NANYA ROAD,MUGANG ZHAOQING
CITY GUANGDONG CHINA.
TEL:86-758-2875541,2870651,2877464,2876185,2877017
FAX:86-758-2878014
LEDTECH ELECTRONICS CORP.
Http://www.ledtech.com.tw
SPECIFICATION
PART NO. : LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
ATTENTION
OBSERVE PRECAUTION
FOR HANDLING
ELECTRO STATIC
SENSITIVE
DEVICES
Approved by
Checked by
Prepared by
Fang-Po
Chih_liang
Carlos_Chen
LP3HN3-ST-UDR3-S21
3W HIGH POWER LED
MODIFY RECORD
TAKE EFFECT DATE
MODIFY ISSUES
REMARKS
LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
Package Dimensions
8
1.5
5.6
5.6
6.1
10.5
14.5
Notes:
1.All dimensions are in mm.
2.Tolerance is +/-0.6mm unless otherwise noted.
Description
LED Chip
Part NO.
LP3HNR-ST-UDR3-S21
Material
Color Coordinates
InGaN/Metal Alloy
Warm White
Lens Color
Water Clear
VER.: 01 Date: 2010/12/17
Page: 1/7
LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
Absolute Maximum Ratings at Ta=25℃：
Parameter
Rating
Unit
Power Dissipation
2975
mW
LED Junction Temperature
120
℃
5
V
D.C. Forward Current
700
mA
Pulsed Forward Current；tp≦100µs,Duty cycle=0.005)*1
1400
mA
Operating Temperature Range
-40 to +75
℃
Storage Temperature Range
-40 to +100
℃
Reverse Voltage
Soldering Temperature
Electric Static Discharge Threshold (HBM)
Reflow Soldering: 260℃ for 10 sec.
Hand Soldering: 350℃ for 3 sec.
6000
V
Notes:
、Proper current derating must be observed to maintain junction temperature below the maximum .
2、All products not sensitive to ESD damage(6000 Volts by HBM condition).
3、Be careful with a powered up current limited power supply, because of current spikes during power up
1
and/or connection. Best practice is to connect the LED then turn up the voltage gradually. People building
their own power supplies should design for minimum current spikes during power up and connection.
4
、For best results the customer needs to provide proper control of the thermal path ,protect against electrical
overstress conditions, and ensure that Ledtech emitters are properly attached to the mcpcb/heat sink.
、It is strongly recommended that the temperature of lead does not exceed 55℃.
6、It is strongly recommended to apply on electrically isolated heat conducting film between the slug and contact
5
surfaces.
VER.: 01 Date: 2010/12/17
Page: 2/7
LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
Electrical and Optical Characteristics：
Parameter
Symbol
Condition
Values
Min.
FULL
Luminous Flux
Typ.
Max.
120
Rank T1
72
83
Rank T2
83
96
96
113
Rank U2
113
134
Rank V1
134
161
Rank V2
161
195
Rank V01
2.7
--
3.0
Rank V02
3.0
--
3.25
3.25
--
3.5
Rank V04
3.5
--
3.75
Rank V05
3.75
--
4.0
Rank V06
4.0
Φv
Rank U1
IF=700mA
Rank V03
Forward voltage
VF
Correlated Colour
Temperature
IF=700mA
4.25
IF=700mA
2700
X
IF=700mA
0.4578
CIE Chromaticity
Coordinates: Y Axis
Y
IF=700mA
0.4101
Reverse Current
IR
IF=700mA
2θ1/2
IF=700mA
RθJ-C
IF=700mA
Coordinates: X Axis
Viewing angle at 50% IV
Thermal Resistance Junction to Case
lm
V
CCT
CIE Chromaticity
Units
----
K
--
50
μA
120
--
Deg.
15
--
℃/W
Notes：
：
1. The datas tested by IS tester.
2. Customer’s special requirements are also welcome.
VER.: 01 Date: 2010/12/17
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LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
Typical Electrical/Optical Characteristic Curves
(25℃ Ambient Temperature Unless Otherwise Noted)
1.2
Relative Response
1.0
0.8
0.6
0.4
0.2
0
300
400
500
600
700
800
W avelength (nm)
Fig.1 WHITE LED Spectrum VS. WAVELENGTH
125
Luminous Flux(lm)
Forward Current IF(mA)
700
600
500
400
100
75
50
300
25
200
0
2.8
3.0
3.2
3.4
3.6
Forward Voltage (V)
100
3.8
Forward Current VS. Applied Voltage
200
300 400
Forward Current VS. Luminous Flux
0°
10°
20°
30°
400
300
200 R
R
R
R
10
0
700
Forward Current (mA)
500
Forward Current IF(mA)
500 600
40°
J-A
J-A
J-A
J-A
1.0
℃/W
℃/W
℃/W
℃/W
60
50
40
30
25
50°
0.9
60°
0.8
50
75
Temperature (
℃)
100
125
Ambient Temperature VS. Forward Current
70°
80°
90°
0.7
0.5
0.3
0.1
0.2
0.4
0.6
Radiation Diagram
VER.: 01 Date: 2010/12/17
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LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
Chromaticity Coordinates Specifications for Bin Grading:
COLOR RANKS (IF=350mA.Ta=25
℃)
BIN
8A
8B
8C
8D
RANK
X
0.4345
0.4430
0.4582
0.4483
Y
0.3880
0.4055
0.4099
0.3919
X
0.4430
0.4530
0.4687
0.4582
Y
0.4055
0.4248
0.4289
0.4099
X
0.4582
0.4687
0.4813
0.4700
Y
0.4099
0.4289
0.4319
0.4126
X
0.4483
0.4582
0.4700
0.4593
Y
0.3919
0.4099
0.4126
0.3944
±
Note: X.Y Tolerance each Bin limit is 0.01.
Chromaticity Coordinates & Bin grading diagram:
0.46
0.45
0.44
0.9
0.8
0.43
CY 0.7
0.42
8C
8B
0.6
0.41
0.5
0.4
0.40
0.3
0.39
8D
8A
0.2
0.38
0.1
0.37
0
0.36
CX
0.35
VER.: 01 Date: 2010/12/17
0.52
0.51
0.50
0.49
0.48
0.47
0.46
0.45
0.44
0.43
0.42
0.41
034
0.40
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
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LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
PRECAUTION IN USE
Storage
Recommended storage environment
Temperature:
5oC ~ 30oC (41oF ~ 86oF)
Humidity:
60% RH Max.
Use within 7 days after opening of sealed vapor/ESD barrier bags.
If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±
±5℃
℃ for 24 hours.
Fold the opened bag firmly and keep in dry environment.
Soldering
Reflow Soldering
Lead Solder
Lead – free Solder
120~150℃
℃
180~200℃
℃
Pre-heat
Pre-heat time
120sec. Max.
120sec. Max.
240℃
℃ Max.
260℃
℃ Max.
Peak temperature
Soldering time
10sec. Max.
10sec. Max.
Condition
refer to
refer to
TemperatureTemperatureprofile 1
profile 2
*After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
＜1 : Lead Solder＞
＞
240°C Max.
10sec. Max.
2.5~5°C/sec.
Hand
Temperature
Soldering time
60sec. Max.
120sec. Max.
350℃
℃ Max.
3sec. Max.
(one time only)
＜2 : Lead-free Solder＞
＞
260°C Max.
10sec. Max.
1~5°C/sec.
Pre-heating
180~200°C
Pre-heating
120~150°C
Soldering
60sec. Max.
120sec. Max.
1~5°C/sec.
2.5~5°C/sec.
Recommended soldering pad design
Use the following conditions shown in the figure.
14.5
1.5
10.5
? 6.1
(Unit:mm)
VER.: 01 Date: 2010/12/17
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LP3HNR-ST-UDR3-S21
3W HIGH POWER LED
Handling of Silicone Resin LEDs
Handling Indications
During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound
Figure 1
In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
Figure 2
When populating boards in SMT production, there are basically no restrictions regarding the form
of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be
prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.
VER.: 01 Date: 2010/12/17
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