AZ® 50XT Photoresist
Ultra-thick Positive Novolak Resist for
Advanced Packaging, TFRH, and
MEMS Applications
AZ’s Thick Film Photoresist Roadmap
Lift-off
TSV / Etch
Implant
Copper Plating
Gold Plating
Solder /
Metal Plating
MEMS /
Ink Jet
DUV
TFRH/Implant
FT: 2-10 µm
FT: 3-15 µm
FT: 5-30 µm
FT: 10-30 µm
FT: >30 µm
FT: >30 µm
FT: 3 - 8 µm
Commercialized materials
<------------------------- P4620 ----------------------->
10XT ------------>
<-----------AZ® nLOF
<----------- AZ® 50XT ---------->
<------------ AZ® 9200 ------------>
Series
AZ® PLP30/40
AZ® N4000
AZ®
Materials in sampling
(all EXP products)
AZ® 5XT
AZ® 40XT-A1 AZ® 40XT-11D
AZ® 12XT-20P
AZ® TX 1311
<------------------------- AZ® 125nXT Series --------------------------> VS-01HJ
<--- AZ® 5nXT / AZ® 15nXT--->
Materials under development
<--------- AZ® EXP 100 -------->
AZ® LExp 500
Red=Neg, Blue =Pos; nLOF, N4000, 5XT, 5nXT, 15nXT, 12XT, 40XT = chemically amplified; 125nXT = photopolymer; 10XT, 9200, P4620, PLP, 50XT = DNQ
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® Electronic Materials
Thick Photoresist Product Summary
Thick Film
Product
Platform
λ
P4000
4500
9200
10XT
50XT
PLP-30
PLP-40
EXP 12XT-20P
EXP 5XT
EXP 40XT
EXP 125nXT
EXP 5nXT
EXP 15nXT
TX 1311
DNQ
DNQ
DNQ
DNQ
DNQ
DNQ
DNQ
CA
CA
CA
PP
CA
CA
CA
g-h
g-h
g-h -i
g-h -i
g-h
g-h
g-h
g-h-i
g-h-i
g-h-i
g-h-i
g-h-i
g-h-i
DUV
FT
Maximum Aspect
Range
Application
Single coat Ratio
(um)
2 - 55
25
2:1
Solder, Cu, Au
2 - 55
25
2:1
Solder, Cu, Au
3 - 50
25
3:1
Solder, Cu
4 - 50
25
3:1
Solder, Cu, Au
15 - 65
65
3:1
Solder, Cu
6 - 25
25
2:1
Au, Cu
20 - 30
30
2:1
Au, Cu
5 - 20
20
3:1
Cu
3-5
5
2:1
Si, Implant, Etch
20 - 100
60
4:1
Etch, Solder, Cu
20 - 120
120
5:1
Cu, Au, Solder
5 - 10
12
3:1
Cu, NiFe, Si
10 - 20
20
3:1
Cu, NiFe, Si
3-5
5
15:1
Cu, NiFe, Si
Developer
Compatibility
400K / TMAH
400K / TMAH
400K / TMAH
400K / TMAH
400K
303N
303N
TMAH
TMAH
TMAH / 400K
TMAH / 303N
TMAH
TMAH
TMAH
¾ Platform: DNQ = Novolak, CA = Chemically Amplified, PP = Photopolymer
¾ Wavelength: Red font indicates better performance.
¾ Developer Compatibility: Bold font indicates most compatible developer, resulting in shorter develop times and
lower exposure energies.
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
▶ Positive resist for plating and
wafer bumping applications
▶ 15 to 60 micron single coat
capability.
▶ 5 to 1 aspect ratio
performance. Excellent
sidewall profiles. Wide
process latitude.
▶ Compatible with steppers
and aligners.
▶ Inorganic developer
recommended.
▶ Compatible with existing
thick film processes.
Copper studs
AZ 50XT at 75µm FT
®
Solder studs (SnPb)
AZ® 50XT at 75µm FT
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Spin Curve
100
90
80
Film Thickness (µm)
70
60
50
40
30
500
750
1000
1250
1500
1750
2000
Spin Speed (rpm)
Static Dispense on silicon
15 sec spin @ 750-2000 rpm
0.2 sec spin @ 2000 rpm
SB: 125°C/180 sec @ 0.002 “
Optical Parameters
λ
n
k
365nm
1.6927 0.010635
436nm
1.6678 0.001430
633nm
1.6255 0.000249
Optical/Cauchy Constants
a= 1.5995
2
b= 0.009958 um
4
c= 0.000716 um
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Process Conditions
Resist Thickness
50µm on Silicon
Softbake
115°C/60 sec; 0.050” gap
115°C/60 sec; 0.025” gap
115°C/300 sec; 0.002” gap
Exposure
Suss MA 200 Contact/Aligner
Exposure gap = 30µm
Develop
AZ 400K (1:3) / 300 sec immersion
C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude - 50µm Lines/Spaces
1375 mJ/cm2
2000 mJ/cm2
1500 mJ/cm2
2125 mJ/cm2
1625 mJ/cm2
2250 mJ/cm2
1750 mJ/cm2
2375 mJ/cm2
1875 mJ/cm2
2500 mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude - 50µm Lines/Spaces
60
C
55
CD
50
µm
DTP: 2253 mJ/cm2
Exp. Lat.: 102%
45
40
1000
1500
2000
2500
3000
Exposure Energy, mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Linearity; FT = 50µm
DTP = 2375 mJ/cm2
10 um
50 um
20 um
60 um
30 um
40 um
80 um
100 um
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude - 50µm Contact Hole
1375 mJ/cm2
1500 mJ/cm2
2000 mJ/cm2
2125 mJ/cm2
1625 mJ/cm2
2250 mJ/cm2
1750 mJ/cm2
2375 mJ/cm2
1875 mJ/cm2
2500 mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Process Conditions
Resist Thickness
65µm on Silicon, Single Coat
Softbake
85°C/120 sec; 0.10mm proximity
126°C/240 sec; 0.10mm proximity
Exposure
Suss MA 200 Contact/Aligner
Exposure gap = FT + 10µm
Develop
AZ 421K / 540 sec immersion
C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Contact Holes - Linearity, 65um FT
Ecd = 1485 mJ/cm²
100 µm C/H
60 µm C/H
80 µm C/H
40 µm C/H
30 µm C/H
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Positive Photoresist
100µm Contact Holes - Exposure Latitude, 65um FT
1350 mJ/cm2
1485 mJ/cm2
1620 mJ/cm2
1755 mJ/cm2
1890 mJ/cm2
2025 mJ/cm2
2160 mJ/cm2
2295 mJ/cm2
2430 mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Process Conditions
Resist Thickness
25µm on Silicon & Copper
Softbake
115°C/60 sec; 0.250” gap
115°C/180 sec; 0.002” gap
Exposure
Ultratech 1500 Stepper
Develop
AZ 400K (1:3) / 270 sec immersion
C
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude on Si, 20µm Contact Holes, FT = 25µm
2100 mJ/cm2
2500 mJ/cm2
2200 mJ/cm2
2600 mJ/cm2
2300 mJ/cm2
2400 mJ/cm2
2700 mJ/cm2
2800 mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Copper Plating - ~20µm High Bumps
CD = 20µm
CD = 30µm
CD = 50µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude on Si, 10µm Lines/Spaces, FT = 25µm
2100 mJ/cm2
2500 mJ/cm2
2200 mJ/cm2
2600 mJ/cm2
2300 mJ/cm2
2400 mJ/cm2
2700 mJ/cm2
2800 mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Linearity on Si @ 2400 mJ/cm2; Focus = -6µm, FT = 25µm
5µm
10µm
6µm
15µm
7µm
20µm
50µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude on Cu, 10µm Lines/Spaces, FT = 25µm
0 mJ/cm2
2100 mJ/cm2
2200 mJ/cm2
2500 mJ/cm2
2600 mJ/cm2
2400 mJ/cm2
2700 mJ/cm2
2800 mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Linearity on Cu @ 2400 mJ/cm2; Focus = -6µm, FT = 25µm
5µm
10µm
6µm
15µm
7µm
20µm
50µm
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT - 65µm FT Process
Baseline Process Conditions:
▶
▶
▶
▶
▶
AZ® 50XT
– ~65µm FT
85°C / 2-min pre-bake w/0.5mm proximity
110°C / 10-minute softbake w/0.1mm proximity
Exposure on Ultratech® Titan-300
– -35µm Focus
– Mask: 100µm vias 1:1
Develop in AZ® 421K Developer
– 9-minute immersion / automated wet bench
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude on UT Titan-300
2100 mJ/cm2
2250 mJ/cm2
2400 mJ/cm2
2550 mJ/cm2
2700 mJ/cm2
2850 mJ/cm2
3000 mJ/cm2
3150 mJ/cm2
3300 mJ/cm2
3450 mJ/cm2
3600 mJ/cm2
3750 mJ/cm2
3900 mJ/cm2
4050 mJ/cm2
4200 mJ/cm2
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Exposure Latitude on UT Titan-300
CD Measurement (um)
160
150
140
130
Top
120
Middle
110
Bottom
100
90
80
2000
2500
3000
3500
4000
4500
Exposure Energy (mJ)
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Process Latitude Summary on UT Titan-300
Process Center
Pre-Bake: 85°C / 120sec / 0.5mm prox.
SB: 110°C / 10-min / 0.1mm prox
Ultratech Titan-300 / Focus @ -35µm
Dose = 3000 mJ/cm2
Mask 100µm contacts 1:1
AZ®421K / 9 min immersion
-15% dose (2550mJ)
-15% develop (459sec)
+2°C (112°C)
-10% dose (2700mJ)
-10% develop (486sec)
+2°C (112°C)
+10% dose (3300mJ)
+10% develop (594sec)
-2°C (108°C)
+15% dose (3450mJ)
+15% develop (621sec)
-2°C (108°C)
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Process Latitude Summary on UT Titan-300
CD Measurement (um)
160
150
140
130
Top
120
Middle
110
Bottom
100
90
80
2450
2650
Pre-Bake: 85°C / 120sec / 0.5mm prox.
SB: 108 - 112°C / 10-min / 0.1mm prox
Ultratech Titan-300 / Focus @ -35µm
Mask 100um contacts 1:1
AZ®421K – 459 sec to 621 sec immersion
2850
3050
3250
3450
Exposure Dose (mJ)
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
- 75µm FT Process
Baseline Process Conditions:
▶
▶
▶
▶
▶
AZ® 50XT
– ~75µm FT
85°C / 2-min pre-bake w/0.5mm proximity
110°C / 10-minute softbake w/0.1mm proximity
Exposure on Ultratech® Saturn
– -35µm Focus
– Mask: 100µm vias 1:1
Develop in AZ® 421K Developer
– 9-minute immersion / automated wet bench
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Performance on Copper
Lithography Performance
2400 mJ/cm2
2500 mJ/cm2
2600 mJ/cm2
2700 mJ/cm2
2800 mJ/cm2
2900 mJ/cm2
3000 mJ/cm2
3100 mJ/cm2
3200 mJ/cm2
3300 mJ/cm2
Ultratech-Saturn; FT = 75µm; CD = 100µm Contact hole
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Photoresist
Performance on Copper
Plating Performance
2400 mJ/cm2
2500 mJ/cm2
2600 mJ/cm2
2700 mJ/cm2
2800 mJ/cm2
2900 mJ/cm2
3000 mJ/cm2
3100 mJ/cm2
3200 mJ/cm2
3300 mJ/cm2
Ultratech-Saturn; FT = 75µm; CD = 100µm C/H
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.
AZ® 50XT Offers
FEATURES
▶ Excellent coating
characteristics
▶ Excellent sidewall profiles
▶ Compatible with a wide
variety of substrates
▶ Sensitive to g, h, and i-line
wavelengths
▶ Stable
▶ Positive tone
BENEFITS
▶ Higher yields, reduced
rework
▶ Straight plating profiles
▶ Works on Cu, Si, and Au
substrates. Meets any
application
▶ Good photospeed. Works
with standard steppers and
contact aligners
▶ Wider process window
▶ Compatible with existing
equipment and processes
AZ, the AZ logo, BARLi, Aquatar, nLOF, Kwik Strip, Klebosol, and Spinfil are
registered trademarks and AX, DX, HERB, HiR, MiR, NCD, PLP, Signiflow,
SWG, and TARP are trademarks of AZ Electronic Materials.