Lecture 1.01
“Modern Board Design” Course:
Organization and Introduction to
Board Design
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Lecture Plan
Program Information:
• Program material
• Recommended literature
• Program rules:
• Work in class and in laboratory
• Grade policy
Introduction to Hardware Board Design
• What is an electronic board
• Board Design industry and Applications
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Course Introduction
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Time, Location etc
1. Lecture’s days and time:
Every Thursday
From 18.00 to 22.00 (be at time)
2. Course duration - ~6 months [bruto], about 250 ac. Hours
(frontal and for the project design).
3. Address: Ramat Gan, 7 Aba Hilel str., floor 15
1.
Parking for free options: Yazira and Ahaliav str. (100-200m from
CDC)
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Program’s Grades Structure
Final grade structure:
Project – 40% from the semester grade
Each project includes the Design Specs and the Design
Environment
Exam – 60% from the semester grade
Each exam is in American Style (multiple choice) and
closed books
The minimum required exam’s and project’s grade is: 65.
The required course average is:
70.
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Study and Help with Job Search Plan
The Course milestones are the Project milestones:
MRD, Kickoff, PDR, CDR, FDR and final exam
CV Design - Very effective and professional help
Coaching for successful career building
Time and project management
Career planning and Job search plan design.
Project FDR with Senior Designers from High Tech companies
Diploma, Recommendations and Individual meetings for successful job
search etc:
CV/Linkedin Profile Design
Job search plan design
Technical Interview Simulation
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Course rules
• Work with slides – questions, comments
• Study environment at home
• Weekly Back up
• Course Forum
• Documents and code style
• Design reviews and final submission.
• Homework assignments, which will be done individually or in groups.
** The main target of the course is making the students mature enough in
Board Design for the industry. Help yourself using internet forums and
online documentation.
** Students get certificate if stand successfully in course requirements.
- Every one will get the tools for working from home, plus 1 evaluation board for
design group.
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Course Material
Course Material includes:
Slide Sets – 4 books: (2 for Board Design, 2 for High Speed Board
Design)
1.
Introduction to Board Design:
1. Board Design Technologies and Design Flow
2. SoB Modern Architectures
3. Device selection
2. Board Design schematics capture. PCB design and manufacturing. Standards
compliancy. Full design flow: Your “First” Board Design Project.
3. High Speed Board Design theory. Ref Project with Signal Integrity review.
4. Introduction to FPGA Design, Advanced High Speed Board Design Subjects.
Reference Board Design and High Speed Board Design Projects
Design Environment - Soft Copy.
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Recommended Literature
1.
Hardware Design
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The Art of Electronics - Paul Horowitz, Winfield Hill (ISBN 0-521-37095-7)
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Switching Powe r Supplies – A to Z – Sanjaya Manitkala
(ISBN 13: 978-0-7506-7970-1)
2.
Digital Design
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Digital Design, Morris Mano (3rd edition or late r - ISBN-13: 9780131989245)
Computer Systems
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Computer System Architecture, Moris Mano (ISBN-13: 9780131755635)
The Indispensable PC Hardware Book – Hans Peter Messmer (ISBN: 0-20159616-4)
OrCAD – Schematics capture and layout
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Inside OrCAD Capture for Windows – Chris Schroeder (ISBN-13: 978-0-75067063-0)
Complete PCB Design Usign OrCAD Capture and Layout – Kraig Mitzne r
(ISBN-13: 978-0-7506-8214-5)
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Recommended Literature
5.
High Speed Board Design
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6.
High-Speed Digital Design – A Handbook of Black Magic – Howard
Johnson
FPGA Design – VHDL
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VHDL Programming by Example – Douglas L. Perry (ISBN: 0-07140070-2)
RTL Hardware Design Using VHDL – Pong P. Chu (ISBN-13: 978-0471-72092-8)
ModelSim User Guide
Communications Fundamentals
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Computer Networks - Andrew Tanenbaum (ISBN 0-13-384248-1)
…and periodically, you must read quality magazines like EDN (http://www.edn.com)
and Electronic Design (http://electronicdesign.com)
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Semester A – Board Design
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Introduction to Board Design
Board Design Technologies and Design Flow
SoB (System on Board) Architecture
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Modern RISC and CISC Processors
DSPs
Buses/Memories
Peripheral Dev ices, Interfaces and Connectors
Analog and Mixed Signal Blocks
Power Supply
Schematic Capture Theory and work with OrCAD
“Ref” Board Design Project Review
“First” Board Design Project - by Course’s Students
Choosing Devices for Board Design
– Analog and Digital chips and devices
– Chip Packages Types and use.
– RoHS, temperature, EMI/RFI, CE and other requirements and standards
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PCB Design and manufacturing theory
PCB Layout and work with Allegro
Coaching Part 1 – Career/life targets, Time management etc
Semester A final exam
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Copyr ight © 2005 AVM Brothers Ltd.
Semester B – High Speed Board Design
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Introduction to High Speed Board Design
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Design rules for Signal Integrity
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Signal Integrity for HI-SPEED Fundamentals.
POWER INTEGRITY for Power Distribution System (PDS)
Common High Speed standards –
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1. Parallel – DDRI to DDRIII (frequencies and applications).
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2. Serial – SATA, PCIe, XAUI, USB3.0 etc.
Analog and digital issues in High Speed PCB Design.
Test and characterization flow
Reflections and Transmission Lines
Crosstalk and EMI Issues
Crosstalk Simulations
Differential Traces and Impedance
Clock Trees and other controlled impedance signals
Eye Diagram
Bypass Caps and Decoupling Systems
Constraints Management and Pre and post layout Simulation
“Ref” High Speed Board Design - Project Overview
“Advanced” High Speed Board Design Project - by Course Students
FPGA for Board Designers with VHDL
Semester B – Final Board Designer Evaluation exam
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Copyr ight © 2005 AVM Brothers Ltd.
What is an electronic board?
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Evolution of electronic boards - Integration
• Old boards contained big discrete components, simple ICs with DIP
packages and only ten to twenty pins each
• Old digital chips only instantiated simple functions: Single digital gate, flip
flop, operational amplifier.
• New chips include thousands and even millions of functions (complete
SoC). BGA packages of 1K pins are common on almost any PCB
design.
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Evolution of electronic boards – The Digital Revolution
• Old analog processing was done using discrete components:
Amplifiers, mixers, filters, etc.
• Today, many functions are done using Digital Signal Processing.
• Digital Signal Processing advantages:
– Solutions done in software: Ease of testing and portability
– Can be easily modified, including ISP.
– DSP operations are more stable, precise and repeatable. They are
independent of process and temperature
– Lower cost and footprint of solution
– Better precision achievable
• Digital Signal Processing disadvantages:
– “Strange” artifacts: Quantization noise, aliasing of signals
– Speed: Need margin for running software on processor
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Board Structure
• Basic Board Components:
– PCB:
• Physical anchoring for chips and components, interconnection
– Components
• Functionality of design
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Board Architecture
The following picture shows an example of functional division on an
electronic board.
Analog
Connectors
Power
Connectors
Power
Supply
Digital Block
Analog
and/or RF
blocks
PCB
Digital
Connectors
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Board Design
Industry and Applications
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Electronic Design Main Applications (1)
Portable electronic systems – Laptops, PDA, Mobile phones, digital cameras
Powerful computer systems – Servers and personal computer, high speed communication
(computer communication - Internet)
Telecommunications – Voice, video and data - Access and Switching equipment with high
reliability and redundancy
Complex control systems – Process control systems, robots, automotive market,
communication, signal and picture processing, hardware implementation of complex algorithms
(encryption, compression).
Systems with High Reliability Requirements – electronic medical equipment, army
applications
Low cost products – computer equipment, electronic games, credit cards etc…
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Electronic Design Main Applications (2)
Main players on the market of products based on electronic boards
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Telecommunications - Voice: Alcatel, Siemens, Motorola, Nortel, etc.
Telecommunications - Video: Polycom, Tandberg, etc.
Telecommunications - Data: Cisco, Lucent, etc
Telecommunications – Infrastructure (CPCI, ATCA boards): Intel, MCG,
Kontron, Schroff, Radysis, Artesyn, etc
Telecommunications – Infrastructure (CPCI, ATCA chassis): Elma,
Kapparel, Carlo Gavazzi, Rital, etc
Military, aeronautic, space: IAI, GE, Lockheed, etc.
Storage devices, MP3 – Sony, Samsung, SanDisk, M-Systems
Mobile Phones: Nokia, Samsung, Ericsson, Motorola, Philips, LG, Sharp
Personal Computers: IBM, Dell, Samsung, LG, Apple
PDAs: Palm, HP, Sony, Apple, etc
Cameras: Sony, Panasonic, Samsung, Sharp
Medical equipment – Siemens, GE, Philips, etc.
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Modern Digital Board Design Challenges (1)
Cost and complexity
– BOM cost
– Component maturity
– PCB complexity, cost, production site
– Component lead time
– Production quantity
Performance and Features
– Processor – Architecture, processing capability, bandwidth, scalability
– Storage
Type: Flash, DRAM, disk
Size, bandwidth, latency
Communications
– Internal buses topology, bandwidth, latency, scalability
– Clocks generation and distribution
– External interfaces – Requirements as internal buses + standards compliancy
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Modern Digital Board Design Challenges (2)
Power
– Multiple voltage and current requirements
– Power distribution topology, hot swap requirements, redundancy, noise filtering
– Sequencing, protection, standards compliancy
Mechanical Design
– Form factor
– Functions separation
– Thermal design – Heatsinks selection, placement (air flow)
System Design
– System integration with system power and communications
– OA&M capabilities
– R&D debug and test capabilities
Design for Production
– ATE capabilities
– BIST, diagnostics
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Case study – ATCA board (1)
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Case study – ATCA board (2)
Cost
– Complexity, size
– Production quantity
Performance and Features
– Processor
– Storage
Communications
– Internal buses
– Clocks generation and distribution
– External interfaces
Power
Physical Design
– Form factor
– Functions separation
– Thermal design
System Design
– System integration
– OA&M capabilities
– R&D debug and test capabilities
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Case study – ATCA board (3)
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Case study – Personal computer
Cost
– Complexity, size
– Production quantity
Performance and Features
– Processor
– Storage
Communications
– Internal buses
– Clocks generation and distribution
– External interfaces
Power
Physical Design
– Form factor
– Functions separation
– Thermal design
System Design
– System integration
– OA&M capabilities
– R&D debug and test capabilities
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Case study – Data acquisition board
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Case study – Mobile phone (1)
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Case study – Mobile phone (2)
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And many, many more…
Entertainment
Medical
electronics
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And many, many more…
Evaluation boards
Consumer products
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And many, many more…
Military equipment
Industrial control
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