Technology Trend and Application of OLED-on-CMOS (OLEDoS) Center for Organic Materials and Electronic Devices Dresden (COMEDD) Fraunhofer Institute for Photonic Microsystems (IPMS), Dresden, D-01109, Germany © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 2 complexity Mobile Display Dilemma micro-displays (<1.3”) Mobile display driving forces: Multimedia content information navigation by user interaction (touch screen,...) augmented-reality (AR) Mobile Flexible Display Mobile Projection Display i Full color PM-Display Microdisplay Monochrome PM-Display See-through Microdisplay Full color AM-Display Multicolor PM-Display time © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de AR Microdisplays: Definition, Application (general) Definition Physically very small, but High information content (TV quality) Active matrix substrate (often CMOS) Low power consumption Enlarged image viewed through magnifying optics Applications Projection Rear projection Front projection Micro projection Near-to-Eye (NTE) Electronic Viewfinder (EVF) Hand-held Head Mounted Display (HMD) Professional Consumer © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 3 4 OLED-on-CMOS (OLED-on-Silicon/OLEDoS) © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 5 Introduction OLED-on-CMOS Key features transparent conductor highly-efficient OLED light source in/on CMOS organic layers extremely thin (~100nm) metal cathode substrate small-molecules/vapor phase (SM-OLED) top-emitting polymers/ liquid phase (P-LED) arbitrary shapes _ Light emission all colors monochrome, white, NIR excellent current/power efficiency (low-voltage, low-power) good/improving lifetime (several 10kh) intransparent substrate (Silicon CMOS wafer) self-emissive fast response time (MHz) electronics feature integration driving, acqusition, processing, control sensor co-integration CMOS-compatible sensors embedded photodetectors temperature magnetic (Hall) M(O)EMS,... © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de CMOS cross-section with OLED on top + 6 Introduction OLED-on-CMOS Top-emitting p-i-n OLED based on small molecules (NOVALED AG) evaporated on Si-wafer intransparent bottom electrode (Si-CMOS substrate) transparent top electrode high transparency low sheet resistivity Ag, Al or Yb 5 2 avoid CMOS HV devices Current density [mA/cm²] reduce operating voltage orange emitter red emitter white emitter system 1 10 0 10 -1 10 3 10 -2 10 -3 10 2 10 -4 10 © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de red Voltage [V] Current lifetime efficiency @100 @1000cd @1000c [Cd/A] cd/m² /m² d/m² @100cd/m² 2.4 3.1 14.1 ora 2.5 3.2 11.6 white 3.2 4.7 5.7 -5 10 1 10 -6 10 -5 lower power dissipation at equivalent radiance 4 10 Luminance [cd/m²] Doped charge transport layers yield better OLED performance 10 10 -4 -3 -2 -1 0 1 Voltage [V] 2 3 4 5 12.000 OLED-on-CMOS: Device Manufacturing/SM-OLED CMOS (so far) 1.0, 0.6, 0.35, 0.18μm processes integrated, mixed-signal circuit design by IPMS/COMEDD wafers contract-manufactured at silicon foundry providers (e.g., X-FAB) © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de OLED post-processing SUNICEL plus200 by Sunic System, Ltd. (Korea) Silicon and quartz wafer: Ø150 mm/6“, Ø200 mm/8“, thickness: 0.6 to 0.8 mm Configuration 7 process chambers 12 organic sources 5 inorganic sources 2 PVD sources Ar/O2 plasma activitation Cycle time: ~ 60 min Pilot capacity: ~ 6000 wafers/a 7 OLED-on-CMOS: Device Manufacturing/P-LED PLED R&D and production line Si-wafer Ø200 mm Etching / Sputtering Clustex 200 | Leybold Optics Spin coating EVG120 | EVG Nitrogen oven MB-OV | MBraun Etching, deposition by thermal evaporation and Barix™ thinfilm encapsulation Helisys | ANS Korea Full-automated wafer bonding system Hercules | EVG Wafer prober Pegasus PA200 | Wentworth Microscopes Eclipse L200 | Nikon Ellipsometer M-2000U | J. A. Woollam Particle scanner Surfscan 7700 | KLA Tencor former microdisplay production line of MicroEmissive Displays Germany GmbH (MED) installed by MED at IPMS premises in E/2006..B/2007 original product: MED eyescreen ME3204 (QVGA, RGB) acquired by IPMS E/2009 © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 8 9 OLED-on-CMOS: Applications microdisplays microdisplay HMD, mobile/micro-projection, HUD, electronic viewfinder (EVF),... bi-directional microdisplay (display + embedded camera) interactive HMD, optical inspection,... sensors optical sensors fluorescence, color, flowmetry, photoplethysmography,... embedded illumination for image sensors patterned illumination possible optical finger-print, lab-on-chip,... light barriers (reflective) opto-coupler autostereoscopic 3D displays mobile devices (single user, single/multi view) © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de object surface micro-optics encapsulation CMOS substrate (wafer) OLED CMOS detector CMOS circuit organic-opto-micro-system 10 OLED micro-displays © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 11 OLED microdisplay: „HYPOLED“ colour VGA (640x480) OLED micro-display for HMD and micro-projection 24 bit parallel video interface color options monochrome (8 bit) full colour (24 bit) digital pixel cell luminance control by pulse width (PWM) color, contrast and gamma correction control via I²C 0.18μm CMOS foundry process core supply 1.8V digital 1.8V I/O interfaces negative OLED cathode voltage (max. -5.5V) active area 7.68x5.76mm² chip size 12x11mm² High brightness 5.8mm up to 10,000 nits for monochrome green (micro-projection) 1,000 nits for RGB colour (HMD) I²C interface (configuration) 50/60Hz frame rate 7.7mm © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de „HYPOLED“: System integration Demonstrator Full-color VGA microdisplay MediaBox (DVB-T, DVBH, WLAN) Full-color VGA microdisplay MediaBox © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 12 13 „HYPOLED“: System integration head-mounted display (HMD) ED OL micro-projection optics (MPU) MediaBox (DVB-T, DVB-H, WLAN) MPU (3-panel) MediaBox © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de i rod mic a spl y 14 OLED-on-CMOS: photodetector integration embedded photodetectors CMOS photodiodes lower level than OLED side-by-side with active electronics devices emission and detection can be operated in parallel or sequentially possibly shaping of OLED emission characteristics (angular, spectral width) © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de micro-optics encapsulation CMOS substrate (wafer) OLED CMOS detector CMOS circuit 15 Bi-directional OLED micro-display OLED-Microdisplay 320 x 240 (QVGA) Embedded image sensor 160x120 (QQVGA) inverted camera image image sensor mode Embedded Computersystem OLED micro-display mode feedback-mode demonstrator system setup © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de Bi-directional OLED microdisplay Feedback-mode demonstrator no imaging optics so far © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 16 18 Bi-directional OLED micro-display: HMD application Head-mounted display (HMD) application: aimed at tracking the eye movement with respect to user's sight (consciously and unconsciously) user's (situation) awareness (unconsciously) interaction object gaze-based human-display-interaction visual Input-/Output-Device (I/O) for personal information management (PIM) virtual street map interactive augmented-reality (AR) applications virtual image www.lumusvision.com real view virtual zoomin button virtual zoomout button HMD carrier Radio 53 km/h Menü -1° Navi mobile host platform bi-directional OLED microdisplay 60 30 Display off see-through optics © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de iSTAR: Bi-directional OLED micro-display “Interactive see-through augmented-reality displays” (iSTAR) Fraunhofer-internal collaborative project (WISA) Display: VGA 640x480, full-color embedded camera 128x96 pixel frame camera 1280x80 pixel ST-Prism and IR sources (eye scene illumination) See-through view, display „on“ Near-to-eye projection optics attached to commercial sports goggles © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de i AR 19 20 Markets SMS by " BOSS" : Consumer head-mounted Displays für Smartphones, mobile TV (3D) electronic view finder (EVF) Industrial HMD Optical Inspection Medizin HMD, lab-on-chip, functional microscopy Automotive HMD, optocoupler MIL ST-HMD © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de (Wed, 05/02/14, 18:21) Hi Paul, how about our meeting today? Have you missed it? Please call back immediately! Rgds, BOSS. CALL DEL ESC SPL: 60dB f: 1kHz F: 23mN HR: 93 BP : 40/105 CT: 14:21 OT: 5:35 Thermocouples Part No. 467-854 M ore Information Yes No ? LAS SPL M OB 21 Outlook © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 22 Organics Micro-Patterning OLED Microdisplay Fabrication by Orthogonal Photolithography (OLITH) Aims full-color OLED micro-displays w/o color-filter (CF) high-resolution (<5 μm) high yield (>90%) fast, parallel processing scaleable onto 8“ wafers and beyond Advantages high OLED efficiency (10x) better stability (via color-specific stack design) widened color gamut no color diffusion © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de Octadecene solution Water solution Fluorous solution 23 Outlook color-by-color OLED microdisplays color gamut current/power efficiency , power consumption Enhanced hardware/circuitry integration additional, non-optical CMOS sensorics (e.g. magnetic) additional system features e.g., embedded eye-tracking high-luminance OLED microdisplays (>1000cd/m²) ST-HMD outdoor micro-projection (ultra-flat optical module) micro-signs no active CMOS small die size cost-effective passive, i.e., external drive/control very fine patterning of emission areas e.g., signs, 7-segment displays,... micro-optics integration (in cover glass) beam steering, shaping high-temperature OLED-on-CMOS (lifetime) ..+85..105..125°C NIR-OLED integration 750..900nm 3D+ high-res, high-speed emissive image source new applications sensors © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de ~60 mm 2 μm 4 μm 1.3 mm Tool extension to combine SM-OLED & P-LED Extension of 8“ P-LED tool by SM-OLED add 2 organic evaporation chambers liquid and vapor phase processes in single cluster tool hybrid OLED (smallmolecules + polymers) eBeam, sputter chamber and etcher allow new processes for SM-OLED attractive for 8“ wafer customers due to unique large variety of processes etcher, eBeam, VitexTFE, metal evaporation, sputter, organics evaporation FAT Q1..2/’13 further extension feasible © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de 24 COMEDD: Business Unit OLED Microdisplay & Sensors R&D and pilot-fabrication of OLED Microdisplays & Sensors design, process development/integration, system integration OLED micro-displays (QVGA..XGA), bidirectional (display and imager in single device, QVGA..SVGA) backplane CMOS IC design (in silicon foundry process, 0.11..0.6μm) proprietary OLED module @ silicon foundry OLED processing (SM-OLED & P-LED) system design (e.g., multimedia controller) applications (e.g., head-mounted display) pilot fabrication lines pilot line OLED-on-CMOS (8” Si wafer) pilot line PLED-on-CMOS (ex MicroEmissive Displays production line, 8” Si wafer) © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de - Confidential - 25 26 Contact Dr. Uwe Vogel Business Unit Manager OLED Microdisplays and Sensors Center for Organic Materials & Electronic Devices Dresden (COMEDD) Fraunhofer Institut für Photonische Mikrosysteme (IPMS) See you! Maria-Reiche-Strasse 2 D-01109 Dresden phone:+49-351-8823-282 email: uwe.vogel@ipms.fraunhofer.de http://www.eetimes.com/electronics-news/4213523/Photo-gallery-Eye-on-innovations-at-ISSCC Thanks to collaborative partners: X-FAB Semiconductor Foundries; Novaled, Fraunhofer IOF, IOSB, IGD; TU Dresden Work was in parts sponsored by European Commission within the HYPOLED project (High-Performance OLED-Microdisplays for Mobile Multimedia HMD and Projection Applications, ICT-2007.3.2-217067) Federal Ministry for Education and Research of the German government (Bundesministerium für Bildung und Forschung), BMBF 01 BK 916-919, 16SV2283/"ZOOM", 16SV3682/"ISEMO" Sächsische Aufbaubank (SAB) of the State of Saxony (11107/1733) Fraunhofer Internal Programs “iSTAR”, Grant No. WISA 817 805 (Industry-focused strategic alliance) © Fraunhofer IPMS Dr. Uwe Vogel uwe.vogel@ipms.fraunhofer.de