StarChips
Technology
Nov/09
StarChips Package Dimensional Display Symbol
Dimensional
Symbol
Item
A
Mounting height
A1
Stand-off height
A2
A3
B
B1
Package height
Lead height
Lead shoulder
width
b
c
D1
E1
D2
E2
e
Lead width
E
Lead thickness
Package length
Package width
Pad length
Pad width
Lead pitch
Spacing between
lead rows
Overall width
D
Overall length
L1
Lead length
L
Soldered portion
length
θ
θ1
θ2
Angle of lead flat
portions or
The plastic body
draft angle
x
Tolerance of lead
center position
y
Coplanarity of the
package terminals
ZD
ZE
Package overhang
e1
Contents
Height between the seating plane and the top of package body
Height between the seating plane and the bottom of package
body
Package thickness
Height between the seating plane and the top of lead shoulder
Maximum lead width above the seating plane
The width of the lead including lead finish, which is external to
the body
The thickness of the metal lead including lead finish.
Package body length
Package body width
The horizontal dimension of the exposed metal heat feature.
The vertical dimension of the exposed metal heat feature.
Distance between lead centers
Distance between lead rows
Maximum package width including leads
Maximum package length (in the longitudinal direction)
including leads
The distance (measured parallel to the seating plane) from the
lead tip to where the lead exits from the body.
Surface mounting type: Length of the lead flat part in contact
with the seating
plane. “L” is the horizontal projection of the distance from the
upper edge of tip of the lead to the intersection of the inner
surface of the lead with the gage plane defined by basic
dimension “0.25mm”.
Through-hole mounting type: Length between the seating plane
and the lead tip.
Through-hole mounting type: Angle between the lead and the
plane
perpendicular to the seating plane
Surface mounting type: Angle between the lead flat part and the
seating plane.
This indicates that the maximum allowable position of the lead
center is x when
the pin width b is the maximum material condition (MMC) (the
concept of the
maximum material condition is applied).
Surface mounting type: This indicates the uniformity of the lead
bottom against
the seating plane. y is the maximum value.
Distance between the center of the outermost lead and the end
of the package body.
check up-to-date version
StarChips Technology Inc.
4F, No.5, Technology Rd., Science-Based Industrial Park, Hsin-Chu, Taiwan, R.O.C.
www.starchips.com.tw
Tel:+886-3-577-5767 # 555
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