TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
Applications




Base Station Receivers
Tower Mount Amplifiers
Balanced Amplifiers
Defense Communications
16-pin 4x4 mm QFN Package
Product Features









Functional Block Diagram
0.62 dB NF (Balanced configuration) at 830 MHz
50−1500 MHz Operational bandwidth
18.4 dB Gain at 830 MHz
+22 dBm Input IP3
-35 dB Reverse Isolation
Integrated shut-down biasing feature
Bias adjustable
Does not require negative voltage supply
4x4 mm 16-pin QFN plastic package
Pin 1 Reference Mark
DC
Bias 1 Vpd1 Ictrl1
16
15
14
NA
13
RFout1/
RFin1/
Vg1
1
12 Vd1
GND
2
11 GND
GND
3
10 GND
RFin2/
Vg2
4
9 Vd2
RFout2/
5
6
7
8
DC
Vpd2 Ictrl2
Bias 2
NA
Backside Paddle - RF/DC GND
General Description
Pin Configuration
The TQL9066 is a high linearity, ultra-low noise figure
dual device amplifier in a 4x4 mm package. At 830 MHz
in a balanced configuration, the LNA provides 18.4 dB
gain, 22 dBm IIP3 and 0.62 dB noise figure. The part
does not require a negative supply for operation and is
bias adjustable for both drain current and voltage. The
device is housed in a green/RoHS-compliant industry
standard QFN package.
The TQL9066 consists of a single monolithic GaAs EpHEMT die and integrates bias circuitry as well as shutdown capability allowing the LNA to be useful for both
FDD and TDD applications.
The TQL9066 is optimized for the 700−1000 MHz band,
but can be used outside of the band. TriQuint offers pincompatible dual LNAs for the 1.5−2.3 GHz band
(TQP3M9040) and 2.3−4.0 GHz (TQP3M9041). The
balanced amplifier is optimized for high performance
receivers in wireless infrastructure and can be used for
base-station transceivers or tower-mounted amplifiers.
Pin No.
Label
1
4
12
9
2, 3, 10, 11
16
5
15
6
14
7
Backside Paddle
RFin1/Vg1
RFin2/Vg2
RFout1/Vd1
RFout2/Vd2
Ground
DC Bias 1
DC Bias 2
Vpd1
Vpd2
Ictrl1
Ictrl2
RF/DC GND
Ordering Information
Part No.
Description
TQL9066
TQL9066-PCB
50−1500 MHz Dual LNA
700−1000 MHz Evaluation Board
Standard T/R size = 2500 pieces on a 13” reel
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
- 1 of 10 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Parameter
Storage Temperature
Drain Voltage (Vd)
Idd (Vd = 5V) per channel
Input Power (CW)
Input Power (CW, DC off condition)
Input Power (DC off condition
& 10% Duty Cycle)
Rating
−65 to 150°C
+7 V
300 mA
+22 dBm
+22 dBm
+30 dBm
Operation of this device outside the parameter ranges
given above may cause permanent damage.
Min
Vpd
Vg
Vd
Id, single channel
Operating Temp. Range
Tch (for>106 hrs MTTF)
0
0
+2
Typ
+0.5
57
−40
Max Units
+5
+1
+5
85
+105
190
V
V
V
mA
°C
°C
Electrical specifications are measured at specified test
conditions. Specifications are not guaranteed over all
recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: Vd = +4.35 V, Temp.=+25°C, tuned balanced configuration. NF is de-embedded to the
input of the input hybrid coupler.
Parameter
Operational Frequency Range
Test Frequency
Gain
Output P1dB
Input IP3
Output IP3
Noise Figure
Reverse Isolation, S12
Drain Voltage, Vd
Drain Current, Id
Power Down Control Voltage, Vpd1
Thermal Resistance, θjc
Conditions
Min
Typ
50
Units
1500
MHz
MHz
dB
dBm
dBm
dBm
dB
dB
V
mA
V
V
°C/W
830
18.4
+21.4
+22
+40
0.62
-35
+4.35
55
Pin=−13 dBm/tone, Δf=1 MHz
Pout=+5 dBm/tone, Δf=1 MHz
Balanced configuration
Single Channel
On-State
Off-State
Channel to case - per channel
Max
0
+2.1
+0.3
Vd
53.4
Notes: This voltage is references to the turret labeled Vpd1, Vpd2 on the evaluation board turret as shown on page 3.
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
- 2 of 10 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
S-Parameters
Test Conditions: VDD=+4.35 V, IDD=55 mA (typ.), T=+25°C, unmatched 50 ohm system, calibrated to device leads
Freq (GHz)
0.63
0.68
0.73
0.78
0.83
0.88
0.93
0.98
1.03
1.08
1.13
1.18
1.23
1.28
1.33
1.38
S11 (mag)
0.79337
0.79442
0.79277
0.78648
0.79306
0.78059
0.78969
0.78116
0.78332
0.78317
0.77558
0.78385
0.77114
0.78121
0.77214
0.77461
S11 (ang)
-12.900
-13.874
-14.172
-15.172
-15.631
-16.375
-17.284
-17.695
-18.899
-19.210
-20.396
-20.946
-21.773
-22.803
-23.231
-24.510
Note: Single Ended Configuration.
S21 (mag)
8.26522
7.74829
7.26533
6.84091
6.49595
6.14597
5.88192
5.59921
5.36480
5.15505
4.95617
4.79515
4.61128
4.47997
4.32752
4.20926
S21 (ang)
90.261
88.361
86.104
84.470
82.537
80.813
79.116
77.274
75.909
74.048
72.708
70.912
69.304
67.885
66.119
64.759
S12 (mag)
0.01148
0.01248
0.01339
0.01432
0.01531
0.01622
0.01727
0.01820
0.01920
0.02024
0.02126
0.02239
0.02335
0.02451
0.02555
0.02670
S12 (ang)
75.844
75.711
75.404
75.284
74.926
74.516
74.219
73.540
73.430
72.645
72.415
71.594
71.051
70.482
69.734
69.193
S22 (mag)
0.92636
0.92606
0.92339
0.92274
0.92335
0.92385
0.92328
0.92190
0.91992
0.92047
0.92067
0.91905
0.91742
0.91527
0.91543
0.91419
S22 (ang)
-12.494
-13.755
-15.078
-16.327
-17.625
-18.774
-20.130
-21.322
-22.552
-23.861
-24.977
-26.433
-27.760
-29.220
-30.654
-32.037
Noise Parameters
Test Conditions: VDD=+4.35 V, IDD=55 mA (typ.), T=+25°C, unmatched 50 ohm system, calibrated to device leads
Freq (GHz)
0.63
0.68
0.73
0.78
0.83
0.88
0.93
0.98
1.03
1.08
1.13
1.18
1.23
1.28
1.33
1.38
NFmin (dB)
0.18904
0.15268
0.13607
0.14421
0.18132
0.22549
0.21280
0.22103
0.22786
0.24764
0.22524
0.22329
0.23666
0.25239
0.23498
0.22454
Note: Single Ended Configuration.
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
MagOpt (mag)
0.68290
0.60214
0.59945
0.61001
0.56081
0.58780
0.51434
0.55135
0.51948
0.49175
0.48301
0.44584
0.46800
0.44915
0.40194
0.42934
- 3 of 10 -
AngOpt (deg)
20.6785
18.3406
22.8778
20.4961
19.4236
24.7523
20.6518
24.4779
22.6357
23.1648
25.1937
25.1826
28.0534
22.6713
29.8884
25.3527
Rn (Ω)
0.06298
0.06813
0.06129
0.06111
0.06567
0.06571
0.06780
0.05977
0.06729
0.06989
0.06393
0.06376
0.06793
0.06323
0.06239
0.07558
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
Noise Figure Circles at 900 MHz
Noise parameter measurements taken at the package pin reference plane. The gate and drain are biased externally through bias-tees. The
achievable NFmin will worsen with on board non-ideal bias circuit.
Graph 1
p1: Freq = 0.9 GHz p2: Freq = 0.9 GHz p3: Freq = 0.9 GHz
NF = 0.22042 dB
NF = 0.27042 dB
NF = 0.32042 dB
Swp Max
p4: Freq = 0.9 GHz p5: Freq = 0.9 GHz p6: Freq = 0.9 GHz
0.9GHz
NF = 0.37042 dB
NF = 0.42042 dB
NF = 0.47042 dB
S11*
p1
p3
p5
p2
p4
ΓOPT
p6
NFCIR(5,0.05)
Swp Min
0.9GHz
Conj(S(1,1))
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
- 4 of 10 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
TQL9066-PCB Evaluation Board Layout
J4
J3
J5
L8
L2
X1
R8
R7
C8
R2
R17
R4
C21
L7
L3
C3
C1
C10
C11
C9
C7
R1
R6
C12
C13
R14
C17
C18
L10
C20
C19
L9
X2
R16
R15
R9
C14
C15
R10
R18
R12
C22
L4
L6
C4
C6
U1
C16
J7
J8
J6
See Evaluation Board PCB Information section for PCB material and stack-up.
Bill of Material – TQL9066-PCB
Reference Des.
Value
Description
Manuf.
Part Number
U1
n/a
Dual LNA
TriQuint
TQL9066
X1
n/a
Hybrid coupler
Anaren
X3C09P1-03S
n/a
C0810J5003AHF
X2
Hybrid coupler
Anaren
R1, R9
330 Ω
RES, 0402, +/-5%, 1/16W
Various
R8, R15
51 Ω
RES, 0402, +/-5%, 1/16W
Various
R6, R14
10 Ω
RES, 0402, +/-5%, 1/16W
Various
R4, R12
2.2K Ω
RES, 0402, +/-5%, 1/16W
Various
R7, R16
2.2 Ω
RES, 0603, +/-5%, 1/8W
Various
R17, R18
15K Ω
RES, 0402, +/-5%, 1/16W
Various
R2, R10
33K Ω
RES, 0402, +/-5%, 1/10W
C1, C4
47 pF
CAP, 0402, +/-5%, 50V
Panasonic
ECJ-0EC1H470J
C3, C6
1.2 pF
CAP, 0402, +/-0.1pF, 25V
Panasonic
ECD-G0E1R2B
C7, C14
1.8 pF
CAP, 0402, +/-0.1pF, 50V
AVX
04025U1R8BAT2A
C8, C15, C21, C22, C11, C19
100 pF
CAP, 0402, +/-5%, 50V
Panasonic
ECJ-0EC1H101J
C9, C16
0.01 uF
CAP, 0805, +/-5%, 50V, X7R
Various
C10, C20
1000 pF
CAP, 0402, +/-10%, 50V
Various
C12, C13, C17, C18
4.7 pF
CAP, 0402, +/-0.1pF, 50V
AVX
04025U4R7BAT2A
L2, L4
6.8 nH
IND, 0402, +/-5%
Coilcraft
0402CS-6N8XJL
L3, L6
220 nH
IND, 0603, +/-5%
Coilcraft
0603CS-R22XJL
L7, L9
100 nH
IND, 0603, +/-5%, 600mA
Coilcraft
0603CS-R10XJL
L8, L10
8.2 nH
IND, 0402, +/-5%
Coilcraft
0402CS-8N2XJL
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
- 5 of 10 -
Various
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
TQL9066-PCB Evaluation Board Schematic
J4
J3
R2
33K
C9
0.01uF
R17
15K
1.8pF
C1
L2
47pF
6.8nH
C10
1000pF
100pF
C8
C7
R7
2.2
C21
100pF
R1
330
L3
220nH
C11
R4
2.2K
R6
C3
1.2pF
100pF
L7
100nH
C12
10
4.7pF
R14
C17
C13
L8 4.7pF
8.2nH
X2
R8
50
X1
C4
R15
50 
L4
47pF 6.8nH
C6
1.2pF
C14
1.8pF
R12
2.2K
L6
220nH
10
L9 4.7pF
100nH
R9
C19
330
100pF
C20
R10
33K
C15
100pF
R18
15K
C22
100pF
C18
L10 4.7pF
8.2nH
1000pF
R16
2.2
C16
0.01uF
J7
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
J6
- 6 of 10 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
Typical Performance (Balanced Configuration)
Test conditions unless otherwise noted: Vd = +4.35 V, Id =115 mA, Temp.=+25°C. NF is de-embedded to the input of the input
hybrid coupler.
Parameter
Typical Value
Frequency
Gain
Reverse Isolation, S12
Noise Figure (Balanced Configuration)
Output P1dB
IIP3 (Pin/tone=-13 dBm, Δf = 1 MHz)
700
18
-39
0.57
+21.6
+22.0
830
18.5
-38
0.62
+21.5
+24.8
Units
900
18.4
-36
0.6
+21.4
+25.7
1000
18.0
-35
0.69
+21.3
+25.0
MHz
dB
dB
dB
dBm
dBm
Performance Plots (Balanced Configuration)
Test conditions unless otherwise noted: Vd = +4.35 V, Id =115 mA, Temp.=+25°C
Gain vs. Frequency
20
Input Return Loss vs. Frequency
0
Output Return Loss vs. Frequency
0
-5
-5
19
-10
+105°C
+85°C
17
+25°C
−40°C
+105°C
-10
|S22| (dB)
|S11| (dB)
Gain (dB)
-15
18
-20
+105°C
-25
+85°C
-30
+25°C
+85°C
+25°C
-15
−40°C
-20
−40°C
-35
16
-25
-40
15
-45
700
750
800
850
900
950
1000
-30
700
750
800
Frequency (MHz)
Isolation vs. Frequency
0
900
950
1000
700
750
850
900
950
1000
Frequency (MHz)
IIP3 vs. Frequency
30
800
Noise Figure vs Frequency
1.4
Temp.=+25°C
-5
1.2
-10
Noise Figure (dB)
25
-15
-20
IIP3 (dBm)
Isolation (dB)
850
Frequency (MHz)
+105°C
-25
+85°C
+25°C
-30
20
+105°C
+85°C
+25°C
−40°C
−40°C
15
-35
Pin = -13dBm/tone
-40
-45
750
800
850
900
950
1000
+25°C
−40°C
0.8
0.6
0.4
0.2
0
10
700
+85°C
1
700
750
800
Frequency (MHz)
850
900
950
1000
700
750
800
850
900
950
1000
Frequency (MHz)
Frequency (MHz)
Idq vs. Vpd
140
120
Idq (mA)
100
80
+105°C
60
+85°C
+25°C
40
−40°C
20
0
0
0.5
1
1.5
2
2.5
3
3.5
Vpd (V)
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
- 7 of 10 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
Pin Configuration and Description
Pin 1 Reference Mark
DC
Bias 1 Vpd1 Ictrl1
16
15
14
NA
13
RFout1/
RFin1/
Vg1
1
12 Vd1
GND
2
11 GND
GND
3
10 GND
RFin2/
Vg2
4
9 Vd2
RFout2/
5
6
7
DC
Vpd2 Ictrl2
Bias 2
8
NA
Backside Paddle - RF/DC GND
Pin No.
Label
Description
1
RFin1/Vg1 RF input pin for channel 1. Gate voltage bias pin for channel 1.
No internal connection but should be grounded to provide PCB mounting
2, 3
GND
integrity and isolation between the two RF paths.
4
RFin2/Vg2 RF input pin for channel 2. Gate voltage bias pin for channel 2.
5
DC Bias 2 DC out bias for channel 2
6
Vpd2
Power down control voltage for channel 1
7
Ictrl2
Channel 2 drain current control
8, 13
NA
No internal connection. These pins can be left floating or grounded.
10, 11
GND
Internally connected. These pins must be externally grounded for functionality.
9
RFout2/Vd2 RF output pin for channel 2. Gate voltage bias pin for channel 2.
12
RFout1/Vd1 RF output pin for channel 1. Drain voltage bias pin for channel 1.
14
Ictrl1
Channel 1 drain current control
15
Vpd1
Power down control voltage for channel 1
16
DC Bias 1 DC out bias for channel 1
RF/DC Ground. Follow recommended via pattern and ensure good solder
Backside Paddle RF/DC GND
attach for best thermal and electrical performance.
Evaluation Board PCB Information
TriQuint PCB 1094098 Material and Stack-up
1 oz. Cu top layer
0.020 ± 0.002
Finished Board
Thickness
Rogers 4003
εr=3.5 typ.
1 oz. Cu bottom layer
50 ohm line dimensions: width = .040”, spacing = .020”
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
- 8 of 10 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
Mechanical Information
Package Marking and Dimensions
Marking: Part number – TQL9066
Year, week - YYWW
Assembly code - AaXXXX
4.000±0.050
16X 0.65 Pitch
16X 0.30±0.05
TERMINAL #1
IDENTIFIER
TQL9066
YYWW
AaXXXX
2.50±0.05
Exp. DAP
4.000±0.050
Pin #1 IDENTIFIER
CHAMFER 0.300 x 45°
16X 0.40±0.05
1.95 Ref.
2.50±0.05
Exp. DAP
GND/THERMAL PAD
.10 C
16X
.850±0.050
.08 C
SEATING PLANE
0.000
0.050
.203 Ref.
C
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation
VGGC) for thermally enhanced plastic very thin fine pitch quad flat no lead package (QFN).
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.
4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012
PCB Mounting Pattern
3
0.65 PITCH
PACKAGE
OUTLINE
12X
16X 0.40
R.19
0.27
1
16X 0.80
1
2.30
0.64
0.55
2.30
COMPONENT SIDE
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
- 9 of 10 -
Disclaimer: Subject to change without notice
www.triquint.com / www.qorvo.com
TQL9066
50 –1500 MHz Dual LNA
RFMD + TriQuint = Qorvo
Product Compliance Information
ESD Sensitivity Ratings
Solderability
Compatible with both lead-free (260°C max. reflow
temperature) and tin/lead (245°C max. reflow
temperature) soldering processes.
Caution! ESD-Sensitive Device
Package contact plating: NiPdAu
ESD Rating:
Value:
Test:
Standard:
Class 1A
≥ 250 V to < 500 V
Human Body Model (HBM)
JEDEC Standard JS-001-2012
ESD Rating:
Value:
Test:
Standard:
Class C3
≥ 1000 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
RoHs Compliance
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
 Lead Free
 Halogen Free (Chlorine, Bromine)
 Antimony Free
 TBBP-A (C15H12Br402) Free
 PFOS Free
 SVHC Free
MSL Rating
MSL Rating: Level 1
Test:
260°C convection reflow
Standard:
JEDEC Standard IPC/JEDEC J-STD-020
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Web: www.triquint.com
Email: customer.support@qorvo.com
Tel: 877-800-8584
For information about the merger of RFMD and TriQuint as Qorvo:
Web:
www.qorvo.com
For technical questions and application information:
Email: sjcapplications.engineering@qorvo.com
Important Notice
The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information
contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained
herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The
information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with
such information is entirely with the user. All information contained herein is subject to change without notice.
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Advanced Datasheet: Rev C 05-22-15
© 2015 TriQuint Semiconductor, Inc.
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