Author Nanoparticle Base fluid Temperature Particle size Eastman Cu EG Particle vol fraction 0.01-0.56 Hong et al. Fe EG 0.1-0.55 Hemmat Esfe et al. [94] Cu -TiO2 Water -EG 0.1–2 vol% Chen et al. [53] MWCNT -Fe2O3 Water 0.05–2 vol% Kumar et al. (2016) nanoparticles Cu-Zn Vegetable oil. Paraffin oil and SAE oil Cu Water, EG 30,40, 50 80 0.1 Cu Water, EG 30,40, 50 80 0.5 Cu Water, EG 30,40, 50 80 1 Cu Water, EG 30,40, 50 80 2 Cu Water, EG 30,40, 50 80 3 Findings Thermal conductivity enhance ment 41% Thermal conductivity enhance ment 18% Thermal conductivity enhance ment 24% Aluminium Aluminium Aluminium Water , EG 30,40, 50 80 0.1 Water , EG 30,40, 50 80 0.5 Water , EG 30,40, 50 80 1 Thermal conductivity enhance ment 28% Thermal Conductivity: Hybrid nanofluids with vegetable oil as base fluids shows 53% better results as compared to paraffin oil and SAE oil. Thermal conductivity enhancement for water is 3.8,5.3. 5.5 and for EG is 6, 5.8, 8 Thermal conductivity enhancement for water is 9.5, 10.5,.13 and for EG is 7, 13, 15 Thermal conductivity enhancement for water is 15.5, 18,.19 and for EG is 18, 21.5, 23 Thermal conductivity enhancement for water is 23, 24, 27 and for EG is 23.5, 32, 30 Thermal conductivity enhancement for water is 25, 28, 33 and for EG is 29, 33, 36 Thermal conductivity enhancement for water is 2.9, 3.2, 4 and for EG is 4.5, 5.5, 4 Thermal conductivity enhancement for water is 10. 9, 12 and for EG is 7.5, 9.5, 14 Thermal conductivity enhancement for water is 11, 16, 18.5 and for EG is 15.5, 17, 20 Aluminium Water , EG 30,40, 50 80 2 Water , EG 30,40, 50 80 3 Al2O3 Water , EG 30,40, 50 150 0.5 Al2O3 Water , EG 30,40, 50 150 1 Al2O3 Water , EG 30,40, 50 150 2 Al2O3 Water , EG 30,40, 50 150 3 Al2O3 EG 20-50 0.5-3 THW CuO CuO Cu Trinh(2017) Al Sundar(2013) Fe3O4 Water EG EG EG Water 20-50 20-50 20-50 20-50 20-60 0.5-3 0.5-3 0.5-3 0.5-3 0.2 THW THW THW Sundar(2014) MWCNTFe3O4 Water 20-60 0.1 Sundar(2014) MWCNTFe3O4 Water 20-60 0.3 Aluminium Patel(2010) Thermal conductivity enhancement for water 18.5, 21.5, 24 and for EG is 17.5, 21.5, 23 Thermal conductivity enhancement for water 21, 27, 28 and for EG is 21.5, 24, 27 Thermal conductivity enhancement for water 2.5, 3, 4.3 and for EG is 2.5, 3.3, 4.3 Thermal conductivity enhancement for water 4, 3.5, 4 and for EG is 3.7, 4.6, 5.5 Thermal conductivity enhancement for water 4.5, 6.5, 7 and for EG is 8, 7, 8 Thermal conductivity enhancement for water 9, 9.5, 10.5 and for EG is 9.5, 10.3, 11 Thermal conductivity enhancement for waterAl2O3 nanofluid is 1432 3-16.5 9-25 8-36 4-27 0.65240.7619 W/(m.K) 0.67340.7891 W/(m.K) 0.68560.8389 W/(m.K) Sundar(2016) ND-Fe3O4 Water 20-60 0.1 Sundar(2016) ND-Fe3O4 Water 20-60 0.2 Al2O3MWCNT Water (Al2O3 eCu Water 2and 10 wt% 2 vol% Al2O3 Water 2 vol% MWCNTeFe3O4 Water/EG 20/60 0.3 Vol% (Suresh 2011) 0.6345-0.7177 W/(m.K) 0.6571-0.769 W/(m.K) 4 and 13 % enhance ment 12.11% enhance ment 7.56% enhance ment 13.88% higher thermal conductivity was obtained for 0.3% nanofluid compared to water at 20 C. Similarly 28.46% higher thermal conductivity was obtained by 0.3% nanofluid compared to the thermal conductivity of base fluid at 60 C Author Nanoparticl e Base fluid Temperatur e Particle size Jha et al.(2008 ) MWCNT Wate r 26.5 °C Jha et al.(2008 ) MWCNT EG 26.5 °C O.D: 2530 nm, I.D: 5-8 nm O.D: 2530 nm, I.D: 5-8 nm CuMWCNT EG CuMWCNT DI CuMWCNT DI CuMWCNT EG Cu water Cu water Eastma n et al Saterlie et al.(2011 ) Cu: 3-5 nm, MWCN T: 20-30 nm Cu: 3-5 nm, MWCN T: 20-30 nm Cu: 3-5 nm, MWCN T: 20-30 nm Cu: 3-5 nm, MWCN T: 20-30 nm 120-200 nm Surfactant Stability 0.04% Thermal conductivit y enhanceme nt 14.8 % 0.04% 7.3% Functionalise d with HNO3 0.8 % 34% Settling stareted as grown after few hrs but settles slowly as compared to EG Stable after 20 days Functionalise d with HNO3 1% 12.7 % Stable after 20 days Functionalise d with HNO3 0.03 % 35.3 % Stable after 20 days Functionalise d with HNO3 0.03 % 10.1% Stable after 20 days 0.3 % 40% 0.55%,1 % 22% enhanced from 0.6 to 0.73 W/(m.K) Oleic acid caped Cu and SDBS as ispersant Particle vol fraction Settled as grown after few hrs Particle settled too rapidly during measureme nt and clogged the set up at 1 vol% and no thermal conductivit y is obtained Autho r Nanopartic le Bas e flui d Author Nanoparti cle Base fluid Saterlie et al.(2011) Cu water Farbod et al.(2014) MWCNT Water Vvv7 Bandyopa dhyaya et al.(2001) SWCNT Water Room temp Jung et al.(2011) Fedele et al. Garg et al.(2009) Al2O3 WATER TiO2 MWCNT Distilled water WATER Yang and Liu et al.(2011) SiO2 water Temperatu re Temperatu re Particl e size Surfacta nt Particl e vol fractio n Metho d Method Partic le size Surfactant Particle vol fraction 120200 nm CTAB acid caped Cu and SDBS as ispersant 0.55%, 1% Functionalized with sulphuric acid and nitric acid GA,SDS,CTAC,DT AB,PEO 300 nm PVA 0.05 wt% Thermal Stabilit conductivity y enhanceme nt Two-step Ultrasonica tion Acetic acid 30 C Gum Arabic Trimethoxysilane Ultrasonica tion Thermal conductivit y enhanceme nt 48% enhanced from 0.6 to 0.89 W/(m.K) Stability Particle are well dispersed allowing for successful thermal cond. measurements Stable for 80 days Gum Arabic was found to be most stable one and is found stable for 3 months Satble for 1 month Stable suspension for 35 days Stable for more than 1 month and no visible sign of sedimentation Stable for 12 months.Pure nanofluid sedimented within few days Author Nanoparticle Base fluid Anoop et al. Al2O3 Water Temperature Particle size Surfactant Particle vol fraction Ph control : 6.5(1 wt %) 1-6 wt % Method Thermal conductivity enhancement Stability Several weeks of stability was achieved 6.0 (2 wt%) 5.5 (4 wt%) 5.0 (6 wt%) MWCNT–Fe3O4 Distilled water NanoSperse AQ GO/Fe3O4 water Tannic acid Baghbanzadeh et al.(2012) Silica nanosphere/ MWCNT Distilled wate SDBS Byrne et al.(2012) CuO DI Water CTAB Phuoc and massoudi et al Fe2O3 DI-water PVP Meng et al CNTs Glycol nil Robertis et al Cu EG PVP Kumaresen and velraj et al CNTs DIWaterEG SDBS Sundar et al.(2014) No particle sedimentation is observed up to 60 days Highly stable for 60 days 0.005, 0.01, 0.1 vol% 1-4 vol% 0.5 to 4% 0.25 to 1 vol% Stable nanofluids were observed for duration up to 1 month..MWCNT is stabilized with silicate Nanofluid was found stable for seven days Nanofluids were stable for two weeks Nanofluids could remain stable for more than two months without sedimentation No sedimentation or agglomeration even after 48 hours. The particles settlement was about 28.5% in 50 days. Nanofluids were stable after 3 months Kathivaran et al Cu polycrystalline DI-water SDS O.25, 0.5 and 1 wt% Nanoparticles were dispersed in water evenly even after 10 hours
