Automotive Product Portfolio
Update
EUF-IND-T0590
JUNE.2014
TM
External Use
Increased Microcontroller Content in Electronics Systems
Safety
Airbags with Faster Impact Detection
Electronic Stability Program
Collision Avoidance and Adaptive Cruise Control
Hybrid/EV
Powertrain
Stop/Start
Regenerative Braking
Driver Information
Body Electronics
Body Control Module
Seat, Door, and Window Control
Remote Control
HVAC Control
Lighting Control/Bending/Leveling
Infotainment
Telematics
Theater Quality Multimedia
Powertrain Control
Automotive
Networking/
Communication
Engine Control
Gasoline Management
Fuel Injection
CAN
LIN
FlexRay
Ethernet
MOST
Chassis
Breaking Systems
Electronic Power Steering
Active Suspension
TM
External Use
1
Vehicle Architectural Trends
Today
Future
Dynamics
Sensors
Brakes
Steering
Dampers ADAS
Airbags Tensioners
(Radar,Camera) Ped. Protection
ECU
ECU
ECU
Vehicle
Dynamics &
Safety
ECU
OBD
Multimedia/
Telematics
Navigation Instruments Entertainment
Gateway
Driver Interface
(HMI)
Body, Security
Lighting
Torque
Management
Driver
Controls
Distributed Electronic Control Units
One ECU per mechanical function- Connected by
multiple CAN and LIN interfaces
Seats
Mirrors
Doors
Lighting
Engine
Transmission
Electric Motor
Generator
Distributed Computing
Major computing nodes on a high performance network
organized by “domains” which control “zones”
•
•
•
•
•
Up to 80 individual ECUs
Local and proprietary network structures
Increasing software complexity
Increasing cabling weight
Increasing ... everything
TM
External Use
3
•
•
•
•
•
Increasing data traffic
Ethernet as the backbone
Central Gateway will have an Ethernet Switch
Lower power: Partial/pretended networking
Autosar 4.0
Overview Car Network (w/o Ethernet)
Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay,
etc.
• Different characteristics per network: data rate, latency, communication
direction (peer-to-peer, single master, multi-master, etc.), quality of
service, determinism, etc.
• Driving force: cost optimization (cable, plug, number of pins, silicon area,
etc.)
•
Lights
LIN
Electric
motors
LIN
Electric
motors
LIN
Electric
motors
Lighting
CAN,
Seats
Air
condition
Instrument
cluster, dash
board
OBD
CAN
CAN,
Central ECU, Gateway
MOST
LIN
Doors
PSI5,
DSI
CAN, FlexRay
Engine
mgmt
Airbag
Sensors
Gear
box
Vehicle
dynamics
Squibs
FlexRay
TM
External Use
4
Wheel
nodes
Audio/Video
player
Navigation
Video disp.
Speaker
Telephone
Simplified example
Overview Car Network (w/ Ethernet)
•
•
•
Various network protocols in the car: CAN, LIN, PSI5, MOST, FlexRay,
Ethernet
Different characteristics per network: data rate, latency, communication
direction (peer-to-peer, single master, multi-master, etc.), quality of service,
determinism, etc.
Driving force:
cost optimization (cable, plug, number of pins, silicon area, etc.)
− Bandwidth to program (flash) the car
−
Lights
LIN
Electric
motors
LIN
Electric
motors
LIN
Electric
motors
LIN
Lighting
Ethernet
Seats
Air
condition
CAN
Switch
Engine
mgmt
Airbag
Sensors
CAN,
Ethernet
Central ECU, Gateway
Doors
PSI5,
DSI
Instrument
cluster, dash
board
OBD
Gear
box
Vehicle
dynamics
FlexRay
External Use
5
Video disp.
Speaker
Ethernet
Squibs
TM
Switch
Navigation
Wheel
nodes
Audio/Video
player
Telephone
Cameras
Simplified example
Body Solutions – Freescale Portfolio Overview
BCM and Gateway
Door, Window, Seat, HVAC, Other Body
Motor Control,
Lighting, etc.
S08
S12
S12 MagniV
Qorivva
Qorivva
8-bit Microcontroller
Families
16-bit Microcontroller
Families
16-bit with Analog
ASSP/MCUs
32-bit Single-Core Microcontr.
Families
32-bit Dual-Core Microcontr.
Families
System Basis Chip (SBC), Network Interconnect
High Side Switches (eXtreme Switch), H-Bridges, Switch Monitoring
TM
External Use
6
Kinetis for Automotive 32-Bit ARM® MCU
TM
External Use
7
ARM is a registered trademark of ARM Limited (or its subsidiaries)
in the EU and/or elsewhere. All rights reserved.
Kinetis 32-Bit ARM® MCU Comes to Automotive
Kinetis E Auto provides an automotive grade
scalable 32-bit portfolio with ARM
•
−
−
−
−
−
−
32-bit M0+ and M4 optimized for high performance and low
power
8K to 2M embedded flash, pin to pin compatible
Peripherals including CAN, LIN(SCI), SPI, IIC…
AEC Q100 certificated, automotive IP on board
Ta = -40˚C to 125˚C
Vdd = 2.7 - 5.5V, 3.3V or 5V convenience
Start your design easily today!
•
−
−
−
Complete ARM ecosystem
Massive options of development tools, SW and HW
references
Samples and Evaluation Boards (8K to 128KB) available now!
More info on Kinetis Auto
TM
External Use
8
ARM is a registered trademark of ARM Limited (or its subsidiaries)
in the EU and/or elsewhere. All rights reserved.
KEA Block Diagram - KEA128
−
•
2.7-5.5V
Automotive general purpose
Ext Osc
(1-20M, 32K)
Operating Characteristics
Voltage range: 2.7 to 5.5 V
− Temperature range (ambient): -40 to
125°C
−
•
Key Features:
−
−
−
−
−
−
−
−
•
ARM Cortex M0+ core
Up to 128K embedded flash
Up to 16K RAM
External OSC and internal ICS for
clock
System functions: LVD, WDG, CRC,
SWD, BITBAND, BME, LP modes
Communication interfaces: SPI, SCI,
IIC, CAN
Multiple timers: FTM, PWM, PIT, PWT,
RTC
12-bit ADC and ACMP
Packages:
16TSSOP, 24QFN, 32LQFP, 64LQFP,
80LQFP
− Pin compatible within KEA family
SWD
Debugger
Int R/C OSC
(~32KHz 2%)
Int LP Osc
(1KHz)
ARM Cortex M0+
48MHz Core Freq
FLL Clk Mult
LVD
POR
1xWDT
1-Cycle GPIO
BME(1)
Peripheral Bus
RAM
>16KB
External Use
9
Peripheral
Bridge
Flash
>128KB
Communications I/O System
OpenDrain IO,
KBI,
GPIO
1
PWT
1
PIT
6+2+2ch
16bit Flex
Timer(2)
12ch,
RTC
−
TM
NVIC
Applications:
Debug
1-CY MUL
•
System
PMC
(1) Support bit operation in RAM
(2) Faster timer running 2 x core clock
1
12bit ADC
MSCAN w/8 FIFO
2
Analog
Comparators
2
SPI
2
I2C
3
SCI
(LIN)
2
KBI
Applications:
Reference Solutions:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Infotainment connection module
GPS/Radio companion MCU
Motorcycle CDI/EFI
Pump/Fan controller
Passive keyless Push Start
BCM/HVAC
Windows/Door/Sun-roof
Seats/Mirror/Wiper Ambient lighting
DC/BLDC Motor control
TM
External Use
10
Fan controller with DC motor control
Pump controller with BLDC motor control
HVAC BLDC blower motor control
Vehicle Ambient lighting
Low power LIN/CAN nodes and gateway
Motor cycle CDI/EFI
Functional Safety for Automotive & Industrial
TM
External Use
11
Functional Safety Simplified
•
Functional safety is the absence of unreasonable risk due to
hazards caused by malfunctioning behavior of electrical/electronic
systems
Simplifies the process of system compliance
Solutions designed to address the requirements of automotive and industrial functional safety
standards
Reduces the time and complexity required to develop safety systems
Comply with ISO 26262 and IEC 61508 standards
Supports the most stringent Safety Integrity Levels (SILs)
Enabling designers to build with confidence
Zero defect methodology
From design to manufacturing to ensure our products meet the stringent demands
of safety applications
More info functional Safety
TM
External Use
12
Functional Safety for Automotive & Industrial Applications
Qorivva MPC574xP( 2x e200z4 200MHz, 2.5M Flash) 32bit Power Architecture™
Processor
•
•
MPC574xP meets highest functional safety
−
Built around safety concept, targeting ISO 26262 ASIL D
−
Safety architecture with cores, DMA in delayed lock step
−
End-to-end error correction coding (e2eECC),
−
Duplicated periphery, start-up self-test (LBIST and MBIST)
−
Voltage regulator redundancy and supply monitoring
−
ADC self-test, and a fault collection unit (FCCU)
−
Sample available now!
Targeted Applications
Automotive
Industrial
Electric Power Steering (EPS)
Aerospace and Defense
Electronic stability control
Non-Automotive Transportation
Vehicle dynamic and chassis control
Factory Automation
Safety domain control
Adaptive Cruise Control
Blind spot detection
TM
External Use
13
MPC574xP 2.5 MB Block Diagram
•
Core
−
−
−
−
−
−
−
−
•
Memory
−
−
−
•
2.5 MBytes NVM with ECC (with add. Safety measure for address).
64kB EEE (Data Flash) available incl. ECC
Up to 384 Kbyte global system SRAM with ECC (Addr + Data)
I/O
−
−
−
−
−
−
−
−
−
•
Dual up to 200MHz PowerTM ISA e200 zen4 core ( Z420)
32 bit Reg File, 64 bit BIU with E2E ECC,
64kB RAM of D-LMEM with MPU for fast context switch + local
data
8KB 2-way I-cache / 4KB 2-way D-Cache
1x Scalar FPU (compiler supported) per core
Safety enhanced Cores – VLE only
No Signal processing unit extension + NO MMU
Delayed Lock Step configuration only
3 x FlexCAN (64+2x32 message buffers)
1 x FlexRay (Dual Channel 64 msg. buffers)
2 x LINFlex (Uart/Lin protocol driver)
4 x DSPI (4 cs each)
2x FlexPWM (2x 12ch for 2 independent Motors Controlled)
3 x eTimer modules (18 channel total)
4 x SAR ADC – 1MS/s target 5V input capable
2 x Cross-triggering unit for motor control automatism
2x SENT
System
Interprocessor I/F SIPI (– approx 300Mbaud)
Safe DMA
Fault Collection unit, WDG, T-sens, & CRC computing unit
Nexus debug interface – Aurora
Dual-PLL (Peripheral + System Core)
3.3 V Single supply: internal regulator with external power stage
or External supply
− 3.3 V I/Os (ADC 5 V capable)
− 144 LQFP / 257 MAPBGA 0.8 mm pitch / Tj = 150°C . Extended
Temperature at 165”C Option (separate P/N)
−
−
−
−
−
−
TM
External Use
14
Case study – MPC574xP & PowerSBC
Functional Safety interactions
Battery Mngt
PowerSBC10 – MC33907
• Sense : AMUX
• Own FSM supply
Voltage Supervisor
Vcore 2.4MHz
1.2 to 3.3V configurable
Boost Driver
Vcore supply
• OV, UV detection
• Independent checker
Vcca
Energy
Management
State Machine
Fail Safe
State
Machine
Analog
& Digital
BIST
• 2.5V reference
• Battery Sense
• Temperature
• I/Os
Independant
FS state Machine
CAN
Physical Layer
Lock Step Mode
e200z4
CPU SPE
• Dual core
• self check
• fit for ASILD
Vcan - 5.0V
Fail Safe
Inputs
• error informed
• diagnostic
Data & Instruction
System
Vcca - 3.3 / 5.0V
Battery sense
Interrupt
System
integration
VI/O - 3.3 / 5.0V
Vpre
440kHz Buck
Configurable
I/Os (6)
Analog Mux
MPC574xP
INT
Communications
• 8-bit check
• parity
• register read back
SecuredSPI
RST
MCU
Challenger
Timed I/O System
Reset
Fault Collection
and Control Unit
• config timing
• error generator
• diagnostics
• ABIST checks
Analog Multiplexer
2.5 V
Ref.
Fail Safe Inputs
Temp.
Fail Safe Output
Fail Safe Inputs
• FCCU monitoring
• bistable protocol
TM
External Use
15
Secured SPI
Fail Safe Outputs
Challenger
• Safety output driver
in case of MCU lock
• ABIST safety check
• algorithm of WD refresh
• RST counter
• LBIST
New
Unprecedented Integration
Integration,
Low Power,
Security &
Safety
Single-chip solution offering multicore architecture and advanced
networking protocols for next generation communication requirements
while reducing the quantity of body control/gateway ECUs
Low Power Management
New low-power modes, analog comparators, and pretended networking
support help meet stringent next generation power budgets and ensure
greener vehicles
Functional Safety and Security
TM
Security modules protect ECUs against various attack scenarios and
Safety modules ensure robust operation per ISO 26262
External Use
16
- Development Device and High End Gateway/BCM Solution
MPC5748C/G
System
Debug
•
JTAG
Crossbar Masters
8-40MHz Osc
•
128KHz IRC
RTC/API
X
32ch eDMA
e200z2
Core
−
−
SIUL
−
16xPIT+RTI
3xSWT
3xSTM
SSCM
256k
256k
SRAM
256k
Peripheral
SRAM
(with ECC)
SRAM
Bridge
(with ECC)
(with ECC)
FCCU
BAF/BAR
STCU
(MBIST/LBIST)
16xSemaphore
−
−
−
−
CROSSBAR SWITCH
Memory Protection Unit (MPU)
Flash controller
6M
Flash
incl EE emulation
(with ECC)
Low
Power
Unit
Interface
−
−
−
•
2x e200z4 + 1x z2 cores, FPU on z4 cores
160 MHz max for z4s and 80 MHz on z2
HSM Security Module option supports both
SHE and EVITA low/medium standard
Media Local Bus supports MOST
communication
2 x USB 2.0 (1 OTG and 1 Host module)
support interfacing to 3G modem and
infotainment domain
2x Ethernet 10/100 Mbps RMII, MII, +1588,
AVB
Ethernet switch
CAN module optionally supports CAN FD
SDHC provides standard SDIO interface
Low Power Unit provides reduced CAN, LIN,
SPI, ADC functionality in low power mode
Designed to ISO26262 process for use in
ASIL B
-40 to +125C (ambient)
3.0V to 5.5V
Packages:
−
DMA MUX
High end Gateway and Body Modules
Key Characteristics:
−
−
−
2x USB 2.0
e200z4
Core
SDHC
e200z4
Core
16MHz IRC
MLB
HSM
Ethernet
32KHz Osc
3x Nexus
Class 3+
Ethernet
FMPLL
Applications:
−
FlexRay
VReg
176 LQFP, 256 BGA, 324 BGA
Communications I/O System
CTU
eMIOS
96ch
1
CRC
32ch*
ATD
12bit
48ch*
ATD
10bit
3
Analog
Comparators
4
DSPI
6
SPIs
4
I2C,
3 SAI
*Mixture of internal and external channels
Features available depend on package and device version
8
CAN
18
LIN
Flex
5747C
5748C
5747G
5748G
Cores
2
2
3
3
Flash
4M
6M
4M
6M
RAM
512k
768k
768k
768k
MLB
N
N
Y
Y
USB
N
N
Y
Y
TM
External Use
18
Performance Analog Portfolio
Embedded System Power Management (PF0100/0200)
System Basis Chips (SBC): power mgmt + comm + safety
CAN bus and LIN connectivity transceivers
System Power
Management
Battery & Energy
Management
Battery Monitoring System (BMS): 12V Pb, 14V Li-ion, 24V+
Alternator Regulator Chip
Stop/Start MOSFETs
Li-Ion Linear Battery Charger
System
Management &
Automation
Engine Management
Braking: ABS, ESC, WSS control
Airbag: power mgmt + comm + safety, squib drivers
Millimeter Wave Radar: 77GHz transmit & receive
DSI sensor Interfaces
Power Drivers
High & low voltage H-Bridge drivers
Low side drivers
Programmable solenoid controllers
H-Bridge and 3-phase motor pre-drivers
Intelligent Distributed Controllers (IDC)
Power Analog
Switches
18V & 36V/24A eXtreme Switches: High side FET w/ smart control
Multi-Switch Detect Interface (MSDI)
Mini/Micro Hi-Speed USB2.0 Switch Interface
TM
External Use
19
One Page Overview – MC33662 LIN 2.1 / J2602-2 Physical
Layer
Key characteristics
Bus Type
LIN 2.1 / J2602-2
Data Rate
10kb or 20kb / >100kb
IQ Low Power Mode
6 µA
LIN ESD/150pF, 330Ω
±15kV
Operating voltage
5.5V - 27V
Operating temp.
-40°C<Tamb<125°C
Features
• Pin-to-pin compatible with MC33399 & 33661
• Excellent EMI performance thanks to bus active
wave shaping
• High EMC immunity and ESD robustness
• Very low emissions:
‒
‒
•
•
•
•
•
•
•
•
•
50dBµV max in low frequency
7dBµV max in high frequency
Fast slew rate selectable (>100kb)
J2602 / LIN2.1 options part number selectable
Automatic compatibility w 3.3 and 5.0V MCUs
Low sleep current (typical @ 6µA)
Short to ground proof
Single battery supply (no 5.0 Vdd required)
Dedicated dual edge sensitive wake-up input
Control of external voltage regulator through INH
Tx permanent dominant timeout
TM
External Use
20
Target Market
All LIN Nodes
8 SOIC-NB
Freescale SBC Solutions – Features Table Overview
Part Number
33662
3391xG5
33902
33903
33903S
33903D
33904
33905S
33905D
Product Status
QS
PPAP
PPAP
PPAP
PPAP
PPAP
PPAP
PPAP
PPAP
VMCU (Vdd)
-
5.0V
110mA
-
5.0V/3.3V
5.0V/3.3V
5.0V/3.3V
5.0V/3.3V
5.0V/3.3V
5.0V/3.3V
100mA+/‐2%
150mA+/‐2%
150mA+/‐2%
150mA+/‐2%
150mA+/‐2%
150mA+/‐2%
VMCU Pw Sharing.
-
-
-
‐
Yes/+300mA
Yes/+300mA
Yes/+300mA
Yes/+300mA
Yes/+300mA
Vaux (ballast)
-
-
-
-
-
-
5.0/3.3V
5.0/3.3V
5.0/3.3V
Vcan
-
-
5V/100mA
5V/100mA
5V/100mA
5V/100mA
5V/100mA
5V/100mA
5V/100mA
CAN HS P/L
-
-
1
1
1
1
1
1
1
LIN2.1 / J2602 P/L
1
1
-
-
1
2
-
1
2
I/Os
1
2
1
1
3
3
4
4
4
LowQ Voff/Von
6µA
33µA
15µA
15/25 µA
15/25 µA
15/25 µA
15/25 µA
15/25 µA
15/25 µA
Battery sense
-
Yes
-
-
Yes
Yes
Yes
Yes
Yes
AMUX
-
Yes
-
-
Yes
Yes
Yes
Yes
Yes
Fail Safe
-
-
-
-
Yes
Yes
Yes
Yes
Yes
Watch Dog
-
Yes
-
Yes / Adv
Yes / Adv
Yes / Adv
Yes / Adv
Yes / Adv
Yes / Adv
SPI
-
8b
pseudoSPI
16b / Safe
16b / Safe
16b / Safe
16b / Safe
16b / Safe
16b / Safe
Package
SO8
LQFP32
SO14
SOIC32eP
SOIC32eP
SOIC32eP
SOIC32eP
SOIC32eP
SOIC54eP
Attach strategy
MCU Supply
-
SO8
S12XS
Low end
SO8
SO8
S12XS
S12XE
S12XE
MPC5604B
MPC5604P
MPC5634M
S12XE
MPC5604B
MPC5604P
MPC5634M
S12XE
MPC5604B
MPC5604P
MPC5634M
S12XE
MPC5604B
MPC5604P
MPC5634M
S12XE
MPC5604B
MPC5604P
MPC5634M
TM
External Use
21
Motor Control Integrated Solutions
TM
External Use
22
Introduction to MagniV S12ZVM
BLDC, PMSM & DC Motor Control
•
Innovative single chip MCU with HV Analog
−
−
−
•
−
−
−
Reduced BOM
Improved Quality
Lower power consumption
Reduced PCB Size
Build a demo in record time
−
−
−
S12ZVM Complete Enablement
TM
External Use
Low-High Side, Relay/MOSFET Drivers, Voltage Reg,
LIN/CANPhy
Accelerate your design, save on cost
−
•
LL18UHV Technology: Low leakage 180nm + 40V UHV
NVM, EEPROM, S12Z core, SCI/SPI, A/D, Timers…
23
No need to be a motor control expert
S12ZVM provides unique combination of hardware
integration and a complete tools and software ecosystem.
S12ZVM enables extremely compact and sophisticated 12V
motor control solutions with Ta up to 150˚C
Motor Control with MagniV S12ZVM
Integrated solution for BLDC, PMSM & DC Motor Control
Target Application:
Fuel
Water
Oil
Pump
HVAC Blower
Wipers
AC Compressor
Sliding Doors
Powered Liftgate
Benefits:
Compact
Performance
Scalable
Single chip
saves PCB space
Lower power/ noise
High temp (Ta 150˚C)
Sensorless
32 to 128K Flash
CAN & LIN
HW & SW re-use
Enablement:
Hardware
Software
Libraries
Eval Board
MC Development Kit
Mini Eval Board
Development
Production
Compiler, Debugger
Optimized Math &
Motor Control
algorithms
TM
External Use
24
S12ZVM Concept : Replace up to 5 IC
Discrete Solution
3+
VREG
(8pin)
2+
LIN phy
MCU
or
DSC
(48pin)
20+
Gate
Driver
(48pin)
(8pin)
Op-amps
4cm
~1 ½ in.
S12ZVM Solution:
• ~ 50 fewer solder joints
• - 4 to 6 cm2 PCB space
TM
64pin
External Use
25
Product Summary - S12ZVM Family
Digital
Components
5V Analogue
Components
MCU Core
and Memories
High-Voltage
Components
BLDC/PMSM motor control
Key Features:
LIN/HV -PHY
•
S12Z CPU @ 50MHz bus speed
•
6ch Gate Drive Unit (GDU) with 50-150nC total Gate
Charge drive capability, incl charge pump for High-Side,
Bootstrap diodes for charging external bootstrap
capacitors
•
Embedded VREG with switchable 5V/20mA sensor supply
•
LIN PHY, LIN2.1 / 2.2 / J2602 compliant
•
Dual 12bit list-based ADC (LADC), synch with PWM
through Programmable Trigger Unit (PTU)
•
2x Op-amp for current sensing
SCI 1
SCI 0
SPI
MSCAN
G BDM KWU Win
Wdog
P BDC
I TIM 16b
O
4ch
6ch PMF
(PWM)
1#
EVdd
2ch
PTU
Pierce
Osc.
RCosc.
+/-1.3%
Temp
Sense
12-Bit
LADC
12-Bit
LADC
PLL
S12Z 50MHz Bus
Bootstrap Diodes
16-128 KB
Flash (ECC)
MOS-FET-Predriver
512B
EEPROM
(ECC)
2-8kB
RAM
(ECC)
GDU 6ch
Charge Pump
Vreg
Vsup
sense
Current Sense
(2 x Op-Amp)
Target applications:
•
Sensorless BLDC or PMSM motor control
•
Bidirectional DC motors (H-Bridge)
•
Various pumps (oil, fuel, water, vacuum)
•
Cooling fan and HVAC blower
TM
External Use
26
Options:
•
Package: 64-LQFP-EP, 48 LQFP-EP
•
Memory: 16kB / 32kB / 64kB / 128kB Flash
•
Option -L with LIN phy
•
Option -C with 2nd Vreg for external CAN phy
•
Temperature: V / M / W (up to 150°C Ta per
AEC-Q100 Grade 0)
S12ZVL - family
Digital
Components
5V Analogue
Components
MCU Core
and Memories
High-Voltage
Components
Integrated General Purpose LIN Node - Summary
Key Features:
•
S12Z-core (up to 32MHz bus frequency) compatible within
MagniV
•
On chip 12V Vreg with Supply-capability:
‒
Pierce
Osc.
LIN-PHY
SCI 1
SCI 0
SPI
IIC
G BDM KWU Win
Wdog
P BDC
I TIM 16b
O 6+2ch
70mA total (170mA with ext. Ballast)
RCosc.
+/-1.3%
Temp
Sense
10-Bit
ADC
PLL
S12Z 32MHz Bus
8-32KB
Flash (ECC)
•
LIN-PHY, LIN2.x / J2602 compliant
•
On chip RC Oscillator; trimmed to +/- 1,3% tolerance over
full temperature range
•
Robust 12V inputs Vsup-sense & HVI (with ADC)
•
1x E-Vdd (20mA source capability)
•
1-3x N-GPIO (25 mA sink capability)
Family options:
•
5x5mm footprint 32QFN-package optional
•
Flexible Memory Options: 8kB to 32kB Flash version
•
ASIL-A compliancy
•
32-LQFP , 48-LQFP or 32QFN-Packaging
•
C / V / M Temperature options (up to 125°C Ta)
PWM 8ch 8b
or 4ch 16b
1#
E-Vdd
1-3#
NGPIO
128B
EEPROM
(ECC)
1kB
RAM
(ECC)
HV Input
Vsup
sense
70, or up to 170mA
with ext. Ballast
Vreg
Target Applications:
•
Any kind of automotive LIN-node
•
LIN-sensors / actuators
•
LIN switchpanel / userinterface
•
LIN RGB LED lighting
•
Ultrasonic sensors
•
…
KNOX
S12ZVL
Application orientation
generic
Package
48LQFP
32LQFP
Flash Memory (ECC)
32/16/8 kB 32/16/8 kB
NGPIO (GPIO with 25mA NMOS) 3
1
10‐Bit ADC
10ch
6ch
TM
External Use
27
S12ZVLS
small sensors
32QFN
32/16 kB
3
6ch
Target Applications
LIN-Sensors
LIN-switchpanels
Product Function
• Hooking up sensors into
automotive LIN-Network
(with signal preconditioning
Market Requirements
• LIN-PHY, 12V-Vreg, MCU
• Small formfactor (QFN)
• ADC, SPI
TM
External Use
28
LIN-Actuator
Product Function
• Reading multiple switchpositions and feeding into
LIN-network
Product Function
• Converting LINcommand into an activity
(eg driving LEDs)
Market Requirements
• LIN-PHY, 12V-Vreg, MCU
• Multiple GPIOs
• ADC
Market Requirements
• LIN-PHY, 12V-Vreg, MCU
• Drivers (3x25mA drive
strength in case of RGBLED)
• ADC
High Temperature and Automotive
Qualification
TM
External Use
29
Automotive Grade for Challenging Environment
Largest portfolio with automotive qualification grade
High temperature for space constraint applications
•Fuel, oil, water pumps, sensor and actuators…
AEC Q100
125˚C
150˚C
Low PPM
All Freescale
Automotive MCU are
certified AEC Q100
All Freescale
Automotive MCU
support up to 125˚C
ambient temperature
Extended
temperature up to
150˚C ambient on
several product lines
(S08SG, S12G,
S12ZV, Qorivva)
Benefit of one of the
lowest PPM level in
the industry
TM
External Use
30
Software and Enablement
TM
External Use
31
Prototype in 24 Hours:
Typical Development Flow
1 choose your hardware
•
•
Demo boards
Reference solutions
• USB Starter Kits
2 Install Development Suite
•
•
•
Initialisation / autocoding
Compiler
Debug
3 Prototype with Demo Code
•
•
•
Low-level drivers: CAN, LIN, Flash
Demo code: CAN wakeup, LIN comms
Peripheral enhancement routines
TM
External Use
32
Software Products Overview by Segment
Chassis/Safety
Body
Autosar 3.x
Autosar 4.0
MCAL
560xB/C/D, 564xB/C, 5668G
MCAL
OS
560xB/C/D, 564xB/C, 5668G
OS
MCAL
560xB/C/D, 564xB/C
574xB/C/G
MCAL
OS
560xB/C/D, 564xB/C
574xB/C/G
OS
Non-Autosar
560xP, 564xL, 567xK
560xP, 5604E, 564xL, 567xK
560xP, 564xL, 567xK
560xP, 564xL
Ethernet/AVB
5604E
Camera Appl SW
5604E
Motor Ctrl TB
Math & MC Lib
Powertrain
MCAL
563xM, 564xA, 567xF
OS
563xM, 564xA, 567xF
MCAL
563xM, 564xA, 567xF
OS
564xL, 567xK
Math & MC Lib
Instruction Set Self Test (Power Arch e200 cores)
Initialization
TM
External Use
564xA, 5676R
33
e200 Power Arch MCUs
RAPPID for 560xP, 564xL, 567xK
Development Tools (expl. MPC5646B/C)
Part number
Price Description
XPC56xxMB2
$375
XDC564B256BSB3M
XDC564B208QSB3M
XDC564B176QSB3M
$120
$120
$120
XKT564B256BSB3M
$497
XKT564B208QSB3M
$497
XKT564B176QSB3M
$497
generic motherboard with connectors for MiniModules
Mini Module with 256MAPBGA socketed silicon
Mini Module with 208LQFP socketed silicon
Mini Module with 176LQFP socketed silicon
Motherboard + 256MAPBGA mini module + CW
CD + wiggler + debugger + doc. Free permanent
Compiler/debugger license limited to 128KB code.
Motherboard + 256MAPBGA mini module + CW
CD + wiggler + debugger + doc. Free permanent
Compiler/debugger license limited to 128KB code.
Motherboard + 256MAPBGA mini module + CW
CD + wiggler + debugger + doc. Free permanent
Compiler/debugger license limited to 128KB code.
CodeWarrior Compiler Free
Free permanent license limited to 128KB code.
Rappid pin wizzard
Free
U-MULTILINK
$119
I/O allocation tool with graphical interfaces, and
outputs documentation, saves engineers a few
hours.
USB interface to PC, Universal Multilink
Development Interface
USB Multilink (P&E)
U-MULTILINK-FX
$399
USB interface to PC, Universal Multilink FX HighSpeed Development Interface
CYCLONE_MAX
$899
Programming tool, see options and add-ons on
P&E website (eg automatisation for series prod,
Ethernet extension…)
CYCLONE_MAX_PE
$899
powerful stand-alone in-circuit programmer and
debugger for Freescale’s high-end architectures
USB Multilink (P&E)
TM
External Use
34
Making the World a Smarter Place.
TM
External Use
35
TM
www.Freescale.com
© 2014 Freescale Semiconductor, Inc. | External Use