GP1S092HCPIF
GP1S092HCPIF
SMT, Gap : 2mm, Slit : 0.3mm
Phototransistor Output,
Compact Transmissive
Photointerrupter
■ Description
■Agency approvals/Compliance
GP1S092HCPIF is a compact-package, phototransistor output, transmissive photointerrupter, with
opposing emitter and detector in a molding that provides
non-contact sensing. The compact package series is
a result of unique technology combing transfer and
injection molding.
This surface mount device has a shaped positioning
pin to assure accurate PCB placement, of the emitter
and detector. It is unique, because it is one of the
few photointerrupters that comes in Tape and Reel
packaging, for use with highly automated pick and
place equipment.
1. Compliant with RoHS directive
■Applications
1. General purpose detection of object presence or
motion.
2. Example: printer, lens control for camera
■ Features
1. Transmissive with phototransistor output
2. Highlights:
• Compact Size
• Positioning Pin “D” shaped to prevent misalignment
• Surface Mount Type (SMT)
• Tape and Reel (T&R) 2 000 pcs per reel
3. Key Parameters:
• Gap Width : 2mm
• Slit Width (detector side): 0.3mm
• Package : 4.5×2.6×2.9 mm
4. RoHS directive compliant
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
1
Sheet No.: D3-A00201FEN
Date Oct. 3. 2005
© SHARP Corporation
GP1S092HCPIF
■ Internal Connection Diagram
Top view
1
2
Anode
Collector
Emitter
Cathode
1
2
3
4
3
4
■ Outline Dimensions
(Unit : mm)
Top view
a'
φ1.2MAX.
a
(C0.3)
a-a' section
(0.3)
Slit width
2+0.2
−0.1
(C0.4)
Center of
light path
0.4
3.4
2
4
2−1±0.05
*2
R0.6±0.1
3
Date
code
0.5+0.1
−0.2
0.8
Package bottom
0.05+0.1
−0.05
(C0.3)
2.6±0.1
2.9±0.1
(0.75)
0.7±0.1
4.5±0.1
• Unspecified tolerance shall be ± 0.2mm
• Dimensions in parenthesis are shown for reference
• The dimensions indicated by ∗ refer to those measured
from the lead base
• The dimensions shown do not include those of burrs
• Leads coplanarity
Difference of distance between package bottom and
bottom side of each shall be MAX. 0.1mm
• Coplanarity of the boss and gap of the device shall be
0.1mm
•
portion : No solder plating
• The marking specifications are shown below
1
1.2±0.05
Product mass : approx. 0.05g
Plating material : SnCu (Cu : TYP. 2%)
■ Details of positioning pin dimensions
(0.35)
0.8
0.2
(Unit : mm)
30˚
(0.08)
0.2
0.2
1.2±0.05
0.4
30˚
(0.08)
0.4
1±0.05
1±0.05
R0.6±0.1
0.2
Sheet No.: D3-A00201FEN
2
GP1S092HCPIF
Date code (2 digit)
1st digit
Year of production
A.D.
Mark
2000
0
2001
1
2002
2
2003
3
2004
4
2005
5
2006
6
2007
7
2008
8
2009
9
2010
0
:
:
2nd digit
Month of production
Month
Mark
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
X
11
Y
12
Z
repeats in a 10 year cycle
Rank mark
There is no rank indicator.
Country of origin
Japan
Sheet No.: D3-A00201FEN
3
GP1S092HCPIF
■ Absolute Maximum Ratings
Parameter
Forward current
Input Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Output
Collector current
Collector power dissipation
Total power dissipation
Operating temperature
Storage temperature
∗1
Soldering temperature
∗
Symbol
Rating
IF
50
VR
6
P
75
VCEO
35
VECO
6
IC
20
PC
75
Ptot
100
Topr
−25 to +85
Tstg
−40 to +100
Tsol
260
(Ta=25˚C)
Unit
mA
V
mW
V
V
mA
mW
mW
˚C
˚C
˚C
1 For 5s or less
■ Electro-optical Characteristics
Parameter
Forward voltage
Input
Reverse current
Output Collector dark current
Collector current
Transfer
Collector-emitter saturation voltage
characRise time
teristics Response time
Fall time
Symbol
VF
IR
ICEO
IC
VCE(sat)
tr
tf
Condition
IF=20mA
VR=3V
VCE=20V
VCE=5V, IF=5mA
IF=10mA, IC=40μA
VCE=5V, IC=100μA, RL=1kΩ
MIN.
−
−
−
100
−
−
−
TYP.
1.2
−
−
−
−
50
50
MAX.
1.4
10
100
400
0.4
150
150
(Ta=25˚C)
Unit
V
μA
nA
μA
V
μs
μs
Sheet No.: D3-A00201FEN
4
GP1S092HCPIF
Fig.2 Power Dissipation vs.
Ambient Temperature
60
120
50
100
Power dissipation P, Pc, Ptot (mW)
Forward current IF (mA)
Fig.1 Forward Current vs.
Ambient Temperature
40
30
20
10
80
75
0
25
50
75 85
P,Pc
60
40
20
15
0
25
Ptot
0
−25
100
0
Ambient temperature Ta (˚C)
25
75 85
50
100
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Forward Voltage
Fig.4 Collector Current vs.
Forward Current
1.1
VCE=5V
Ta=25˚C
1
0.9
25˚C
0˚C
25˚C
50˚C
Collector current IC (mA)
Forward current IF (mA)
100
75˚C
10
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
0
3
2
4
Fig.5 Collector Current vs.
Collector-emitter Voltage
3.3
10
12
14
100
Relative collector current (%)
2.4
IF=40mA
2.1
1.8
IF=30mA
1.5
1.2
IF=20mA
0.9
IF=10mA
IF=5mA
2
3
4
90
80
70
60
50
40
30
10
0
0
1
20
20
0.3
0
18
IF5mA
VCE5V
110
IF=50mA
0.6
16
120
2.7
Collector current IC (mA)
8
Fig.6 Relative Collector Current vs.
Ambient Temperature
Ta=25˚C
3
6
Forward current IF (mA)
Forward voltage VF (V)
5
6
7
8
9
10
25
Collector-emitter voltage VCE (V)
0
25
50
75
Ambient temperature Ta (˚C)
Sheet No.: D3-A00201FEN
5
GP1S092HCPIF
0.2
Fig.8 Collector Dark Current vs.
Ambient Temperature
IF10mA
IC40MA
0.18
Collector dark current ICEO (A)
Collector-emitter saturation voltage VCE (sat) (V)
Fig.7 Collector-emitter Saturation Voltage vs.
Ambient Temperature
0.16
0.14
0.12
0.1
0.08
10
6
10
7
10
8
10
9
VCE20V
0.06
0.04
25
0
25
50
10
75
10
0
25
Ambient temperature Ta (˚C)
Fig.9 Response Time vs. Load Resistance
Response time (Ms)
1 000
75
100
Fig.10 Test Circuit for Response Time
VCE5V
IC100MA
Ta25˚C
VCC
RL
RD
Output Input
Output
Input
100
50
Ambient temperature Ta (˚C)
10%
tf
tr
10
ts
tf
td
tr
90%
td
ts
1
0.1
1
10
100
Load resistance RL (k7)
Fig.11 Detecting Position Characteristics (1)
Fig.12 Detecting Position Characteristics (2)
100
90
IF=5mA
VCE=5V
90
80
L=0
80
L
Relative collector current (%)
Relative collector current (%)
100
70
60
50
40
30
20
10
IF=5mA
VCE=5V
L=0
70
60
L
50
40
30
20
10
0
0
0
0.5
1
1.5
2
0
Shield moving distance L (mm)
0.5
1
1.5
2
Shield moving distance L (mm)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
Sheet No.: D3-A00201FEN
6
GP1S092HCPIF
■ Design Considerations
● Design guide
1) Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to
the external light.
2) Position of opaque board
Opaque board shall be installed at place 1.6mm or more from the top of elements.
(Example)
1.6mm or more
1.6mm or more
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photointerrupter will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Used parts
This product is assembled using the below parts.
• Photodetector (qty. : 1)
Category
Material
Maximum Sensitivity
wavelength (nm)
Sensitivity
wavelength (nm)
Response time (μs)
Phototransistor
Silicon (Si)
930
700 to 1 200
20
• Photo emitter (qty. : 1)
Category
Material
Maximum light emitting
wavelength (nm)
I/O Frequency (MHz)
Infrared emitting diode
(non-coherent)
Gallium arsenide (GaAs)
950
0.3
• Material
Case
Lead frame
Lead frame plating
Black polyphernylene
sulfide resin (UL94 V-0)
42Alloy
SnCu plating
Sheet No.: D3-A00201FEN
7
GP1S092HCPIF
■ Manufacturing Guidelines
● Storage and management after open
Storage condition
Storage temp.: 5 to 30˚C, Storage humidity : 70%RH or less at regular packaging.
Treatment after opening the moisture-proof package
After opening, you should mount the products while keeping them on the condition of 5 to 25˚C and 70%RH
or less in humidity within 4 days.
After opening the bag once even if the prolonged storage is necessary, you should mount the products within
two weeks.
And when you store the rest of products you should put into a DRY BOX. Otherwise after the rest of products
and silicagel are sealed up again, you should keep them under the condition of 5 to 30˚C and 70%RH or
less in humidity.
Baking before mounting
When the above-mentioned storage method could not be executed, please process the baking treatment
before mounting the products.
However the baking treatment is permitted within one time.
Recommended condition : 125˚C, 16 to 24 hours
∗Do not process the baking treatment with the product wrapped. When the baking treatment processing, you
should move the products to a metallic tray or fix temporarily the products to substrate.
Sheet No.: D3-A00201FEN
8
GP1S092HCPIF
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please solder within one time.
MAX
240˚C
1 to 4˚C/s
200˚C
MAX
160˚C
1 to 4˚C/s
1 to 4˚C/s
25˚C
MAX10s
MAX120s
MAX60s
MAX90s
Hand soldering
Hand soldering should be completed within 3 s when the point of solder iron is below 350̊C.
Please solder within one time.
Please don't touch the terminals directly by soldering iron.
Soldered product shall treat at normal temperature.
Other notice
Please take care not to let any external force exert on lead pins.
Please test the soldering method in actual condition and make sure the soldering works fine, since the
impact on the junction between the device and PCB varies depending on the cooling and soldering
conditions.
Lead terminals
Lead terminals of this product are tin copper alloy plated. Before usage, please evaluate solderability with
actual conditions and confirm. And the uniformity in color for the lead terminals are not specified.
Sheet No.: D3-A00201FEN
9
GP1S092HCPIF
● Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
Do not execute ultrasonic cleaning.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
Sheet No.: D3-A00201FEN
10
GP1S092HCPIF
■ Package specification
Package materials
Carrier tape : PS (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Package method
2 000 pcs of products shall be packaged in a reel. One reed with silicagel is endased in aluminum laminated
bag. After sealing up the bag, it encased in one case (5 bags/case).
Carrier tape structure and Dimensions
M
K
H
J
N
5˚
MA
X.
I
B
A
C
D
F
E
G
L
X.
MA
5˚
Dimensions List
A
B
±0.3
12
9.5+0.3
−0.2
H
I
+0.1
φ1.5−0
6.1±0.1
C
5.5±0.05
J
0.4±0.05
D
1.75±0.1
K
3.2±0.1
E
8±0.1
L
2.8±0.1
(Unit : mm)
G
±0.05
2
4±0.1
M
N
±0.1
4.3
1.45±0.1
F
Reel structure and Dimensions
e
g
c
d
Dimensions
a
330±1
e
21±1
f
a
b
List
b
13±1
f
2±0.5
c
80±1
g
2±0.5
(Unit : mm)
d
13±0.5
Sheet No.: D3-A00201FEN
11
GP1S092HCPIF
Direction of product insertion
Model name and quantity shall be printed
on the back side of the real
Pull-out direction
[Packing : 2 000pcs/reel]
Storage method
Storage conditions should follow the condition shown below.
Storage temperature : 5 to 30˚C
Storage hunidity : 70%RH or less
Sheet No.: D3-A00201FEN
12
GP1S092HCPIF
■ Important Notices
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
Sheet No.: D3-A00201FEN
[H128]
13
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Authorized Distributor
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