EVG®501 Users Manual
Operator Manuals
--------------------------- Interlock List
Start Up
Recipe Programming
Process Description
Recorder Software
PM-Manual
-
Operation Manuals
1 of 164
Interlock List
Customer Support Documentation
EVG501
EV Group
E. Thallner GmbH
DI-Erich-Thallner-Straße 1
A-4782 St. Florian/Inn
2 of 164
Interlock List
Table of Contents
1
Safety Interlocks........................................................................ 3
1.1
System Layout .................................................................. 3
1.2
Description........................................................................ 4
1.2.1
1.2.2
1.2.3
1.2.4
2
2
Leak Sensors...........................................................................4
Water Flow Sensor ..................................................................5
Over Temperature Sensor.......................................................6
EMO Button .............................................................................8
Circuit Diagrams........................................................................ 9
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1
Safety Interlocks
1 Safety Interlocks
1.1 System Layout
2
3a
Figure 1 - System Layout – Top View
3b
4
1
Figure 2 - System Layout
1
Leak Sensors
2
Water Flow Sensor
3a
Over temperature Sensor in the electronic rack
3b
Over temperature Sensor in the bond chamber
4
EMO Button
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Interlock List
1.2 Description
1.2.1
Leak Sensors
In the system there are trays with liquid sensors (Bond Module).
Sensor:
Liquid level switch SK1-8-M12-P-nb-Ö-PTFE
Figure 3 - Leakage Sensor
Function:
If liquid reaches the sensor the machine shuts down.
Recovery Procedure:
It is necessary to fix the leak, restart the whole machine, do an
automatic clean up of the machine (if available) and start a new
process.
Location:
The figure below shows example locations of leak sensors:
Figure 4 - Leak Sensor
Note: Find detailed information about the location of Leak Sensors in
“Technical Documentation” / “Exploded Views”.
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1
Safety Interlocks
1.2.2
Water Flow Sensor
The water flow sensor checks the general water flow.
Sensor:
Flow Meter 100CT 24VDC
Figure 5 - Flow Meter 100CT 24VDC
Function:
If the water flow is to low the top and bottom heaters shuts down after
120 sec.
Recovery Procedure:
Check water flow and start a new process.
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Interlock List
1.2.3
Over Temperature Sensor
The over temperature sensor checks the temperature of the heaters.
1.2.3.1
Over Temperature Sensor in the Electronic Rack (3a)
Sensor:
Temperature limiter TB45
Function:
If the temperature is higher than 650°C the chamber will be disabled.
Recovery Procedure:
1)
Reset the temperature limiter TB45.
2)
Enable the chamber.
3)
Check the heating and start a new process
This failure occurs only when there is a problem with the hardware. In
this case call EV Group!
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1
Safety Interlocks
1.2.3.2
Over Temperature Sensor at the Bond Cover (3b)
Sensor:
MIC Microtherm Temperature Limiter R22A214 (marked with “a” in
picture below)
Function:
If the temperature is higher than 63°C the station will be disabled.
Recovery Procedure
Permit a cool down and check the cover cooling (cooling chuck marked
with “b” in picture above). Enable the station and start a new process.
Location:
b
a
Figure 6 –Bond cover
There is another over-temperature sensor (“Temperature switch E21
125°C nc”; marked with “c” in the picture below) on the bottom side of
the bond cover.
c
Figure 7 - Bottom side of the bond cover
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Interlock List
1.2.4
EMO Button
The Emergency Off – Button (EMO-Button) shuts down the machine
immediately.
Switch:
Emergency off switch CE4T-10R-02
Figure 8 - EMO Button
Function:
Only use the EMO in emergency situations. Emergency situations are
situations where injury of personnel or serious damages of the system
impends immediately.
Recovery Procedure
To operate the tool again you need to restart it.
Release the EMO button (turn clockwise), start up machine, perform an
automatic clean up and start a new process.
Note: Find detailed information about the location of EMO Button in “Technical
Documentation” / “Exploded Views”.
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Circuit Diagrams
2
2 Circuit Diagrams
The following figure shows an example electronic drawing of an
interlock connection:
Figure 9 - Electronic Drawing (EMO Robot, Safety Door Interlock)
Note: This is an example circuit diagram. Refer to “Technical Documentation” /
“Electronic Drawings” to find all circuit diagrams of the system.
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Interlock List
History
10
Date
Modification
by
2010-07-23
First written
WAA
Copyright © 2009 EVG
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Circuit Diagrams
2
EV Group Support:
Phone:
Fax:
E-Mail:
North America
+1 480 305 2400
+1 480 305 2401
TechSupportUS@EVGroup.com
Phone:
Fax:
E-Mail:
Japan
+81 45 348 1237
+81 45 348 0666
service@EVGroup.jp
Phone:
Fax:
Korea
+82 (2) 3218 4400
+82 (2) 3218 4401
Phone:
Fax:
E-Mail:
All other locations
+43 7712 5311 3000
+43 7712 5311 3500
TechSupportSD@EVGroup.com
State:
Released
Author:
WAA
File:
EVG501_InterlockList_OO_eng_01.doc
Created on:
2009-11-10
Printed on:
2010-07-23
Version:
1.0
Last revision
2010-07-23
Purpose:
Operation
Language:
EN
Copyright © 2009 EVG
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Start Up and GUI
Customer Support Documentation
EVG501
EV Group
E. Thallner GmbH
DI-Erich-Thallner-Straße 1
A-4782 St. Florian/Inn
13 of 164
Start Up and GUI
Table of Contents
1
Note to the User......................................................................... 4
2
Safety ......................................................................................... 5
3
System Description................................................................... 6
3.1
Short Description .............................................................. 6
3.2
System Layout .................................................................. 7
3.3
Safety................................................................................ 8
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
4
System Startup ........................................................................ 13
5
EVG Explorer ........................................................................... 14
6
EVG Framework....................................................................... 15
6.1
Initialize........................................................................... 17
7
GUI............................................................................................ 19
7.1
Jobs ................................................................................ 22
7.1.1
7.1.2
8
Overview Stations..................................................................23
Overview Jobs .......................................................................24
Bond Module............................................................................ 26
8.1
Context Menu Bond Module ........................................... 28
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
2
Safety Interlocks ......................................................................8
Emergency OFF Button (EMO Button)....................................8
Over Temperature Switch in the Bond Oven...........................9
Safety Switches in the Clamps of the Cover (if equipped) ......9
Open/Close Chamber............................................................10
Tooling...................................................................................11
Heater....................................................................................28
Flags......................................................................................30
Piston.....................................................................................31
Recorder................................................................................32
Vacuum System ....................................................................32
Start Process .........................................................................33
Disable...................................................................................33
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Note to the User
9
1
Vacuum System .......................................................................34
10 Jobs ..........................................................................................35
10.1 Add Job ........................................................................... 35
10.2 Delete Job ....................................................................... 37
11 Recipes.....................................................................................39
12 Low IO.......................................................................................40
13 Analysis....................................................................................41
13.1 Logfile Details.................................................................. 42
14 Alarms ......................................................................................43
15 Recovery from Errors..............................................................44
16 Handling Tool for Emergency Situations & Unloading after
Bonding ..........................................................................................45
17 Step by Step Process Guide ...................................................46
18 Shut Down ................................................................................49
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Start Up and GUI
1 Note to the User
!
!
CAUTION
HAZARDOUS AREA
To be opened by trained and
authorized personnel only
10023467
Installation, adjustment, programming and maintenance (except
periodical maintenance described in the manual) may only be done by
qualified EVG service engineers.
For further deliveries please check immediately after unpacking that the
consignment confirms to the information given on the packing list.
Read and understand the operating instructions before you operate the
unit and follow them in all respects.
The equipment may only be operated by personal trained from EVG
service engineers.
No liability will be accepted for personal injury nor material damages in
the event that damage or breakdowns occur as a result of failure to
comply with these operating instructions; neither will any guarantees
relating to repairs to or replacements of our products apply.
Any part of this print is not allowed to be reproduced in any form without
permission of EVG
This print is a subject to change without notice.
COPYRIGHT © 2010 EVG
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Safety
2
2 Safety
•
The equipment represents state-of-the-art technology and optimum
operationally reliable. The user may however be exposed to hazards
if it is used improperly or for other than its intended purpose!
•
If the equipment is used for any other than its intended purpose, all
liability and warranty claims will lapse!
•
All unauthorized modifications and alterations affecting the safety
are prohibited!
•
The use of self-made tools is not allowed in any case.
•
Any use by unauthorized personnel or careless handling may
increase the potential danger.
•
If the media support specified from EVG is not fulfilled, the
operational function of the equipment is not guaranteed.
•
Always wear gloves during operating with the system.
•
•
Avoid any contact with any liquid used in the system
Wear Safetyglasses.
!! ATTENTION !!
Do not remove or change any safety facilities from the system.
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Start Up and GUI
3 System Description
Before working with the EVG System read and understand the General Safety
Instructions.
Following Manual is written for Operator Login Level.
3.1
Short Description
„Wafer-to-wafer“ and „chip-to-wafer“ (or “die to wafer”) are key enabling
processes for manufacturing of various devices ranging from MicroElectro- Mechanical Systems (MEMS) to advanced chips based on 3D
integration and advanced wafer-level packaging.
EVG®500 and Gemini® equipment series are designed to enable the
use of various wafer bonding processes based on different principles
and using a large variety of substrates and bonding layers (figure 1).
Figure 1 - Wafer bonding processes classification with examples of substrates types
The equipment described in this document is designed as a universal
tool allowing easy use and operator-friendly operation.
6
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System Description
3
3.2 System Layout
1
2
3
4
Figure 2 - System Layout
1
PC Monitor
2
Bond Module
3
Emergency OFF Button
4
ON/OFF Switch
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Start Up and GUI
3.3 Safety
3.3.1
Safety Interlocks
Refer to “Interlock List” for a detailed description about the location and
functionality of all safety interlocks on the system.
3.3.2
Emergency OFF Button (EMO Button)
The Emergency OFF Button (EMO button) shuts down the system
immediately. To operate the tool again it has to be restarted (see
chapter “System Startup”).
Only use the EMO in emergency situations. Emergency situations are
situations where injury of personnel or serious damages of the system
impends immediately.
Location:
Figure 3 - EMO Button
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System Description
3.3.3
3
Over Temperature Switch in the Bond Oven
When the temperature of the heating cartridge ground plate gets over
80°C, the over temperature switch releases the heaters switch
(controlled by EVG Bond Software) and the heaters are shut off
immediately.
1
2
Figure 4 - Over Temperature Switch
1
Over temperature Switch
2
Heating Cartridge
If you want to start heating again, you have to switch on the heater
switch (controlled by EVG Bond Software) and restart your process.
3.3.4
Safety Switches in the Clamps of the Cover (if
equipped)
If the 4 clamps are not closed properly the safety circuit, which contains
of the 4 switches is not closed and the cover moves up automatically.
Figure 5 - Safety Switches
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Start Up and GUI
3.3.5
Open/Close Chamber
Open/Close the cover of the bond chamber by opening the four screw
caps (1).
11
Figure 6 - Open/Close Cover Buttons
10
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System Description
3.3.6
3
Tooling
Please make sure that the bondchuck fits to the pressure disk which is
installed in the bonding system. Mismatch may damage the toolset.
3.3.6.1
Bondchuck 3”/6”
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Start Up and GUI
3.3.6.2
12
Bondchuck 4”/6”
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System Startup
4
4 System Startup
Figure 7 - Main Switch
1
2
1)
Turn the main switch (1) fully clockwise.
2)
On the right hand side of the main switch there is the power
ON/OFF button. Press the green button (2) to turn the system on.
3)
Check if all circuit breakers are on:
It is not necessary to switch on the PC separately. After the PC has
booted the EVG5xx software will be started automatically.
As soon as the EVG Explorer appears the boot sequence is finished.
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Start Up and GUI
5 EVG Explorer
1
Figure 8 - EVG Explorer
Move the trackball (see “1” below) to the EVG system software icon and
double click the left trackball button (see “2” below) to start the software.
1
2
3
Figure 9 - Keyboard Layout with Trackball
14
1
Trackball
2
Left Trackball button
3
Right Trackball button
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EVG Framework
6
6 EVG Framework
1)
Wait while the EVG Framework is loading:
Figure 10 - EVG Framework loading
2)
Enter the user name and password in the login window and click
on the button “Login”:
Figure 11 - EVG Framework Login
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Start Up and GUI
3)
After a successful login, the “Overview Stations” of the window
“Jobs” will be displayed:
Figure 12 - Jobs - Overview Stations
16
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EVG Framework
6
6.1 Initialize
Click on the following button in the bottom navigation bar:
The following window (System – Overview) will be opened:
Figure 13 - System - Overview
In the “System”-frame there is an area displaying the current
“Equipment Processing State”:
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Start Up and GUI
Click on the following button to initialize the system:
While the system initializes the “Equipment Processing State” is
“Initializing”.
As soon as the state is “Idle” the initializing process is finished and the
EVG Framework can be used to operate the system:
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GUI
7
7 GUI
The basic layout of every window in the EVG Framework can be divided
into the following three parts:
1
2
3
Figure 14 - Basic Layout
1
Status information
2
Content of the current window (e.g. “Jobs”)
3
Navigation bar
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Start Up and GUI
Status Information
The status information is located on the top of the screen. It is always
visible while working with the EVG Framework and it is used to find all
important status information about the system while operating it.
1
2
3
4
5
6
7
Figure 15 - Status Information
1
2
Current system date and time.
3
Displays the “current view” (which window and submenu is
currently opened).
E.g. “Current View: Jobs: Overview Stations”
4
Displays the current status of the system (e.g. “System
Initialized.” or “Recipe … loaded”).
5
Log out button (displays the name of the user currently logged
in).
6
Current system status (e.g. “OK”). If the status is not “OK” it
can be checked in the alarm window.
By clicking on this icon the alarms window will be opened
directly.
7
20
SECS-GEM status icon: click here to open the SECS-GEM
communication window.
The light tower icon represents the light tower on the system
indicating the current status of the system (e.g. error).
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GUI
7
Navigation Bar
The navigation bar is located on the bottom of the screen. It is always
visible while working with the EVG Framework and can be used to
toggle between the main windows.
Figure 16 - Navigation Bar
Menu item:
Description:
Jobs: provides an overview and settings of all stations, jobs and
materials
System: general system and module settings (e.g. Low I/O or
robot handling system settings)
Recipes: allows the user to create and edit existing recipes
Analysis: displays a list of the system log information (e.g.
debug, warning or error messages)
Setup: important system settings can be adjusted (e.g. “Light
Tower Settings” or settings of the robot handling system)
Alarm: can be used to find a list of all events, alarm conditions
and error conditions
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Start Up and GUI
7.1 Jobs
Click on the button “Jobs” in the bottom navigation bar to open the
“Jobs”-window:
The “Jobs”-window looks like this:
1
2
3
Figure 17 - Jobs - Overview Stations
22
1
Submenu items
2
Process Functions
3
Overview Stations
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GUI
7.1.1
7
Overview Stations
Figure 18 - Overview Stations
7.1.1.1
1
Bond Module
2
Vacuum System
Bond Module
Refer to chapter “Bond Module” for detailed information.
7.1.1.2
Vacuum System
Refer to chapter “Bond Module” for detailed information.
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Start Up and GUI
7.1.2
Overview Jobs
Figure 19 - Overview Jobs
7.1.2.1
Add Job
Create a new job (see chapter “Jobs” for further information).
24
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GUI
7.1.2.2
7
Delete
Select a job by clicking on it:
Click on the button “Delete”
Confirm the following window by clicking on “Yes”:
Figure 20 - Delete Job
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Start Up and GUI
8 Bond Module
Open the “Jobs” window and click on “Overview Stations” to find the
bond module:
1
2
3
26
1
Bond Module (opens context menu on click)
2
Parameter (status information)
3
Process Information
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Bond Module
8
Parameter
Displays the current status of the system (Temperature, Force…).
Process Information
The process information displays current status information (only active
when process is running)
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Start Up and GUI
8.1 Context Menu Bond Module
Click on the bond module icon to open the context menu:
Note: Available context menu items may vary depending on system
configuration!
8.1.1
8.1.1.1
Heater
Set Temperature
1)
Choose “Top”, “Bottom” or “Both” heaters.
2)
Enter the set point in °C.
3)
Click on
to confirm.
Figure 21 - Set Temperature
28
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Bond Module
8.1.1.2
8
Cooling
1)
Select if cooling should be done on “Top”, “Bottom” or “Both”.
2)
Select if the cooling should be switched “ON” or “OFF”.
3)
Click on
to confirm.
Figure 22 - Cooling
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Start Up and GUI
8.1.2
8.1.2.1
Flags
Flags Out
1)
Select the flags that should be moved.
2)
Select if the flags should be moved “OUT” or “IN”.
3)
Click on
to confirm.
Figure 23 - Select Flags
30
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Bond Module
8.1.3
8.1.3.1
8
Piston
Piston Down
1)
Enter the set point for the piston down force in N (see restrictions).
2)
Click on
to confirm.
Figure 24 - Piston Down
8.1.3.2
Piston Up
Piston will be moved up (no window will be opened).
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Start Up and GUI
8.1.4
8.1.4.1
Recorder
Start Recorder
Starts the Recorder.
8.1.4.2
Open Recorder
This menu item will be available after the recorder has been started by
clicking on “Start Recorder”. Click on it to open the recorder software.
8.1.5
8.1.5.1
Vacuum System
Evacuate
1)
Select the mode (“Evacuate Off” or “Evacuate Low”).
2)
Click on
to confirm.
Figure 25 - Evacuate
32
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Bond Module
8.1.5.2
8
Purge
1)
Select the mode (“Purge Off” or “Vent”).
2)
Click on
to confirm.
Figure 26 - Purge
8.1.6
Start Process
Click here to start a process on the bond module.
8.1.7
Disable
Click here to enable or disable the bond module.
Enabled:
Disabled:
Figure 27 - Bond Chamber Enabled/Disabled
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Start Up and GUI
9 Vacuum System
Refer to “Technical Documentation” => “Vacuum Equipment” for details
about the vacuum system.
Open the “Jobs”-window and go to “Overview Stations” to find the
vacuum system overview:
1
2
3
Figure 28 - Vacuum System
34
1
Vent Valve
2
Chamber Valve
3
Roughing Pump
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Jobs
10
10 Jobs
10.1
Add Job
1)
Click on the following button in the bottom navigation bar to open
the “Jobs“-window:
2)
Click on the following button to add a job:
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Start Up and GUI
36
3)
The window “Add Job” will be opened:
4)
Select a recipe:
5)
Enter the carrier ID in “Top Substrate” and “Bottom Substrate”:
6)
After finishing adjusting the settings, click on
to confirm.
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Jobs
10.2
10
Delete Job
1)
Click on “Overview Jobs” to find the list of the jobs:
2)
In the list, select the jobs that should be deleted:
3)
Click on
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Start Up and GUI
4)
38
In the following window, click on “Yes” to confirm:
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Recipes
11
11 Recipes
Click on the following button in the bottom navigation bar to open the
recipe window:
The recipe window will be opened:
Figure 29 - Recipe Window
Note: Refer to “Recipe Programming” manual for information on how to create
and edit recipes (engineer only).
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Start Up and GUI
12 Low IO
Click on the following button to go open the “System”-window to find
“Low I/O” and “Module I/O” (engineer only):
40
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Analysis
13
13 Analysis
Click on the button “Analysis” in the bottom navigation bar:
The “Analysis”-window will be opened:
Figure 30 - Analysis
The following information will be displayed in the “Analysis”-window:
Column:
Description:
Examples:
Timestamp
Time format:
[hour]:[minute]:[second].[millisecond]
10:42:19.836
LogLevel
Type of logfile message (see below)
“Info”, “Error” or “Warning”
Module
Module name
“CIMFramework.
EquipmentControlService”
Message
Logfile message
“Could not set process state.”
Threshold
“1364”
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Start Up and GUI
13.1
Logfile Details
Double-click on a logfile message to open the window “Logfile Details”:
Figure 31 - Logfile Details
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Alarms
14
14 Alarms
The “Alarms”-window can be opened by clicking on the button “Alarms”
(1) in the bottom navigation bar or by clicking on the status information
icon (2) displaying the status (e.g. “OK”):
The “Alarms”-window will be opened:
Figure 32 - Alarms
Timestamp
Time format: [hour]:[minute]:[second].[millisecond]
Type
Type of the event (e.g. “Information”).
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Start Up and GUI
15 Recovery from Errors
Most errors that will occur require going into an engineering or
maintenance level screen to execute certain functions to recover the
tools and the system.
Things that the operator can do in case of an error:
44
1)
Press the Emergency Stop button only if the probability of damage
or Injury may occur.
2)
Call a trained maintenance person to perform what is needed to
recover.
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Handling Tool for Emergency Situations & Unloading after Bonding
16
16 Handling Tool for Emergency Situations
& Unloading after Bonding
If for any reason any bond tools have to be handled after a recovery please use
the bond tool-handling device, heat resistant gloves and protective eye wear to
avoid any potential injury from a hot bond tool.
Figure 33 - Handling Tool
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Start Up and GUI
17 Step by Step Process Guide
1)
Load the wafers on the bond tool.
2)
Open the cover of the bond chamber by using the four screw caps.
Figure 34 - Open Cover
46
3)
Put the bond tool in the chamber.
4)
Take the bond chuck top, where the already aligned wafer stack is
clamped, with the handling tool and bring into the Chamber.
The 2 positioning pins must fit into the holes of the bond chuck top
(for 6 inch Chambers).
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Step by Step Process Guide
17
For 6” and 8” Bondchucks:
Use the two position pins to load the bond chuck correct into the
EVG5xx.
Only for 6” Bondchucks:
Use the two position pins to load the bond chuck correct into the
EVG5xx.
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48
5)
Close the cover of the bond chamber and fix all four screw caps:
6)
Click on “Add Job” and choose a recipe. After confirming the
process will be started immediately.
7)
Now the defined bond process will be started.
8)
When the defined bond process is finished, the chamber can be
opened by unscrewing all four screw caps and the bond tool can
be taken out.
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Shut Down
18
18 Shut Down
1)
After finishing all running processes click on the button “Shutdown”
in the “System”-window:
2)
Wait until the “Equipment Processing State” is “NotInitialized”:
3)
Click on “Close Application”:
4)
In the following window click on “Yes” to close the EVG
Framework:
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5)
In the EVG Explorer click on the shut down button
(see below):
6)
In the shut down window select “Shut down” (default) and click on
“OK” to shut down the operating system:
7)
Wait until the screen “It is now safe to turn off your computer”
shows up and then turn off the system by turning the main switch
(1) fully counter-clockwise.
1
Figure 35 - Main Switch
50
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Shut Down
18
History
Date
Modification
by
2010-07-20
First written with OC
WAA
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Start Up and GUI
EV Group Support:
52
Phone:
Fax:
E-Mail:
North America
+1 480 305 2400
+1 480 305 2401
TechSupportUS@EVGroup.com
Phone:
Fax:
E-Mail:
Japan
+81 45 348 1237
+81 45 348 0666
service@EVGroup.jp
Phone:
Fax:
Korea
+82 (2) 3218 4400
+82 (2) 3218 4401
Phone:
Fax:
E-Mail:
All other locations
+43 7712 5311 3000
+43 7712 5311 3500
TechSupportSD@EVGroup.com
State:
Released
Author:
WAA
File:
EVG501_StartUp_GN_eng_01.doc
Created on:
2010-03-18
Printed on:
2010-07-20
Version:
1.0
Last revision
2010-07-20
Purpose:
Operation
Language:
EN
Copyright © 2010 EVG
64 of 164
Recipe Programming
Customer Support Documentation
EVG501
Development Engineer
EV Group
E. Thallner GmbH
DI-Erich-Thallner-Straße 1
A-4782 St. Florian/Inn
65 of 164
Recipe Programming
Table of Contents
1
Overview .................................................................................... 3
2
RNS Management...................................................................... 4
3
Recipes....................................................................................... 6
3.1
Create New Recipe........................................................... 6
3.2
Edit Recipe ....................................................................... 8
3.2.1
Master Recipe .........................................................................8
3.2.1.1
3.2.1.2
3.2.1.3
3.2.2
2
Module Recipe.......................................................................10
3.3
Open Recipe................................................................... 11
3.4
3.5
Save Recipe ................................................................... 12
Delete Recipe ................................................................. 13
3.3.1
3.3.2
4
Create Recipe Step.................................................................... 8
Link Recipe Steps ...................................................................... 9
Unlink Recipe Steps................................................................... 9
Open Latest ...........................................................................12
Open Specific ........................................................................12
Recipe Steps Overview ........................................................... 14
4.1
Master Recipe................................................................. 14
4.2
Module Recipe................................................................ 14
4.2.1
Heater....................................................................................15
4.2.2
Misc .......................................................................................17
4.2.3
Piston.....................................................................................18
4.2.4
Vacuum System ....................................................................19
4.2.5
Control ...................................................................................21
4.2.1.1
4.2.1.2
4.2.1.3
4.2.1.4
Set Temperature ...................................................................... 15
Cooling ..................................................................................... 15
Wait Temperature .................................................................... 16
Preheat..................................................................................... 17
4.2.2.1
Flags......................................................................................... 17
4.2.3.1
4.2.3.2
4.2.3.3
Piston Down ............................................................................. 18
Piston Up.................................................................................. 18
Wait Force ................................................................................ 19
4.2.4.1
4.2.4.2
4.2.4.3
Evacuate .................................................................................. 19
Purge........................................................................................ 20
Wait Pressure........................................................................... 21
4.2.5.1
Timer ........................................................................................ 21
5
Alarms ...................................................................................... 22
6
Permissions ............................................................................. 23
6.1
Engineer Level................................................................ 23
6.2
Operator Level ................................................................ 23
7
Set-up Procedures .................................................................. 24
7.1
Adjustment of the wafer stack-thickness for Wafer Bow . 24
7.2
Before Adjusting the Wafer Bow (Hydraulic System only)25
7.3
Location and Description of Dial Indicator....................... 26
7.4
Example for wafer stack thickness.................................. 28
7.5
Sequence during process ............................................... 28
7.6
Spring ratings.................................................................. 28
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Overview
1
1 Overview
Click on the following button in the bottom navigation bar to open the
recipe window:
The recipe window will be opened:
1
2
Figure 1 - Recipe Window
1
Recipe Toolbar
2
Recently Opened
Recipe Toolbar
This toolbar can be used to create, open, save or delete recipes.
Recently Opened
Use this menu to open one of the recently opened recipes.
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Recipe Programming
2 RNS Management
The „RNS Management“-window is used to perform the following
actions for „Recipe Namespaces“:
•
•
•
Create
Rename
Delete
Click on the following button in the bottom navigation bar to open the
system window:
Click on “RNS Management”:
The “RNS Management”-window will be opened:
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RNS Management
2
Enter the root location for the recipe namespace here:
Use the following area to create, rename and delete namespaces:
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Recipe Programming
3 Recipes
3.1 Create New Recipe
1)
Click on the button
opened:
. The following window will be
Figure 2 - Create New Recipe
2)
6
Select the namespace of the recipe:
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Recipes
3)
Enter the name of the recipe:
4)
Enter a comment:
5)
Click on
3
to confirm. A new blank recipe will be created:
Figure 3 - Blank Master Recipe
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Recipe Programming
3.2 Edit Recipe
3.2.1
Master Recipe
Click on
to edit a recipe. The recipe editor will be opened:
Figure 4 - Edit Master Recipe
3.2.1.1
Create Recipe Step
Use the mouse cursor to drag and drop both steps “LoadBondchuck”
and “BondSubstrates” onto the blank area:
Figure 5 - Create Master Recipe Steps
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Recipes
3.2.1.2
3
Link Recipe Steps
Drag and drop from the connecting point of one recipe step to the
connecting point of another recipe step to create the following link:
Drag and drop:
Linked recipe steps:
Figure 6 - Linking Recipe Steps
3.2.1.3
Unlink Recipe Steps
Right-click on the link between the recipe steps and click on “Unlink” to
remove the link:
Figure 7 - Unlinking Recipe Steps
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Recipe Programming
3.2.2
Module Recipe
1)
Click on the button
on the “BondSubstrates” recipe step:
Figure 8 - Edit "BondSubtrates" Step
2)
The following window will be opened:
Figure 9 - Module Recipe Editor
10
3)
To create a new recipe step, drag and drop it to a blank line:
4)
When the recipe step is selected, the settings can be adjusted in
the right window:
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Recipes
3
3.3 Open Recipe
5)
Click on the button
opened:
. The following window will be
Figure 10 - Select Namespace
6)
Select the namespace and the name of the recipe:
Figure 11 - Select Recipe
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Recipe Programming
3.3.1
Open Latest
After selecting a recipe, click on
the recipe.
3.3.2
to open the latest version of
Open Specific
After selecting a recipe, click on
currently selected recipe:
to display all versions of the
Select the version that should be opened and click on
.
3.4 Save Recipe
The button
can be used to save changes made to a recipe (a
new version will be added to the current recipe file).
To save the current recipe as a new recipe file, click on
12
.
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Recipes
3
3.5 Delete Recipe
Click on
to delete the recipe that is currently opened. The
following dialog box will appear prompting to confirm deleting the
recipe:
Figure 12 - Delete Recipe
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Recipe Programming
4 Recipe Steps Overview
4.1 Master Recipe
Recipe Step
Description
“LoadBondchuck” is used to initialize before
starting the module recipe of the bond process.
“BondSubstrates” contains the module recipe
steps.
4.2 Module Recipe
Category
Recipe Step
Description
Choose Top, Bottom or both
heaters as well as the temperature
set point and heat up slew rate.
Switch top or bottom cooling ON or
OFF.
System waits until specified
temperature is reached.
Needs to be used as first recipe
step. Set pre conditioned
temperature and tolerance range.
Temperature will be kept at the
level after process is finished.
Move certain flags IN or OUT.
Set setpoint for piston down force.
Move piston up.
If force gradient is chosen, check
for the target force to be reached.
Select mode for Evacuate.
Select mode for Purge.
The system waits until the
specified vacuum is reached.
The system keeps the adjusted
conditions until the timer elapsed.
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Recipe Steps Overview
4.2.1
4.2.1.1
4
Heater
Set Temperature
Value
Description
Gradient
Enter Heat up Ramp in °C/min.
Heater Target
Enter the Heater Target (top, bottom, both).
Setpoint
Enter the Setpoint in °C.
Heats the top- or the bottom side heater or both together to a specified
level.
The Heat-up Ramp defines the speed how fast the heaters should ramp
up to the temperature. If the check box for maximum is activated, the
system heats up as fast as possible until the specified temperature is
reached.
For defining different heat up procedures for the two heaters, the
Heating command has to be inserted 2 times to adjust top- and bottom
temperature independently.
4.2.1.2
Cooling
Value
Description
Gradient
Enter Cooling Ramp in °C/min.
Heater Target
Enter the Heater Target (top, bottom, both).
Setpoint
Enter the Setpoint in °C.
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Recipe Programming
Cools the top- or the bottom side heater or both together to a specified
level.
The Cool-down Ramp defines the speed how fast the heaters should
cool down. If the check box for maximum is activated, the system cools
down as fast as possible until the specified temperature is reached.
For defining different cool down procedures for the two heaters, the
Cooling command has to be inserted 2 times to adjust the top- and
bottom temperature independently.
4.2.1.3
Wait Temperature
Value
Description
Heater
Select the Heater Target (top, bottom, both).
Mode
Select “higher” or “lower”.
Target
Temperature
Enter the target temperature in °C.
Timeout
Enter a timeout value in hours, minutes and seconds.
It defines the maximum allowed wait time until the
system stops the process and comes up with a
timeout error message.
The system waits until the specified temperature is reached on one or
on both heaters.
According to the process command before, the system will heat or cool
and therefore the temperature will pass the defined temperature
upwards (higher than) or downwards (lower than).
The Timeout defines the maximum allowed wait time until the system
stops the process and comes up with a timeout error message.
It is recommended to use the Timeout feature only in well known and
often used processes. The command is not useful for R&D processes
as long as parameters are changed often. The risk that the system
stops the process because of a wrong Timeout is high.
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Recipe Steps Overview
4.2.1.4
4
Preheat
Value
Description
Setpoint
Bottom
Enter the bottom heater target in °C.
Setpoint Top
Enter the top heater target in °C.
Tolerance
Bottom
Tolerance Top
The defined temperature for the bottom- and topside heater (Setpoint)
is valid when no process is running.
In other words, as soon as a process has ended, the temperature on
the top and the bottom side heater will go back to the values defined in
this command.
The actual value of the temperature can vary in the range defined in the
field Tolerance. If the temperature is above or below the defined range,
no further process will start, and no chuck can be loaded to the
chamber (for EVG540, EVG560 and GEMINI systems) until the
temperatures of the heaters have reached the specified range.
4.2.2
4.2.2.1
Misc
Flags
Pulls the wafer separation flags.
The command allows defining either to pull out all 3 spacers at once or
to pull the spacer one by one.
For pulling the spacer individually the proper check box has to be
activated and the command has to be inserted 3 times in the recipe.
Each time with a different check box activated.
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Recipe Programming
4.2.3
4.2.3.1
Piston
Piston Down
Moves the piston of the bonder. The topside heater comes in contact
with the substrate. The force, which is used to press the topside heater
down, has to be defined in this command.
Warning: Piston Down: The value for the Newton indication is limited:
Pneumatic Bonders: minimal force: 100N
Hydraulic Bonders: minimal force: 500N.
Functions:
If “Setpoint” in “Piston Mode” is chosen:
Enter a Force-Setpoint – the Piston goes down with the entered force.
“Check Tolerance” is only available if “Setpoint” is chosen. If “Check
Tolerance” is selected it is possible to use the function “Timeout”.
Moreover it is possible to choose “Auto Abort” if “Timeout” is selected
too.
If “ForceRamp” (if available) in “Piston Mode” is chosen:
It is possible to enter start-/stop-force and the “Slewrate” (negative for
fallen force-ramp). If the stop-force is reached the ramp will be stopped
– the force is still the same as the stop-force. “Piston Up” or a fallen
piston-ramp is able to change this.
4.2.3.2
Piston Up
The “Piston Up” recipe step has no parameters:
Drives the piston back in the start position (separated from the
substrate).
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Recipe Steps Overview
4.2.3.3
4
Wait Force
Value
Description
Heater
Select the Heater Target (top, bottom, both).
Mode
Select “higher” or “lower”.
Target Force
Enter the target force in N.
Timeout
Enter a timeout value in hours, minutes and seconds.
It defines the maximum allowed wait time until the
system stops the process and comes up with a
timeout error message.
If a force gradient is chosen, it will check that the target force will be
reached.
4.2.4
4.2.4.1
Vacuum System
Evacuate
Value
Description
Mode
Enter the “Evacuate Mode”.
Setpoint
Starts (Evacuate Low or Evacuate High) and stops (Evacuate Off) the
evacuation of the bond chamber. Evacuate Off closes the valves only.
Remaining gas is kept inside but the chamber will not be vented or
purged using any other connected gas. In other words: The atmosphere
in the bond chamber is trapped as soon as the command Evacuate Off
comes.
Evacuate Low evacuates the chamber but only with the roughing pump
and without switching to the Turbo Molecular Pump. The final vacuum
in the chamber is in the range of 1-5mbar (100Pa – 500Pa) dependent
on the type of roughing pump.
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Recipe Programming
Evacuate Controlled allows to define a setpoint for the pressure in the
chamber. The controllable range is between 1 to 1000mbar (0,1 –
100kPa) abs. (if system is equipped with a vacuum-controller).
Evacuate High evacuated the chamber with the roughing pump and
switches to the Turbo Molecular Pump later on.
Every Evacuate is valid until another command overwrites it.
Commands like Purge, Pump and Purge or Evacuate Off (as an option
of this command) will stop evacuation.
If no such command is entered in the recipe later on, the system keeps
pulling vacuum until the process ends. At this time the chamber will be
vented automatically.
4.2.4.2
Purge
Value
Description
Mode
Enter the “Purge Mode”.
Setpoint
To fill the chamber after evacuation with different types of gases.
Purge 1 through Purge 4 are symbolising 4 independent purge gas
lines. Every line can be equipped with a type of process gas (e.g. N2,
forming gas, Ar,…).
Vent is for filling the chamber with air coming in from the clean room
environment.
This function is automatically activated before the chamber lid opens to
make sure that the pressure on the inside and outside of the chamber
are equal.
Purge Off closes all Purge valves and traps the already created
atmosphere in the chamber.
Furthermore the chamber can be filled until a certain level of pressure is
reached (refers to the command Wait Pressure)
If equipped: enter a setpoint in [ccm/min].
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Recipe Steps Overview
4.2.4.3
4
Wait Pressure
Value
Description
Mode
Select “higher” or “lower”.
Target
Pressure
Enter the target pressure (in mbar).
Timeout
Enter a timeout value in hours, minutes and seconds.
It defines the maximum allowed wait time until the
system stops the process and comes up with a
timeout error message.
The system waits until the specified vacuum is reached in the chamber.
According to the process command before, the system will check
evacuation (lower than) or purging (higher than).
It is recommended to use the Timeout feature only in well known and
often used processes. The command is not useable for R&D processes
as long as parameters are changed often. The risk that the system
stops the process because of a wrong Timeout is high otherwise.
4.2.5
4.2.5.1
Control
Timer
The system keeps the adjusted conditions until the time defined in this
command is elapsed. The Timer has to be specified in hours, minutes
and seconds.
Max. allowed wait time: 9hours 59min 59sec
For a longer wait time, multiple Timer can be inserted in the recipe.
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Recipe Programming
5 Alarms
The “Alarms”-window can be opened by clicking on the button “Alarms”
(1) in the bottom navigation bar or by clicking on the status information
icon (2) displaying the status (e.g. “OK”):
The “Alarms”-window will be opened:
Figure 13 - Alarms
22
Timestamp
Time format: [hour]:[minute]:[second].[millisecond]
Type
Type of the event (e.g. “Information”).
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Permissions
6
6 Permissions
6.1 Engineer Level
Engineer login level allows the user to perform the following actions in
the recipe window:
•
•
•
Create a new recipe file
Edit existing recipe files
Save recipe files
6.2 Operator Level
When logged in as an operator, it is not possible to open the recipe
window because the operator does not have permission to edit recipes.
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Recipe Programming
7 Set-up Procedures
The following section contains information about any set-up procedure
that is necessary to run a process on a selected product.
7.1 Adjustment of the wafer stack-thickness for
Wafer Bow
When activating wafer bow the bow cylinder lowers the piston including
pressure disk absorber plate with pressure disk down. It moves down
so that there is 2mm clearance between pressure disk and wafer stack
and the spring-loaded center pin makes contact to the wafer stack and
retracts 0.5mm (offset).
The spring coefficient of that spring is 5N/mm and it is preloaded with
5N.
The total bow-force applied to the wafer stack will be:
5N + 0.5mm * 5N/mm=7.5N
The stroke can be adjusted on the dial indicator mounted on top of the
pressure head and must be appropriate to the stack height. Otherwise
pressure disk moves down too far and flags won’t pull out or even the
wafer stack can be damaged.
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Set-up Procedures
7
7.2 Before Adjusting the Wafer Bow (Hydraulic
System only)
Note: The following steps only have to be done on hydraulic systems before
adjusting the wafer bow.
1)
Click on the chamber where the wafer bow has to be adjusted (1).
2)
Go to “Piston” (2) and click on “Adjust Waferbow” (3).
1
2
3
Figure 14 - Adjust Wafer Bow
The following message box will appear:
Figure 15 - Adjust Waferbow Message Box
3)
Follow the instructions in the message box and click on “OK” when
finished.
Note: Do not click on “OK” if the wafer bow screw is not adjusted correctly yet!
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Recipe Programming
7.3 Location and Description of Dial Indicator
The dial indicator is used to set the stack height:
Figure 16 – Location on the EVG5xx
Pneumatic System:
Hydraulic System:
1
1
2
1
3
1
4
26
1
Locking Hub
2
Adjustment wheel
3
Scale for fine adjustment
4
Scale for coarse adjustment
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Set-up Procedures
7
By setting the stack thickness the stroke of the bow piston is limited
according the stack thickness. The stack thickness must be set with the
adjustment wheel (see “2” above).
Warning: You must not adjust the stack-thickness below zero! An adjustment
below zero will cause damage to the bonder!
One turn of the wheel means a change of the stroke by 1 mm which is
indicated on the scale for coarse adjustment beside the wheel.
Using the scale for fine adjustment on the wheel itself allows us to
adjust for micrometers.
Figure 17 - Scale for fine adjustment set to zero
Attention: The wafer stack thickness must be the same on all bond-tools for
the chosen process program. If its not, you may not be able to pull the wafer
separation flags and this could damage your wafer stack!!!!!
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Recipe Programming
7.4 Example for wafer stack thickness
Use the following example for the adjustment of your stack:
Thickness of first wafer
Thickness of flags
Thickness of second wafer
480µ
50µ
480µ
Thickness of electrode (movable center disc)
1000µ
Total Stack Thickness:
2010µ
7.5 Sequence during process
When wafer bow is applied the pressure disk lowers until 3mm
clearance to wafer stack and center pin retracts 0.5mm. The force
applied to the center of the wafer stack will be 7.5N (5N pre-load +
0.5mm * 5N/mm).
Wafer flags are pulled out. Piston down is performed and pressure disk
lowers, the Wafer Bow pin moves 2mm to the inside and the force of
the center pin will increase by 10N (2mm * 5N/mm) to 17.5N on the
wafer. This is not a bow-force anymore because the flags at this point
are pulled and not separating the wafers any more and the entire
pressure disk will make contact to the wafer stack.
7.6 Spring ratings
In 8” systems the standard springs for wafer bow are rated at 5N per
mm.
There may be processes where other springs are necessary (thin wafer,
thick wafer, deep etched wafer, thick flags, etc.).
Please contact EV Group for your specific needs.
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7
Set-up Procedures
History
Date
Modification
by
2010-07-23
First written with OC
WAA
Copyright © 2010 EVG
29
93 of 164
Recipe Programming
EV Group Support:
30
Phone:
Fax:
E-Mail:
North America
+1 480 305 2400
+1 480 305 2401
TechSupportUS@EVGroup.com
Phone:
Fax:
E-Mail:
Japan
+81 45 348 1237
+81 45 348 0666
service@EVGroup.jp
Phone:
Fax:
Korea
+82 (2) 3218 4400
+82 (2) 3218 4401
Phone:
Fax:
E-Mail:
All other locations
+43 7712 5311 3000
+43 7712 5311 3500
TechSupportSD@EVGroup.com
State:
Released
Author:
WAA
File:
EVG501_RecipeProgramming_DO_eng_01.doc
Created on:
2010-03-01
Printed on:
2010-07-23
Version:
1.0
Last revision
2010-07-23
Purpose:
Operation
Language:
EN
Copyright © 2010 EVG
94 of 164
Development Engineer - Process
Description
Customer Support Documentation
EVG5xx
EV Group
E. Thallner GmbH
DI-Erich-Thallner-Straße 1
A-4782 St. Florian/Inn
95 of 164
Development Engineer - Process Description
Table of Contents
1
2
Wafer Bonding Processes ........................................................ 3
1.1
Direct Wafer Bonding........................................................ 3
1.2
Anodic Wafer Bonding ...................................................... 5
1.3
Adhesive Wafer Bonding .................................................. 6
1.4
Glass Frit Wafer Bonding.................................................. 7
1.5
Eutectic Wafer Bonding .................................................... 8
1.6
Transient Liquid Phase (TLP) Wafer Bonding................. 10
1.7
Metal Thermo-compression Wafer bonding .................... 11
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Wafer Bonding Processes
1
1 Wafer Bonding Processes
1.1 Direct Wafer Bonding
This is a wafer bonding method in which the adhesion between two
surfaces occurs as a result of chemical bonds established between
molecules from the two surfaces. Typically the adhesion is weak at
room temperature (mediated by Van der Waals forces) and maximum
bond strength is reached by transforming the weak bonds into covalent
bonds through a high temperature thermal annealing (process flow
shown in fig. 1).
Figure 1 - Direct wafer bonding process flow
For Si-Si direct bonding the annealing temperature is >600°C for
hydrophobic bonding (SiO2 removed from Si prior bonding by 1-2% HF)
or >900°C for hydrophilic bonding (with native, thermally grown or
deposited oxides). After correct thermal annealing the bond strength
reaches same range as Si bulk fracture strength.
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Development Engineer - Process Description
Surface activated wafer bonding is also a direct bonding method which
uses a special surface preparation process (surface activation) in order
to change and control the bonding mechanism by controlling the
surface chemistry. After surface activation, higher energy bonds are
formed at room temperature (even covalent) compared to the nonactivated surfaces and thus the energy required to reach the maximum
bond strength by forming covalent bonds across the entire bonded
interface is lower. As a result, the annealing temperature and annealing
time in this case are much lower than in a standard direct bonding
process. The annealing temperature for this type of process ranges
from room temperature to 400°C, depending on materials to be bonded.
The typical surface activation used for this process is a plasma
activation using an EVG®800 series plasma chamber for accurate
process control.
Typical materials used for direct wafer bonding under various process
conditions are:
- Si, silica, quartz, quartz glass (), other glasses (e.g. borofloat, BK7,
special properties glasses)
- Compound semiconductors (GaAs, InP, GaP, etc.)
- Oxide materials (LiNbO3, LiTaO3, etc.)
The general requirement of direct bonding is that surfaces have a
microroughness <0.5 nm (in some situations even higher values may be
acceptable, depending on process conditions boundaries).
Microroughness is typically defined as surface Rms measured by
Atomic Force Microscope (AFM) on 2 x 2 µm² areas across the
substrate.
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Wafer Bonding Processes
1
1.2 Anodic Wafer Bonding
Initially reported for joining a metal surface to a glass surface, the term
“anodic bonding” is used today mainly to identify the bonding of silicon
wafers to glass wafers with high content of alkali oxides (fig. 2). The
glass materials mostly used for anodic bonding are Borofloat® from
Schott Glass - Germany, and Pyrex®7740 from Corning Inc., USA.
The bond occurs when the two wafers are heated after being brought in
contact and an electric field is applied. At a certain temperature
(depending on the glass composition) oxides dissociate and the mobile
alkali ions are driven by the electric field into the glass, creating an
oxygen rich layer at the silicon-glass interface. Oxygen ions are driven
by the electric field to the silicon surface and produce oxidation of Si.
The resulting bond strength is very high and the process is irreversible.
In terms of equipment, it is important for the bond chamber to provide
good temperature uniformity and ensure good electrical contacts.
Figure 2a - Anodic wafer bonding process flow
Figure 2b - Bonding mechanism
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Development Engineer - Process Description
1.3 Adhesive Wafer Bonding
Adhesive wafer bonding is a technique using an intermediate layer for
bonding. Polymers, spin-on glasses, resists and polyimides are some of
the materials suitable for use as intermediate layers for bonding. The
choice of the material for intermediate layer is always made considering
the substrate materials and topography.
The main advantages of using this approach are: low temperature
processing (maximum temperatures below 400°C), surface
planarization and tolerance to particles (the intermediate layer can
incorporate particles with the diameter in the layer thickness range).
Figure 3 - Adhesive wafer bonding general process flow
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Wafer Bonding Processes
1
1.4 Glass Frit Wafer Bonding
This type of bond is using as intermediate layer for bonding a low
melting point glass. The bond occurs by heating the substrates with
applied contact force (fig. 4).
Glass frit bonding has a high tolerance to surface roughness and can
incorporate high topography of the substrates. Glass frit material can be
deposited by screen printing or used as glass preformed sheets. This
process is very reliable and is used in high volume production by major
MEMS devices manufacturers for applications where low vacuum
encapsulation is required.
Figure 4 - Glass frit wafer bonding general principle
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Development Engineer - Process Description
1.5 Eutectic Wafer Bonding
This is a wafer bonding process which uses as bonding layer an
eutectic alloy formed during bond process. Eutectic alloy is formed at
the bonding interface in a process which goes through a liquid phase:
for this reason, eutectic bonding is less sensitive to surface flatness
irregularities, scratches, as well as to particles compared to the direct
wafer bonding methods (metal layer can incorporate particles with
diameter lower than the eutectic layer thickness).
Figure 5 - Eutectic wafer bonding process flow
Some of the main eutectic alloys used for wafer bonding applications
are listed in table 1.
Eutectic System
Eutectic
Temperature
Bonding
Temperature
(recommended)
Au:Sn (80:20)
Au:Sn- 300°C
290°C
Au:Si
363°C
375°C
Au:Ge
380°C
390°C
Al:Ge
423°C
435°C
Au:In
510°C
520°C
Table 1 - Main eutectic combinations used for wafer bonding
For a successful eutectic bonding process it is very important that
bonder assures a good temperature uniformity across the entire wafer
surface and also to control very well the temperature value (avoid
overshooting the set point) in order to have a reliable process.
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Wafer Bonding Processes
1
Experimental results showed that good quality interfaces are obtained
when temperature is raised to a value lower than the eutectic
temperature (heating simultaneously from top/bottom), maintained
constant for short time to reach uniform heating of both wafers, than
increased again by heating both heaters to a temperature exceeding
the eutectic point with 10-20°C (depending on specific process
conditions and on substrates restrictions) followed by cooling down to a
temperature below the eutectic temperature.
A typical thermal profile of a eutectic wafer bonding process is shown in
fig. 6.
Figure 6 - Schematic thermal profile of a eutectic wafer bonding process
Eutectic wafer bonding does not require application of high contact
force. Due to the liquid phase formed during the process, high contact
force results always in metal squeezing out of the interface, resulting in
poor interface layer uniformity as well as contamination of the bond
tools and bond chamber. The role of the light contact force required is
just to ensure good contact of the two wafers and good contact of the
two heaters of the bonder with wafers’ back sides.
Eutectic wafer bonding is a good candidate to high-vacuum applications
as this process has a very low specific outgasing due to the use of only
high purity components. The liquid melt formed during process can only
enhance the high vacuum compatibility by allowing high quality sealing
even on non-perfect surfaces.
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Development Engineer - Process Description
1.6 Transient Liquid Phase (TLP) Wafer Bonding
For some applications the process temperatures must be lower than the
bonding temperatures of the most usual eutectic alloys (300°C - 400°C).
In such situations an alternative process can be used, which results in
an inter-metallic compound bonding layer. In literature this process is
known under different names among which can be mentioned “diffusion
soldering” or Transient Liquid Phase (TLP) bonding.
This bonding process is an advanced type of solder bond that can form
high-quality hermetic seals at lower temperatures than other bonding
technologies. This technique uses one thin layer of metal (typically 110µm thick) which during a thermal process diffuses into its bonding
partner forming an inter-metallic compound layer with re-melting
temperature higher than the bonding temperature (table 2). The process
flow and recommended thermal profile are same as for eutectic wafer
bonding (fig. 6).
Component 1
(thick)
Component 2
(thickness)
Bonding
temperature
Diffusion time
Remelting
temperature
Cu
Sn (1µm)
Sn (5µm)
280°C
300°C
4 min.
20 min.
>415°C
>676°C
Au
In (2µm)
In (5µm)
In (2µm)
260°C
200°C
160°C - 240°C
15 min.
30 sec.
10 min.
>278°C
>495°C
>495°C
Ag
Sn (2µm)
Sn (5µm)
250°C - 350°C
250°C
10 min.
60 min.
>600°C
>600°C
Table 2 - Examples of metals which can be used for Transient Liquid Phase (TLP)
* Table adapted from [G. Humpston, and D. Jacobson, in Principles of
Soldering, ASM International 2004, p. 231]. Times correspond to full
diffusion of the specified thickness of Component 2.
Same as eutectic wafer bonding, diffusion soldering bonding is
attractive for MEMS vacuum packaging as the process is completed at
low temperatures (150°C - 300°C) and can withstand much higher
temperatures after bonding (see Table 2), bonding layers are made out
of metals (low permeability), and they can planarize over surface
defects or particles resulting from prior processes.
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Wafer Bonding Processes
1
1.7 Metal Thermo-compression Wafer bonding
Quite often people are wrongly considering that thermo-compression
and eutectic bonding are one single process. In thermo-compression
bonding process the two surfaces adhere to each other due to a metal
bond established between two metal surfaces pressed together under
heating. The bonding mechanism is enhanced by the deformation of the
two surfaces in contact in order to disrupt any intervening surface films
and enable metal-to-metal contact (fig. 7). By heating the two metal
surfaces the contact force applied for the bond process can be
minimized. High force uniformity across the bonding area results in high
yield.
Figure 7 - Metal thermo-compression wafer bonding process flow
There are several metals used for metal thermo-compression bonding,
as Au, Cu or Al. These are considered interesting for wafer bonded
MEMS applications mainly due to their availability in main
microelectronics applications. Their use for one or another type of
applications is conditioned by the type of substrates used (e.g. no Aucontaining substrates can be further processed in CMOS lines).
Typically the metals used for this process are evaporated, sputtered or
electroplated on the surface. In such process it is extremely important to
assure a proper diffusion barrier or adhesion layer between the metal
bonding layer and its substrate.
The surface microroughness of the metal bonding layers ranges from
<1nm and up to few tens of nm, depending on the metal used, on
deposition technique and on the wafer bonding process conditions.
Important:
The aim of this section of the operator manual is to offer a short overview of
the available wafer bonding processes which can be performed in EVG
permanent bonding equipment.
For detailed discussion regarding substrates or bonding layers specifications,
general process conditions or specific applications-related topics EVG
customers are advised to contact a qualified EVG process engineer.
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Development Engineer - Process Description
History
12
Date
Modification
by
2010-07-12
First written with DV
WAA
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Wafer Bonding Processes
1
EV Group Support:
Phone:
Fax:
E-Mail:
North America
+1 480 305 2400
+1 480 305 2401
TechSupportUS@EVGroup.com
Phone:
Fax:
E-Mail:
Japan
+81 45 348 1237
+81 45 348 0666
service@EVGroup.jp
Phone:
Fax:
Korea
+82 (2) 3218 4400
+82 (2) 3218 4401
Phone:
Fax:
E-Mail:
All other locations
+43 7712 5311 3000
+43 7712 5311 3500
TechSupportSD@EVGroup.com
State:
Released
Author:
WAA
File:
EVG500-GEM_CAN_ProcessDescription_DO_eng_04.doc
Created on:
2005-07-18
Printed on:
2010-07-12
Version:
4.0
Last revision
2010-07-12
Purpose:
Process Description
Language:
EN
Copyright © 2010 EVG
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Recorder Software
Customer Support Documentation
EVG5xx
EV Group
E. Thallner GmbH
DI-Erich-Thallner-Straße 1
A-4782 St. Florian/Inn
108 of 164
Recorder Software
Table of Contents
1
General ....................................................................................... 3
2
Choose parameters................................................................... 4
2.1
Settings for graphs and scales.......................................... 4
3
Measure Bars............................................................................. 7
3.1
Show Measure Bar ........................................................... 7
3.2
Move Measure Bar ........................................................... 8
3.3
Delete Measure Bar .......................................................... 8
4
Zoom .......................................................................................... 9
5
More functions of the recorder Software .............................. 10
5.1
Grids ............................................................................... 10
5.2
File Info ........................................................................... 10
5.3
“Printing” ......................................................................... 10
5.4
“About Recorder” ............................................................ 11
5.5
Save / Open.................................................................... 11
5.5.1
5.5.2
6
2
Open......................................................................................11
Save ......................................................................................11
Activate the recorder software............................................... 12
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Activate the recorder software
6
1 General
This software allows to record all process parameters and save this
parameters.
After opening the Recorder- Program following window appears:
Press “Yes” to show the view as last used.
Press “No” to adjust the settings new.
The Recorder looks like this:
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Recorder Software
2 Choose parameters
Choose the parameters which should be shown in the left scale. For
each chosen parameter a seperate scale is shown (in the same colour
as the parameter line).
2.1 Settings for graphs and scales
Press the right mouse button on the colour field to
adjust the colour for the graphs and the scale of
the chosen value. Choose a colour and press
“OK” to confirm the new colour or press “Cancel”
to cancel the colour adjustment.
Press the left mouse button on the colour field for more “Graph Settigs”
of the chosen value. Following window will be shown:
4
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Activate the recorder software
6
Find general information of the chosen graph in the field “Graph
Description”.
Field “Y-Scale”:
“Auto Range”: the software searches automatically the best view by
using the available values for the chosen graph.
Use “User defined Values” and enter values for “Max. Value” and “Min
Value” in the defined fields.
Choose “Invert Curve” to invert the chosen graph.
In the field “Curve Settings” it is possible to choose the style and the
width of the chosen graph.
Use “Settings” – “Basic Settings” or press “Ctrl” + “S” on the keyboard to
adjust the basic settings for graphs, scales, measuring lines and graph
update.
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Recorder Software
Measuring Lines: Adjust the colors and the width of the lines (find
more in item “Measure Bars”) as they should be shown. Catch Range:
the mouse pointer catches the measuring line x Pixel early as the line is
shown. Enter a value (for x) in the field “Catch Range”.
Graph Update: this is an automatic update of the measuring point of
the curves. Update Interval: a value for the time in seconds for interval
of updating the graph.
Note: This has no importance to updating the measuring points!
6
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Activate the recorder software
6
3 Measure Bars
With the measure bar it is possible to find exact values of the visible
graphs.
3.1 Show Measure Bar
Press „Strg“ + left mouse button or „Shift“ + left mouse button to show a
measure bar. (Place the mouse pointer before pressing the left mouse
button where the measure bar should appear.)
Up to four measure bars can be shown.
Find the specific values for all measure lines in the window “Values
Measure”. If this window does not appear use the button “Toggle
Measure Window”
in the toolbar to open it.
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Recorder Software
3.2 Move Measure Bar
Move the mouse over a measure bar. The mouse button will change
into double arrow (as shown).
Use the left mouse button to move the measure bar.
3.3 Delete Measure Bar
Delete one measure bar:
Press “Strg” or “Shift” on the keyboard and point with the mouse on the
measure bar which should be deleted and press the right mouse button.
Delete all measure bars:
Use the button “Delete Measure Bars”
8
in the toolbar.
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Activate the recorder software
6
4 Zoom
Draw a rectangle over the part which should be zoomed with the mouse
pointer:
There are four zoom- steps available.
Press the right mouse button to go back one zoom- step.
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Recorder Software
5 More functions of the recorder Software
5.1 Grids
Choose the view of the grids. Choose “Linear Grid”
Grid”
according to the shown graphs.
or “Logarithmic
5.2 File Info
Press “File” / “File Info” or use button
to open the window “File Info”.
Find all corresponding information of the current file in this window.
Add an additional comment if necessary. This comment will only be
saved if save button will be pressed afterwards.
5.3 “Printing”
Find the buttons “Print”, “Print Preview” and “Print Setup” at menu
“Printing” in the menu bar.
“Print Setup”: activate / deactivate printing the legend, the filename
and the scales. Choose print orientation “Portrait” or “Landscape”.
10
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6
Activate the recorder software
“Print Preview”: Take a look at the print preview before printing the
document.
“Print”: Print document.
5.4 “About Recorder”
Find information about the software- version and the registration (limited
or unlimited) in the window “About EVGRecorder” (press “Info” / “About
EVGRecorder” in the menu bar).
5.5 Save / Open
5.5.1
Open
Open an existing file via „File“ / “Open” or the button
5.5.2
Save
Save the current file via „File“ / “Save” or the button
.
Save the current document with a new name via “File” / “Save As” or
the button
.
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Recorder Software
6 Activate the recorder software
The recorder software has to be activated by an EVG Engineer.
12
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6
Activate the recorder software
History
Date
Modification
by
January 30th, 2007
Manual for new Recorder- Software; first written
HMA
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Recorder Software
EV Group Support:
Phone:
Fax:
E-Mail:
Japan
+81 45 438 0663
+81 45 438 0665
service@EVGroup.jp
Phone:
Fax:
E-Mail:
All other locations
+43 7712 5311 3000
+43 7712 5311 3500
TechSupportSD@EVGroup.com
State:
Released
Author:
HMA
Created on:
2007-01-30
Printed on:
2007-11-02
Version:
1.0
Last revision
Purpose:
14
Phone:
Fax:
E-Mail:
North America
+1 800 384 8794
+1 480 727 9700
TechSupportUS@EVGroup.com
Language:
EN
Copyright © 2000 EVG
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Preventive Maintenance
Customer Support Documentation
EVG501
EV Group
E. Thallner GmbH
DI-Erich-Thallner-Straße 1
A-4782 St. Florian/Inn
122 of 164
Preventive Maintenance
Table of Contents
1
Note to the User......................................................................... 4
2
Daily Maintenance ..................................................................... 5
2.1
Main Pressure................................................................... 5
2.2
Bond Tools........................................................................ 6
2.3
Flags ................................................................................. 7
2.4
Clamping glasses ............................................................. 7
3
Weekly Maintenance ................................................................. 8
3.1
Before starting Weekly Maintenance ................................ 8
3.2
Error Tracking: Memory Leak ........................................... 8
3.3
Uniformity Check .............................................................. 9
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.4
3.5
Flag Pulling Mechanism.................................................. 16
Pressure Insert ............................................................... 17
3.6
Cleaning.......................................................................... 22
3.5.1
4
Pressure uniformity test by using pressure sensitive foil.........9
Check Flatness......................................................................11
Heater Flatness .....................................................................12
Bond Tool Flatness................................................................14
Compliant Layer Graphite 6” .................................................15
Adjustment of Pressure Disc .................................................21
Monthly Maintenance .............................................................. 23
4.1
Before starting Monthly Maintenance.............................. 23
4.2
Cover connection lines.................................................... 23
4.3
Piston Motion .................................................................. 24
4.4
Main Pressure Regulator Unit......................................... 24
4.5
Check Start/Stop, EMO, Mainswitch ............................... 25
4.5.1
4.5.2
Check Start/Stop ...................................................................25
Check EMO Button................................................................25
4.6
4.7
4.8
Vacuum System.............................................................. 26
Roughing Pump .............................................................. 27
Cover Open/Close .......................................................... 27
4.9
Check of Sensors ........................................................... 28
4.10
4.11
Water filter ...................................................................... 30
Water Cooling/Glycol Mix................................................ 30
4.8.1
4.8.2
4.9.1
Open Cover ...........................................................................27
Close Cover...........................................................................28
Leakage Sensor ....................................................................28
4.11.1 Cooling Water Quality:...........................................................30
4.11.2 Requirements: .......................................................................30
5
Quarterly Maintenance............................................................ 31
5.1
Checking Bond module and chuck ................................. 31
5.2
Adjust heater offset......................................................... 31
5.2.1
5.2.2
2
Short Description ...................................................................31
How to adjust the temperature offset.....................................32
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Note to the User
1
6
Annual Inspection....................................................................34
6.1
Cooling Fluid ................................................................... 34
6.2
Cooling Lines .................................................................. 34
6.3
Cleaning Procedure ........................................................ 34
6.4
Vacuum Pump................................................................. 35
6.5
Vacuum Gauges ............................................................. 35
6.6
Heater Cooling ................................................................ 35
6.7
Waterlines ....................................................................... 35
6.8
Turbo pump..................................................................... 35
6.9
Waferbow Contact of the Piston...................................... 35
7
Troubleshooting ......................................................................36
7.1
Bonder doesn’t heat ........................................................ 36
7.2
Bonder doesn’t reach end temperature........................... 37
7.3
Endvacuum not reached ................................................. 38
7.4
No High Voltage .............................................................. 39
8
Personal Protective Equipment (PPE) ...................................40
9
Lockout/Tagout........................................................................41
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Preventive Maintenance
1 Note to the User
!
!
CAUTION
HAZARDOUS AREA
To be opened by trained and
authorized personnel only
10023467
Installation, adjustment, programming and maintenance (except
periodical maintenance described in the manual) may only be done by
qualified EVG service engineers.
For further deliveries please check immediately after unpacking that the
consignment confirms to the information given on the packing list.
Read and understand the operating and safety instructions before you
operate the unit and follow them in all respects.
The equipment may only be operated by personal trained from EVG
service engineers.
No liability will be accepted for personal injury no material damages in
the event that damage or breakdowns occur as a result of failure to
comply with these operating instructions; neither will any guarantees
relating to repairs to or replacements of our products apply.
Any part of this print is not allowed to be reproduced in any form without
permission of EVG
This print is a subject to change without notice.
COPYRIGHT © 2010 EVG
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Daily Maintenance
2
2 Daily Maintenance
2.1 Main Pressure
The Main Pressure is checked by the software permanently. There
must be an error message if the pressure drops below 5 bar.
Inspect the main pressure regulator (1) on the rear wall. The normal
static operating pressure should be around 6-8 bar.
1
Figure 1 - Main Pressure Regulator
Weekly check the main pressure regulator and the filter for the
presence of oil or water (see chapter “Weekly Maintenance”).
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Preventive Maintenance
2.2 Bond Tools
Visually inspect the bond tool surface. There should be no deposits or
scratches visible. Clean the bond tools with alcohol. Particularly the top
and bottom surface of the bond chuck insert.
Figure 2 - Top Surface of the Bond Tool
Figure 3 - Bottom Surface of the Bond Tool
6
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Daily Maintenance
2
2.3 Flags
Make a visual inspection of the flags on the bond tools. Ensure that the
flags are not bent, and that the screws which hold them in place are
secure. The flag height must be higher than the bottom wafer.
Figure 4 - Flag on the Bond Tool
2.4 Clamping glasses
Make a visual inspection of the clamping glasses. Insure that there are
no scratches or cracks.
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Preventive Maintenance
3 Weekly Maintenance
3.1 Before starting Weekly Maintenance
Perform daily maintenance as described in the previous chapter.
3.2 Error Tracking: Memory Leak
We recommend restarting the system computer and the Microsoft
Windows operating system in a regular interval, like during the weekly
pre-maintenance, to avoid problems and to ensure a stable production
environment.
8
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Weekly Maintenance
3
3.3 Uniformity Check
3.3.1
Pressure uniformity test by using pressure
sensitive foil
Needed equipment:
•
•
•
2 SI Wafer with blank surface
Pressure film Ultra Low 13,1' 28-85PSI
Bondchuck
Figure 5 - Needed Equipment
For the pressure film test two different pressure films are necessary,
one more clear and one white film.
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Preventive Maintenance
Cut out one peace of each pressure film that has the same size than
the wafer. Now place first a wafer and than the white pressure film (blue
bag) on the bond chuck. The harsh side of the pressure film up. Next
place the more clear pressure film (black bag) with the harsh side down
on the chuck, so that the harsh sides of the pressure films are in
contact.
Figure 6 - SI Wafer - Pressure Films – Chuck
Finally place the second SI Wafer on the chuck and clamp the wafer
stack with the pressure film in between.
Figure 7 - SI Wafer
10
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Weekly Maintenance
3.3.2
3
Check Flatness
In order to check the flatness of a heater or a bond chuck accurately,
check the flatness two times in a 90° angle.
When checking the flatness make sure to check it on the whole surface
by moving the straight edge over the surface like shown below:
Note: If the flatness is only checked once the result could be inaccurate.
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Preventive Maintenance
3.3.3
Heater Flatness
3.3.3.1
Bottom Heater
Make a visual check of the bottom heater.
Check the flatness of the heater with a straight edge.
Figure 8 - Bottom Heater
Figure 9 - Bottom Heater
12
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Weekly Maintenance
3
As seen below there is a gap (1) between the heater and the straight
edge.
1
Figure 10 - Bottom Heater
The gap between the heater and the straight edge can be measured
with feeler gauges and a measuring gap (see below).
feeler gauges
measuring gap
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3.3.3.2
Top Heater
Make a visual check of the top heater.
Check the flatness of the heater with a straight edge. Make sure that
there is no gap between the top heater and the straight edge.
Figure 11 - Top Heater
3.3.4
Bond Tool Flatness
Check the flatness of the bond chuck insert with a straight edge.
Make sure that the surface is absolutely even and no spots are visible.
Figure 12 - Bond Chuck
14
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Weekly Maintenance
3.3.5
3
Compliant Layer Graphite 6”
Make a visual check of the compliant layer graphite. Make sure that the
surface is absolutely even and no spots are visible.
Figure 13 - Compliant Layer Graphite 6"
Note: The compliant layer graphite should be exchanged annually!
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Preventive Maintenance
3.4 Flag Pulling Mechanism
Manually activate the flag pulling mechanism. Ensure that the flag
pulling mechanism is working smoothly, and that there is no debris that
might cause a flag to fail.
Figure 14 - Flags on Bond Tool
Figure 15 - Flags on Bond Tool
Make sure that there are no cracked wafer pieces in the bellows (1) of
the pulling mechanism.
1
Figure 16 – Bellows
16
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Weekly Maintenance
3
3.5 Pressure Insert
Required tools:
Figure 17 - Compliant Layer Graphite 6”
Figure 18 - Compliant Layer Graphite 4”
Figure 19 - Pressure Disc with Compliant Layer Graphite
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Preventive Maintenance
Replace the compliant graphite foils of the pressure disc:
1) If the System is an EVG520IS bring the Cover to Service Position
first (remove the perforated plate “Covering top back” and bring the
Cover into its service position).
2) Remove 5 pieces pressure disc clamps
3) Remove Pressure Disc
4) Remove carefully the two “Compliant Layer Graphite” (Number “1”
and “3” in following drawing. It’s recommended to change both
“Compliant Layer Graphite” because of evenness.)
Note: Contamination! Thermocouple!
5) Mount new Compliant Layer Graphite and fix Thermocouple.
Figure 20
1
Compliant Layer Graphite 6”/8”/12” (depends on the system)
2
Thermocouples (2 pieces) – The two Thermocouples must be placed
between the two “Compliant Layers Graphite”!
3
Compliant Layer Graphite – Most time the two “Compliant Layers
Graphite” do have the same size. If not place the smaller Graphite-Disc
(Number “3” in drawing above) exact in the middle of the “Pressure Disc” (A
little bit of Isopropanol can help you with that).
The smaller “Graphite Discs” are used for special
“Pressure Discs” only.
4
18
Pressure Disc
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3
Weekly Maintenance
6) Fix New Compliant Layer Graphite and Quartz Glass Pressure
Disc with pressure disc clamps
Adjustment:
There is a notch on the side of the pressure disc (pictures below)
and a notch on the heater. Align these to notches together!
1
2
2
3
Figure 21
1
If there is no notch on the side of the disc the notch above the disc must be
exact in one line to the screw above / beneath.
2
3
Notch for electrode. If there is no notch remove the electrode.
4
Flattened side
5
Thermocouple
6
Pressure disc clamps
7
Flattened side
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Preventive Maintenance
Remove disc: It is easier to remove the four red marked clamps by
using a small screwdriver first. The disc is still fixed by the two blue
marked clamps (Figure 21) now.
Mount disc in reverse order.
There is a flattened side and a spring side on the clamp. Fix the disc
with the flattened side (Figure 23 - Fix disc).
4
Figure 22 - Clamp
It may be necessary to readjust the tension the spring side of the clamp
if it is loose.
5
6
7
Figure 23 - Fix disc
20
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Weekly Maintenance
3.5.1
3
Adjustment of Pressure Disc
Adjust the pressure disc as shown in Figure 24 and Figure 25.
Figure 24
Concentric
Figure 25
Make a visual check of the top side pressure glass. There should be no
crack or spot detectable.
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3.6 Cleaning
For all cleaning processes the entire EVG5xx system must be switched
off, and the heater temperature has to be below 50°C. Alcohol and a
wipe suitable for clean rooms can be used for all cleaning actions.
Clean all bottom heating chucks of bond chamber with alcohol.
Clean the pressure disk of the top heater of pressure lids.
(Example 6”)
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Monthly Maintenance
4
4 Monthly Maintenance
4.1 Before starting Monthly Maintenance
Perform weekly maintenance as described in the previous chapter.
4.2 Cover connection lines
1)
Check all lines (pneumatic, electric and water-cooling) for cracks
and damage.
2)
Make sure that the water and pneumatic lines are not crimped.
Figure 26 - Cover Connection Lines
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4.3 Piston Motion
Check the movement of the piston. The motion of the piston has to be
smooth and it must fully retract.
4.4 Main Pressure Regulator Unit
Check the main pressure regulator (1) and the filter for the presence of
oil or water.
1
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Monthly Maintenance
4
4.5 Check Start/Stop, EMO, Mainswitch
4.5.1
Check Start/Stop
•
Check the function of the Start (“I”) and the Stop (“0”) button:
Note: Shut down the system PC before pressing the Stop button!
4.5.2
Check EMO Button
Check if the emergency stop is functioning correctly:
Pushing the emergency stop button must bring the system in a safe
state position. System must not restart after the button gets unlocked.
Figure 27 - EMO
Note: Shut down the system PC before pressing the EMO button!
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Preventive Maintenance
4.6 Vacuum System
Check the functionality of the Vacuum System (software Bonder
diagnostic), depending on the vacuum system configuration.
For the vacuum system specifications refer to the Acceptance Test
Protocol.
2
1
3
5
4
6
7
8
9
10
1. Vent Valve
2. Purge 1 Valve
3. Chamber Valve
4. Turbo Pump
5. Bypass Valve
6. Turbo Valve
7. Roughing pump
8. Pump (more details refer to recipe)
9. Pump & Purge (more
details refer to recipe)
10. Purge (more details refer to recipe)
Notice: Vacuum System is customized.
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Monthly Maintenance
4
4.7 Roughing Pump
Following Roughing Pumps are used on the EVG5xx systems (depends
on vacuum system configuration).
•
•
•
•
•
Pfeiffer MVP 055-3
Varian SH100
Varian SH110
BOC Edwards XDS5
BOC Edwards XDS10
- min. Pressure: 2mbar
- min. Pressure: 6,6 x 10-2mbar
- min. Pressure: 6,6 x 10-2mbar
- min. Pressure: 7,0 x 10-2mbar
- min. Pressure: 7,0 x 10-2mbar
The end vacuum of the Roughing Pump can be checked by connecting
an external gauge to the Roughing Pump.
For troubleshooting refer to the OEM manual or contact EV Group.
4.8 Cover Open/Close
Check if all covers open and close smoothly.
4.8.1
Open Cover
Check if the status of “Cover” (1) changes from “closed” to “open” when
the cover is opened.
1
Figure 28 - Status "Cover Open"
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4.8.2
Close Cover
Check if the status of “Cover” (1) changes from “open” to “closed” when
the cover is closed.
1
Figure 29 - Status "Cover Closed"
4.9 Check of Sensors
4.9.1
Leakage Sensor
Put a paper strip underneath the leakage sensor to check the
functionality. The sensor must release Æ LED on the sensor will be off,
error message “MACH: Leakage detected” will appear in the SW and
the water flow will be stopped.
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Monthly Maintenance
4
If the sensor doesn’t release adjust the sensitivity with the
potentiometer (2).
2
1
Figure 30 - Leakage Sensors
1
Paper Strip
2
Potentiometer
Figure 31 - Position of Leakage Sensor
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4.10
Water filter
Open the water filter and clean it. If there are any deposits in the sieve
check your cooling water quality. To find the location of the water filter
refer to the picture below.
4.11
Water Cooling/Glycol Mix
4.11.1
Cooling Water Quality:
Closed loop system filtered (100 micron filters); the cooling water must
be mechanically clean, optically clear, without deposits, to keep the
cooling circuit free from dirt and organic suspended matter. To avoid
corrosion damages, the following requirements for the cooling water
must be met:
4.11.2
Requirements:
Recommended is the mixing of inhibited Propylenglycol 30 - 50 % Vol.
in DI-Water (e.g.: Heat Transfer Fluid Dowcal 20 from DOW Chemical
Company)
pH value: 7 – 8.2
max. oxygen content: < 4mg/kg (ppm) - due to level of
Propylenglycol
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Quarterly Maintenance
5
5 Quarterly Maintenance
5.1 Checking Bond module and chuck
Make a visual check of the Bond tool and the chuck. There should be
no crack or spot detectable. The surface must be flat.
5.2 Adjust heater offset
5.2.1
5.2.1.1
Short Description
Temperature offset:
The thermocouple sensors used on EVG bonding systems are very
accurate, but still have a small measurement tolerance. That is why the
same temperature reading on different EVG bonding machines may
lead to a small temperature difference from bonder to bonder.
In order to compensate this difference and to run one production
bonding recipe on different machine with the same result, a temperature
offset setting is possible which can be adjusted individually from
bondchamber to bondchamber.
This setting adds an individually adjustable offset in the range of +5 to 5°C to the set point in the recipe. The status window on the screen
shows the temperature including the offset.
e.g.: If a 380°C heating set point is adjusted in the recipe and the offset
is defined with +3°C, the heaters reach a temperature of 383°C
according to the thermocouple in the bonder and will show 383°C in the
status window and in the recorder file.
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5.2.2
How to adjust the temperature offset
To adjust the heater offset click on:
Options\General Settings\Heater Configuration
(as shown in the window below):
Here a temperature offset of +/- 5° C for every heater can be set.
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5
Afterwards the apply button has to be clicked for saving the new
adjustment. This will not work if a process is running. In this case there
will be a message that the IO service has to be restarted to apply the
adjustment.
These adjustments can only be done by administrators.
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6 Annual Inspection
Check the following points in addition to the monthly maintenance
Tools needed for any PM.
Metric Allen wrench set
US Allen wrench set
Metric open-end box end wrenches
Philips head screwdriver (small and medium size)
Flat head screwdriver (small and medium size)
Volt meter
Spare Latex gloves
6.1 Cooling Fluid
Use a hydrometer to check if the fluid contains the proper percentage of
Glycol.
Ensure that the flow and pressure meets the specifications. Also check
the PH value of the fluid.
6.2 Cooling Lines
Check the lines for deposits, corrosion, and leaks.
6.3 Cleaning Procedure
Clean all chambers with IP alcohol. After you have cleaned the whole
chamber (including the heating chuck) wipe all surfaces of the bonder
with IP alcohol. After you have cleaned everything, heat the chamber up
to 300°C and evacuate it overnight.
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Annual Inspection
6
6.4 Vacuum Pump
Exchange the tip seal of the vacuum pump annually.
6.5 Vacuum Gauges
Remove the vacuum gauges and ship them to the manufacturer for
cleaning and recalibration.
6.6 Heater Cooling
Check the flow rate for the top and bottom side heater. Compare the
rates with the recommended ones.
6.7 Waterlines
Clean all waterlines chemically and mechanically. If there are visible
deposits in the lines check your water quality and the water filter!
6.8 Turbo pump
It is strongly recommended to exchange the oil lubricant reservoir in the
pump annually.
Further instructions how to precede please find in the Pfeiffer
Operation Manual in the Technical Section of this manual.
6.9 Waferbow Contact of the Piston
Check if the waferbow contacts the bondtool when you press waferbow
button in the bonder diagnostic. The adjustment has to be done by an
authorized EVG service engineer.
A yearly maintenance done by an EVG Service Engineer is strongly
recommended.
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7 Troubleshooting
7.1 Bonder doesn’t heat
Bonder doesn’t heat
Bonder doesn´t
heat
Check heater switch
Heating Circuit
Control
Which LED´s are
not ON ?
ON
OFF
Turn on
Check display
OMRON
Which LED ?
Few
ALL
Transfer of desired
temp. value
TOP A TOP B TOP C BOT A BOT B BOT C
OK
Check Remote LED
OMRON
NOK
Heating circuit XXX
is defect
ON
Load process
parameter again
Call EV Service to
change the heating
circuit
Check OUT LED
OMRON
ON
Transfer of desired
temp. value
OFF
OK
Heating circuit
control
ON
OFF
Call EV Service
36
ON
OFF
Ref. to OMRON
operation manual
NOK
Check heat enable
plug-in
Check LED´s on
heater plug-in
OFF
Call EV Service
Observation temp.
is too high
Wait until temp.
decreases
Check fuses on
card
OK
NOK
Change defect fuse
and try again
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Troubleshooting
7
7.2 Bonder doesn’t reach end temperature
Bonder doesn´t reach
end temperature
Check observation temperature in the
window "extended bond monitor"
temperature above 350 °C
temperature below 350 °C
t > 350°C > t
Insufficient cooling
Check cooling
pressure 6 bar
OK
NOK
Adjust correct value
Check fan´s on
underside
Try again
OK
NOK
Call EV Service
Check lamp cooling
OK
NOK
Atmosphere or
vacuum
Repair
and try again
Call EV Service
ATM
VAC
Correct placement
of bond tool ?
OK
NOK
Check position of
thermocouple
OK
Call EV Service
Ventilate
Under vacuum it takes
a long time to reach
the end temperature !
Load bond
tool new
NOK
Move in correct
position
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7.3 Endvacuum not reached
Endvacuum
not reached
Turbo Pump
on full speed?
Cover
properly
sealed
OK
NOK
Which error
is displayed
Check
roughing
pump
Refer to Turbo
pump manual
OK NOK
All fittings
tight?
Run up time
expired
Grease the
sealrings with high
vacuum grease
OK NOK
OK NOK
Others
Make helium
leak test
Tighten and grease them
with high vacuum grease
Call EV
Service
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Troubleshooting
7
7.4 No High Voltage
No High Voltage
Check Ext. Bond Monitor if Voltage is
displayed
Measure High Voltage on
the connector plate of the
bondoven (disconnect the
cable to the cover)
OK NOK
OK NOK
Call EV Service
Measure if the
cable has a
connection with
the electrode
Check if the electrode
spring and the
graphite electrode are
inserted
OK NOK
OK NOK
Repair or
exchange the
cable
Insert both
Check your
wafers
Attention High Voltage: Take care when you measure on the high voltage
connectors. Measure only with specified tools and take care about the safety
requirements.
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8 Personal Protective Equipment (PPE)
1. Chemical resistant latex gloves
This PPE is required when working with Isopropyl alcohol or NH4OH
contaminated units (cleaning chambers, brushes, etc…).
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Lockout/Tagout
9
9 Lockout/Tagout
1. Mainswitch OFF and LOCK:
Start und shutdown procedure
Power OFF
The sequence for powering down the system is:
1. Follow the guidelines for shutting down Windows
2. At the screen “It is now OK to turn off your computer”, Turn the main
switch counter clockwise 90* to the OFF position
Power ON
The sequence for powering up the system is:
1. Turn the “Main Switch” clockwise 90* to the ON position
Switch on the computer which is located behind the left door.
The main EVG5xx program should be located on the Windows desktop
in a folder called EVG5xx, open this folder and double click on the
EVG5xx icon
2. Turn on the heater power circuit breaker clockwise 90* to the ON
position.
NOTE:
Main switch has to be on when switching on the heater-power circ.
Breaker.
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History
42
Date
Modification
by
2010-07-23
First written
WAA
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Lockout/Tagout
9
EV Group Support:
Phone:
Fax:
E-Mail:
North America
+1 480 305 2400
+1 480 305 2401
TechSupportUS@EVGroup.com
Phone:
Fax:
E-Mail:
Japan
+81 45 348 1237
+81 45 348 0666
service@EVGroup.jp
Phone:
Fax:
Korea
+82 (2) 3218 4400
+82 (2) 3218 4401
Phone:
Fax:
E-Mail:
All other locations
+43 7712 5311 3000
+43 7712 5311 3500
TechSupportSD@EVGroup.com
State:
Released
Author:
WAA
File:
EVG501_PM-Manual_PM_eng_01.doc
Created on:
2009-03-06
Printed on:
2010-07-23
Version:
1.0
Last revision
2010-07-23
Purpose:
Maintenance
Language:
EN
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