STPS40100HR Aerospace 2 x 20 A - 100 V Schottky rectifier Datasheet - production data Features • Forward current: 2 x 20 A • Repetitive peak voltage: 100 V • Low forward voltage drop: 0.9 V • Maximum junction temperature: 175 °C • Negligible switching losses • Low capacitance • High reverse avalanche surge capability 50 • Hermetic packages • ESCC qualified Description This power Schottky rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. Housed in hermetically sealed surface mount and through hole packages, it is ideal for use in applications for aerospace and other harsh environments. The STPS40100HR is intended for use in medium voltage application and particularly, in high frequency circuits where low switching losses and low noise are required. Table 1. Device summary Order code ESCC detailed specification Quality level STPS40100C2FY1 - Engineering model STPS40100C2FYT 5106/019/05 October 2015 This is information on a product in full production. Package IF (AV) VRRM Tj (max) VF (max) TO-254 2 x 20 100 175 0.9 ESCC flight DocID17306 Rev 4 1/8 www.st.com Characteristics 1 STPS40100HR Characteristics Table 2. Absolute maximum ratings Symbol IFSM Characteristic Forward surge current (per diode)(1) Value Unit 300 A (2) 100 V (3) Repetitive peak reverse current 1 A Average output rectified current (50% duty cycle):(4), (5) per diode per device 20 40 A IF(RMS) Forward rms current (per diode) 30 A TOP Operating temperature range(6) (case temperature) -65 to +175 °C +175 °C -65 to +175 °C VRRM IRRM IO TJ Repetitive peak reverse voltage Junction temperature (6) TSTG Storage temperature range TSOL Soldering temperature: For TO-254(7) +260 dV/dt Critical rate of rise of reverse voltage 10000 °C V/µs 1. Sinusoidal pulse of 10 ms duration 2. Pulsed, duration 5 ms, F = 50 Hz 3. Pulsed, duration 2 µs, F = 1 kHz 4. For Tcase ≥ +132°C per device and Tcase ≥ +148°C per diode, derate linearly to 0 A at +175°C. 5. The “per device” ratings apply only when both anode terminals are tied together. 6. For devices with hot solder dip lead finish all testing performed at Tamb > +125 °C are carried out in a 100% inert atmosphere. 7. Duration 10 seconds maximum at a distance of not less than 1.5 mm from the device body and the same lead shall not be re-soldered until 3 minutes have elapsed. Table 3. Thermal resistance Symbol Rth(j-c) (1) Characteristic Thermal resistance, junction to case per diode per device 1. Package mounted on infinite heatsink 2/8 DocID17306 Rev 4 Value Unit 1.5 1.2 °C/W STPS40100HR Characteristics s Table 4. Electrical measurements at ambient temperature (per diode), Tamb = 22 ±3 °C Symbol IR1 IR2 Characteristic Reverse current MIL-STD-750 test method 4016 VF1(1) VF2 (1) VF3 (1) C Zth(j-c)(2) Forward voltage 4011 Values Test conditions Units Min. Max. DC method, VR = 100 V - 30 µA DC method, VR = 50 V - 5 µA Pulse method, IF = 5 A - 610 mV Pulse method, IF = 10 A - 730 mV Pulse method, IF = 20 A - 900 mV 1 nF Capacitance 4001 VR = 10 V, F = 1 MHz - Relative thermal impedance, junction to case 3101 IH = 15 to 40 A, tH = 50 ms IM = 50 mA, tmd = 100 µs Calculate ΔVF(3) °C/W 1. Pulse width ≤ 300µs, duty cycle ≤ 2% 2. Performed only during screening tests parameter drift values (initial measurements for HTRB), go-no-go. 3. The limits for ΔVF shall be defined by the manufacturer on every lot in accordance with MIL-STD-750 Method 3101 and shall guarantee the Rth(j-c) limits specified in maximum ratings. Table 5. Electrical measurements at high and low temperatures (per diode) Symbol Characteristic MIL-STD-750 test method Values Test conditions(1) Units Min. Max. Tcase = +125 (+0, -5) °C DC method, VR = 100 V - 20 mA IR2 Tcase = +125 (+0, -5) °C DC method, VR = 50 V - 7.5 mA VF2(2) Tcase = +125 (+0, -5) °C pulse method, IF = 10 A - 660 mV Tcase = +125 (+0, -5) °C pulse method, IF = 20 A - 850 mV Tcase = -55 (+5, -0) °C pulse method, IF = 20 A - 950 mV IR1 Reverse current Forward voltage VF3 (2) 4016 4011 1. Read and record measurements shall be performed on a sample of 5 components with 0 failures allowed. Alternatively a 100% inspection may be performed. 2. Pulse width ≤ 300µs, duty cycle ≤ 2% DocID17306 Rev 4 3/8 8 Configurations 2 STPS40100HR Configurations Figure 1. Available device configuration 6736&)< 6736&)<7 7HUPLQDO $QRGHD 7HUPLQDO &RPPRQFDWKRGH 7HUPLQDO $QRGHE 4/8 DocID17306 Rev 4 STPS40100HR 3 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 3.1 TO-254 package information Figure 2. TO-254(a) package outline B R1 D E H ØF C G A 3 2 1 N ØM R2 L K ØI K J a. The terminal identification is specified by the device configuration. See Figure 1 for terminal connections DocID17306 Rev 4 5/8 8 Package information STPS40100HR Table 6. TO-254 package mechanical data Dimension in millimeters Dimension in inches Reference Min. Max. Min. Max. A 13.59 13.84 0.535 0.545 B 13.59 13.84 0.535 0.545 C 20.07 20.32 0.790 0.800 D 6.3 6.7 0.248 0.264 E 1 3.9 0.039 0.154 ØF 3.5 3.9 0.138 0.154 G 16.89 17.4 0.665 0.685 H ØI(1) 6.86 BSC 0.89 0.270 BSC 1.14 0.045 J 3.81 BSC 0.150 BSC K 3.81 BSC 0.150 BSC L 12.95 14.5 ØM 0.510 3.05 Typ. 0.571 0.120 Typ. N - 0.71 - 0.028 R1(2) - 1 - 0.039 R2(3) 1.65 Typ. 1. 3 locations 2. Radius of heatsink flange corner - 4 locations 3. Radius of body corner - 4 locations 6/8 0.035 DocID17306 Rev 4 0.065 STPS40100HR 4 Ordering information Ordering information Table 7. Ordering information(1) Order code ESCC detailed specification Package STPS40100C2FY1 TO-254 STPS40100C2FYT Lead finish Marking Gold STPS40100C2FSY1 + BeO Solder dip 5106/019/05 Mass EPPL Packing 10 g 510601905 + BeO Y Strip pack 1. Contact ST sales office for information about the specific conditions for products in die form. 5 Revision history Table 8. Document revision history Date Revision Changes 26-Mar-2010 1 Initial release. 19-Mar-2014 2 Updated Table 1: Device summary and Table 7: Ordering information. 15-Sep-2015 3 Update Features and Table 8. Reformatted to current standards. 23-Oct-2015 4 Updated Table 1 and Table 7. DocID17306 Rev 4 7/8 8 STPS40100HR IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 8/8 DocID17306 Rev 4