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Reliability and Lifetime of Power Modules Tutorial: Industry Best
Practices in Reliability Prediction and Assurance for Power Electronics
Presentation · September 2016
DOI: 10.13140/RG.2.2.34359.32160
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Reliability and Lifetime
of Power Modules
Tutorial: Industry Best Practices in Reliability Prediction and
Assurance for Power Electronics
M. Thoben
Infineon Technologies, Max Planck Str. 1, D-59581 Warstein
EPE´16 ECCE Europe
2016-09-05
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
2
Main inverter for hybrid and electric vehicles
Full integration:
radial distributed electronics
source: BMW
source: BMW
Stand alone solution:
radial distributed electronics
 Small mechanical dimensions
 Design flexibility for system
integration
 Energy efficiency
source: ZF
Mechatronic solution:
Electronics attached to transmission
2016-02-15
 Lifetime
 System cost
Copyright © Infineon Technologies AG 2016. All rights reserved.
3
Failure Rate
Lifetime modeling / Mission profile is the basis
for service life calculations
Early „Infant Mortality“ Failure
e.g. Assembly failures
Wear Out Failures
Random Failures
Time
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
4
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
5
Reliability
For „standard“ packages there are well defined
„standard“automotive test qualification
For power modules the LV 324 released in 2014
Qualification of Power Modules for the use in components of Electrical and Hybrid Vehicles
General requirements, Test conditions and Tests
Can be ordered at supplier portal of BMW, Daimler, VW e.g. (VW 82324 GS / BMW GS 95035)
2016-02-15
Copyright © Infineon Technologies AG 2016. All rights reserved.
6
Power Module Test matrix
8.2 QL-01 Power Cycling (PCsec)
8.2.1 Intention
this is the basic test for ensuring the lifetime
2016-02-15
Copyright © Infineon Technologies AG 2016. All rights reserved.
7
PC conditions
Tjmax
Tj
Tc
Tcmax
Internal heating and external cooling
Conditions according : IEC 60749-34:2011
∆Tj = 50~100K
Tjmax = 150°C
One test with IL>=0.85 ICN
T1
T2
1 cycle
Tamb
Ic
Icmax
0A
PC,sec
ton <= 5 s
Focus: wire bond / die attach
PC,min
ton >= 15 s
Focus: wire bond / die attach / substrate solder
2016-02-15
Copyright © Infineon Technologies AG 2016. All rights reserved.
8
Power cycling (sec.)
Test procedure: TJ measurement by VCE (T)
›
TJ measurement indirectly by use of VCE
(T) dependency @ 100mA current
›
VCE values directly measured after load
current switch off @ 100mA and
calculate TJ by use of VCE (T) correlation
›
Linear or polynomial fit
Load current
Measurement current
TJ
VCE @ 100mA
Calculation via VCE
(T) calibration
VCE @ 100mA
2016-06-26
for internal use only
Copyright © Infineon Technologies AG 2016. All rights reserved.
9
During the Validation Test
example Power Cycling (sec.)
1
Online monitoring of VCE / Vf; TJ; TC; IC; RthJ-C data during the PC (sec) test
– VCE increase due to bondwire lift-off / chip solder delamination
– RthJ-C increase due to chip solder fatigue
Assessment for eol:
VCE/Vf limit:
+5% of initial value
RthJ-C limit:
+20% of initial value
2016-06-26
for internal use only
Copyright © Infineon Technologies AG 2016. All rights reserved.
10
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
11
Typical wear out mechanisms in power
modules
degradation of
chip metallization wire bond lift-off
Degradation of
chip solder
DBC solder joint
cracking
wire bond lift-off
degradation of chip
metallization
solder joint cracking
Degradation of
chip solder
Thermo mechanical stress leads to wear
out of interconnects in power modules
2016-02-15
Copyright © Infineon Technologies AG 2016. All rights reserved.
12
Combination of PowerCycling and Thermal-Cycling with test
condition: Tjmax=175 °C, Tcoolant,max=122 °C, Tcoolant,
min=22 °C
Twater_min
22°C
Twater_max
122°C
theating (passive)
10min
tcooling (passive)
5min
200
180
Tjmax=175°C
Tj
160
140
T [°C]
120
100
Tcase
80
60
40
20
0
0
100
200
300
400
500
t [s]
600
700
800
900
ILast
220A
ton (active)
2s
toff (active)
4s
No of active cycles
per passive cycle
100
Tjmax (standardmodule)
175°C
Tjmax (improved
module)
173°C
1000
Combination of PowerCycling and Thermal Cycling simulating Cold start
condition for Power electronics at engine coolant loop
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
13
Degradation in substrate and chip solder after combined
Thermal Cycling/PC test with Tjmax=175 °C and Tcoolant,
max=122 °C
Solder layer DCB-baseplate
US-image in Solder Layer Chip-DCB
After 240000 short / 2400 long cycles
Delamination
after 2400 long cycles
Improved .XT System solder
Degradation
(according electrical measurement)
No relevant
Degradation
>6500 long cycles
possible
Degradation of chip solder/wirebond and substrate solder occurs in
parallel under combined test conditions
Specific lifetime model for substrate solder necessary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
14
Influence of chip metallization and wire bond
material on degradation mechanism
1,0E+08
Power Cycles
1,0E+07
1,0E+06
1,0E+05
Chip metallisation V2
+ improved Al wire
Combined test
1,0E+04
1,0E+03
20,0
Reference module
Chip metallisation V1
+ improved Al wire
40,0
60,0
80,0
100,0
120,0
140,0
160,0
∆Tj
Chip metallisation
V1
Chipmetallisierung
V2
Reference Power module
Tjmax = 180°C
Tjmax = 175..200°C
Tjmax = 175..200°C
More cycles are reached compared to combined test conditions
Modification of chip metallisation and wire bond influences/improves reliability
Lifetime model has to be adapted to specific failure mechanism
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
15
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
16
Lifetime models
N f  A  T  e
a
j 

N f  K  TJ 1  e
(
Ea
)
k B T j ,mean
2 


 TJ 273

 ton 3  I 4 V 5  D 6
(Lesit project.
1997)
(R. Bayerer et al.
CIPS 2008)
(U. Scheuermann et al.
PCIM 2013)
(Tj=Tlow in °C)
Lebensdauerauswertung
1,0E+07
Comparison of Power Cycling Tests with
CIPS 2008 model
Anzahl der Zyklen
1,0E+06
1,0E+05
1,0E+04
40,00
50,00
60,00
70,00
80,00
90,00
100,00
110,00
120,00
ΔTj [K]
Test 600V IGBT
Test 1700V IGBT
CIPS2008 1200V
Standard BSM100GS120DLC
Test 1200V IGBT
CIPS2008 600V
CIPS2008 1700V
A. Hensler et al. :
Proc. Braunschweiger
Symposium Hybrid- und
Elektrofahrzeuge (2011)
 Liftime is influenced by several factors: ton / wire thickness / current)
 Models have to reflect influencing parameters to be more precise
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
Page 17
Reliability specification – HybridPACK Modules
 PC curves described for different Tvjmax
 Reliability specification below DT40K estimated
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
18
Reliability specification –
PC ton time dependency
If ton < 0.1s thes N=N(0.1s)
If ton > 60s thes N=N(60s)
 ton influence taken into account for 0.1s<ton<60s
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
19
Reliability specification – thermal cycling
95% Curve
 Reliability specification for thermal cycling
has to taken into account additionally to PC
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
20
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
21
Simulation Reliability PC,TC,TST
(Tjmax = 125°C)
1,0E+11
systemsolderdegradation
Copper
Chipsoder
delamination
Power cycling
1,0E+10
dotted lines: estimated
1,0E+09
n (No. of Cycles)
Wire bond
lift-off
Power Cycling: Low-, Medium & High Power Modules
Solder
1,0E+08
1,0E+07
Traction Modules
1,0E+06
Standard Modules
1,0E+05
1,0E+04
10
100
Delta Tj in K
Temperaturverlauf PC
Chipsolde
r
System
solder
160
Tmax
140
N= c1(wp)c2
Temp
PLWK
T
 
w p    d p ;
120
100
C
PLWK
Wire bond
IGBT Module
80
da
C
 C1 * w p 2
dN
60
ton
40
Simulationsmode
ll
2016-08-28
toff
20
0
293
295
297
t [s]
Copyright © Infineon Technologies AG 2016. All rights reserved.
299
301
22
Simulation of stress/strain in solder joint or
wire bond
Stress
Temperature

Viscoplastic strain
- Hysterese


wp
strain energy density
 
w p    d p ;
C

da
C
 C1 * w p 2
dN
 Strain energy density is calculated for solderjoint from simulation of PC
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
23
Usage of physics of failure simulation:
Influence of on time on reliability of chip solder joint
Variation of ton
in Power Cycling Test
(wton ) - c2

; c2  2.1
- c2
N cyc (tref ) (wref )
N cyc (ton )
 Simulation is used to investigate influencing parameter ton
 Exact prediction of crackpropagation not necessary
 Simulation results confirm empirical lifetime model for ton dependency
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
24
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
25
Use cases in a (x)eV
› The system [electrical motor] has to support all these use cases
Acceleration
cruising
hill hold / stall
condition
braking
2016-06-27
Copyright © Infineon Technologies AG 2016. All rights reserved.
26
Use-cases and mission profile equivalently
important for proper inverter designs
Use-cases describe
individual situations
Mission profile describe
the actual usage
2016-02-15
Copyright © Infineon Technologies AG 2016. All rights reserved.
27
Calculation of life time
from the given mission profile
Electrical characteristics
VCE sat, VF , Eon , Eoff , Erec
Motor + drive control
VDC, phase current, m, cos j, fs
Mission profile
Loss Calculation
Loss profile
Thermal simulation
Thermal Parameters
Zth jc, Zth CH , Zth H ambient , IGBT / diode
Cycle numbers with
different T
Cooling Conditions
Flowrate, Tcool
Life time modeling
Temperature Profile
Tj max IGBT / diode / solder
Climatic conditions
Calculation of
T occurrence
Tambient
2016-02-15
Copyright © Infineon Technologies AG 2016. All rights reserved.
Life time
Consumption
per year
28
Calculation of lifetime based on mission profile
Overview of calculation steps
Mission Profile
I_RMS
V_DC
F_S
P_Diode
COS_PHI
M
P_IGBT
Power loss model
Power loss profile
Thermal model
Temperature profile
T
Cycles @ T
T, Tjmax,ton counting
Lifetime model
Power cycling /
Thermal cycling
Lifetime
consumption
29
Copyright © Infineon 2016-06-27
Technologies AG 2016. All rights reserved.
Dr. Krzysztof Mainka
From Mission Profile to Power Loss Profile
 T  273 
Eon ( I , V , T )  Eon ( I nom , Vnom,150)  

 150  273 
 E ( I ,V , 25) 
ln  on nom nom

 Eon ( I nom,Vnom,150) 
 298
ln 

 423
 T  273 
Eoff ( I , V , T )  Eoff ( I nom, Vnom,150)  

 150  273 
 T  273 
Erec ( I , V , T )  Erec ( I nom, Vnom,150)  

 150  273 

 Eoff ( I nom,Vnom, 25) 
ln 

 Eoff ( I nom,Vnom,150) 
298


ln 

 423
 E ( I ,V , 25) 
ln  rec nom nom

 Erec ( I nom,Vnom,150) 
 298
ln 

 423
I
V

I nom Vnom

I
V

I nom Vnom
 I 

 
 I nom 
Switching Losses
0.5

V
Vnom
Conduction losses
Phase current, battery voltage, modulation
index cos(ϕ)), switching frequency
 Mission profile parameters and the
module’s characteristics are combined to
a power loss profile.
Power loss profile
 For a standard three phase inverter, well
known mathematical formulas are used
2016-06-27
Copyright © Infineon Technologies AG 2016. All rights reserved.
30
Temperature profile computation
RDs1
P_IGBT*xP
TEMP_SOLDER
+
V
RTs1
CDs1
P_Diode*xP
CTs1
IGBT Passive
IGBT
TEMP_T
IGBT Active
P_IGBT*xP
P_Diodepas*xP
+
RTp1
RT1
RT2
RT3
RT4
RT5
CT3
V
Power Module
CTp1
CT1
RDp1
RD1
CDp1
CD1
CT2
RD2
CT4
CT5
RD3
RD4
RD5
CD3
CD4
CD5
TEMP_D
+
V
Diode
P_IGBTpas*xP
Diode Passive
FEM Simulation for thermal model generation
CD2
P_Diode*xP
Diode Active
Thermal Model of Power module for IGBT / Diode
substrate solder considering cross coupling
 Thermal model for impedance and cross coupling of IGBT/diode
 Model for solder temperature approximating the step response
 Model for specific cooling system (e.g. heat transfer coefficient)
2016-06-27
Copyright © Infineon Technologies AG 2016. All rights reserved.
31
Temperature profile processing
Active and passive ΔT cycles
Cycles @ T
Passive ΔT are defined as the difference between the maximum
temperature reached during the active phase of the cycle and the
ambient temperature (cold start).
 Passive cycles take into account the maximum temperature swing.
 Considering passive cycles ensures that calculations are conservative.
 Separating active/passive cycles simplifies life time calculations.
32
Copyright © Infineon 2016-06-27
Technologies AG 2016. All rights reserved.
Dr. Krzysztof Mainka
Temperature profile processing
Edge-counting vs. Rainflow
›
The number, amplitude and resulting temperature of the ΔT are calculated from
the temperature profile
›
Different counting algorithms interpret the same temperature profile differently
T
T
T
T
ASTM E1049 or
AFNOR A03-406
Dr. Krzysztof Mainka
Copyright © Infineon Technologies 2011. All rights reserved.
Page 33
Comparison of counting method
Why Rainflow?
Calculation error %
K.Mainka, M. Thoben, O.Schilling: „Lifetime calculation for
power modules, application and theory of models and
counting methods“. EPE 2011
Dr. Krzysztof Mainka
Copyright © Infineon Technologies 2011. All rights reserved.
Page 34
Lifetime estimation
Equivalent stress
Active ∆T
N
N
f(∆T, Tj, ton)This function is failure
mechanism specific
N
Mission
Profile
Active ∆T
∆Tref
∆T
Neq
Passive ∆T
N
N
Passive ∆T
Equivalent
Stress
∆Tref
∆T
Optional
∆Tref
f(∆T, Tj, ton)
 Mission Profile can be summarized to single equivalent stress value
 life time consumption from active and from passive cycles
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
35
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
36
Influence of module stack on maximum temperature
during operation with same die size
 Increase of 40 to 50K for Power module without baseplate compared to
direct cooled Module
 Significant impact of power module stack on lifetime
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
37
Power losses and temperature for different
vehicle operations
Power losses and temperature
during recuperation with Power
module 200A /direct cooled
Power losses and temperature
during motorstart with Power
module 200A /direct cooled
 Increasing high losses on diode during recuperation (decreasing motor
speed)
 0.5s Boost operation with significant higher losses on the IGBT
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
38
Influence of chipsize and cooling method on
temperature
Required Operation Cycles and resulting temperature increase for
different chip size and cooling in Power module with Copper baseplate
Chipsize
cooling
direct
200A
indirect 200A
direct
400A
indirect 400A
required cycles
[Mio/lifetime]
boost
coldstart motorstart recuperation 1 recuper. 2
IGBTDiode IGBTDiode IGBTDiode IGBT Diode IGBT Diode
51
44 44
49 77
33
41
84
23
48
73
51 50
50 81
36
63
103
33
57
27
21 24
20 33
19
28
41
16
24
46
40 28
24 34
20
48
61
26
34
0.15 0.15
0.12 0.12
1.5
1.5
0.8
0.8
2.4
2.4
 Heat capacity of the baseplate is sufficient for 0.5s motorstart
 Direct cooling significantly reduces temperature ripple at recuperation
 400A Chipsize necessary for required cycles although Tjmax not reached
2016-02-15
Copyright © Infineon Technologies AG 2016. All rights reserved.
39
Application parameters influencing lifetime
regarding power cycling capability
 Small Changes in application parameters have high impact on lifetime

- 10% Rth improvement=+39% life time

-10% switching frequency =+17% life time
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
40
Cooling conditions:
Rth definition for lifetime calculation
Specification limit : 20% above initial Rth
Typical value before stress test
 Rth for lifetime estimation should consider typical value(before stress
test),

Power Cycling test under LV324 condition already includes Rth
degradation
set date
Copyright © Infineon Technologies AG 2013. All rights reserved.
41
Electrical Characteristics:
Power Losses
› Different definition for loss calculation are possible for Lifetime
Simulation:
– Switching losses: +10% to +20% Eon, Eoff, Erec from
datasheet.
– Conduction losses: Vcesat, Vf + 10% OR datasheet MAX
values
– Huge Impact on Lifetime:
typ Eon, Eoff, Erec, Vcesat, Vf
Lifetime
=> +10% Eon, Eoff, Erec, Vcesat, Vf
=> ≈ 50% Lifetime
 To prevent „overengineering“ loss data for Lifetime estimation should
focus on typical Values before stress test,

Value should address defined statistic range (e.g. 0.5*(MAX – TYP) +
TYP) (includes systematic&statistic distribution but no EOL and
measurement tolerance)
42
Electrical Characteristics: Same Rg and Vge
but different switching speed
Datasheet nomenclature Eoff from 10%Vce to 2%Ic
Driver A
Driver B
Identical power
module equal
operating conditions!
100%
 Just using the same Rg and Vge is by far not enough to achieve equal
switching performance! (losses may double with same Rg)
 Additional information is needed (e.g. dv/dt; di/dt) for correct loss data,
 measurement with final assembly/driver stage ensure precise loss data
43
Thermal cycling requirements for different
cooling loops for 15 years lifetime
N cyc: (TCASE )  C4  (
From reliability specification
TCASE -4.5
)
80K
T_solder_max [°C]
85
85
85
85
85
85
85
85
85
85
85
85
T_water_min = Tc_min [°C]
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
delta Tc [K]
110
105
100
95
90
85
80
75
70
65
60
55
150
300
300
600
750
900 1350 1500 1500 1500 1050 1050
Cycles per lifetime
equivalent number of
T=80K for acceleration
exponent :4,5
629 1020 819 1300 1274 1182 1350 1122
822
589
288
194 10590
A: coolant temperature is controlled to 70°C / temp. substrate solder: 85°C
T_solder_max [°C]
55
60
65
70
75
80
85
90
95
100
105
110
T_water_min = Tc_min [°C]
-25
-20
-15
-10
-5
0
5
10
15
20
25
30
delta Tc [K]
80
80
80
80
80
80
80
80
80
80
80
80
150
300
300
600
750
900 1350 1500 1500 1500 1050 1050
150
300
300
600
750
900 1350 1500 1500 1500 1050 1050 10950
Cycles per lifetime
equivalent number of
T=80K for acceleration
exponent :4,5
Required
Cycles
B: coolant temperature has constant swing compared to ambient /
temp. substrate solder: 55~110°C
 required test cycles for 15 years lifetime: 11000cycles, although solder
joint maximum temperatures differs
 System level information needed for precise lifetime simulation
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
44
Contents
1
Motivation
2
LV324 Power Module Qualification
3
Power modules wear-out mechanisms
4
Lifetime models and Reliability Specifications
5
Physics of failure simulation
6
Mission profile simulation
7
Effect of parameters on life time expectations
8
Summary
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
45
Power Module with high reliabilty
power cycling test showed a lifetime
consumption of less than 10%
 today’s available power module technology ensures reliable power
electronics over the vehicle lifetime when applying described methods
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
46
Summary
› In the presentation methods are presented to ensure and
determine lifetime based on mission profile
› A detailed knowledge of degradation mechanisms of today’s power
modules is available
› If the failure mode is changing, e.g. crack in wire bond moves to
crack in metallization layer, different solder materials or other
assembly technologies are applied, the lifetime model has to be
modified.
› Physics of failure Finite Element simulations can help to describe
and understand lifetime models
› It is necessary to understand the reliability requirements from the
applications in order to optimize the design of the module and all
system parameters.
› Today’s available power module technology ensures reliable power
electronics over the vehicle lifetime when applying described
methods
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
47
Time for Questions
Thank you for your
attention!
Are there any questions?
2016-08-28
Copyright © Infineon Technologies AG 2016. All rights reserved.
48
Literature
› [1] Thoben M., Mainka K., Bayerer R., Graf I., Münzer M.: From
vehicle drive cycle to reliability testing of Power Modules for
hybrid vehicle inverter. PCIM Europe 2008.
› [2] Mainka K., Thoben M., Schilling O.: Lifetime calculation for
power modules, application and theory of models and counting
methods. EPE 2011
› [3] Schilling O., Schäfer M., Mainka K., Thoben M., Sauerland F.
Power Cycling Testing and FE Modelling Focussed on Al Wire
Bond Fatigue in High Power IGBT Modules. ESREF 2012
› [4] AN2010-02 Use of Power Cycling Curves for IGBT4
› [5] M. Thoben, F. Sauerland, K. Mainka, S. Edenharter, L.
Beaurenaut: Lifetime Modeling and Simulation of Power Modules
for Hybrid Electrical / Electrical Vehicles. ESREF 2014
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