Program Manual
Programing
Manual
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1
PREFACE
Thank you for your recent purchase of a Pemtron Corporation product.
Before using the product, please read this manual carefully together with the additional supplied manuals to
ensure the proper handling and operation of the equipment so that this product will serve your needs for many
years.
After reading it, please keep the manuals within easy reach so that you may be able to refer to them when you
have questions about the operation of the system or if a troubleshooting need should arise.
The figures and photographs included in this manual may be slightly different from the actual objects depicted
and have been shown with an emphasis on ease of understanding,. Please also note that the physical
appearance and specifications for the product are subject to change without notice for improvement and
enhancement purposes.
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TABLE OF CONTENTS
I. INTRODUCTION ............................................................................... 4
I-1 background
I-2 PRODUCT Feature
I-3 TECHNOLOGIES
4
4
4
II. PRECAUTIONS FOR SAFE OPERATION....................................... 4
III. HOW TO MAKE DATA ................................................................... 5
III-1 HOW TO IMPORT GERBER DATA
5
III-1-1 IMPORT METHOD OF Gerber........................................................................................... 5
III-2 General data making method
7
III-2-1 data IMPORTING procedure .............................................................................................. 7
III-2-2 Board data setup procedure ............................................................................................... 7
III-2-3 Fiducial Mark setup procedure ......................................................................................... 10
III-2-4 Pad setup procedure ........................................................................................................ 12
III-2-5 FOV importing procedure ................................................................................................. 14
III-2-6 PCB loading procedure .................................................................................................... 16
III-2-7 Fiducial Mark teaching procedure .................................................................................... 17
III-2-8 2D Calibrate steps ............................................................................................................ 20
III-3 Inspection condition setup method
21
III-3-1 Inspection parameter setup procedure ............................................................................ 21
III-3-2 Inspection parameter debug procedure ........................................................................... 24
III-4 How to use Pad Condition
27
III-4-1 Work sequence for Pad Condition ................................................................................... 27
III-4-2 Pad size selection procedure ........................................................................................... 30
III-4-3 reference name input Operation procedure ..................................................................... 31
32
III-5-1 importing procedure with Array Fiducial ........................................................................... 32
III-6 how to make data with Virtual Fiducial
41
III-6-1 importing procedure with Virtual Fiducial ......................................................................... 41
III-7 How to set barcode
45
III-7-1 Barcode setting procedure ............................................................................................... 45
III-8 How to set bare board teaching
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III-5 how to make data with Array Fiducial
50
III-8-1 bare board teaching setting procedure ............................................................................ 50
III-8-2 bare board teaching data loading procedure ................................................................... 52
III-8-3 how to disable Bare Board Teaching................................................................................ 52
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I. INTRODUCTION
I-1 BACKGROUND
To maximize the return of investment on this inspection equipment, the product is based on the concept of
high throughput, in-line application, and cost savings. The most significant advantage is automation of the
inspection process to enable real time control of product quality. For this purpose, in-line application steps,
labor hours and other operations are required. This product is a high speed 3D solder print inspection system
which provides the performance required for in-line inspection through a combination of technologies
developed by Pemtron Corporation.
I-2 PRODUCT FEATURE
In-line total quantity inspection after solder printing is achieved with the high speed 3D solder print inspection
machine combining the technologies developed by Pemtron Corporation. The solder printing conditions for
φ=0.2 x 0.2 mm opening can be inspected using 3D. Also soldering area, volume, height, horn, bridge, blur
(excess solder), and misalignment can be inspected.
I-3 TECHNOLOGIES
- 3D high speed inspection with the Stripe pattern projection
- 2D / 3D combined inspection
- Automatic zero point setting
- Automatic warpage compensation by image recognition
- Two-colored ring LED
- Simple inspection recipe management
II. PRECAUTIONS FOR SAFE OPERATION
Since Warning and Caution points differ for every product, before you read this manual please refer to the
PRECAUTIONS FOR SAFE OPERATION in the Operation Manual or Service Manual.
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III. HOW TO MAKE DATA
This chapter explains how to import Gerber data necessary for inspection data, how to set the Fiducial Mark,
and how to set the inspection condition. Also, several types of formats are available to address various PCBs.
Section III-1 explains how to import Gerber data.
Section III-2 explains the procedure from the Board data setting to the Fiducial Mark setting as a general data
making method.
Section III-3 explains how to set the inspection conditions to combine with the scanned image data by the
created data.
Section III-4 explains how to use the Pad condition, which adjusts the inspection data without imaging the
PCB.
Section III-5 explains how to make the data using the Array Fiducial as the sub board importing method.
Section III-6 explains how to make the data using the Virtual Fiducial as the importing method in case there is
no Fiducial Mark on the Gerber Data.
Section III-7 explains how to set the Barcode.
III-1 HOW TO IMPORT GERBER DATA
III-1-1 IMPORT METHOD OF GERBER
The following explains how to import Gerber data on inspection machine format when making new
data.
Step 1: First, select “File” -> “Pad Control View” from the menu bar.
Step 2: “Press ‘OK’ to update gerber data” message if you are updating. In this example you are
creating new data so click “Cancel”.
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Figure III-1-1 Menu Bar
Figure III-1-2 Message display
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Step 3: Since the “Pad Control View” window is displayed, click “File Control” to select “Gerber
import”.
Figure III-1-3 “Pad Control View” window display
Step 4: The “Gerber import” window is displayed, Reference the data from the Gerber File or
Aperture File and select the Gerber data to be imported.
・
Extended Gerber type (RS274X) – Click ① for “Gerber File:” and select the Gerber
data.
・
Standard Gerber type (RS274D) – Place a checkmark on “Aperture File:” to select any
one of APT, REP, GAP, LST(r, s), GB, or LST(c, r), and click ② to select the Gerber data.
Step 5: When selecting Gerber data is done in the Figure III-1-4, click “OK”.
①
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* If you cannot select (or import) data even using the Standard Gerber type, you you will
need to enter each data from the Gerber Control by the Aperture manually.
②
Figure III-1-4 “Gerber import” window
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III-2 GENERAL DATA MAKING METHOD
III-2-1 DATA IMPORTING PROCEDURE
Step 1: When you import the Gerber data using the steps of the section III-1-1, the Gerber data is
displayed on the layout window.
Figure III-2-1 Layout window when importing Gerber data
III-2-2 BOARD DATA SETUP PROCEDURE
Step 1: Select “Y-axis symmetry”, “X-axis symmetry”, “90 degrees”, or “-90 degrees” in the “etc”
window on the left side of the window, so that the layout display will become congruent with
the actual PCB.
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Figure III-2-2 “etc” window display
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Invert to Y direction.
Invert to X direction.
Rotate 90 degrees
clockwise.
Rotate 90 degrees
counterclockwise.
Figure III-2-3 Window display in each importing
Step 2: Click “Board size & Origin” in the “PCB Control” window on the left side so that the layout
display will become congruent with the actual PCB.
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Figure III-2-4 “PCB Control” window display
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Step 3: Drag the area which is judged to be the perimeter of a PCB using the mouse.
Drag
by
the mouse
Figure III-2-5 PCB circumference setting window
Step 4: The “Board size & Origin” window is displayed, and the virtual Board size computed by the
above dragging operation is displayed in the “Width” and “Length” fields.
Step 5: Make sure that the values in “Width” and “Length” correspond with the actual PCB size based
on the Figure III-2-6, and if they don’t, enter the actual PCB size using key input (unit: mm).
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Figure III-2-6 “Board size & Origin” window display
Step 6: Select the board origin from among 4 kinds of “Origin” shown in the Figure III-2-6, and click
“OK”.
Step 7: The “Board size” of the “State of work” located at the bottom of the window changes from pink
to green.
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Figure III-2-7 “State of work” window display
III-2-3 FIDUCIAL MARK SETUP PROCEDURE
Step 1: Choose the button which corresponds with the shape of the Fiducial Mark from among “Flash”,
“Group”, or “Trace” of the “Select” group on the left of the window, and click.
・“Flash” is mainly used for data drawn in a circle.
・“Group” is mainly used for data whose lines are linked and drawn.
・“Trace” is mainly used for data drawn using lines.
Figure III-2-8 “Select” display on the left of the window
Step 2: Drag the Fiducial Mark with the mouse and surround it.
Drag
mouse
by
Figure III-2-9 Fiducial Mark setting
Right ckick
with mouse
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Step 3: The pink window surrounds the Fiducial Mark. Right click inside the window with the mouse
and select “Add Fiducial”.
Figure III-2-10 Add Fiducial setting
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* When the Fiducial Mark on the window looks small and is less visible, you can make it more
easily viewable by using the Zoom function of the “etc” on the left of the window.
Figure III-2-11 “Zoom in” window display
《Zoom in》
《Zoom out》
《Zoom fit》
Zoom in the surrounded area by dragging.
Zoom out by increments by clicking the “Zoom out” key.
Return to the original condition prior to “Zoom in / out”.
“Zoom out” / “Zoom fit” cannot be used unless “Zoom in” is used.
Step 4: Select the appropriate values for “Type” and “Shape” on the “Add Fiducial” window, and click
“OK”.
Figure III-2-12 “Add Fiducial” window display
“Type” dropdown list
《Global》
Critical mark
《Array》
Sub mark
《Local》
Sub mark per sub board
《Virtuality》 Temporary mark if there is no mark on Gerber
・
“Shape” dropdown list
《Rectangle》 Rectangle
《Circle》
Circle
《Undefined》 Unused
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・
Step 5: If other target Fiducial Marks exist, configure the setting according to Step 1 to Step 4.
Step 6: When the setting of all Fiducial Marks is completed, the “Fiducial” of the “State of work”
located at the bottom of the window, changes from pink to green.
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Figure III-2-13 “State of work” window display
III-2-4 PAD SETUP PROCEDURE
Step 1: Click “Work area” of the Pad control on the left side of the window. Consider the part which
includes the Pad except the “Fiducial Mark” as the inspection area, and surround it by
dragging with the mouse. The inspection area is surrounded in a red dotted line.
Drag with
mouse
Figure III-2-14 “Work area” setup window display
Step 2: When you click “Create Pattern” of the Pad control on the left side of the window, red
windows are automatically pasted to all the Pads within the inspection area surrounded by the
dotted line.
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Figure III-2-15 “Create Pattern” window display
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Step 3: The “Pad” of the “State of work” located at the bottom of the window changes from pink to
green.
Figure III-2-16 “State of work” window display
* If there are Fiducial Marks within the “Work area” (i.e. if Fiducial Marks are mixed in the Work
area), perform Step 4 to Step 5 to release the Fiducial Marks recognized as Pads.
* If there is no Fiducial Mark within the “Work area”, skip Step 4 to Step 5 and proceed to the
next section, III-2-5 FOV IMPORTING PROCEDURE.
Step 4: Click “Pad” of the “Select” on the left side of the window and surround the Fiducial Mark
recognized as the Pad by dragging with the mouse.
Drag by
mouse
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Figure III-2-17
Step 5: Press “Delete” on the keyboard, and cancel the Pad recognition.
If other target Fiducial Mark exists, configure the settings according to Step 4 to Step 5.
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III-2-5 FOV IMPORTING PROCEDURE
Step 1: Click “Create FOV” of the “FOV control” on the left side of the window. The FOV whose
movement is optimized is automatically allocated.
Figure III-2-18 FOV importing window display
Step 2: The “FOV” of the “State of work”, located at the bottom of the window, changes from pink to
green.
Figure III-2-19 “State of work” window display
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Step 3: Click “OK” on the lower right side of the window.
Figure III-2-20 FOV importing window display
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Step 4: The “Input PcbName” message will be displayed; click “OK”.
Figure III-2-21 Message display
Step 5: Enter the Group name and the Board name in the Header window, and select “Blue/Green” or
“Yellow/Red” of the Board Color.
Enter the metal mask thickness in “Stencil [T]”, and enter any comment in “Comment” as
needed, then click “OK”.
Figure III-2-22 Header window display
Step 6: The message “Press ’OK’ to update job data” is displayed. Click “OK” done.
Step 7: The message for the rail width adjustment will be displayed. Click “Yes”. The rail width
automatically changes.
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Figure III-1-23 Message display
Figure III-2-24 Message display
* If you don’t need to adjust the rail width, click “No”. Also, if the data for the same rail width
was imported in advance, this message might not be displayed.
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Step 8: When the rail width automatically changes and the layout window is displayed, the import
process will be finished.
Figure III-2-25 Layout window display
III-2-6 PCB LOADING PROCEDURE
Step 1: Place a PCB so that it will be sensed by the inloader sensor.
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Step 2: Select “Load/Unload” from the menu bar.
Figure III-2-26 Menu bar
Step 3: The “Load PCB” message is displayed. When done, click “Yes”.
Figure III-2-27 Load message display
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Step 4: After the PCB is conveyed and the message “Failed fiducial check” is displayed, click “OK”.
Figure III-2-28 Message display
Step 5: Next, the message “Global fiducial mark could not be found” is displayed; click “OK”.
Figure III-2-29 Message display
III-2-7 FIDUCIAL MARK TEACHING PROCEDURE
Step 1: Right click the lower right part of the window.
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Figure III-2-30 Layout window display
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Step 2: The “Board Data” window is displayed, so click “Set Fiducial Mark”.
Figure III-2-31 “Board Data” window display
Step 3: When right clicking inside the window, the camera moves to a new position. Adjust the Fiducial
Mark so that it will become located in the center of the window.
In so doing, if you can hardly see the Fiducial Mark due to causes such as the window looks
too dark or too bright, the “Fiducial LED / Binary value Setup” window will be displayed
when you click “LED/Binary Value”. Please change and tune the LED value so that you can
easily see it.
When you make the setting value smaller, the whole window becomes dark. When you make
the value bigger, the whole window becomes bright.
However, when you change this value, it will not be reflected unless you click “Grab” on the
“Setting Fiducial Dialog” window.
When the tuning is finished, close the “Fiducial LED / Binary value Setup” window.
Step 4: When you drag and surround the Fiducial Mark located in the center of the window by the
mouse, the IMAGE graphics is displayed on the right side of the window.
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Figure III-2-32 “Fiducial LED / Binary value Setup” window display
Drag by
the mouse
Figure III-2-33 “Setting Fiducial Dialog” window display
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In this case, it is recommended to surround the sesquialteral-sized space of the Fiducial Mark.
If the window is too large or too small, you may be unable to capture the Mark or compensate
the Mark recognition with high accuracy.
[Mark setting is too large]
[Mark setting is too small]
Figure III-2-34 Improper setup example
Step 5: The “Fiducial LED / Binary value Setup” window is displayed when you click “LED/Binary
Value”. Adjust the Binary value by changing so that the binarized image for “IMAGE” can be
displayed in sharp black and white.
When you make the setting value smaller, the whole window becomes brighter. When you
make the value bigger, the whole window becomes darker.
Figure III-2-35 “Fiducial LED / Binary value Setup” window display
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[Optimal Mark recognition state]
[Too bright]
[Too dark]
Figure III-2-36 IMAGE graphics
When the tuning is finished, close the “Fiducial LED / Binary value Setup” window.
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Step 6: Click “Teaching” on the “Setting Fiducial Dialog” window. When the Fiducial Mark is located
in the center of the window, the “Teaching” is finished.
Figure III-2-37 “Setting Fiducial Dialog” window display
If data other than Number 1 exists in “Fiducial Info”, repeat Step 3 to Step 7 in a manner
similar to Number 1.
Step 7: When all the “Teaching” steps are completed, click “Inspection” and check whether the
Fiducial Mark is properly recognized.
III-2-8 2D CALIBRATE STEPS
Step 1: When you completed the previous check (see section III-2-7, Step 8) using “Inspection”,
click ”Close” as shown in Figure III-2-35. With the “Setting Fiducial Dialog” window left
unchanged, the message “Do you want to perform automatic 2D calibration?” is displayed.
When done, click “Yes”.
Step 2: The “2D LED Calibration” window is displayed. Check the values for “MIN” and “MAX”. When
done, click “OK”.
* Because the brightness level of solder is set here, if the MIN is 90 and the MAX is 200, the
range between 90 and 200 is specified as solder.
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Figure III-2-38 Message display
Figure III-2-39 “2D LED Calibration” window display
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Step 3: The message “Min. value ***, Max. value *** Which would you like to apply?” is displayed.
Click “Yes” when done.
Figure III-2-40 Message display
III-3 INSPECTION CONDITION SETUP METHOD
III-3-1 INSPECTION PARAMETER SETUP PROCEDURE
Step 1: Select any one FOV from the Layout window by left-clicking it.
Moving the mouse on the layout displays the FOV Frame in Pink.
Step 2: The “Fiducial Mark reading check” dialog is displayed if the Fiducial Mark isn’t read. Select
“Yes” and after reading the Fiducial Mark, select “FOV”.
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Figure III-3-1 Layout window display
Figure III-3-2 Fiducial Mark reading check window display
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Step 3: Since the FOV image is displayed, select one Inspection Pad by right-clicking it.
Figure III-3-3 Inspection Pad window display
Step 4: The “ROI Analysis” is displayed.
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Figure III-3-4 ROI Analysis window display
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Step 5: Since the FOV image is displayed, select one Inspection Pad by right-clicking it.
Thresh
old,
Warnin
g
values
Figure III-3-5 Inspection condition
Step 6: When you click “Inspect” on the lower right of the window after changing any values, perform
a reinspection for the parts whose values were changed and the values will be set. Also,
when you need to adjust them further, set the Threshold and Warning values again
repeatedly.
Figure III-3-6 Run menu
When you want to set the values without inspection after changing them, click “APPLY”. The
changed values will be set as-is.
In addition, if you need to import to another Pad after adjusting the Threshold Warning value,
select the importing condition from the following to import one.
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Figure III-3-7 Importing condition window display
・《Init.》
・《Link figure》
・《Link ref.name》
・《Link pattern》
・《Link all》
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Change to the initial setting value.
Change all the same Pad shapes.
Change all the same references.
Change all the Pads which have the same pattern Number.
Change all the inspection data.
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III-3-2 INSPECTION PARAMETER DEBUG PROCEDURE
Step 1: Click “Auto” from the menu bar.
Figure III-3-8 Menu bar
Step 2: The “Inspection Setup” window is displayed. Select from among the three Modes and then
click “Start”. The inspection is started based on the selected Mode.
Figure III-3-9 “Inspection Setup” window display
《Inspection Mode》
This is used in normal inspection. Carry in a PCB one by one, inspect it, and carry it
out to perform serial inspections.
・
《Repeat Mode》
Inspect a PCB repeatedly. In normal inspection, this isn’t used.
This is used for checking the machine precision and other tests. Also, when you place
a checkmark on “conveyor”, you will perform serial inspections by carrying the PCB
from the exit side to the entrance side.
・
《Debug Mode》
If any NG occurs during inspection, the inspection suspends.
The final result and the inspection recipe for the NG component can be changed.
The Debug Mode normally works in a manner similar to the Auto Mode but this is the
mode for improving the PCB’s direct first run rate by checking the detected image by
the operator and tuning the inspection recipe extemporarily.
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・
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Step 3: Select “Detail Option”. Change the Stop Option to “Stop with NG Viewer mode” and the
display when NG judging to “Edit NG Viewer” and “Large Image Save”. Clicking “OK”
ensures the setting.
Figure III-3-10 “Inspection Setup” window display
Step 4: Inspect the actual PCB using the “Inspection Mode”.
Step 5: Start the auto inspection. After the inspection of one PCB is finished, if there is any Pad which
was judged as NG, the “NG Monitor” is displayed..
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Figure III-3-11 NG Monitor window display
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Step 6: When you check the image using 2D and 3D and you decide to make any adjustment of the
inspection parameters, select “Edit Data” to display the “ROI Analysis” dialog. Tune the
parameters according to the section III-3-1, Inspection Parameter Setup procedure.
Step 7: If you select “Exit” after tuning, the “ROI Analysis” dialog is closed and the “NG Monitor”
dialog is displayed. For the inspection result, select “OK” or “NG” based on the circumstances.
The next defective Pad will then be displayed. Check all the defects. However, if there are
many defects judged as NG, select “Manual” and readjust the inspection parameters.
Step 8: When all the NG judgments are completed and any defects have occurred, the PCB is carried
out to the exit and stopped. In the case of good components, the PCB is carried out to the next
process.
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III-4 HOW TO USE PAD CONDITION
III-4-1 WORK SEQUENCE FOR PAD CONDITION
This section explains the function of adjusting inspection data without imaging a PCB.
If you use this function, you can set or modify the inspection data and search by the Pad size.
Below we focus on the general work sequence.
Step 1: First, select “PAD Condition” from the menu bar.
Figure III-4-1 Menu bar
Step 2: The “Pad Condition” window is displayed on the layout window.
Information
Array
Pattern
Pad
: Sub board number
: Pad ID
: Pad number
Width
Length
Area
Angle
X Coord
Y Coord
: Pad opening size (mm)
: Pad opening size (mm)
: Pad area value
: Pad angle
: Pad X direction coordinate
: Pad Y direction coordinate
Select Option
Sel Pattern
Sel Ref.Code
Sel Type
Sel Ref.coord
Size
: Select the Pad with the same Pad ID.
: Select the Pad with the same reference name.
: Select the Pad with the same shape.
: Unused
: Select by Pad size.
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Figure III-4-2 Pad Condition Layout window
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All
: Select all the Pads.
DeselectAll
: Release all the selected Pads.
DeselectPad
: Release only the selected Pads.
AdjustCond
: The inspection parameter setting window is displayed.
The parameter information of the inspection Pad is displayed in the list.
Step 3: Select a Pad to be parameter-tuned.
Using the Select Option, select a Pad to be changed.
When you want to modify all the Pads, select “All”. When you select some of Pads, drag on
the layout window to select.
Select a Pad and then “Sel Pattern” when you tune the Pad with the same Pad ID.
Select a Pad and then “Sel Type” when you tune the Pad with the same Pad shape.
Figure III-4-3 Select all the Pads
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Figure III-4-4 Select a Pad by dragging the mouse
Figure III-4-5 Select by the same Pad ID / Pad shape
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Step 4: After you selected the Pad, select “Adjust Cond”.
.
Figure III-4-6 Parameter tuning – password input
Step 5: The parameter setting window is displayed, so change the parameter of the item that you want
to tune.
When you click the item to be changed, the column turns white and you can enter the value.
Change this just like the contents of the section III-3 Inspection condition setup
procedure.
After setting the parameter, select “APPLY” to reflet thethe parameter setting.
When finished, select “Exit” to exit the parameter setting.
Step 6: When you return to “Pad Condition” and select “OK”, the dialog for checking whether you
save the inspection data or not appears. If you select “OK”, the changed data is saved.
If you select “NO”, the changed data isn’t saved and returns to the Manual mode. The
changed data is reflected if it was changed.
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Figure III-4-7 Parameter tuning – parameter input
Figure III-4-8 Confirmation for saving inspection data
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III-4-2 PAD SIZE SELECTION PROCEDURE
This section focuses on the advanced functions of the PAD inspection data editing.
Use the advanced functions depending on the set items.
Step 1: The following provides a supplementary explanation of the Pad selection function. First, we
explain the function to select the Pad by Pad Size. If you select “Size”, the “Pad Size” dialog is
displayed.
Enter the Pad size to be searched. When you want to search for small Pads, enter the target
Pad size into the “Min(mm)」” and select “Less”. Then, the Pads with the set size or smaller
are selected. Similarly, when you want to select any size, enter the sizes into the “Min(mm)”
and “Max(mm)” and select “In”. In that case, all the Pads between the entered sizes are
selected.
When you want to select bigger Pads, enter the Pad size to be searched into the “Max（mm)”
and select “More”. Then, the Pads with the set size or bigger are selected.
Select the Pad size 0.5 mm or smaller
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Select the Pad size from 0.5 to 1.0 mm
Select the Pad size 1.0 mm or bigger
Figure III-4-9 Select Pad Size window
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III-4-3 REFERENCE NAME INPUT OPERATION PROCEDURE
Step 1: This section explains how to set the reference code name. You can enter the reference code
manually.
Select the Pad for which you want to enter the reference code name. Right click the mouse to
open the menu window. Select “Pad.CodeEdit” on the menu.
Figure III-4-10 Select “Pad.CodeEdit”
Step 2: When the “CODE EDIT” dialog is displayed, enter the reference code.
Figure III-4-11 “CODE EDIT” window
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Step 3: The reference name is entered in the “CODE” column of the list.
Figure III-4-12 “CODE” window
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III-5 HOW TO MAKE DATA WITH ARRAY FIDUCIAL
III-5-1 IMPORTING PROCEDURE WITH ARRAY FIDUCIAL
Here we explain how to make the inspection data necessary to import sub boards.
Step 1: When you load the Gerber data according to the steps of Section III-1-1, the Gerber data is
displayed on the layout window.
Figure III-5-1 Layout window when importing Gerber data
Step 2: First, set the standard sub board as the inspection area.
For the “Fiducial Mark” setting, set “Array” to the Type.
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Figure III-5-2 “Pad Control View” window display
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Step 3: Select one Pad from the area where the inspection data was imported.
Select “Pad” on the Menu and select a Pad by dragging the mouse.
Figure III-5-3 Select Pad window
Step 4: When you finish selecting the Pad in the Figure III-5-3, select “Array” of the “PCB control”.
Figure III-5-4 “PCB Control” window
Step 5: The “Array Board” setting window is displayed on the layout window click “Source” of the
Array gap.
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Figure III-5-5 Array import – Data setting for “import from” window
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Step 6: Select the Pad which is the same as the Pad to be Array-imported with the Pad selected in
Step 3. Then select “Flash” or “Trace” and drag the mouse to set.
Figure III-5-6 Array import – Pad setting window
Step 7: Click “Offset” of the Array gap on the Layout window’s Array Board setting dialog.
Figure III-5-7 Array import – Data setting for “import to” window
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Step 8: Select “Add” on the Array Board setting dialog.
Figure III-5-8 Array import – Add inspection data window
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Step 9: Enter the number of sub boards to be imported in the “Add Array” setting dialog. The
“Number” is C = X direction and R = Y direction. When the imported angle is the same and
there are 2 PCBs in the X direction and 2 PCBs in the Y direction, enter C=2 and Y=2. The
offset value of the X direction is entered in the C field of the Gap, and the offset value of
the Y direction is entered in the R field.
Figure III-5-9 Add Array – Inspection data add setting window
Step 10: You can check the imported inspection area in the Layout window.
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Figure III-5-１0 After Array import window
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Step 11: If angles in the import source and the destination are different, select “Model2” in the Array
Board setting dialog of Step 8.
Step 12: Perform the Pad setting in the Import source according to the procedure of Step 4. After
setting, select “Source” of the Rotate Center Point in the Array Board setting dialog.
Step 13: Perform the Pad setting in the Import destination according to the procedure for Step 7. After
setting, select “Center” of the Rotate Center Point in the Array Board setting dialog.
Figure III-5-11 Array Board import angle setting window
Step 14: Select “New” in the Array Board setting dialog. Select “Angle” of the import destination.
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Figure III-5-１2 Array angle setting window
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Step 15: The imported inspection area can be checked in the Layout window.
Figure III-5-１3 After Array-import window
Step 16: To import the data whose angles were changed, set the standard Pad to be imported in the
angle-changed and imported inspection area. The setting method is the same as for Step 8.
Step 17: When you set the Pad in the import source, select “Source” of the Array gap in the Model2,
of the Array Board setting dialog.
Step 18: Performing the Pad setting in the Import source is done according to the procedure of Step 4.
After setting, select “Offset” of the Array gap in the Model2 of the Array Board setting
dialog.
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Step 19: Select “Add” of the Model2 in the Array Board setting dialog. Set the sub board information
to be imported according to the same procedure as Step 9.
Figure III-5-１4 Array angle change for sub board setting window
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Step 20: You can check the imported inspection area in the Layout window.
Figure III-5-１5 After Array import window
Step 21: Select “Create FOV” to auto-configure the FOV. The FOV is imported only in the inspection
area where the import source was. At this time, the FOV is set even in the inspection area
where the FOV is not imported.
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Figure III-5-１6 FOV setup window
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Step 22: Click “OK” on the lower right of the window.
Figure III-5-17 FOV setup window display
Step 23: The “Input PcbName” message is displayed; click “OK”.
Figure III-5-18 Message display
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Step 24: Enter the Group name and the Board name in the Header window, and select “Blue/Green”
or “Yellow/Red” of the Board Color.
Enter the metal mask thickness into the Stencil[T]. Enter any comment into the Comment
column as needed, and then click “OK”.
Figure III-5-19 Header window display
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Step 25: The message “Press ’OK’ to update job data” is displayed. Click “OK” when finished.
Figure III-5-20 Message display
Step 26: Because the message for the rail width adjustment is displayed, click “Yes”. The rail width
automatically changes.
Figure III-5-21 Message display
* If you don’t need to adjust the rail width, click “No”. Also, if the data for the same rail width
was imported in advance, this message might not be displayed.
Step 27: When the rail width automatically changes and the layout window is displayed, the import
process will be finished.
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Figure III-5-22 Inspection layout – FOV setting window
Step 28: Perform the subsequent procedures according to the section III-2-6 PCB Loading
Procedure.
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III-6 HOW TO MAKE DATA WITH VIRTUAL FIDUCIAL
III-6-1 IMPORTING PROCEDURE WITH VIRTUAL FIDUCIAL
Here we explain how to make data by setting a Pad or something as a temporary Fiducial Mark once
you load the Gerber data which doesn’t have any Fiducial Mark for inspection, and then configure the
Fiducial Mark position on the actual PCB.
Step 1: When you load the Gerber data according to the section III-2-1, the Gerber data is displayed in
the Layout window.
Figure III-6-1 Layout window when importing Gerber data
Step 2: Perform the Board data setting according to the Steps of Section III-2-2.
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Step 3: First, set the land or other item as a temporary Fiducial Mark.
Select the proper item when setting “Fiducial Mark”, and set “Virtual” to Type.
Figure III-6-2 Pad Control View window display
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Step 4: If you perform the section III-2-4 Pad Setting Procedure and III-2-5 FOV Import Procedure,
and the position of +[1], which indicates “Fiducial Mark” on the selected Pad on the Layout
window, is displayed, this is the end of making data with Virtual Fiducial.
Figure III-6-3 Layout window display
Step 5: Open the Fiducial Mark setting window according to the Teaching Procedure of the section
III-2-7 Fiducial Mark Teaching Procedure after you perform the section III-2-6 PCB
Loading Procedure, and configure the Fiducial Mark setting.
As usual, tune all the temporary Fiducial Marks set when you import the Gerber data. When
the tuning of the Fiducial Mark position and lighting is finished, click “Virtual Teaching” on the
right side of the menu, and configure all the Fiducial Mark settings.
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Figure III-6-4 Virtual Teaching setup window
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Step 6: When the “Virtual Teaching” of the Fiducial Mark is completed, select “Virtual Inspection”.
Figure III-6-6 Virtual Inspection setup window
Step 7: Set the formal (not temporary) Fiducial Mark.
Move the image to the Mark position that you want to make the formal Fiducial Mark, and
configure the setting for the position and the lighting. When you click “Change Real fiducial”
and perform the Teaching action after the setting is finished, the “Fiducial Mark” is changed.
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Figure III-6-7 Change Real fiducial setup window
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Step 8: When all the above steps are finished, configure the normal “Fiducial Mark” setting and “2D
LED Calibration” setting. When the position of +[1], which indicates “Fiducial Mark” on the
layout window, is displayed as changed, this is the end of making data with Virtual Fiducial.
Figure III-6-8 Layout window display
Step 9: Perform the subsequent procedures according to the section III-2-6 PCB Loading
Procedure.
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III-7 HOW TO SET BARCODE
III-7-1 BARCODE SETTING PROCEDURE
This section explains how to operate the Barcode read setting.
Step 1: Select “Set Barcode Mark” from the “Board Data” window.
Figure III-7-1 Board Data setting
Step 2: The Barcode read setting dialog is displayed.
Figure III-7-2 Setting Barcode window
Step 3: Select the Barcode to be read from the “Barcode Type” list.
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Figure III-7-3 Barcode Type setting
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Step 4: Select the Barcode of the “Barcode Info”. Select “Move” to move the camera to the initial
setting position.
Figure III-7-4 Select Barcode No
Step 5: Move the camera to the position where the Barcode to be read is located.
When you place the mouse within the image and right click, the camera moves.
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Figure III-7-5 Camera move
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Step 6: When you move to the Barcode to be read, set the read size.
Set the read Barcode by dragging the mouse. Surround the space about 10 mm larger than the
read Barcode. In addition, specify the Barcode color to be read. Black or White can be set using the
“BarCodeColor”.
Figure III-7-6 Barcode reading size
Step 7: Ensure the Barcode reading size and the position. Select “Teaching”.
When the dialog for confirming the reading size and the position is opened, select “OK”.
When you set the reading size and the position, they are entered into the “Barcode Info”.
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Figure III-7-7 Reading size – identify the position
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Step 8: Select “Inspection”. When the data is normally read, it will be displayed in the dialog.
Figure III-7-8 Read Barcode ID
Step 9: If any reading error occurs, the “Inspection failed” dialog is displayed.
Step 10: When the Barcode read error occurs, set the LED color to the “LED Type Select”, the LED
light volume to the “LED Value”, and the binarization to the “Binary Value”.
In the white Barcode, the reading using the LED Type Select = 2D BLUE,
the LED Value = 7～10, and the Binary Value = 100～120 is made.
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Figure III-7-9 Read error
Figure III-7-10 Read error
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Step 11: Configure the action when the reading error occurs in auto inspection using “Barcode
reading error”.
The read result is displayed on the lower right of the layout window. This is the end of the
Barcode setting.
Figure III-7-11 Operation setting when any read error occurs during auto inspection
：Regard the inspection time as the Barcode ID.
：Regard the inspected number as the Barcode ID.
：Display the dialog to enter the Barcode ID manually.
Time stamp
The number of inspection
Edit Barcode
Figure III-7-12 Normal
Figure III-7-13 Inspection Time
Figure III-7-14 PCB Number
Figure III-7-15 Edit Barcode
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Step 12: Input the Barcode ID manually to click “OK”.
Figure III-7-16 Barcode ID manual input
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III-8 HOW TO SET BARE BOARD TEACHING
III-8-1 BARE BOARD TEACHING SETTING PROCEDURE
Explained here is how to measure the solder print height from the land surface in order to carry out
more precise inspections. Measure the resist surface value from the land surface, and specify the
offset volume as the corrected value when implementing inspections.
Step 1: Select “Teach” of Bare Setup in the Board Data window.
Figure III-8-1 Bare Board Teaching window
Step 2: The Bare Board Teaching menu window is displayed; select “Teach”.
Teach
Load
Close
：Run the Bare Board Teaching.
：Load the saved Bare Board Teaching data.
：Exit the Bare Board Teaching.
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Figure III‐8-2 bare teaching menu
Step 3: The “execution confirmation” dialog of the Bare Board Teaching is displayed, so select
“Yes”.
Figure III-8-3 Bare Board Teaching execution confirmation window
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Step 4: Bare Board Teaching is executed, and the Progress graph is displayed.
If you need to stop the Teaching for any reason, click “STOP”.
Figure III‐8-4 Bare Board Teaching progress window
Step 5: When the Bare Board Teaching is finished, the “Teaching data saving” dialog is displayed.
Enter the data name to save it.
Figure III‐8-5 Teaching data saving dialog
Step 6: When the Bare Board Teaching is finished, regard the measured value of the land surface
and the resist surface as the corrected value to implement the inspection measurement using
it. The measured result of the land surface is displayed on the “ROI Analysis” dialog’s 3D
Bare.
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Figure III‐8-6 Display after implementing Bare Board Teaching
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Figure III‐8‐7 Display when Bare Board Teaching is unadministered
III-8-2 BARE BOARD TEACHING DATA LOADING PROCEDURE
This section explains how to load the saved Bare Board Teaching data and implement the Bare Board
Teaching.
Step 1: Select “Load” on the Bare Board Teaching menu window.
When the “Data read confirmation” dialog is displayed, select “Yes”.
Figure III‐8‐8 Display for data load confirmation
Step 2: Select the saved file from the “Data confirmation” dialog, and select “Open”.
The data is loaded, and the Bare Board Teaching is applied.
Figure III‐8‐9 Display for data confirmation
Explained here is how to release the application of the Bare Board Teaching.
Step 1: Select “initialize” of the “Bare Setup” in the Board Data window.
The application of the Bare Board Teaching is released.
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III-8-3 HOW TO DISABLE BARE BOARD TEACHING
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Revision History
Date
2008/02/12
Page
Contents
Supplement
First Edition
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