TOWARDS A SUSTAINABLE ELECTROMAGNETIC ENVIRONMENT
THE EMC TECHNOLOGY ROADMAP
April 2006
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CORE TEAM MEMBERS
Prof. Dr. Ir. Ing. Frank Leferink, Thales
Frank.Leferink@nl.thalesgroup.com
Ir. Marcel van Doorn, Philips
Marcel.van.Doorn@philips.com
Dr. Amaury Soubeyran, EADS
Amaury.Soubeyran@eads.net
Prof. dr. Christos Christopoulos, Univ. of Nottingham
Christos.Christopoulos@nottingham.ac.uk
Dr. Marco Leone, Siemens
Marco.Leone@siemens.com
Ir. Chris van den Dries, Dutch EMC-ESD Associaton
cdr@fme.nl
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TABLE OF CONTENTS
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RATIONALE AND OBJECTIVES
HISTORY
VISION: TRENDS & NEEDS
STRATEGIC RESEARCH AGENDA
NEXT STEPS
STAKEHOLDERS LIST
PREFACE
Representatives from the electronics industry together with the academic and
research communities have developed Vision 2020: The EMC Technology Roadmap.
This document charts a future direction for EMC technology that can meet the
demands of tomorrow’s electronics industry.
The roadmap serves as the starting point for a future focused dialogue among
industry leaders, researchers and governments. Continued collaboration – including
periodic updating of the vision and roadmap – will be key to realizing the vision on the
EMC technology domain.
Electromagnetic Compatibility (EMC)
is the ability of a device, equipment or system to function
satisfactorily in its electromagnetic environment without
introducing intolerable electromagnetic disturbances to
anything in that environment.
The prevention of known adverse effects on health caused
by human exposure to electromagnetic fields (EMF) is part
of the EMC technology domain (from 0 Hz to 300 GHz).
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RATIONALE AND OBJECTIVES
Electromagnetic Compatibility (EMC) underpins almost all engineering activities and
influences our daily life more than ever in a time that the number of EMC problems is
rapidly increasing. In the coming years the electromagnetic environment will
drastically change. A high-speed digital lifestyle and a widespread proliferation of
(wireless) devices will, without well-timed and properly informed action, result in an
increase of interference problems in homes, vehicles, hospitals, factories, aircrafts,
etc. In addition to this ‘natural’ environment, intentional electromagnetic threats are
also now emerging to which unprotected systems will be vulnerable. Without a
coordinated development program in which all stakeholders are involved, this
increasingly complex electromagnetic environment cannot be controlled anymore and
will lead to more and more interference problems and safety hazards, possibly
aggravated by intentional malicious aggressions.
Europe’s goal to achieve sustainable growth, competitiveness, and security can only be
achieved through a better quality and cooperation of the entire EMC research and
innovation community. This does not only include the capacity to create new EMC
knowledge, but also an understanding of how the EMC knowledge might be used,
applied and implemented by industry. Competitive advantage will also come from the
existence of an effective know-how transfer from science to useful application in
industry. In addition to that, the public fear of electromagnetic fields introduces
often non-technical issues where a collaborative approach between researchers from
different areas, including medical and psychological experts, is needed.
However, because EMC issues arise everywhere, in any product and environment,
research and engineering activities are fragmented. This fragmentation poses a big
disadvantage, that is EMC research and innovation does not receive sufficiently
coherent attention to establish a determined push towards lower costs and higher
social and economic benefits.
In our view, long-term fundamental work of strategic nature in EMC is required now
to support emerging technologies and prevent new threats. A European Technology
Network on Sustainable Electromagnetic Environments (ETN-SEE) has been
established to facilitate, coordinate, and accelerate the development and acceptance
of technologies that will create in the future an electromagnetic friendly and secure
society.
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OBJECTIVES ETN-SEE
Establish a clear strategic vision on EMC
Strengthen EMC innovation
Enhance international cooperation
Improve cooperation between industry and
research institutes
Alleviate fragmentation in research
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HISTORY
September 2004:
At the EMC Europe conference in Eindhoven industry experts and academics
decided to establish an Industry Forum on EMC, in order to include EMC as a
strategic technology domain in the technology programs of the EU.
February 2005:
At the EMC conference in Zurich the Industry Forum decided to go for a
European Technology Platform Sustainable Electromagnetic Environments ETPSEE (EMC including EMF). Publication of the document “Towards an EMC
Technology Platform” (47 pages).
March/May 2005:
Presentation of the list of stakeholders and summary vision document to the
EU DG representatives. A formal application letter was sent to the European
Commissioners with the request to establish an ETP on EMC & EMF.
July 2005:
Response to the application letter by Viviane Reding, member of the European
Commission, to further analyse the best approach for developing a research
agenda in the field of EMC, including EMF.
December 2005:
Renaming of the envisaged ETP-SEE to European Technology Network on
Sustainable Electromagnetic Environments (ETN-SEE), in line with the advice
of the European Commission to set-up an ETN to create a broad network and
foster links with ETPs, acknowledge the importance of the subjects.
February 2006:
Roadmap workshop with the ETN-SEE core team in Brussels. During this
workshop an EMC research topics questionnaire for the stakeholders was
prepared.
March 2006:
Strategic Research Agenda discussion with stakeholders during the COST 286
meeting in Barcelona. Input and feedback on the research topics questionnaire
was discussed. Working groups to workout the EMC research proposals were
defined.
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EXAMPLES OF ELECTROMAGNETIC INTERFERENCE
Airbags activated by mobile telephones resulted in the recall of millions of cars.
Pacemakers disturbed by security ports.
Motor management system stopped a car unintentionally due to high field
strengths.
Wheelchair starts rolling when using a mobile phone.
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VISION: TRENDS & NEEDS
The developers of the vision on the EMC technology domain identified several technological,
economical, and social trends that will impose new demands on EMC technology.
Semiconductors technology
The main building blocks of an electronic system
are the Integrated Circuits (ICs). According to
the International Technology Roadmap for
Semiconductors 2004, the communication speed
between the chips is increasing and is projected to
be 29 GHz with an on-chip clock of 33 GHz in the
year 2015. To reach these higher speeds ICs are
using increasingly lower voltages, e.g. 0.8 V in 2015.
This means that their logic thresholds are lower,
the noise margin is going down and they are
becoming more vulnerable to interference.
Radiated emissions will increase because of faster
switching edges and hence more energy in a
harmonic spectrum that extends to higher
frequencies. Signal integrity problems will also
increase due to the continuing reduction in rise
times and the increase in clock frequencies. Over
the coming decade the number and variety of
potential disturbance sources and victims is set to
increase exponentially. This will lead to an
astronomical increase in the risk of interference.
The question of how to control interference is
becoming a key issue in system design.
The Connected Home
Explosion of wireless devices
The number of users of mobile systems is growing
exponentially. The wireless and wired spectrum
will get overcrowded with applications such as
GSM (Global System for Mobile communication),
UMTS (Universal Mobile Telephone system),
BlueTooth, WLAN (Wireless Local Area Network),
UWB (Ultra Wide Band), ADSL (Asymmetric
Digital Subscriber Line, and PLC (Power Line
Communication). Legislation by itself (e.g.
spectrum trading) will not be able to cope with
assigning the extra channels and capacity needed.
Technological improvements will be key to a
sustained and compatible diversification and
parallel operation of communication systems.
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•
•
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VISION STATEMENTS
The coming 15 years ‘designing
for EMC compliance’ will stay
on the critical path of the
product creation process.
In the coming years EMC/SI
modeling & simulations at subsystem level will become
essential.
EMC expert systems will close
the gap between complete
system and sub-system
simulations.
Information & Communication Technology
A high-speed digital lifestyle is emerging. By 2010
all products are expected to have digital
components incorporated. Time-to-market and
product lifecycles are becoming increasingly
shorter. EMC often lies on the critical path of the
product creation process. The risk of re-design
has to be reduced and design efficiency has to be
improved.
Future generations of sensor systems (‘smart
dust’) will rely on wireless systems, because of
fragility and impracticality of fibre-optic-based
channels. Such systems are characterized by large
numbers of highly sensitive and low-power
sensor/actuator pairs. Both the integration of the
sensor arrays in an existing EM ambient, as well as
telemetry aspects will require the associated EMC
problem to be defined and tackled from the
outset.
Transport
Cars, planes, vessels, and trains are more and more
controlled by sensitive electronic systems, which
make these transportation systems sensitive to
electromagnetic interferences. The electronics
inside the transportation systems are causing
interference with radio communication systems.
New transport applications with an EMC impact
are: automatic driving with fail safe technology,
radar technology for sensing obstacles and
objects, intelligent traffic/weather sensors,
wireless networking technology in and between
cars, etc.
Many systems, especially airplanes, are limited
screened against electromagnetic fields due to the
replacement of metal by composite materials,
resulting in more and more vulnerable systems.
Brain-implants
Human Exposure to EM Fields (EMF)
There is growing concern about the potentially
harmful effects on human beings of exposure to
electromagnetic fields (EMF). Standardization
bodies in Europe – and worldwide – are developing
standards to limit EMF exposure for humans. The
goal is to prevent any known adverse effects on
health caused by exposure to electromagnetic
fields in the frequency range from 0 Hz to 300
GHz. Legislation requires compliance with the EMF
standards. To comply with the new EMF standards,
it is necessary to develop an EMF competence.
Future applications in the fields of wireless
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connectivity, wearable electronics, on/in-body
sensors, and healthcare add further weight to the
EMF issue.
Intentional EM interference (terrorism)
Intentional and/or high-power electromagnetic
interference is increasingly seen as a potential
weapon of large scale malfunction and terrorism. A
proper understanding of the threats and how to
mitigate fall-out in a variety of critical systems
and components is essential to tackling the
problem head-on, and must be addressed at supranational and governmental level. The fact that
targeted systems are often situated in consumer
rather than military markets, makes this a focus
issue for the civilian sector as well. A recent
example of intentional EMI is a small source
capable to disturb or even destroy RFID devices.
EMC standardization
New EMC standards have to be developed for
products with high clock frequencies, digital
modulation techniques and wired & wireless
communication devices.
There are enough changes taking place in the
electrical environment to warrant reassessment of
the present limits, such as digital services,
consumer awareness, and the increase in amount of
electronic equipment. We need to develop a
database of defined protection levels for radio
services that can be used as a basis for deriving
future EMC limits.
The current EMC test methods have their origins
in analogue technology and the limits are based on
the protection of analogue radio and TV services
below 1 GHz. Digital radio services have different
tolerances to broadband and narrow band
interference than analogue radio services. Urgent
investigations are needed into what the effect of
this will be in terms of interference limits and
test methods for digital radio/TV products.
Resolving the digital EMC problem is going to be a
major challenge in the coming decade.
EMC of networks and installations is a missing link
in the current mass of EMC standards. Many wired
home networks use the existing power or
telephone wiring and – without co-ordination – this
will lead to EMC problems.
Ever since the publication of the first European
Directive 89/336/EEC on EMC of 03 May 1989
(enforced 1 Jan 1996), the interest of product
committees in standards and their application has
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been growing. Several international standards
related to EMC, often with European participants
or organizers as key members have been, or are in
the process of being developed. Progress has often
been slowed by the shortages in concerted funded
efforts related to some more fundamental
research on specific test facilities and methods.
Integral design approach
Increasingly dense EM environment
Increasingly, co-existence and compatibility of
electrical and electronic systems is an issue of
complex and dynamically changing environment of
partially known or specified sources of radiation.
Therefore, traditional approaches based on (over)
simplified models and isolated operation and
performance are no longer adequate in today’s
increasingly dense EM environment. An integral
systems approach rooted in sound electromagnetic
principles and design and analysis techniques, as
offered by EMC technology, offers the best
guarantees for sustained benign electronic
developments.
EMC as enabling technology
EMC is inherently a question of EM interactions
within complex environments and/or systems. As
an individual discipline, EMC studies EM
interactions, both at the fundamental and applied
level. EMC must therefore be seen as an enabling
technology for continued improvement and
successes in electronic technologies.
EMC COSTS
The EMC related costs constitute 1 – 5% of the sales price of electrical and
electronic goods. With a European sales volume in electronics of around 500
Billion euro, the EMC financial impact is in the range of 5 to 25 Billion euro a
year.
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STRATEGIC RESEARCH AGENDA
Achieving the vision will require strategies for investing in EMC research and
development. Four main EMC technology themes emerged from the vision and
roadmapping process:
Theme 1:
EMC Methodologies
Theme 2:
EMC Standardization / Control
Theme 3:
EM Safety / Security
Theme 4:
EM Modeling & Simulation
These strategies are supported by a series of high-priority activities that will
directly lead to their fulfillment. These activities were judged by the stakeholders
to be achievable in the short (less than three years), medium (three to ten years) to
long-term (more than ten years). The tables on the next pages show the strategic
research agenda in more detail. For each theme the topics that were ranked with the
highest priority have been marked bold.
EMC TECHNOLOGY ROADMAP FRAMEWORK
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EMC TECHNOLOGY DEVELOPMENT STRATEGIES
Develop new methods & tools to decrease emission and increase
immunity of components, and (sub-)systems.
Control the future EM environment by legislation &
standardization: new test methods, frequency-bands, limits, …
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No
EMC RESEARCH TOPICS
TIMEFRAME*
S
M
L
x
x
x
x
x
x
x
x
x
x
x
x
x
x
THEME I:
EMC METHODOLOGIES
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2
3
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Materials / meta-materials
- Innovative materials for EMC applications
- Incl. nanotechnology, shielding, and
filtering
Signal- & Power Integrity
EMC impact of new technologies
- Communication technologies
- Automotive hybrid drives
- Power electronics drives
- Sensor technologies
Interconnects
- Wireless (antenna’s, co-existence, …)
- Wired (PLC, High-Speed buses, …)
EMC of semiconductor devices
Transients protection (ESD, lightning)
*
S = Short-term (< 3 years), M = Medium-term (3 to 10 years), L = Long-term (>
10 years)
No
EMC RESEARCH TOPICS
TIMEFRAME*
S
M
L
x
x
x
x
x
x
x
THEME II:
EMC STANDARDIZATION
/ CONTROL
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New test methods
- Test methods above 1 GHz: RVC, TEM,
- Statistical vs. deterministic data
evaluation
- Diagnostic methods
- IC/module testing for system
characterization
- Methodologies for translation of EMC
requirements between various (sub)-system
levels
- In-situ testing (large systems)
- Measurement / compliance uncertainty
- Fast emission measurements in time domain
Unification of standards
- Multimedia, Defense, Automotive,
Aerospace, Electro-medical devices
EM spectrum management
- Intentional and unintentional radiators
x
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No
EMC RESEARCH TOPICS
TIMEFRAME*
S
M
x
x
x
x
x
x
L
THEME III:
EM SAFETY / SECURITY
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No
EMF: Human exposure to EM fields
- Exposure assessment and mitigation
techniques
Product Safety (EMC for functional safety)
- Risk based EMC
IEMI: Intentional Electromagnetic
Interference
EMC RESEARCH TOPICS
TIMEFRAME*
S
M
L
x
x
x
x
x
x
x
x
x
THEME IV:
EM MODELING &
SIMULATION
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New computational techniques
- Hybrid techniques for multi-scale
problems (FDTD, TLM, PO, …)
- Multidisciplinary techniques for concurrent
engineering (EMC, thermal, mechanical, …)
Modeling of novel materials
Non-deterministic modeling
Expert systems / design tools
- For components, board, cables/connectors,
and systems
- EMC/SI/PI verification, analysis, synthesis
Certification by simulation
EM dosimetry
x
x
x
x
BENEFITS FROM EMC RESEARCH & DEVELOPMENT
Predictable development time; prevention of a delayed market introduction
due to EMC/EMF problems.
Risk reduction in new technologies/applications/business.
Reduction of costly interference reduction techniques.
Balance between quality and cost price of a product.
Fewer complaints from the field.
Compliance with the statutory international standards on EMC and EMF.
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Can these aims be achieved within existing Technology Platforms?
Several existing Technology Platforms (TPs) have an interest in EMC, EMF and associated
topics. There is no doubt that some EMC related work has been done over the years as
part of ongoing work in other thematic areas. What has been missing however is a
coordinated effort to address generic technology issues. There are several examples:
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The general development of modeling and simulation techniques as part of a concurrent design environment. It is not sensible to believe that such a major
development can be accomplished piece meal by addressing specific sectoral
requirements when a generic approach would result to more powerful tools of general
applicability. This however must be done in close association with industry so that
tools are developed that are relevant to and usable by industry.
The development and harmonization of standards can best be done within the
context of sound science and a general outlook encompassing the present and future
needs of a multitude of users. It is a truism to say that one industry’s signals are
noise and interference for another.
Novelty and innovation can best be fostered when the resources and the vision of
dedicated professionals are merged together to push forward major high-risk
research programs. We mention in particular, the use of simulation for compliance
assessment, a statistical view of EMC, the treatment of complexity in practical
systems etc.
There is considerable fragmentation of research with the current way of doing
things. Is there sufficient interaction between practitioners in EMC, Signal Integrity
and Communications to ensure that the linkages, compromises and optimization
between different technologies (not forgetting the human factor) are all fully
considered in a design? We believe that a long-term coordinated research effort is
required to address these issues, which are central to the development and
acceptance of new technologies, and products, where compatibility, inter-operability,
co-existence and multi-functionality will be paramount.
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NEXT STEPS
The EMC Technology Roadmap outlines a view of where the electronics industry is
today, a vision of where its stakeholders want to go tomorrow, and strategies on how to
get there. It provides guidance to government, industry, and academia on the direction
of future activities.
Working Groups are established for each strategic research topic. The task of the
Working Groups is to create high-level brief project descriptions for their specific
research topics. Through the definition of a strategic research agenda they will
influence policy in the Seventh Framework Program (FP7) and hence, in due course, lead
to the development of specific projects, which will be submitted through normal
channels for EU funding.
The European Technology Network on Sustainable Electromagnetic Environments (ETNSEE) will seek to work with and not replace the work of existing Technology Platforms
(TPs). Many areas of concern mentioned in this document represent “horizontal issues”
and therefore can be best addressed by the new ETN-SEE coordinating and focusing
the work in the relevant area of several TPs. In some cases, where no existing TPs have
a significant activity, the ETN-SEE will play a more independent role. The objective in
all cases will be to address all issues which impact on the electromagnetic design of
complex systems.
Links between EMC technology themes
and European Technology Platforms
European Technology Platforms:
ACARE
ARTEMIS
ECTP
EMobility
ENIAC
ERRAC
ERTRAC
ESTP
NEM
Advisory Council for Aeronautics Research in Europe
Embedded Systems
The European Construction Technology Platform
The Mobile and Wireless Communications Technology Platform
Nanoelectronics Initiative Advisory Council
European Rail Research Advisory Council
European Road Transport Research Advisory Council
The European Space Technology Platform
European Initiative on NETWORKED and ELECTRONIC MEDIA
……..
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STAKEHOLDERS LIST
The following companies and organizations actively participated in the development of
the EMC technology roadmap:
National Physical Laboratory, England
National Centre for Scientific Research
“Democritos”, Greece
EADS, France
University of Rome ‘La Sapienza’, Italy
Cherry Clough Consultants, England
NPL, England
Centro Ricerche Fiat, Italy
EMC Srl, Italy
Swedish Defence Research Agency,
FOI, Sweden
LAAS-CNRS, France
University of Liege, Belgium
Philips, Netherlands
IEEA, France
Renault, France
IETR, France
Technische Universiteit Eindhoven
Bolls Radgivning, Denmark
Thales, France
Flomerics, France
CERPEM, France
Electronics Cell, Belgium
Politecnico di Torino, Italy
University of Fiorentina, Italy
Qinetiq, England
Katholieke Hogeschool BruggeOostende, Belgium
University of Nottingham
MBDA, United Kingdom
Wavecontrol, Spain
SIQ, Slovenia
Mier Comunicaciones, S.A., Spain
Montena emc sa, Switzerland
Ficosa International, S.A., Spain
University of Lille, France
Sharp Electronica, Espana, Spain
Laboratoire National de Métrologie
Vereniging FME-CWM, Netherlands
University of Rennes, INSA, France
ST Microelectronics, France
Groupe President Electronics, Spain
University of L’Aquila, Italy
Selenia Communications SpA, Italy
Audi AG, Germany
Hrvatska Elektropriveda d.d., Croatia
University of Hannover, Germany
CE-test, Netherlands
BAESYSTEMS Avionics Ltd., England
INRETS, France
TNO Prevention and Care, Netherlands
QinetiQ, England
N.V. Nederlandsche Apparatenfabriek
“Nedap”, Netherlands
Dutch Amateur Radio Organization,
VERON, Netherlands
RadioCAD Ltd., England
Bolls Radgivning, Denmark
Fraunhofer-Izm, Germany
Technical University of Lodz, Poland
Airbus Deutschland GmbH, Germany
EADS, Germany
CISPR, England
Ministry of Defence, Royal Navy,
Netherlands
Slovak University of Technology,
Slovakia
Infoplan Mérnökiroda Kft., Hungary
Stork Fokker AESP B.V., Netherlands
KPN Mobile, Netherlands
ARC Seibersdorf Research GmbH,
Austria
INDIBA S.A., Spain
University of Twente, Netherlands
Thales, Netherlands
Siemens A.G. Germany
BAE Systems, England
Ministry of Defence, France
National Institute of
Telecommunications, Poland
Siemens VDO Automotive, Italy
IRSEEM, France
INTESPACE, France
University of Fiorentina, Italy
CST, France
Polish Office of Telecommunications
and Post Regulation, Poland
Ecole Polytechnique Fédérale de
Lausanne, Switzerland
ONERA, France
ESEO, France
ESAOTE, Italy
Eurocopter, England
ATMEL, France
University of Split, Croatia
EXENDIS, Netherlands
EPF Lausanne, Switzerland
PROTECTA Co. Ltd., Hungary
Ramon Llull University, Spain
Gps microSAT S.A., Spain
Skydata Engineering s.r.l., Italy
Zuken, Germany
AA / SSEA, Italy
MIRA, England
AD TELECOM, Spain
Aristotle University of Thessaloniki,
Greece
CE SEAT, S.A., Spain
SIEMENS-CNX, Italy
Institute of Logistics and Warehousing,
Poland
Technical University of Catalonia, Spain
Wroclaw University of Technology,
Poland
Ministry of Defense – United Kingdom,
England
Nederlands Meetinstituut, Netherlands
Université Paul Cézanne d’AIX –
MARSEILLE, France
Eindhoven University of Technology,
Netherlands
Galileo Avionica, Italy
ETH, Switzerland
Royal Philips Electronics, Netherlands
Budapest University of Technology and
Economics, Hungary
NLR, Netherlands
TÜV Product Service Ltd, England
Swedish National Testing and Research
Institute, Sweden
Nederlandse EMC-ESD Vereniging,
Netherlands
The University of York, United Kingdom
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CONTACT
For more information, contact:
European Technology Network on Sustainable Electromagnetic
Environments (EMC and EMF)
Website: http://www.emc-esd.nl/ (link: ETN-SEE)
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