GreenFET3
SLG59M1721V
Layout Guide
Content
1
1
VDD
C2
100nF
ON
U1
1
2
3
D_Sense1
1
2
3
4
1
C3
100u
C4
100u
R_Array
1
3
5
7
9
8
7
6
5
VDD
GND
ON CAP/ILIM
D
S
D
S
1
3
5
7
9
S_Sense1
1
C5
100u
C6
100u
R1
2
4
6
8
10
R2
C7
100nF
2
4
6
8
10
U2
9
1
2
3
4
D_Sense2
ON
VDD
D
D
D
8
7
6
5
GND
CAP
S
S
S_Sense2
1
1
C8
100nF
U3
1
2
3
4
D_Sense3
ON
VDD
D
D
8
7
6
5
GND
CAP
S
S
S_Sense3
1
1
C9
100nF
U4
9
1
2
3
4
D_Sense4
1
ON
VDD
D
D
D
8
7
6
5
GND
S
S
S
S_Sense4
1
U5
1
2
3
4
D_Sense5
1
ON
VIN
VIN
VIN
8
7
6
5
GND
VOUT
VOUT
VOUT
S_Sense5
1
U6
1
2
D_Sense6
ON
D
GND
S
4
3
R3
R4
Figure 4. SLG59M1721V Connection Circuit
2. Power and Ground Planes
CAP/RILIM
Description
The SLG59M1721V is a 18 m, ~ 2.0 A singlechannel load switch that is able to switch 0.85V to 3.6V
power rails. The product is packaged in an ultra-small
1 x 1.4 mm package.
D/VIN
D/VIN
1
1
S_Sense6
1
1
1
VDD CAP2
GND CAP1
ON1
S2
ON2
S1
D1
D2
1. Description
C1
10uF
10
9
8
7
6
1
1
2
3
4
5
S/VOUT S/VOUT
Figure 1: SLG59M1721V Block Diagram
2.
Power and Ground Planes
This layout guide provides some important information
about the PCB layout of SLG59M1721V applications.
SILEGO FC-TDFN 1x1.4-6L PKG
Unit: um
2.1. The VDD pin needs are 0.1uF and 10uF external
capacitors to smooth pulses from the power supply.
Locate these capacitors close to PIN1.
2.2. The trace length from the control IC to the ON pin
should be as short as possible and must avoid
crossing this trace with power rails.
2.3. The D/VIN and S/VOUT pins carry significant
current. Please note how the D/VIN and S/VOUT
pads are placed directly on the power planes in
Figure 2. SLG59M1721V Package Dimensions and
Recommended Land Pattern
Please solder your SLG59M1721V here
Figure 3, which minimizes the RDS (ON) associated
with long, narrow traces. The D/VIN, S/VOUT and
GND pins dissipate most of the heat generated
during high-load current condition. The layout shown
in Figure 3 is illustrating a proper solution for heat to
transfer as efficiently as possible out of the device.
46mm
2.4. Place the power rail ramp capacitor as close as
possible to the CAP pin to avoid/reduce the effect of
parasitic mount capacitance.
2.5. The GND pin (PIN6) should be connected to GND.
2.6. 2 oz. copper is recommended for higher currents.
28mm
Figure 3. SLG59M1721V Evaluation Test Board
Note: Evaluation board has D_Sense and S_Sense pads. Please use them only
for RDS(ON) evaluation.