PRODUCT SPECIFICATION
EMMS3,ST
Rev.:
Description du changement/Description of change
-
Initial release
A
ECN #19-0122;
PRÉPARÉ PAR/PREPARED BY
S.S.
G.P.
Date
(a.y/m.m/j.d)
2019/12/10
DATE (a.y/m/j.d)
Frederick Plante
2017-08-16
VERIFIÉ PAR/VERIFIED BY
DATE (a.y/m/j.d)
Gilbert Pesant
2017-11-21
VERIFIÉ PAR/VERIFIED BY
DATE (a.y/m/j.d)
Alain Leclerc
2017-11-22
VERIFIÉ PAR/VERIFIED BY
DATE (a.y/m/j.d)
Richard Lejeune
2017-11-24
APPROUVE PAR/APPROVED BY
DATE (a.y/m/j.d)
Gilbert Pesant
2017/12/08
FEE16.doc Rev. -
Appr.
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TABLE OF CONTENTS
1.
INTRODUCTION......................................................................................................................................... 4
1.1.
1.2.
SCOPE ...................................................................................................................................................... 4
DEFINITIONS ............................................................................................................................................ 4
2.
REFERENCE DOCUMENTS ..................................................................................................................... 7
3.
DETAILED DESCRIPTION ....................................................................................................................... 9
3.1. OVERVIEW OF HARDWARE....................................................................................................................... 9
3.2. MANAGEMENT SYSTEMS ......................................................................................................................... 9
3.3. BLOCK DIAGRAM ................................................................................................................................... 10
3.4. OPERATING MODES ................................................................................................................................ 11
3.4.1.
Normal Operating Conditions ...................................................................................................... 11
3.4.2.
Watchdogs ..................................................................................................................................... 11
3.4.3.
Ethernet port ................................................................................................................................. 12
3.5. FIRMWARE ............................................................................................................................................. 13
4.
SPECIFICATIONS..................................................................................................................................... 14
4.1. ELECTRICAL ........................................................................................................................................... 14
4.1.1.
RF Specifications (EMMS3-DOCSIS) .......................................................................................... 14
4.1.1.1. Upstream (DOCSIS 3.0) ........................................................................................................... 14
4.1.1.2. Downstream (DOCSIS 3.0) ...................................................................................................... 16
4.1.2.
RF Specifications (EMMS3-EuroDOCSIS) .................................................................................. 17
4.1.2.1. Upstream (EuroDOCSIS 3.0) ................................................................................................... 17
4.1.2.2. Downstream (EuroDOCSIS 3.0) .............................................................................................. 19
4.1.3.
Power ............................................................................................................................................ 20
4.1.3.1. Power Supply Input................................................................................................................... 20
4.1.3.2. Power Supply Requirements (1)................................................................................................. 21
4.1.3.3. Power Consumption .................................................................................................................. 21
4.1.4.
Surge Protection ........................................................................................................................... 22
4.1.4.1. EMMS3-DOCSIS ..................................................................................................................... 22
4.1.4.2. EMMS3-EuroDOCSIS ............................................................................................................. 22
4.1.5.
Inputs / Outputs ............................................................................................................................. 23
4.1.5.1. 20 pins I/O header ..................................................................................................................... 23
4.1.5.2. RF interface options .................................................................................................................. 28
4.1.6.
MTBF ............................................................................................................................................ 31
4.2. MECHANICAL (PCB ASSEMBLY).............................................................................................................. 32
4.2.1.
PCB Mounting Points ................................................................................................................... 35
4.2.2.
Product Finish .............................................................................................................................. 38
4.2.3.
Labeling ........................................................................................................................................ 38
4.3. ENVIRONMENTAL & HEAT-SINKING ....................................................................................................... 38
4.4. FIRMWARE ............................................................................................................................................. 40
4.4.1.
General ......................................................................................................................................... 40
4.4.2.
Communication Protocols ............................................................................................................ 41
4.4.3.
MIB Support .................................................................................................................................. 41
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4.4.3.1. DOCSIS® MIBs ........................................................................................................................ 42
4.4.3.2. HMS MIBs ................................................................................................................................ 42
4.4.3.3. Electroline Proprietary MIBs .................................................................................................... 42
4.4.4.
HTTP server .................................................................................................................................. 43
4.4.5.
Dual IP .......................................................................................................................................... 43
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1. Introduction
1.1.Scope
®
®
This product specification covers DOCSIS and EuroDOCSIS 3.0 versions of the Electroline Modem Module
series of products. Throughout this document, both models will be referred to as EMMS3.
The EMMS3 is temperature hardened for integration in OEM product that are required to operate in the outdoor
or extreme temperature environment. Typical cable modems are designed to work on desktops, indoors and
were not designed to operate under extreme conditions.
1.2.Definitions
Term/Acronym
Definition
CATV
Community Antenna Television or Cable Television
CPE
Customer Premise Equipment. The CPE is the device that is remotely connected to
the Internet through the cable modem. The DRM has two CPE port; Ethernet and
USB.
CMTS
Cable Modem Termination System – This is a gateway and data packet routing
device used by HFC network operators to transition between the local area network
(LAN), usually inside of a hub or headend, to the HFC subscriber access network.
The network management system is connected to the LAN.
DOCSIS®
Data Over Cable Service Interface Specification - A suite of specifications
developed in association with CableLabs and standardized by the Society of Cable
Telecommunications Engineers for data communication using HFC technology.
DOCSIS® 3.0 has dramatically increase bandwidth over previous DOCSIS
standard.
EuroDOCSIS®
European version of DOCSIS®. Basically the same specification except for
upstream path going at 65MHz (instead of 42MHz) and the channel width of 8Mhz
(instead of 6MHz)
ECOS
Embedded Configurable Operating System. Linux based operating system
specialized for embedded applications
Element Management
A process that monitors key parameters (example: power supply voltage, optical
power, etc.), controls and performs key functions (example: switches between
primary and backup equipment, changes state of ingress isolation switches, etc.),
provisions for the operation (example: sets alarm limits, sets gain levels, etc.) and
communicates the values of the monitored parameters and status of elements
(devices) in a network to a remote software system that processes the data for
management purposes.
EMS
Element Management System. The EMS configures alarm conditions, poll NEs and
report alarms to the NMS.
ESD
Electro Static Discharge
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Term/Acronym
Definition
HFC
Hybrid Fiber Coax
HMS
Hybrid Management Sub layer is a suite of specifications being standardized by the
SCTE that defines transponders for HFC network management.
Hybrid Fiber and Coaxial
System
An architecture and technology commonly used by cable television and other
broadband service providers to distribute telecommunications services to
residential, business and institutional customers.
HMTS
HMS Modem Termination System. Similar in function to a CMTS, the HMTS is
the equivalent for pure-HMS compliant devices
IEEE
Institute of Electrical and Electronics Engineers. The IEEE promotes the
development and application of electro technology.
IP
Internet Protocol. IP address has the form of a.b.c.d. For example, 10.1.0.45 is a
private IP address within a cable operator's network.
LAN
Local Area Network
MIB
Management Information Base. A MIB is a specification that contains definitions
of management information so that management stations know what objects on a
device can be remotely monitored, configured, and controlled. An object represents
an element of information that an agent supports. The collection of all objects for a
particular device is called a MIB.
NOC
Network Operation Centre. The NOC is the physical place where all the alarms are
collected. The NMS is usually located at the NOC.
NMS
Network Management System. An NMS configures and collects alarms from
different systems (power supply alarms, optical node alarms, CMTS alarms, etc.). It
also receives alarms from the EMS.
NE
Network Element, such as the DHT
OS
Operating System
RF
Radio Frequency
SCTE
Society of Cable Telecommunications Engineers
SNMP
Simple Network Management Protocol. The standards defined by SNMP include:
the structure of data used to manage a device on a network, the policies for
accessing that data, the format that data takes before being transported across a
network, and the operations used to manipulate that data.
SNMP Agent
A process that resides on a device on the network It responds to requests and
directives from an SNMP Manager. Agents are also able to provide unsolicited,
asynchronous notifications to management stations (traps).
SNMP Manager
The process that generates requests to retrieve and modify management
information, receives the response to requests, or receives event reports.
Status monitoring
A subset of the functions of a network management system and element
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Term/Acronym
Definition
management system that remotely monitors critical performance and status
parameters of the network and reported the information to a strategically located
processor for display, archiving, alarming and other purposes.
TFTP
Trivial File Transfer Protocol. A protocol used for transferring file, in this case, a
cable modem configuration file.
QoS
Quality of Service.
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2. Reference Documents
Electroline documents:
(Available through Electroline)
Electroline MIB Interface Specification for Transponders (publication 926-0005)
DHT-PS-NA-01 Series Installation and Operation Manual (publication 914-0121)
DHT-PS-NA-02 & DHT-PS-NA-06 Series Installation Manual (publication 914-0133)
DHT-PS-NA-02 & DHT-PS-NA-06 Series Operation’s Manual (publication 914-0134)
DHT3,NA02 Series Installation Manual (publication 914-0168)
Related specifications and standards:
(Available at the STCE Web site: http://www.scte.org/standards/Standards_Available.aspx)
ANSI/SCTE 135-1 2013
DOCSIS 3.0 Part 1: Physical Layer Specification
ANSI/SCTE 135-2 2013
DOCSIS 3.0 Part 2: MAC and Upper Layer Protocols
ANSI/SCTE 135-3 2013
DOCSIS 3.0 Part 3: Security Services
ANSI/SCTE 135-4 2013
DOCSIS 3.0 Part 4: Operations Support Systems Interface
ANSI/SCTE 135-5 2009
DOCSIS 3.0 Part 5: Cable Modem to Customer Premise Equipment Interface
ANSI/SCTE 25-3 2011 Hybrid Fiber Coax Outside Plant Status Monitoring – Power Supply to Transponder
Interface Bus (PSTIB) Specification v1.1 1.1
HMS151: Power Supply to Transponder Interface Bus (PSTIB) For DOCSIS-HMS Transponders
ANSI/SCTE 36 2012 SCTE-ROOT Management Information Base (MIB) Definitions
ANSI/SCTE 37 2010 Hybrid Fiber/Coax Outside Plant Status Monitoring SCTE-HMS-ROOTS Management
Information Base (MIB) Definition
ANSI/SCTE 38-1 2009 Hybrid Fiber/Coax Outside Plant Status Monitoring SCTE-HMS-PROPERTY-MIB
Management Information Base (MIB) Definition
ANSI/SCTE 38-2 2011 Hybrid Fiber/Coax Outside Plant Status Monitoring SCTE-HMS-ALARMS-MIB
Management Information Base (MIB) Definition
ANSI/SCTE 38-3 2012 Hybrid Fiber/Coax Outside Plant Status Monitoring SCTE-HMS-COMMON-MIB
Management Information Base (MIB) Definition
ANSI/SCTE 38-4 2012 Hybrid Fiber/Coax Outside Plant Status Monitoring SCTE-HMS-PS-MIB Management
Information Base (MIB) Definition
ANSI/SCTE 38-6 2012 Hybrid Fiber/Coax Outside Plant Status Monitoring – SCTE-HMS-GEN-MIB
Management Information Base (MIB) Definition
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ANSI/SCTE 38-7 2008 Hybrid Fiber/Coax Outside Plant Status Monitoring SCTE-HMS-TransponderInterface-Bus(TIB)-MIB Management Information Base (MIB) Definition
DOCSIS 3.0 Interface Specifications:
(Available at the CableLabs Web site: http://www.cablelabs.com)
CM-SP-MULPIv3.0 DOCSIS 3.0 MAC and Upper Layer Protocols Interface Specification
CM-SP-OSSIv3.0
DOCSIS 3.0 Operations Support System Interface Specification
CM-SP-PHYv3.0
DOCSIS 3.0 Physical Layer Specification
CM-SP-SECv3.0
DOCSIS 3.0 Security Specification
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3. Detailed description
3.1. Overview of Hardware
The EMMS3 is a core module having a very small foot print and easily integrated in other HFC products. It can
be sold as a single OEM module or part of a product manufactured and/or designed by Electroline. It can be
used as a pass through device (like a regular off the shelf cable modem) or, with appropriate firmware and
motherboard circuitry, can be used in a variety of monitoring, telemetry or remote control applications.
The hardware includes a cable modem chipset that is ruggedized for outdoor environment and its RF front-end,
®
®
both compliant to DOCSIS /EuroDOCSIS 1.0/1.1/2.0/3.0 specifications. An optional push button activates the
unit’s reset circuitry and can initiate a “factory default restore” when pressed for 5s. This circuitry can also be
triggered by remote using a MIB object. A temperature probe located near the transponder’s main processor
measures the temperature inside the transponder and allows adjusting RF calibration over the full temperature
operating range.
The hardware includes a Broadcom, BCM3383 chipset (8x4) that is ruggedized for outdoor environment and its
RF front-end, both compliant to DOCSIS/EuroDOCSIS 3.0 specifications. The BCM3383’s “full band capture”
frontend provides the added functionality of 8 fully independent digital tuners, and spectrum analysis.
A configuration with a Broadcom BCM33843 processor is also available, for 16x4 operation.
The EMMS3 firmware application resides in non-volatile memory and is loaded in the DDR3 RAM at boot
time. This application uses an SNMP agent that drives all the DOCSIS MIBs, additional HMS MIB objects that
are used for monitoring power supplies and Electroline proprietary MIB objects for special functions and
configurations.
3.2. Management Systems
The EMMS3 communicates equipment performance and status to network management systems. It integrates
with SNMP-based third-party network management systems (NMS) to allow an open choice of network
management solutions to the end user (the cable operator).
Given that the EMMS3 is based on regular cable modem architecture, it coexists with
DOCSIS/EuroDOCSIS 1.0/1.1/2.0/3.0 cable modems. It can receive commands from a cable modem NMS or a
power supply (or fibernode) NMS, or a system specifically designed for transponders.
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3.3.Block Diagram
Temperature
Probe
Flash
RAM
Ethernet
Diplexer
or
separate US/DS
connectors
LNA
Single Chip DOCSIS
Modem
2xGPIO
(SMB/MCX)
Reset
12V nom (5-24V range)
Serial
SPI (2 devices)
5 LED signals
Figure 1: EMMS3 internal diagram
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3.4.Operating modes
3.4.1. Normal Operating Conditions
The normal operating conditions of the EMMS3 are as follows:
•
Connected to and powered from a target motherboard;
•
The RF input is present and is as per DOCSIS®/EuroDOCSIS® specifications. A valid
DOCSIS®/EuroDOCSIS® configuration file has been loaded (supplied and managed by the cable
operator);
•
The Ethernet port and/or serial ports are connected to target device.
In these conditions, all LEDs are lit (“plain modem”/monitoring modes):
POWER
ONLINE / OK
US / CABLE
DS / MON
RF LEVEL
In monitoring mode, the CABLE and DATA LEDs turn off momentarily at each data transfer.
The “RF LEVEL”, bi-color LED (with red and green elements) indicates the downstream RF level at the
downstream input port, relative to the DOCSIS/Euro-DOCSIS limits for the downstream channel and “total
power” as follows:
LED status
Level
Red:
too high (DOCSIS channel level or total power)
Red+green:
borderline high
Green:
OK
Flashing red+green:
borderline low
Flashing red:
too low
Off
no “tunable” DOCSIS channel
The five LEDs are located at the rear end of PCB bottom. The standard configuration uses right angle LEDs
(side emitter). Dual PCB footprints are provided, so that a “top emitter” LED configuration can also be used
upon request. The five LED signals are also provided on the 20 pins I/O connector, so that LEDs can be
monitored, or located on an external PCB.
3.4.2.Watchdogs
The EMMS3 offers 4-levels of watchdog;
• The firmware watchdog that resets the CPU in case of a fatal firmware error;
• The hardware watchdog that performs a hardware reset if the main CPU fails to kick in within 1-2
minutes;
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•
•
A user configurable SNMP watchdog that can perform a hardware reset if the DRM3 fails to receive
any SNMP communication in the specified time.
An “RF watchdog” if the unit is offline (i.e. lost its downstream carrier) for more than 30 min.
3.4.3. Ethernet port
The Ethernet port is designed to comply with the standards for a 10/100/1000 Mbps port, and has ESD
protection using TVS/diodes array on data lines.
The Ethernet connector has 2 integrated LEDs (green and yellow), with the following functions:
LED
Status
Function
Lit continuous
Link speed: 1000 Mbps
GREEN
Lit with slow blink (≈ 1 blink/s)
Link speed: 100 Mbps
(link speed)
Lit with fast blink (≈ 10 blinks/s)
Link speed: 10 Mbps
Off
No link
Blink
Link with data transfer
YELLOW
(link activity)
The Ethernet port is auto-detect; it does not require a crossover cable.
It has two operating modes: craft mode and customer premise equipment (CPE) mode. Each mode offers access
to specific MIB objects. In craft mode, the Ethernet port allows a PC to be connected locally to the EMMS3.
Read/write access to both the HMS and Electroline MIBs is allowed while read access to certain DOCSIS MIB
is permitted to help troubleshooting.
In CPE mode, the Ethernet port behaves like a normal cable modem Ethernet port, allowing access to the
network if this access has been provisioned by the CMTS and its config file. Read/write access to the MIBs is
as per DOCSIS OSSI specifications. Read/write access to the Electroline MIBs is allowed during the preregistration period. Once registration is complete, the DOCSIS settings may prevent access to these MIBs.
The Ethernet port has an associated MAC address, that is related to the “cable” MAC address as follows:
MACETHERNET = MACCABLE + 3.
Ethernet port physical dimensions (J401):
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3.5.Firmware
The firmware runs on eCOS operating system which is free of license. Code from previous DHT products is
ported to EMMS3. Therefore EMMS3 inherits from functions and stability of the original transponders.
The firmware is composed of two logically separated sections: the cable modem section and the monitoring
section composed of real-time tasks that gathers monitoring information through hardware drivers. SNMP is the
primary management interface of both sections. An embedded WEB server is also included for easy status
viewing.
The cable modem can be set to operate in 3 different modes:
1. Bridge cable modem (default operation)
2. Residential Gateway;
3. eRouter with primary network Bridged (Mainly use to set static IP to CPE);
Also, the firmware can operate as a “standard cable modem” or in a status monitoring transponder mode. In
transponder mode, the firmware is offered following two network philosophies; An Electroline MIB allows the
user to select between the two modes.
1. As a single IP approach meaning the TCP/IP stack is shared between the cable modem application and
the monitoring application;
2. As a dual IP in which the monitoring application uses a separate TCP/IP stack and is seen as a virtual
CPE device by the cable modem provisioning system.
Note: The cable modem modes (Bridge, RG or eRouter) apply also when running in transponder mode.
However, in RG or eRouter operation mode, the webui won’t be the Electroline one showing status monitoring.
It will be the Broadcom UI for residential gateway.
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4. Specifications
4.1.Electrical
4.1.1.RF Specifications (EMMS3-DOCSIS)
4.1.1.1.Upstream (DOCSIS 3.0)
Upstream
Frequency Range (edge to edge)
5-42 (North America)
MHz
5-85 (North America, extended upstream)
Level Range per channel
TDMA:
(Multiple Transmit Channel mode disabled, or
(32 QAM, 64 QAM)
Pmin to +57
Multiple Transmit Channel mode enabled with
(8 QAM, 16 QAM)
Pmin to +58
(QPSK)
Pmin to +61
one channel in the TCS)
dBmV
SCDMA:
(all modulations)
Pmin to +56
where:
Pmin = +17 at ≤1280KHz modulation rate
Pmin = +20 at 2560KHz modulation rate
Pmin = +23 at 5120KHz modulation rate
Level Range per channel
TDMA:
(two channels in the TCS)
(32 QAM, 64 QAM)
Pmin to +54
(8 QAM, 16 QAM)
Pmin to +55
(QPSK)
Pmin to +58
dBmV
SCDMA:
(all modulations)
Pmin to +53
where:
Pmin = +17 at ≤1280KHz modulation rate
Pmin = +20 at 2560KHz modulation rate
Pmin = +23 at 5120KHz modulation rate
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Level Range per channel
TDMA:
(three of four channels in the TCS)
(32 QAM, 64 QAM)
Pmin to +51
(8 QAM, 16 QAM)
Pmin to +52
(QPSK)
Pmin to +55
dBmV
SCDMA:
(all modulations)
Pmin to +53
where:
Pmin = +17 at ≤1280KHz modulation rate
Pmin = +20 at 2560KHz modulation rate
Pmin = +23 at 5120KHz modulation rate
Modulation Type
QPSK, 8 QAM, 16 QAM, 32 QAM, 64 QAM and 128 QAM
Modulation Rate (nominal)
TDMA: 1280, 2560, and 5120
KHz
S-CDMA: 1280, 2560, and 5120
Pre-DOCSIS3 operation: TDMA: 160, 320, and 640
Bandwidth
KHz
TDMA: 1600, 3200, and 6400
S-CDMA: 1600, 3200, and 6400
Pre-DOCSIS3 operation: TDMA: 200, 400, and 800
Output Impedance
75
Diplexer ≥ 6
Output Return Loss (across freq. range)
SMB/MCX ≥ 10
Ω
dB
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4.1.1.2.Downstream (DOCSIS 3.0)
Downstream:
North America
Frequency range (std. US) (edge to edge)
54 to 1002
(DOCSIS channel center frequency)
111 to 999 (± 30 KHz)
(Video channel center frequency)
57 to 999 (± 30 KHz)
Frequency range (ext. US) (edge to edge)
108 to 1002
(DOCSIS channel center frequency)
111 to 999 (± 30 KHz)
(Video channel center frequency)
111 to 999 (± 30 KHz)
Level Range (one DOCSIS channel)
-15 to +15 (64 QAM and 256 QAM)
Modulation Type
MHz
dBmV
64 QAM and 256 QAM
Symbol Rate (nominal)
5.056941 (64 QAM)
Msym/s
5.360537 (256 QAM)
Bandwidth
6 MHz
(alpha = 0.18 Square Root Raised Cosine shaping for 64 QAM, and
alpha = 0.12 Square Root Raised Cosine shaping for 256 QAM)
Total Input Power
< 33
dBmV
(42 / 85 MHz and above)
X = average power of lowest power demodulated QAM channel
Channels demodulated within the EMMS3:
Maximum average power of carrier
input to EMMS3, within any 6 MHz
channel from 54 / 108 MHz up to 1002
MHz
≤ Min (X + 10 dB, +15 dBmV)
Non-demodulated 6 MHz bands within the EMMS3:
a) ≤ Min (X + 10 dB, +20 dBmV), for zero, one, or two 6 MHz bands.
b) ≤ Min (X + 10 dB, +15 dBmV), for all other 6 MHz bands besides
the two possible allocated exceptions
Input Impedance
75
Diplexer ≥ 6
Input Return Loss (across freq. range)
SMB/MCX ≥ 10
Downstream Power Report accuracy
±2
(full temperature range)
Ω
dB
dB
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4.1.2.RF Specifications (EMMS3-EuroDOCSIS)
4.1.2.1.Upstream (EuroDOCSIS 3.0)
Upstream
Frequency Range (edge to edge)
5-65 (EURO)
MHz
5-85 (EURO, extended upstream)
Level Range per channel
TDMA:
(Multiple Transmit Channel mode disabled, or
(32 QAM, 64 QAM)
Pmin to +57
Multiple Transmit Channel mode enabled with
(8 QAM, 16 QAM)
Pmin to +58
(QPSK)
Pmin to +61
one channel in the TCS)
dBmV
SCDMA:
(all modulations)
Pmin to +56
where:
Pmin = +17 at ≤1280KHz modulation rate
Pmin = +20 at 2560KHz modulation rate
Pmin = +23 at 5120KHz modulation rate
Level Range per channel
TDMA:
(two channels in the TCS)
(32 QAM, 64 QAM)
Pmin to +54
(8 QAM, 16 QAM)
Pmin to +55
(QPSK)
Pmin to +58
dBmV
SCDMA:
(all modulations)
Pmin to +53
where:
Pmin = +17 at ≤1280KHz modulation rate
Pmin = +20 at 2560KHz modulation rate
Pmin = +23 at 5120KHz modulation rate
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Level Range per channel
TDMA:
(three of four channels in the TCS)
(32 QAM, 64 QAM)
Pmin to +51
(8 QAM, 16 QAM)
Pmin to +52
(QPSK)
Pmin to +55
dBmV
SCDMA:
(all modulations)
Pmin to +53
where:
Pmin = +17 at ≤1280KHz modulation rate
Pmin = +20 at 2560KHz modulation rate
Pmin = +23 at 5120KHz modulation rate
Modulation Type
QPSK, 8 QAM, 16 QAM, 32 QAM, 64 QAM and 128 QAM
Modulation Rate (nominal)
TDMA: 1280, 2560, and 5120
KHz
S-CDMA: 1280, 2560, and 5120
Pre-DOCSIS3 operation: TDMA: 160, 320, and 640
Bandwidth
KHz
TDMA: 1600, 3200, and 6400
S-CDMA: 1600, 3200, and 6400
Pre-DOCSIS3 operation: TDMA: 200, 400, and 800
Output Impedance
75
Diplexer ≥ 6
Output Return Loss (across freq. range)
SMB/MCX ≥ 10
Ω
dB
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4.1.2.2.Downstream (EuroDOCSIS 3.0)
Downstream:
EURO
Frequency range (std. US) (edge to edge)
85 to 1006
(DOCSIS channel center frequency)
112 to 1002 (± 30 KHz)
(Video channel center frequency)
89 to 1002 (± 30 KHz)
Frequency range (ext. US) (edge to edge)
108 to 1006
(DOCSIS channel center frequency)
112 to 1002 (± 30 KHz)
(Video channel center frequency)
112 to 1002 (± 30 KHz)
-17 to +13 (64 QAM)
Level Range (one DOCSIS channel)
-13 to +17 (256 QAM)
Modulation Type
MHz
dBmV
64 QAM and 256 QAM
Symbol Rate (nominal)
6.952 (64 QAM and 256 QAM)
Bandwidth
Msym/s
8 MHz
(alpha = 0.15 Square Root Raised Cosine shaping for 64 QAM and
256 QAM)
Total Input Power
< 33
dBmV
( 80 MHz and above)
X = average power of lowest power demodulated QAM channel
Channels demodulated within the EMMS3:
Maximum average power of carrier
input to EMMS3, within any 8 MHz
channel from 85 MHz up to 1006 MHz
a) ≤ Min (X + 10 dB, +13 dBmV), for 64 QAM
b) ≤ Min (X + 10 dB, +17 dBmV), for 256 QAM
Non-demodulated 8 MHz bands within the EMMS3:
a) ≤ Min (X + 10 dB, +20 dBmV), for zero, one, or two 8 MHz bands.
b) ≤ Min (X + 10 dB, +17 dBmV), for all other 8 MHz bands besides
the two possible allocated exceptions
Input Impedance
75
Diplexer ≥ 6
Input Return Loss (across freq. range)
SMB/MCX ≥ 10
Downstream Power Report accuracy
±2
(full temperature range)
Ω
dB
dB
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4.1.3. Power
4.1.3.1.Power Supply Input
The EMMS3 has two power entry connector options (mutually exclusive):
1) CN6:
Right-angle connector on PCB top, for 5.5/2.1 barrel plug with 9.5mm length.
polarity: center +
2) CN5:
1x2 pin header, right-angle on PCB bottom. Pitch = 2.0mm. Pin1 (+), Pin2 (-)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
P/N: 1X2P-2.0-W
Note: connector is “through-hole”, other connector or mounting options are possible.
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Mating connector for CN5 (for cable, AWG #22-28 wires)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
P/N: 1x2P-ZM
Note: EMMS3 has a single digital, analog and RF ground.
4.1.3.2.Power Supply Requirements (1)
Description
Value
Note
Single supply output
voltage
4.9 to 25 VDC
Nominal operating voltages of 5V, 12V or
24VDC.
Supply power
12W
Continuous available power.
Ripple voltage
1% Vpp max.
At full load.
Recommended
Switching frequency
600 KHz max
To be kept well below the upstream frequency
range.
(1) Over the full operating temperature range.
4.1.3.3.Power Consumption
Power Consumption
Typical
Maximum
Standard: 3383 8x4 operation
6W
8 W (1)
Option: 33843 16x4 operation
7W
9 W (1)
(1) High upstream power and high upstream traffic condition.
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4.1.4.Surge Protection
All models have their Ethernet port protected against ESD using TVS.
4.1.4.1.EMMS3-DOCSIS
Ring Wave
IEEE C62.41-1991, cat A3 6KV 200A
Combination Wave
IEEE C62.41-1991, cat B3 6KV 3KA
Note: F-connector only – EMMS3 with Diplexer option
4.1.4.2.EMMS3-EuroDOCSIS
Ring Wave
IEC 61000-4-12, Level 4 (4KV/133A)
Combination Wave
IEC 61000-4-5, Level 4 (4KV/2KA)
Note: F-connector only – EMMS3 with Diplexer option
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4.1.5. Inputs / Outputs
4.1.5.1.20 pins I/O header
A 20 pin I/O header is provided, to enable communications to a “main board”, in embedded applications. This
header has 3 designations on the PCB bottom: J1410, J1413 and J1414, associated with different connector
types (all sharing the same PCB footprint).
The header has a 2x10 configuration with 2x2mm pitch. It is “through-hole”, making different assembly
configurations possible (top or bottom), to accommodate various embedded applications. “Pin 1” is indicated by
a square pad on the PCB.
This section provides the signal descriptions on this header, and available connector types. It is referred to as
“I/O” in the following table.
I/O connector pin assignment
Port
Signal Description
Signal
Type
Signal
Format
Comments
I/O-1
SPI MOSI
Digital
Output
0 to 3.3VDC
Source / Sink Current 24 ma max.
I/O-2
SPI CLOCK
Digital
Output
0 to 3.3VDC
Source / Sink Current 24 ma max
I/O-3
SPI MISO
Digital
Input
0 to 3.3VDC
Accept Input voltage up to 5.5VDC
(Internal pull-up 100KΩ to 3.3VDC)
I/O-4
DS/MON LED (lit when low)
Digital
Output
0 to 3.3VDC
DS ch locked / Monitoring activity
Parallel with on-board LED cathode,
series 330R to CPU LED port.
I/O-5
Ground
Reference
0V
I/O-6
ONLINE/OK LED (lit when low)
Digital
Output
0 to 3.3VDC
CM online / operating status
Parallel with on-board LED cathode,
series 330R to CPU LED port.
I/O-7
US/CABLE LED (lit when low)
Digital
Output
0 to 3.3VDC
US ch locked / rf comm..activity
Parallel with on-board LED cathode,
series 330R to CPU LED port.
I/O-8
POWER LED (lit when low)
Digital
Output
0 to 3.3VDC
Power status.
Parallel with on-board LED cathode,
series 330R to CPU LED port.
I/O-9
SPI Chip Select 1
Digital
Output
0 to 3.3VDC
Source / Sink Current 24 ma max.
I/O-10
SPI Chip Select 2
Digital
Output
0 to 3.3VDC
Source / Sink Current 24 ma max.
I/O-11
GPIO_00
Digital
IN/Out
0 to 3.3VDC
General purpose I/O.
Source / Sink Current 4 ma max.
3.4V max input voltage.
I/O-12
Ground
Reference
0V
Tied to PCB ground plane.
I/O-13
Ground
Reference
0V
Tied to PCB ground plane.
I/O-14
Serial port transmit enable (active
high) and Receive enable (active
low)
Digital
Output
0 to 3.3VDC
Used for half duplex communication.
HMS022 (MAC layer) ready
I/O-15
Reset (active low)
Digital
Input
0 to 3.3VDC
or "Open"
Internal pull-up 10KΩ το 3.3 VDC
Tied to PCB ground plane.
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I/O-16
RF LEVEL LED (G) (lit when low)
Digital
Output
0 to 3.3VDC
RF level LED, green element.
Parallel with on-board LED cathode,
series 330R to CPU LED port.
I/O-17
GPIO_01
Digital
IN/Out
0 to 3.3VDC
General purpose I/O.
Source / Sink Current 4 ma max.
3.4V max input voltage.
I/O-18
RF LEVEL LED (R) (lit when low)
Digital
Output
0 to 3.3VDC
RF level LED, red element.
Parallel with on-board LED cathode.
series 499R to CPU LED port.
I/O-19
UART Transmit
Digital
Output
0 to 3.3VDC
Serial data out
HMS022 (MAC layer) ready
I/O-20
UART Receive
Digital
Input
0 to 3.3VDC
Serial data in
Internal pull-up 100KΩ to 3.3 VDC.
HMS022 (MAC layer) ready.
The following pages show the I/O connector options, and examples of mating connectors.
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J1410:
P/N:
mating for J1410:
2X10P-2.0W (Male header, right angle, 2x10, 2.0 x 2.0mm pitch)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
P/N
2x10P-2.0M (Female header, right angle, 2x10, 2.0 x 2.0mm pitch)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
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J1413:
P/N:
Mating for J1413:
2X10P-2.0-180
(Male header, shrouded, straight, 2x10, 2.0 x 2.0mm pitch)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
P/N: MFC-20P
(2x10 connector for ribbon cable)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
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J1414:
P/N:
mating for J1414:
2.0 2x10P
(Male header, straight, 2x10, 2.0 x 2.0mm pitch)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
P/N
2X10P-2.0X4.3mm (Female header, right angle, 2x10, 2.0 x 2.0mm pitch)
SHENZHEN XINRITENG ELECTRONICS Co., LTD
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4.1.5.2.RF interface options
The EMMS3 can be provided with a modular diplexer module and F female interface connector, or separate
upstream (US) and downstream (DS) rf connectors.
The US and DS rf connectors standard options are “MCX straight”, and “SMB right angle”, all 75Ω impedance.
They are “through-hole” type, which can accommodate various application specific mounting options.
The rf interface components are identified as following on the PCB (top side for diplexer, bottom side for the
SMB/MCX connectors):
J1402 Diplexer module
J1403 Upstream MCX
J1405 Upstream SMB
J1404 Downstream MCX
J1406 Downstream SMB
Note that the SBM/MCX connector options share a common PCB footprint.
The following pages provide more details on the various rf interface options.
J1402 Diplexer module
A diplexer can be installed for direct coaxial connection with an F connector. Three frequency splits are offered.
Diplexer is surge protected against ring wave and combination wave.
Electroline internal part number (reference):
42 / 54 MHz frequency split
1071-0204
Electroline internal part number (reference):
65 / 85 MHz frequency split
1071-0206
Electroline internal part number (reference):
85 / 108 MHz frequency split
1071-0213
Warning: if Diplexer option is used;
•
Do not exceed 10 inches-pounds of torque on the F-connector.
•
F connector shall have RF signal only, do not connect AC power (RF+AC).
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Diplexer mechanical characteristic:
11.0 MIN
25mm
LP
14.61
GND
HP GND
Plating:
Housing and cover: Mat tin over copper flash.
Leads:
Gold
Housing and cover material: Steel
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J1403/J1404:
MCX 75Ω straight jack
Manuf / P/N: Johnson Components 133-8701-211 (or equivalent)
J1405/J1406:
SMB 75Ω right-angle jack
Manuf / P/N: Johnson Components 131-8701-301 (or equivalent)
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4.1.6.MTBF
MTBF: 52.2 years
MTBF is calculated per Bellcore TR-332, method 1 at 40°C using an environmental multiplying factor
of 1.5. As per Bellcore specifications, the activation energy (Ea) varies by component type.
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4.2. Mechanical (pcb assembly)
The following figures shows 3D views and dimensions of the EMMS3 PCB assembly, for several rf interface
options.
- With diplexer module and F connector:
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- With SMB connectors (no diplexer):
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- With MCX connectors (no diplexer):
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4.2.1.PCB Mounting Points
The following figures show the positions of all mounting points (PCB and heatsink), and connectors on the
EMMS3 PCB.
PCB top views:
Mounting Hole "A"
Ø2.5mm+/-0.07 [.098"+/- .003]
-4 places
Heat sink Hole
Ø3.2mm+/-0.07 [.126"+/-.003]
-4 places
A
2.1mm [0.08"]
3.8mm [0.15"]
B
17.3mm [0.68"]
25.1mm [0.99"]
61.8mm [2.43"]
62.6mm [2.46"]
62.8mm [2.47"]
65.0mm [2.56"]
A
B
B
2
8
B
A
A
5.3mm [0.21"]
14.6mm [0.57"]
17.9mm [0.71"]
42.8mm [1.69"]
80.5mm [3.17"]
84.2mm [3.32"]
91.7mm [3.61"]
110.1mm [4.33"]
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133.3mm [5.25"]
101.9mm [4.01"]
95.4mm [3.76"]
55.2mm [2.17"]
33.3mm [1.31"]
59.9mm [2.36"]
2
8
74.9mm [2.95"]
101.9mm [4.01"]
24.1mm [0.95"]
[0.08"]2.0mm
TYP.
3.5mm [0.14"]
7.8mm [0.31"]
1
26.1mm [1.03"]
57.6mm [2.27"]
25.0mm [0.98"]
7.0mm [0.28"]
8
51.5mm [2.03"]
2
41.5mm [1.63"]
98.941mm [3.895"]
1
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PCB bottom view:
75.0mm [2.95"]
60.4mm [2.38"]
7.0mm [0.28"]
99.1mm [3.90"]
23.3mm [0.92"]
13.5mm [0.53"]
8.1mm [0.32"]
17.7mm [0.70"]
27.8mm [1.09"]
37.8mm [1.49"]
47.9mm [1.89"]
56.8mm [2.24"]
61.6mm [2.42"]
1
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4.2.2.Product Finish
The EMMS3 is assembled on an 4-layer FR4 PCB of 0.062in thickness, gold plated and ROHS compliant.
4.2.3. Labeling
A master label is affixed to the unit and includes the informations such as the model, serial number and MAC
address. MAC address and serial number are displayed and encoded in bar codes. MAC address is printed with
the dash “-“ between the digits but it is not encoded in the bar code. The bar codes on the label are Code 128type and include the MAC address of the unit and the serial number. Inside of the individual carton there is four
stick-on labels with model number, MAC address and serial number.
4.3.Environmental & heat-sinking
The EMMS3 is provided on a PCB with exposed 3383 CPU. Heat-sinking is mandatory, and application
specific. Three PCB holes are provided in proximity of the 3383, so that a heat-sinking bracket or similar device
can be affixed to the PCB, to transfer the generated heat away from the CPU and towards the housing and
environment. The heat must be extracted from the 8x8mm die on top of the CPU package, as shown below.
Note that the optional 33843 CPU (for 16x4 operation) has an additional heat transfer plate on top of the
package, resulting in an increased height and contact area for heat sinking.
3383CPU
size: 23x23mm
heat transfer area: 8x8mm
nominal height: 2.0mm
θJC = 0.56 ⁰C/W
33843CPU
size: 23x23mm
heat transfer area: 18x18mm
nominal height: 2.4mm
θJC = 2.32 ⁰C/W
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The heat-sinking mechanism used must allow the CPU die temperature and PCB temperature to remain within
the limits shown in this section. The PCB and CPU die temperatures are measured by internal sensors, and can
be read by the following MIB objects:
CPU die temperature:
Name: dieTemperature
Type: OBJECT-TYPE
OID:
1.3.6.1.4.1.5802.1.3.1.4.4.4.1
Module: ELECTROLINE-COMMON-TEST-MIB
PCB temperature:
Name: internalTemperature
Type: OBJECT-TYPE
OID:
1.3.6.1.4.1.5802.1.3.1.4.3.1
Module: ELECTROLINE-COMMON-STATUS-MIB
Thermal operating limits for the “commercial” and “industrial” grade EMMS3 modules are as follows:
Industrial grade:
PCB temperature
-40⁰C to 85⁰C
CPU die temperature: 110⁰C max
Commercial grade:
PCB temperature
0⁰C to +70⁰C
CPU die temperature: 110⁰C max
Storage Temperature: -45°C to +85°C
Humidity:
0 to 90%, non-condensing
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4.4.Firmware
4.4.1.General
The firmware is loaded in the ECMM’s non-volatile memory. It is based on the chipset manufacturer’s
reference firmware with additional optional functions for monitoring. The chipset includes an SNMP agent that
is accessed by a third-party SNMP manager such as a MIB browser or a NMS/EMS software.
The ECMM’s SNMP agent implements SNMPv1 , SNMPv2c and SNMPv3 with Diffie-Hellman key exchange.
The EMMS3 supports the following SNMP commands: Get, Set, GetNext, GetBulk and Traps.
DHT Unit
Requests:
"set" values
DHT's power supply
monitoring application
Requests: "Set" and
"get" queries
SNMP Agent
Events:
Alarms and
nominal traps
Events (traps):
Cold and warm starts
and alarms
Network
Management
System
or
Element Management
System
When used for monitoring function, the EMMS3 actively monitors the parameters that are defined, and
periodically compares the current values it reads against a set of thresholds. The period between comparisons is
10 seconds. If one of the alarm thresholds is reached, the EMMS3 sends a trap to the management system as
long as the alarm enable bit is set for the item. The EMMS3 starts or re-starts a 30 second timer each time a user
sets any of the configuration objects. The net system effect of this is to store the configuration 30 seconds after
the last configuration MIB is set. This method assumes that the user sets the desired configuration MIBs one
right after the other in a relatively short time.
Other features of the firmware include:
°
Trap assurance
An Electroline MIB object ensures that traps sent by the EMMS3 are received by the EMS. This feature
can be turned on or off depending on the NMS/EMS.
°
Automatic detection of devices
The EMMS3 automatically detects target motherboard. For example, in a power supply monitoring
function, EMMS3 would obtain status monitoring parameters and power supply ID from an HMS022
data bus.
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Automatic registration
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The EMMS3 automatically registers with the CMTS and, if the EMS’s IP address is in the DOCSIS
configuration file, it automatically registers with the EMS.
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Support for multiple managers
The EMMS3 sends its traps to a list of management stations (maximum of 10). An Electroline MIB
object supports this feature.
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Automatic shutoff of inverter test (for power supply application)
When performing power supply monitoring function, the EMMS3 automatically stops the power
supply’s inverter test after a user configurable amount of time (default value is 15 minutes) or when one
battery reaches 10.875 VDC (5.4V for 6V battery) in order to avoid depleting the batteries.
4.4.2.Communication Protocols
The is compliant with all DOCSIS 3.0 media access control (MAC) layer specifications.
The SNMP protocol is used for communications between the EMMS3 and a network or element management
system (NMS or EMS). This communication is essentially to relay the status of the data monitored standby
power supply and to configure the EMMS3, This protocol is encapsulated over the IP protocol so that the data
can be carried on an IP network. The EMMS3 includes an SNMP agent that responds to commands from an
SNMP manager such as a MIB browser or an NMS/EMS station.
To formulate a query into an SNMP command, the NMS uses the appropriate object ID (a MIB element). It
then sends the command using the EMMS3’s IP address. The packet is routed through the cable operator’s LAN
to a CMTS that transmits the packet over the cable network. The EMMS3 decapsulates the SNMP information
that is transported over a UDP frame and over a DOCSIS frame and then takes action upon it.
Each EMMS3 has an IP address which allows it to use an IP-based addressing scheme. The NMS issues or
receives commands in the following format:
[DOCSIS[IPNE[UDP[SNMP]]]]
where: “IPNE”
“UDP”
“SNMP”
represents the IP frame including the IP address of the EMMS3
represents the UDP frame
represents the SNMP command/request using HMS MIBs objects
4.4.3.MIB Support
MIB support depends on the application and integration method of the EMMS3 into the target device. For
example, if EMMS3 is integrated into a power supply and communication is made using HMS022, the EMMS3
supports the applicable standby power supply MIB objects as defined by the SCTE’s HMS subcommittee. The
®
MAC and PHY objects are not implemented because DOCSIS covers them.
Another example is implementing an EMMS3 onto a motherboard, which in turn, is embedded into a fiber
node. In this case, the EMMS3 supports the applicable fiber node MIB objects as defined by the SCTE’s HMS
subcommittee. An alternate approach could be to have a separate microprocessor with full TCP/IP stack with an
embedded SNMP agent. In this scenario, EMMS3 acts as a regular cable modem performing only packet
forwarding hence, the monitoring agent providing the MIB objects would be accessible from a different IP
address and would be seen as a CPE device.
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4.4.3.1.DOCSIS® MIBs
The EMMS3 complies with the DOCSIS (and EuroDOCSIS) 3.0 specification.
The DOCSIS 3.0 MIBs are already included in the SNMP agent of the chipset’s reference design and can be
found in the DOCSIS/EuroDOCSIS 3.0 documentation, from the CableLabs web site.
4.4.3.2.HMS MIBs
The EMMS3 complies with the following SCTE-HMS MIBs:
•
SCTE 36 (HMS028) SCTE-ROOT and scteHmsTree definition
•
SCTE 37 (HMS072) scteHmsTree subgroups:
•
SCTE 38-1 (HMS026) propertyIdent objects
•
SCTE 38-2 (HMS023) alarmsIdent objects
•
SCTE 38-3 (HMS024) commonAdminGroup objects and the commonPhyAddress object
•
SCTE 38-4 (HMS027) psIdent objects
•
SCTE 38-5 (HMS025) fnIdent objects
•
SCTE 38-6 (HMS033) genIdent objects
•
SCTE 38-7 (HMS050) transponderInterfaceBusIdent objects
4.4.3.3.Electroline Proprietary MIBs
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The Electroline proprietary MIBs support certain features that are not available with the DOCSIS or HMS
MIBs. The Electroline MIBs allow for inventory management and for configuration of certain parameters and
operating modes. For more information, see the Electroline MIB Interface Specification for Transponders
(publication 926-0005).
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4.4.4.HTTP server
The EMMS3 includes an HTTP server that can be used to read the status of the DOCSIS section of the cable
modem. It can also be used to read monitored devices data. The HTTP server is used with internet browsers,
and is accessible from both the Ethernet and RF side. It includes a spectrum analyzer display, that utilizes the
chipset’s “full band capture” technology. The spectrum analyzer function is compatible with Chrome and Safari
browsers only, and is accessed through port 8080.
4.4.5.Dual IP
The EMMS3 can have its monitoring parameters accessible on a second IP (and second MAC address). All the
SCTE-HMS MIB objects become available on a separate IP address with its own community string and access
list.
The additional MAC address for dual IP is related to the “cable” MAC address as follows:
MACDUAL-IP = MACCABLE + 2.
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