भारत सरकार
Government of India
अंत�रक �वभाग
Department of Space
अंत�रक उपयोग क��(इसरो)
आंबावाड� �वस्तार प.ओ.
अहमदाबाद – 380 015 (भारत)
दरू भाषः +91-79-2691 3051/98
फैक् नं. : +91-79-2691 5835/02/48
SPACE APPLICATIONS CENTRE (ISRO)
Ambawadi Vistar P.O.
Ahmedabad – 380 015 (INDIA)
Telephone : +91-79 – 2691 3051/98
Fax No. : +91-79 – 2691 5835 / 02 /48
Email: publictender@sac.isro.gov.in
ईओआई सूचना सं.: सैक/ईओआई /01/2015-16
EOI Notice No.: SAC/EOI/01/2015-16
िनयत ितिथ
सं�क् �ववरण
Brief Description
�व�ुत-�कािशक नीतभार� क� अिभकल्पन, �वकास एवं सं�वरचन
Design, Development and Fabrication of Electro-Optical Payloads
(अपरा� 3 बजे तक)
Due Date
(Up to 3 pm)
01-06-2015
अिभरुिच क� अिभव्य��हेतु आवेदनके िलए अनुरो
Expression of Interest (EOI)
�व�ुत-�कािशक नीतभार� क� अिभकल्पन, �वकास एवं सं�वरचन
Design, Development and Fabrication of Electro-Optical Payloads
अंत�रक्ष उपयोगक�(सैक), भारतीय अंत�रक्ष अनुसंधान संगठ(इसरो), भारत सरकार शांितपूण् र उ� ेश्य�के िलए अंत�रक्ष �वज्ञान एवं �ौ�ोिगक� के उपयोग हेतु नीतभार� के �वक
कायर् करता है। इस संबंध म, सैक �व�ुत �कािशक पेलोड के �वकास एवं आवश्यकता दस्तावे
म� उ�ल्ल�खत पर�क्षण -अप के िलए अिभरूिच क� अिभव्य��हेतु आवेद(ईओआई)
आमं��त करता है । ईओआई म� अिभकल्पन, �वकास, पर�क्षण एवं अंत�रक्ष गुणव�ा संब
दृ��कोण का उल्लेख �कया गया ह
Space Applications Centre (SAC), Indian Space Research Organization (ISRO), Govt.
of India is engaged in the development of payloads for utilization of Space Science and
Technology for peaceful purposes. In this context, SAC invites Expression of Interest
(EOI) for the development of Electro Optical Payloads and test set-ups mentioned in the
requirement document. EOI shall include approaches for design, development, testing
and space level Qualification.
ईओआई दस्तावेज �ारंिभक आवश्यकता, कायर् का क्, गुणव�ा एवं उ�रदाियतत्व उपलब्
कराता है , �जसे वेबसाइट www.isro.gov.in से एक्सेस �कया जा सकता है
EOI document provides the preliminary requirements, scope of work, quality and
responsibility, which may be accessed from website www.isro.gov.in
Expression of Interest (EOI)
for
Design, Development & Fabrication
of
Electro Optical Payloads
Space Applications Centre (SAC)
Indian Space Research Organization (ISRO)
Ahmedabad- 380015
India
Space Applications Centre, Ahmadabad
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Space Applications Centre, Ahmadabad
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Contents
1. INTRODUCTION ............................................................................................................ 4
2. SCOPE OF THE WORK .................................................................................................... 4
3. REFERENCE DOCUMENTS .............................................................................................. 7
4. VENDOR DETAILS .......................................................................................................... 8
NOTICE OF INTENT TO PARTICIPATE IN EOI ....................................................................... 9
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1. INTRODUCTION
Space Applications Centre (SAC-ISRO) is engaged in the development of a number of electrooptical remote sensing payloads for earth resources monitoring. SAC/ISRO, Govt. of India,
proposes to involve reputed Indian industry for development of electro optical Payloads and
test set-ups with Qualification models and flight model meeting quality requirements.
This Expression of Interest (EOI) document provides the preliminary information of the work
involved, mode of operation, responsibility etc.
2. SCOPE OF THE WORK
The work pertains to development of electro optical systems, where highest quality and
reliability is expected to be built into the system. Design, Fabrication, Testing and Assembly
is to be carried out according to ISRO Quality standards. Following figure shows a block
diagram of a payload. A typical EO payload consists of following subsystems.
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Subsystems of the Electro-Optical (E-O) Payload
1.
2.
3.
4.
Optics (mirror or lens based subsystem)
Detector head assembly
Payload electronics
Mechanical housings for all the above (Typically made of INVAR or CFRP or
equivalent material)
5. Integration
6. Test setups to test all the above at subsystem level as well as integrated level
SAC will supply necessary specifications for designing a subsystem, technical data and
instructions for design, development and testing at the appropriate time. Typically it will
include:
• Design specifications
• Preferred Parts List
• Interface details
• Test details
• Schedule of development
• Others information as mutually agreed upon
The nature of work will be typically (but not limited) to the following activities.
• Subsystem design as per specifications given by SAC
• Design of test setups for subsystem level as well as integrated level testing
• FMECA and stress analysis.
• Schematics and PCB designs
• Software / Firmware designs for VM, FM and test setups
• Mechanical housing designs
• Design Review and clearance by SAC
• Bare PCB Fabrication
• Procurement of components
• Fabrication details
• Card wiring
• Test plan document including interface stimuli
• Functional Testing
• Mechanical Packaging Assembly
• Test set up development
• Testing as per approved plan
• Result Review and clearance by SAC
• Documentation/Process Identification Document.
All the above designs should comply with ISRO quality standards. All the above designs are
to be functionally tested as per the approved Test plan / document. Vendor should have /
have access to well established fabrication and testing facilities. In some cases critical
component will be provided by SAC whereas in other cases vendor has to procure the
components. Detector mounting and integration with other subsystems will be carried out
in the SAC premises. Thermo Vacuum and Vibration facilities of SAC can be utilized by
Vendor in case vendor does not have these facilities. Vendor shall ensure to provide the
integration support at SAC.
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Details of payload subsystems to be developed by Vendor:
1. Optics:
Reflective / refractive optical system with mirrors / lenses will be developed as per the
specifications given by SAC with the required envelope. This may have single or multiple
bands depending on payload system specification. It should demonstrate ‘survivability’
under ‘environmental loads’ and also exhibit standard space design constraints like less
mass and volume, restricted outgassing properties of selected materials, selection of
material for design from declared material list etc.
2. Detector Head Assembly(DHA):
DHA consists of the Visible/Infrared Detectors and proximity electronics. Detector requires
low noise biases, clocks for its operation. IR Detectors use Active Coolers for its operation.
Vibration generated due to Active coolers needs to be minimized by proper mounting
scheme. Proper method to hold the detector has to be worked out without affecting its
performance. Heat generated by the coolers needs to be taken away efficiently by the
thermal design. Detector characterization is to be carried out by the vendor.
3. Payload Electronics (Proximity, Camera and Power Supply):
Payload Electronics for the payload mainly consists of the following:
•
Development of detector and its proximity electronics for generating very low noise
bias and driving clocks,
• Video processing electronics for signal conditioning and digitization of detector
output,
• Logic and control electronics for generating control logic for other subsystems
• Power supply electronics, for providing power to all other electronics.
For all the above mentioned activities, specifications and development guidelines will be
provided by SAC. As per these guidelines the all the subsystem will be realized.
4. Mechanical Structure and Thermal Control System:
Mechanical structure will provide rigid support for all of the above subsystems namely
Optics, DHA, Payload electronics. Thermal control system monitors and maintains the
temperature of critical parts/subsystems of the payload within the allowable temperature
specifications considering payload internal heat dissipation and orbital heat loads.
Thermal Control System is to be designed in such a way that the heat generated within the
payload is to be rejected to Space to lower the payload subsystem temperature and avoid or
minimize the external radiative Orbital heat loads which payload may receive while in the
orbit.
5. Payload integration and testing:
This activity involves the integration of all the subsystems that are tested and qualified at
subsystem level. Final integrated payload will also subjected to the activities like
qualification, calibration etc, before delivering for space craft integration.
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For testing of all above mentioned sub systems, test unit or test bench will have to be
developed that can test the optics, detector , electronics, simulate interfaces and evaluate
the performance of integrated payloads.
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3. REFERENCE DOCUMENTS
S. No
1
Standard
ISRO- PAX-300
2
ISRO- PAX-301 Issue-3
3
ISRO-PAX-304
4
ISRO-PAS-207
5
ISRO-PAS-100
6
ISRO-PAS-201
7
MIL-P-50884D
8
MIL-I-45208
9
MIL-STD-202
10
IPC-FC-231
11
IPC-FC-232
12
IPC-FC-233
13
IPC-FC-241
Description
Workmanship standards for the fabrication of
Electronics packages
Design Requirements for Printed Circuit Boards
layout
Test Specifications for Printed Circuit Boards
Storage, Handling and Transportation
requirements for Electronics Hardware
Non-Conformance Control Requirements for
ISRO projects
Failure Reporting, Analysis and Corrective Action
System
Printed wiring boards, Flexible or rigid-flex
general specification
Inspection system requirements
Test Methods for Electronic and Electrical
component parts
Flexible bare dielectric for use in flexible printed
wiring boards
Specification for adhesive coated dielectric films
for use as cover sheets for flexible printed wiring
Flexible adhesive bonding films
Metal clad flexible dielectric for use in fabrication
of flexible printed wiring
In addition to above documents, ISRO generates revisions and new guidelines time to time,
which will also be applicable. The documents will be available from SAC. Alert notes w.r.t.
quality will also be provided by SAC.
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4. VENDOR DETAILS
The prospective vendors should submit full details of their technical competence for
undertaking project of this nature, in the technical part of their proposal document. A
preferable format (not limited to) is provided in the following table.
S. No.
Description
Details
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Year Of Establishment
Vendor’s Area Of Core Competence / Activities
Infrastructure Details (Area, Facilities Etc.)
Annual Turnover in the last two financial years
Value of major orders currently being executed
Number of Technical Manpower with breakup of
Engineers, Technicians, Tradesman etc.
List of in house facilities (license details)
Any tie-ups with relevant / specialized companies
proposed for this activity and list of their facilities with
qualification Status. Concern from those companies.
Quality certification and Internal QC procedures
followed
Details of similar Electro-Optical hardware developed
for commercial/ space (ground/onboard).
Development and Testing of E-O H/W experience
commercial/ space (ground/onboard).
Details of test facility planned to be used
Delivery Plans and typical schedule
Export license requirements, if any
Willingness to provide Non-Disclosure Agreement
(NDA), Confidentiality Agreement, Intellectual
Property Rights (IPR) and Arbitration
Please provide complete information along with all relevant brochures, list of work carried out
so far and other relevant information for complete assessment of your offer
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NOTICE OF INTENT TO PARTICIPATE IN EOI
EOI Title: Design, Development, Fabrication and Testing of Electro optical Payload systems.
Vendors must compete and return this form to SAC/ISRO. The undersigned person has read
all EOI instructions and requirements and will submit a proposal in compliance with those
instructions. Return this form to the name and address listed in this document.
Company Name:
Name:
Title:
Address:
Telephone:
Fax:
Email:
Website:
Signature:
Date:
For any further information please contact
Sr. Purchase & Stores Officer,
Bldg. #30, Room #98,
Space Applications Centre (SAC), ISRO,
Ahmedabad-380015
Telephone: +91 079 26913098
Email: publictender@sac.isro.gov.in
Note: Response is to be provided as per line items in EOI.
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