.
SKIP:
An index where the materials that will be moved away from the work site have not been
processed.
SLIDE BAR: A horizontal or vertical bar with a center button used to make sliding adjustments to a set-
ting such as illumination or focus. As shown, the illuminators can be increased by moving
the center button to the right or decreased by moving it to the left.
SLIDE BAR
SOIC:
Small Outline IC.
SPC:
see Statistical Process Control.
STANDBY:
This mode is entered by pressing the [Motor Stop] control button on the MMI. In Standby
mode, power to the electric motors and solenoids is interrupted.
STATISTICAL PROCESS CONTROL: A technique to improve manufacturing yield by gathering and ana-
lyzing data, and then altering the process while in progress to improve or keep the product
consistent.
STEP AND REPEAT: A machine feature to process a number of identical devices (device groups) with-
out an index. For example, if several identical die are in the same work site instead of
teaching each die individually the operator would teach the process once and then teach
only the locations of successive die.
SWAP:
To move the images in the screen’s display windows so that they change place (swap).
The image in the large window moves to the small window and the image in the small window moves to the large window. Initiated by the pressing F1 function key.
-T[TAB]:
A key used to move from one edit field or selection to the next.
TABLE MAPPING:A method of correcting any precision errors in the XY table positioning.
TABLE ORIGIN:The absolute origin (0,0) of the table. Reference System Origins are located within
(mapped on top of) this reference system.
TAIL LENGTH:Tail length is the length of the wire “tail” left hanging below the capillary after the second
bond is made. This parameter effects the size of the ball that will be formed by the EFO.
TIP:
see Tool Inflection Point.
TIP HEIGHT: The height above the work surface to start search (or constant) velocity.
TOL CORRECTION: Top of Loop correction equalizes wire payout and adjusts trajectory during part of
the cycle to help loop height consistency in some applications.
TOOL INFLECTION POINT: The distance above the bond surface at which the speed of the descending
capillary changes from controlled deceleration to constant velocity. TIPs are learned for all
wires. Subtracting the programmed TIP offset value from the learned bonding height gives
the TIP offset.
TRANSDUCER:A device that converts electrical into vibration energy to weld the wire.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
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B-9
Maxµm Ultra Ball Bonder
-UULTRASONICS GENERATOR: The mechanics and electronics that vibrate the transducer as part of the
bonding process.
UPPER CONSOLE: Bonder subassemblies including: monitor, man machine interface, keyboard, light
tower, audio alarm, wire feed, pneumatic controls and cabling.
UPH: UNITS PER HOUR. The number of units bonded per hour.
UPS:
Uninterruptible Power Supply.
USG:
see Ultrasonics Generator.
UTILITIES MODE: A mode of the machine that allows the operator to make adjustments that are typically
not related to the process. For example: copying disks, deleting files, etc.
-VVIDEO LEAD LOCATOR: Finds exact taught location of bond positions on the outer leads to each device
to ensure accurate placement. Maintains information about position, angle, width, and illumination levels. Notifies bonder of any lead displacements to ensure correct bond placement. Takes video image directly from the monitor.
VISION SYSTEM: There are two aspects of the vision system: the optics and the electronics. The Vision
System provides information for the proper alignment of die bond sites and leads within
the work site.
VLL:
see Video Lead Locator.
VLL ASSOCIATION: A contiguous group of leads that can be viewed by the Vision System from one
position of the table.
-WW/C:
Wire clamp.
W/H:
Workholder.
WIRE FEED: A system for taking wire from a wire spool and delivering it to the bonding tool. A wire feed
mechanism including: mechanics, electronics, sensors, and controlling software.
WIRE GROUP:A group of wires that reside in the same reference system that have the same bond
parameters applied to them.
WIRE PATH: The mechanics including: possibly compressed air, supports, etc. that is the bonding wire’s
route from the spool to the capillary.
WIRE SAG: Refers to a wire whose loop tends to dip down unintentionally.
-XX AXIS:
The side to side motion of the bond head (see XY table).
X-Y ZERO:
Primary alignment point for a package. Used as point from which all other X and Y coordinates are calculated. Suggested location is at bottom left-hand corner of package on a
lead.
XY TABLE:
A positioning system for moving a load (a bond head in the case of wire bonders) in XY
(horizontal) space.
B-10
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© 2006 kulicke & Soffa Industries Inc
All Rights Reserved
Appendix B: Glossary of Terms & Abbreviations
-YY AXIS:
The front to back motion of the bond head (see XY table).
YIELD:
The percentage of good bonded devices processed by the machine vs. the number of
unbonded devices that enter the machine.
-ZZ APEX:
The highest point achieved by the Z axis between bonds of a single wire.
Z AXIS:
The up and down motion of the bond head.
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
B-11
Maxµm Ultra Ball Bonder
This page is left intentionally blank
B-12
98868-0000-002-02
© 2006 kulicke & Soffa Industries Inc
All Rights Reserved
Section C: System Wiring Diagram
C System Wiring Diagram
This section shows the system wiring diagram of Maxµm Ultra.
Figure C-1 Maxµm Ultra System Wiring Diagram page 1
Volume 2: Maintenance
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
C-1
Maxµm Ultra Ball Bonder
Figure C-2 Maxµm Ultra System Wiring Diagram page 2
C-2
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Section C: System Wiring Diagram
Figure C-3 Maxµm Ultra System Wiring Diagram page 3
Volume 2: Maintenance
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
C-3
Maxµm Ultra Ball Bonder
This page is left intentionally blank
C-4
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All Rights Reserved
Index
A
Abbreviations B-1, C-1
Adjust Bond Head Vertical Limits 5-32
Adjust Camera Linearity 4-15
Adjust EFO Wand Position 5-48, 5-50
Adjust Light Tower Height 3-32
Adjust Magnification 4-16
Adjust Microscope Field of View 3-36
Adjust Microscope Focus 3-35
Adjust Optics Focus 4-14
Adjust Wire Clamp Gap 5-10
Adjust Wire Clamp Lateral Position 5-9
Alarm, Audible 3-30
Align Transducer 5-36
B
Before Applying Power! i-iv
BITS
System Setup 3-24
Theory of Operation 3-16
BITS Errors 1-43
False NSOL Error Indications 1-47
False NSOP Error Indications 1-45
Non-Stick on Lead (NSOL) Errors 1-46
Non-Stick on Pad (NSOP) 1-43
NSOP - Broken Wire 1-45
Short Tail Error (SHTL) 1-48
Bond Head
Adjust Upper and Lower Mechanical Limits 5-32
Beryllium Product Warning 5-4
Bond Head Assembly
Components 5-5
Maintenance Procedures 5-7
Replace Capillary 5-7
Cables
Bond Head Flex Board 5-69
Cable List 5-68
Replace Bond Head Interconnect Board 5-70
Control System
Circuit Board Locations 5-63
Circuit Boards 5-63
Organization 5-62
Servo CPU (CPU2) 5-64
Servo Preamp Board 5-66
Z Amplifier 5-67
Electronic Flame-Off (EFO) 5-46
Overview 5-1
Preventive Maintenance 5-4
Adjust Clamp Gap 5-10
Adjust Wire Clamp Lateral Position 5-9
Align Transducer 5-36
Check/Clean Encoder Grating 5-15
Clean Clamp Jewels 5-12
Clean Clamp Jewels for 200 hours 5-13
Clean EFO Wand 5-51
Clean Wire Feed Tube 5-45
Inspect Capillary Clamp 5-9
Preventive Maintenance Guide 1-25
Remove Bond Head 5-24
Replace Wire Clamp 5-43
Replace Z Encoder 5-20
Replace ZTC Heater 5-30
Set Bond Head Height (Adjust Rails) 5-23
Ultrasonic Generator (USG) 5-56
Ultrasonic Transducer 5-56
Wire Clamp Driver 5-53
Bond Placement Problems 1-49
Bond Site Illuminators
Control System 4-20
Preventive Maintenance 4-23
Replace LED Illuminators 4-21
C
Cable Assemblies
Bond Head 5-68
Bond Head Flex Board 5-69
Lower Console 2-32
Ultrasonic System 5-56
Video Monitor 3-28
Vision System 4-32
XY Table 6-37
Calibration
BITS AGC A-30
Bond Force Calibration A-19
Bond Force Verification A-23
Bond Head A-7
Calibration Results A-50
Input/Output Slot A-48
Input/Output Tray A-46
Program Portability Factors A-56
bond force offset A-57
EFO current offset A-56
loop height factor/offset A-57
USG personality values A-58
PRS pixel A-5
Sequence Flowchart A-3
Servo A-4
Transducer Alignment A-14
USG Calibration A-25
Workholder
Clamp A-33
Indexer A-35
Rail Height Adjustment A-39
Rails A-31
Tucker A-38
Workholder Calibrations A-42, A-45
X Registration Sensor A-36
Camera
rotation A-7
Capillary
installation A-1
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
I-1
Maxµm Ultra Ball Bonder
Replacement A-27
Check Power Supply DC Outputs 2-44
Check Z Encoder Signal Amplitude 5-15
Circuit Boards
Communications Port 2-10
EFO 5-46
General Descriptions
Bottom Row 2-8
Top Row 2-7
Information in Sections 3 - 6 2-15
Information in Volume 3
MHS 2-15
Input/Output (I/O) & Temp Controller 2-11
Locations 2-6, 2-32
Replace Circuit Board 2-16
Servo CPU (CPU2) 5-64, 6-31
Servo Preamp 5-66, 6-33
Stepper/Sensor 2-13
System 2-5
Ultrasonic Generator (USG) 5-56
Vision System 4-29
VME Bridge 2-9
Wire Clamp Driver 5-54
Wire Feed/BITS 3-14
Wire Feed/BITS and Wire Feed Interface 3-25
XY Servo Amplifier 6-34
Z Amplifier 5-67
Clamp Calibration A-33
Clean Air Guide 3-20
Clean Bond Head Encoder Grating 5-15
Clean Compressed Air Input Filter 3-9
Clean EFO Wand 5-51
Clean Objective Lens 4-13
Clean Wire Clamp Jewels 5-12
Clean Wire Clamp Jewels for 200 hours 5-13
Clean Wire Feed Guide 1-33
Clean Wire Tensioner 3-21
Clean XY Table Motors 6-10
Clean/Inspect Wire Clamp Feed Tube 5-45
Configure Vision System Assembly 4-32
Control System 2-4
Card Rack Assembly 2-4
Backplane Assembly 2-5
Description 2-4
VMEbus 2-5
Circuit Boards 2-5
Maintenance Procedures 2-16
Organization 2-4
Preventive Maintenance 2-15
Replace Card Rack Air Filter 2-17
Replace TDI Fan Filter 2-43
Replace Circuit Board 2-16
Controls, Operator 2-19
Maintenance Procedures 2-21
Clean MMI 2-21
Remove/Install MMI 2-22
Replace MMI Keypad 2-23
Replace Mouse 2-23
I-2
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© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Cross Hair Offset A-8
D
Deformed Bonds 1-51
Dictionary B-1, C-1
Disk System
Floppy Disk Storage/Handling 2-26
Floppy Disks 2-26
Maintenance Procedures 2-28
Preventive Maintenance 2-28
E
EFO Open Errors 1-49
Electronic Flame-Off (EFO)
Description 5-46
EFO Box Assembly 5-46
Maintenance Procedures 5-48
Adjust Electrode 5-48, 5-50
Clean Electrode 5-51
Replace EFO Box 5-52
Replace Electrode 5-51
Emergency Stop Switch i-vi
Ethernet Connector 2-48
External Interfaces
Ethernet 2-48
Host Processor 2-10
F
Fire Safety i-vi
Fuses 2-42
G
General Precautions i-iii
Glossary B-1, C-1
I
Indexer Calibration A-35
Input Air Pressure Sensor Setup 3-10
Inspect Capillary Clamp 5-9
L
Light Tower
Adjust Light Tower Height 3-32
Audible Alarm 3-30
Description 3-30
Preventive Maintenance 3-32
Lockout/Tagout Procedure i-v
Looping Problems 1-41
Index
Lower Console 2-1
Cable Assemblies 2-32
Connector For External Equipment 2-48
Control System 2-4
General Description 1-4
MMI Assembly 2-19
Operator Interface 2-19
Components 2-19
Maintenance Procedures 2-21
Preventive Maintenance 2-21
Overview 2-2
Power System 2-36
Preventive Maintenance
Check DC Outputs 2-44
Clean MMI 2-21
Replace Card Rack Air Filter 2-17
Replace TDI Fan Filter 2-43
Test ESTOP Switch 2-21
Preventive Maintenance Guide 1-22
System Computer 2-26
Lubricate Rear Y Coupling Bearing 6-16
Lubricate Rear Y Slide Bearings 6-13
Lubricate X and Front Y Table Slide Bearings 6-12
M
Machine Emissions i-viii
Machine Installation 1-12
Machine Setup 1-12
Detailed Setup 1-15
Simple Setup 1-12
Magazine Handlers
Calibration
Calibration Results A-50
Input Slot A-48
Input/Output Tray A-46
Maintenance
Preventive 1-19
Maintenance Guide 1-1
Equipment Descriptions 1-2
Machine Software 1-6
Material Handling System 1-4
Optics & Vision System 1-6
Upper/Lower Console 1-4
User Interface 1-5
XY Table 1-4
Machine Installation 1-12
Recommended Spares 1-55
Routine Maintenance 1-28
Safety Considerations 1-10
Setup Guides 1-12
Special Tools 1-55
Specifications 1-7
Torque Specifications 1-56
Troubleshooting 1-33
Manuals
Maintenance Manual Content 1-1
Maxum Publications 1-2
Microscope
Adjust Field of View 3-36
Adjust Focus 3-35
Clean Microscope Eyepieces 3-36
Description 3-35
Maintenance Procedures 3-35
Preventive Maintenance 3-35
MMI Assembly 2-19
O
Optics
Description 4-6
General Description 1-6
Maintenance Procedures 4-8
Microscope 3-35
Overview 4-1
Preventive Maintenance 4-6
Check Focus 4-14
Check Illuminator Hardware 4-23
Clean Microscope Lenses 3-36
Clean Objective Lens 4-13
Preventive Maintenance Guide 1-24
Replacement Procedures 4-25
Optics Assembly 4-8
Optics Housing Alignment 4-11
Optics Housing Alignment 4-11
Other Safety Features i-vii
P
Personal Safety i-v
Pneumatic System
Controls and Indicators 3-6
Initial Settings 3-8
Description 3-4
Maintenance Procedures 3-9
Replace Air Solenoid Valve 3-11
Replace Input Air Filter 2-17
Set Up Input Air Pressure Sensor 3-10
Preventive Maintenance
Check Wire Vibration 3-9
Clean Air Guide 3-20
Clean Input Air Filter 3-9
Inspect External Air Supply 3-9
Inspect Hoses 3-9
Schematic 3-4
Power Supply i-v
Check DC Outputs 2-44
Description 2-36
Fuse Specification 2-42
Replacement Procedure 2-46
Surge and Spike Protection 2-41
Power System 2-36
AC Power Distribution 2-39
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
I-3
Maxµm Ultra Ball Bonder
Access to Components 2-43
Corrective Maintenance
FRU list 2-42
Power Supply Assembly 2-42
DC Power Distribution 2-39
Power Input 2-36
Power Supply 2-36
Status Lights 2-41
System Description 2-36
Testpoints/Indicators 2-40
Preventive Maintenance 1-19
Bond Head 5-4
Adjust Wire Clamp Gap 5-10
Adjust Wire Clamp Lateral Position 5-9
Align Transducer 5-36
Check Z Encoder Signal Amplitude 5-15
Clean EFO Wand 5-51
Clean Encoder Grating 5-15
Clean Wire Clamp Jewels 5-12
Clean Wire Clamp Jewels (200Hrs) 5-13
Clean Wire Feed Tube 5-45
Inspect Capillary Clamp 5-9
ESTOP Switch 2-21
Light Tower 3-32
Lower Console
Card Rack 2-15
Check Card Rack Filter 2-17
Check DC Outputs 2-44
Check TDI Fan Filter 2-43
Clean MMI 2-21
Disk System 2-28
Operator Interface 2-21
Maintenance Guides 1-22
Bond Head 1-25
General and Special Maintenance 1-22
Lower Console 1-22
Upper Console 1-23
Vision System 1-24
XY Table 1-27
Maintenance Schedule 1-19
1000-hour Maintenance 1-19
15000-hour Maintenance 1-21
200-hour Maintenance 1-19
3000-hour Maintenance 1-19
40-hour Maintenance 1-19
8-hour Maintenance 1-19
Conditional Maintenance 1-21
Material Handling System (MHS) 1-27
Microscope 3-35
Clean Microscope Lenses 3-36
Optics 4-6
Clean Objective Lens 4-13
Pneumatic System 3-9
Check Wire Vibration 3-9
Clean Air Guide 3-20
Clean Input Air Filter 3-9
Inspect External Air Supply 3-9
Inspect Hoses 3-9
I-4
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Video Monitor 3-28
Vision System 4-6
Bond Site Illuminators 4-23
Vision System Assembly 4-30
Wire Feed System 3-17
Clean Air Guide 3-20
Clean Wire Tensioner 3-21
Replace Conductive Spool Contact Spring
3-21
Wire Feed/BITS Board 3-26
XY Table 6-4
Check X and Y Cooling Hoses 6-4
Check Y Axis Ground Strap 6-4
Clean XY Motors 6-10
Lubricate Rear Y Coupling Bearing 6-16
Lubricate Rear Y Slide 6-13
Lubricate X and Front Y Slide Bearings 6-12
PRS
pixel calibration A-5
Publications, Maxum 1-2
R
Rail Calibration A-31
Rail Height Adjustment A-39
Remove Bond Head 5-24
Remove MMI 2-22
Replace Air Input Filter 2-17
Replace Air Solenoid Valve 3-11
Replace Bond Head Interconnect Board 5-70
Replace Camera Control Unit 4-26
Replace Capillary 1-28, 5-7
Replace Card Rack Air Filter 2-17
Replace Circuit Board 2-16
Replace Conductive Spool Contact Spring 3-21
Replace defective camera head 4-25
Replace EFO Box 5-52
Replace EFO Wand 5-51
Replace Illuminator Flex Assembly 4-21
Replace Optics Assembly 4-8
Replace Power Supply 2-46
Replace Rear Y Slide Bearings 6-25
Replace System Computer 2-28
Replace TDI Fan Filter 2-43
Replace Ultrasonic Transducer 5-60
Replace USG Circuit Board 5-59
Replace Video Monitor 4-26
Replace Vision System Assembly 4-33
Replace Wire Clamp 5-43
Replace Wire Feed/BITS Board 3-26
Replace Wire Spool 1-30, 3-17
Replace Work Light Lamp 3-34
Replace X Motor 6-22
Replace Y Motor 6-18
Replace Z Encoder 5-20
Replace ZTC Heater 5-30
Routine Maintenance
Index
Clean Air Guide 1-33
Replace Capillary 1-28
Replace Wire Spool 1-30, 3-17
S
Safe Handling i-v
Safety 1-10
Safety Information i-i
Emergency Stop Switch i-vi
Fire Safety i-vi
General Precautions i-iii
Lockout/Tagout Procedure i-v
Machine Emissions i-viii
Other Safety Features i-vii
Personal Safety i-v
Power Supply i-v
Safe Handling i-v
Servicing Electrical Equipment
Types of Electrical Hazards i-iv
Servicing Heated Equipment i-v
Symbols and Messages i-i
Warning and Safety Labels i-viii
Warnings i-ii
Servicing Electrical Equipment
Types of Electrical Hazards i-iv
Servicing Heated Equipment i-v
Set Bond Head Height (Adjust Rails) 5-23
Setup Air Guide Sensor 3-23
Solid-State Video Camera System
Description 4-24
Replace defective camera head 4-25
Vision System 4-24
Spares, Recommended 1-55
Special Tools 1-55
Specifications 1-7
Dimensions and Weight 1-10
Facility Requirements 1-7
Material Handling 1-7
Operating Environment 1-7
Wire Bonding 1-8
Surge and spike Protection 2-41
Symbols and Messages i-i
System Computer 2-26
Description 2-26
PCB Locations 2-8
System Computer Handling Instructions 2-26
Electrostatic Discharge (ESD) Protection
2-27
General Handling Instructions 2-27
Operating Precautions 2-28
Temperature and Humidity 2-27
Unpacking 2-27
System Magnification A-7
T
Terms and Conventions i-xxi
Torque Specifications 1-56
Troubleshooting
Checklists 1-34
Bond Head 1-35
Lower Console 1-38
Miscellaneous 1-39
Vision System/Optics 1-34
XY Table 1-37
Wire Bond Troubleshooting Guide 1-40
BITS Errors 1-43
Bond Placement 1-49
Deformed Bonds 1-51
EFO Open Errors 1-49
Looping Problems 1-41
Wire Feed Problems 1-53
Tucker Calibration A-38
Types of Electrical Hazards i-iv
U
Ultrasonic System
Align Transducer 5-36
Description 5-56
Replace Transducer 5-60
Replace USG Board 5-59
USG Circuit Board 5-56
Upper Console 3-1
General Description 1-4
Light Tower 3-30
Overview 3-1, 3-2
Pneumatic Controls/Indicators 3-6
Pneumatic System 3-4
Preventive Maintenance Guide 1-23
Video Monitor 3-28
Wire Feed System 3-12
Wire Feed/BITS and Wire Feed Interface Boards
3-25
Work Light 3-30
Use of This Manual i-xxi
User Interface
General Description 1-5
V
Video Camera
Camera Control Unit Replacement 4-26
Video Lead Locator (VLL) 4-29
Video Monitor
Cables 3-28
Description 3-28
Preventive Maintenance 3-28
Vision System
Adjustments
Focus 4-14
Volume 2: Maintenance
© 2007 Kulicke & Soffa Industries Inc
All Rights Reserved
I-5
Maxµm Ultra Ball Bonder
Linearity 4-15
Magnification 4-16
Monitor 4-18
Bond Site Illuminators 4-20
Circuit Board Assembly 4-29
Functional Diagram 4-5
General Description 1-6
Maintenance Procedures 4-8
Optics 4-6
Optimize Vision System Performance 4-35
Electronics 4-36
Eyepoints 4-37
Illumination 4-35
Optics and Camera 4-35
VLL Diagnostics 4-37
Workholder 4-37
XY Table 4-36
Overview 4-1
Preventive Maintenance 4-6
Preventive Maintenance Guide 1-24
Replacement Procedures 4-25
Camera Control Unit 4-26
Optics Assembly 4-8
Optics Housing Alignment 4-11
Video Monitor 4-26
Solid-State Video Camera System 4-24
Replace defective camera head 4-25
Video Camera 4-6
Video Monitor 4-3
Vision System Assembly
Cable Connections 4-32
Configuration 4-32
Controls and Indicators 4-30
Description 4-29
Maintenance 4-30
Replace Circuit Board Assembly 4-33
UPS 4-30
W
Warning and Safety Labels i-viii
Warnings i-ii
Wire Clamp Driver
Description 5-53
Wire Feed Interface Board
Description 3-25
I-6
98868-0000-002-03
© 2007 kulicke & Soffa Industries Inc
All Rights Reserved
Wire Feed System
Bond Integrity Test System 3-16
Control System 3-14
Description 3-12
Maintenance Procedures 3-17
Preventive Maintenance 3-17
Check Wire Vibration 3-9
Clean Air Guide 3-20
Clean Wire Tensioner 3-21
Replace Conductive Spool Contact Spring
3-21
Wire Feed Troubleshooting 1-53
Wire Feed/BITS Board
Description 3-25
Preventive Maintenance 3-26
Work Light
Description 3-32
Preventive Maintenance 3-32
Replace Lamp 3-34
Workholder Calibrations A-45
Gripper A-42
X
X Registration Sensor Calibration A-36
XY Table
Access to Components 6-5
Cable Assemblies 6-37
Control System
Circuit Boards 6-30
Description 6-29
Servo CPU (CPU2) 6-31
Servo Preamp 6-33
XY Servo Amplifier 6-34
General Description 1-4
Overview 6-1
Preventive Maintenance 6-4
Clean XY Motors 6-10
Lubricate Rear Y Coupling Bearing 6-16
Lubricate Rear Y Slide 6-13
Lubricate X and Front Y Slide Bearings 6-12
Preventive Maintenance Guide 1-27
Replacement Procedures 6-18
Replace Rear Y Slide Bearings 6-25
Replace X Motor 6-22
Replace Y Motor 6-18