BC95&M95 R2.0
Compatible Design
GSM/GPRS/NB-IoT Module Series
Rev. BC95&M95 R2.0_Compatible_Design_V1.2
Date: 2017-03-15
www.quectel.com
GSM/GPRS/NB-IoT Module Series
BC95&M95 R2.0 Compatible Design
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Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233
Tel: +86 21 5108 6236
Email: info@quectel.com
Or our local office. For more information, please visit:
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http://www.quectel.com/support/salesupport.aspx
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/techsupport.aspx
Or Email to: Support@quectel.com
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
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Copyright © Quectel Wireless Solutions Co., Ltd. 2017. All rights reserved.
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About the Document
History
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Revision
Date
Author
Description
1.0
2016-10-24
Bryant CHEN/
Mark ZHANG
Initial
Bryant CHEN/
Mark ZHANG
Changed the name of BC95 variants from BC95CM/BC95-SL/BC95-VF to BC95-B8/BC95-B5/B
C95-B20.
Bryant CHEN
1. Deleted SWD interface information for BC95
module.
2. Added PCM interface information for M95
R2.0 module.
3. Modified the reference design for power
supply.
4. Modified the sketch map of installation
between BC95 and M95 R2.0.
1.1
1.2
2016-12-14
2017-03-15
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Contents
About the Document ................................................................................................................................... 2
Contents ....................................................................................................................................................... 3
Table Index ................................................................................................................................................... 4
Figure Index ................................................................................................................................................. 5
1
Introduction .......................................................................................................................................... 6
2
General Descriptions ........................................................................................................................... 7
2.1.
Product Description ................................................................................................................... 7
2.2.
Feature Overview ...................................................................................................................... 8
2.3.
Pin Assignment.......................................................................................................................... 9
3
Pin Description ................................................................................................................................... 11
4
Hardware Reference Design ............................................................................................................. 16
4.1.
Power Supply .......................................................................................................................... 16
4.1.1. Reference Design for Power Supply .............................................................................. 16
4.1.2. Reduce Voltage Drop ..................................................................................................... 16
4.2.
Power-on Circuit ...................................................................................................................... 17
4.3.
Power-off Circuit ...................................................................................................................... 18
4.3.1. Power Down Module ...................................................................................................... 18
4.3.2. EMERG_OFF & RESET Interface ................................................................................. 20
4.4.
Network Status Indication* ...................................................................................................... 21
4.5.
USIM&SIM Interface ............................................................................................................... 21
4.6.
UART Interface ........................................................................................................................ 22
4.7.
RF Interface ............................................................................................................................. 23
5
Recommended Footprint .................................................................................................................. 24
6
Manufacturing and Packaging .......................................................................................................... 29
6.1.
Soldering ................................................................................................................................. 30
6.2.
Packaging ................................................................................................................................ 31
7
Appendix A ......................................................................................................................................... 33
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Table Index
TABLE 1: MODULE GENERAL INFORMATION ................................................................................................. 7
TABLE 2: FEATURE OVERVIEW ........................................................................................................................ 8
TABLE 3: I/O PARAMETERS DEFINITION ........................................................................................................ 11
TABLE 4: COMPARISON OF PINS .................................................................................................................... 11
TABLE 5: MANUFACTURING ........................................................................................................................... 29
TABLE 6: RELATED DOCUMENTS .................................................................................................................. 33
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Figure Index
FIGURE 1: BC95&M95 R2.0 PIN ASSIGNMENT ............................................................................................... 9
FIGURE 2: COMBINATION OF PIN ASSIGNMENT OF BC95&M95 R2.0 ....................................................... 10
FIGURE 3: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 16
FIGURE 4: REFERENCE CIRCUIT FOR VBAT INPUT.................................................................................... 17
FIGURE 5: DRIVING CIRCUIT OF THE PWRKEY........................................................................................... 17
FIGURE 6: TIMING OF TURNING ON SCENARIOS ....................................................................................... 18
FIGURE 7: TIMING OF TURNING OFF SCENARIOS (USE AT COMMAND FOR M95 R2.0) ........................ 19
FIGURE 8: TIMING OF TURNING OFF SCENARIOS (USE PWRKEY FOR M95 R2.0) ................................. 19
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FIGURE 9: DRIVING CIRCUIT OF EMERGENCY SHUTDOWN AND RESET ............................................... 20
FIGURE 10: TIMING OF EMERGENCY SHUTDOWN AND RESET ............................................................... 20
FIGURE 11: REFERENCE CIRCUIT OF THE NETLIGHT ............................................................................... 21
FIGURE 12: REFERENCE CIRCUIT OF 6-PIN USIM&SIM CARD CONNECTOR ......................................... 22
FIGURE 13: REFERENCE DESIGN OF UART INTERFACE ........................................................................... 22
FIGURE 14: REFERENCE CIRCUIT OF RF INTERFACE ............................................................................... 23
FIGURE 15: BOTTOM VIEW OF BC95 AND M95 R2.0 ................................................................................... 24
FIGURE 16: RECOMMENDED COMPATIBLE FOOTPRINT (UNIT: MM) ........................................................ 25
FIGURE 17: RECOMMENDED STENCIL OF BC95 (UNIT: MM) ..................................................................... 26
FIGURE 18: RECOMMENDED STENCIL OF M95 R2.0 (UNIT: MM)............................................................... 27
FIGURE 19: INSTALLATION SKETCH MAP FOR BC95 AND M95 R2.0 ......................................................... 28
FIGURE 20: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 30
FIGURE 21: TAPE SPECIFICATION................................................................................................................. 31
FIGURE 22: REEL SPECIFICATION ................................................................................................................ 32
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1
Introduction
Quectel NB-IoT BC95 module is compatible with Quectel GSM/GPRS M95 R2.0 module. This document
briefly describes the compatible design between BC95 and M95 R2.0 modules.
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2
General Descriptions
2.1. Product Description
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M95 R2.0 is a quad-band GSM/GPRS module which works at frequencies of GSM850, EGSM900,
DCS1800 and PCS1900. BC95 is an NB-IoT module that includes three variants: BC95-B5, BC95-B8
and BC95-B20. BC95 and M95 R2.0 are designed as compatible products. Customers can choose a
proper module for applications according to their needs. The compatible design guideline ensures a
smooth migration from M95 R2.0 to BC95 for customers’ products.
Table 1: Module General Information
Module
BC95
M95 R2.0
Appearance
Packaging
Dimensions
Description
54-pin LCC +
40-pin LGA
19.9 × 23.6 × 2.2mm
NB-IoT module;
contains three variants:
BC95-B5, BC95-B8 and
BC95-B20.
42-pin LCC
19.9 × 23.6 × 2.65mm
GSM/GPRS module
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2.2. Feature Overview
The following table compares general properties and features of M95 R2.0 and BC95 modules.
Table 2: Feature Overview
Feature
M95 R2.0
Power supply
Peak current
BC95
3.3V~4.6V
3.1V~4.2V
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VBAT: Max 2.0A
VBAT: Max 0.3A
Frequency bands
Quad band:
GSM850/900/1800/1900
BC95-B5: Band 5 @H-FDD
BC95-B8: Band 8 @H-FDD
BC95-B20: Band 20 @H-FDD
GPRS
Multislot class 12
Not supported
Temperature range
(Board temperature)
Operation temperature range:
-35°C ~ +75°C1)
Extended temperature range:
-40°C ~ +85°C2)
Operation temperature range:
-30°C ~ +75°C1)
Extended temperature range:
-40°C ~ +85°C2)
Serial interface
Baudrate: 300 to 115200bps
Autobauding: 4800 to 115200bps
Flow control: RTS/CTS
Power domain: 2.8V
Baudrate:
 Main port: 9600/115200bps3)
 Debug port: 921600bps
Power domain: 3.0V
USIM&SIM interface
Support USIM/SIM card:
1.8V or 3.0V
Only support USIM card: 3.0V
Analog audio
Two analog input channels and two
analog output channels
Not supported
VOmax=3.0V
VI=1.5V~3.3V
Not supported
RTC backup
NOTES
\
1. 1) Within operation temperature range, the module is 3GPP compliant.
2. 2) Within extended temperature range, the module remains the ability to establish and maintain SMS,
data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio
spectrum and no harm to radio network. Only one or more parameters like P out might reduce in their
value and exceed the specified tolerances. When the temperature returns to the normal operating
temperature levels, the module will meet 3GPP specifications again.
3. 3) BC95 supports 9600bps baud rate for AT command communication & data transmission and
115200bps for firmware upgrading on main port.
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2.3. Pin Assignment
VBAT
VBAT
GND
GND
RESERVED
GND
RF_ANT
RESERVED
34
33
32
31
30
29
28
RI
SPK1N
RESERVED
SPK1P
RESERVED
LOUDSPKN
RESERVED
LOUDSPKP
MIC2N
31
30
29
28
27
SIM_GND
26
25
24
23
22
21
RI/PCM_CLK
SIM1_CLK
SIM1_DATA
SIM1_RST
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61
62
63
64
TXD
PWRKEY
RXD
EMERG_OFF
RTS
CTS
TXD
RXD
RESERVED
VDD_EXT
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
DBG_TXD
ADC
DBG_RXD
RESERVED
NETLIGHT
VDD_EXT
84
DCD/SIM2_RST
DTR/SIM1_
PRESENCE
83
SIM2_VDD
82
16
17
18
19
20
81
65
SIM2_CLK
85
6
7
8
9
10
11
SIM2_DATA
66
41
42
80
86
PCM_IN
60
67
RESERVED
DBG_TXD
79
87
SIM1_VDD
M95 R2.0
Top View
RESERVED
PCM_OUT
59
68
MIC1N
DBG_RXD
78
88
MIC1P
USIM_VDD
12
13
14
15
58
BC95
Top View
USIM_RST
NETLIGHT
77
17
18
19
20
21
RESERVED
RESERVED
USIM_DATA
1
2
3
4
5
STATUS/
PCM_SYNC
RESET
57
22
23
24
25
26
27
RESERVED
GND
GND
RESERVED
37
36
35
MIC2P
VBAT
RESERVED
70
69
AGND
USIM_CLK
VRTC
RESERVED
10
11
12
13
14
15
16
90
89
USIM_GND
VBAT
RESERVED
75
76
GND
32
33
34
35
36
RESERVED
55
56
43
42
41
40
39
38
GND
RESERVED
7
8
9
91
GND
RESERVED
93
92
71
GND
RESERVED
72
GND
RESERVED
94
73
37
38
39
40
RESERVED
74
GND
RESERVED
1
2
3
4
5
6
RF_ANT
50
GND
44
45
46
47
48
51
52
53
54
RESERVED
49
RESERVED
The following figure shows the pin assignment of BC95 and M95 R2.0.
Figure 1: BC95&M95 R2.0 Pin Assignment
NOTES
1. The blue pins of BC95 are the additional pins compared with M95 R2.0.
2. The green pins of M95 R2.0 are the additional pins compared with BC95.
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VBAT
RESERVED
VBAT
GND
RESERVED
GND
GND
RESERVED
49
RF_ANT
50
VRTC
VBAT
VBAT
GND
GND
GND
RESERVED
AGND
GND
RESERVED
GND
RESERVED
1
2
3
4
5
6
RF_ANT
GND
GND
51
52
53
54
RESERVED
44
45
46
47
48
GND
The figure below shows the combination of pin assignment for BC95 and M95 R2.0.
SIM_GND
MIC2P
SIM1_CLK
MIC2N
SIM1_DATA
MIC1P
SIM1_RST
MIC1N
SIM1_VDD
43
42
41
40
39
38
GND
USIM_GND
USIM_CLK
USIM_DATA
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RTS
LOUDSPKP
CTS
EMERG
_OFF
VDD_EXT
PWRKEY
DTR/SIM1_
PRESENCE
RESERVED
LOUDSPKN
SIM2_VDD
RESET
DCD/SIM2_RST
SIM2_CLK
RESERVED
SPK1P
SIM2_DATA
RESERVED
RI/PCM_CLK
PCM_IN
RESERVED
SPK1N
TXD
RXD
34
33
32
31
30
29
28
USIM_VDD
RESERVED
RESERVED
RESERVED
RI
RESERVED
RESERVED
RESERVED
TXD
RXD
RESERVED
RESERVED
VDD_EXT
RESERVED
RESERVED
RESERVED
RESERV ED
ADC
DBG_TXD
NETLIGHT
RESERVED
DBG_RXD
22
23
24
25
26
27
RESERVED
10
11
12
13
14
15
16
PCM_OUT
RESERVED
DBG_TXD
RESERVED
37
36
35
BC95&M95 R2.0
Top View
DBG_RXD
RESERVED
7
8
9
STATUS/
PCM_SYNC
NETLIGHT
RESERVED
17
18
19
20
21
RESERVED
USIM_RST
Figure 2: Combination of Pin Assignment of BC95&M95 R2.0
NOTES
1.
2.
3.
4.
5.
BC95 and M95 R2.0 are identical in size. The black pins of BC95 and M95 R2.0 are compatible pins
on main functions.
The blue pins of BC95 are the additional pins compared with M95 R2.0.
The pin names marked in red in the inside area are M95 R2.0’s.
The green pins of M95 R2.0 are the additional pins compared with BC95.
The purple pins are different pins on main functions.
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3
Pin Description
This chapter describes the pin definition and comparison of BC95 and M95 R2.0.
Table 3: I/O Parameters Definition
Symbol
IO
DI
DO
PI
PO
AI
AO
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Description
Bidirectional
Digital Input
Digital Output
Power Input
Power Output
Analog Input
Analog Output
The following table shows the comparison of pins between BC95 and M95 R2.0.
Table 4: Comparison of Pins
BC95
M95 R2.0
Pin No.
Pin Name
IO
Description
Pin
No.
Pin Name
IO
Description
1
RESERVED
/
/
/
/
/
/
2
GND
/
Ground
1
AGND
/
Ground
AI
Channel 2
Microphone positive
input
AI
Channel 2
Microphone
negative input
3
4
RESERVED
RESERVED
/
/
/
/
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3
MIC2P
MIC2N
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5
RESERVED
/
/
4
MIC1P
AI
Channel 1
Microphone positive
input
6
RESERVED
/
/
5
MIC1N
AI
Channel 1
Microphone
negative input
7
RESERVED
/
/
/
/
/
/
8
RESERVED
/
/
/
/
/
/
9
RESERVED
/
/
/
/
/
/
10
RESERVED
/
/
6
SPK1N
AO
Channel 1 audio
negative output
11
RESREVED
/
/
7
SPK1P
AO
Channel 1 audio
positive output
12
RESERVED
/
/
8
LOUDSPKN
AO
Channel 2 audio
negative output
13
RESERVED
/
/
9
LOUDSPKP
AO
Channel 2 audio
positive output
DI
Turn on/off the
module.
Pulled up to VBAT
14
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RESERVED
/
/
10
PWRKEY
15
RESET
DI
Reset the module
11
EMERG_
OFF
DI
Emergency off.
Pulling down for at
least 40ms will turn
off the module in
case of emergency.
Use it only when
shutting down via
PWRKEY or AT
command cannot be
implemented.
16
RESERVED
/
/
/
/
/
/
DO
Indicate the
module’s
operating status/
PCM
synchronization
signal.
These functions can
be switched through
AT command.
2.8V
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17
RESERVED
/
/
BC95&M95 R2.0_Compatible_Design
12
STATUS/
PCM_SYN1)
GSM/GPRS/NB-IoT Module Series
BC95&M95 R2.0 Compatible Design
18
19
20
21
/
NETLIGHT*
DBG_RXD
DBG_TXD
DI
RXD port for
debugging UART.
3.0V
DO
TXD port for
debugging UART.
3.0V
15
General purpose
analog to digital
converter
/
13
14
NETLIGHT
DBG_RXD
DBG_TXD
DO
Indicate the
module’s
network status.
2.8V
DI
RXD port for
debugging UART.
2.8V
DO
TXD port for
debugging UART.
2.8V
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ADC*
/
DO
Network status
indication
2.8V
AI
/
/
41
/
PCM_OUT
/
/
DO
PCM serial data
output.
2.8V
/
/
42
PCM_IN
DI
PCM serial data
input.
2.8V
RESERVED
/
/
/
/
/
/
23
RESERVED
/
/
16
SIM2_DATA
IO
SIM2 data.
1.8V/3.0V
24
RESERVED
/
/
17
SIM2_CLK
DO
SIM2 clock.
1.8V/3.0V
/
/
22
25
RESERVED
/
/
18
SIM2_VDD
PO
Power supply for
SIM2 card.
1.8V/3.0V.
26
VDD_EXT
PO
3.0 V
19
VDD_EXT
PO
2.8V
DI
Data terminal ready/
SIM card insertion
detection.
These functions can
be switched through
AT command.
2.8V
27
RESERVED
/
/
20
DTR/SIM1_
PRESENCE
2)
28
RESERVED
/
/
/
/
/
/
29
RXD
DI
Receive data
3.0V
21
RXD
DI
Receive data
2.8V
30
TXD
DO
Transmit data
3.0V
22
TXD
DO
Transmit data
2.8V
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31
RESERVED
/
/
23
CTS
DO
Clear to send
2.8V
32
RESERVED
/
/
24
RTS
DI
Request to send
2.8V
DO
Data carrier
detection/reset
signal of
SIM2 card.
2.8V
33
RESERVED
/
/
25
DCD/
SIM2_RST3)
DO
Ring indicator
3.0V
26
RI/
PCM_CLK4)
DO
Ring indicator/PCM
clock signal.
These functions can
be switched through
AT command.
2.8V
RESERVED
/
/
/
/
/
/
36
RESERVED
/
/
/
/
/
/
37
RESERVED
/
/
/
/
/
/
PO
Power supply for
USIM card.
3.0V
PO
Power supply for
SIM1 card.
1.8/3.0V
DO
Reset signal of
USIM card.
3.0V
DO
Reset signal of
SIM1 card.
1.8/3.0V
IO
Data signal of
USIM card.
3.0V
IO
Data signal of
SIM1 card.
1.8/3.0V
30
SIM1_CLK
DO
Clock signal of
SIM1 card.
1.8/3.0V
34
RI*
35
38
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USIM_VDD
27
28
SIM1_VDD
39
USIM_RST
40
USIM_
DATA
41
USIM_
CLK
DO
Clock signal of
USIM card.
3.0V
42
USIM_
GND
/
Ground
31
SIM1_GND
/
Ground
43
GND
/
Ground
/
/
/
/
29
SIM1_RST
SIM1_DATA
44
RESERVED
/
/
32
VRTC
PI/
PO
VOmax=3.0V
VOmin=2.0V
VOnorm=2.8V
VI=1.5~3.3V
Iin≈10uA
45
VBAT
PI
Main power supply
of module.
3.1V~4.2V
33
VBAT
PI
Main power supply
of module.
3.3V~4.6V
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46
VBAT
PI
Main power supply
of module.
3.1V~4.2V
47
GND
/
Ground
35
GND
/
Ground
48
GND
/
Ground
36
GND
/
Ground
49
RESERVED
/
/
/
/
/
/
50
RESERVED
/
/
/
/
/
/
51
GND
/
Ground
37
GND
/
Ground
52
GND
/
Ground
38
GND
/
Ground
53
RF_ANT
IO
RF antenna
39
RF_ANT
IO
RF antenna
54
GND
/
Ground
40
GND
/
Ground
55~58,
67~70,
75~80,
84~91
RESERVED
/
/
/
/
/
/
59~66,
71~74,
81~83,
92~94
GND
/
Ground
/
/
/
/
NOTES
1.
2.
3.
4.
5.
6.
7.
34
VBAT
PI
Main power supply
of module.
3.3V~4.6V
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The blue pins of BC95 are the additional pins compared with M95 R2.0.
The pins marked in red are compatible pins, but their functions are different.
The green pins of M95 R2.0 are the additional pins compared with BC95.
The black pins are compatible pins on main functions.
Keep all reserved and unused pins unconnected.
All GND pins should be connected to ground.
The AGND pin of M95 R2.0 should be routed as single-ended to main ground when analog audio is
used in single-ended application. Otherwise, it can be connected to GND directly.
8. “*” means NETLIGHT, ADC and RI functions of BC95 are under development.
9. 1) When using the PCM interface, STATUS pin can be used as PCM_SYNC pin.
10. 2) DTR pin can be used as SIM1_PRESENCE pin via AT command. For more details, please refer to
the document [2].
11. 3) When using the SIM2 interface, DCD pin can be used as SIM2_RST pin. For more details, please
refer to the document [3].
12. 4) When using the PCM interface, RI pin can be used as PCM_CLK pin.
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4
Hardware Reference Design
The following chapters describe compatible design of BC95 and M95 R2.0 on main functionalities.
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4.1. Power Supply
4.1.1. Reference Design for Power Supply
The power supply is one of the key factors in module design, as the performance of the module largely
depends on the power source. The battery power supply is capable of providing the sufficient current up
to 2A.
The following figure shows a reference design for battery power source. The typical battery output voltage
is 3.6V.
Battery
VBAT
GND
OUT
C1
TVS
470uF
C2
1uF
Figure 3: Reference Circuit of Power Supply
4.1.2. Reduce Voltage Drop
The power supply range of M95 R2.0 module is from 3.3V to 4.6V and the power supply range of BC95 is
from 3.1V to 4.2V. Attention should be paid to the range of the power source to make sure that the input
voltage will never drop below 3.3V and never exceed 4.2V, and the typical power supply is 3.8V. The
VBAT pins of BC95 are compatible with that of M95 R2.0, therefore, it is recommended to mount C1~C4.
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VBAT
Module
BC95 VBAT
or M95 R2.0 VBAT
+
C1
100uF
C2
C3
C4
100nF
100pF
22pF
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Figure 4: Reference Circuit for VBAT Input
4.2. Power-on Circuit
The turn-on method of BC95 and M95 R2.0 is different. BC95 can be automatically turned on by
supplying power source to VBAT pins, while M95 R2.0 will be started after pressing PWRKEY for about 1s.
The following circuit is a reference design for M95 R2.0 power-on circuit.
Module
PWRKEY M95 R2.0
4.7K
pulse
47K
Figure 5: Driving Circuit of the PWRKEY
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The turning on scenarios of BC95 and M95 R2.0 is illustrated as the following figure.
T1
VBAT
>1s
M95 R2.0
VIH>0.6*VBAT
PWRKEY
(Input)
VIL<0.1*VBAT
EMERG_
OFF
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800ms
M95 R2.0
OFF
BOOTING
RUNNING
RESET
BC95 OFF BOOTING
RUNNING
Figure 6: Timing of Turning on Scenarios
NOTES
1. Make sure that VBAT is stable before pulling down PWRKEY pin. The time of T1 is recommended as
200ms. It is not recommended to always pull down PWRKEY pin
2. The part in the above figure marked in red is for M95 R2.0.
3. The part in the above figure marked in black is for BC95.
4.3. Power-off Circuit
4.3.1. Power Down Module
M95 R2.0 module can be turned off through AT+QPOWD command or driving the PWRKEY to a low level
voltage for a certain time, while BC95 can only be turned off by shutting down the VBAT power supply.
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The power-down scenario is illustrated as the following figure.
VBAT
Log out from network in 2s~40s
M95 R2.0 RXD
AT+QPOWD
M95 R2.0 RUNNING
Power-down procedure
OFF
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BC95
OFF
RUNNING
Figure 7: Timing of Turning off Scenarios (Use AT Command for M95 R2.0)
VBAT
0.7s<Pulldown<1s
PWRKEY
(INPUT)
Log out from network in 2s~12s
EMERG_OFF
(INPUT)
RESET
(INPUT)
Figure 8: Timing of Turning off Scenarios (Use PWRKEY for M95 R2.0)
NOTES
1. The part in the above figure marked in red is for M95 R2.0.
2. The part in the above figure marked in black is for BC95.
3. The time of logging out from network depends on the local network signal.
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4.3.2. EMERG_OFF & RESET Interface
The EMERG_OFF circuit of M95 R2.0 is compatible with the RESET circuit of BC95. The M95 R2.0 can
be shut down by EMERG_OFF pin and BC95 can be reset by RESET pin. They can only be used under
abnormal situation.
The following circuit is a reference design for M95 R2.0 emergency shutdown and BC95 reset.
Module
BC95 RESET
or M95 R2.0
EMERG_OFF
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4.7K
pulse
47K
Figure 9: Driving Circuit of Emergency Shutdown and Reset
The emergency shutdown and reset scenario is illustrated as the following figure.
VBAT
RESET
EMERG_OFF
BC95
M95 R2.0
M95 R2.0 RUNNING
≥100ms
≥100ms
Power-down
procedure
OFF
≥1.4s
BC95
RUNNING
OFF
RUNNING
Figure 10: Timing of Emergency Shutdown and Reset
NOTE
The time of logging out from network depends on the local network signal.
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4.4. Network Status Indication*
The NETLIGHT pin can be used to drive a network status indicator LED. The following circuit is a
reference design of NETLIGHT.
VBAT
Module
2.2K
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BC95 or M95 R2.0
4.7K
NETLIGHT
47K
Figure 11: Reference Circuit of the NETLIGHT
NOTE
“*” means this function of BC95 is under development.
4.5. USIM&SIM Interface
SIM interface of M95 R2.0 supports 1.8V or 3.0V USIM/SIM cards by default, while USIM interface of
BC95 only supports 3.0V USIM card. The pin assignment of BC95’s USIM interface is compatible with
M95 R2.0’s SIM1 interface.
A reference circuit for a 6-pin USIM&SIM card connector is illustrated as the following figure.
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USIM_VDD or M95 R2.0 SIM1_VDD
Module
15K
100nF
BC95 USIM_GND or M95 R2.0 SIM_GND
BC95 USIM_VDD or M95 R2.0 SIM1_VDD
22R
BC95 USIM_RST or M95 R2.0 SIM1_RST
USIM&SIM Card Connector
VCC
GND
RST
VPP
CLK
IO
BC95 USIM_CLK or M95 R2.0 SIM1_CLK
22R
22R
BC95 USIM_DATA or M95 R2.0 SIM1_DATA
33pF
33pF
33pF
ESD
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GND
GND
Figure 12: Reference Circuit of 6-Pin USIM&SIM Card Connector
4.6. UART Interface
MAIN_UART and DBG_UART on BC95 and M95 R2.0 have the same function, but with different voltage
domain: 3.0V for BC95 UART port and 2.8V for M95 R2.0 UART port. The BC95 UART port does not
support hardware flow control.
The following circuit shows a reference design of UART interface level match when application processor
communicates with module via UART interface. It is recommended to add a level match circuit between
M95 R2.0/BC95 module and DTE because of the difference on power domain. For details, please refer to
document [1].
Module
Translator
VCC
DTE
VDD_EXT
VCC-A
VCC-B
VCC
DCD
DCD-A
DCD-B
DCD
TXD
TXD-A
TXD-B
RXD
CTS
CTS-A
CTS-B
CTS
RI
DBG_TXD
RI-A
DBG_TXD-A
RI-B
DBG_TXD-B
RI
DBG_RXD
BC95 or M95 R2.0
RXD
DTR
RTS
DBG_RXD
GND
RXD-A
DTR-A
RTS-A
DBG_RXD-A
GND-A
RXD-B
DTR-B
RTS-B
DBG_RXD-B
GND-B
TXD
DTR
RTS
DBG_TXD
GND
Figure 13: Reference Design of UART Interface
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NOTES
1.
2.
UART pins of M95 R2.0 belong to 2.8V power domain, and UART pins of BC95 belong to 3.0V power
domain.
The green pins of M95 R2.0 are the additional pins compared with BC95.
4.7. RF Interface
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RF_ANT pins of BC95 and M95 R2.0 are compatible. The RF interface has an impedance of 50Ω. A
reference circuit is shown in the following figure. In order to adjust RF performance, it should reserve a
π-type matching circuit. The resistance of R1 is 0Ω by default and C1 and C2 capacitors are not mounted.
Module
R1
BC95 or M95 R2.0
0R
RF_ANT
C1
C2
NM
NM
Figure 14: Reference Circuit of RF Interface
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5
Recommended Footprint
The following figure shows the bottom view of BC95 and M95 R2.0.
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BC95
M95 R2.0
Figure 15: Bottom View of BC95 and M95 R2.0
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The following figure shows the recommended compatible footprint of BC95 and M95 R2.0.
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Figure 16: Recommended Compatible Footprint (Unit: mm)
The thickness of PCB is different, to ensure the module soldering quality, the thickness of stencil is
recommended to be 0.15mm for BC95 module and 0.2mm for M95 R2.0. For more details, please refer to
document [4].
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The recommended stencil of BC95 is shown as below.
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Figure 17: Recommended Stencil of BC95 (Unit: mm)
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The recommended stencil of M95 R2.0 is shown as below.
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Figure 18: Recommended Stencil of M95 R2.0 (Unit: mm)
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The following figure shows the sketch map of installation between BC95 and M95 R2.0.
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Figure 19: Installation Sketch Map for BC95 and M95 R2.0
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6
Manufacturing and Packaging
The following table shows the compatible manufacturing and packaging information between BC95 and
M95 R2.0.
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Table 5: Manufacturing
Feature
Reflow Profile
Reel
BC95&M95 R2.0_Compatible_Design
BC95&M95 R2.0
Compatible
Compatible
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BC95&M95 R2.0 Compatible Design
6.1. Soldering
Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the
stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly
so as to produce a clean stencil surface on a single pass.
It is suggested that the peak reflow temperature is 235 ~ 245ºC (for SnAg3.0Cu0.5 alloy). The absolute
max reflow temperature is 260ºC. To avoid damage to the module when it is repeatedly heated, it is
suggested that the module should be mounted after reflow soldering for the other side of PCB has been
completed. Recommended reflow soldering thermal profile is shown below.
ºC
250
217
200
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Preheat
Heating
Cooling
Liquids Temperature
200ºC
40s~60s
160ºC
150
70s~120s
100
Between 1~3ºC/s
50
0
50
100
150
200
250
300
s
Time
Figure 20: Reflow Soldering Thermal Profile
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6.2. Packaging
The modules are stored inside a vacuum-sealed bag which is ESD protected. It should not be opened
until the devices are ready to be soldered onto the application.
The reel is 330mm in diameter and each reel contains 250 modules.
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Figure 21: Tape Specification
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DETAIL:A
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6
PS
DETAIL:A
Figure 22: Reel Specification
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7
Appendix A
Table 6: Related Documents
SN
Document Name
Remark
[1]
Quectel_BC95_Hardware_Design
BC95 Hardware Design
[2]
Quectel_M95_Hardware_Design
M95 Hardware Design
[3]
Quectel_M95_Dual_SIM_Application_Notes
M95 Dual SIM Application Notes
[4]
Module_Secondary_SMT_User_Guide
Module Secondary SMT User Guide
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