TPA3004D2 - Texas Instruments

TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 12-W STEREO CLASS-D AUDIO POWER AMPLIFIER WITH DC VOLUME CONTROL Check for Samples: TPA3004D2 FEATURES 1 • • 2 • • • • • DESCRIPTION 12-W/Ch Into an 8-Ω Load From 15-V Supply Efficient, Class-D Operation Eliminates Heatsinks and Reduces Power Supply Requirements 32-Step DC Volume Control From -40 dB to 36 dB Line Outputs For External Headphone Amplifier With Volume Control Regulated 5-V Supply Output for Powering TPA6110A2 Space-Saving, Thermally-Enhanced PowerPAD™ Packaging Thermal and Short-Circuit Protection The TPA3004D2 is a 12-W (per channel) efficient, Class-D audio amplifier for driving bridged-tied stereo speakers. The TPA3004D2 can drive stereo speakers as low as 4 Ω. The high efficiency of the TPA3004D2 eliminates the need for external heatsinks when playing music. Stereo speaker volume is controlled with a dc voltage applied to the volume control terminal offering a range of gain from -40 dB to 36 dB. Line outputs, for driving external headphone amplifier inputs, are also dc voltage controlled with a range of gain from -56 dB to 20 dB. An integrated 5-V regulated supply is provided for powering an external headphone amplifier. APPLICATIONS LCD Monitors and TVs Powered Speakers 10 µF Cs 0.1 µF Cs 0.1 µF Crinp 1 µF 1 µF Clinp 1 µF BSRP PVCCR PVCCR PGNDR ROUTN PGNDR PVCCR MODE V2P5 AVCC LINP 1 µF MODE_OUT SYSTEM CONTROL VAROUTR LINN RLINE_OUT VAROUTL TPA3004D2 AVDDREF FADE VOLUME AGND REFGND VCLAMPL Cs Cbs 10 nF PVCC 0.1 µF BSLP ROSC PVCCL COSC VARMAX PVCCL VARDIFF VARMAX LOUTP VARDIFF PGNDL AVDD PGNDL VREF BSLN VOL Ccpr VCLAMPR RINP LOUTN LINN 1 µF 1 µF Clinn Cbs Cs RINN LOUTN LINP C2p5 10 nF MODE_OUT PVCCL RINP SD PVCCL RINN Crinn ROUTN BSRN SYSTEM CONTROL PVCCR Cs PVCC ROUTP Cbs 10 µF ROUTP PVCC 10 nF LOUTP • • AVCC Cs 0.1 µF Cvcc 10 µF LLINE_OUT AVDD Cvdd Cosc 100 nF 220 pF SYSTEM CONTROL Rosc 120 kΩ Ccpl 1 µF 10 kΩ 10 kΩ Cs 0.1 µF Cs Cs 10 µF 10 µF Cbs 10 nF PVCC 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2011, Texas Instruments Incorporated TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICE TA 48-PIN HTQFP (PHP) 40°C to 85°C (1) (1) TPA3004D2PHP The PHP package is available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA3004D2PHPR). PHP PACKAGE BSRP PVCCR ROUTP ROUTP PGNDR ROUTN ROUTN PGNDR 43 42 41 40 39 38 37 SD 1 36 VCLAMPR RINN 2 35 MODE_OUT RINP 3 34 MODE V2P5 4 33 AVCC LINP 5 32 VAROUTR LINN 6 31 VAROUTL AVDDREF 7 30 FADE VREF 8 29 AVDD VARDIFF 9 28 COSC VARMAX 10 27 ROSC VOLUME 11 26 AGND REFGND 12 25 VCLAMPL Submit Documentation Feedback 24 BSLP PVCCL PVCCL LOUTP LOUTP PGNDL PGNDL 20 21 22 23 LOUTN 18 19 LOUTN PVCCL BSLN 15 16 17 PVCCL TPA3004D2 13 14 2 46 45 44 PVCCR 48 47 PVCCR PVCCR BSRN (TOP VIEW) Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 FUNCTIONAL BLOCK DIAGRAM V2P5 PVCC V2P5 VAROUTR VClamp Gen V2P5 VCLAMPR BSRN Gain Adj. PVCCR(2) Gate Drive Cint2 RINN Gain Adj. Rfdbk2 RINP ROUTN(2) Deglitch & PGNDR Modulation Logic BSRP PVCCR(2) Rfdbk2 V2P5 VREF Gate Drive Cint2 ROUTP(2) VOLUME VARDIFF VARMAX FADE Gain Control PGNDR To Gain Adj. Blocks REFGND OC Detect V2P5 ROSC Ramp Generator Biases References AVDDREF Thermal Startup Protection Logic & COSC VDD VDDok AVCC AVDD VCCok AVDD 5V LDO PVCC TTL Input Buffer SD MODE MODE_OUT AGND VClamp Gen VCLAMPL BSLN Mode PVCCL(2) Control Gate Drive Cint2 V2P5 LINN AVCC PGNDL Deglitch & Gain Adj. Rfdbk2 BSLP Modulation Logic LINP LOUTN(2) PVCCL(2) Rfdbk2 V2P5 Cint2 Gain Adj. Gate Drive LOUTP(2) PGNDL VAROUTL Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 3 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com Pin Functions Pin NO. NAME I/O DESCRIPTION AGND 26 - Analog ground for digital/analog cells in core AVCC 33 - High-voltage analog power supply (8.5 V to 18 V) AVDD 29 O 5-V Regulated output capable of 100-mA output AVDDREF 7 O 5-V Reference output—provided for connection to adjacent VREF terminal. BSLN 13 I/O Bootstrap I/O for left channel, negative high-side FET BSLP 24 I/O Bootstrap I/O for left channel, positive high-side FET BSRN 48 I/O Bootstrap I/O for right channel, negative high-side FET BSRP 37 I/O Bootstrap I/O for right channel, positive high-side FET COSC 28 I/O I/O for charge/discharging currents onto capacitor for ramp generator triangle wave biased at V2P5 FADE 30 I Input for controlling volume ramp rate. A logic low on this pin places the amplifier in fade mode. A logic high on this pin allows a quick transition to the desired volume setting when cycling SD or during power-up. LINN 6 I Negative differential audio input for left channel LINP 5 I Positive differential audio input for left channel LOUTN 16, 17 O Class-D ½-H-bridge negative output for left channel LOUTP 20, 21 O Class-D ½-H-bridge positive output for left channel MODE 34 I Input for MODE control. A logic high on this pin places the amplifier in the variable output mode and the Class-D outputs are disabled. A logic low on this pin places the amplifier in the Class-D mode and Class-D stereo outputs are enabled. Variable outputs (VAROUTL and VAROUTR) are still enabled in Class-D mode to be used as line-level outputs for external amplifiers. MODE_OUT 35 O Output for control of the variable output amplifiers. When the MODE pin (34) is a logic high, the MODE_OUT pin is driven low. When the MODE pin (34) is a logic low, the MODE_OUT pin is driven high. This pin is intended for MUTE control of an external headphone amplifier. Leave unconnected when not used for headphone amplifier control. PGNDL 18, 19 - Power ground for left channel H-bridge PGNDR 42, 43 - Power ground for right channel H-bridge PVCCL 14, 15 Power supply for left channel H-bridge (tied to pins 22 and 23 internally), not connected to PVCCR or AVCC. PVCCL 22, 23 Power supply for left channel H-bridge (tied to pins 14 and 15 internally), not connected to PVCCR or AVCC. PVCCR 38,39 Power supply for right channel H-bridge (tied to pins 46 and 47 internally), not connected to PVCCL or AVCC. PVCCR 46, 47 Power supply for right channel H-bridge (tied to pins 38 and 39 internally), not connected to PVCCL or AVCC. REFGND 12 - Ground for gain control circuitry. Connect to AGND. If using a DAC to control the volume, connect the DAC ground to this terminal. RINP 3 I Positive differential audio input for right channel Negative differential audio input for right channel RINN 2 I ROSC 27 I/O Current setting resistor for ramp generator. Nominally equal to 1/8*VCC ROUTN 44, 45 O Class-D ½-H-bridge negative output for right channel ROUTP 40, 41 O Class-D ½-H-bridge positive output for right channel SD 1 I Shutdown signal for IC (low = shutdown, high = operational). TTL logic levels with compliance to VCC. VARDIFF 9 I DC voltage to set the difference in gain between the Class-D and VAROUT outputs. Connect to GND or AVDDREF if VAROUT outputs are unconnected. VARMAX 10 I DC voltage that sets the maximum gain for the VAROUT outputs. Connect to GND or AVDDREF if VAROUT outputs are unconnected. VAROUTL 31 O Variable output for left channel audio. Line level output for driving external HP amplifier. VAROUTR 32 O Variable output for right channel audio. Line level output for driving external HP amplifier. VCLAMPL 25 - Internally generated voltage supply for left channel bootstrap capacitors. VCLAMPR 36 - Internally generated voltage supply for right channel bootstrap capacitors. 4 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 Pin Functions (continued) Pin NO. I/O NAME DESCRIPTION VOLUME 11 I DC voltage that sets the gain of the Class-D and VAROUT outputs. VREF 8 I Analog reference for gain control section. V2P5 4 O 2.5-V Reference for analog cells, as well as reference for unused audio input when using single-ended inputs. Thermal Pad — Connect to AGND and PGND—should be center point for both grounds. — ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT Supply voltage range: AVCC, PVCC -0.3 V to 20 V ≥ 3.6 Ω Load impedance, RL MODE, VREF, VARDIFF, VARMAX, VOLUME, FADE Input voltage range, VI SD -0.3 V to VCC + 0.3 V RINN, RINP, LINN, LINP Supply current Output current 120 mA AVDDREF 10 mA VAROUTL, VAROUTR 20 mA See the Thermal Information Table Operating free-air temperature range, TA Operating junction temperature range, TJ -40°C to 85°C -40°C to 150°C (2) Storage temperature range, Tstg (2) -0.3 V to 7 V AVDD Continuous total power dissipation (1) 0 V to 5.5 V -65°C to 150°C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The (TPA3004D2) incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. THERMAL INFORMATION THERMAL METRIC (1) (2) TPS3004D2 PHP (48) PIN qJA Junction-to-ambient thermal resistance 26.6 qJCtop Junction-to-case (top) thermal resistance 12.6 qJB Junction-to-board thermal resistance 7.9 yJT Junction-to-top characterization parameter 0.1 yJB Junction-to-board characterization parameter 4.2 qJCbot Junction-to-case (bottom) thermal resistance 0.2 (1) (2) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 5 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Supply voltage, VCC PVCC, AVCC; RL ≥ 3.6 Ω 8.5 18 V Volume reference voltage VREF 3.0 5.5 V Volume control pins, input voltage VARDIFF, VARMAX, VOLUME 5.5 V SD High-level input voltage, VIH Low-level input voltage, VIL 2 MODE 3.5 FADE 4 SD 0.8 MODE, FADE MODE_OUT, IOH = 1 mA Low-level output voltage, VOL MODE_OUT, IOL = -1 mA Low-level input current, IIL AVDD–100mV AGND+100mV V 1 FADE, VI= 18 V, VCC = 18 V 150 SD, VI= 18 V, VCC = 18 V 50 MODE, FADE , VI= 0 V, VCC = 18 V 1 SD, VI= 0 V, VCC = 18 V 1 µA 275 kHz 85 °C 125 °C 225 Operating free-air temperature, TA (1) V MODE, VI = 5 V, VCC = 18 V Oscillator frequency, fOSC Operating junction temperature, TJ V 2 High-level output voltage, VOH High-level input current, IIH V –40 (1) µA µA Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device. The junction temperature is controlled by the thermal design of the application and should be carefully considered in high power dissipation applications. See the thermal considerations section on pages 33-35 for recommendations on improving the thermal performance of your application. DC CHARACTERISTICS TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted) PARAMETER Class-D Output offset voltage (measured differentially) | VOS | TEST CONDITIONS MIN MAX 10 65 0.45 x AVDD 0.5 x AVDD 0.55 x AVDD V 4.5 5 5.5 V INN and INP connected together, Gain = 36 dB V2P5 (terminal 4) 2.5-V Bias voltage No load AVDD 5-V Regulated output IO = 0 to 100 mA, SD = 2 V, VCC = 8.5 V to 18 V PSRR Class-D power supply rejection ratio VCC = 11.5 V to 12.5 V ICC(class-D) Class-D mode quiescent current MODE = 2 V, SD = 2 V, VCC = 18 V ICC(varout) Variable output mode quiescent current ICC(class-D)max Class-D mode RMS current at max power ICC(SD) Supply current in shutdown mode rDS(on) Drain-source on-state resistance 6 TYP –80 UNIT mV dB 16 28.5 mA MODE = 3.5 V, SD = 2 V, VCC = 18 V 7 9 mA RL = 8 Ω, PO = 12 W, VCC = 15 V to 18 V 2 SD = 0.8 V, VCC = 12 V 1 SD = 0.8 V, VCC = 18 V VCC = 12 V, IO = 1 A, TJ = 25°C A 10 160 High side 300 Low side 250 Total 550 Submit Documentation Feedback µA mΩ 650 Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 AC CHARACTERISTICS FOR CLASS-D OUTPUTS TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted) PARAMETER TEST CONDITIONS kSVR Supply ripple rejection ratio VCC = 11.5 V to 12.5 V from 10 Hz to 1 kHz, Gain = 36 dB –67 dB PO(max) Maximum continuous output power(thermally limited) RL = 4 Ω 7.5 W RL = 8 Ω, VCC = 15 V 12 W Output integrated noise floor 20 Hz to 22 kHz, No weighting filter, Gain = 0.5 dB –82 dBV Crosstalk, Class-D-Left → Class-D-Right Gain = 13.2 dB, PO = 1 W, RL = 8 Ω –77 dB Crosstalk, Class-D → VAROUT Maximum output at THD < 0.5%, Gain = 36 dB –63 dB Signal-to-noise ratio Maximum output at THD+N < 0.5%, f = 1 kHz, Gain = 0.5 dB 102 dB 150 °C 20 °C Vn SNR MIN Thermal trip point Thermal hysteresis TYP MAX UNITS CHARACTERISTICS FOR VAROUT OUTPUTS PARAMETER |VOS| THD+N Output offset voltage Total harmonic distortion + noise TEST CONDITIONS Measured between V2P5 and VAROUT, Gain = 20 dB, RL = 10 kΩ MIN TYP MAX 10 65 AV = 7.3 dB, f = 1 kHz, PO = 6 mW, RL = 32 Ω 0.025% AV = 7.3 dB, f = 1 kHz, RL = 2 kΩ, VO = 1 Vrms 0.002% UNITS mV PSRR DC power supply rejection ratio Gain = 20 dB –74 dB kSVR Supply ripple rejection ratio Gain = 20 dB, f = 1 kHz –95 dB Crosstalk, VAROUTL → VAROUTR Maximum output at THD < 0.5%, Gain = 20 dB –60 dB Crosstalk, VAROUT → Class-D Maximum output at THD < 0.5%, Gain = 20 dB –74 dB Vn Output integrated noise floor 20 Hz to 22 kHz, Gain = 20 dB 75 20 Hz to 22 kHz, Gain = –0.3 dB 15 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 µV 7 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com Table 1. DC Volume Control for Class-D Outputs (1) 8 VOLTAGE ON THE VOLUME PIN AS A PERCENTAGE OF VREF (INCREASING VOLUME OR FIXED GAIN) VOLTAGE ON THE VOLUME PIN AS A PERCENTAGE OF VREF (DECREASING VOLUME) GAIN OF CLASS-D AMPLIFIER % % dB 0 – 4.5 0 – 2.9 –75 (1) 4.5 – 6.7 2.9 – 5.1 –40.0 6.7– 8.91 5.1 – 7.2 –37.5 8.9 – 11.1 7.2 – 9.4 –35.0 11.1 – 13.3 9.4 – 11.6 –32.4 13.3 – 15.5 11.6 – 13.8 –29.9 15.5 – 17.7 13.8 – 16.0 –27.4 17.7 – 19.9 16.0 – 18.2 –24.8 19.9 – 22.1 18.2 – 20.4 –22.3 22.1 – 24.3 20.4 – 22.6 –19.8 24.3 – 26.5 22.6 – 24.8 –17.2 26.5 – 28.7 24.8 – 27.0 –14.7 28.7– 30.9 27.0 – 29.1 –12.2 30.9 – 33.1 29.1 – 31.3 –9.6 33.1 – 35.3 31.3 – 33.5 –7.1 35.3 – 37.5 33.5 – 35.7 –4.6 37.5 – 39.7 35.7 – 37.9 –2.0 39.7 – 41.9 37.9 – 40.1 0.5 (1) 41.9 – 44.1 40.1 – 42.3 3.1 44.1 – 46.4 42.3 – 44.5 5.6 46.4 – 48.6 44.5 – 46.7 8.1 48.6 – 50.8 46.7 – 48.9 10.7 50.8 – 53.0 48.9 – 51.0 13.2 53.0 – 55.2 51.0 – 53.2 15.7 55.2 – 57.4 53.2 – 55.4 18.3 57.4 – 59.6 55.4 – 57.6 20.8 59.6 – 61.8 57.6 – 59.8 23.3 61.8 – 64.0 59.8 – 62.0 25.9 64.0 – 66.2 62.0 – 64.2 28.4 66.2 – 68.4 64.2 – 66.4 30.9 68.4 – 70.6 66.4 – 68.6 33.5 >70.6 >68.6 36.0 (1) Tested in production. Remaining steps are specified by design. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 Table 2. DC Volume Control for VAROUT Outputs (1) (2) VAROUT_VOLUME (V) (1) – FROM FIGURE 24 – AS A PERCENTAGE OF VREF (INCREASING VOLUME OR FIXED GAIN) VAROUT_VOLUME (V) – FROM FIGURE 24 – AS A PERCENTAGE OF VREF (DECREASING VOLUME) GAIN OF VAROUT AMPLIFIER % % dB 0 – 4.5 0 – 2.9 –66 (1) 4.5 – 6.7 2.9 – 5.1 –56.0 6.7– 8.91 5.1 – 7.2 –53.5 8.9 – 11.1 7.2 – 9.4 –50.9 11.1 – 13.3 9.4 – 11.6 –48.4 13.3 – 15.5 11.6 – 13.8 –45.9 15.5 – 17.7 13.8 – 16.0 –43.3 17.7 – 19.9 16.0 – 18.2 –40.8 19.9 – 22.1 18.2 – 20.4 –38.3 22.1 – 24.3 20.4 – 22.6 –35.7 24.3 – 26.5 22.6 – 24.8 –33.2 26.5 – 28.7 24.8 – 27.0 –30.7 28.7– 30.9 27.0 – 29.1 –28.1 30.9 – 33.1 29.1 – 31.3 –25.6 33.1 – 35.3 31.3 – 33.5 –23.1 35.3 – 37.5 33.5 – 35.7 –20.5 37.5 – 39.7 35.7 – 37.9 –18.0 39.7 – 41.9 37.9 – 40.1 –15.5 41.9 – 44.1 40.1 – 42.3 –13.0 (2) 44.1 – 46.4 42.3 – 44.5 –10.4 46.4 – 48.6 44.5 – 46.7 –7.9 48.6 – 50.8 46.7 – 48.9 –5.3 50.8 – 53.0 48.9 – 51.0 –2.8 53.0 – 55.2 51.0 – 53.2 –0.3 55.2 – 57.4 53.2 – 55.4 2.3 57.4 – 59.6 55.4 – 57.6 4.8 59.6 – 61.8 57.6 – 59.8 7.3 61.8 – 64.0 59.8 – 62.0 9.9 64.0 – 66.2 62.0 – 64.2 12.4 66.2 – 68.4 64.2 – 66.4 14.9 68.4 – 70.6 66.4 – 68.6 17.5 >70.6 >68.6 20.0 (1) VAROUT_VOLUME (V) = VOLUME (V) - VARDIFF (V), see section VOLUME CONTROL OPERATION through MODE_OUT OPERATION section. Tested in production. Remaining steps are specified by design. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 9 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS Table 3. Table of Graphs FIGURE Class-D Efficiency vs Output power Figure 1 PO Class-D Output power vs Load resistance Figure 2 vs Supply voltage Figure 3 ICC Class-D Supply current vs Supply voltage Figure 4 vs Output Power Figure 5 Shutdown supply current vs Supply voltage Figure 6 Class-D Input impedance vs Gain IO(sd) THD+N Class-D Total harmonic distortion + noise kSVR Class-D Supply ripple rejection ratio Figure 8 – Figure 12 vs Output power Figure 13 – Figure 17 vs Frequency Figure 19 Class-D Intermodulation performance Figure 20 Class-D Input offset voltage vs Common-mode input voltage Figure 21 Class-D Crosstalk vs Frequency Figure 22 vs Frequency Class-D Shutdown attenuation 10 Figure 23 Figure 24 Class-D Common-mode rejection ratio vs Frequency Figure 25 VAROUT Input resistance vs Gain Figure 26 VAROUT Noise vs Frequency Figure 27 VAROUT Closed Loop Response kSVR Figure 18 Class-D Closed loop response Class-D Mute attenuation THD+N Figure 7 vs Frequency Figure 28 VAROUT Common-mode rejection ratio vs Frequency Figure 29 VAROUT Crosstalk vs Frequency Figure 30 vs Output power Figure 31 vs Output voltage Figure 32 vs Frequency Figure 33 vs Frequency Figure 34 VAROUT Total harmonic distortion + noise VAROUT Supply ripple rejection ratio Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 EFFICIENCY vs OUTPUT POWER OUTPUT POWER vs LOAD RESISTANCE 12 100 VCC = 12 V, THD = 10% RL = 8 Ω, VCC = 18 V 90 10 80 Efficiency – % PO – Output Power – W RL = 4 Ω, VCC = 12 V 70 60 50 40 30 Class-D, LC Filter, Resistive Load 20 10 VCC = 12 V, THD = 1% 8 VCC = 8 V, THD = 10% 6 4 VCC = 8 V, THD = 1% 2 Dashed line may require external heat sinking 0 0 0 2 4 6 8 PO – Output Power – W 10 4 12 6 8 10 12 RL – Load Resistance – Ω Figure 1. 16 SUPPLY CURRENT vs SUPPLY VOLTAGE 20 12 8 Ω Speaker 10% THD+N 19 18 I CC– Supply Current – mA 10 8 8 Ω Speaker 1% THD+N 6 4 SD = 2 V, MODE = 2 V, Class-D, No Load 17 16 15 14 13 12 TA = 25°C 2 8.5 9 14 Figure 2. OUTPUT POWER vs SUPPLY VOLTAGE PO – Output Power – W f = 1 kHz, LC Filter, Class-D, Resistive Load, TA = 25°C 10 11 11 12 13 14 15 16 VCC – Supply Voltage – V 17 18 10 8.5 9 Figure 3. 10 11 12 13 14 15 16 VCC – Supply Voltage – V 17 18 Figure 4. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 11 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com SHUTDOWN SUPPLY CURRENT vs SUPPLY VOLTAGE SUPPLY CURRENT vs OUTPUT POWER 2500 4.5 I CC– Supply Current – mA 2000 I CC(sd)– Shutdown Supply Current – µ A VCC = 12 V, MODE = 2 V, Class-D, Left/Right Channel Total Output Power 8Ω 1500 4Ω 1000 16 Ω 500 0 0 5 10 15 PO – Output Power – W 20 SD = 0 V, No Load 4 3.5 3 2.5 2 1.5 1 0.5 0 25 8 6 10 12 14 VCC – Supply Voltage – V Figure 5. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 120 THD+N – Total Harmonic Distortion + Noise – % 1 Class-D Z i – Input Impedance – k Ω 100 80 60 40 20 –30 –10 10 Gain – dB 30 50 VCC = 8 V RL = 8 Ω Gain = +36 dB Class-D PO = 3 W 0.1 PO = 0.25 W PO = 1.5 W 0.01 20 100 1k 10k f – Frequency – Hz Figure 7. 12 18 Figure 6. INPUT IMPEDANCE vs GAIN 0 –50 16 Figure 8. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 10 VCC = 12 V RL = 8 Ω Gain = +36 dB Class-D THD+N –Total Harmonic Distortion + Noise – dB THD+N – Total Harmonic Distortion + Noise – % 1 PO = 0.5 W PO = 5 W 0.1 PO = 2.5 W 0.01 10 100 1k 10k VCC = 18 V, Gain = 36 dB, RL = 8 Ω 5 2 1 0.5 PO = 1 W PO = 4 W 0.2 0.1 0.05 PO = 12 W 0.02 0.01 20 50 f – Frequency – Hz 100 200 Figure 9. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY THD+N – Total Harmonic Distortion + Noise – % 1 THD+N – Total Harmonic Distortion + Noise – % 5 k 10 k 20 k Figure 10. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY VCC = 8 V RL = 4 Ω Gain = +36 dB PO = 4 W 500 1 k 2 k f – Frequency – Hz PO = 0.5 W 0.1 PO = 2 W 0.01 1 VCC = 12 V RL = 4 Ω Gain = +36 dB PO = 0.5 W 0.1 PO = 7 W PO = 3.5 W 0.01 20 100 1k 10k 20 f – Frequency – Hz 100 1k 10k f – Frequency – Hz Figure 11. Figure 12. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 13 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 VCC = 8 V RL = 8 Ω Gain = +13.2 dB Class-D THD+N – Total Harmonic Distortion + Noise – % THD+N – Total Harmonic Distortion + Noise – % 10 1 f = 1 kHz f = 20 Hz 0.1 0.01 10 m 100 m 1 10 VCC = 12 V RL = 8 Ω Gain = +13.2 dB Class-D 1 f = 20 Hz f = 1 kHz 0.1 0.01 10 m PO – Output Power – W 100 m Figure 13. TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 VCC = 18 V, RL = 8 Ω THD+N – Total Harmonic Distortion + Noise – % THD+N –Total Harmonic Distortion + Noise – dB 10 2 1 0.5 f = 1 kHz 0.2 0.1 f = 20 kHz 0.05 0.02 0.01 100 m 200 m f = 20 Hz 5 500 m 1 2 PO – Output Power – W 10 20 VCC = 8 V RL = 4 Ω Gain = 13.2 dB 1 f = 1 kHz f = 20 Hz 0.1 0.01 20 m 100 m 1 10 PO – Output Power – W Figure 15. 14 10 Figure 14. TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 5 1 PO – Output Power – W Figure 16. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY –40 VCC = 12 V RL = 4 Ω Gain = 13.2 dB k SVR – Supply Ripple Rejection Ratio – dB THD+N – Total Harmonic Distortion + Noise – % 10 1 f = 20 Hz f = 1 kHz 0.1 0.01 20 m 100 m 1 –45 RL = 8 Ω, C2p5 = 1 µF, Class-D –50 –55 VCC = 8 V –60 –65 VCC = 12 V –70 –75 –80 20 10 100 PO – Output Power – W Figure 17. CLOSED LOOP RESPONSE INTERMODULATION PERFORMANCE –20 0 –40 FFT – dBr 50 Phase – Deg Gain Phase Gain – dB 0 100 0 –50 –100 –100 –150 –150 –100 –200 –120 –250 10 VCC = 12 V, Gain= +36 dB, RL = 8 Ω Class-D 100 1k 10 k f – Frequency – Hz 100 k –250 1M VCC = 12 V, 19 kHz, 20 kHz, 1:1, PO = 1 W, RL = 8 Ω Gain= +13.2 dB, BW =20 Hz to 22 kHz, Class-D No Filter –60 –50 –200 10 k 20 k Figure 18. 100 50 1k f – Frequency – Hz –80 –140 50 Figure 19. 100 1k f – Frequency – Hz 10 k Figure 20. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 15 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com CROSSTALK vs FREQUENCY INPUT OFFSET VOLTAGE vs COMMON-MODE INPUT VOLTAGE 6 0 VCC = 12 V Class-D –20 4 Crosstalk – dB VIO – Input Offset Voltage – mV 5 VCC = 12 V, C2p5 = 1 µF, PO = 1 W, Gain = +13.2 dB, Class-D, RL = 8 Ω –10 3 2 –30 –40 –50 –60 1 –70 0 –80 –1 0 4 1 2 3 VICM – Common-Mode Input Voltage – V –90 20 5 100 Figure 21. Figure 22. SHUTDOWN ATTENUATION vs FREQUENCY MUTE ATTENUATION vs FREQUENCY –80 –40 VCC = 12 V, RL = 8 Ω, VI = 1 Vrms –85 –50 Class-D, –90 Shutdown Attenuation – dB Mute Attenuation – dB –30 VOLUME = 0 V –60 –70 –80 –90 –100 VCC = 12 V, RL = 8 Ω, VI = 1 Vrms Gain = +13.2 dB, Class-D –95 –100 –105 –110 –115 –110 –120 –120 –125 –130 –130 10 100 1k 10 k 10 f – Frequency – Hz 100 1k 10 k f – Frequency – Hz Figure 23. 16 10 k 20 k 1k f – Frequency – Hz Figure 24. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 COMMON-MODE REJECTION RATIO vs FREQUENCY INPUT RESISTANCE vs GAIN 160 VCC = 12 V, RL = 8 Ω, C2p5 = 1 µF, Class-D –50 VAROUT 140 RL – Input Resistance – k Ω –60 –70 –80 120 100 80 60 40 –90 20 –100 10 100 1k 10 k f – Frequency – Hz 0 –50 100 k –30 Figure 25. 10 BCLOSED LOOP RESPONSE 0 12.853 VCC = 12 V, Gain = +20 dB, RL = 8 Ω, Inputs AC Coupled to GND, VAROUT, No Filter −20 −40 −60 Gain − dB −120 −140 5.784 100 2.249 75 −1.285 50 25 Phase −4.82 −25 −50 −11.889 −75 −15.424 −180 −18.958 −200 10 k 0 −8.354 −160 1k f − Frequency − Hz 150 125 −100 100 175 Gain 9.318 −80 20 30 Figure 26. NOISE vs FREQUENCY Noise FFT − dBV –10 Gain – dB Phase − Deg CMRR – Common-Mode Rejection Ratio – dB –40 −100 VCC = 12 V, Gain = +7.9 dB, RL = 8 Ω, VAROUT −22.493 10 100 −125 −150 −175 1k 10 k f − Frequency − Hz Figure 27. Figure 28. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 17 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com COMMON-MODE REJECTION RATIO vs FREQUENCY CROSSTALK (VAROUTL-TO-VAROUTR) vs FREQUENCY 0 VCC = 12 V, RL = 8 Ω , C2P5 = 1 µF, VAROUT –42 –44 VO = 1 Vrms, RL = 10 kΩ, VAROUT –10 –20 –46 G = 20 dB G = 10 dB G = 0 dB –30 Crosstalk – dB CMRR – Common-Mode Rejection Ratio – dBv –40 –48 –50 –52 –40 G = –10 dB –50 –60 –54 –70 –56 –80 –58 –90 –60 20 –100 100 1k f– Frequency – Hz 20 10 k 100 1k Figure 29. Figure 30. TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE 2 20 VCC = 12 V RL = 32 Ω, Gain = +6 dB, VAROUT THD+N –Total Harmonic Distortion + Noise – % THD+N –Total Harmonic Distortion + Noise – % 20 10 1 0.2 f = 1 kHz 0.1 f = 20 kHz 0.02 0.01 f = 20 Hz 0.001 20 µ 100 µ 200 µ 1m 2m 10 m 20 m 10 2 1 VCC = 12 V RL = 10 kΩ, Gain = +6 dB VAROUT 0.2 0.1 0.02 f = 1 kHz 0.01 0.001 20 m PO – Output Power – W Figure 31. 18 10 k f – Frequency – Hz 100 m 200 m VO – Output Voltage – VRMS 1 2 Figure 32. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 2 1 –40 VCC = 12 V RL = 32 Ω, PO = 5 mW, Gain = +7.9 dB, VAROUT k SVR – Supply Ripple Rejection Ratio – dB THD+N –Total Harmonic Distortion + Noise – % 10 0.2 0.1 0.02 0.01 0.005 20 100 1k f – Frequency – Hz 10 k –50 VCC = 12 V VAROUT –60 –70 –80 –90 –100 –110 20 100 1k 10 k f – frequency – Hz Figure 33. Figure 34. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 19 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com C22 1 nF VCC ROUT+ GND VCC ROUT– APPLICATION INFORMATION C23 1 nF L1 (Bead) L2 (Bead) 10 µF PGND 10 nF C15 0.1uF 0.1uF C9 C10 10 nF SHUTDOWN C2 1 µF C3 1 µF 1 µF C4 LIN– 1 µF MODEB BSRP PVCCR PVCCR ROUTP ROUTP PGNDR PGNDR ROUTN ROUTN V2P5 AVCC LINP VAROUTR VAROUTR LINN VAROUTL VAROUTL TPA3004D2 AVDDREF FADE VREF AVDD VARDIFF COSC VARMAX ROSC T5 VOLUME AGND REFGND VCLAMPL MODE C13 0.1 µF C16 10 µF 220pF C11 100 nF R1 120 kΩ AGND BSLP PVCCL PVCCL LOUTP 10 nF PGND L3 (Bead) L4 (Bead) C25 1nF GND C24 1nF VCC C21 0.1 µF 10 µF LOUT– PGND VCC 10 nF GND 1 µF C12 0.1 µF C17 LOUT+ C20 LOUTP PGNDL PGNDL LOUTN LOUTN PVCCL PVCCL AGND VCC AVDD C14 C6 C8 GND GND MODE T6 P1 50 kΩ PGND RINP T7 P2 50 kΩ 1 µF MODE_OUT BSLN P3 50k C7 VCLAMPR RINN 1 µF C5 AGND PVCCR SD C1 RIN– C19 PVCCR BSRN C18 † Schottky diodes only needed for short circuit protection when VCC > 15 V. See SHORT CIRCUIT PROTECTION section in Application Information. Figure 35. Stereo Class-D With Single-Ended Inputs 20 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 AGND REFGND VOLUME VARMAX VARDIFF VREF AVDDREF LINN BSRN T5 1 µF LINP V2P5 PGNDL Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 C24 1 nF L3 (Bead) C25 1 nF L4 (Bead) PGND PGNDL 10 µ F 0.1 µ F VCLAMPR VCLAMPL AGND ROSC COSC AVDD FADE VAROUTL VAROUTR AVCC MODE MODE_OUT 10 nF C21 PVCCL LOUTN LOUT– VCC PVCCR PVCCL VCC PVCCR PVCCL 10 nF LOUTN C12 LOUTP C11 PVCCR 0.1 µ F C17 C19 1 µF C8 220 pF C6 120 kΩ R1 100 nF C14 C16 10 µ F PGND C13 0.1µ F 1 µF AVDD AVCC C7 Cin2 (T2) 1 µF Rin2 10 kΩ (T1) 1 µF Rin1 10 kΩ Cin1 10 kΩ (T3) Rhps2 0.47µ F Cvcc 10 kΩ Rhps1 Rout1 1 kΩ Rout2 1 kΩ R3 120 kΩ AVDD Cout2 BYP IN1 10 kΩ Rhpf2 IN2 Vo2 SD VDD GND Vo1 AVDD (T4) 220 µ F Rhpf1 10 kΩ 220 µ F TPA6110A2 Cout1 www.ti.com C20 C10 10 nF VCC PVCCR PVCCL VCC ROUT+ ROUTP LOUTP LOUT+ TPA3004D2 ROUTN P1 50 kΩ C4 1 µF RINP RINN PGNDR GND T6 C5 1 µF 1 µF PGNDR P2 50 kΩ T7 C3 C1 1 µF C9 0.1 µ F PGND ROUTP P3 50 kΩ LIN– AGND C2 SD ROUTN C18 C15 0.1 µ F 10 µ F L2 (Bead) C23 1 nF BSRP RIN– SHUTDOWN ROUT– 10 nF GND L1 (Bead) C22 1 nF TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 BSLP GND BSLN † Schottky diodes only needed for short circuit protection when VCC > 15 V. See SHORT CIRCUIT PROTECTION section in Application Information. Figure 36. Stereo Class-D With Single-Ended Inputs and Stereo Headphone Amplifier Interface Submit Documentation Feedback 21 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com Class-D Operation This section focuses on the class-D operation of the TPA3004D2. Traditional Class-D Modulation Scheme The traditional class-D modulation scheme, which is used in the TPA032D0x family, has a differential output where each output is 180 degrees out of phase and changes from ground to the supply voltage, VCC. Therefore, the differential prefiltered output varies between positive and negative VCC, where filtered 50% duty cycle yields 0 V across the load. The traditional class-D modulation scheme with voltage and current waveforms is shown in Figure 37. Note that even at an average of 0 V across the load (50% duty cycle), the current to the load is high, causing high loss, thus causing a high supply current. OUTP OUTN +12 V Differential Voltage Across Load 0V –12 V Current Figure 37. Traditional Class-D Modulation Scheme's Output Voltage and Current Waveforms Into an Inductive Load With No Input TPA3004D2 Modulation Scheme The TPA3004D2 uses a modulation scheme that still has each output switching from 0 to the supply voltage. However, OUTP and OUTN are now in phase with each other with no input. The duty cycle of OUTP is greater than 50% and OUTN is less than 50% for positive output voltages. The duty cycle of OUTP is less than 50% and OUTN is greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout most of the switching period, greatly reducing the switching current, which reduces any I2R losses in the load. 22 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 OUTP OUTN Differential Voltage Across Load Output = 0 V +12 V 0V –12 V Current OUTP OUTN Differential Voltage Output > 0 V +12 V 0V Across Load –12 V Current Figure 38. The TPA3004D2 Output Voltage and Current Waveforms Into an Inductive Load Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme The main reason that the traditional class-D amplifier needs an output filter is that the switching waveform results in maximum current flow. This causes more loss in the load, which causes lower efficiency. The ripple current is large for the traditional modulation scheme, because the ripple current is proportional to voltage multiplied by the time at that voltage. The differential voltage swing is 2 × VCC, and the time at each voltage is half the period for the traditional modulation scheme. An ideal LC filter is needed to store the ripple current from each half cycle for the next half cycle, while any resistance causes power dissipation. The speaker is both resistive and reactive, whereas an LC filter is almost purely reactive. The TPA3004D2 modulation scheme has very little loss in the load without a filter because the pulses are very short and the change in voltage is VCC instead of 2 × VCC. As the output power increases, the pulses widen, making the ripple current larger. Ripple current could be filtered with an LC filter for increased efficiency, but for most applications the filter is not needed. An LC filter with a cutoff frequency less than the class-D switching frequency allows the switching current to flow through the filter instead of the load. The filter has less resistance than the speaker, which results in less power dissipation, therefore increasing efficiency. Effects of Applying a Square Wave into a Speaker Audio specialists have advised for years not to apply a square wave to speakers. If the amplitude of the waveform is high enough and the frequency of the square wave is within the bandwidth of the speaker, the square wave could cause the voice coil to jump out of the air gap and/or scar the voice coil. A 250-kHz switching frequency, however, does not significantly move the voice coil, as the cone movement is proportional to 1/f2 for frequencies beyond the audio band. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 23 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com Damage may occur if the voice coil cannot handle the additional heat generated from the high-frequency switching current. The amount of power dissipated in the speaker may be estimated by first considering the overall efficiency of the system. If the on-resistance (rds(on)) of the output transistors is considered to cause the dominant loss in the system, then the maximum theoretical efficiency for the TPA3004D2 with an 8-Ω load is as follows: ǒ Efficiency (theoretical, %) + R ń R ) r L L ds(on) Ǔ 100% + 8ń(8 ) 0.58) 100% + 93.24% (1) The maximum measured output power is approximately 7.5 W with an 12-V power supply. The total theoretical power supplied (P(total)) for this worst-case condition would therefore be as follows: P + P ńEfficiency + 7.5 W ń 0.9324 + 8.04 W (total) O (2) The efficiency measured in the lab using an 8-Ω speaker was 89%. The power not accounted for as dissipated across the rds(on) may be calculated by simply subtracting the theoretical power from the measured power: Other losses + P (measured) * P (theoretical) + 8.43 * 8.04 + 0.387 W (total) (total) (3) The quiescent supply current at 14 V is measured to be 14.3 mA. It can be assumed that the quiescent current encapsulates all remaining losses in the device, i.e., biasing and switching losses. It may be assumed that any remaining power is dissipated in the speaker and is calculated as follows: P + 0.387 W * (14 V 14.3 mA) + 0.19 W (dis) (4) Note that these calculations are for the worst-case condition of 7.5 W delivered to the speaker. Since the 0.19 W is only 2.5% of the power delivered to the speaker, it may be concluded that the amount of power actually dissipated in the speaker is relatively insignificant. Furthermore, this power dissipated is well within the specifications of most loudspeaker drivers in a system, as the power rating is typically selected to handle the power generated from a clipping waveform. When to Use an Output Filter Design the TPA3004D2 without the filter if the traces from amplifier to speaker are short (< 1 inch). Powered speakers, where the speaker is in the same enclosure as the amplifier, is a typical application for class-D without a filter. Most applications require a ferrite bead filter. The ferrite filter reduces EMI around 1 MHz and higher (FCC and CE only test radiated emissions greater than 30 MHz). When selecting a ferrite bead, choose one with high impedance at high frequencies, but very low impedance at low frequencies. Use a LC output filter if there are low frequency (<1 MHz) EMI sensitive circuits and/or there are long wires from the amplifier to the speaker. 15 µH OUTP L1 15 µH OUTN L2 C1 C2 0.22 µF 1 µF C3 0.22 µF Figure 39. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 4 Ω 24 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 33 µH OUTP L1 33 µH OUTN L2 C1 C2 0.1 µF 0.47 µF C3 0.1 µF Figure 40. Typical LC Output Filter, Cutoff Frequency of 27 kHz, Speaker Impedance = 8 Ω Ferrite Chip Bead OUTP 1 nF Ferrite Chip Bead OUTN 1 nF Figure 41. Typical Ferrite Chip Bead Filter (Chip bead example: Fair-Rite 2512067007Y3) Volume Control Operation Three pins labeled VOLUME, VARDIFF, and VARMAX control the class-D volume when driving speakers and the VAROUT volume. All of these pins are controlled with a dc voltage, which should not exceed VREF. When driving speakers in class-D mode, the VOLUME pin is the only pin that controls the gain. Table 1 lists the gain in class-D mode as determined by the voltage on the VOLUME pin in reference to the voltage on VREF. If using a resistor divider to fix the gain of the amplifier, the VREF terminal can be directly connected to AVDDREF and a resistor divider can be connected across VREF and REFGND. (See Figure 35 in the Application Information section). For fixed gain, calculate the resistor divider values necessary to center the voltage between the two percentage points given in the first column of Table 1. For example, if a gain of 10.7 dB is desired, the resistors in the divider network can both be 10 kΩ. With these resistor values, a voltage of 50%*VREF will be present at the VOLUME pin and result in a class-D gain of 10.7 dB. If using a DAC to control the class-D gain, VREF and REFGND should be connected to the reference voltage for the DAC and the GND terminal of the DAC, respectively. For the DAC application, AVDDREF would be left unconnected. The reference voltage of the DAC provides the reference to the internal gain circuitry through the VREF input and any fluctuations in the DAC output voltage will not affect the TPA3004D2 gain. The percentages in the first column of Table 1 should be used for setting the voltages of the DAC when the voltage on the VOLUME terminal is increased. The percentages in the second column should be used for the DAC voltages when decreasing the voltage on the VOLUME terminal. Two lookup tables should be used in software to control the gain based on an increase or decrease in the desired system volume. This is explained further in a section below. If using an analog potentiometer to control the gain, it should be connected between VREF and REFGND. VREF can be connected to AVDDREF or an external voltage source, if desired. The first and second column in Table 1 should be used to determine the point at which the gain changes depending on the direction that the potentiometer is turned. If the voltage on the center tap of the potentiometer is increasing, the first column in Table 1 should be referenced to determine the trip points. If the voltage is decreasing, the trip points in the second column should be referenced. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 25 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com The trip point, where the gain actually changes, is different depending on whether the voltage on the VOLUME terminal is increasing or decreasing as a result of hysteresis about each trip point. The hysteresis ensures that the gain control is monotonic and does not oscillate from one gain step to another. A pictorial representation of the volume control can be found in Figure 43. The graph focuses on three gain steps with the trip points defined in the first and second columns of Table 1 for class-D gain. The dotted lines represent the hysteresis about each gain step. The timing of the volume control circuitry is controlled by an internal 60 Hz clock. This clock determines the rate at which the gain changes when adjusting the voltage on the external volume control pins. The gain updates every 4 clock cycles (nominally 67 ms based on a 60 Hz clock) to the next step until the final desired gain is reached. For example, if the TPA3004D2 is currently in the +0.53 db class-D gain step and the VOLUME pin is adjusted for maximum gain at +36 dB, the time required for the gain to reach 36dB is 14 steps x 67ms/step = 0.938 seconds. Referencing Table 1, there are 14 steps between the +0.53 dB gain step and the maximum gain step of +36 dB. VARDIFF and VARMAX Operation The TPA3004D2 allows the user to specify a difference between the class-D gain and VAROUT gain. This is desirable to avoid any listening discomfort when plugging in headphones. When interfacing with the variable outputs, the VARDIFF and VARMAX pins control the VAROUT channel gain proportional to the gain set by the voltage on the VOLUME pin. When VARDIFF=0 V, the difference between the class-D gain and the VAROUT gain is 16 dB. As the voltage on the VARDIFF terminal is increased, the VAROUT channel gain decreases. Internal to the TPA3004D2 device, the voltage on the VARDIFF terminal is subtracted from the voltage on the VOLUME terminal and this value is used to determine the VAROUT gain. Some audio systems require that the gain be limited in the VAROUT mode to a level that is comfortable for headphone listening. The VARMAX terminal controls the maximum gain for the VAROUT channels. The functionality of the VARDIFF and VARMAX pin are combined to fix the VAROUT channel gain. A block diagram of the combined functionality is shown in Figure 42. The value obtained from the block diagram for VAROUT_VOLUME is a DC voltage that can be used in conjunction with Table 2 to determine the VAROUT channel gain. Table 2 lists the gain in VAROUT mode as determined by the VAROUT_VOLUME voltage in reference to the voltage on VREF. VARDIFF (V) VARMAX (V) – + VOLUME (V) VOLUME–VARDIFF Is VARMAX> YES (VOLUME–VARDIFF) VAROUT_VOLUME (V) = VOLUME (V) – VARDIFF (V) ? NO VAROUT_VOLUME (V) = VARMAX (V) Figure 42. Block Diagram of VAROUT Volume Control 26 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 Decreasing Voltage on VOLUME Terminal Class-D Gain – dB 5.6 3.1 Increasing Voltage on VOLUME Terminal 0.5 2.00 (40.1%*VREF) 2.21 2.10 2.11 (44.1%*VREF) (41.9%*VREF) (42.3%*VREF) Voltage on VOLUME Pin – V Figure 43. DC Volume Control Operation, VREF = 5 V MODE OPERATION The MODE pin is an input for controlling the output mode of the TPA3004D2. A logic HIGH on this pin disables the Class-D outputs. A logic LOW on this pin enables the class-D outputs. The VAROUT outputs are active in both modes and can be used as line level inputs to an external powered subwoofer while driving internal stereo speakers with the class-D outputs. The trip levels are defined in the specifications table. For interfacing with an external headphone amplifier like the TPA6110A2, the MODE pin can be connected to the switch on a headphone jack. When configured like Figure 36, the class-D outputs will be disabled when a headphone plug is inserted into the headphone jack. MODE_OUT OPERATION The MODE_OUT pin is an output for controlling the SHUTDOWN pin on an external headphone amplifier like the TPA6110A2 or for interfacing with other logic. The output voltages for a given load condition are given in the specifications table. This output is controlled by the MODE pin logic. When the MODE input is driven to a logic low, the MODE_OUT output drives to a logic high. Conversely, when the MODE pin is driven to a logic high, the MODE_OUT output drives LOW. The MODE_OUT output is simply the inverted state of the MODE input. It is designed in this manner because the TPA6110A2 SHUTDOWN input is active high. This allows the TPA3004D2 to place the TPA6110A2 into the shutdown state when driving internal speakers in the Class-D mode. Conversely, the MODE_OUT pin drives low to enable the TPA6110A2 headphone amplifier when headphones are plugged into the headphone jack and the MODE input is driven high. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 27 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com FADE OPERATION The FADE terminal is a logic input that controls the operation of the volume control circuitry during transitions to and from the shutdown state and during power-up. A logic low on this terminal, places the amplifier in the fade mode. During power-up or recovering from the shutdown state (a logic high is applied to the SD terminal), the volume is smoothly ramped up from the mute state, –75 dB, to the desired volume setting determined by the voltage on the volume control terminals. Conversely, the volume is smoothly ramped down from the current state to the mute state when a logic low is applied to the SD terminal. The timing of the volume control circuitry is controlled by an internal 60-Hz clock. This clock determines the rate at which the gain changes when adjusting the voltage on the external volume control pins. The gain updates every 4 clock cycles (nominally 67 ms based on a 60 Hz clock) to the next step until the final desired gain is reached. For example, if the TPA3004D2 is currently in the +0.53 db class-D gain step and the VOLUME pin is adjusted for maximum gain at +36 dB, the time required for the gain to reach 36dB is 14 steps x 67 ms/step = 0.938 seconds. Referencing Table 1, there are 14 steps between the +0.53 dB gain step and the maximum gain step of +36 dB. Figure 44 shows a scope capture of the differential output (measured across OUT+ and OUT–) with the amplifier in the fade mode. A 1 Vpp dc voltage was applied across the differential inputs and a logic low was applied to the SD terminal at the time defined in the figure. The figure depicts the outputs transitioning from one gain step to the next lower step at approximately 67 ms/step. A logic high on this pin disables the volume fade effect during transitions to and from the shutdown state and during power-up. During power-up or recovering from the shutdown state (a logic high is applied to the SD terminal), the transition from the mute state, –75 dB, to the desired volume setting is less than 1 ms. Conversely, the volume ramps down from current state to the mute state within 1 ms when a logic low is applied to the SD terminal. For the best pop performance, the fade mode should be enabled (a logic low is applied to the FADE terminal). SD = 0V GND Figure 44. Differential Output With FADE (Terminal 30) Held Low Figure 45 shows a scope capture of the differential output with the fade effect disabled. The outputs transition to the lowest gain state within 1ms of applying a logic low to the SD terminal. 28 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 SD = 0 V GND Figure 45. Differential Output With FADE Terminal Held High The switching frequency is determined using the values of the components connected to ROSC (pin 27) and COSC (pin 28) and may be calculated with the following equation: fOSC = 6.6 / (ROSC × COSC) . INTERNAL 2.5-V BIAS GENERATOR CAPACITOR SELECTION The internal 2.5-V bias generator (V2P5) provides the internal bias for the preamplifier stages on both the class-D amplifiers and the variable amplifiers. The external input capacitors and this internal reference allow the inputs to be biased within the optimal common-mode range of the input preamplifiers. The selection of the capacitor value on the V2P5 terminal is critical for achieving the best device performance. During startup or recovery from the shutdown state, the V2P5 capacitor determines the rate at which the amplifier starts up. When the voltage on the V2P5 capacitor equals 0.75xV2P5, or 75% of its final value, the device turns on and the class-D outputs start switching. The startup time is not critical for the best depop performance since any pop sound that is heard is the result of the class-D outputs switching on and not the startup time. However, at least a 0.47-µF capacitor is recommended for the V2P5 capacitor. A secondary function of the V2P5 capacitor is to filter high frequency noise on the internal 2.5-V bias generator. INPUT RESISTANCE Each gain setting is achieved by varying the input resistance of the amplifier, which can range from its smallest value to over six times that value. As a result, if a single capacitor is used in the input high-pass filter, the –3 dB or cutoff frequency also changes by over six times. Zf Ci Input Signal IN Zi The –3-dB frequency can be calculated using Equation 5. Input impedance (ZI) vs Gain can be found in Figure 7. 1 f *3dB + 2p Z iC i (5) Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 29 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com INPUT CAPACITOR, CI In the typical application an input capacitor (CI) is required to allow the amplifier to bias the input signal to the proper dc level (V2P5) for optimum operation. In this case, CI and the input impedance of the amplifier (ZI) form a high-pass filter with the corner frequency determined in equation 6. –3 dB fc = 1 2pZiCi fc (6) The value of CI is important, as it directly affects the bass (low frequency) performance of the circuit. Consider the example where ZI is 20 kΩ and the specification calls for a flat bass response down to 20 Hz. Equation 6 is reconfigured as Equation 7. 1 Ci + 2pZ i f c (7) In this example, CI is 0.4 µF, so one would likely choose a value in the range of 0.47 µF to 1 µF. If the gain is known and will be constant, use ZI from Figure 7 (Input Impedance vs Gain) to calculate CI. Calculations for CI should be based off the impedance at the lowest gain step intended for use in the system. A further consideration for this capacitor is the leakage path from the input source through the input network (CI) and the feedback network to the load. This leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially in high gain applications. For this reason a low-leakage tantalum or ceramic capacitor is the best choice. When polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at 2.5 V, which is likely higher than the source dc level. Note that it is important to confirm the capacitor polarity in the application. Power Supply Decoupling, CS The TPA3004D2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. The optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power supply leads. For higher frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (ESR) ceramic capacitor, typically 0.1 µF placed as close as possible to the device VCC lead works best. For filtering lower-frequency noise signals, a larger aluminum electrolytic capacitor of 10 µF or greater placed near the audio power amplifier is recommended. The 10-µF capacitor also serves as local storage capacitor for supplying current during large signal transients on the amplifier outputs. BSN and BSP Capacitors The full H-bridge output stages use only NMOS transistors. They therefore require bootstrap capacitors for the high side of each output to turn on correctly. A 10-nF ceramic capacitor, rated for at least 25 V, must be connected from each output to its corresponding bootstrap input. Specifically, one 10-nF capacitor must be connected from xOUTP to xBSP, and one 10-nF capacitor must be connected from xOUTN to xBSN. (See the application circuit diagram in Figure 35.) The bootstrap capacitors connected between the BSxx pins and corresponding output function as a floating power supply for the high-side N-channel power MOSFET gate drive circuitry. During each high-side switching cycle, the bootstrap capacitors attempt to hold the gate-to-source voltage high enough to keep the high-side MOSFETs turned on. However, there is a leakage path and the voltage on the bootstrap capacitors slowly decrease while the high-side is conducting. 30 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 By driving the outputs into heavy clipping with a sine wave of less than 50 Hz, the bootstrap voltage can decrease below the minimum Vgs required to keep the high-side output MOSFET turned on. When this occurs, the output transistor becomes a source-follower and the output drops from VCC to approximately Vclamp (voltage on pins 25 and 36). For the majority of applications, driving a square wave at low frequencies is not a design consideration and the recommended bootstrap capacitor value of 10-nF is acceptable. However, if this is a concern, increasing the bootstrap capacitors holds the gate voltage for a longer period of time and the drop in the output voltage does not occur. A value of 220-nF is recommended with a 51 Ω resistor placed in series between the outputs and bootstrap pins. The 51 Ω series resistor is necessary to limit the current charging and discharging the bootstrap capacitors. VCLAMP Capacitors To ensure that the maximum gate-to-source voltage for the NMOS output transistors is not exceeded, two internal regulators clamp the gate voltage. Two 1-µF capacitors must be connected from VCLAMPL (pin 25) and VCLAMPR (pin 36) to ground and must be rated for at least 25 V. The voltages at the VCLAMP terminals vary with VCC and may not be used for powering any other circuitry. Internal Regulated 5-V Supply (AVDD) The AVDD terminal (pin 29) is the output of an internally-generated 5-V supply, used for the oscillator, preamplifier, and volume control circuitry. It requires a 0.1-µF to 1-µF capacitor, placed very close to the pin, to ground to keep the regulator stable. The regulator may be used to power an external headphone amplifier or other circuitry, up to a current limit specified in the specification table. When powering external circuitry, like the TPA6110A2 headphone amplifier, an additional 10 µF or larger capacitor should be added to the AVDD terminal. AVDD – POWER-UP RESPONSE Power–Up Ch1 (AVDD) AVDD (pin 29) AVCC (pin 33) Ch2 (AVCC) Ch1 5.00 V/div Ch2 2.00 V/div M 10.0 µs Figure 46. Power-Up Response Differential Input The differential input stage of the amplifier cancels any noise that appears on both input lines of the channel. To use the TPA3004D2 EVM with a differential source, connect the positive lead of the audio source to the INP input and the negative lead from the audio source to the INN input. To use the TPA3004D2 with a single-ended source, ac ground the INP input through a capacitor equal in value to the input capacitor on INN and apply the audio source to the INN input. In a single-ended input application, the INP input should be ac-grounded at the audio source instead of at the device input for best noise performance. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 31 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com SD OPERATION The TPA3004D2 employs a shutdown mode of operation designed to reduce supply current (ICC) to the absolute minimum level during periods of nonuse for power conservation. The SD input terminal should be held high (see specification table for trip point) during normal operation when the amplifier is in use. Pulling SD low causes the outputs to mute and the amplifier to enter a low-current state, ICC(SD) = 10 µA. SD should never be left unconnected, because amplifier operation would be unpredictable. POWER-OFF POP REDUCTION For the best power-off pop performance, the amplifier should be placed in the shutdown mode prior to removing the power supply voltage. Another method to reduce power-off pop is implemented in the hardware. A 100 µF – 150 µF capacitor can be added to the AVDD terminal in parallel with the 100-nF capacitor shown in Figure 35. The additional capacitance holds up the regulator voltage for a longer period of time and results in smaller power-off pop. USING LOW-ESR CAPACITORS Low-ESR capacitors are recommended throughout this application section. A real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. The voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. The lower the equivalent value of this resistance the more the real capacitor behaves like an ideal capacitor. SHORT-CIRCUIT PROTECTION The TPA3004D2 has short circuit protection circuitry on the outputs that prevents damage to the device during output-to-output shorts, output-to-GND shorts, and output-to-VCC shorts. When a short-circuit is detected on the outputs, the part immediately disables the output drive. This is a latched fault and must be reset by cycling the voltage on the SD pin to a logic low and back to the logic high state for normal operation. This will clear the short-circuit flag and allow for normal operation if the short was removed. If the short was not removed, the protection circuitry will again activate. The trip-point for the short-circuit protection is nominally set at 8 A. For VCC > 15 V, two Schottky diodes are required to provide short-circuit protection. The diodes should be placed as close to the TPS3004D2 as possible, with the anodes connected to PGND and the cathodes connected to OUTP and OUTN as shown in the application circuit schematic. The diodes should have a forward voltage rating of 0.5 V at a minimum of 1 A output current and a dc blocking voltage rating of at least 30 V. The diodes must also be rated to operate at a junction temperature of 150°C. If VCC < 15 V, the Schottky diodes are not required for short circuit protection. If short-circuit protection is not required, the Schottky diodes may be omitted. THERMAL PROTECTION Thermal protection on the TPA3004D2 prevents damage to the device when the internal die temperature exceeds 150°C. There is a ±15 degree tolerance on this trip point from device to device. Once the die temperature exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 20°C. The device begins normal operation at this point with no external system interaction. THERMAL CONSIDERATIONS: OUTPUT POWER AND MAXIMUM AMBIENT TEMPERATURE To calculate the maximum ambient temperature, the following equation may be used: TAmax = TJ - qJAPDissipated where: TJ = 125°C qJA = 19°C/W spacer 2-Layer PCB, 5 sq. in. copper, see Figure 47. (8) To estimate the power dissipation, the following equation may be used: 32 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 PDissipated = PO(average) x ((1 / Efficiency) – 1) Efficiency = ~85% for an 8-Ω load = ~75% for a 4-Ω load (9) Example. What is the maximum ambient temperature for an application that requires the TPA3004D2 to drive 10 W into an 8-Ω speaker (stereo)? PDissipated = 20 W x ((1 / 0.85) – 1) = 3.5 W space (PO = 10 W * 2) TAmax = 125°C – (19°C/W x 3.5 W) = 58.5°C This calculation shows that the TPA3004D2 can drive 10 W of continuous RMS power per channel into an 8-Ω speaker up an ambient temperature of 58.5°C. Figure 47 and Figure 48 show the results of several thermal experiments conducted with the TPA3004D2. Both figures show that the best thermal performance can be achieved with more copper area for heat dissipation and an adequate number of thermal vias. Figure 47 shows two curves for a 2-layer and 4-layer PCB. The 2-layer PCB layout was tightly controlled with a fixed amount of 2 oz. copper on the bottom layer of the PCB. The amount of copper is shown on the x-axis. Nine thermal vias of 13 mil (0.33mm) diameter were drilled under the PowerPad and connected to the bottom layer. The top layer only consisted of traces for signal routing. The 4-layer PCB layout was also tightly controlled with a fixed amount of 2 oz. copper in middle GND layer. The top layer only consisted of traces for signal routing. The bottom and other middle layer were left blank. Nine thermal vias of 0.33mm diameter were drilled under the PowerPad and connected to the middle layer. Figure 48 shows the effect of the number of thermal vias drilled under the PowerPad on the thermal performance of the PCB. The experiment was conducted with a 2-layer PCB and 3 square inches of copper on the bottom layer. For the best thermal performance, at least 16 vias in a 4x4 pattern should be used under the PowerPad. Refer to the TPA3004D2 EVM User's Manual, SLOU115, for an example layout with a 4x4 via pattern. PCB gerber files are available at request. PRINTED CIRCUIT BOARD (PCB) LAYOUT Because the TPA3004D2 is a class-D amplifier that switches at a high frequency, the layout of the printed circuit board (PCB) should be optimized according to the following guidelines for the best possible performance. • Decoupling capacitors — The high-frequency 0.1-µF decoupling capacitors should be placed as close to the PVCC (pin 14, 15, 22, 23, 38, 39, 46, 47) and AVCC (pin 33) terminals as possible. The V2P5 (pin 4) capacitor, AVDD (pin 29) capacitor, and VCLAMP (pins 25, 36) capacitor should also be placed as close to the device as possible. Large (10 µF or greater) bulk power supply decoupling capacitors should be placed near the TPA3004D2 on the PVCCL, PVCCR, and AVCC terminals. • Grounding — The AVCC (pin 33) decoupling capacitor, AVDD (pin 29) capacitor, V2P5 (pin 4) capacitor, COSC (pin 28) capacitor, and ROSC (pin 27) resistor should each be grounded to analog ground (AGND, pin 26 and pin 30). The PVCC (pin 9 and pin 16) decoupling capacitors should each be grounded to power ground (PGND, pins 18, 19, 42, 43). Analog ground and power ground may be connected at the PowerPAD, which should be used as a central ground connection or star ground for the TPA3004D2. Basically, an island should be created with a single connection to PGND at the PowerPAD. • Output filter — The ferrite EMI filter (Figure 41) should be placed as close to the output terminals as possible for the best EMI performance. The LC filter (Figure 40 should be placed close to the outputs. The capacitors used in both the ferrite and LC filters should be grounded to power ground. • PowerPAD — The PowerPAD must be soldered to the PCB for proper thermal performance and optimal reliability. The dimensions of the PowerPAD thermal land should be 5 mm by 5 mm (197 mils by 197 mils). The PowerPAD size measures 4.55 x 4.55 mm. Four rows of solid vias (four vias per row, 0.3302 mm or 13 mils diameter) should be equally spaced underneath the thermal land. The vias should connect to a solid copper plane, either on an internal layer or on the bottom layer of the PCB. The vias must be solid vias, not thermal relief or webbed vias. For additional information, refer to the PowerPAD Thermally Enhanced Package application note, TI literature number SLMA002. For an example layout, see the TPA3004D2 Evaluation Module (TPA3004D2EVM) User Manual, TI (SLOU158). Both the EVM user manual and the PowerPAD application note are available on the TI web site at http://www.ti.com. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 33 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com THERMAL RESISTANCE vs COPPER AREA 2-LAYER PCB THERMAL RESISTANCE vs COPPER AREA 4-LAYER PCB 35 θ JA – Thermal Resistance – °C/W θ JA – Thermal Resistance – °C/W 35 30 25 20 15 1 1.5 2 2.5 3 3.5 4 Copper Area – sq. Inches 4.5 5 30 25 20 15 1 2 3 4 Copper Area – sq. Inches 5 Figure 47. Thermal Resistance THERMAL RESISTANCE vs THERMAL VIA QUANTITY 2-LAYER PCB θ JA – Thermal Resistance – °C/W 25 24 23 22 21 20 4 6 8 10 12 14 Thermal Via Quantity (13 Mil Diameter) 16 Figure 48. Thermal Resistance 34 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 BASIC MEASUREMENT SYSTEM This application note focuses on methods that use the basic equipment listed below: • Audio analyzer or spectrum analyzer • Digital multimeter (DMM) • Oscilloscope • Twisted pair wires • Signal generator • Power resistor(s) • Linear regulated power supply • Filter components • EVM or other complete audio circuit Figure 49 shows the block diagrams of basic measurement systems for class-AB and class-D amplifiers. A sine wave is normally used as the input signal since it consists of the fundamental frequency only (no other harmonics are present). An analyzer is then connected to the APA output to measure the voltage output. The analyzer must be capable of measuring the entire audio bandwidth. A regulated dc power supply is used to reduce the noise and distortion injected into the APA through the power pins. A System Two audio measurement system (AP-II) (Reference 1) by Audio Precision includes the signal generator and analyzer in one package. The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling capacitors, (CIN), so no additional coupling is required. The generator output impedance should be low to avoid attenuating the test signal, and is important since the input resistance of APAs is not very high (about 10 kΩ). Conversely the analyzer-input impedance should be high. The output impedance, ROUT, of the APA is normally in the hundreds of milliohms and can be ignored for all but the power-related calculations. Figure 49(a) shows a class-AB amplifier system. They take an analog signal input and produce an analog signal output. These amplifier circuits can be directly connected to the AP-II or other analyzer input. This is not true of the class-D amplifier system shown in Figure 49(b), which requires low pass filters in most cases in order to measure the audio output waveforms. This is because it takes an analog input signal and converts it into a pulse-width modulated (PWM) output signal that is not accurately processed by some analyzers. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 35 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 www.ti.com Power Supply Signal Generator APA RL Analyzer 20 Hz – 20 kHz (a) Basic Class–AB Power Supply Low–Pass RC Filter Signal Generator Class–D APA RL Low–Pass RC Filter Analyzer 20 Hz – 20 kHz (b) Filter–Free and Traditional Class–D (1) For efficiency measurements with filter-free class-D, RL should be an inductive load like a speaker. Figure 49. Audio Measurement Systems The TPA3004D2 uses a modulation scheme that does not require an output filter for operation, but they do sometimes require an RC low-pass filter when making measurements. This is because some analyzer inputs cannot accurately process the rapidly changing square-wave output and therefore record an extremely high level of distortion. The RC low-pass measurement filter is used to remove the modulated waveforms so the analyzer can measure the output sine wave. DIFFERENTIAL INPUT AND BTL OUTPUT All of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied load (BTL) outputs. Differential inputs have two input pins per channel and amplify the difference in voltage between the pins. Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly used in audio to describe differential outputs. BTL outputs have two output pins providing voltages that are 180 degrees out of phase. The load is connected between these pins. This has the added benefits of quadrupling the output power to the load and eliminating a dc blocking capacitor. A block diagram of the measurement circuit is shown in Figure 50. The differential input is a balanced input, meaning the positive (+) and negative (–) pins will have the same impedance to ground. Similarly, the BTL output equates to a balanced output. 36 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 Evaluation Module Audio Power Amplifier Generator Analyzer Low–Pass RC Filter CIN VGEN RGEN RIN ROUT RIN ROUT CIN RGEN RL Low–Pass RC Filter Twisted–Pair Wire RANA CANA RANA CANA Twisted–Pair Wire Figure 50. Differential Input—BTL output Measurement Circuit The generator should have balanced outputs and the signal should be balanced for best results. An unbalanced output can be used, but it may create a ground loop that will affect the measurement accuracy. The analyzer must also have balanced inputs for the system to be fully balanced, thereby cancelling out any common mode noise in the circuit and providing the most accurate measurement. The following general rules should be followed when connecting to APAs with differential inputs and BTL outputs: • Use a balanced source to supply the input signal. • Use an analyzer with balanced inputs. • Use twisted-pair wire for all connections. • Use shielding when the system environment is noisy. • Ensure the cables from the power supply to the APA, and from the APA to the load, can handle the large currents (see Table 4). Table 4 shows the recommended wire size for the power supply and load cables of the APA system. The real concern is the dc or ac power loss that occurs as the current flows through the cable. These recommendations are based on 12-inch long wire with a 20-kHz sine-wave signal at 25°C. Table 4. Recommended Minimum Wire Size for Power Cables POUT (W) RL (Ω) 10 4 18 22 16 40 18 42 2 4 18 22 3.2 8.0 3.7 8.5 1 8 22 28 2.0 8.0 2.1 8.1 < 0.75 8 22 28 1.5 6.1 1.6 6.2 AWG Size DC Power Loss (mW) AC Power Loss (mW) CLASS-D RC LOW-PASS FILTER An RC filter is used to reduce the square-wave output when the analyzer inputs cannot process the pulse-width modulated class-D output waveform. This filter has little effect on the measurement accuracy because the cutoff frequency is set above the audio band. The high frequency of the square wave has negligible impact on measurement accuracy because it is well above the audible frequency range and the speaker cone cannot respond at such a fast rate. The RC filter is not required when an LC low-pass filter is used, such as with the class-D APAs that employ the traditional modulation scheme (TPA032D0x, TPA005Dxx). The component values of the RC filter are selected using the equivalent output circuit as shown in Figure 51. RL is the load impedance that the APA is driving for the test. The analyzer input impedance specifications should be available and substituted for RANA and CANA. The filter components, RFILT and CFILT, can then be derived for the system. The filter should be grounded to the APA near the output ground pins or at the power supply ground pin to minimize ground loops. Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 37 TPA3004D2 SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 Load www.ti.com RC Low–Pass Filters RFILT AP Analyzer Input CFILT VL= VIN RL CANA RANA CANA RANA VOUT RFILT CFILT To APA GND Figure 51. Measurement Low-Pass Filter Derivation Circuit—Class-D APAs The transfer function for this circuit is shown in Equation 10 where wO = REQCEQ, REQ = RFILT||RANA and CEQ = (CFILT + CANA). The filter frequency should be set above fMAX, the highest frequency of the measurement bandwidth, to avoid attenuating the audio signal. Equation 11 provides this cutoff frequency, fC. The value of RFILT must be chosen large enough to minimize current that is shunted from the load, yet small enough to minimize the attenuation of the analyzer-input voltage through the voltage divider formed by RFILT and RANA. A rule of thumb is that RFILT should be small (~100 Ω) for most measurements. This reduces the measurement error to less than 1% for RANA≥ 10 kΩ. ǒ Ǔ R V OUT V IN f C + Ǹ2 ǒ + R ANA )R ANA FILT Ǔ ǒ Ǔ 1 ) j ww O f (10) MAX (11) An exception occurs with the efficiency measurements, where RFILT must be increased by a factor of ten to reduce the current shunted through the filter. CFILT must be decreased by a factor of ten to maintain the same cutoff frequency. See Table 2 for the recommended filter component values. Once fC is determined and RFILT is selected, the filter capacitance is calculated using Equation 11. When the calculated value is not available, it is better to choose a smaller capacitance value to keep fC above the minimum desired value calculated in Equation 12. 1 C + FILT 2p f R C FILT (12) Table 5 shows recommended values of RFILT and CFILT based on common component values. The value of fC was originally calculated to be 28 kHz for an fMAX of 20 kHz. CFILT, however, was calculated to be 57000 pF, but the nearest values of 56000 pF and 51000 pF were not available. A 47000 pF capacitor was used instead, and fC is 34 kHz, which is above the desired value of 28 kHz. Table 5. Typical RC Measurement Filter Values MEASUREMENT 38 RFILT CFILT Efficiency 1000 Ω 5600 pF All other measurements 100 Ω 56000 pF Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 REVISION HISTORY Changes from Original (February 2003) to Revision A • Page Changed the data sheet From: Product Preview To Production Data ................................................................................. 1 Changes from Revision A (March 2003) to Revision B Page • Updated the FUNCTIONAL BLOCK DIAGRAM ................................................................................................................... 3 • Updated Figure 35 .............................................................................................................................................................. 20 • Updated Figure 36 .............................................................................................................................................................. 21 • Changed Figure 39 title From: Cutoff Frequency of 41 kHz, To: Cutoff Frequency of 27 kHz, ......................................... 24 • Changed Figure 39 title From: Cutoff Frequency of 41 kHz, To: Cutoff Frequency of 27 kHz, ......................................... 25 • Changed text in section SELECTION OF COSC AND ROSC From: ROSC (pin 20) and COSC (pin 21) To: ROSC (pin 27) and COSC (pin 28) ................................................................................................................................................ 29 • Added three paragraphs to the section BSN and BSP CAPACITORS .............................................................................. 30 • Added two paragraphs to the section SHORT-CIRCUIT PROTECTION ........................................................................... 32 • Added Note 1 to Figure 49 ................................................................................................................................................. 36 Changes from Revision B (August 2003) to Revision C Page • Added 10µF between AVDD and AGND in Figure 35 ........................................................................................................ 20 • Updated Figure 36 .............................................................................................................................................................. 21 • Added section POWER-OFF POP REDUCTION ............................................................................................................... 32 Changes from Revision C (January 2004) to Revision D • Page Changed the PO(max) Test Condition From: RL = 8 Ω To: RL = 8 Ω, VCC = 15 V ................................................................... 7 Changes from Revision D (September 2010) to Revision E • Page Replaced the Dissipations Ratings table with the Thermal Information table. ..................................................................... 5 Submit Documentation Feedback Copyright © 2003–2011, Texas Instruments Incorporated Product Folder Link(s): TPA3004D2 39 PACKAGE OPTION ADDENDUM www.ti.com 6-Jun-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) TPA3004D2PHP ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR -40 to 85 TPA3004D2 TPA3004D2PHPG4 ACTIVE HTQFP PHP 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR -40 to 85 TPA3004D2 TPA3004D2PHPR ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR -40 to 85 TPA3004D2 TPA3004D2PHPRG4 ACTIVE HTQFP PHP 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-4-260C-72 HR -40 to 85 TPA3004D2 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 6-Jun-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPA3004D2PHPR Package Package Pins Type Drawing HTQFP PHP 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 16.4 Pack Materials-Page 1 9.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.6 1.5 12.0 16.0 Q2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA3004D2PHPR HTQFP PHP 48 1000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated

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