APC209
4 Channel Rail to Rail Output Operating Amplifier
Features
•
•
•
•
•
•
•
•
•
General Description
The APC209 consists of four independent, high gain and
high output driver current, CMOS operating amplifier,com-
Operating Voltage: VDD : 2.4V~6.0V
Low Input Current
bining rail to rail output range with large output current. It
provides a low input bias current 2pA. The output swing
Rail to Rail Output Swing
of the amplifier, guaranteed for loads down to 1kΩ and
output current to an 10Ω load from a 5V power supply.
Push-Pull Output Driving
High Output Current Drive :100mA
APC209 is designed to operate at 3V, especially wellsuited for low voltage application.
Wide Bandwidth: 7MHz
Fast Slew Rate 5V/ms
Simplified Application Circuit
Available in 14 pin TSSOP Package
Lead Free and Green Devices Available
(RoHS Compliant)
Applications
•
•
•
Input
Output
Amplifiers
1/2 VDD
Filters
Analog circuit
Ordering and Marking Information
Package Code
O : TSSOP-14
Operating Ambient Temperature Range
I : -40 to 85 °C
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APC209
Assembly Material
Handling Code
Temperature Range
Package Code
APC209 O :
APC209
XXXXX
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
1
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APC209
Pin Configuration
1OUT 1
14 4OUT
1INN 2
13 4INN
1INP 3
VDD 4
12 4INP
APC209
Top View
11 GND
2INP 5
10 3INP
2INN 6
9 3INN
2OUT 7
8 3OUT
Absolute Maximum Ratings (Note 1)
Symbol
VDD
Parameter
Supply Voltage (VDD to GND)
Input Voltage (INN,INP to GND)
PD
Power Dissipation
TJ
Maximum Junction Temperature
TSTG
TSDR
Rating
Unit
-0.3 ~ 6
V
-0.3 ~ VDD+0.3
V
Internally Limited
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
W
150
o
-65 ~ 150
o
260
o
C
C
C
Note 1 : Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Junction-to-Ambient Resistance in Free Air
Typical Value
Unit
(Note 2)
TSSOP-14
o
100
C/W
Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operation Conditions (Note 3)
Symbol
Range
Unit
VDD
Supply Voltage
Parameter
2.4 ~ 5.5
V
VICM
Common Mode Input Voltage
0 ~ VDD-1
TA
Ambient Temperature
-40 ~ 85
o
V
TJ
Junction Temperature
-40 ~ 125
o
C
C
Note 3 : Refer to the typical application circuit
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
2
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APC209
Electrical Characteristics
Unless otherwise specified, these specifications apply over VDD=5V, GND=0V and TA= 25 oC, unless otherwise
specified.
Symbol
Parameter
APC209
Test Conditions
TA=25 oC
Unit
Min
Typ
Max
-
4
10
mV
2
-
pA
VOS
Input Offset Voltage
IBIAS
Input Bias Current
-
VICM
Input Command Voltage Range
0
-
VDD-0.8
V
RIN
Input Resistance
-
5
-
MΩ
VO
Output Voltage Swing
0
-
5
V
-25 oC<TA<75 oC
RL=2kΩ
o
o
VOH
Output High Voltage
RL=10kΩ,-25 C<TA<75 C
-
4.98
-
V
VOL
Output Low Voltage
RL=10kΩ,-25 oC<TA<75 oC
-
0.02
-
V
Output Source Current
VO=4.5V
-
-300
-
Output Sink Current
VO=0.5V
-
300
-
-
1.25
4
2.4V<VDD<6V, TA=25 C
-
2.5
5
Common Mode Rejection Ratio
VO=4.5V
-
-80
-
dB
Input Offset Current
VO=0.5V
-
-
1
pA
Supply Voltage Rejection Ratio
Vrr=100mVPP, fin=100Hz,RL=2kΩ
-
-50
-
dB
Large Signal Voltage Gain
RL=10kΩ
-
85
-
dB
Gain Bandwidth Product
RL=10kΩ
-
7
-
MHz
PM
Phase Margin
AV=100, RL=10kΩ
-
48
-
Degree
SR
Slew Rate
VOPP=0.8V, CI=150pF, RL=10kΩ
-
5.6
-
V/µS
Av=1
-
0.01
-
%
IOUT
IDD
CMRR
IOS
PSRR
Av
GBW
Supply Current (Per Channel)
Total Harmonic Distortion Plus
THD+N
Noise
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
VO=1/2VDD, -25 oC<TA<75 oC
o
3
mA
mA
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APC209
Typical Operating Characteristics
Supply Current vs. Supply Voltage
Supply Current vs. Temperature
2.0
4
No Load
1.6
Supply Current (mA)
Supply Current (mA)
VDD=5V
1.8
3.5
3
2.5
2
1.5
1
1.4
1.2
1.0
0.8
0.6
0.4
0.5
0.2
0
0
1
2
3
4
5
6
0.0
7
-25
Input Offset Voltage vs. Temperature
7
25
50
75
Supply Voltage
6
Input Common Mode Voltage (V)
VDD=5V
Input Offset Voltage (mV)
0
Temperature(°C)
Input Common Mode Voltage vs.
Supply voltage(V)
6
5
4
3
2
1
0
5
4
3
2
1
0
-25
0
25
50
0
75
1
2
3
4
5
6
7
Supply Voltage(V)
Temperature(°C)
Output Swing vs. Supply Voltage
Output Swing vs. Temperature
6
8
VDD=5V, RL=2kΩ
RL=2kΩ
7
5
Output Swing (V)
Output Swing (V)
6
5
4
3
2
4
3
2
1
1
0
0
0
1
2
3
4
5
6
7
-25
Supply Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
0
25
50
75
Temperature(°C)
4
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APC209
Typical Operating Characteristics (Cont.)
Output Current vs. Output Swing
Output Swing vs. Load Resistance
1000
6
VDD=5V
VDD=5V
Output Swing (V)
Output Swing (mA)
5
100
10
4
3
2
1
1
0.1
0
0
1
2
3
4
5
6
10
Output Swing (V)
Sink Current vs. Output Voltage
500
VDD=5V
400
Source Current (mA)
Sink Current (mA)
350
300
250
200
150
100
350
300
250
200
150
100
50
50
0
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
Output Voltage Referred to Vdd(V)
Output Voltage Referred to Ground (V)
Large Signal Voltage Gain vs. Frequency
+90
Large Signal Frequency Response
6
VDD=5V
VDD=5V, RL=2kΩ
5
Output Swing (V)
+80
Gain(dB)
10k
VDD=5V
450
400
+100
1k
Source Current vs. Output Voltage
500
450
100
Load Resistance (Ω)
+70
+60
+50
+40
+30
+20
4
3
2
1
+10
+0
10
100
1k
10k
100k
1M
0
10
10M
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
5
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APC209
Typical Operating Characteristics (Cont.)
CMRR vs. Frequency
+0
95
-10
90
-20
85
-30
CMRR (dB)
Av (dB)
Large Signal Voltage Gain vs. Supply Voltage
100
80
75
70
VDD=5V,RL=10kΩ
-40
-50
-60
65
-70
60
-80
55
-90
50
2
3
Supply Voltage (V)
4
-100
5
10
10k
100k
Voltage Follower Pulse Response
+0
9
VDD=5V
-10 VRR=100mVpp/100Hz
8
4
7
3
6
2
5
1
4
0
3
-1
2
-2
1
-3
Output Voltage (V)
-30
-40
-50
-60
-70
0
100
1k
10k
Frequency (Hz)
Voltage Follower Pulse Response
0.5
0.1
0.3
0
0.2
-0.1
0.1
-0.2
0
-0.3
-0.1
-0.4
2
2
3
4
5
Time (µs)
0.4
1
1
0.2
VDD=5V,CL=270pF
0
-4
0
100k
3
4
Input Voltage (V)
-80
10
-0.2
5
VDD=5V,RL=2kΩ
-20
PSRR (dB)
1k
Frequency (Hz)
PSRR vs. Frequency
Output Voltage (V)
100
Input Voltage (V)
1
-0.5
Time (µs)
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
6
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APC209
Pin Description
PIN
FUNCTION
NO.
NAME
1
1OUT
The output pin of 1st operating amplifier.
2
1INN
The inverting input pin of 1st operating amplifier.
3
1INP
The non-inverting input pin of 1st operating amplifier.
4
VDD
Operating Amplifier’s supply voltage pin.
5
2INP
The non-inverting input pin of 2nd operating amplifier.
6
2INN
The inverting input pin of 2nd operating amplifier.
7
2OUT
The output pin of 2nd operating amplifier.
8
3OUT
The output pin of 3rd operating amplifier.
9
3INN
The inverting input pin of 3rd operating amplifier.
10
3INP
The non-inverting input pin of 3rd operating amplifier.
11
GND
Operating Amplifier’s ground.
12
4INP
The non-inverting input pin of 4th operating amplifier.
13
4INN
The inverting input pin of 4th operating amplifier.
14
4OUT
The output pin of 4th operating amplifier.
Block Diagram
VDD
1INP
1OUT
1INN
2INP
2OUT
2INN
3INP
3OUT
3INN
4INP
4OUT
4INN
GND
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
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APC209
Package Information
TSSOP-14
D
E
E1
SEE VIEW A
c
A
GAUGE PLANE
SEATING PLANE
VIEW A
S
Y
M
B
O
L
L
θ
A1
A2
0.25
b
e
TSSOP-14
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
1.20
0.047
A1
0.05
0.15
0.002
0.006
A2
0.80
1.05
0.031
0.041
b
0.19
0.30
0.007
0.012
0.008
c
0.09
0.20
0.004
D
4.90
5.10
0.193
0.201
0.260
0.177
E
6.20
6.60
0.244
E1
4.30
4.50
0.169
0.018
e
0.65 BSC
0.026 BSC
L
0.45
0.75
θ
0o
8o
0o
0.030
8o
Note : 1. Followed from JEDEC MO-153 AB-1.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
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APC209
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
16.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.50±0.10
P0
P1
P2
D0
D1
T
A0
B0
K0
2.00±0.10
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
1.60±0.20
TSSOP-14
4.00±0.10
8.00±
0.10
(mm)
Devices Per Unit
Package Type
Unit
Quantity
TSSOP-14
Tape & Reel
2500
Copyright  ANPEC Electronics Corp.
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APC209
Taping Direction Information
TSSOP-14
USER DIRECTION OF FEED
Classification Profile
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
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APC209
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
Volume mm
>2000
260 °C
245 °C
245 °C
3
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
11
Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1tr≧100mA
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APC209
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.2 - Nov., 2009
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