Rendering date: 2016-10-02 22:07:20
http://conductivity-app.org
CuETP
UNS:C11000
EN:CW004A
Manufactures list:
Aurubis (http://www.aurubis.com/en/) - Cu-ETP, Cu-ETP1
Cupori Oy (http://www.cupori.com) - Cupori 110 Premium
Daechang Co., Ltd. (http://www.brasone.com/) - ETP
Diehl Metall Stiftung & CO.KG (http://www.diehlmetall.de) - KD58
Freeport McMoRan Copper & Gold (http://www.fcx.com/) - C110 - ETP Copper
KGHM Polska Miedź S.A. (http://www.kghm.pl/) - Cu-ETP-8-CL
KM Europa Metal AG (http://www.kme.com/) - KME100
La Farga (http://www.lfl.es) - Cu-ETP, Cu-ETP1
Luvata (http://www.luvata.com/) - CuETP
Montanwerke Brixlegg AG (http://www.montanwerke-brixlegg.com) - MB-ETP, MB-ETP1
Mueller Industries (www.muellerindustries.com/) - ASTM B152 Alloy C11000
Nexans (http://www.nexans.us/) - ETP copper, Cu-a1
Palabora (http://www.palabora.com/) - Cu-ETP 1
Pan Pacific Copper (http://www.ppcu.co.jp/eng/) - Tough Pitch Copper (ETP)
Pegler Yorkshire Group LTD. (http://www.pegleryorkshire.co.uk) - ETP
Revere Copper Products, Inc. (http://reverecopper.com/) - C11000
Sociedad Contractual Minera el Abra (http://www.fcx.com/) - C110
Sociedad Minera Cerro Verde S.A.A. (http://www.fcx.com/) - C110
Sofia Med S.A. (http://www.sofiamed.bg) - Cu-ETP
Tenke Fungurume (http://www.fcx.com/) - C110
Wieland-Werke AG (http://www.wieland.de/) - Wieland-K32®/E-Cu58
CuETP is the most common copper. It is universal for electrical applications. CuETP has a
minimum conductivity rating of 100% IACS and is required to be 99.9% pure. It has
0.02% to 0.04% oxygen content (typical). Most ETP sold today will meet or exceed the
101% IACS specification. As with OF copper, silver (Ag) content is counted as copper
(Cu) for purity purposes. C11000C (Electrolytic Tough Pitch Copper) is an electrolytic
refined copper widely used for electrical and electronic applications. CuETP has the
properties required in all applications with a hydrogen-free atmosphere. In the presence
of H2 and heat all oxygen-bearing coppers suffer from so-called hydrogen embrittlement.
This is a chemical reduction of copper oxide by diffusing hydrogen leading to formation of
H2O within the microstructure, resulting in embrittlement of the grain boundaries. The
phosphorus of our copper content is very low, so that electrical conductivity is
comparable to the best performing materials. C1100 is an oxygen containing copper
which has a very high electrical and thermal conductivity. It has excellent forming
properties. Due to its oxygen content soldering and welding properties are limited. The
alloy is registered US EPA antimicrobial. Due to its high copper content of about 99% CuETP provides the full antimicrobial properties of copper to inhibit the growth of bacteria,
1
viruses and fungi which are in contact for a short period of time on copper containing
surfaces. Traditionally used ETP grade copper for electric applications, characterized by
its content of hard copper oxides (Cu2O) with sizes of 5÷10 µm, which, for very small
wire diameters, significantly decrease their ductility. Electrolytic Tough Pitch Copper is
not suitable for case hardening. This material can be bent, soldered, drilled, riveted, and
formed to almost any configuration. ETP Copper is available in round bar, squares, flat
rectangular (bus bar), and certain profile shapes.
Literature [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 342, 340, 415, 268,
347, 343, 345, 344, 143, 341, 346]
2
Basic properties
Basic properties
3
Density [g/cm ]
Specific heat capacity
[J/(kg*K)]
Temperature coefficient of
electrical resistance (0...100°C)
[10-3/K]
Electrical conductivity [T=20°C,
(% IACS)]
Thermal conductivity
[W/(m*K)]
Value
8,89-8,94
8,32
7,93
Comments
Solid state,
temperature:
20°C
Solid state,
temperature:
1083°C
Liquid state,
temperature:
1083°C
385-386
3,7
97
100-101,5
388
H14 temper
O60 temper
For high
conductivity
copper, a
values of 387
is an adjusted
value
corresponding
to an electrical
conductivity of
101% IACS
Thermal expansion coefficient
17,7
20...300°C [10-6/K]
[Ref: 316, 409, 413, 254, 342, 340, 415, 268, 347, 343, 346,
417, 418, 419, 420, 421, 422, 423]
Electrical conductivity is strongly influenced by chemical composition. A high level of cold
deformation and small grain size decrease the electrical conductivity moderately.
Minimum conductivity level can be specified [Ref: 316, 409, 410, 254, 340, 268, 344,
143]
3
Variation of density with amount of cold reduction by rolling for CuETP (C11000) and
similar coppers (CuETP1). A - vacuum annealed 12 h at 880 °C and cold drawn; B vacuum annealed 12 h at 970 °C and flat rolled; C - vacuum annealed 12 h at 995 °C
and cold drawn; D - hot rolled, vacuum annealed 4 h at 600 °C and drawn [Ref: 254]
Electrical conductivity of CuETP, CuETP1 according to KME [Ref: 417]
4
The influence of impurities on the electrical conductivity of CuETP [Ref: 24, 56, 26, 27]
5
Applications
Main applications
Typical uses: produced in all forms except pipe and used for building fronts, downspouts,
flashing, gutters, roofing, screening, spouting, gaskets, radiators, busbars, electrical
wire, stranded conductors, contacts, radio parts, switches, terminals, ball floats, butts,
cotter pins, nails, rivets, soldering copper, tacks, chemical process equipment, kettles,
pans, printing rolls, rotating bands, roadbed expansion plates, vats. Automotive industry:
radiators, gaskets. Builders hardware: cotter pins, butts, ball floats, tacks, soldering
copper, rivets. Consumer: christmas ornaments. Electrical industry: transformer coils,
switches, terminals, contacts, radio parts, busbars, terminal connectors, conductors,
stranded conductors, cable strip. Fasteners. Industrial: printed circuit boards, stamped
parts, pressure vessels, chemical process, equipment, chlorine cells, chimney cap
screens, heat exchangers, printing rolls, anodes, rotating bands, pans, vats, heat sinks.
Architecture: downspouts, flashing, roofing, gutters, building fronts, skylight frames,
kitchen countertops.
Preferred applications: transformer, fuse, relay box, punshed screen, cable strip, current
carrying capacity. Literature: [Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254,
342, 340, 415, 268, 347, 343, 345, 344, 143, 341, 346]
Kinds of semi-finished products/final products
Forms Available: sheet, strip, plate for locomotive fireboxes, rod for locomotive staybolts,
flat products, rod, bar and shapes, wire, conductors, tubular products, miscellaneous
Product
Plate for locomotive
fireboxes
Rod
Rod for locomotive
staybolts
Sheet and strip
Wire
CuETP (C11000)
Specification
Literature
ASME SB11
[Ref: 428]
SAE J463
MIL-C-12166
[Ref: 429]
[Ref: 430]
ASME SB12
[Ref: 431]
AMS 4500
AMS 4701
MIL-W-3318
MIL-W-6712
[Ref:
[Ref:
[Ref:
[Ref:
432]
433]
434]
435]
ASTM and federal specifications for CuETP (C11000)
Product and condition
- General requirements
for copper and copper
alloy plate, sheet, strip
and rolled bar
- Sheet, strip, plate and
rolled bar
- Sheet, lead coated
Specification number
ASTM
Federal
Flat products:
B248 [Ref: 436]
-
B152 [Ref: 373]
QQ-C-576 [Ref: 389]
B101 [Ref: 437]
-
6
- Sheet and strip for
building construction
- Strip and flat wire
- Foil, strip and sheet for
printed circuits
B370 [Ref: 388]
-
B272 [Ref: 375]
QQ-C-502 [Ref: 381]
B451 [Ref: 438]
-
Rod, bar and shapes:
- General requirements
for copper and copper
alloy rod, bar and shapes
B249 [Ref: 334]
- Rod, bar and shapes
B133 [Ref: 372]
- Rod, hot rolled
- Rod, bar and shapes for
forging
- Busbars, rods and
shapes
B49 [Ref: 348]
QQ-C-502 [Ref: 381],
QQ-C-576 [Ref: 389]
-
B124 [Ref: 380]
QQ-C-502 [Ref: 381]
B187 [Ref: 374]
QQ-B-825 [Ref: 440]
-
Wire
- General requirements
for copper and copper
alloy wire
- Hard drawn
- Tinned
- Medium-hard drawn
- Tinned
B250 [Ref: 441]
B1 [Ref: 385]
B246 [Ref: 400]
B2 [Ref: 386]
B246 [Ref: 400]
B3 [Ref: 387]
- Soft
B189 [Ref: 399]
- Lead alloy coated
B355 [Ref: 403]
- Nickiel coated
B48 [Ref: 371], B272
- Rectangular and square
[Ref: 375]
- Tinned
B33 [Ref: 396]
- Silver coated
B298 [Ref: 402]
B47 [Ref: 442], B116
- Trolley
[Ref: 398]
Conductors
- Bunch stranded
B174 [Ref: 444]
B8 [Ref: 445], B226 [Ref:
- Concentric-lay stranded
446], B496 [Ref: 447]
- Conductors for electronic
B286 [Ref: 401], B470
equipment
[Ref: 397]
B172 [Ref: 448], B173
- Rope-lay stranded
[Ref: 449]
- Composite conductors
(copper plus copper-clad
B229 [Ref: 450]
steel)
Tubular products
- Bus pipe and tube
B188 [Ref: 379]
- Pipe
- Welded copper tube
B477 [Ref: 452]
Miscellaneous
- Standard classification of
B224 [Ref: 453]
copper
- Electrolytic Cu wirebars,
cakes, slabs, billets,
B5 [Ref: 454]
ingots and ingot bars
- Anodes
- Die forgings
B283 [Ref: 456]
7
QQ-W-343 [Ref: 404]
QQ-W-343 [Ref: 404]
QQ-W-343 [Ref: 404]
-
QQ-B-825 [Ref: 440]
WW-P-377 [Ref: 451]
QQ-A-673 [Ref: 455]
-
EN specification for CuETP (C11000)
Number
EN 13601
EN 13600
EN 13602
EN 1652
EN 1976
EN 1977
EN 13599
EN 13605
EN 12165
EN 12420
EN 13148
Title - products
Copper and copper alloys. Copper
rod, bar and wire for general
electrical purposes
Copper and copper alloys. Seamless
copper tubes for electrical purposes
Copper and copper alloys. Drawn,
round copper wire for the
manufacture of electrical conductors
Copper and copper alloys. Plate,
sheet, strip and circles for general
purposes
Copper and copper alloys. Cast
unwrought copper products
Copper and copper alloys. Copper
drawing stock (wire rod)
Copper and copper alloys. Copper
plate, sheet and strip for electrical
purposes
Copper and copper alloys. Copper
profiles and profiled wire for electrical
purposes
Copper and copper alloys. Wrought
and unwrought forging stock
Copper and copper alloys. Forgings
Copper and copper alloys. Hot-dip
tinned strip
8
Chemical composition
Chemical composition
Ag [wt.%]
As [wt.%]
Bi [wt.%]
Cd [wt.%]
Co [wt.%]
Cr [wt.%]
Cu [wt.%]
Fe [wt.%]
Mn [wt.%]
Ni [wt.%]
O2 [wt.%]
P [wt.%]
Pb [wt.%]
S [wt.%]
Sb [wt.%]
Se [wt.%]
Sn [wt.%]
Te [wt.%]
Zn [wt.%]
[Ref: 567]
Value
0,0009
6E-05
1E-05
1E-06
3E-06
9E-06
99,97884
0,00016
4E-06
0,00017
0,019
0,0002
7E-05
0,00028
6E-05
1E-05
3E-05
2E-05
0,00018
Comments
Calculated
* Chemical composition measured for wire rod (diameter 8.00 mm) obtained from
Contirod technology
Composition limits: 99.90 Cu min (silver counted as copper). Silver has little effect on
mechanical and electrical properties but does raise the recrystallization temperature and
tends to produce a fine-grain copper. Iron as present in commercial copper, has no effect
on mechanical properties, but even traces of iron can cause C11000 to be slightly
ferromagnetic. Sulfur causes spewing and unsoundness, and is kept below 0.003% in
ordinary refinery practice. Selenium and tellurium are usually considered undesirable
impurities but may be added to improve machinability. Bismuth creates brittleness in
amounts greater than 0.001%. Lead should not be present in amounts greater than
0.005% if the copper is to be hot rolled. Cadmium is rarely present; its effect is to
toughen copper without much loss in conductivity. Arsenic decreases the conductivity of
copper noticeably, although it is often added intentionally to copper not used in electrical
service because it increases the toughness and heat resistance of the metal. Antimony is
sometimes added to the copper when a high recrystallization temperature is desired
[Ref: 316, 409, 412, 254, 415, 343, 344]
Chemical composition of CuETP according to EN 1976, EN 1977
Chemical composition, wt%
Other named elements
Cu1)
Bi
9
O
Pb
max
max
(As + Bi + Cd + Co + Cr + Fe + Mn + Ni +
O + P + Pb + S + Sb + Se + Si + Sn + Te
99,90
0,0005
+ Zn) maximum 0,03%
1)
Including Ag with maximum 0,015%
2)
Maximum permissible oxygen 0,060%
Literature: [Ref: 335, 336]
10
min
0,00402)
0,005
Chemical composition of CuETP1 according to EN 1976, EN 1977
Ag
As
Bi
Cd
Co
Cr
Fe
0,00
25
0,00
05
0,00
02
-1)
-3)
-1)
0,00
10
1)
2)
3)
Chemical composition, wt%
Mn Ni
O
P
Pb
max.
-1)
-3)
0,04
00
-1)
1)
2)
0,00
05
S
Sb
Se
Si
Sn
Te
Zn
0,00
15
0,0004
0,00
02 2)
-3)
-3)
0,00
02
-3)
1)
(As + Cd + Cr + Mn + P + Sb) maximum 0,0015%
(Bi + Se + Te) maximum 0,0003%, including (Se + Te) maximum 0,00030%
3)
(Co + Fe + Ni + Si + Sn + Zn) maximum 0,0020%
Literature: [Ref: 335, 336]
11
Cu
-
Mechanical properties
Mechanical properties
UTS [MPa]
YS [MPa]
Elongation [%]
Hardness
Value
220-395
69-365
4-55
10-62
40-95
25-64
Young’s modulus [GPa]
115
115-130
Kirchhoff’s modulus [GPa]
44
44-49
Comments
HRB
HRF
HR30T
O60 temper
Cold-worked
(H) temper
O60 temper
Cold-worked
(H) temper
Poisson ratio
0,33
[Ref: 316, 409, 254, 342, 340, 415, 268, 343, 344, 143, 346,
417, 418, 419, 420, 421, 422, 423, 66, 267, 355, 91, 354, 406]
Variation of tensile properties with amount of cold reduction by rolling for Cu-ETP
(C11000) and similar coppers (Cu-ETP1) [Ref: 254]
12
Variation of hardness with amount of cold reduction by rolling for Cu-ETP (C11000) and
similar coppers (Cu-ETP1) [Ref: 254]
Mechanical properties of CuETP, CuETP1 according to KME [Ref: 417]
Temper
UTS, MPa
YS, MPa
R220 (a)
R240
R290
R360
220 - 260
240 - 300
290 - 360
≥ 360
< 140
≥ 180
≥ 250
≥ 320
(a) Annealed
Elongation A
50, %
33
8
4
2
Hardness HV
40 - 65
65 - 95
90 - 110
≥ 110
Mechanical properties of CuETP wire rod (diameter 8.0mm) used in electrical application
[Ref: 316, 254, 343, 344, 143, 346, 417, 418, 419, 420, 421, 422, 423, 66, 267, 355,
91, 354, 357, 358]
Material
CuETP
Production technology
Chemical
composition
Cu + Ag
[%wt]
-
Contirod, Southwire,
Continuus Properzi
99,95 - 99,97
99,98
13
Content by
weight of
elements
Oxygen
UTS
Elongation A250
Ductility
[ppm]
150
25
[ppm]
[MPa]
[%]
[mm]
150 - 400
220 - 240
40 - 45
0,2
160 - 200
220
45 - 50
0,05
Mechanical properties of CuETP, CuETP1 wire rod [Ref: 567]
Production
technology
Contirod
YS
[MPa]
140,0
UTS
[MPa]
220,7
Elongation A250
[%]
42,3
Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) from Contirod
technology [Ref: 567]
14
Tensile stress characteristic of CuETP wire rod (diameter 8.0mm) by Fujiwara [Ref: 357]
Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process [Ref: 567]
15
Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process [Ref: 567]
16
UTS/YS ratio vs strain of Cu-OFE wires (diameter 0,5-8.0 mm) after drawing process
[Ref: 567]
17
Elongation A250 vs strain of Cu-ETP wires (diameter 0,5-8.0 mm) after drawing process
[Ref: 567]
18
Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process -logarithmic system [Ref: 567]
19
Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) after drawing
process -logarithmic system [Ref: 567]
20
Typical mechanical properties of CuETP, CuETP1 [Ref: 316, 409, 254, 340, 268, 344, 91, 354]
Hardness
Temper
UTS,
MPa
YS (a),
MPa
OS050
OS025
H00
H01
H02
H04
H08
H10
H20
220
235
250
260
290
345
380
395
235
69
76
195
205
250
310
345
365
69
OS050
H00
H01
H04
M20
220
250
260
345
220
Elongation in A50, %
69
195
205
310
60
H04
310
275
H80
(40%)
380
345
HRF
Flat products, 1 mm thick
45
40
45
45
60
60
70
70
84
84
90
90
94
94
95
95
45
45
Flat products, 6 mm thick
50
40
40
60
35
70
12
90
50
40
Flat products, 25 mm thick
20
85
Rod, 6 mm in diameter
10
94
220
Rod, 25 mm in diameter
69
55
40
330
305
220
69
55
40
Rod, 50 mm in diameter
H80
(16%)
310
275
OS050
240
Wire, 2 mm in diameter
35(d)
-
OS050
H80
(35%)
M20
16
20
21
87
85
Shear
strength,
MPa
Fatigue
strength (b),
MPa
HRB
HR30T
10
25
40
50
60
62
-
25
36
50
57
63
64
-
150
160
170
170
180
195
200
200
160
76
90
90
97
-
10
25
50
-
-
150
170
170
195
150
-
45
-
180
-
60
-
200
-
-
-
150
-
47
-
185
115(c)
-
-
150
-
45
-
180
-
-
-
165
-
H04
H08
280
455
OS050
OS025
H55
(15%)
H80
(40%)
220
235
1.5(e)
1.5(e)
Tube, 25 mm outside diameter, 1.65 mm wall thickness
69
45
40
76
45
45
-
200
230
-
150
160
-
275
220
25
77
35
45
180
-
380
345
8
95
60
63
200
-
Shapes, 13 mm in diameter
OS050
220
69
50
40
150
H80
275
220
30
35
180
(15%)
M20
220
69
50
40
150
M30
220
69
50
40
150
(a) At 0.5% extension under load. (b) At 108 cycles. (c) At 3 × 108 cycles in a rotating beam test. (d) Elongation in 254 mm. (e)
Elongation in 1500 mm.
22
Mechanical properties of CuETP, CuETP1 (flat, round, square, hexagonal) according to EN13601 by Aurubis [Ref: 418]
Dimensions, mm
Metallurgical
State D
D
H035 (a)
Round, square,
hexagonal
up
From
To
to
2
80
2
80
Hardness
Thickness
0.5
0.5
Up
to
-
From
Width
To
From
40
40
1
1
Up
to
-
HB
Elongation
HV
Max.
Min.
UTS
MPa
YS,
MPa
Max.
A100
[%]
A
[%]
To
Min.
200
200
Cold drawn product without any specific mechanical properties
35
65
35
65
-
R200 (a)
2
-
80
1,0
-
40
5
-
200
-
-
-
-
200
Max.120
25
35
H065
2
-
80
0,5
-
40
1
-
200
65
90
70
95
-
-
-
R250
2
-
10
1,0
-
10
5
-
200
-
-
-
-
250
8
12
R250
2
10
30
-
-
-
-
-
-
-
-
-
-
250
-
15
R230
-
30
80
-
10
40
-
10
200
-
-
-
-
230
-
18
H085
H075
2
-
40
40
80
0,5
-
20
20
40
1
-
20
120
160
85
75
110
100
90
80
115
105
-
-
-
R300
2
-
20
1,0
-
10
5
-
120
-
-
-
-
300
5
8
R280
-
20
40
-
10
20
-
10
120
-
-
-
-
280
-
10
R260
-
40
80
-
20
40
-
20
160
-
-
-
-
260
-
12
H100
2
-
10
0,5
-
5
1
-
120
100
-
110
-
-
-
-
R350
2
-
10
1,0
-
5
5
-
120
-
-
-
-
350
Min.
200
Min.
180
Min.
160
Min.
260
Min.
240
Min.
220
Min.
320
3
5
(a) Annealed
23
Mechanical properties of CuETP, CuETP1 according to EN13606 by Aurubis [Ref: 418]
Metallurgical State
D
H035 (a)
R200 (a)
H065
R240
H080
R280
Dimensions, mm
Thickness
Width
Max.
Max.
50
180
50
180
50
180
10
150
10
150
5
100
5
100
Hardness
HB
Min.
35
65
80
-
HV
Max.
Min.
65
35
95
70
115
85
(a) Annealed
24
UTS MPa
Max.
Min.
Same as drawn
70
200
100
240
120
280
YS,
MPa
Max. 120
Min. 160
Min. 240
Elongation
A
A100 [%]
[%]
25
-
35
15
8
Exploitation properties
Heat resistance
Mechanical and electrical properties vs temperatures
Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hour
annealing process (At temperatures from 100 °C to 400 °C the UTS of Cu-ETP wire rod is
stable, whilein the temperature range of 500 °C to 900 decreases) [Ref: 567]
25
Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 1 hour
annealing process [Ref: 567]
26
Variation of tensile properties and grain size of electrolytic tough pitch copper (Cu-ETP)
and similar coppers (Cu-ETP1) [Ref: 254]
27
Short-time elevated-temperature tensile properties of Cu-ETP (C11000) and similar
coppers (Cu-ETP1) [Ref: 254]
Low-temperature tensile properties of Cu-ETP (C11000) and similar coppers (Cu-ETP1)
[Ref: 254]
28
Tension stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire
rod after annealing process [Ref: 567]
29
Tensile stress characteristic of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire
rod after annealing process [Ref: 567]
Elongation vs strain of Cu-ETP wires (diameter 0.5-8.0 mm) obtained from wire rod after
annealing process [Ref: 567]
30
Softening resistance of Cu-ETP [Ref: 417]
Thermal expansion and enthalpy of Cu-ETP. (a) Total thermal expansion from -190 °C.
(b) Enthalpy (heat content) above 0 °C [Ref: 254]
Thermal conductivity of Cu-ETP in different temperature [Ref: 254, 340, 415, 344, 267,
91, 406]
Temperature
K
4.2
20
77
194
°C
-268.8
-253
-196
-79
31
Thermal conductivity
W/m·K
300
530
550
400
273
373
573
973
0
100
300
700
390
380
370
300
Softening resistance of cold drawn Cu-ETP wires [Ref: 567]
32
Softening resistance of cold drawn Cu-OFE wires[Ref: 567]
Long-therm heat resistance, e.g. Arrhenius curve
33
Mechanical properties vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24
hours annealing process [Ref: 567]
34
Elongation A250 vs temperature of Cu-ETP wire rod (diameter 8.0mm) after 24 hours
annealing process [Ref: 567]
35
Percentage reduction of area vs temperature of Cu-ETP wire rod (diameter 8.0mm) after
24 hours annealing process [Ref: 567]
Half- softening temperature
Half-softening temperature of Cu-ETP wire [Ref: 567]
Diameter of wire
Strain
[mm]
7,0
5,5
4,5
2,5
0,5
[-]
0,28
0,76
1,16
2,38
5,59
Half-softening
temperature
[°C]
265
210
210
175
125
Corrosion resistance
Hydrogen embrittlement resistance
CuETP (C11000) is subjected to embrittlement when heated to 370 °C or above in a
reducing atmosphere, as in annealing, brazing or welding. If hydrogen or carbon
monoxide is present in the reducing atmosphere embrittlement can be rapid. Literature:
[Ref: 316, 409, 410, 411, 412, 413, 414, 325, 411, 254, 340, 268, 343, 143, 346, 335,
336, 417, 418, 419, 420, 421, 422, 423, 267, 354, 424, 425, 426, 427, 92]
36
Other kind of corrosion elements
Type of
corrosion
Atmospheric
Marine
environment
Stress crack
Hydrogen
embrittlement
Electrolytic
Suitability
Literature
[Ref: 254, 340, 415, 344,
417, 419, 420, 421, 422,
423, 267, 406]
[Ref: 254, 268, 344, 418,
Good
423]
Good
[Ref: 254, 340, 415, 344]
CuETP (C11000) is subjected to
[Ref: 316, 409, 410, 411,
embrittlement when heated to 370 °C or
412, 413, 414, 325, 411,
above in a reducing atmosphere, as in
254, 340, 268, 343, 143,
annealing, brazing or welding. If hydrogen 346, 335, 336, 417, 418,
or carbon monoxide is present in the
419, 420, 421, 422, 423,
reducing atmosphere embrittlement can be 267, 354, 242, 425, 426,
rapid
427, 92]
[Ref: 254, 340, 268, 347,
Good
423, 406]
Good
37
Other
C11000 has excellent corrosion resistance
to weathering and very good resistance to
many chemicals. It is often used
specifically for corrosion resistance. It is
suitable for use with most waters, and can
be used underground because it resists soil
corrosion. It resists non-oxidising mineral
and organic acids, caustic solutions and
saline solutions. Depending on
concentration and specific conditions of
exposure, copper generally resists: acids
mineral acids such as hydrochloric and
sulphuric acids; organic acids such as
acetic acid (including acetates and
vinegar), carbolic, citric, formic, oxalic,
tartaric and fatty acids; acidic solutions
containing sulphur, such as the sulphurous
acid and sulphite solutions used in pulp
mills. Alkalies fused sodium and potassium
hydroxide; concentrated and dilute caustic
solutions. Salt solutions aluminium
[Ref: 254, 342, 268, 347,
chloride, aluminium sulphate, calcium
344, 346, 417, 421, 66,
chloride, copper sulphate, sodium
267, 354]
carbonate, sodium nitrate, sodium
sulphate, zinc sulphate. Waters all potable
waters, many industrial and mine waters,
seawater and brackish water. The
corrosion resistance of C11000 is not
adequate for: ammonia, amines and
ammonium salts; oxidizing acids such as
chromic and nitric acids and their salts;
ferric chloride; persulphates and
perchlorates; mercury and mercury salts.
Copper may also corrode in aerated non
oxidising acids such as sulphuric and acetic
acids, although it is practically immune
from these acids if air is completely
excluded. Copper is not suitable for use
with acetylene, which can react to form an
acetylide which is explosive. C11000 is
considered to be immune to stress
corrosion cracking in ammonia and the
similar media which cause season cracking
in brass and other copper alloys.
www.copper.org
Rheological resistance
Stress relaxation
38
Relaxation at stress level 0.5 × Yield Strength [Ref: 419]
Stress relaxation curves for Cu-ETP (C11000) and similar coppers (Cu-ETP1). Data are
H80 temper wire, 2 mm in diameter, and represent the time-temperature combination
necessary to produce a 5% reduction in tensile strength [Ref: 254]
Creep
39
Creep properties of CuETP, CuETP1 (C11000)
Testing
temperature
Stress
°C
MPa
Temper
Total
Duration of
extension(a) Intercept
test
h
%
%
Minimum
creep rate
% per
1000 h
Strip, 2.5mm thick
55
2500
2.6
2.0
0.15
130
100
2600
10.0
7.6
1.2
OS030
140
170
29.8(b)
39
55
2000
3.3
2.3
0.65
175
100
350
15(b)
8.0
6.3
55
8250
0.20
0.15
0.01
130
100
8600
0.67
0.26
0.042
H01
140
1750
2.4(b)
0.32
0.45
55
6850
1.14
0.14
0.088
175
100
1100
2.0
0.22
0.66
55
7200
0.24
0.13
0.01
130
100
8600
1.02
0.25
0.054
H02
140
4680
3.4(b)
0.36
0.27
175
55
1050
3.3(b)
0.6
55
8250
1.58
0.08
0.035
H06
130
100
8700
7.31
0.16
0.055
140
4030
11(b)
0.24
0.17
Rod, 3.2 mm diameter
2.5
6000
0.08
0.016
0.011
4.1
6000
0.19
0.010
0.030
OS025
260
7.2
6500
0.64
0.113
0.080
13.8
6500
2.88
0.87
0.306
7.2
6500
0.06
0.045
0.011
14.5
6500
0.20
0.112
0.012
H08
205
28
6500
1.08
0.41
0.097
50
6500
5.42
2.47
0.44
(a) Total extension is initial extension (not given in table) plus intercept plus the product of
minimum creep rate and duration.
(b) Rupture test
Literature: [Ref: 254]
Wear resistance
Friction resistance
Values given below apply to any of the unalloyed copperd in contact with the indicated
materials without lubrication of any kind between the contacting surfaces:
Opposing material
Carbon steel
Cast iron
Glass
Coefficient of friction
Static
Sliding
0.53
0.36
1.05
0.29
0.68
0.53
Literature: [Ref: 254]
40
Fatigue resistance
Fatigue cracking
Fatigue strength at 108 cycles in
a reversed bending test , MPa
Flat products, 1 mm thick
OS025
76
H02
90
H04
90
H08
97
Rod, 25 mm in diameter
115 (At 3 × 108 cycles in a rotating
H80 (35%)
beam test)
Literature: [Ref: 254]
Temper
Values shown in table are typical for all tough pitch, oxygen-free, phosphorus-deoxidized
and arsenical coppers. Copper does not exhibit an endurance limit under fatigue loading
and, on the average, will fracture in fatigue at the stated number od cycles when
subjected to an alternating stress equal to the corresponding fatigue strenght (see Fig.)
[Ref: 254]
Rotating-beam fatigue strength of Cu-ETP (C11000) wire, 2 mm in diameter, H80 temper
[Ref: 254]
The fatigue strength is defined as the maximum bending stress amplitude which a
material withstands for 107 load cycles under symmetrical alternate load without
breaking. It is dependent on the temper tested and is about 1/3 of the tensile strength
[Ref: 419].
41
Impact strength
Typical impact strength of Cu-ETP (Cu-ETP1)
Product and condition
Impact strength, J
Charpy V-notch
Hot rolled, annealed
96
Charpy keyhole-notch
As-cast
11
As-hot rolled
43
Rod- Annealed
52
- Commercial temper
35
Izod
Rod- Annealed and drawn 30%
54
- Drawn 30%
45
Plate- As-hot rolled
52
- Annealed
53(a)
39(b)
26(a)
12(b)
(a) Parallel to rolling direction. (b) Transverse to rolling direction
Literature: [Ref: 254]
Cold rolled 50%
42
Fabrication properties
Fabrication properties
Soldering
Brazing
Hot dip tinning
Electrolytic tinning
Electrolytic silvering
Electrolytic nickel coating
Laser welding
Value
Comments
Excellent
Good
Excellent
Excellent
Excellent
Excellent
Less suitable
Not
Oxyacetylene Welding
Recommended
Not
Gas Shielded Arc Welding
Recommended
Not
Coated Metal Arc Welding
Recommended
Resistance welding
Less suitable
Not
Spot Weld
Recommended
Not
Seam Weld
Recommended
Butt Weld
Good
Capacity for Being Hot Formed
Excellent
Forgeability Rating
65
Machinability Rating
20
Less suitable
[Ref: 254, 340, 415, 268, 343, 344, 417, 418, 419, 422, 423,
267, 91, 354, 406, 427]
43
Technological properties
Technological properties
Value
Melting temperature [°C]
1083
Casting temperature [°C]
1140-1200
Annealling temperature [°C]
475-750
Stress relievieng temperature
[°C]
150-200
Hot working temperature [°C]
750-875
44
Comments
Literature
[Ref: 316, 254
, 342, 340,
415, 268, 344,
143, 341, 417,
418, 419, 420,
421, 422, 423,
267, 355, 91,
354, 406]
[Ref: 316, 254
, 342, 340,
415, 268, 343,
344, 346, 417,
418, 419, 420,
421, 422, 423,
66, 267, 355,
91, 354, 406]
[Ref: 254, 340
, 268, 344,
421, 422, 423,
66, 267, 91,
357]
[Ref: 254, 340
, 268, 417,
418, 419, 423,
267, 91, 354,
406]
[Ref: 254, 342
, 340, 268,
344, 66, 267,
91, 406]
Time - temperature relationships for annealing Cu-ETP and similar coppers (Cu-ETP1)
[Ref: 254]
45
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91. Key to Metals - Data Base - www.keytometals.com
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342. Casting - D. M. Stefanescu, ASM Handbook, The Materials Information Society
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46
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373. ASTM B152 / B152M - 13 Standard Specification for Copper Sheet, Strip,
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and Shapes and General Purpose Rod, Bar, and Shapes 375. ASTM B272 - 12 Standard Specification for Copper Flat Products with
Finished (Rolled or Drawn) Edges (Flat Wire and Strip) 379. ASTM B188 - 10 Standard Specification for Seamless Copper Bus Pipe and
Tube 380. ASTM B124 / B124M - 12 Standard Specification for Copper and Copper
Alloy Forging Rod, Bar, and Shapes 381. QQ-C-502C (Notice-1), Federal Specification: Copper Rods And Shapes; And
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385. ASTM B1 - 12 Standard Specification for Hard-Drawn Copper Wire 386. ASTM B2 - 12e1 Standard Specification for Medium-Hard-Drawn Copper
47
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396. ASTM B33 - 10 Standard Specification for Tin-Coated Soft or Annealed
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48
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418. Data Sheet - Cu-ETP - Aurubis
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436. ASTM B248 - 12 Standard Specification for General Requirements for
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Building Construction 438. ASTM B451-93 Specification for Copper Foil, Strip, and Sheet for Printed
49
Circuits and Carrier Tapes - (Withdrawn 1998)
440. QQ B 825 Bus Bar, Copper, Aluminum Or Aluminum Alloy 441. ASTM B250 / B250M - 12 Standard Specification for General Requirements
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Conductors for Electrical Conductors 445. ASTM B8 - 11 Standard Specification for Concentric-Lay-Stranded Copper
Conductors, Hard, Medium-Hard, or Soft 446. ASTM B226 - 11 Standard Specification for Cored, Annular, Concentric-LayStranded Copper Conductors 447. ASTM B496 - 04(2010)e1 Standard Specification for Compact Round
Concentric-Lay-Stranded Copper Conductors 448. ASTM B172 - 10 Standard Specification for Rope-Lay-Stranded Copper
Conductors Having Bunch-Stranded Members, for Electrical Conductors 449. ASTM B173 - 10 Standard Specification for Rope-Lay-Stranded Copper
Conductors Having Concentric-Stranded Members, for Electrical Conductors 450. ASTM B229 - 12 Standard Specification for Concentric-Lay-Stranded Copper
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Electrical Contact Alloy 453. ASTM B224 - 10 Standard Classification of Coppers 454. ASTM B5 - 11 Standard Specification for High Conductivity Tough-Pitch
Copper Refinery Shapes 455. QQA673 Anode, Plating 456. ASTM B283 / B283M - 12 Standard Specification for Copper and CopperAlloy Die Forgings (Hot-Pressed) 567. AGH-UST - own research - contact person: tknych@agh.edu.pl
50