Silicon for new trends in automotive powertrain electronics By Johan Janssens, Marcos Laraia and Bart De Cock 1. Introduction Today’s cars are evolving towards high energy efficiency at minimum environmental impact. While in the long term non-petroleum based powertrains seem to be the most promising answer, in the meantime the car industry is introducing further improvements building on available technology. A major trend is hybridization where a lot of growth is visible in micro hybrids (including stop-start) and mild hybrids. These “modest hybrid” solutions may seem to be already old-fashioned – yet a lot of electronic and mechanical development is still ongoing for these applications. This article will first examine some good examples of continuous improvements around the Lundell electrical machine, better known as the alternator. Thanks to better electronic control, its efficiency is increased, more energy can be recuperated and the impact of frequent engine starts is smoothened. A second section will highlight the addition of more sensors that will help further reduce petroleum-dependency of the classic combustion engine. The last paragraph explains how existing inductive sensor technology can improve brake pedals to help cars save even more energy. 2. Starter-Alternator In a starter-alternator system, the passive rectification diodes are replaced by high current switches. These switches are responsible for driving the starter-alternator as motor (starter mode) and performing synchronous rectification on the generated stator currents inside the alternator (alternator mode). Synchronous rectification dramatically improves the energy efficiency of the alternator by bypassing the (body) diode with a highly conductive channel, reducing the forward drop below 150mV. −more− prepredrivers drivers Fig 1 : Synchronous rectification in an alternator A main functional challenge in this application is to ensure a very fast switch off when the sign of the stator current is reversing; any delay in the switch off would result in unwanted battery discharge, in very much the same way as reverse recovery of a regular diode would do. To this end, the predriver IC contains high slew-rate drivers operating inside an autonomous gate control loop, designed to make the best possible compromise between ohmic loss during rectification and transition loss when the current changes sign. The integration of these predrivers in an IC is quite complex. Firstly, it requires the coexistence of many different voltage domains on a common silicon substrate, while at the same time ensuring reliable communication between these domains. Secondly, the driver IC of a starter alternator is placed in about the worst place possible, being subject to a wide range of transients like battery reversal, load dump, negative ground shifts, very large dV/dts on the stator phases (in the order of 100 Volts per microsecond), electromagnetic disturbances, etc. Still, using differential techniques and meticulous management of the parasitic (bipolar) effects in the silicon substrate, it is possible to build this type of IC in a cost effective bulk technology as opposed to Silicon on Insulator (SOI) technology. Bootstrap loader LSSUP HV SUPPLY LSS HSS SUP D Synchr. rectifier G Predriver Auto - Shutdown S LSS Fig 2 : Robust Predriver to control a High Cgs MOSFET in a starter-alternator Apart from the traditional lead-acid batteries, we see that more and more types of energy storage elements are being taken up in the power network around start/stop systems, such as Li-ion cells, supercapacitors, etc. In these systems, the safety aspect becomes as important as the core functionality. As a result, we see the ISO26262 safety norm popping up more and more, occasionally leading to a significant portion of the silicon dedicated to monitoring the application, checking the health of the IC and its companion ICs,… and ensuring a safe state in case it is needed. Lastly, the combination of intelligent circuits with high power components in the immediate vicinity means that the junction temperatures of the control circuits are rising considerably; it is not uncommon that operational junction temperatures above 175°C need to be considered in the application. Moreover, during the qualification phase of the component, temperatures up to 200°C may be used to further accelerate the degradation processes in order to keep the duration of the life test within a reasonable 2000 hours. By using a silicon process with extended temperature profile and taking this constraint into account during the design phase, this challenge can be effectively dealt with. 3. Sensing in the Internal Combustion Engine Sensors play a key role in allowing modern internal combustion engines to reach unprecedented efficiency levels while emissions are minimized. For instance, the mass airflow (MAF) sensor weighs the amount of air getting into the combustion chamber, so the right quantity of fuel is precisely injected. And at the other end of the engine, oxygen and NOx sensors directly measure the composition of the exhaust gas and forward the information back to the Engine Control Unit (ECU). The invasion of pressure sensors virtually everywhere is a trend that has accompanied the evolution of the internal combustion engine and its quest for increased control. It started with the manifold absolute pressure (MAP) sensor, which can be used alternatively to the MAF sensor. As fuel injection technology advanced, gasoline direct injection (GDI) and diesel direct injection (DDI) pressure sensors were needed to allow measure of the fuel pressure injected via a common rail fuel line directly into the combustion chamber of each cylinder. The latter sometimes also requires diesel particulate filters (DPF) to reduce soot, and the DPF needs a pressure sensor to help maintain appropriate operating conditions. Even outside the engine, tire pressure monitoring systems (TPMS) make sure tires are properly inflated to provide not only better safety, but also higher fuel efficiency due to lower rolling resistance. The final frontier for pressure sensors is the combustion chamber itself. In order to achieve ultimate combustion control, one of the necessary conditions is to know precisely the pressure inside all cylinders at all times. Some kinds of clean diesel engines are already running with the help of in-cylinder pressure sensors. Those same sensors are also a key enabler of new engines being researched, an example being the homogeneous charge compression ignition (HCCI), which aims to combine the low emissions of the gasoline engine along with the efficiency of the diesel engine. All these advancements present new technical challenges for which increasingly sophisticated integrated electronics are required. For one, better control requires tighter accuracy and tolerances of 0.5% are now commonplace. At the same time the operating temperature range keeps being extended, as the pressure sensing function moves closer to the heart of the engine. That puts additional contraints on the sensing element and on the electronics needed to compensate for its non-ideal characteristics. The block diagram of a new-generation pressure sensor IC is shown in Figure 3. Highprecision performance starts with a low-noise analog front end, followed by a highresolution sigma-delta A/D converter. Sophisticated digital signal processing provides for nonlinear temperature compensation of both offset and sensitivity of the sensing element. And the usual 5V analog output is being gradually replaced by standard digital outputs such as SENT and PSI5. This approach reduces total quantization error by eliminating need of the output D/A in the sensor and the A/D in the ECU side. Each individual sensor is calibrated in production and the compensation coefficients are stored in the internal EEPROM. VCC OVERVOLTAGE REVERSE BATTERY VBDR NCV7190 5V to 3.3V LINEAR REGULATOR POR GAIN NL REGISTER INM X G1 G2 X INP LPF Main ALU S-D A/D + X +/- S - S-D D/A LPF OUT D/A X COARSE OFF REGISTER REG FBACK NL REGISTER OFFSET TC REGISTER SENT Output TX GAIN TC REGISTER EEPROM OFFSET TC (a,b,c) COEFFICIENTS ALU A/D LATCH GAIN TC (a,b,c) COEFFICIENTS (feeds data to registers) SERIAL COMM INTERFACE TEMP INT TEMP SENSE G chopping chopping SENSOR T SENSE OFFSET NL REGISTER MUX VSS RC OSC CK GEN TESTABILITY & DIAGNOSTICS Fig 3 : Block diagram of a next-generation precision signal conditioning interface IC for pressure sensors 4. Inductive Position Sensor Interface for Brake Pedals A typical brake pedal has only a switch that helps to determine when the brake light should be turned on. With the addition of brake energy regeneration (regen) functions, new brake pedal position sensors are needed. In essence the standard friction brake system is upgraded with a control system that measures the exact displacement of the brake pedal. When the brake pedal is only slightly depressed, the friction brake system will not be activated yet. During this “regen band”, the energy regeneration system will measure the brake pedal displacement and determine how much kinetic energy of the moving car needs to be transferred towards a temporary energy storage. This energy storage can take on many forms; OEMs may prefer a pneumatic or hydraulic reservoir, a 48V battery, a supercapacitor, or even a flywheel. Mild hybrids will convert the stored energy back into propulsion power for a limited time during the next acceleration phase, whereas micro hybrids only use electrical regeneration to power the boardnet over extended periods. In order to measure the exact position of the brake pedal during the “regen band”, similar technologies as for accelerator pedals can be used. Figure 4 shows a block diagram of a contactless sensor solution for such an application. Fig 4 : Block diagram of an inductive position sensor application The custom inductive sensor interfaces developed by ON Semiconductor make use of advanced front-end filters in combination with intelligent processing. The on-chip drivers stimulate the sensor through at least one excitation inductor. The coupled output inductor(s) of the sensor will generate signals that contain information on the relative position of the excitation inductor(s) vs. the output inductor(s). The variation in relative position of the inductors depends largely on the chosen sensor design, it is typically the result of linear or rotational motions. The integrated circuit then translates the electrical input and output signals of the sensor into digital position information. This extracted position is then communicated to the microcontroller through an interface depending on customer requirements or preferences. Proprietary mixed-signal solutions can be selected to support sensor interface output formats that range from ratiometric Voltage, Sin-Cos Voltage, PWM, SENT or PSI5. Semiconductor suppliers in this sensor field should possess - besides the required technical skills - also the right attitude towards ISO26262. Many of the pedal applications in a car are directly related to safety and this needs to be addressed by means of an appropriate ISO26262 understanding, methodology and toolset. Inductive sensors can be composed in a redundant configuration sharing same structures for some functions and providing independent data outputs, achieving ASIL-D on the module level. The emerging regen applications combined with the new applicable safety standards are driving the industry towards the development of new integrated circuits for interfacing with inductive sensors. 5. Conclusion Developers and suppliers of electronic components are making the difference on the road towards future powertrains. Though the micro and mild hybrids offer a relatively modest fuel economy improvement, they are cost-effective. It is exactly this robust automotive step-by-step approach that will make the majority of cars evolve steadily towards new technologies while at the same time building the fundaments of nextgeneration powertrains. -Ends• Follow @onsemi on Twitter: www.twitter.com/onsemi About ON Semiconductor ON Semiconductor (Nasdaq: ONNN) is driving energy efficient innovations, empowering customers to reduce global energy use. The company offers a comprehensive portfolio of energy efficient power and signal management, logic, discrete and custom solutions to help design engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, LED lighting, medical, military/aerospace and power supply applications. ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, and a network of manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit http://www.onsemi.com. # # # ON Semiconductor and the ON Semiconductor logo are registered trademarks of Semiconductor Components Industries, LLC. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders. Although the company references its Web site in this news release, such information on the Web site is not to be incorporated herein. April 2014 Ref: ONSAR2606A