8
7
6
4
5
2
3
1
Single (S)
Recommended P.C. Board Layout
SCALE 8:1
Single (M)
Single (M)
Single (S)
F
Pin 1
F
Pin 1
.177
[4.49]
.089
[2.26]
.050[1.27]
.027[0.70]
APPLICATION
.065[1.65]
E
.280 .100
[7.11] [2.54]
SMSS-6 XX - X - 04 - XX - V - XXX - XX - X - XX - LF
(A) (B) (C ) (D) (E)
(F)
(G) (H) (I) (J)
.055[1.40]
A. Pins Per Row
- 1 through 40
B. Row Specification
Mates with:
- S= Single Row
TSHS
- D= Double Row
TSHC
C. Surface Mount
TSHR
D. Plating Options
TSHSM
- See Plating Options below
BSTS
E. Vertical
BSTC
F. Polarized Position
BSTCM
- Leave blank if not needed
- If required, specify empty pin position
- e.g. 012 for Pin 12
G. Packing Information
- TR= Tape and Reel
- TB= Tube
H. Pad
- P= Plastic
- K= Kapton
- O= No Pad
- If left blank, packaging at MLE's discretion
Pad may be metal, mylar or plastic
I. Alignment Pin
- Leave blank if not needed
- AP= With
J. Lead Free
.031
[0.79]
.050[1.27]
Pin 1
.027[0.70]
Double
.050[1.27]X No. of Positions .016[0.40]
.099
[2.51]
D
01
40
.050[1.27]
.222
[5.63]
.016[0.40] X .006[0.15]
Single (S)
.252
[6.40]
.050[1.27]X No. of Spaces .014[0.38]
G
T
GT
H
F
FT
C
.136
[3.45]
01
Point of
Contact
.090[2.29]
40
.050[1.27]X No. of Positions - .100[2.54]
80
B
02
.226
[5.75]
.100 .197
[2.54] [5.00]
.235
[6.00]
79
Double
.035
[0.90]
.255[6.47]
PROPRIETARY AND CONFIDENTIAL
THE INFORMATION CONTAINED IN THIS
DRAWING IS THE SOLE PROPERTY OF
Major League Electronics. ANY
REPRODUCTION IN PART OR AS A WHOLE
WITHOUT THE WRITTEN PERMISSION OF
Major League Electronics IS
PROHIBITED.
8
7
6
5
C
B
Tails may be clipped to acheive specific dimensions.
Products cut to specific sizes are uncancellable/ nonreturnable.
Parts are subject to change without notice.
UNLESS OTHERWISE SPECIFIED:
A
Plating options
-10µ Gold on Contact Area/ Flash on Tail
-Matte Tin all Over
-10µ Gold on Contact Area/ Matte Tin on Tail
-30µ Gold on Contact Area/ Matte Tin on Tail
-Gold Flash over Entire Pin
- Gold Flash on Contact Area/ Matte Tin on Tail
Materials:
Contact Material: Phosphor Bronze
Insulator Material: Nylon 6T
Plating: Au or Sn over 50µ” (1.27) Ni
01
.040[1.25]
D
Specifications:
Insertion Depth: .104[2.64] to .230[5.84]
Insertion Force- Per Contact- H Plating:
3.5oz. [0.97N] avg. with .018[0.46] Sq. pin
Withdrawal Force- Par Contact- H Plating:
1.5oz. [0.97N] avg. with .018[0.46] Sq. pin
Current Rating: 1.0 Ampere
Insulation Resistance: 1000M Ohms Min.
Dielectric Withstanding: 300V AC
Contact Resistance: 20M Ohms Max.
Operation Temperature: -40°C to +105°C
Max. Process Temperature
Peak: 260°C up to 10 secs.
Process: 230°C up to 60 secs.
Wave: 260°C up to 6 secs.
Manual Solder: 350°C up to 5 secs.
Single (M)
E
4
DIMENSIONS ARE IN
INCHES
TOLERENCES:
ONE DECIMALS ±.100
TWO DECIMAL ±.100
THREE DECIMAL ±.005
FOUR DECIMAL ±.002
3
01/21/15
CHECKED
GWE
01/21/15
A
MFG APPR.
INTERPRET GEOMETRIC
TOLERANCING PER:
MATERIAL
USED ON
APPLICATION
DATE
EOW
ENG APPR.
FINISH
NEXT ASSY
NAME
DRAWN
ADDRESS:
2533 Centennial Blvd.
Jeffersonville, In 47130
Phone: 812-670-4174
Fax: 812-670-4175
E-Mail: mle@mlelectronics.com
DO NOT SCALE DRAWING
2
TITLE: SMSS-6 SERIES
SIZE DWG. NO.
REV
C
D
SCALE 10:1
SHEET 1 OF 1
1