THICK FILM CHIP RESISTOR
Example = CR050103J001
Ordering Code
C
R
1.
0
5
2.
1. Product Style
Code
Type
CR
Single Chip
RA
Chip Array - 8P4R
RB
Chip Array - 4P2R
RC
Chip Array - 16P8R
RN
Chip Network - 10P8R
2. Size
Code
01
02
03
05
06
CR
12
20
25
22
37
75
03
RA
02
RB
02
RC
02
RN
02
Size
0201
0402
0603
0805
1206
1210
2010
2512
1225 (Current Sensing)
3720 (Current Sensing)
7520 (Current Sensing)
0603 - 8P4R
0402 - 8P4R
0402 - 4P2R
0402 - 16P8R
0402 - 10P8R
3. Nominal Resistance
E24 Series 5%
3 Digits
e.g. 0473 = 47KΩ
E192 Series 1%, 0.25%
0.5%, 1%,2%
4 Digits
e.g. 71K5 = 71.5KΩ
Zero Ohm Jumper
0
4. Resistance Tolerance
Code Resistance Tolerance
±0.1%
B
±0.25%
C
±0.5%
D
±1%
F
±2%
G
±5%
J
0
1
0
3.
3
J
4.
0
5.
0
6.
1
7.
5. Temperature Coefficient of Resistance
Code
Temperature Coefficient of Resistance
General specification:
0
Show in each ratings table, please see
page 6,8,10,12,14
Special specification:
1
100PPM/℃ for low-ohmic resistor
6. Special type
Code
Special type
0
NA
1
028R R type
2
028R S type
3
1210 1/2W
4
0603 1/8W
5
RA06 1/10W
6
0805 1/4W
7
0805 1/6W
8
1206 1/2W
9
2512 2W
A
2010 1W
B
2512 1.5W
TCR ± 100 PPM/℃
P
TCR ± 150 PPM/℃
K
TCR ± 200 PPM/℃
F
TCR ± 300 PPM/℃
G
TCR ± 400 PPM/℃
H
TCR ± 450 PPM/℃
Y
TCR ± 500 PPM/℃
I
TCR ± 600 PPM/℃
J
V
Concave Termination
7. Package
Code
1
2
3
4
5
8
A
B
C
D
Package
5K Paper Taping
10K Paper Taping
20K Paper Taping
4K Plastic Taping
Bulk
2K Plastic Taping
5K BOX
10K BOX
25K BOX
50K BOX
THICK FILM CHIP RESISTOR
Structure and Dimensions
Single Chip: CR 01, 02, 03, 05, 06, 12, 20, 25, 22, 37, 75
Sn
EU RoHS Complaint
Substrate: Al2O3
M(Marking ): Epoxy
C1(Conductor) : Ag / Pd
R(Resistor): RuO2
G1(1st Protective Coating): Glass
Ag(Terminal Conductor): Ag
Ni(Middle Electrode): Ni
Sn(Outer Electrode): Sn
G2(2nd Protective Coating): Epoxy
Plating Termination
Ni/Sn (Lead free)
Dimensions Unit: mm
STYLE
Type
L
W
H
L1
L2
CR01
0201
0.60±0.03
0.30±0.03
0.23±0.03
0.13±0.08
0.15±0.08
CR02
0402
1.0±0.05
0.5±0.05
0.35±0.05
0.2±0.1
15
0 . 25 +− 00 ..10
CR03
0603
1.6±0.10
0.8+−00..15
10
0.45±0.10
0.3±0.2
0.3±0.2
CR05
CR06
CR12
CR20
CR25
CR22
CR37
CR75
0805
1206
1210
2010
2512
1225
3720
7520
2.05±0.10
3.15±0.15
3.1±0.1
5.0±0.15
1.25±0.15
1.6±0.15
2.6±0.15
2.5±0.15
0.55±0.10
0.55±0.10
0.6±0.1
0.55±0.10
0.4±0.2
0.5±0.25
0.5±0.3
0.6±0.25
0.4±0.2
0.5±0.2
0.5±0.2
0.6±0.25
6.4±0.15
3.2±0.15
0.55±0.10
0.6±0.25
0.6±0.25
3.10±0.15
2.00±0.20
2.00±0.20
6.30±0.15
3.75±0.20
7.50±0.30
0.90±0.15
0.60±0.10
0.60±0.10
0.60±0.30
0.40±0.20
0.40±0.20
0.55±0.25
0.40±0.20
0.40±0.20
THICK FILM CHIP RESISTOR
Thick Film Chip Resistor Array / Network ( Convex Termination)
Chip Array RA02 (0402 Size / 8P4R)
Chip Array RA03 (0603 Size / 8P4R)
UNIT：mm
STYLE TYPE
L
W
H
Q1
a
b
1.0±0.1
0.45±0.1
0.3±0.1
0.2±0.1
0.3±0.1
RA02
024R
2.0±0.1
RA03
034R
3.2±0.15 1.6±0.2
0.6±0.1
p
Q2
0.5±0.1 0.2±0.1
0.65±0.15 0.3±0.15 0.3±0.15 0.8±0.15 0.45±0.1
D
0.2±0.1
0.38±0.
1
Chip Array RB02(0402 Size / 4P2R)
UNIT：mm
STYLE
TYPE
L
W
H
Q
a
RB02
022R
1.0±0.1
1.0±0.1
0.35±0.1
0.25±0.15
0.2±0.15
b
p
0.25±0.15 0.65±0.15
D
0.3±0.1
THICK FILM CHIP RESISTOR
Chip Array RC02 (0402 Size / 16P8R)
Equivalent circuit diagram
STYLE
RC02
TYPE
028R
L
W
H
D
Q1
4.0±0.2
1.6±0.15
0.45±0.1
0.2±0.1
0.4±0.2
Q2
a
b
p
0.3±0.1
0.3±0.2
0.3±0.2
0.5±0.2
Chip Network RN02 (0402 Size / 10P8R)
STYLE
RN02
TYPE
028R
Terminal
Convex
L
W
H
D
Q1
3.2±0.2
1.6±0.2
0.5±0.1
0.32±0.1
0.53±0.1
Q2
a
b
p
0.32±0.1
0.3±0.2
0.3±0.2
0.64±0.1
THICK FILM CHIP RESISTOR
Ratings table for Chip Resistors CR 01,02,03,05,06,12,20,25
Operating Temperature Range ：
1) 0201,0402 : -55~+125°C
2) 0603,0805,1206,1210,2010,2512 : -55~+155°C
Size
Rate
Rate
Maximum Maximum
power Current
Working Overload
of
at
Voltage
Voltage
70°C jumper
(V)
(V)
(A)
(W)
Temperature Coefficient
of Resistance
(PPM/°C)
Combination of Resistance
Range and Tolerance
F(±1%)
G(±2%)
J(±5%)
E192 series
E24 series
10Ω<R≦1M
1Ω~1MΩ
1Ω~1MΩ
1Ω≦R≦10R
10Ω~1M
1Ω~10MΩ
1Ω~10MΩ
0402
1/16
50
100
1Ω~9.1Ω
±200
＞1M
1
±100
10Ω~1M
1Ω~10MΩ
1Ω~22MΩ
0603
1/10
50
100
1Ω~9.1Ω
±200
＞1M
±100
10Ω~1M
1Ω~10MΩ
1Ω~22MΩ
0805
1/8
150
300
1Ω~9.1Ω
±200
＞1M
±100
10Ω~1M
1Ω~10MΩ
1Ω~22MΩ
1206
1/4
1Ω~9.1Ω
±200
＞1M
±100
10Ω~1M
2
1Ω~10MΩ
1Ω~22MΩ
1210
1/3
1Ω~9.1Ω
±200
＞1M
200
400
±100
10Ω~1M
1Ω~10MΩ
1Ω~22MΩ
2010
3/4
1Ω~9.1Ω
±200
＞1M
±100
10Ω~1M
1Ω~10MΩ
1Ω~22MΩ
2512
1
1Ω~9.1Ω
±200
＞1M
＊ E24 Series for ±5% & ±10% Above 10MΩ up to 39MΩ is specially available
＊ E192 Series for ±1% & ±2% Above 1MΩ up to 10MΩ is specially available
＊ Jumper means the 0Ω. Actually, the jumper has a maximum resistance Rmax=50mΩ
＊ Max. working voltage is determined by Rated Power x Resistance Value or Max. working voltage listed
above, whichever is lower.
0201
1/20
0.5
15
50
±250
-100/+600
±100
Performance Characteristic
Item
Condition of test
(According to JIS C 5202 item 5.2)
Measure resistance at +25°C or specified room
temperature as R0, then measure at -55°C and +125 °C
respectively as R.
Temperature Determine the temperature characteristic of resistance
Coefficient of by the following formula.
Resistance
R − R0
× 106 (ppm/°C)
T.C.R.=
R0 (t − t0 )
Where t0=+25°C or specified room temperature
t = -55°C or +125°C ± 3°C
Performance of requirement
CHIP Resistor
Jumper
See Ratings Table
---
THICK FILM CHIP RESISTOR
Item
Condition of test
(According to JIS C 5202 item 5.5)
Apply 2.5 times of rated voltage but not exceeding the
Short-time maximum overload voltage for 5 seconds. Have the
Overload
specimen stabilized at room temperature for 30
minutes. MeasureΔR/R(%).
(According to JIS C 5202 item 6.1)
Mount the specimen on a test board as shown in the
Bending
figures. Slowly apply force till the board is bent of the
Strength
specification standard and be held there for 10 seconds,
measure the ΔR/R(%) at this position.
(According to JIS C 5202 item 6.4)
1.Immerse the specimen in the solder pot at 260 ± 5°C
for 10 ±1 seconds. Have the specimen stabilized at
room temperature for 30 minutes minimum. Measure
ΔR/R(%).
Resistance to
(According
to MIL-STD 202G Method 210F)
Soldering heat
2.Mount the specimen on a board. The solder iron shall
be heated to 350°C ±10°C and applied to the
termination for a duration of 4 seconds to 5 seconds.
Have the specimen stabilized at room temperature for
30 minutes minimum. MeasureΔR/R(%).
(According to JIS C 5202 item 6.5)
Solderability Dipping the specimen in the solder pot at 235 ± 5°C for
2 ± 1 seconds.
(According to JIS C 5202 item 7.4)
In sequence, at room temperature, -55°C / 30min.,
25°C / 2 min. ~ +125°C / 30min., 25°C / 2 min. as a
Temperature
cycle, after 5 cycles the specimen shall be stabilized at
Cycle
room temperature for one hour minimum and then
measure the Δ R/R(%).
Load Life
in Moisture
Load Life
Insulation
Resistance
Voltage
Proof
(According to JIS C 5202 item 7.9)
Place the specimen in a test chamber at 40±2°C and
90-95% relative humidity. Apply the rated voltage to the
specimen at the 1.5 hours “ON” and 0.5 hour “OFF”
cycle. The total time of test is 1000 hours. After the test,
have the specimen stabilized at room temperature for
one hour minimum. MeasureΔR/R(%)
(According to JIS C 5202 item 7.10)
Place the specimen in the oven at 70±2°C. Apply the
rated voltage to the specimen at the 1.5 hours “ON” and
0.5 hour “OFF” cycle. The total time of test is 1000
hours. After the test,have the specimen stabilized at
room temperature for one hour minimum and Measure
ΔR/R(%).
(According to JIS C 5202 item 5.6)
Place the specimen in the jig and apply a maximun
working DC voltage for one minute.
(According to JIS C 5202 item 5.7)
Place the specimen in the jig and apply a maximun
working AC voltage for one minute.
Performance of requirement
CHIP Resistor
Jumper
Requirement for 5%, 10%
<50mΩ
Within ±(2%+0.1Ω )
Requirement for 1%, 2%
Within ±(1%+0.05Ω )
No major visible damage
Within ±(1%+0.05Ω ),No cracks <50mΩ
in the resistor body, no terminal
peeling
Requirement for 5%,10%
<50mΩ
Within ±(1%+0.05Ω )
Requirement for 1%,2%
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
At least 95%of the terminal
As left
surface
must be covered by new solder.
Requirement for 5%,10%
<50mΩ
Within ±(1%+0.05Ω )
Requirement for 1%,2%
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
Requirement for 5%,10%
Within ±(3%+0.1Ω )
Requirement for 1%,2%
Within ±(1%+0.05Ω )
No major visible damage
<100mΩ
Requirement for 5%,10%
Within ±(3%+0.1Ω )
Requirement for 1%,2%
Within ±(1%+0.05Ω )
No major visible damage
<100mΩ
Rins: 1000MΩ minimum
As left
No abnormalities such as
flashover or Breakdown on
appearance.
As left
THICK FILM CHIP RESISTOR
Ratings table for High Precision Resistors CR 02,03,05,06,12,20,25
Operating Temperature Range ：
1) 0201, 0402 : -55~+125°C
2) 0603, 0805, 1206,1 210, 2010, 2512 : -55~+155°C
Size
Rate
Maximum Maximum
power
Working Overload
at
Voltage
Voltage
70°C
(V)
(V)
(W)
0402
1/16
50
100
0603
1/10
50
100
0805
1/8
150
300
1206
1/4
200
400
1210
1/3
200
400
2010
3/4
200
400
2512
1
200
400
Temperature Coefficient
of Resistance
(PPM/°C)
10Ω<R≦10MΩ
R≦10Ω;R>10MΩ
10Ω<R≦10MΩ
R≦10Ω;R>10MΩ
10Ω<R≦10MΩ
R≦10Ω;R>10MΩ
10Ω<R≦10MΩ
R≦10Ω;R>10MΩ
10Ω<R≦10MΩ
R≦10Ω;R>10MΩ
10Ω<R≦10MΩ
R≦10Ω;R>10MΩ
10Ω<R≦10MΩ
R≦10Ω;R>10MΩ
±100
±200
±100
±200
±100
±200
±100
±200
±100
±200
±100
±200
±100
±200
Combination of Resistance
Range and Tolerance
±0.1%,±0.25%,±0.5%
E192 series
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
1Ω~10MΩ
Performance Characteristic
Item
Condition of test
(According to JIS C 5202 item 5.2)
Measure resistance at +25°C or specified room temperature
as R0, then measure at -55°C and +125 °C respectively as
Temperature R.Determine the temperature characteristic of resistance by
Coefficient of the following formula.
R − R0
Resistance
× 106 (ppm/°C)
T.C.R.=
R0 (t − t0 )
Where t0=+25°C or specified room temperature t = -55°C
or +125°C ± 3°C
(According to JIS C 5202 item 5.5)
Apply 2.5 times of rated voltage but not exceeding the
Short-time
maximum overload voltage for 5 seconds. Have the
Overload
specimen stabilized at room temperature for 30 minutes.
MeasureΔR/R(%).
(According to JIS C 5202 item 6.1)
Mount the specimen on a test board as shown in the
Bending
figures. Slowly apply force till the board is bent of the
Strength
specification standard and be held there for 10 seconds,
measure the ΔR/R(%) at this position.
(According to JIS C 5202 item 6.4)
1.Immerse the specimen in the solder pot at 260 ± 5°C for
10 ±1 seconds. Have the specimen stabilized at room
temperature for 30 minutes minimum. MeasureΔR/R(%).
Resistance to (According to MIL-STD 202G Method 210F)
Soldering heat 2.Mount the specimen on a board. The solder iron shall be
heated to 350°C ±10°C and applied to the termination for
a duration of 4 seconds to 5 seconds. Have the specimen
stabilized at room temperature for 30 minutes minimum.
MeasureΔR/R(%).
Performance of requirement
See Ratings Table
Within ±(0.75%+0.05Ω )
No major visible damage
Within ±(1%+0.05Ω ),No cracks in
the resistor body, no terminal
peeling
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
THICK FILM CHIP RESISTOR
Item
Solderability
Temperature
Cycle
Load Life
in Moisture
Load Life
Insulation
Resistance
Voltage
Proof
Condition of test
(According to JIS C 5202 item 6.5)
Dipping the specimen in the solder pot at 235 ± 2°C for 2 ±
1 seconds.
(According to JIS C 5202 item 7.4)
In sequence, at room temperature, -55°C / 30min., 25°C / 2
min. ~ +125°C / 30min., 25°C / 2 min. as a cycle, after 5
cycles the specimen shall be stabilized at room temperature
for one hour minimum and then measure the Δ R/R(%).
Performance of requirement
At least 95% of the terminal surface
must be covered by new solder.
(According to JIS C 5202 item 7.9)
Place the specimen in a test chamber at 40±2°C and
90-95% relative humidity. Apply the rated voltage to the
specimen at the 1.5 hours “ON” and 0.5 hour “OFF” cycle.
The total time of test is 1000 hours. After the test, have the
specimen stabilized at room temperature for one hour
minimum. MeasureΔR/R(%)
(According to JIS C 5202 item 7.10)
Place the specimen in the oven at 70±2°C. Apply the rated
voltage to the specimen at the 1.5 hours “ON” and 0.5 hour
“OFF” cycle. The total time of test is 1000 hours. After the
test,have the specimen stabilized at room temperature for
one hour minimum and MeasureΔR/R(%).
(According to JIS C 5202 item 5.6)
Place the specimen in the jig and apply a maximum working
DC voltage for one minute.
(According to JIS C 5202 item 5.7)
Place the specimen in the jig and apply a maximun working
AC voltage for one minute.
Within ±(0.5%+0.05Ω )
No major visible damage
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
Within ±(0.5%+0.05Ω )
No major visible damage
Rins: 1000MΩ minimum
No abnormalities such as flashover
or Breakdown on appearance.
THICK FILM CHIP RESISTOR
Ratings table for Low-Ohmic
1. Standard
Maximum Maximum Combination of
Working Overload Resistance Range
and Tolerance
Voltage
Voltage
(V)
(V)
±5%
Temperature Coefficient
of Resistance
(PPM/°C )
0.01Ω≦R<0.1Ω 0.1Ω≦R<1Ω
Size
Rate
power
at 70°C
(W)
0402
1/16
0.25
0.50
0.1Ω≦R<1Ω
---
±800ppm/℃
0603
1/10
0.32
0.64
0.01Ω≦R<1Ω
±1,500ppm/℃
±600ppm/℃
0805
1/8
0.64
1.28
0.01Ω≦R<1Ω
±1,500ppm/℃
±600ppm/℃
1206
1/4
0.90
1.81
0.01Ω≦R<1Ω
±1,500ppm/℃
±600ppm/℃
1210
1/3
0.90
1.81
0.01Ω≦R<1Ω
±1,500ppm/℃
±600ppm/℃
2010
3/4
1.28
2.56
0.01Ω≦R<1Ω
±1,500ppm/℃
±600ppm/℃
2512
1
1.78
3.56
0.01Ω≦R<1Ω
±1,500ppm/℃
±600ppm/℃
Operating
Temperature
Range (°C)
-55~+125
2. Low TCR
Size
Rate
power
at 700C
(W)
0402
1/16W
0603
1/10W
0805
1/8W
1206
1/4W
2010
1/2W
2512
1W
1225
3W
3720
1W
7520
2W
Maximum Maximum
Working Overload
Resistance Range
Voltage
Voltage
V
V
50mΩ ~ 100mΩ
0.16
0.08
0.36
0.18
101mΩ ~ 500mΩ
0.50
0.25
501mΩ ~ 1000mΩ
0.07
0.14
20 mΩ ~ 50mΩ
0.10
0.20
51mΩ ~ 100mΩ
0.22
0.44
101 mΩ ~ 500mΩ
0.32
0.64
501mΩ ~ 1000mΩ
0.08
0.16
20mΩ ~ 50mΩ
0.11
0.22
51mΩ ~ 100mΩ
0.25
0.50
101mΩ ~ 500mΩ
0.35
0.70
501mΩ ~ 1000mΩ
0.07
0.14
0.11
0.22
0.35
0.70
0.50
1.00
10mΩ ~ 20mΩ
0.14
0.07
21mΩ ~ 50mΩ
0.20
0.10
51mΩ ~ 500mΩ
0.32
0.16
501mΩ ~ 1000mΩ
0.64
0.32
0.14
0.28
0.22
0.44
0.70
1.40
1.00
2.00
3mΩ ~ 10mΩ
0.34
0.17
11mΩ ~ 19mΩ
0.48
0.24
0.78
0.39
20mΩ ~ 50mΩ
1.54
0.77
51mΩ ~ 200mΩ
0.14
0.28
10mΩ ~ 19mΩ
0.70
1.40
20mΩ ~ 500mΩ
TCR
( PPM/℃)
Resistance
Tolerance
Operating
Temperature
Range (°C)
±400
±300
±200
±600
±400
±300
±200
±600
±400
±300
±200
±600
±400
±300
±200
±1%, ±2%, ±5%
-55 ~ +125℃
±450
±300
±200
±150
±300
±150
0.09
0.18
1mΩ ~ 4mΩ
±300
±2%, ±5%
0.14
0.84
0.28
1.68
5mΩ ~ 10mΩ
11mΩ ~ 350mΩ
±200
±150
±1%, ±2%, ±5%
THICK FILM CHIP RESISTOR
3. High Power Rating, Low TCR
Size
Rate
power
at 70°C
(W)
0805
1/4W
0.5
1.0
1206
1/2W
0.7
1.4
Maximum Maximum
Working Overload
Resistance Range
Voltage
Voltage
(V)
(V)
100mΩ ~ 1000mΩ
TCR
( PPM/℃)
Resistance
Tolerance
Operating
Temperature
Range (°C)
±200
±300
±1%,±2%,±5%
-55 ~ +125℃
TCR
( PPM/℃)
Resistance
Tolerance
Operating
Temperature
Range (°C)
±1%,±2%,±5%
-55 ~ +125℃
4. Ultra Low TCR
Size
Rate
power
at 70°C
(W)
1206
1/4W
0.5
1.0
100mΩ ~ 1000mΩ
±100
2010
1/2W
0.7
1.4
100mΩ ~ 1000mΩ
±100
2512
1W
1.0
2.0
100mΩ ~ 1000mΩ
±100
7520
2W
0.1
0.2
1mΩ ~ 5mΩ
±100
Maximum Maximum
Working Overload
Resistance Range
Voltage
Voltage
(V)
(V)
＊ Max. working voltage is determined by
Rated Power x Resistance Value or Max. working voltage listed
above, whichever is lower.
＊
Max. working current is determined by
Rated Power / Resistance Value
Performance Characteristic
Item
Temperature
Coefficient of
Resistance
Short-time
Overload
Bending
Strength
Condition of test
(According to JIS C 5202 item 5.2)
Measure resistance at +25°C or specified room temperature as
R0, then measure at -55°C and +125 °C respectively as
R.Determine the temperature characteristic of resistance by the
following formula.
R − R0
× 106 (ppm/°C)
T.C.R.=
R0 (t − t0 )
Where t0=+25°C or specified room temperature t = -55°C or
+125°C ± 3°C
(According to JIS C 5202 item 5.5)
Apply 2.5 times of rated voltage but not exceeding the maximum
overload voltage for 5 seconds. Have the specimen stabilized at
room temperature for 30 minutes. MeasureΔR/R(%).
(According to JIS C 5202 item 6.1)
Mount the specimen on a test board as shown in the figures.
Slowly apply force till the board is bent of the specification
standard and be held there for 10 seconds, measure the Δ
R/R(%) at this position.
Performance of requirement
See Ratings Table
Within ±2%
No major visible damage
0.1Ω~1Ω Within ±1%
0.001Ω~0.1Ω Within ±3%
No cracks in the resistor body,
no terminal peeling
THICK FILM CHIP RESISTOR
Item
Condition of test
(According to JIS C 5202 item 6.4)
1.Immerse the specimen in the solder pot at 260 ± 5°C for 10 ±
1 seconds. Have the specimen stabilized at room temperature
for 30 minutes minimum. MeasureΔR/R(%).
Resistance to (According to MIL-STD 202G Method 210F)
Soldering heat 2.Mount the specimen on a board. The solder iron shall be
heated to 350°C ±10°C and applied to the termination for a
duration of 4 seconds to 5 seconds. Have the specimen
stabilized at room temperature for 30 minutes minimum.
MeasureΔR/R(%).
(According to JIS C 5202 item 6.5)
Solderability Dipping the specimen in the solder pot at 235 ± 2°C for 2 ± 1
seconds.
(According to JIS C 5202 item 7.4)
In sequence, at room temperature, -55°C / 30min., 25°C / 2
Temperature
min. ~ +125°C / 30min., 25°C / 2 min. as a cycle, after 5 cycles
Cycle
the specimen shall be stabilized at room temperature for one
hour minimum and then measure the Δ R/R(%).
(According to JIS C 5202 item 7.9)
Place the specimen in a test chamber at 40±2°C and 90-95%
Load Life
relative humidity. Apply the rated voltage to the specimen at the
in Moisture
1.5 hours “ON” and 0.5 hour “OFF” cycle. The total time of test
is 1000 hours. After the test, have the specimen stabilized at
room temperature for one hour minimum. MeasureΔR/R(%)
(According to JIS C 5202 item 7.10)
Place the specimen in the oven at 70±2°C. Apply the rated
voltage to the specimen at the 1.5 hours “ON” and 0.5 hour
Load Life
“OFF” cycle. The total time of test is 1000 hours. After the
test,have the specimen stabilized at room temperature for one
hour minimum and MeasureΔR/R(%).
(According to JIS C 5202 item 5.6)
Insulation
Place the specimen in the jig and apply a maximum working DC
Resistance
voltage for one minute.
(According to JIS C 5202 item 5.7)
Voltage
Place the specimen in the jig and apply a maximum working AC
Proof
voltage for one minute.
Performance of requirement
0.1Ω~1Ω Within ±1%
0.001Ω~0.1Ω Within ±3%
No cracks in the resistor body.
At least 95% of the terminal
surface
must be covered by new solder.
0.1Ω~1Ω Within ±1%
0.001Ω~0.1Ω Within ±3%
No cracks in the resistor body.
0.1Ω~1Ω Within ±3%
0.001Ω~0.1Ω Within ±10%
No major visible damage
0.1Ω~1Ω Within ±3%
0.001Ω~0.1Ω Within ±10%
No major visible damage
Rins: 1000MΩΩ minimum
No abnormalities such as
flashover or Breakdown on
appearance.
THICK FILM CHIP RESISTOR
Ratings table for Resistors Array RA02, RA03, RB02, RC02
Size
Rate
Rate
Maximum Maximum
power Current
Working Overload
of
at
Voltage
Voltage
70°C jumper
(V)
(V)
(A)
(W)
Temperature
Coefficient
of
Resistance
(PPM/°C)
Combination of
Resistance Range and
Tolerance
J(±5%),F(±1%)
E24,E192 series
Operating
Temperature
Range (°C)
0402
1/16
1
50
100
±200
10Ω~1MΩ
-55~+125
0603
1/16
1
50
100
±200
10Ω~1MΩ
-55~+125
＊ Jumper means the 0Ω. Actually, the jumper has a maximum resistance Rmax=50mΩ
＊ Max.working voltage is determined by
Rated Power x Resistance Value or Max.working voltage listed above,
whichever is lower.
Performance Characteristic
Item
Condition of test
(According to JIS C 5202 item 5.2)
Measure resistance at +25°C or specified room
temperature as R0, then measure at -55°C and +125 °C
respectively as R.
Temperature Determine the temperature characteristic of resistance
Coefficient of by the following formula.
Resistance
R − R0
× 106 (ppm/°C)
T.C.R.=
R0 (t − t0 )
Where t0=+25°C or specified room temperature
t = -55°C or +125°C ± 3°C
(According to JIS C 5202 item 5.5)
Apply 2.5 times of rated voltage but not exceeding the
Short-time maximum overload voltage for 5 seconds. Have the
Overload
specimen stabilized at room temperature for 30
minutes. MeasureΔR/R(%).
(According to JIS C 5202 item 6.1)
Mount the specimen on a test board as shown in the
Bending
figures. Slowly apply force till the board is bent of the
Strength
specification standard and be held there for 10 seconds,
measure the ΔR/R(%) at this position.
(According to JIS C 5202 item 6.4)
1.Immerse the specimen in the solder pot at 260 ± 5°C for
10 ±1 seconds. Have the specimen stabilized at room
temperature for 30 minutes minimum. MeasureΔR/R(%).
Resistance to (According to MIL-STD 202G Method 210F)
Soldering heat 2.Mount the specimen on a board. The solder iron shall
be heated to 350°C ±10°C and applied to the
termination for a duration of 4 seconds to 5 seconds.
Have the specimen stabilized at room temperature for
30 minutes minimum. MeasureΔR/R(%).
(According to JIS C 5202 item 6.5)
Solderability Dipping the specimen in the solder pot at 235 ± 5°C for
2 ± 1 seconds.
Performance of requirement
CHIP Resistor
Jumper
See Ratings Table
---
Requirement for 5%, 10%
<50mΩ
Within ±(2%+0.1Ω )
Requirement for 1%, 2%
Within ±(1%+0.05Ω )
No major visible damage
Within ±(1%+0.05Ω )
<50mΩ
No cracks in the resistor body,
no terminal peeling
Requirement for 5%,10%
<50mΩ
Within ±(1%+0.05Ω )
Requirement for 1%,2%
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
At least 95% of the terminal
surface must be covered by
new solder.
As left
THICK FILM CHIP RESISTOR
Item
Condition of test
(According to JIS C 5202 item 7.4)
In sequence, at room temperature, -55°C / 30min.,
25°C / 2 min. ~ +125°C / 30min., 25°C / 2 min. as a
Temperature
cycle, after 5 cycles the specimen shall be stabilized at
Cycle
room temperature for one hour minimum and then
measure the Δ R/R(%).
Load Life
in Moisture
Load Life
Insulation
Resistance
Voltage
Proof
(According to JIS C 5202 item 7.9)
Place the specimen in a test chamber at 40±2°C and
90-95% relative humidity. Apply the rated voltage to the
specimen at the 1.5 hours “ON” and 0.5 hour “OFF”
cycle. The total time of test is 1000 hours. After the test,
have the specimen stabilized at room temperature for
one hour minimum. MeasureΔR/R(%)
(According to JIS C 5202 item 7.10)
Place the specimen in the oven at 70±2°C. Apply the
rated voltage to the specimen at the 1.5 hours “ON” and
0.5 hour “OFF” cycle. The total time of test is 1000
hours. After the test,have the specimen stabilized at
room temperature for one hour minimum and Measure
ΔR/R(%).
(According to JIS C 5202 item 5.6)
Place the specimen in the jig and apply a maximun
working DC voltage for one minute.
(According to JIS C 5202 item 5.7)
Place the specimen in the jig and apply a maximum
working AC voltage for one minute.
Performance of requirement
CHIP Resistor
Jumper
Requirement for 5%,10%
<50mΩ
Within ±(1%+0.05Ω )
Requirement for 1%,2%
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
Requirement for 5%,10%
Within ±(3%+0.1Ω )
Requirement for 1%,2%
Within ±(1%+0.05Ω )
No major visible damage
<100mΩ
Requirement for 5%,10%
Within ±(3%+0.1Ω )
Requirement for 1%,2%
Within ±(1%+0.05Ω )
No major visible damage
<100mΩ
Rins: 1000MΩ minimum
As left
No abnormalities such as
flashover or Breakdown on
appearance.
As left
Ratings table for Resistors Network RN 02
Size
028R
Rate
Rate
Maximum Maximum
power Current
Working Overload
of
at
Voltage
Voltage
70°C jumper
(V)
(V)
(A)
(W)
1/32
1
25
50
Temperature
Coefficient
of
Resistance
(PPM/°C)
Combination of
Resistance Range and
Tolerance
J(±5%)
E24 series
Operating
Temperature
Range (°C)
±200
10Ω~1MΩ
-55~+125
Performance Characteristic
Item
Condition of test
Performance of requirement
See Ratings Table
(According to JIS C 5202 item 5.2)
Measure resistance at +25°C or specified room temperature
as R0, then measure at -55°C and +125 °C respectively as
R.
Temperature Determine the temperature characteristic of resistance by
Coefficient of the following formula.
Resistance
R − R0
× 106 (ppm/°C)
T.C.R.=
R0 (t − t0 )
Where t0=+25°C or specified room temperature t = -55°C
or +125°C ± 3°C
THICK FILM CHIP RESISTOR
Item
Short-time
Overload
Bending
Strength
Condition of test
(According to JIS C 5202 item 5.5)
Apply 2.5 times of rated voltage but not exceeding the
maximum overload voltage for 5 seconds. Have the
specimen stabilized at room temperature for 30 minutes.
MeasureΔR/R(%).
(According to JIS C 5202 item 6.1)
Mount the specimen on a test board as shown in the
figures. Slowly apply force till the board is bent of the
specification standard and be held there for 10 seconds,
measure the ΔR/R(%) at this position.
(According to JIS C 5202 item 6.4)
1.Immerse the specimen in the solder pot at 260 ± 5°C for 10 ±1
seconds. Have the specimen stabilized at room temperature for
30 minutes minimum. MeasureΔR/R(%).
Resistance to (According to MIL-STD 202G Method 210F)
Soldering heat 2.Mount the specimen on a board. The solder iron shall be
heated to 350°C ±10°C and applied to the termination for
a duration of 4 seconds to 5 seconds. Have the specimen
stabilized at room temperature for 30 minutes minimum.
MeasureΔR/R(%).
(According to JIS C 5202 item 6.5)
Solderability Dipping the specimen in the solder pot at 235 ± 2°C for 2 ±
1 seconds.
(According to JIS C 5202 item 7.4)
In sequence, at room temperature, -55°C / 30min., 25°C / 2
Temperature min. ~ +125°C / 30min., 25°C / 2 min. as a cycle, after 5
cycles the specimen shall be stabilized at room temperature
Cycle
for one hour minimum and then measure the Δ R/R(%).
Load Life
in Moisture
Load Life
Insulation
Resistance
Voltage
Proof
(According to JIS C 5202 item 7.9)
Place the specimen in a test chamber at 40±2°C and
90-95% relative humidity. Apply the rated voltage to the
specimen at the 1.5 hours “ON” and 0.5 hour “OFF” cycle.
The total time of test is 1000 hours. After the test, have the
specimen stabilized at room temperature for one hour
minimum. MeasureΔR/R(%)
(According to JIS C 5202 item 7.10)
Place the specimen in the oven at 70±2°C. Apply the rated
voltage to the specimen at the 1.5 hours “ON” and 0.5 hour
“OFF” cycle. The total time of test is 1000 hours. After the
test,have the specimen stabilized at room temperature for
one hour minimum and MeasureΔR/R(%).
(According to JIS C 5202 item 5.6)
Place the specimen in the jig and apply a maximun working
DC voltage for one minute.
(According to JIS C 5202 item 5.7)
Place the specimen in the jig and apply a maximun working
AC voltage for one minute.
Performance of requirement
Requirement for 5%
Within ±(2%+0.1Ω )
Requirement for 1%
Within ±(1%+0.05Ω )
No major visible damage
Within ±(1%+0.05Ω ),No cracks in
the resistor body, no terminal
peeling
Requirement for 5%
Within ±(1%+0.05Ω )
Requirement for 1%
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
At least 95% of the terminal surface
must be covered by new solder.
Requirement for 5%
Within ±(1%+0.05Ω )
Requirement for 1%
Within ±(0.5%+0.05Ω )
No cracks in the resistor body.
Requirement for 5%
Within ±(3%+0.1Ω )
Requirement for 1%
Within ±(1%+0.05Ω )
No major visible damage
Requirement for 5%
Within ±(3%+0.1Ω )
Requirement for 1%
Within ±(1%+0.05Ω )
No major visible damage
Rins: 1000MΩ minimum
No abnormalities such as flashover
or Breakdown on appearance.
THICK FILM CHIP RESISTOR
Derating curve
Power rating or current rating is in the case of jumper based on continuous full-load at ambient temperature of 70
℃. For operation at ambient temperature in excess of 70℃,the load should be derated in accordance with figure
of Derating Curve.
1) Apply to 0603,0805,1206,1210,2010,2512
Rated Power
&
Rated Current
80
Ratio (%)
40
0
-55
155
70
0
Ambient Temperature(℃)
2) Apply to 0201,0402, Low-ohmic types, Array types and Network types
Rated Power
Rated Current
&
80
Ratio (%)
40
0
-55
0
70
Ambient Temperature(℃)
125
THICK FILM CHIP RESISTOR
Resistance Marking
Tolerance / Resistance Range
Product Types
Marking
0201(CR01)
0402(CR02)
ARRAY(RB02)
No marking
Speciality
Out of standard resistance value
0603 (CR03)
0805 (CR05)
1206 (CR06)
1210 (CR12)
0
2010 (CR20)
2512 (CR25)
0Ω
ARRAY (RA02,RA03,RC02)
Ex: 0 = 0Ω
NETWORK(RN02)
0603 (CR03)
0805 (CR05)
1R0
1206 (CR06)
1210 (CR12)
1Ω≦R<10Ω 2010 (CR20)
2512 (CR25)
Ex:1R0 = 1Ω
0603 (CR03)
0805 (CR05)
1206 (CR06)
1210 (CR12)
223
R≧10Ω
2010 (CR20)
2512 (CR25)
(E24)
ARRAY (RA02,RA03,RC02)
Ex:223 = 22000Ω = 22KΩ
5%
R≧10Ω
R223
NETWORK(RN02)
Ex:R223 = 22000Ω = 22KΩ (R Type)
(CR03)
All Resistance 0603
Refer 0603 E-192 Multiplier Code
01Z
Ex:01Z = 0.1Ω
R≧10Ω
1%
(E192)
223
Ex: 223 =22KΩ
0805 (CR05)
1210 (CR12)
1Ω≦R<100Ω 2512 (CR25)
ARRAY (RA02,RA03)
1206 (CR06)
2010 (CR20)
0805 (CR05)
1210 (CR12)
2512 (CR25)
ARRAY (RA02,RA03)
0603 (CR03)
1206 (CR06)
2512 (CR25)
3720 (CR37)
1206 (CR06)
2010 (CR20)
R≧100Ω
1%
2%
5%
0603 (CR03) for E24 series
Just for 24 series
22,27,30,33,36,39,43 ,51,56,62,68,82,91
R<1Ω
10R0
Ex:10R0 = 10Ω
1780
Ex: 1780=178Ω
0805(CR05)
1210 (CR12)
1225 (CR22)
7520 (CR75)
3 Marking
101
Ex: 101=101mΩ
4 Marking
R020
Ex: R020=20mΩ
035
035=35 mΩ
THICK FILM CHIP RESISTOR
Standard Series of Value in A Decade
E192
100
101
102
104
105
106
107
109
110
111
113
114
115
117
118
120
121
123
124
126
127
129
130
132
133
135
137
138
140
142
143
145
147
149
150
152
154
156
158
160
162
164
165
167
E96
100
E48
100
102
105
105
107
110
110
113
115
115
118
121
121
124
127
127
130
133
133
137
140
140
143
147
147
150
154
154
158
162
165
162
E192
169
172
174
176
178
180
182
184
187
189
191
193
196
198
200
203
205
208
210
213
215
218
221
223
226
229
232
234
237
240
243
246
249
252
255
258
261
264
267
271
274
277
280
284
E96
169
E48
169
174
178
178
182
187
187
191
196
196
200
205
205
210
215
215
221
226
226
232
237
237
243
249
249
255
261
261
267
274
280
274
E192
287
291
294
298
301
305
309
312
316
320
324
328
332
336
340
344
348
352
357
361
365
370
374
379
383
388
392
397
402
407
412
417
422
427
432
437
442
448
453
459
464
470
475
481
E96
287
E48
287
294
301
301
309
316
316
324
332
332
340
348
348
357
365
365
374
383
383
392
402
402
412
422
422
432
442
442
453
464
475
E192
487
493
499
505
464
E96
487
499
511
517
523
530
536
542
549
556
562
569
576
583
590
597
604
612
619
626
634
642
649
657
665
673
681
690
698
706
715
723
732
741
750
759
768
777
787
796
806
816
E48
487
511
523
536
536
549
562
562
576
590
619
634
649
649
665
681
681
698
715
715
732
750
750
768
787
806
E96
825
E24
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
E12
10
E48
825
845
866
866
887
909
909
931
953
953
976
590
604
619
E192
825
835
845
856
866
876
887
898
909
920
931
942
953
965
976
989
787
E6
10
12
15
15
18
22
22
27
33
33
39
47
47
56
68
82
68
THICK FILM CHIP RESISTOR
0603
R-value
100
101
102
104
105
106
107
109
110
111
113
114
115
117
118
120
121
123
124
126
127
129
130
132
133
135
137
138
140
142
143
145
147
149
150
152
154
156
158
Code
Multiplier
CODE
01
A0
02
A1
03
A2
04
A3
05
A4
06
A5
07
A6
08
A7
09
A8
10
A9
11
B0
12
B1
13
B2
14
B3
15
B4
16
B5
17
B6
18
B7
19
B8
20
A
100
R-value
160
162
164
165
167
169
172
174
176
178
180
182
184
187
189
191
193
196
198
200
203
205
208
210
213
215
218
221
223
226
229
232
234
237
240
243
246
249
252
B
101
CODE
B9
21
C0
22
C1
23
C2
24
C3
25
C4
26
C5
27
C6
28
C7
29
C8
30
C9
31
D0
32
D1
33
D2
34
D3
35
D4
36
D5
37
D6
38
D7
39
D8
C
102
Indication :
Example:
E192 RESISTANCE CODE
R-value
255
258
261
264
267
271
274
277
280
284
287
291
294
298
301
305
309
312
316
320
324
328
332
336
340
344
348
352
357
361
365
370
374
379
383
388
392
397
402
D
103
E
104
CODE
40
D9
41
E0
42
E1
43
E2
44
E3
45
E4
46
E5
47
E6
48
E7
49
E8
50
E9
51
F0
52
F1
53
F2
54
F3
55
F4
56
F5
57
F6
58
F7
59
F
105
Resistance Code
R-value
407
412
417
422
427
432
437
442
448
453
459
464
470
475
481
487
493
499
505
511
517
523
530
536
542
549
556
562
569
576
583
590
597
604
612
619
626
634
642
G
106
+
10.2KΩ = 02C
33.2Ω = 51X
CODE
F8
60
F9
61
G0
62
G1
63
G2
64
G3
65
G4
66
G5
67
G6
68
G7
69
G8
70
G9
71
H0
72
H1
73
H2
74
H3
75
H4
76
H5
77
H6
78
H7
H
107
R-value
649
657
665
673
681
690
698
706
715
723
732
741
750
759
768
777
787
796
806
816
825
835
845
856
866
876
887
898
909
920
931
942
953
965
976
989
X
10-1
Multiplier Code
Y
10-2
CODE
79
H8
80
H9
81
K0
82
K1
83
K2
84
K3
85
K4
86
K5
87
K6
88
K7
89
K8
90
K9
91
M0
92
M1
93
M2
94
M3
95
M4
96
M5
Z
10-3
THICK FILM CHIP RESISTOR
Packaging
Reel Dimensions
STANDARD 7”
Tape Size
8mm
Tape Size
12mm
A
B (Min.)
C
D (Min.)
178±1
(7.008±0.04)
50
(1.969)
13.0±0.5
(0.512±0.02)
20.2
(0.795)
E (Min.)
W
T (Max.)
1.5
(0.059)
9±0.5
(0.354±0.02)
2.5
(0.1)
A
B (Min.)
C
D (Min.)
178±1
(7.008±0.04)
50
(1.969)
13.0±0.5
(0.512±0.02)
20.2
(0.795)
E (Min.)
W
T (Max.)
1.5
(0.059)
13±0.5
(0.512±0.02)
2.5
(0.1)
8mm：CR01,CR02,03,05,06,12,RA02,RA03,RB02,RN02
12mm：CR20,CR25,RC02
THICK FILM CHIP RESISTOR
Dimension
A
B
W
E
F
T1
CR01
(0201)
0.030±0.004
(0.75±0.1)
0.018±0.004
(0.45±0.1)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
CR02
(0402)
0.045±0.008
(1.15±0.2)
0.026±0.008
(0.65±0.2)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
0.018±0.004
(0.45±0.1)
0.079±0.004
(2.0±0.1)
0.059±0.004
(1.5±0.1)
CR03
(0603)
0.075±0.008
(1.9±0.2)
0.043±0.008
(1.1±0.2)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
0.024±0.004
(0.60±0.1)
0.157±0.004
(4.0±0.1)
0.059±0.004
(1.5±0.1)
CR05
(0805)
0.092±0.008
(2.35±0.2)
0.065±0.008
(1.6±0.2)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
0.030±0.004
(0.75±0.1)
0.157±0.004
(4.0±0.1)
0.059±0.004
(1.5±0.1)
CR06
(1206)
RA03
RN02
0.138±0.008
(3.5±0.2)
0.075±0.008
(1.9±0.2)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
0.030±0.004
(0.75±0.1)
0.157±0.004
(4.0±0.1)
0.059±0.004
(1.5±0.1)
CR12
(1210)
0.138±0.008
(3.5±0.2)
0.11±0.008
(2.8±0.2)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
0.157±0.004
(4.0±0.1)
0.059±0.004
(1.5±0.1)
CR20
(2010)
0.22±0.008
(5.4±0.2)
0.11±0.008
(2.8±0.2)
0.472±0.004
(12.0±0.1)
0.069±0.004
(1.75±0.1)
0.217±0.002
(5.5±0.05)
0.008±0.002
(0.2±0.05)
--------
0.157±0.004
(4.0±0.1)
0.059±0.004
(1.5±0.1)
CR25
(2512)
0.264±0.008
(6.7±0.2)
0.142±0.008
(3.4±0.2)
0.472±0.004
(12.0±0.1)
0.069±0.004
(1.75±0.1)
0.217±0.002
(5.5±0.05)
0.008±0.002
(0.2±0.05)
--------
0.157±0.004
(4.0±0.1)
0.059±0.004
(1.5±0.1)
RA02
0.087±0.008
(2.2±0.2)
0.047±0.006
(1.2±0.15)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
0.028±0.004
(0.7±0.1)
0.079±0.004
(2.0±0.1)
0.059±0.004
(1.5±0.1)
RB02
0.045±0.008
(1.15±0.2)
0.045±0.008
(1.15±0.2)
0.315±0.008
(8.0±0.2)
0.069±0.004
(1.75±0.1)
0.138±0.002
(3.5±0.05)
--------
0.018±0.004
(0.45±0.1)
0.079±0.004
(2.0±0.1)
0.059±0.004
(1.5±0.1)
RC02
0.169±0.008
(4.3±0.2)
0.075±0.008
(1.9±0.2)
0.472±0.008
(12.0±0.2)
0.069±0.004
(1.75±0.1)
0.217±0.002
(5.5±0.5)
--------
0.033±0.004
(0.8±0.1)
0.157±0.004
(4.0±0.1)
0.059±0.004
(1.5±0.1)
Top Tape
T2
P
0.0138±0.004 0.079±0.002
(0.35±0.1)
(2.0±0.05)
0.030±0.004
(0.75±0.1)
D
0.059±0.004
(1.5±0.1)
ψ D0
E
A
F
B
W
ψ D1 1.4Min.
T
P1
Resistor
P2
P0
direction of unreeling
Emboss Tape
Unit: mm
Dimension
CR22
(1225)
A
B
W
E
3.38±0.10 6.68±0.10 12.0±0.30 1.75±0.10
F
5.5±0.10
P0
P1
ψD0
T
4.00±0.10 4.00±0.10 2.00±0.05 1.55+0.05 1.45±0.20
Peel force of top cover tape.The peel speed shall be about 300mm/min±5%
The peel force of top cover tape shall be between 20 and 80g
Top Cover Tape
20~80g
165~180
P2
THICK FILM CHIP RESISTOR
Top Tape
ψ D0
E
A
F
B
W
ψ D1 1.4Min.
T
P1
Resistor
P2
P0
direction of unreeling
Emboss Tape
Unit: mm
Codes
A
B
W
E
F
P0
P1
P2
ψD0
T
CS37
2.50±0.20 4.45±0.20 12.0±0.30 1.75±0.01
5.5±0.05 4.00 ±0.05 4.00±0.10 2.00±0.05 1.50+0.10 1.50 ±0.10
CS75
2.50±0.20 8.30±0.20 16.0±0.30 1.75±0.01
7.8±0.05
4.00±0.05 4.00±0.10 2.00±0.05 1.50+0.10 1.50 ±0.10
Peel force of top cover tape. The peel speed shall be about 300mm/min±5%
The peel force of top cover tape shall be between 0.1 and 0.7N
Top Cover Tape
165~180
0.1~0.7N
RESTRICTIVELY USED SUBSTANCES:
As the constituent table, no prohibited substances are used in SCC parts.
We promised that SCC deliver to Customer are free from any of the environmental hazardous substances. (The
conditions and details are from customer’s requirement and environment regulations.)
STORAGE CONDITION OF PRODUCTS:
Storage Environments.
Tape packing material are designed to withstand long-term storage, but they will degrade more rapidly in the presence
of high temperature or high humidity, Therefore, the products must be stored in an ambient temperature of less than 40
℃ with a relative humidity of less than 70%RH. Allowable storage period is within 12 months from the notice for final
shipments.(As JEDEC Standard No. 48-A)
Soldering Recommendation
Typical Profile Band for Sn63/Pb37 Alloy Solder Paste
THICK FILM CHIP RESISTOR
℃
IR-REFLOW PROFILE (Sn/Pb)
300
240 +0/-5℃; 10~30secs
250
200
>183℃; 60~150secs
150
100
100~150 ℃; 60~120secs
50
Reflow
Pre-Heat
Cooling
The IR-Reflow profile for lead free part.
℃
IR-REFLOW PROFILE (Pb-free)
300
250 +0/-5℃; 20~40secs
250
200
>217℃; 60~150secs
150
100
150~200 ℃; 60~180secs
50
Pre-Heat
Reflow
Cooling
SOLDER PAD DESIGN GUIDES
(in case more details required, please refer to IPC 782 A)
C
B
P
D
A
Chip
*
0201
*
0402
*
0603
A
1.00
1.50
2.10
D
0.30
0.50
0.90
IR Reflow
B
P
0.40
0.35
0.60
0.50
0.90
0.60
C
0.65
1.00
1.50
A
D
Wave Solder
B
P
C
N/A
2.70
0.90
0.80
0.90
1.60
THICK FILM CHIP RESISTOR
0805
1206
1210
2010
2512
1225
3720
7520
2.60
3.80
3.80
5.60
7.00
6.00
4.60
5.2
1.20
2.00
2.00
3.80
3.80
2.00
1.00
1.20
1.30
1.60
2.80
2.80
3.50
7.60
6.00
7.60
0.70
0.90
0.90
0.90
1.60
2.00
1.80
2.00
1.90
2.90
2.90
4.70
5.40
4.00
2.80
3.20
3.40
4.80
4.80
6.30
8.50
1.30
2.30
2.30
3.50
4.50
1.30
1.70
2.50
2.50
3.20
1.05
1.25
1.25
1.40
2.00
2.35
3.55
3.55
4.90
6.50
Note:*to minimize tombstoning for small chips 0201, 0402, 0603, four methodologies can be used.
1) Make all corners of the pads to round shape as above figure
2) Reduce the amount of solder paste using, a stencil opening which is less then the pad area
3) Control the pad size as small as possible
SOLDER PAD DESIGN GUIDES (RESISTORS ARRAY,NETWORK)
B
F
A
TYPE
RA02
RA03
RB02
RC02
RN02
P
8P4R
8P4R
4P2R
16P8R
10P8R
A
0.5±0.10
0.8±0.10
0.5±0.10
0.5±0.10
0.8±0.10
B
0.30±0.05
0.45±0.05
0.30±0.05
0.30±0.05
0.35±0.05
F
1.80±0.20
2.60±0.20
1.80±0.20
1.80±0.20
2.60±0.20
Unit:mm
P
0.50±0.05
0.80±0.05
0.67±0.05
0.50±0.05
0.64±0.05